MCRF200 125 kHz microID™ Passive RFID Device Features Package Type • Factory programming and memory serialization (SQTPSM) • One-time contactless programmable (developer kit only) • Read-only data transmission after programming • 96 or 128 bits of One-Time Programmable (OTP) user memory (also supports 48 and 64-bit protocols) • Typical operation frequency: 100 kHz-400 kHz • Ultra low-power operation (5 µA @ VCC = 2V) • Modulation options: - ASK, FSK, PSK • Data Encoding options: - NRZ Direct, Differential Biphase, Manchester Biphase • Die, wafer, COB, PDIP or SOIC package options • Factory programming options Application • Low-cost alternative for existing low-frequency RFID devices • Access control and time attendance • Security systems • Animal tagging • Product identification • Industrial tagging • Inventory control RF Signal Reader PDIP/SOIC VA 1 8 VB NC 2 7 NC I/O 3 6 VSS RESET 4 5 VCC Note: Pins 3, 4, 5 and 6 are for device test purposes only. Pins 1 and 8 are for antenna connections. DO NOT ground pin 5. Description The MCRF200 is a passive Radio Frequency Identification (RFID) device for low-frequency applications (100 kHz-400 kHz). The device is powered by rectifying an incoming RF signal from the reader. The device requires an external LC resonant circuit to receive the incoming RF signal and to send data. The device develops a sufficient DC voltage for operation when its external coil voltage reaches approximately 10 VPP. This device has a total of 128 bits of user programmable memory and an additional 12 bits in its configuration register. The user can manually program the 128 bits of user memory by using a contactless programmer in a microID developer kit such as DV103001 or PG103001. However, in production volume the MCRF200 is programmed at the factory (Microchip SQTP – see Technical Bulletin TB023). The device is a One-Time Programmable (OTP) integrated circuit and operates as a read-only device after programming. MCRF200 Data 2003 Microchip Technology Inc. DS21219H-page 1 MCRF200 Block Diagram Data Coil Connections Modulation Circuit Modulation Control Clock Generator VCC Row Decode Memory Array Rectifier VSS Counter The configuration register includes options for communication protocol (ASK, FSK, PSK), data encoding method, data rate, and data length.These options are specified by customer and factory programmed during assembly. Because of its many choices of configuration options, the device can be easily used as an alternative or second source for most of the existing low frequency passive RFID devices available today. The device has a modulation transistor between the two antenna connections (VA and VB). The modulation transistor damps or undamps the coil voltage when it sends data. The variation of coil voltage controlled by the modulation transistor results in a perturbation of voltage in reader antenna coil. By monitoring the changes in reader coil voltage, the data transmitted from the device can be reconstructed. DS21219H-page 2 Column Decode The device is available in die, wafer, Chip-on-Board (COB) modules, PDIP, or SOIC packages. Factory programming and memory serialization (SQTP) are also available upon request. See TB023 for more information on contact programming support. The DV103001 developer’s kit includes Contactless Programmer, ASK, FSK, PSK reference readers, and reference design guide. The reference design guide includes schematics for readers and contactless programmer as well as in-depth document for antenna circuit designs. 2003 Microchip Technology Inc. MCRF200 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) Storage temperature ..............................................................................................................................- 65°C to +150°C Ambient temperature with power applied................................................................................................-40°C to +125°C Maximum current into coil pads ..............................................................................................................................50 mA † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: AC AND DC CHARACTERISTICS All parameters apply across the specified operating ranges unless Industrial (I): TA = -40°C to +85°C otherwise noted. Parameter Sym Min Typ Max Units Clock frequency FCLK 100 — 400 kHz Contactless programming time TWC — 2 — sec — Years Data retention 200 — Coil current (Dynamic) ICD — 50 µA Operating current IDD — 5 µA VAVB 10 — — VPP VCC 2 — — VDC CIN — 2 — pF Turn-on-voltage (Dynamic) for modulation Input Capacitance 2003 Microchip Technology Inc. Conditions For all 128-bit array at 25°C VCC = 2V Between VA and VB DS21219H-page 3 MCRF200 2.0 FUNCTION DESCRIPTION 2.1.2 The device contains three major building blocks. They are RF front-end, configuration and control logic, and memory sections. The Block Diagram is shown on page 1. 2.1 This circuit generates a Power-on Reset when the tag first enters the reader field. The Reset releases when sufficient power has developed on the VDD regulator to allow correct operation. 2.1.3 RF Front-End The RF front-end of the device includes circuits for rectification of the carrier, VDD (operating voltage) and high-voltage clamping. This section also includes a clock generator and modulation circuit. RECTIFIER – AC CLAMP The rectifier circuit rectifies RF voltage on the external LC antenna circuit. Any excessive voltage on the tuned circuit is clamped by the internal circuitry to a safe level to prevent damage to the IC. FIGURE 2-1: CLOCK GENERATOR This circuit generates a clock based on the carrier frequency from the reader. This clock is used to derive all timing in the device, including the baud rate and modulation rate. 2.1.4 2.1.1 POWER-ON RESET MODULATION CIRCUIT The device sends the encoded data to the reader by AM-modulating the coil voltage across the tuned LC circuit. A modulation transistor is placed between the two antenna coil pads (VA and VB). The transistor turns on and off based on the modulation signal. As a result, the amplitude of the antenna coil voltage varies with the modulation signal. See Figure 2-1 for details. MODULATION SIGNAL AND MODULATED SIGNAL MCRF200 VA Modulation Signal L C Modulation Transistor VB Amplitude Modulation Signal Modulated RF Signal (across VA and VB) DS21219H-page 4 t 2003 Microchip Technology Inc. MCRF200 2.2 Configuration Register and Control Logic The configuration register determines the operational parameters of the device. The configuration register can not be programmed contactlessly; it is programmed during wafer probe at the Microchip factory. CB11 is always a zero; CB12 is set when successful contact or contactless programming of the data array has been completed. Once CB12 is set, device programming and erasing is disabled. Table 2-4 contains a description of the bit functions of the control register. 2.2.1 BAUD RATE TIMING OPTION The chip will access data at a baud rate determined by bits CB2, CB3 and CB4 of the configuration register. For example, MOD32 (CB2 = 0, CB3 = 1, CB4 = 1) has 32 RF cycles per bit. This gives the data rate of 4 kHz for the RF carrier frequency of 128 kHz. The default timing is MOD128 (FCLK/128), and this mode is used for contact and contactless programming. Once the array is successfully programmed, the lock bit CB12 is set. When the lock bit is set, programming and erasing the device becomes permanently disabled. The configuration register has no effect on device timing until the EEPROM data array is programmed (CB12 = 1). 2.2.2 DATA ENCODING OPTION This logic acts upon the serial data being read from the EEPROM. The logic encodes the data according to the configuration bits CB6 and CB7. CB6 and CB7 determine the data encoding method. The available choices are: 2.2.3 MODULATION OPTION CB8 and CB9 determine the modulation protocol of the encoded data. The available choices are: • • • • ASK FSK PSK_1 PSK_2 When ASK (direct) option is chosen, the encoded data is fed into the modulation transistor without change. When FSK option is chosen, the encoded data is represented by: a) b) Sets of 10 RF carrier cycles (first 5 cycles → higher amplitude, the last 5 cycles → lower amplitude) for logic “high” level. Sets of 8 RF carrier cycles (first 4 cycles → higher amplitude, the last 4 cycles → lower amplitude) for logic “low” level. For example, FSK signal for MOD40 is represented: a) b) 4 sets of 10 RF carrier cycles for data ‘1’. 5 sets of 8 RF carrier cycles for data ‘0’. Refer to Figure 2-2 for the FSK signal with MOD40 option. The PSK_1 represents change in the phase of the modulation signal at the change of the encoded data. For example, the phase changes when the encoded data is changed from ‘1’ to ‘0’, or from ‘0’ to ‘1’. The PSK_2 represents change in the phase at the change on ‘1’. For example, the phase changes when the encoded data is changed from ‘0’ to ‘1’, or from ‘1’ to ‘1’. • Non-return to zero-level (NRZ_L) • Biphase Differential, Biphase Manchester • Inverted Manchester FIGURE 2-2: ENCODED DATA AND FSK OUTPUT SIGNAL FOR MOD40 OPTION Encoded Data ‘1’ 5 cycles (HI) 5 cycles (LO) 40 RF cycles 2003 Microchip Technology Inc. Encoded Data ‘0’ 4 cycles (HI) 4 cycles (LO) 40 RF cycles DS21219H-page 5 MCRF200 FIGURE 2-3: ‘1’ PSK DATA MODULATION ‘0’ ‘0’ ‘1’ ‘1’ Encoded Data (NRZ_L) PP PP PSK_ 1 Change on Data PP P P 2.2.4 PP MEMORY ARRAY LOCK BIT (CB12) The CB12 must be ‘0’ for contactless programming (Blank). The bit (CB12) is automatically set to ‘1’ as soon as the device is programmed contactlessly. 2.3 Memory Section The device has 128 bits of one-time programmable (OTP) memory. The user can choose 96 or 128 bits by selecting the CB1 bit in the configuration register. See Table 2-4 for more details. 2.3.1 PSK _2 Change on ‘1’ PP COLUMN AND ROW DECODER LOGIC AND BIT COUNTER The column and row decoders address the EEPROM array at the clock rate and generate a serial data stream for modulation. This data stream can be up to 128 bits in length. The size of the data stream is user programmable with CB1 and can be set to 96 or 128 bits. Data lengths of 48 and 64 bits are available by programming the data twice in the array, end-to-end. The column and row decoders route the proper voltage to the array for programming and reading. In the programming modes, each individual bit is addressed serially from bit 1 to bit 128. EXAMPLE 2-2: “00A” CONFIGURATION The “00A” (hex) configuration is interpreted as follows: CB1 CB12 “00A” → 0000-0000-1010 The MSB corresponds to CB12 and the LSB corresponds to CB1 of the configuration register. Therefore, we have: CB12=0 CB11=0 CB10=0 CB9=0 CB8=0 CB7=0 CB6=0 CB5=0 CB4=1 CB3=0 CB2=1 CB1=0 Referring to Table 2-4, the “00A” configuration represents: Not programmed device (blank), anticollision: disabled, FSK protocol, NRZ_L (direct) encoding, MOD50 (baud rate = rf/50), 96 bits. EXAMPLE 2-3: MCRF200 CONFIGURATION FOR FDX-B ISO ANIMAL STANDARD PROTOCOL (ASP) The FDX-B ISO Specification is: 2.4 Examples of Configuration Settings EXAMPLE 2-1: “08D” CONFIGURATION The “08D” (hex) configuration is interpreted as follows: CB1 CB12 Modulation = ASK Data encoding = Differential biphase Baud rate = rf/32 = 4 Kbits/sec for 128 kHz Memory size = 128 bits Referring to Table 2-4, the equivalent MCRF200 configuration is: “14D”. “08D” → 0000-1000-1101 Referring to Table 2-4, the “08D” configuration represents: Modulation = PSK_1 PSK rate = rf/2 Data encoding = NRZ_L (direct) Baud rate = rf/32 = MOD32 Memory size 128 bits DS21219H-page 6 2003 Microchip Technology Inc. MCRF200 TABLE 2-4: CONFIGURATION REGISTER CB12 CB11 CB10 CB9 CB8 CB7 CB6 CB5 CB4 CB3 CB2 CB1 MEMORY SIZE CB1 = 1 128-bit user memory array CB1 = 0 96-bit user memory array BAUD RATE CB2 CB3 CB4 Rate 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 MOD128 MOD100 MOD80 MOD32 MOD64 MOD50 MOD40 MOD16 SYNC WORD CB5 = 0 (Always) DATA ENCODING CB6 = 0; CB7 = 0 NRZ_L (Direct) CB6 = 0; CB7 = 1 Biphase_S (Differential) CB6 = 1; CB7 = 0 Biphase_L (Manchester) CB6 = 1; CB7 = 1 (Inverted Manchester) MODULATION OPTIONS CB8 = 0; CB9 = 0 FSK 0 = Fc/8, 1 = Fc/10 CB8 = 0; CB9 = 1 Direct (ASK) CB8 = 1; CB9 = 0 PSK_1 (phase change on change of data) CB8 = 1; CB9 = 1 PSK_2 (phase change at beginning of a one) PSK RATE OPTION CB10 = 1 Carrier/4 CB10 = 0 Carrier/2 (ANTICOLLISION OPTION (Read-only) CB11 = 0 Disabled (Always) MEMORY ARRAY LOCK BIT (Read-only) CB12 = 0 User memory array not locked (Blank) CB12 = 1 User memory array is locked (Programmed) 2003 Microchip Technology Inc. DS21219H-page 7 MCRF200 3.0 MODES OF OPERATION 3.2 The device has two basic modes of operation: Native mode and Read mode. 3.1 Native Mode Read Mode After the device is programmed (CB12=1), the device is operated in the Read-only mode. The device transmits its data according to the protocol in the configuration register. Every unprogrammed blank device (CB12=0) operates in Native mode, regardless of configuration register settings: FCLK/128, FSK, NRZ_L (direct) Once the user memory is programmed, the lock bit is set (CB12=1) which causes the MCRF200 to switch from Native mode to the Communication mode defined by the configuration register. Refer to Figure 4-1 for contactless programming sequence. Also see the microID™ 125 kHz RFID System Design Guide (DS51115) for more information. FIGURE 3-1: From Reader TYPICAL APPLICATION CIRCUIT IAC RF Signal 2.5 mH 648 pF Input capacitance: 2 pF 125 kHz Pad VA L L C Pad VB To Reader amplifier/filter MCRF200 Data C 1 f res = ------------------- = 125 kHz 2π LC DS21219H-page 8 2003 Microchip Technology Inc. MCRF200 4.0 CONTACTLESS PROGRAMMING The contactless programming of the device is possible for blank devices (CB12=0) only and is recommended for only low-volume, manual operation during development. In volume production, the MCRF200 is normally used as a factory programmed device only. The contactless programming timing sequence consists of: a) b) c) d) e) RF power-up signal. Short gap (absence of RF field). Verify signal (continuous RF signal). Programming signal. Device response with programmed data. The blank device (CB12=0) understands the RF power-up followed by a gap as a blank checking command, and outputs 128 bits of FSK data with all ‘1’s after the short gap. To see this blank data (verify), the reader/programmer must provide a continuous RF signal for 128 bit-time. (The blank (unprogrammed) device has all ‘F’s in its memory array. Therefore, the blank data should be all ‘1’s in FSK format). Since the blank device operates at Default mode (MOD128), there are 128 RF cycles for each bit. Therefore, the time requirement to complete this verify is 128 bits x 128 RF cycles/bit x 8 use/cycles = 131.1 msec for 125 kHz signal. As soon as the device completes the verify, it enters the programming mode. The reader/programmer must provide RF programming data right after the verify. In this programming mode, each bit lasts for 128 RF cycles. Refer to Figure 4-1 for the contactless programming sequence. Customer must provide the following specific voltage for the programming: 1. 2. Power-up and verify signal = 13.5V ±1 VPP Programming voltage: - To program bit to ‘1’: 13.5V ±1 VPP - To program bit to ‘0’: 30V ±2 VPP After the programming cycle, the device outputs programmed data (response). The reader/programmer can send the programming data repeatedly after the device response until the programming is successfully completed. The device locks the CB12 as soon as the programming mode (out of field) is exited and becomes a read-only device. Once the device is programmed (CB12=1), the device outputs its data according to the configuration register. The PG103001 (Contactless Programmer) is used for the programming of the device. The voltage level shown in Figure 4-1 is adjusted by R5 and R7 in the contactless programmer. Refer to the MicroID™ 125 kHz RFID System Design Guide (DS51115) for more information. 2003 Microchip Technology Inc. DS21219H-page 9 DS21219H-page 10 ~ 50 - 100 µs 0V 80 - 180 µs 13.5 ± 1 VPP (R5) Verify FSK Signal 128 bits x 128 cycles/bit x 8 µs/cycle = 131.1 ms 13.5 ±1 VPP Default programming protocol = FSK, Fc/8/10, 128 bits For 96-bit programming, bits 33-64 are ‘don’t care’, but all 128-bit cycles must be in the sequence. Gap Note: Bit 3… Low-power signal: leaves bit = 1 High-power signal: programs bit = 0 1 bit = 128 cycles x 8 µs/cycle = 1.024 ms ∆t = Guard Band 128 bits 30 ± 2 VPP (R7) High-Power Signal Low-Power Signal 13.5 ± 1 VPP (R5) Bit 2 Bit 1 Program FIGURE 4-1: Power-up Contactless Programming Protocol f = 125 kHz t = 8 µs MCRF200 CONTACTLESS PROGRAMMING SEQUENCE 2003 Microchip Technology Inc. MCRF200 5.0 MECHANICAL SPECIFICATIONS FOR DIE AND WAFER FIGURE 5-1: DIE PLOT Device Test Only VSS VCC RESET I/O TABLE 5-1: PAD COORDINATES (µm) Passivation Openings Pad Name Pad Width Pad Height Pad Pad Center X Center Y VA 90.0 90.0 427.50 -734.17 VB 90.0 90.0 -408.60 -734.17 Note 1: All coordinates are referenced from the center of the die. 2: Die size: 1.1215 mm x 1.7384 mm 44.15 mils x 68.44 mils TABLE 5-2: Name VA PAD FUNCTION TABLE Function Antenna Coil connection VB VSS VCC For device test only Do Not Connect to Antenna RESET I/O VB 2003 Microchip Technology Inc. VA DS21219H-page 11 MCRF200 TABLE 5-3: DIE MECHANICAL DIMENSIONS Specifications Min Typ Max Unit Bond pad opening — — 3.5 x 3.5 89 x 89 — — mil µm Note 1, Note 2 Die backgrind thickness — — 7 177.8 — — mil µm Sawed 6” wafer on frame (option = WF) Note 3 — — 11 279.4 — — mil µm Unsawed wafer (option = W) Note 3 Die backgrind thickness tolerance — — — — ±1 ±25.4 mil µm Die passivation thickness (multilayer) — 0.9050 — µm Note 4 Die Size: Die size X*Y before saw (step size) Die size X*Y after saw — — 44.15 x 68.44 42.58 x 66.87 — — mil mil — — Note 1: 2: 3: 4: 5: Comments The bond pad size is that of the passivation opening. The metal overlaps the bond pad passivation by at least 0.1 mil. Metal Pad Composition is 98.5% Aluminum with 1% Si and 0.5% Cu. As the die thickness decreases, susceptibility to cracking increases. It is recommended that the die be as thick as the application will allow. The Die Passivation thickness (0.905 µm) can vary by device depending on the mask set used. The passivation is formed by: -Layer 1: Oxide (undoped oxide 0.135 µm) -Layer 2: PSG (doped oxide, 0.43 µm) -Layer 3: Oxynitride (top layer, 0.34 µm) The conversion rate is 25.4 µm/mil. Notice: Extreme care is urged in the handling and assembly of die products since they are susceptible to mechanical and electrostatic damage. TABLE 5-4: WAFER MECHANICAL SPECIFICATIONS Specifications Min Typ Max Unit Wafer Diameter — 8 — inch Die separation line width — 80 — µm Dice per wafer — 14,000 — die Batch size — 24 — wafer DS21219H-page 12 Comments 150 mm 2003 Microchip Technology Inc. MCRF200 6.0 FAILED DIE IDENTIFICATION Every die on the wafer is electrically tested according to the data sheet specifications and visually inspected to detect any mechanical damage such as mechanical cracks and scratches. Any failed die in the test or visual inspection is identified by black colored ink. Therefore, any die covered with black ink should not be used. The ink dot specification: • Ink dot size: minimum 20 µm x 20 µm • Position: central third of die • Color: black 7.0 WAFER DELIVERY DOCUMENTATION Each wafer container is marked with the following information: • • • • • • Microchip Technology Inc. MP Code Lot Number Total number of wafers in the container Total number of good dice in the container Average die per wafer (DPW) Scribe number of wafers with number of good dice 2003 Microchip Technology Inc. 8.0 NOTICE ON DIE AND WAFER HANDLING The device is very susceptible to Electrostatic Discharge (ESD). ESD can cause critical damage to the device. Special attention is needed during the handling process. Any untraviolet (UV) light can erase the memory cell contents of an unpackaged device. Flourescent lights and sun light can also erase the memory cell although it takes more time than UV lamps. Therefore, keep any unpackaged devices out of UV light and also avoid direct exposure from strong flourescent lights and sun light. Certain integrated circuit (IC) manufacturing, chip-onboard (COB) and tag assembly operations may use UV light. Operations such as backgrind, de-tape, certain cleaning operations, epoxy or glue cure should be done without exposing the die surface to UV light. Using x-ray for die inspection will not harm the die, nor erase memory cell contents. DS21219H-page 13 MCRF200 9.0 PACKAGING INFORMATION 9.1 Package Marking Information 8-Lead PDIP (300 mil) MCRF200 XXXXXNNN 0025 XXXXXXXX XXXXXNNN YYWW 8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN Legend: Note: * XX...X Y YY WW NNN Example: Example: MCRF200 XXX0025 NNN Customer specific information* Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. Standard device marking consists of Microchip part number, year code, week code, and traceability code. DS21219H-page 14 2003 Microchip Technology Inc. MCRF200 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) E1 D 2 n 1 α E A2 A L c A1 β B1 p eB UNITS DIMENSION LIMITS Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing § Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic B MIN n p A A2 A1 E E1 D L c B1 B eB α β .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10 MAX .170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 10 5 10 5 MIN MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 2003 Microchip Technology Inc. DS21219H-page 15 MCRF200 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 α h 45° c A2 A φ β UNITS DIMENSION LIMITS Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic L MIN n p A A2 A1 E E1 D h L φ c B α β .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 A1 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 .10 .18 5.79 6.02 3.71 3.91 4.80 4.90 .25 .38 .48 .62 0 4 .20 .23 .33 .42 0 12 0 12 MIN MAX 1.75 1.55 .25 6.20 3.99 5.00 .51 .76 8 .25 .51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 DS21219H-page 16 2003 Microchip Technology Inc. MCRF200 1M/3M COB (IOA2) MCRF200 COB 8 mm Antenna Coil Connection 5 mm Thickness = 0.4 mm 2003 Microchip Technology Inc. DS21219H-page 17 MCRF200 NOTES: DS21219H-page 18 2003 Microchip Technology Inc. MCRF200 ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape® or Microsoft® Internet Explorer. Files are also available for FTP download from our FTP site. Connecting to the Microchip Internet Web Site SYSTEMS INFORMATION AND UPGRADE HOT LINE The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive the most current upgrade kits. The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world. 042003 The Microchip web site is available at the following URL: www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: • Latest Microchip Press Releases • Technical Support Section with Frequently Asked Questions • Design Tips • Device Errata • Job Postings • Microchip Consultant Program Member Listing • Links to other useful web sites related to Microchip Products • Conferences for products, Development Systems, technical information and more • Listing of seminars and events 2003 Microchip Technology Inc. DS21219H-page 19 MCRF200 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Device: MCRF200 Y N Literature Number: DS21219H Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21219H-page 20 2003 Microchip Technology Inc. MCRF200 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Device Temperature Range Package XXX Configuration/SQTP code Device MCRF200 = 125 kHz Contactless Programmable MicroID™ tag, 96/128-bit Temperature Range I = -40°C to +85°C (Industrial) Examples: a) b) MCRF200-I/W00A = 125 kHz, industrial temperature, wafer package, contactlessly programmable, 96 bit, FSK Fc/8 Fc/10, direct encoded, Fc/50 data return rate tag. MCRF200-I/WFQ23 = 125 kHz, industrial temperature, wafer sawn and mounted on frame, factory programmed. The configuration register is: CB12 CB11 CB10 CB9 CB8 CB7 CB6 CB5 CB4 CB3 CB2 CB1 0 0 0 0 0 0 0 0 1 0 1 0 Package WF W S P SN 1M = = = = = = 3M = Sawed wafer on frame (7 mil backgrind) Wafer (11 mil backgrind) Dice in waffle pack Plastic PDIP (300 mil Body) 8-lead Plastic SOIC (150 mil Body) 8-lead 0.40 mm (I0A2 package) COB Module w/1000 pF capacitor 0.40 mm (I0A2 package) COB Module with 330 pF capacitor Configuration Three-digit HEX value to be programmed into the configuration register. Three HEX characters correspond to 12 binary bits. These bits are programmed into the configuration register MSB first (CB12, CB11...CB1). Refer to example. SQTP Code An assigned custom, 3-digit code used for tracking and controlling production and customer data files for factory programming. In this case the configuration code is not shown in the part number, but is captured in the SQTP documentation. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2003 Microchip Technology Inc. DS21219H-page 21 MCRF200 NOTES: DS21219H-page 22 2003 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartShunt and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003 . The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2003 Microchip Technology Inc. DS21219H-page 23 WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC Korea Corporate Office Australia 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Atlanta Unit 706B Wan Tai Bei Hai Bldg. No. 6 Chaoyangmen Bei Str. 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