EClamp2342N ESD/EMI Protection for Color LCD Interfaces PRELIMINARY PROTECTION PRODUCTS - EMIClampTM Description Features The EClampTM2342N is a low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics. They have been optimized for protection of color LCD panels in cellular phones and other portable electronics. Bidirectional EMI/RFI filter with integrated TVS for ESD protection ESD protection to IEC 61000-4-2 (ESD) Level4, of TVS diodes for ESD protection, and a resistor capacitor network for EMI/RFI filtering. A series resistor value of 100Ω and a capacitance value of 20pF are used to achieve 30dB minimum attenuation from 1GHz to 2.5GHz. Each line features two stages of TVS diode protection. The TVS diodes provide effective suppression of ESD voltages in excess of 15kV (air discharge) and 8kV (contact discharge) per IEC 610004-2, level 4. Mechanical Characteristics +/-15kV (air), +/-8kV (contact) Filter performance: 30dB minimum attenuation The device consists of eight identical circuits comprised 1GHz to 2.5GHz TVS working voltage: 5V Resistor: 100Ω +/− 15% Input Capacitance: 20pF (VR = 0V) Protection and filtering for eight lines Solid-state technology 16 pin QFN Nominal Dimensions: 3.0 x 3.0 x 1.0 mm Lead Pitch: 0.5mm Lead finish: Matte Tin Marking : Marking Code + Date Code Packaging : Tape and Reel per EIA 481 Applications The EClamp2342N is in a 16-pin, 0.5mm pitch QFN package. It measures 3.0 x 3.0 x 1.0mm. The small package makes it ideal for use in portable electronics such as cell phones, digital still cameras, and PDA’s. Circuit Diagram Color LCD Panel Protection Cell Phone CCD Camera Lines Clamshell Cell Phones Personal Digital Assistants (PDA’s) Package Configuration 16 1 LOW PASS FILTER R = 100Ω, C=20pF (max) 16 Pin QFN (Top Side View) Maximum Dimensions (in mm) Device Schematic (8X) Revision 09/01/2004 1 www.semtech.com EClamp2342N PRELIMINARY PROTECTION PRODUCTS Maximum Ratings R ating Symbol Value Units VESD +/- 17 +/- 12 kV Junction Temp erature TJ 125 o Op erating Temp erature Top -40 to +85 o Storage Temp erature TSTG -55 to +150 o ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) C C C Electrical Characteristics P ar am et er S y m b ol Con d i t i on s Mi n i mu m Ty p i c a l M ax i m u m Units 5 V 10 V 0.5 µA 100 115 Ohms 20 pF T VS Reverse Stand-Off Voltage VRWM T VS Reverse Breakdown Voltage V BR It = 1mA T VS Reverse Leakage Current IR VRWM = 3.0V Total Series Resistance R Each Line Total Cap acitance Cin Inp ut to Gnd, Each Line VR = 0V, f = 1MHz 16 Total Cap acitance Cin Inp ut to Gnd, Each Line VR = 2.5V, f = 1MHz 12 2004 Semtech Corp. 2 6 85 8 pF www.semtech.com EClamp2342N PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss S21 (Each Line) CH1 S21 LOG Analog Crosstalk (Each Line) 6 dB / REF 0 dB CH1 S21 LOG 20 dB /REF 0 dB 1: -8.4313 dB 280.123 MHz 2: -18.865 dB 900 MHz 0 dB -6 dB 3: -31.170 dB 1.8 GHz 1 -12 dB 4: -31.638 dB 2.5 GHz -18 dB 2 -24 dB -30 dB 3 4 -36 dB -42 dB 1 MHz 10 MHz 100 MHz STOP 3000. 000000 MHz START. 030 MHz ESD Clamping (+8kV Contact) ESD Clamping (-8kV Contact) Capacitance vs. Reverse Voltage (Normalized to 0 volts) Series Resistance vs. Temperature (Normalized to 25 Degrees Celcius) 1.2 1.2 1 1.1 0.8 Series Resistance (Ohm) Capacitance - CJ (pF) STOP 3000. 000000 MHz START. 030 MHz 3 1 GHz GHz 0.6 0.4 0.2 1.0 0.9 0.8 f = 1 MHz 0 0 1 2 3 4 5 0.7 -40 Reverse Voltage - VR (V) 2004 Semtech Corp. -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature (*C) 3 www.semtech.com EClamp2342N PRELIMINARY PROTECTION PRODUCTS Applications Information Device Connection Pin Identification and Configuration (Top Side View) The EClamp2342N is comprised of eight identical circuits each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. The device is housed in a 16-pin Quad Flat No-Lead (QFN) package. Electrical connection is made via 16 pins located at the bottom of the device. A center tab serves as the ground connection. Pin connections are noted in the table to the right. The device is symmetrical and designed for easy PCB routing as shown in the layout example below. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Pin Identification 3 - 10 Inp ut, Lines 1, 2, 3, 4, 5, 6, 7, 8 1, 2, 11 - 16 Outp ut Lines 1, 2, 3, 4, 5,6, 7, 8 Center Tab Ground Pin Configuration and Schematic 3 2 7 LOW PASS FILTER 4 1 8 13 LOW PASS FILTER LOW PASS FILTER Layout Example (Top Side View) 14 LOW PASS FILTER Outputs 1 2 3 4 5 6 7 8 5 16 9 6 15 LOW PASS FILTER I/O Lines 1 - 4 1 2 2004 Semtech Corp. 3 4 5 6 Inputs 12 LOW PASS FILTER LOW PASS FILTER 10 11 LOW PASS FILTER I/O Lines 5 - 8 7 8 4 www.semtech.com EClamp2342N PRELIMINARY PROTECTION PRODUCTS Outline Drawing - 16L QFN A DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX D A A1 A2 b D D1 E E1 e L N aaa bbb B PIN 1 INDICATOR (LASER MARK) E A2 A aaa C A1 C .031 .040 .002 .000 (.008) .007 .010 .012 .114 .118 .122 .051 .057 .061 .114 .118 .122 .051 .057 .061 .020 BSC .012 .016 .020 16 .003 .004 0.80 1.00 0.00 0.05 (0.20) 0.18 0.25 0.30 2.90 3.00 3.10 1.30 1.45 1.55 2.90 3.00 3.10 1.30 1.45 1.55 0.50 BSC 0.30 0.40 0.50 16 0.08 0.10 SEATING PLANE D1 e/2 LxN E/2 E1 2 1 N e bxN bbb D/2 C A B NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - 16L QFN H R DIM 2x G 2x Z 2x (C) 4x Y X C G H R P X Y Z DIMENSIONS INCHES MILLIMETERS (.112) .079 .063 .006 .020 .012 .033 .146 (2.85) 2.00 1.60 0.15 0.50 0.30 0.85 3.70 P NOTES: 1. 2004 Semtech Corp. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 5 www.semtech.com EClamp2342N PRELIMINARY PROTECTION PRODUCTS Marking 16 15 14 13 1 2 3 4 2342N YYWW Ordering Information 13 14 15 16 12 11 10 9 12 11 10 9 1 2 3 4 5 6 7 8 Top View Showing Device Marking Part Number Qty per Reel R eel Size EClamp 2342N .TCT 3000 7 Inch EMIClamp and EClamp are marks of Semtech Corporation 8 7 6 5 Bottom View Showing Pin 1 Identifier Notes: 1) YYWW = Date Code (example: 0410 = 2004 year Week 10 2) Pin 1 indicated by bevel on the ground pad Tape and Reel Specification Tape Specifications Device Orientation in Tape Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2004 Semtech Corp. 6 www.semtech.com