BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors Rev. 07 — 17 November 2009 Product data sheet 1. Product profile 1.1 General description NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages. Table 1. Product overview Type number[1] Package NXP JEITA JEDEC PNP complement BC846 SOT23 - TO-236AB BC856 BC846W SOT323 SC-70 - BC856W BC846T SOT416 SC-75 - BC856T BC546A[2] SOT54 SC-43A TO-92 BC556A BC546B[2] SOT54 SC-43A TO-92 BC556B [1] Valid for all available selection groups. [2] Also available in SOT54A and SOT54 variant packages (see Section 2). 1.2 Features General-purpose transistors SMD plastic packages Two different gain selections 1.3 Applications General-purpose switching and amplification 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter Conditions Min Typ Max Unit open base - - 65 V - - 100 mA 110 - 450 VCEO collector-emitter voltage IC collector current hFE DC current gain VCE = 5 V; IC = 2 mA hFE group A 110 180 220 hFE group B 200 290 450 BC846/BC546 series NXP Semiconductors 65 V, 100 mA NPN general-purpose transistors 2. Pinning information Table 3. Pin Pinning Description Simplified outline Symbol SOT23; SOT323; SOT416 1 base 2 emitter 3 collector 3 3 1 1 2 2 sym021 006aaa144 SOT54 1 emitter 2 base 3 collector 3 1 2 3 2 1 001aab347 sym026 SOT54A 1 emitter 2 base 3 collector 3 1 2 2 3 1 001aab348 sym026 SOT54 variant 1 emitter 2 base 3 collector 3 1 2 3 001aab447 2 1 sym026 BC846_BC546_SER_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 2 of 14 BC846/BC546 series NXP Semiconductors 65 V, 100 mA NPN general-purpose transistors 3. Ordering information Table 4. Ordering information Type number[1] Package Name Description Version BC846 - plastic surface mounted package; 3 leads SOT23 BC846W SC-70 plastic surface mounted package; 3 leads SOT323 BC846T SC-75 plastic surface mounted package; 3 leads SOT416 BC546A[2] SC-43A plastic single-ended leaded (through hole) package; 3 leads SOT54 BC546B[2] SC-43A plastic single-ended leaded (through hole) package; 3 leads SOT54 [1] Valid for all available selection groups. [2] Also available in SOT54 and SOT54 variant packages (see Section 2 and Section 9). 4. Marking Table 5. Marking codes Type number Marking code[1] Type number Marking code[1] BC846 1D* BC846T 1M BC846A 1A* BC846AT 1A BC846B 1B* BC846BT 1B BC846W 1D* BC546A C546A BC846AW 1A* BC546B C546B BC846BW 1B* - - [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BC846_BC546_SER_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 3 of 14 BC846/BC546 series NXP Semiconductors 65 V, 100 mA NPN general-purpose transistors 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO VCEO collector-base voltage open emitter - 80 V collector-emitter voltage open base - 65 V VEBO emitter-base voltage open collector - 6 V IC collector current - 100 mA ICM peak collector current single pulse; tp ≤ 1 ms - 200 mA IBM peak base current single pulse; tp ≤ 1 ms - 200 mA Ptot total power dissipation Tamb ≤ 25 °C SOT23 - 250 mW SOT323 - 200 mW SOT416 - 150 mW [1] - 500 mW Tj junction temperature SOT54 - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7. Symbol Rth(j-a) [1] Thermal characteristics Parameter Min Typ Max Unit SOT23 - - 500 K/W SOT323 - - 625 K/W thermal resistance from junction to ambient Conditions in free air SOT416 - - 833 K/W SOT54 - - 250 K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. BC846_BC546_SER_7 Product data sheet [1] © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 4 of 14 BC846/BC546 series NXP Semiconductors 65 V, 100 mA NPN general-purpose transistors 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Min Typ Max Unit collector-base cut-off VCB = 30 V; IE = 0 A current VCB = 30 V; IE = 0 A; Tj = 150 °C - - 15 nA - - 5 μA IEBO emitter-base cut-off current VEB = 5 V; IE = 0 A - - 100 nA hFE DC current gain hFE group A VCE = 5 V; IC = 10 μA - 180 - hFE group B VCE = 5 V; IC = 10 μA - 290 - DC current gain VCE = 5 V; IC = 2 mA 110 - 450 hFE group A VCE = 5 V; IC = 2 mA 110 180 220 hFE group B VCE = 5 V; IC = 2 mA 200 290 450 200 ICBO VCEsat VBEsat VBE Conditions collector-emitter saturation voltage base-emitter saturation voltage base-emitter voltage IC = 10 mA; IB = 0.5 mA - 90 IC = 100 mA; IB = 5 mA [1] - 200 400 mV IC = 10 mA; IB = 0.5 mA [2] - 760 - mV IC = 100 mA; IB = 5 mA [2] - 900 - mV IC = 2 mA; VCE = 5 V [3] 580 660 700 mV IC = 10 mA; VCE = 5 V [3] - - 770 mV 100 - - MHz collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz - 2 3 pF Ce emitter capacitance VEB = 0.5 V; IC = ic = 0 A; f = 1 MHz - 11 - pF NF noise figure IC = 200 μA; VCE = 5 V; RS = 2 kΩ; f = 1 kHz; B = 200 Hz - 2 10 dB fT transition frequency Cc VCE = 5 V; IC = 10 mA; f = 100 MHz [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. [2] VBEsat decreases by approximately 1.7 mV/K with increasing temperature. [3] VBE decreases by approximately 2 mV/K with increasing temperature. BC846_BC546_SER_7 Product data sheet mV © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 5 of 14 BC846/BC546 series NXP Semiconductors 65 V, 100 mA NPN general-purpose transistors mgt723 400 hFE mgt724 1200 VBE (mV) 1000 (1) 300 (1) 800 (2) (2) 200 600 (3) 400 (3) 100 200 0 10−1 1 10 102 0 10−1 103 1 10 102 I C (mA) VCE = 5 V VCE = 5 V (1) Tamb = 150 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Fig 1. 103 I C (mA) (3) Tamb = 150 °C Selection A: DC current gain as a function of collector current; typical values mgt725 103 VCEsat (mV) Fig 2. Selection A: Base-emitter voltage as a function of collector current; typical values mgt726 1200 VBEsat (mV) 1000 (1) 800 (2) 102 600 (1) (3) (2) 400 (3) 200 10 10−1 1 10 102 0 10−1 103 1 IC/IB = 20 IC/IB = 10 (1) Tamb = 150 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Fig 3. 102 103 (3) Tamb = 150 °C Selection A: Collector-emitter saturation voltage as a function of collector current; typical values Fig 4. Selection A: Base-emitter saturation voltage as a function of collector current; typical values BC846_BC546_SER_7 Product data sheet 10 I C (mA) I C (mA) © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 6 of 14 BC846/BC546 series NXP Semiconductors 65 V, 100 mA NPN general-purpose transistors mgt727 600 VBE (mV) 1000 hFE (1) 500 mgt728 1200 (1) 400 800 (2) (2) 300 600 200 400 (3) (3) 100 200 0 10−1 1 10 102 0 10−2 103 10−1 1 10 I C (mA) VCE = 5 V VCE = 5 V (1) Tamb = 150 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Fig 5. 102 103 I C (mA) (3) Tamb = 150 °C Selection B: DC current gain as a function of collector current; typical values mgt729 104 VCEsat (mV) Fig 6. Selection B: Base-emitter voltage as a function of collector current; typical values mgt730 1200 VBEsat (mV) 1000 (1) 103 800 (2) 600 (3) 102 400 (1) 200 (3) (2) 10 10−1 1 10 102 0 10−1 103 1 IC/IB = 20 IC/IB = 10 (1) Tamb = 150 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Fig 7. 102 103 (3) Tamb = 150 °C Selection B: Collector-emitter saturation voltage as a function of collector current; typical values Fig 8. Selection B: Base-emitter saturation voltage as a function of collector current; typical values BC846_BC546_SER_7 Product data sheet 10 I C (mA) I C (mA) © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 7 of 14 BC846/BC546 series NXP Semiconductors 65 V, 100 mA NPN general-purpose transistors 8. Package outline 3.0 2.8 1.1 0.9 2.2 1.8 1.1 0.8 0.45 0.15 3 3 0.45 0.15 2.5 1.4 2.1 1.2 2.2 1.35 2.0 1.15 1 1 2 0.48 0.38 1.9 Dimensions in mm Fig 9. 2 0.4 0.3 0.15 0.09 0.25 0.10 1.3 04-11-04 Package outline SOT23 (TO-236AB) Dimensions in mm 04-11-04 Fig 10. Package outline SOT323 (SC-70) 0.95 0.60 1.8 1.4 3 0.45 0.38 4.2 3.6 0.45 0.15 0.48 0.40 1.75 0.9 1.45 0.7 1 2 4.8 4.4 1 2.54 3 1.27 2 0.30 0.15 0.25 0.10 5.2 5.0 1 Dimensions in mm 04-11-04 Fig 11. Package outline SOT416 (SC-75) 14.5 12.7 Dimensions in mm 04-11-16 Fig 12. Package outline SOT54 (SC-43A/TO-92) 0.45 0.38 0.45 0.38 4.2 3.6 4.2 3.6 1.27 0.48 0.40 3 max 1 2.5 max 0.48 0.40 1 2 4.8 4.4 5.08 2.54 2 4.8 4.4 2.54 3 1.27 3 5.2 5.0 5.2 5.0 14.5 12.7 Dimensions in mm Fig 13. Package outline SOT54A 04-06-28 Dimensions in mm 05-01-10 Fig 14. Package outline SOT54 variant BC846_BC546_SER_7 Product data sheet 14.5 12.7 © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 8 of 14 BC846/BC546 series NXP Semiconductors 65 V, 100 mA NPN general-purpose transistors 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number[2] Package Description Packing quantity 3000 5000 10000 BC846 SOT23 4 mm pitch, 8 mm tape and reel -215 - -235 BC846W SOT323 4 mm pitch, 8 mm tape and reel -115 - -135 BC846T SOT416 4 mm pitch, 8 mm tape and reel -115 - -135 BC546A SOT54 bulk, straight leads - -412 - SOT54A tape and reel, wide pitch - - -116 tape ammopack, wide pitch - - -126 - -112 - SOT54 variant bulk, delta pinning BC546B SOT54 bulk, straight leads - -412 - SOT54A tape and reel, wide pitch - - -116 tape ammopack, wide pitch - - -126 - -112 - SOT54 variant bulk, delta pinning [1] For further information and the availability of packing methods, see Section 13. [2] Valid for all available selection groups. BC846_BC546_SER_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 9 of 14 BC846/BC546 series NXP Semiconductors 65 V, 100 mA NPN general-purpose transistors 10. Soldering 2.90 2.50 solder lands solder resist 2 0.85 1 2.70 1.30 3.00 0.85 3 occupied area solder paste 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 Dimensions in mm Fig 15. Reflow soldering footprint SOT23 (TO-236AB) 3.40 1.20 (2x) solder lands solder resist occupied area 2 1 4.60 4.00 1.20 3 preferred transport direction during soldering 2.80 4.50 MSA427 Dimensions in mm Fig 16. Wave soldering footprint SOT23 (TO-236AB) BC846_BC546_SER_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 10 of 14 BC846/BC546 series NXP Semiconductors 65 V, 100 mA NPN general-purpose transistors 2.65 0.75 1.325 1.30 solder lands 2 solder paste 0.50 (3×) 1.90 3 0.60 2.35 0.85 (3×) solder resist occupied area 1 Dimensions in mm 0.55 (3×) msa429 2.40 Fig 17. Reflow soldering footprint SOT323 (SC-70) 4.60 4.00 1.15 2 3.65 3 2.10 2.70 solder lands 0.90 (2×) 1 solder resist occupied area Dimensions in mm msa419 preferred transport direction during soldering Fig 18. Wave soldering footprint SOT323 (SC-70) 2.2 0.6 1.1 0.7 2 2.0 3 0.85 1.5 1 0.6 (3x) 1.9 Dimensions in mm solder lands solder resist 0.5 (3x) msa438 solder paste occupied area Fig 19. Reflow soldering footprint SOT416 (SC-75) BC846_BC546_SER_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 11 of 14 BC846/BC546 series NXP Semiconductors 65 V, 100 mA NPN general-purpose transistors 11. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes BC846_BC546_SER_7 20091117 Product data sheet - BC846_BC546_SER_6 Modifications: BC846_BC546_SER_6 • This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • • • • Table 3 “Pinning”: updated Figure 17 “Reflow soldering footprint SOT323 (SC-70)”: updated Figure 18 “Wave soldering footprint SOT323 (SC-70)”: updated Figure 19 “Reflow soldering footprint SOT416 (SC-75)”: updated 20060207 Product data sheet - BC846_BC847_ BC848_5 BC846T_847T_ SERIES_3 BC846W_BC847W_ BC848W_4 BC546_547_4 BC846_BC847_BC848_5 20040206 Product specification - BC846_BC847_ BC848_4 BC846T_847T_SERIES_ 20001115 3 Product specification - BC846T_847T_2 BC846W_BC847W_ BC848W_4 20020204 Product specification - BC846W_847W_3 BC546_547_4 20041125 Product specification - BC546_547_3 BC846_BC546_SER_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 12 of 14 BC846/BC546 series NXP Semiconductors 65 V, 100 mA NPN general-purpose transistors 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 12.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BC846_BC546_SER_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 17 November 2009 13 of 14 NXP Semiconductors BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Packing information . . . . . . . . . . . . . . . . . . . . . 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 17 November 2009 Document identifier: BC846_BC546_SER_7