SS115 1.0 AMP. Surface Mount Schottky Barrier Rectifiers Voltage Range 150 Volts Current 1.0 Ampere SMA/DO-214AC Features a a a a a a For surface mounted application Metal to silicon rectifier, majority carrier conduction Low forward voltage drop Easy pick and place High surge current capability Plastic material used carriers Underwriters Laboratory Classification 94V-O a Epitaxial construction a High temperature soldering: o 260 C/ 10 seconds at terminals Mechanical Data a a a a a Case: Molded plastic Terminals: Solder plated Polarity: Indicated by cathode band Packaging: 12mm tape per EIA STD RS-481 Weight: 0.064 gram .062(1.58) .050(1.27) .111(2.83) .090(2.29) .187(4.75) .160(4.06) .091(2.30) .078(1.99) .056(1.41) .035(0.90) .012(.31) .006(.15) .008(.20) .004(.10) .210(5.33) .195(4.95) Dimensions in inches and (millimeters) Maximum Ratings and Electrical Characteristics Rating at 25ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Symbol Type Number Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current at TL (See Fig. 1) Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) Maximum Instantaneous Forward Voltage O (Note 1) @ 25 C 1.0A O @ 125 C 1.0A O @ 25 C 2.0A O @ 125 C 2.0A Maximum DC Reverse Current @ TA =25 at Rated DC Blocking Voltage @ TA=125 SS115 Units VRRM VRMS VDC 150 105 150 V V V I(AV) 1.0 A IFSM 30 A VF IR Typical Junction Capacitance (Note 3) Cj Typical Thermal Resistance ( Note 2 ) RJL Operating Temperature Range Storage Temperature Range TJ TSTG 0.82 0.67 0.89 0.75 0.05 0.5 50 20 -65 to +150 -65 to +150 Notes: 1. Pulse Test with PW=300 usec, 1% Duty Cycle 2. Measured on P.C.Board with 0.2 x 0.2”(5.0 x 5.0mm) Copper Pad Areas. 3. Measured at 1 MHz and A pplied Reverse Voltage of 4.0V D.C ｈｔｔｐ：／／ｗｗｗ．ｌｕｇｕａｎｇ．ｃｎ ｍａｉｌ：ｌｇｅ＠ｌｕｇｕａｎｇ．ｃｎ V mA mA pF /W RATINGSANDCHARACTERISTICCURVES(SS115) FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE .50 PCB MOUNTED ON 0.2X0.2" (5.0X5.0mm) COPPER PAD AREAS 50 60 70 80 90 100 110 PEAK FORWARD SURGE CURRENT. (A) AVERAGE FORWARD CURRENT. (A) RESISTIVE OR INDUCTIVE LOAD 0 FIG.2- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 50 1.0 AT RATED TL 8.3ms Single Half Sine Wave JEDEC Method 40 30 20 10 0 120 130 140 150 160 1 170 10 100 NUMBER OF CYCLES AT 60Hz o LEAD TEMPERATURE. ( C) FIG.3- TYPICAL FORWARD CHARACTERISTICS FIG.4- TYPICAL REVERSE CHARACTERISTICS 100 50 INSTANTANEOUS REVERSE CURRENT. (mA) INSTANTANEOUS FORWARD CURRENT. (A) Tj=125 0C 10.0 1 Tj=25 0C 0.1 PULSE WIDTH=300 S 1% DUTY CYCLE 0.01 10 Tj=125 0C 1 0.1 Tj=25 0C 0.01 0.001 0 .2 .4 .6 .8 1.0 1.2 1.4 1.6 0 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE. (%) FORWARD VOLTAGE. (V) FIG.5- TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE.(pF) 400 Tj=25 0C f=1.0MHz Vsig=50mVp-p 100 10 .1 1.0 10 100 REVERSE VOLTAGE. (V) ｈｔｔｐ：／／ｗｗｗ．ｌｕｇｕａｎｇ．ｃｎ ｍａｉｌ：ｌｇｅ＠ｌｕｇｕａｎｇ．ｃｎ