AMD AM50DL128BH56I Stacked multi-chip package (mcp) flash memory and sram Datasheet

Am50DL128BH
Data Sheet
-XO\
7KHIROORZLQJGRFXPHQWVSHFLILHV6SDQVLRQPHPRU\SURGXFWVWKDWDUHQRZRIIHUHGE\ERWK$GYDQFHG
0LFUR'HYLFHVDQG)XMLWVX$OWKRXJKWKHGRFXPHQWLVPDUNHGZLWKWKHQDPHRIWKHFRPSDQ\WKDWRULJ
LQDOO\ GHYHORSHG WKHVSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EHRIIHUHG WR FXVWRPHUVRIERWK $0' DQG
)XMLWVX
Continuity of Specifications
7KHUHLVQRFKDQJHWRWKLVGDWDVKHHWDVDUHVXOWRIRIIHULQJWKHGHYLFHDVD6SDQVLRQSURGXFW$Q\
FKDQJHVWKDWKDYHEHHQPDGHDUHWKHUHVXOWRIQRUPDOGDWDVKHHWLPSURYHPHQWDQGDUHQRWHGLQWKH
GRFXPHQWUHYLVLRQVXPPDU\ZKHUHVXSSRUWHG)XWXUHURXWLQHUHYLVLRQVZLOORFFXUZKHQDSSURSULDWH
DQGFKDQJHVZLOOEHQRWHGLQDUHYLVLRQVXPPDU\
Continuity of Ordering Part Numbers
$0'DQG)XMLWVXFRQWLQXHWRVXSSRUWH[LVWLQJSDUWQXPEHUVEHJLQQLQJZLWK³$P´DQG³0%0´7RRUGHU
WKHVHSURGXFWVSOHDVHXVHRQO\WKH2UGHULQJ3DUW1XPEHUVOLVWHGLQWKLVGRFXPHQW
For More Information
3OHDVH FRQWDFW \RXU ORFDO $0' RU )XMLWVX VDOHV RIILFH IRU DGGLWLRQDO LQIRUPDWLRQ DERXW 6SDQVLRQ
PHPRU\VROXWLRQV
Publication Number 30773 Revision A
Amendment +1 Issue Date October 7, 2003
THIS PAGE LEFT INTENTIONALLY BLANK.
ADVANCE INFORMATION
Am50DL128BH
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Two Am29DL640G 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous
Operation Flash Memories and 32 Mbit (2 M x 16-Bit) Pseudo Static RAM with Page Mode
DISTINCTIVE CHARACTERISTICS
■ 20 year data retention at 125°C
MCP Features
■ Power supply voltage of 2.7 to 3.3 volt
— Reliable operation for the life of the system
SOFTWARE FEATURES
■ High performance
— Access time as fast as 55 ns
■ Package
■ Data Management Software (DMS)
— AMD-supplied software manages data programming,
enabling EEPROM emulation
— Eases historical sector erase flash limitations
— 73-Ball FBGA
■ Operating Temperature
■ Supports Common Flash Memory Interface (CFI)
— –40°C to +85°C
Flash Memory Features
ARCHITECTURAL ADVANTAGES
■ Simultaneous Read/Write operations
— Data can be continuously read from one bank while
executing erase/program functions in another bank.
— Zero latency between read and write operations
■ Flexible Bank™ architecture
— Read may occur in any of the three banks not being written
or erased.
— Four banks may be grouped by customer to achieve desired
bank divisions.
■ Manufactured on 0.13 µm process technology
■ SecSi™ (Secured Silicon) Sector: Extra 256 Byte sector
— Factory locked and identifiable: 16 bytes available for
secure, random factory Electronic Serial Number; verifiable
as factory locked through autoselect function. ExpressFlash
option allows entire sector to be available for
factory-secured data
— Customer lockable: Sector is one-time programmable. Once
sector is locked, data cannot be changed.
■ Zero Power Operation
— Sophisticated power management circuits reduce power
consumed during inactive periods to nearly zero.
■ Boot sectors
— Top and bottom boot sectors in the same device
■ Compatible with JEDEC standards
— Pinout and software compatible with single-power-supply
flash standard
PERFORMANCE CHARACTERISTICS
■ High performance
— Access time as fast as 55 ns
— Program time: 4 µs/word typical utilizing Accelerate function
■ Ultra low power consumption (typical values)
— 2 mA active read current at 1 MHz
— 10 mA active read current at 5 MHz
— 200 nA in standby or automatic sleep mode
■ Minimum 1 million erase cycles guaranteed per sector
■ Program/Erase Suspend/Erase Resume
— Suspends program/erase operations to allow
programming/erasing in same bank
■ Data# Polling and Toggle Bits
— Provides a software method of detecting the status of
program or erase cycles
■ Unlock Bypass Program command
— Reduces overall programming time when issuing multiple
program command sequences
HARDWARE FEATURES
■ Any combination of sectors can be erased
■ Ready/Busy# output (RY/BY#)
— Hardware method for detecting program or erase cycle
completion
■ Hardware reset pin (RESET#)
— Hardware method of resetting the internal state machine to
the read mode
■ WP#/ACC input pin
— Write protect (WP#) function protects sectors 0, 1, 140, and
141, regardless of sector protect status
— Acceleration (ACC) function accelerates program timing
■ Sector protection
— Hardware method of locking a sector, either in-system or
using programming equipment, to prevent any program or
erase operation within that sector
— Temporary Sector Unprotect allows changing data in
protected sectors in-system
pSRAM Features
■ Power dissipation
— Operating: 40 mA maximum
— Standby: 70 µA maximum
— Deep power-down standby: 5 µA
■ CE1s# and CE2s Chip Select
■ Power down features using CE1s# and CE2s
■ Data retention supply voltage: 2.7 to 3.3 volt
■ Byte data control: LB#s (DQ7–DQ0), UB#s (DQ15–DQ8)
■ 8-word page mode access
This document contains information on a product under development at Advanced Micro Devices. The information
is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed
product without notice.
Publication# 30773 Rev: A Amendment/+1
Issue Date: October 7, 2003
Refer to AMD’s Website (www.amd.com) for the latest information.
A D V A N C E
I N F O R M A T I O N
GENERAL DESCRIPTION
Am29DL640H Features
The Am29DL640H is a 64 megabit, 3.0 volt-only flash
memory device, organized as 4,194,304 words of 16
bits each or 8,388,608 bytes of 8 bits each. Word
mode data appears on DQ15–DQ0; byte mode data
appears on DQ7–DQ0. The device is designed to be
programmed in-system with the standard 3.0 volt VCC
supply, and can also be programmed in standard
EPROM programmers.
The device is available with an access time of 55, 70
or 85 ns and is offered in a 73-ball FBGA package.
Standard control pins—chip enable (CE#f), write enable (WE#), and output enable (OE#)—control normal
read and write operations, and avoid bus contention
issues.
The device requires only a single 3.0 volt power supply for both read and write functions. Internally generated and regulated voltages are provided for the
program and erase operations.
Simultaneous Read/Write Operations with
Zero Latency
The Simultaneous Read/Write architecture provides
simultaneous operation by dividing the memory
space into four banks, two 8 Mb banks with small and
large sectors, and two 24 Mb banks of large sectors
only. Sector addresses are fixed, system software can
be used to form user-defined bank groups.
During an Erase/Program operation, any of the three
non-busy banks may be read from. Note that only two
banks can operate simultaneously. The device can improve overall system performance by allowing a host
sy stem to program or erase in one bank, then
immediately and simultaneously read from the other
bank, with zero latency. This releases the system from
waiting for the completion of program or erase
operations.
The Am29DL640H can be organized as both a top and
bottom boot sector configuration.
Bank
Megabits
Bank 1
8 Mb
Bank 2
Bank 3
24 Mb
24 Mb
Bank 4
8 Mb
Sector Sizes
Eight 4 Kword,
Fifteen 32 Kword
Forty-eight 32 Kword
Forty-eight 32 Kword
Eight 4 Kword,
Fifteen 32 Kword
The SecSi™ (Secured Silicon) Sector is an extra
256 byte sector capable of being permanently locked
by AMD or customers. The SecSi Customer Indicator
Bit (DQ6) is permanently set to 1 if the part has been
customer locked, permanently set to 0 if the part has
been factory locked, and is 0 if customer lockable.
This way, customer lockable parts can never be used
to replace a factory locked part.
2
Factory locked parts provide several options. The
SecSi Sector may store a secure, random 16 byte
ESN (Electronic Serial Number), customer code (programmed through AMD’s ExpressFlash service), or
both. Customer Lockable parts may utilize the SecSi
Sector as bonus space, reading and writing like any
other flash sector, or may permanently lock their own
code there.
DMS (Data Management Software) allows systems
to easily take advantage of the advanced architecture
of the simultaneous read/write product line by allowing
removal of EEPROM devices. DMS will also allow the
system software to be simplified, as it will perform all
functions necessary to modify data in file structures,
as opposed to single-byte modifications. To write or
update a particular piece of data (a phone number or
configuration data, for example), the user only needs
to state which piece of data is to be updated, and
where the updated data is located in the system. This
i s an a d v a nt a g e c o m p a r e d to s y s t e m s w h e r e
user-written software must keep track of the old data
location, status, logical to physical translation of the
data onto the Flash memory device (or memory devices), and more. Using DMS, user-written software
does not need to interface with the Flash memory directly. Instead, the user's software accesses the Flash
memory by calling one of only six functions. AMD provides this software to simplify system design and software integration efforts.
The device offers complete compatibility with the
JEDEC single-power-supply Flash command set
standard. Commands are written to the command
register using standard microprocessor write timings.
Reading data out of the device is similar to reading
from other Flash or EPROM devices.
The host system can detect whether a program or
erase operation is complete by using the device status bits: RY/BY# pin, DQ7 (Data# Polling) and
DQ6/DQ2 (toggle bits). After a program or erase cycle
has been completed, the device automatically returns
to the read mode.
The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting
the data contents of other sectors. The device is fully
erased when shipped from the factory.
Hardware data protection measures include a low
V CC detector that automatically inhibits write operations during power transitions. The hardware sector
protection feature disables both program and erase
operations in any combination of the sectors of memory. This can be achieved in-system or via programming equipment.
The device offers two power-saving features. When
addresses have been stable for a specified amount of
time, the device enters the automatic sleep mode.
The system can also place the device into the
standby mode. Power consumption is greatly reduced in both modes.
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5
MCP Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . 5
Flash Memory Block Diagram. . . . . . . . . . . . . . . . 6
Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . 7
Special Package Handling Instructions .................................... 7
Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9
MCP Device Bus Operations. . . . . . . . . . . . . . . . 10
Table 1. Device Bus Operations—Flash Word Mode, CIOf =
VIH ...................................................................................... 11
Table 2. Device Bus Operations—Flash Byte Mode, CIOf = VIL
12
Flash Device Bus Operations . . . . . . . . . . . . . . . 13
Word/Byte Configuration ........................................................ 13
Requirements for Reading Array Data ................................... 13
Writing Commands/Command Sequences ............................ 13
Accelerated Program Operation ............................................. 13
Autoselect Functions .............................................................. 13
Simultaneous Read/Write Operations with Zero Latency ....... 13
Standby Mode ........................................................................ 14
Automatic Sleep Mode ........................................................... 14
RESET#: Hardware Reset Pin ............................................... 14
Output Disable Mode .............................................................. 14
Chip Erase Command Sequence ........................................... 29
Sector Erase Command Sequence ........................................ 29
Erase Suspend/Erase Resume Commands ........................... 30
Figure 5. Erase Operation.............................................................. 30
Table 12. Am29DL640H Command Definitions................... 31
Flash Write Operation Status. . . . . . . . . . . . . . . . 32
DQ7: Data# Polling ................................................................. 32
Figure 6. Data# Polling Algorithm .................................................. 32
RY/BY#: Ready/Busy#............................................................ 33
DQ6: Toggle Bit I .................................................................... 33
Figure 7. Toggle Bit Algorithm........................................................ 33
DQ2: Toggle Bit II ................................................................... 34
Reading Toggle Bits DQ6/DQ2 ............................................... 34
DQ5: Exceeded Timing Limits ................................................ 34
DQ3: Sector Erase Timer ....................................................... 34
Table 13. Write Operation Status ................................................... 35
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 36
Figure 8. Maximum Negative Overshoot Waveform ...................... 36
Figure 9. Maximum Positive Overshoot Waveform........................ 36
ESD IMMUNITY ...................................................................... 37
Flash DC Characteristics . . . . . . . . . . . . . . . . . . . 38
CMOS Compatible. . . . . . . . . . . . . . . . . . . . . . . . . 38
Figure 10. ICC1 Current vs. Time (Showing Active and
Automatic Sleep Currents) ............................................................. 40
Figure 11. Typical ICC1 vs. Frequency ............................................ 40
Table 3. Am29DL640H Sector Architecture ....................................15
Table 4. Bank Address ....................................................................18
Table 5. SecSi™ Sector Addresses ...............................................18
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Sector/Sector Block Protection and Unprotection .................. 19
pSRAM AC Characteristics . . . . . . . . . . . . . . . . . 42
CE#s Timing ........................................................................... 42
Table 6. Am29DL640H Boot Sector/Sector Block Addresses for
Protection/Unprotection ...................................................................19
Write Protect (WP#) ................................................................ 19
Table 7. WP#/ACC Modes ..............................................................20
Temporary Sector Unprotect .................................................. 20
Figure 12. Test Setup.................................................................... 41
Figure 13. Input Waveforms and Measurement Levels ................. 41
Figure 14. Timing Diagram for Alternating
Between Pseudo SRAM to Flash................................................... 42
Read-Only Operations ........................................................... 43
Figure 15. Read Operation Timings ............................................... 43
Figure 1. Temporary Sector Unprotect Operation........................... 20
Figure 2. In-System Sector Protect/Unprotect Algorithms .............. 21
Hardware Reset (RESET#) .................................................... 44
SecSi™ (Secured Silicon) Sector
Flash Memory Region ............................................................ 22
Word/Byte Configuration (CIOf) .............................................. 45
Figure 3. SecSi Sector Protect Verify.............................................. 23
Hardware Data Protection ...................................................... 23
Low VCC Write Inhibit .............................................................. 23
Write Pulse “Glitch” Protection ............................................... 23
Logical Inhibit .......................................................................... 23
Power-Up Write Inhibit ............................................................ 23
Common Flash Memory Interface (CFI) . . . . . . . 23
Table 8. CFI Query Identification String .............................. 24
Table 9. System Interface String......................................................24
Figure 16. Reset Timings ............................................................... 44
Figure 17. CIOf Timings for Read Operations................................ 45
Figure 18. CIOf Timings for Write Operations................................ 45
Erase and Program Operations .............................................. 46
Figure 19. Program Operation Timings..........................................
Figure 20. Accelerated Program Timing Diagram..........................
Figure 21. Chip/Sector Erase Operation Timings ..........................
Figure 22. Back-to-back Read/Write Cycle Timings ......................
Figure 23. Data# Polling Timings (During Embedded Algorithms).
Figure 24. Toggle Bit Timings (During Embedded Algorithms)......
Figure 25. DQ2 vs. DQ6.................................................................
47
47
48
49
49
50
50
Table 10. Device Geometry Definition................................. 25
Table 11. Primary Vendor-Specific Extended Query........... 26
Flash Command Definitions . . . . . . . . . . . . . . . . 27
Reading Array Data ................................................................ 27
Reset Command ..................................................................... 27
Autoselect Command Sequence ............................................ 27
Enter SecSi™ Sector/Exit SecSi Sector
Command Sequence .............................................................. 27
Byte/Word Program Command Sequence ............................. 28
Unlock Bypass Command Sequence ..................................... 28
Temporary Sector Unprotect .................................................. 51
Figure 4. Program Operation .......................................................... 29
Figure 31. Pseudo SRAM Write Cycle—WE# Control ................... 57
October 7, 2003
Figure 26. Temporary Sector Unprotect Timing Diagram .............. 51
Figure 27. Sector/Sector Block Protect and
Unprotect Timing Diagram ............................................................. 52
Alternate CE#f Controlled Erase and Program Operations .... 53
Figure 28. Flash Alternate CE#f Controlled Write (Erase/Program)
Operation Timings.......................................................................... 54
Read Cycle ............................................................................. 55
Figure 29. Psuedo SRAM Read Cycle........................................... 55
Figure 30. Page Read Timing ........................................................ 56
Write Cycle ............................................................................. 57
Am50DL128BH
3
A D V A N C E
I N F O R M A T I O N
Figure 32. Pseudo SRAM Write Cycle—CE#1ps Control ............... 58
Figure 33. Pseudo SRAM Write Cycle—
UB#s and LB#s Control................................................................... 59
Flash Erase And Programming Performance . .
Latchup Characteristics . . . . . . . . . . . . . . . . . . .
Package Pin Capacitance . . . . . . . . . . . . . . . . . .
Flash Data Retention . . . . . . . . . . . . . . . . . . . . . .
pSRAM Data Retention . . . . . . . . . . . . . . . . . . . .
pSRAM Power on and Deep Power Down . . . . .
4
60
60
60
61
62
62
Figure 34. Deep Power-down Timing............................................. 62
Figure 35. Power-on Timing........................................................... 62
pSRAM Address Skew . . . . . . . . . . . . . . . . . . . . . 63
Figure 36. Read Address Skew ..................................................... 63
Figure 37. Write Address Skew...................................................... 63
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 64
FTA073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm ............. 64
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 65
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
PRODUCT SELECTOR GUIDE
Part Number
Speed
Options
Am50DL128BH
Standard Voltage
Range: VCC =
2.7–3.3 V
Flash Memory
Pseudo SRAM
56
70
85
56, 70
85
Max Access Time, ns
55
70
85
70
85
Page Access Time (pSRAM), ns
N/A
N/A
N/A
30
35
CE#f Access, ns
55
70
85
70
85
OE# Access, ns
25
30
40
25
30
MCP BLOCK DIAGRAM
VSS
VCCf
A21 to A0
RY/BY
64 MBit
Flash Memory
#1
CE#f1
VCCf
VSS
A21 to A0
A21 to A0
A-1
WP#/ACC
RESET#
CIOf
CE#f2
DQ15/A-1 to DQ0
RY/BY#
64 MBit
Flash Memory
#2
DQ15/A-1 to DQ0
DQ15/A-1 to D
VCCs/VSSQ
VSS/VSSQ
A20 to A0
LB#s
UB#s
WE#
OE#
CE1#s
CE2s
October 7, 2003
32 MBit
Pseudo
SRAM
Am50DL128BH
DQ15/A-1 to DQ0
5
A D V A N C E
I N F O R M A T I O N
FLASH MEMORY BLOCK DIAGRAM
VCC
VSS
OE# BYTE#
Mux
Bank 1
Bank 2
X-Decoder
A21–A0
RESET#
WE#
CE#
BYTE#
WP#/ACC
STATE
CONTROL
&
COMMAND
REGISTER
Status
DQ15–DQ0
Control
Mux
DQ15–DQ0
DQ15–DQ0
Bank 3 Address
Bank 3
X-Decoder
Bank 4 Address
Y-gate
A0–A21
X-Decoder
A21–A0
DQ15–DQ0
Bank 2 Address
DQ15–DQ0
RY/BY#
DQ15–DQ0
A21–A0
X-Decoder
Y-gate
Bank 1 Address
A21–A0
Bank 4
Mux
6
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
CONNECTION DIAGRAM
73-Ball FBGA
Top View
Flash 1 only
A1
A10
NC
NC
B1
B5
B6
B10
NC
NC
NC
NC
C5
C3
C4
C6
C7
C8
NC
A7
LB# WP#/ACC WE#
A8
A11
D2
D3
D4
D7
D8
D9
A3
A6
UB# RESET# CE2s
A19
A12
A15
E2
E3
E4
E5
E6
E7
E8
E9
A2
A5
A18
RY/BY#
A20
A9
A13
A21
F1
F2
F3
F4
F7
F8
F9
F10
NC
A1
A4
A17
A10
A14
CE2#f
NC
G1
G2
G3
G4
G7
G8
G9
G10
NC
A0
VSS
DQ1
DQ6
NC
A16
NC
H2
H3
H4
H5
H6
H7
H8
H9
CE#f1
OE#
DQ9
DQ3
DQ4
J2
J3
J4
J5
J6
J7
J8
J9
CE1#s
DQ0
DQ10
VCCf
VCCs
DQ12
DQ7
VSS
K3
K4
K5
K6
K7
K8
DQ8
DQ2
DQ11
NC
DQ5
DQ14
L1
L5
L6
L10
NC
NC
NC
NC
D6
Flash 1, 2 and
Pseudo SRAM
shared
DQ13 DQ15/A-1 CIOf
M1
M10
NC
NC
Special Package Handling Instructions
Special handling is required for Flash Memory products
in molded packages (BGA). The package and/or data
October 7, 2003
Pseudo
SRAM only
Flash 1 and 2
shared
C1
D5
Flash 2 only
integrity may be compromised if the package body is
exposed to temperatures above 150°C for prolonged
periods of time.
Am50DL128BH
7
A D V A N C E
I N F O R M A T I O N
PIN DESCRIPTION
LOGIC SYMBOL
A20–A0
= 21 Address Inputs (Common)
A21, A-1
= 2 Address Inputs (Flash)
DQ15–DQ0
= 16 Data Inputs/Outputs (Common)
CE#f1
= Chip Enable 1 (Flash 1)
A21, A-1
CE#f2
= Chip Enable 2 (Flash 2)
SA
CE#1s
= Chip Enable 1 (pSRAM)
CE#f1
CE2s
= Chip Enable 2 (pSRAM)
CE#f2
OE#
= Output Enable (Common)
CE#1s
WE#
= Write Enable (Common)
CE2s
RY/BY#
= Ready/Busy Output
OE#
UB#s
= Upper Byte Control (pSRAM)
WE#
LB#s
= Lower Byte Control (pSRAM)
WP#/ACC
CIOf
= I/O Configuration (Flash)
CIOf = VIH = Word mode (x16),
CIOf = VIL = Byte mode (x8)
RESET#
21
A20–A0
RESET#
= Hardware Reset Pin, Active Low
WP#/ACC
= Hardware Write Protect/
Acceleration Pin (Flash)
VCCf
= Flash 3.0 volt-only single power supply (see Product Selector Guide for
speed options and voltage supply
tolerances)
VCCs
= pSRAM Power Supply
VSS
= Device Ground (Common)
NC
= Pin Not Connected Internally
16 or 8
DQ15–DQ0
RY/BY#
UB#s
LB#s
CIOf
8
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
ORDERING INFORMATION
The order number (Valid Combination) is formed by the following:
Am50DL128
B
H
70
I
T
TAPE AND REEL
T
= 7 inches
S
= 13 inches
TEMPERATURE RANGE
I
= Industrial (–40°C to +85°C)
SPEED OPTION
See “Product Selector Guide” on page 5.
PROCESS TECHNOLOGY
H
= 0.13 µm
PSEUDO SRAM DEVICE DENSITY
B
=
32 Mbits
AMD DEVICE NUMBER/DESCRIPTION
Am50DL128BH
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Two Am29DL640H 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous
Operation Flash Memory and 32 Mbit (2 M x 16-Bit) Pseudo Static RAM with Page Mode
Valid Combinations
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD or Fujitsu sales office to
confirm availability of specific valid combinations and to check on
newly released combinations.
October 7, 2003
Order Number
Package Marking
Am50DL128BH56I
T,S
M50000004J
Am50DL128BH70I
T, S
M50000004K
Am50DL128BH85I
T, S
M50000004L
Am50DL128BH
9
A D V A N C E
I N F O R M A T I O N
MCP DEVICE BUS OPERATIONS
This section describes the requirements and use of
the device bus operations, which are initiated through
the internal command register. The command register
itself does not occupy any addressable memory location. The register is a latch used to store the commands, along with the address and data information
10
needed to execute the command. The contents of the
register serve as inputs to the internal state machine.
The state machine outputs dictate the function of the
device. Tables 1-2 lists the device bus operations, the
inputs and control levels they require, and the resulting output. The following subsections describe each of
these operations in further detail.
Am50DL128BH
October 7, 2003
A D V A N C E
Table 1.
Device Bus Operations—Flash Word Mode, CIOf = VIH
CE#f
CE#f
Active Inactive CE1#s
Operation
(Notes 1, 2)
I N F O R M A T I O N
CE2s
OE# WE#
Addr.
(Note 3)
Read from
Active Flash
(Note 8)
Write to Active
Flash
(Note 8)
(Note 9)
(Note 9)
L
H
L
H
H
H
H
L
H
H
H
L
LB#s UB#s
WP#/
(Note (Note RESET#
ACC
4)
4)
(Note 5)
DQ7–
DQ0
DQ15–
DQ8
L
H
AIN
X
X
H
L/H
DOUT
DOUT
H
L
AIN
X
X
H
(Note 5)
DIN
DIN
Standby
VCC ± 0.3 V
H
H
X
X
X
X
X
VCC ±
0.3 V
H
High-Z
High-Z
Deep Power-down
Standby
VCC ± 0.3 V
H
L
X
X
X
X
X
VCC ±
0.3 V
H
High-Z
High-Z
Output Disable (Note 10)
L
L
H
H
H
X
X
X
H
H
X
X
X
H
L/H
High-Z
High-Z
H
H
H
L
X
X
X
X
X
L
L/H
High-Z
High-Z
H
H
H
L
SADD,
A6 = L,
A1 = H,
A0 = L
X
X
VID
L/H
DIN
X
H
L
SADD,
A6 = H,
A1 = H,
A0 = L
X
X
VID
(Note 7)
DIN
X
X
X
X
X
X
VID
(Note 7)
DIN
High-Z
L
L
DOUT
DOUT
L
H
AIN
H
L
H
X
High-Z
DOUT
L
H
DOUT
High-Z
Flash Hardware (Note 8)
Reset
(Note 9)
H
X
(Note 8)
Sector Protect
(Notes 6, 10)
Sector
Unprotect
(Notes 6, 10)
Temporary
Sector
Unprotect
(Note 9)
L
H
(Note 8)
(Note 9)
L
H
(Note 8)
X
(Note 9)
Read from pSRAM
Write to pSRAM
H
H
H
H
H
L
H
H
H
L
H
H
H
L
L
H
L
H
X
AIN
L
L
L
H
L
L
H
H
X
DIN
DIN
High-Z
DIN
DIN
High-Z
Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 11.5–12.5 V, VHH = 9.0 ± 0.5 V, X = Don’t Care, SADD = Flash Sector Address, AIN =
Address In, DIN = Data In, DOUT = Data Out
Notes:
1. Other operations except for those indicated in this column are
inhibited.
2. Do not apply CE#f1 or 2 = VIL, CE1#s = VIL and CE2s = VIH at the
same time.
3.
Active flash is device being addressed.
4.
Don’t care or open LB#s or UB#s.
5.
If WP#/ACC = VIL , the boot sectors will be protected. If WP#/ACC
= VIH the boot sectors protection will be removed.
If WP#/ACC = VACC (9V), the program time will be reduced by
40%.
6.
The sector protect and sector unprotect functions may also be
implemented via programming equipment. See the “Sector/Sector
Block Protection and Unprotection” section.
7.
If WP#/ACC = VIL, the two outermost boot sectors remain
protected. If WP#/ACC = VIH, the two outermost boot sector
protection depends on whether they were last protected or
unprotected using the method described in “Sector/Sector Block
Protection and Unprotection”. If WP#/ACC = VHH, all sectors will
be unprotected.
8.
Data will be retained in pSRAM.
9.
Data will be lost in pSRAM.
10. CE# inputs on both flash devices may be held low for this operation.
October 7, 2003
Am50DL128BH
11
A D V A N C E
Table 2.
Device Bus Operations—Flash Byte Mode, CIOf = VIL
CE#f
CE#f
Active Inactive CE2s
Operation
(Notes 1, 2)
I N F O R M A T I O N
OE# WE#
Address
LB#s
(4)
UB#s
WP#/ACC
RESET#
(4)
(Note 5)
DQ7–
DQ0
DQ15–
DQ8
(Note 3)
Read from
Flash
(Note 8)
H
H
H
L
H
H
H
L
L
(Note 9)
(Note 8)
Write to Flash
L
(Note 9)
L
H
AIN
X
X
H
L/H
DOUT
High-Z
H
L
AIN
X
X
H
(Note 5)
DIN
High-Z
Standby
VCC ±
0.3 V
H
H
X
X
X
X
X
VCC ±
0.3 V
H
High-Z
High-Z
Deep Power-down
Standby
VCC ±
0.3 V
H
L
X
X
X
X
X
VCC ±
0.3 V
H
High-Z
High-Z
H
H
X
X
X
L
L
H
H
L/H
High-Z
High-Z
H
H
X
X
X
X
X
X
X
X
L
L/H
High-Z
High-Z
H
L
SADD, A6 = L,
A1 = H, A0 = L
X
X
VID
L/H
DIN
X
H
L
SADD, A6 = H,
A1 = H, A0 = L
X
X
VID
(Note 7)
DIN
X
X
X
X
X
X
VID
(Note 7)
DIN
High-Z
L
L
DOUT
DOUT
H
L
High-Z
DOUT
L
H
DOUT
High-Z
L
L
DIN
DIN
H
L
High-Z
DIN
L
H
DIN
High-Z
Output Disable
Flash Hardware (Note 8)
Reset
(Note 9)
Sector Protect
(Note 5)
(Note 8)
Sector
Unprotect
(Note 5)
(Note 8)
Temporary
Sector
Unprotect
(Note 8)
H
H
L
H
H
H
L
H
H
H
L
H
H
H
L
L
(Note 9)
L
(Note 9)
X
(Note 9)
Read from pSRAM
Write to pSRAM
H
X
H
H
L
L
H
H
L
H
X
L
AIN
AIN
H
H
X
X
Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 11.5–12.5 V, VHH = 9.0 ± 0.5 V, X = Don’t Care, SA = pSRAM Address Input, Byte Mode,
SADD = Flash Sector Address, AIN = Address In, DIN = Data In, DOUT = Data Out
Notes:
1. Other operations except for those indicated in this column are
inhibited.
2.
Do not apply CE#f = VIL, CE1#s = VIL and CE2s = VIH at the same
time.
3.
Active flash is device being addressed.
4.
Don’t care or open LB#s or UB#s.
5.
If WP#/ACC = VIL , the boot sectors will be protected. If WP#/ACC
= VIH the boot sectors protection will be removed.
If WP#/ACC = VACC (9V), the program time will be reduced by
40%.
6.
12
7.
If WP#/ACC = VIL, the two outermost boot sectors remain
protected. If WP#/ACC = VIH, the two outermost boot sector
protection depends on whether they were last protected or
unprotected using the method described in “Sector/Sector Block
Protection and Unprotection”. If WP#/ACC = VHH, all sectors will
be unprotected.
8.
Data will be retained in pSRAM.
9.
Data will be lost in pSRAM.
10. CE# inputs on both flash devices may be held low for this
operation.
The sector protect and sector unprotect functions may also be
implemented via programming equipment. See the “Sector/Sector
Block Protection and Unprotection” section.
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
FLASH DEVICE BUS OPERATIONS
Word/Byte Configuration
The CIOf pin controls whether the device data I/O pins
operate in the byte or word configuration. If the CIOf
pin is set at logic ‘1’, the device is in word configuration, DQ15–DQ0 are active and controlled by CE#f
and OE#.
If the CIOf pin is set at logic ‘0’, the device is in byte
configuration, and only data I/O pins DQ7–DQ0 are
active and controlled by CE#f and OE#. The data I/O
pins DQ14–DQ8 are tri-stated, and the DQ15 pin is
used as an input for the LSB (A-1) address function.
An erase operation can erase one sector, multiple sectors, or the entire device. Table 3 indicates the address
space that each sector occupies. Similarly, a “sector
address” is the address bits required to uniquely select
a sector. The “Flash Command Definitions” section
has details on erasing a sector or the entire chip, or
suspending/resuming the erase operation.
The device address space is divided into four banks. A
“bank address” is the address bits required to uniquely
select a bank.
ICC2 in the DC Characteristics table represents the active current specification for the write mode. The Flash
AC Characteristics section contains timing specification tables and timing diagrams for write operations.
Requirements for Reading Array Data
To read array data from the outputs, the system must
drive the CE#f and OE# pins to VIL. CE#f is the power
control and selects the device. OE# is the output control and gates array data to the output pins. WE#
should remain at V I H . The CIOf pin determines
whether the device outputs array data in words or
bytes.
The internal state machine is set for reading array data
upon device power-up, or after a hardware reset. This
ensures that no spurious alteration of the memory
content occurs during the power transition. No command is necessary in this mode to obtain array data.
Standard microprocessor read cycles that assert valid
addresses on the device address inputs produce valid
data on the device data outputs. Each bank remains
enabled for read access until the command register
contents are altered.
Refer to the Flash Read-Only Operations table for timing specifications and to Figure 15 for the timing diagram. ICC1 in the DC Characteristics table represents
the active current specification for reading array data.
Writing Commands/Command Sequences
To write a command or command sequence (which includes programming data to the device and erasing
sectors of memory), the system must drive WE# and
CE#f to VIL, and OE# to VIH.
For program operations, the CIOf pin determines
whether the device accepts program data in bytes or
words. Refer to “Flash Device Bus Operations” for
more information.
The device features an Unlock Bypass mode to facilitate faster programming. Once a bank enters the Unlock Bypass mode, only two write cycles are required
to program a word or byte, instead of four. The
“Byte/Word Program Command Sequence” section
has details on programming data to the device using
both standard and Unlock Bypass command sequences.
October 7, 2003
Accelerated Program Operation
The device offers accelerated program operations
through the ACC function. This is one of two functions
provided by the WP#/ACC pin. This function is primarily intended to allow faster manufacturing throughput
at the factory.
If the system asserts VHH on this pin, the device automatically enters the aforementioned Unlock Bypass
mode, temporarily unprotects any protected sectors,
and uses the higher voltage on the pin to reduce the
time required for program operations. The system
would use a two-cycle program command sequence
as required by the Unlock Bypass mode. Removing
VHH from the WP#/ACC pin returns the device to normal operation. Note that VHH must not be asserted on
WP#/ACC for operations other than accelerated programming, or device damage may result. In addition,
the WP#/ACC pin must not be left floating or unconnected; inconsistent behavior of the device may result.
See “Write Protect (WP#)” on page 19 for related information.
Autoselect Functions
If the system writes the autoselect command sequence, the device enters the autoselect mode. The
system can then read autoselect codes from the internal register (which is separate from the memory array)
on DQ15–DQ0. Standard read cycle timings apply in
this mode. Refer to the Sector/Sector Block Protection
and Unprotection and Autoselect Command Sequence sections for more information.
Simultaneous Read/Write Operations with
Zero Latency
This device is capable of reading data from one bank
of memory while programming or erasing in the other
bank of memory. An erase operation may also be suspended to read from or program to another location
within the same bank (except the sector being
erased). Figure 22 shows how read and write cycles
Am50DL128BH
13
A D V A N C E
I N F O R M A T I O N
may be initiated for simultaneous operation with zero
latency. ICC6f and ICC7f in the table represent the current specifications for read-while-program and
read-while-erase, respectively.
Standby Mode
When the system is not reading or writing to the device, it can place the device in the standby mode. In
this mode, current consumption is greatly reduced,
and the outputs are placed in the high impedance
state, independent of the OE# input.
The device enters the CMOS standby mode when the
CE#f and RESET# pins are both held at VCC ± 0.3 V.
(Note that this is a more restricted voltage range than
V IH .) If CE#f and RESET# are held at V IH , but not
within VCC ± 0.3 V, the device will be in the standby
mode, but the standby current will be greater. The device requires standard access time (tCE) for read access when the device is in either of these standby
modes, before it is ready to read data.
If the device is deselected during erasure or programming, the device draws active current until the
operation is completed.
ICC3f in the table represents the standby current specification.
Automatic Sleep Mode
The automatic sleep mode minimizes Flash device energy consumption. The device automatically enables
this mode when addresses remain stable for tACC +
30 ns. The automatic sleep mode is independent of
the CE#f, WE#, and OE# control signals. Standard address access timings provide new data when addresses are changed. While in sleep mode, output
data is latched and always available to the system.
ICC5f in the table represents the automatic sleep mode
current specification.
RESET#: Hardware Reset Pin
The RESET# pin provides a hardware method of resetting the device to reading array data. When the RESET# pin is driven low for at least a period of tRP, the
device immediately terminates any operation in
progress, tristates all output pins, and ignores all
read/write commands for the duration of the RESET#
pulse. The device also resets the internal state machine to reading array data. The operation that was interrupted should be reinitiated once the device is
ready to accept another command sequence, to ensure data integrity.
Current is reduced for the duration of the RESET#
pulse. When RESET# is held at VSS±0.3 V, the device
draws CMOS standby current (ICC4 f). If RESET# is
held at VIL but not within VSS±0.3 V, the standby current will be greater.
The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the Flash
memory, enabling the system to read the boot-up firmware from the Flash memory.
If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a “0” (busy) until the
internal reset operation is complete, which requires a
time of t READY (during Embedded Algorithms). The
system can thus monitor RY/BY# to determine
whether the reset operation is complete. If RESET# is
asserted when a program or erase operation is not executing (RY/BY# pin is “1”), the reset operation is completed within a time of tREADY (not during Embedded
Algorithms). The system can read data tRH after the
RESET# pin returns to VIH.
Refer to the pSRAM AC Characteristics tables for RESET# parameters and to Figure 16 for the timing diagram.
Output Disable Mode
When the OE# input is at VIH, output from the device is
disabled. The output pins are placed in the high
impedance state.
14
Am50DL128BH
October 7, 2003
A D V A N C E
Table 3.
Bank
Bank 1
I N F O R M A T I O N
Am29DL640H Sector Architecture
Sector
Sector Address
A21–A12
Sector Size
(Kbytes/Kwords)
(x8)
Address Range
(x16)
Address Range
SA0
0000000000
8/4
000000h–001FFFh
00000h–00FFFh
SA1
0000000001
8/4
002000h–003FFFh
01000h–01FFFh
SA2
0000000010
8/4
004000h–005FFFh
02000h–02FFFh
SA3
0000000011
8/4
006000h–007FFFh
03000h–03FFFh
SA4
0000000100
8/4
008000h–009FFFh
04000h–04FFFh
SA5
0000000101
8/4
00A000h–00BFFFh
05000h–05FFFh
SA6
0000000110
8/4
00C000h–00DFFFh
06000h–06FFFh
SA7
0000000111
8/4
00E000h–00FFFFh
07000h–07FFFh
SA8
0000001xxx
64/32
010000h–01FFFFh
08000h–0FFFFh
SA9
0000010xxx
64/32
020000h–02FFFFh
10000h–17FFFh
SA10
0000011xxx
64/32
030000h–03FFFFh
18000h–1FFFFh
SA11
0000100xxx
64/32
040000h–04FFFFh
20000h–27FFFh
SA12
0000101xxx
64/32
050000h–05FFFFh
28000h–2FFFFh
SA13
0000110xxx
64/32
060000h–06FFFFh
30000h–37FFFh
SA14
0000111xxx
64/32
070000h–07FFFFh
38000h–3FFFFh
SA15
0001000xxx
64/32
080000h–08FFFFh
40000h–47FFFh
SA16
0001001xxx
64/32
090000h–09FFFFh
48000h–4FFFFh
SA17
0001010xxx
64/32
0A0000h–0AFFFFh
50000h–57FFFh
SA18
0001011xxx
64/32
0B0000h–0BFFFFh
58000h–5FFFFh
SA19
0001100xxx
64/32
0C0000h–0CFFFFh
60000h–67FFFh
SA20
0001101xxx
64/32
0D0000h–0DFFFFh
68000h–6FFFFh
SA21
0001101xxx
64/32
0E0000h–0EFFFFh
70000h–77FFFh
SA22
0001111xxx
64/32
0F0000h–0FFFFFh
78000h–7FFFFh
October 7, 2003
Am50DL128BH
15
A D V A N C E
Table 3.
Bank
Bank 2
16
I N F O R M A T I O N
Am29DL640H Sector Architecture (Continued)
Sector
Sector Address
A21–A12
Sector Size
(Kbytes/Kwords)
(x8)
Address Range
SA23
0010000xxx
64/32
100000h–00FFFFh
80000h–87FFFh
SA24
0010001xxx
64/32
110000h–11FFFFh
88000h–8FFFFh
SA25
0010010xxx
64/32
120000h–12FFFFh
90000h–97FFFh
SA26
0010011xxx
64/32
130000h–13FFFFh
98000h–9FFFFh
SA27
0010100xxx
64/32
140000h–14FFFFh
A0000h–A7FFFh
SA28
0010101xxx
64/32
150000h–15FFFFh
A8000h–AFFFFh
SA29
0010110xxx
64/32
160000h–16FFFFh
B0000h–B7FFFh
SA30
0010111xxx
64/32
170000h–17FFFFh
B8000h–BFFFFh
SA31
0011000xxx
64/32
180000h–18FFFFh
C0000h–C7FFFh
SA32
0011001xxx
64/32
190000h–19FFFFh
C8000h–CFFFFh
SA33
0011010xxx
64/32
1A0000h–1AFFFFh
D0000h–D7FFFh
SA34
0011011xxx
64/32
1B0000h–1BFFFFh
D8000h–DFFFFh
SA35
0011000xxx
64/32
1C0000h–1CFFFFh
E0000h–E7FFFh
SA36
0011101xxx
64/32
1D0000h–1DFFFFh
E8000h–EFFFFh
SA37
0011110xxx
64/32
1E0000h–1EFFFFh
F0000h–F7FFFh
SA38
0011111xxx
64/32
1F0000h–1FFFFFh
F8000h–FFFFFh
SA39
0100000xxx
64/32
200000h–20FFFFh
F9000h–107FFFh
SA40
0100001xxx
64/32
210000h–21FFFFh
108000h–10FFFFh
SA41
0100010xxx
64/32
220000h–22FFFFh
110000h–117FFFh
SA42
0101011xxx
64/32
230000h–23FFFFh
118000h–11FFFFh
SA43
0100100xxx
64/32
240000h–24FFFFh
120000h–127FFFh
SA44
0100101xxx
64/32
250000h–25FFFFh
128000h–12FFFFh
SA45
0100110xxx
64/32
260000h–26FFFFh
130000h–137FFFh
SA46
0100111xxx
64/32
270000h–27FFFFh
138000h–13FFFFh
SA47
0101000xxx
64/32
280000h–28FFFFh
140000h–147FFFh
SA48
0101001xxx
64/32
290000h–29FFFFh
148000h–14FFFFh
SA49
0101010xxx
64/32
2A0000h–2AFFFFh
150000h–157FFFh
SA50
0101011xxx
64/32
2B0000h–2BFFFFh
158000h–15FFFFh
SA51
0101100xxx
64/32
2C0000h–2CFFFFh
160000h–167FFFh
SA52
0101101xxx
64/32
2D0000h–2DFFFFh
168000h–16FFFFh
SA53
0101110xxx
64/32
2E0000h–2EFFFFh
170000h–177FFFh
SA54
0101111xxx
64/32
2F0000h–2FFFFFh
178000h–17FFFFh
SA55
0110000xxx
64/32
300000h–30FFFFh
180000h–187FFFh
SA56
0110001xxx
64/32
310000h–31FFFFh
188000h–18FFFFh
SA57
0110010xxx
64/32
320000h–32FFFFh
190000h–197FFFh
SA58
0110011xxx
64/32
330000h–33FFFFh
198000h–19FFFFh
SA59
0100100xxx
64/32
340000h–34FFFFh
1A0000h–1A7FFFh
SA60
0110101xxx
64/32
350000h–35FFFFh
1A8000h–1AFFFFh
SA61
0110110xxx
64/32
360000h–36FFFFh
1B0000h–1B7FFFh
SA62
0110111xxx
64/32
370000h–37FFFFh
1B8000h–1BFFFFh
SA63
0111000xxx
64/32
380000h–38FFFFh
1C0000h–1C7FFFh
SA64
0111001xxx
64/32
390000h–39FFFFh
1C8000h–1CFFFFh
SA65
0111010xxx
64/32
3A0000h–3AFFFFh
1D0000h–1D7FFFh
SA66
0111011xxx
64/32
3B0000h–3BFFFFh
1D8000h–1DFFFFh
SA67
0111100xxx
64/32
3C0000h–3CFFFFh
1E0000h–1E7FFFh
SA68
0111101xxx
64/32
3D0000h–3DFFFFh
1E8000h–1EFFFFh
SA69
0111110xxx
64/32
3E0000h–3EFFFFh
1F0000h–1F7FFFh
SA70
0111111xxx
64/32
3F0000h–3FFFFFh
1F8000h–1FFFFFh
Am50DL128BH
(x16)
Address Range
October 7, 2003
A D V A N C E
Table 3.
Bank
Bank 3
I N F O R M A T I O N
Am29DL640H Sector Architecture (Continued)
Sector
Sector Address
A21–A12
Sector Size
(Kbytes/Kwords)
(x8)
Address Range
(x16)
Address Range
SA71
1000000xxx
64/32
400000h–40FFFFh
200000h–207FFFh
SA72
1000001xxx
64/32
410000h–41FFFFh
208000h–20FFFFh
SA73
1000010xxx
64/32
420000h–42FFFFh
210000h–217FFFh
SA74
1000011xxx
64/32
430000h–43FFFFh
218000h–21FFFFh
SA75
1000100xxx
64/32
440000h–44FFFFh
220000h–227FFFh
SA76
1000101xxx
64/32
450000h–45FFFFh
228000h–22FFFFh
SA77
1000110xxx
64/32
460000h–46FFFFh
230000h–237FFFh
SA78
1000111xxx
64/32
470000h–47FFFFh
238000h–23FFFFh
SA79
1001000xxx
64/32
480000h–48FFFFh
240000h–247FFFh
SA80
1001001xxx
64/32
490000h–49FFFFh
248000h–24FFFFh
SA81
1001010xxx
64/32
4A0000h–4AFFFFh
250000h–257FFFh
SA82
1001011xxx
64/32
4B0000h–4BFFFFh
258000h–25FFFFh
SA83
1001100xxx
64/32
4C0000h–4CFFFFh
260000h–267FFFh
SA84
1001101xxx
64/32
4D0000h–4DFFFFh
268000h–26FFFFh
SA85
1001110xxx
64/32
4E0000h–4EFFFFh
270000h–277FFFh
SA86
1001111xxx
64/32
4F0000h–4FFFFFh
278000h–27FFFFh
SA87
1010000xxx
64/32
500000h–50FFFFh
280000h–28FFFFh
SA88
1010001xxx
64/32
510000h–51FFFFh
288000h–28FFFFh
SA89
1010010xxx
64/32
520000h–52FFFFh
290000h–297FFFh
SA90
1010011xxx
64/32
530000h–53FFFFh
298000h–29FFFFh
SA91
1010100xxx
64/32
540000h–54FFFFh
2A0000h–2A7FFFh
SA92
1010101xxx
64/32
550000h–55FFFFh
2A8000h–2AFFFFh
SA93
1010110xxx
64/32
560000h–56FFFFh
2B0000h–2B7FFFh
SA94
1010111xxx
64/32
570000h–57FFFFh
2B8000h–2BFFFFh
SA95
1011000xxx
64/32
580000h–58FFFFh
2C0000h–2C7FFFh
SA96
1011001xxx
64/32
590000h–59FFFFh
2C8000h–2CFFFFh
SA97
1011010xxx
64/32
5A0000h–5AFFFFh
2D0000h–2D7FFFh
SA98
1011011xxx
64/32
5B0000h–5BFFFFh
2D8000h–2DFFFFh
SA99
1011100xxx
64/32
5C0000h–5CFFFFh
2E0000h–2E7FFFh
SA100
1011101xxx
64/32
5D0000h–5DFFFFh
2E8000h–2EFFFFh
SA101
1011110xxx
64/32
5E0000h–5EFFFFh
2F0000h–2FFFFFh
SA102
1011111xxx
64/32
5F0000h–5FFFFFh
2F8000h–2FFFFFh
SA103
1100000xxx
64/32
600000h–60FFFFh
300000h–307FFFh
SA104
1100001xxx
64/32
610000h–61FFFFh
308000h–30FFFFh
SA105
1100010xxx
64/32
620000h–62FFFFh
310000h–317FFFh
SA106
1100011xxx
64/32
630000h–63FFFFh
318000h–31FFFFh
SA107
1100100xxx
64/32
640000h–64FFFFh
320000h–327FFFh
SA108
1100101xxx
64/32
650000h–65FFFFh
328000h–32FFFFh
SA109
1100110xxx
64/32
660000h–66FFFFh
330000h–337FFFh
SA110
1100111xxx
64/32
670000h–67FFFFh
338000h–33FFFFh
SA111
1101000xxx
64/32
680000h–68FFFFh
340000h–347FFFh
SA112
1101001xxx
64/32
690000h–69FFFFh
348000h–34FFFFh
SA113
1101010xxx
64/32
6A0000h–6AFFFFh
350000h–357FFFh
SA114
1101011xxx
64/32
6B0000h–6BFFFFh
358000h–35FFFFh
SA115
1101100xxx
64/32
6C0000h–6CFFFFh
360000h–367FFFh
SA116
1101101xxx
64/32
6D0000h–6DFFFFh
368000h–36FFFFh
SA117
1101110xxx
64/32
6E0000h–6EFFFFh
370000h–377FFFh
SA118
1101111xxx
64/32
6F0000h–6FFFFFh
378000h–37FFFFh
October 7, 2003
Am50DL128BH
17
A D V A N C E
Table 3.
Bank
Bank 4
Sector
I N F O R M A T I O N
Am29DL640H Sector Architecture (Continued)
Sector Address
A21–A12
Sector Size
(Kbytes/Kwords)
(x8)
Address Range
(x16)
Address Range
SA119
1110000xxx
64/32
700000h–70FFFFh
380000h–387FFFh
SA120
1110001xxx
64/32
710000h–71FFFFh
388000h–38FFFFh
SA121
1110010xxx
64/32
720000h–72FFFFh
390000h–397FFFh
SA122
1110011xxx
64/32
730000h–73FFFFh
398000h–39FFFFh
SA123
1110100xxx
64/32
740000h–74FFFFh
3A0000h–3A7FFFh
SA124
1110101xxx
64/32
750000h–75FFFFh
3A8000h–3AFFFFh
SA125
1110110xxx
64/32
760000h–76FFFFh
3B0000h–3B7FFFh
SA126
1110111xxx
64/32
770000h–77FFFFh
3B8000h–3BFFFFh
SA127
1111000xxx
64/32
780000h–78FFFFh
3C0000h–3C7FFFh
SA128
1111001xxx
64/32
790000h–79FFFFh
3C8000h–3CFFFFh
SA129
1111010xxx
64/32
7A0000h–7AFFFFh
3D0000h–3D7FFFh
SA130
1111011xxx
64/32
7B0000h–7BFFFFh
3D8000h–3DFFFFh
SA131
1111100xxx
64/32
7C0000h–7CFFFFh
3E0000h–3E7FFFh
SA132
1111101xxx
64/32
7D0000h–7DFFFFh
3E8000h–3EFFFFh
SA133
1111110xxx
64/32
7E0000h–7EFFFFh
3F0000h–3F7FFFh
SA134
1111111000
8/4
7F0000h–7F1FFFh
3F8000h–3F8FFFh
SA135
1111111001
8/4
7F2000h–7F3FFFh
3F9000h–3F9FFFh
SA136
1111111010
8/4
7F4000h–7F5FFFh
3FA000h–3FAFFFh
SA137
1111111011
8/4
7F6000h–7F7FFFh
3FB000h–3FBFFFh
SA138
1111111100
8/4
7F8000h–7F9FFFh
3FC000h–3FCFFFh
SA139
1111111101
8/4
7FA000h–7FBFFFh
3FD000h–3FDFFFh
SA140
1111111110
8/4
7FC000h–7FDFFFh
3FE000h–3FEFFFh
SA141
1111111111
8/4
7FE000h–7FFFFFh
3FF000h–3FFFFFh
Note: The address range is A21:A-1 in byte mode (CIOf=VIL) or A21:A0 in word mode (CIOf=VIH).
Table 4.
Bank Address
Bank
1
2
3
4
A21–A19
000
001, 010, 011
100, 101, 110
111
Table 5.
18
SecSi™ Sector Addresses
Device
Sector Size
(x8)
Address Range
(x16)
Address Range
Am29DL640H
256 bytes
000000h–0000FFh
00000h–0007Fh
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
Sector/Sector Block Protection and
Unprotection
Sector
A21–A12
Sector/
Sector Block Size
(Note: For the following discussion, the term “sector”
applies to both sectors and sector blocks. A sector
block consists of two or more adjacent sectors that are
protected or unprotected at the same time (see Table
6).
SA103–SA106
11000XXXXX
256 (4x64) Kbytes
SA107–SA110
11001XXXXX
256 (4x64) Kbytes
SA111–SA114
11010XXXXX
256 (4x64) Kbytes
SA115–SA118
11011XXXXX
256 (4x64) Kbytes
SA119–SA122
11100XXXXX
256 (4x64) Kbytes
The hardware sector protection feature disables both
program and erase operations in any sector. The hardware sector unprotection feature re-enables both program and erase operations in previously protected
sectors. Sector protection/unprotection can be implemented via two methods.
SA123–SA126
11101XXXXX
256 (4x64) Kbytes
SA127–SA130
11110XXXXX
256 (4x64) Kbytes
SA131–SA133
1111100XXX,
1111101XXX,
1111110XXX
192 (3x64) Kbytes
SA134
1111111000
8 Kbytes
Table 6. Am29DL640H Boot Sector/Sector Block
Addresses for Protection/Unprotection
SA135
1111111001
8 Kbytes
SA136
1111111010
8 Kbytes
SA137
1111111011
8 Kbytes
8 Kbytes
Sector
A21–A12
Sector/
Sector Block Size
SA138
1111111100
SA0
0000000000
8 Kbytes
SA139
1111111101
8 Kbytes
SA1
0000000001
8 Kbytes
SA140
1111111110
8 Kbytes
SA2
0000000010
8 Kbytes
SA141
1111111111
8 Kbytes
SA3
0000000011
8 Kbytes
SA4
0000000100
8 Kbytes
SA5
0000000101
8 Kbytes
SA6
0000000110
8 Kbytes
SA7
0000000111
8 Kbytes
SA8–SA10
0000001XXX,
0000010XXX,
0000011XXX,
192 (3x64) Kbytes
SA11–SA14
00001XXXXX
256 (4x64) Kbytes
SA15–SA18
00010XXXXX
256 (4x64) Kbytes
SA19–SA22
00011XXXXX
256 (4x64) Kbytes
SA23–SA26
00100XXXXX
256 (4x64) Kbytes
SA27-SA30
00101XXXXX
256 (4x64) Kbytes
SA31-SA34
00110XXXXX
256 (4x64) Kbytes
SA35-SA38
00111XXXXX
256 (4x64) Kbytes
SA39-SA42
01000XXXXX
256 (4x64) Kbytes
SA43-SA46
01001XXXXX
256 (4x64) Kbytes
SA47-SA50
01010XXXXX
256 (4x64) Kbytes
SA51-SA54
01011XXXXX
256 (4x64) Kbytes
SA55–SA58
01100XXXXX
256 (4x64) Kbytes
SA59–SA62
01101XXXXX
256 (4x64) Kbytes
SA63–SA66
01110XXXXX
256 (4x64) Kbytes
SA67–SA70
01111XXXXX
256 (4x64) Kbytes
SA71–SA74
10000XXXXX
256 (4x64) Kbytes
SA75–SA78
10001XXXXX
256 (4x64) Kbytes
SA79–SA82
10010XXXXX
256 (4x64) Kbytes
SA83–SA86
10011XXXXX
256 (4x64) Kbytes
SA87–SA90
10100XXXXX
256 (4x64) Kbytes
SA91–SA94
10101XXXXX
256 (4x64) Kbytes
SA95–SA98
10110XXXXX
256 (4x64) Kbytes
SA99–SA102
10111XXXXX
256 (4x64) Kbytes
October 7, 2003
Sector protection/unprotection requires VID on the RESET# pin only, and can be implemented either in-system or via programming equipment. Figure 2 shows
the algorithms and Figure 27 shows the timing diagram. This method uses standard microprocessor bus
cycle timing. For sector unprotect, all unprotected sectors must first be protected prior to the first sector unprotect write cycle. Note that the sector unprotect
algorithm unprotects all sectors in parallel. All previously protected sectors must be individually re-protected. To change data in protected sectors efficiently,
the temporary sector unprotect function is available.
See “Temporary Sector Unprotect”.
The device is shipped with all sectors unprotected.
AMD offers the option of programming and protecting
sectors at its factory prior to shipping the device
through AMD’s ExpressFlash™ Service. Contact an
AMD representative for details.
It is possible to determine whether a sector is protected or unprotected. See the Sector/Sector Block
Protection and Unprotection section for details.
Write Protect (WP#)
The Write Protect function provides a hardware
method of protecting without using VID. This function is
one of two provided by the WP#/ACC pin.
If the system asserts VIL on the WP#/ACC pin, the device disables program and erase functions in sectors
0, 1, 140, and 141, independently of whether those
sectors were protected or unprotected using the
method described in “Sector/Sector Block Protection
and Unprotection”.
Am50DL128BH
19
A D V A N C E
I N F O R M A T I O N
If the system asserts VIH on the WP#/ACC pin, the device reverts to whether sectors 0, 1, 140, and 141
were last set to be protected or unprotected. That is,
sector protection or unprotection for these sectors depends on whether they were last protected or unprotected using the method described in “Sector/Sector
Block Protection and Unprotection”.
Note that the WP#/ACC pin must not be left floating or
unconnected; inconsistent behavior of the device may
result.
Table 7.
WP# Input
Voltage
WP#/ACC Modes
Device
Mode
VIL
Disables programming and erasing in
SA0, SA1, SA140, and SA141
VIH
Enables programming and erasing in
SA0, SA1, SA140, and SA141
VHH
Enables accelerated progamming (ACC).
See “Accelerated Program Operation” on
page 13.
Temporary Sector Unprotect
(Note: For the following discussion, the term “sector”
applies to both sectors and sector blocks. A sector
block consists of two or more adjacent sectors that are
protected or unprotected at the same time (see Table
6).
This feature allows temporary unprotection of previously protected sectors to change data in-system. The
Sector Unprotect mode is activated by setting the RESET# pin to VID. During this mode, formerly protected
sectors can be programmed or erased by selecting the
sector addresses. Once VID is removed from the RESET# pin, all the previously protected sectors are
protected again. Figure 1 shows the algorithm, and
Figure 26 shows the timing diagrams, for this feature.
If the WP#/ACC pin is at VIL , sectors 0, 1, 140, and
141 will remain protected during the Temporary sector
Unprotect mode.
START
RESET# = VID
(Note 1)
Perform Erase or
Program Operations
RESET# = VIH
Temporary Sector
Unprotect Completed
(Note 2)
Notes:
1. All protected sectors unprotected (If WP#/ACC = VIL,
sectors 0, 1, 140, and 141 will remain protected).
2. All previously protected sectors are protected once
again.
Figure 1.
20
Am50DL128BH
Temporary Sector Unprotect Operation
October 7, 2003
A D V A N C E
I N F O R M A T I O N
START
START
Protect all sectors:
The indicated portion
of the sector protect
algorithm must be
performed for all
unprotected sectors
prior to issuing the
first sector
unprotect address
PLSCNT = 1
RESET# = VID
Wait 1 µs
Temporary Sector
Unprotect Mode
No
PLSCNT = 1
RESET# = VID
Wait 1 µs
No
First Write
Cycle = 60h?
First Write
Cycle = 60h?
Yes
Yes
Set up sector
address
No
All sectors
protected?
Sector Protect:
Write 60h to sector
address with
A6 = 0, A1 = 1,
A0 = 0
Yes
Set up first sector
address
Sector Unprotect:
Write 60h to sector
address with
A6 = 1, A1 = 1,
A0 = 0
Wait 150 µs
Increment
PLSCNT
Temporary Sector
Unprotect Mode
Verify Sector
Protect: Write 40h
to sector address
with A6 = 0,
A1 = 1, A0 = 0
Reset
PLSCNT = 1
Read from
sector address
with A6 = 0,
A1 = 1, A0 = 0
Wait 15 ms
Verify Sector
Unprotect: Write
40h to sector
address with
A6 = 1, A1 = 1,
A0 = 0
Increment
PLSCNT
No
No
PLSCNT
= 25?
Yes
Yes
No
Yes
Device failed
Read from
sector address
with A6 = 1,
A1 = 1, A0 = 0
Data = 01h?
Protect another
sector?
PLSCNT
= 1000?
No
No
Data = 00h?
Yes
Yes
Remove VID
from RESET#
Device failed
Last sector
verified?
Write reset
command
Sector Protect
Algorithm
Sector Protect
complete
Set up
next sector
address
No
Yes
Sector Unprotect
Algorithm
Remove VID
from RESET#
Write reset
command
Sector Unprotect
complete
Figure 2.
October 7, 2003
In-System Sector Protect/Unprotect Algorithms
Am50DL128BH
21
A D V A N C E
I N F O R M A T I O N
SecSi™ (Secured Silicon) Sector
Flash Memory Region
The SecSi (Secured Silicon) Sector feature provides a
Flash memory region that enables permanent part
identification through an Electronic Serial Number
(ESN). The SecSi Sector is 256 bytes in length, and
uses a SecSi Sector Indicator Bit (DQ7) to indicate
whether or not the SecSi Sector is locked when
shipped from the factory. This bit is permanently set at
the factory and cannot be changed, which prevents
cloning of a factory locked part. This ensures the security of the ESN once the product is shipped to the field.
AMD offers the device with the SecSi Sector either
factor y locked o r custom er locka ble . Th e factory-locked version is always protected when shipped
from the factory, and has the SecSi (Secured Silicon)
Sector Indicator Bit permanently set to a “1.” The customer-lockable version is shipped with the SecSi Sector unprotected, allowing customers to utilize the that
sector in any manner they choose. The customer-lockable version has the SecSi (Secured Silicon) Sector
Indicator Bit permanently set to a “0.” Thus, the SecSi
Sector Indicator Bit prevents customer-lockable devices from being used to replace devices that are factory locked.
The system accesses the SecSi Sector Secure
through a command sequence (see “Enter SecSi™
Sector/Exit SecSi Sector Command Sequence”). After
the system has written the Enter SecSi Sector command sequence, it may read the SecSi Sector by
using the addresses normally occupied by the boot
sectors. This mode of operation continues until the
system issues the Exit SecSi Sector command sequence, or until power is removed from the device. On
power-up, or following a hardware reset, the device reverts to sending commands to the first 256 bytes of
Sector 0.
Factory Locked: SecSi Sector Programmed and
Protected At the Factory
In a factory locked device, the SecSi Sector is protected when the device is shipped from the factory.
The SecSi Sector cannot be modified in any way. The
device is preprogrammed with both a random number
and a secure ESN. The 8-word random number will at
addresses 000000h–000007h in word mode (or
000000h–00000Fh in byte mode). The secure ESN
will be programmed in the next 8 words at addresses
22
000008h–00000Fh (or 000010h–000019h in byte
mode). The device is available preprogrammed with
one of the following:
■ A random, secure ESN only
■ Customer code through the ExpressFlash service
■ Both a random, secure ESN and customer code
through the ExpressFlash service.
Customers may opt to have their code programmed by
AMD through the AMD ExpressFlash service. AMD
programs the customer’s code, with or without the random ESN. The devices are then shipped from AMD’s
factory with the SecSi Sector permanently locked.
Contact an AMD representative for details on using
AMD’s ExpressFlash service.
Customer Lockable: SecSi Sector NOT
Programmed or Protected At the Factory
If the security feature is not required, the SecSi Sector
can be treated as an additional Flash memory space.
The SecSi Sector can be read any number of times,
but can be programmed and locked only once. Note
that the accelerated programming (ACC) and unlock
bypass functions are not available when programming
the SecSi Sector.
The SecSi Sector area can be protected using one of
the following procedures:
■ Write the three-cycle Enter SecSi Sector Region
command sequence, and then follow the in-system
sector protect algorithm as shown in Figure 2, except that RESET# may be at either VIH or VID. This
allows in-system protection of the SecSi Sector Region without raising any device pin to a high voltage.
Note that this method is only applicable to the SecSi
Sector.
■ To verify the protect/unprotect status of the SecSi
Sector, follow the algorithm shown in Figure 3.
Once the SecSi Sector is locked and verified, the system must write the Exit SecSi Sector Region command sequence to return to reading and writing the
remainder of the array.
The SecSi Sector lock must be used with caution
since, once locked, there is no procedure available for
unlocking the SecSi Sector area and none of the bits
in the SecSi Sector memory space can be modified in
any way.
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
.
Logical Inhibit
Write cycles are inhibited by holding any one of OE# =
VIL, CE#f = VIH or WE# = VIH. To initiate a write cycle,
CE#f and WE# must be a logical zero while OE# is a
logical one.
START
RESET# =
VIH or VID
Wait 1 µs
Write 60h to
any address
If data = 00h,
SecSi Sector is
unprotected.
If data = 01h,
SecSi Sector is
protected.
Figure 3.
If WE# = CE#f = VIL and OE# = VIH during power up,
the device does not accept commands on the rising
edge of WE#. The internal state machine is automatically reset to the read mode on power-up.
Remove VIH or VID
from RESET#
Write 40h to SecSi
Sector address
with A6 = 0,
A1 = 1, A0 = 0
Read from SecSi
Sector address
with A6 = 0,
A1 = 1, A0 = 0
Power-Up Write Inhibit
COMMON FLASH MEMORY INTERFACE
(CFI)
Write reset
command
The Common Flash Interface (CFI) specification outlines device and host system software interrogation
handshake, which allows specific vendor-specified
software algorithms to be used for entire families of
devices. Software support can then be device-independent, JEDEC ID-independent, and forward- and
backward-compatible for the specified flash device
families. Flash vendors can standardize their existing
interfaces for long-term compatibility.
SecSi Sector
Protect Verify
complete
SecSi Sector Protect Verify
Hardware Data Protection
The command sequence requirement of unlock cycles
for programming or erasing provides data protection
against inadvertent writes (refer to Table 12 for command definitions). In addition, the following hardware
data protection measures prevent accidental erasure
or programming, which might otherwise be caused by
spurious system level signals during V CC power-up
and power-down transitions, or from system noise.
Low VCC Write Inhibit
When VCC is less than V LKO, the device does not accept any write cycles. This protects data during VCC
power-up and power-down. The command register
and all internal program/erase circuits are disabled,
and the device resets to the read mode. Subsequent
writes are ignored until VCC is greater than VLKO. The
system must provide the proper signals to the control
pins to prevent unintentional writes when V CC is
greater than VLKO.
This device enters the CFI Query mode when the system writes the CFI Query command, 98h, to address
55h in word mode (or address AAh in byte mode), any
time the device is ready to read array data. The
system can read CFI information at the addresses
given in Tables 8–11. To terminate reading CFI data,
the system must write the reset command.The CFI
Query mode is not accessible when the device is executing an Embedded Program or embedded Erase algorithm.
The system can also write the CFI query command
when the device is in the autoselect mode. The device
enters the CFI query mode, and the system can read
CFI data at the addresses given in Tables 8–11. The
system must write the reset command to return the device to reading array data.
For further information, please refer to the CFI Specification and CFI Publication 100, available via the
World Wide Web at http://www.amd.com/flash/cfi. Alternatively, contact an AMD representative for copies
of these documents.
Write Pulse “Glitch” Protection
Noise pulses of less than 5 ns (typical) on OE#, CE#f
or WE# do not initiate a write cycle.
October 7, 2003
Am50DL128BH
23
A D V A N C E
Table 8.
I N F O R M A T I O N
CFI Query Identification String
Addresses
(Word Mode)
Addresses
(Byte Mode)
Data
10h
11h
12h
20h
22h
24h
0051h
0052h
0059h
Query Unique ASCII string “QRY”
13h
14h
26h
28h
0002h
0000h
Primary OEM Command Set
15h
16h
2Ah
2Ch
0040h
0000h
Address for Primary Extended Table
17h
18h
2Eh
30h
0000h
0000h
Alternate OEM Command Set (00h = none exists)
19h
1Ah
32h
34h
0000h
0000h
Address for Alternate OEM Extended Table (00h = none exists)
Table 9.
Description
System Interface String
Addresses
(Word Mode)
Addresses
(Byte Mode)
Data
1Bh
36h
0027h
VCC Min. (write/erase)
D7–D4: volt, D3–D0: 100 millivolt
1Ch
38h
0036h
VCC Max. (write/erase)
D7–D4: volt, D3–D0: 100 millivolt
1Dh
3Ah
0000h
VPP Min. voltage (00h = no VPP pin present)
1Eh
3Ch
0000h
VPP Max. voltage (00h = no VPP pin present)
1Fh
3Eh
0003h
Typical timeout per single byte/word write 2N µs
20h
40h
0000h
Typical timeout for Min. size buffer write 2N µs (00h = not supported)
21h
42h
0009h
Typical timeout per individual block erase 2N ms
22h
44h
0000h
Typical timeout for full chip erase 2N ms (00h = not supported)
23h
46h
0005h
Max. timeout for byte/word write 2N times typical
24h
48h
0000h
Max. timeout for buffer write 2N times typical
25h
4Ah
0004h
Max. timeout per individual block erase 2N times typical
26h
4Ch
0000h
Max. timeout for full chip erase 2N times typical (00h = not supported)
24
Description
Am50DL128BH
October 7, 2003
A D V A N C E
Table 10.
Addresses
(Word Mode)
Addresses
(Byte Mode)
I N F O R M A T I O N
Device Geometry Definition
Data
Description
N
27h
4Eh
0017h
Device Size = 2 byte
28h
29h
50h
52h
0002h
0000h
Flash Device Interface description (refer to CFI publication 100)
2Ah
2Bh
54h
56h
0000h
0000h
Max. number of byte in multi-byte write = 2N
(00h = not supported)
2Ch
58h
0003h
Number of Erase Block Regions within device
2Dh
2Eh
2Fh
30h
5Ah
5Ch
5Eh
60h
0007h
0000h
0020h
0000h
Erase Block Region 1 Information
(refer to the CFI specification or CFI publication 100)
31h
32h
33h
34h
62h
64h
66h
68h
007Dh
0000h
0000h
0001h
Erase Block Region 2 Information
(refer to the CFI specification or CFI publication 100)
35h
36h
37h
38h
6Ah
6Ch
6Eh
70h
0007h
0000h
0020h
0000h
Erase Block Region 3 Information
(refer to the CFI specification or CFI publication 100)
39h
3Ah
3Bh
3Ch
72h
74h
76h
78h
0000h
0000h
0000h
0000h
Erase Block Region 4 Information
(refer to the CFI specification or CFI publication 100)
October 7, 2003
Am50DL128BH
25
A D V A N C E
Table 11.
I N F O R M A T I O N
Primary Vendor-Specific Extended Query
Addresses
(Word Mode)
Addresses
(Byte Mode)
Data
40h
41h
42h
80h
82h
84h
0050h
0052h
0049h
Query-unique ASCII string “PRI”
43h
86h
0031h
Major version number, ASCII (reflects modifications to the silicon)
44h
88h
0033h
Minor version number, ASCII (reflects modifications to the CFI table)
45h
8Ah
0004h
Address Sensitive Unlock (Bits 1-0)
0 = Required, 1 = Not Required
Description
Silicon Revision Number (Bits 7-2)
46h
8Ch
0002h
Erase Suspend
0 = Not Supported, 1 = To Read Only, 2 = To Read & Write
47h
8Eh
0001h
Sector Protect
0 = Not Supported, X = Number of sectors in per group
48h
90h
0001h
Sector Temporary Unprotect
00 = Not Supported, 01 = Supported
49h
92h
0004h
Sector Protect/Unprotect scheme
01 =29F040 mode, 02 = 29F016 mode, 03 = 29F400, 04 = 29LV800
mode
4Ah
94h
4Bh
96h
0000h
Burst Mode Type
00 = Not Supported, 01 = Supported
4Ch
98h
0000h
Page Mode Type
00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page
4Dh
9Ah
0085h
4Eh
9Ch
0095h
0077h
Simultaneous Operation
00 = Not Supported, X = Number of Sectors (excluding Bank 1)
ACC (Acceleration) Supply Minimum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
ACC (Acceleration) Supply Maximum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
Top/Bottom Boot Sector Flag
26
4Fh
9Eh
0001h
50h
A0h
0001h
57h
AEh
0004h
58h
B0h
0017h
59h
B2h
0030h
5Ah
B4h
0030h
5Bh
B6h
0017h
00h = Uniform device, 01h = 8 x 8 Kbyte Sectors, Top And Bottom Boot
with Write Protect, 02h = Bottom Boot Device, 03h = Top Boot Device,
04h = Both Top and Bottom
Program Suspend
0 = Not supported, 1 = Supported
Bank Organization
00 = Data at 4Ah is zero, X = Number of Banks
Bank 1 Region Information
X = Number of Sectors in Bank 1
Bank 2 Region Information
X = Number of Sectors in Bank 2
Bank 3 Region Information
X = Number of Sectors in Bank 3
Bank 4 Region Information
X = Number of Sectors in Bank 4
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
FLASH COMMAND DEFINITIONS
Writing specific address and data commands or sequences into the command register initiates device operations. Table 12 defines the valid register command
sequences. Writing incorrect address and data values
or writing them in the improper sequence may place
the device in an unknown state. A reset command is
then required to return the device to reading array
data.
All addresses are latched on the falling edge of WE#
or CE#f, whichever happens later. All data is latched
on the rising edge of WE# or CE#f, whichever happens first. Refer to the pSRAM AC Characteristics
section for timing diagrams.
Reading Array Data
The device is automatically set to reading array data
after device power-up. No commands are required to
retrieve data. Each bank is ready to read array data
after completing an Embedded Program or Embedded
Erase algorithm.
After the device accepts an Erase Suspend command,
the corresponding bank enters the eras e-sus pend-read mode, after which the system can read
data from any non-erase-suspended sector within the
same bank. The system can read array data using the
standard read timing, except that if it reads at an address within erase-suspended sectors, the device outputs status data. After completing a programming
operation in the Erase Suspend mode, the system
may once again read array data with the same exception. See the Erase Suspend/Erase Resume Commands section for more information.
The system must issue the reset command to return a
bank to the read (or erase-suspend-read) mode if DQ5
goes high during an active program or erase operation, or if the bank is in the autoselect mode. See the
next section, Reset Command, for more information.
See also Requirements for Reading Array Data in the
section for more information. The Flash Read-Only
Operations table provides the read parameters, and
Figure 15 shows the timing diagram.
The reset command may be written between the
sequence cycles in a program command sequence
before programming begins. This resets the bank to
which the system was writing to the read mode. If the
program command sequence is written to a bank that
is in the Erase Suspend mode, writing the reset
co m m an d re tur n s th at b a nk t o t he e ra se- suspend-read mode. Once programming begins, however, the device ignores reset commands until the
operation is complete.
The reset command may be written between the sequence cycles in an autoselect command sequence.
Once in the autoselect mode, the reset command
must be written to return to the read mode. If a bank
entered the autoselect mode while in the Erase Suspend mode, writing the reset command returns that
bank to the erase-suspend-read mode.
If DQ5 goes high during a program or erase operation,
writing the reset command returns the banks to the
read mode (or erase-suspend-read mode if that bank
was in Erase Suspend).
Autoselect Command Sequence
The autoselect command sequence allows the host
system to access the manufacturer and device codes,
and determine whether or not a sector is protected.
The autoselect command sequence may be written to
an address within a bank that is either in the read or
erase-suspend-read mode. The autoselect command
may not be written while the device is actively programming or erasing in the other bank.
The autoselect command sequence is initiated by first
writing two unlock cycles. This is followed by a third
write cycle that contains the bank address and the autoselect command. The bank then enters the autoselect mode. The system may read any number of
autoselect codes without reinitiating the command sequence.
Reset Command
Table 12 shows the address and data requirements.
To determine sector protection information, the system
must write to the appropriate bank address (BA) and
sector address (SADD). Table 3 shows the address
range and bank number associated with each sector.
Writing the reset command resets the banks to the
read or erase-suspend-read mode. Address bits are
don’t cares for this command.
The system must write the reset command to return to
the read mode (or erase-suspend-read mode if the
bank was previously in Erase Suspend).
The reset command may be written between the sequence cycles in an erase command sequence before
erasing begins. This resets the bank to which the system was writing to the read mode. Once erasure begins, however, the device ignores reset commands
until the operation is complete.
October 7, 2003
Enter SecSi™ Sector/Exit SecSi Sector
Command Sequence
The SecSi Sector region provides a secured data area
containing a random, sixteen-byte electronic serial
number (ESN). The system can access the SecSi
Sector region by issuing the three-cycle Enter SecSi
Am50DL128BH
27
A D V A N C E
I N F O R M A T I O N
Sector command sequence. The device continues to
access the SecSi Sector region until the system issues the four-cycle Exit SecSi Sector command sequence. The Exit SecSi Sector command sequence
returns the device to normal operation. The SecSi
Sector is not accessible when the device is executing
an Embedded Program or embedded Erase algorithm.
Table 12 shows the address and data requirements for
both command sequences. See also “SecSi™ (Secured Silicon) Sector Flash Memory Region” for further
information.
Byte/Word Program Command Sequence
The system may program the device by word or byte,
depending on the state of the CIOf pin. Programming
is a four-bus-cycle operation. The program command
sequence is initiated by writing two unlock write cycles, followed by the program set-up command. The
program address and data are written next, which in
turn initiate the Embedded Program algorithm. The
system is not required to provide further controls or
timings. The device automatically provides internally
generated program pulses and verifies the programmed cell margin. Table 12 shows the address
and data requirements for the byte program command
sequence. Note that the SecSi Sector, autoselect, and
CFI functions are unavailable when a program operation is in progress.
When the Embedded Program algorithm is complete,
that bank then returns to the read mode and addresses are no longer latched. The system can determine the status of the program operation by using
DQ7, DQ6, or RY/BY#. Refer to the Flash Write Operation Status section for information on these status
bits.
Any commands written to the device during the Embedded Program Algorithm are ignored. Note that a
hardware reset immediately terminates the program
operation. The program command sequence should
be reinitiated once that bank has returned to the read
mode, to ensure data integrity.
Programming is allowed in any sequence and across
sector boundaries. A bit cannot be programmed
from “0” back to a “1.” Attempting to do so may
cause that bank to set DQ5 = 1, or cause the DQ7 and
DQ6 status bits to indicate the operation was success-
28
ful. However, a succeeding read will show that the
data is still “0.” Only erase operations can convert a
“0” to a “1.”
Unlock Bypass Command Sequence
The unlock bypass feature allows the system to program bytes or words to a bank faster than using the
standard program command sequence. The unlock
bypass command sequence is initiated by first writing
two unlock cycles. This is followed by a third write
cycle containing the unlock bypass command, 20h.
That bank then enters the unlock bypass mode. A
two-cycle unlock bypass program command sequence
is all that is required to program in this mode. The first
cycle in this sequence contains the unlock bypass program command, A0h; the second cycle contains the
program address and data. Additional data is programmed in the same manner. This mode dispenses
with the initial two unlock cycles required in the standard program command sequence, resulting in faster
total programming time. Table 12 shows the requirements for the command sequence.
During the unlock bypass mode, only the Unlock Bypass Program and Unlock Bypass Reset commands
are valid. To exit the unlock bypass mode, the system
must issue the two-cycle unlock bypass reset command sequence. The first cycle must contain the bank
address and the data 90h. The second cycle need
only contain the data 00h. The bank then returns to
the read mode.
The device offers accelerated program operations
through the WP#/ACC pin. When the system asserts
VHH on the WP#/ACC pin, the device automatically enters the Unlock Bypass mode. The system may then
write the two-cycle Unlock Bypass program command
sequence. The device uses the higher voltage on the
WP#/ACC pin to accelerate the operation. Note that
the WP#/ACC pin must not be at VHH any operation
other than accelerated programming, or device damage may result. In addition, the WP#/ACC pin must not
be left floating or unconnected; inconsistent behavior
of the device may result.
Figure 4 illustrates the algorithm for the program operation. Refer to the Erase and Program Operations
table in the AC Characteristics section for parameters,
and Figure 19 for timing diagrams.
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
Any commands written during the chip erase operation
are ignored. However, note that a hardware reset immediately terminates the erase operation. If that occurs, the chip erase command sequence should be
reinitiated once that bank has returned to reading
array data, to ensure data integrity.
START
Figure 5 illustrates the algorithm for the erase operation. Refer to the Erase and Program Operations tables in the AC Characteristics section for parameters,
and Figure 21 section for timing diagrams.
Write Program
Command Sequence
Embedded
Program
algorithm
in progress
Data Poll
from System
Sector Erase Command Sequence
Verify Data?
Sector erase is a six bus cycle operation. The sector
erase command sequence is initiated by writing two
unlock cycles, followed by a set-up command. Two additional unlock cycles are written, and are then followed by the address of the sector to be erased, and
the sector erase command. Table 12 shows the address and data requirements for the sector erase command sequence.
No
Yes
Increment Address
No
The device does not require the system to preprogram
prior to erase. The Embedded Erase algorithm automatically programs and verifies the entire memory for
an all zero data pattern prior to electrical erase. The
system is not required to provide any controls or timings during these operations.
Last Address?
Yes
Programming
Completed
Note: See Table 12 for program command sequence.
Figure 4.
Program Operation
Chip Erase Command Sequence
Chip erase is a six bus cycle operation. The chip erase
command sequence is initiated by writing two unlock
cycles, followed by a set-up command. Two additional
unlock write cycles are then followed by the chip erase
command, which in turn invokes the Embedded Erase
algorithm. The device does not require the system to
preprogram prior to erase. The Embedded Erase algorithm automatically preprograms and verifies the entire
memory for an all zero data pattern prior to electrical
erase. The system is not required to provide any controls or timings during these operations. Table 12
shows the address and data requirements for the chip
erase command sequence. Note that the SecSi Sector, autoselect, and CFI functions are unavailable
when a erase operation is in progress.
When the Embedded Erase algorithm is complete,
that bank returns to the read mode and addresses are
no longer latched. The system can determine the status of the erase operation by using DQ7, DQ6, DQ2,
or RY/BY#. Refer to the Flash Write Operation Status
section for information on these status bits.
October 7, 2003
After the command sequence is written, a sector erase
time-out of 80 µs occurs. During the time-out period,
additional sector addresses and sector erase commands may be written. Loading the sector erase buffer
may be done in any sequence, and the number of sectors may be from one sector to all sectors. The time
between these additional cycles must be less than 80
µs, otherwise erasure may begin. Any sector erase
address and command following the exceeded
time-out may or may not be accepted. It is recommended that processor interrupts be disabled during
this time to ensure all commands are accepted. The
interrupts can be re-enabled after the last Sector
Erase command is written. Any command other than
S e ct o r E ra se o r E ra s e S u s p en d d u r i n g th e
time-out period resets that bank to the read mode.
The system must rewrite the command sequence and
any additional addresses and commands. Note that
the SecSi Sector, autoselect, and CFI functions are
unavailable when a erase operation is in progress.
The system can monitor DQ3 to determine if the sector erase timer has timed out (See the section on DQ3:
Sector Erase Timer.). The time-out begins from the rising edge of the final WE# pulse in the command
sequence.
When the Embedded Erase algorithm is complete, the
bank returns to reading array data and addresses are
no longer latched. Note that while the Embedded
Erase operation is in progress, the system can read
Am50DL128BH
29
A D V A N C E
I N F O R M A T I O N
data from the non-erasing bank. The system can determine the status of the erase operation by reading
DQ7, DQ6, DQ2, or RY/BY# in the erasing bank.
Refer to the Flash Write Operation Status section for
information on these status bits.
Once the sector erase operation has begun, only the
Erase Suspend command is valid. All other commands are ignored. However, note that a hardware
reset immediately terminates the erase operation. If
that occurs, the sector erase command sequence
should be reinitiated once that bank has returned to
reading array data, to ensure data integrity.
Figure 5 illustrates the algorithm for the erase operation. Refer to the Erase and Program Operations tables in the AC Characteristics section for parameters,
and Figure 21 section for timing diagrams.
Erase Suspend/Erase Resume
Commands
The Erase Suspend command, B0h, allows the system to interrupt a sector erase operation and then read
data from, or program data to, any sector not selected
for erasure. The bank address is required when writing
this command. This command is valid only during the
sector erase operation, including the 80 µs time-out
period during the sector erase command sequence.
The Erase Suspend command is ignored if written during the chip erase operation or Embedded Program
algorithm.
just as in the standard Byte Program operation.
Refer to the Flash Write Operation Status section for
more information.
In the erase-suspend-read mode, the system can also
issue the autoselect command sequence. The device
allows reading autoselect codes even at addresses
within erasing sectors, since the codes are not stored
in the memory array. When the device exits the autoselect mode, the device reverts to the Erase Suspend mode, and is ready for another valid operation.
Refer to the Sector/Sector Block Protection and Unprotection and Autoselect Command Sequence sections for details.
To resume the sector erase operation, the system
must write the Erase Resume command (address bits
are don’t care). The bank address of the erase-suspended bank is required when writing this command.
Further writes of the Resume command are ignored.
Another Erase Suspend command can be written after
the chip has resumed erasing.
START
Write Erase
Command Sequence
(Notes 1, 2)
When the Erase Suspend command is written during
the sector erase operation, the device requires a maximum of 20 µs to suspend the erase operation. However, when the Erase Suspend command is written
during the sector erase time-out, the device immediately terminates the time-out period and suspends the
erase operation. Addresses are “don’t-cares” when
writing the Erase suspend command.
After the erase operation has been suspended, the
bank enters the erase-suspend-read mode. The system can read data from or program data to any sector
not selected for erasure. (The device “erase suspends” all sectors selected for erasure.) Reading at
any address within erase-suspended sectors produces status information on DQ7–DQ0. The system
can use DQ7, or DQ6 and DQ2 together, to determine
if a sector is actively erasing or is erase-suspended.
Refer to the Flash Write Operation Status section for
information on these status bits.
Data Poll to Erasing
Bank from System
No
Data = FFh?
Yes
Erasure Completed
Notes:
1. See Table 12 for erase command sequence.
2. See the section on DQ3 for information on the sector
erase timer.
After an erase-suspended program operation is complete, the bank returns to the erase-suspend-read
mode. The system can determine the status of the
program operation using the DQ7 or DQ6 status bits,
30
Embedded
Erase
algorithm
in progress
Am50DL128BH
Figure 5.
Erase Operation
October 7, 2003
A D V A N C E
Cycles
Table 12.
Command
Sequence
(Note 1)
Read (Note 6)
Reset (Note 7)
Autoselect (Note 8)
Manufacturer ID
Device ID (Note 9)
SecSi Sector Factory
Protect (Note 10)
Sector/Sector Block
Protect Verify
(Note 11)
1
1
Word
Byte
Word
Byte
Word
Byte
6
4
Word
555
4
Byte
Word
Byte
Word
Exit SecSi Sector Region
Byte
Word
Program
Byte
Word
Unlock Bypass
Byte
Unlock Bypass Program (Note 12)
Unlock Bypass Reset (Note 13)
Word
Chip Erase
Byte
Word
Sector Erase
Byte
Erase Suspend (Note 14)
Erase Resume (Note 15)
Word
CFI Query (Note 16)
Byte
Enter SecSi Sector Region
4
First
Addr Data
RA
RD
XXX
F0
555
AA
AAA
555
AA
AAA
555
AA
AAA
4
4
3
2
2
6
6
1
1
1
Am29DL640H Command Definitions
Second
Addr Data
2AA
555
2AA
555
2AA
555
555
AAA
555
AAA
555
AAA
555
AAA
XXX
XXX
555
AAA
555
AAA
BA
BA
55
AA
55
55
55
2AA
AA
AAA
3
I N F O R M A T I O N
AA
AA
AA
A0
90
AA
AA
2AA
555
2AA
555
2AA
555
2AA
555
PA
XXX
2AA
555
2AA
555
90
90
90
(BA)555
90
(BA)AAA
55
55
55
55
555
AAA
555
AAA
555
AAA
555
AAA
(BA)X00
Fifth
Addr
Data
Sixth
Addr
Data
01
(BA)X01
(BA)X0E
7E
(BA)X02
(BA)X1C
(BA)X03
80/00
(BA)X06
(SADD)
X02
00/01
(SADD)
X04
02
(BA)X0F
(BA)X1E
01
55
555
AAA
10
55
SADD
30
88
90
XXX
00
A0
PA
PD
20
PD
00
55
55
555
AAA
555
AAA
80
80
555
AAA
555
AAA
AA
AA
2AA
555
2AA
555
B0
30
98
Legend:
X = Don’t care
RA = Address of the memory location to be read.
RD = Data read from location RA during read operation.
PA = Address of the memory location to be programmed. Addresses
latch on the falling edge of the WE# or CE#f pulse, whichever happens
later.
Notes:
1. See Tables 1–2 for description of bus operations.
2. All values are in hexadecimal.
3. Except for the read cycle and the fourth cycle of the autoselect
command sequence, all bus cycles are write cycles.
4. Data bits DQ15–DQ8 are don’t care in command sequences,
except for RD and PD.
5. Unless otherwise noted, address bits A21–A12 are don’t cares for
unlock and command cycles, unless SADD or PA is required.
6. No unlock or command cycles required when bank is reading
array data.
7. The Reset command is required to return to the read mode (or to
the erase-suspend-read mode if previously in Erase Suspend)
when a bank is in the autoselect mode, or if DQ5 goes high (while
the bank is providing status information).
8. The fourth cycle of the autoselect command sequence is a read
cycle. The system must provide the bank address to obtain the
manufacturer ID, device ID, or SecSi Sector factory protect
information. Data bits DQ15–DQ8 are don’t care. See the
Autoselect Command Sequence section for more information.
October 7, 2003
(BA)555
(BA)AAA
(BA)555
(BA)AAA
(BA)555
(BA)AAA
55
555
AA
Bus Cycles (Notes 2–5)
Third
Fourth
Addr
Data
Addr
Data
PD = Data to be programmed at location PA. Data latches on the rising
edge of WE# or CE#f pulse, whichever happens first.
SADD = Address of the sector to be verified (in autoselect mode) or
erased. Address bits A21–A12 uniquely select any sector. Refer to
Table 3 for information on sector addresses.
BA = Address of the bank that is being switched to autoselect mode, is
in bypass mode, or is being erased. Address bits A21–A19 select a
bank. Refer to Table 4 for information on sector addresses.
9.
10.
11.
12.
13.
14.
15.
16.
The device ID must be read across the fourth, fifth, and sixth
cycles.
The data is 80h for factory locked, 40h for customer locked and
00h for not locked.
The data is 00h for an unprotected sector/sector block and 01h
for a protected sector/sector block.
The Unlock Bypass command is required prior to the Unlock
Bypass Program command.
The Unlock Bypass Reset command is required to return to the
read mode when the bank is in the unlock bypass mode.
The system may read and program in non-erasing sectors, or
enter the autoselect mode, when in the Erase Suspend mode.
The Erase Suspend command is valid only during a sector erase
operation, and requires the bank address.
The Erase Resume command is valid only during the Erase
Suspend mode, and requires the bank address.
Command is valid when device is ready to read array data or when
device is in autoselect mode.
Am50DL128BH
31
A D V A N C E
I N F O R M A T I O N
FLASH WRITE OPERATION STATUS
The device provides several bits to determine the status of
a program or erase operation: DQ2, DQ3, DQ5, DQ6, and
DQ7. Table 13 and the following subsections describe the
function of these bits. DQ7 and DQ6 each offer a method
for determining whether a program or erase operation is
complete or in progress. The device also provides a hardware-based output signal, RY/BY#, to determine whether
an Embedded Program or Erase operation is in progress or
has been completed.
the status or valid data. Even if the device has completed the program or erase operation and DQ7 has
valid data, the data outputs on DQ15–DQ0 may be still
invalid. Valid data on DQ15–DQ0 (or DQ7–DQ0 for
byte mode) will appear on successive read cycles.
Table 13 shows the outputs for Data# Polling on DQ7.
Figure 6 shows the Data# Polling algorithm. Figure 23
in the pSRAM AC Characteristics section shows the
Data# Polling timing diagram.
DQ7: Data# Polling
The Data# Polling bit, DQ7, indicates to the host system
whether an Embedded Program or Erase algorithm is in
progress or completed, or whether a bank is in Erase Suspend. Data# Polling is valid after the rising edge of the final
WE# pulse in the command sequence.
During the Embedded Program algorithm, the device outputs on DQ7 the complement of the datum programmed to
DQ7. This DQ7 status also applies to programming during
Erase Suspend. When the Embedded Program algorithm is
complete, the device outputs the datum programmed to
DQ7. The system must provide the program address to
read valid status information on DQ7. If a program address
falls within a protected sector, Data# Polling on DQ7 is active for approximately 1 µs, then that bank returns to the
read mode.
START
Read DQ7–DQ0
Addr = VA
DQ7 = Data?
No
No
During the Embedded Erase algorithm, Data# Polling
produces a “0” on DQ7. When the Embedded Erase
algorithm is complete, or if the bank enters the Erase
Suspend mode, Data# Polling produces a “1” on DQ7.
The system must provide an address within any of the
sectors selected for erasure to read valid status information on DQ7.
After an erase command sequence is written, if all
sectors selected for erasing are protected, Data# Polling on DQ7 is active for approximately 100 µs, then
the bank returns to the read mode. If not all selected
sectors are protected, the Embedded Erase algorithm
erases the unprotected sectors, and ignores the selected sectors that are protected. However, if the system reads DQ7 at an address within a protected
sector, the status may not be valid.
When the system detects DQ7 has changed from the
complement to true data, it can read valid data at
DQ15–DQ0 (or DQ7–DQ0 for byte mode) on the following read cycles. Just prior to the completion of an
Embedded Program or Erase operation, DQ7 may
change asynchronously with DQ15–DQ8 (DQ7–DQ0
in byte mode) while Output Enable (OE#) is asserted
low. That is, the device may change from providing
status information to valid data on DQ7. Depending on
when the system samples the DQ7 output, it may read
32
Yes
DQ5 = 1?
Yes
Read DQ7–DQ0
Addr = VA
DQ7 = Data?
Yes
No
FAIL
PASS
Notes:
1. VA = Valid address for programming. During a sector
erase operation, a valid address is any sector address
within the sector being erased. During chip erase, a
valid address is any non-protected sector address.
2. DQ7 should be rechecked even if DQ5 = “1” because
DQ7 may change simultaneously with DQ5.
Am50DL128BH
Figure 6.
Data# Polling Algorithm
October 7, 2003
A D V A N C E
I N F O R M A T I O N
RY/BY#: Ready/Busy#
The RY/BY# is a dedicated, open-drain output pin
which indicates whether an Embedded Algorithm is in
progress or complete. The RY/BY# status is valid after
the rising edge of the final WE# pulse in the command
sequence. Since RY/BY# is an open-drain output, several RY/BY# pins can be tied together in parallel with a
pull-up resistor to VCC.
If the output is low (Busy), the device is actively erasing or programming. (This includes programming in
the Erase Suspend mode.) If the output is high
(Ready), the device is in the read mode, the standby
mode, or one of the banks is in the erase-suspend-read mode.
DQ6 also toggles during the erase-suspend-program
mode, and stops toggling once the Embedded Program algorithm is complete.
Table 13 shows the outputs for Toggle Bit I on DQ6.
Figure 7 shows the toggle bit algorithm. Figure 24 in
the “Flash AC Characteristics” section shows the toggle bit timing diagrams. Figure 25 shows the differences between DQ2 and DQ6 in graphical form. See
also the subsection on DQ2: Toggle Bit II.
START
Table 13 shows the outputs for RY/BY#.
Read Byte
(DQ7–DQ0)
Address =VA
DQ6: Toggle Bit I
Toggle Bit I on DQ6 indicates whether an Embedded
Program or Erase algorithm is in progress or complete, or whether the device has entered the Erase
Suspend mode. Toggle Bit I may be read at any address, and is valid after the rising edge of the final
WE# pulse in the command sequence (prior to the
program or erase operation), and during the sector
erase time-out.
During an Embedded Program or Erase algorithm operation, successive read cycles to any address cause
DQ6 to toggle. The system may use either OE# or
CE#f to control the read cycles. When the operation is
complete, DQ6 stops toggling.
Read Byte
(DQ7–DQ0)
Address =VA
Toggle Bit
= Toggle?
Yes
No
After an erase command sequence is written, if all
sectors selected for erasing are protected, DQ6 toggles for approximately 100 µs, then returns to reading
array data. If not all selected sectors are protected, the
Embedded Erase algorithm erases the unprotected
sectors, and ignores the selected sectors that are protected.
DQ5 = 1?
Yes
Read Byte Twice
(DQ7–DQ0)
Address = VA
The system can use DQ6 and DQ2 together to determine whether a sector is actively erasing or is
erase-suspended. When the device is actively erasing
(that is, the Embedded Erase algorithm is in progress),
DQ6 toggles. When the device enters the Erase Suspend mode, DQ6 stops toggling. However, the system
must also use DQ2 to determine which sectors are
erasing or erase-suspended. Alternatively, the system
can use DQ7 (see the subsection on DQ7: Data# Polling).
If a program address falls within a protected sector,
DQ6 toggles for approximately 1 µs after the program
command sequence is written, then returns to reading
array data.
Toggle Bit
= Toggle?
No
Yes
Program/Erase
Operation Not
Complete, Write
Reset Command
Program/Erase
Operation Complete
Note: The system should recheck the toggle bit even if DQ5
= “1” because the toggle bit may stop toggling as DQ5
changes to “1.” See the subsections on DQ6 and DQ2 for
more information.
Figure 7.
October 7, 2003
No
Am50DL128BH
Toggle Bit Algorithm
33
A D V A N C E
I N F O R M A T I O N
DQ2: Toggle Bit II
The “Toggle Bit II” on DQ2, when used with DQ6, indicates whether a particular sector is actively erasing
(that is, the Embedded Erase algorithm is in progress),
or whether that sector is erase-suspended. Toggle Bit
II is valid after the rising edge of the final WE# pulse in
the command sequence.
DQ2 toggles when the system reads at addresses
within those sectors that have been selected for erasure. (The system may use either OE# or CE#f to control the read cycles.) But DQ2 cannot distinguish
whether the sector is actively erasing or is erase-suspended. DQ6, by comparison, indicates whether the
device is actively erasing, or is in Erase Suspend, but
cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for sector and
mode information. Refer to Table 13 to compare outputs for DQ2 and DQ6.
Figure 7 shows the toggle bit algorithm in flowchart
form, and the section “DQ2: Toggle Bit II” explains the
algorithm. See also the DQ6: Toggle Bit I subsection.
Figure 24 shows the toggle bit timing diagram. Figure
25 shows the differences between DQ2 and DQ6 in
graphical form.
Reading Toggle Bits DQ6/DQ2
Refer to Figure 7 for the following discussion. Whenever the system initially begins reading toggle bit status, it must read DQ15–DQ0 (or DQ7–DQ0 for byte
mode) at least twice in a row to determine whether a
toggle bit is toggling. Typically, the system would note
and store the value of the toggle bit after the first read.
After the second read, the system would compare the
new value of the toggle bit with the first. If the toggle
bit is not toggling, the device has completed the program or erase operation. The system can read array
data on DQ15–DQ0 (or DQ7–DQ0 for byte mode) on
the following read cycle.
not gone high. The system may continue to monitor
the toggle bit and DQ5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform
other system tasks. In this case, the system must start
at the beginning of the algorithm when it returns to determine the status of the operation (top of Figure 7).
DQ5: Exceeded Timing Limits
DQ5 indicates whether the program or erase time has
exceeded a specified internal pulse count limit. Under these
conditions DQ5 produces a “1,” indicating that the program
or erase cycle was not successfully completed.
The device may output a “1” on DQ5 if the system tries
to program a “1” to a location that was previously programmed to “0.” Only an erase operation can
change a “0” back to a “1.” Under this condition, the
device halts the operation, and when the timing limit
has been exceeded, DQ5 produces a “1.”
Under both these conditions, the system must write
the reset command to return to the read mode (or to
the erase-suspend-read mode if a bank was previously in the erase-suspend-program mode).
DQ3: Sector Erase Timer
After writing a sector erase command sequence, the
system may read DQ3 to determine whether or not
erasure has begun. (The sector erase timer does not
apply to the chip erase command.) If additional
sectors are selected for erasure, the entire time-out
also applies after each additional sector erase command. When the time-out period is complete, DQ3
switches from a “0” to a “1.” If the time between additional sector erase commands from the system can be
assumed to be less than 50 µs, the system need not
monitor DQ3. See also the Sector Erase Command
Sequence section.
However, if after the initial two read cycles, the system
determines that the toggle bit is still toggling, the system also should note whether the value of DQ5 is high
(see the section on DQ5). If it is, the system should
then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling
just as DQ5 went high. If the toggle bit is no longer
toggling, the device has successfully completed the
program or erase operation. If it is still toggling, the device did not completed the operation successfully, and
the system must write the reset command to return to
reading array data.
After the sector erase command is written, the system
should read the status of DQ7 (Data# Polling) or DQ6
(Toggle Bit I) to ensure that the device has accepted
the command sequence, and then read DQ3. If DQ3 is
“1,” the Embedded Erase algorithm has begun; all further commands (except Erase Suspend) are ignored
until the erase operation is complete. If DQ3 is “0,” the
device will accept additional sector erase commands.
To ensure the command has been accepted, the system software should check the status of DQ3 prior to
and following each subsequent sector erase command. If DQ3 is high on the second status check, the
last command might not have been accepted.
The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has
Table 13 shows the status of DQ3 relative to the other
status bits.
34
Am50DL128BH
October 7, 2003
A D V A N C E
Table 13.
Standard
Mode
Erase
Suspend
Mode
Status
Embedded Program Algorithm
Embedded Erase Algorithm
Erase
Erase-Suspend- Suspended Sector
Read
Non-Erase
Suspended Sector
Erase-Suspend-Program
I N F O R M A T I O N
Write Operation Status
DQ7
(Note 2)
DQ7#
0
DQ6
Toggle
Toggle
DQ5
(Note 1)
0
0
DQ3
N/A
1
DQ2
(Note 2)
No toggle
Toggle
RY/BY#
0
0
1
No toggle
0
N/A
Toggle
1
Data
Data
Data
Data
Data
1
DQ7#
Toggle
0
N/A
N/A
0
Notes:
1. DQ5 switches to ‘1’ when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits.
Refer to the section on DQ5 for more information.
2. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for further
details.
3. When reading write operation status bits, the system must always provide the bank address where the Embedded Algorithm
is in progress. The device outputs array data if the system addresses a non-busy bank.
October 7, 2003
Am50DL128BH
35
A D V A N C E
I N F O R M A T I O N
ABSOLUTE MAXIMUM RATINGS
Storage Temperature
Plastic Packages . . . . . . . . . . . . . . . –55°C to +125°C
20 ns
Ambient Temperature
with Power Applied . . . . . . . . . . . . . . –40°C to +85°C
+0.8 V
Voltage with Respect to Ground
–0.5 V
VCCf, VCCs (Note 1) . . . . . . . . . . . . –0.5 V to +4.0 V
RESET# (Note 2) . . . . . . . . . . . .–0.5 V to +12.5 V
20 ns
–2.0 V
WP#/ACC . . . . . . . . . . . . . . . . . .–0.5 V to +10.5 V
20 ns
All other pins (Note 1) . . . . . . –0.5 V to VCC +0.5 V
Output Short Circuit Current (Note 3) . . . . . . 200 mA
Notes:
1. Minimum DC voltage on input or I/O pins is –0.5 V.
During voltage transitions, input or I/O pins may
overshoot V SS to –2.0 V for periods of up to 20 ns.
Maximum DC voltage on input or I/O pins is VCC +0.5 V.
See Figure 8. During voltage transitions, input or I/O pins
may overshoot to VCC +2.0 V for periods up to 20 ns. See
Figure 9.
2. Minimum DC input voltage on pins RESET#, and
WP#/ACC is –0.5 V. During volta ge tran sitions,
WP#/ACC, and RESET# may overshoot VSS to –2.0 V
for periods of up to 20 ns. See Figure 8. Maximum DC
input voltage on pin RESET# is +12.5 V which may
overshoot to +14.0 V for periods up to 20 ns. Maximum
DC input voltage on WP#/ACC is +9.5 V which may
overshoot to +12.0 V for periods up to 20 ns.
Figure 8. Maximum Negative
Overshoot Waveform
20 ns
VCC
+2.0 V
VCC
+0.5 V
2.0 V
3. No more than one output may be shorted to ground at a
time. Duration of the short circuit should not be greater
than one second.
20 ns
20 ns
Figure 9. Maximum Positive
Overshoot Waveform
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. This
is a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational sections of this data sheet is not implied.
Exposure of the device to absolute maximum rating
conditions for extended periods may affect device reliability.
OPERATING RANGES
Industrial (I) Devices
Ambient Temperature (TA) . . . . . . . . . –40°C to +85°C
VCCf/VCCs Supply Voltages
VCCf/VCCs for standard voltage range . . 2.7 V to 3.3 V
Operating ranges define those limits between which the
functionality of the device is guaranteed.
36
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
ESD IMMUNITY
Spansion Flash memory Multi-Chip Products (MCPs)
may contain component devices that are developed by
FASL LLC ("Spansion components") and component
devices that are developed by a third party
("third-party components")
teed by FASL LLC for ESD immunity. However, ESD
test results for third-party components may be available from the component manufacturer. Component
manufacturer contact information is listed in the Spansion MCP Qualification Report, when available.
Spansion components are tested and guaranteed to
the ESD immunity levels listed in the corresponding
Spansion Flash memory Qualification Database.
Third-party components are neither tested nor guaran-
The Spansion Flash memory Qualification Database
and Spansion MCP Qualification Report are available
from AMD and Fujitsu sales offices.
October 7, 2003
Am50DL128BH
37
A D V A N C E
I N F O R M A T I O N
FLASH DC CHARACTERISTICS
CMOS Compatible
Parameter
Symbol
Parameter Description
Test Conditions
Typ
Max
Unit
±1.0
µA
ILI
Input Load Current
VIN = VSS to VCC,
VCC = VCC max
ILIT
RESET# Input Load Current
VCC = VCC max; RESET# = 12.5 V
35
µA
ILR
Reset Leakage Current
VCC = VCC max; RESET# = 12.5 V
35
µA
ILO
Output Leakage Current
VOUT = VSS to VCC,
VCC = VCC max
±1.0
µA
ILIA
ACC Input Leakage Current
VCC = VCC max, WP#/ACC
= VACC max
35
µA
ICC1f
Flash VCC Active Read Current
(Notes 1, 2)
CE#f = VIL, OE# = VIH,
Byte Mode
5 MHz
1 MHz
2
4
CE#f = VIL, OE# = VIH,
Word Mode
5 MHz
10
16
10
1 MHz
16
mA
2
4
15
30
mA
VCCf = VCC max, CE#f, RESET#,
WP#/ACC = VCCf ± 0.3 V
0.2
5
µA
Flash VCC Reset Current (Notes 2, 7)
VCCf = VCC max, RESET# = VSS ± 0.3 V,
WP#/ACC = VCCf ± 0.3 V
0.2
5
µA
ICC5f
Flash VCC Current Automatic Sleep Mode
(Notes 2, 4, 7)
VCCf = VCC max, VIH = VCC ± 0.3 V;
VIL = VSS ± 0.3 V
0.2
5
µA
ICC6f
Flash VCC Active Read-While-Program
Current (Notes 1, 2)
CE#f = VIL, OE# = VIH
Byte
21
45
Word
21
45
ICC7f
Flash VCC Active Read-While-Erase
Current (Notes 1, 2)
CE#f = VIL, OE# = VIH
Byte
21
45
Word
21
45
ICC8f
Flash VCC Active
Program-While-Erase-Suspended Current
(Notes 2, 5)
CE#f = VIL, OE#f = VIH
17
35
ICC2f
Flash VCC Active Write Current (Notes 2, 3) CE#f = VIL, OE# = VIH, WE# = VIL
ICC3f
Flash VCC Standby Current (Notes 2, 7)
ICC4f
mA
mA
mA
VIL
Input Low Voltage
–0.2
0.8
V
VIH
Input High Voltage
2.4
VCC + 0.2
V
VHH
Voltage for WP#/ACC Program
Acceleration and Sector
Protection/Unprotection
8.5
9.5
V
VID
Voltage for Sector Protection, Autoselect
and Temporary Sector Unprotect
11.5
12.5
V
VOL
Output Low Voltage
0.45
V
VOH1
Output High Voltage
VOH2
VLKO
IOL = 4.0 mA, VCCf = VCCs = VCC min
IOH = –2.0 mA, VCCf = VCCs = VCC min
IOH = –100 µA, VCC = VCC min
Flash Low VCC Lock-Out Voltage (Note 5)
0.85 x
VCC
3.
ICC active while Embedded Erase or Embedded Program is in
progress.
4.
Automatic sleep mode enables the low power mode when
addresses remain stable for tACC + 30 ns. Typical sleep mode
current is 200 nA.
V
VCC–0.4
2.0
Notes:
1. The ICC current listed is typically less than 2 mA/MHz, with OE# at
VIH.
2. Maximum ICC specifications are tested with VCC = VCCmax.
38
Min
2.5
V
5.
Not 100% tested.
6.
CE#f refers to chip enable input of active flash (device being
addressed).
7.
Typical and maximum current specifications shown are for each
flash device.
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
pSRAM DC & OPERATING CHARACTERISTICS
Parameter
Symbol
Parameter Description
Test Conditions
Min
Typ
Max
Unit
ILI
Input Leakage Current
VIN = VSS to VCC
–1.0
1.0
µA
ILO
Output Leakage Current
CE1#s = VIH, CE2s = VIL or OE# = VIH or
WE# = VIL, VIO= VSS to VCC
–1.0
1.0
µA
ICC1s
Operating Current
Cycle time = Min., IIO = 0 mA, 100% duty,
CE1#s = VIL, CE2s = VIH, VIN = VIL = or VIH,
tRC = Min.
40
mA
ICC2s
Page Access Operating
Current
Cycle time = Min., IIO = 0 mA, 100% duty,
CE1#s = VIL, CE2s = VIH, VIN = VIL = or VIH,
tPC = Min.
25
mA
VOL
Output Low Voltage
IOL = 1.0 mA
0.4
V
VOH
Output High Voltage
IOH = –0.5 mA
ISB
Standby Current (CMOS)
CE#1 = VCCS – 0.2 V, CE2 = VCCS – 0.2 V
70
µA
IDSB
Deep Power-down Standby
CE2 = 0.2 V
5
µA
VIL
Input Low Voltage
–0.3
(Note 1)
0.4
V
VIH
Input High Voltage
2.4
VCC +
0.3
(Note 2)
V
2
V
Notes:
1. VCC – 1.0 V for a 10 ns pulse width.
2. VCC + 1.0 V for a 10 ns pulse width.
October 7, 2003
Am50DL128BH
39
A D V A N C E
I N F O R M A T I O N
FLASH DC CHARACTERISTICS
Zero-Power Flash
Supply Current in mA
25
20
15
10
5
0
0
500
1000
1500
2000
2500
3000
3500
4000
Time in ns
Note: Addresses are switching at 1 MHz
Figure 10.
ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents)
12
3.3 V
10
2.7 V
Supply Current in mA
8
6
4
2
0
1
2
3
4
5
Frequency in MHz
Note: T = 25 °C
Figure 11.
40
Typical ICC1 vs. Frequency
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
TEST CONDITIONS
Table 14.
3.3 V
Test Condition
2.7 kΩ
Device
Under
Test
CL
Test Specifications
6.2 kΩ
All Speeds
Output Load
1 TTL gate
Output Load Capacitance, CL
(including jig capacitance)
30
pF
Input Rise and Fall Times
5
ns
0.0–3.0
V
Input timing measurement
reference levels
1.5
V
Output timing measurement
reference levels
1.5
V
Input Pulse Levels
Note: Diodes are IN3064 or equivalent
Figure 12.
Unit
Test Setup
KEY TO SWITCHING WAVEFORMS
WAVEFORM
INPUTS
OUTPUTS
Steady
Changing from H to L
Changing from L to H
Don’t Care, Any Change Permitted
Changing, State Unknown
Does Not Apply
Center Line is High Impedance State (High Z)
KS000010-PAL
3.0 V
Input
1.5 V
Measurement Level
1.5 V
Output
0.0 V
Figure 13.
October 7, 2003
Input Waveforms and Measurement Levels
Am50DL128BH
41
A D V A N C E
I N F O R M A T I O N
pSRAM AC CHARACTERISTICS
CE#s Timing
Parameter
Test Setup
JEDEC
Std
Description
—
tCCR
CE#s Recover Time
—
Min
All Speeds
Unit
0
ns
CE#f
tCCR
tCCR
tCCR
tCCR
CE1#s
CE2s
Figure 14. Timing Diagram for Alternating
Between Pseudo SRAM to Flash
42
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
FLASH AC CHARACTERISTICS
Read-Only Operations
Parameter
Speed
JEDEC
Std.
Description
Test Setup
56
70
85
Unit
tAVAV
tRC
Read Cycle Time (Note 1)
Min
55
70
85
ns
tAVQV
tACC
Address to Output Delay
CE#f, OE# = VIL
Max
55
70
85
ns
tELQV
tCE
Chip Enable to Output Delay
OE# = VIL
Max
55
70
85
ns
tGLQV
tOE
Output Enable to Output Delay
Max
25
30
40
ns
tEHQZ
tDF
Chip Enable to Output High Z (Notes 1, 3)
Max
16
ns
tGHQZ
tDF
Output Enable to Output High Z (Notes 1, 3)
Max
16
ns
tAXQX
tOH
Output Hold Time From Addresses, CE#f or
OE#, Whichever Occurs First
Min
0
ns
Min
0
ns
tOEH
Read
Output Enable Hold Time
Toggle and
(Note 1)
Data# Polling
Min
10
ns
Notes:
1. Not 100% tested.
2. See Figure 12 and Table 14 for test specifications
3. Measurements performed by placing a 50Ω termination on the data pin with a bias of VCC/2. The time from OE# high to the
data bus driven to VCC/2 is taken as tDF
.
tRC
Addresses Stable
Addresses
tACC
CE#f
tRH
tRH
tDF
tOE
OE#
tOEH
WE#
tCE
tOH
HIGH Z
HIGH Z
Output Valid
Outputs
RESET#
RY/BY#
0V
Figure 15.
October 7, 2003
Read Operation Timings
Am50DL128BH
43
A D V A N C E
I N F O R M A T I O N
FLASH AC CHARACTERISTICS
Hardware Reset (RESET#)
Parameter
JEDEC
Std
Description
All Speed Options
Unit
tReady
RESET# Pin Low (During Embedded Algorithms)
to Read Mode (See Note)
Max
20
µs
tReady
RESET# Pin Low (NOT During Embedded
Algorithms) to Read Mode (See Note)
Max
500
ns
tRP
RESET# Pulse Width
Min
500
ns
tRH
Reset High Time Before Read (See Note)
Min
50
ns
tRPD
RESET# Low to Standby Mode
Min
20
µs
tRB
RY/BY# Recovery Time
Min
0
ns
Note: Not 100% tested.
RY/BY#1,
RY/BY#2
CE#f, OE#
tRH
RESET#1,
RESET#2
tRP
tReady
Reset Timings NOT during Embedded Algorithms
Reset Timings during Embedded Algorithms
tReady
RY/BY#1,
RY/BY#2
tRB
CE#f, OE#
RESET#1,
RESET#2
tRP
Figure 16.
44
Reset Timings
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
FLASH AC CHARACTERISTICS
Word/Byte Configuration (CIOf)
Parameter
JEDEC
Std
Speed
Description
56
70
85
Unit
tELFL/tELFH
CE#f to CIOf Switching Low or High
Max
5
ns
tFLQZ
CIOf Switching Low to Output HIGH Z
Max
16
ns
tFHQV
CIOf Switching High to Output Active
Min
55
70
85
ns
CE#f
OE#
CIOf
CIOf
Switching
from word
to byte
mode
tELFL
Data Output
(DQ14–DQ0)
DQ0–DQ14
Address
Input
DQ15
Output
DQ15/A-1
Data Output
(DQ7–DQ0)
tFLQZ
tELFH
CIOf
CIOf
Switching
from byte
to word
mode
Data Output
(DQ7–DQ0)
DQ0–DQ14
Address
Input
DQ15/A-1
Data Output
(DQ14–DQ0)
DQ15
Output
tFHQV
Figure 17.
CIOf Timings for Read Operations
CE#f
The falling edge of the last WE# signal
WE#
CIOf
tSET
(tAS)
tHOLD (tAH)
Note: Refer to the Erase/Program Operations table for tAS and tAH specifications.
Figure 18.
October 7, 2003
CIOf Timings for Write Operations
Am50DL128BH
45
A D V A N C E
I N F O R M A T I O N
FLASH AC CHARACTERISTICS
Erase and Program Operations
Parameter
Speed
JEDEC
Std
Description
tAVAV
tWC
Write Cycle Time (Note 1)
Min
tAVWL
tAS
Address Setup Time
Min
0
ns
tASO
Address Setup Time to OE# low during toggle bit
polling
Min
15
ns
tAH
Address Hold Time
Min
tAHT
Address Hold Time From CE#f or OE# high
during toggle bit polling
Min
tDVWH
tDS
Data Setup Time
Min
tWHDX
tDH
Data Hold Time
Min
0
ns
tOEPH
Output Enable High during toggle bit polling
Min
20
ns
tGHWL
tGHWL
Read Recovery Time Before Write
(OE# High to WE# Low)
Min
0
ns
tWLEL
tWS
WE# Setup Time (CE#f to WE#)
Min
0
ns
tELWL
tCS
CE#f Setup Time
Min
0
ns
tEHWH
tWH
WE# Hold Time (CE#f to WE#)
Min
0
ns
tWHEH
tCH
CE#f Hold Time
Min
0
ns
tWLWH
tWP
Write Pulse Width
Min
tWHDL
tWPH
Write Pulse Width High
Min
30
ns
tSR/W
Latency Between Read and Write Operations
Min
0
ns
Byte
Typ
5
Word
Typ
7
tWLAX
56
70
85
Unit
55
70
85
ns
30
40
45
0
30
25
40
30
ns
ns
45
35
ns
ns
tWHWH1
tWHWH1
Programming Operation (Note 2)
tWHWH1
tWHWH1
Accelerated Programming Operation,
Word or Byte (Note 2)
Typ
4
µs
tWHWH2
tWHWH2
Sector Erase Operation (Note 2)
Typ
0.4
sec
tVCS
VCC Setup Time (Note 1)
Min
50
µs
tRB
Write Recovery Time from RY/BY#
Min
0
ns
Program/Erase Valid to RY/BY# Delay
Max
90
ns
tBUSY
µs
Notes:
1. Not 100% tested.
2. See the “Flash Erase And Programming Performance” section for more information.
46
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
FLASH AC CHARACTERISTICS
Program Command Sequence (last two cycles)
tAS
tWC
Addresses
Read Status Data (last two cycles)
555h
PA
PA
PA
tAH
CE#f
tCH
tGHWL
OE#
tWHWH1
tWP
WE#
tWPH
tCS
tDS
tDH
PD
A0h
Data
Status
tBUSY
DOUT
tRB
RY/BY#
VCCf
tVCS
Notes:
1. PA = program address, PD = program data, DOUT is the true data at the program address.
2. Illustration shows device in word mode.
Figure 19.
Program Operation Timings
VHH
WP#/ACC
VIL or VIH
VIL or VIH
tVHH
Figure 20.
October 7, 2003
tVHH
Accelerated Program Timing Diagram
Am50DL128BH
47
A D V A N C E
I N F O R M A T I O N
FLASH AC CHARACTERISTICS
Erase Command Sequence (last two cycles)
tAS
tWC
2AAh
Addresses
Read Status Data
VA
SADD
VA
555h for chip erase
tAH
CE#f
tGHWL
tCH
OE#
tWP
WE#
tWPH
tCS
tWHWH2
tDS
tDH
Data
55h
In
Progress
30h
Complete
10 for Chip Erase
tBUSY
tRB
RY/BY#
tVCS
VCCf
Notes:
1. SADD = sector address (for Sector Erase), VA = Valid Address for reading status data (see “Flash Write Operation Status”.
2. These waveforms are for the word mode.
Figure 21.
48
Chip/Sector Erase Operation Timings
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
FLASH AC CHARACTERISTICS
Addresses
tWC
tWC
tRC
Valid PA
Valid RA
tWC
Valid PA
Valid PA
tAH
tCPH
tACC
tCE
CE#f
tCP
tOE
OE#
tOEH
tGHWL
tWP
WE#
tDF
tWPH
tDS
tOH
tDH
Valid
Out
Valid
In
Data
Valid
In
Valid
In
tSR/W
WE# Controlled Write Cycle
Read Cycle
Figure 22.
CE#f Controlled Write Cycles
Back-to-back Read/Write Cycle Timings
tRC
Addresses
VA
VA
VA
tACC
tCE
CE#f
tCH
tOE
OE#
tOEH
tDF
WE#
tOH
High Z
DQ7
Complement
Complement
DQ6–DQ0
Status Data
Status Data
True
Valid Data
High Z
True
Valid Data
tBUSY
RY/BY#
Note: VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data
read cycle.
Figure 23.
October 7, 2003
Data# Polling Timings (During Embedded Algorithms)
Am50DL128BH
49
A D V A N C E
I N F O R M A T I O N
FLASH AC CHARACTERISTICS
tAHT
tAS
Addresses
tAHT
tASO
CE#f
tCEPH
tOEH
WE#
tOEPH
OE#
tDH
DQ6/DQ2
tOE
Valid
Status
Valid
Status
Valid
Status
(first read)
(second read)
(stops toggling)
Valid Data
Valid Data
RY/BY#
Note: VA = Valid address; not required for DQ6. Illustration shows first two status cycle after command sequence, last status
read cycle, and array data read cycle.
Figure 24.
Enter
Embedded
Erasing
WE#
Erase
Suspend
Erase
Toggle Bit Timings (During Embedded Algorithms)
Enter Erase
Suspend Program
Erase Suspend
Read
Erase
Suspend
Program
Erase
Resume
Erase Suspend
Read
Erase
Erase
Complete
DQ6
DQ2
Note: DQ2 toggles only when read at an address within an erase-suspended sector. The system may use OE# or CE#f to
toggle DQ2 and DQ6.
Figure 25.
50
DQ2 vs. DQ6
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
FLASH AC CHARACTERISTICS
Temporary Sector Unprotect
Parameter
JEDEC
Std
Description
All Speed Options
Unit
tVIDR
VID Rise and Fall Time (See Note)
Min
500
ns
tVHH
VHH Rise and Fall Time (See Note)
Min
250
ns
tRSP
RESET# Setup Time for Temporary Sector
Unprotect
Min
4
µs
tRRB
RESET# Hold Time from RY/BY# High for
Temporary Sector Unprotect
Min
4
µs
Note: Not 100% tested.
VID
RESET#
VID
VSS, VIL,
or VIH
VSS, VIL,
or VIH
tVIDR
tVIDR
Program or Erase Command Sequence
CE#f
WE#
tRRB
tRSP
RY/BY#
Figure 26.
October 7, 2003
Temporary Sector Unprotect Timing Diagram
Am50DL128BH
51
A D V A N C E
I N F O R M A T I O N
FLASH AC CHARACTERISTICS
VID
VIH
RESET#
SADD,
A6, A1, A0
Valid*
Valid*
Sector/Sector Block Protect or Unprotect
Data
60h
60h
Valid*
Verify
40h
Status
Sector/Sector Block Protect: 150 µs,
Sector/Sector Block Unprotect: 15 ms
1 µs
CE#f
WE#
OE#
* For sector protect, A6 = 0, A1 = 1, A0 = 0. For sector unprotect, A6 = 1, A1 = 1, A0 = 0, SADD = Sector Address.
Figure 27. Sector/Sector Block Protect and
Unprotect Timing Diagram
52
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
FLASH AC CHARACTERISTICS
Alternate CE#f Controlled Erase and Program Operations
Parameter
Speed
JEDEC
Std
Description
56
70
85
Unit
tAVAV
tWC
Write Cycle Time (Note 1)
Min
55
70
85
ns
tAVWL
tAS
Address Setup Time
Min
tELAX
tAH
Address Hold Time
Min
30
40
45
ns
tDVEH
tDS
Data Setup Time
Min
30
40
45
ns
tEHDX
tDH
Data Hold Time
Min
0
ns
tGHEL
tGHEL
Read Recovery Time Before Write
(OE# High to WE# Low)
Min
0
ns
tWLEL
tWS
WE# Setup Time
Min
0
ns
tEHWH
tWH
WE# Hold Time
Min
0
ns
tELEH
tCP
CE#f Pulse Width
Min
25
tEHEL
tCPH
CE#f Pulse Width High
Min
25
tWHWH1
tWHWH1
Programming Operation
(Note 2)
tWHWH1
tWHWH1
tWHWH2
tWHWH2
0
ns
40
45
30
ns
ns
Byte
Typ
5
Word
Typ
7
Accelerated Programming Operation,
Word or Byte (Note 2)
Typ
4
µs
Sector Erase Operation (Note 2)
Typ
0.4
sec
µs
Notes:
1. Not 100% tested.
2. See the “Flash Erase And Programming Performance” section for more information.
October 7, 2003
Am50DL128BH
53
A D V A N C E
I N F O R M A T I O N
FLASH AC CHARACTERISTICS
555 for program
2AA for erase
PA for program
SADD for sector erase
555 for chip erase
Data# Polling
Addresses
PA
tWC
tAS
tAH
tWH
WE#
tGHEL
OE#
tWHWH1 or 2
tCP
CE#f
tWS
tCPH
tBUSY
tDS
tDH
DQ7#
Data
tRH
A0 for program
55 for erase
DOUT
PD for program
30 for sector erase
10 for chip erase
RESET#
RY/BY#
Notes:
1. Figure indicates last two bus cycles of a program or erase operation.
2. PA = program address, SADD = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. DOUT is the data written to the device.
4. Waveforms are for the word mode.
Figure 28.
54
Flash Alternate CE#f Controlled Write (Erase/Program) Operation Timings
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
pSRAM AC CHARACTERISTICS
Read Cycle
Parameter
Symbol
Speed
Description
56, 70
85
Unit
tRC
Read Cycle Time
Min
70
85
ns
tACC
Address Access Time
Max
70
85
ns
tCO
Chip Enable Access Time
Max
70
tOE
Output Enable Access Time
Max
25
ns
tBA
Data Byte Control Access Time
Max
25
ns
tCOE
Chip Enable Low to Output Active
Min
10
ns
tOEE
Output Enable Low to Output Active
Min
0
ns
tBE
Data Byte Control Low to Output Active
Min
0
ns
tOD
Chip Enable High to Output High-Z
Max
20
ns
tODO
Output Enable High to Output High-Z
Max
20
ns
85
ns
tBD
Data Byte Control High to Output High-Z
Max
20
ns
tOH
Output Data Hold from Address Change
Min
10
ns
tPM
Page Mode Time
Min
70
ns
tPC
Page Mode Cycle Time
Min
30
ns
tAA
Page Mode Address Access Time
Max
30
ns
Page Output Data Hold Time
Min
10
ns
tAOH
tRC
Addresses
A20 to A0
tACC
tOH
tCO
CE#1s
Fixed High
CE2s
tOD
tOE
OE#
tODO
WE#
tBA
LB#, UB#
DOUT
DQ15 to DQ0
tBE
tOEE
High-Z
tBD
Indeterminate
High-Z
Valid Data Out
tCOE
Notes:
1. tOD, tODo, tBD, and tODW are defined as the time at which
the outputs achieve the open circuit condition and are
not referenced to output voltage levels.
3. If CE#, LB#, or UB# goes low at the same time or after WE#
goes low, the outputs will remain at high impedance.
2. If CE#, LB#, or UB# goes low at the same time or before
WE# goes high, the outputs will remain at high impedance.
Figure 29.
October 7, 2003
Psuedo SRAM Read Cycle
Am50DL128BH
55
A D V A N C E
I N F O R M A T I O N
pSRAM AC CHARACTERISTICS
tPM
Addresses
A2 to A0
tRC
tPC
tPC
tPC
Addresses
A20 to A3
CE#1s
Fixed High
CE2s
OE#
WE#
LB#, UB#
tOD
tOE
tBA
tBD
tOEE
tAOH
tAOH
tAOH
tBE
DOUT
DQ15 to DQ0
tCOE
tCO
tACC
DOUT
DOUT
tAA
DOUT
tAA
tOH
DOUT
tAA
tODO
Maximum 8 words
Figure 30.
Page Read Timing
Notes:
1. tOD, tODo, tBD, and tODW are defined as the time at which
the outputs achieve the open circuit condition and are
not referenced to output voltage levels.
3. If CE#, LB#, or UB# goes low at the same time or after WE#
goes low, the outputs will remain at high impedance.
2. If CE#, LB#, or UB# goes low at the same time or before
WE# goes high, the outputs will remain at high impedance.
56
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
pSRAM AC CHARACTERISTICS
Write Cycle
Parameter
Symbol
Speed
Description
tWC
Write Cycle Time
Min
56, 70
85
70
85
Unit
ns
tWP
Write Pulse Time
Min
50
60
ns
tCW
Chip Enable to End of Write
Min
60
70
ns
tBW
Data Byte Control to End of Write
Min
60
70
ns
tAW
Address Valid to End of Write
Min
60
70
ns
tAS
Address Setup Time
Min
0
ns
tWR
Write Recovery Time
Min
0
ns
tODW
WE# Low to Write to Output High-Z
Max
20
ns
tOEW
ns
WE# High to Write to Output Active
Min
0
tDS
Data Set-up Time
Min
30
tDH
Data Hold from Write Time
Min
0
ns
tCH
CE2 Hold Time
Min
300
µs
tCEH
Chip Enable High Pulse Width
Min
10
ns
tWEH
Write Enable High Pulse Width
Min
6
ns
tWC
Addresses
A20 to A0
tAS
tWR
tWP
WE#
tCW
CE#1s
tCH
CE2s
tBW
LB#, UB#
(Note 3)
tODW
DOUT
DQ15 to DQO
tOEW
tDS
DIN
DQ15 to DQ0
(Note 4)
High-Z
(Note 1)
tDH
Valid Data In
Notes:
1. If the device is using the I/Os to output data, input signals of reverse polarity must not be applied.
2. If OE# is high during the write cycle, the outputs will remain at high impedance.
3. If CE#1ps, LB# or UB# goes low at the same time or after WE# goes low, the outputs will remain at high impedance.
4. If CE#1ps, LB# or UB# goes high at the same time or before WE# goes high, the outputs will remain at high impedance.
Figure 31.
October 7, 2003
Pseudo SRAM Write Cycle—WE# Control
Am50DL128BH
57
A D V A N C E
I N F O R M A T I O N
pSRAM AC CHARACTERISTICS
tWC
Addresses
A20 to A0
tAS
tWP
tWR
WE#
tCW
tCEH
CE#1ps
tCH
CE2ps
tBW
LB#, UB#
tBE
DOUT
DQ15 to DQ0
tODW
High-Z
High-Z
tCOE
tDS
DIN
DQ15 to DQ0
(Note 1)
tDH
Valid Data In
(Note 1)
Notes:
1. If the device is using the I/Os to output data, input signals of reverse polarity must not be applied.
2. If OE# is high during the write cycle, the outputs will remain at high impedance.
Figure 32.
58
Pseudo SRAM Write Cycle—CE#1ps Control
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
pSRAM AC CHARACTERISTICS
tWC
Addresses
A20 to A0
tAS
tWP
tWR
WE#
tCW
CE#1s
tCH
CE2s
tBW
UB#, LB#
tCOE
tODW
DOUT
DQ15 to DQ0
High-Z
tBE
High-Z
tDS
DIN
DQ15 to DQ0
tDH
Valid Data In
(Note 1)
Notes:
1. If the device is using the I/Os to output data, input signals of reverse polarity must not be applied.
2. If OE# is high during the write cycle, the outputs will remain at high impedance.
Figure 33. Pseudo SRAM Write Cycle—
UB#s and LB#s Control
October 7, 2003
Am50DL128BH
59
A D V A N C E
I N F O R M A T I O N
FLASH ERASE AND PROGRAMMING PERFORMANCE
Parameter
Typ (Note 1)
Max (Note 2)
Unit
Comments
Sector Erase Time
0.4
5
sec
Chip Erase Time
56
Excludes 00h programming
prior to erasure (Note 4)
Byte Program Time
5
150
µs
Accelerated Byte/Word Program Time
4
120
µs
Accelerated Chip Programming Time
10
30
sec
Word Program Time
7
210
µs
Byte Mode
42
126
Word Mode
28
84
Chip Program Time
(Note 3)
sec
Excludes system level
overhead (Note 5)
sec
Notes:
1. Typical program and erase times assume the following conditions: 25°C, 3.0 V VCC, 1,000,000 cycles. Additionally,
programming typicals assume checkerboard pattern.
2. Under worst case conditions of 90°C, VCC = 2.7 V, 1,000,000 cycles.
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes
program faster than the maximum program times listed.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Table
12 for further information on command definitions.
6. The device has a minimum erase and program cycle endurance of 1,000,000 cycles.
LATCHUP CHARACTERISTICS
Description
Min
Max
Input voltage with respect to VSS on all pins except I/O pins
(including A9, OE#, and RESET#)
–1.0 V
12.5 V
Input voltage with respect to VSS on all I/O pins
–1.0 V
VCC + 1.0 V
–100 mA
+100 mA
VCC Current
Note: Includes all pins except VCC. Test conditions: VCC = 3.0 V, one pin at a time.
PACKAGE PIN CAPACITANCE
Parameter
Symbol
CIN
Parameter Description
Input Capacitance
Test Setup
Typ
Max
Unit
VIN = 0
11
14
pF
VOUT = 0
12
16
pF
COUT
Output Capacitance
CIN2
Control Pin Capacitance
VIN = 0
14
16
pF
CIN3
WP#/ACC Pin Capacitance
VIN = 0
17
20
pF
Notes:
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0 MHz.
60
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
FLASH DATA RETENTION
Parameter Description
Test Conditions
Min
Unit
150°C
10
Years
125°C
20
Years
Minimum Pattern Data Retention Time
October 7, 2003
Am50DL128BH
61
A D V A N C E
I N F O R M A T I O N
pSRAM DATA RETENTION
Parameter
Symbol
Parameter Description
Min
Test Setup
Typ
Max
Unit
3.3
V
70
µA
VDR
VCC for Data Retention
CS1#s ≥ VCC – 0.2 V (Note 1)
IDR
Data Retention Current
VCC = 3.0 V, CE1#s ≥ VCC – 0.2 V
(Note 1)
tCS
CE2 Setup Time
0
ns
tCH
CE2 Hold Time
300
µs
tDPD
CE2 Pulse Width
10
ms
tCHC
CE2 Hold from CE#1
0
ns
tCHP
CE2 Hold from Power On
30
µs
2.7
1.0
(Note 2)
Notes:
1. CE1#s ≥ VCC – 0.2 V, CE2s ≥ VCC – 0.2 V (CE1#s controlled) or CE2s ≤ 0.2 V (CE2s controlled).
2. Typical values are not 100% tested.
pSRAM POWER ON AND DEEP POWER DOWN
CE#1s
tDPD
CE#2s
tCS
tCH
Figure 34.
Deep Power-down Timing
Note: Data cannot be retained during deep power-down standby mode.
VDD
VDD min
tCHC
CE#1s
CE#2s
tCHP
tCH
Figure 35.
62
Power-on Timing
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
pSRAM ADDRESS SKEW
over 10 µs
CE#1s
WE#
Address
tRC min
Figure 36.
Read Address Skew
Note: If multiple invalid address cycles shorter than tRC min occur for a period greater than 10 µs, at least one valid address
cycle over tRC min is required during that period.
over 10 µs
CE#1s
tWP min
WE#
Address
tWC min
Figure 37.
Write Address Skew
Note: If multiple invalid address cycles shorter than tWC min occur for a period greater than 10 µs, at least one valid address
cycle over tWC min, in addition to tWP min, is required during that period.
October 7, 2003
Am50DL128BH
63
A D V A N C E
I N F O R M A T I O N
PHYSICAL DIMENSIONS
FTA073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm
D1
A
D
eD
0.15 C
10
(2X)
9
8
SE 7
7
6
E
E1
5
4
eE
3
2
1
INDEX MARK
PIN A1
CORNER
M
B
10
TOP VIEW
L
K
J
H
G
F
E
D
C B
A
PIN A1
CORNER
7
SD
0.15 C
(2X)
BOTTOM VIEW
0.20 C
A A2
A1
C
73X
0.08 C
SIDE VIEW
6
b
0.15 M
0.08 M
C A B
C
NOTES:
PACKAGE
JEDEC
SYMBOL
FTA 073
N/A
11.60 mm x 8.00 mm
PACKAGE
MIN.
NOM.
MAX.
NOTE
A
---
---
1.40
PROFILE
A1
0.25
---
---
BALL HEIGHT
A2
1.00
---
1.11
BODY THICKNESS
D
11.60 BSC.
BODY SIZE
E
8.00 BSC.
8.80 BSC.
BODY SIZE
MATRIX FOOTPRINT
MD
7.20 BSC.
12
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
D1
E1
73
n
Ob
0.30
0.35
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
BALL COUNT
0.40
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
BALL DIAMETER
eE
0.80 BSC
BALL PITCH
eD
0.80 BSC
BALL PITCH
0.40 BSC
SOLDER BALL PLACEMENT
SD/SE
1.
A2,A3,A4,A5,A6,A7,A8,A9
B2,B3,B4,B7,B8,B9,C2,C9,C10
D1,D10,E1,E10,F5,F6,G5,G6
H1,H10,J1,J10,K1,K2,K9,K10
L2,L3,L4,L7,L8,L9
M2,M3,M4,M5,M6,M7,M8,M9
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
DEPOPULATED SOLDER BALL
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTION OR OTHER MEANS.
3159\38.14b
64
Am50DL128BH
October 7, 2003
A D V A N C E
I N F O R M A T I O N
REVISION SUMMARY
Revision A (September 23, 2003)
Revision A+1 (October 7, 2003)
Initial release.
ESD
Added ESD Disclaimer.
Trademarks
Copyright © 2003 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
ExpressFlash is a trademark of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
October 7, 2003
Am50DL128BH
65
A D V A N C E
66
I N F O R M A T I O N
Am50DL128BH
October 7, 2003