AVAGO HFBR-782BEPZ Pluggable parallel fiber optic modules, transmitter and receiver low cost per gb/ Datasheet

HFBR-772BWZ/BEWZ/BHWZ/BEPWZ and
HFBR-782BZ/BEZ/BHZ/BEPZ
Pluggable Parallel Fiber Optic Modules,
Transmitter and Receiver
Data Sheet
Description
The HFBR-772BWZ transmitter and HFBR-782BZ receiver
are high performance fiber optic modules for parallel optical data communication applications. These 12-channel
devices, operating up to 2.7 Gbd per channel, provide a
cost effective solution for short-reach applications requiring up to 32 Gb/s aggregate bandwidth. These modules
are designed to operate on multimode fiber systems at
a nominal wavelength of 850 nm. They incorporate high
performance, highly reliable, short wavelength optical
devices coupled with proven circuit technology to provide long life and consistent service.
The HFBR-772BWZ transmitter module incorporates a
12- channel VCSEL (Vertical Cavity Surface Emitting Laser) array together with a custom 12-channel laser driver
integrated circuit providing IEC-60825 and CDRH Class
1M laser eye safety.
The HFBR-782BZ receiver module contains a 12-channel
PIN photodiode array coupled with a custom preamplifier
/ post amplifier integrated circuit.
Features
• RoHS Compliant
• Low cost per Gb/s
• High package density per Gb/s
• 3.3 volt power supply for low power consumption
• 850 nm VCSEL array source
• 12 independent channels per module
• Separate transmitter and receiver modules
• 2.7 Gbd data rate per channel
• Standard MTP® (MPO) ribbon fiber connector interface
• Pluggable package
• 50/125 micron multimode fiber operation:
•
•
•
Distance up to 300 m with 500 MHz.km fiber at 2.5 Gbd
Distance up to 600 m with 2000 MHz.km fiber at 2.5 Gbd
Data I/O is CML compatible
Control I/O is LVTTL compatible
Manufactured in an ISO 9002 certified facility
Ordering Information
Operating from a single +3.3 V power supply, both modules provide LVTTL or LVCMOS control interfaces and
Current Mode Logic (CML) compatible data interfaces to
simplify external circuitry.
The HFBR-772BWZ and HFBR-782BZ products are available
for production orders through the Avago Component Field
Sales office.
HFBR-772BWZ
No EMI Nose Shield
The transmitter and receiver devices are housed in MTP®/
MPO receptacled packages. Electrical connections to the
devices are achieved by means of a pluggable 10 x 10
connector array.
HFBR-782BZ
No EMI Nose Shield
HFBR-772BEWZ
With Extended EMI Nose Shield
HFBR-782BEZ
With Extended EMI Nose Shield
HFBR-772BHWZ
No Heatsink, No EMI Nose Shield
HFBR-782BHZ
No Heatsink, No Nose Shield
HFBR-772BEPWZ
With Extended EMI Nose Shield,
With “flush pin-fin” Heatsink
HFBR-782BEPZ
With Extended EMI Nose Shield,
With “flush pin-fin” Heatsink
Applications
• Datacom switch and router backplane connections
• Telecom switch and router backplane connections
• InfiniBand connections
Patent - www.avagotech.com/patents
Design Summary:
Functional Description, Receiver Section
Design for low-cost, high-volume manufacturing
The receiver section, Figure 2, contains a 12-channel
AlGaAs/ GaAs photodetector array, transimpedance
preamplifier, filter, gain stages to amplify and buffer the
signal, and a quantizer to shape the signal.
Avago’s parallel optics solution combines twelve 2.7 Gbd
channels into discrete transmitter and receiver modules
providing a maximum aggregate data rate of 32 Gb/s.
Moreover, these modules employ a heat sink for thermal
management when used on high-density cards, have excellent EMI performance, and interface with the industry
standard MTP®/MPO connector systems. They provide the
most cost-effective high- density (Gbd per inch) solutions
for high-data capacity applications. See Figure 1 for the
transmitter and Figure 2 for the receiver block diagrams.
The HFBR-772BWZ transmitter and the HFBR-782BZ receiver modules provide very closely spaced, high-speed
parallel data channels. Within these modules there will be
some level of cross talk between channels. The cross talk
within the modules will be exhibited as additional data
jitter or sensitivity reduction compared to single-channel
performance. Avago Technologies’ jitter and sensitivity
specifications include cross talk penalties and thus represent real, achievable module performance.
Functional Description, Transmitter Section
The transmitter section, Figure 1, uses a 12-channel 850
nm VCSEL array as the optical source and a diffractive optical lens array to launch the beam of light into the fiber.
The package and connector system are designed to allow
repeatable coupling into standard 12-fiber ribbon cable.
In addition, this module has been designed to be compliant with IEC 60825 Class 1 eye safety requirements.
The optical output is controlled by a custom IC, which
provides proper laser drive parameters and monitors
drive current to ensure eye safety. An EEPROM and state
machine are programmed to provide both ac and dc current drive to the laser to ensure correct modulation, eye
diagram and extinction ratio over variations of temperature and power supply voltages.
The Signal Detect function is designed to sense the
proper optical output signal on each of the 12 channels.
If loss of signal is detected on an individual channel, that
channel output is squelched.
Packaging
The flexible electronic subassembly was designed to
allow high-volume assembly and test of the VCSEL, PIN
photo diode and supporting electronics prior to final
assembly.
Regulatory Compliance
The overall equipment design into which the parallel
optics module is mounted will determine the certification level. The module performance is offered as a figure
of merit to assist the designer in considering their use in
the equipment design.
Organization Recognition
See the Regulatory Compliance Table for a listing of the
standards, standards associations and testing laboratories
applicable to this product.
Electrostatic Discharge (ESD)
There are two design cases in which immunity to ESD
damage is important.
The first case is during handling of the module prior to
mounting it on the circuit board. It is important to use
normal ESD handling precautions for ESD sensitive devices. These precautions include using grounded wrist
straps, work benches, and floor mats in ESD controlled
areas.
The second case to consider is static discharges to the
exterior of the equipment chassis containing the module parts. To the extent that the MTP® (MPO) connector
receptacle is exposed to the outside of the equipment
chassis it may be subject to system level ESD test criteria
that the equipment is intended to meet.
See the Regulatory Compliance Table for further details.
2
COMPARATOR
SHUT
DOWN
DIN+
DIN-
SERIAL
CONTROL
I/O*
AMPLIFIER
D/A
CONVERTER
12
INPUT
STAGE
12
4
LEVEL
SHIFTER
CONTROLLER
12
DRIVER
VCSEL ARRAY
D/A
CONVERTER
TEMPERATURE
DETECTION
CIRCUIT
Figure 1. Transmitter block diagram.
* TX_EN, TX_DIS, RESET-, FAULT-
OFFSET CONTROL
PIN
DOUT+
TRANS-IMPEDANCE
PRE-AMPLIFIER
LIMITING
AMPLIFIER
OUTPUT BUFFER
DOUT-
SIGNAL DETECT
CIRCUIT
Figure 2. Receiver block diagram (each channel).
3
SD
Electromagnetic Interference (EMI)
Connector Cleaning
Many equipment designs using these high-data-rate
modules will be required to meet the requirements of
the FCC in the United States, CENELEC in Europe and
VCCI in Japan. These modules, with their shielded design,
perform to the levels detailed in the Regulatory Compliance Table. The performance detailed in the Regulatory
Compliance Table is intended to assist the equipment designer in the management of the overall equipment EMI
performance. However, system margins are dependent
on the customer board and chassis design.
The optical connector used is the MTP® (MPO). The optical ports have recessed optics that are visible through
the nose of the ports. The provided port plug should
be installed any time a fiber cable is not connected. The
port plug ensures the optics remain clean and no cleaning should be necessary. In the event the optics become
contaminated, forced nitrogen or clean dry air at less
than 20 psi is the recommended cleaning agent. The
optical port features, including guide pins, preclude use
of any solid instrument. Liquids are not advised due to
potential damage.
Immunity
Equipment using these modules will be subject to radio
frequency electromagnetic fields in some environments. These modules have good immunity due to their
shielded designs. See the Regulatory Compliance Table
for further detail.
Eye Safety
These 850 nm VCSEL-based modules provide eye safety
by design. The HFBR-772BWZ has been registered with
CDRH and certified by TUV as a Class 1M device under
Amendment 2 of IEC 60825-1. See the Regulatory Compliance Table for further detail. If Class 1M exposure is
possible, a safety-warning label should be placed on the
product stating the following:
LASER RADIATION
DO NOT VIEW DIRECTLY WITH
OPTICAL INSTRUMENTS
CLASS 1M LASER PRODUCT
4
Process Plug
Each parallel optics module is supplied with an inserted
process plug for protection of the optical ports within the
MTP® (MPO) connector receptacle.
Handling Precautions
The HFBR-772BWZ and HFBR-782BZ can be damaged by
current surges and overvoltage conditions. Power supply
transient precautions should be taken. Application of
wave soldering, reflow soldering and/or aqueous wash
processes with the parallel optic device on board is not
recommended as damage may occur.
Normal handling precautions for electrostatic sensitive
devices should be taken (see ESD section).
The HFBR-772BWZ is a Class 1M laser product.
DO NOT VIEW RADIATION DIRECTLY WITH OPTICAL INSTRUMENTS.
Absolute Maximum Ratings [1,2]
Parameter
Symbol
Min.
Max.
Unit
Reference
Storage Temperature
(non-operating)
TS
–40
100
°C
1
Case Temperature (operating)
TC
90
°C
1, 2, 4
Supply Voltage
VCC
–0.5
4.6
V
1, 2
Data/Control Signal Input Voltage
VI
–0.5
VCC + 0.5
V
1
Transmitter Differential Data Input
Voltage
|VD|
2
V
1, 3
Output Current (dc)
ID
25
mA
1
95
%
1
Relative Humidity (non-condensing) RH
5
Notes:
1. Absolute Maximum Ratings are those values beyond which damage to the device may occur. See Reliability Data Sheet for specific reliability
performance.
2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability
is not implied, and damage to the device may occur over an extended period of time.
3. This is the maximum voltage that can be applied across the Transmitter Differential Data Inputs without damaging the input circuit.
4. Case Temperature is measured as indicated in Figure 3.
Recommended Operating Conditions [1]
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Case Temperature
TC
0
40
80
°C
2, Figs. 3
Supply Voltage
VCC
3.135
3.3
3.465
V
Figs. 5, 6,
12
1
2.7
Gbd
3
4, Figs. 7, 8
Signaling Rate per Channel
Data Input Differential
Peak-to-Peak Voltage Swing
DVDINP-P
175
1400
mVP-P
Control Input Voltage High
VIH
2.0
VCC
V
Control Input Voltage Low
VIL
VEE
0.8
V
Power Supply Noise
for Transmitter and Receiver
NP
200
mVP-P
5, Figs. 5, 6
Transmitter/Receiver Data
I/O Coupling Capacitors
CAC
0.1
mF
Fig. 7
Receiver Differential Data
Output Load
RDL
100
W
Fig. 7
Notes:
1. Recommended Operating Conditions are those values outside of which functional performance is not intended, device reliability is not implied, and damage to the device may occur over an extended period of time. See Reliability Data Sheet for specific reliability performance.
2. Case Temperature is measured as indicated in Figure 3.
3. The receiver has a lower cut off frequency near 100 kHz.
4. Data inputs are CML compatible. Coupling capacitors are required to block DC. ∆VDINP-P = ∆VDINH – ∆VDINL, where ∆VDINH = High State Differential Data Input Voltage and ∆VDINL = Low State Differential Data Input Voltage.
5. Power Supply Noise is defined for the supply, VCC, over the frequency range from 500 Hz to 2500 MHz, with the recommended power supply
filter in place, at the supply side of the recommended filter. See Figures 5 and 6 for recommended power supply filters.
5
Electrical Characteristics
Transmitter Electrical Characteristics
(TC = 0 °C to +80 °C, VCC = 3.3 V ± 5%, Typical TC = +40 °C, VCC = 3.3 V)
Typ.
Max.
Unit
Reference
(Conditions)
ICCT
320
415
mA
Fig. 6
Power Dissipation
PDIST
1.1
1.45
W
Differential Input Impedance
Zin
100
120
W
1, Fig. 7, 11
FAULT Assert Time
TOFF
200
250
ms
Fig. 13
RESET Assert Time
TOFF
5
7.5
ms
Fig. 14
RESET De-assert Time
TON
55
100
ms
Fig. 14
Transmit Enable (TX_EN) Assert Time
TON
55
100
ms
Fig. 15
Transmit Enable (TX_EN) De-assert Time
TOFF
5
7.5
ms
2, Fig. 15
Transmit Disable (TX_DIS) Assert Time
TOFF
5
7.5
ms
Fig. 15
Transmit Disable (TX_DIS) De-assert Time
TON
55
100
ms
Fig. 15
Power On Initiation Time
TINT
60
100
ms
Fig. 12
Control I/Os
(TX_EN, TX_DIS
FAULT, RESET)
Compatible
|Input Current High |
|IIH|
0.5
mA
(2.0 V < VIH < VCC)
| Input Current Lo w|
|IIL|
0.5
mA
(VEE < VIL < 0.8 V)
Output Voltage Low
VOL
VEE
0.4
V
(IOL = 4.0 mA)
Output Voltage High
VOH
2.5
VCC
V
(IOH = –0.5 mA)
Parameter
Symbol
Supply Current
Min.
80
3.3
Notes:
1. Differential impedance is measured between DIN+and DIN– over the range 4 MHz to 2 GHz.
2. When the control signal Transmitter Enable, Tx_EN, is used to disable the transmitter, Tx_EN must be taken to a logic low-state level (VIL) for
one millisecond or longer. Similarly, if the control signal Transmitter Disable, Tx_DIS, is used, then Tx_DIS must be taken to a logic high- state
level (VIH) for one millisecond or longer.
6
Receiver Electrical Characteristics
(TC = 0 °C to +80 °C, VCC = 3.3 V ± 5%, Typical TC = +40 °C, VCC = 3.3 V)
Typ.
Max.
Unit
Reference
(Conditions)
ICCR
400
445
mA
1, Fig. 5
Power Dissipation
PDISR
1.3
1.55
W
Differential Output Impedance
ZOUT
80
100
120
W
2, Fig. 8, 10
Data Output Differential
Peak-to-Peak Voltage Swing
DVDOUTP-P
450
600
750
mVP-P
3, Figs. 7, 8
100
150
ps
4
150
ps
5
µs
µs
6
7
V
V
(IOL = 4.0 mA)
(IOH = -0.5 mA)
Parameter
Symbol
Supply Current
Min.
Inter-channel Skew
Differential Data Output Rise/Fall Time
tr/tf
110
Signal Detect
Assert Time (OFF-to-ON)
De-assert Time (ON-to-OFF)
tSDA
tSDD
170
190
Control I/O
Output Voltage LowLVTTL & LVCMOS
Output Voltage HighCompatible
VOL
VOH
VEE
2.5
3.1
0.4
VCC
Notes:
1. ICCR is the dc supply current, dependent upon the number of active channels, where the Data Outputs are ac coupled with capacitors between the outputs and any resistive terminations. See Figure 7 for recommended termination.
2. Measured over the range 4 MHz to 2 GHz.
3. DVDOUTP-P = DVDOUTH – DVDOUTL, where DVDOUTH = High State Differential Data Output Voltage and DVDOUTL = Low State Differential Data
Output Voltage. DVDOUTH and DVDOUTL = VDOUT+ – VDOUT–, measured with a 100 W differential load connected with the recommended coupling capacitors and with a 2500 MBd, 8B10B serial encoded data pattern.
4. Inter-channel Skew is defined for the condition of equal amplitude, zero ps skew input signals. Input power at –10 dBm.
5. Rise and Fall Times are measured between the 20% and 80% levels using a 500 MHz square wave signal.
6. The Signal Detect output will change from logic “0” (Low) to “1” (High) within the specified assert time for a step transition in optical input
power from the de-asserted condition to the specified asserted optical power level on all 12 channels.
7. The Signal Detect output will change from logic “1” (High) to “0” (Low) within the specified de-assert time for a step transition in optical input
power from the specified asserted optical power level to the de-asserted condition on any 1 channel.
7
Optical Characteristics
Transmitter Optical Characteristics
(TC = 0 °C to +80 °C, VCC = 3.3 V ± 5%, Typical TC = +40 °C, VCC = 3.3 V)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Output Optical Power
POUT
–8
–4
–2
dBm avg.
1
Output Optical Power – Off State
POUT DIS
–30
dBm avg.
Extinction Ratio
Output Power -2 to -8 dBm
ER
6
7
Center Wavelength
lC
830
850
860
nm
Spectral Width – rms
s
0.4
0.85
nm rms
Rise/Fall Time
tr/tf
50
100
ps
3
110
200
ps
4
–124
dB/Hz
60
120
psp-p
psp-p
Inter-channel Skew
Relative Intensity Noise
RIN
Jitter Contribution
Deterministic
Total
DJ
TJ
20
60
dB
2
5
6
Notes:
1. The specified optical output power, measured at the output of a short test cable, will be compliant with IEC 60825-1 Amendment 2, Class
1 Accessible Emission Limits, AEL, and the output power of the module without an attached cable will be compliant with the IEC 60825-1
Amendment 2, Class 1M AEL. See discussion in the Regulatory Compliance section.
2. Extinction Ratio is defined as the ratio of the average output optical power of the transmitter in the high (“1”) state to the low (“0”) state and
is expressed in decibels (dB) by the relationship 10log(Phigh avg/Plow avg). The transmitter is driven with a 550 MBaud, 27-1 PRBS serial encoded pattern.
3. These are filtered rise/fall time measurements as defined in IEEE Gb Ethernet specification using a 2.488GBd (1.875 GHz bandwidth) 4th Bessel Thompson filter. A max spec of 100ps for unfiltered waveform is equivalent to a max spec 215ps for filtered waveform.
4. Inter-channel Skew is defined for the condition of equal amplitude, zero ps skew input signals.
5. Deterministic Jitter (DJ) is defined as the combination of Duty Cycle Distortion (Pulse-Width Distortion) and Data Dependent Jitter. Deterministic Jitter is measured at the 50% signal threshold level using a 2.5 GBd Pseudo Random Bit Sequence of length 223 – 1 (PRBS), or equivalent,
test pattern with zero skew between the differential data input signals.
6. Total Jitter (TJ) includes Deterministic Jitter and Random Jitter (RJ). Total Jitter is specified at a BER of 10-12 for the same 2.5 GBd test pattern
as for DJ.
8
Receiver Optical Characteristics
(TC = 0 °C to +80 °C, VCC = 3.3 V ± 5%, Typical TC = +40 °C, VCC = 3.3 V)
Parameter
Symbol
Min.
Input Optical Power Sensitivity
PIN MIN
Input Optical Power Saturation
PIN MAX
–2
Operating Center Wavelength
lC
830
Stressed Receiver Sensitivity
Typ.
Max.
Unit
Reference
–18.5
-16
dBm avg.
1
dBm avg.
2
–1
–15.5
860
nm
-11.3
dBm
3
Stressed Receiver Eye Opening
120
190
ps
4
Return Loss
12
19
dB
5
-31
0.5
-19
-21
2
dBm avg.
dBm avg.
dB
6
Signal Detect
Asserted
De-asserted
Hysteresis
PA
PD
PA-PD
-17
Notes:
1. Sensitivity is defined as the average input power with the worst case, minimum, Extinction Ratio necessary to produce a BER of 10-12 at the
center of the Baud interval using a 2.5 GBd Pseudo Random Bit Sequence of length 223 – 1 (PRBS), or equivalent, test pattern. For this parameter, input power is equivalent to that provided by an ideal source, i.e., a source with RIN and switching attributes that do not degrade the
sensitivity measurement. All channels not under test are operating receiving data with an average input power up to 6 dB above PIN MIN.
2. Saturation is defined as the average input power that produces at the center of the output swing a receiver output eye width less than 120 ps
where BER < 10-12 using a 2.5 GBd Pseudo Random Bit Sequence of length 223 –1 (PRBS), or equivalent, test pattern.
3. Stressed receiver sensitivity is defined as the average input power necessary to produce a BER < 10-12 at the center of the Baud interval using
a 2.5 GBd Pseudo Random Bit Sequence of length 223 – 1 (PRBS), or equivalent, test pattern. For this parameter, input power is conditioned
with 2.5 dB Inter-Symbol Interference, ISI, (min), 33 ps Duty Cycle Dependent Deterministic Jitter, DCD DJ (min) and 6 dB ER (ER Penalty = 2.23
dB). All channels not under test are operating receiving data with an average input power up to 6 dB above PIN MIN.
4. Stressed receiver eye opening is defined as the receiver output eye width where BER < 10-12 at the center of the output swing using a 2.5 GBd
Pseudo Random Bit Sequence of length 223 – 1 (PRBS), or equivalent, test pattern. For this parameter, input power is an average input optical
power of –10.7 dBm and conditioned with 2.5 dB ISI (min), 33 ps DCD DJ (min), 6 dB ER (ER Penalty = 2.23 dB). All channels not under test are
operating receiving data with an average input power up to 6 dB above PIN MIN.
5. Return loss is defined as the ratio, in dB, of the received optical power to the optical power reflected back down the fiber.
6. Signal Detect assertion requires all optical inputs to exhibit a minimum 6 dB Extinction Ratio at PA = –17 dBm. All channels not under test are
operating with PRBS 23 serial encoded patterns, asynchronous with the channel under test, and an average input power up to 6 dB higher
than PIN MIN.
9
Regulatory Compliance Table
Feature
Test Method
Performance
Electrostatic Discharge
(ESD) to the Electrical
Pads
JEDEC Human Body Model (HBM)
(JESD22-A114-B)
Transmitter Module > 1000 V
Receiver Module > 2000 V
JEDEC Machine Model (MM)
Transmitter Module > 50 V
Receiver Module > 200 V
Electrostatic Discharge
(ESD) to the Connector
Receptacle
Variation of IEC 61000-4-2
Typically withstands at leasr 6 kV air discharge
(with module biased) without damage.
Electromagnetic Interference (EMI)
FCC Part 15 CENELEC EN55022
(CISPR 22A) VCCI Class 1
Typically pass with 10 dB margin. Actual performance dependent on enclosure design.
Immunity
Variation of IEC 61000-4-3
Typically minimal effect from a 10 v/m field
swept from 80 MHz to 1 GHz applied to the
module without a chassis enclosure.
Laser Eye Safety and
Equipment Type Testing
IEC 60825-1 Amendment 2
CFR 21 Section 1040
POUT: IEC AEL & US FDA CRDH Class 1M
CDRH Accession Number: 9720151-22
TUV Certficate Number: E2171095.04
Component Recognition
Underwriters Laboratories and Canadian StanUL File Number: E173874
dards Association Joint Component Recognition
for Information Technology Equipment including
Electrical Business Equipment
RoHS Complaince
10
Less than 1000ppm of Cadmium, lead, mercury,
hexavalent chromium, polybrominated biphenyls, and polybrominated biphenyl ethers
Table 1. Transmitter Module Pad Description
Symbol
Functional Description
VEE
Transmitter Signal Common. All voltages are referenced to this potential unless otherwise
indicated. Directly connect these pads to transmitter signal ground plane.
VCCT
Transmitter Power Supply. Use recommended power supply filter circuit in Figure 6.
DIN0+ through DIN11+
Transmitter Data In+ for channels 0 through 11, respectively. Differential termination and
self bias are included, see Figure 11.
DIN0– through DIN11–
Transmitter Data In- for channels 0 through 11, respectively. Differential termination and self
bias are included; see Figure 11.
TX_EN
TX Enable. Active high. Internal pull-up High = VCSEL array is enabled if TX_DIS is inactive
(Low).Low = VCSEL array is off. TX_EN must be taken to a logic low state level (VOL) for 1 ms
or longer.
TX_DIS
TX Disable. Active high. Internal pull-down Low = VCSEL array is enabled if TX_EN is active
(High).High = VCSEL array is off. TX_DIS must be taken to a logic High state level (VOH) for 1
ms or longer.
RESET-
Transmitter RESET- input. Active low. Internal pull-up. Low = Resets logic function clears
FAULT- signal, VCSEL array is off. high = Normal operation. See Figure 14.
FAULT-
Transmitter FAULT- output. Active low. Low (logic “0”) results from a VCSEL over-current condition, out of temperature range, or EEPROM calibration data corruption condition detected
for any VCSEL. An asserted (logic “0”) FAULT- disables the VCSEL array and is cleared by
RESET- or power cycling VCCT FAULT- is a single ended LVTTL compatible output.
DNC
Do not connect to any electrical potential.
Table 2. Receiver Module Pad Description
Symbol
Functional Description
VEE
Receiver Signal Common. All voltages are referenced to this potential unless otherwise
indicated.Directly connect these pads to receiver signal ground plane.
VCCR
Receiver Power Supply. Use recommended power supply filter circuit in Figure 5.
VPP
Not required for Avago product. Pads not internally connected.(Voltage for MSA compatibility in order to ac-couple receiver data outputs).
DOUT0+ through DOUT11+
Receiver Data Out+ for channels 0 through 11, respectively. Terminate these high-speed
differential CML outputs with standard CML techniques at the inputs of the receiving device.
Individual data outputs will be squelched for insufficient input signal level.
DOUT0– through DOUT11–
Receiver Data Out- for channel 0 through 11, respectively. Terminate these high-speed differential CML outputs with standard CML techniques at the inputs of the receiving device.
Individual data outputs will be squelched for insufficient input signal level.
SD
Signal Detect. Normal optical input levels to all channels results in a logic “1” output, VOH,
asserted. Low input optical levels to any channel results in a fault condition indicated by a
logic “0” output, VOL, de-asserted. SD is a single-ended LVTTL compatible output.
RX_EN
Receiver output enable. Active high (logic “1”), internal pull-up. Low (logic “0”) = receiver
outputs disabled, all outputs are high (logic “1”).
SQ_EN
Squelch enable input. Active high (logic “1”), internal pull-up. Low (logic “0”) = squelch disabled. When SQ_EN is high and SD is low, corresponding outputs are squelched.
EN_SD
Enable Signal Detect. Active high (logic “1”), internal pull-up. Low (logic “0”) = Signal detect
output forced active high.
DNC
Do not connect to any electrical potential.
11
TRANSMITTER MODULE PAD ASSIGNMENT
(TOWARD MTP® CONNECTOR)
J
I
H
G
F
E
D
C
B
A
1
DNC
DNC
DNC
V EE
V EE
V EE
V EE
V EE
V EE
DNC
2
DNC
DNC
DNC
V EE
V EE
DIN5+
V EE
V EE
DIN8+
V EE
3
DNC
V CCT
V CCT
V EE
DIN4+
DIN5-
V EE
DIN7+
DIN8-
V EE
4
DNC
V CCT
V CCT
DIN3+
DIN4-
V EE
DIN6+
DIN7-
V EE
DNC
5
DNC
V CCT
V CCT
DIN3-
V EE
DIN2+
DIN6-
V EE
DIN9-
V EE
6
DNC
V CCT
V CCT
V EE
DIN1+
DIN2-
V EE
DIN10-
DIN9+
V EE
7
DNC
DNC
DNC
DIN0+
DIN1-
V EE
DIN11- DIN10+
V EE
DNC
8
DNC
RESET-
FAULT-
DIN0-
V EE
V EE
DIN11+
V EE
V EE
DNC
9
DNC
TX_EN
TX_DIS
V EE
V EE
V EE
V EE
V EE
V EE
DNC
10
DNC
DNC
DNC
DNC
DNC
DNC
DNC
DNC
DNC
DNC
TOP VIEW (PCB LAYOUT)
(10 x 10 ARRAY)
12
RECEIVER MODULE PAD ASSIGNMENT
(TOWARD MTP® CONNECTOR)
J
I
H
G
F
E
D
C
B
A
1
V PP
DNC
DNC
V EE
V EE
V EE
V EE
V EE
V EE
DNC
2
V PP
DNC
DNC
V EE
V EE
DOUT5-
V EE
V EE
DOUT8-
V EE
3
DNC
V CCR
V CCR
V EE
DOUT4- DOUT5+
V EE
DOUT7- DOUT8+
V EE
4
DNC
V CCR
V CCR
DOUT3- DOUT4+
5
DNC
V CCR
V CCR
DOUT3+
6
DNC
V CCR
V CCR
V EE
7
DNC
DNC
SD
8
V PP
DNC
9
V PP
10 SQ_EN
V EE
V EE
DOUT6- DOUT7+
DOUT2- DOUT6+
DOUT1- DOUT2+
V EE
DNC
DOUT9+
V EE
DOUT10+ DOUT9-
V EE
V EE
DOUT0- DOUT1+
V EE
DOUT11+ DOUT10-
V EE
DNC
DNC
DOUT0+
V EE
V EE
DOUT11-
V EE
V EE
DNC
RX_EN
EN_SD
V EE
V EE
V EE
V EE
V EE
V EE
DNC
DNC
DNC
DNC
DNC
DNC
DNC
DNC
DNC
DNC
TOP VIEW (PCB LAYOUT)
(10 x 10 ARRAY)
13
V EE
Case Temperature
Measurement Point
Figure 3. Case temperature measurement point (label and heatsink removed for clarity)
Case to Ambient Thermal Resistance (C/W)
25.0
No heatsink
Heatsink
20.0
15.0
10.0
5.0
0.0
0
0.5
1
Air Velocity (m/s)
1.5
2
Figure 4. Sample HFBR-772BWZ(BHWZ)/782BZ(BHZ) Case to Ambient thermal resistance (C/W) versus air velocity (sea level)
14
HFBR-782BZ
V CCR
V CCR
V CCR
V CCR
R = 1.0 kΩ
0603
R = 100Ω
0603
L = 6.8 nH
0805
L = 1 µH
2220
C = 0.1 µF
0603
C = 0.1 µF
0603
C = 10 µF
1210
V CC
C = 10 µF
1210
V CCR
V CCR
V CCR
V CCR
NOTE:
1. Vcc is defined by 3.135 <Vcc <3.465 Volts and the power supply filter has <50 mV drop across it resulting
in 3.085 <Vccr, <3.415 volts.
Figure 5. Recommended receiver power supply filter.
HFBR-772BWZ
V CCT
V CCT
V CCT
V CCT
R = 1.0 kΩ
0603
R = 100Ω
0603
L = 6.8 nH
0805
L = 1 µH
2220
C = 0.1 µF
0603
C = 0.1 µF
0603
C = 10 µF
1210
V CCT
V CCT
V CCT
V CCT
NOTE:
1. Vcc is defined by 3.135 <Vcc <3.465 Volts and the power supply filter has <50 mV drop across it resulting
3.085 < Vcct <3.145 volts.
Figure 6. Recommended transmitter power supply filter.
15
V CC
C = 10 µF
1210
HFBR-772BWZ
DATA OUT (+)
R
100 Ω
C = 100 nF
R
50 Ω
C = 100 nF
R
50 Ω
DATA OUT (–)
HFBR-782BZ
ASIC
D OUT (+)
C = 100 nF
RDL
100 Ω
D OUT (–)
C = 100 nF
NOTE:
AC coupling capacitors should be used to connect data outputs to data inputs between
the HFBR-772BWZ, HFBR-782BZ, and host board ICs (eg ASIC) with either 50Ω single
ended or 100Ω differential terminations as shown. The capacitors' value can be reduced
from 100 nF (0603 size) if the data rate and run length are limited.
Figure 7. Recommended ac coupling and data signal termination.
V DI/O+
D IN+
+
∆V DIN
TRANSMITTER
∆V DI/OH
–
∆V DI/OL
D IN–
V DI/O–
D OUT+
+
RECEIVER
∆V DOUT
–
∆V DI/OH
V DI/O REFERS TO
EITHER V DIN OR V DOUT
AS APPROPRIATE
Figure 8. Differential signals.
16
+
D V DI/O P-P
D OUT–
∆V DI/OL
–
Unused receiver
channel outputs
must be terminated
2 x ∅2.54 MIN. PAD KEEP-OUT
Æ 0.1 A B-C
2 x ∅1.7 ± 0.05 HOLES
Æ 0.1 A B-C
3 x ∅ 4.17 MIN. PAD KEEP-OUT
Æ 0.1 A B-C
5.46
B
3 x ∅ 2.69 ± 0.05 HOLES
FOR #2 SCREW
∅ 0.1 A B-C
A
Rx
SYM.
13.72
18 REF.
100 PIN FCI
MEG-Array® RECEPTACLE
CONNECTORS
18.42 MIN.
C
Tx
SYM.
9 x 1.27 TOT = 11.43
END OF
MODULE
FRONT
(10 x 10 =) 100 x ∅ 0.58 ± 0.05 PADS
∅ 0.05 A B-C
8.00
50
KEEP-OUT AREA
FOR MPO CONNECTOR
9 x 1.27 TOT = 11.43
1.89 REF.
8.95 REF.
30.23
PCB LAYOUT
(TOP VIEW)
Note: The host electrical connector attached to the PCB must be a 100-position FCI Meg-Array Plug (FCI PN: 84512-102) or
equivalent.
Figure 9. Package board footprint (dimensions in mm). PCB top view.
17
V CCR
50 Ω
V CCT
50 Ω
D IN+
D OUT+
D OUT–
50Ω
Z IN
50Ω
V BIAS
(NOMINAL 1.7 V)
D IN–
V EE
V EE
Figure 10. Rx data output equivalent circuit.
Figure 11. Tx data input equivalent circuit.
V CC > 2.8 V
V CC
~60 ms
~6.5 ms
SHUTDOWN
TX OUT 0
NORMAL
~4.6 ms
TX OUT 1
SHUTDOWN
NORMAL
~4.6 ms
TX OUT 2
SHUTDOWN
TX OUT 11
SHUTDOWN
NORMAL
NORMAL
Figure 12. Typical transmitter power-up sequence.
NO FAULT DETECTED
FAULT DETECTED
~Toff
<200 µs
-FAULT
TX OUT CH 0-11
Figure 13. Transmitter FAULT signal timing diagram.
18
~100 ns
RESET
FAULT
> 100 ns
(Ton)
~55 ms
~4.2 ms
SHUTDOWN
~4.6 ms
TX OUT 0
NORMAL
TX OUT 1
~4.6 ms
TX OUT 2
TX OUT 11
~5 µs (Toff)
Figure 14. Transmitter RESET timing diagram.
TX_DIS
TX_EN
~5 µs (Toff)
TX OUT
CH 0-11
NORMAL
~5 µs (Toff)
TX OUT
CH 0-11
SHUTDOWN
(a)
TX_EN [1]
~4.2 ms
SHUTDOWN
(b)
NOTE [1]: TX_DIS, WHICH IS
NOT SHOWN, IS THE
FUNCTIONAL COMPLIMENT
OF TX_EN.
(Ton)
~55 ms
~4.6 ms
TX OUT CH 0
TX OUT CH 1
TX OUT
CH 11
(c)
Figure 15. Transmitter TX_EN and TX_DIS timing diagram.
19
NORMAL
Module Outline
Notes:
1. Module supplied with port process plug.
2. Module mass approximately 20 grams.
Figure 16. Package outline for HFBR-772BWZ and HFBR-782BZ (dimensions in mm).
20
Notes:
1. Module supplied with port process plug.
2. Module mass approximately 20 grams.
Figure 17. Package Outline for HFBR-772BHWZ/782BHZ (dimensions in mm)
21
Figure 18. Package Outline for HFBR-772BEWZ/782BEZ (dimensions in mm)
22
Figure 19. Package Outline for HFBR-772BEPWZ/782BEPZ (dimensions in mm)
23
Figure 20. Host Frontplate Layout (dimensions in mm)
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes AV01-0658EN
AV02-1158EN - January 29, 2013
HFBR-772BxxxZ and HFBR-782BxxZ
Pluggable Parallel Fiber Optic Modules,
Transmitter and Receiver
Datasheet Addendum
Description
The HFBR-772BxxxZ transmitter and HFBR-782Bxxz receiver are high performance fiber optic modules for parallel
optical data communications applications. These 12 channels devices are optimized for short reach optical link applications requiring data transfer rates of up to 2.7 Gb/s per channel. For applications requiring higher data rates, the
HFBR-772BxxxZ and HFBR-782Bxxz can be operated at 3.125 Gb/s with reduced link length and marginally increased
link contributed jitter. This data sheet addendum highlights the changes to maximum link distance and contributed
jitter that can be expected when operating at 3.125 Gb/s.
Table 1. Modified Module Specifications @ 3.125 Gb/s
Description
Units
Notes
Link Distance (500 MHz.km)
Symbol
Maximum
220
Average
Minimum
m
300 m max @ 2.5 Gb/s
Link Distance (2000 MHz.km)
400
m
600 m max @ 2.5 Gb/s
TX Contributed Deterministic Jitter
DJ
70
30
ps
60 ps @ 2.5 Gb/s
TX Contributed Total Jitter
TJ
130
70
ps
120 ps @ 2.5 Gb/s
RX Input Optical Power Sensitivity
Pin Min
-14
-16.5
dBm avg
-16 dBm max @2.5 Gb/s
ps
120ps min @ 2.5 Gb/s
Stressed RX Eye Opening
180
110
Patent - www.avagotech.com/patents
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Addendum to
AV02-1158EN - January 29, 2013