High Performance LGA Cooling Solutions ATS PART # ATS-57003-C1-R0 D Features & Benefits » Provides high capacity cooling for high power LGAs » Unique attachment minimizes mechanical stress on the device » Includes spring-loaded, push pin mounts for direct attachment to the PCB C A B Thermal Performance *Image above is for illustration purposes only. Air Velocity Thermal Resistance FT/MIN M/S °C/W (UNDUCTED FLOW) °C/W (DUCTED FLOW) 200 1.0 1.38 0.8 300 1.5 0.87 400 2.0 0.7 500 2.5 0.6 600 3.0 0.55 700 3.5 0.5 800 4.0 0.45 Product Details DIMENSION A DIMENSION B DIMENSION C DIMENSION D INTERFACE MATERIAL FINISH 94 mm 94 mm 27 mm N/A mm NO TIM BLACK-ANODIZED Notes: 1) 2) 3) 4) Dimension C = heat sink height from bottom of the base to the top of the fin field. Thermal performance data are provided for reference only. Actual performance may vary by application. ATS reserves the right to update or change its products without notice to improve the design or performance. Contact ATS to learn about custom options available. For more information, to find a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe). REV1_0908