Freescale MC68HC705B5 Microcontroller Datasheet

MC68HC05B4
MC68HC705B5
MC68HC05B5
MC68HC05B6
MC68HC05B8
MC68HC05B16
MC68HC705B16
MC68HC705B16N
MC68HC05B32
MC68HC705B32
Technical Data
M68HC05
Microcontrollers
MC68HC05B6/D
Rev. 4.1
08/2005
freescale.com
INTRODUCTION
1
MODES OF OPERATION AND PIN DESCRIPTIONS
2
MEMORY AND REGISTERS
3
INPUT/OUTPUT PORTS
4
PROGRAMMABLE TIMER
5
SERIAL COMMUNICATIONS INTERFACE
6
PULSE LENGTH D/A CONVERTERS
7
ANALOG TO DIGITAL CONVERTER
8
RESETS AND INTERRUPTS
9
CPU CORE AND INSTRUCTION SET
10
ELECTRICAL SPECIFICATIONS
11
MECHANICAL DATA
12
ORDERING INFORMATION
13
APPENDICES
14
HIGH SPEED OPERATION
15
TPG
2
1
INTRODUCTION
2
MODES OF OPERATION AND PIN DESCRIPTIONS
3
MEMORY AND REGISTERS
4
INPUT/OUTPUT PORTS
5
PROGRAMMABLE TIMER
6
SERIAL COMMUNICATIONS INTERFACE
7
PULSE LENGTH D/A CONVERTERS
8
ANALOG TO DIGITAL CONVERTER
9
RESETS AND INTERRUPTS
10
CPU CORE AND INSTRUCTION SET
11
ELECTRICAL SPECIFICATIONS
12
MECHANICAL DATA
13
ORDERING INFORMATION
14
APPENDICES
15
HIGH SPEED OPERATION
TPG
3
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SECTION 1 INTRODUCTION
SECTION 2 MODES OF OPERATION AND PIN DESCRIPTIONS
SECTION 3 MEMORY AND REGISTERS
SECTION 4 INPUT/OUTPUT PORTS
SECTION 5 PROGRAMMABLE TIMER
SECTION 6 SERIAL COMMUNICATIONS INTERFACE
SECTION 7 PULSE LENGTH D/A CONVERTERS
SECTION 8 ANALOG TO DIGITAL CONVERTER
SECTION 9 RESETS AND INTERRUPTS
SECTION 10 CPU CORE AND INSTRUCTION SET
SECTION 11 ELECTRICAL SPECIFICATIONS
SECTION 12 MECHANICAL DATA
SECTION 13 ORDERING INFORMATION
SECTION 14 APPENDICES
SECTION 15 HIGH SPEED OPERATION
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5
MC68HC05B6
High-density Complementary
Metal Oxide Semiconductor
(HCMOS) Microcomputer Unit
All Trade Marks recognized. This document contains information on new products. Specifications and information herein are
subject to change without notice.
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and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
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This document supersedes any earlier documentation relating to the products referred to herein. The information contained
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 Freescale LTD., 2005
TPG
6
Conventions
Where abbreviations are used in the text, an explanation can be found in the
glossary, at the back of this manual. Register and bit mnemonics are defined in the
paragraphs describing them.
An overbar is used to designate an active-low signal, eg: RESET.
Unless otherwise stated, shaded cells in a register diagram indicate that the bit is
either unused or reserved; ‘u’ is used to indicate an undefined state (on reset).
Unless otherwise stated, pins labelled “NU” should be tied to VSS in an electrically
noisy environment. Pins labelled “NC” can be left floating, since they are not bonded
to any part of the device.
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6
TABLE OF CONTENTS
Paragraph
Number
TITLE
Page
Number
1
INTRODUCTION
1.1
1.2
Features.............................................................................................................1–2
Mask options for the MC68HC05B6 ..................................................................1–3
2
MODES OF OPERATION AND PIN DESCRIPTIONS
2.1
Modes of operation ............................................................................................2–1
2.1.1
Single chip mode .........................................................................................2–1
2.2
Serial RAM loader .............................................................................................2–2
2.3
‘Jump to any address’........................................................................................2–4
2.4
Low power modes..............................................................................................2–6
2.4.1
STOP ...........................................................................................................2–6
2.4.2
WAIT ............................................................................................................2–8
2.4.2.1
Power consumption during WAIT mode .................................................2–8
2.4.3
SLOW mode.................................................................................................2–9
2.4.3.1
Miscellaneous register...........................................................................2–9
2.5
Pin descriptions ..............................................................................................2–10
2.5.1
VDD and VSS ............................................................................................2–10
2.5.2
IRQ ............................................................................................................2–10
2.5.3
RESET .......................................................................................................2–10
2.5.4
TCAP1 .......................................................................................................2–10
2.5.5
TCAP2 .......................................................................................................2–11
2.5.6
TCMP1.......................................................................................................2–11
2.5.7
TCMP2.......................................................................................................2–11
2.5.8
OSC1, OSC2 .............................................................................................2–11
2.5.8.1
Crystal ..................................................................................................2–11
2.5.8.2
Ceramic resonator................................................................................2–11
2.5.8.3
External clock .......................................................................................2–12
2.5.9
RDI (Receive data in).................................................................................2–13
2.5.10
TDO (Transmit data out) ............................................................................2–13
2.5.11
SCLK..........................................................................................................2–13
2.5.12
PLMA .........................................................................................................2–13
MC68HC05B6
Rev. 4.1
TABLE OF CONTENTS
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Paragraph
Number
2.5.13
2.5.14
2.5.15
2.5.16
2.5.17
2.5.18
TABLE OF CONTENTS
Page
Number
PLMB ......................................................................................................... 2–13
VPP1.......................................................................................................... 2–13
VRH ........................................................................................................... 2–13
VRL............................................................................................................ 2–13
PA0 – PA7/PB0 – PB7/PC0 – PC7 ............................................................ 2–13
PD0/AN0–PD7/AN7................................................................................... 2–13
3
MEMORY AND REGISTERS
3.1
3.2
3.3
3.4
3.5
3.5.1
3.5.2
3.5.3
3.5.4
3.5.5
3.6
3.7
3.8
Registers ........................................................................................................... 3–1
RAM .................................................................................................................. 3–1
ROM .................................................................................................................. 3–1
Self-check ROM ................................................................................................ 3–2
EEPROM ........................................................................................................... 3–3
EEPROM control register ............................................................................ 3–3
EEPROM read operation ............................................................................. 3–5
EEPROM erase operation ........................................................................... 3–5
EEPROM programming operation ............................................................... 3–6
Options register (OPTR) .............................................................................. 3–6
EEPROM during STOP mode ........................................................................... 3–7
EEPROM during WAIT mode ............................................................................ 3–7
Miscellaneous register...................................................................................... 3–9
4
INPUT/OUTPUT PORTS
4.1
Input/output programming ................................................................................. 4–1
4.2
Ports A and B .................................................................................................... 4–2
4.3
Port C ................................................................................................................ 4–3
4.4
Port D ................................................................................................................ 4–3
4.5
Port registers ..................................................................................................... 4–4
4.5.1
Port data registers A and B (PORTA and PORTB) ...................................... 4–4
4.5.2
Port data register C (PORTC)...................................................................... 4–4
4.5.3
Port data register D (PORTD)...................................................................... 4–5
4.5.3.1
A/D status/control register...................................................................... 4–5
4.5.4
Data direction registers (DDRA, DDRB and DDRC).................................... 4–5
4.6
Other port considerations .................................................................................. 4–6
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TABLE OF CONTENTS
MC68HC05B6
Rev. 4.1
Paragraph
Number
TABLE OF CONTENTS
Page
Number
5
PROGRAMMABLE TIMER
5.1
5.1.1
5.2
5.2.1
5.2.2
5.3
5.3.1
5.3.2
5.4
5.4.1
5.4.2
5.4.3
5.5
5.5.1
5.6
5.7
5.8
Counter ..............................................................................................................5–1
Counter register and alternate counter register ...........................................5–3
Timer control and status ....................................................................................5–4
Timer control register (TCR) ........................................................................5–4
Timer status register (TSR)..........................................................................5–6
Input capture......................................................................................................5–7
Input capture register 1 (ICR1) ....................................................................5–7
Input capture register 2 (ICR2) ....................................................................5–8
Output compare .................................................................................................5–9
Output compare register 1 (OCR1)..............................................................5–9
Output compare register 2 (OCR2)............................................................5–10
Software force compare .............................................................................5–11
Pulse Length Modulation (PLM) ......................................................................5–11
Pulse length modulation registers A and B (PLMA/PLMB) ........................5–11
Timer during STOP mode................................................................................5–12
Timer during WAIT mode.................................................................................5–12
Timer state diagrams .......................................................................................5–12
6
SERIAL COMMUNICATIONS INTERFACE
6.1
6.2
6.3
6.4
6.5
6.6
6.6.1
6.6.2
6.7
6.8
6.9
6.10
6.11
6.11.1
6.11.2
6.11.3
6.11.4
6.11.5
6.12
6.13
6.14
SCI two-wire system features ............................................................................6–1
SCI receiver features .........................................................................................6–3
SCI transmitter features.....................................................................................6–3
Functional description........................................................................................6–3
Data format ........................................................................................................6–5
Receiver wake-up operation ..............................................................................6–5
Idle line wake-up ..........................................................................................6–6
Address mark wake-up ................................................................................6–6
Receive data in (RDI) ........................................................................................6–6
Start bit detection...............................................................................................6–6
Transmit data out (TDO) ....................................................................................6–8
SCI synchronous transmission ..........................................................................6–9
SCI registers ....................................................................................................6–10
Serial communications data register (SCDR) ............................................6–10
Serial communications control register 1 (SCCR1) ...................................6–10
Serial communications control register 2 (SCCR2) ...................................6–14
Serial communications status register (SCSR)..........................................6–16
Baud rate register (BAUD) .........................................................................6–18
Baud rate selection ..........................................................................................6–19
SCI during STOP mode ...................................................................................6–21
SCI during WAIT mode....................................................................................6–21
MC68HC05B6
Rev. 4.1
TABLE OF CONTENTS
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Paragraph
Number
TABLE OF CONTENTS
Page
Number
7
PULSE LENGTH D/A CONVERTERS
7.1
7.2
7.3
7.4
Miscellaneous register....................................................................................... 7–3
PLM clock selection........................................................................................... 7–4
PLM during STOP mode ................................................................................... 7–4
PLM during WAIT mode .................................................................................... 7–4
8
ANALOG TO DIGITAL CONVERTER
8.1
8.2
8.2.1
8.2.2
8.2.3
8.3
8.4
8.5
A/D converter operation..................................................................................... 8–1
A/D registers...................................................................................................... 8–3
Port D data register (PORTD)...................................................................... 8–3
A/D result data register (ADDATA) ............................................................... 8–3
A/D status/control register (ADSTAT)........................................................... 8–4
A/D converter during STOP mode..................................................................... 8–6
A/D converter during WAIT mode...................................................................... 8–6
Port D analog input............................................................................................ 8–6
9
RESETS AND INTERRUPTS
9.1
Resets ............................................................................................................... 9–1
9.1.1
Power-on reset............................................................................................. 9–2
9.1.2
Miscellaneous register ................................................................................ 9–2
9.1.3
RESET pin ................................................................................................... 9–3
9.1.4
Computer operating properly (COP) watchdog reset .................................. 9–3
9.1.4.1
COP watchdog during STOP mode ....................................................... 9–4
9.1.4.2
COP watchdog during WAIT mode ........................................................ 9–4
9.1.5
Functions affected by reset.......................................................................... 9–5
9.2
Interrupts ........................................................................................................... 9–6
9.2.1
Interrupt priorities......................................................................................... 9–6
9.2.2
Nonmaskable software interrupt (SWI) ........................................................ 9–6
9.2.3
Maskable hardware interrupts ..................................................................... 9–7
9.2.3.1
External interrupt (IRQ).......................................................................... 9–7
9.2.3.2
Miscellaneous register .......................................................................... 9–9
9.2.3.3
Timer interrupts .................................................................................... 9–10
9.2.3.4
Serial communications interface (SCI) interrupts................................. 9–10
9.2.4
Hardware controlled interrupt sequence.................................................... 9–11
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TABLE OF CONTENTS
MC68HC05B6
Rev. 4.1
Paragraph
Number
TABLE OF CONTENTS
Page
Number
10
CPU CORE AND INSTRUCTION SET
10.1 Registers .........................................................................................................10–1
10.1.1
Accumulator (A) .........................................................................................10–2
10.1.2
Index register (X)........................................................................................10–2
10.1.3
Program counter (PC) ................................................................................10–2
10.1.4
Stack pointer (SP) ......................................................................................10–2
10.1.5
Condition code register (CCR)...................................................................10–2
10.2 Instruction set ..................................................................................................10–3
10.2.1
Register/memory Instructions ....................................................................10–4
10.2.2
Branch instructions ....................................................................................10–4
10.2.3
Bit manipulation instructions ......................................................................10–4
10.2.4
Read/modify/write instructions ...................................................................10–4
10.2.5
Control instructions ....................................................................................10–4
10.2.6
Tables.........................................................................................................10–4
10.3 Addressing modes .........................................................................................10–11
10.3.1
Inherent....................................................................................................10–11
10.3.2
Immediate ................................................................................................10–11
10.3.3
Direct........................................................................................................10–11
10.3.4
Extended..................................................................................................10–12
10.3.5
Indexed, no offset.....................................................................................10–12
10.3.6
Indexed, 8-bit offset..................................................................................10–12
10.3.7
Indexed, 16-bit offset................................................................................10–12
10.3.8
Relative ....................................................................................................10–13
10.3.9
Bit set/clear ..............................................................................................10–13
10.3.10 Bit test and branch ...................................................................................10–13
11
ELECTRICAL SPECIFICATIONS
11.1
11.2
11.2.1
11.2.2
11.3
11.4
Absolute maximum ratings ..............................................................................11–1
DC electrical characteristics ............................................................................11–2
IDD trends for 5V operation ........................................................................11–3
IDD trends for 3.3V operation .....................................................................11–6
A/D converter characteristics...........................................................................11–8
Control timing ................................................................................................11–10
12
MECHANICAL DATA
12.1 MC68HC05B family pin configurations ............................................................12–1
12.1.1
52-pin plastic leaded chip carrier (PLCC) ..................................................12–1
12.1.2
64-pin quad flat pack (QFP) .......................................................................12–2
MC68HC05B6
Rev. 4.1
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Paragraph
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Number
12.1.3
56-pin shrink dual in line package (SDIP).................................................. 12–3
12.2 MC68HC05B6 mechanical dimensions ........................................................... 12–4
12.2.1
52-pin plastic leaded chip carrier (PLCC) .................................................. 12–4
12.2.2
64-pin quad flat pack (QFP)....................................................................... 12–5
12.2.3
56-pin shrink dual in line package (SDIP).................................................. 12–6
13
ORDERING INFORMATION
13.1
13.2
13.3
EPROMS ......................................................................................................... 13–2
Verification media ............................................................................................ 13–2
ROM verification units (RVU)........................................................................... 13–2
A
MC68HC05B4
A.1
A.2
Features ........................................................................................................... A–1
Self-check mode............................................................................................... A–5
B
MC68HC05B8
B.1
Features ........................................................................................................... B–1
C
MC68HC705B5
C.1
C.2
C.2.1
C.3
C.3.1
C.4
C.5
C.5.1
C.5.2
C.5.3
C.5.4
C.5.5
C.6
C.7
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Features ........................................................................................................... C–1
EPROM ............................................................................................................ C–5
EPROM programming operation................................................................. C–5
EPROM registers.............................................................................................. C–6
EPROM control register .............................................................................. C–6
Options register (OPTR)................................................................................... C–7
Bootstrap mode ................................................................................................ C–8
Erased EPROM verification ...................................................................... C–11
EPROM parallel bootstrap load ................................................................ C–11
EPROM (RAM) serial bootstrap load and execute ................................... C–13
RAM parallel bootstrap load and execute ................................................. C–14
Bootstrap loader timing diagrams ............................................................. C–17
DC electrical characteristics ........................................................................... C–19
Control timing ................................................................................................. C–19
TABLE OF CONTENTS
MC68HC05B6
Rev. 4.1
Paragraph
Number
TABLE OF CONTENTS
Page
Number
D
MC68HC05B16
D.1
D.2
D.3
Features............................................................................................................ D–1
Self-check routines ........................................................................................... D–2
External clock ................................................................................................... D–4
E
MC68HC705B16
E.1
Features............................................................................................................ E–2
E.2
External clock ................................................................................................... E–5
E.3
EPROM............................................................................................................. E–5
E.3.1
EPROM read operation............................................................................... E–5
E.3.2
EPROM program operation......................................................................... E–5
E.3.3
EPROM/EEPROM/ECLK control register ................................................... E–6
E.3.4
Mask option register.................................................................................... E–8
E.3.5
EEPROM options register (OPTR) ............................................................. E–9
E.4
Bootstrap mode .............................................................................................. E–10
E.4.1
Erased EPROM verification ...................................................................... E–13
E.4.2
EPROM/EEPROM parallel bootstrap........................................................ E–13
E.4.3
EEPROM/EPROM/RAM serial bootstrap.................................................. E–16
E.4.4
RAM parallel bootstrap ............................................................................. E–19
E.4.4.1
Jump to start of RAM ($0050) ............................................................. E–20
E.5
Absolute maximum ratings ............................................................................. E–21
E.6
DC electrical characteristics ........................................................................... E–22
E.7
A/D converter characteristics.......................................................................... E–24
E.8
Control timing ................................................................................................. E–26
E.9
EPROM electrical characteristics ................................................................... E–28
F
MC68HC705B16N
F.1
F.2
F.3
F.4
F.4.1
F.4.2
F.4.3
F.4.4
F.4.5
F.5
F.5.1
Features............................................................................................................ F–2
External clock ................................................................................................... F–5
RESET pin........................................................................................................ F–5
EPROM............................................................................................................. F–5
EPROM read operation............................................................................... F–5
EPROM program operation......................................................................... F–6
EPROM/EEPROM/ECLK control register ................................................... F–6
Mask option register.................................................................................... F–8
EEPROM options register (OPTR) ............................................................. F–9
Bootstrap mode .............................................................................................. F–10
Erased EPROM verification ...................................................................... F–13
MC68HC05B6
Rev. 4.1
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Number
F.5.2
EPROM/EEPROM parallel bootstrap.........................................................F–13
F.5.3
Serial RAM loader......................................................................................F–16
F.5.3.1
Jump to start of RAM ($0051) ..............................................................F–16
F.6
Absolute maximum ratings ..............................................................................F–19
F.7
DC electrical characteristics ............................................................................F–20
F.8
A/D converter characteristics ..........................................................................F–22
F.9
Control timing ..................................................................................................F–24
F.10 EPROM electrical characteristics ....................................................................F–26
G
MC68HC05B32
G.1
G.2
Features ........................................................................................................... G–1
External clock ................................................................................................... G–2
H
MC68HC705B32
H.1
Features ........................................................................................................... H–3
H.2
External clock ................................................................................................... H–7
H.3
RESET pin........................................................................................................ H–7
H.4
EPROM ............................................................................................................ H–7
H.4.1
EPROM read operation............................................................................... H–8
H.4.2
EPROM program operation ........................................................................ H–8
H.4.3
EPROM/EEPROM control register ............................................................. H–8
H.4.4
Mask option register ................................................................................. H–11
H.4.5
Options register (OPTR) ........................................................................... H–12
H.5
Bootstrap mode .............................................................................................. H–13
H.5.1
Erased EPROM verification ...................................................................... H–16
H.5.2
EPROM/EEPROM parallel bootstrap........................................................ H–16
H.5.3
Serial RAM loader..................................................................................... H–19
H.5.3.1
Jump to start of RAM ($0051) ............................................................. H–19
H.6
Absolute maximum ratings ............................................................................. H–22
H.7
DC electrical characteristics ........................................................................... H–23
H.8
A/D converter characteristics ......................................................................... H–25
H.9
Control timing ................................................................................................. H–27
H.10 EPROM electrical characteristics ................................................................... H–29
I
HIGH SPEED OPERATION
I.1
I.2
I.3
Freescale
viii
DC electrical characteristics ............................................................................... I–2
A/D converter characteristics ............................................................................. I–3
Control timing for 5V operation...........................................................................I–4
TABLE OF CONTENTS
MC68HC05B6
Rev. 4.1
LIST OF FIGURES
Figure
Number
1-1
2-1
2-2
2-3
2-4
2-5
3-1
4-1
4-2
4-3
5-1
5-2
5-3
5-4
5-5
6-1
6-2
6-3
6-4
6-5
6-6
6-7
6-8
6-9
6-10
7-1
7-2
7-3
8-1
8-2
9-1
9-2
9-3
TITLE
Page
Number
MC68HC05B6 block diagram ............................................................................. 1–3
MC68HC05B6 ‘load program in RAM and execute’ schematic diagram ............ 2–3
MC68HC05B6 ‘jump to any address’ schematic diagram .................................. 2–5
STOP and WAIT flowcharts................................................................................ 2–7
Slow mode divider block diagram ....................................................................... 2–9
Oscillator connections ...................................................................................... 2–12
Memory map of the MC68HC05B6 .................................................................... 3–2
Standard I/O port structure................................................................................. 4–2
ECLK timing diagram.......................................................................................... 4–3
Port logic levels................................................................................................... 4–6
16-bit programmable timer block diagram .......................................................... 5–2
Timer state timing diagram for reset ................................................................. 5–13
Timer state timing diagram for input capture .................................................... 5–13
Timer state timing diagram for output compare ................................................ 5–14
Timer state timing diagram for timer overflow................................................... 5–14
Serial communications interface block diagram ................................................. 6–2
SCI rate generator division ................................................................................. 6–4
Data format......................................................................................................... 6–5
SCI examples of start bit sampling technique .................................................... 6–7
SCI sampling technique used on all bits............................................................. 6–7
Artificial start following a framing error ............................................................... 6–8
SCI start bit following a break............................................................................. 6–8
SCI example of synchronous and asynchronous transmission .......................... 6–9
SCI data clock timing diagram (M=0) ............................................................... 6–12
SCI data clock timing diagram (M=1) ............................................................... 6–13
PLM system block diagram................................................................................. 7–1
PLM output waveform examples ........................................................................ 7–2
PLM clock selection............................................................................................ 7–4
A/D converter block diagram .............................................................................. 8–2
Electrical model of an A/D input pin ................................................................... 8–6
Reset timing diagram.......................................................................................... 9–1
Watchdog system block diagram ........................................................................ 9–3
Interrupt flow chart.............................................................................................. 9–8
MC68HC05B6
Rev. 4.1
LIST OF FIGURES
Freescale
ix
Figure
Number
10-1
10-2
11-1
11-2
11-3
11-4
11-5
11-6
11-7
11-8
11-9
11-10
11-11
11-12
11-13
12-1
12-2
12-3
12-4
12-5
12-6
A-1
A-2
A-3
B-1
B-2
C-1
C-2
C-3
C-4
C-5
C-6
C-7
C-8
C-9
C-10
D-1
D-2
D-3
E-1
E-2
E-3
Freescale
x
TITLE
Page
Number
Programming model ......................................................................................... 10–1
Stacking order .................................................................................................. 10–1
Run IDD vs internal operating frequency (4.5V, 5.5V) ...................................... 11–3
Run IDD (SM = 1) vs internal operating frequency (4.5V, 5.5V) ....................... 11–3
Wait IDD vs internal operating frequency (4.5V, 5.5V)...................................... 11–3
Wait IDD (SM = 1) vs internal operating frequency (4.5V, 5.5V)....................... 11–4
Increase in IDD vs frequency for A/D, SCI systems active, VDD = 5.5V........... 11–4
IDD vs mode vs internal operating frequency, VDD = 5.5V ............................... 11–4
Run IDD vs internal operating frequency (3 V, 3.6V)......................................... 11–6
Run IDD (SM = 1) vs internal operating frequency (3V,3.6V) ........................... 11–6
Wait IDD vs internal operating frequency (3V, 3.6V)......................................... 11–6
Wait IDD (SM = 1) vs internal operating frequency (3V, 3.6V).......................... 11–7
Increase in IDD vs frequency for A/D, SCI systems active, VDD = 3.6V............ 11–7
IDD vs mode vs internal operating frequency, VDD = 3.6V ............................... 11–7
Timer relationship........................................................................................... 11–12
52-pin PLCC pinout for the MC68HC05B6....................................................... 12–1
64-pin QFP pinout for the MC68HC05B6......................................................... 12–2
56-pin SDIP pinout for the MC68HC05B6........................................................ 12–3
52-pin PLCC mechanical dimensions .............................................................. 12–4
64-pin QFP mechanical dimensions................................................................. 12–5
56-pin SDIP mechanical dimensions................................................................ 12–6
MC68HC05B4 block diagram .............................................................................A–2
Memory map of the MC68HC05B4 ....................................................................A–3
MC68HC05B4 self-check schematic diagram ....................................................A–7
MC68HC05B8 block diagram .............................................................................B–2
Memory map of the MC68HC05B8 ....................................................................B–3
MC68HC705B5 block diagram ...........................................................................C–2
Memory map of the MC68HC705B5 ..................................................................C–3
Modes of operation flow chart (1 of 2)................................................................C–9
Modes of operation flow chart (2 of 2)..............................................................C–10
Timing diagram with handshake.......................................................................C–11
EPROM(RAM) parallel bootstrap schematic diagram ......................................C–12
EPROM (RAM) serial bootstrap schematic diagram ........................................C–15
RAM parallel bootstrap schematic diagram......................................................C–16
EPROM parallel bootstrap loader timing diagram ............................................C–17
RAM parallel loader timing diagram ................................................................C–18
MC68HC05B16 block diagram ...........................................................................D–3
Oscillator connections ........................................................................................D–4
Memory map of the MC68HC05B16 ..................................................................D–5
MC68HC705B16 block diagram .........................................................................E–2
Memory map of the MC68HC705B16 ................................................................E–3
Modes of operation flow chart (1 of 2)..............................................................E–11
LIST OF FIGURES
MC68HC05B6
Rev. 4.1
Figure
Number
E-4
E-5
E-6
E-7
E-8
E-9
E-10
E-11
F-1
F-2
F-3
F-4
F-5
F-6
F-7
F-8
F-9
F-10
G-1
G-2
H-1
H-2
H-3
H-4
H-5
H-6
H-7
H-8
H-9
H-10
I-1
TITLE
Page
Number
Modes of operation flow chart (2 of 2) ..............................................................E–12
Timing diagram with handshake .......................................................................E–14
Parallel EPROM loader timing diagram ............................................................E–14
EPROM Parallel bootstrap schematic diagram.................................................E–15
RAM/EPROM/EEPROM serial bootstrap schematic diagram ..........................E–17
Parallel RAM loader timing diagram .................................................................E–19
RAM parallel bootstrap schematic diagram ......................................................E–20
Timer relationship .............................................................................................E–28
MC68HC705B16N block diagram.......................................................................F–2
Memory map of the MC68HC705B16N..............................................................F–3
Modes of operation flow chart (1 of 2) ..............................................................F–11
Modes of operation flow chart (2 of 2) ..............................................................F–12
Timing diagram with handshake .......................................................................F–14
Parallel EPROM loader timing diagram ............................................................F–14
EPROM parallel bootstrap schematic diagram.................................................F–15
RAM load and execute schematic diagram ......................................................F–17
Parallel RAM loader timing diagram .................................................................F–18
Timer relationship .............................................................................................F–26
MC68HC05B32 block diagram .......................................................................... G–2
Memory map of the MC68HC05B32 ................................................................. G–3
MC68HC705B32 block diagram ........................................................................ H–4
Memory map of the MC68HC705B32 ............................................................... H–5
Modes of operation flow chart (1 of 2) ............................................................. H–14
Modes of operation flow chart (2 of 2) ............................................................. H–15
Timing diagram with handshake ...................................................................... H–17
Parallel EPROM loader timing diagram ........................................................... H–17
EPROM parallel bootstrap schematic diagram................................................ H–18
RAM load and execute schematic diagram ..................................................... H–20
Parallel RAM loader timing diagram ................................................................ H–21
Timer relationship ............................................................................................ H–29
Timer relationship ................................................................................................ I–5
MC68HC05B6
Rev. 4.1
LIST OF FIGURES
Freescale
xi
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Freescale
xii
LIST OF FIGURES
MC68HC05B6
Rev. 4.1
LIST OF TABLES
Table
Number
1-1
2-1
3-1
3-2
3-3
4-1
6-1
6-2
6-3
6-4
6-5
6-6
8-1
8-2
9-1
9-2
9-3
10-1
10-2
10-3
10-4
10-5
10-6
10-7
10-8
10-9
11-1
11-2
11-3
11-4
11-5
11-6
11-7
TITLE
Page
Number
Data sheet appendices....................................................................................... 1–1
Mode of operation selection ............................................................................... 2–1
EEPROM control bits description ....................................................................... 3–4
Register outline................................................................................................... 3–8
IRQ sensitivity..................................................................................................... 3–9
I/O pin states ...................................................................................................... 4–2
Method of receiver wake-up ............................................................................. 6–11
SCI clock on SCLK pin ..................................................................................... 6–13
First prescaler stage ......................................................................................... 6–18
Second prescaler stage (transmitter) ............................................................... 6–18
Second prescaler stage (receiver).................................................................... 6–19
SCI baud rate selection .................................................................................... 6–20
A/D clock selection ............................................................................................. 8–4
A/D channel assignment..................................................................................... 8–5
Effect of RESET, POR, STOP and WAIT............................................................ 9–5
Interrupt priorities ............................................................................................... 9–7
IRQ sensitivity..................................................................................................... 9–9
MUL instruction ................................................................................................ 10–5
Register/memory instructions........................................................................... 10–5
Branch instructions ........................................................................................... 10–6
Bit manipulation instructions............................................................................. 10–6
Read/modify/write instructions ......................................................................... 10–7
Control instructions........................................................................................... 10–7
Instruction set (1 of 2)....................................................................................... 10–8
Instruction set (2 of 2)....................................................................................... 10–9
M68HC05 opcode map................................................................................... 10–10
Absolute maximum ratings ............................................................................... 11–1
DC electrical characteristics for 5V operation................................................... 11–2
DC electrical characteristics for 3.3V operation................................................ 11–5
A/D characteristics for 5V operation ................................................................. 11–8
A/D characteristics for 3.3V operation .............................................................. 11–9
Control timing for 5V operation ....................................................................... 11–10
Control timing for 3.3V operation .................................................................... 11–11
MC68HC05B6
Rev. 4.1
LIST OF TABLES
Freescale
xiii
Table
Number
13-1
13-2
A-1
A-2
A-3
B-1
C-1
C-2
C-3
C-4
C-5
D-1
D-2
E-1
E-2
E-3
E-4
E-5
E-6
E-7
E-8
E-9
E-10
E-11
E-12
E-13
E-14
E-15
F-1
F-2
F-3
F-4
F-5
F-6
F-7
F-8
F-9
F-10
F-11
F-12
F-13
F-14
Freescale
xiv
TITLE
Page
Number
MC order numbers ........................................................................................... 13–1
EPROMs for pattern generation ....................................................................... 13–2
Mode of operation selection ...............................................................................A–1
Register outline ..................................................................................................A–4
MC68HC05B4 self-check results .......................................................................A–6
Register outline ..................................................................................................B–4
Register outline ..................................................................................................C–4
Mode of operation selection ...............................................................................C–8
Bootstrap vector targets in RAM ......................................................................C–14
Additional DC electrical characteristics for MC68HC705B5.............................C–19
Additional control timing for MC68HC705B5 ....................................................C–19
Mode of operation selection ...............................................................................D–2
Register outline ..................................................................................................D–6
Register outline ..................................................................................................E–4
EPROM control bits description .........................................................................E–6
EEPROM control bits description .......................................................................E–7
Mode of operation selection .............................................................................E–10
Bootstrap vector targets in RAM ......................................................................E–18
Absolute maximum ratings ...............................................................................E–21
DC electrical characteristics for 5V operation ..................................................E–22
DC electrical characteristics for 3.3V operation ...............................................E–23
A/D characteristics for 5V operation.................................................................E–24
A/D characteristics for 3.3V operation..............................................................E–25
Control timing for 5V operation.........................................................................E–26
Control timing for 3.3V operation......................................................................E–27
DC electrical characteristics for 5V operation ..................................................E–28
Control timing for 5V operation.........................................................................E–28
Control timing for 3.3V operation......................................................................E–28
Register outline .................................................................................................. F–4
EPROM control bits description ......................................................................... F–7
EEPROM control bits description ....................................................................... F–8
Mode of operation selection ............................................................................. F–10
Bootstrap vector targets in RAM ...................................................................... F–16
Absolute maximum ratings ............................................................................... F–19
DC electrical characteristics for 5V operation .................................................. F–20
DC electrical characteristics for 3.3V operation ............................................... F–21
A/D characteristics for 5V operation................................................................. F–22
A/D characteristics for 3.3V operation.............................................................. F–23
Control timing for 5V operation......................................................................... F–24
Control timing for 3.3V operation...................................................................... F–25
DC electrical characteristics for 5V operation .................................................. F–26
Control timing for 5V operation......................................................................... F–26
LIST OF TABLES
MC68HC05B6
Rev. 4.1
Table
Number
F-15
G-1
H-1
H-2
H-3
H-4
H-5
H-6
H-7
H-8
H-9
H-10
H-11
H-12
H-13
H-14
H-15
I-1
I-2
I-3
TITLE
Page
Number
Control timing for 3.3V operation ......................................................................F–26
Register outline.................................................................................................. G–4
Register outline.................................................................................................. H–6
EPROM control bits description......................................................................... H–9
EEPROM control bits description .................................................................... H–10
Mode of operation selection ............................................................................ H–13
Bootstrap vector targets in RAM...................................................................... H–19
Absolute Maximum ratings .............................................................................. H–22
DC electrical characteristics for 5V operation.................................................. H–23
DC electrical characteristics for 3.3V operation............................................... H–24
A/D characteristics for 5V operation ................................................................ H–25
A/D characteristics for 3.3V operation ............................................................. H–26
Control timing for 5V operation ........................................................................ H–27
Control timing for operation at 3.3V ................................................................. H–28
DC electrical characteristics for 5V operation.................................................. H–29
Control timing for 5V operation ........................................................................ H–29
Control timing for 3.3V operation ..................................................................... H–29
Ordering information............................................................................................ I–1
DC electrical characteristics for 5V operation...................................................... I–2
A/D characteristics for 5V operation .................................................................... I–3
MC68HC05B6
Rev. 4.1
LIST OF TABLES
Freescale
xv
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Freescale
xvi
LIST OF TABLES
MC68HC05B6
Rev. 4.1
1
1
INTRODUCTION
The MC68HC05B6 microcomputer (MCU) is a member of Freescale’s MC68HC05 family of
low-cost single chip microcomputers. This 8-bit MCU contains an on-chip oscillator, CPU, RAM,
ROM, EEPROM, A/D converter, pulse length modulated outputs, I/O, serial communications
interface, programmable timer system and watchdog. The fully static design allows operation at
frequencies down to dc to further reduce the already low power consumption to a few micro-amps.
This data sheet is structured such that devices similar to the MC68HC05B6 are described in a set
of appendices (see Table 1-1).
Table 1-1 Data sheet appendices
Device
Differences from MC68HC05B6
A
MC68HC05B8
B
7.25K bytes ROM
MC68HC705B5
C
6K bytes EPROM; self-check replaced by bootstrap
firmware; no EEPROM
MC68HC05B16
D
16K bytes ROM; increased RAM and self-check ROM
MC68HC705B16
E
16K bytes EPROM; increased RAM; self-check replaced
by bootstrap firmware; modified power-on reset routine
MC68HC705B16N
F
16K bytes EPROM; increased RAM; self-check replaced
by bootstrap firmware; modified power-on reset routine
MC68HC05B32
G
32K bytes ROM; no page zero ROM; increased RAM
H
32K bytes EPROM; no page zero ROM; increased RAM;
self-check mode replaced by bootstrap firmware
MC68HC705B32
MC68HC05B6
Rev. 4.1
Appendix
MC68HC05B4
4K bytes ROM; no EEPROM
INTRODUCTION
Freescale
1-1
1
1.1
Features
Hardware features
•
Fully static design featuring the industry standard M68HC05 family CPU core
•
On chip crystal oscillator with divide by 2 or a software selectable divide by 32 option (SLOW
mode)
•
2.1 MHz internal operating frequency at 5V; 1.0 MHz at 3V
•
High speed version available
•
176 bytes of RAM
•
5936 bytes of user ROM plus 14 bytes of user vectors
•
256 bytes of byte erasable EEPROM with internal charge pump and security bit
•
Write/erase protect bit for 224 of the 256 bytes EEPROM
•
Self test/bootstrap mode
•
Power saving STOP, WAIT and SLOW modes
•
Three 8-bit parallel I/O ports and one 8-bit input-only port
•
Software option available to output the internal E-clock to port pin PC2
•
16-bit timer with 2 input captures and 2 output compares
•
Computer operating properly (COP) watchdog timer
•
Serial communications interface system (SCI) with independent transmitter/receiver baud rate
selection; receiver wake-up function for use in multi-receiver systems
•
8 channel A/D converter
•
2 pulse length modulation systems which can be used as D/A converters
•
One interrupt request input plus 4 on-board hardware interrupt sources
•
Available in 52-pin plastic leaded chip carrier (PLCC), 64-pin quad flat pack (QFP) and 56-pin
shrink dual in line (SDIP) packages
•
Complete development system support available using the MMDS05 development station with
the M68HC05B32EM emulation module
•
Extended operating temperature range of -40 to +125 °C
Freescale
1-2
INTRODUCTION
MC68HC05B6
Rev. 4.1
1
1.2
Mask options for the MC68HC05B6
The MC68HC05B6 has three mask options that are programmed during manufacture and must
be specified on the order form.
•
Power-on-reset delay (tPORL) = 16 or 4064 cycles
•
Automatic watchdog enable/disable following a power-on or external reset
•
Watchdog enable/disable during WAIT mode
RESET
IRQ
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
PC0
PC1
PC2/ECLK
PC3
PC4
PC5
PC6
PC7
COP watchdog
OSC2
OSC1
Oscillator
÷ 2 / ÷ 32
M68HC05
CPU
VDD
VSS
432 bytes
self check ROM
176 bytes
RAM
16-bit
programmable
timer
Port D
PD0/AN0
PD1/AN1
PD2/AN2
PD3/AN3
PD4/AN4
PD5/AN5
PD6/AN6
PD7/AN7
VRH
VRL
5950 bytes
User ROM
(including 14 bytes
User vectors)
Port A
Charge pump
VPP1
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
Port B
256 bytes
EEPROM
Port C
Warning: It is recommended that an external clock is always used if tPORL is set to 16 cycles. This
will prevent any problems arising with oscillator stability when the device is put into
STOP mode.
8-bit
A/D converter
TCMP1
TCMP2
TCAP1
TCAP2
SCI
RDI
SCLK
TDO
PLM
PLMA D/A
PLMB D/A
Figure 1-1 MC68HC05B6 block diagram
MC68HC05B6
Rev. 4.1
INTRODUCTION
Freescale
1-3
1
THIS PAGE LEFT BLANK INTENTIONALLY
Freescale
1-4
INTRODUCTION
MC68HC05B6
Rev. 4.1
2
2
MODES OF OPERATION AND PIN
DESCRIPTIONS
2.1
Modes of operation
The MC68HC05B6 MCU has two modes of operation, namely single chip and self check modes.
Table 2-1 shows the conditions required to enter each mode on the rising edge of RESET.
Table 2-1 Mode of operation selection
2.1.1
IRQ pin
TCAP1 pin
PD3
PD4
VSS to VDD
VSS to VDD
X
X
Single chip
Mode
2VDD
VDD
1
0
Serial RAM loader
2VDD
VDD
1
1
Jump to any address
Single chip mode
This is the normal operating mode of the MC68HC05B6. In this mode the device functions as a
self-contained microcomputer (MCU) with all on-board peripherals, including the three 8-bit I/O
ports and the 8-bit input-only port, available to the user. All address and data activity occurs within
the MCU.
MC68HC05B6
Rev. 4.1
MODES OF OPERATION AND PIN DESCRIPTIONS
Freescale
2-1
2.2
2
Serial RAM loader
The ‘load program in RAM and execute’ mode is entered if the following conditions are satisfied
when the reset pin is released to VDD. The format used is identical to the format used for the
MC68HC805C4. The SEC bit in the options register must be inactive, i.e. set to ‘1’.
–
IRQ at 2xVDD
–
TCAP1 at VDD
–
PD3 at VDD for at least 30 machine cycles after reset
–
PD4 at VSS for at least 30 machine cycles after reset
In the ‘load program in RAM and execute’ routine, user programs are loaded into MCU RAM via
the SCI port and then executed. Data is loaded sequentially, starting at RAM location $0050, until
the last byte is loaded. Program control is then transferred to the RAM program starting at location
$0051. The first byte loaded is the count of the total number of bytes in the program plus the count
byte. The program starts at the second byte in RAM. During the firmware initialization stage, the
SCI is configured for the NRZ data format (idle line, start bit, eight data bits and stop bit). The baud
rate is 9600 with a 4 MHz crystal. A program to convert ASCII S-records to the format required by
the RAM loader is available from Freescale.
If immediate execution is not desired after loading the RAM program, it is possible to hold off
execution. This is accomplished by setting the byte count to a value that is greater than the overall
length of the loaded data. When the last byte is loaded, the firmware will halt operation expecting
additional data to arrive. At this point, the reset switch is placed in the reset position which will reset
the MCU, but keep the RAM program intact. All routines can now be entered from this state,
including the one which will execute the program in RAM (see Section 2.3).
To load a program in the EEPROM, the ‘load program in RAM and execute’ function is also used.
In this instance the process involves two distinct steps. Firstly, the RAM is loaded with a program
which will control the loading of the EEPROM, and when the RAM contents are executed, the MCU
is instructed to load the EEPROM.
The erased state of the EEPROM is $FF.
Figure 2-1 shows the schematic diagram of the circuit required for the serial RAM loader.
Freescale
2-2
MODES OF OPERATION AND PIN DESCRIPTIONS
MC68HC05B6
Rev. 4.1
P1
10 nF
10 kΩ
GND
+5V
2xVDD
10
RESET
VDD
OSC1
18
47 µF
RESET
OSC2
16
17
10 MΩ
0.01 µF
6
15
22 pF
NC
RS232
50
52
10 kΩ
IRQ
RDI
PD3
TDO
PD4
Connect as required
for the application
32
33
34
35
36
37
38
39
42
43
44
45
46
47
48
49
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
TCAP1
MC68HC05B6 (52-pin package)
24
25
26
27
28
29
30
31
22 pF
NC
9600 Bd
RS232 level translator
suggested:
MC145406 or MAX232
4 MHz
VRH
VRL
VPP1
PLMA
PLMB
SCLK
TCMP2
TCAP2
TCMP1
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
PD7
PD6
PD5
PD2
PD1
PD0
19
11
9
22
8
7
40
20
21
51
1
Connect as required
for the application
23
2
3
4
5
12
13
14
VSS
41
Figure 2-1 MC68HC05B6 ‘load program in RAM and execute’ schematic diagram
MC68HC05B6
Rev. 4.1
MODES OF OPERATION AND PIN DESCRIPTIONS
Freescale
2-3
2
2.3
2
‘Jump to any address’
The ‘jump to any address’ mode is entered when the reset pin is released to VDD, if the following
conditions are satisfied:
–
IRQ at 2xVDD
–
TCAP1 at VDD
–
PD3 at VDD for at least 30 machine cycles after reset
–
PD4 at VDD for at least 30 machine cycles after reset
This function allows execution of programs previously loaded in RAM or EEPROM using the
methods outlined in Section 2.2.
To execute the ‘jump to any address’ function, data input at port A has to be $CC and data input at
port B and port C should represent the MSB and LSB respectively, of the address to jump to for
execution of the user program. A schematic diagram of the circuit required is shown in Figure 2-2.
Freescale
2-4
MODES OF OPERATION AND PIN DESCRIPTIONS
MC68HC05B6
Rev. 4.1
P1
10 nF
10 kΩ
GND
+5V
2xVDD
10
RESET
VDD
OSC1
18
47 µF
RESET
OSC2
16
17
10 MΩ
0.01 µF
6
15
22 pF
NC
10 kΩ
IRQ
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
PD4
TCAP1
MC68HC05B6 (52-pin package)
32
33
34
35
36
37
38
39
PD3
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
VRH
VRL
VPP1
PLMA
PLMB
SCLK
RDI
TDO
TCMP2
8 x 10 kΩ
LSB
Select required address
MSB
8 x 10 kΩ
42
43
44
45
46
47
48
49
22 pF
NC
8 x 10 kΩ optional (see note)
24
25
26
27
28
29
30
31
4 MHz
TCAP2
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
TCMP1
VSS
PD7
PD6
PD5
PD2
PD1
PD0
19
11
9
22
8
7
40
20
21
51
50
52
Connect as required
for the application
1
23
2
3
4
5
12
13
14
41
Note:
These eight resistors are optional; direct connection is possible if pins PA0-PA7, PB0-PB7 and PC0-PC7
are kept in input mode during application.
Figure 2-2 MC68HC05B6 ‘jump to any address’ schematic diagram
MC68HC05B6
Rev. 4.1
MODES OF OPERATION AND PIN DESCRIPTIONS
Freescale
2-5
2
2.4
2
Low power modes
The STOP and WAIT instructions have different effects on the programmable timer, the serial
communications interface, the watchdog system, the EEPROM and the A/D converter. These
different effects are described in the following sections.
2.4.1
STOP
The STOP instruction places the MCU in its lowest power consumption mode. In STOP mode, the
internal oscillator is turned off, halting all internal processing including timer, serial
communications interface and the A/D converter (see flowchart in Figure 2-3). The only way for
the MCU to wake-up from the STOP mode is by receipt of an external interrupt or by the detection
of a reset (logic low on RESET pin or a power-on reset).
During STOP mode, the I-bit in the CCR is cleared to enable external interrupts (see
Section 10.1.5). The SM bit is cleared to allow nominal speed operation for the 4064 cycles count
while exiting STOP mode (see Section 2.4.3).
All other registers and memory remain unaltered and all input/output lines remain unchanged.
This continues until an external interrupt (IRQ) or reset is sensed, at which time the internal
oscillator is turned on. The external interrupt or reset causes the program counter to vector to the
corresponding locations ($1FFA, B and $1FFE, F respectively).
When leaving STOP mode, a tPORL internal cycles delay is provided to give the oscillator time to
stabilise before releasing CPU operation. This delay is selectable via a mask option to be either
16 or 4064 cycles. The CPU will resume operation by servicing the interrupt that wakes it up, or
by fetching the reset vector, if reset wakes it up.
Warning: If tPORL is selected to be 16 cycles, it is recommended that an external clock signal is
used to avoid problems with oscillator stability while the device is in STOP mode.
Note:
The stacking corresponding to an eventual interrupt to go out of STOP mode will only
be executed when going out of STOP mode.
The following list summarizes the effect of STOP mode on the individual modules of the
MC68HC05B6.
–
The watchdog timer is reset; refer to Section 9.1.4.1
–
The EEPROM acts as read-only memory (ROM); refer to Section 3.6
–
All SCI activity stopped; refer to Section 6.13
–
The timer stops counting; refer to Section 5.6
–
The PLM outputs remain at current level; refer to Section 7.3
–
The A/D converter is disabled; refer to Section 8.3
–
The I-bit in the CCR is cleared
Freescale
2-6
MODES OF OPERATION AND PIN DESCRIPTIONS
MC68HC05B6
Rev. 4.1
STOP
YES
2
Watchdog active?
NO
Stop oscillator and all
clocks.
Clear I bit.
NO
Reset?
IRQ
external
interrupt?
NO
WAIT
YES
Oscillator active. Timer, SCI,
A/D, EEPROM clocks active.
Processor clocks stopped
Clear I-bit
Reset?
YES
NO
IRQ
external
interrupt?
YES
YES
YES
NO
Timer interrupt?
NO
Turn on oscillator.
Wait for time delay to
stabilise
YES
SCI interrupt?
NO
Restart processor clock
Generate
watchdog reset
(1) Fetch reset vector or
(2) Service interrupt:
a. stack
b. set I-bit
c. vector to interrupt
routine
(1) Fetch reset vector or
(2) Service interrupt:
a. stack
b. set I-bit
c. vector to interrupt
routine
Figure 2-3 STOP and WAIT flowcharts
MC68HC05B6
Rev. 4.1
MODES OF OPERATION AND PIN DESCRIPTIONS
Freescale
2-7
2.4.2
2
WAIT
The WAIT instruction places the MCU in a low power consumption mode, but WAIT mode
consumes more power than STOP mode. All CPU action is suspended and the watchdog is
disabled, but the timer, A/D and SCI systems remain active and operate as normal (see flowchart
in Figure 2-3). All other memory and registers remain unaltered and all parallel input/output lines
remain unchanged. The programming or erase mechanism of the EEPROM is also unaffected, as
well as the charge pump high voltage generator.
During WAIT mode the I-bit in the CCR is cleared to enable all interrupts. The INTE bit in the
miscellaneous register (Section 2.5) is not affected by WAIT mode. When any interrupt or reset is
sensed, the program counter vectors to the locations containing the start address of the interrupt
or reset service routine.
Any IRQ, timer (overflow, input capture or output compare) or SCI interrupt (in addition to a logic
low on the RESET pin) causes the processor to exit WAIT mode.
If a non-reset exit from WAIT mode is performed (i.e. timer overflow interrupt exit), the state of the
remaining systems will be unchanged.
If a reset exit from WAIT mode is performed the entire system reverts to the disabled reset state.
Note:
The stacking corresponding to an eventual interrupt to leave WAIT mode will only be
executed when leaving WAIT mode.
The following list summarizes the effect of WAIT mode on the modules of the MC68HC05B6.
–
The watchdog timer functions according to the mask option selected; refer
to Section 9.1.4.2
–
The EEPROM is not affected; refer to Section 3.7
–
The SCI is not affected; refer to Section 6.14
–
The timer is not affected; refer to Section 5.7
–
The PLM is not affected; refer to Section 7.4
–
The A/D converter is not affected; refer to Section 8.4
–
The I-bit in the CCR is cleared
2.4.2.1
Power consumption during WAIT mode
Power consumption during WAIT mode depends on how many systems are active. The power
consumption will be highest when all the systems (A/D, timer, EEPROM and SCI) are active, and
lowest when the EEPROM erase and programming mechanism, SCI and A/D are disabled. The
timer cannot be disabled in WAIT mode. It is important that before entering WAIT mode, the
programmer sets the relevant control bits for the individual modules to reflect the desired
functionality during WAIT mode.
Power consumption may be further reduced by the use of SLOW mode.
Freescale
2-8
MODES OF OPERATION AND PIN DESCRIPTIONS
MC68HC05B6
Rev. 4.1
2.4.3
SLOW mode
The SLOW mode function is controlled by the SM bit in the miscellaneous register at location
$000C. It allows the user to insert, under software control, an extra divide-by-16 between the
oscillator and the internal clock driver (see Figure 2-4). This feature permits a slow down of all the
internal operations and thus reduces power consumption. The SLOW mode function should not
be enabled while using the A/D converter or while erasing/programming the EEPROM unless the
internal A/D RC oscillator is turned on.
OSC2
OSC1
pin
pin
fOSC
Oscillator
fOSC/2
÷2
÷ 16
fOSC/32
SM–bit
(bit 1, $000C)
Control logic
Main internal clock
Figure 2-4 Slow mode divider block diagram
2.4.3.1
Miscellaneous register
Miscellaneous
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
$000C
POR
INTP
INTN
INTE
SFA
SFB
SM
State
on reset
bit 0
WDOG ?001 000?
SM — Slow mode
1 (set)
–
0 (clear) –
The system runs at a bus speed 16 times lower than normal
(fOSC/32). SLOW mode affects all sections of the device, including
SCI, A/D and timer.
The system runs at normal bus speed (fOSC/2).
The SM bit is cleared by external or power-on reset. The SM bit is automatically cleared when
entering STOP mode.
Note:
The bits shown shaded in the above representation are explained individually in the
relevant sections of this manual. The complete register plus an explanation of each bit
can be found in Section 3.8.
MC68HC05B6
Rev. 4.1
MODES OF OPERATION AND PIN DESCRIPTIONS
Freescale
2-9
2
2.5
Pin descriptions
2.5.1
VDD and VSS
2
Power is supplied to the microcontroller using these two pins. VDD is the positive supply and VSS
is ground.
It is in the nature of CMOS designs that very fast signal transitions occur on the MCU pins. These
short rise and fall times place very high short-duration current demands on the power supply. To
prevent noise problems, special care must be taken to provide good power supply by-passing at
the MCU. By-pass capacitors should have good high-frequency characteristics and be as close to
the MCU as possible. Bypassing requirements vary, depending on how heavily the MCU pins are
loaded.
2.5.2
IRQ
This is an input-only pin for external interrupt sources. Interrupt triggering is selected using the
INTP and INTN bits in the miscellaneous register, to be one of four options detailed in Table 9-3.
In addition, the external interrupt facility (IRQ) can be disabled using the INTE bit in the
miscellaneous register (see Section 3.8). It is only possible to change the interrupt option bits in
the miscellaneous register while the I-bit is set. Selecting a different interrupt option will
automatically clear any pending interrupts. Further details of the external interrupt procedure can
be found in Section 9.2.3.1.
The IRQ pin contains an internal Schmitt trigger as part of its input to improve noise immunity.
2.5.3
RESET
This active low I/O pin is used to reset the MCU. Applying a logic zero to this pin forces the device
to a known start-up state. An external RC-circuit can be connected to this pin to generate a
power-on-reset (POR) if required. In this case, the time constant must be great enough to allow
the oscillator circuit to stabilize. This input has an internal Schmitt trigger to improve noise
immunity. When a reset condition occurs internally, i.e. from the COP watchdog, the RESET pin
provides an active-low open drain output signal that may be used to reset external hardware.
2.5.4
TCAP1
The TCAP1 input controls the input capture 1 function of the on-chip programmable timer system.
Freescale
2-10
MODES OF OPERATION AND PIN DESCRIPTIONS
MC68HC05B6
Rev. 4.1
2.5.5
TCAP2
The TCAP2 input controls the input capture 2 function of the on-chip programmable timer system.
2.5.6
TCMP1
The TCMP1 pin is the output of the output compare 1 function of the timer system.
2.5.7
TCMP2
The TCMP2 pin is the output of the output compare 2 function of the timer system.
2.5.8
OSC1, OSC2
These pins provide control input for an on-chip oscillator circuit. A crystal, ceramic resonator or
external clock signal connected to these pins supplies the oscillator clock. The oscillator frequency
(fOSC) is divided by two to give the internal bus frequency (fOP). There is also a software option
which introduces an additional divide by 16 into the oscillator clock, giving an internal bus
frequency of fOSC/32.
2.5.8.1
Crystal
The circuit shown in Figure 2-5(a) is recommended when using either a crystal or a ceramic
resonator. Figure 2-5(d) lists the recommended capacitance and feedback resistance values. The
internal oscillator is designed to interface with an AT-cut parallel-resonant quartz crystal resonator
in the frequency range specified for fOSC (see Section 11.4). Use of an external CMOS oscillator
is recommended when crystals outside the specified ranges are to be used. The crystal and
associated components should be mounted as close as possible to the input pins to minimise
output distortion and start-up stabilisation time. The manufacturer of the particular crystal being
considered should be consulted for specific information.
2.5.8.2
Ceramic resonator
A ceramic resonator may be used instead of a crystal in cost sensitive applications. The circuit shown
in Figure 2-5(a) is recommended when using either a crystal or a ceramic resonator. Figure 2-5(d)
lists the recommended capacitance and feedback resistance values. The manufacturer of the
particular ceramic resonator being considered should be consulted for specific information.
MC68HC05B6
Rev. 4.1
MODES OF OPERATION AND PIN DESCRIPTIONS
Freescale
2-11
2
2.5.8.3
2
External clock
An external clock should be applied to the OSC1 input, with the OSC2 pin left unconnected, as
shown in Figure 2-5(c). The tOXOV or tILCH specifications (see Section 11.4) do not apply when
using an external clock input. The equivalent specification of the external clock source should be
used in lieu of tOXOV or tILCH.
L
C1
RS
OSC1
OSC2
MCU
OSC1
C0
OSC2
RP
(b) Crystal equivalent circuit
COSC2
COSC1
MCU
OSC1
OSC2
External
clock
NC
(a) Crystal/ceramic resonator
oscillator connections
(c) External clock source connections
Crystal
RS(max)
C0
Ceramic resonator
2MHz
4MHz
Unit
400
75
Ω
RS(typ)
2 – 4MHz
10
Unit
Ω
5
7
pF
C0
40
pF
8
12
ƒF
C1
4.3
pF
COSC1
15 – 40 15 – 30
pF
COSC1
30
pF
COSC2
15 – 30 15 – 25
pF
COSC2
30
pF
C1
RP
10
10
MΩ
RP
1 – 10
MΩ
Q
30 000
40 000
—
Q
1250
—
(d) Typical crystal and ceramic resonator parameters
Figure 2-5 Oscillator connections
Freescale
2-12
MODES OF OPERATION AND PIN DESCRIPTIONS
MC68HC05B6
Rev. 4.1
2.5.9
RDI (Receive data in)
2
The RDI pin is the input pin of the SCI receiver.
2.5.10
TDO (Transmit data out)
The TDO pin is the output pin of the SCI transmitter.
2.5.11
SCLK
The SCLK pin is the clock output pin of the SCI transmitter.
2.5.12
PLMA
The PLMA pin is the output of pulse length modulation converter A.
2.5.13
PLMB
The PLMB pin is the output of pulse length modulation converter B.
2.5.14
VPP1
The VPP1 pin is the output of the charge pump for the EEPROM1 array.
2.5.15
VRH
The VRH pin is the positive reference voltage for the A/D converter.
2.5.16
VRL
The VRL pin is the negative reference voltage for the A/D converter.
2.5.17
PA0 – PA7/PB0 – PB7/PC0 – PC7
These 24 I/O lines comprise ports A, B and C. The state of any pin is software programmable, and
all the pins are configured as inputs during power-on or reset.
Under software control the PC2 pin can output the internal E-clock (see Section 4.2).
2.5.18
PD0/AN0–PD7/AN7
This 8-bit input only port (D) shares its pins with the A/D converter. When enabled, the A/D
converter uses pins PD0/AN0 – PD7/AN7 as its analog inputs. On reset, the A/D converter is
disabled which forces the port D pins to be input only port pins (see Section 8.5).
MC68HC05B6
Rev. 4.1
MODES OF OPERATION AND PIN DESCRIPTIONS
Freescale
2-13
2
THIS PAGE LEFT BLANK INTENTIONALLY
Freescale
2-14
MODES OF OPERATION AND PIN DESCRIPTIONS
MC68HC05B6
Rev. 4.1
3
3
MEMORY AND REGISTERS
The MC68HC05B6 MCU is capable of addressing 8192 bytes of memory and registers with its
program counter. The memory map includes 5950 bytes of User ROM (including User vectors),
432 bytes of self check ROM, 176 bytes of RAM and 256 bytes of EEPROM.
3.1
Registers
All the I/O, control and status registers of the MC68HC05B6 are contained within the first 32-byte
block of the memory map, as shown in Figure 3-1. The miscellaneous register is shown in
Section 3.8 as this register contains bits which are relevant to several modules.
3.2
RAM
The user RAM comprises 176 bytes of memory, from $0050 to $00FF. This is shared with a 64
byte stack area. The stack begins at $00FF and may extend down to $00C0.
Note:
3.3
Using the stack area for data storage or temporary work locations requires care to prevent
the data from being overwritten due to stacking from an interrupt or subroutine call.
ROM
The User ROM consists of 5950 bytes of ROM mapped as follows:
•
48 bytes of page zero ROM from $0020 to $004F
•
5888 bytes of User ROM from $0800 to $1EFF
•
14 bytes of User vectors from $1FF2 to $1FFF
MC68HC05B6
Rev. 4.1
MEMORY AND REGISTERS
Freescale
3-1
3.4
Self-check ROM
There are two areas of self-check ROM (ROMI and ROMII) located from $0200 to $02BF (192
bytes) and $1F00 to $1FEF (240 bytes) respectively.
3
MC68HC05B6
Registers
$0000
I/O
(32 bytes)
$0020
Page 0 User
ROM
(48 bytes)
$0050
$00C0
$0100
$0101
$0120
RAM
(176 bytes)
Stack
OPTR (1 byte)
Non protected (31 bytes)
EEPROM
(256 bytes)
Protected (224 bytes)
$0200
Self-check ROM I
(192 bytes)
$02C0
$0800
$1F00
User ROM
(5888 bytes)
Self-check ROM II
(240 bytes)
$1FF0
SCI
$1FF2–3
Timer overflow
$1FF4–5
$1FF6–7 Timer output compare 1& 2
$1FF8–9 Timer input capture 1 & 2
External IRQ
$1FFA–B
$1FFC–D
SWI
$1FFE–F Reset/power-on reset
Port A data register
$0000
Port B data register
$0001
Port C data register
$0002
Port D input data register
$0003
Port A data direction register
$0004
Port B data direction register
$0005
Port C data direction register
$0006
EEPROM/ECLK control register
$0007
A/D data register
$0008
A/D status/control register
$0009
Pulse length modulation A
$000A
Pulse length modulation B
$000B
Miscellaneous register
$000C
SCI baud rate register
$000D
SCI control register 1
$000E
SCI control register 2
$000F
SCI status register
$0010
SCI data register
$0011
Timer control register
$0012
Timer status register
$0013
Capture high register 1
$0014
Capture low register 1
$0015
Compare high register 1
$0016
Compare low register 1
$0017
Counter high register
$0018
Counter low register
$0019
Alternate counter high register
$001A
Alternate counter low register
$001B
Capture high register 2
$001C
Capture low register 2
$001D
Compare high register 2
$001E
Compare low register 2
$001F
Options register
$0100
User vectors
(14 bytes)
Reserved
Figure 3-1 Memory map of the MC68HC05B6
Freescale
3-2
MEMORY AND REGISTERS
MC68HC05B6
Rev. 4.1
3.5
EEPROM
The user EEPROM consists of 256 bytes of memory located from address $0100 to $01FF. 255
bytes are general purpose and 1 byte is used by the option register. The non-volatile EEPROM is
byte erasable.
An internal charge pump provides the EEPROM voltage (VPP1), which removes the need to supply
a high voltage for erase and programming functions. The charge pump is a capacitor/diode ladder
network which will give a very high impedance output of around 20-30 MΩ. The voltage of the
charge pump is visible at the VPP1 pin. During normal operation of the device, where
programming/erasing of the EEPROM array will occur, VPP1 should never be connected to either
VDD or VSS as this could prevent the charge pump reaching the necessary programming voltage.
Where it is considered dangerous to leave VPP1 unconnected for reasons of excessive noise in
a system, it may be tied to VDD; this will protect the EEPROM data but will also increase power
consumption, and therefore it is recommended that the protect bit function is used for regular
protection of EEPROM data (see Section 3.5.5).
In order to achieve a higher degree of security for stored data, there is no capability for bulk or row
erase operations.
The EEPROM control register ($0007) provides control of the EEPROM programming and erase
operations.
Warning: The VPP1 pin should never be connected to VSS, as this could cause permanent
damage to the device.
3.5.1
EEPROM control register
EEPROM/ECLK control
Address
bit 7
bit 6
bit 5
bit 4
$0007
0
0
0
0
bit 3
bit 2
bit 1
bit 0
State
on reset
ECLK E1ERA E1LAT E1PGM 0000 0000
ECLK
See Section 4.3 for a description of this bit.
E1ERA — EEPROM erase/programming bit
Providing the E1LAT and E1PGM bits are at logic one, this bit indicates whether the access to the
EEPROM is for erasing or programming purposes.
1 (set)
–
0 (clear) –
An erase operation will take place.
A programming operation will take place.
Once the program/erase EEPROM address has been selected, E1ERA cannot be changed.
MC68HC05B6
Rev. 4.1
MEMORY AND REGISTERS
Freescale
3-3
3
E1LAT — EEPROM programming latch enable bit
1 (set)
3
–
0 (clear) –
Address and data can be latched into the EEPROM for further
program or erase operations, providing the E1PGM bit is cleared.
Data can be read from the EEPROM. The E1ERA bit and the E1PGM
bit are reset to zero when E1LAT is ‘0’.
STOP, power-on and external reset clear the E1LAT bit.
Note:
After the tERA1 erase time or tPROG1 programming time, the E1LAT bit has to be reset
to zero in order to clear the E1ERA bit and the E1PGM bit.
E1PGM — EEPROM charge pump enable/disable
1 (set)
–
Internal charge pump generator switched on.
0 (clear) –
Internal charge pump generator switched off.
When the charge pump generator is on, the resulting high voltage is applied to the EEPROM array.
This bit cannot be set before the data is selected, and once this bit has been set it can only be
cleared by clearing the E1LAT bit.
A summary of the effects of setting/clearing bits 0, 1 and 2 of the control register are give in Table 3-1.
Table 3-1 EEPROM control bits description
E1ERA
Note:
Freescale
3-4
E1LAT E1PGM
Description
0
0
0
Read condition
0
1
0
Ready to load address/data for program/erase
0
1
1
Byte programming in progress
1
1
0
Ready for byte erase (load address)
1
1
1
Byte erase in progress
All combinations are not shown in the above table, since the E1PGM and E1ERA bits
are cleared when the E1LAT bit is at zero, and will result in a read condition.
MEMORY AND REGISTERS
MC68HC05B6
Rev. 4.1
3.5.2
EEPROM read operation
To be able to read from EEPROM, the E1LAT bit has to be at logic zero, as shown in Table 3-1.
While this bit is at logic zero, the E1PGM bit and the E1ERA bit are permanently reset to zero and
the 256 bytes of EEPROM may be read as if it were a normal ROM area. The internal charge pump
generator is automatically switched off since the E1PGM bit is reset.
If a read operation is executed while the E1LAT bit is set (erase or programming sequence), data
resulting from the operation will be $FF.
Note:
When not performing any programming or erase operation, it is recommended that
EEPROM should remain in the read mode (E1LAT = 0)
3.5.3
EEPROM erase operation
To erase the contents of a byte of the EEPROM, the following steps should be taken:
1
Set the E1LAT bit.
1) Set the E1ERA bit (1& 2 may be done simultaneously with the same
instruction).
2) Write address/data to the EEPROM address to be erased.
3) Set the E1PGM bit.
4) Wait for a time tERA1.
5) Reset the E1LAT bit (to logic zero).
While an erase operation is being performed, any access of the EEPROM array will not be
successful.
The erased state of the EEPROM is $FF and the programmed state is $00.
Note:
Data written to the address to be erased is not used, therefore its value is not
significant.
If a second word is to be erased, it is important that the E1LAT bit be reset before restarting the
erasing sequence otherwise any write to a new address will have no effect. This condition provides
a higher degree of security for the stored data.
User programs must be running from the RAM or ROM as the EEPROM will have its address and
data buses latched.
MC68HC05B6
Rev. 4.1
MEMORY AND REGISTERS
Freescale
3-5
3
3.5.4
EEPROM programming operation
To program a byte of EEPROM, the following steps should be taken:
3
1
Set the E1LAT bit.
2
Write address/data to the EEPROM address to be programmed.
3
Set the E1PGM bit.
4
Wait for time tPROG1.
5
Reset the E1LAT bit (to logic zero).
While a programming operation is being performed, any access of the EEPROM array will not be
successful.
Warning: To program a byte correctly, it has to have been previously erased. It is advised that this
is done only for 0→1 transitions, as this saves excessive overwriting of EEPROM.
If a second word is to be programmed, it is important that the E1LAT bit be reset before restarting
the programming sequence otherwise any write to a new address will have no effect. This
condition provides a higher degree of security for the stored data.
User programs must be running from the RAM or ROM as the EEPROM will have its address and
data buses latched.
Note:
224 bytes of EEPROM (address $0120 to $01FF) can be program and erase protected
under the control of bit 1 of the OPTR register detailed in Section 3.5.5.
3.5.5
Options register (OPTR)
This register (OPTR), located at $0100, contains the secure and protect functions for the
EEPROM and allows the user to select options in a non-volatile manner. The contents of the
OPTR register are loaded into data latches with each power-on or external reset.
Address
Options (OPTR)(1)
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
$0100
State
on reset
bit 1
bit 0
EE1P
SEC Not affected
(1) This register is implemented in EEPROM; therefore reset has no effect on the individual bits.
Freescale
3-6
MEMORY AND REGISTERS
MC68HC05B6
Rev. 4.1
EE1P – EEPROM protect bit
In order to achieve a higher degree of protection, the EEPROM is effectively split into two parts,
both working from the VPP1 charge pump. Part 1 of the EEPROM array (32 bytes from $0100 to
$011F) cannot be protected; part 2 (224 bytes from $0120 to $01FF) is protected by the EE1P bit
of the options register.
1 (set)
–
0 (clear) –
Part 2 of the EEPROM array is not protected; all 256 bytes of EEPROM
can be accessed for any read, erase or programming operations
Part 2 of the EEPROM array is protected; any attempt to erase or
program a location will be unsuccessful
When this bit is set to 1 (erased), the protection will remain until the next power-on or external
reset. EE1P can only be written to ‘0’ when the ELAT bit in the EEPROM control register is set.
SEC – Security bit
This high security bit allows the user to secure the EEPROM data from external accesses. When
the SEC bit is at ‘0’, the EEPROM contents are secured by preventing any entry to test mode. The
only way to erase the SEC bit to ‘1’ externally is to enter self-check mode, at which time the entire
EEPROM contents will be erased. When the SEC bit is changed, its new value will have no effect
until the next external or power-on reset.
3.6
EEPROM during STOP mode
When entering STOP mode, the EEPROM is automatically set to the read mode and the VPP1
high voltage charge pump generator is automatically disabled.
3.7
EEPROM during WAIT mode
The EEPROM is not affected by WAIT mode. Any program/erase operation will continue as in
normal operating mode. The charge pump is not affected by WAIT mode, therefore it is possible
to wait the tERA1 erase time or tPROG1 programming time in WAIT mode.
Under normal operating conditions, the charge pump generator is driven by the internal CPU
clocks. When the operating frequency is low, e.g. during WAIT mode, the clocking should be done
by the internal A/D RC oscillator. The RC oscillator is enabled by setting the ADRC bit of the A/D
status/control register at $0009.
MC68HC05B6
Rev. 4.1
MEMORY AND REGISTERS
Freescale
3-7
3
Table 3-2 Register outline
Register name
3
Address bit 7
Port A data (PORTA)
$0000
Port B data (PORTB)
$0001
Port C data (PORTC)
$0002
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State on
reset
Undefined
Undefined
PC2/
ECLK
Port D data (PORTD)
$0003
Port A data direction (DDRA)
$0004
0000 0000
0000 0000
Port B data direction (DDRB)
$0005
Port C data direction (DDRC)
$0006
EEPROM/ECLK control
$0007
A/D data (ADDATA)
$0008
A/D status/control (ADSTAT)
$0009
Pulse length modulation A (PLMA)
$000A
Pulse length modulation B (PLMB)
$000B
Miscellaneous
PD7
PD6
PD5
PD4
PD3
PD2
Undefined
PD1
PD0
Undefined
0000 0000
0
0
0
0
ECLK E1ERA E1LAT E1PGM 0000 0000
0
CH3
0000 0000
COCO ADRC ADON
CH2
CH1
CH0
0000 0000
0000 0000
0000 0000
$000C POR(1) INTP
INTN
INTE
SCT1
SCT0
SFA
SFB
SM
WDOG(2) ?001 000?
SCT0
SCR2
SCR1
SCR0 00uu uuuu
SCI baud rate (BAUD)
$000D
SPC1
SPC0
SCI control 1 (SCCR1)
$000E
R8
T8
SCI control 2 (SCCR2)
$000F
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SCI status (SCSR)
$0010
TDRE
TC
RDRF
IDLE
OR
NF
FE
SCI data (SCDR)
$0011
Timer control (TCR)
$0012
ICIE
OCIE
TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0
ICF1
OCF1
TOF
M
WAKE CPOL CPHA
LBCL
Undefined
SBK
0000 0000
1100 000u
0000 0000
ICF2
Undefined
Timer status (TSR)
$0013
Input capture high 1
$0014
OCF2
Input capture low 1
$0015
Undefined
Output compare high 1
$0016
Undefined
Output compare low 1
$0017
Undefined
Timer counter high
$0018
1111 1111
1111 1100
Undefined
Timer counter low
$0019
Alternate counter high
$001A
1111 1111
Alternate counter low
$001B
1111 1100
Input capture high 2
$001C
Undefined
Input capture low 2
$001D
Undefined
Output compare high 2
$001E
Undefined
Output compare low 2
$001F
Options (OPTR)(3)
$0100
Undefined
EE1P
SEC Not affected
(1) The POR bit is set each time there is a power-on reset.
(2) The state of the WDOG bit after reset is dependent on the mask option selected; 1=watchdog enabled, 0=watchdog disabled.
(3) This register is implemented in EEPROM; therefore reset has no effect on the individual bits.
Freescale
3-8
MEMORY AND REGISTERS
MC68HC05B6
Rev. 4.1
3.8
Miscellaneous register
Address
Miscellaneous
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
$000C POR(1) INTP
INTN
INTE
SFA
SFB
SM
bit 0
State
on reset
WDOG(2) ?001 000?
(1) The POR bit is set each time there is a power-on reset.
(2) The state of the WDOG bit after reset is dependent on the mask option selected; 1=watchdog enabled, 0=watchdog disabled.
POR — Power-on reset bit (see Section 9.1)
This bit is set each time the device is powered on. Therefore, the state of the POR bit allows the
user to make a software distinction between a power-on and an external reset. This bit cannot be
set by software and is cleared by writing it to zero.
1 (set)
–
0 (clear) –
A power-on reset has occurred.
No power-on reset has occurred.
INTP, INTN — External interrupt sensitivity options (see Section 9.2)
These two bits allow the user to select which edge the IRQ pin will be sensitive to (see Table 3-3).
Both bits can be written to only while the I-bit is set, and are cleared by power-on or external reset,
thus the device is initialised with negative edge and low level sensitivity.
Table 3-3 IRQ sensitivity
INTP
INTN
0
0
Negative edge and low level sensitive
IRQ sensitivity
0
1
Negative edge only
1
0
Positive edge only
1
1
Positive and negative edge sensitive
INTE — External interrupt enable (see Section 9.2)
1 (set)
–
External interrupt function (IRQ) enabled.
0 (clear) –
External interrupt function (IRQ) disabled.
The INTE bit can be written to only while the I-bit is set, and is set by power-on or external reset,
thus enabling the external interrupt function.
MC68HC05B6
Rev. 4.1
MEMORY AND REGISTERS
Freescale
3-9
3
SFA — Slow or fast mode selection for PLMA (see Section 7.1)
This bit allows the user to select the slow or fast mode of the PLMA pulse length modulation
output.
1 (set)
3
–
0 (clear) –
Slow mode PLMA (4096 x timer clock period).
Fast mode PLMA (256 x timer clock period).
SFB — Slow or fast mode selection for PLMB (see Section 7.1)
This bit allows the user to select the slow or fast mode of the PLMB pulse length modulation
output.
1 (set)
–
0 (clear) –
Note:
Slow mode PLMB (4096 x timer clock period).
Fast mode PLMB (256 x timer clock period).
The highest speed of the PLM system corresponds to the frequency of the TOF bit
being set, multiplied by 256. The lowest speed of the PLM system corresponds to the
frequency of the TOF bit being set, multiplied by 16.
Warning: Because the SFA bit and SFB bit are not double buffered, it is mandatory to set the SFA
bit and SFB bit to the desired values before writing to the PLM registers; not doing so
could temporarily give incorrect values at the PLM outputs.
SM — Slow mode (see Section 2.4.3)
1 (set)
–
0 (clear) –
The system runs at a bus speed 16 times lower than normal
(fOSC/32). SLOW mode affects all sections of the device, including
SCI, A/D and timer.
The system runs at normal bus speed (fOSC/2).
The SM bit is cleared by external or power-on reset. The SM bit is automatically cleared when
entering STOP mode.
WDOG — Watchdog enable/disable (see Section 9.1.4)
The WDOG bit can be used to enable the watchdog timer previously disabled by a mask option.
Following a watchdog reset the state of the WDOG bit is as defined by the mask option specified.
Once the watchdog is enabled, the WDOG bit acts as a reset mechanism for the watchdog
counter. Writing a’1’ to this bit clears the counter to its initial value and prevents a watchdog
timeout.
1 (set)
–
0 (clear) –
Freescale
3-10
Watchdog counter cleared and enabled.
The watchdog cannot be disabled by software; writing a zero to this
bit has no effect.
MEMORY AND REGISTERS
MC68HC05B6
Rev. 4.1
4
INPUT/OUTPUT PORTS
4
In single-chip mode, the MC68HC05B6 has a total of 24 I/O lines, arranged as three 8-bit ports
(A, B and C), and eight input-only lines, arranged as one 8-bit port (D). Each I/O line is individually
programmable as either input or output, under the software control of the data direction registers.
The 8-bit input-only port (D) shares its pins with the A/D converter, when the A/D converter is
enabled. To avoid glitches on the output pins, data should be written to the I/O port data register
before writing ones to the corresponding data direction register bits to set the pins to output mode.
4.1
Input/output programming
The bidirectional port lines may be programmed as inputs or outputs under software control. The
direction of each pin is determined by the state of the corresponding bit in the port data direction
register (DDR). Each port has an associated DDR. Any I/O port pin is configured as an output if
its corresponding DDR bit is set to a logic one. A pin is configured as an input if its corresponding
DDR bit is cleared to a logic zero.
At power-on or reset, all DDRs are cleared, thus configuring all port pins as inputs. The data
direction registers can be written to or read by the MCU. During the programmed output state, a
read of the data register actually reads the value of the output data latch and not the I/O pin. The
operation of the standard port hardware is shown schematically in Figure 4-1.
MC68HC05B6
Rev. 4.1
INPUT/OUTPUT PORTS
Freescale
4-1
M68HC05 internal connections
4
Data direction
register bit
DDRn
Latched data
register bit
DATA
Output
buffer
I/O
Pin
O/P
data
buffer
Input
buffer
DDRn
DATA
I/O Pin
Output



1
0
0
1
1
1
Input



0
0
tristate
0
1
tristate
Figure 4-1 Standard I/O port structure
Table 4-1 shows the effect of reading from or writing to an I/O pin in various circumstances. Note
that the read/write signal shown is internal and not available to the user.
Table 4-1 I/O pin states
R/W
0
0
1
1
4.2
DDRn
0
1
0
1
Action of MCU write to/read of data bit
The I/O pin is in input mode. Data is written into the output data latch.
Data is written into the output data latch, and output to the I/O pin.
The state of the I/O pin is read.
The I/O pin is in output mode. The output data latch is read.
Ports A and B
These ports are standard M68HC05 bidirectional I/O ports, each comprising a data register and
a data direction register.
Reset does not affect the state of the data register, but clears the data direction register, thereby
returning all port pins to input mode. Writing a ‘1’ to any DDR bit sets the corresponding port pin
to output mode.
Freescale
4-2
INPUT/OUTPUT PORTS
MC68HC05B6
Rev. 4.1
4.3
Port C
In addition to the standard port functions described for port A and B, port C pin 2 can be
configured, using the ECLK bit of the EEPROM/ECLK control register, to output the CPU clock. If
this is selected the corresponding DDR bit is automatically set and bit 2 of port C will always read
the output data latch. The other port C pins are not affected by this feature.
EEPROM/ECLK control
Address
bit 7
bit 6
bit 5
bit 4
$0007
0
0
0
0
bit 3
bit 2
bit 1
bit 0
State
on reset
ECLK E1ERA E1LAT E1PGM 0000 0000
ECLK — External clock output bit
1 (set)
–
0 (clear) –
ECLK CPU clock is output on PC2.
ECLK CPU clock is not output on PC2; port C acts as a normal I/O port.
The ECLK bit is cleared by power-on or external reset. It is not affected by the execution of a STOP
or WAIT instruction.
The timing diagram of the clock output is shown in Figure 4-2.
Internal clock (PHI2)
External clock (ECLK/PC2)
Output port (if write to output port)
Figure 4-2 ECLK timing diagram
4.4
Port D
This 8-bit input-only port shares its pins with the A/D converter subsystem. When the A/D
converter is enabled, pins PD0-PD7 read the eight analog inputs to the A/D converter. Port D can
be read at any time, however, if it is read during an A/D conversion sequence noise, may be
injected on the analog inputs, resulting in reduced accuracy of the A/D. Furthermore, performing
MC68HC05B6
Rev. 4.1
INPUT/OUTPUT PORTS
Freescale
4-3
4
a digital read of port D with levels other than VDD or VSS on the port D pins will result in greater
power dissipation during the read cycle.
As port D is an input-only port there is no DDR associated with it. Also, at power up or external
reset, the A/D converter is disabled, thus the port is configured as a standard input-only port.
Note:
It is recommended that all unused input ports and I/O ports be tied to an appropriate
logic level (i.e. either VDD or VSS).
4
4.5
Port registers
The following sections explain in detail the individual bits in the data and control registers
associated with the ports.
4.5.1
Port data registers A and B (PORTA and PORTB)
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
Port A data (PORTA)
$0000
Undefined
Port B data (PORTB)
$0001
Undefined
Each bit can be configured as input or output via the corresponding data direction bit in the port
data direction register (DDRx).
The state of the port data registers following reset is not defined.
4.5.2
Port data register C (PORTC)
Address
Port C data (PORTC)
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
PC2/
ECLK
$0002
bit 1
bit 0
State
on reset
Undefined
Each bit can be configured as input or output via the corresponding data direction bit in the port
data direction register (DDRx).
In addition, bit 2 of port C is used to output the CPU clock if the ECLK bit in the EEPROM
CTL/ECLK register is set (see Section 4.3).
The state of the port data registers following reset is not defined.
Freescale
4-4
INPUT/OUTPUT PORTS
MC68HC05B6
Rev. 4.1
4.5.3
Port data register D (PORTD)
Port D data (PORTD)
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
$0003
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
Undefined
All the port D bits are input-only and are shared with the A/D converter. The function of each bit is
determined by the ADON bit in the A/D status/control register.
4
The state of the port data registers following reset is not defined.
4.5.3.1
A/D status/control register
Address
A/D status/control
$0009
bit 7
bit 6
bit 5
COCO ADRC ADON
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
0
CH3
CH2
CH1
CH0
0000 0000
ADON — A/D converter on
1 (set)
–
0 (clear) –
A/D converter is switched on; all port D pins act as analog inputs for
the A/D converter.
A/D converter is switched off; all port D pins act as input only pins.
Reset clears the ADON bit, thus configuring port D as an input only port.
4.5.4
Data direction registers (DDRA, DDRB and DDRC)
Address
Port A data direction (DDRA)
bit 7
bit 6
bit 5
bit 4
bit 3
$0004
bit 2
bit 1
bit 0
State
on reset
0000 0000
Port B data direction (DDRB)
$0005
0000 0000
Port C data direction (DDRC)
$0006
0000 0000
Writing a ‘1’ to any bit configures the corresponding port pin as an output; conversely, writing any
bit to ‘0’ configures the corresponding port pin as an input.
Reset clears these registers, thus configuring all ports as inputs.
MC68HC05B6
Rev. 4.1
INPUT/OUTPUT PORTS
Freescale
4-5
4.6
Other port considerations
All output ports can emulate ‘open-drain’ outputs. This is achieved by writing a zero to the relevant
output port latch. By toggling the corresponding data direction bit, the port pin will either be an
output zero or tri-state (an input). This is shown diagrammatically in Figure 4-3.
4
When using a port pin as an ‘open-drain’ output, certain precautions must be taken in the user
software. If a read-modify-write instruction is used on a port where the ‘open-drain’ is assigned
and the pin at this time is programmed as an input, it will read it as a ‘one’. The read-modify-write
instruction will then write this ‘one’ into the output data latch on the next cycle. This would cause
the ‘open-drain’ pin not to output a ‘zero’ when desired.
Note:
‘Open-drain’ outputs should not be pulled above VDD.
Read buffer output
(a)
A
Y
Data direction register bit DDRn
DDRn
A
1
0
Y
1
1
0
0
0
1
1
0
low
1
1
—
0
0
high
0
1
high


 Normal operation – tri state
tri state 
tri state 
0
1
(b)


 ‘Open-drain’


VDD
VDD
Px0
‘Open-drain’ output
(c)
DDRx, bit 0 = 0
Portx, bit 0 = 0
DDRx, bit 0 = 0
Portx, bit 0 = 0
Figure 4-3 Port logic levels
Freescale
4-6
INPUT/OUTPUT PORTS
MC68HC05B6
Rev. 4.1
5
PROGRAMMABLE TIMER
The programmable timer on the MC68HC05B6 consists of a 16-bit read-only free-running counter,
with a fixed divide-by-four prescaler, plus the input capture/output compare circuitry. The timer can
be used for many purposes including measuring pulse length of two input signals and generating
two output signals. Pulse lengths for both input and output signals can vary from several
microseconds to many seconds. In addition, it works in conjunction with the pulse length
modulation (PLM) system, which can also be referred to as the pulse width modulation system, to
execute two 8-bit D/A PLM (pulse length modulation) conversions, with a choice of two repetition
rates. The timer is also capable of generating periodic interrupts or indicating passage of an
arbitrary multiple of four CPU cycles. A block diagram is shown in Figure 5-1, and timing diagrams
are shown in Figure 5-2, Figure 5-3, Figure 5-4 and Figure 5-5.
The timer has a 16-bit architecture, hence each specific functional segment is represented by two
8-bit registers (except the PLMA and PLMB which use one 8-bit register for each). These registers
contain the high and low byte of that functional segment. Accessing the low byte of a specific timer
function allows full control of that function; however, an access of the high byte inhibits that specific
timer function until the low byte is also accessed.
The 16-bit programmable timer is monitored and controlled by a group of sixteen registers, full
details of which are contained in this section.
Note:
5.1
A problem may arise if an interrupt occurs in the time between the high and low bytes
being accessed. To prevent this, the I-bit in the condition code register (CCR) should be
set while manipulating both the high and low byte register of a specific timer function,
ensuring that an interrupt does not occur.
Counter
The key element in the programmable timer is a 16-bit, free-running counter or counter register,
preceded by a prescaler that divides the internal processor clock by four. The prescaler gives the
timer a resolution of 2µs if the internal bus clock is 2 MHz. The counter is incremented during the
low portion of the internal bus clock. Software can read the counter at any time without affecting
its value.
MC68HC05B6
Rev. 4.1
PROGRAMMABLE TIMER
Freescale
5-1
5
Internal bus
8
Internal
processor
clock
High
byte
Output
compare
register 1
5
Low
byte
High
byte
Output
compare
register 2
$0016
$0017
8-bit
buffer
Low
byte
High
byte
$001E
$001F
÷4
16-bit
$0018
free-running
$0019
counter
Counter
alternate
register
COP watchdog
counter input
To PLM
High
byte
Low
byte
Low
byte
High
byte
Input capture $0014
register 1 $0015
Low
byte
Input capture $001C
register 2 $001D
$001A
$001B
Internal timer bus
Output
compare
circuit 1
Edge
detect
circuit 2
Edge
detect
circuit 1
Overflow
detect
circuit
Output
compare
circuit 2
TCAP2
pin
TCAP1
pin
D
+
C
D
7
6
5
4
3
ICF1
OCF1
TOF
ICF2
OCF2
+
Timer status
register
$0013
ICIE
OCIE
TOIE
FOLV2 FOLV1 OLVL2
IEDG1
OLVL1
C
Q
TCMP2
pin
Latch
Q
TCMP1
pin
Latch
Timer control
register
$0012
Interrupt circuit
Input capture
interrupt
$1FF8,9
Output compare
interrupt
$1FF6,7
Overflow interrupt
$1FF4,5
Figure 5-1 16-bit programmable timer block diagram
Freescale
5-2
PROGRAMMABLE TIMER
MC68HC05B6
Rev. 4.1
5.1.1
Counter register and alternate counter register
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
Timer counter high
$0018
1111 1111
Timer counter low
$0019
1111 1100
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
Alternate counter high
$001A
1111 1111
Alternate counter low
$001B
1111 1100
The double-byte, free-running counter can be read from either of two locations, $18-$19 (counter
register) or $1A-$1B (alternate counter register). A read from only the less significant byte (LSB)
of the free-running counter ($19 or $1B) receives the count value at the time of the read. If a read
of the free-running counter or alternate counter register first addresses the more significant byte
(MSB) ($18 or $1A), the LSB is transferred to a buffer. This buffer value remains fixed after the first
MSB read, even if the user reads the MSB several times. This buffer is accessed when reading
the free-running counter or alternate counter register LSB and thus completes a read sequence
of the total counter value. In reading either the free-running counter or alternate counter register,
if the MSB is read, the LSB must also be read to complete the sequence. If the timer overflow flag
(TOF) is set when the counter register LSB is read then a read of the timer status register (TSR)
will clear the flag.
The alternate counter register differs from the counter register only in that a read of the LSB does
not clear TOF. Therefore, where it is critical to avoid the possibility of missing timer overflow
interrupts due to clearing of TOF, the alternate counter register should be used.
The free-running counter is set to $FFFC during power-on and external reset and is always a
read-only register. During a power-on reset, the counter begins running after the oscillator start-up
delay. Because the free-running counter is 16 bits preceded by a fixed divide-by-4 prescaler, the
value in the free-running counter repeats every 262,144 internal bus clock cycles. TOF is set when
the counter overflows (from $FFFF to $0000); this will cause an interrupt if TOIE is set.
In some particular timing control applications it may be desirable to reset the 16-bit free running
counter under software control. When the low byte of the counter ($19 or $1B) is written to, the
counter is configured to its reset value ($FFFC).
The divide-by-4 prescaler is also reset and the counter resumes normal counting operation. All of
the flags and enable bits remain unaltered by this operation. If access has previously been made
to the high byte of the free-running counter ($18 or $1A), then the reset counter operation
terminates the access sequence.
Warning: This operation may affect the function of the watchdog system (see Section 9.1.4). The
PLM results will also be affected while resetting the counter.
MC68HC05B6
Rev. 4.1
PROGRAMMABLE TIMER
Freescale
5-3
5
5.2
Timer control and status
The various functions of the timer are monitored and controlled using the timer control and status
registers described below.
5.2.1
Timer control register (TCR)
The timer control register ($0012) is used to enable the input captures (ICIE), output compares
(OCIE), and timer overflow (TOIE) functions as well as forcing output compares (FOLV1 and
FOLV2), selecting input edge sensitivity (IEDG1) and levels of output polarity (OLV1 and OLV2).
5
Timer control (TCR)
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
Address
bit 7
bit 6
bit 5
$0012
ICIE
OCIE
TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0
ICIE — Input captures interrupt enable
If this bit is set, a timer interrupt is enabled whenever the ICF1 or ICF2 status flag (in the timer
status register) is set.
1 (set)
–
Interrupt enabled.
0 (clear) –
Interrupt disabled.
OCIE — Output compares interrupt enable
If this bit is set, a timer interrupt is enabled whenever the OCF1 or OCF2 status flag (in the timer
status register) is set.
1 (set)
–
Interrupt enabled.
0 (clear) –
Interrupt disabled.
TOIE — Timer overflow interrupt enable
If this bit is set, a timer interrupt is enabled whenever the TOF status flag (in the timer status
register) is set.
1 (set)
–
Interrupt enabled.
0 (clear) –
Interrupt disabled.
Freescale
5-4
PROGRAMMABLE TIMER
MC68HC05B6
Rev. 4.1
FOLV2 — Force output compare 2
This bit always reads as zero, hence writing a zero to this bit has no effect. Writing a one at this position
will force the OLV2 bit to the corresponding output level latch, thus appearing at the TCMP2 pin. Note
that this bit does not affect the OCF2 bit of the status register (see Section 5.4.3).
1 (set)
–
0 (clear) –
OLV2 bit forced to output level latch.
No effect.
FOLV1 — Force output compare 1
This bit always reads as zero, hence writing a zero to this bit has no effect. Writing a one at this position
will force the OLV1 bit to the corresponding output level latch, thus appearing at the TCMP1 pin. Note
that this bit does not affect the OCF1 bit of the status register (see Section 5.4.3).
1 (set)
–
0 (clear) –
OLV1 bit forced to output level latch.
No effect.
OLV2 — Output level 2
When OLV2 is set a high output level will be clocked into the output level register by the next
successful output compare, and will appear on the TCMP2 pin. When clear, it will be a low level
which will appear on the TCMP2 pin.
1 (set)
–
0 (clear) –
A high output level will appear on the TCMP2 pin.
A low output level will appear on the TCMP2 pin.
IEDG1 — Input edge 1
When IEDG1 is set, a positive-going edge on the TCAP1 pin will trigger a transfer of the
free-running counter value to the input capture register 1. When clear, a negative-going edge
triggers the transfer.
1 (set)
–
0 (clear) –
Note:
TCAP1 is positive-going edge sensitive.
TCAP1 is negative-going edge sensitive.
There is no need for an equivalent bit for the input capture register 2 as TCAP2 is
negative-going edge sensitive only.
OLV1 — Output level 1
When OLV1 is set a high output level will be clocked into the output level register by the next
successful output compare, and will appear on the TCMP1 pin. When clear, it will be a low level
which will appear on the TCMP1 pin.
1 (set)
–
0 (clear) –
MC68HC05B6
Rev. 4.1
A high output level will appear on the TCMP1 pin.
A low output level will appear on the TCMP1 pin.
PROGRAMMABLE TIMER
Freescale
5-5
5
5.2.2
Timer status register (TSR)
The timer status register ($13) is a read only register and contains the status bits corresponding
to the four timer interrupt conditions – ICF1,OCF1, TOF, ICF2 and OCF2.
Accessing the timer status register satisfies the first condition required to clear the status bits. The
remaining step is to access the register corresponding to the status bit.
Address
bit 7
bit 6
bit 5
bit 4
bit 3
$0013
ICF1
OCF1
TOF
ICF2
OCF2
Timer status (TSR)
5
bit 2
bit 1
bit 0
State
on reset
Undefined
ICF1 — Input capture flag 1
This bit is set when the selected polarity of edge is detected by the input capture edge detector 1
at TCAP1; an input capture interrupt will be generated, if ICIE is set. ICF1 is cleared by reading
the TSR and then the input capture low register 1 ($15).
1 (set)
–
0 (clear) –
A valid input capture has occurred.
No input capture has occurred.
OCF1 — Output compare flag 1
This bit is set when the output compare 1 register contents match those of the free-running
counter; an output compare interrupt will be generated if OCIE is set. OCF1 is cleared by reading
the TSR and then reading or writing the output compare 1 low register ($17).
1 (set)
–
0 (clear) –
A valid output compare has occurred.
No output compare has occurred.
TOF — Timer overflow status flag
This bit is set when the free-running counter overflows from $FFFF to $0000; a timer overflow interrupt
will occur if TOIE is set. TOF is cleared by reading the TSR and the counter low register ($19).
1 (set)
–
0 (clear) –
Timer overflow has occurred.
No timer overflow has occurred.
When using the timer overflow function and reading the free-running counter at random times to
measure an elapsed time, a problem may occur whereby the timer overflow flag is unintentionally
cleared if:
1
The timer status register is read or written when TOF is set, and
1) The LSB of the free-running counter is read, but not for the purpose of
servicing the flag.
Reading the alternate counter register instead of the counter register will avoid this potential
problem.
Freescale
5-6
PROGRAMMABLE TIMER
MC68HC05B6
Rev. 4.1
ICF2 — Input capture flag 2
This bit is set when a negative edge is detected by the input capture edge detector 2 at TCAP2;
an input capture interrupt will be generated if ICIE is set. ICF2 is cleared by reading the TSR and
then the input capture low register 2 ($1D).
1 (set)
–
A valid (negative) input capture has occurred.
0 (clear) –
No input capture has occurred.
OCF2 — Output compare flag 2
This bit is set when the output compare 2 register contents match those of the free-running
counter; an output compare interrupt will be generated if OCIE is set. OCF2 is cleared by reading
the TSR and then reading or writing the output compare 2 low register ($1F).
1 (set)
–
A valid output compare has occurred.
0 (clear) –
5.3
No output compare has occurred.
Input capture
‘Input capture’ is a technique whereby an external signal is used to trigger a read of the free
running counter. In this way it is possible to relate the timing of an external signal to the internal
counter value, and hence to elapsed time.
There are two input capture registers: input capture register 1 (ICR1) and input capture register 2 (ICR2).
The same input capture interrupt enable bit (ICIE) is used for the two input captures.
5.3.1
Input capture register 1 (ICR1)
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
Input capture high 1
$0014
Undefined
Input capture low 1
$0015
Undefined
The two 8-bit registers that make up the 16-bit input capture register 1 are read-only, and are used
to latch the value of the free-running counter after the input capture edge detector circuit 1 senses
a valid transition at TCAP1. The level transition that triggers the counter transfer is defined by the
input edge bit (IEDG1). When an input capture 1 occurs, the corresponding flag ICF1 in TSR is
set. An interrupt can also accompany an input capture 1 provided the ICIE bit in TCR is set. The
8 most significant bits are stored in the input capture high 1 register at $14, the 8 least significant
bits in the input capture low 1 register at $15.
MC68HC05B6
Rev. 4.1
PROGRAMMABLE TIMER
Freescale
5-7
5
5
The result obtained from an input capture will be one greater than the value of the free-running
counter on the rising edge of the internal bus clock preceding the external transition. This delay is
required for internal synchronization. Resolution is one count of the free-running counter, which is
four internal bus clock cycles. The free-running counter contents are transferred to the input
capture register 1 on each valid signal transition whether the input capture 1 flag (ICF1) is set or
clear. The input capture register 1 always contains the free-running counter value that
corresponds to the most recent input capture 1. After a read of the input capture 1 register MSB
($14), the counter transfer is inhibited until the LSB ($15) is also read. This characteristic causes
the time used in the input capture software routine and its interaction with the main program to
determine the minimum pulse period. A read of the input capture 1 register LSB ($15) does not
inhibit the free-running counter transfer since the two actions occur on opposite edges of the
internal bus clock.
Reset does not affect the contents of the input capture 1 register, except when exiting STOP mode
(see Section 5.6).
5.3.2
Input capture register 2 (ICR2)
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
Input capture high 2
$001C
Undefined
Input capture low 2
$001D
Undefined
The two 8-bit registers that make up the 16-bit input capture register 2 are read-only, and are used
to latch the value of the free-running counter after the input capture edge detector circuit 2 senses
a negative transition at pin TCAP2. When an input capture 2 occurs, the corresponding flag ICF2
in TSR is set. An interrupt can also accompany an input capture 2 provided the ICIE bit in TCR is
set.The 8 most significant bits are stored in the input capture 2 high register at $1C, the 8 least
significant bits in the input capture 2 low register at $1D.
The result obtained from an input capture will be one greater than the value of the free-running
counter on the rising edge of the internal bus clock preceding the external transition. This delay is
required for internal synchronization. Resolution is one count of the free-running counter, which is
four internal bus clock cycles. The free-running counter contents are transferred to the input
capture register 2 on each negative signal transition whether the input capture 2 flag (IC2F) is set
or clear. The input capture register 2 always contains the free-running counter value that
corresponds to the most recent input capture 2. After a read of the input capture register 2 MSB
($1C), the counter transfer is inhibited until the LSB ($1D) is also read. This characteristic causes
the time used in the input capture software routine and its interaction with the main program to
determine the minimum pulse period. A read of the input capture register 2 LSB ($1C) does not
inhibit the free-running counter transfer since the two actions occur on opposite edges of the
internal bus clock.
Reset does not affect the contents of the input capture 2 register, except when exiting STOP mode
(see Section 5.6).
Freescale
5-8
PROGRAMMABLE TIMER
MC68HC05B6
Rev. 4.1
5.4
Output compare
‘Output compare’ is a technique which may be used, for example, to generate an output waveform,
or to signal when a specific time period has elapsed, by presetting the output compare register to
the appropriate value.
There are two output compare registers: output compare register 1 (OCR1) and output compare
register 2 (OCR2), both of which are read or write registers.
Note:
The same output compare interrupt enable bit (OCIE) is used for the two output
compares.
5.4.1
5
Output compare register 1 (OCR1)
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
Output compare high 1
$0016
Undefined
Output compare low 1
$0017
Undefined
The 16-bit output compare register 1 is made up of two 8-bit registers at locations $16 (MSB) and
$17 (LSB). The contents of the output compare register 1 are compared with the contents of the
free-running counter continually and, if a match is found, the corresponding output compare flag
(OCF1) in the timer status register is set and the output level (OLVL1) is transferred to pin TCMP1.
The output compare register 1 values and the output level bit should be changed after each
successful comparison to establish a new elapsed timeout. An interrupt can also accompany a
successful output compare provided the corresponding interrupt enable bit (OCIE) is set. (The
free-running counter is updated every four internal bus clock cycles.)
After a processor write cycle to the output compare register 1 containing the MSB ($16), the output
compare function is inhibited until the LSB ($17) is also written. The user must write both bytes
(locations) if the MSB is written first. A write made only to the LSB ($17) will not inhibit the compare
1 function. The processor can write to either byte of the output compare register 1 without affecting
the other byte. The output level (OLVL1) bit is clocked to the output level register and hence to the
TCMP1 pin whether the output compare flag 1 (OCF1) is set or clear. The minimum time required
to update the output compare register 1 is a function of the program rather than the internal
hardware. Because the output compare flag 1 and the output compare register 1 are not defined
at power on, and not affected by reset, care must be taken when initializing output compare
functions with software. The following procedure is recommended:
–
Write to output compare high 1 to inhibit further compares;
–
Read the timer status register to clear OCF1 (if set);
–
Write to output compare low 1 to enable the output compare 1 function.
MC68HC05B6
Rev. 4.1
PROGRAMMABLE TIMER
Freescale
5-9
The purpose of this procedure is to prevent the OCF1 bit from being set between the time it is read
and the write to the corresponding output compare register.
All bits of the output compare register are readable and writable and are not altered by the timer
hardware or reset. If the compare function is not needed, the two bytes of the output compare
register can be used as storage locations.
5.4.2
Output compare register 2 (OCR2)
Address
5
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
Output compare high 2
$001E
Undefined
Output compare low 2
$001F
Undefined
The 16-bit output compare register 2 is made up of two 8-bit registers at locations $1E (MSB) and
$1F (LSB). The contents of the output compare register 2 are compared with the contents of the
free-running counter continually and, if a match is found, the corresponding output compare flag
(OCF2) in the timer status register is set and the output level (OLVL2) is transferred to pin TCMP2.
The output compare register 2 values and the output level bit should be changed after each
successful comparison to establish a new elapsed timeout. An interrupt can also accompany a
successful output compare provided the corresponding interrupt enable bit (OCIE) is set. (The
free-running counter is updated every four internal bus clock cycles.)
After a processor write cycle to the output compare register 2 containing the MSB ($1E), the
output compare function is inhibited until the LSB ($1F) is also written. The user must write both
bytes (locations) if the MSB is written first. A write made only to the LSB ($1F) will not inhibit the
compare 2 function. The processor can write to either byte of the output compare register 2 without
affecting the other byte. The output level (OLVL2) bit is clocked to the output level register and
hence to the TCMP2 pin whether the output compare flag 2 (OCF2) is set or clear. The minimum
time required to update the output compare register 2 is a function of the program rather than the
internal hardware. Because the output compare flag 2 and the output compare register 2 are not
defined at power on, and not affected by reset, care must be taken when initializing output
compare functions with software. The following procedure is recommended:
–
Write to output compare high 2 to inhibit further compares;
–
Read the timer status register to clear OCF2 (if set);
–
Write to output compare low 2 to enable the output compare 2 function.
Freescale
5-10
PROGRAMMABLE TIMER
MC68HC05B6
Rev. 4.1
The purpose of this procedure is to prevent the OCF1 bit from being set between the time it is read
and the write to the corresponding output compare register.
All bits of the output compare register are readable and writable and are not altered by the timer
hardware or reset. If the compare function is not needed, the two bytes of the output compare
register can be used as storage locations.
5.4.3
Software force compare
A software force compare is required in many applications. To achieve this, bit 3 (FOLV1 for OCR1)
and bit 4 (FOLV2 for OCR2) in the timer control register are used. These bits always read as ‘zero’,
but a write to ‘one’ causes the respective OLVL1 or OLVL2 values to be copied to the respective
output level (TCMP1 and TCMP2 pins).
Internal logic is arranged such that in a single instruction, one can change OLVL1 and/or OLVL2,
at the same time causing a forced output compare with the new values of OLVL1 and OLVL2. In
conjunction with normal compare, this function allows a wide range of applications including fixed
frequency generation.
Note:
5.5
A software force compare will affect the corresponding output pin TCMP1 and/or
TCMP2, but will not affect the compare flag, thus it will not generate an interrupt.
Pulse Length Modulation (PLM)
The programmable timer works in conjunction with the PLM system to execute two 8-bit D/A PLM
conversions, with a choice of two repetition rates (see Section 7).
5.5.1
Pulse length modulation registers A and B (PLMA/PLMB)
Address
Pulse length modulation A (PLMA)
MC68HC05B6
Rev. 4.1
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
$000A
Address
Pulse length modulation B (PLMB)
bit 7
State
on reset
0000 0000
bit 7
bit 6
bit 5
bit 4
$000B
PROGRAMMABLE TIMER
bit 3
bit 2
bit 1
bit 0
State
on reset
0000 0000
Freescale
5-11
5
5.6
Timer during STOP mode
When the MCU enters STOP mode, the timer counter stops counting and remains at that
particular count value until STOP mode is exited by an interrupt. If STOP mode is exited by
power-on or external reset, the counter is forced to $FFFC but if it is exited by external interrupt
(IRQ) then the counter resumes from its stopped value.
Another feature of the programmable timer is that if at least one valid input capture edge occurs
at one of the TCAP pins while in STOP mode, the corresponding input capture detect circuitry is
armed. This action does not wake the MCU or set any timer flags, but when the MCU does
wake-up there will be an active input capture flag (and data) from that first valid edge which
occurred during STOP mode.
5
If STOP mode is exited by an external reset then no such input capture flag or data action takes
place even if there was a valid input capture edge (at one of the TCAP pins) during STOP mode.
5.7
Timer during WAIT mode
The timer system is not affected by WAIT mode and continues normal operation. Any valid timer
interrupt will wake-up the system.
5.8
Timer state diagrams
The relationships between the internal clock signals, the counter contents and the status of the
flag bits are shown in the following figures. It should be noted that the signals labelled ‘internal’
(processor clock, timer clocks and reset) are not available to the user.
Freescale
5-12
PROGRAMMABLE TIMER
MC68HC05B6
Rev. 4.1
Internal
processor clock
Internal
reset
Internal
timer clocks
 T00
 T01
 T10

 T11
16-bit
counter
$FFFC
$FFFD
$FFFE
$FFFF
5
External reset
or end of POR
Note:
The counter and timer control registers are the only ones affected by power-on or external reset.
Figure 5-2 Timer state timing diagram for reset
Internal
processor clock
Internal
timer clocks
 T00
 T01
 T10

 T11
16-bit
counter
$F124
$F125
$F126
}
}
}
}
Input
edge
$F123
Internal
capture latch
Input capture
register
$????
$F124
Input capture
flag
Note:
If the input edge occurs in the shaded area from one timer state T10 to the next timer state T10, then
the input capture flag will be set during the next T11 state.
Figure 5-3 Timer state timing diagram for input capture
MC68HC05B6
Rev. 4.1
PROGRAMMABLE TIMER
Freescale
5-13
Internal
processor clock
Internal
timer clocks
 T00
 T01

T10

 T11
16-bit
counter
$F456
$F457
$F458
$F459
(Note 1)
Output compare
register
5
CPU writes $F457
(Note 1)
Compare register
latch
(Note 2)
Output compare
flag and TCMP1,2
Note:
$F457
1
The CPU write to the compare registers may take place at any time, but a compare only occurs at timer state
T01. Thus a four cycle difference may exist between the write to the compare register and the actual compare.
1)
The output compare flag is set at the timer state T11 that follows the comparison match ($F457 in this example).
Figure 5-4 Timer state timing diagram for output compare
Internal
processor clock
Internal
timer clocks
 T00
 T01
 T10

 T11
16-bit
counter
$FFFF
$0000
$0001
$0002
Timer overflow
flag
Note:
The timer overflow flag is set at timer state T11 (transition of counter from $FFFF to $0000). It is cleared
by a read of the timer status register during the internal processor clock high time, followed by a read of the
counter low register.
Figure 5-5 Timer state timing diagram for timer overflow
Freescale
5-14
PROGRAMMABLE TIMER
MC68HC05B6
Rev. 4.1
6
SERIAL COMMUNICATIONS INTERFACE
A full-duplex asynchronous serial communications interface (SCI) is provided with a standard
non-return-to-zero (NRZ) format and a variety of baud rates. The SCI transmitter and receiver are
functionally independent and have their own baud rate generator; however they share a common
baud rate prescaler and data format.
The serial data format is standard mark/space (NRZ) and provides one start bit, eight or nine data
bits, and one stop bit.
6
The SCLK pin is the output of the transmitter clock. It outputs the transmitter data clock for
synchronous transmission (no clocks on start bit and stop bit, and a software option to send clock
on last data bit). This allows control of peripherals containing shift registers (e.g. LCD drivers).
Phase and polarity of these clocks are software programmable.
Any SCI bidirectional communication requires a two-wire system: receive data in (RDI) and
transmit data out (TDO).
‘Baud’ and ‘bit rate’ are used synonymously in the following description.
6.1
SCI two-wire system features
•
Standard NRZ (mark/space) format
•
Advanced error detection method with noise detection for noise duration of up to 1/16th bit time
•
Full-duplex operation (simultaneous transmit and receive)
•
32 software selectable baud rates
•
Different baud rates for transmit and receive; for each transmit baud rate, 8 possible receive
baud rates
•
Software selectable word length (eight or nine bits)
•
Separate transmitter and receiver enable bits
•
Capable of being interrupt driven
•
Transmitter clocks available without altering the regular transmitter or receiver functions
•
Four separate enable bits for interrupt control
71
MC68HC05B6
Rev. 4.1
SERIAL COMMUNICATIONS INTERFACE
Freescale
6-1
Internal bus
SCI interrupt
+
$0011
(See note)
Transmit
data register
$0011
(See note)
&
&
&
&
Transmit
data shift
register
TDO
pin
+
6
7
TRDE
TE
6
TC
5
RDRF
7
6
5
4
3
2
1
0
Receive
data shift
register
RDI
pin
SCSR
$0010
4
IDLE
3
OR
2
NF
1
FE
Wake up
unit
7
SBK
Flag
control
Transmitter
control
Receiver
control
Transmitter
clock
SCLK
pin
$000F
SCCR2
TIE
TCIE
RIE
ILIE
TE
RE
SBK
RWU
Receive
data register
Receiver
clock
Clock extraction
phase and
polarity control
7
R8
Note:
6
T8
5
4
M
3
WAKE
2
CPOL
1
CPHA
0
LBCL
SCCR1
$000E
The serial communications data register (SCI SCDR) is controlled by the internal
R/W signal. It is the transmit data register when written to and the receive data
register when read.
Figure 6-1 Serial communications interface block diagram
71
Freescale
6-2
SERIAL COMMUNICATIONS INTERFACE
MC68HC05B6
Rev. 4.1
6.2
SCI receiver features
•
Receiver wake-up function (idle line or address bit)
•
Idle line detection
•
Framing error detection
•
Noise detection
•
Overrun detection
•
Receiver data register full flag
6.3
SCI transmitter features
•
Transmit data register empty flag
•
Transmit complete flag
•
Send break
6.4
6
Functional description
A block diagram of the SCI is shown in Figure 6-1. Option bits in serial control register1 (SCCR1)
select the ‘wake-up’ method (WAKE bit) and data word length (M-bit) of the SCI. SCCR2 provides
control bits that individually enable the transmitter and receiver, enable system interrupts and
provide the wake-up enable bit (RWU) and the send break code bit (SBK). Control bits in the baud
rate register (BAUD) allow the user to select one of 32 different baud rates for the transmitter and
receiver (see Section 6.11.5).
Data transmission is initiated by writing to the serial communications data register (SCDR).
Provided the transmitter is enabled, data stored in the SCDR is transferred to the transmit data
shift register. This transfer of data sets the transmit data register empty flag (TDRE) in the SCI
status register (SCSR) and generates an interrupt (if transmitter interrupts are enabled). The
transfer of data to the transmit data shift register is synchronized with the bit rate clock (see
Figure 6-2). All data is transmitted least significant bit first. Upon completion of data transmission,
the transmission complete flag (TC) in the SCSR is set (provided no pending data, preamble or
break is to be sent) and an interrupt is generated (if the transmit complete interrupt is enabled). If
the transmitter is disabled, and the data, preamble or break (in the transmit data shift register) has
been sent, the TC bit will also be set. This will also generate an interrupt if the transmission
complete interrupt enable bit (TCIE) is set. If the transmitter is disabled during a transmission, the
character being transmitted will be completed before the transmitter gives up control of the
TDO pin.
71
MC68HC05B6
Rev. 4.1
SERIAL COMMUNICATIONS INTERFACE
Freescale
6-3
When SCDR is read, it contains the last data byte received, provided that the receiver is enabled.
The receive data register full flag bit (RDRF) in the SCSR is set to indicate that a data byte has
been transferred from the input serial shift register to the SCDR; this will cause an interrupt if the
receiver interrupt is enabled. The data transfer from the input serial shift register to the SCDR is
synchronized by the receiver bit rate clock. The OR (overrun), NF (noise), or FE (framing) error
flags in the SCSR may be set if data reception errors occurred.
An idle line interrupt is generated if the idle line interrupt is enabled and the IDLE bit (which detects
idle line transmission) in SCSR is set. This allows a receiver that is not in the wake-up mode to
detect the end of a message or the preamble of a new message, or to resynchronize with the
transmitter. A valid character must be received before the idle line condition or the IDLE bit will not
be set and idle line interrupt will not be generated.
6
The SCP0 and SCP1 bits function as a prescaler for SCR0–SCR2 to generate the receiver baud rate
and for SCT0–SCT2 to generate the transmitter baud rate. Together, these eight bits provide multiple
transmitter/receiver rate combinations for a given crystal frequency (see Figure 6-2). This register
should only be written to while both the transmitter and receiver are disabled (TE=0, RE=0).
Internal processor clock
SCP0 – SCP1
prescaler
rate control
(÷ NP)
SCR0 – SCR2
receiver
rate control
(÷ NR)
SCT0 – SCT2
transmitter
rate control
(÷ NT)
÷16
Transmitter clock
Note:
SCP1
SPC0
SCT2
SCT1
SCT0
SCR2
SCR1
SCR0
7
6
5
4
3
2
1
0
Baud rate register
$000D
Receiver clock
There is a fixed rate divide-by-16 before the transmitter to compensate for the inherent divide-by-16 of the receiver (sampling).
This means that by loading the same value for both the transmitter and receiver baud rate selector, the same baud rates can
be obtained.
Figure 6-2 SCI rate generator division
71
Freescale
6-4
SERIAL COMMUNICATIONS INTERFACE
MC68HC05B6
Rev. 4.1
6.5
Data format
Receive data or transmit data is the serial data that is transferred to the internal data bus from the
receive data input pin (RDI) or from the internal bus to the transmit data output pin (TDO). The
non-return-to-zero (NRZ) data format shown in Figure 6-3 is used and must meet the following
criteria:
–
The idle line is brought to a logic one state prior to transmission/reception of
a character.
–
A start bit (logic zero) is used to indicate the start of a frame.
–
The data is transmitted and received least significant bit first.
–
A stop bit (logic one) is used to indicate the end of a frame. A frame consists
of a start bit, a character of eight or nine data bits, and a stop bit.
–
A break is defined as the transmission or reception of a low (logic zero) for at
least one complete frame time (10 zeros for 8-bit format, 11 zeros for 9-bit).
6
Control bit M selects
8 or 9 bit data



Idle line
0
1
2
3
4
5
6
7
0
8
Start
Stop Start
Figure 6-3 Data format
6.6
Receiver wake-up operation
The receiver logic hardware also supports a receiver wake-up function which is intended for
systems having more than one receiver. With this function a transmitting device directs messages
to an individual receiver or group of receivers by passing addressing information as the initial
byte(s) of each message. The wake-up function allows receivers not addressed to remain in a
dormant state for the remainder of the unwanted message. This eliminates any further software
overhead to service the remaining characters of the unwanted message and thus improves
system performance.
The receiver is placed in wake-up mode by setting the receiver wake-up bit (RWU) in the SCCR2
register. While RWU is set, all of the receiver related status flags (RDRF, IDLE, OR, NF, and FE)
are inhibited (cannot become set). Note that the idle line detect function is inhibited while the RWU
bit is set. Although RWU may be cleared by a software write to SCCR2, it would be unusual to do
so. Normally RWU is set by software and is cleared automatically in hardware by one of the two
methods described below.
71
MC68HC05B6
Rev. 4.1
SERIAL COMMUNICATIONS INTERFACE
Freescale
6-5
6.6.1
Idle line wake-up
In idle line wake-up mode, a dormant receiver wakes up as soon as the RDI line becomes idle.
Idle is defined as a continuous logic high level on the RDI line for ten (or eleven) full bit times.
Systems using this type of wake-up must provide at least one character time of idle between
messages to wake up sleeping receivers, but must not allow any idle time between characters
within a message.
6.6.2
6
Address mark wake-up
In address mark wake-up, the most significant bit (MSB) in a character is used to indicate whether
it is an address (1) or data (0) character. Sleeping receivers will wake up whenever an address
character is received. Systems using this method for wake-up would set the MSB of the first
character of each message and leave it clear for all other characters in the message. Idle periods
may be present within messages and no idle time is required between messages for this wake-up
method.
6.7
Receive data in (RDI)
Receive data is the serial data that is applied through the input line and the SCI to the internal bus.
The receiver circuitry clocks the input at a rate equal to 16 times the baud rate. This time is referred
to as the RT rate in Figure 6-4 and as the receiver clock in Figure 6-2.
The receiver clock generator is controlled by the baud rate register, as shown in Figure 6-1 and
Figure 6-2; however, the SCI is synchronized by the start bit, independent of the transmitter.
Once a valid start bit is detected, the start bit, each data bit and the stop bit are sampled three
times at RT intervals 8 RT, 9 RT and 10 RT (1 RT is the position where the bit is expected to start),
as shown in Figure 6-5. The value of the bit is determined by voting logic which takes the value of
the majority of the samples. A noise flag is set when all three samples on a valid start bit or data
bit or the stop bit do not agree.
6.8
Start bit detection
When the input (idle) line is detected low, it is tested for three more sample times (referred to as
the start edge verification samples in Figure 6-4). If at least two of these three verification samples
detect a logic zero, a valid start bit has been detected, otherwise the line is assumed to be idle. A
noise flag is set if one of the three verification samples detect a logic one, thus a valid start bit
could be assumed with a set noise flag present.
71
Freescale
6-6
SERIAL COMMUNICATIONS INTERFACE
MC68HC05B6
Rev. 4.1
16X internal sampling clock
RT clock edges for all three examples
1RT 2RT 3RT 4RT 5RT 6RT 7RT 8RT
Idle
Start
RDI
1
1
1
1
1
1
1
1
1
1
1
Start
qualifiers
0
0
Start
0
0
Start edge
verification samples
Noise
RDI
1
1
1
1
1
1
1
1
1
1
1
0
0
1
0
0
0
0
Start
Noise
RDI
1
1
1
1
1
0
1
1
1
1
1
0
6
Figure 6-4 SCI examples of start bit sampling technique
Previous bit
Present bit
Next bit
<
<
<
RDI
Samples
16RT 1RT
8RT 9RT 10RT
16RT 1RT
Figure 6-5 SCI sampling technique used on all bits
If there has been a framing error without detection of a break (10 zeros for 8 bit format or 11 zeros
for 9 bit format), the circuit continues to operate as if there actually was a stop bit, and the start
edge will be placed artificially. The last bit received in the data shift register is inverted to a logic
one, and the three logic one start qualifiers (shown in Figure 6-4) are forced into the sample shift
register during the interval when detection of a start bit is anticipated (see Figure 6-6); therefore,
the start bit will be accepted no sooner than it is anticipated.
71
MC68HC05B6
Rev. 4.1
SERIAL COMMUNICATIONS INTERFACE
Freescale
6-7
If the receiver detects that a break (RDRF = 1, FE = 1, receiver data register = $0000) produced
the framing error, the start bit will not be artificially induced and the receiver must actually detect
a logic one before the start bit can be recognised (see Figure 6-7).
Data
Expected stop
Artificial edge
Data
Start bit
RDI
Data samples
a) Case 1: receive line low during artificial edge
Data
6
Expected stop
Start edge
Data
Start bit
RDI
Data samples
b) Case 2: receive line high during expected start edge
Figure 6-6 Artificial start following a framing error
Expected stop
Detected as valid start edge
Break
Start bit













RDI
Data samples
Start
qualifiers
Start edge
verification
samples
Figure 6-7 SCI start bit following a break
6.9
Transmit data out (TDO)
Transmit data is the serial data from the internal data bus that is applied through the SCI to the
output line. Data format is as discussed in Section 6.5 and shown in Figure 6-3. The transmitter
generates a bit time by using a derivative of the RT clock, thus producing a transmission rate equal
to 1/16th that of the receiver sample clock (assuming the same baud rate is selected for both the
receiver and transmitter).
71
Freescale
6-8
SERIAL COMMUNICATIONS INTERFACE
MC68HC05B6
Rev. 4.1
6.10
SCI synchronous transmission
The SCI transmitter allows the user to control a one way synchronous serial transmission. The
SCLK pin is the clock output of the SCI transmitter. No clocks are sent to that pin during start bit
and stop bit. Depending on the state of the LBCL bit (bit 0 of SCCR1), clocks will or will not be
activated during the last valid data bit (address mark). The CPOL bit (bit 2 of SCCR1) allows the
user to select the clock polarity, and the CPHA bit (bit 1 of SCCR1) allows the user to select the
phase of the external clock (see Figure 6-8, Figure 6-9 and Figure 6-10).
During idle, preamble and send break, the external SCLK clock is not activated.
These options allow the user to serially control peripherals which consist of shift registers, without
losing any functions of the SCI transmitter which can still talk to other SCI receivers. These options
do not affect the SCI receiver which is independent of the transmitter.
The SCLK pin works in conjunction with the TDO pin. When the SCI transmitter is disabled
(TE = 0), the SCLK and TDO pins go to the high impedance state.
Note:
6
The LBCL, CPOL and CPHA bits have to be selected before enabling the transmitter
to ensure that the clocks function correctly. These bits should not be changed while the
transmitter is enabled.
RDI
Data out
TDO
Data in
Asynchronous
(e.g. Modem)
SCLK
MC68HC05B6
Data in
Clock
Output port
Enable
Synchronous
(e.g. shift register,
display driver, etc.)
Figure 6-8 SCI example of synchronous and asynchronous transmission
71
MC68HC05B6
Rev. 4.1
SERIAL COMMUNICATIONS INTERFACE
Freescale
6-9
6.11
SCI registers
The SCI system is configured and controlled by five registers: SCDR, SCCR1, SCCR2, SCSR,
and BAUD.
6.11.1
Serial communications data register (SCDR)
Address
SCI data (SCDR)
6
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
$0011
State
on reset
0000 0000
The SCDR is controlled by the internal R/W signal and performs two functions in the SCI. It acts
as the receive data register (RDR) when it is read and as the transmit data register (TDR) when it
is written. Figure 6-1 shows this register as two separate registers, RDR and TDR. The RDR
provides the interface from the receive shift register to the internal data bus and the TDR provides
the parallel interface from the internal data bus to the transmit shift register.
The receive data register is a read-only register containing the last byte of data received from the
shift register for the internal data bus. The RDR full bit (RDRF) in the serial communications status
register is set to indicate that a byte has been transferred from the input serial shift register to the
SCDR. The transfer is synchronized with the receiver bit rate clock (from the receiver control) as
shown in Figure 6-1. All data is received with the least significant bit first.
The transmit data register (TDR) is a write-only register containing the next byte of data to be
applied to the transmit shift register from the internal data bus. As long as the transmitter is
enabled, data stored in the SCDR is transferred to the transmit shift register (after the current byte
in the shift register has been transmitted).
The transfer is synchronized with the transmitter bit rate clock (from the transmitter control) as
shown in Figure 6-1. All data is received with the least significant bit first.
6.11.2
Serial communications control register 1 (SCCR1)
SCI control 1 (SCCR1)
Address
bit 7
bit 6
$000E
R8
T8
bit 5
bit 4
M
bit 3
bit 2
bit 1
WAKE CPOL CPHA
bit 0
State
on reset
LBCL
Undefined
The SCI control register 1 (SCCR1) contains control bits related to the nine data bit character
format, the receiver wake-up feature and the options to output the transmitter clocks for
synchronous transmissions.
71
Freescale
6-10
SERIAL COMMUNICATIONS INTERFACE
MC68HC05B6
Rev. 4.1
R8 — Receive data bit 8
This read-only bit is the ninth serial data bit received when the SCI system is configured for nine
data bit operation (M = 1). The most significant bit (bit 8) of the received character is transferred
into this bit at the same time as the remaining eight bits (bits 0–7) are transferred from the serial
receive shifter to the SCI receive data register.
T8 — Transmit data bit 8
This read/write bit is the ninth data bit to be transmitted when the SCI system is configured for nine
data bit operation (M = 1). When the eight low order bits (bits 0–7) of a transmit character are
transferred from the SCI data register to the serial transmit shift register, this bit (bit 8) is
transferred to the ninth bit position of the shifter.
M — Mode (select character format)
The read/write M-bit controls the character length for both the transmitter and receiver at the same
time. The 9th data bit is most commonly used as an extra stop bit or it can also be used as a parity
bit (see Table 6-1).
1 (set)
–
Start bit, 9 data bits, 1 stop bit.
0 (clear) –
Start bit, 8 data bits, 1 stop bit.
6
Table 6-1 Method of receiver wake-up
WAKE
M
Method of receiver wake-up
0
x
Detection of an idle line allows the next data type received to cause the receive
data register to fill and produce an RDRF flag.
1
0
Detection of a received one in the eighth data bit allows an RDRF flag and
associated error flags.
1
1
Detection of a received one in the ninth data bit allows an RDRF flag and
associated error flags.
x = Don’t care
WAKE — Wake-up mode select
This bit allows the user to select the method for receiver wake-up. The WAKE bit can be read or
written to any time. See Table 6-1.
1 (set)
–
Wake-up on address mark; if RWU is set, SCI will wake-up if the 8th
(if M=0) or 9th (if M=1) bit received on the Rx line is set.
0 (clear) –
Wake-up on idle line; if RWU is set, SCI will wake-up after 11 (if M=0)
or 12 (if M=1) consecutive ‘1’s on the Rx line.
71
MC68HC05B6
Rev. 4.1
SERIAL COMMUNICATIONS INTERFACE
Freescale
6-11
CPOL – Clock polarity
This bit allows the user to select the polarity of the clocks to be sent to the SCLK pin. It works in
conjunction with the CPHA bit to produce the desired clock-data relation (see Figure 6-9 and
Figure 6-10).
1 (set)
–
0 (clear) –
Steady high value at SCLK pin outside transmission window.
Steady low value at SCLK pin outside transmission window.
This bit should not be manipulated while the transmitter is enabled.
CPHA – Clock phase
This bit allows the user to select the phase of the clocks to be sent to the SCLK pin. This bit works
in conjunction with the CPOL bit to produce the desired clock-data relation (see Figure 6-9 and
Figure 6-10).
6
1 (set)
–
0 (clear) –
SCLK clock line activated at beginning of data bit.
SCLK clock line activated in middle of data bit.
This bit should not be manipulated while the transmitter is enabled.
Idle or preceding
transmission
M = 0 (8 data bits)
Start
Stop
clock
(CPOL = 0, CPHA = 0)
*
clock
(CPOL = 0, CPHA = 1)
*
clock
(CPOL = 1, CPHA = 0)
*
clock
(CPOL = 1, CPHA = 1)
data
Idle or next
transmission
*
0
Start LSB
1
2
3
4
5
7
6
MSB Stop
* LBCL bit controls last data clock
Figure 6-9 SCI data clock timing diagram (M=0)
71
Freescale
6-12
SERIAL COMMUNICATIONS INTERFACE
MC68HC05B6
Rev. 4.1
Idle or preceding
transmission
Idle or next
Stop transmission
M = 1 (9 data bits)
Start
clock
(CPOL = 0, CPHA = 0)
*
clock
(CPOL = 0, CPHA = 1)
*
clock
(CPOL = 1, CPHA = 0)
*
clock
(CPOL = 1, CPHA = 1)
*
data
0
1
2
3
4
5
7
6
8
MSB Stop
Start LSB
6
* LBCL bit controls last data clock
Figure 6-10 SCI data clock timing diagram (M=1)
LBCL – Last bit clock
This bit allows the user to select whether the clock associated with the last data bit transmitted
(MSB) has to be output to the SCLK pin. The clock of the last data bit is output to the SCLK pin if
the LBCL bit is a logic one, and is not output if it is a logic zero.
The last bit is the 8th or 9th data bit transmitted depending on the 8 or 9 bit format selected by
M-bit (seeTable 6-2).
This bit should not be manipulated while the transmitter is enabled.
Table 6-2 SCI clock on SCLK pin
Data format
M-bit
LBCL bit
Number of clocks on
SCLK pin
8 bit
0
0
7
8 bit
0
1
8
9 bit
1
0
8
9 bit
1
1
9
71
MC68HC05B6
Rev. 4.1
SERIAL COMMUNICATIONS INTERFACE
Freescale
6-13
6.11.3
Serial communications control register 2 (SCCR2)
The SCI control register 2 (SCCR2) provides the control bits that enable/disable individual SCI
functions.
SCI control (SCCR2)
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
$000F
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SBK
0000 0000
TIE — Transmit interrupt enable
1 (set)
6
–
TDRE interrupts enabled.
0 (clear) –
TDRE interrupts disabled.
TCIE — Transmit complete interrupt enable
1 (set)
–
TC interrupts enabled.
0 (clear) –
TC interrupts disabled.
RIE — Receiver interrupt enable
1 (set)
–
RDRF and OR interrupts enabled.
0 (clear) –
RDRF and OR interrupts disabled.
ILIE — Idle line interrupt enable
1 (set)
–
IDLE interrupts enabled.
0 (clear) –
IDLE interrupts disabled.
TE — Transmitter enable
When the transmit enable bit is set, the transmit shift register output is applied to the TDO line and
the corresponding clocks are applied to the SCLK pin. Depending on the state of control bit M
(SCCR1), a preamble of 10 (M = 0) or 11 (M = 1) consecutive ones is transmitted when software
sets the TE bit from a cleared state.
If a transmission is in progress and a zero is written to TE, the transmitter will wait until after the
present byte has been transmitted before placing the TDO and the SCLK pin in the idle, high
impedance state.
If the TE bit has been written to a zero and then set to a one before the current byte is transmitted,
the transmitter will wait for that byte to be transmitted and will then initiate transmission of a new
preamble. After this latest transmission, and provided the TDRE bit is set (no new data to
transmit), the line remains idle (driven high while TE = 1); otherwise, normal transmission occurs.
This function allows the user to neatly terminate a transmission sequence.
71
Freescale
6-14
SERIAL COMMUNICATIONS INTERFACE
MC68HC05B6
Rev. 4.1
After loading the last byte in the serial communications data register and receiving the TDRE flag,
the user should clear TE. Transmission of the last byte will then be completed and the line will go
idle.
1 (set)
–
Transmitter enabled.
0 (clear) –
Transmitter disabled.
RE — Receiver enable
1 (set)
–
Receiver enabled.
0 (clear) –
Receiver disabled.
When RE is clear (receiver disabled) all the status bits associated with the receiver (RDRF, IDLE,
OR, NF and FE) are inhibited.
RWU — Receiver wake-up
When the receiver wake-up bit is set by the user software, it puts the receiver to sleep and enables
the wake-up function. The type of wake-up mode for the receiver is determined by the WAKE bit
discussed above (in the SCCR1). When the RWU bit is set, no status flags will be set. Flags which
were set previously will not be cleared when RWU is set.
6
If the WAKE bit is cleared, RWU is cleared by the SCI logic after receiving 10 (M = 0) or 11 (M =1)
consecutive ones. Under these conditions, RWU cannot be set if the line is idle. If the WAKE bit is
set, RWU is cleared after receiving an address bit. The RDRF flag will then be set and the address
byte stored in the receiver data register.
SBK — Send break
If the send break bit is toggled set and cleared, the transmitter sends 10 (M = 0) or 11 (M = 1)
zeros and then reverts to idle sending data. If SBK remains set, the transmitter will continually
send whole blocks of zeros (sets of 10 or 11) until cleared. At the completion of the break code,
the transmitter sends at least one high bit to guarantee recognition of a valid start bit.
71
MC68HC05B6
Rev. 4.1
SERIAL COMMUNICATIONS INTERFACE
Freescale
6-15
6.11.4
Serial communications status register (SCSR)
SCI status (SCSR)
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
$0010
TDRE
TC
RDRF
IDLE
OR
NF
FE
bit 0
State
on reset
1100 000u
The serial communications status register (SCSR) provides inputs to the interrupt logic circuits for
generation of the SCI system interrupt. In addition, a noise flag bit and a framing error bit are also
contained in the SCSR.
TDRE — Transmit data register empty flag
This bit is set when the contents of the transmit data register are transferred to the serial shift
register. New data will not be transmitted unless the SCSR register is read before writing to the
transmit data register to clear the TDRE flag.
6
If the TDRE bit is clear, this indicates that the transfer has not yet occurred and a write to the serial
communications data register will overwrite the previous value. The TDRE bit is cleared by
accessing the serial communications status register (with TDRE set) followed by writing to the
serial communications data register.
TC — Transmit complete flag
This bit is set to indicate that the SCI transmitter has no meaningful information to transmit (no
data in shifter, no preamble, no break). When TC is set the serial line will go idle (continuous
MARK). The TC bit is cleared by accessing the serial communications status register (with TC set)
followed by writing to the serial communications data register. It does not inhibit the transmitter
function in any way.
RDRF — Receive data register full flag
This bit is set when the contents of the receiver serial shift register are transferred to the receiver
data register.
If multiple errors are detected in any one received word, the NF and RDRF bits will be affected as
appropriate during the same clock cycle. The RDRF bit is cleared when the serial communications
status register is accessed (with RDRF set) followed by a read of the serial communications data
register.
IDLE — Idle line detected flag
This bit is set when a receiver idle line is detected (the receipt of a minimum of ten/eleven
consecutive “1”s). This bit will not be set by the idle line condition when the RWU bit is set. This
allows a receiver that is not in the wake-up mode to detect the end of a message, detect the
preamble of a new message or resynchronize with the transmitter. The IDLE bit is cleared by
accessing the serial communications status register (with IDLE set) followed by a read of the serial
communications data register. Once cleared, IDLE will not be set again until after RDRF has been
set, (i.e. until after the line has been active and becomes idle again).
71
Freescale
6-16
SERIAL COMMUNICATIONS INTERFACE
MC68HC05B6
Rev. 4.1
OR — Overrun error flag
This bit is set when a new byte is ready to be transferred from the receiver shift register to the
receiver data register and the receive data register is already full (RDRF bit is set). Data transfer
is inhibited until the RDRF bit is cleared. Data in the serial communications data register is valid
in this case, but additional data received during an overrun condition (including the byte causing
the overrun) will be lost.
The OR bit is cleared when the serial communications status register is accessed (with OR set)
followed by a read of the serial communications data register.
NF — Noise error flag
This bit is set if there is noise on a ‘valid’ start bit, any of the data bits or on the stop bit. The NF
bit is not set by noise on the idle line nor by invalid start bits. If there is noise, the NF bit is not set
until the RDRF flag is set. Each data bit is sampled three times as described in Section 6.7.
The NF bit represents the status of the byte in the serial communications data register. For the
byte being received (shifted in) there will be also a ‘working’ noise flag, the value of which will be
transferred to the NF bit when the serial data is loaded into the serial communications data
register. The NF bit does not generate an interrupt because the RDRF bit gets set with NF and
can be used to generate the interrupt.
6
The NF bit is cleared when the serial communications status register is accessed (with NF set)
followed by a read of the serial communications data register.
FE — Framing error flag
This bit is set when the word boundaries in the bit stream are not synchronized with the receiver
bit counter (generated by the reception of a logic zero bit where a stop bit was expected). The FE
bit reflects the status of the byte in the receive data register and the transfer from the receive shifter
to the receive data register is inhibited by an overrun. The FE bit is set during the same cycle as
the RDRF bit but does not get set in the case of an overrun (OR). The framing error flag inhibits
further transfer of data into the receive data register until it is cleared.
The FE bit is cleared when the serial communications status register is accessed (with FE set)
followed by a read of the serial communications data register.
71
MC68HC05B6
Rev. 4.1
SERIAL COMMUNICATIONS INTERFACE
Freescale
6-17
6.11.5
Baud rate register (BAUD)
The baud rate register provides the means to select two different or equivalent baud rates for the
transmitter and receiver.
SCI baud rate (BAUD)
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
$000D
SCP1
SCP0
SCT2
SCT1
SCT0
SCR2
SCR1
bit 0
State
on reset
SCR0 00uu uuuu
SCP1, SCP0 — Serial prescaler select bits
These read/write bits determine the prescale factor, NP, by which the internal processor clock is
divided before it is applied to the transmitter and receiver rate control dividers, NT and NR. This
common prescaled output is used as the input to a divider that is controlled by the SCR0–SCR2
bits for the SCI receiver, and by the SCT0–SCT2 bits for the transmitter.
6
Table 6-3 First prescaler stage
SCP1
SCP0
Prescaler
division ratio (NP)
0
0
1
0
1
3
1
0
4
1
1
13
SCT2, SCT1,SCT0 — SCI rate select bits (transmitter)
These three read/write bits select the baud rates for the transmitter. The prescaler output is divided
by the factors shown in Table 6-4.
Table 6-4 Second prescaler stage (transmitter)
SCT2
SCT1
SCT0
Transmitter
division ratio (NT)
0
0
0
1
0
0
1
2
0
1
0
4
0
1
1
8
1
0
0
16
1
0
1
32
1
1
0
64
1
1
1
128
71
Freescale
6-18
SERIAL COMMUNICATIONS INTERFACE
MC68HC05B6
Rev. 4.1
SCR2, SCR1, SCR0 — SCI rate select bits (receiver)
These three read/write bits select the baud rates for the receiver. The prescaler output described
above is divided by the factors shown in Table 6-5.
Table 6-5 Second prescaler stage (receiver)
SCR2
SCR1
SCR0
Receiver
division ratio (NR)
0
0
0
1
0
0
1
2
0
1
0
4
0
1
1
8
1
0
0
16
1
0
1
32
1
1
0
64
1
1
1
128
6
The following equations are used to calculate the receiver and transmitter baud rates:
f op
baudTx = ----------------------------------16 • NP • NT
f op
baudRx = ----------------------------------16 • NP • NR
where:
NP = prescaler divide ratio
NT = transmitter baud rate divide ratio
NR = receiver baud rate divide ratio
baudTx = transmitter baud rate
baudRx = receiver baud rate
fOSC = oscillator frequency
6.12
Baud rate selection
The flexibility of the baud rate generator allows many different baud rates to be selected. A
particular baud rate may be generated in several ways by manipulating the various prescaler and
division ratio bits. Table 6-6 shows the baud rates that can be achieved, for five typical crystal
frequencies. These are effectively the highest baud rates which can be achieved using a given
crystal.
71
MC68HC05B6
Rev. 4.1
SERIAL COMMUNICATIONS INTERFACE
Freescale
6-19
Table 6-6 SCI baud rate selection
Crystal frequency – fOSC (MHz)
6
SCP1
SCP0
NP
NT/NR
4.194304
0
0
0
0
4.00
2.4576
2.00
1.8432
0
1
1
131072
125000
76800
62500
0
0
0
57600
0
1
1
2
65536
62500
38400
31250
0
0
28800
0
1
0
1
4
32768
31250
19200
15625
0
14400
0
0
1
1
1
8
16384
15625
9600
7813
7200
0
0
1
0
0
1
16
8192
7813
4800
3906
3600
0
0
1
0
1
1
32
4096
3906
2400
1953
1800
0
0
1
1
0
1
64
2048
1953
1200
977
900
0
0
1
1
1
1
128
1024
977
600
488
450
0
1
0
0
0
3
1
43691
41667
25600
20833
19200
0
1
0
0
1
3
2
21845
20833
12800
10417
9600
0
1
0
1
0
3
4
10923
10417
6400
5208
4800
0
1
0
1
1
3
8
5461
5208
3200
2604
2400
0
1
1
0
0
3
16
2731
2604
1600
1302
1200
0
1
1
0
1
3
32
1365
1302
800
651
600
0
1
1
1
0
3
64
683
651
400
326
300
0
1
1
1
1
3
128
341
326
200
163
150
1
0
0
0
0
4
1
32768
31250
19200
15625
14400
1
0
0
0
1
4
2
16384
15625
9600
7813
7200
1
0
0
1
0
4
4
8192
7813
4800
3906
3600
1
0
0
1
1
4
8
4096
3906
2400
1953
1800
1
0
1
0
0
4
16
2048
1953
1200
977
900
1
0
1
0
1
4
32
1024
977
600
488
450
1
0
1
1
0
4
64
512
488
300
244
225
1
0
1
1
1
4
128
256
244
150
122
113
1
1
0
0
0
13
1
10082
9615
5908
4808
4431
1
1
0
0
1
13
2
5041
4808
2954
2404
2215
1
1
0
1
0
13
4
2521
2404
1477
1202
1108
1
1
0
1
1
13
8
1260
1202
738
601
554
1
1
1
0
0
13
16
630
601
369
300
277
1
1
1
0
1
13
32
315
300
185
150
138
1
1
1
1
0
13
64
158
150
92
75
69
1
1
1
1
1
13
128
79
75
46
38
35
Note:
SCT/R2 SCT/R1 SCT/R0
The examples shown above do not apply when the part is operating in slow mode (see
Section 2.4.3).
71
Freescale
6-20
SERIAL COMMUNICATIONS INTERFACE
MC68HC05B6
Rev. 4.1
6.13
SCI during STOP mode
When the MCU enters STOP mode, the baud rate generator driving the receiver and transmitter
is shut down. This stops all SCI activity. Both the receiver and the transmitter are unable to
operate.
If the STOP instruction is executed during a transmitter transfer, that transfer is halted. When
STOP mode is exited as a result of an external interrupt, that particular transmission resumes.
If the receiver is receiving data when the STOP instruction is executed, received data sampling is
stopped (baud generator stops) and the rest of the data is lost.
Warning: For the above reasons, all SCI transactions should be in the idle state when the STOP
instruction is executed.
6.14
6
SCI during WAIT mode
The SCI system is not affected by WAIT mode and continues normal operation. Any valid SCI
interrupt will wake-up the system. If required, the SCI system can be disabled prior to entering
WAIT mode by writing a zero to the transmitter and receiver enable bits in the serial
communication control register 2 at $000F. This action will result in a reduction of power
consumption during WAIT mode.
71
MC68HC05B6
Rev. 4.1
SERIAL COMMUNICATIONS INTERFACE
Freescale
6-21
6
THIS PAGE LEFT BLANK INTENTIONALLY
71
Freescale
6-22
SERIAL COMMUNICATIONS INTERFACE
MC68HC05B6
Rev. 4.1
7
PULSE LENGTH D/A CONVERTERS
The pulse length D/A converter (PLM) system works in conjunction with the timer to execute two
8-bit D/A conversions, with a choice of two repetition rates. (See Figure 7-1.)
Data bus
8
PLMA
D/A
pin
8
PLMA
register
PLMB
register
‘A’ register
buffer
‘B’ register
buffer
‘A’
comparator
‘B’
comparator
7
R
Latch
S
R
Latch
S
Zero detector
Zero detector
8
SFA
bit
‘A’
multiplexer
16
PLMB
D/A
pin
8
‘B’
multiplexer
16
SFB
bit
Timer bus
From timer
Figure 7-1 PLM system block diagram
MC68HC05B6
Rev. 4.1
PULSE LENGTH D/A CONVERTERS
Freescale
7-1
The D/A converter has two data registers associated with it, PLMA and PLMB.
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
Pulse length modulation A (PLMA)
$000A
0000 0000
Pulse length modulation B (PLMB)
$000B
0000 0000
This is a dual 8-bit resolution D/A converter associated with two output pins (PLMA and PLMB).
The outputs are pulse length modulated signals whose duty cycle ratio may be modified. These
signals can be used directly as PLMs, or the filtered average may be used as general purpose
analog outputs.
7
The longest repetition period is 4096 times the programmable timer clock period (CPU clock
multiplied by four), and the shortest repetition period is 256 times the programmable timer clock
period (the repetition rate frequencies for a 4 MHz crystal are 122 Hz and 1953 Hz respectively).
Registers PLMA ($0A) and PLMB ($0B) are associated with the pulse length values of the two
counters. A value of $00 loaded into these registers results in a continuously low output on the
corresponding D/A output pin. A value of $80 results in a 50% duty cycle output, and so on, to the
maximum value $FF corresponding to an output which is at ‘1’ for 255/256 of the cycle. When the
MCU makes a write to register PLMA or PLMB the new value will only be picked up by the D/A
converters at the end of a complete cycle of conversion. This results in a monotonic change of the
DC component at the output without overshoots or vicious starts (a vicious start is an output which
gives totally erroneous PLM during the period immediately following an update of the PLM D/A
registers). This feature is achieved by double buffering of the PLM D/A registers. Examples of
PWM output waveforms are shown in Figure 7-2.
256 T
$00
255 T
$01 T
128 T
128 T
$80
255 T
$FF
T
T = 4 CPU clocks in fast mode and 64 CPU clocks in slow mode
Figure 7-2 PLM output waveform examples
Freescale
7-2
PULSE LENGTH D/A CONVERTERS
MC68HC05B6
Rev. 4.1
Note:
Since the PLM system uses the timer counter, PLM results will be affected while resetting
the timer counter. Both D/A registers are reset to $00 during power-on or external reset.
WAIT mode does not affect the output waveform of the D/A converters.
7.1
Miscellaneous register
Miscellaneous
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
$000C
POR
INTP
INTN
INTE
SFA
SFB
SM
State
on reset
bit 0
WDOG ?001 000?
SFA — Slow or fast mode selection for PLMA
This bit allows the user to select the slow or fast mode of the PLMA pulse length modulation
output.
1 (set)
–
0 (clear) –
Slow mode PLMA (4096 x timer clock period).
Fast mode PLMA (256 x timer clock period).
7
SFB — Slow or fast mode selection for PLMB
This bit allows the user to select the slow or fast mode of the PLMB pulse length modulation
output.
1 (set)
–
0 (clear) –
Slow mode PLMB (4096 x timer clock period).
Fast mode PLMB (256 x timer clock period).
The highest speed of the PLM system corresponds to the frequency of the TOF bit being set,
multiplied by 256. The lowest speed of the PLM system corresponds to the frequency of the TOF
bit being set, multiplied by 16. Because the SFA bit and SFB bit are not double buffered, it is
mandatory to set them to the desired values before writing to the PLM registers; not doing so could
temporarily give incorrect values at the PLM outputs.
SM — Slow mode
1 (set)
–
0 (clear) –
MC68HC05B6
Rev. 4.1
The system runs at a bus speed 16 times lower than normal
(fOSC/32). SLOW mode affects all sections of the device, including
SCI, A/D and timer.
The system runs at normal bus speed (fOSC/2).
PULSE LENGTH D/A CONVERTERS
Freescale
7-3
The SM bit is cleared by external or power-on reset. The SM bit is automatically cleared when
entering STOP mode.
Note:
7.2
The bits that are shown shaded in the above representation are explained individually
in the relevant sections of this manual. The complete register plus an explanation of
each bit can be found in Section 3.8
PLM clock selection
The slow/fast mode of the PLM D/A converters is selected by bits 1, 2, and 3 of the miscellaneous
register at address $000C (SFA bit for PLMA and SFB bit for PLMB). The slow/fast mode has no
effect on the D/A converters’ 8-bit resolution (see Figure 7-3).
fOSC
7
÷2
÷32
SM bit = 0
Bus
frequency (fOP)
÷4
Timer
clock
SM bit = 1
x4096
x256
SF bit = 1
PLM
clock
SF bit = 0
Figure 7-3 PLM clock selection
7.3
PLM during STOP mode
On entering STOP mode, the PLM outputs remain at their particular level. When STOP mode is
exited by an interrupt, the PLM systems resume regular operation. If STOP mode is exited by
power-on or external reset the registers values are forced to $00.
7.4
PLM during WAIT mode
The PLM system is not affected by WAIT mode and continues normal operation.
Freescale
7-4
PULSE LENGTH D/A CONVERTERS
MC68HC05B6
Rev. 4.1
8
ANALOG TO DIGITAL CONVERTER
The analog to digital converter system consists of a single 8-bit successive approximation
converter and a sixteen channel multiplexer. Eight of the channels are connected to the
PD0/AN0 – PD7/AN7 pins of the MC68HC05B6 and the other eight channels are dedicated to
internal reference points for test functions. The channel input pins do not have any internal output
driver circuitry connected to them because such circuitry would load the analog input signals due
to output buffer leakage current. There is one 8-bit result data register (address $08) and one 8-bit
status/control register (address $09).
The A/D converter is ratiometric and two dedicated pins, VRH and VRL, are used to supply the
reference voltage levels for all analog inputs. These pins are used in preference to the system
power supply lines because any voltage drops in the bonding wires of the heavily loaded supply
pins could degrade the accuracy of the A/D conversion. An input voltage equal to or greater than
VRH converts to $FF (full scale) with no overflow indication and an input voltage equal to VRL
converts to $00.
The A/D converter can operate from either the bus clock or an internal RC type oscillator. The
internal RC type oscillator is activated by the ADRC bit in the A/D status/control register (ADSTAT)
and can be used to give a sufficiently high clock rate to the A/D converter when the bus speed is too
low to provide accurate results. When the A/D converter is not being used it can be disconnected,
by clearing the ADON bit in the ADSTAT register, in order to save power (see Section 8.2.3).
For further information on A/D converter operation please refer to the M68HC11 Reference
Manual — M68HC11RM/AD.
8.1
A/D converter operation
The A/D converter consists of an analog multiplexer, an 8-bit digital to analog converter capacitor
array, a comparator and a successive approximation register (SAR) (see Figure 8-1).
There are eleven options that can be selected by the multiplexer; AN0–AN7, VRH, (VRH+VRL)/2
or VRL. Selection is done via the CHx bits in the ADSTAT register (see Section 8.2.3). AN0–AN7
are the only input points for A/D conversion operations; the others are reference points that can
be used for test purposes.
MC68HC05B6
Rev. 4.1
ANALOG TO DIGITAL CONVERTER
Freescale
8-1
8
The A/D reference input (AN0–AN7) is applied to a precision internal D/A converter. Control logic
drives this D/A converter and the analog output is successively compared with the analog input
sampled at the beginning of the conversion. The conversion is monotonic with no missing codes.
AN0
VRH
VRL
8-bit capacitive DAC
with sample and hold
AN1
AN3
AN4
AN5
AN6
AN7
Analog MUX
(Channel assignment)
AN2
Successive approximation
register (SAR) and control
Result
A/D status/control register (ADSTAT)$09
CH0
CH1
CH2
CH3
0
ADON ADRC COCO
VRH
(VRH+VRL)/2
VRL
8
A/D result register (ADDATA) $08
Figure 8-1 A/D converter block diagram
The result of each successive comparison is stored in the SAR and, when the conversion is
complete, the contents of the SAR are transferred to the read-only result data register ($08), and
the conversion complete flag, COCO, is set in the A/D status/control register ($09).
Warning: Any write to the A/D status/control register will abort the current conversion, reset the
conversion complete flag and start a new conversion on the selected channel.
At power-on or external reset, both the ADRC and ADON bits are cleared; thus the A/D is disabled.
Freescale
8-2
ANALOG TO DIGITAL CONVERTER
MC68HC05B6
Rev. 4.1
8.2
A/D registers
8.2.1
Port D data register (PORTD)
Port D data (PORTD)
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
$0003
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
Undefined
Port D is an input-only port which routes the eight analog inputs to the A/D converter. When the
A/D converter is disabled, the pins are configured as standard input-only port pins, which can be
read via the port D data register.
Note:
8.2.2
When the A/D function is enabled, pins PD0–PD7 will act as analog inputs. Using a pin
or pins as A/D inputs does not affect the ability to read port D as static inputs; however,
reading port D during an A/D conversion sequence may inject noise on the analog
inputs and result in reduced accuracy of the A/D result.
Performing a digital read of port D with levels other than VDD or VSS on the pins will
result in greater power dissipation during the read cycle, and may give unpredictable
results on the corresponding port D pins.
8
A/D result data register (ADDATA)
Address
A/D data (ADDATA)
bit 7
bit 6
bit 5
bit 4
bit 3
$0008
bit 2
bit 1
bit 0
State
on reset
0000 0000
ADDATA is a read-only register which is used to store the results of A/D conversions. Each result
is loaded into the register from the SAR and the conversion complete flag, COCO, in the ADSTAT
register is set.
MC68HC05B6
Rev. 4.1
ANALOG TO DIGITAL CONVERTER
Freescale
8-3
8.2.3
A/D status/control register (ADSTAT)
Address
A/D status/control (ADSTAT)
$0009
bit 7
bit 6
bit 5
COCO ADRC ADON
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
0
CH3
CH2
CH1
CH0
0000 0000
COCO — Conversion complete flag
1 (set)
–
COCO is set each time a conversion is complete, allowing the new
result to be read from the A/D result data register ($08). The
converter then starts a new conversion.
0 (clear) –
COCO is cleared by reading the result data register or writing to the
status/control register.
Reset clears the COCO flag.
ADRC — A/D RC oscillator control
The ADRC bit allows the user to control the A/D RC oscillator, which is used to provide a
sufficiently high clock rate to the A/D to ensure accuracy when the chip is running at low speeds.
1 (set)
8
–
When the ADRC bit is set, the A/D RC oscillator is turned on and, if
ADON is set, the A/D runs from the RC oscillator clock. See Table 8-1.
0 (clear) –
When the ADRC bit is cleared, the A/D RC oscillator is turned-off
and, if ADON is set, the A/D runs from the CPU clock.
When the A/D RC oscillator is turned on, it takes a time tADRC to stabilize (see Table 11-6 and
Table 11-7). During this time A/D conversion results may be inaccurate.
Note:
If the MCU bus clock falls below 1MHz, the A/D RC oscillator should be switched on.
Power-on or external reset clears the ADRC bit.
Table 8-1 A/D clock selection
Freescale
8-4
RC
A/D
oscillator converter
Comments
ADRC
ADON
0
0
OFF
OFF
A/D switched off.
0
1
OFF
ON
A/D using CPU clock.
1
0
ON
OFF
Allows the RC oscillator to stabilize.
1
1
ON
ON
A/D using RC oscillator clock.
ANALOG TO DIGITAL CONVERTER
MC68HC05B6
Rev. 4.1
ADON — A/D converter on
The ADON bit allows the user to enable/disable the A/D converter.
1 (set)
–
A/D converter is switched on.
0 (clear) –
A/D converter is switched off.
When the A/D converter is switched on, it takes a time tADON for the current sources to stabilize
(see Table 11-6 and Table 11-7). Using the A/D converter before this time has elapsed may result
in the incorrect operation of the A/D, even after tADON has elapsed. In this case ADON would have
to be cleared and set again.
Power-on or external reset will clear the ADON bit, thus disabling the A/D converter.
CH3–CH0 — A/D channels 3, 2, 1 and 0
The CH3–CH0 bits allow the user to determine which channel of the A/D converter multiplexer is
selected. See Table 8-2 for channel selection.
Reset clears the CH0–CH3 bits.
Table 8-2 A/D channel assignment
MC68HC05B6
Rev. 4.1
CH3
CH2
CH1
CH0
Channel selected
0
0
0
0
AN0
0
0
0
1
AN1
0
0
1
0
AN2
0
0
1
1
AN3
0
1
0
0
AN4
0
1
0
1
AN5
0
1
1
0
AN6
0
1
1
1
AN7
1
0
0
0
VRH pin (high)
1
0
0
1
(VRH + VRL) / 2
1
0
1
0
VRL pin (low)
1
0
1
1
VRL pin (low)
1
1
0
0
VRL pin (low)
1
1
0
1
VRL pin (low)
1
1
1
0
VRL pin (low)
1
1
1
1
VRL pin (low)
ANALOG TO DIGITAL CONVERTER
8
Freescale
8-5
8.3
A/D converter during STOP mode
When the MCU enters STOP mode with the A/D converter turned on, the A/D clocks are stopped
and the A/D converter is disabled for the duration of STOP mode, including the 4064 cycles
start-up time. If the A/D RC oscillator is in operation it will also be disabled.
8.4
A/D converter during WAIT mode
The A/D converter is not affected by WAIT mode and continues normal operation.
In order to reduce power consumption the A/D converter can be disconnected, under software
control using the ADON bit and the ADRC bit in the A/D status/control register at $0009, before
entering WAIT mode.
8.5
8
Port D analog input
The external analog voltage value to be processed by the A/D converter is sampled on an internal
capacitor through a resistive path, provided by input-selection switches and a sampling aperture
time switch, as shown in Figure 8-2. Sampling time is limited to 12 bus clock cycles. After
sampling, the analog value is stored on the capacitor and held until the end of conversion. During
this hold time, the analog input is disconnected from the internal A/D system and the external
voltage source sees a high impedance input.
The equivalent analog input during sampling is an RC low-pass filter with a minimum resistance
of 50 kΩ and a capacitance of at least 10pF. It should be noted that these are typical values
measured at room temperature.
Input protection device
Analog
input
pin
< 2pF
≥ 50kΩ
+ ∼20V
- ∼0.7V
1 µA
junction
leakage
≥ 10pF
DAC
capacitance
VRL
Note:
The analog switch is closed during the 12 cycle sample time only.
Figure 8-2 Electrical model of an A/D input pin
Freescale
8-6
ANALOG TO DIGITAL CONVERTER
MC68HC05B6
Rev. 4.1
9
RESETS AND INTERRUPTS
9.1
Resets
The MC68HC05B6 can be reset in three ways: by the initial power-on reset function, by an active
low input to the RESET pin or by a computer operating properly (COP) watchdog reset. Any of
these resets will cause the program to go to its starting address, specified by the contents of
memory locations $1FFE and $1FFF, and cause the interrupt mask bit in the condition code
register to be set.
tVDDR
VDD
VDD threshold (1-2V typical)
tOXOV
9
OSC1
Internal
processor clock
RESET
Internal
address bus
Internal
data bus
tPORL
tCYC
tRL (or tDOGL)
(Internal power-on reset)
1FFE 1FFE 1FFE 1FFE 1FFF
New
PC
1FFE 1FFE 1FFE 1FFE
Reset sequence
New
PCH
(External hardware reset)
1FFF
New
PC
New
PCL
Op
code
Reset sequence
New
PCL
Op
code
Program
execution
begins
New
PCH
Program
execution
begins
Figure 9-1 Reset timing diagram
MC68HC05B6
Rev. 4.1
RESETS AND INTERRUPTS
Freescale
9-1
9.1.1
Power-on reset
A power-on reset occurs when a positive transition is detected on VDD. The power-on reset
function is strictly for power turn-on conditions and should not be used to detect drops in the power
supply voltage. The power-on circuitry provides a stabilization delay (tPORL) from when the
oscillator becomes active. If the external RESET pin is low at the end of this delay then the
processor remains in the reset state until RESET goes high. The user must ensure that the voltage
on VDD has risen to a point where the MCU can operate properly by the time tPORL has elapsed.
If there is doubt, the external RESET pin should remain low until the voltage on VDD has reached
the specified minimum operating voltage. This may be accomplished by connecting an external
RC circuit to this pin to generate a power-on reset (POR). In this case, the time constant must be
great enough to allow the oscillator circuit to stabilize.
During power-on reset, the RESET pin is driven low during a tPORL delay start-up sequence. tPORL is
defined by a user specified mask option to be either 16 cycles or 4064 cycles (see Section 1.2).
A software distinction between a power-on reset and an external reset can be made using the
POR bit in the miscellaneous register (see Section 9.1.2).
9.1.2
Miscellaneous register
Address
Miscellaneous
9
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
$000C POR(1) INTP
INTN
INTE
SFA
SFB
SM
bit 0
State
on reset
WDOG(2) ?001 000?
(1) The POR bit is set each time there is a power-on reset.
(2) The state of the WDOG bit after reset is dependent on the mask option selected; 1=watchdog enabled, 0=watchdog disabled.
POR — Power-on reset bit
This bit is set each time the device is powered on. Therefore, the state of the POR bit allows the
user to make a software distinction between a power-on and an external reset. This bit cannot be
set by software and is cleared by writing it to zero.
1 (set)
–
0 (clear) –
Note:
Freescale
9-2
A power-on reset has occurred.
No power-on reset has occurred.
The bits shown shaded in the above representation are explained individually in the
relevant sections of this manual. The complete register plus an explanation of each bit
can be found in Section 3.8.
RESETS AND INTERRUPTS
MC68HC05B6
Rev. 4.1
9.1.3
RESET pin
When the oscillator is running in a stable condition, the MCU is reset when a logic zero is applied
to the RESET input for a minimum period of 1.5 machine cycles (tCYC). An internal Schmitt Trigger
is used to improve noise immunity on this pin. When the RESET pin goes high, the MCU will
resume operation on the following cycle. When a reset condition occurs internally, i.e. from POR
or the COP watchdog, the RESET pin provides an active-low open drain output signal which may
be used to reset external hardware. Current limitation to protect the pull-down device is provided
in case an RC type external reset circuit is used.
9.1.4
Computer operating properly (COP) watchdog reset
The watchdog counter system consists of a divide-by-8 counter, preceded by a fixed divide-by-4
and a fixed divide-by-256 prescaler, plus control logic as shown in Figure 9-2. The divide-by-8
counter can be reset by software.
Main CPU
clock
R
÷ 8 watchdog
counter
WDOG bit
Reset
pin
9
Reset
Enable
÷ 256
(Bit 7 of free
running counter)
Latch
+
fOSC/2
÷4
fOSC/32 prescaler
Power-on
S
Control logic
Schmitt
trigger
Input
protection
Figure 9-2 Watchdog system block diagram
Warning: The input to the watchdog system is derived from the carry output of bit 7 of the free
running timer counter. Therefore, a reset of the timer may affect the period of the
watchdog timeout.
The watchdog system can be automatically enabled, following power-on or external reset, via a
mask option (see Section 1.2), or it can be enabled by software by writing a ‘1’ to the WDOG bit
in the miscellaneous register at $000C (see Section 9.1.2). Once enabled, the watchdog system
MC68HC05B6
Rev. 4.1
RESETS AND INTERRUPTS
Freescale
9-3
cannot be disabled by software (writing a ‘zero’ to the WDOG bit has no effect at any time). In
addition, the WDOG bit acts as a reset mechanism for the watchdog counter. Writing a ‘1’ to this
bit clears the counter to its initial value and prevents a watchdog timeout.
WDOG — Watchdog enable/disable
The WDOG bit can be used to enable the watchdog timer previously disabled by a mask option.
Following a watchdog reset the state of the WDOG bit is as defined by the mask option specified.
1 (set)
–
0 (clear) –
Watchdog enabled and counter cleared.
The watchdog cannot be disabled by software; writing a zero to this
bit has no effect.
The divide-by-8 watchdog counter will generate a main reset of the chip when it reaches its final
state; seven clocks are necessary to bring the watchdog counter from its clear state to its final
state. This reset appears after time tDOG since the last clear or since the enable of the watchdog
counter system. The watchdog counter, therefore, has to be cleared periodically, by software, with
a period less than tDOG.
The reset generated by the watchdog system is apparent at the RESET pin (see Figure 9-2). The
RESET pin level is re-entered in the control logic, and when it has been maintained at level ‘zero’
for a minimum of tDOGL, the RESET pin is released.
9.1.4.1
9
COP watchdog during STOP mode
The STOP instruction is inhibited when the watchdog system is enabled. If a STOP instruction is
executed while the watchdog system is enabled, then a watchdog reset will occur as if there were
a watchdog timeout. In the case of a watchdog reset due to a STOP instruction, the oscillator will
not be affected, thus there will be no tPORL cycles start-up delay. On start-up, the watchdog will be
configured according to the user specified mask option.
9.1.4.2
COP watchdog during WAIT mode
The state of the watchdog during WAIT mode is selected via a mask option (see Section 1.2) to
be one of the options below:
Watchdog enabled — the watchdog counter will continue to operate during WAIT mode and a
reset will occur after time tDOG.
Watchdog disabled — on entering WAIT mode, the watchdog counter system is reset and
disabled. On exiting WAIT mode the counter resumes normal operation.
Freescale
9-4
RESETS AND INTERRUPTS
MC68HC05B6
Rev. 4.1
9.1.5
Functions affected by reset
When processing stops within the MCU for any reason, i.e. power-on reset, external reset or the
execution of a STOP or WAIT instruction, various internal functions of the MCU are affected.
Table 9-1 shows the resulting action of any type of system reset, but not necessarily in the order
in which they occur.
Table 9-1 Effect of RESET, POR, STOP and WAIT
RESET
POR
WAIT
Timer prescaler set to zero
Function/effect
x
x
–
STOP
–
Timer counter set to $FFFC
x
x
–
–
All timer enable bits cleared (disable)
x
x
–
–
Data direction registers cleared (inputs)
x
x
–
–
Stack pointer set to $00FF
x
x
–
–
Force internal address bus to restart
x
x
–
–
Vector $1FFE, $1FFF
x
x
–
–
–
Interrupt mask bit (I-bit CCR) set to 1
x
x
–
Interrupt mask bit (I-bit CCR) cleared
–
–
x
x
Set interrupt enable bit (INTE)
x
x
–
–
Set POR bit in miscellaneous register
–
x
–
–
Reset STOP latch
x
x
–
–
Reset IRQ latch
x
x
–
–
Reset WAIT latch
x
x
–
–
SCI disabled
x
x
–
–
SCI status bits cleared (except TDRE and TC)
x
x
–
–
SCI interrupt enable bits cleared
x
x
–
–
SCI status bits TDRE and TC set
x
x
–
–
Oscillator disabled for 4064 cycles
–
x
–
x
Timer clock cleared
–
x
–
x
SCI clock cleared
–
x
–
x
A/D disabled
x
x
–
x
SM bit in the miscellaneous register cleared
x
x
–
x
Watchdog counter reset
x
x
x
x
WDOG bit in the miscellaneous register reset
x
x
–
x
EEPROM control bits (see Section 3.5.1)
x
x
–
x
9
x = Described action takes place
– = Described action does not take place
MC68HC05B6
Rev. 4.1
RESETS AND INTERRUPTS
Freescale
9-5
9.2
Interrupts
The MCU can be interrupted by four different sources: three maskable hardware interrupts and
one non maskable software interrupt:
•
External signal on the IRQ pin
•
Serial communications interface (SCI)
•
Programmable timer
•
Software interrupt instruction (SWI)
Interrupts cause the processor to save the register contents on the stack and to set the interrupt
mask (I-bit) to prevent additional interrupts. The RTI instruction (ReTurn from Interrupt) causes the
register contents to be recovered from the stack and normal processing to resume. While
executing the RTI instruction, the value of the I-bit is replaced by the corresponding I-bit stored on
the stack.
Unlike reset, hardware interrupts do not cause the current instruction execution to be halted, but
are considered pending until the current instruction is complete. The current instruction is the one
already fetched and being operated on. When the current instruction is complete, the processor
checks all pending hardware interrupts. If interrupts are not masked (I-bit clear) and the
corresponding interrupt enable bit is set, the processor proceeds with interrupt processing;
otherwise, the next instruction is fetched and executed.
Note:
9
9.2.1
Power-on and external reset clear all interrupt enable bits, but set the INTE bit in the
miscellaneous register, thus preventing interrupts during the reset sequence.
Interrupt priorities
Each potential interrupt source is assigned a priority level, which means that if more than one
interrupt is pending at the same time, the processor will service the one with the highest priority
first. For example, if both an external interrupt and a timer interrupt are pending after an instruction
execution, the external interrupt is serviced first.
Table 9-2 shows the relative priority of all the possible interrupt sources. Figure 9-3 shows
the interrupt processing flow.
9.2.2
Nonmaskable software interrupt (SWI)
The software interrupt (SWI) is an executable instruction and a nonmaskable interrupt: it is
executed regardless of the state of the I-bit in the CCR. If the I-bit is zero (interrupts enabled), SWI
is executed after interrupts that were pending when the SWI was fetched, but before interrupts
Freescale
9-6
RESETS AND INTERRUPTS
MC68HC05B6
Rev. 4.1
Table 9-2 Interrupt priorities
Register
Flags
Vector address
Priority
Reset
Source
—
—
$1FFE, $1FFF
highest
Software interrupt (SWI)
—
—
$1FFC, $1FFD
$1FFA, $1FFB
—
—
Timer input captures
TSR
ICF1, ICF2
$1FF8, $1FF9
Timer output compares
TSR
OCF1, OCF2
$1FF6, $1FF7
Timer overflow
TSR
TOF
$1FF4, $1FF5
SCSR
TDRE, TC, OR,
RDRF, IDLE
$1FF2, $1FF3
External interrupt (IRQ)
Serial communications
interface (SCI)
lowest
generated after the SWI was fetched. The SWI interrupt service routine address is specified by
the contents of memory locations $1FFC and $1FFD.
9.2.3
Maskable hardware interrupts
If the interrupt mask bit in the CCR is set, all maskable interrupts (internal and external) are
masked. Clearing the I-bit allows interrupt processing to occur.
Note:
9.2.3.1
The internal interrupt latch is cleared in the first part of the interrupt service routine;
therefore, one external interrupt pulse could be latched and serviced as soon as the
I-bit is cleared.
9
External interrupt (IRQ)
If the interrupt mask in the condition code register has been cleared and the interrupt enable bit
(INTE) is set and the signal on the external interrupt pin (IRQ) satisfies the condition selected by
the option control bits (INTP and INTN), then the external interrupt is recognized. INTE, INTP and
INTN are all bits contained in the miscellaneous register at $000C. When the interrupt is
recognized, the current state of the CPU is pushed onto the stack and the I-bit is set. This masks
further interrupts until the present one is serviced. The external interrupt service routine address
is specified by the content of memory locations $1FFA and $1FFB.
MC68HC05B6
Rev. 4.1
RESETS AND INTERRUPTS
Freescale
9-7
Reset
Is I-bit set?
IRQ
external interrupt?
Clear IRQ request
latch
Stack
PC, X, A, CC
Timer
internal interrupt?
Set I-bit
SCI
internal interrupt?
9
Fetch next
instruction
Execute instruction
Load PC from:
IRQ:
$1FFA-$1FFB
Timer IC: $1FF8-$1FF9
Timer OC: $1FF6-$1FF7
Timer OVF:$1FF4-$1FF5
SCI:
$1FF2-$1FF3
Complete interrupt routine
and execute RTI
Figure 9-3 Interrupt flow chart
Freescale
9-8
RESETS AND INTERRUPTS
MC68HC05B6
Rev. 4.1
9.2.3.2
Miscellaneous register
Address
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
$000C
POR
INTP
INTN
INTE
SFA
SFB
SM
Miscellaneous
Note:
bit 0
State
on reset
WDOG ?001 000?
The bits shown shaded in the above representation are explained individually in the
relevant sections of this manual. The complete register plus an explanation of each bit
can be found in Section 3.8.
INTP, INTN — External interrupt sensitivity options
These two bits allow the user to select which edge the IRQ pin is sensitive to as shown in
Table 9-3. Both bits can be written to only while the I-bit is set, and are cleared by power-on or
external reset. Therefore the device is initialised with negative edge and low level sensitivity.
Table 9-3 IRQ sensitivity
INTP
INTN
0
0
Negative edge and low level sensitive
IRQ sensitivity
0
1
Negative edge only
1
0
Positive edge only
1
1
Positive and negative edge sensitive
9
INTE — External interrupt enable
1 (set)
–
External interrupt function (IRQ) enabled.
0 (clear) –
External interrupt function (IRQ) disabled.
The INTE bit can be written to only while the I-bit is set, and is set by power-on or external reset,
thus enabling the external interrupt function.
Table 9-3 describes the various triggering options available for the IRQ pin, however it is important
to re-emphasize here that in order to avoid any conflict and spurious interrupt, it is only possible
to change the external interrupt options while the I-bit is set. Any attempt to change the external
interrupt option while the I-bit is clear will be unsuccessful. If an external interrupt is pending, it will
automatically be cleared when selecting a different interrupt option.
Note:
If the external interrupt function is disabled by the INTE bit and an external interrupt is
sensed by the edge detector circuitry, then the interrupt request is latched and the
interrupt stays pending until the INTE bit is set. The internal latch of the external
interrupt is cleared in the first part of the service routine (except for the low level
MC68HC05B6
Rev. 4.1
RESETS AND INTERRUPTS
Freescale
9-9
interrupt which is not latched); therefore, only one external interrupt pulse can be
latched during tILIL and serviced as soon as the I-bit is cleared.
9.2.3.3
Timer interrupts
There are five different timer interrupt flags (ICF1, ICF2, OCF1, OCF2 and TOF) that will cause a
timer interrupt whenever they are set and enabled. These five interrupt flags are found in the five
most significant bits of the timer status register (TSR) at location $0013. ICF1 and ICF2 will vector
to the service routine defined by $1FF8-$1FF9, OCF1 and OCF2 will vector to the service routine
defined by $1FF6–$1FF7 and TOF will vector to the service routine defined by $1FF4–$1FF5 as
shown in Figure 5.1.
There are three corresponding enable bits; ICIE for ICF1 and ICF2, OCIE for OCF1 and OCF2,
and TOIE for TOF. These enable bits are located in the timer control register (TCR) at address
$0012. See Section 5.2.1 and Section 5.2.2 for further information.
9.2.3.4
Serial communications interface (SCI) interrupts
There are five different interrupt flags (TDRE, TC, OR, RDRF and IDLE) that cause SCI interrupts
whenever they are set and enabled. These five interrupt flags are found in the five most significant
bits of the SCI status register (SCSR) at location $0010.
There are four corresponding enable bits: TIE for TDRE, TCIE for TC, RIE for OR and RDRF, and
ILIE for IDLE. These enable bits are located in the serial communications control register 2
(SCCR2) at address $000F. See Section 6.11.3 and Section 6.11.4.
9
The SCI interrupt causes the program counter to vector to the address pointed to by memory
locations $1FF2 and $1FF3 which contain the starting address of the interrupt service routine.
Software in the SCI interrupt service routine must determine the priority and cause of the interrupt
by examining the interrupt flags and the status bits located in the serial communications status
register SCSR (address $0010).
The general sequence for clearing an interrupt is a software sequence of accessing the serial
communications status register while the flag is set followed by a read or write of an associated
register. Refer to Section 6 for a description of the SCI system and its interrupts.
Freescale
9-10
RESETS AND INTERRUPTS
MC68HC05B6
Rev. 4.1
9.2.4
Hardware controlled interrupt sequence
The following three functions: reset, STOP and WAIT, are not in the strictest sense interrupts. However,
they are acted upon in a similar manner. Flowcharts for STOP and WAIT are shown in Figure 2.4.
RESET: A reset condition causes the program to vector to its starting address, which is
contained in memory locations $1FFE (MSB) and $1FFF (LSB). The I-bit in the
condition code register is also set, to disable interrupts.
STOP:
The STOP instruction causes the oscillator to be turned off and the processor to ‘sleep’
until an external interrupt (IRQ) or occurs or the device is reset.
WAIT:
The WAIT instruction causes all processor clocks to stop, but leaves the timer clocks
running. This ‘rest’ state of the processor can be cleared by reset, an external interrupt
(IRQ), a timer interrupt or an SCI interrupt. There are no special WAIT vectors for these
individual interrupts.
9
MC68HC05B6
Rev. 4.1
RESETS AND INTERRUPTS
Freescale
9-11
THIS PAGE LEFT BLANK INTENTIONALLY
9
Freescale
9-12
RESETS AND INTERRUPTS
MC68HC05B6
Rev. 4.1
10
CPU CORE AND INSTRUCTION SET
This section provides a description of the CPU core registers, the instruction set and the
addressing modes of the MC68HC05B6.
10.1
Registers
The MCU contains five registers, as shown in the programming model of Figure 10-1. The interrupt
stacking order is shown in Figure 10-2.
7
0
7
0
7
0
Accumulator
Index register
15
Program counter
15
7
0
0 0 0 0 0 0 0 0 1 1
7
0
1 1 1 H I N Z C
Stack pointer
Condition code register
10
Carry / borrow
Zero
Negative
Interrupt mask
Half carry
Figure 10-1 Programming model
Unstack
Condition code register
Accumulator
Index register
Program counter high
Program counter low
Stack
0
Interrupt
Increasing
memory
address
Return
7
Decreasing
memory
address
Figure 10-2 Stacking order
115
MC68HC05B6
Rev. 4.1
CPU CORE AND INSTRUCTION SET
Freescale
10-1
10.1.1
Accumulator (A)
The accumulator is a general purpose 8-bit register used to hold operands and results of
arithmetic calculations or data manipulations.
10.1.2
Index register (X)
The index register is an 8-bit register, which can contain the indexed addressing value used to
create an effective address. The index register may also be used as a temporary storage area.
10.1.3
Program counter (PC)
The program counter is a 16-bit register, which contains the address of the next byte to be fetched.
10.1.4
Stack pointer (SP)
The stack pointer is a 16-bit register, which contains the address of the next free location on the
stack. During an MCU reset or the reset stack pointer (RSP) instruction, the stack pointer is set to
location $00FF. The stack pointer is then decremented as data is pushed onto the stack and
incremented as data is pulled from the stack.
10
When accessing memory, the ten most significant bits are permanently set to 0000000011. These
ten bits are appended to the six least significant register bits to produce an address within the
range of $00C0 to $00FF. Subroutines and interrupts may use up to 64 (decimal) locations. If 64
locations are exceeded, the stack pointer wraps around and overwrites the previously stored
information. A subroutine call occupies two locations on the stack; an interrupt uses five locations.
10.1.5
Condition code register (CCR)
The CCR is a 5-bit register in which four bits are used to indicate the results of the instruction just
executed, and the fifth bit indicates whether interrupts are masked. These bits can be individually
tested by a program, and specific actions can be taken as a result of their state. Each bit is
explained in the following paragraphs.
115
Freescale
10-2
CPU CORE AND INSTRUCTION SET
MC68HC05B6
Rev. 4.1
Half carry (H)
This bit is set during ADD and ADC operations to indicate that a carry occurred between bits 3 and 4.
Interrupt (I)
When this bit is set all maskable interrupts are masked. If an interrupt occurs while this bit is set,
the interrupt is latched and remains pending until the interrupt bit is cleared.
Negative (N)
When set, this bit indicates that the result of the last arithmetic, logical, or data manipulation was
negative.
Zero (Z)
When set, this bit indicates that the result of the last arithmetic, logical, or data manipulation was zero.
Carry/borrow (C)
When set, this bit indicates that a carry or borrow out of the arithmetic logical unit (ALU) occurred
during the last arithmetic operation. This bit is also affected during bit test and branch instructions
and during shifts and rotates.
10.2
Instruction set
The MCU has a set of 62 basic instructions. They can be grouped into five different types as
follows:
–
Register/memory
–
Read/modify/write
–
Branch
–
Bit manipulation
–
Control
10
The following paragraphs briefly explain each type. All the instructions within a given type are
presented in individual tables.
This MCU uses all the instructions available in the M146805 CMOS family plus one more: the
unsigned multiply (MUL) instruction. This instruction allows unsigned multiplication of the contents
of the accumulator (A) and the index register (X). The high-order product is then stored in the index
register and the low-order product is stored in the accumulator. A detailed definition of the MUL
instruction is shown in Table 10-1.
115
MC68HC05B6
Rev. 4.1
CPU CORE AND INSTRUCTION SET
Freescale
10-3
10.2.1
Register/memory Instructions
Most of these instructions use two operands. The first operand is either the accumulator or the
index register. The second operand is obtained from memory using one of the addressing modes.
The jump unconditional (JMP) and jump to subroutine (JSR) instructions have no register
operand. Refer to Table 10-2 for a complete list of register/memory instructions.
10.2.2
Branch instructions
These instructions cause the program to branch if a particular condition is met; otherwise, no
operation is performed. Branch instructions are two-byte instructions. Refer to Table 10-3.
10.2.3
Bit manipulation instructions
The MCU can set or clear any writable bit that resides in the first 256 bytes of the memory space
(page 0). All port data and data direction registers, timer and serial interface registers,
control/status registers and a portion of the on-chip RAM reside in page 0. An additional feature
allows the software to test and branch on the state of any bit within these locations. The bit set, bit
clear, bit test and branch functions are all implemented with single instructions. For the test and
branch instructions, the value of the bit tested is also placed in the carry bit of the condition code
register. Refer to Table 10-4.
10.2.4
10
Read/modify/write instructions
These instructions read a memory location or a register, modify or test its contents, and write the
modified value back to memory or to the register. The test for negative or zero (TST) instruction is
an exception to this sequence of reading, modifying and writing, since it does not modify the value.
Refer to Table 10-5 for a complete list of read/modify/write instructions.
10.2.5
Control instructions
These instructions are register reference instructions and are used to control processor operation
during program execution. Refer to Table 10-6 for a complete list of control instructions.
10.2.6
Tables
Tables for all the instruction types listed above follow. In addition there is a complete alphabetical
listing of all the instructions (see Table 10-7 and Table 10-8), and an opcode map for the
instruction set of the M68HC05 MCU family (see Table 10-9).
115
Freescale
10-4
CPU CORE AND INSTRUCTION SET
MC68HC05B6
Rev. 4.1
Table 10-1 MUL instruction
X:A ← X*A
Operation
Multiplies the eight bits in the index register by the eight
Description bits in the accumulator and places the 16-bit result in the
concatenated accumulator and index register.
H : Cleared
I : Not affected
N : Not affected
Z : Not affected
C : Cleared
Condition
codes
Source
MUL
Form
Addressing mode
Cycles
Bytes
Opcode
Inherent
11
1
$42
Table 10-2 Register/memory instructions
Addressing modes
Indexed
(no
offset)
# Bytes
# Cycles
Opcode
# Bytes
# Cycles
Opcode
# Bytes
# Cycles
Opcode
# Bytes
# Cycles
Opcode
# Bytes
# Cycles
Indexed
(16-bit
offset)
Opcode
Indexed
(8-bit
offset)
# Cycles
Extended
# Bytes
Direct
Opcode
Mnemonic
Immediate
Load A from memory
LDA
A6
2
2
B6
2
3
C6
3
4
F6
1
3
E6
2
4
D6
3
5
Load X from memory
LDX
AE
2
2
BE
2
3
CE
3
4
FE
1
3
EE
2
4
DE
3
5
Store A in memory
STA
B7
2
4
C7
3
5
F7
1
4
E7
2
5
D7
3
6
Store X in memory
STX
BF
2
4
CF
3
5
FF
1
4
EF
2
5
DF
3
6
Add memory to A
ADD
AB
2
2
BB
2
3
CB
3
4
FB
1
3
EB
2
4
DB
3
5
Add memory and carry to A
ADC
A9
2
2
B9
2
3
C9
3
4
F9
1
3
E9
2
4
D9
3
5
Subtract memory
SUB
A0
2
2
B0
2
3
C0
3
4
F0
1
3
E0
2
4
D0
3
5
Subtract memory from A
with borrow
SBC
A2
2
2
B2
2
3
C2
3
4
F2
1
3
E2
2
4
D2
3
5
5
Function
AND memory with A
AND
A4
2
2
B4
2
3
C4
3
4
F4
1
3
E4
2
4
D4
3
OR memory with A
ORA
AA
2
2
BA
2
3
CA
3
4
FA
1
3
EA
2
4
DA
3
5
Exclusive OR memory with A
EOR
A8
2
2
B8
2
3
C8
3
4
F8
1
3
E8
2
4
D8
3
5
Arithmetic compare A
with memory
CMP
A1
2
2
B1
2
3
C1
3
4
F1
1
3
E1
2
4
D1
3
5
Arithmetic compare X
with memory
CPX
A3
2
2
B3
2
3
C3
3
4
F3
1
3
E3
2
4
D3
3
5
Bit test memory with A
(logical compare)
BIT
A5
2
2
B5
2
3
C5
3
4
F5
1
3
E5
2
4
D5
3
5
Jump unconditional
JMP
BC
2
2
CC
3
3
FC
1
2
EC
2
3
DC
3
4
Jump to subroutine
JSR
BD
2
5
CD
3
6
FD
1
5
ED
2
6
DD
3
7
10
115
MC68HC05B6
Rev. 4.1
CPU CORE AND INSTRUCTION SET
Freescale
10-5
Table 10-3 Branch instructions
Relative addressing mode
Function
Mnemonic
Opcode # Bytes # Cycles
Branch always
BRA
20
2
3
Branch never
BRN
21
2
3
Branch if higher
BHI
22
2
3
Branch if lower or same
BLS
23
2
3
Branch if carry clear
BCC
24
2
3
(Branch if higher or same)
(BHS)
24
2
3
Branch if carry set
BCS
25
2
3
(Branch if lower)
(BLO)
25
2
3
Branch if not equal
BNE
26
2
3
Branch if equal
BEQ
27
2
3
Branch if half carry clear
BHCC
28
2
3
Branch if half carry set
BHCS
29
2
3
Branch if plus
BPL
2A
2
3
Branch if minus
BMI
2B
2
3
Branch if interrupt mask bit is clear
BMC
2C
2
3
Branch if interrupt mask bit is set
BMS
2D
2
3
Branch if interrupt line is low
BIL
2E
2
3
Branch if interrupt line is high
BIH
2F
2
3
Branch to subroutine
BSR
AD
2
6
Table 10-4 Bit manipulation instructions
Addressing Modes
10
Bit set/clear
Bit test and branch
Function
Mnemonic
Opcode # Bytes # Cycles Opcode # Bytes # Cycles
Branch if bit n is set
BRSET n (n=0–7)
2•n
3
5
Branch if bit n is clear
BRCLR n (n=0–7)
01+2•n
3
5
Set bit n
BSET n (n=0–7)
10+2•n
2
5
Clear bit n
BCLR n (n=0–7)
11+2•n
2
5
115
Freescale
10-6
CPU CORE AND INSTRUCTION SET
MC68HC05B6
Rev. 4.1
Table 10-5 Read/modify/write instructions
Addressing modes
Inherent
(X)
Indexed
(8-bit
offset)
Indexed
(no
offset)
Opcode
# Bytes
# Cycles
Opcode
# Bytes
# Cycles
Opcode
# Bytes
# Cycles
Opcode
# Bytes
# Cycles
Opcode
# Bytes
# Cycles
Direct
Mnemonic
Inherent
(A)
Increment
INC
4C
1
3
5C
1
3
3C
2
5
7C
1
5
6C
2
6
Decrement
DEC
4A
1
3
5A
1
3
3A
2
5
7A
1
5
6A
2
6
Clear
CLR
4F
1
3
5F
1
3
3F
2
5
7F
1
5
6F
2
6
Complement
COM
43
1
3
53
1
3
33
2
5
73
1
5
63
2
6
Negate (two’s complement)
NEG
40
1
3
50
1
3
30
2
5
70
1
5
60
2
6
Rotate left through carry
ROL
49
1
3
59
1
3
39
2
5
79
1
5
69
2
6
Rotate right through carry
ROR
46
1
3
56
1
3
36
2
5
76
1
5
66
2
6
Logical shift left
LSL
48
1
3
58
1
3
38
2
5
78
1
5
68
2
6
Logical shift right
LSR
44
1
3
54
1
3
34
2
5
74
1
5
64
2
6
Arithmetic shift right
ASR
47
1
3
57
1
3
37
2
5
77
1
5
67
2
6
Test for negative or zero
TST
4D
1
3
5D
1
3
3D
2
4
7D
1
4
6D
2
5
Multiply
MUL
42
1
11
Function
Table 10-6 Control instructions
Inherent addressing mode
Function
Mnemonic
Opcode # Bytes # Cycles
Transfer A to X
TAX
97
1
2
Transfer X to A
TXA
9F
1
2
Set carry bit
SEC
99
1
2
Clear carry bit
CLC
98
1
2
Set interrupt mask bit
SEI
9B
1
2
Clear interrupt mask bit
CLI
9A
1
2
Software interrupt
SWI
83
1
10
Return from subroutine
RTS
81
1
6
Return from interrupt
RTI
80
1
9
Reset stack pointer
RSP
9C
1
2
No-operation
NOP
9D
1
2
Stop
STOP
8E
1
2
Wait
WAIT
8F
1
2
10
115
MC68HC05B6
Rev. 4.1
CPU CORE AND INSTRUCTION SET
Freescale
10-7
Table 10-7 Instruction set (1 of 2)
Addressing modes
Mnemonic
10
INH
IMM
DIR
EXT
REL
IX
IX1
Condition codes
IX2
BSC BTB
H
I
N
Z
C
ADC
Þ
•
Þ
Þ
Þ
ADD
Þ
•
Þ
Þ
Þ
AND
•
•
Þ
Þ
•
ASL
•
•
Þ
Þ
Þ
ASR
•
•
Þ
Þ
Þ
BCC
•
•
•
•
•
BCLR
•
•
•
•
•
BCS
•
•
•
•
•
BEQ
•
•
•
•
•
BHCC
•
•
•
•
•
BHCS
•
•
•
•
•
BHI
•
•
•
•
•
BHS
•
•
•
•
•
BIH
•
•
•
•
•
BIL
•
•
•
•
•
BIT
•
•
Þ
Þ
•
BLO
•
•
•
•
•
BLS
•
•
•
•
•
BMC
•
•
•
•
•
BMI
•
•
•
•
•
BMS
•
•
•
•
•
BNE
•
•
•
•
•
BPL
•
•
•
•
•
BRA
•
•
•
•
•
BRN
•
•
•
•
•
BRCLR
•
•
•
•
Þ
BRSET
•
•
•
•
Þ
BSET
•
•
•
•
•
BSR
•
•
•
•
•
CLC
•
•
•
•
0
•
CLI
•
0
•
•
CLR
•
•
0
1
•
CMP
•
•
Þ
Þ
Þ
Address mode abbreviations
BSC Bit set/clear
IMM
Immediate
BTB
Bit test & branch
IX
Indexed (no offset)
DIR
Direct
IX1
EXT
Extended
IX2
INH
Inherent
REL
Condition code symbols
Þ
Tested and set if true,
cleared otherwise
Interrupt mask
•
Not affected
Negate (sign bit)
?
Load CCR from stack
Z
Zero
0
Cleared
C
Carry/borrow
1
Set
H
Half carry (from bit 3)
Indexed, 1 byte offset
I
Indexed, 2 byte offset
N
Relative
Not implemented
115
Freescale
10-8
CPU CORE AND INSTRUCTION SET
MC68HC05B6
Rev. 4.1
Table 10-8 Instruction set (2 of 2)
Addressing modes
Mnemonic
INH
IMM
DIR
EXT
REL
IX
IX1
Condition codes
IX2
BSC BTB
H
I
N
Z
COM
•
•
Þ
Þ
C
1
CPX
•
•
Þ
Þ
Þ
DEC
•
•
Þ
Þ
•
EOR
•
•
Þ
Þ
•
INC
•
•
Þ
Þ
•
JMP
•
•
•
•
•
JSR
•
•
•
•
•
LDA
•
•
Þ
Þ
•
LDX
•
•
Þ
Þ
•
LSL
•
•
Þ
Þ
Þ
Þ
LSR
•
•
0
Þ
MUL
0
•
•
•
0
NEG
•
•
Þ
Þ
Þ
NOP
•
•
•
•
•
ORA
•
•
Þ
Þ
•
ROL
•
•
Þ
Þ
Þ
ROR
•
•
Þ
Þ
Þ
RSP
•
•
•
•
•
RTI
?
?
?
?
?
RTS
•
•
•
•
•
SBC
•
•
Þ
Þ
Þ
SEC
•
•
•
•
1
SEI
•
1
•
•
•
STA
•
•
Þ
Þ
•
STOP
•
0
•
•
•
STX
•
•
Þ
Þ
•
SUB
•
•
Þ
Þ
Þ
SWI
•
1
•
•
•
TAX
•
•
•
•
•
TST
•
•
Þ
Þ
•
TXA
•
•
•
•
•
WAIT
•
0
•
•
•
Address mode abbreviations
BSC Bit set/clear
IMM
Immediate
BTB
Bit test & branch
IX
Indexed (no offset)
DIR
Direct
IX1
EXT
Extended
IX2
INH
Inherent
REL
10
Condition code symbols
Þ
Tested and set if true,
cleared otherwise
Interrupt mask
•
Not affected
Negate (sign bit)
?
Load CCR from stack
Z
Zero
0
Cleared
C
Carry/borrow
1
Set
H
Half carry (from bit 3)
Indexed, 1 byte offset
I
Indexed, 2 byte offset
N
Relative
Not implemented
115
MC68HC05B6
Rev. 4.1
CPU CORE AND INSTRUCTION SET
Freescale
10-9
Freescale
10-10
CPU CORE AND INSTRUCTION SET
0
0000
1
0001
2
0010
3
0011
4
0100
5
0101
6
0110
7
0111
8
1000
9
1001
A
1010
B
1011
C
1100
D
1101
E
1110
F
1111
BTB 2
5
BTB 2
5
BTB 2
5
3
3
3
BTB 2
5
BTB 2
5
BTB 2
5
BTB 2
5
BTB 2
5
BTB 2
5
BTB 2
5
BTB 2
5
BTB 2
5
BTB 2
5
BTB 2
3
3
3
3
3
3
3
3
3
3
3
BRCLR7
BRSET7
BRCLR6
BRSET6
BRCLR5
BRSET5
BRCLR4
BRSET4
BRCLR3
BRSET3
BRCLR2
BTB 2
5
3
BRSET2
BRCLR1
BRSET1
BRCLR0
BTB 2
5
BRSET0
3
5
BSC 2
BCLR7
BSC 2
5
BSET7
BSC 2
5
BCLR6
BSC 2
5
BSET6
BSC 2
5
BCLR5
BSC 2
5
BSET5
BSC 2
5
BCLR4
BSC 2
5
BSET4
BSC 2
5
BCLR3
BSC 2
5
BSET3
BSC 2
5
BCLR2
BSC 2
5
BSET2
BSC 2
5
BCLR1
BSC 2
5
BSET1
BSC 2
5
BCLR0
BSC 2
5
BSET0
5
REL 2
3
REL 2
3
REL
3
REL 2
3
REL 2
3
REL
3
REL
3
REL 2
3
BIH
BIL
BMS
BMC
BMI
BPL
REL 2
REL
3
REL 2
3
REL 2
3
REL
3
REL 2
3
REL 2
3
BHCS
REL 2
3
BHCC
BEQ
BNE
BCS
BCC
BLS
BHI
BRN
BRA
3
BSC
BTB
DIR
EXT
INH
IMM
Bit set/clear
Bit test and branch
Direct
Extended
Inherent
Immediate
IX
IX1
IX2
REL
A
X
Abbreviations for address modes and registers
Low
High
Branch
REL
2
0010
CLR
TST
INC
DEC
ROL
LSL
ASR
ROR
LSR
COM
NEG
DIR
3
0011
INH 1
3
INH 1
3
CLRA
TSTA
INCA
INH 1
3
INH 1
INH 1
3
3
INH 1
DECA
INH 1
3
ROLA
LSLA
ASRA
INH 1
3
3
INH 1
INH 1
3
RORA
LSRA
11
INH
3
COMA
MUL
INH 1
NEGA
3
INH 2
3
INH 2
3
INH 2
3
INH 2
3
CLRX
TSTX
INCX
INH 2
3
INH 2
INH 2
3
3
INH 2
DECX
ROLX
3
INH 2
ASRX
LSLX
3
INH 2
3
RORX
LSRX
COMX
INH 2
NEGX
3
CLR
TST
INC
DEC
ROL
LSL
ASR
ROR
LSR
COM
NEG
Read/modify/write
INH
IX1
5
6
0101
0110
Indexed (no offset)
Indexed, 1 byte (8-bit) offset
Indexed, 2 byte (16-bit) offset
Relative
Accumulator
Index register
DIR 1
5
DIR 1
DIR 1
4
5
DIR 1
DIR 1
5
DIR 1
5
DIR 1
5
DIR 1
5
5
DIR 1
DIR 1
5
5
1
DIR 1
5
INH
4
0100
10
Bit manipulation
BTB
BSC
0
1
0000
0001
IX1 1
6
IX1 1
IX1 1
5
6
IX1 1
IX1 1
6
IX1 1
6
IX1 1
6
IX1 1
6
6
IX1 1
IX1 1
6
6
IX1 1
6
CLR
TST
INC
DEC
ROL
LSL
ASR
ROR
LSR
COM
NEG
IX
7
0111
1
WAIT
1
1
1
1
1
1
1
INH 1
INH
2
2
INH
10
INH
INH
6
STOP
SWI
RTS
RTI
9
Not implemented
IX 1
5
IX
IX
4
5
IX
IX
5
IX
5
IX
5
IX
5
5
IX
IX 1
5
5
1
IX 1
5
TXA
NOP
RSP
SEI
CLI
SEC
CLC
TAX
Control
INH
INH
8
9
1000
1001
2
INH
2
INH 2
INH
2
INH 2
2
INH 2
2
INH 2
2
INH 2
2
INH
2
2
2
2
2
2
2
2
2
LDX
BSR
ADD
ORA
ADC
EOR
LDA
BIT
AND
CPX
SBC
CMP
SUB
IMM
A
1010
2
STX
LDX
JSR
JMP
ADD
ORA
ADC
EOR
STA
LDA
BIT
AND
CPX
SBC
CMP
SUB
3
Bytes
1
STX
LDX
JSR
JMP
ADD
ORA
ADC
EOR
STA
LDA
BIT
AND
CPX
SBC
CMP
SUB
SUB
F
1111
EXT 3
EXT 3
5
EXT 3
4
EXT 3
6
EXT 3
3
EXT 3
4
EXT 3
4
EXT 3
4
EXT 3
4
EXT 3
5
EXT 3
4
EXT 3
4
EXT 3
4
EXT 3
4
EXT 3
4
EXT 3
4
4
IX
3
0
0000
IX2 2
IX2 2
6
IX2 2
5
IX2 2
7
IX2 2
4
IX2 2
5
IX2 2
5
IX2 2
5
IX2 2
5
IX2 2
6
IX2 2
5
IX2 2
5
IX2 2
5
IX2 2
5
IX2 2
5
IX2 2
5
5
STX
LDX
JSR
JMP
ADD
ORA
ADC
EOR
STA
LDA
BIT
AND
CPX
SBC
CMP
SUB
IX1
E
1110
Address mode
STX
LDX
JSR
JMP
ADD
ORA
ADC
EOR
STA
LDA
BIT
AND
CPX
SBC
CMP
SUB
Register/memory
EXT
IX2
C
D
1100
1101
Cycles
DIR 3
DIR 3
4
DIR 3
3
DIR 3
5
DIR 3
2
DIR 3
3
DIR 3
3
DIR 3
3
DIR 3
3
DIR 3
4
DIR 3
3
DIR 3
3
DIR 3
3
DIR 3
3
DIR 3
3
DIR 3
3
Mnemonic
Legend
2
IMM 2
REL 2
2
6
2
IMM 2
IMM 2
2
IMM 2
2
IMM 2
2
2
IMM 2
IMM 2
2
IMM 2
2
IMM 2
2
IMM 2
2
IMM 2
2
IMM 2
2
2
DIR
B
1011
STX
LDX
JSR
JMP
ADD
ORA
ADC
EOR
STA
LDA
BIT
AND
CPX
SBC
CMP
SUB
IX
IX
4
IX
3
IX
5
IX
2
IX
3
IX
3
IX
3
IX
3
IX
4
IX
3
IX
3
IX
3
IX
3
IX
3
IX
3
3
0
0000
1
0001
2
0010
3
0011
4
0100
5
0101
6
0110
7
0111
8
1000
9
1001
A
1010
B
1011
C
1100
D
1101
E
1110
F
1111
Low
High
Opcode in binary
Opcode in hexadecimal
IX1 1
IX1 1
5
IX1 1
4
IX1 1
6
IX1 1
3
IX1 1
4
IX1 1
4
IX1 1
4
IX1 1
4
IX1 1
5
IX1 1
4
IX1 1
4
IX1 1
4
IX1 1
4
IX1 1
4
IX1 1
4
4
IX
F
1111
Table 10-9 M68HC05 opcode map
MC68HC05B6
Rev. 4.1
115
10.3
Addressing modes
Ten different addressing modes provide programmers with the flexibility to optimize their code for
all situations. The various indexed addressing modes make it possible to locate data tables, code
conversion tables and scaling tables anywhere in the memory space. Short indexed accesses are
single byte instructions; the longest instructions (three bytes) enable access to tables throughout
memory. Short absolute (direct) and long absolute (extended) addressing are also included. One
or two byte direct addressing instructions access all data bytes in most applications. Extended
addressing permits jump instructions to reach all memory locations.
The term ‘effective address’ (EA) is used in describing the various addressing modes. The
effective address is defined as the address from which the argument for an instruction is fetched
or stored. The ten addressing modes of the processor are described below. Parentheses are used
to indicate ‘contents of’ the location or register referred to. For example, (PC) indicates the
contents of the location pointed to by the PC (program counter). An arrow indicates ‘is replaced
by’ and a colon indicates concatenation of two bytes. For additional details and graphical
illustrations, refer to the M6805 HMOS/M146805 CMOS Family Microcomputer/
Microprocessor User's Manual or to the M68HC05 Applications Guide.
10.3.1
Inherent
In the inherent addressing mode, all the information necessary to execute the instruction is
contained in the opcode. Operations specifying only the index register or accumulator, as well as
the control instruction, with no other arguments are included in this mode. These instructions are
one byte long.
10.3.2
Immediate
In the immediate addressing mode, the operand is contained in the byte immediately following the
opcode. The immediate addressing mode is used to access constants that do not change during
program execution (e.g. a constant used to initialize a loop counter).
10
EA = PC+1; PC ← PC+2
10.3.3
Direct
In the direct addressing mode, the effective address of the argument is contained in a single byte
following the opcode byte. Direct addressing allows the user to directly address the lowest 256
bytes in memory with a single two-byte instruction.
EA = (PC+1); PC ← PC+2
Address bus high ← 0; Address bus low ← (PC+1)
115
MC68HC05B6
Rev. 4.1
CPU CORE AND INSTRUCTION SET
Freescale
10-11
10.3.4
Extended
In the extended addressing mode, the effective address of the argument is contained in the two
bytes following the opcode byte. Instructions with extended addressing mode are capable of
referencing arguments anywhere in memory with a single three-byte instruction. When using the
Freescale assembler, the user need not specify whether an instruction uses direct or extended
addressing. The assembler automatically selects the short form of the instruction.
EA = (PC+1):(PC+2); PC ← PC+3
Address bus high ← (PC+1); Address bus low ← (PC+2)
10.3.5
Indexed, no offset
In the indexed, no offset addressing mode, the effective address of the argument is contained in
the 8-bit index register. This addressing mode can access the first 256 memory locations. These
instructions are only one byte long. This mode is often used to move a pointer through a table or
to hold the address of a frequently referenced RAM or I/O location.
EA = X; PC ← PC+1
Address bus high ← 0; Address bus low ← X
10.3.6
Indexed, 8-bit offset
In the indexed, 8-bit offset addressing mode, the effective address is the sum of the contents of
the unsigned 8-bit index register and the unsigned byte following the opcode. Therefore the
operand can be located anywhere within the lowest 511 memory locations. This addressing mode
is useful for selecting the mth element in an n element table.
10
EA = X+(PC+1); PC ← PC+2
Address bus high ← K; Address bus low ← X+(PC+1)
where K = the carry from the addition of X and (PC+1)
10.3.7
Indexed, 16-bit offset
In the indexed, 16-bit offset addressing mode, the effective address is the sum of the contents of
the unsigned 8-bit index register and the two unsigned bytes following the opcode. This address
mode can be used in a manner similar to indexed, 8-bit offset except that this three-byte instruction
allows tables to be anywhere in memory. As with direct and extended addressing, the Freescale
assembler determines the shortest form of indexed addressing.
EA = X+[(PC+1):(PC+2)]; PC ← PC+3
Address bus high ← (PC+1)+K; Address bus low ← X+(PC+2)
where K = the carry from the addition of X and (PC+2)
115
Freescale
10-12
CPU CORE AND INSTRUCTION SET
MC68HC05B6
Rev. 4.1
10.3.8
Relative
The relative addressing mode is only used in branch instructions. In relative addressing, the
contents of the 8-bit signed byte (the offset) following the opcode are added to the PC if, and only
if, the branch conditions are true. Otherwise, control proceeds to the next instruction. The span of
relative addressing is from –126 to +129 from the opcode address. The programmer need not
calculate the offset when using the Freescale assembler, since it calculates the proper offset and
checks to see that it is within the span of the branch.
EA = PC+2+(PC+1); PC ← EA if branch taken;
otherwise EA = PC ← PC+2
10.3.9
Bit set/clear
In the bit set/clear addressing mode, the bit to be set or cleared is part of the opcode. The byte
following the opcode specifies the address of the byte in which the specified bit is to be set or
cleared. Any read/write bit in the first 256 locations of memory, including I/O, can be selectively set
or cleared with a single two-byte instruction.
EA = (PC+1); PC ← PC+2
Address bus high ← 0; Address bus low ← (PC+1)
10.3.10
Bit test and branch
The bit test and branch addressing mode is a combination of direct addressing and relative
addressing. The bit to be tested and its condition (set or clear) is included in the opcode. The
address of the byte to be tested is in the single byte immediately following the opcode byte (EA1).
The signed relative 8-bit offset in the third byte (EA2) is added to the PC if the specified bit is set
or cleared in the specified memory location. This single three-byte instruction allows the program
to branch based on the condition of any readable bit in the first 256 locations of memory. The span
of branch is from –125 to +130 from the opcode address. The state of the tested bit is also
transferred to the carry bit of the condition code register.
10
EA1 = (PC+1); PC ← PC+2
Address bus high ← 0; Address bus low ← (PC+1)
EA2 = PC+3+(PC+2); PC ← EA2 if branch taken;
otherwise PC ← PC+3
115
MC68HC05B6
Rev. 4.1
CPU CORE AND INSTRUCTION SET
Freescale
10-13
THIS PAGE LEFT BLANK INTENTIONALLY
10
115
Freescale
10-14
CPU CORE AND INSTRUCTION SET
MC68HC05B6
Rev. 4.1
11
ELECTRICAL SPECIFICATIONS
This section contains the electrical specifications and associated timing information for the
MC68HC05B6.
11.1
Absolute maximum ratings
Table 11-1 Absolute maximum ratings
Symbol
Value
Supply voltage(1)
Rating
VDD
– 0.5 to +7.0
V
Input voltage (Except VPP1)
VIN
VSS – 0.5 to VDD + 0.5
V
Input voltage
– Self-check mode (IRQ pin only)
VIN
VSS – 0.5 to 2VDD + 0.5
V
TA
TL to TH
0 to +70
–40 to +85
–40 to +125
°C
TSTG
– 65 to +150
°C
ID
IS
25
45
mA
mA
Operating temperature range
– Standard (MC68HC05B6)
– Extended (MC68HC05B6C)
– Automotive (MC68HC05B6M)
Storage temperature range
Current drain per pin (excluding VDD and VSS)(2)
– Source
– Sink
Unit
11
(1) All voltages are with respect to VSS.
(2) Maximum current drain per pin is for one pin at a time, limited by an external resistor.
Note:
This device contains circuitry designed to protect against damage due to high
electrostatic voltages or electric fields. However, it is recommended that normal
precautions be taken to avoid the application of any voltages higher than those given
in the maximum ratings table to this high impedance circuit. For maximum reliability all
unused inputs should be tied to either VSS or VDD.
MC68HC05B6
Rev. 4.1
ELECTRICAL SPECIFICATIONS
Freescale
11-1
129
130
131
132
133
11.2
DC electrical characteristics
Table 11-2 DC electrical characteristics for 5V operation
11
(VDD = 5 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH)
Characteristic(1)
Output voltage
ILOAD = – 10 µA
ILOAD = +10 µA
Output high voltage (ILOAD = 0.8mA)
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2
Output high voltage (ILOAD = 1.6mA)
TDO, SCLK, PLMA, PLMB
Output low voltage (ILOAD = 1.6mA)
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2,
TDO, SCLK, PLMA, PLMB
Output low voltage (ILOAD = 1.6mA)
RESET
Input high voltage
PA0–7, PB0–7, PC0–7, PD0–7, OSC1,
IRQ, RESET, TCAP1, TCAP2, RDI
Input low voltage
PA0–7, PB0–7, PC0–7, PD0–7, OSC1, IRQ,
RESET,TCAP1, TCAP2, RDI
Supply current(3)
RUN (SM = 0) (See Figure 11-1)
RUN (SM = 1) (See Figure 11-2)
WAIT (SM = 0) (See Figure 11-3)
WAIT (SM = 1) (See Figure 11-4)
STOP
0 to 70 (standard)
– 40 to 85 (extended)
– 40 to 105 (extended)
– 40 to 125 (automotive)
High-Z leakage current
PA0–7, PB0–7, PC0–7, TDO, RESET, SCLK
Input current (0 to 70)
IRQ, OSC1, TCAP1, TCAP2, RDI,
PD0/AN0-PD7/AN7 (channel not selected)
Input current (– 40 to 125)
IRQ, OSC1, TCAP1, TCAP2, RDI,
Capacitance
Ports (as input or output), RESET, TDO, SCLK
IRQ, TCAP1, TCAP2, OSC1, RDI
PD0/AN0–PD7/AN7 (A/D off)
PD0/AN0–PD7/AN7 (A/D on)
Symbol
Min
Typ(2)
Max
Unit
VOH
VOL
VDD – 0.1
—
—
—
—
0.1
V
VOH
VDD – 0.8
VDD – 0.4
—
VOH
VDD – 0.8
VDD – 0.4
—
VOL
—
0.1
0.4
0.4
1
VOL
V
V
VIH
0.7VDD
—
VDD
V
VIL
VSS
—
0.2VDD
V
—
—
—
—
3.5
0.5
1
0.35
6
1.5
2
1
mA
mA
mA
mA
—
—
—
—
2
—
—
—
10
20
60
60
µA
µA
µA
µA
IIL
—
±0.2
±1
µA
IIN
—
±0.2
±0.2
±1
±1
mA
IIN
—
—
±5
µA
COUT
CIN
CIN
CIN
—
—
—
—
—
—
12
22
12
8
—
—
pF
pF
pF
pF
IDD
(1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient
switching currents inherent in CMOS designs (see Section 2).
(2) Typical values are at mid point of voltage range and at 25°C only.
(3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 4.2MHz); all inputs 0.2 V from
rail; no DC loads; maximum load on outputs 50pF (20pF on OSC2).
STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD – 0.2 V: STOP IDD measured with
OSC1 = VDD.
WAIT IDD is affected linearly by the OSC2 capacitance.
Freescale
11-2
ELECTRICAL SPECIFICATIONS
MC68HC05B6
Rev. 4.1
134
135
136
137
138
11.2.1
IDD trends for 5V operation
For the examples below, typical values are at the mid-point of the voltage range and at a
temperature of 25°C only.
8
7
6
5
4
3
2
1
0
IDD (mA)
5.5V
4.5V
0
0.5
1
1.5
2
2.5
3
Internal operating frequency (MHz)
3.5
4
Figure 11-1 Run IDD vs internal operating frequency (4.5V, 5.5V)
1.2
1
0.8
IDD (mA) 0.6
0.4
5.5V
4.5V
0.2
0
0
0.5
1
1.5
2
2.5
3
Internal operating frequency (MHz)
3.5
4
Figure 11-2 Run IDD (SM = 1) vs internal operating frequency (4.5V, 5.5V)
11
2.5
2
IDD (mA)
1.5
1
5.5V
4.5V
0.5
0
0
0.5
1
1.5
2
2.5
3
Internal operating frequency (MHz)
3.5
4
Figure 11-3 Wait IDD vs internal operating frequency (4.5V, 5.5V)
MC68HC05B6
Rev. 4.1
ELECTRICAL SPECIFICATIONS
Freescale
11-3
139
140
0.9
0.8
0.7
0.6
0.5
IDD (mA) 0.4
0.3
0.2
0.1
0
5.5V
4.5V
0
0.5
1
1.5
2
2.5
3
Internal operating frequency (MHz)
3.5
4
Figure 11-4 Wait IDD (SM = 1) vs internal operating frequency (4.5V, 5.5V)
1.6
1.4
1.2
1
0.8
IDD (mA) 0.6
0.4
0.2
0
A/D + SCI
A/D
SCI
0
0.5
1
1.5
2
Internal operating frequency (MHz)
2.5
3
Figure 11-5 Increase in IDD vs frequency for A/D, SCI systems active, VDD = 5.5V
11
IDD (mA)
8
7
6
5
4
3
2
1
0
Run IDD
Wait IDD
Run IDD (SM = 1)
Wait IDD (SM = 1)
0
0.5
1
1.5
2
2.5
3
Internal operating frequency (MHz)
3.5
4
Figure 11-6 IDD vs mode vs internal operating frequency, VDD = 5.5V
Freescale
11-4
ELECTRICAL SPECIFICATIONS
MC68HC05B6
Rev. 4.1
Table 11-3 DC electrical characteristics for 3.3V operation
(VDD = 3.3Vdc ± 10%, VSS = 0Vdc, TA = TL to TH)
Characteristic(1)
Symbol
Output voltage
ILOAD = – 10 µA
VOH
ILOAD = +10 µA
VOL
Output high voltage (ILOAD = 0.2mA)
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2
VOH
Output high voltage (ILOAD = 0.4mA)
TDO, SCLK, PLMA, PLMB
VOH
Output low voltage (ILOAD = 0.4mA)
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2,
VOL
TDO, SCLK, PLMA, PLMB
Output low voltage (ILOAD = 0.4mA)
VOL
RESET
Input high voltage
PA0–7, PB0–7, PC0–7, PD0–7, OSC1,
VIH
IRQ, RESET, TCAP1, TCAP2, RDI
Input low voltage
PA0–7, PB0–7, PC0–7, PD0–7, OSC1, IRQ,
VIL
RESET, TCAP1, TCAP2, RDI
Supply current(3)
RUN (SM = 0) (See Figure 11-1)
RUN (SM = 1) (See Figure 11-2)
WAIT (SM = 0) (See Figure 11-3)
WAIT (SM = 1) (See Figure 11-4)
IDD
STOP
0 to 70 (standard)
– 40 to 85 (extended)
– 40 to 105 (extended)
– 40 to 125 (automotive)
High-Z leakage current
PA0–7, PB0–7, PC0–7, TDO, RESET, SCLK
IIL
Input current (0 to 70)
IRQ, OSC1, TCAP1, TCAP2, RDI,
IIN
PD0/AN0-PD7/AN7 (channel not selected)
Input current (– 40 to 125)
IRQ, OSC1, TCAP1, TCAP2, RDI,
IIN
Capacitance
Ports (as input or output), RESET, TDO,
COUT
SCLK
CIN
IRQ, TCAP1, TCAP2, OSC1, RDI
CIN
PD0/AN0–PD7/AN7 (A/D off)
CIN
PD0/AN0–PD7/AN7 (A/D on)
Min
Typ(2)
Max
Unit
VDD – 0.1
—
—
—
—
0.1
V
VDD – 0.3
VDD – 0.1
—
VDD – 0.3
VDD – 0.1
—
—
0.1
0.3
0.2
0.6
0.7VDD
—
VDD
V
VSS
—
0.2VDD
V
—
—
—
—
1.2
0.2
0.4
0.15
3
1
1.5
0.5
mA
mA
mA
mA
—
—
—
—
1
—
—
—
10
10
40
40
µA
µA
µA
µA
—
±0.2
±1
µA
—
±0.2
±0.2
±1
±1
µA
—
—
±5
µA
—
—
—
—
—
—
12
22
12
8
—
—
pF
pF
pF
pF
V
V
11
(1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the
transient switching currents inherent in CMOS designs (see Section 2).
(2) Typical values are at mid point of voltage range and at 25°C only.
(3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 2.0MHz); all inputs 0.2 V
from rail; no DC loads; maximum load on outputs 50pF (20pF on OSC2).
STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD – 0.2 V: STOP IDD measured with
OSC1 = VDD.
WAIT IDD is affected linearly by the OSC2 capacitance.
MC68HC05B6
Rev. 4.1
ELECTRICAL SPECIFICATIONS
Freescale
11-5
11.2.2
IDD trends for 3.3V operation
For the examples below, typical values are at the mid-point of the voltage range and at a
temperature of 25°C only.
2.5
2
IDD (mA)
1.5
1
3.6V
3.0V
0.5
0
0
0.5
1
1.5
2
Internal operating frequency (MHz)
2.5
Figure 11-7 Run IDD vs internal operating frequency (3 V, 3.6V)
0.6
0.5
0.4
IDD (mA) 0.3
0.2
3.6V
3.0V
0.1
0
0
0.5
1
1.5
2
Internal operating frequency (MHz)
2.5
Figure 11-8 Run IDD (SM = 1) vs internal operating frequency (3V,3.6V)
11
1.2
1
0.8
IDD (mA) 0.6
0.4
3.6V
3.0V
0.2
0
0
0.5
1
1.5
2
Internal operating frequency (MHz)
2.5
Figure 11-9 Wait IDD vs internal operating frequency (3V, 3.6V)
Freescale
11-6
ELECTRICAL SPECIFICATIONS
MC68HC05B6
Rev. 4.1
0.5
0.4
IDD (mA)
0.3
0.2
3.6V
3.0V
0.1
0
0
0.5
1
1.5
2
Internal operating frequency (MHz)
2.5
Figure 11-10 Wait IDD (SM = 1) vs internal operating frequency (3V, 3.6V)
0.7
0.6
0.5
IDD (mA) 0.4
0.3
0.2
0.1
0
A/D + SCI
A/D
SCI
0
0.5
1
1.5
2
Internal operating frequency (MHz)
2.5
Figure 11-11 Increase in IDD vs frequency for A/D, SCI systems active, VDD = 3.6V
2.5
2
IDD (mA)
Run IDD
1.5
Run IDD (SM=1)
1
Wait IDD (SM=1)
0.5
0
11
Wait IDD
0
0.5
1
1.5
Internal operating frequency (MHz)
2
2.5
Figure 11-12 IDD vs mode vs internal operating frequency, VDD = 3.6V
MC68HC05B6
Rev. 4.1
ELECTRICAL SPECIFICATIONS
Freescale
11-7
11.3
A/D converter characteristics
Table 11-4 A/D characteristics for 5V operation
(VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH)
Min
Max
Unit
Resolution
Characteristic
Number of bits resolved by the A/D
Parameter
8
—
Bit
Non-linearity
Max deviation from the best straight line through the A/D
transfer characteristics
(VRH = VDD and VRL = 0V)
—
± 0.5
LSB
Quantization error
Uncertainty due to converter resolution
—
± 0.5
LSB
Absolute accuracy
Difference between the actual input voltage and the
full-scale equivalent of the binary code output code for all
errors
—
±1
LSB
Conversion range
Analog input voltage range
VRL
VRH
V
VRH
Maximum analog reference voltage
VRL
VDD + 0.1
V
Minimum analog reference voltage
VSS – 0.1
VRH
V
∆VR(1)
Minimum difference between VRH and VRL
3
—
V
Conversion time
Total time to perform a single analog to digital conversion
a. External clock (OSC1, OSC2)
b. Internal RC oscillator
—
—
32
32
tCYC
µs
VRL
Monotonicity
Conversion result never decreases with an increase in
input voltage and has no missing codes
Zero input reading
Conversion result when VIN = VRL
00
—
Hex
Full scale reading
Conversion result when VIN = VRH
—
FF
Hex
Sample acquisition time Analog input acquisition sampling
a. External clock (OSC1, OSC2)
b. Internal RC oscillator(2)
—
—
12
12
tCYC
µs
Sample/hold capacitance Input capacitance on PD0/AN0–PD7/AN7
—
12
pF
Input leakage(3)
—
1
µA
Input leakage on A/D pins PD0/AN0–PD7/AN7, VRL, VRH
GUARANTEED
(1) Performance verified down to 2.5V ∆VR, but accuracy is tested and guaranteed at ∆VR = 5V±10%.
11
(2) Source impedances greater than 10kΩ will adversely affect internal charging time during input sampling.
(3) The external system error caused by input leakage current is approximately equal to the product of R source and input
current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2).
Freescale
11-8
ELECTRICAL SPECIFICATIONS
MC68HC05B6
Rev. 4.1
Table 11-5 A/D characteristics for 3.3V operation
(VDD = 3.3 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH)
Min
Max
Unit
Resolution
Characteristic
Number of bits resolved by the A/D
Parameter
8
—
Bit
Non-linearity
Max deviation from the best straight line through the A/D
transfer characteristics
(VRH = VDD and VRL = 0V)
—
±1
LSB
Quantization error
Uncertainty due to converter resolution
—
±1
LSB
Absolute accuracy
Difference between the actual input voltage and the
full-scale equivalent of the binary code output code for all
errors
—
±2
LSB
Conversion range
Analog input voltage range
VRL
VRH
V
VRH
Maximum analog reference voltage
VRL
VDD + 0.1
V
VRL
Minimum analog reference voltage
VSS – 0.1
VRH
V
∆VR
Minimum difference between VRH and VRL
3
—
V
Conversion time
Total time to perform a single analog to digital conversion
Internal RC oscillator
—
32
µs
Monotonicity
Conversion result never decreases with an increase in
input voltage and has no missing codes
GUARANTEED
Zero input reading
Conversion result when VIN = VRL
00
—
Hex
Full scale reading
Conversion result when VIN = VRH
—
FF
Hex
Sample acquisition time Analog input acquisition sampling
Internal RC oscillator(1)
—
12
µs
Sample/hold capacitance Input capacitance on PD0/AN0–PD7/AN7
—
12
pF
Input leakage(2)
—
1
µA
Input leakage on A/D pins PD0/AN0–PD7/AN7, VRL, VRH
(1) Source impedances greater than 10kΩ will adversely affect internal charging time during input sampling.
(2) The external system error caused by input leakage current is approximately equal to the product of R source and input
current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2).
11
MC68HC05B6
Rev. 4.1
ELECTRICAL SPECIFICATIONS
Freescale
11-9
11.4
Control timing
Table 11-6 Control timing for 5V operation
(VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH)
Characteristic
Symbol
Frequency of operation
Crystal option
fOSC
External clock option
fOSC
Internal operating frequency (fOSC/2)
Using crystal
fOP
Using external clock
fOP
Cycle time (see Figure 9-1)
tCYC
Crystal oscillator start-up time (see Figure 9-1)
tOXOV
Stop recovery start-up time (crystal oscillator)
tILCH
RC oscillator stabilization time
tADRC
A/D converter stabilization time
tADON
External RESET input pulse width
tRL
Power-on RESET output pulse width
4064 cycle
tPORL
16 cycle
tPORL
Watchdog RESET output pulse width
tDOGL
Watchdog time-out
tDOG
EEPROM byte erase time
0 to 70 (standard)
– 40 to 85 (extended)
– 40 to 125 (automotive)
EEPROM byte program time(1)
0 to 70 (standard)
– 40 to 85 (extended)
– 40 to 125 (automotive)
Timer (see Figure 11-13)
Resolution(2)
Input capture pulse width
Input capture pulse period
Interrupt pulse width (edge-triggered)
Interrupt pulse period
OSC1 pulse width(5)
Write/Erase endurance(6)(7)
Data retention(6)(7)
11
Min
Max
Unit
—
dc
4.2
4.2
MHz
MHz
dc
dc
476
—
1.5
2.1
2.1
—
100
100
5
500
—
MHz
MHz
ns
ms
ms
µs
µs
tCYC
4064
16
1.5
6144
—
—
—
7168
tCYC
tCYC
tERA
tERA
tERA
10
10
10
—
—
—
ms
ms
ms
tPROG
tPROG
tPROG
10
10
20
—
—
—
ms
ms
ms
—
—
—
—
—
—
tCYC
ns
tCYC
ns
tCYC
ns
cycles
years
tRESL
tTH, tTL
tTLTL
tILIH
tILIL
tOH, tOL
—
—
4
125
—(3)
125
—(4)
90
10000
10
tCYC
tCYC
(1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when
programming the EEPROM.
(2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting
factor in determining the timer resolution.
(3) The minimum period tTLTL should not be less than the number of cycle times it takes to execute
the capture interrupt service routine plus 24 tCYC.
(4) The minimum period tILIL should not be less than the number of cycle times it takes to execute
the interrupt service routine plus 21 tCYC.
(5) tOH and tOL should not total less than 238ns.
(6) At a temperature of 85°C
(7) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information.
Freescale
11-10
ELECTRICAL SPECIFICATIONS
MC68HC05B6
Rev. 4.1
Table 11-7 Control timing for 3.3V operation
(VDD = 3.3Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH)
Symbol
Min
Max
Unit
Frequency of operation
Crystal option
External clock option
Characteristic
fOSC
fOSC
—
dc
2.0
2.0
MHz
MHz
Internal operating frequency (fOSC/2)
Using crystal
Using external clock
fOP
fOP
—
dc
1.0
1.0
MHz
MHz
Cycle time (see Figure 9-1)
tCYC
1000
—
ns
Crystal oscillator start-up time (see Figure 9-1)
tOXOV
—
100
ms
Stop recovery start-up time (crystal oscillator)
tILCH
100
ms
RC oscillator stabilization time
tADRC
5
µs
A/D converter stabilization time
tADON
500
µs
External RESET input pulse width
tRL
1.5
—
tCYC
Power-on RESET output pulse width
4064 cycle
16 cycle
tPORL
tPORL
4064
16
—
—
tCYC
tCYC
Watchdog RESET output pulse width
tDOGL
1.5
—
tCYC
Watchdog time-out
tDOG
6144
7168
tCYC
EEPROM byte erase time
0 to 70 (standard)
– 40 to 85 (extended)
– 40 to 125 (automotive)
30
30
30
—
—
—
ms
ms
ms
EEPROM byte program time(1)
0 to 70 (standard)
– 40 to 85 (extended)
– 40 to 125 (automotive)
tERA
tERA
tERA
tPROG
tPROG
tPROG
30
30
30
—
—
—
ms
ms
ms
Timer (see Figure 11-13)
Resolution(2)
Input capture pulse width
Input capture pulse period
tRESL
tTH, tTL
tTLTL
4
250
—(3)
—
—
—
tCYC
ns
tCYC
Interrupt pulse width (edge-triggered)
tILIH
250
—
ns
Interrupt pulse period
tILIL
—(4)
—
tCYC
tOH, tOL
200
—
OSC1 pulse width(5)
Write/Erase endurance(6)(7)
Data retention
(6)(7)
11
ns
—
10000
cycles
—
10
years
(1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when
programming the EEPROM.
(2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting
factor in determining the timer resolution.
(3) The minimum period tTLTL should not be less than the number of cycle times it takes to
execute the capture interrupt service routine plus 24 tCYC.
(4) The minimum period tILIL should not be less than the number of cycle times it takes to execute
the interrupt service routine plus 21 tCYC.
(5) tOH and tOL should not total less than 500ns.
(6) At a temperature of 85°C
(7) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information.
MC68HC05B6
Rev. 4.1
ELECTRICAL SPECIFICATIONS
Freescale
11-11
tTLTL
tTH
tTL
External
signal
(TCAP1,
TCAP2)
Figure 11-13 Timer relationship
11
Freescale
11-12
ELECTRICAL SPECIFICATIONS
MC68HC05B6
Rev. 4.1
12
MECHANICAL DATA
MC68HC05B family pin configurations
12.1.1
52-pin plastic leaded chip carrier (PLCC)
47
48
49
50
51
52
2
3
4
5
39
16
38
17
37
18
36
19
35
20
34
PC3
PC4
PC5
PC6
PC7
VSS
VPP1/NU
PB0
PB1
PB2
PB3
PB4
PB5
PLMB
TCAP1
TCAP2
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
PB7
PB6
33
15
32
40
31
41
14
30
13
29
42
28
12
27
43
26
44
11
25
10
24
45
23
46
9
22
8
21
VRH
PD4/AN4
VDD
PD3/AN3
PD2/AN2
PD1/AN1
PD0/AN0
NC/VPP6
OSC1
OSC2
RESET
IRQ
PLMA
6
7
VRL
NC/NU
PD5/AN5
PD6/AN6
PD7/AN7
TCMP1
TCMP2
TDO
SCLK
RDI
PC0
PC1
PC2/ECLK
12.1
Pin 6
Pin 15
MC68HC05B4
Device
NC
NC
Pin 40
NU
MC68HC05B6
NC
NC
VPP1
MC68HC05B8
NC
NC
VPP1
MC68HC05B16
NC
NC
VPP1
MC68HC05B32
NC
NC
VPP1
MC68HC705B5
NC
VPP6
NU
MC68HC705B16
NU
VPP6
VPP1
MC68HC705B16N
NU
VPP6
VPP1
MC68HC705B32
NU
VPP6
VPP1
NC = Not connected
NU = Non-user pin (Should be tied to VSS
in an electrically noisy environment)
12
Figure 12-1 52-pin PLCC pinout for the MC68HC05B6
TPG
MC68HC05B6
Rev. 4.1
MECHANICAL DATA
Freescale
12-1
141
64-pin quad flat pack (QFP)
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
PC2/ECLK
PC3
PC4
PC5
PC6
PC7
VSS
VPP1/NC
NC
NC/NU
PB0
PB1
PB2
PB3
PB4
PB5
12.1.2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PB6
PB7
NC
NC
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
NC
TCAP2
TCAP1
PLMB D/A
VRL
VRH
PD4/AN4
VDD
PD3/AN3
PD2/AN2
PD1/AN1
PD0/AN0
NC
NC
NC/VPP6
OSC1
OSC2
RESET
IRQ
PLMA D/A
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
PC1
PC0
NC
NC
NC
NC
NC
RDI
SCLK
TDO
TCMP2
TCMP1
PD7/AN7
PD6/AN6
PD5/AN5
NC
Pin 27
Pin 55
Pin 57
MC68HC05B4
Device
NC
NC
NC
MC68HC05B6
MC68HC05B8
MC68HC05B16
MC68HC05B32
NC
NC
VPP1
MC68HC705B5
12
Not available in this package
MC68HC705B16
VPP6
NU
MC68HC705B16N
VPP6
NU
VPP1
VPP1
MC68HC705B32
VPP6
NC
VPP1
NC = Not connected
NU = Non-user pin (Should be tied to VSS in an electrically noisy environment)
Figure 12-2 64-pin QFP pinout for the MC68HC05B6
TPG
Freescale
12-2
MECHANICAL DATA
MC68HC05B6
Rev. 4.1
142
12.1.3
56-pin shrink dual in line package (SDIP)
TCMP1
PD7
PD6
PD5
NC
NC/NU
NC
VRL
VRH
PD4
VDD
PD3
PD2
PD1
PD0
NC/VPP6
OSC1
OSC2
RESET
IRQ
PLMA
PLMB
TCAP1
TCAP2
PA7
PA6
PA5
PA4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Device
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
TCMP2
TDO
SCLK
RDI
PC0
PC1
NC
PC2
PC3
PC4
PC5
PC6
PC7
VSS
VPP1/NC
PB0
PB1
PB2
PB3
PB4
PB5
NC
PB6
PB7
PA0
PA1
PA2
PA3
Pin 6
Pin 16
MC68HC05B4
NC
NC
Pin 42
NC
MC68HC05B6
NC
NC
VPP1
MC68HC05B8
NC
NC
VPP1
MC68HC05B16
NC
NC
VPP1
MC68HC05B32
NC
NC
VPP1
MC68HC705B5
NC
VPP6
NC
MC68HC705B16
Not available in this package
MC68HC705B16N
Contact Sales
MC68HC705B32
NU
VPP6
VPP1
NC = Not connected
NU = Non-user pin (Should be tied to VSS in an electrically noisy environment)
12
Figure 12-3 56-pin SDIP pinout for the MC68HC05B6
TPG
MC68HC05B6
Rev. 4.1
MECHANICAL DATA
Freescale
12-3
143
12.2
MC68HC05B6 mechanical dimensions
12.2.1
52-pin plastic leaded chip carrier (PLCC)
0.18 M T N S –P S
–N–
–L–
B
L S –M S
Y BRK
–M–
Case No. 778-02
52 Lead PLCC
w/o pedestal
G1
W
pin 52
Z1
pin 1
–P–
X
V
A
R
Z
U
0.18 M T N S –P S
L S –M S
0.18 M T L S –M S
N S –P S
0.18 M T L S –M S
N S –P S
C
G
G1
0.25 S T L S –M S
12
Dim.
Min.
Max.
A
19.94
20.19
B
19.94
20.19
C
4.20
4.57
E
2.29
2.79
F
0.33
0.48
G
1.27 BSC
H
0.66
0.81
J
0.51
—
K
0.64
—
R
19.05
19.20
0.10
J E
–T– SEATING PLANE
N S –P S
Notes
1. Datums –L–, –M–, –N– and –P– are determined where top of lead
shoulder exits plastic body at mould parting line.
2. Dimension G1, true position to be measured at datum –T– (seating
plane).
3. Dimensions R and U do not include mould protrusion. Allowable
mould protrusion is 0.25mm per side.
4. Dimensions and tolerancing per ANSI Y 14.5M, 1982.
5. All dimensions in mm.
Dim.
Min.
Max.
U
19.05
19.20
1.21
V
1.07
W
1.07
1.21
X
1.07
1.42
Y
—
0.50
Z
2°
10°
G1
18.04
18.54
K1
1.02
—
Z1
2°
10°
Figure 12-4 52-pin PLCC mechanical dimensions
TPG
Freescale
12-4
MECHANICAL DATA
MC68HC05B6
Rev. 4.1
144
12.2.2
64-pin quad flat pack (QFP)
L
B
33
-A-
-B-
Case No. 840C
64 lead QFP
B
Detail “A”
64
0.05 A – B
L
17
1
P
B
32
0.20 M C A – B S D S
49
V
0.20 M H A – B S D S
48
- A, B, D Detail “A”
F
N
J
16
-D-
Base
Metal
D
A
0.20 M C A – B S D S
Section B–B
0.05 A – B
0.20 M C A – B S D S
S
0.20 M H A – B S D S
U
T
Detail “C”
M
E
R
Q
C
-CSeating
Plane
Datum
-H- Plane
G
H
X
Dim.
Min.
Max.
A
13.90
14.10
B
13.90
14.10
C
2.067
2.457
D
0.30
0.45
E
2.00
2.40
F
0.30
—
G
0.80 BSC
H
0.067
0.250
J
0.130
0.230
K
0.50
0.66
L
K
W
M
12.00 REF
Notes
Dim.
Min.
1. Datum Plane –H– is located at bottom of lead and is coincident with
the lead where the lead exits the plastic body at the bottom of the
parting line.
2. Datums A–B and –D to be determined at Datum Plane –H–.
3. Dimensions S and V to be determined at seating plane –C–.
4. Dimensions A and B do not include mould protrusion. Allowable
mould protrusion is 0.25mm per side. Dimensions A and B do
include mould mismatch and are determined at Datum Plane –H–.
5. Dimension D does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08 total in excess of the D dimension
at maximum material condition. Dambar cannot be located on the
lower radius or the foot.
6. Dimensions and tolerancing per ANSI Y 14.5M, 1982.
7. All dimensions in mm.
M
5°
10°
N
0.130
0.170
P
Max.
0.40 BSC
Q
2°
8°
R
0.13
0.30
S
16.20
16.60
T
0.20 REF
U
9°
15°
V
16.20
16.60
W
X
12
0.042 NOM
1.10
1.30
Figure 12-5 64-pin QFP mechanical dimensions
TPG
MC68HC05B6
Rev. 4.1
MECHANICAL DATA
Freescale
12-5
145
12.2.3
56-pin shrink dual in line package (SDIP)
L
-A56
29
Case No. 859-01
56 lead SDIP
H
-B-
1
28
M
J
C
-TSeating
Plane
K
G
F
0.25 M T B S
N
E
D
0.25 M T A S
Dim.
Min.
Max.
A
51.69
52.45
B
13.72
14.22
C
3.94
5.08
D
0.36
0.56
E
F
G
0.89 BSC
0.81
1.17
Notes
Dim.
H
1. Due to space limitations, this case shall be represented by a
general case outline, rather than one showing all the leads.
2. Dimensions and tolerancing per ANSI Y 14.5 1982.
3. All dimensions in mm.
4. Dimension L to centre of lead when formed parallel.
5. Dimensions A and B do not include mould flash. Allowable mould
flash is 0.25 mm.
Min.
Max.
7.62 BSC
J
0.20
0.38
K
2.92
3.43
L
15.24 BSC
M
0°
15°
N
0.51
1.02
1.778 BSC
Figure 12-6 56-pin SDIP mechanical dimensions
12
TPG
Freescale
12-6
MECHANICAL DATA
MC68HC05B6
Rev. 4.1
146
13
ORDERING INFORMATION
This section describes the information needed to order the MC68HC05B6 and other family members.
To initiate a ROM pattern for the MCU, it is necessary to contact your local field service office, local
sales person or Freescale representative. Please note that you will need to supply details such as:
mask option selections; temperature range; oscillator frequency; package type; electrical test
requirements; and device marking details so that an order can be processed, and a customer
specific part number allocated. Refer to Table 13-1 for appropriate part numbers. The part number
consists of the device title plus the appropriate suffix. For example, the MC68HC05B6 in 52-pin
PLCC package at –40 to +85°C would be ordered as: MC68HC05B6CFN.
Table 13-1 MC order numbers
Device Title
MC68HC05B6
MC68HC05B4
MC68HC05B8
MC68HC05B16
MC68HC05B32
MC68HC705B5
MC68HC705B16
MC68HC705B16N
MC68HC705B32
MC68HC05B6
Rev. 4.1
Package Type
52-pin PLCC
64-pin QFP
56-pin SDIP
52-pin PLCC
64-pin QFP
56-pin SDIP
52-pin PLCC
64-pin QFP
56-pin SDIP
52-pin PLCC
64-pin QFP
56-pin SDIP
52-pin PLCC
64-pin QFP
56-pin SDIP
52-pin PLCC
56-pin SDIP
52-pin PLCC
64-pin QFP
52-pin PLCC
64-pin QFP
56-pin SDIP
52-pin PLCC
64-pin QFP
56-pin SDIP
Suffix
0 to 70°C
FN
FU
B
FN
FU
B
FN
FU
B
FN
FU
B
FN
FU
B
FN
B
FN
FU
FN
FU
FN
FU
B
Suffix
Suffix
-40 to +85°C -40 to +105°C
CFN
VFN
CFU
VFU
CB
VB
CFN
VFN
CFU
VFU
CB
VB
CFN
VFN
CFU
VFU
CB
VB
CFN
VFN
CFU
VFU
CB
VB
CFN
N/A
CFU
N/A
Contact Sales
N/A
CFN
VFN
CB
VB
CFN
VFN
CFU
VFU
CFN
VFN
CFU
VFU
Contact Sales
CFN
N/A
CFU
N/A
CB
N/A
ORDERING INFORMATION
Suffix
-40 to +125°C
MFN
MFU
MB
MFN
MFU
MB
MFN
MFU
MB
MFN
MFU
MB
N/A
N/A
N/A
MFN
MB
MFN
MFU
MFN
MFU
13
N/A
N/A
N/A
Freescale
13-1
147
148
13.1
EPROMS
For the MC68HC05B6, an 8 kbyte EPROM programmed with the customer’s software (positive
logic for address and data) should be submitted for pattern generation. All unused bytes should
be programmed to $00. The size of EPROM which should be used for all other family members is
listed in Table 13-2.
The EPROM should be clearly labelled, placed in a conductive IC carrier and securely packed.
Table 13-2 EPROMs for pattern generation
Device
MC68HC05B4
13.2
Size of EPROM
8 kbyte
MC68HC05B8
8 kbyte
MC68HC05B16
16 kbyte
MC68HC05B32
32 kbyte
Verification media
All original pattern media (EPROMs) are filed for contractual purposes and are not returned. A
computer listing of the ROM code will be generated and returned with a listing verification form.
The listing should be thoroughly checked and the verification form completed, signed and returned
to Freescale. The signed verification form constitutes the contractual agreement for creation of the
custom mask. If desired, Freescale will program blank EPROMs (supplied by the customer) from
the data file used to create the custom mask, to aid in the verification process.
13.3
ROM verification units (RVU)
Ten MCUs containing the customer’s ROM pattern will be provided for program verification. These
units will have been made using the custom mask but are for ROM verification only. For
expediency, they are usually unmarked and are tested only at room temperature (25°C) and at
5 Volts. These RVUs are included in the mask charge and are not production parts. They are
neither backed nor guaranteed by Freescale Quality Assurance.
13
Freescale
13-2
ORDERING INFORMATION
MC68HC05B6
Rev. 4.1
A
MC68HC05B4
The MC68HC05B4 is a device similar to the MC68HC05B6, but without EEPROM and having a
reduced ROM size of 4 kbytes. The entire MC68HC05B6 data sheet applies to the MC68HC05B4,
with the exceptions outlined in this appendix.
A.1
Features
•
4158 bytes User ROM (including 14 bytes User vectors)
•
No EEPROM
•
High speed version not available
Section 3.5, ‘EEPROM’, therefore, does not apply to the MC68HC05B4, and the register at
address $07 only allows the user to select whether or not the ECLK should appear at PC2, using
bit 3 of $07. All other bits of this register read as ‘0’.
Table A-1 Mode of operation selection
IRQ pin
TCAP1 pin
PD3
PD4
VSS to VDD
VSS to VDD
X
X
Mode
2VDD
VDD
0
X
Self check
2VDD
VDD
1
0
Serial RAM loader
2VDD
VDD
1
1
Jump to any address
Single chip
14
MC68HC05B6
Rev. 4.1
MC68HC05B4
Freescale
A-1
149
150
151
152
153
Port A
Port B
4158 bytes
User ROM
(including 14 bytes
User vectors)
Oscillator
÷ 2 / ÷32
M68HC05
CPU
PC0
PC1
PC2/ECLK
PC3
PC4
PC5
PC6
PC7
432 bytes
self check ROM
Port D
VDD
VSS
PLMA D/A
PLMB D/A
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
COP watchdog
OSC2
OSC1
PD0/AN0
PD1/AN1
PD2/AN2
PD3/AN3
PD4/AN4
PD5/AN5
PD6/AN6
PD7/AN7
VRH
VRL
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
Port C
RESET
IRQ
8-bit
A/D converter
176 bytes
RAM
16-bit
programmable
timer
PLM
SCI
TCMP1
TCMP2
TCAP1
TCAP2
RDI
SCLK
TDO
Figure A-1 MC68HC05B4 block diagram
14
Freescale
A-2
MC68HC05B4
MC68HC05B6
Rev. 4.1
154
155
156
MC68HC05B4
Registers
$0000
I/O
(32 bytes)
$0020
Page 0 User
ROM
(48 bytes)
$0050
$00C0
RAM
(176 bytes)
Stack
$0100
$0200
Self-check ROM I
(192 bytes)
$02C0
$0F00
$1F00
User ROM
(4096 bytes)
Self-check ROM II
(240 bytes)
$1FF0
$1FF2–3
SCI
$1FF4–5
Timer overflow
$1FF6–7 Timer output compare 1& 2
$1FF8–9 Timer input capture 1 & 2
$1FFA–B
External IRQ
$1FFC–D
SWI
$1FFE–F Reset/power-on reset
Port A data register
$0000
Port B data register
$0001
Port C data register
$0002
Port D input data register
$0003
Port A data direction register
$0004
Port B data direction register
$0005
Port C data direction register
$0006
EEPROM/ECLK control register
$0007
A/D data register
$0008
A/D status/control register
$0009
Pulse length modulation A
$000A
Pulse length modulation B
$000B
Miscellaneous register
$000C
SCI baud rate register
$000D
SCI control register 1
$000E
SCI control register 2
$000F
SCI status register
$0010
SCI data register
$0011
Timer control register
$0012
Timer status register
$0013
Capture high register 1
$0014
Capture low register 1
$0015
Compare high register 1
$0016
Compare low register 1
$0017
Counter high register
$0018
Counter low register
$0019
Alternate counter high register
$001A
Alternate counter low register
$001B
Capture high register 2
$001C
Capture low register 2
$001D
Compare high register 2
$001E
Compare low register 2
$001F
User vectors
(14 bytes)
Reserved
Figure A-2 Memory map of the MC68HC05B4
14
MC68HC05B6
Rev. 4.1
MC68HC05B4
Freescale
A-3
Table A-2 Register outline
Register name
Address bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State on
reset
Port A data (PORTA)
$0000
Port B data (PORTB)
$0001
Port C data (PORTC)
$0002
Port D data (PORTD)
$0003
Port A data direction (DDRA)
$0004
0000 0000
Port B data direction (DDRB)
$0005
0000 0000
Port C data direction (DDRC)
$0006
ECLK control
$0007
A/D data (ADDATA)
$0008
A/D status/control (ADSTAT)
$0009
Pulse length modulation A (PLMA)
$000A
Pulse length modulation B (PLMB)
$000B
Miscellaneous
Undefined
Undefined
PC2/
ECLK
PD7/
AN7
PD6/
AN6
PD5/
AN5
PD4/
AN4
PD3/
AN3
PD2/
AN2
Undefined
PD1/
AN1
PD0/
AN0
Undefined
0000 0000
0
0
0
0
ECLK
0
0
0
0000 0000
0
CH3
CH2
CH1
CH0
0000 0000
0000 0000
COCO ADRC ADON
0000 0000
0000 0000
$000C POR(1) INTP
INTN
INTE
SCT1
SCT0
SFA
SFB
SM
WDOG ?001 000?
SCT0
SCR2
SCR1
SCR0 00uu uuuu
WAKE CPOL CPHA
LBCL uuuu uuuu
(2)
SCI baud rate (BAUD)
$000D
SPC1
SPC0
SCI control 1 (SCCR1)
$000E
R8
T8
SCI control 2 (SCCR2)
$000F
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SCI status (SCSR)
$0010
TDRE
TC
RDRF
IDLE
OR
NF
FE
SCI data (SCDR)
$0011
Timer control (TCR)
$0012
ICIE
OCIE
TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0
ICF1
OCF1
TOF
M
SBK
0000 0000
1100 000u
0000 0000
ICF2
OCF2
uuuu uuuu
Timer status (TSR)
$0013
Input capture high 1
$0014
Input capture low 1
$0015
Undefined
Output compare high 1
$0016
Undefined
Output compare low 1
$0017
Undefined
Timer counter high
$0018
1111 1111
1111 1100
Undefined
Timer counter low
$0019
Alternate counter high
$001A
1111 1111
Alternate counter low
$001B
1111 1100
Input capture high 2
$001C
Undefined
Input capture low 2
$001D
Undefined
Output compare high 2
$001E
Undefined
Output compare low 2
$001F
Undefined
(1) This bit is set each time there is a power-on reset.
(2) The state of the WDOG bit after reset is dependent upon the mask option selected; 1=watchdog enabled, 0=watchdog disabled.
14
Freescale
A-4
MC68HC05B4
MC68HC05B6
Rev. 4.1
A.2
Self-check mode
The self-check function available on the MC68HC05B4 provides an internal capability to
determine if the device is functional. Self-check is performed using the circuit shown in Figure A-3.
Port C pins PC0–PC3 are monitored for the self-check results (light emitting diodes are shown but
other devices could be used), and are interpreted as described in Table A-3. The self-check mode
is entered by applying 2 x VDD dc (via a 4.7kΩ resistor) to the IRQ pin and 5V dc input (via a 4.7kΩ
resistor) to the TCAP1 pin and then depressing the reset switch to execute a reset. After reset, the
following tests are performed automatically and once completed they continually repeat. A good
device will exhibit flashing LEDs; a bad device will be indicated by the LEDs holding at one value.
Note:
Self-check code can be obtained from your local Freescale representative.
I/0
—
Functionally exercises ports A, B, C and D
RAM
—
Counter test for each RAM byte
ROM
—
Exclusive OR with odd ones parity result
Timer
—
Tracks counter registers and checks ICF1, ICF2, OCF1, OCF2 and TOF
flags
SCI
—
Transmission test; check for RDRF, TDRE, TC and FE flags
A/D
—
Check A/D functionality on internal channels: VRL, VRH and (VRL +
VRH)/2
PLM
—
Checks the PLM basic functionality
Interrupts —
Tests external timer and SCI interrupts
Watchdog—
Tests the watchdog
Caution: This document includes descriptions of the various self-check and bootstrap
mechanisms that are currently implemented as firmware in the non-user ROM areas of
the MC68HC05B6 and related devices.
As these firmware routines are intended primarily to help Freescale’s engineers test the
devices, they may be changed or removed at any time.
For this reason, Freescale recommends the self-check and bootstrap routines are not
called from the user software. Customers who do call these routines from the user
software do so at their own risk.
14
MC68HC05B6
Rev. 4.1
MC68HC05B4
Freescale
A-5
Table A-3 MC68HC05B4 self-check results
PC3
PC2
PC1
PC0
1
0
0
1
Bad port
Remarks
0
1
1
0
Bad port
1
0
1
0
Bad RAM
1
0
1
1
Bad ROM
1
1
0
0
Bad Timer
1
1
0
1
Bad SCI
1
1
1
0
Bad A/D
0
0
0
1
Bad PLM
0
0
1
0
Bad interrupts
0
0
1
1
Bad watchdog
Flashing
Good device
All others
Bad device, bad port etc.
‘0’ indicates LED on; ‘1’ indicates LED off
14
Freescale
A-6
MC68HC05B4
MC68HC05B6
Rev. 4.1
P1
47 µF
10 nF
15
RESET
NC
8
VRH
18 RESET
10
VDD
16
OSC1
17
OSC2
10 MΩ
0.01 µF
22 pF
IRQ
50
52
20
21
2
51
3
4
5
9
11
12
13
14
24
25
26
27
28
29
30
31
22 pF
19
BC239
VPP1
RDI
TDO
PLMA
PLMB
TCMP1
SCLK
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
TCAP2
TCMP2 1
TCAP1 22
32
PB7
33
PB6
34
PB5
35
PB4
36
PB3
37
PB2
38
PB1
39
PB0
PC7
PC6
PC5
PC4
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
4k7 Ω
23
PC3
PC2
PC1
VSS VRL
41
Note:
4 MHz
NC
MC68HC05B4 (52-pin package)
6
40
GND
+5V
2xVDD
PC0
4k7 Ω
EEPROM tested
4k7 Ω
EEPROM not tested
4k7 Ω
42
43
44
45
46
47
48
49
680 Ω
680 Ω
680 Ω
680 Ω
7
For the MC68HC05B4, switches on PB5 and PB6 have no effect
All resistors are 10 kΩ, unless otherwise stated.
Figure A-3 MC68HC05B4 self-check schematic diagram
14
MC68HC05B6
Rev. 4.1
MC68HC05B4
Freescale
A-7
THIS PAGE LEFT BLANK INTENTIONALLY
14
Freescale
A-8
MC68HC05B4
MC68HC05B6
Rev. 4.1
B
MC68HC05B8
The MC68HC05B8 is a device similar to the MC68HC05B6, but with an increased ROM size of
7.25 kbytes. The entire MC68HC05B6 data sheet applies to the MC68HC05B8, with the
exceptions outlined in this appendix.
B.1
Features
•
7230 bytes User ROM (including 14 bytes User vectors)
•
High speed version available
14
TPG
MC68HC05B6
Rev. 4.1
MC68HC05B8
Freescale
B-1
157
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
PC0
PC1
PC2/ECLK
PC3
PC4
PC5
PC6
PC7
COP watchdog
OSC2
OSC1
Oscillator
÷ 2 / ÷32
M68HC05
CPU
VDD
VSS
432 bytes
self check ROM
176 bytes
RAM
16-bit
programmable
timer
Port D
PD0/AN0
PD1/AN1
PD2/AN2
PD3/AN3
PD4/AN4
PD5/AN5
PD6/AN6
PD7/AN7
VRH
VRL
Port A
RESET
IRQ
7230 bytes
User ROM
(including 14 bytes
User vectors)
Port B
Charge pump
VPP1
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
Port C
256 bytes
EEPROM
8-bit
A/D converter
TCMP1
TCMP2
TCAP1
TCAP2
SCI
RDI
SCLK
TDO
PLM
PLMA D/A
PLMB D/A
Figure B-1 MC68HC05B8 block diagram
14
TPG
Freescale
B-2
MC68HC05B8
MC68HC05B6
Rev. 4.1
158
MC68HC05B8
Registers
$0000
I/O
(32 bytes)
$0020
Page 0 User
ROM
(48 bytes)
$0050
$00C0
$0100
$0101
RAM
(176 bytes)
Stack
OPTR (1 byte)
Non protected (31 bytes)
$0120
EEPROM
(256 bytes)
Protected (224 bytes)
$0200
Self-check ROM I
(192 bytes)
$02C0
$0300
$1F00
User ROM
(7168 bytes)
Self-check ROM II
(240 bytes)
$1FF0
$1FF2–3
SCI
Timer overflow
$1FF4–5
$1FF6–7 Timer output compare 1& 2
$1FF8–9 Timer input capture 1 & 2
External IRQ
$1FFA–B
$1FFC–D
SWI
$1FFE–F Reset/power-on reset
Port A data register
$0000
Port B data register
$0001
Port C data register
$0002
Port D input data register
$0003
Port A data direction register
$0004
Port B data direction register
$0005
Port C data direction register
$0006
EEPROM/ECLK control register
$0007
A/D data register
$0008
A/D status/control register
$0009
Pulse length modulation A
$000A
Pulse length modulation B
$000B
Miscellaneous register
$000C
SCI baud rate register
$000D
SCI control register 1
$000E
SCI control register 2
$000F
SCI status register
$0010
SCI data register
$0011
Timer control register
$0012
Timer status register
$0013
Capture high register 1
$0014
Capture low register 1
$0015
Compare high register 1
$0016
Compare low register 1
$0017
Counter high register
$0018
Counter low register
$0019
Alternate counter high register
$001A
Alternate counter low register
$001B
Capture high register 2
$001C
Capture low register 2
$001D
Compare high register 2
$001E
Compare low register 2
$001F
Options register
$0100
User vectors
(14 bytes)
Reserved
Figure B-2 Memory map of the MC68HC05B8
14
TPG
MC68HC05B6
Rev. 4.1
MC68HC05B8
Freescale
B-3
159
Table B-1 Register outline
Register name
Address bit 7
Port A data (PORTA)
$0000
Port B data (PORTB)
$0001
Port C data (PORTC)
$0002
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State on
reset
Undefined
Undefined
PC2/
ECLK
Port D data (PORTD)
$0003
Port A data direction (DDRA)
$0004
0000 0000
0000 0000
Port B data direction (DDRB)
$0005
Port C data direction (DDRC)
$0006
EEPROM/ECLK control
$0007
A/D data (ADDATA)
$0008
A/D status/control (ADSTAT)
$0009
Pulse length modulation A (PLMA)
$000A
Pulse length modulation B (PLMB)
$000B
Miscellaneous
PD7
PD6
PD5
PD4
PD3
PD2
Undefined
PD1
PD0
Undefined
0000 0000
0
0
0
0
ECLK E1ERA E1LAT E1PGM 0000 0000
0
CH3
0000 0000
COCO ADRC ADON
CH2
CH1
CH0
0000 0000
0000 0000
0000 0000
$000C POR(1) INTP
INTN
INTE
SCT1
SCT0
SFA
SFB
SM
WDOG(2) ?001 000?
SCT0
SCR2
SCR1
SCR0 00uu uuuu
SCI baud rate (BAUD)
$000D
SPC1
SPC0
SCI control 1 (SCCR1)
$000E
R8
T8
SCI control 2 (SCCR2)
$000F
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SCI status (SCSR)
$0010
TDRE
TC
RDRF
IDLE
OR
NF
FE
SCI data (SCDR)
$0011
Timer control (TCR)
$0012
ICIE
OCIE
TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0
ICF1
OCF1
TOF
M
WAKE CPOL CPHA
LBCL
Undefined
SBK
0000 0000
1100 000u
0000 0000
ICF2
Undefined
Timer status (TSR)
$0013
Input capture high 1
$0014
OCF2
Input capture low 1
$0015
Undefined
Output compare high 1
$0016
Undefined
Output compare low 1
$0017
Undefined
Timer counter high
$0018
1111 1111
1111 1100
Undefined
Timer counter low
$0019
Alternate counter high
$001A
1111 1111
Alternate counter low
$001B
1111 1100
Input capture high 2
$001C
Undefined
Input capture low 2
$001D
Undefined
Output compare high 2
$001E
Undefined
Output compare low 2
$001F
Options (OPTR)(3)
$0100
Undefined
EE1P
SEC Not affected
(1) This bit is set each time there is a power-on reset.
(2) The state of the WDOG bit after reset is dependent upon the mask option selected; 1=watchdog enabled, 0=watchdog disabled.
(3) This register is implemented in EEPROM; therefore reset has no effect on the individual bits.
14
TPG
Freescale
B-4
MC68HC05B8
MC68HC05B6
Rev. 4.1
160
C
MC68HC705B5
The MC68HC705B5 is a device similar to the MC68HC05B6, but with the 6 kbytes ROM and 256
bytes EEPROM replaced by a single EPROM array. In addition, the self-check routines available
on the MC68HC05B6 are replaced by bootstrap firmware. The MC68HC705B5 is intended to
operate as a one time programmable (OTP) version of the MC68HC05B6 without EEPROM or the
MC68HC05B4, meaning that the application program can never be erased once it has been
loaded into the EPROM. The entire MC68HC05B6 data sheet applies to the MC68HC705B5, with
the exceptions outlined in this appendix.
C.1
Features
•
6206 bytes EPROM (including 14 bytes User vectors)
•
No EEPROM
•
Bootstrap firmware
•
Simultaneous programming of up to 4 bytes
•
Data protection for program code
•
Optional pull-down resistors on port B and port C
•
MC68HC05B6 mask options are programmable using control bits held in the options register
•
52-pin PLCC and 56-pin SDIP packages
•
High speed version not available
14
MC68HC05B6
Rev. 4.1
MC68HC705B5
Freescale
C-1
161
162
163
164
165
PC0
PC1
PC2/ECLK
PC3
PC4
PC5
PC6
PC7
Oscillator
÷ 2 / ÷32
176 bytes
RAM
M68HC05
CPU
VDD
VSS
16-bit
programmable
timer
Port D
PD0/AN0
PD1/AN1
PD2/AN2
PD3/AN3
PD4/AN4
PD5/AN5
PD6/AN6
PD7/AN7
VRH
VRL
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
496 bytes
bootstrap ROM
COP watchdog
OSC2
OSC1
Port A
RESET
IRQ
Port B
6206 bytes
EPROM
(including 14 bytes
User vectors)
VPP6
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
Port C
256 bytes
EPROM1
8-bit
A/D converter
TCMP1
TCMP2
TCAP1
TCAP2
SCI
RDI
SCLK
TDO
PLM
PLMA D/A
PLMB D/A
Figure C-1 MC68HC705B5 block diagram
14
Freescale
C-2
MC68HC705B5
MC68HC05B6
Rev. 4.1
166
167
168
169
170
MC68HC705B5
Registers
$0000
I/O
(32 bytes)
$0020
Page 0 User
EPROM
(48 bytes)
$0002
Port D input data register
$0003
$0005
Port C data direction register
$0006
EPROM/ECLK control register
$0007
A/D data register
$0008
A/D status/control register
$0009
Pulse length modulation A
$000A
Pulse length modulation B
$000B
Miscellaneous register
$000C
SCI baud rate register
$000D
SCI control register 1
$000E
SCI control register 2
$000F
SCI status register
$0010
SCI data register
$0011
Timer control register
$0012
Timer status register
$0013
Capture high register 1
$0014
User EPROM
(5888 bytes)
Capture low register 1
$0015
Compare high register 1
$0016
Compare low register 1
$0017
Options register
Counter high register
$0018
Counter low register
$0019
Alternate counter high register
$001A
Alternate counter low register
$001B
Capture high register 2
$001C
Capture low register 2
$001D
Compare high register 2
$001E
Compare low register 2
$001F
Options register
$1EFE
$0100
User EPROM1
(256 bytes)
Bootstrap ROMI
(256 bytes)
$0300
$0800
$1F00
$0001
$0004
Stack
$1EFE
Port B data register
Port C data register
Port A data direction register
RAM
(176 bytes)
$0200
$0000
Port B data direction register
$0050
$00C0
Port A data register
Bootstrap ROMII
(240 bytes)
$1FF0
$1FF2–3
SCI
Timer overflow
$1FF2–3
$1FF2–3 Timer output compare 1& 2
$1FF2–3 Timer input capture 1 & 2
External IRQ
$1FF2–3
$1FF2–3
SWI
$1FF2–3 Reset/power-on reset
User vectors
(14 bytes)
Reserved
Figure C-2 Memory map of the MC68HC705B5
14
MC68HC05B6
Rev. 4.1
MC68HC705B5
Freescale
C-3
171
172
173
174
175
Table C-1 Register outline
Register name
Address bit 7
Port A data (PORTA)
$0000
Port B data (PORTB)
$0001
Port C data (PORTC)
$0002
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State on
reset
Undefined
Undefined
PC2/
ECLK
Port D data (PORTD)
$0003
Port A data direction (DDRA)
$0004
0000 0000
0000 0000
Port B data direction (DDRB)
$0005
Port C data direction (DDRC)
$0006
EPROM/ECLK control
$0007
A/D data (ADDATA)
$0008
A/D status/control (ADSTAT)
$0009
Pulse length modulation A (PLMA)
$000A
Pulse length modulation B (PLMB)
$000B
Miscellaneous
PD7
PD6
PD5
PD4
PD3
PD2
Undefined
PD1
PD0
Undefined
0000 0000
EPPT(1) ELAT EPGM ECLK
u?00 0uuu
0000 0000
COCO ADRC ADON
0
CH3
CH2
CH1
CH0
0000 0000
0000 0000
0000 0000
$000C POR(2) INTP
INTN
INTE
SCT1
SCT0
SFA
SFB
SM
WDOG(3) ?001 000?
SCT0
SCR2
SCR1
SCR0 00uu uuuu
SCI baud rate (BAUD)
$000D
SPC1
SPC0
SCI control 1 (SCCR1)
$000E
R8
T8
SCI control 2 (SCCR2)
$000F
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SCI status (SCSR)
$0010
TDRE
TC
RDRF
IDLE
OR
NF
FE
SCI data (SCDR)
$0011
Timer control (TCR)
$0012
ICIE
OCIE
TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0
ICF1
OCF1
TOF
Timer status (TSR)
$0013
Input capture high 1
$0014
M
WAKE CPOL CPHA
LBCL
uuuu
SBK
0000 0000
1100 000u
0000 0000
ICF2
uuuu
OCF2
Undefined
Input capture low 1
$0015
Undefined
Output compare high 1
$0016
Undefined
Output compare low 1
$0017
Undefined
Timer counter high
$0018
1111 1111
1111 1100
Timer counter low
$0019
Alternate counter high
$001A
1111 1111
Alternate counter low
$001B
1111 1100
Input capture high 2
$001C
Undefined
Input capture low 2
$001D
Undefined
Output compare high 2
$001E
Undefined
Output compare low 2
$001F
Options (OPTR)(4)
$1EFE
Undefined
EPP
0
RTIM RWAT WWAT PBPD PCPD Not affected
(1) This bit reflects the state of the EPP bit in the options register ($1EFE) at reset.
(2) This bit is set each time the device is powered-on.
(3) The state of the WDOG bit after reset depends on the mask option selected; ‘1’ = watchdog enabled and ‘0’ = watchdog disabled.
(4) Because this register is implemented in EPROM, reset has no effect on the state of the individual bits.
14
Freescale
C-4
MC68HC705B5
MC68HC05B6
Rev. 4.1
176
177
178
C.2
EPROM
The MC68HC705B5 has a total of 6206 bytes of EPROM, 256 bytes being reserved for the
EPROM1 array (see Figure C-2). The EPP bit (EPROM protect) is not operative on the EPROM1
array, making it possible to program it after the main EPROM has been programmed and
protected. The reset and interrupt vectors are located at $1FF2-$1FFF and the EPROM control
register described in Section C.3.1 is located at address $0007.
The EPROM array is supplied by the VPP6 pin in both read and programming modes. Typically
the user’s software will be loaded in a programming board where VPP6 is controlled by one of the
bootstrap loader routines (bootloader mode). It will then be placed in an application where no
programming occurs (user mode). In this case the VPP6 pin should be hardwired to VDD.
An erased EPROM byte reads as $00.
Warning: A minimum VDD voltage must be applied to the VPP6 pin at all times, including
power-on, as a lower voltage could damage the device. Unless otherwise stated,
EPROM programming is guaranteed at ambient (25°C) temperature only
C.2.1
EPROM programming operation
The User program can be used to program some EPROM locations, provided the proper
procedure is followed. In particular, the programming sequence must be running in RAM, as the
EPROM will not be available for code execution while the ELAT bit is set. The VPP6 switching must
occur externally, after the EPGM bit is set, for example, under the control of a signal generated on
a pin by the programming routine.
Note:
Unless the part has a window for reprogramming, only the cumulative programming of
bits to logic 1 is possible if multiple programming is made on the same byte.
To allow simultaneous programming of up to 4 bytes, they must be in the same group of addresses
which share the same most significant address bits; only the two LSBs can change.
14
MC68HC05B6
Rev. 4.1
MC68HC705B5
Freescale
C-5
C.3
EPROM registers
C.3.1
EPROM control register
Address
EPROM/ECLK control
$0007
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
State
on reset
bit 0
EPPT(1) ELAT EPGM ECLK
u?00 0uuu
(1) This bit is a copy of the EPP bit in the options register at $1EFE and therefore its state on reset will be the same as that for the
EPP bit.
Bit 7 — Factory use only
This bit is strictly for factory use only and will always read zero.
EPPT — EPROM protect test bit
This bit is a copy of the EPROM protect bit (EPP) located in the option register. When ELAT is set,
the EPPT bit can be tested by the software to check if the EPROM array is protected or not, since
the EPROM content is not available when ELAT is set.
POR or external reset modifies this bit to reflect the state of the EPP bit in the options register.
ELAT — EPROM programming latch enable bit
1 (set)
–
0 (clear) –
When set, this bit allows latching of the address and up to 4 data
bytes for further programming, provided EPGM is zero.
When cleared, program and interrupt routines can be executed and
data can be read in the EPROM or firmware ROM.
STOP, power-on and external reset clear this bit.
EPGM — EPROM programming bit
This bit is the EPROM program enable bit. It can be set to ‘1’ to enable programming only after
ELAT is set and at least one byte is written to the EPROM. It is not possible to clear EPGM by
software, but clearing ELAT will always clear EPGM.
ECLK — External clock option bit
See Section 4.3.
14
Freescale
C-6
MC68HC705B5
MC68HC05B6
Rev. 4.1
C.4
Options register (OPTR)
Address
Options (OPTR)(1)
bit 7
$1EFE
bit 6
bit 5
EPP
0
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
RTIM RWAT WWAT PBPD PCPD Not affected
(1) This register is implemented in EPROM, therefore reset has no effect on the state of the individual bits.
Note:
This register can only be written to while the device is in bootloader mode.
Bit 7 — Factory use only
Warning: This bit is strictly for factory use only and will always read zero to avoid accidental
damage to the device. Any attempt to write to this bit could result in physical damage.
EPP — EPROM protect
This bit protects the contents of the main EPROM against accidental modification; it has no effect
on reading or executing code in the EPROM.
1 (set)
–
0 (clear) –
EPROM contents are protected.
EPROM contents are not protected.
RTIM — Reset time
This bit can modify tPORL, i.e. the time that the RESET pin is kept low following a power-on reset.
This feature is handled in the ROM part via a mask option.
1 (set)
–
0 (clear) –
tPORL = 16 cycles.
tPORL = 4064 cycles.
RWAT — Watchdog after reset
This bit can modify the status of the watchdog counter after reset.
1 (set)
–
0 (clear) –
The watchdog will be active immediately following power-on or
external reset (except in bootstrap mode).
The watchdog system will be disabled after power-on or external
reset.
WWAT — Watchdog during WAIT mode
This bit can modify the status of the watchdog counter during WAIT mode.
MC68HC05B6
Rev. 4.1
MC68HC705B5
14
Freescale
C-7
1 (set)
–
0 (clear) –
The watchdog will be active during WAIT mode.
The watchdog system will be disabled during WAIT mode.
PBPD – Port B pull-down resistors
1 (set)
–
0 (clear) –
Pull-down resistors are connected to all 8 pins of port B; the
pull-down, RPD, is active only while the pin is an input.
No pull-down resistors are connected.
PCPD — Port C pull-down resistors
1 (set)
–
0 (clear) –
Pull-down resistors are connected to all 8 pins of port C; the
pull-down, RPD, is active only while the pin is an input.
No pull-down resistors are connected.
The combination of bit 0 and bit 1 allows the option of pull-down resistors on 0, 8 or 16 inputs. This
feature is not available on the MC68HC05B6.
C.5
Bootstrap mode
The 432 bytes of self-check firmware on the MC68HC05B6 are replaced with 496 bytes of
bootstrap firmware. The bootstrap firmware located from $0200 to $02FF and $1F00 to $1FEF
can be used to program the EPROM, to check if the EPROM is erased and to load and execute
data in RAM.
When the MC68HC705B5 is placed in the bootstrap mode, the bootstrap reset vector is fetched
and the bootstrap firmware starts to execute. Table C-2 shows the conditions required to enter
each level of bootstrap mode on the rising edge of RESET. The hold time on the IRQ and TCAP1
pins after the external RESET pin is brought high is two clock cycles.
Table C-2 Mode of operation selection
IRQ pin
TCAP1 pin
PD2
PD3
PD4
VSS to VDD
VSS to VDD
x
x
x
Mode
+ 9 Volts
VDD
0
1
0
Erased EPROM verification
+ 9 Volts
VDD
x
0
0
EPROM parallel bootstrap load
+ 9 Volts
VDD
x
1
1
EPROM (RAM) serial bootstrap load and execute
+ 9 Volts
VDD
x
0
1
RAM parallel bootstrap load and execute
Single chip
x = Don’t care
14
Freescale
C-8
MC68HC705B5
MC68HC05B6
Rev. 4.1
The bootstrap program first copies part of itself into RAM, as the program cannot be executed in
ROM during verification/programming of the EPROM. It then sets the TCMP1 output to a logic high
level.
Reset
IRQ at 9V?
N
User mode
Y
TCAP1 set?
N
Non-user mode
Y
Bootstrap mode
A
Y
PD4 set?
N
PD3 set?
Y
Y
N
Parallel EPROM bootstrap
Program EPROM;
parallel load;
green LED flashes
Programming OK?
EPROM
erased?
N
PD2 set?
N
Y
Non-user mode
Red LED on
EPROM not erased
Green LED on
Y
N
Red LED on
Green LED on
Bad EPROM programming
EPROM verified
Figure C-3 Modes of operation flow chart (1 of 2)
14
MC68HC05B6
Rev. 4.1
MC68HC705B5
Freescale
C-9
A
Bootstrap RAM
N
PD3 set?
Y
N
PD4 set?
Serial EPROM (RAM) bootstrap
Red LED off
Y
N
Load next RAM
byte
Transmit last four
programmed locations
RAM full?
Receive address
Y
Execute RAM
program at $0050
Receive four data
Green LED on
Y
Bad EPROM
programming
Negative
address?
Red LED on
N
Execute RAM
program at $0083
N
Program EPROM data
at address; green LED
flashes
Y
Programming OK?
Figure C-4 Modes of operation flow chart (2 of 2)
14
Freescale
C-10
MC68HC705B5
MC68HC05B6
Rev. 4.1
C.5.1
Erased EPROM verification
The flowchart in Figure C-3 and Figure C-4 shows that the on-chip bootstrap routines can be used
to check if the EPROM is erased (all $00s). If a non $00 byte is detected, the red LED stays on
and the routine will stay in a loop. Only when the whole EPROM content is verified as erased will
the green LED be turned on.
C.5.2
EPROM parallel bootstrap load
When this mode is selected, the EPROM is loaded in increasing address order with non EPROM
segments being skipped by the loader. Simultaneous programming is performed by reading four
bytes of data before actual programming is performed, thus dividing the loading time of the internal
EPROM by four.
When PD2=0, the programming time is set to 5 milliseconds and the program/verify routine takes
approximately 15 seconds.
Parallel data is entered through Port A, while the 13-bit address is output on port B and PC0 to
PC4. If the data comes from an external EPROM, the handshake can be disabled by connecting
together PC5 and PC6. If the data is supplied via a parallel interface, handshaking will be provided
by PC5 and PC6 according to the timing diagram of Figure C-5.
During programming, the green LED flashes at about 3 Hz.
Upon completion of the programming operation, the EPROM content is checked against the
external data source. If programming is verified the green LED stays on, while an error causes the
red LED to be turned on. Figure C-6 shows a circuit that can be used to program the EPROM (or
to load and execute data in the RAM).
Note:
The entire EPROM can be loaded from the external source; if it is desired to leave a
segment undisturbed, the data for this segment should be all zeros.
Address
HDSK out
(PC5)
DATA
HDSK in
(PC6)
F29
Data read
14
Data read
Figure C-5 Timing diagram with handshake
MC68HC05B6
Rev. 4.1
MC68HC705B5
Freescale
C-11
RESET
RUN
1N914
P1 1
2
3
+
100µF
GND
+5V
VPP
1kΩ
100kΩ
1.0µF
+
1N914
TCAP1 VRH VDD
IRQ
47µF
OSC1
+
10MΩ
red LED
470Ω
0.01µF
470Ω
RESET
OSC2
NC
TCMP1
TCMP2
PLMA
PLMB
RDI
VRL
TCAP2
PD7
PD6
PD5
PD3
PD2
PD1
PD0
green LED
red LED — programming failed
green LED — programming OK
4.0 MHz
22pF
22pF
MC68HC705B5
+5V
RAM
26
27
28
VPP NC PGM VCC
20
A0
A1
A2
A3
A4
A5
A6
A7
CE
27C64
25
24
21
23
2
A8
A9
A10
A11
A12
GND
14
Note:
D0
D1
D2
D3
D4
D5
D6
D7
OE
1N5819
1
EPROM
10
9
8
7
6
5
4
3
11
12
13
15
16
17
18
19
TDO
SCLK
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
10 kΩ
1 kΩ
BC309C
PD4
VPP6
12 kΩ
4k7Ω
PC7
BC239C
1nF
+
4k7Ω
+5V
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
100 kΩ
HDSK out
PC5
PC6
VSS
PC4
PC3
PC2
PC1
PC0
Short circuit if
handshake not used
A12
A11
A10
A9
A8
HDSK in
22
This circuit is recommended for programming only at 25°C and not for use in the
end application, or at temperatures other than 25°C. If used in the end application,
VPP6 should be tied to VDD to avoid damaging the device.
14
Figure C-6 EPROM(RAM) parallel bootstrap schematic diagram
Freescale
C-12
MC68HC705B5
MC68HC05B6
Rev. 4.1
C.5.3
EPROM (RAM) serial bootstrap load and execute
The serial routine communicates through the SCI with an external host, typically a PC, by means
of an RS232 link at 9600 baud, 8-bit, no parity and full duplex.
Data format is not ASCII, but 8-bit binary, so a complementary program must be run by the host
to supply the required format. Such a program is available for the IBM PC from Freescale.
The EPROM bootstrap routines are used to customise the OTP EPROM. To increase the speed
of programming, four bytes are programmed in parallel while the data is simultaneously
transmitted and received in full duplex. This implies that while 4 bytes are being programmed, the
next 4 bytes are received and the preceding 4 bytes are echoed. The format accepted by the serial
loader is as follows:
[address n high] [address n low] [data(n)] [data (n+1)] [data (n+2)] [data (n+3)]
Address n must have the two LSBs at zero so that n, n+1, n+2 and n+3 have identical MSBs.
These blocks of four bytes do not need to be contiguous, as a new address is transmitted for each
new group.
The protocol is as follows:
1
The MC68HC705B5 sends the last two bytes programmed to the host as a
prompt; this allows verification by the host of proper programming.
1) In response to the first byte prompt, the host sends the first address byte.
2) After receiving the first address byte, the MC68HC705B5 sends the next
byte programmed.
3) The exchange of data continues until the MC68HC705B5 has sent the four
data bytes and the host has sent the 2 address data bytes and 4 data bytes.
4) If the data is non zero, it is programmed at the address provided, while the
next address and bytes are received and the previous data is echoed.
5) Loop to 1.
After reset, the MC68HC705B5 serial bootstrap routine will first echo two blocks of four bytes at
$0000, as no data is programmed yet.
If the data sent in is $00, no programming in the EPROM takes place, and the contents of the
accessed location are returned as a prompt. The entire EPROM memory can be read in this
fashion (serial dump). The red LED will be on if the data read from the EPROM is not $00.
Serial RAM loading and execute can be accomplished in this mode. A RAM byte will be written if
the address sent by the host in the serial protocol points to the RAM.
In the RAM bootloader mode, all interrupt vectors are mapped to pseudo-vectors in RAM (see
Table C-3). This allows programmers to use their own service-routine addresses. Each
pseudo-vector is allowed three bytes of space rather than the two bytes for normal vectors,
because an explicit jump (JMP) opcode is needed to cause the desired jump to the user’s
service-routine address.
MC68HC05B6
Rev. 4.1
MC68HC705B5
Freescale
C-13
14
Table C-3 Bootstrap vector targets in RAM
Vector targets in RAM
SCI interrupt
$00E4
Timer overflow
$00E7
Timer output compare
$00EA
Timer input capture
$00ED
IRQ
$00F0
SWI
$00F3
A 10-byte stack is also reserved at the top of the RAM allowing, for example, one interrupt and two
sub-routine levels.
Program execution is triggered by sending a negative (bit 7 set) high address; execution starts at
address XADR ($0083).
The RAM addresses between $0050 and $0082 are used by the loader and are therefore not
available to the user during serial loading/executing.
Refer to Figure C-7 shows a suitable circuit. Figure C-9 shows address and data bus timing.
C.5.4
RAM parallel bootstrap load and execute
The RAM bootstrap program will start loading the RAM with external data (e.g. from a 2564 or
2764 EPROM). Before loading a new byte, the state of the PD4/AN4 pin is checked; if this pin goes
to level ‘0’, or if the RAM is full, then control is given to the loaded program at address $0050.
If the data is supplied by a parallel interface, handshaking will be provided by PC5 and PC6
according to Figure C-10. If the data comes from an external EPROM, the handshake can be
disabled by connecting together PC5 and PC6.
Figure C-8 shows a circuit that can be used to load the RAM with short test programs. Up to 8
programs can be loaded in turn from the EPROM. Selection is accomplished by means of the
switches connected to the EPROM higher address lines (A8 through A10). If the user program sets
PC0 to level ‘1’, the external EPROM will be disabled, rendering both port A outputs and port B
inputs available.
The EPROM parallel bootstrap loader circuit (Figure C-6) can also be used, provided VPP is tied
to VDD. The high order address lines will be at zero. The LEDs will stay off.
14
Freescale
C-14
MC68HC705B5
MC68HC05B6
Rev. 4.1
P1
RESET
100kΩ
RUN
10nF
1kΩ
1N914
1.0µF
+
1N914
22
8
1
2
3
GND
+5V
VPP
+
47µF
10
TCAP1 VRH VDD
19
IRQ
18 RESET
47µF
OSC1
+
10MΩ
OSC2
Red LED
470Ω
0.01µF
20
470Ω
21
PLMA
4.0 MHz
22pF
22pF
PLMB
Green LED
PD3
Erase check
MC68HC705B5
Green — EPROM erased
Red — EPROM not erased
Serial boot
PD4
Green — programming OK
Red — programming error
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
9600 BD
8-bit
no parity
RS232
Connector
22µF
+
8
5
7
3
2
1
2 x 3KΩ
+5V
16
2
22µF
+
6
MAX
232
13
14
1
3
4
5
12
11
+
22µF
+
22µF
14
13
12
5
4
3
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
VPP6
12 kΩ
4k7Ω
PC7
PD0
PD1
PD2
PD5
PD6
PD7
50
RDI
52
TDO
VSS
41
BC239C
1nF
+
4k7Ω
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
15
Note:
10 kΩ
1 kΩ
BC309C
Serial boot
1N5819
Erase check
PC6
PC5
PC4
PC3
PC2
PC1
PC0
43
44
45
46
47
48
49
23
TCAP2
2
TCMP1
1
TCMP2
51
SCLK
40
NC
VRL
7
A minimum VDD voltage must be applied to the VPP6 pin at all times,
including power-on, as a lower voltage could damage the device. Unless
otherwise stated, EPROM programming is guaranteed at ambient (25°C)
temperature only
Figure C-7 EPROM (RAM) serial bootstrap schematic diagram
MC68HC05B6
Rev. 4.1
MC68HC705B5
Freescale
C-15
14
P1
RESET
RUN
100µF
1N914
+
1
GND
+5V
2
1kΩ
100kΩ
1.0µF
+
1N914
TCAP1
VDD
IRQ
OSC1
RESET
OSC2
10MΩ
4.0 MHz
0.01µF
22pF
22pF
PD4
VPP6
MC68HC705B5
+5V
1
26
27
+5V
16 x 100kΩ
28
VPP NC PGM VCC
20
CE
23
A11
2
A12
U1
2764
+5V
3 x 4.7kΩ
25
24
21
A8
A9
A0
A1
A2
A3
A4
A5
A6
A7
D0
D1
D2
D3
D4
D5
D6
D7
10
9
8
7
6
5
4
3
11
12
13
15
16
17
18
19
A10
GND
14
OE
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB6
PB7
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
+5V
18 x 100 kΩ
NC
TCAP2
TCMP2
TCMP1
PLMB
PLMA
SCLK
TDO
RDI
VRH
VRL
PD7
PD6
PD5
PD3
PD2
PD1
PD0
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
VSS
22
14
Figure C-8 RAM parallel bootstrap schematic diagram
Freescale
C-16
MC68HC705B5
MC68HC05B6
Rev. 4.1
C.5.5
Bootstrap loader timing diagrams
tCOOE
tCOOE
tCOOE
tCDDE
Address
tADE
tDHE
tADE
tDHE
tADE
tDHE
tADE
tDHE
Data
tADE max (address to data delay)
5 machine cycles
tDHA min (data hold time)
14 machine cycles
tCOOE (load cycle time)
117 machine cycles < tCOOE < 150 machine cycles
tCDDE (programming cycle time)
tCOOE + tPROG (5ms nominal)
1 machine cycle = 1/(2f0(Xtal))
Figure C-9 EPROM parallel bootstrap loader timing diagram
14
MC68HC05B6
Rev. 4.1
MC68HC705B5
Freescale
C-17
tCR
Address
PC5 out
tHO
tADR
tDHR
Data
tHI max
PC6 in
PD4
tEXR max
tADR max (address to data delay; PC6=PC5)
16 machine cycles
tDHR min (data hold time)
4 machine cycles
tCR (load cycle time; PC6=PC5)
49 machine cycles
tHO (PC5 handshake out delay)
5 machine cycles
tHI max (PC6 handshake in, data hold time)
10 machine cycles
tEXR max (max delay for transition to be
recognised during this cycle; PC6=PC5
30 machine cycles
1 machine cycle = 1/(2f0(Xtal))
Figure C-10
RAM parallel loader timing diagram
14
Freescale
C-18
MC68HC705B5
MC68HC05B6
Rev. 4.1
C.6
Note:
DC electrical characteristics
The complete table of DC electrical characteristics can be found in Section 11.2. The
values contained in the following table should be used in conjunction with those quoted
in that section.
Table C-4 Additional DC electrical characteristics for MC68HC705B5
(VDD = 5 Vdc ± 10%, VSS = 0 Vdc, TA = 25°C)
Characteristic
Symbol
Input current
Port B and port C pull-down (VIN =VIH)
IRPD
EPROM absolute maximum voltage
EPROM programming voltage
EPROM programming current
EPROM read voltage
C.7
Note:
Min
Typ
Max
Unit
µA
80
VPP6 max
VDD
—
18
V
VPP6
15.0
15.5
16
V
IPP6
—
—
18
mA
VPP6R
VDD
VDD
VDD
V
Control timing
The complete table of control timing can be found in Section 11.4. The values
contained in the following table should be used in conjunction with those quoted in that
section.
Table C-5 Additional control timing for MC68HC705B5
(VDD = 5 Vdc ± 10%, VSS = 0 Vdc, TA = 25° C)
Characteristic
EPROM programming time
Symbol
Min
Typ
Max
Unit
tPROG
5
—
20
ms
14
MC68HC05B6
Rev. 4.1
MC68HC705B5
Freescale
C-19
THIS PAGE LEFT BLANK INTENTIONALLY
14
Freescale
C-20
MC68HC705B5
MC68HC05B6
Rev. 4.1
D
MC68HC05B16
Maskset errata
This errata section outlines the differences between previously available masksets
(D20J, F62J and G28F) and all other masksets. Unless otherwise stated, the main
body of Appendix D refers to all these other masksets with any differences being noted
in this errata section.
•
Certain MC68HC05B16 masksets contain the same oscillator circuitry as the
MC68HC05B6 (see Section 2.5.8.3). These are denoted by D20J, F62J and G28F.
The MC68HC05B16 is a device similar to the MC68HC05B6, but with increased RAM, ROM and
self-check ROM sizes. The entire MC68HC05B6 data sheet, including the electrical
characteristics, applies to the MC68HC05B16, with the exceptions outlined in this appendix.
D.1
Features
•
15 kbytes User ROM
•
352 bytes of RAM
•
496 bytes self-check ROM
•
52-pin PLCC, 56-pin SDIP and 64-pin QFP packages
•
High speed version available
14
MC68HC05B6
Rev. 4.1
MC68HC05B16
Freescale
D-1
179
180
181
182
183
Table D-1 Mode of operation selection
D.2
IRQ pin
TCAP1 pin
PD3
PD4
VSS to VDD
VSS to VDD
X
X
Mode
2VDD
VDD
0
X
Self check
2VDD
VDD
1
0
Serial RAM loader
2VDD
VDD
1
1
Jump to any address
Single chip
Self-check routines
The self-check routines for the MC68HC05B16 are identical to those of the MC68HC05B4 with the
following exception.
The count byte on the MC68HC05B16 can be any value up to 256 ($00). The first 176 bytes are
loaded into RAM I and the remainder is loaded into RAM II starting at $0250.
14
184
Freescale
D-2
MC68HC05B16
MC68HC05B6
Rev. 4.1
Port A
Port B
Charge pump
VPP1
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
Port C
256 bytes
EEPROM
PC0
PC1
PC2/ECLK
PC3
PC4
PC5
PC6
PC7
496 bytes
self-check ROM
15120 bytes
ROM
RESET
IRQ
COP watchdog
OSC2
OSC1
Oscillator
÷ 2 / ÷32
M68HC05
CPU
VDD
VSS
16-bit
timer
Port D
PD0/AN0
PD1/AN1
PD2/AN2
PD3/AN3
PD4/AN4
PD5/AN5
PD6/AN6
PD7/AN7
VRH
VRL
352 bytes
static RAM
8-bit
A/D converter
TCMP1
TCMP2
TCAP1
TCAP2
SCI
RDI
SCLK
TDO
PLM
PLMA D/A
PLMB D/A
Figure D-1 MC68HC05B16 block diagram
14
MC68HC05B6
Rev. 4.1
MC68HC05B16
Freescale
D-3
D.3
External clock
When using an external clock the OSC1 and OSC2 pins should be driven in antiphase, as shown
in Figure D-2. The tOXOV or tILCH specifications (see Section 11.4) do not apply when using an
external clock input. The equivalent specification of the external clock source should be used in
lieu of tOXOV or tILCH.
L
C1
RS
OSC1
OSC2
MCU
C0
OSC1
OSC2
(b) Crystal equivalent circuit
COSC2
COSC1
MCU
(a) Crystal/ceramic resonator
oscillator connections
OSC1
OSC2
External
clock
NC
(c) External clock source connections
Crystal
RS(max)
C0
Ceramic resonator
2MHz
4MHz
Unit
400
75
Ω
RS(typ)
2 – 4MHz
10
Unit
Ω
5
7
pF
C0
40
pF
8
12
ƒF
C1
4.3
pF
COSC1
15 – 40 15 – 30
pF
COSC1
30
pF
COSC2
15 – 30 15 – 25
pF
COSC2
30
pF
C1
RP
10
10
MΩ
RP
1 – 10
MΩ
Q
30 000
40 000
—
Q
1250
—
(d) Typical crystal and ceramic resonator parameters
Figure D-2 Oscillator connections
14
Freescale
D-4
MC68HC05B16
MC68HC05B6
Rev. 4.1
MC68HC05B16
Registers
$0000
I/O
(32 bytes)
$0020
Page 0 User
ROM
(48 bytes)
Port A data register
$0000
Port B data register
$0001
Port C data register
$0002
Port D input data register
$0003
Port A data direction register
$0004
Port B data direction register
$0005
Port C data direction register
$0006
EEPROM/ECLK control register
$0007
A/D data register
$0008
A/D status/control register
$0009
Pulse length modulation A
$000A
Pulse length modulation B
$000B
Miscellaneous register
$000C
SCI baud rate register
$000D
SCI control register 1
$000E
SCI control register 2
$000F
SCI status register
$0010
$0011
$0200
SCI data register
Timer control register
$0012
$0250
Timer status register
$0013
RAM11
(176 bytes)
Capture high register 1
$0014
Capture low register 1
$0015
User ROM
(15104 bytes)
Compare high register 1
$0016
Compare low register 1
$0017
$3DFE
Counter high register
$0018
Counter low register
$0019
$3E00
Alternate counter high register
$001A
Alternate counter low register
$001B
Capture high register 2
$001C
Capture low register 2
$001D
Compare high register 2
$001E
Compare low register 2
$001F
Options register
$0100
$0050
$00C0
$0100
$0101
RAM1
(176 bytes)
Stack
Options register
Unprotected (31 bytes)
$0120
EEPROM
(256 bytes)
Protected (224 bytes)
$0300
Self-check ROM
(496 bytes)
$3FF0
$3FF2–3
SCI
Timer overflow
$3FF4–5
$3FF6–7 Timer output compare 1& 2
$3FF8–9 Timer input capture 1 & 2
External IRQ
$3FFA–B
$3FFC–D
SWI
$3FFE–F Reset/power-on reset
User vectors
(14 bytes)
Reserved
Figure D-3 Memory map of the MC68HC05B16
14
MC68HC05B6
Rev. 4.1
MC68HC05B16
Freescale
D-5
Table D-2 Register outline
Register name
Address bit 7
Port A data (PORTA)
$0000
Port B data (PORTB)
$0001
Port C data (PORTC)
$0002
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State on
reset
Undefined
Undefined
PC2/
ECLK
Port D data (PORTD)
$0003
Port A data direction (DDRA)
$0004
0000 0000
0000 0000
Port B data direction (DDRB)
$0005
Port C data direction (DDRC)
$0006
EEPROM/ECLK control
$0007
A/D data (ADDATA)
$0008
A/D status/control (ADSTAT)
$0009
Pulse length modulation A (PLMA)
$000A
Pulse length modulation B (PLMB)
$000B
Miscellaneous
PD7
PD6
PD5
PD4
PD3
PD2
Undefined
PD1
PD0
Undefined
0000 0000
0
0
0
0
ECLK E1ERA E1LAT E1PGM 0000 0000
0
CH3
0000 0000
COCO ADRC ADON
CH2
CH1
CH0
0000 0000
0000 0000
0000 0000
$000C POR(1) INTP
INTN
INTE
SCT1
SCT0
SFA
SFB
SM
WDOG(2) ?001 000?
SCT0
SCR2
SCR1
SCR0 00uu uuuu
SCI baud rate (BAUD)
$000D
SPC1
SPC0
SCI control 1 (SCCR1)
$000E
R8
T8
SCI control 2 (SCCR2)
$000F
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SCI status (SCSR)
$0010
TDRE
TC
RDRF
IDLE
OR
NF
FE
SCI data (SCDR)
$0011
Timer control (TCR)
$0012
ICIE
OCIE
TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0
ICF1
OCF1
TOF
M
WAKE CPOL CPHA
LBCL
Undefined
SBK
0000 0000
1100 000u
0000 0000
ICF2
Undefined
Timer status (TSR)
$0013
Input capture high 1
$0014
OCF2
Input capture low 1
$0015
Undefined
Output compare high 1
$0016
Undefined
Output compare low 1
$0017
Undefined
Timer counter high
$0018
1111 1111
1111 1100
Undefined
Timer counter low
$0019
Alternate counter high
$001A
1111 1111
Alternate counter low
$001B
1111 1100
Input capture high 2
$001C
Undefined
Input capture low 2
$001D
Undefined
Output compare high 2
$001E
Undefined
Output compare low 2
$001F
Options (OPTR)(3)
$0100
Undefined
EE1P
SEC Not affected
(1) This bit is set each time there is a power-on reset.
(2) The state of the WDOG bit after reset is dependent upon the mask option selected; 1=watchdog enabled, 0=watchdog disabled.
(3) This register is implemented in EEPROM; therefore reset has no effect on the individual bits.
14
Freescale
D-6
MC68HC05B16
MC68HC05B6
Rev. 4.1
E
MC68HC705B16
To ensure correct operation of the MC68HC705B16 after power-on, the device must
be reset a second time after power-on. This can be done in software using the
MC68HC705B16 watchdog.
The following software sub-routine should be used:
RESET2
BSET
0, $0C
STOP
Start watchdog
STOP causes immediate watchdog
system reset
The interrupt vector at $3FF0 and $3FF1 must be initialised with the RESET2
address value.
The MC68HC705B16 is a device similar to the MC68HC05B6, but with increased RAM and
15 kbytes of EPROM instead of 6 kbytes of ROM. In addition, the self-check routines available in
the MC68HC05B6 are replaced by bootstrap firmware. The MC68HC705B16 is an OTPROM
(one-time programmable ROM) version of the MC68HC05B16, meaning that once the application
program has been loaded in the EPROM it can never be erased. The entire MC68HC05B6 data
sheet applies to the MC68HC705B16, with the exceptions outlined in this appendix.
14
MC68HC05B6
Rev. 4.1
MC68HC705B16
Freescale
E-1
185
186
187
188
189
E.1
Features
352 bytes of RAM
•
576 bytes bootstrap ROM
•
Simultaneous programming of up to 8 bytes of EPROM
•
Optional pull-down resistors available on all port B and port C pins
•
52-pin PLCC and 64-pin QFP packages
•
High speed version not available
256 bytes
EEPROM
VPP1
Charge pump
VPP6
15168 bytes
EPROM
RESET
IRQ
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
PC0
PC1
PC2/ECLK
PC3
PC4
PC5
PC6
PC7
576 bytes
bootstrap ROM
COP watchdog
OSC2
OSC1
Oscillator
÷ 2 / ÷ 32
352 bytes
static RAM
M68HC05
CPU
VDD
VSS
16-bit
timer
Port D
PD0/AN0
PD1/AN1
PD2/AN2
PD3/AN3
PD4/AN4
PD5/AN5
PD6/AN6
PD7/AN7
VRH
VRL
Port A
•
Port B
15 kbytes EPROM
Port C
•
8-bit
A/D converter
TCMP1
TCMP2
TCAP1
TCAP2
SCI
RDI
SCLK
TDO
PLM
PLMA D/A
PLMB D/A
Figure E-1 MC68HC705B16 block diagram
14
Note:
Freescale
E-2
The electrical characteristics of the MC68HC05B6 as provided in Section 11 do not
apply to the MC68HC705B16. Data specific to the MC68HC705B16 can be found in
this appendix.
MC68HC705B16
MC68HC05B6
Rev. 4.1
190
191
192
193
194
MC68HC705B16
Registers
$0000
I/O
(32 bytes)
$0020
Page 0 User
EPROM
(48 bytes)
$0100
$0101
$0006
E/EEPROM/ECLK control register
$0007
A/D data register
$0008
A/D status/control register
$0009
Pulse length modulation A
$000A
Pulse length modulation B
$000B
Miscellaneous register
$000C
SCI baud rate register
$000D
SCI control register 1
$000E
SCI control register 2
$000F
SCI status register
$0010
SCI data register
$0011
Timer control register
$0012
Timer status register
$0013
RAM11
(176 bytes)
Capture high register 1
$0014
Capture low register 1
$0015
User EPROM
(15104 bytes)
Compare high register 1
$0016
Compare low register 1
$0017
Counter high register
$0018
Counter low register
$0019
Alternate counter high register
$001A
Alternate counter low register
$001B
Capture high register 2
$001C
Capture low register 2
$001D
Compare high register 2
$001E
Compare low register 2
$001F
Options register
$0100
Mask option register
$3DFE
EEPROM
(256 bytes)
Protected (224 bytes)
$3DFE
$3DFF
$3E00
$0003
$0005
Unprotected (31 bytes)
Bootstrap ROM1
(80 bytes)
$0300
$0002
Port D input data register
Port C data direction register
Options register
$0250
$0001
$0004
Stack
$0200
Port B data register
Port C data register
Port A data direction register
RAM1
(176 bytes)
$0120
$0000
Port B data direction register
$0050
$00C0
Port A data register
Mask option register
Bootstrap ROM11
(496 bytes)
$3FF0–1
$3FF2–3
SCI
Timer overflow
$3FF4–5
$3FF6–7 Timer output compare 1& 2
$3FF8–9 Timer input capture 1 & 2
External IRQ
$3FFA–B
$3FFC–D
SWI
$3FFE–F Reset/power-on reset
User vectors
(14 bytes)
Reserved
Figure E-2 Memory map of the MC68HC705B16
14
MC68HC05B6
Rev. 4.1
MC68HC705B16
Freescale
E-3
195
196
197
198
199
Table E-1 Register outline
Register name
Address bit 7
Port A data (PORTA)
$0000
Port B data (PORTB)
$0001
Port C data (PORTC)
$0002
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State on
reset
Undefined
Undefined
PC2/
ECLK
PD7
PD6
PD5
PD4
PD3
PD2
Undefined
Port D data (PORTD)
$0003
Port A data direction (DDRA)
$0004
PD1
PD0
0000 0000
Undefined
0000 0000
Port B data direction (DDRB)
$0005
Port C data direction (DDRC)
$0006
0000 0000
EPROM/EEPROM/ECLK control
$0007
E6LAT E6PGM ECLK E1ERA E1LAT E1PGM 0000 0000
A/D data (ADDATA)
$0008
A/D status/control (ADSTAT)
$0009
Pulse length modulation A (PLMA)
$000A
Pulse length modulation B (PLMB)
$000B
Miscellaneous
0000 0000
COCO ADRC ADON
0
CH3
CH2
CH1
CH0
0000 0000
0000 0000
0000 0000
$000C POR(1) INTP
INTN
INTE
SCT1
SCT0
SFA
SFB
SM
WDOG(2) ?001 000?
SCT0
SCR2
SCR1
SCR0 00uu uuuu
SCI baud rate (BAUD)
$000D
SPC1
SPC0
SCI control 1 (SCCR1)
$000E
R8
T8
SCI control 2 (SCCR2)
$000F
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SCI status (SCSR)
$0010
TDRE
TC
RDRF
IDLE
OR
NF
FE
SCI data (SCDR)
$0011
Timer control (TCR)
$0012
ICIE
OCIE
TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0
ICF1
OCF1
TOF
M
WAKE CPOL CPHA
LBCL
Undefined
SBK
0000 0000
1100 000u
0000 0000
ICF2
Undefined
Timer status (TSR)
$0013
Input capture high 1
$0014
OCF2
Input capture low 1
$0015
Undefined
Output compare high 1
$0016
Undefined
Output compare low 1
$0017
Undefined
Timer counter high
$0018
1111 1111
1111 1100
Undefined
Timer counter low
$0019
Alternate counter high
$001A
1111 1111
Alternate counter low
$001B
1111 1100
Input capture high 2
$001C
Undefined
Input capture low 2
$001D
Undefined
Output compare high 2
$001E
Undefined
Output compare low 2
$001F
Options (OPTR)(3)
$0100
Mask option register (MOR)(4)
$3DFE
Undefined
EE1P
SEC Not affected
RTIM RWAT WWAT PBPD PCPD Not affected
(1) This bit is set each time there is a power-on reset.
(2) The state of the WDOG bit after reset is dependent upon the mask option selected; 1=watchdog enabled, 0=watchdog disabled.
(3) This register is implemented in EEPROM; therefore reset has no effect on the individual bits.
14
(4) This register is implemented in EPROM; therefore reset has no effect on the individual bits.
Freescale
E-4
MC68HC705B16
MC68HC05B6
Rev. 4.1
200
201
202
203
204
E.2
External clock
When using an external clock the OSC1 and OSC2 pins should be driven in antiphase (see
Figure D-2). The tOXOV or tILCH specifications (see Section E.8) do not apply when using an
external clock input. The equivalent specification of the external clock source should be used in
lieu of tOXOV or tILCH.
E.3
EPROM
The MC68HC705B16 memory map is given in Figure E-2. The device has a total of 15168 bytes
of EPROM (including 14 bytes for User vectors) and 256 bytes of EEPROM.
The EPROM array is supplied by the VPP6 pin in both read and program modes. Typically the
user’s software would be loaded into a programming board where VPP6 is controlled by one of the
bootstrap loader routines. It would then be placed in an application where no programming occurs.
In this case the VPP6 pin should be hardwired to VDD.
Warning: A minimum VDD voltage must be applied to the VPP6 pin at all times, including
power-on. Failure to do so could result in permanent damage to the device. Unless
otherwise stated, EPROM programming is guaranteed at ambient (25°C) temperature
only.
E.3.1
EPROM read operation
The execution of a program in the EPROM address range or a load from the EPROM are both
read operations. The E6LAT bit in the EPROM/EEPROM control register should be cleared to ‘0’
which automatically resets the E6PGM bit. In this way the EPROM is read like a normal ROM.
Reading the EPROM with the E6LAT bit set will give data that does not correspond to the actual
memory content. As interrupt vectors are in EPROM, they will not be loaded when E6LAT is set.
Similarly, the bootstrap ROM routines cannot be executed when E6LAT is set. In read mode, the
VPP6 pin must be at the VDD level. When entering the STOP mode, the EPROM is automatically
set to the read mode.
Note:
E.3.2
An erased byte reads as $00.
EPROM program operation
Typically the EPROM will be programmed by the bootstrap routines resident in the on-chip ROM.
However, the user program can be used to program some EPROM locations if the proper
procedure is followed. In particular, the programming sequence must be running in RAM, as the
MC68HC05B6
Rev. 4.1
MC68HC705B16
Freescale
E-5
14
205
206
207
208
209
EPROM will not be available for code execution while the E6LAT bit is set. The VPP6 switching
must occur externally after the E6PGM bit is set, for example under control of a signal generated
on a pin by the programming routine.
Note:
When the part becomes a PROM, only the cumulative programming of bits to logic ‘1’
is possible if multiple programming is made on the same byte.
To allow simultaneous programming of up to eight bytes, these bytes must be in the same group
of addresses which share the same most significant address bits; only the three least significant
bits can change.
E.3.3
EPROM/EEPROM/ECLK control register
Address
EPROM/EEPROM/ECLK control
bit 7
$0007
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
E6LAT E6PGM ECLK E1ERA E1LAT E1PGM 0000 0000
E6LAT — EPROM programming latch enable bit
1 (set)
–
Address and up to eight data bytes can be latched into the EPROM
for further programming providing the E6PGM bit is cleared.
0 (clear) –
Data can be read from the EPROM or firmware ROM; the E6PGM bit
is reset to zero when E6LAT is ‘0’.
STOP, power-on and external reset clear the E6LAT bit.
Note:
After the tERA1 erase time or tPROG1 programming time, the E6LAT bit has to be reset
to zero in order to clear the E6PGM bit.
E6PGM — EPROM program enable bit
This bit is the EPROM program enable bit. It can be set to ‘1’ to enable programming only after
E6LAT is set and at least one byte is written to the EPROM. It is not possible to clear this bit using
software but clearing E6LAT will always clear E6PGM.
Table E-2 EPROM control bits description
E6LAT E6PGM
14
Note:
Freescale
E-6
Description
0
0
Read/execute in EPROM
1
0
Ready to write address/data to EPROM
1
1
programming in progress
The E6PGM bit can never be set while the E6LAT bit is at zero.
MC68HC705B16
MC68HC05B6
Rev. 4.1
210
211
212
ECLK
See Section 4.3.
E1ERA — EEPROM erase/programming bit
Providing the E1LAT and E1PGM bits are at logic one, this bit indicates whether the access to the
EEPROM is for erasing or programming purposes.
1 (set)
–
0 (clear) –
An erase operation will take place.
A programming operation will take place.
Once the program/erase EEPROM address has been selected, E1ERA cannot be changed.
E1LAT — EEPROM programming latch enable bit
1 (set)
–
0 (clear) –
Address and data can be latched into the EEPROM for further
program or erase operations, providing the E1PGM bit is cleared.
Data can be read from the EEPROM. The E1ERA bit and the E1PGM
bit are reset to zero when E1LAT is ‘0’.
STOP, power-on and external reset clear the E1LAT bit.
Note:
After the tERA1 erase time or tPROG1 programming time, the E1LAT bit has to be reset
to zero in order to clear the E1ERA bit and the E1PGM bit.
E1PGM — EEPROM charge pump enable/disable
1 (set)
–
Internal charge pump generator switched on.
0 (clear) –
Internal charge pump generator switched off.
When the charge pump generator is on, the resulting high voltage is applied to the EEPROM array.
This bit cannot be set before the data is selected, and once this bit has been set it can only be
cleared by clearing the E1LAT bit.
A summary of the effects of setting/clearing bits 0, 1 and 2 of the control register are given in Table E-3.
Table E-3 EEPROM control bits description
E1ERA
Note:
E1LAT E1PGM
Description
0
0
0
Read condition
0
1
0
Ready to load address/data for program/erase
0
1
1
Byte programming in progress
1
1
0
Ready for byte erase (load address)
1
1
1
Byte erase in progress
14
The E1PGM and E1ERA bits are cleared when the E1LAT bit is at zero.
MC68HC05B6
Rev. 4.1
MC68HC705B16
Freescale
E-7
E.3.4
Mask option register
Address
Mask option register (MOR)(1)
bit 7
$3DFE
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
RTIM RWAT WWAT PBPD PCPD Not affected
(1) This register is implemented in EPROM; therefore reset has no effect on the individual bits.
RTIM — Reset time
This bit can modify the time tPORL, where the RESET pin is kept low after a power-on reset.
1 (set)
–
0 (clear) –
tPORL = 16 cycles.
tPORL = 4064 cycles.
RWAT — Watchdog after reset
This bit can modify the status of the watchdog counter after reset. Usually, the watchdog system
is disabled after power-on or external reset but when this bit is set, it will be active immediately
after the following resets (except in bootstrap mode).
WWAT — Watchdog during WAIT mode
This bit can modify the status of the watchdog counter in WAIT mode. Normally, the watchdog
system is disabled in WAIT mode but when this bit is set, the watchdog will be active in WAIT
mode.
PBPD — Port B pull-down
This bit, when programmed, connects a resistive pull-down on each pin of port B. This pull-down,
RPD, is active on a given pin only while it is an input.
PCPD — Port C pull-down
This bit, when programmed, connects a resistive pull-down on each pin of port C. This pull-down,
RPD, is active on a given pin only while it is an input.
14
Freescale
E-8
MC68HC705B16
MC68HC05B6
Rev. 4.1
E.3.5
EEPROM options register (OPTR)
Address
Options (OPTR)(1)
bit 7
bit 6
bit 5
bit 4
$0100
bit 3
bit 2
State
on reset
bit 1
bit 0
EE1P
SEC Not affected
(1) This register is implemented in EEPROM; therefore reset has no effect on the individual bits.
EE1P – EEPROM protect bit
In order to achieve a higher degree of protection, the EEPROM is effectively split into two parts,
both working from the VPP1 charge pump. Part 1 of the EEPROM array (32 bytes from $0100 to
$011F) cannot be protected; part 2 (224 bytes from $0120 to $01FF) is protected by the EE1P bit
in the options register.
1 (set)
–
0 (clear) –
Part 2 of the EEPROM array is not protected; all 256 bytes of
EEPROM can be accessed for any read, erase or programming
operations.
Part 2 of the EEPROM array is protected; any attempt to erase or
program a location will be unsuccessful.
When this bit is set to 1 (erased), the protection will remain until the next power-on or external
reset. EE1P can only be written to ‘0’ when the E1LAT bit in the EEPROM control register is set.
Note:
The EEPROM1 protect function is disabled while in bootstrap mode.
SEC — Secure bit
This bit allows the EPROM and EEPROM1 to be secured from external access. When this bit is
in the erased state (set), the EPROM and EEPROM1 content is not secured and the device may
be used in non user mode. When the SEC bit is programmed to ‘zero’, the EPROM and EEPROM1
content is secured by prohibiting entry to the non user mode. To deactivate the secure bit, the
EPROM has to be erased by exposure to a high density ultraviolet light, and the device has to be
entered into the EPROM erase verification mode with PD1 set. When the SEC bit is changed, its
new value will have no effect until the next power-on or external reset.
1 (set)
–
0 (clear) –
EEPROM/EPROM not protected.
EEPROM/EPROM protected.
14
MC68HC05B6
Rev. 4.1
MC68HC705B16
Freescale
E-9
E.4
Bootstrap mode
The 432 bytes of self-check firmware on the MC68HC05B6 are replaced by 576 bytes of bootstrap
firmware. A detailed description of the modes of operation within bootstrap mode is given below.
The bootstrap program in mask ROM address locations $0200 to $024F and $3E00 to $3FEF can
be used to program the EPROM and the EEPROM, to check if the EPROM is erased or to load
and execute data in RAM.
After reset, while going to the bootstrap mode, the vector located at address $3FEE and $3FEF
(RESET) is fetched to start execution of the bootstrap program. To place the part in bootstrap
mode, the IRQ pin should be at + 9V with the TCAP1 pin ‘high’ during transition of the RESET pin
from low to high. The hold time on the IRQ and TCAP1 pins is two clock cycles after the external
RESET pin is brought high.
When the MC68HC705B16 is placed in the bootstrap mode, the bootstrap reset vector is fetched
and the bootstrap firmware starts to execute. Table E-4 shows the conditions required to enter
each level of bootstrap mode on the rising edge of RESET.
Table E-4 Mode of operation selection
IRQ pin
TCAP1 pin PD1 PD2 PD3 PD4
Mode
VSS to VDD
VSS to VDD
x
x
x
x
Single chip
+ 9 Volts
VDD
0
0
x
0
Erased EPROM verification (EEV)
+ 9 Volts
VDD
1
0
0
0
Erased EPROM verification; erase EEPROM; EPROM/EEPROM
parallel program/verify
+ 9 Volts
VDD
1
0
1
0
Erased EPROM verification; erase EEPROM;
EPROM/EEPROM/ RAM serial bootstrap load and execute
+ 9 Volts
VDD
x
x
0
1
RAM parallel bootstrap load and execute (if SEC bit = 1)
+ 9 Volts
VDD
x
x
1
1
Serial EPROM/EEPROM/RAM bootloader (if SEC = 1)
x = Don’t care
The bootstrap program first copies part of itself in RAM (except ‘RAM parallel load’), as the
program cannot be executed in ROM during verification/programming of the EPROM. It then sets
the TCMP1 output to a logic high level.
14
Freescale
E-10
MC68HC705B16
MC68HC05B6
Rev. 4.1
Reset
IRQ at 9V?
N
User mode
Y
Y
TCAP1 set?
N
SEC bit active?
N
Non-user mode
Y
Bootstrap mode
Erased EPROM verification
A
Y
PD4 set?
N
PD2 set?
N
Y
Non-user mode
EPROM
erased?
Y
N
N
Red LED on
EPROM not erased
B
Y
Green LED on
PD1 set?
Y
PD3 set?
N
Bulk erase EEPROM1
Parallel E/EEPROM bootstrap
Program EPROM;
parallel load; green LED
flashes
Red LED on
N
Programming OK?
Y
EEPROM1 erased?
Y
N
Red LED on
Bad EPROM programming
Green LED on
Red LED off
EPROM verified
14
Figure E-3 Modes of operation flow chart (1 of 2)
MC68HC05B6
Rev. 4.1
MC68HC705B16
Freescale
E-11
Red LED flashes
Y
SEC bit set?
A
N
N
PD3 set?
Parallel bootstrap RAM
Serial E/EEPROM (RAM) bootstrap
Y
N
PD4 set?
B
Y
N
Load next RAM
byte
Transmit last four
programmed locations
RAM1 full?
Receive address
Y
Execute RAM
program at $0050
Receive four data
Y
Negative
address?
N
Green LED on
Program E/EEPROM
data at address; green
LED flashes
Execute RAM
program at $008B
Figure E-4 Modes of operation flow chart (2 of 2)
14
Freescale
E-12
MC68HC705B16
MC68HC05B6
Rev. 4.1
E.4.1
Erased EPROM verification
If a non $00 byte is detected, the red LED is turned on and the routine stops (see Figure E-3 and
Figure E-4). Only when the entire EPROM content is verified as erased does the green LED switch
on. PD1 is then checked. If PD1=0, the bootstrap program stops here and no programming occurs
until such time as a high level is sensed on PD1. If PD1=1, the bootstrap program proceeds to
erase the EEPROM1 for a nominal 100 ms (4.0 MHz crystal). It is then checked for complete
erasure; if a non $FF byte is detected, the red LED is turned on, and erase is performed a second
time, and so on until total erasure is verified. At this point, both EPROM and EEPROM1 are
completely erased and the security bit is cleared. The programming operation can then be
performed. A schematic diagram of the circuit required for erased EPROM verification is shown in
Figure E-7.
E.4.2
EPROM/EEPROM parallel bootstrap
Before the parallel bootstrap routines begin, the erased EPROM verification program is executed
as described in Section E.4.1. When PD2=0, the programming time is set to 5 milliseconds with
the bootstrap program and verify for the EPROM taking approximately 15 seconds. The EPROM
is loaded in increasing address order with non EPROM segments being skipped by the loader.
Simultaneous programming is performed by reading eight bytes of data before actual
programming is performed, thus the loading time of the internal EPROM is divided by eight.
Parallel data is entered through Port A, while the 14-bit address is output on port B, PC0 to PC4
and TCMP2. If the data comes from an external EPROM, the handshake can be disabled by
connecting together PC5 and PC6. If the data is supplied by a parallel interface, handshaking will
be provided by PC5 and PC6 according to the timing diagram of Figure E-5 (see also Figure E-6).
During programming, the green LED will flash at about 3 Hz.
Upon completion of the programming operation, the contents of the EPROM and EEPROM1 are
checked against the external data source. If programming is verified the green LED stays on, while
an error will cause the red LED to be turned on. Figure E-7 is a schematic diagram of a circuit that
can be used to program the EPROM or to load and execute data in the RAM.
Note:
The entire EPROM and EEPROM1 can be loaded from the external source; if it is
desired to leave a segment undisturbed, the data for this segment should be all zeros
for EPROM data and all $FFs for EEPROM1 data.
14
MC68HC05B6
Rev. 4.1
MC68HC705B16
Freescale
E-13
Address
HDSK out
(PC5)
Data
HDSK in
(PC6)
F29
Data read
Data read
Figure E-5 Timing diagram with handshake
tCOOE
tCOOE
tCOOE
tCDDE
Address
tADE
tDHE
tADE
tDHE
tADE
tDHE
tADE
tDHE
Data
tADE max (address to data delay)
5 machine cycles
tDHA min (data hold time)
14 machine cycles
tCOOE (load cycle time)
117 machine cycles < tCOOE < 150 machine cycles
tCDDE (programming cycle time)
tCOOE + tPROG (5ms nominal for EPROM; 10ms for EEPROM1))
1 machine cycle = 1/(2f0(Xtal))
Figure E-6 Parallel EPROM loader timing diagram
14
Freescale
E-14
MC68HC705B16
MC68HC05B6
Rev. 4.1
P1
RESET
RUN
1N914
+
100µF
1kΩ
1N914
1.0µF
+
red LED
470Ω
0.01µF
470Ω
TCAP1 VRH VDD
IRQ
OSC1
RESET
OSC2
NC
TCMP1
VPP1
PLMA
PLMB
RDI
VRL
TCAP2
PD7
PD6
PD5
PD3
PD2
PD1
PD0
Boot
green LED
red LED — programming failed
green LED — programming OK
Erase check
green LED — EPROM erased
red LED — EPROM not erased
47µF
22pF
Erase check & boot
EPROM erase
check
RAM
27
EPROM
28
A13
A0
A1
A2
A3
A4
20
CE
A5
A6
27C128 A7
25
24
21
23
2
D0
D1
D2
D3
D4
D5
D6
D7
A8
A9
A10
A11
A12
GND
14
Note:
1N5819
PD4
SCLK
TDO
VPP PGM VCC
OE
26
10
9
8
7
6
5
4
3
11
12
13
15
16
17
18
19
10k Ω
TCMP2
+
4.0 MHz
22pF
MC68HC705B16
MCU
+5V
1
GND
+5V
VPP
1 kΩ
BC309C
100kΩ
1
2
3
VPP6
12 kΩ
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
4k7Ω
PC7
BC239C
1nF
+
4k7Ω
+5V
100 kΩ
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
HDSK out
PC5
PC6
VSS
PC4
PC3
PC2
PC1
PC0
Short circuit if
handshake not used
A12
A11
A10
A9
A8
HDSK in
22
This circuit is recommended for programming only at 25°C and not for use in the
end application, or at temperatures other than 25°C. If used in the end application,
VPP6 should be tied to VDD to avoid damaging the device.
14
Figure E-7 EPROM Parallel bootstrap schematic diagram
MC68HC05B6
Rev. 4.1
MC68HC705B16
Freescale
E-15
E.4.3
EEPROM/EPROM/RAM serial bootstrap
For erased EPROM verification, PD4 must be at ‘0’. In this case, erased EPROM verification
executes as described in Section E.4.1 before control is given to the serial routine.
If PD4 is at ‘1’, the program initially checks the state of the security bit. If the security bit is active
(‘0’), the program will not enter serial bootstrap and the red LED will flash. Otherwise the serial
bootstrap program will be executed according to Figure E-3 and Figure E-4.
The serial routine communicates through the SCI with an external host, typically a PC, by means
of an RS232 link at 9600 baud, 8-bit, no parity and full duplex. Refer to Figure E-8 for a schematic
diagram of a suitable circuit.
Note:
Data format is not ASCII, but 8-bit binary, so a complementary program must be run by
the host to supply the required format. Such a program is available for the IBM PC from
Freescale.
The EPROM bootstrap routines are used to customise the OTP EPROM. To increase the speed
of programming the 15 kbytes, four bytes are programmed while the data is simultaneously
transmitted back and forward in full duplex. This implies that while 4 bytes are being programmed
the next 4 bytes are received and the preceding 4 bytes are echoed. The format accepted by the
serial loader is as follows:
1) EPROM locations
[address n high] [address n low] [data(n)] [data (n+1)] [data (n+2)] [data (n+3)]
Address n must have the two least significant bits at zero so that n, n+1, n+2 and n+3
have identical most significant bits. These blocks of four bytes do not need to be
contiguous, as a new address is transmitted for each new group.
2) EEPROM1 locations
[address n high] [address n low] [data(n)] [dummy data 1] [dummy data 2] [dummy data 3]
The same four byte protocol of data exchange is used, but only the first data value is
programmed at address n. The three following dummy data values must be sent to be
in agreement with the protocol, but are not significant.
The protocol is as follows:
1) The MC68HC705B16 sends the last two bytes programmed to the host as a
prompt; this also allows the host to verify that programming has been carried
out correctly.
2) In response to the first byte prompt, the host sends the first address byte.
14
3) After receiving the first address byte, the MC68HC705B16 sends the next
byte programmed.
Freescale
E-16
MC68HC705B16
MC68HC05B6
Rev. 4.1
P1
RESET
100kΩ
RUN
10nF
1kΩ
1N914
1.0µF
+
1N914
22
8
1
2
3
GND
+5V
VPP
+
47µF
10
TCAP1 VRH VDD
19
IRQ
18 RESET
OSC1
20
OSC2
47µF
+
Red LED
470Ω
0.01µF
470Ω
21
Green LED
PLMA
4.0 MHz
22pF
22pF
PLMB
U2 MC68HC705B16
MCU (socket)
PD3
Erase check
Green LED — EPROM erased
Red LED — EPROM not erased
Serial boot
Serial boot
Flashing green LED — programming
Green LED — programming ended
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
Erase check and serial boot
EPROM erase check
9600 BD
8-bit
no parity
22µF
+
RS232
connector
8
5
7
3
2
1
2 x 3KΩ
+5V
16
2
22µF
+
6
MAX
232
13
14
1
3
4
5
12
11
+
22µF
+
22µF
14
13
12
5
4
3
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
VPP6
12 kΩ
4k7Ω
PC7
PD0
PD1
PD2
PD5
PD6
PD7
50
RDI
52
TDO
VSS
41
BC239C
1nF
+
4k7Ω
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
15
Note:
10k Ω
1 kΩ
BC309C
Erase check
&
serial boot
1N5819
PD4
PC6
PC5
PC4
PC3
PC2
PC1
PC0
43
44
45
46
47
48
49
VPP1
23
TCAP2
2
TCMP1
1
TCMP2
51
SCLK
40
NC
VRL
7
A minimum VDD voltage must be applied to the VPP6 pin at all times,
including power-on, as a lower voltage could damage the device. Unless
otherwise stated, EPROM programming is guaranteed at ambient (25°C)
temperature only
14
Figure E-8 RAM/EPROM/EEPROM serial bootstrap schematic diagram
MC68HC05B6
Rev. 4.1
MC68HC705B16
Freescale
E-17
4) The exchange of data continues until the MC68HC705B16 has sent the four
data bytes and the host has sent the 2 address data bytes and 4 data bytes.
5) If the data is different from $00 for EPROM or $FF for EEPROM, it is
programmed at the address provided, while the next address and bytes are
received and the previous data is echoed.
6) Loop to 1.
After reset, the MC68HC705B16 serial bootstrap routine will first echo two blocks of four bytes at
$00, as no data is programmed yet.
If the data received is $00 for EPROM locations or $FF for EEPROM locations, no programming
in the EPROM and EEPROM1 takes place, and the contents of the accessed location are returned
as a prompt. The entire EPROM/EEPROM memory can be read in this fashion (serial dump).
Warning: When using this function with a programmed device, the device must be placed into
RAM/EPROM/EEPROM serial bootstrap mode without EPROM erase check (PD4 = 1).
Serial RAM loading and execute can be accomplished in this mode. A RAM byte will be written if
the address sent by the host in the serial protocol points to the RAM.
RAM bytes $008B–$00E3 and $0250–$02ED are available for user test programs. A 10-byte stack
resides at the top of RAMI, allowing, for example, one interrupt and two sub-routine levels. The
RAM addresses between $0050 and $008A are used by the loader and are therefore not available
to the user during serial loading/executing.
If the SEC bit is at ‘1’, program execution is triggered by sending a negative (bit 7 set) high
address; execution starts at address XADR ($008B).
In the RAM bootloader mode, all interrupt vectors are mapped to pseudo-vectors in RAM (see
Table E-5). This allows programmers to use their own service-routine addresses. Each
pseudo-vector is allowed three bytes of space rather than the two bytes for normal vectors,
because an explicit jump (JMP) opcode is needed to cause the desired jump to the user’s service
routine address.
Table E-5 Bootstrap vector targets in RAM
Vector targets in RAM
SCI interrupt
14
Freescale
E-18
$02EE
Timer overflow
$02F1
Timer output compare
$02F4
Timer input capture
$02F7
IRQ
$02FA
SWI
$02FD
MC68HC705B16
MC68HC05B6
Rev. 4.1
E.4.4
RAM parallel bootstrap
The program first checks the state of the security bit. If the SEC bit is active, i.e. ‘0’, the program
will not enter the RAM bootstrap mode and the red LED will flash. Otherwise the RAM bootstrap
program will start loading the RAM with external data (e.g. from a 2564 or 2764 EPROM). Before
loading a new byte the state of the PD4/AN4 pin is checked. If this pin goes to level ‘0’, or if the
RAM is full, then control is given to the loaded program at address $0050. See Figure E-3 and
Figure E-4.
If the data is supplied by a parallel interface, handshaking will be provided by PC5 and PC6
according to Figure E-9. If the data comes from an external EPROM, the handshake can be
disabled by connecting together PC5 and PC6.
Figure E-10 provides a schematic diagram of a circuit that can be used to load the RAM with short
test programs. Up to 8 programs can be loaded in turn from the EPROM. Selection is
accomplished by means of the switches connected to the EPROM higher address lines (A8
through A10). If the user program sets PC0 to level ‘1’, this will disable the external EPROM, thus
rendering both port A output and port B input available. The EPROM parallel bootstrap loader
schematic can also be used (Figure E-7), provided VPP is at VDD level. The high order address
lines will be at zero. The LEDs will stay off.
tCR
Address
PC5 out
tHO
tADR
tDHR
Data
tHI max
PC6 in
PD4
tEXR max
tADR max (address to data delay; PC6=PC5)
16 machine cycles
tDHR min (data hold time)
4 machine cycles
tCR (load cycle time; PC6=PC5)
49 machine cycles
tHO (PC5 handshake out delay)
5 machine cycles
tHI max (PC6 handshake in, data hold time)
10 machine cycles
tEXR max (max delay for transition to be recognised during this cycle; PC6=PC5
30 machine cycles
1 machine cycle = 1/(2f0(Xtal))
14
Figure E-9 Parallel RAM loader timing diagram
MC68HC05B6
Rev. 4.1
MC68HC705B16
Freescale
E-19
E.4.4.1
Jump to start of RAM ($0050)
PD4 must be high during the first 49 program cycles and pulled low before the 68th cycle for
immediate jump execution at address $0050.
P1
RESET
100kΩ
RUN
100µF
1N914
+
1
GND
+5V
2
1kΩ
1N914
1.0µF
+
TCAP1
VDD
IRQ
OSC1
RESET
OSC2
0.01µF
4.0 MHz
22pF
22pF
PD4
VPP6
U2 MC68HC705B16
MCU (socket)
+5V
1
26
27
16 x 100kΩ
28
VPP NC PGM VCC
20
CE
23
A11
2
A12
U1
2764
+5V
3 x 4.7kΩ
25
24
21
A8
A9
A0
A1
A2
A3
A4
A5
A6
A7
D0
D1
D2
D3
D4
D5
D6
D7
10
9
8
7
6
5
4
3
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB6
PB7
11
12
13
15
16
17
18
19
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
A10
GND
14
OE
+5V
18 x 100 kΩ
VPP1
NC
TCAP2
TCMP2
TCMP1
PLMB
PLMA
SCLK
TDO
RDI
VRH
VRL
PD7
PD6
PD5
PD3
PD2
PD1
PD0
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
VSS
22
Figure E-10 RAM parallel bootstrap schematic diagram
14
Freescale
E-20
MC68HC705B16
MC68HC05B6
Rev. 4.1
E.5
Absolute maximum ratings
Table E-6 Absolute maximum ratings
Symbol
Value
Supply voltage(1)
Rating
VDD
– 0.5 to +7.0
V
Input voltage (Except VPP1 and VPP6)
VIN
VSS – 0.5 to VDD + 0.5
V
Input voltage
– Self-check mode (IRQ pin only)
VIN
VSS – 0.5 to 2VDD + 0.5
V
TA
TL to TH
0 to +70
–40 to +85
–40 to +105
–40 to +125
°C
TSTG
– 65 to +150
°C
ID
IS
25
45
mA
mA
Operating temperature range
– Standard (MC68HC705B16)
– Extended (MC68HC705B16C)
– Industrial (MC68HC705B16V)
– Automotive (MC68HC705B16M)
Storage temperature range
Current drain per pin (excluding VDD and VSS)(2)
– Source
– Sink
Unit
(1) All voltages are with respect to VSS.
(2) Maximum current drain per pin is for one pin at a time, limited by an external resistor.
Note:
This device contains circuitry designed to protect against damage due to high
electrostatic voltages or electric fields. However, it is recommended that normal
precautions be taken to avoid the application of any voltages higher than those given
in the maximum ratings table to this high impedance circuit. For maximum reliability all
unused inputs should be tied to either VSS or VDD.
14
MC68HC05B6
Rev. 4.1
MC68HC705B16
Freescale
E-21
E.6
DC electrical characteristics
Table E-7 DC electrical characteristics for 5V operation
(VDD = 5 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH)
Symbol
Characteristic(1)
Output voltage
ILOAD = – 10 µA
VOH
ILOAD = +10 µA
VOL
Output high voltage (ILOAD = 0.8mA)
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2
VOH
Output high voltage (ILOAD = 1.6mA)
VOH
TDO, SCLK, PLMA, PLMB
Output low voltage (ILOAD = 1.6mA)
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2,
VOL
TDO, SCLK, PLMA, PLMB
Output low voltage (ILOAD = 1.6mA)
VOL
RESET
Input high voltage
PA0–7, PB0–7, PC0–7, PD0–7, OSC1,
VIH
IRQ, RESET, TCAP1, TCAP2, RDI
Input low voltage
VIL
PA0–7, PB0–7, PC0–7, PD0–7, OSC1,
IRQ, RESET, TCAP1, TCAP2, RDI
Supply current(3)
RUN (SM = 0) (See Figure 11-1)
IDD
IDD
RUN (SM = 1) (See Figure 11-2)
IDD
WAIT (SM = 0) (See Figure 11-3)
IDD
WAIT (SM = 1) (See Figure 11-4)
STOP
IDD
0 to 70 (standard)
IDD
– 40 to 85 (extended)
IDD
– 40 to 105 (industrial)
IDD
– 40 to 125 (automotive)
High-Z leakage current
IIL
PA0–7, PB0–7, PC0–7, TDO, RESET, SCLK
Input current
Port B and port C pull-down (VIN =VIH)
IRPD
Input current (0 to 70)
IIN
IRQ, OSC1, TCAP1, TCAP2, RDI,
PD0/AN0-PD7/AN7 (channel not selected)
Input current (– 40 to 125)
IIN
IRQ, OSC1, TCAP1, TCAP2, RDI,
PD0/AN0-PD7/AN7 (channel not selected)
Capacitance
Ports (as input or output), RESET, TDO, SCLK COUT
CIN
IRQ, TCAP1, TCAP2, OSC1, RDI
CIN
PD0/AN0–PD7/AN7 (A/D off)
CIN
PD0/AN0–PD7/AN7 (A/D on)
14
Min
Typ(2)
Max
Unit
VDD – 0.1
—
—
—
—
0.1
V
VDD – 0.8
VDD – 0.4
—
VDD – 0.8
VDD – 0.4
—
—
0.1
0.4
0.4
1
0.7VDD
—
VDD
V
VSS
—
0.2VDD
V
—
—
—
—
5.0
1.0
1.5
0.9
6
1.5
2
1
mA
mA
mA
mA
—
—
—
—
2
—
—
—
10
20
60
60
µA
µA
µA
µA
—
±0.2
±1
µA
V
V
µA
80
—
±0.2
±1
µA
—
—
±5
µA
—
—
—
—
—
—
12
22
12
8
—
—
pF
pF
pF
pF
(1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching
currents inherent in CMOS designs (see Section 2).
(2) Typical values are at mid point of voltage range and at 25°C only.
(3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 4.2MHz); all inputs 0.2 V from rail; no
DC loads; maximum load on outputs 50pF (20pF on OSC2).
STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD – 0.2 V: STOP IDD measured with OSC1 = VDD.
WAIT IDD is affected linearly by the OSC2 capacitance.
Freescale
E-22
MC68HC705B16
MC68HC05B6
Rev. 4.1
Table E-8 DC electrical characteristics for 3.3V operation
(VDD = 3.3Vdc ± 10%, VSS = 0Vdc, TA = TL to TH)
Characteristic(1)
Symbol
Output voltage
ILOAD = – 10 µA
VOH
ILOAD = +10 µA
VOL
Output high voltage (ILOAD = 0.8mA)
VOH
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2
Output high voltage (ILOAD = 1.6mA)
TDO, SCLK, PLMA, PLMB
VOH
Output low voltage (ILOAD = 1.6mA)
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2,
VOL
TDO, SCLK, PLMA, PLMB
Output low voltage (ILOAD = 1.6mA)
VOL
RESET
Input high voltage
PA0–7, PB0–7, PC0–7, PD0–7, OSC1,
VIH
IRQ, RESET, TCAP1, TCAP2, RDI
Input low voltage
PA0–7, PB0–7, PC0–7, PD0–7, OSC1, IRQ,
VIL
RESET, TCAP1, TCAP2, RDI
Supply current(3)
IDD
RUN (SM = 0) (See Figure 11-1)
RUN (SM = 1) (See Figure 11-2)
IDD
WAIT (SM = 0) (See Figure 11-3)
IDD
WAIT (SM = 1) (See Figure 11-4)
IDD
STOP
0 to 70 (standard)
IDD
– 40 to 85 (extended)
IDD
– 40 to 105 (industrial)
IDD
– 40 to 125 (automotive)
IDD
High-Z leakage current
PA0–7, PB0–7, PC0–7, TDO, RESET, SCLK
IIL
Input current
Port B and port C pull-down (VIN =VIH)
IRPD
Input current (0 to 70)
IRQ, OSC1, TCAP1, TCAP2, RDI,
IIN
PD0/AN0-PD7/AN7 (channel not selected)
Input current (– 40 to 125)
IIN
IRQ, OSC1, TCAP1, TCAP2, RDI,
PD0/AN0-PD7/AN7 (channel not selected)
Capacitance
Ports (as input or output), RESET, TDO,
COUT
SCLK
CIN
IRQ, TCAP1, TCAP2, OSC1, RDI
CIN
PD0/AN0–PD7/AN7 (A/D off)
CIN
PD0/AN0–PD7/AN7 (A/D on)
Min
Typ(2)
Max
Unit
VDD – 0.1
—
—
—
—
0.1
V
VDD – 0.3
VDD – 0.1
—
VDD – 0.3
VDD – 0.1
—
—
0.1
0.4
0.2
0.6
0.7VDD
—
VDD
V
VSS
—
0.2VDD
V
—
—
—
—
2.0
0.8
1.0
0.4
3
1
1.5
0.5
mA
mA
mA
mA
—
—
—
—
1
—
—
—
10
10
40
40
µA
µA
µA
µA
—
±0.2
±1
V
V
µA
µA
80
—
±0.2
±1
µA
—
—
±5
µA
—
—
—
—
—
—
12
22
12
8
—
—
pF
pF
pF
pF
(1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching
currents inherent in CMOS designs (see Section 2).
(2) Typical values are at mid point of voltage range and at 25°C only.
14
MC68HC05B6
Rev. 4.1
MC68HC705B16
Freescale
E-23
(3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 2.0MHz); all inputs 0.2 V from rail; no
DC loads; maximum load on outputs 50pF (20pF on OSC2).
STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD – 0.2 V: STOP IDD measured with OSC1 = VDD.
WAIT IDD is affected linearly by the OSC2 capacitance.
14
Freescale
E-24
MC68HC705B16
MC68HC05B6
Rev. 4.1
E.7
A/D converter characteristics
Table E-9 A/D characteristics for 5V operation
(VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH)
Min
Max
Unit
Resolution
Characteristic
Number of bits resolved by the A/D
Parameter
8
—
Bit
Non-linearity
Max deviation from the best straight line through the A/D
transfer characteristics
(VRH = VDD and VRL = 0V)
—
± 0.5
LSB
Quantization error
Uncertainty due to converter resolution
—
± 0.5
LSB
Absolute accuracy
Difference between the actual input voltage and the
full-scale equivalent of the binary code output code for all
errors
—
±1
LSB
Conversion range
Analog input voltage range
VRL
VRH
V
VRH
Maximum analog reference voltage
VRL
VDD + 0.1
V
Minimum analog reference voltage
VSS – 0.1
VRH
V
∆VR(1)
Minimum difference between VRH and VRL
3
—
V
Conversion time
Total time to perform a single analog to digital conversion
a. External clock (OSC1, OSC2)
b. Internal RC oscillator
—
—
32
32
tCYC
µs
VRL
Monotonicity
Conversion result never decreases with an increase in
input voltage and has no missing codes
GUARANTEED
Zero input reading
Conversion result when VIN = VRL
00
—
Hex
Full scale reading
Conversion result when VIN = VRH
—
FF
Hex
Sample acquisition time Analog input acquisition sampling
a. External clock (OSC1, OSC2)
b. Internal RC oscillator(2)
—
—
12
12
tCYC
µs
Sample/hold capacitance Input capacitance on PD0/AN0–PD7/AN7
—
12
pF
Input leakage(3)
—
1
µA
Input leakage on A/D pins PD0/AN0–PD7/AN7, VRL, VRH
(1) Performance verified down to 2.5V ∆VR, but accuracy is tested and guaranteed at ∆VR = 5V±10%.
(2) Source impedances greater than 10kΩ will adversely affect internal charging time during input sampling.
(3) The external system error caused by input leakage current is approximately equal to the product of R source and input
current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2).
14
MC68HC05B6
Rev. 4.1
MC68HC705B16
Freescale
E-25
Table E-10 A/D characteristics for 3.3V operation
(VDD = 3.3 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH)
Min
Max
Unit
Resolution
Characteristic
Number of bits resolved by the A/D
Parameter
8
—
Bit
Non-linearity
Max deviation from the best straight line through the A/D
transfer characteristics
(VRH = VDD and VRL = 0V)
—
±1
LSB
Quantization error
Uncertainty due to converter resolution
—
±1
LSB
Absolute accuracy
Difference between the actual input voltage and the
full-scale equivalent of the binary code output code for all
errors
—
±2
LSB
Conversion range
Analog input voltage range
VRL
VRH
V
VRH
Maximum analog reference voltage
VRL
VDD + 0.1
V
VRL
Minimum analog reference voltage
VSS – 0.1
VRH
V
∆VR
Minimum difference between VRH and VRL
3
—
V
Conversion time
Total time to perform a single analog to digital conversion
Internal RC oscillator
—
32
µs
Monotonicity
Conversion result never decreases with an increase in
input voltage and has no missing codes
Zero input reading
Conversion result when VIN = VRL
00
—
Hex
Full scale reading
Conversion result when VIN = VRH
—
FF
Hex
Sample acquisition time Analog input acquisition sampling
Internal RC oscillator(1)
—
12
µs
Sample/hold capacitance Input capacitance on PD0/AN0–PD7/AN7
—
12
pF
Input leakage(2)
—
1
µA
Input leakage on A/D pins PD0/AN0–PD7/AN7, VRL, VRH
GUARANTEED
(1) Source impedances greater than 10kΩ will adversely affect internal charging time during input sampling.
(2) The external system error caused by input leakage current is approximately equal to the product of R source and input
current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2).
14
Freescale
E-26
MC68HC705B16
MC68HC05B6
Rev. 4.1
E.8
Control timing
Table E-11 Control timing for 5V operation
(VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH)
Characteristic
Symbol
Frequency of operation
Crystal option
fOSC
External clock option
fOSC
Internal operating frequency (fOSC/2)
Using crystal
fOP
Using external clock
fOP
Cycle time (see Figure 9-1)
tCYC
Crystal oscillator start-up time (see Figure 9-1)
tOXOV
Stop recovery start-up time (crystal oscillator)
tILCH
RC oscillator stabilization time
tADRC
A/D converter stabilization time
tADON
External RESET input pulse width
tRL
Power-on RESET output pulse width
4064 cycle
tPORL
16 cycle
tPORL
Watchdog RESET output pulse width
tDOGL
Watchdog time-out
tDOG
EEPROM byte erase time
tERA
0 to 70 (standard)
– 40 to 85 (extended)
tERA
– 40 to 105 (industrial)
tERA
– 40 to 125 (automotive)
tERA
EEPROM byte program time(1)
tPROG
0 to 70 (standard)
– 40 to 85 (extended)
tPROG
– 40 to 105 (industrial)
tPROG
– 40 to 125 (automotive)
tPROG
Timer (see Figure E-11)
Resolution(2)
tRESL
Input capture pulse width
tTH, tTL
Input capture pulse period
tTLTL
Interrupt pulse width (edge-triggered)
tILIH
Interrupt pulse period
tILIL
OSC1 pulse width(5)
tOH, tOL
Write/Erase endurance(6)(7)
—
—
Data retention(6)(7)
Min
Max
Unit
—
dc
4.2
4.2
MHz
MHz
dc
dc
480
—
1.5
2.1
2.1
—
100
100
5
500
—
MHz
MHz
ns
ms
ms
µs
µs
tCYC
4064
16
1.5
6144
—
—
—
7168
tCYC
tCYC
10
10
10
10
—
—
—
—
ms
ms
ms
ms
10
10
15
20
—
—
—
—
ms
ms
ms
ms
—
—
—
—
—
—
tCYC
ns
tCYC
ns
tCYC
ns
cycles
years
4
125
—(3)
125
—(4)
90
10000
10
tCYC
tCYC
(1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when
programming the EEPROM.
(2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting
factor in determining the timer resolution.
(3) The minimum period tTLTL should not be less than the number of cycle times it takes to
execute the capture interrupt service routine plus 24 tCYC.
(4) The minimum period tILIL should not be less than the number of cycle times it takes to
execute the interrupt service routine plus 21 tCYC.
(5) tOH and tOL should not total less than 238ns.
(6) At a temperature of 85°C
(7) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information.
MC68HC05B6
Rev. 4.1
MC68HC705B16
14
Freescale
E-27
Table E-12 Control timing for 3.3V operation
(VDD = 3.3Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH)
Symbol
Min
Max
Unit
Frequency of operation
Crystal option
External clock option
Characteristic
fOSC
fOSC
—
dc
2.0
2.0
MHz
MHz
Internal operating frequency (fOSC/2)
Using crystal
Using external clock
fOP
fOP
—
dc
1.0
1.0
MHz
MHz
Cycle time (see Figure 9-1)
tCYC
1000
—
ns
Crystal oscillator start-up time (see Figure 9-1)
tOXOV
—
100
ms
ms
Stop recovery start-up time (crystal oscillator)
tILCH
100
RC oscillator stabilization time
tADRC
5
µs
A/D converter stabilization time
tADON
500
µs
External RESET input pulse width
tRL
1.5
—
tCYC
Power-on RESET output pulse width
4064 cycle
16 cycle
tPORL
tPORL
4064
16
—
—
tCYC
tCYC
Watchdog RESET output pulse width
tDOGL
1.5
—
tCYC
Watchdog time-out
tDOG
6144
7168
tCYC
EEPROM byte erase time
0 to 70 (standard)
– 40 to 85 (extended)
– 40 to 105 (industrial)
– 40 to 125 (automotive)
30
30
30
30
—
—
—
—
ms
ms
ms
ms
EEPROM byte program time(1)
0 to 70 (standard)
– 40 to 85 (extended)
– 40 to 105 (industrial)
– 40 to 125 (automotive)
tERA
tERA
tERA
tERA
tPROG
tPROG
tPROG
tPROG
30
30
30
30
—
—
—
—
ms
ms
ms
ms
Timer (see Figure E-11)
Resolution(2)
Input capture pulse width
Input capture pulse period
tRESL
tTH, tTL
tTLTL
4
250
—(3)
—
—
—
tCYC
ns
tCYC
Interrupt pulse width (edge-triggered)
tILIH
250
—
ns
Interrupt pulse period
tILIL
—(4)
—
tCYC
tOH, tOL
200
—
OSC1 pulse width(5)
Write/Erase endurance(6)(7)
Data retention(6)(7)
ns
—
10000
cycles
—
10
years
(1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when
programming the EEPROM.
(2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting
factor in determining the timer resolution.
(3) The minimum period tTLTL should not be less than the number of cycle times it takes to
execute the capture interrupt service routine plus 24 tCYC.
(4) The minimum period tILIL should not be less than the number of cycle times it takes to execute
the interrupt service routine plus 21 tCYC.
(5) tOH and tOL should not total less than 500ns.
(6) At a temperature of 85°C
(7) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information.
14
Freescale
E-28
MC68HC705B16
MC68HC05B6
Rev. 4.1
tTLTL
tTH
tTL
External
signal
(TCAP1,
TCAP2)
Figure E-11 Timer relationship
E.9
EPROM electrical characteristics
Table E-13 DC electrical characteristics for 5V operation
(VDD = 5 Vdc ± 10%, VSS = 0 Vdc, TA = 25°C)
Characteristic(1)
EPROM
Absolute maximum voltage
Programming voltage
Programming current
Read voltage
Symbol
Min
Typ(2)
Max
Unit
VPP6 max
VPP6
IPP6
VPP6R
VDD
15
—
VDD
—
15.5
50
VDD
18
16
64
VDD
V
V
mA
V
(1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the
transient switching currents inherent in CMOS designs (see Section 2).
(2) Typical values are at mid point of voltage range and at 25°C only.
Table E-14 Control timing for 5V operation
(VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = 25°C)
Characteristic
EPROM programming time
Symbol
Min
Max
Unit
tPROG
5
20
ms
Table E-15 Control timing for 3.3V operation
(VDD = 3.3 Vdc ± 10%, VSS = 0 Vdc, TA = 25°C)
Characteristic
EPROM programming time
Symbol
Min
Max
Unit
tPROG
5
20
ms
14
MC68HC05B6
Rev. 4.1
MC68HC705B16
Freescale
E-29
14
Freescale
E-30
MC68HC705B16
MC68HC05B6
Rev. 4.1
F
MC68HC705B16N
The MC68HC705B16N is a new device identical to the MC68HC705B16 in its memory
map and functionality, except for the following:
•
Bootloader
•
Reset pulse width
•
Reset twice issue
•
Electrical characteristics
On the MC68HC705B16 there was a requirement to reset the device a second time
after power-on. On the MC68HC705B16N this reset twice action is now not required.
The interrupt service routine for the vector at address $3FF0–$3FF1 is no longer
required, as the vector will never be fetched. However, the interrupt service routine and
vector contents required for the MC68HC705B16 (see Section E, page E–1) can also
be kept on the MC68HC705B16N with no detrimental effect, although they will never
be used.
The MC68HC705B16N is a device similar to the MC68HC05B6, but with increased RAM and
15 kbytes of EPROM instead of 6 kbytes of ROM. In addition, the self-check routines available in
the MC68HC05B6 are replaced by bootstrap firmware. The MC68HC705B16N is an OTPROM
(one-time programmable ROM) version of the MC68HC05B16, meaning that once the application
program has been loaded in the EPROM it can never be erased. The entire MC68HC05B6 data
sheet applies to the MC68HC705B16N, with the exceptions outlined in this appendix.
14
MC68HC05B6
Rev. 4.1
MC68HC705B16N
Freescale
F-1
213
214
215
216
217
F.1
Features
352 bytes of RAM
•
576 bytes bootstrap ROM
•
Simultaneous programming of up to 8 bytes of EPROM
•
Optional pull-down resistors available on all port B and port C pins
•
52-pin PLCC and 64-pin QFP packages
256 bytes
EEPROM
VPP1
Charge pump
VPP6
15168 bytes
EPROM
RESET
IRQ
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
PC0
PC1
PC2/ECLK
PC3
PC4
PC5
PC6
PC7
576 bytes
bootstrap ROM
COP watchdog
OSC2
OSC1
Oscillator
352 bytes
static RAM
÷ 2 / ÷ 32
M68HC05
CPU
VDD
VSS
16-bit
timer
Port D
PD0/AN0
PD1/AN1
PD2/AN2
PD3/AN3
PD4/AN4
PD5/AN5
PD6/AN6
PD7/AN7
VRH
VRL
Port A
•
Port B
15 kbytes EPROM
Port C
•
8-bit
A/D converter
TCMP1
TCMP2
TCAP1
TCAP2
SCI
RDI
SCLK
TDO
PLM
PLMA D/A
PLMB D/A
Figure F-1 MC68HC705B16N block diagram
Note:
14
Freescale
F-2
The electrical characteristics of the MC68HC05B6 as provided in Section 11 do not
apply to the MC68HC705B16N. Data specific to the MC68HC705B16N can be found
in this appendix.
MC68HC705B16N
MC68HC05B6
Rev. 4.1
218
219
220
221
222
MC68HC705B16
Registers
$0000
I/O
(32 bytes)
$0020
Page 0 User
EPROM
(48 bytes)
$0100
$0101
$0006
E/EEPROM/ECLK control register
$0007
A/D data register
$0008
A/D status/control register
$0009
Pulse length modulation A
$000A
Pulse length modulation B
$000B
Miscellaneous register
$000C
SCI baud rate register
$000D
SCI control register 1
$000E
SCI control register 2
$000F
SCI status register
$0010
SCI data register
$0011
Timer control register
$0012
Timer status register
$0013
RAM11
(176 bytes)
Capture high register 1
$0014
Capture low register 1
$0015
User EPROM
(15104 bytes)
Compare high register 1
$0016
Compare low register 1
$0017
Counter high register
$0018
Counter low register
$0019
Alternate counter high register
$001A
Alternate counter low register
$001B
Capture high register 2
$001C
Capture low register 2
$001D
Compare high register 2
$001E
Compare low register 2
$001F
Options register
$0100
Mask option register
$3DFE
EEPROM
(256 bytes)
Protected (224 bytes)
$3DFE
$3DFF
$3E00
$0003
$0005
Unprotected (31 bytes)
Bootstrap ROM1
(80 bytes)
$0300
$0002
Port D input data register
Port C data direction register
Options register
$0250
$0001
$0004
Stack
$0200
Port B data register
Port C data register
Port A data direction register
RAM1
(176 bytes)
$0120
$0000
Port B data direction register
$0050
$00C0
Port A data register
Mask option register
Bootstrap ROM11
(496 bytes)
$3FF0–1
$3FF2–3
SCI
Timer overflow
$3FF4–5
$3FF6–7 Timer output compare 1& 2
$3FF8–9 Timer input capture 1 & 2
External IRQ
$3FFA–B
$3FFC–D
SWI
$3FFE–F Reset/power-on reset
User vectors
(14 bytes)
Reserved
Figure F-2 Memory map of the MC68HC705B16N
14
MC68HC05B6
Rev. 4.1
MC68HC705B16N
Freescale
F-3
223
224
225
226
227
Table F-1 Register outline
Register name
Address bit 7
Port A data (PORTA)
$0000
Port B data (PORTB)
$0001
Port C data (PORTC)
$0002
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State on
reset
Undefined
Undefined
PC2/
ECLK
PD7
PD6
PD5
PD4
PD3
PD2
Undefined
Port D data (PORTD)
$0003
Port A data direction (DDRA)
$0004
PD1
PD0
0000 0000
Undefined
0000 0000
Port B data direction (DDRB)
$0005
Port C data direction (DDRC)
$0006
0000 0000
EPROM/EEPROM/ECLK control
$0007
E6LAT E6PGM ECLK E1ERA E1LAT E1PGM 0000 0000
A/D data (ADDATA)
$0008
A/D status/control (ADSTAT)
$0009
Pulse length modulation A (PLMA)
$000A
Pulse length modulation B (PLMB)
$000B
Miscellaneous
0000 0000
COCO ADRC ADON
0
CH3
CH2
CH1
CH0
0000 0000
0000 0000
0000 0000
$000C POR(1) INTP
INTN
INTE
SCT1
SCT0
SFA
SFB
SM
WDOG(2) ?001 000?
SCT0
SCR2
SCR1
SCR0 00uu uuuu
SCI baud rate (BAUD)
$000D
SPC1
SPC0
SCI control 1 (SCCR1)
$000E
R8
T8
SCI control 2 (SCCR2)
$000F
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SCI status (SCSR)
$0010
TDRE
TC
RDRF
IDLE
OR
NF
FE
SCI data (SCDR)
$0011
Timer control (TCR)
$0012
ICIE
OCIE
TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0
ICF1
OCF1
TOF
M
WAKE CPOL CPHA
LBCL
Undefined
SBK
0000 0000
1100 000u
0000 0000
ICF2
Undefined
Timer status (TSR)
$0013
Input capture high 1
$0014
OCF2
Input capture low 1
$0015
Undefined
Output compare high 1
$0016
Undefined
Output compare low 1
$0017
Undefined
Timer counter high
$0018
1111 1111
1111 1100
Undefined
Timer counter low
$0019
Alternate counter high
$001A
1111 1111
Alternate counter low
$001B
1111 1100
Input capture high 2
$001C
Undefined
Input capture low 2
$001D
Undefined
Output compare high 2
$001E
Undefined
Output compare low 2
$001F
Options (OPTR)(3)
$0100
Mask option register (MOR)(4)
$3DFE
Undefined
EE1P
SEC Not affected
RTIM RWAT WWAT PBPD PCPD Not affected
(1) This bit is set each time there is a power-on reset.
(2) The state of the WDOG bit after reset is dependent upon the mask option selected; 1=watchdog enabled, 0=watchdog disabled.
(3) This register is implemented in EEPROM; therefore reset has no effect on the individual bits.
14
(4) This register is implemented in EPROM; therefore reset has no effect on the individual bits.
Freescale
F-4
MC68HC705B16N
MC68HC05B6
Rev. 4.1
228
229
230
231
232
F.2
External clock
When using an external clock the OSC1 and OSC2 pins should be driven in antiphase (see
Figure D-2). The tOXOV or tILCH specifications (see Section F.9) do not apply when using an
external clock input. The equivalent specification of the external clock source should be used in
lieu of tOXOV or tILCH.
F.3
RESET pin
When the oscillator is running in a stable condition, the MCU is reset when a logic zero is applied
to the RESET input for a minimum period of 3.0 machine cycles (tCYC). For more information see
Section 9.1.3.
F.4
EPROM
The MC68HC705B16N memory map is given in Figure F-2. The device has a total of 15168 bytes
of EPROM (including 14 bytes for User vectors) and 256 bytes of EEPROM.
The EPROM array is supplied by the VPP6 pin in both read and program modes. Typically the
user’s software would be loaded into a programming board where VPP6 is controlled by one of the
bootstrap loader routines. It would then be placed in an application where no programming occurs.
In this case the VPP6 pin should be hardwired to VDD.
Warning: A minimum VDD voltage must be applied to the VPP6 pin at all times, including
power-on. Failure to do so could result in permanent damage to the device. Unless
otherwise stated, EPROM programming is guaranteed at ambient (25°C) temperature
only.
F.4.1
EPROM read operation
The execution of a program in the EPROM address range or a load from the EPROM are both
read operations. The E6LAT bit in the EPROM/EEPROM control register should be cleared to ‘0’
which automatically resets the E6PGM bit. In this way the EPROM is read like a normal ROM.
Reading the EPROM with the E6LAT bit set will give data that does not correspond to the actual
memory content. As interrupt vectors are in EPROM, they will not be loaded when E6LAT is set.
Similarly, the bootstrap ROM routines cannot be executed when E6LAT is set. In read mode, the
VPP6 pin must be at the VDD level. When entering the STOP mode, the EPROM is automatically
set to the read mode.
Note:
14
An erased byte reads as $00.
MC68HC05B6
Rev. 4.1
MC68HC705B16N
Freescale
F-5
233
234
235
236
237
F.4.2
EPROM program operation
Typically the EPROM will be programmed by the bootstrap routines resident in the on-chip ROM.
However, the user program can be used to program some EPROM locations if the proper
procedure is followed. In particular, the programming sequence must be running in RAM, as the
EPROM will not be available for code execution while the E6LAT bit is set. The VPP6 switching
must occur externally after the E6PGM bit is set, for example under control of a signal generated
on a pin by the programming routine.
Note:
When the part becomes a PROM, only the cumulative programming of bits to logic ‘1’
is possible if multiple programming is made on the same byte.
To allow simultaneous programming of up to eight bytes, these bytes must be in the same group
of addresses which share the same most significant address bits; only the three least significant
bits can change.
F.4.3
EPROM/EEPROM/ECLK control register
Address
EPROM/EEPROM/ECLK control
bit 7
$0007
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
E6LAT E6PGM ECLK E1ERA E1LAT E1PGM 0000 0000
E6LAT — EPROM programming latch enable bit
1 (set)
–
Address and up to eight data bytes can be latched into the EPROM
for further programming providing the E6PGM bit is cleared.
0 (clear) –
Data can be read from the EPROM or firmware ROM; the E6PGM bit
is reset to zero when E6LAT is ‘0’.
STOP, power-on and external reset clear the E6LAT bit.
Note:
After the tERA1 erase time or tPROG1 programming time, the E6LAT bit has to be reset
to zero in order to clear the E6PGM bit.
E6PGM — EPROM program enable bit
This bit is the EPROM program enable bit. It can be set to ‘1’ to enable programming only after
E6LAT is set and at least one byte is written to the EPROM. It is not possible to clear this bit using
software but clearing E6LAT will always clear E6PGM.
14
Note:
The E6PGM bit can never be set while the E6LAT bit is at zero.
238
Freescale
F-6
MC68HC705B16N
MC68HC05B6
Rev. 4.1
Table F-2 EPROM control bits description
E6LAT E6PGM
Description
0
0
Read/execute in EPROM
1
0
Ready to write address/data to EPROM
1
1
programming in progress
ECLK
See Section 4.3.
E1ERA — EEPROM erase/programming bit
Providing the E1LAT and E1PGM bits are at logic one, this bit indicates whether the access to the
EEPROM is for erasing or programming purposes.
1 (set)
–
0 (clear) –
An erase operation will take place.
A programming operation will take place.
Once the program/erase EEPROM address has been selected, E1ERA cannot be changed.
E1LAT — EEPROM programming latch enable bit
1 (set)
–
0 (clear) –
Address and data can be latched into the EEPROM for further
program or erase operations, providing the E1PGM bit is cleared.
Data can be read from the EEPROM. The E1ERA bit and the E1PGM
bit are reset to zero when E1LAT is ‘0’.
STOP, power-on and external reset clear the E1LAT bit.
Note:
After the tERA1 erase time or tPROG1 programming time, the E1LAT bit has to be reset
to zero in order to clear the E1ERA bit and the E1PGM bit.
E1PGM — EEPROM charge pump enable/disable
1 (set)
–
Internal charge pump generator switched on.
0 (clear) –
Internal charge pump generator switched off.
When the charge pump generator is on, the resulting high voltage is applied to the EEPROM array.
This bit cannot be set before the data is selected, and once this bit has been set it can only be
cleared by clearing the E1LAT bit.
A summary of the effects of setting/clearing bits 0, 1 and 2 of the control register are given in Table F-3.
Note:
The E1PGM and E1ERA bits are cleared when the E1LAT bit is at zero.
14
MC68HC05B6
Rev. 4.1
MC68HC705B16N
Freescale
F-7
Table F-3 EEPROM control bits description
E1ERA
F.4.4
E1LAT E1PGM
Description
0
0
0
Read condition
0
1
0
Ready to load address/data for program/erase
0
1
1
Byte programming in progress
1
1
0
Ready for byte erase (load address)
1
1
1
Byte erase in progress
Mask option register
Address
Mask option register (MOR)(1)
bit 7
$3DFE
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
RTIM RWAT WWAT PBPD PCPD Not affected
(1) This register is implemented in EPROM; therefore reset has no effect on the individual bits.
RTIM — Reset time
This bit can modify the time tPORL, where the RESET pin is kept low after a power-on reset.
1 (set)
–
0 (clear) –
tPORL = 16 cycles.
tPORL = 4064 cycles.
RWAT — Watchdog after reset
This bit can modify the status of the watchdog counter after reset. Usually, the watchdog system
is disabled after power-on or external reset but when this bit is set, it will be active immediately
after the following resets (except in bootstrap mode).
WWAT — Watchdog during WAIT mode
This bit can modify the status of the watchdog counter in WAIT mode. Normally, the watchdog
system is disabled in WAIT mode but when this bit is set, the watchdog will be active in WAIT
mode.
PBPD — Port B pull-down
This bit, when programmed, connects a resistive pull-down on each pin of port B. This pull-down,
RPD, is active on a given pin only while it is an input.
14
Freescale
F-8
MC68HC705B16N
MC68HC05B6
Rev. 4.1
PCPD — Port C pull-down
This bit, when programmed, connects a resistive pull-down on each pin of port C. This pull-down,
RPD, is active on a given pin only while it is an input.
F.4.5
EEPROM options register (OPTR)
Address
Options (OPTR)(1)
bit 7
bit 6
bit 5
bit 4
$0100
bit 3
bit 2
State
on reset
bit 1
bit 0
EE1P
SEC Not affected
(1) This register is implemented in EEPROM; therefore reset has no effect on the individual bits.
EE1P – EEPROM protect bit
In order to achieve a higher degree of protection, the EEPROM is effectively split into two parts,
both working from the VPP1 charge pump. Part 1 of the EEPROM array (32 bytes from $0100 to
$011F) cannot be protected; part 2 (224 bytes from $0120 to $01FF) is protected by the EE1P bit
in the options register.
1 (set)
–
0 (clear) –
Part 2 of the EEPROM array is not protected; all 256 bytes of
EEPROM can be accessed for any read, erase or programming
operations.
Part 2 of the EEPROM array is protected; any attempt to erase or
program a location will be unsuccessful.
When this bit is set to 1 (erased), the protection will remain until the next power-on or external
reset. EE1P can only be written to ‘0’ when the E1LAT bit in the EEPROM control register is set.
Note:
The EEPROM1 protect function is disabled while in bootstrap mode.
SEC — Secure bit
This bit allows the EPROM and EEPROM1 to be secured from external access. When this bit is
in the erased state (set), the EPROM and EEPROM1 content is not secured and the device may
be used in non user mode. When the SEC bit is programmed to ‘zero’, the EPROM and EEPROM1
content is secured by prohibiting entry to the non user mode. To deactivate the secure bit, the
EPROM has to be erased by exposure to a high density ultraviolet light, and the device has to be
entered into the EPROM erase verification mode with PD1 set. When the SEC bit is changed, its
new value will have no effect until the next power-on or external reset.
1 (set)
–
0 (clear) –
MC68HC05B6
Rev. 4.1
EEPROM/EPROM not protected.
EEPROM/EPROM protected.
MC68HC705B16N
14
Freescale
F-9
F.5
Bootstrap mode
Oscillator divide-by-two is forced in bootstrap mode.
The 432 bytes of self-check firmware on the MC68HC05B6 are replaced by 576 bytes of bootstrap
firmware. A detailed description of the modes of operation within bootstrap mode is given below.
The bootstrap program in mask ROM address locations $0200 to $024F and $3E00 to $3FEF can
be used to program the EPROM and the EEPROM, to check if the EPROM is erased or to load
and execute data in RAM.
After reset, while going to the bootstrap mode, the vector located at address $3FEE and $3FEF
(RESET) is fetched to start execution of the bootstrap program. To place the part in bootstrap
mode, the IRQ pin should be at 2xVDD with the TCAP1 pin ‘high’ during transition of the RESET
pin from low to high. The hold time on the IRQ and TCAP1 pins is two clock cycles after the
external RESET pin is brought high.
When the MC68HC705B16N is placed in the bootstrap mode, the bootstrap reset vector will be
fetched and the bootstrap firmware will start to execute. Table F-4 shows the conditions required
to enter each level of bootstrap mode on the rising edge of RESET.
Table F-4 Mode of operation selection
IRQ pin
TCAP1 pin PD1 PD2 PD3 PD4
Mode
VSS to VDD
VSS to VDD
x
x
x
x
Single chip
2xVDD
VDD
0
0
0
0
Erased EPROM verification
2xVDD
VDD
0
0
1
0
EPROM verification;
2xVDD
VDD
1
0
0
0
EPROM verification; erase EEPROM;
EPROM/EEPROM parallel program/verify
2xVDD
VDD
1
0
1
0
Erased EPROM verification; erase EEPROM;
EPROM parallel program/verify (no E2)
2xVDD
VDD
1
0
0
1
Jump to start of RAM ($0051); SEC bit = NON ACTIVE
1
Serial RAM load/execute – similar to MC68HC05B6 but can fill RAM I
and II
2xVDD
VDD
x
0
1
x = Don’t care
The bootstrap program will first copy part of itself in RAM (except ‘RAM parallel load’), as the
program cannot be executed in ROM during verification/programming of the EPROM. It will then
set the TCMP1 output to a logic high level, unlike the MC68HC05B6 which keeps TCMP1 low. This
can be used to distinguish between the two circuits and, in particular, for selection of the VPP level
and current capability.
14
Freescale
F-10
MC68HC705B16N
MC68HC05B6
Rev. 4.1
Reset
IRQ at 2xVDD?
N
Y
TCAP1=VDD?
User mode
Y
N
SEC bit active?
N
Non-user mode
Y
PD4 set?
Y
N
Non-user mode
Y
PD2 set?
SEC bit active?
N
PD2 set?
Y
Erased EPROM
verification
PD3 set?
Y
Non-user mode
Y
Serial RAM
load/execute
N
N
Red LED on
Y
N
Y
PD1 set?
Red LED on
N
N
PD3 set?
Y
Jump to RAM
($0051)
SEC bit active?
N
N
EPROM verify
Verify EPROM
EPROM erased?
Red LED on
Erased EPROM verification
Y
Red LED on
N
EPROM
verified?
Y
Green LED on
Green LED on
Y
PD1 set?
N
Y
D
14
Figure F-3 Modes of operation flow chart (1 of 2)
MC68HC05B6
Rev. 4.1
MC68HC705B16N
Freescale
F-11
D
EEPROM byte
erase and verify
N
EEPROM erased?
Y
Parallel program
and verify
N
PD3 set?
Y
Go to $300
(EPROM only)
Go to $100
(EPROM and EEPROM)
Parallel program
Data verified?
N
Y
14
Red LED on
Green LED on
Figure F-4 Modes of operation flow chart (2 of 2)
Freescale
F-12
MC68HC705B16N
MC68HC05B6
Rev. 4.1
F.5.1
Erased EPROM verification
If a non $00 byte is detected, the red LED will be turned on and the routine will stop (see Figure F-3
and Figure F-4). Only when the whole EPROM content is verified as erased will the green LED be
turned on. PD1 is then checked. If PD1=0, the bootstrap program stops here and no programming
occurs until such time as a high level is sensed on PD1. If PD1 = 1, the bootstrap program
proceeds to erase the EEPROM1 for a nominal 2.5 seconds (4.0 MHz crystal). It is then checked
for complete erasure; if any EEPROM byte is not erased, the program will stop before erasing the
SEC byte. When both EPROM and EEPROM1 are completely erased and the security bit is
cleared the programming operation can be performed. A schematic diagram of the circuit required
for erased EPROM verification is shown in Figure F-8.
F.5.2
EPROM/EEPROM parallel bootstrap
Within this mode there are various subsections which can be utilised by correctly configuring the
port pins shown in Table F-4.
The erased EPROM verification program will be executed first as described in Section F.5.1. The
EPROM programming time is set to 10 milliseconds with the bootstrap program and verify for the
EPROM taking approximately 15 seconds. The EPROM will be loaded in increasing address order
with non EPROM segments being skipped by the loader. Simultaneous programming is performed
by reading eight bytes of data before actual programming is performed, thus dividing the loading
time of the internal EPROM by 8. If any block of 8 EPROM bytes or 1 EEPROM byte of data is in
the erased state, no programming takes place, thus speeding up the execution time.
Parallel data is entered through Port A, while the 15-bit address is output on port B, PC0 to PC4
and TCMP1 and TCMP2. If the data comes from an external EPROM, the handshake can be
disabled by connecting together PC5 and PC6. If the data is supplied by a parallel interface,
handshake will be provided by PC5 and PC6 according to the timing diagram of Figure F-6 (see
also Figure F-7).
During programming, the green LED will flash at about 3 Hz.
Upon completion of the programming operation, the EPROM and EEPROM1 content will be
checked against the external data source. If programming is verified the green LED will stay on,
while an error will cause the red LED to be turned on. Figure F-7 is a schematic diagram of a circuit
which can be used to program the EPROM or to load and execute data in the RAM.
Note:
The entire EPROM and EEPROM1 can be loaded from the external source; if it is
desired to leave a segment undisturbed, the data for this segment should be all $00s
for EPROM data and all $FFs for EEPROM1 data.
14
MC68HC05B6
Rev. 4.1
MC68HC705B16N
Freescale
F-13
Address
HDSK out
(PC5)
Data
HDSK in
(PC6)
F29
Data read
Data read
Figure F-5 Timing diagram with handshake
tCOOE
tCOOE
tCOOE
tCDDE
Address
tADE
tDHE
tADE
tDHE
tADE
tDHE
tADE
tDHE
Data
tADE max (address to data delay)
5 machine cycles
tDHA min (data hold time)
14 machine cycles
tCOOE (load cycle time)
117 machine cycles < tCOOE < 150 machine cycles
tCDDE (programming cycle time)
tCOOE + tPROG (10 ms nominal for EPROM; 10ms for EEPROM1))
1 machine cycle = 1/(2f0(Xtal))
Figure F-6 Parallel EPROM loader timing diagram
14
Freescale
F-14
MC68HC705B16N
MC68HC05B6
Rev. 4.1
P1
RESET
RUN
1N914
+
100µF
1.0µF
+
1N914
red LED
470Ω
0.01µF
470Ω
TCAP1 VRH VDD
IRQ
OSC1
RESET
OSC2
NC
TCMP1
VPP1
PLMA
PLMB
RDI
VRL
TCAP2
PD7
PD6
PD5
PD3
PD2
PD1
PD0
Boot
green LED
red LED — programming failed
green LED — programming OK
Erase check
green LED — EPROM erased
red LED — EPROM not erased
47µF
4.0 MHz
EPROM verify
22pF
Erase check
& boot
(EPROM only)
22pF
Erase verify & boot
D0
D1
D2
D3
D4
D5
D6
D7
GND
14
Note:
OE
Erase check &
boot (EPROM
& EEPROM)
EPROM
check
10
9
8
7
6
5
4
3
11
12
13
15
16
17
18
19
1N5819
EPROM
SCLK
TDO
TCMP2
10k Ω
1 kΩ
BC309C
PD4
1
27
28
VPP PGM VCC
A14
26
A13
A0
A1
A2
A3
A4
20
CE
A5
A6
27C256 A7
+
MC68HC705B16N
MCU
+5V
A8
A9
A10
A11
A12
GND
+5V
VPP
1kΩ
100kΩ
25
24
21
23
2
1
2
3
VPP6
12 kΩ
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
4k7Ω
PC7
BC239C
1nF
+
4k7Ω
+5V
100 kΩ
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
HDSK out
PC5
PC6
VSS
PC4
PC3
PC2
PC1
PC0
Short circuit if
handshake not used
A12
A11
A10
A9
A8
HDSK in
22
This circuit is recommended for programming only at 25°C and not for use in the
end application, or at temperatures other than 25°C. If used in the end application,
VPP6 should be tied to VDD to avoid damaging the device.
14
Figure F-7 EPROM parallel bootstrap schematic diagram
MC68HC05B6
Rev. 4.1
MC68HC705B16N
Freescale
F-15
F.5.3
Serial RAM loader
This mode is similar to the RAM load/execute program for the MC68HC05B6 described in
Section 2.2, with the additional features listed below. Table F-4 shows the entry conditions
required for this mode.
If the first byte is less than $B0, the bootloader behaves exactly as the MC68HC05B6, i.e. count
byte followed by data stored in $0050 to $00FF. If the count byte is larger than RAM I (176 bytes)
then the code continues to fill RAM II. In this case the count byte is ignored and the program
execution begins at $0051 once the total RAM area is filled or if no data is received for 5
milliseconds.
The user must take care when using branches or jumps as his code will be relocated in RAM I and
II. If the user intends to use the stack in his program, he should send NOP’s to fill the desired stack
area.
In the RAM bootloader mode, all interrupt vectors are mapped to pseudo-vectors in RAM (see
Table F-5). This allows programmers to use their own service-routine addresses. Each
pseudo-vector is allowed three bytes of space rather than the two bytes for normal vectors,
because an explicit jump (JMP) opcode is needed to cause the desired jump to the users
service-routine address.
Table F-5 Bootstrap vector targets in RAM
Vector targets in RAM
SCI interrupt
F.5.3.1
$0063
Timer overflow
$0060
Timer output compare
$005D
Timer input capture
$005A
IRQ
$0057
SWI
$0054
Jump to start of RAM ($0051)
The Jump to start of RAM program will be executed when the device is brought out of reset with
PD1 and PD4 at ‘1’ and PD2 and PD3 at ‘0’.
14
Freescale
F-16
MC68HC705B16N
MC68HC05B6
Rev. 4.1
P1
RESET
100kΩ
RUN
10nF
1kΩ
1N914
1.0µF
+
1N914
22
8
1
2
3
GND
+5V
VPP
+
47µF
10
TCAP1 VRH VDD
19
IRQ
18 RESET
OSC1
20
OSC2
47µF
+
Red LED
470Ω
0.01µF
470Ω
21
PLMA
4.0 MHz
22pF
22pF
PLMB
Green LED
RAM load
& execute
PD3
Jump to $51
Erase check
MC68HC705B16N
MCU (socket)
Green LED — EPROM erased
Red LED — EPROM not erased
Serial boot
PD4
1 kΩ
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
Serial RAM
load & execute
9600 BD
8-bit
no parity
22µF
+
RS232
Connector
8
5
7
3
2
1
2 x 3KΩ
+5V
16
2
22µF
+
6
MAX
232
13
14
1
3
4
5
12
11
+
22µF
+
22µF
14
13
12
5
4
3
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
VPP6
12 kΩ
4k7Ω
PC7
PD0
PD1
PD2
PD5
PD6
PD7
50
RDI
52
TDO
VSS
41
BC239C
1nF
+
4k7Ω
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
15
Note:
10k Ω
BC309C
Flashing green LED — programming
Green LED — programming ended
1N5819
Serial boot
PC6
PC5
PC4
PC3
PC2
PC1
PC0
43
44
45
46
47
48
49
VPP1
23
TCAP2
2
TCMP1
1
TCMP2
51
SCLK
40
NC
VRL
7
A minimum VDD voltage must be applied to the VPP6 pin at all times,
including power-on, as a lower voltage could damage the device. Unless
otherwise stated, EPROM programming is guaranteed at ambient (25°C)
temperature only
14
Figure F-8 RAM load and execute schematic diagram
MC68HC05B6
Rev. 4.1
MC68HC705B16N
Freescale
F-17
tCR
Address
PC5 out
tHO
tADR
tDHR
Data
tHI max
PC6 in
PD4
tEXR max
tADR max (address to data delay; PC6=PC5)
16 machine cycles
tDHR min (data hold time)
4 machine cycles
tCR (load cycle time; PC6=PC5)
49 machine cycles
tHO (PC5 handshake out delay)
5 machine cycles
tHI max (PC6 handshake in, data hold time)
10 machine cycles
tEXR max (max delay for transition to be recognised during this cycle; PC6=PC5
30 machine cycles
1 machine cycle = 1/(2f0(Xtal))
Figure F-9 Parallel RAM loader timing diagram
14
Freescale
F-18
MC68HC705B16N
MC68HC05B6
Rev. 4.1
F.6
Absolute maximum ratings
Table F-6 Absolute maximum ratings
Symbol
Value
Supply voltage(1)
Rating
VDD
– 0.5 to +7.0
V
Input voltage (Except VPP1 and VPP6)
VIN
VSS – 0.5 to VDD + 0.5
V
Input voltage
– Self-check mode (IRQ pin only)
VIN
VSS – 0.5 to 2VDD + 0.5
V
TA
TL to TH
0 to +70
–40 to +85
–40 to +105
–40 to +125
°C
TSTG
– 65 to +150
°C
ID
IS
25
45
mA
mA
Operating temperature range
– Standard (MC68HC705B16N)
– Extended (MC68HC705B16NC)
– Industrial (MC68HC705B16NV)
– Automotive (MC68HC705B16NM)
Storage temperature range
Current drain per pin (excluding VDD and VSS)(2)
– Source
– Sink
Unit
(1) All voltages are with respect to VSS.
(2) Maximum current drain per pin is for one pin at a time, limited by an external resistor.
Note:
This device contains circuitry designed to protect against damage due to high
electrostatic voltages or electric fields. However, it is recommended that normal
precautions be taken to avoid the application of any voltages higher than those given
in the maximum ratings table to this high impedance circuit. For maximum reliability all
unused inputs should be tied to either VSS or VDD.
14
MC68HC05B6
Rev. 4.1
MC68HC705B16N
Freescale
F-19
F.7
DC electrical characteristics
Table F-7 DC electrical characteristics for 5V operation
(VDD = 5 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH)
Symbol
Characteristic(1)
Output voltage
ILOAD = – 10 µA
VOH
ILOAD = +10 µA
VOL
Output high voltage (ILOAD = 0.8mA)
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2
VOH
Output high voltage (ILOAD = 1.6mA)
VOH
TDO, SCLK, PLMA, PLMB
Output low voltage (ILOAD = 1.6mA)
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2,
VOL
TDO, SCLK, PLMA, PLMB
Output low voltage (ILOAD = 1.6mA)
VOL
RESET
Input high voltage
PA0–7, PB0–7, PC0–7, PD0–7, OSC1,
VIH
IRQ, RESET, TCAP1, TCAP2, RDI
Input low voltage
VIL
PA0–7, PB0–7, PC0–7, PD0–7, OSC1,
IRQ, RESET, TCAP1, TCAP2, RDI
Supply current(3)
RUN (SM = 0) (See Figure 11-1)
IDD
IDD
RUN (SM = 1) (See Figure 11.2)
IDD
WAIT (SM = 0) (See Figure 11-3)
IDD
WAIT (SM = 1) (See Figure 11-4)
STOP
IDD
0 to 70 (standard)
IDD
– 40 to 85 (extended)
IDD
– 40 to 105 (industrial)
IDD
– 40 to 125 (automotive)
High-Z leakage current
IIL
PA0–7, PB0–7, PC0–7, TDO, RESET, SCLK
Input current
Port B and port C pull-down (VIN =VIH)
IRPD
Input current (0 to 70)
IIN
IRQ, OSC1, TCAP1, TCAP2, RDI,
PD0/AN0-PD7/AN7 (channel not selected)
Input current (– 40 to 125)
IIN
IRQ, OSC1, TCAP1, TCAP2, RDI,
PD0/AN0-PD7/AN7 (channel not selected)
Capacitance
Ports (as input or output), RESET, TDO, SCLK COUT
CIN
IRQ, TCAP1, TCAP2, OSC1, RDI
CIN
PD0/AN0–PD7/AN7 (A/D off)
CIN
PD0/AN0–PD7/AN7 (A/D on)
14
Min
Typ(2)
Max
Unit
VDD – 0.1
—
—
—
—
0.1
V
VDD – 0.8
VDD – 0.4
—
VDD – 0.8
VDD – 0.4
—
—
0.1
0.4
0.4
1
0.7VDD
—
VDD
V
VSS
—
0.2VDD
V
—
—
—
—
5.0
1.0
1.5
0.9
6
1.5
2
1
mA
mA
mA
mA
—
—
—
—
2
—
—
—
10
20
60
100
µA
µA
µA
µA
—
±0.2
±1
µA
V
V
µA
80
—
±0.2
±1
µA
—
—
±5
µA
—
—
—
—
—
—
12
22
12
8
—
—
pF
pF
pF
pF
(1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching
currents inherent in CMOS designs (see Section 2).
(2) Typical values are at mid point of voltage range and at 25°C only.
(3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 4.2MHz); all inputs 0.2 V from rail; no
DC loads; maximum load on outputs 50pF (20pF on OSC2).
STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD – 0.2 V: STOP IDD measured with OSC1 = VDD.
WAIT IDD is affected linearly by the OSC2 capacitance.
Freescale
F-20
MC68HC705B16N
MC68HC05B6
Rev. 4.1
Table F-8 DC electrical characteristics for 3.3V operation
(VDD = 3.3Vdc ± 10%, VSS = 0Vdc, TA = TL to TH)
Characteristic(1)
Symbol
Output voltage
ILOAD = – 10 µA
VOH
ILOAD = +10 µA
VOL
Output high voltage (ILOAD = 0.8mA)
VOH
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2
Output high voltage (ILOAD = 1.6mA)
TDO, SCLK, PLMA, PLMB
VOH
Output low voltage (ILOAD = 1.6mA)
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2,
VOL
TDO, SCLK, PLMA, PLMB
Output low voltage (ILOAD = 1.6mA)
VOL
RESET
Input high voltage
PA0–7, PB0–7, PC0–7, PD0–7, OSC1,
VIH
IRQ, RESET, TCAP1, TCAP2, RDI
Input low voltage
PA0–7, PB0–7, PC0–7, PD0–7, OSC1, IRQ,
VIL
RESET, TCAP1, TCAP2, RDI
Supply current(3)
IDD
RUN (SM = 0) (See Figure 11-1)
RUN (SM = 1) (See Figure 11-2)
IDD
WAIT (SM = 0) (See Figure 11-3)
IDD
WAIT (SM = 1) (See Figure 11-4)
IDD
STOP
0 to 70 (standard)
IDD
– 40 to 85 (extended)
IDD
– 40 to 105 (industrial)
IDD
– 40 to 125 (automotive)
IDD
High-Z leakage current
PA0–7, PB0–7, PC0–7, TDO, RESET, SCLK
IIL
Input current
Port B and port C pull-down (VIN =VIH)
IRPD
Input current (0 to 70)
IRQ, OSC1, TCAP1, TCAP2, RDI,
IIN
PD0/AN0-PD7/AN7 (channel not selected)
Input current (– 40 to 125)
IIN
IRQ, OSC1, TCAP1, TCAP2, RDI,
PD0/AN0-PD7/AN7 (channel not selected)
Capacitance
Ports (as input or output), RESET, TDO,
COUT
SCLK
CIN
IRQ, TCAP1, TCAP2, OSC1, RDI
CIN
PD0/AN0–PD7/AN7 (A/D off)
CIN
PD0/AN0–PD7/AN7 (A/D on)
Min
Typ(2)
Max
Unit
VDD – 0.1
—
—
—
—
0.1
V
VDD – 0.3
VDD – 0.1
—
VDD – 0.3
VDD – 0.1
—
—
0.1
0.4
0.2
0.6
0.7VDD
—
VDD
V
VSS
—
0.2VDD
V
—
—
—
—
2.0
0.8
1.0
0.4
3
1
1.5
0.5
mA
mA
mA
mA
—
—
—
—
1
—
—
—
10
10
40
60
µA
µA
µA
µA
—
±0.2
±1
V
V
µA
µA
80
—
±0.2
±1
µA
—
—
±5
µA
—
—
—
—
—
—
12
22
12
8
—
—
pF
pF
pF
pF
(1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching
currents inherent in CMOS designs (see Section 2).
(2) Typical values are at mid point of voltage range and at 25°C only.
14
MC68HC05B6
Rev. 4.1
MC68HC705B16N
Freescale
F-21
(3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 2.0MHz); all inputs 0.2 V from rail; no
DC loads; maximum load on outputs 50pF (20pF on OSC2).
STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD – 0.2 V: STOP IDD measured with OSC1 = VDD.
WAIT IDD is affected linearly by the OSC2 capacitance.
14
Freescale
F-22
MC68HC705B16N
MC68HC05B6
Rev. 4.1
F.8
A/D converter characteristics
Table F-9 A/D characteristics for 5V operation
(VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH)
Min
Max
Unit
Resolution
Characteristic
Number of bits resolved by the A/D
Parameter
8
—
Bit
Non-linearity
Max deviation from the best straight line through the A/D
transfer characteristics
(VRH = VDD and VRL = 0V)
—
± 0.5
LSB
Quantization error
Uncertainty due to converter resolution
—
± 0.5
LSB
Absolute accuracy
Difference between the actual input voltage and the
full-scale equivalent of the binary code output code for all
errors
—
±1
LSB
Conversion range
Analog input voltage range
VRL
VRH
V
VRH
Maximum analog reference voltage
VRL
VDD + 0.1
V
Minimum analog reference voltage
VSS – 0.1
VRH
V
∆VR(1)
Minimum difference between VRH and VRL
3
—
V
Conversion time
Total time to perform a single analog to digital conversion
a. External clock (OSC1, OSC2)
b. Internal RC oscillator
—
—
32
32
tCYC
µs
VRL
Monotonicity
Conversion result never decreases with an increase in
input voltage and has no missing codes
GUARANTEED
Zero input reading
Conversion result when VIN = VRL
00
—
Hex
Full scale reading
Conversion result when VIN = VRH
—
FF
Hex
Sample acquisition time Analog input acquisition sampling
a. External clock (OSC1, OSC2)
b. Internal RC oscillator(2)
—
—
12
12
tCYC
µs
Sample/hold capacitance Input capacitance on PD0/AN0–PD7/AN7
—
12
pF
Input leakage(3)
—
1
µA
Input leakage on A/D pins PD0/AN0–PD7/AN7, VRL, VRH
(1) Performance verified down to 2.5V ∆VR, but accuracy is tested and guaranteed at ∆VR = 5V±10%.
(2) Source impedances greater than 10kΩ will adversely affect internal charging time during input sampling.
(3) The external system error caused by input leakage current is approximately equal to the product of R source and input
current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2).
14
MC68HC05B6
Rev. 4.1
MC68HC705B16N
Freescale
F-23
Table F-10 A/D characteristics for 3.3V operation
(VDD = 3.3 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH)
Min
Max
Unit
Resolution
Characteristic
Number of bits resolved by the A/D
Parameter
8
—
Bit
Non-linearity
Max deviation from the best straight line through the A/D
transfer characteristics
(VRH = VDD and VRL = 0V)
—
±1
LSB
Quantization error
Uncertainty due to converter resolution
—
±1
LSB
Absolute accuracy
Difference between the actual input voltage and the
full-scale equivalent of the binary code output code for all
errors
—
±2
LSB
Conversion range
Analog input voltage range
VRL
VRH
V
VRH
Maximum analog reference voltage
VRL
VDD + 0.1
V
VRL
Minimum analog reference voltage
VSS – 0.1
VRH
V
∆VR
Minimum difference between VRH and VRL
3
—
V
Conversion time
Total time to perform a single analog to digital conversion
Internal RC oscillator
—
32
µs
Monotonicity
Conversion result never decreases with an increase in
input voltage and has no missing codes
Zero input reading
Conversion result when VIN = VRL
00
—
Hex
Full scale reading
Conversion result when VIN = VRH
—
FF
Hex
Sample acquisition time Analog input acquisition sampling
Internal RC oscillator(1)
—
12
µs
Sample/hold capacitance Input capacitance on PD0/AN0–PD7/AN7
—
12
pF
Input leakage(2)
—
1
µA
Input leakage on A/D pins PD0/AN0–PD7/AN7, VRL, VRH
GUARANTEED
(1) Source impedances greater than 10kΩ will adversely affect internal charging time during input sampling.
(2) The external system error caused by input leakage current is approximately equal to the product of R source and input
current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2).
14
Freescale
F-24
MC68HC705B16N
MC68HC05B6
Rev. 4.1
F.9
Control timing
Table F-11 Control timing for 5V operation
(VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH)
Characteristic
Symbol
Frequency of operation
Crystal option
fOSC
External clock option
fOSC
Internal operating frequency (fOSC/2)
Using crystal
fOP
Using external clock
fOP
Cycle time (see Figure 9-1)
tCYC
Crystal oscillator start-up time (see Figure 9-1)
tOXOV
Stop recovery start-up time (crystal oscillator)
tILCH
RC oscillator stabilization time
tADRC
A/D converter stabilization time
tADON
External RESET input pulse width
tRL
Power-on RESET output pulse width
4064 cycle
tPORL
16 cycle
tPORL
Watchdog RESET output pulse width
tDOGL
Watchdog time-out
tDOG
EEPROM byte erase time
tERA
0 to 70 (standard)
– 40 to 85 (extended)
tERA
– 40 to 105 (industrial)
tERA
– 40 to 125 (automotive)
tERA
EEPROM byte program time(1)
tPROG
0 to 70 (standard)
– 40 to 85 (extended)
tPROG
– 40 to 105 (industrial)
tPROG
– 40 to 125 (automotive)
tPROG
Timer (see Figure F-10)
Resolution(2)
tRESL
Input capture pulse width
tTH, tTL
Input capture pulse period
tTLTL
Interrupt pulse width (edge-triggered)
tILIH
Interrupt pulse period
tILIL
OSC1 pulse width(5)
tOH, tOL
Write/Erase endurance(6)
—
—
Data retention(6)(7)
Min
Max
Unit
—
dc
4.2
4.2
MHz
MHz
dc
dc
480
—
3.0
2.1
2.1
—
100
100
5
500
—
MHz
MHz
ns
ms
ms
µs
µs
tCYC
4064
16
1.5
6144
—
—
—
7168
tCYC
tCYC
10
10
10
10
—
—
—
—
ms
ms
ms
ms
10
10
15
20
—
—
—
—
ms
ms
ms
ms
—
—
—
—
—
—
tCYC
ns
tCYC
ns
tCYC
ns
cycles
years
4
125
—(3)
125
—(4)
90
10000
10
tCYC
tCYC
(1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when
programming the EEPROM.
(2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting
factor in determining the timer resolution.
(3) The minimum period tTLTL should not be less than the number of cycle times it takes to
execute the capture interrupt service routine plus 24 tCYC.
(4) The minimum period tILIL should not be less than the number of cycle times it takes to execute
the interrupt service routine plus 21 tCYC.
(5) tOH and tOL should not total less than 238ns.
(6) At a temperature of 85°C
(7) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information.
MC68HC05B6
Rev. 4.1
MC68HC705B16N
14
Freescale
F-25
Table F-12 Control timing for 3.3V operation
(VDD = 3.3Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH)
Symbol
Min
Max
Unit
Frequency of operation
Crystal option
External clock option
Characteristic
fOSC
fOSC
—
dc
2.0
2.0
MHz
MHz
Internal operating frequency (fOSC/2)
Using crystal
Using external clock
fOP
fOP
—
dc
1.0
1.0
MHz
MHz
Cycle time (see Figure 9-1)
tCYC
1000
—
ns
Crystal oscillator start-up time (see Figure 9-1)
tOXOV
—
100
ms
ms
Stop recovery start-up time (crystal oscillator)
tILCH
100
RC oscillator stabilization time
tADRC
5
µs
A/D converter stabilization time
tADON
500
µs
External RESET input pulse width
tRL
3.0
—
tCYC
Power-on RESET output pulse width
4064 cycle
16 cycle
tPORL
tPORL
4064
16
—
—
tCYC
tCYC
Watchdog RESET output pulse width
tDOGL
1.5
—
tCYC
Watchdog time-out
tDOG
6144
7168
tCYC
EEPROM byte erase time
0 to 70 (standard)
– 40 to 85 (extended)
– 40 to 105 (industrial)
– 40 to 125 (automotive)
30
30
30
30
—
—
—
—
ms
ms
ms
ms
EEPROM byte program time(1)
0 to 70 (standard)
– 40 to 85 (extended)
– 40 to 105 (industrial)
– 40 to 125 (automotive)
tERA
tERA
tERA
tERA
tPROG
tPROG
tPROG
tPROG
30
30
30
30
—
—
—
—
ms
ms
ms
ms
Timer (see Figure F-10)
Resolution(2)
Input capture pulse width
Input capture pulse period
tRESL
tTH, tTL
tTLTL
4
250
—(3)
—
—
—
tCYC
ns
tCYC
Interrupt pulse width (edge-triggered)
tILIH
250
—
ns
Interrupt pulse period
tILIL
—(4)
—
tCYC
tOH, tOL
200
OSC1 pulse width(5)
Write/Erase endurance(6)(7)
Data retention(6)(7)
—
ns
—
10000
cycles
—
10
years
(1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when
programming the EEPROM.
(2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting
factor in determining the timer resolution.
(3) The minimum period tTLTL should not be less than the number of cycle times it takes to
execute the capture interrupt service routine plus 24 tCYC.
(4) The minimum period tILIL should not be less than the number of cycle times it takes to execute
the interrupt service routine plus 21 tCYC.
(5) tOH and tOL should not total less than 500ns.
(6) At a temperature of 85°C
(7) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information.
14
Freescale
F-26
MC68HC705B16N
MC68HC05B6
Rev. 4.1
tTLTL
tTH
tTL
External
signal
(TCAP1,
TCAP2)
Figure F-10 Timer relationship
F.10
EPROM electrical characteristics
Table F-13 DC electrical characteristics for 5V operation
(VDD = 5 Vdc ± 10%, VSS = 0 Vdc, TA = 25°C)
Characteristic(1)
EPROM
Absolute maximum voltage
Programming voltage
Programming current
Read voltage
Symbol
Min
Typ(2)
Max
Unit
VPP6 max
VPP6
IPP6
VPP6R
VDD
15
—
VDD
—
15.5
50
VDD
18
16
64
VDD
V
V
mA
V
(1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the
transient switching currents inherent in CMOS designs (see Section 2).
(2) Typical values are at mid point of voltage range and at 25°C only.
Table F-14 Control timing for 5V operation
(VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = 25°C)
Characteristic
EPROM programming time
Symbol
Min
Max
Unit
tPROG
5
20
ms
Table F-15 Control timing for 3.3V operation
(VDD = 3.3 Vdc ± 10%, VSS = 0 Vdc, TA = 25°C)
Characteristic
EPROM programming time
Symbol
Min
Max
Unit
tPROG
5
20
ms
14
MC68HC05B6
Rev. 4.1
MC68HC705B16N
Freescale
F-27
14
Freescale
F-28
MC68HC705B16N
MC68HC05B6
Rev. 4.1
G
MC68HC05B32
The MC68HC05B32 is a device similar to the MC68HC05B6, but with increased RAM and ROM
sizes. The entire MC68HC05B6 data sheet applies to the MC68HC05B32, with the exceptions
outlined in this appendix.
G.1
Features
•
31248 bytes User ROM
•
No page zero ROM
•
528 bytes of RAM
•
52-pin PLCC and 64-pin QFP packages for -40 to +85°C operating temperature range
(extended)
•
56-pin SDIP package for 0 to 70°C operating temperature range
•
High speed version not available
Note:
G.2
Preliminary electrical specifications for the MC68HC05B32 should be taken as being
similar to those for the MC68HC705B32. When silicon is fully available, the part will be
re-characterised and new data made available.
External clock
When using an external clock the OSC1 and OSC2 pins should be driven in antiphase (see
Figure D-2). The tOXOV or tILCH specifications (see Section H.9) do not apply when using an
external clock input. The equivalent specification of the external clock source should be used in
lieu of tOXOV or tILCH.
14
MC68HC05B6
Rev. 4.1
MC68HC05B32
Freescale
G-1
239
240
241
242
VPP6
32 kbytes
ROM
RESET
IRQ
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
PC0
PC1
PC2/ECLK
PC3
PC4
PC5
PC6
PC7
638 bytes
self-check ROM
COP watchdog
OSC2
OSC1
Oscillator
÷ 2 / ÷32
528 bytes
static RAM
M68HC05
CPU
VDD
VSS
16-bit
timer
Port D
PD0/AN0
PD1/AN1
PD2/AN2
PD3/AN3
PD4/AN4
PD5/AN5
PD6/AN6
PD7/AN7
VRH
VRL
Port A
Charge pump
Port B
VPP1
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
Port C
256 bytes
EEPROM
8-bit
A/D converter
TCMP1
TCMP2
TCAP1
TCAP2
SCI
RDI
SCLK
TDO
PLM
PLMA D/A
PLMB D/A
Figure G-1 MC68HC05B32 block diagram
14
Freescale
G-2
MC68HC05B32
MC68HC05B6
Rev. 4.1
MC68HC05B32
Registers
$0000
I/O
(32 bytes)
$0020
$0100
$0101
$0006
EEPROM/ECLK control register
$0007
A/D data register
$0008
A/D status/control register
$0009
Pulse length modulation A
$000A
Pulse length modulation B
$000B
Miscellaneous register
$000C
SCI baud rate register
$000D
SCI control register 1
$000E
SCI control register 2
$000F
SCI status register
$0010
SCI data register
$0011
Bootloader ROMI
(80 bytes)
Timer control register
$0012
Timer status register
$0013
RAMII
(352 bytes)
Capture high register 1
$0014
Capture low register 1
$0015
Bootloader ROMII
(80 bytes)
Compare high register 1
$0016
Compare low register 1
$0017
Counter high register
$0018
Counter low register
$0019
Alternate counter high register
$001A
Alternate counter low register
$001B
Capture high register 2
$001C
Capture low register 2
$001D
Compare high register 2
$001E
Compare low register 2
$001F
Options register
$0100
EEPROM
(256 bytes)
Protected (224 bytes)
$0400
$7E00
User ROM
(31232 bytes)
Bootloader ROMIII
(478 bytes)
$7FDE
$7FE0
$0003
$0005
Unprotected (31 bytes)
$03B0
$0002
Port D input data register
Port C data direction register
Options register
$0250
$0001
$0004
Stack
$0200
Port B data register
Port C data register
Port A data direction register
RAMI
(176 bytes)
$0120
$0000
Port B data direction register
$0050
$00C0
Port A data register
Bootloader ROM vectors
(16 bytes)
$7FF0
$7FF2–3
SCI
Timer overflow
$7FF4–5
$7FF6–7 Timer output compare 1& 2
$7FF8–9 Timer input capture 1 & 2
External IRQ
$7FFA–B
$7FFC–D
SWI
$7FFE–F Reset/power-on reset
User vectors
(14 bytes)
Reserved
Figure G-2 Memory map of the MC68HC05B32
14
MC68HC05B6
Rev. 4.1
MC68HC05B32
Freescale
G-3
Table G-1 Register outline
Register name
Address bit 7
Port A data (PORTA)
$0000
Port B data (PORTB)
$0001
Port C data (PORTC)
$0002
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
State on
reset
Undefined
Undefined
PC2/
ECLK
Port D data (PORTD)
$0003
Port A data direction (DDRA)
$0004
0000 0000
0000 0000
Port B data direction (DDRB)
$0005
Port C data direction (DDRC)
$0006
EEPROM/ECLK control
$0007
A/D data (ADDATA)
$0008
A/D status/control (ADSTAT)
$0009
Pulse length modulation A (PLMA)
$000A
Pulse length modulation B (PLMB)
$000B
Miscellaneous
PD7
PD6
PD5
PD4
PD3
PD2
Undefined
PD1
PD0
Undefined
0000 0000
0
0
0
0
ECLK E1ERA E1LAT E1PGM 0000 0000
0
CH3
0000 0000
COCO ADRC ADON
CH2
CH1
CH0
0000 0000
0000 0000
0000 0000
$000C POR(1) INTP
INTN
INTE
SCT1
SCT0
SFA
SFB
SM
WDOG(2) ?001 000?
SCT0
SCR2
SCR1
SCR0 00uu uuuu
SCI baud rate (BAUD)
$000D
SPC1
SPC0
SCI control 1 (SCCR1)
$000E
R8
T8
SCI control 2 (SCCR2)
$000F
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SCI status (SCSR)
$0010
TDRE
TC
RDRF
IDLE
OR
NF
FE
SCI data (SCDR)
$0011
Timer control (TCR)
$0012
ICIE
OCIE
TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0
ICF1
OCF1
TOF
M
WAKE CPOL CPHA
LBCL
Undefined
SBK
0000 0000
1100 000u
0000 0000
ICF2
Undefined
Timer status (TSR)
$0013
Input capture high 1
$0014
OCF2
Input capture low 1
$0015
Undefined
Output compare high 1
$0016
Undefined
Output compare low 1
$0017
Undefined
Timer counter high
$0018
1111 1111
1111 1100
Undefined
Timer counter low
$0019
Alternate counter high
$001A
1111 1111
Alternate counter low
$001B
1111 1100
Input capture high 2
$001C
Undefined
Input capture low 2
$001D
Undefined
Output compare high 2
$001E
Undefined
Output compare low 2
$001F
Options (OPTR)(3)
$0100
Mask option register (MOR)(4)
$7FDE
Undefined
EE1P
SEC Not affected
RTIM RWAT WWAT PBPD PCPD Not affected
(1) This bit is set each time there is a power-on reset.
(2) The state of the WDOG bit after reset is dependent upon the mask option selected; 1 = watchdog enabled, 0 = watchdog disabled.
(3) This register is implemented in EEPROM; therefore reset has no effect on the individual bits.
(4) This register is implemented in ROM; therefore reset has no effect on the individual bits.
14
Freescale
G-4
MC68HC05B32
MC68HC05B6
Rev. 4.1
y
r
H ina
m
i
l
e
MC68HC705B32
Maskset errata
r
P
This errata section outlines the differences between two previously available masksets
(D59J and D40J) and all other masksets. Unless otherwise stated, the main body of
Appendix G refers to all these other masksets with any differences being noted in this
errata section.
y
r
a
in
•
For the D59J and D40J masksets, the MCU only requires that a logic zero is
applied to the RESET input for 1.5 tCYC.
•
For D59J, 16 cycle POR delay option (tPORL) is not available
•
For the D59J maskset, oscillator divide ratio DIV10 is forced in Bootstrap mode.
On all other revisions DIV2 is forced.
For the D59J:
P
m
i
l
re
The STOP Idd is greater than the expected value of 120µA at 5 volts Vdd at a
temperature of 20°C with the CAN module enabled and in SLEEP mode. Typically the
STOP Idd is in the region of 2.0 milliamps at 20°C.
The fault lies with the design of the EPROM array. When the STOP instruction is
executed, the next opcode in memory is present on the data bus. A fault in the EPROM
write data latch circuitry causes a latch to be driven to logic 0 on both sides when the
data bus for that bit is logic 1. This results in increasing STOP Idd of 450µA per data
bus bit set to a logic 1. If all data bus bits are set to logic 1 (i.e. next opcode is $FF,
STX 0,X) the STOP Idd shall be in the region of 3.6mA.
y
r
a
in
The minimum STOP Idd is achieved by ensuring the opcode immediately following the
STOP instruction is data $00. This corresponds to BRSET 0,ADDRESS,LABEL. If the
label points to the next sequential instruction in memory then this has the effect of a 5
cycle NOP but note that the carry bit in the condition code register may be altered by
the BRSET instruction.
P
MC68HC05B6
Rev. 4.1
m
i
l
re
MC68HC705B32
14
Freescale
H-1
243
244
245
246
247
y
r
a
in
Example
STOP
m
i
l
e
r
P
BRSET 0,$00,NEXT
NEXT any CPU instruction
The address compared may be any address in the page zero memory and the only
restriction is that it should not be a register with flags cleared by reading the register.
The example shows the address compared to be port A data register and this should
not cause any problems in any applications.
High STOP Idd will be variable dependant upon the opcode following the STOP
instruction. The more bits set in the following opcode, the higher the STOP Idd. The
work around described above may be used on any 68HC05B32 or corrected version of
the 68HC705B32 without problem. It simply adds a 5 cycle delay to the recovery from
STOP and 3 bytes of additional code per STOP instruction but may alter the state of the
carry bit in the CCR.
Also for the D59J:
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The EEPROM programming circuit only fully supports 16-byte simultaneous
programming mode and does not support single byte programming correctly.
The fault lies with the design of the EPROM array. A fault in the EPROM write data latch
circuitry causes a latch to be driven to logic 0 on both sides when the data bus for that
bit is logic 1. When the ELAT signal is removed, there is a race condition with the EPBS
signal which results in the data bus value being copied to all the EPROM latches.
Since 16-byte simultaneous programming functions correctly, it is a relatively simple
matter to emulate single byte programming by first initialising all 16 data latches to $00
and then writing the data to be written to the appropriate address.
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This problem does not affect user application software in normally circumstances since
it only applies to programming the EPROM array. The serial programming software
should always simulate 16-byte programming. The Freescale software for
programming the 705B32 from an IBM compatible PC functions in 16 byte
programming mode. This program therefore correctly programs the EPROM.
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In normal circumstances this errata does not affect the user application software. This
only affects software that programs the EPROM array. The parallel programming
bootloader software within the 705B32 ROM performs 16-byte programming and so
functions correctly.
14
Freescale
H-2
MC68HC705B32
MC68HC05B6
Rev. 4.1
248
249
250
251
252
The MC68HC705B32 is an EPROM version of the MC68HC05B32, with the ROM replaced by a
similar amount of EPROM. The entire MC68HC05B6 data sheet applies to the MC68HC705B32,
with the exceptions outlined in this appendix.
H.1
Features
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•
31246 bytes user EPROM
•
No page zero EPROM at $20–$4F
•
528 bytes of RAM
•
638 bytes bootstrap ROM instead of 432 bytes of self-check ROM
•
Simultaneous programming of EPROM with up to 16 bytes of different data
•
-40 to +85°C operating temperature range (extended)
•
52-pin PLCC, 56-pin SDIP and 64-pin QFP packages
•
High speed version not available
Note:
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The electrical characteristics from the MC68HC05B6 data sheet should not be used for
the MC68HC705B32. Data specific to this device can be found in Section H.7 and
Section H.9.
P
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MC68HC05B6
Rev. 4.1
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MC68HC705B32
14
Freescale
H-3
253
254
255
256
257
VPP6
32 kbytes
EPROM
RESET
IRQ
OSC2
OSC1
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
PC0
PC1
PC2/ECLK
PC3
PC4
PC5
PC6
PC7
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638 bytes
bootstrap ROM
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COP watchdog
Oscillator
÷ 2 / ÷32
528 bytes
static RAM
M68HC05
CPU
VDD
VSS
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16-bit
timer
Port D
PD0/AN0
PD1/AN1
PD2/AN2
PD3/AN3
PD4/AN4
PD5/AN5
PD6/AN6
PD7/AN7
VRH
VRL
Port A
Charge pump
Port B
VPP1
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
Port C
256 bytes
EEPROM
8-bit
A/D converter
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TCMP1
TCMP2
TCAP1
TCAP2
SCI
RDI
SCLK
TDO
PLM
PLMA D/A
PLMB D/A
Figure H-1 MC68HC705B32 block diagram
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14
Freescale
H-4
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MC68HC705B32
MC68HC05B6
Rev. 4.1
258
259
260
261
262
MC68HC705B32
Registers
$0000
I/O
(32 bytes)
$0020
$0050
$00C0
$0100
$0101
RAM1
(176 bytes)
Stack
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Unprotected (31 bytes)
EEPROM
(256 bytes)
Protected (224 bytes)
$0200
Bootstrap ROMI
(80 bytes)
$0250
RAM11
(352 bytes)
$03B0
Bootstrap ROMII
(80 bytes)
$0400
$7FDE
$7FDF
$7FE0
$7FF0–1
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User EPROM
(31232 bytes)
Bootstrap ROMIII
(478 bytes)
Mask option register
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User vectors
(14 bytes)
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Port B data register
$0001
Port C data register
$0002
Port D input data register
$0003
Port A data direction register
$0004
Port B data direction register
$0005
Port C data direction register
$0006
A/D status/control register
$0009
Pulse length modulation A
$000A
Pulse length modulation B
$000B
Miscellaneous register
$000C
SCI baud rate register
$000D
SCI control register 1
$000E
SCI control register 2
$000F
SCI status register
$0010
SCI data register
$0011
Timer control register
$0012
Timer status register
$0013
Capture high register 1
$0014
Capture low register 1
$0015
Compare high register 1
$0016
Compare low register 1
$0017
Counter high register
$0018
Counter low register
$0019
Alternate counter high register
$001A
Alternate counter low register
$001B
Capture high register 2
$001C
Capture low register 2
$001D
Compare high register 2
$001E
Compare low register 2
$001F
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Bootstrap ROM vectors
(16 bytes)
$7FF2–3
SCI
Timer overflow
$7FF4–5
$7FF6–7 Timer output compare 1& 2
$7FF8–9 Timer input capture 1 & 2
External IRQ
$7FFA–B
$7FFC–D
SWI
$7FFE–F Reset/power-on reset
$0000
E/EEPROM/ECLK control register $0007
$0008
A/D data register
Options register
$0120
$7E00
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Port A data register
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Options register
$0100
Mask option register
$7FDE
Reserved
14
Figure H-2 Memory map of the MC68HC705B32
MC68HC05B6
Rev. 4.1
MC68HC705B32
Freescale
H-5
263
264
265
266
267
Table H-1 Register outline
Register name
Address bit 7
Port A data (PORTA)
$0000
Port B data (PORTB)
$0001
Port C data (PORTC)
$0002
Port D data (PORTD)
bit 5
$0004
Port B data direction (DDRB)
$0005
Port C data direction (DDRC)
$0006
EPROM/EEPROM/ECLK control
$0007
PD7
PD6
0
bit 4
bit 3
bit 2
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bit 1
PD5
PD4
PD3
PD2
$0009
Pulse length modulation A (PLMA)
$000A
Pulse length modulation B (PLMB)
$000B
Miscellaneous
Undefined
Undefined
PD1
0000 0000
E6LAT E6PGM ECLK E1ERA E1LAT E1PGM u000 0000
0000 0000
COCO ADRC ADON
0
CH3
CH2
CH1
INTN
INTE
SCT1
SCT0
SFA
SFB
SM
WDOG(2) ?001 000?
SCT0
SCR2
SCR1
SCR0 00uu uuuu
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SPC1
SPC0
R8
T8
SCI control 2 (SCCR2)
$000F
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SCI status (SCSR)
$0010
TDRE
TC
RDRF
IDLE
OR
NF
FE
SCI data (SCDR)
$0011
Output compare low 1
Timer counter high
Timer counter low
0000 0000
0000 0000
$000C POR(1) INTP
$000E
Output compare high 1
CH0
0000 0000
$000D
Input capture low 1
Undefined
0000 0000
SCI baud rate (BAUD)
Timer status (TSR)
PD0
0000 0000
SCI control 1 (SCCR1)
Input capture high 1
State on
reset
Undefined
$0008
A/D status/control (ADSTAT)
Timer control (TCR)
bit 0
PC2/
ECLK
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$0003
Port A data direction (DDRA)
A/D data (ADDATA)
bit 6
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WAKE CPOL CPHA
LBCL
Undefined
SBK
0000 0000
1100 000u
0000 0000
$0012
ICIE
OCIE
TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0
$0013
ICF1
OCF1
TOF
ICF2
OCF2
$0014
Undefined
Undefined
$0015
Undefined
$0016
Undefined
$0017
Undefined
$0018
1111 1111
$0019
1111 1100
Alternate counter high
$001A
1111 1111
Alternate counter low
$001B
1111 1100
Input capture high 2
$001C
Input capture low 2
$001D
Output compare high 2
$001E
Output compare low 2
$001F
Options (OPTR)(3)
$0100
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Mask option register (MOR)(4)
$7FDE
(1) This bit is set each time there is a power-on reset.
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EE1P
Undefined
Undefined
Undefined
Undefined
SEC Not affected
RTIM RWAT WWAT PBPD PCPD Not affected
(2) The state of the WDOG bit after reset is dependent upon the mask option selected; 1=watchdog enabled, 0=watchdog disabled.
(3) This register is implemented in EEPROM; therefore reset has no effect on the individual bits.
14
(4) This register is implemented in EPROM; therefore reset has no effect on the individual bits.
Freescale
H-6
MC68HC705B32
MC68HC05B6
Rev. 4.1
268
269
270
H.2
External clock
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When using an external clock the OSC1 and OSC2 pins should be driven in antiphase (see
Figure D-2). The tOXOV or tILCH specifications (see Section H.9) do not apply when using an
external clock input. The equivalent specification of the external clock source should be used in
lieu of tOXOV or tILCH.
H.3
RESET pin
P
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When the oscillator is running in a stable condition, the MCU is reset when a logic zero is applied
to the RESET input for a minimum period of 3.0 machine cycles (tCYC). This differs from the 05B6,
05B4, 705B5, 05B8, 05B16, 705B16 and the 05B32, which require 1.5 tCYC. For more information
see Section 9.1.3.
H.4
EPROM
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The MC68HC705B32 memory map is given in Figure H-2. The device has a total of 31246 bytes
of EPROM. 14 bytes are used for the reset and interrupt vectors from address $7FF2 to $7FFF.
The main EPROM block of 31232 bytes is located from $0400 to $7DFF. One byte of EPROM is
used as an options register and is located at address $7FDE.
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The EPROM array is supplied by the VPP6 pin in both read and program modes. Typically the
user’s software will be loaded into a programming board where VPP6 is controlled by one of the
bootstrap loader routines. It will then be placed in an application where no programming occurs.
In this case the VPP6 pin should be hardwired to VDD.
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Warning: A minimum VDD voltage must be applied to the VPP6 pin at all times, including
power-on. Failure to do so could result in permanent damage to the device. Unless
otherwise stated, EPROM programming is guaranteed at ambient (25°C) temperature
only.
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MC68HC05B6
Rev. 4.1
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MC68HC705B32
14
Freescale
H-7
H.4.1
EPROM read operation
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The execution of a program in the EPROM address range or a load from the EPROM are both
read operations. The E6LAT bit in the EPROM/EEPROM control register should be cleared to ‘0’
which automatically resets the E6PGM bit. In this way the EPROM is read like a normal ROM.
Reading the EPROM with the E6LAT bit set will give data that does not correspond to the actual
memory content. As interrupt vectors are in EPROM, they will not be loaded when E6LAT is set.
Similarly, the bootstrap ROM routines cannot be executed when E6LAT is set. In read mode, the
VPP6 pin must be at the VDD level. When entering the STOP mode, the EPROM is automatically
set to the read mode.
Note:
H.4.2
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An erased byte reads as $00.
EPROM program operation
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Typically, the EPROM will be programmed by the bootstrap routines resident in the on-chip ROM.
However, the user program can be used to program some EPROM locations if the proper
procedure is followed. In particular, the programming sequence must be running in RAM, as the
EPROM will not be available for code execution while the E6LAT bit is set. The VPP6 switching
must occur externally after EPGM is set, for example under control of a signal generated on a pin
by the programming routine.
Note:
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Unless the part has a window for reprogramming, only the cumulative programming of
bits to logic ‘1’ is possible if multiple programming is made on the same byte.
To allow simultaneous programming of up to sixteen bytes, these bytes must be in the same group
of addresses which share the same most significant address bits; only the four LSBs can change.
H.4.3
EPROM/EEPROM control register
Address
EPROM/EEPROM/ECLK control
$0007
bit 7
bit 6
0
Freescale
H-8
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
E6LAT E6PGM ECLK E1ERA E1LAT E1PGM u000 0000
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bit 5
MC68HC705B32
MC68HC05B6
Rev. 4.1
E6LAT — EPROM programming latch enable bit
1 (set)
–
Address and up to sixteen data bytes can be latched into the EPROM
for further programming providing the E6PGM bit is cleared. When
programming the EPROM, all other 15 addresses must be latched
with the erased state ($00) or corruption may occur.
0 (clear) –
Data can be read from the EPROM or firmware ROM; the E6PGM bit
is reset to zero when E6LAT is ‘0’.
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STOP, power-on and external reset clear the E6LAT bit.
Note:
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After the tERA1 erase time or tPROG1 programming time, the E6LAT bit has to be reset
to zero in order to clear the E6PGM bit.
E6PGM — EPROM program enable bit
This bit is the EPROM program enable bit. It can be set to ‘1’ to enable programming only after
E6LAT is set and at least one byte is written to the EPROM. It is not possible to clear this bit using
software but clearing E6LAT will always clear E6PGM.
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Table H-2 EPROM control bits description
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E6LAT E6PGM
Note:
0
0
1
0
1
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Description
Read/execute in EPROM
Ready to write address/data to EPROM
programming in progress
All combinations are not shown in the above table, since the E6PGM bit is cleared when
the E6LAT bit is at zero, and will result in a read condition.
ECLK
See Section 4.3.
E1ERA — EEPROM erase/programming bit
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Providing the E1LAT and E1PGM bits are at logic one, this bit indicates whether the access to the
EEPROM is for erasing or programming purposes.
1 (set)
–
0 (clear) –
An erase operation will take place.
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A programming operation will take place.
Once the program/erase EEPROM address has been selected, E1ERA cannot be changed.
MC68HC05B6
Rev. 4.1
MC68HC705B32
Freescale
H-9
14
E1LAT — EEPROM programming latch enable bit
1 (set)
–
0 (clear) –
Address and data can be latched into the EEPROM for further
program or erase operations, providing the E1PGM bit is cleared.
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Data can be read from the EEPROM. The E1ERA bit and the E1PGM
bit are reset to zero when E1LAT is ‘0’.
STOP, power-on and external reset clear the E1LAT bit.
Note:
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After the tERA1 erase time or tPROG1 programming time, the E1LAT bit has to be reset
to zero in order to clear the E1ERA bit and the E1PGM bit.
E1PGM — EEPROM charge pump enable/disable
1 (set)
–
Internal charge pump generator switched on.
0 (clear) –
Internal charge pump generator switched off.
When the charge pump generator is on, the resulting high voltage is applied to the EEPROM array.
This bit cannot be set before the data is selected, and once this bit has been set it can only be
cleared by clearing the E1LAT bit.
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A summary of the effects of setting/clearing bits 0, 1 and 2 of the control register are given in Table H-3.
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Table H-3 EEPROM control bits description
E1ERA
0
0
0
1
1
Note:
E1LAT E1PGM
0
Read condition
1
0
Ready to load address/data for program/erase
1
1
Byte programming in progress
1
0
Ready for byte erase (load address)
1
1
Byte erase in progress
The E1PGM and E1ERA bits are cleared when the E1LAT bit is at zero.
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Freescale
H-10
Description
0
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MC68HC705B32
MC68HC05B6
Rev. 4.1
H.4.4
Mask option register
Address
Mask option register (MOR)(1)
bit 7
bit 6
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bit 5
$7FDE
bit 4
bit 3
bit 2
bit 1
bit 0
State
on reset
RTIM RWAT WWAT PBPD PCPD Not affected
(1) Because this register is implemented in EPROM, reset has no effect on the individual bits.
RTIM
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This bit can modify the time tPORL, where the RESET pin is kept low after a power-on reset.
1 (set)
–
0 (clear) –
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tPORL = 16 cycles.
tPORL = 4064 cycles.
RWAT
This bit can modify the status of the watchdog counter after reset. Usually, the watchdog system
is disabled after power-on or external reset but when this bit is set, it will be active immediately
after the following resets (except in bootstrap mode).
WWAT
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This bit can modify the status of the watchdog counter in WAIT mode. Normally, the watchdog
system is disabled in WAIT mode but when this bit is set, the watchdog will be active in WAIT
mode.
PBPD
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This bit, when programmed, connects a resistive pull-down on all 8 pins of port B. This pull-down,
RPD, is active on a given pin only while it is an input.
PCPD
This bit, when programmed, connects a resistive pull-down on all 8 pins of port C. This pull-down,
RPD, is active on a given pin only while it is an input.
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MC68HC05B6
Rev. 4.1
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MC68HC705B32
14
Freescale
H-11
H.4.5
Options register (OPTR)
Address
Options (OPTR)(1)
bit 7
bit 6
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bit 5
$0100
bit 4
bit 3
bit 2
State
on reset
bit 1
bit 0
EE1P
SEC Not affected
(1) Because this register is implemented in EEPROM, reset has no effect on the individual bits.
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EE1P – EEPROM protect bit
In order to achieve a higher degree of protection, the EEPROM is effectively split into two parts,
both working from the VPP1 charge pump. Part 1 of the EEPROM array (32 bytes from $0100 to
$011F) cannot be protected; part 2 (224 bytes from $0120 to $01FF) is protected by the EE1P bit
of the options register.
1 (set)
–
0 (clear) –
Part 2 of the EEPROM array is not protected; all 256 bytes of
EEPROM can be accessed for any read, erase or programming
operations.
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Part 2 of the EEPROM array is protected; any attempt to erase or
program a location will be unsuccessful.
When this bit is set to 1 (erased), the protection will remain until the next power-on or external
reset. EE1P can only be written to ‘0’ when the E1LAT bit in the EEPROM control register is set.
Note:
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The EEPROM1 protect function is disabled while in bootstrap mode.
SEC — Secure bit
This bit allows the EPROM and EEPROM1 to be secured from external access. When this bit is
in the erased state (set), the EPROM and EEPROM1 content is not secured and the device may
be used in non user mode. When the SEC bit is programmed to ‘zero’, the EPROM and EEPROM1
content is secured by prohibiting entry to the non user mode. To deactivate the secure bit, the
EPROM has to be erased by exposure to a high density ultraviolet light, and the device has to be
entered into the EPROM erase verification mode with PD1 set. When the SEC bit is changed, its
new value will have no effect until the next power-on or external reset.
1 (set)
–
0 (clear) –
14
Freescale
H-12
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EEPROM/EPROM not protected.
EEPROM/EPROM protected.
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MC68HC705B32
MC68HC05B6
Rev. 4.1
H.5
Bootstrap mode
Oscillator divide-by-two is forced in bootstrap mode.
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The 432 bytes of self-check firmware on the MC68HC05B6 are replaced by 654 bytes of bootstrap
firmware. A detailed description of the modes of operation within bootstrap mode is given below.
The bootstrap program in mask ROM address locations $0200 to $024F, $03B0 to $3FFF, $7E00
to $7FDD and $7FE0 to $7FEF can be used to program the EPROM and the EEPROM, to check
if the EPROM is erased or to load and execute data in RAM.
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After reset, while going to the bootstrap mode, the vector located at address $7FEE and $7FEF
(RESET) is fetched to start execution of the bootstrap program. To place the part in bootstrap
mode, the IRQ pin should be at 2xVDD with the TCAP1 pin ‘high’ during transition of the RESET
pin from low to high. The hold time on the IRQ and TCAP1 pins is two clock cycles after the
external RESET pin is brought high.
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When the MC68HC705B32 is placed in the bootstrap mode, the bootstrap reset vector will be
fetched and the bootstrap firmware will start to execute. Table H-4 shows the conditions required
to enter each level of bootstrap mode on the rising edge of RESET.
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Table H-4 Mode of operation selection
IRQ pin
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TCAP1 pin PD1 PD2 PD3 PD4
Mode
VSS to VDD
VSS to VDD
x
x
x
x
Single chip
2xVDD
VDD
0
0
0
x
Erased EPROM verification
2xVDD
VDD
2xVDD
VDD
2xVDD
VDD
1
0
0
0
EPROM verification; erase EEPROM;
EPROM/EEPROM parallel program/verify
0
1
0
0
Erased EPROM verification;
no EEPROM erase if SEC is zero (parallel mode)
1
1
0
0
Erased EPROM verification; erase EEPROM;
EPROM parallel program/verify (no E2)
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2xVDD
VDD
x
1
1
0
Jump to start of RAM ($0051); SEC bit = ACTIVE
2xVDD
VDD
0
1
0
1
EPROM and EEPROM verification; SEC bit = ACTIVE (parallel mode)
2xVDD
VDD
x
x
1
1
Serial RAM load/execute – similar to MC68HC05B6 but can fill RAM I,
II and III
x = Don’t care
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The bootstrap program will first copy part of itself in RAM (except ‘RAM parallel load’), as the
program cannot be executed in ROM during verification/programming of the EPROM. It will then
set the TCMP1 output to a logic high level, unlike the MC68HC05B6 which keeps TCMP1 low. This
can be used to distinguish between the two circuits and, in particular, for selection of the VPP level
and current capability.
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MC68HC05B6
Rev. 4.1
MC68HC705B32
14
Freescale
H-13
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Reset
IRQ at 2xVDD?
N
User mode
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Y
Y
TCAP1=VDD?
N
N
SEC bit active?
Non-user mode
Y
Parallel E/EEPROM bootstrap
Bootstrap mode
PD3 set?
Y
SEC bit active?
N
N
N
PD2 set?
N
N
m
i
l
e
r
P
PD2 set?
Y
Red LED on
N
N
Y
Red LED on
y
r
a
in
PD4 set?
Y
PD1 set?
Erased EPROM verification
Y
Y
Serial RAM
load/execute
Non-user mode
Jump to RAM
($0051)
EPROM erased?
Y
Green LED on
SEC bit active?
PD1 set?
N
N
B
m
i
l
e
r
P
Red LED off
Red LED on
y
r
a
in
PD4 set?
Erase EEPROM1
Y
Y
A
N
C
14
Figure H-3 Modes of operation flow chart (1 of 2)
Freescale
H-14
MC68HC705B32
MC68HC05B6
Rev. 4.1
C
Y
PD2 set?
m
i
l
re
Base address = $400
(EPROM only)
P
A
B
PD2 set?
N
y
r
a
in
N
Base address = $400
(EPROM only)
Y
Base address = $400
(EPROM only)
y
r
a
in
N
Base address = $100
(EPROM and EEPROM)
P
m
i
l
re
Data verified?
N
Red LED on
Y
Green LED on
y
r
a
in
Figure H-4 Modes of operation flow chart (2 of 2)
P
MC68HC05B6
Rev. 4.1
m
i
l
re
MC68HC705B32
14
Freescale
H-15
H.5.1
Erased EPROM verification
y
r
a
in
If a non $00 byte is detected, the red LED will be turned on and the routine will stop (see
Figure H-3 and Figure H-4). Only when the whole EPROM content is verified as erased will the
green LED be turned on. PD1 is then checked. If PD1=0, the bootstrap program stops here and
no programming occurs until such time as a high level is sensed on PD1. If PD1 = 1, the bootstrap
program proceeds to erase the EEPROM1 for a nominal 2.5 seconds (4.0 MHz crystal). It is then
checked for complete erasure; if any EEPROM byte is not erased, the program will stop before
erasing the SEC byte. When both EPROM and EEPROM1 are completely erased and the security
bit is cleared the programming operation can be performed. A schematic diagram of the circuit
required for erased EPROM verification is shown in Figure H-7.
H.5.2
m
i
l
e
r
P
EPROM/EEPROM parallel bootstrap
Within this mode there are various subsections which can be utilised by correctly configuring the
port pins shown in Table H-4.
y
r
a
in
The erased EPROM verification program will be executed first as described in Section H.5.1.
When PD2=0, the programming time is set to 5 milliseconds with the bootstrap program and verify
for the EPROM taking approximately 15 seconds. The EPROM will be loaded in increasing
address order with non EPROM segments being skipped by the loader. Simultaneous
programming is performed by reading sixteen bytes of data before actual programming is
performed, thus dividing the loading time of the internal EPROM by 16. If any block of 16 EPROM
bytes or 1 EEPROM byte of data is in the erased state, no programming takes place, thus
speeding up the execution time.
m
i
l
e
r
P
Parallel data is entered through Port A, while the 15-bit address is output on port B, PC0 to PC4
and TCMP1 and TCMP2. If the data comes from an external EPROM, the handshake can be
disabled by connecting together PC5 and PC6. If the data is supplied by a parallel interface,
handshake will be provided by PC5 and PC6 according to the timing diagram of Figure H-5 (see
also Figure H-6).
y
r
a
in
During programming, the green LED will flash at about 3 Hz.
Upon completion of the programming operation, the EPROM and EEPROM1 content will be
checked against the external data source. If programming is verified the green LED will stay on,
while an error will cause the red LED to be turned on. Figure H-7 is a schematic diagram of a
circuit which can be used to program the EPROM or to load and execute data in the RAM.
Note:
14
Freescale
H-16
m
i
l
e
r
P
The entire EPROM and EEPROM1 can be loaded from the external source; if it is
desired to leave a segment undisturbed, the data for this segment should be all $00s
for EPROM data and all $FFs for EEPROM1 data.
MC68HC705B32
MC68HC05B6
Rev. 4.1
Address
HDSK out
(PC5)
Data
HDSK in
(PC6)
F29
P
m
i
l
re
y
r
a
in
Data read
Data read
Figure H-5 Timing diagram with handshake
tCOOE
tCOOE
Address
tADE
tDHE
Data
P
tADE
tADE
m
i
l
re
tDHE
y
r
a
in
tCOOE
tADE max (address to data delay)
5 machine cycles
tDHA min (data hold time)
14 machine cycles
tDHE
tADE
tCDDE
tDHE
tCOOE (load cycle time)
117 machine cycles < tCOOE < 150 machine cycles
tCDDE (programming cycle time)
tCOOE + tPROG (5ms nominal for EPROM; 10ms for EEPROM1))
1 machine cycle = 1/(2f0(Xtal))
y
r
a
in
Figure H-6 Parallel EPROM loader timing diagram
P
MC68HC05B6
Rev. 4.1
m
i
l
re
MC68HC705B32
14
Freescale
H-17
y
r
a
in
m
i
l
e
r
P
RESET
RUN
1N914
+
100µF
1.0µF
+
red LED
470Ω
0.01µF
470Ω
TCAP1 VRH VDD
IRQ
OSC1
RESET
OSC2
NC
TCMP1
VPP1
PLMA
PLMB
RDI
VRL
TCAP2
PD7
PD6
PD5
PD3
PD2
PD1
PD0
Boot
green LED
red LED — programming failed
green LED — programming OK
Erase check
green LED — EPROM erased
red LED — EPROM not erased
47µF
22pF
Verify
EPROM
Erase check & boot
y
r
a
in
RAM
m
i
l
e
r
P
A0
A1
A2
A3
A4
20
CE
A5
A6
27C256 A7
D0
D1
D2
D3
D4
D5
D6
D7
GND
14
Note:
14
10
9
8
7
6
5
4
3
11
12
13
15
16
17
18
19
1N5819
EPROM
SCLK
TDO
TCMP2
PC7
BC239C
1nF
+
4k7Ω
+5V
100 kΩ
HDSK out
PC5
PC6
Short circuit if
handshake not used
A12
A11
A10
A9
A8
y
r
a
in
VSS
m
i
l
e
r
P
10k Ω
VPP6
4k7Ω
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
22
1 kΩ
12 kΩ
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
OE
Program
EPROM
EPROM erase
check
PD4
1
27
28
VPP PGM VCC
A14
26
A13
+
4.0 MHz
22pF
MC68HC705B32
MCU
+5V
A8
A9
A10
A11
A12
GND
+5V
VPP
1kΩ
1N914
25
24
21
23
2
1
2
3
BC309C
100kΩ
P1
PC4
PC3
PC2
PC1
PC0
HDSK in
This circuit is recommended for programming only at 25°C and not for use in the
end application, or at temperatures other than 25°C. If used in the end application,
VPP6 should be tied to VDD to avoid damaging the device.
Figure H-7 EPROM parallel bootstrap schematic diagram
Freescale
H-18
MC68HC705B32
MC68HC05B6
Rev. 4.1
H.5.3
Serial RAM loader
y
r
a
in
This mode is similar to the RAM load/execute program for the MC68HC05B6 described in
Section 2.2, with the additional features listed below. Table H-4 shows the entry conditions
required for this mode.
If the first byte is less than $B0, the bootloader behaves exactly as the MC68HC05B6, i.e. count
byte followed by data stored in $0050 to $00FF. If the count byte is larger than RAM I (176 bytes)
then the code continues to fill RAM II then RAM III. In this case the count byte is ignored and the
program execution begins at $0051 once the total RAM area is filled or if no data is received for 5
milliseconds.
P
m
i
l
re
The user must take care when using branches or jumps as his code will be relocated in RAM I, II
and III. If the user intends to use the stack in his program, he should send NOP’s to fill the desired
stack area.
In the RAM bootloader mode, all interrupt vectors are mapped to pseudo-vectors in RAM (see
Table H-5). This allows programmers to use their own service-routine addresses. Each
pseudo-vector is allowed three bytes of space rather than the two bytes for normal vectors,
because an explicit jump (JMP) opcode is needed to cause the desired jump to the users
service-routine address.
y
r
a
in
Table H-5 Bootstrap vector targets in RAM
m
i
l
re
Vector targets in RAM
P
H.5.3.1
SCI interrupt
$0063
Timer overflow
$0060
Timer output compare
$005D
Timer input capture
$005A
IRQ
$0057
SWI
$0054
y
r
a
in
Jump to start of RAM ($0051)
The Jump to start of RAM program will be executed when bring the device out of reset with PD2
and PD3 at ‘1’ and PD4 at ‘0’.
P
MC68HC05B6
Rev. 4.1
m
i
l
re
MC68HC705B32
14
Freescale
H-19
RESET
100kΩ
y
r
a
in
RUN
10nF
1kΩ
1N914
1.0µF
+
1N914
22
8
19
IRQ
m
i
l
e
r
P
470Ω
470Ω
1
2
3
GND
+5V
VPP
+
47µF
10
TCAP1 VRH VDD
18 RESET
OSC1
20
OSC2
Red LED
0.01µF
P1
21
PLMA
47µF
+
4.0 MHz
22pF
22pF
PLMB
Green LED
Erase check
PD3
MC68HC705B32
MCU (socket)
Green LED — EPROM erased
Red LED — EPROM not erased
Serial boot
Flashing green LED — programming
Green LED — programming ended
39
38
37
36
35
34
33
32
m
i
l
e
r
P
31
30
29
28
27
26
25
24
Erase check and serial boot
EPROM erase check
9600 BD
8-bit
no parity
RS232
Connector
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
22µF
+
8
5
7
3
2
1
2 x 3KΩ
+5V
16
2
22µF
+
6
MAX
232
13
14
1
3
4
5
12
11
+
22µF
+
22µF
14
13
12
5
4
3
PD0
PD1
PD2
PD5
PD6
PD7
50
RDI
52
TDO
VSS
41
14
VPP6
m
i
l
e
r
P
12 kΩ
4k7Ω
PC7
BC239C
1nF
+
4k7Ω
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
15
Note:
10k Ω
1 kΩ
BC309C
Serial boot
Erase check
&
serial boot
1N5819
y
r
a
in
PD4
PC6
PC5
PC4
PC3
PC2
PC1
PC0
43
44
45
46
47
48
49
y
r
a
in
VPP1
23
TCAP2
2
TCMP1
1
TCMP2
51
SCLK
40
NC
VRL
7
A minimum VDD voltage must be applied to the VPP6 pin at all times,
including power-on, as a lower voltage could damage the device. Unless
otherwise stated, EPROM programming is guaranteed at ambient (25°C)
temperature only
Figure H-8 RAM load and execute schematic diagram
Freescale
H-20
MC68HC705B32
MC68HC05B6
Rev. 4.1
tCR
Address
PC5 out
tHO
m
i
l
e
tADR
Data
PC6 in
r
P
PD4
tDHR
y
r
a
in
tHI max
tEXR max
tADR max (address to data delay; PC6=PC5)
tDHR min (data hold time)
y
r
a
in
16 machine cycles
4 machine cycles
tCR (load cycle time; PC6=PC5)
m
i
l
re
tHO (PC5 handshake out delay)
tHI max (PC6 handshake in, data hold time)
49 machine cycles
5 machine cycles
10 machine cycles
tEXR max (max delay for transition to be recognised during this cycle; PC6=PC5
P
30 machine cycles
1 machine cycle = 1/(2f0(Xtal))
Figure H-9 Parallel RAM loader timing diagram
P
MC68HC05B6
Rev. 4.1
m
i
l
re
y
r
a
in
MC68HC705B32
14
Freescale
H-21
H.6
Absolute maximum ratings
y
r
a
in
Table H-6 Absolute Maximum ratings
Symbol
Value
Unit
Supply voltage(1)
Rating
VDD
– 0.5 to +7.0
V
Input voltage (Except VPP1 and VPP6)
VIN
VSS – 0.5 to VDD + 0.5
V
Input voltage
– Self-check mode (IRQ pin only)
VIN
VSS – 0.5 to 2VDD + 0.5
V
TA
TL to TH
0 to +70
–40 to +85
°C
TSTG
– 65 to +150
°C
ID
IS
25
45
mA
mA
m
i
l
e
r
P
Operating temperature range
– Standard (MC68HC705B32)
– Extended (MC68HC705B32C)
Storage temperature range
Current drain per pin (excluding VDD and VSS)(2)
– Source
– Sink
(1) All voltages are with respect to VSS.
y
r
a
in
(2) Maximum current drain per pin is for one pin at a time, limited by an external resistor.
Note:
This device contains circuitry designed to protect against damage due to high
electrostatic voltages or electric fields. However, it is recommended that normal
precautions be taken to avoid the application of any voltages higher than those given
in the maximum ratings table to this high impedance circuit. For maximum reliability all
unused inputs should be tied to either VSS or VDD.
m
i
l
e
r
P
m
i
l
e
r
P
14
Freescale
H-22
y
r
a
in
MC68HC705B32
MC68HC05B6
Rev. 4.1
H.7
DC electrical characteristics
y
r
a
in
Table H-7 DC electrical characteristics for 5V operation
(VDD = 5 Vdc ± 10%, VSS = 0 Vdc, –40 to +85°C)
Characteristic(1)
Output voltage
ILOAD = – 10 µA
ILOAD = +10 µA
Output high voltage (ILOAD = 0.8mA)
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2
Output high voltage (ILOAD = 1.6mA)
TDO, SCLK, PLMA, PLMB
Output high voltage (ILOAD = -300µA)
OSC2
Output low voltage (ILOAD = 1.6mA)
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2,
TDO, SCLK, PLMA, PLMB
Output low voltage (ILOAD = 1.6mA)
RESET
Output low voltage (ILOAD = -100µA)
OSC2
Input high voltage
PA0–7, PB0–7, PC0–7, PD0–7, OSC1,
IRQ, RESET, TCAP1, TCAP2, RDI
Input low voltage
PA0–7, PB0–7, PC0–7, PD0–7,OSC1, IRQ,
RESET, TCAP1, TCAP2, RDI
Supply current(3) (For Guidance Only)
RUN (SM = 0) (See Figure 11-1)
RUN (SM = 1) (See Figure 11-2)
WAIT (SM = 0) (See Figure 11-3)
WAIT (SM = 1) (See Figure 11-4)
STOP
0 to 70 (standard)
– 40 to 85 (extended)
High-Z leakage current
PA0–7, PB0–7, PC0–7, TDO, RESET, SCLK
Input current
Port B and port C pull-down (VIN =VIH)
Input current (0 to 70)
IRQ, OSC1, TCAP1, TCAP2, RDI,
PD0/AN0-PD7/AN7 (channel not selected)
Input current (– 40 to 85)
IRQ, OSC1, TCAP1, TCAP2, RDI,
PD0/AN0-PD7/AN7 (channel not selected)
Capacitance
Ports (as input or output), RESET, TDO,
SCLK
IRQ, TCAP1, TCAP2, OSC1, RDI
PD0/AN0–PD7/AN7 (A/D off)
PD0/AN0–PD7/AN7 (A/D on)
r
P
r
P
P
Min
Typ(2)
Max
Unit
VDD – 0.1
—
—
—
—
0.1
V
VDD – 0.8
VDD – 0.4
—
VOH
VDD – 0.8
VDD – 0.4
—
VOH
VDD – 0.8
VDD – 0.3
—
VOL
—
0.1
0.4
VOL
—
0.4
1
VOL
—
TBD
—
0.7VDD
—
VDD
V
VSS
—
0.2VDD
V
—
—
—
—
6
1.5
2
1
TBD
TBD
TBD
TBD
mA
mA
mA
mA
IDD
IDD
—
—
10
10
TBD
TBD
µA
µA
IIL
—
±0.2
±1
µA
Symbol
VOH
VOL
m
i
l
e
VOH
VIH
VIL
m
i
l
e
IDD
IDD
IDD
IDD
y
r
a
in
IRPD
IIN
IIN
m
i
l
re
COUT
COUT
CIN
CIN
V
µA
80
y
r
a
in
V
—
±0.2
±1
µA
—
—
±5
µA
—
—
—
—
—
—
12
22
12
8
—
—
pF
pF
pF
pF
(1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching
currents inherent in CMOS designs (see Section 2).
(2) Typical values are at mid point of voltage range and at 25°C only.
MC68HC05B6
Rev. 4.1
MC68HC705B32
Freescale
H-23
14
(3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 2.0 MHz); all inputs 0.2 V from rail; no
DC loads; maximum load on outputs 50pF (20pF on OSC2).
STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD – 0.2 V: STOP IDD measured with OSC1 = VDD.
WAIT IDD is affected linearly by the OSC2 capacitance.
y
r
a
in
m
i
l
e
r
P
m
i
l
e
r
P
m
i
l
e
r
P
14
Freescale
H-24
y
r
a
in
y
r
a
in
MC68HC705B32
MC68HC05B6
Rev. 4.1
Table H-8 DC electrical characteristics for 3.3V operation
(VDD = 3.3Vdc ± 10%, VSS = 0Vdc, TA = –40 to +85°C)
Symbol
Characteristic(1)
Output voltage
ILOAD = – 10 µA
VOH
ILOAD = +10 µA
VOL
Output high voltage (ILOAD = 0.8mA)
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2
VOH
Output high voltage (ILOAD = 1.6mA)
TDO, SCLK, PLMA, PLMB
VOH
Output low voltage (ILOAD = 1.6mA)
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2,
VOL
TDO, SCLK, PLMA, PLMB
Output low voltage (ILOAD = 1.6mA)
VOL
RESET
Input high voltage
PA0–7, PB0–7, PC0–7, PD0–7, OSC1,
VIH
IRQ, RESET, TCAP1, TCAP2, RDI
Input low voltage
PA0–7, PB0–7, PC0–7, PD0–7, OSC1, IRQ,
VIL
RESET, TCAP1, TCAP2, RDI
Supply current(3) (For Guidance Only)
RUN (SM = 0) (See Figure 11-1)
IDD
RUN (SM = 1) (See Figure 11-2)
IDD
WAIT (SM = 0) (See Figure 11-3)
IDD
WAIT (SM = 1) (See Figure 11-4)
IDD
STOP
0 to 70 (standard)
IDD
– 40 to 85 (extended)
IDD
High-Z leakage current
PA0–7, PB0–7, PC0–7, TDO, RESET, SCLK
IIL
Input current (0 to 70)
IRQ, OSC1, TCAP1, TCAP2, RDI,
IIN
PD0/AN0-PD7/AN7 (channel not selected)
Input current (– 40 to 125)
IRQ, OSC1, TCAP1, TCAP2, RDI,
IIN
PD0/AN0-PD7/AN7 (channel not selected)
Capacitance
Ports (as input or output), RESET, TDO,
COUT
SCLK
COUT
IRQ, TCAP1, TCAP2, OSC1, RDI
CIN
PD0/AN0–PD7/AN7 (A/D off)
CIN
PD0/AN0–PD7/AN7 (A/D on)
r
P
r
P
m
i
l
e
m
i
l
e
m
i
l
re
y
r
a
in
Min
Typ(2)
Max
Unit
VDD – 0.1
—
—
—
—
0.1
V
VDD – 0.3
VDD – 0.1
—
VDD – 0.3
VDD – 0.1
—
—
0.1
0.3
0.2
0.6
—
VDD
0.7VDD
y
r
a
in
V
V
V
VSS
—
0.2VDD
V
—
—
—
—
3
1
1.5
0.5
TBD
TBD
TBD
TBD
mA
mA
mA
mA
—
—
10
10
TBD
TBD
µA
µA
—
±0.2
±1
µA
—
±0.2
±1
µA
—
—
±5
µA
12
8
—
—
pF
pF
pF
pF
y
r
a
in
—
—
—
—
—
—
12
22
(1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the
transient switching currents inherent in CMOS designs (see Section 2).
(2) Typical values are at mid point of voltage range and at 25°C only.
(3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 2.0 MHz); all inputs
0.2 V from rail; no DC loads; maximum load on outputs 50pF (20pF on OSC2).
STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD – 0.2 V: STOP IDD measured with
OSC1 = VDD.
WAIT IDD is affected linearly by the OSC2 capacitance.
P
MC68HC05B6
Rev. 4.1
MC68HC705B32
Freescale
H-25
14
H.8
A/D converter characteristics
y
r
a
in
Table H-9 A/D characteristics for 5V operation
(VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = –40 to +85°C)
Characteristic
Parameter
Min
Max
Unit
8
—
Bit
Max deviation from the best straight line through the A/D
transfer characteristics
(VRH = VDD and VRL = 0V)
—
± 0.5
LSB
Quantization error
Uncertainty due to converter resolution
—
± 0.5
LSB
Absolute accuracy
Difference between the actual input voltage and the
full-scale equivalent of the binary code output code for all
errors
—
±1
LSB
m
i
l
e
r
P
Resolution
Number of bits resolved by the A/D
Non-linearity
Conversion range
Analog input voltage range
VRL
VRH
V
VRH
Maximum analog reference voltage
VRL
VDD + 0.1
V
y
r
a
in
VRL
Minimum analog reference voltage
VSS – 0.1
VRH
V
∆VR
Minimum difference between VRH and VRL
3
—
V
Conversion time
Total time to perform a single analog to digital conversion
a. External clock (OSC1, OSC2)
b. Internal RC oscillator
—
—
32
32
tCYC
µs
Monotonicity
Conversion result never decreases with an increase in
input voltage and has no missing codes
Zero input reading
Conversion result when VIN = VRL
00
—
Hex
Full scale reading
Conversion result when VIN = VRH
—
FF
Hex
Sample acquisition time Analog input acquisition sampling
a. External clock (OSC1, OSC2)
b. Internal RC oscillator(1)
—
—
12
12
tCYC
µs
Sample/hold capacitance Input capacitance on PD0/AN0–PD7/AN7
—
12
pF
Input leakage(2)
—
1
µA
m
i
l
e
r
P
Input leakage on A/D pins PD0/AN0–PD7/AN7, VRL, VRH
GUARANTEED
(1) Source impedances greater than 10kΩ will adversely affect internal charging time during input sampling.
(2) The external system error caused by input leakage current is approximately equal to the product of R source and input
current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2).
m
i
l
e
r
P
14
Freescale
H-26
y
r
a
in
MC68HC705B32
MC68HC05B6
Rev. 4.1
Table H-10 A/D characteristics for 3.3V operation
(VDD = 3.3 Vdc ± 10%, VSS = 0 Vdc, TA = –40 to +85°C)
Characteristic
Parameter
y
r
a
in
Min
Max
Unit
8
—
Bit
Max deviation from the best straight line through the A/D
transfer characteristics
(VRH = VDD and VRL = 0V)
—
±1
LSB
Quantization error
Uncertainty due to converter resolution
—
±1
LSB
Absolute accuracy
Difference between the actual input voltage and the
full-scale equivalent of the binary code output code for all
errors
—
±2
LSB
Resolution
Number of bits resolved by the A/D
Non-linearity
r
P
m
i
l
e
Conversion range
Analog input voltage range
VRL
VRH
V
VRH
Maximum analog reference voltage
VRL
VDD + 0.1
V
VRL
Minimum analog reference voltage
VSS – 0.1
VRH
V
∆VR
Minimum difference between VRH and VRL
3
—
V
Conversion time
Total time to perform a single analog to digital conversion
Internal RC oscillator
—
32
µs
Monotonicity
Conversion result never decreases with an increase in
input voltage and has no missing codes
Zero input reading
Conversion result when VIN = VRL
Full scale reading
Conversion result when VIN = VRH
Sample acquisition time Analog input acquisition sampling
Internal RC oscillator(1)
m
i
l
e
Sample/hold capacitance Input capacitance on PD0/AN0–PD7/AN7
Input leakage(2)
y
r
a
in
Input leakage on A/D pins PD0/AN0–PD7/AN7, VRL, VRH
r
P
GUARANTEED
00
—
Hex
—
FF
Hex
—
12
µs
—
12
pF
—
1
µA
(1) Source impedances greater than 10kΩ will adversely affect internal charging time during input sampling.
(2) The external system error caused by input leakage current is approximately equal to the product of R source and input
current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2).
P
MC68HC05B6
Rev. 4.1
m
i
l
re
y
r
a
in
MC68HC705B32
14
Freescale
H-27
H.9
Control timing
y
r
a
in
Table H-11 Control timing for 5V operation
(VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = –40 to +85°C)
Characteristic
Symbol
Min
Max
Unit
Frequency of operation
Crystal option
External clock option
fOSC
fOSC
—
dc
4.2
4.2
MHz
MHz
Internal operating frequency (fOSC/2)
Using crystal
Using external clock
fOP
fOP
—
dc
2.1
2.1
MHz
MHz
Cycle time (see Figure 9-1)
tCYC
476
—
ns
Crystal oscillator start-up time (see Figure 9-1)
tOXOV
—
100
ms
ms
m
i
l
e
r
P
Stop recovery start-up time (crystal oscillator)
tILCH
100
RC oscillator stabilization time
tADRC
5
µs
A/D converter stabilization time
tADON
500
µs
tRL
3.0
—
tCYC
Power-on RESET output pulse width
4064 cycle
16 cycle
tPORL
tPORL
4064
16
—
—
tCYC
tCYC
Watchdog RESET output pulse width
tDOGL
1.5
—
tCYC
Watchdog time-out
tDOG
6144
7168
tCYC
EEPROM byte erase time
0 to 70 (standard)
– 40 to 85 (extended)
10
10
—
—
ms
ms
EEPROM byte program time(1)
0 to 70 (standard)
– 40 to 85 (extended)
tERA
tERA
tPROG
tPROG
10
10
—
—
ms
ms
Timer (see Figure H-10)
Resolution(2)
Input capture pulse width
Input capture pulse period
tRESL
tTH, tTL
tTLTL
4
125
—(3)
—
—
—
tCYC
ns
tCYC
External RESET input pulse width
m
i
l
e
r
P
y
r
a
in
Interrupt pulse width (edge-triggered)
tILIH
125
—
Interrupt pulse period
tILIL
—(4)
—
tOH, tOL
90
—
OSC1 pulse width(5)
Write/Erase endurance(6)(7)
Data retention(6)(7)
y
r
a
in
ns
tCYC
ns
—
10000
cycles
—
10
years
(1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when
programming the EEPROM.
(2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting factor
in determining the timer resolution.
(3) The minimum period tTLTL should not be less than the number of cycle times it takes to execute
the capture interrupt service routine plus 24 tCYC.
(4) The minimum period tILIL should not be less than the number of cycle times it takes to execute
the interrupt service routine plus 21 tCYC.
(5) tOH and tOL should not total less than 238ns.
(6) At a temperature of 85°C
(7) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information.
m
i
l
e
r
P
14
Freescale
H-28
MC68HC705B32
MC68HC05B6
Rev. 4.1
Table H-12 Control timing for operation at 3.3V
y
r
a
in
(VDD = 3.3Vdc ± 10%, VSS = 0 Vdc, TA = –40 to +85°C)
Characteristic
Frequency of operation
Crystal option
External clock option
r
P
Min
Max
Unit
fOSC
fOSC
—
dc
2.0
2.0
MHz
MHz
fOP
fOP
—
dc
1.0
1.0
MHz
MHz
tCYC
1000
—
ns
tOXOV
—
100
ms
m
i
l
e
Internal operating frequency (fOSC/2)
Using crystal
Using external clock
Cycle time (see Figure 9-1)
Symbol
Crystal oscillator start-up time (see Figure 9-1)
Stop recovery start-up time (crystal oscillator)
tILCH
100
ms
RC oscillator stabilization time
tADRC
5
µs
A/D converter stabilization time
tADON
500
µs
External RESET input pulse width
tRL
3.0
—
tCYC
Power-on RESET output pulse width
4064 cycle
16 cycle
tPORL
tPORL
4064
16
—
—
tCYC
tCYC
Watchdog RESET output pulse width
tDOGL
1.5
—
tCYC
Watchdog time-out
tDOG
6144
7168
tCYC
EEPROM byte erase time
0 to 70 (standard)
– 40 to 85 (extended)
tERA
tERA
30
30
—
—
ms
ms
tPROG
tPROG
30
30
—
—
ms
ms
tRESL
tTH, tTL
tTLTL
4
250
—(3)
—
—
—
tCYC
ns
tCYC
m
i
l
re
EEPROM byte program time(1)
0 to 70 (standard)
– 40 to 85 (extended)
P
Timer (see Figure H-10)
Resolution(2)
Input capture pulse width
Input capture pulse period
y
r
a
in
Interrupt pulse width (edge-triggered)
tILIH
250
—
ns
Interrupt pulse period
tILIL
—(4)
—
tCYC
tOH, tOL
100
—
OSC1 pulse width(5)
Write/Erase endurance(6)(7)
Data retention(6)(7)
y
r
a
in
ns
—
10000
cycles
—
10
years
(1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when
programming the EEPROM.
(2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting
factor in determining the timer resolution.
m
i
l
re
(3) The minimum period tTLTL should not be less than the number of cycle times it takes to
execute the capture interrupt service routine plus 24 tCYC.
(4) The minimum period tILIL should not be less than the number of cycle times it takes to
execute the interrupt service routine plus 21 tCYC.
P
(5) tOH and tOL should not total less than 500ns.
14
(6) At a temperature of 85°C
(7) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information.
MC68HC05B6
Rev. 4.1
MC68HC705B32
Freescale
H-29
tTLTL
tTH
tTL
y
r
a
in
External
signal
(TCAP1,
TCAP2)
m
i
l
e
r
P
Figure H-10 Timer relationship
H.10
EPROM electrical characteristics
Table H-13 DC electrical characteristics for 5V operation
(VDD = 5 Vdc ± 10%, VSS = 0 Vdc, TA = 25°C)
Characteristic(1)
EPROM
Absolute maximum voltage
Programming voltage
Programming current
Read voltage
Symbol
VPP6 max
VPP6
IPP6
VPP6R
Typ(2)
Min
Max
y
r
a
in
VDD
15
—
VDD
—
15.5
50
VDD
18
16
64
VDD
Unit
V
V
mA
V
(1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the
transient switching
inherent
in CMOSBLANK
designs (see Section
2).
THIScurrents
PAGE
LEFT
INTENTIONALLY
m
i
l
e
r
P
(2) Typical values are at mid point of voltage range and at 25°C only.
Table H-14 Control timing for 5V operation
(VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = 25°C)
Characteristic
EPROM programming time
Symbol
Min
Max
Unit
tPROG
5
20
ms
Table H-15 Control timing for 3.3V operation
(VDD = 3.3 Vdc ± 10%, VSS = 0 Vdc, TA = 25°C)
Characteristic
EPROM programming time
Min
Max
Unit
tPROG
5
20
ms
m
i
l
e
r
P
14
Freescale
H-30
y
r
a
in
Symbol
MC68HC705B32
MC68HC05B6
Rev. 4.1
I
HIGH SPEED OPERATION
This section contains the electrical specifications and associated timing information for high speed
versions of the MC68HC05B6, MC68HC05B8 and MC68HC05B16 (fOSC max = 8 MHz). The
ordering information for these devices is contained in Table I-1.
Table I-1 Ordering information
Device title
MC68HC05B6
MC68HC05B8
MC68HC05B16
Note:
Package
Suffix
0 to 70°C
Suffix
-40 to +85°C
52-pin PLCC
FN
CFN
64-pin QFP
FU
CFU
56-pin SDIP
B
CB
52-pin PLCC
FN
CFN
CFU
64-pin QFP
FU
56-pin SDIP
B
CB
52-pin PLCC
FN
CFN
64-pin QFP
FU
CFU
56-pin SDIP
B
CB
The high speed version has the same device title as the standard version. High speed
operation is selected via a check-box on the order form and will be confirmed on the
listing verification form.
MC68HC05B6
Rev. 4.1
HIGH SPEED OPERATION
Freescale
I-1
15 271
272
273
274
275
I.1
DC electrical characteristics
Table I-2 DC electrical characteristics for 5V operation
(VDD = 5 Vdc ± 10%, VSS = 0 Vdc, TA = –40 to +85°C)
Characteristic(1)
Output voltage
ILOAD = – 10 µA
ILOAD = +10 µA
Output high voltage (ILOAD = 0.8mA)
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2
Output high voltage (ILOAD = 1.6mA)
TDO, SCLK, PLMA, PLMB
Output low voltage (ILOAD = 1.6mA)
PA0–7, PB0–7, PC0–7, TCMP1, TCMP2,
TDO, SCLK, PLMA, PLMB
Output low voltage (ILOAD = 1.6mA)
RESET
Input high voltage
PA0–7, PB0–7, PC0–7, PD0–7, OSC1,
IRQ, RESET, TCAP1, TCAP2, RDI
Input low voltage
PA0–7, PB0–7, PC0–7, PD0–7, OSC1, IRQ,
RESET, TCAP1, TCAP2, RDI
Supply current(3)
RUN (SM = 0) (See Figure 11-1)
RUN (SM = 1) (See Figure 11-2)
WAIT (SM = 0) (See Figure 11-3)
WAIT (SM = 1) (See Figure 11-4)
STOP
0 to 70 (standard)
– 40 to 85 (extended)
High-Z leakage current
PA0–7, PB0–7, PC0–7, TDO, RESET, SCLK
Input current (0 to 70)
IRQ, OSC1, TCAP1, TCAP2, RDI,
PD0/AN0-PD7/AN7 (channel not selected)
Capacitance
Ports (as input or output), RESET, TDO, SCLK
IRQ, TCAP1, TCAP2, OSC1, RDI
PD0/AN0–PD7/AN7 (A/D off)
PD0/AN0–PD7/AN7 (A/D on)
Symbol
Min
Typ(2)
Max
Unit
VOH
VOL
VDD – 0.1
—
—
—
—
0.1
V
VOH
VDD – 0.8
—
VOH
VDD – 0.8
—
—
—
VOL
—
—
—
0.4
VOL
—
—
—
VIH
0.7VDD
—
VDD
V
VIL
VSS
—
0.2VDD
V
IDD
—
—
—
—
—
—
—
—
12
3
4
2
mA
mA
mA
mA
—
—
—
—
10
20
µA
µA
IIL
—
—
±1
µA
IIN
—
—
—
±5
±1
µA
COUT
CIN
CIN
CIN
—
—
—
—
—
—
12
22
12
8
—
—
pF
pF
pF
pF
V
—
V
1
(1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient
switching currents inherent in CMOS designs (see Section 2).
(2) Typical values are at mid point of voltage range and at 25°C only.
(3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 8.0MHz); all inputs 0.2 V from
rail; no DC loads; maximum load on outputs 50pF (20pF on OSC2).
STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD – 0.2 V: STOP IDD measured with
OSC1 = VDD.
WAIT IDD is affected linearly by the OSC2 capacitance.
15
276
Freescale
I-2
HIGH SPEED OPERATION
MC68HC05B6
Rev. 4.1
I.2
A/D converter characteristics
Table I-3 A/D characteristics for 5V operation
(VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = –40 to +85°C)
Min
Max
Unit
Resolution
Characteristic
Number of bits resolved by the A/D
Parameter
8
—
Bit
Non-linearity
Max deviation from the best straight line through
the A/D transfer characteristics
(VRH = VDD and VRL = 0V)
—
± 0.5
LSB
Quantization error
Uncertainty due to converter resolution
—
± 0.5
LSB
—
±1
LSB
Difference between the actual input voltage and
Absolute accuracy the full-scale equivalent of the binary code
output code for all errors
Conversion range
Analog input voltage range
VRL
VRH
V
VRH
Maximum analog reference voltage
VRL
VDD + 0.1
V
Minimum analog reference voltage
VSS – 0.1
VRH
V
∆VR(1)
Minimum difference between VRH and VRL
3
—
V
Conversion time
Total time to perform a single analog to digital
conversion
a. External clock (OSC1, OSC2)
b. Internal RC oscillator
—
—
32
32
tCYC
µs
Monotonicity
Conversion result never decreases with an
increase in input voltage and has no missing
codes
VRL
GUARANTEED
Zero input reading Conversion result when VIN = VRL
00
—
Hex
Conversion result when VIN = VRH
—
FF
Hex
Analog input acquisition sampling
Sample acquisition
a. External clock (OSC1, OSC2)
time
b. Internal RC oscillator(2)
—
—
12
12
tCYC
µs
Full scale reading
Sample/hold
capacitance
Input capacitance on PD0/AN0–PD7/AN7
—
12
pF
Input leakage(3)
Input leakage on A/D pins PD0/AN0–PD7/AN7
VRL, VRH
—
—
1
1
µA
µA
(1) Performance verified down to 2.5V ∆VR, but accuracy is tested and guaranteed at ∆VR = 5V±10%.
(2) Source impedances greater than 10kΩ will adversely affect internal charging time during input sampling.
(3) The external system error caused by input leakage current is approximately equal to the product of R
source and input current. Input current to A/D channel will be dependent on external source impedance
(see Figure 8-2).
MC68HC05B6
Rev. 4.1
HIGH SPEED OPERATION
Freescale
I-3
15
I.3
Control timing for 5V operation
(VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = –40 to +85°C)
Symbol
Min
Max
Unit
Frequency of operation
Crystal option
External clock option
Characteristic
fOSC
fOSC
—
dc
8.0
8.0
MHz
MHz
Internal operating frequency (fOSC/2)
Crystal
External clock
fOP
fOP
—
dc
4.0
4.0
MHz
MHz
Cycle time (see Figure 9-1)
tCYC
250
—
ns
Crystal oscillator start-up time (see Figure 9-1)
tOXOV
—
100
ms
Stop recovery start-up time (crystal oscillator)
tILCH
100
ms
tRL
1.5
—
tCYC
Power-on RESET output pulse width
4064 cycle
16 cycle
tPORL
tPORL
4064
16
—
—
tCYC
tCYC
Watchdog RESET output pulse width
tDOGL
1.5
—
tCYC
Watchdog time-out
tDOG
6144
7168
tCYC
EEPROM byte erase time
0 to 70 (standard)
– 40 to 85 (extended)
10
10
—
—
ms
ms
EEPROM byte program time(1)
0 to 70 (standard)
– 40 to 85 (extended)
tERA
tERA
tPROG
tPROG
10
10
—
—
ms
ms
Timer (see Figure I-1)
Resolution(2)
Input capture pulse width
Input capture pulse period
tRESL
tTH, tTL
tTLTL
4
125
—(3)
—
—
—
tCYC
ns
tCYC
External RESET input pulse width
Interrupt pulse width (edge-triggered)
tILIH
125
—
ns
Interrupt pulse period
tILIL
—(4)
—
tCYC
tOH, tOL
90
—
OSC1 pulse width
Write/Erase endurance(5)(6)
Data retention(5)(6)
ns
—
10000
cycles
—
10
years
(1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when
programming the EEPROM.
(2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting
factor in determining the timer resolution.
(3) The minimum period tTLTL should not be less than the number of cycle times it takes to
execute the capture interrupt service routine plus 24 tCYC.
(4) The minimum period tILIL should not be less than the number of cycle times it takes to
execute the interrupt service routine plus 21 tCYC.
(5) At a temperature of 85°C
(6) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate
information.
15
Freescale
I-4
HIGH SPEED OPERATION
MC68HC05B6
Rev. 4.1
tTLTL
tTH
tTL
External
signal
(TCAP1,
TCAP2)
Figure I-1 Timer relationship
MC68HC05B6
Rev. 4.1
HIGH SPEED OPERATION
Freescale
I-5
15
THIS PAGE LEFT BLANK INTENTIONALLY
15
Freescale
I-6
HIGH SPEED OPERATION
MC68HC05B6
Rev. 4.1
GLOSSARY
This section contains abbreviations and specialist words used in this data
sheet and throughout the industry. Further information on many of the terms
may be gleaned from Freescale’s M68HC11 Reference Manual,
M68HC11RM/AD, or from a variety of standard electronics text books.
$xxxx
The digits following the ‘$’ are in hexadecimal format.
%xxxx
The digits following the ‘%’ are in binary format.
A/D, ADC
Analog-to-digital (converter).
Bootstrap mode
In this mode the device automatically loads its internal memory from an
external source on reset and then allows this program to be executed.
Byte
Eight bits.
CCR
Condition codes register; an integral part of the CPU.
CERQUAD
A ceramic package type, principally used for EPROM and high temperature
devices.
Clear
‘0’ — the logic zero state; the opposite of ‘set’.
CMOS
Complementary metal oxide semiconductor. A semiconductor technology
chosen for its low power consumption and good noise immunity.
COP
Computer operating properly. aka ‘watchdog’. This circuit is used to detect
device runaway and provide a means for restoring correct operation.
CPU
Central processing unit.
D/A, DAC
Digital-to-analog (converter).
EEPROM
Electrically erasable programmable read only memory. aka ‘EEROM’.
EPROM
Erasable programmable read only memory. This type of memory requires
exposure to ultra-violet wavelengths in order to erase previous data. aka
‘PROM’.
ESD
Electrostatic discharge.
Expanded mode
In this mode the internal address and data bus lines are connected to
external pins. This enables the device to be used in much more complex
systems, where there is a need for external memory for example.
TPG
MC68HC05B6
GLOSSARY
Freescale
i
277
EVS
Evaluation system. One of the range of platforms provided by Freescale for
evaluation and emulation of their devices.
HCMOS
High-density complementary metal oxide semiconductor. A semiconductor
technology chosen for its low power consumption and good noise immunity.
I/O
Input/output; used to describe a bidirectional pin or function.
Input capture
(IC) This is a function provided by the timing system, whereby an external
event is ‘captured’ by storing the value of a counter at the instant the event
is detected.
Interrupt
This refers to an asynchronous external event and the handling of it by the
MCU. The external event is detected by the MCU and causes a
predetermined action to occur.
IRQ
Interrupt request. The overline indicates that this is an active-low signal
format.
K byte
A kilo-byte (of memory); 1024 bytes.
LCD
Liquid crystal display.
LSB
Least significant byte.
M68HC05
Freescale’s family of 8-bit MCUs.
MCU
Microcontroller unit.
MI BUS
Interconnect bus. A single wire, medium speed serial communications
protocol.
MSB
Most significant byte.
Nibble
Half a byte; four bits.
NRZ
Non-return to zero.
Opcode
The opcode is a byte which identifies the particular instruction and operating
mode to the CPU. See also: prebyte, operand.
Operand
The operand is a byte containing information the CPU needs to execute a
particular instruction. There may be from 0 to 3 operands associated with an
opcode. See also: opcode, prebyte.
Output compare
(OC) This is a function provided by the timing system, whereby an external
event is generated when an internal counter value matches a predefined
value.
PLCC
Plastic leaded chip carrier package.
PLL
Phase-locked loop circuit. This provides a method of frequency
multiplication, to enable the use of a low frequency crystal in a high
frequency circuit.
Prebyte
This byte is sometimes required to qualify an opcode, in order to fully specify
a particular instruction. See also: opcode, operand.
TPG
Freescale
ii
GLOSSARY
MC68HC05B6
278
Pull-down, pull-up These terms refer to resistors, sometimes internal to the device, which are
permanently connected to either ground or VDD.
PWM
Pulse width modulation. This term is used to describe a technique where the
width of the high and low periods of a waveform is varied, usually to enable
a representation of an analog value.
QFP
Quad flat pack package.
RAM
Random access memory. Fast read and write, but contents are lost when the
power is removed.
RFI
Radio frequency interference.
RTI
Real-time interrupt.
ROM
Read-only memory. This type of memory is programmed during device
manufacture and cannot subsequently be altered.
RS-232C
A standard serial communications protocol.
SAR
Successive approximation register.
SCI
Serial communications interface.
Set
‘1’ — the logic one state; the opposite of ‘clear’.
Silicon glen
An area in the central belt of Scotland, so called because of the
concentration of semiconductor manufacturers and users found there.
Single chip mode
In this mode the device functions as a self contained unit, requiring only I/O
devices to complete a system.
SPI
Serial peripheral interface.
Test mode
This mode is intended for factory testing.
TTL
Transistor-transistor logic.
UART
Universal asynchronous receiver transmitter.
VCO
Voltage controlled oscillator.
Watchdog
see ‘COP’.
Wired-OR
A means of connecting outputs together such that the resulting composite
output state is the logical OR of the state of the individual outputs.
Word
Two bytes; 16 bits.
XIRQ
Non-maskable interrupt request. The overline indicates that this has an
active-low signal format.
TPG
MC68HC05B6
GLOSSARY
Freescale
iii
279
THIS PAGE LEFT BLANK INTENTIONALLY
TPG
Freescale
iv
GLOSSARY
MC68HC05B6
280
INDEX
In this index numeric entries are placed first; page references in italics indicate that the reference
is to a figure.
A
A/D converter
block diagram 8–2
during STOP mode 8–6
during WAIT mode 8–6
operation 8–1
registers
ADDATA 8–3
ADSTAT 8–4
PORTD 8–3
A/D converter characteristics 11–8 11–9 E–24 E–25
F–22 F–23 H–25 H–26 I–3
A/D status/control register
ADON 4–5
absolute maximum ratings 11–1
ADDATA – A/D result data register 8–3
ADON – A/D converter on 8–5
ADON – A/D converter on bit 4–5
ADRC – A/D RC oscillator control 8–4
ADSTAT
ADON 8–5
ADRC 8–4
CH3-CH0 8–5
COCO 8–4
ADSTAT – A/D status/control register 8–4
alternate counter register 5–3
analog input 8–6
,
,
B
Baud rate register
SCP1, SCP0 6–18
SCR2, SCR1, SCR0 6–19
SCT2, SCT1, SCT0 6–18
block diagrams
MC68HC05B16 D–3
MC68HC05B32 G–2
MC68HC05B4 A–2
MC68HC05B8 B–2
MC68HC705B16 E–2
MC68HC705B16N F–2
MC68HC05B6
,
,
,
,
,
MC68HC705B32 H–4
MC68HC705B5 C–2
PLM system 7–1
programmable timer 5–2
SCI 6–2 6–2
watchdog system 9–3
bootstrap mode C–8 E–10 H–12
,
,
,
,
C
ceramic resonator 2–11
CH3-CH0 – A/D channels 3, 2, 1 and 0 8–5
COCO – Conversion complete flag 8–4
control timing 11–10 11–11 C–19 E–26 E–27 F–24
F–25 H–27 H–28 I–4
COP watchdog 9–3
during STOP mode 9–4
during WAIT mode 9–4
counter 5–1
counter register 5–3
CPHA – Clock phase 6–12
CPOL – Clock polarity 6–12
crystal 2–11
,
,
,
,
,
,
,
,
,
D
data direction registers
DDRA, DDRB, DDRC 4–5
data format 6–5
DC electrical characteristics 11–2 11–5 C–19 E–22
E–23 F–20 F–21 H–23 H–24 I–2
,
E
,
,
,
,
,
,
,
,
,
,
E1ERA – EEPROM erase/programming bit 3–3 E–7
F–7 H–9
E1LAT – EEPROM programming latch enable 3–4
E1LAT – EEPROM programming latch enable bit E–7
F–7 H–10
,
,
INDEX
,
Freescale
v
281
282
283
284
285
,
E1PGM – EEPROM charge pump enable/disable 3–4
E–7 F–7 H–10
E6LAT – EPROM programming latch enable bit E–6 F–6
H–9
E6PGM – EPROM program enable bit E–6 F–6 H–9
ECLK – External clock output bit 4–3
EE1P – EEPROM protect bit E–9 F–9
EE1P – EEPROM protection bit H–12
EEPROM 3–1 3–3
erase operation 3–5
programming operation 3–6
read operation 3–5
STOP mode 3–7
WAIT mode 3–7
EEPROM control register
E1ERA 3–3
E1LAT 3–4
E1PGM 3–4
ECLK 3–3
EEPROM options register
EE1P E–9 F–9
SEC E–9, F–9
EEPROM/ECLK control
ECLK 4–3
ELAT – EPROM programming latch enable bit C–6
EPGM – EPROM programming bit C–6
EPP – EPROM protect C–7
EPPT – EPROM protect test bit C–6
EPROM 13–2 C–5 E–5 F–5
control register C–6 E–6 F–6
options register C–7
program operation E–5 F–6 H–8
programming operation C–5
read operation E–5 F–5 H–8
EPROM control register
ELAT C–6
EPGM C–6
EPPT C–6
EPROM electrical characteristics E–28 F–26 H–29
EPROM registers C–6
EPROM/EEPROM/ECLK control register
E1ERA E–7 F–7
E1LAT E–7 F–7
E1PGM E–7 F–7
E6LAT E–6 F–6
E6PGM E–6 F–6
external clock 2–12 D–4 E–5 F–5 G–2
external interrupt 9–7
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
F
FE – Framing error flag 6–17
H
high speed operation I–1
I
I/O pin states 4–2
I/O port structure 4–2 4–2
ICF1 – Input capture flag 1 5–6
ICF2 – Input capture flag 2 5–7
IDLE – Idle line detect flag 6–16
IEDG1 – Input edge 1 5–5
ILIE – Idle line interrupt enable 6–14
Input capture registers
ICR1 5–7
ICR2 5–8
input/output programming 4–1
INTE – External interrupt enable 3–9 9–9
interrupts
priorities 9–6
SCI 9–10
SWI 9–6
INTP, INTN – External interrupt sensitivity options 3–9 9–9
IRQ 9–7
IRQ sensitivity 9–9
,
,
,
L
LBCL – Last bit clock 6–13
low power modes
SLOW 2–9
STOP 2–6
WAIT 2–8
,
,
,
,
,
,
,
,
,
,
,
M
M – Mode 6–11
Mask option register
PBPD E–8 F–8 H–11
PCPD E–8 F–9 H–11
RTIM E–8 F–8 H–11
RWAT E–8 F–8 H–11
WWAT E–8 F–8 H–11
mask options
MC68HC05B6 1–3
maskable hardware interrupts 9–7
maskset errata D–1 H–1
MC68HC05B16 D–1
block diagram D–3
memory map D–5
MC68HC05B32 G–1
block diagram G–2
memory map G–3
MC68HC05B4
block diagram A–2
memory map A–3
MC68HC05B6
block diagram 1–3
mask options 1–3
memory map 3–2
pinouts 12–1 12–2 12–3
, ,
, ,
, ,
, ,
, ,
,
,
,
286
Freescale
vi
INDEX
MC68HC05B6
MC68HC05B8 B–1
block diagram B–2
memory map B–3
MC68HC705B16 E–1
block diagram E–2
memory map E–3
MC68HC705B16N F–1
block diagram F–2
memory map F–3
MC68HC705B32 H–3
block diagram H–4
memory map H–5
MC68HC705B5 C–1
block diagram C–2
memory map C–3
mechanical dimensions 12–4 12–5 12–6
memory map
MC68HC05B16 D–5
MC68HC05B32 G–3
MC68HC05B4 A–3
MC68HC05B6 3–2
MC68HC05B8 B–3
MC68HC705B16 E–3
MC68HC705B16N F–3
MC68HC705B32 H–5
MC68HC705B5 C–3
Miscellaneous register
INTE 3–9 9–9
INTP, INTN 3–9 9–9
POR 3–9 9–2
SFA 3–10 7–3
SFB 3–10 7–3
SM 2–9 3–10 7–3
WDOG 3–10 9–4
modes of operation
jump to any address 2–4
low power modes 2–6
single chip mode 2–1
,
,
,
,
,
,
,
,
,
,
N
NF – Noise error flag 6–17
nonmaskable software interrupt 9–6
O
OCF1 – Output compare flag 2 5–6
OCF2 – Output compare flag 2 5–7
OCIE – Output compares interrupt enable 5–4
OLV1 – Output level 1 5–5
OLV2 – Output level 2 5–5
Options register
SEC H–12
options register
EE1P H–12
EPP C–7
PBPD C–8
MC68HC05B6
PCPD C–8
RTIM C–7
RWAT C–7
WWAT C–7
OPTR – options register 3–6 C–7
EE1P – EEPROM protection bit 3–7
SEC – Security bit 3–7
OR – Overrun error flag 6–17
oscillator connections 2–12 D–4
Output compare registers
OCR1 5–9
OCR2 5–10
,
,
P
,
,
,
,
,
parallel bootstrap E–13 E–19 F–13 H–16
PBPD – Port B pull-down E–8 F–8
PBPD – Port B pull-down resistors C–8
PCPD – Port C pull-down E–8 F–9
PCPD – Port C pull-down resistors C–8
pin configurations 12–1
pins
IRQ 2–10
OSC1, OSC2 2–11
PA0–PA7, PB0–PB7, PC0–PC7 2–13
PD0/AN0–PD7/AN7 2–13
PLMA, PLMB 2–13
RDI, TDO 2–13
RESET 2–10 9–3
SCLK 2–13
TCAP1 2–10
TCAP2 2–11
TCMP1, TCMP2 2–11
VDD, VSS 2–10
VPP1 2–13
VRH, VRL 2–13
PLCC 12–1
PLM 5–11
block diagram 7–1
clock selection 7–4
PLMA, PLMB 7–2
POR – Power-on reset bit 3–9 9–2
port registers
PORTA, PORTB 4–4
PORTC 4–4
PORTD 4–5
PORTD – Port D data register 8–3
ports
A and B 4–2
C 4–3
D 4–3
power-on reset 9–2
programmable timer
block diagram 5–2
Pulse 5–11
pulse length modulation 5–11
registers
PLMA, PLMB 5–11
,
,
INDEX
Freescale
vii
pulse length modulation registers
PLMA, PLMB 5–11
Q
QFP 12–2
R
R8 – Receive data bit 8 6–11
RAM 3–1
RDI 6–6
RDRF – Receive data register full flag 6–16
RE – receiver enable 6–15
receive data in 6–6
receiver 6–3
register outline 3–8
registers 3–1
RESET 9–3, E–5, F–5
reset timing diagram 9–1
resets 9–1
RIE – receiver interrupt enable 6–14
ROM 3–1
RTIM – Reset time C–7 E–8 F–8
RVU 13–2
RWAT – Watchdog after reset C–7 E–8 F–8
RWU – receiver wake-up 6–15
,
,
,
,
,
SBK – Send break 6–15
SCI
block diagram 6–2
receiver 6–3
sampling technique 6–7
synchronous transmission 6–9
transmitter 6–3
two-wire system 6–1
SCI interrupts 9–10
SCI registers
BAUD 6–18
SCCR1 6–10
SCCR2 6–14
SCDR 6–10
SCSR 6–16
SCP1, SCP0 – Serial prescaler select bits 6–18
SCR2, SCR1, SCR0 – SCI rate select bits 6–19
SCT2, SCT1, SCT0 – SCI rate select bits 6–18
SDIP 12–3
SEC – Secure bit E–9 F–9 H–12
self-check mode A–5
self-check ROM 3–2
serial bootstrap E–16
Serial communications control register 1 6–10
CPHA 6–12
CPOL 6–12
,
,
,
,
,
,
,
S
Freescale
viii
LBCL 6–13
M 6–11
R8 6–11
T8 6–11
WAKE 6–11
Serial communications control register 2
ILIE 6–14
RE 6–15
RIE 6–14
RWU 6–15
SBK 6–15
TCIE 6–14
TE 6–14
TIE 6–14
Serial communications data register 6–10
Serial communications status register
FE 6–17
IDLE 6–16
NF 6–17
OR 6–17
RDRF 6–16
TC 6–16
TDRE 6–16
serial RAM loader 2–2 F–16 H–19
SFA – Slow or fast mode selection for PLMA 3–10 7–3
SFB – Slow or fast mode selection for PLMB 3–10 7–3
single chip mode 2–1
SLOW 2–9
SM – Slow mode 3–10 7–3
SM – slow mode selection bit 2–9
start bit detection 6–6
STOP 2–6 3–7 5–12 6–21 7–4 8–6 9–4
,
,
,
,
,
T
T8 – transmit data bit 8 6–11
TC – Transmit complete flag 6–16
TCIE – Transmit complete interrupt enable 6–14
TDO 6–8
TDRE – Transmit data register empty flag 6–16
TE – Transmitter enable 6–14
TIE – Transmit interrupt enable 6–14
Timer control register
IEDG1 5–5
OCIE 5–4
OLV1 5–5
OLV2 5–5
TOIE 5–4
timer interrupts 9–10
timer state diagrams 5–12
Timer status register
ICF1 5–6
ICF2 5–7
OCF1 5–6
OCF2 5–7
TOF 5–6
TOF – Timer overflow status flag 5–6
TOIE – Timer overflow interrupt enable 5–4
transmit data out 6–8
INDEX
MC68HC05B6
transmitter 6–3
TSR – Timer status register 5–6
V
verification media 13–2
W
,
,
,
,
,
,
WAIT 2–8 3–7 5–12 6–21 7–4 8–6 9–4
WAKE – Wake-up mode select 6–11
wake-up
address mark 6–6
idle line 6–6
receiver 6–5
WDOG – Watchdog enable/disable 3–10 9–4
WWAT – Watchdog during WAIT mode C–7 E–8 F–8
,
MC68HC05B6
,
,
INDEX
Freescale
ix
THIS PAGE LEFT BLANK INTENTIONALLY
Freescale
x
INDEX
MC68HC05B6
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SECTION 1 INTRODUCTION
SECTION 2 MODES OF OPERATION AND PIN DESCRIPTIONS
SECTION 3 MEMORY AND REGISTERS
SECTION 4 INPUT/OUTPUT PORTS
SECTION 5 PROGRAMMABLE TIMER
SECTION 6 SERIAL COMMUNICATIONS INTERFACE
SECTION 7 PULSE LENGTH D/A CONVERTERS
SECTION 8 ANALOG TO DIGITAL CONVERTER
SECTION 9 RESETS AND INTERRUPTS
SECTION 10 CPU CORE AND INSTRUCTION SET
SECTION 11 ELECTRICAL SPECIFICATIONS
SECTION 12 MECHANICAL DATA
SECTION 13 ORDERING INFORMATION
SECTION 14 APPENDICES
SECTION 15 HIGH SPEED OPERATION
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288
INTRODUCTION
1
MODES OF OPERATION AND PIN DESCRIPTIONS
2
MEMORY AND REGISTERS
3
INPUT/OUTPUT PORTS
4
PROGRAMMABLE TIMER
5
SERIAL COMMUNICATIONS INTERFACE
6
PULSE LENGTH D/A CONVERTERS
7
ANALOG TO DIGITAL CONVERTER
8
RESETS AND INTERRUPTS
9
CPU CORE AND INSTRUCTION SET
10
ELECTRICAL SPECIFICATIONS
11
MECHANICAL DATA
12
ORDERING INFORMATION
13
APPENDICES
14
HIGH SPEED OPERATION
15
TPG
289
1
INTRODUCTION
2
MODES OF OPERATION AND PIN DESCRIPTIONS
3
MEMORY AND REGISTERS
4
INPUT/OUTPUT PORTS
5
PROGRAMMABLE TIMER
6
SERIAL COMMUNICATIONS INTERFACE
7
PULSE LENGTH D/A CONVERTERS
8
ANALOG TO DIGITAL CONVERTER
9
RESETS AND INTERRUPTS
10
CPU CORE AND INSTRUCTION SET
11
ELECTRICAL SPECIFICATIONS
12
MECHANICAL DATA
13
ORDERING INFORMATION
14
APPENDICES
15
HIGH SPEED OPERATION
TPG
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