APL3534/A/B Compact, Small Package 1A Power-Distribution Switches General Description Features • • • • • • • • • • • • High Side N-MOSFET with Internal Charge Pump 1A Continuous Current The APL3534/A/B is a power-distribution switch with current- limiting function and output OVP protections that can Built-in Soft-Start Wide Supply Voltage Range deliver current up to 1A. The device incorporates a 110mΩ N-channel MOSFET power switch. Current-Limit and Short-Circuit Protections Input Voltage Under Voltage Lockout Protection The device integrates some protection features, including current-limit protection, output over-voltage protection, Reverse Current Blocking when Switch Disabled Output OVP Protection over-temperature protection and UVLO. The current-limit protection can protect down-stream devices from cata- Reverse Current-Limit Protection Output Discharge strophic failure by limiting the output current at currentlimit threshold during over-load or short-circuit events. Over-Temperature Protection Lead Free and Green Devices Available (RoHS The output over-voltage protection can prevent current flowing from VOUT to VIN when an abnormally high volt- Compliant) age exists in VOUT. The over-temperature protection function shuts down the N-channel MOSFET power switch o when the junction temperature rises beyond 140 C and will automatically turns on the power switch when the o temperature drops by 20 C. The UVLO function keeps the power switch in off state until there is a valid input Applications • • • HDMI Port Protection Switches voltage present. The device is available in lead free SOT-23-3 and Bluetooth Protection Switches SOT-23-5 packages. High-side Power Protection Switches Pin Configuration Simplified Application Circuit GND 1 VIN VOUT 3 VIN VOUT 2 APL3534 APL3534 SOT-23-3 GND VIN GND 1 EN 2 VOUT 3 5 NC 4 VIN APL3534A SOT-23-5 VOUT APL3534A/B 5 NC GND 1 ENB 2 VOUT 3 EN/ENB GND 4 VIN APL3534B SOT-23-5 ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.4 - Oct., 2013 1 www.anpec.com.tw APL3534/A/B Ordering and Marking Information Enable Function Blank : No Enable Function A : Active High B : Active Low Package Code A : SOT-23-3 B : SOT-23-5 Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device APL3534 Assembly Material Handling Code Temperature Range Package Code Enable Function APL3534 A: L34X X - Date Code APL3534A B: L34AX X - Date Code APL3534B B: L34BX X - Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Absolute Maximum Ratings Symbol VIN VOUT VEN, VENB TJ TSTG TSDR (Note 1) Rating Unit VIN to GND Voltage Parameter -0.3 ~ 6.5 V VOUT to GND Voltage -0.3 ~ 6.5 V EN, ENB to GND Voltage -0.3 ~ 6.5 Maximum Junction Temperature -40 ~ 150 o -65 ~ 150 o 260 o Storage Temperature Maximum Lead Soldering Temperature (10 Seconds) V C C C Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Characteristics Symbol θJA (Note 2) Parameter Typical Value Junction-to-Ambient Resistance in free air (SOT-23-3, SOT-23-5) Unit o 260 C/W Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2013 2 www.anpec.com.tw APL3534/A/B Recommended Operating Conditions (Note 3) Symbol Parameter VIN VIN Input Voltage IOUT OUT Output Current TA Ambient Temperature TJ Range Unit 2.7~ 5.4 V 0~1 Junction Temperature A -40 ~ 85 o -40 ~ 125 o C C Note 3: Refer to the typical application circuit. Electrical Characteristics o VIN=5V, VEN=5V or VENB=0V and TA=25 C (unless otherwise noted). Symbol Parameter APL3534/A/B Test Conditions Unit Min. Typ. Max. 2.35 2.5 2.65 V - 0.1 - V UNDER-VOLTAGE LOCKOUT VIN UVLO Threshold Voltage VIN rising VIN UVLO Hysteresis SUPPLY CURRENT IVIN VIN Supply Current No load, VEN = High (or VENB = Low) - 100 150 µA ISD VIN Shutdown Current No load, VEN = Low (or VENB = High) - - 1 µA OUT Leakage Current VOUT tied to ground, VEN =Low (or VENB = High) - - 1 µA OUT Input Current VOUT=5V, VIN = 0V, no matter VEN = Low or High - - 1 µA VIN=5V, IOUT=1A, TJ=25oC - 110 140 mΩ VIN=5V, IOUT=1A, TJ=-40~125oC - - 175 mΩ VIN=3.3V, IOUT=1A, TJ=25oC - 120 155 mΩ - - 195 mΩ TJ=25oC, 1.3 1.6 1.9 A TJ=-40~125oC 1.05 - - A VOUT<1.2V (This function is disabled during soft start interval) 0.3 0.6 1 A VOUT - VIN=1V, TJ=25oC 0.3 0.5 0.7 A - 0.7 - ms 5.5 5.75 6 V - 20 - µs 1 2.5 4 ms POWER SWITCH RDS(ON) Power Switch On Resistance o VIN=3.3V, IOUT=1A, TJ=-40~125 C CURRENT-LIMIT PROTECTIONS ILIM ISHORT Current-Limit Threshold Short-Circuit Output Current OUTPUT OVER-VOLTAGE PROTECTS IRV tRVDEG Reverse Current Blocking Threshold Reverse Current Blocking Deglitch Time Guaranteed by Design VOVP Output OVP Threshold TOVD Output OVP Delay Time SOFT-START CONTROL PIN tSS Soft-Start Time Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2013 VIN=5V, VOUT=10% to 90% 3 www.anpec.com.tw APL3534/A/B Electrical Characteristics (Cont.) o VIN=5V, VEN=5V or VENB=0V and TA=25 C (unless otherwise noted). Symbol Parameter APL3534/A/B Test Conditions Unit Min. Typ. Max. - 40 - Ω Input Logic High 2 - - V Input Logic Low - - 0.8 V OUTPUT DISCHARGE AND ENABLE VOUT Discharge Resistance VEN, VENB VIN=5V, VEN=Low(or VENB=High), VOUT=1V EN, ENB Input Current VEN=5V or VENB=5V - - 1 µA EN, ENB Leakage VEN=0V or VENB=0V - - 1 µA TJ rising - 140 - °C - 20 - °C OUTPUT TEMPERATURE PROTECTION (OTP) TOTP Over-Temperature Threshold Over-Temperature Hysteresis Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2013 4 www.anpec.com.tw APL3534/A/B Pin Description PIN FUNCTION NO. NAME SOT-23-3 SOT-23-5 1 1 GND 2 3 VOUT 3 4 VIN - 2 EN/ENB - 5 NC Ground. Output Voltage Pin. The output voltage follows the input voltage. When EN is low or VIN is UVLO, the output voltage is discharged by an internal resistor. Power Supply Input Connect this pin to external DC supply. Pulling the ENB above 2V or EN below 0.8V will disable the device, and pulling ENB pin below 0.8V or EN above 2V will enable the device. The EN and ENB pins cannot be left floating. Not Connected Internally. Block Diagram VOUT VIN UVLO Charge Pump Current- Limit & Short Current Limit Gate Driver and Control Logic OVP EN / ENB (SOT-23-5) OTP GND Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2013 5 www.anpec.com.tw APL3534/A/B Typical Application Circuit SOT-23-5 SOT-23-3 VIN 0.1µF 3 VIN VOUT 2 APL3534 VIN VOUT 0.1µF 4 VIN VOUT 3 VOUT 0.1µF 0.1µF APL3534A GND On 1 Off 2 EN GND 1 SOT-23-5 VIN 4 3 VIN VOUT VOUT 0.1µF 0.1µF APL3534B Off On 2 ENB GND 1 Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2013 6 www.anpec.com.tw APL3534/A/B Function Description VIN Under-voltage Lockout (UVLO) Output Over-Voltage Protection The APL3534/A/B power switch has a built-in under-volt- The output over-voltage protection is implemented by 2 either sensing mechanisms. One is by sensing when age lockout circuit to keep the output shut off until internal circuitry is operating properly. The UVLO circuit has hys- VOUT voltage is above VOVP threshold, the internal power MOSFET is turned off. The other is by sensing when re- teresis and a de-glitch feature so that it will typically ignore undershoot transients on the input. When input volt- verse current, flowing from VOUT to VIN, surpasses IRV. When the reverse current reachers the reverse current age exceeds the UVLO threshold, the output voltage starts a soft-start to reduce the inrush current. Blocking threshold, the device limits the reveres current at IRV threshold level. When the reverse current fault ex- Power Switch ists for more than 0.7ms, the internal power MOSFET is turned off. The internal power MOSFET is allowed to turn- The power switch is an N-channel MOSFET with a low RDS(ON). The internal power MOSFET does not have the on once the output voltage gose below VIN-1.2V. body diode. When IC is in UVLO state, the MOSFET prevents a current flowing from the VOUT back to VIN and Output Discharge VIN to VOUT. When the input voltage is under VIN UVLO Threshold or VEN=Low or VENB=High, the output discharge device is Current-Limit Protection The APL3534/A/B power switch provides the current-limit protection function. During current-limit, the devices limit turned on to discharge the output voltage. output current at current-limit threshold. For reliable operation, the device should not be operated in current- Enable/Disable (SOT-23-5) limit for extended period time. the device, and pulling ENB pin below 0.8V or EN above 2V will enable the device. Short-Circuit Protection When the output voltage drops below 1.2V, which is When the IC is disabled the supply current is reduced to less than 1µA. The enable input is compatible with both caused by the over load or short-circuit, the devices limit the output current down to a safe level. The short-circuit TTL and CMOS logic levels. The EN/ENB pins cannot be left floating. current-limit is used to reduce the power dissipation during short-circuit condition. If the junction temperature is Over-temperature Protection over the thermal shutdown temperature the device will enter the thermal shutdown. This Function is disabled When the junction temperature exceeds 140 C, the internal thermal sense circuit turns off the power FET and during soft-start interval. allows the device to cool down. When the device’s junco tion temperature cools by 20 C, the internal thermal sense Soft-Start circuit will enable the device, resulting in a pulsed output during continuous thermal protection. Thermal protec- Pulling the ENB above 2V or EN below 0.8V will disable o The APLA3534/A/B has a built-in output soft-start control tion is designed to protect the IC in the event of overtemperature conditions. For normal operation, the junc- to limit the current surge during start-up. The soft-start interval is 2.5ms. Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2013 tion temperature cannot exceed TJ=+125oC. 7 www.anpec.com.tw APL3534/A/B Application Information Input Capacitor Recommanded Minimum Footprit The APL3534/A/B requires proper input capacitance to supply current surge during stepping load transients to 0.037 0.057 prevent the input voltage rail from dropping. Because the parasitic inductor from the voltage sources or other bulk capacitors to the VIN pin limit the slew rate of the surge currents, more parasitic inductance needs more input 0.102 0.024 capacitance. A ceramic input capacitor (0.1 to 10µF) from VIN to GND, located near the APL3534/A/B, is strongly recommended to suppress the ringing during short circuit fault event. 0.074 Without the input capacitor, the output short may cause sufficient ringing on the input (from supply lead inductance) Unit : Inch SOT-23-3 to damage internal control circuitry. 0.076 Layout Consideration The PCB layout should be carefully performed to maxi- 0.1 mize thermal dissipation and to minimize voltage drop, droop and EMI. The following guidelines must be considered: 0.05 1. Please place the input capacitors near the VIN pin as close as possible. 2. Output decoupling capacitors for load must be placed near the load as close as possible for decoupling highfrequency ripples. 0.038 0.02 Unit : Inch SOT-23-5 3. Locate APL3534/A/B and output capacitors near the load to reduce parasitic resistance and inductance for excellent load transient performance. 4. The negative pins of the input and output capacitors and the GND pin must be connected to the ground plane of the load. 5. Keep VIN and VOUT traces as wide and short as possible. Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2013 8 www.anpec.com.tw APL3534/A/B Package Information SOT-23-3 D e E E1 SEE VIEW A c b 0.25 A L GAUGE PLANE SEATING PLANE 0 A1 A2 e1 VIEW A S Y M B O L SOT-23-3 INCHES MILLIMETERS MIN. MIN. MAX. A MAX. 0.057 1.45 A1 0.00 0.15 0.000 0.006 A2 0.90 1.30 0.035 0.051 b 0.30 0.50 0.012 0.020 c 0.08 0.22 0.003 0.009 D 2.70 3.10 0.106 0.122 E 2.60 3.00 0.102 0.118 E1 1.40 1.80 0.055 e 0.95 BSC e1 0.071 0.037 BSC 1.90 BSC 0.075 BSC L 0.30 0.60 0 0° 8° 0.012 0° 0.024 8° Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2013 9 www.anpec.com.tw APL3534/A/B Package Information SOT-23-5 D e E E1 SEE VIEW A b c 0.25 A L 0 GAUGE PLANE SEATING PLANE A1 A2 e1 VIEW A S Y M B O L SOT-23-5 INCHES MILLIMETERS MIN. A MAX. 0.057 1.45 0.000 0.006 1.30 0.035 0.051 0.50 0.012 0.020 0.22 0.003 0.009 0.122 0.118 0.00 0.15 A2 0.90 b 0.30 c 0.08 A1 MIN. MAX. D 2.70 3.10 0.106 E 2.60 3.00 0.102 E1 1.40 1.80 0.055 e 0.95 BSC e1 0.071 0.037 BSC 1.90 BSC 0.075 BSC L 0.30 0.60 0 0° 8° 0.012 0° 0.024 8° Note : 1. Follow JEDEC TO-178 AA. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2013 10 www.anpec.com.tw APL3534/A/B Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application SOT-23-3 Application SOT-23-5 A H T1 C d D W E1 F 178.0±2.00 50 MIN. 8.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00 -0.40 3.20±0.20 3.10±0.20 1.50±0.20 4.0±0.10 4.0±0.10 A H T1 C d D W E1 F 178.0±2.00 50 MIN. 8.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00 -0.40 3.20±0.20 3.10±0.20 1.50±0.20 (mm) Devices Per Unit Package Type Unit Quantity SOT-23-3 Tape & Reel 3000 SOT-23-5 Tape & Reel 3000 Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2013 11 www.anpec.com.tw APL3534/A/B Taping Direction Information SOT-23-3 USER DIRECTION OF FEED SOT-23-5 USER DIRECTION OF FEED Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2013 12 www.anpec.com.tw APL3534/A/B Classification Profile Supplier Tp≧Tc User Tp≦Tc TC TC -5oC User tp Supplier tp Tp tp Temperature Max. Ramp Up Rate = 3oC/s Max. Ramp Down Rate = 6oC/s TL Tsmax TC -5oC t Preheat Area Tsmin tS 25 Time 25oC to Peak Time Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds 3 °C/second max. 3 °C/second max. 183 °C 60-150 seconds 217 °C 60-150 seconds See Classification Temp in table 1 See Classification Temp in table 2 Time (tP)** within 5°C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time 25°C to peak temperature * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2013 13 www.anpec.com.tw APL3534/A/B Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package Thickness <2.5 mm ≥2.5 mm Volume mm <350 235 °C 220 °C 3 Volume mm ≥350 220 °C 220 °C 3 Table 2. Pb-free Process – Classification Temperatures (Tc) Package Thickness <1.6 mm 1.6 mm – 2.5 mm ≥2.5 mm Volume mm <350 260 °C 260 °C 250 °C 3 Volume mm 350-2000 260 °C 250 °C 245 °C 3 Volume mm >2000 260 °C 245 °C 245 °C 3 Reliability Test Program Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 Description 5 Sec, 245°C 1000 Hrs, Bias @ Tj=125°C 168 Hrs, 100%RH, 2atm, 121°C 500 Cycles, -65°C~150°C VHBM≧2KV VMM≧200V 10ms, 1tr≧100mA Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2013 14 www.anpec.com.tw