Not Recommended for New Designs ISO7230A ISO7231A SLLS906C – MAY 2008 – REVISED JUNE 2011 www.ti.com One Megabit per Second Triple Digital Isolators Check for Samples: ISO7230A, ISO7231A FEATURES 1 • • • • • 1Mbps Signaling Rate – Low Channel-to-Channel Output Skew; 2ns Maximum (5V-Operation) – Low Pulse-Width Distortion (PWD); 10ns Maximum (5V-Operation) Typical 25-Year Life at Rated Working Voltage (See Application note SLLA197 and Figure 10) 4000Vpeak Isolation, 560Vpeak VIORM – UL 1577, IEC 60747-5-2 (VDE 0884, Rev 2), IE 61010-1 and CSA Approved, IEC 60950-1 4kV ESD Protection Operate With 3.3V or 5V Supplies • • High Electromagnetic Immunity (See Application note SLLA181) –40°C to 125°C Operating Range APPLICATIONS • • • • Industrial Fieldbus Computer Peripheral Interface Servo Control Interface Data Acquisition DESCRIPTION See the Product Notification section. The ISO7230A and ISO7231A are triple-channel digital isolators each with multiple channel configurations and output-enable functions. These devices have logic input and output buffers separated by TI’s silicon dioxide (SiO2) isolation barrier. Used in conjunction with isolated power supplies, these devices block high voltage, isolate grounds, and prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. The ISO7230 triple-channel device has all three channels in the same direction while the ISO7231 has two channels in one direction and one channel in opposition. These devices have an active-high output enable that when driven to a low level, places the output in a high-impedance state. The ISO7230A and ISO7231A have TTL input thresholds and a noise-filter at the input that prevents transient pulses of up to 2ns in duration from being passed to the output of the device. In each device a periodic update pulse is sent across the isolation barrier to ensure the proper dc level of the output. If this dc-refresh pulse is not received, the input is assumed to be unpowered or not being actively driven, and the failsafe circuit drives the output to a logic high state. (Contact TI for a logic low failsafe option). These devices require two supply voltages of 3.3V, 5V, or any combination. All inputs are 5V tolerant when supplied from a 3.3V supply and all outputs are 4mA CMOS. These devices are characterized for operation over the ambient temperature range of –40°C to 125°C. ISO7231 DW PACKAGE ISO7230 DW PACKAGE VCC1 GND1 INA INB INC NC NC GND1 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC2 GND2 OUTA OUTB OUTC NC EN GND2 VCC1 GND1 INA INB OUTC NC EN1 GND1 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC2 GND2 OUTA OUTB INC NC EN2 GND2 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2011, Texas Instruments Incorporated Not Recommended for New Designs ISO7230A ISO7231A SLLS906C – MAY 2008 – REVISED JUNE 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. FUNCTION DIAGRAM Galvanic Isolation Barrier DC Channel Filter OSC + PWM Pulse Width Demodulation Vref Carrier Detect EN IN Input + Filter Data MUX AC Detect Vref OUT Output Buffer AC Channel Table 1. Device Function Table ISO723x INPUT VCC PU (1) OUTPUT VCC PU (1) INPUT (IN) OUTPUT ENABLE (EN) OUTPUT (OUT) H H or Open H L H or Open L X L Z Open H or Open H PD PU X H or Open H PD PU X L Z PU = Powered Up; PD = Powered Down ; X = Irrelevant; H = High Level; L = Low Level AVAILABLE OPTIONS PRODUCT SIGNALING RATE INPUT THRESHOLD CHANNEL CONFIGURATION MARKED AS ISO7230ADW 1 Mbps ~1.5V (TTL) (CMOS compatible) 3/0 ISO7230A 1 Mbps ~1.5 V (TTL) (CMOS compatible) 2/1 ISO7231A ISO7231ADW (1) 2 ORDERING NUMBER (1) ISO7230ADW (rail) ISO7230ADWR (reel) ISO7231ADW (rail) ISO7231ADWR (reel) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Copyright © 2008–2011, Texas Instruments Incorporated Not Recommended for New Designs ISO7230A ISO7231A SLLS906C – MAY 2008 – REVISED JUNE 2011 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT VCC Supply voltage (2), VCC1, VCC2 –0.5 to 6 V VI Voltage at IN, OUT, EN –0.5 to 6 V IO Output current ±15 mA ESD Electrostatic Field-Induced-Charged Device discharge Model TJ Maximum junction temperature Human Body Model Machine Model (1) (2) ±4 JEDEC Standard 22, Test Method A114-C.01 JEDEC Standard 22, Test Method C101 All pins ANSI/ESDS5.2-1996 kV ±1 ±200 V 170 °C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal and are peak voltage values. RECOMMENDED OPERATING CONDITIONS MIN TYP MAX VCC Supply voltage (1), VCC1, VCC2 IOH High-level output current IOL Low-level output current tui Input pulse width 1 1/tui Signaling rate 0 VIH High-level input voltage (IN) (EN on all devices) 2 VCC VIL Low-level input voltage (IN) (EN on all devices) 0 0.8 TJ Junction temperature H External magnetic field-strength immunity per IEC 61000-4-8 and IEC 61000-4-9 certification (1) (2) 3.15 5.5 –4 UNIT V mA 4 mA 1000 kbps μs 1500 (2) V 150 °C 1000 A/m For the 5V operation, VCC1 or VCC2 is specified from 4.5V to 5.5V. For the 3V operation, VCC1 or VCC2 is specified from 3.15V to 3.6V. Typical signaling rate under ideal conditions at 25°C. Copyright © 2008–2011, Texas Instruments Incorporated 3 Not Recommended for New Designs ISO7230A ISO7231A SLLS906C – MAY 2008 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: VCC1 and VCC2 at 5V (1) OPERATION over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX VI = VCC or 0V, All channels, no load, EN2 at 3V 1 3 1 3 VI = VCC or 0V, All channels, no load, EN1 at 3V, EN2 at 3V 6.5 11 6.5 11 VI = VCC or 0V, All channels, no load, EN2 at 3V 15 22 16 22 VI = VCC or 0V, All channels, no load, EN1 at 3V, EN2 at 3V 13 20 13 20 UNIT SUPPLY CURRENT Quiescent ISO7230A 1 Mbps ICC1 Quiescent ISO7231A 1 Mbps Quiescent ISO7230A 1 Mbps ICC2 Quiescent ISO7231A 1 Mbps mA mA mA mA ELECTRICAL CHARACTERISTICS IOFF Sleep mode output current EN at 0V, Single channel VCC – 0.8 IOH = –20μA, See Figure 1 VCC – 0.1 VOH High-level output voltage VOL Low-level output voltage VI(HYS) Input voltage hysteresis IIH High-level input current IIL Low-level input current CI Input capacitance to ground IN at VCC, VI = 0.4 sin (4E6πt) CMTI Common-mode transient immunity VI = VCC or 0V, See Figure 4 (1) μA 0 IOH = –4mA, See Figure 1 V IOL = 4mA, See Figure 1 0.4 IOL = 20μA, See Figure 1 0.1 150 mV 10 IN from 0V to VCC –10 25 V μA 2 pF 50 kV/μs For the 5V operation, VCC1 or VCC2 is specified from 4.5V to 5.5V. For the 3V operation, VCC1 or VCC2 is specified from 3.15V to 3.6V. SWITCHING CHARACTERISTICS: VCC1 and VCC2 at 5V OPERATION over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 40 95 tPLH, tPHL Propagation delay PWD Pulse-width distortion (1) |tPHL – tPLH| tsk(o) Channel-to-channel output skew tr Output signal rise time tf Output signal fall time tPHZ Propagation delay, high-level-to-high-impedance output 15 20 tPZH Propagation delay, high-impedance-to-high-level output 15 20 tPLZ Propagation delay, low-level-to-high-impedance output 15 20 tPZL Propagation delay, high-impedance-to-low-level output 15 20 tfs Failsafe output delay time from input power loss (1) (2) 4 See Figure 1 (2) 10 0 See Figure 1 See Figure 2 See Figure 3 2 2 ns ns ns 2 12 UNIT ns μs Also referred to as pulse skew. tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical specified loads. Copyright © 2008–2011, Texas Instruments Incorporated Not Recommended for New Designs ISO7230A ISO7231A SLLS906C – MAY 2008 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: VCC1 at 5V, VCC2 at 3.3V (1) OPERATION over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 1 3 1 3 6.5 11 6.5 11 UNIT SUPPLY CURRENT ISO7230A ICC1 ISO7231A ISO7230A ICC2 ISO7231A Quiescent 1 Mbps Quiescent 1 Mbps Quiescent 1 Mbps Quiescent 1 Mbps VI = VCC or 0V, All channels, no load, EN2 at 3V VI = VCC or 0V, All channels, no load, EN1 at 3V, EN2 at 3V VI = VCC or 0V, All channels, no load, EN2 at 3V VI = VCC or 0V, All channels, no load, EN1 at 3V, EN2 at 3V 9 15 9.5 15 8 12 8 12 mA mA mA mA ELECTRICAL CHARACTERISTICS IOFF Sleep mode output current VOH High-level output voltage EN at 0 V, Single channel IOH = –4mA, See Figure 1 VCC – 0.4 ISO7231 (5-V side) VCC – 0.8 IOH = –20μA, See Figure 1 V VCC – 0.1 IOL = 4mA, See Figure 1 0.4 IOL = 20μA, See Figure 1 0.1 VOL Low-level output voltage VI(HYS) Input voltage hysteresis IIH High-level input current IIL Low-level input current CI Input capacitance to ground IN at VCC, VI = 0.4 sin (4E6πt) CMTI Common-mode transient immunity VI = VCC or 0 V, See Figure 4 (1) μA 0 ISO7230 150 mV 10 IN from 0V to VCC V –10 μA 2 pF 25 50 kV/μs MIN TYP MAX 40 100 For the 5-V operation, VCC1 or VCC2 is specified from 4.5V to 5.5V. For the 3V operation, VCC1 or VCC2 is specified from 3.15 V to 3.6 V. SWITCHING CHARACTERISTICS: VCC1 at 5V, VCC2 at 3.3V OPERATION over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS tPLH, tPHL Propagation delay, low-to-high-level output PWD Pulse-width distortion (1) |tPHL – tPLH| tsk(o) Channel-to-channel output skew tr Output signal rise time tf Output signal fall time tPHZ Propagation delay, high-level-to-high-impedance output 15 20 tPZH Propagation delay, high-impedance-to-high-level output 15 20 tPLZ Propagation delay, low-level-to-high-impedance output 15 20 tPZL Propagation delay, high-impedance-to-low-level output 15 20 tfs Failsafe output delay time from input power loss (1) (2) (2) ISO723xA See Figure 1 ISO723xA 11 0 See Figure 1 See Figure 2 See Figure 3 2.5 2 ns ns ns 2 18 UNIT ns μs Also known as pulse skew tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical specified loads. Copyright © 2008–2011, Texas Instruments Incorporated 5 Not Recommended for New Designs ISO7230A ISO7231A SLLS906C – MAY 2008 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: VCC1 at 3.3V, VCC2 at 5V (1) OPERATION over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 0.5 1 1 2 4.5 7 4.5 7 15 22 16 22 13 20 13 20 UNIT SUPPLY CURRENT Quiescent ISO7230A VI = VCC or 0V, All channels, no load, EN2 at 3V 1 Mbps ICC1 Quiescent ISO7231A VI = VCC or 0V, All channels, no load, EN1 at 3V, EN2 at 3V 1 Mbps Quiescent ISO7230A VI = VCC or 0V, All channels, no load, EN2 at 3V 1 Mbps ICC2 Quiescent ISO7231A VI = VCC or 0V, All channels, no load, EN1 at 3V, EN2 at 3V 1 Mbps mA mA mA mA ELECTRICAL CHARACTERISTICS IOFF Sleep mode output current VOH EN at 0V, Single channel IOH = –4mA, See Figure 1 High-level output voltage VCC – 0.4 ISO7231 (5-V side) VCC – 0.8 IOH = –20μA, See Figure 1 V VCC – 0.1 IOL = 4mA, See Figure 1 0.4 IOL = 20μA, See Figure 1 0.1 VOL Low-level output voltage VI(HYS) Input voltage hysteresis IIH High-level input current IIL Low-level input current CI Input capacitance to ground IN at VCC, VI = 0.4 sin (4E6πt) CMTI Common-mode transient immunity VI = VCC or 0V, See Figure 4 (1) μA 0 ISO7230 150 mV 10 IN from 0V to VCC –10 25 V μA 2 pF 50 kV/μs For 5V operation, VCC1 or VCC2 is specified from 4.5V to 5.5V. For 3V operation, VCC1 or VCC2 is specified from 3.15V to 3.6V. SWITCHING CHARACTERISTICS: VCC1 at 3.3V and VCC2 at 5V OPERATION over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP Propagation delay PWD Pulse-width distortion (1) |tPHL – tPLH| tsk(o) Channel-to-channel output skew tr Output signal rise time tf Output signal fall time tPHZ Propagation delay, high-level-to-high-impedance output 15 20 tPZH Propagation delay, high-impedance-to-high-level output 15 20 tPLZ Propagation delay, low-level-to-high-impedance output 15 20 tPZL Propagation delay, high-impedance-to-low-level output 15 20 tfs Failsafe output delay time from input power loss (1) (2) 6 (2) ISO723xA See Figure 1 ISO723xA 40 MAX tPLH, tPHL 100 11 0 See Figure 1 See Figure 2 See Figure 3 2.5 2 ns ns ns 2 12 UNIT ns μs Also known as pulse skew tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical specified loads. Copyright © 2008–2011, Texas Instruments Incorporated Not Recommended for New Designs ISO7230A ISO7231A SLLS906C – MAY 2008 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: VCC1 and VCC2 at 3.3V (1) OPERATION over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX VI = VCC or 0 V, all channels, no load, EN2 at 3V 0.5 1 1 2 VI = VCC or 0V, all channels, no load, EN1 at 3V, EN2 at 3V 4.5 7 4.5 7 UNIT SUPPLY CURRENT Quiescent ISO7230A 1 Mbps ICC1 Quiescent ISO7231A 1 Mbps Quiescent ISO7230A 1 Mbps ICC2 Quiescent ISO7231A 1 Mbps VI = VCC or 0V, all channels, no load, EN2 at 3V 9 15 9.5 15 8 12 8 12 VI = VCC or 0V, all channels, no load, EN1 at 3V, EN2 at 3V mA mA mA mA ELECTRICAL CHARACTERISTICS IOFF Sleep mode output current EN at 0V, single channel VCC – 0.4 IOH = –20μA, See Figure 1 VCC – 0.1 VOH High-level output voltage VOL Low-level output voltage VI(HYS) Input voltage hysteresis IIH High-level input current IIL Low-level input current CI Input capacitance to ground IN at VCC, VI = 0.4 sin (4E6πt) CMTI Common-mode transient immunity VI = VCC or 0V, See Figure 4 (1) μA 0 IOH = –4mA, See Figure 1 V IOL = 4mA, See Figure 1 0.4 IOL = 20μA, See Figure 1 0.1 150 mV 10 IN from 0V or VCC –10 25 V μA 2 pF 50 kV/μs For 5V operation, VCC1 or VCC2 is specified from 4.5V to 5.5V. For 3V operation, VCC1 or VCC2 is specified from 3.15V to 3.6V. SWITCHING CHARACTERISTICS: VCC1 and VCC2 at 3.3-V OPERATION over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP Propagation delay PWD Pulse-width distortion (1) |tPHL – tPLH| tsk(o) Channel-to-channel output skew tr Output signal rise time tf Output signal fall time tPHZ Propagation delay, high-level-to-high-impedance output 15 20 tPZH Propagation delay, high-impedance-to-high-level output 15 20 tPLZ Propagation delay, low-level-to-high-impedance output 15 20 tPZL Propagation delay, high-impedance-to-low-level output 15 20 tfs Failsafe output delay time from input power loss (1) (2) (2) ISO723xA See Figure 1 ISO723xA 45 MAX tPLH, tPHL 110 12 0 See Figure 1 See Figure 2 See Figure 3 3 2 ns ns ns 2 18 UNIT ns μs Also referred to as pulse skew. tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical specified loads. Copyright © 2008–2011, Texas Instruments Incorporated 7 Not Recommended for New Designs ISO7230A ISO7231A SLLS906C – MAY 2008 – REVISED JUNE 2011 www.ti.com ISOLATION BARRIER PARAMETER MEASUREMENT INFORMATION IN Input Generator VI 50 W NOTE A VCC VI VCC/2 VCC/2 OUT 0V tPHL tPLH CL NOTE B VO VO VOH 90% 50% 50% 10% tr VOL tf A. The input pulse is supplied by a generator having the following characteristics: PRR ≤ 50kHz, 50% duty cycle, tr ≤ 3ns, tf ≤ 3ns, ZO = 50Ω. B. CL = 15 pF and includes instrumentation and fixture capacitance within ±20%. Figure 1. Switching Characteristic Test Circuit and Voltage Waveforms Vcc Vcc ISOLATION BARRIER RL = 1 kW ±1% IN 0V Input Generator VI OUT EN Vcc/2 VI t PZL VO VO CL Vcc/2 0V t PLZ Vcc 0.5 V 50% NOTE B 50 W VOL NOTE A ISOLATION BARRIER 3V Vcc IN Input Generator VI OUT VO Vcc/2 VI Vcc/2 0V t PZH EN 50 W CL NOTE B RL = 1 kW ±1% VO VOH 50% 0.5 V t PHZ 0V NOTE A A. The input pulse is supplied by a generator having the following characteristics: PRR ≤ 50kHz, 50% duty cycle, tr ≤ 3ns, tf ≤ 3ns, ZO = 50Ω. B. CL = 15 pF and includes instrumentation and fixture capacitance within ±20%. Figure 2. Enable/Disable Propagation Delay Time Test Circuit and Waveform 8 Copyright © 2008–2011, Texas Instruments Incorporated Not Recommended for New Designs ISO7230A ISO7231A SLLS906C – MAY 2008 – REVISED JUNE 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VCC 0V or VCC IN ISOLATION BARRIER VI VCC OUT VI 2.7 V VO 0V VOH tfs CL NOTE B VO 50% VOL A. The input pulse is supplied by a generator having the following characteristics: PRR ≤ 50kHz, 50% duty cycle, tr ≤ 3ns, tf ≤ 3ns, ZO = 50Ω. B. CL = 15pF and includes instrumentation and fixture capacitance within ±20%. Figure 3. Failsafe Delay Time Test Circuit and Voltage Waveforms VCC2 VCC1 S1 IN ISOLATION BARRIER C = 0.1 mF± 1% GND1 C = 0.1 mF± 1% OUT NOTE B Pass-fail criteria: Output must remain stable VOH or VOL GND2 VCM A. The input pulse is supplied by a generator having the following characteristics: PRR ≤ 50kHz, 50% duty cycle, tr ≤ 3ns, tf ≤ 3ns, ZO = 50Ω. B. CL = 15 pF and includes instrumentation and fixture capacitance within ±20%. Figure 4. Common-Mode Transient Immunity Test Circuit and Voltage Waveform Copyright © 2008–2011, Texas Instruments Incorporated 9 Not Recommended for New Designs ISO7230A ISO7231A SLLS906C – MAY 2008 – REVISED JUNE 2011 www.ti.com DEVICE INFORMATION PACKAGE CHARACTERISTICS PARAMETER L(I01) L(I02) RIO TEST CONDITIONS MIN TYP MAX UNIT Minimum air gap (Clearance) Shortest terminal-to-terminal distance through air 8.34 mm Minimum external tracking (Creepage) Shortest terminal-to-terminal distance across the package surface 8.1 mm Minimum Internal Gap (Internal Clearance) Distance through the insulation 0.008 mm Isolation resistance Input to output, VIO = 500V, all pins on each side of the barrier tied together creating a two-terminal device, TA < 100°C >1012 Input to output, VIO = 500V, 100°C ≤ TA ≤ TA max >1011 Ω Ω CIO Barrier capacitance Input to output VI = 0.4 sin (4E6πt) 2 pF CI Input capacitance to ground VI = 0.4 sin (4E6πt) 2 pF REGULATORY INFORMATION VDE CSA UL Certified according to IEC 60747-5-2 Approved under CSA Component Acceptance Notice Recognized under 1577 Component Recognition Program (1) File Number: 40016131 File Number: 220991 File Number: E181974 (1) Production tested ≥ 3000 VRMS for 1 second in accordance with UL 1577. DEVICE I/O SCHEMATICS Enable VCC2 VCC2 VCC1 VCC2 1 MW VCC1 VCC1 VCC2 1 MW 500 W EN Output Input IN 500 W 8W OUT 13 W 10 Copyright © 2008–2011, Texas Instruments Incorporated Not Recommended for New Designs ISO7230A ISO7231A SLLS906C – MAY 2008 – REVISED JUNE 2011 www.ti.com THERMAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS Low-K Thermal Resistance θJA Junction-to-air θJB Junction-to-Board Thermal Resistance θJC Junction-to-Case Thermal Resistance PD (1) MIN TYP MAX (1) 168 High-K Thermal Resistance °C/W 96.1 61 °C/W 48 °C/W VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 50% duty cycle square wave Device Power Dissipation UNIT 220 mW Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages. TYPICAL CHARACTERISTIC CURVES INPUT THRESHOLD VOLTAGE vs FREE-AIR TEMPERATURE VCC1 FAILSAFE THRESHOLD vs FREE-AIR TEMPERATURE 1.4 3 5 V Vth+ 2.9 VCC1 - Failsafe Threshold - V Input Voltage Threshold - V 1.35 1.3 3.3 V Vth+ 1.25 1.2 Air Flow at 7 cf/m, Low-K Board 1.15 5 V Vth1.1 2.8 VCC at 5 V or 3.3 V, Load = 15 pF, Air Flow at 7/cf/m, Low-K Board 2.7 Vfs+ 2.6 2.5 Vfs- 2.4 2.3 2.2 1.05 3.3 V Vth1 -40 -25 -10 2.1 5 20 35 50 65 80 TA - Free-Air Temperature - °C 95 110 2 -40 125 -10 5 20 35 50 65 80 95 110 125 TA - Free-Air Temperature - °C Figure 5. Figure 6. HIGH-LEVEL OUTPUT CURRENT vs HIGH-LEVEL OUTPUT VOLTAGE LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE 50 50 VCC = 5 V Load = 15 pF, TA = 25°C Load = 15 pF, TA = 25°C 45 40 IO - Output Current - mA 40 IO - Output Current - mA -25 VCC = 3.3 V 30 20 35 VCC = 3.3 V 30 25 VCC = 5 V 20 15 10 10 5 0 0 0 2 4 VO - Output Voltage - V Figure 7. Copyright © 2008–2011, Texas Instruments Incorporated 6 0 1 2 3 VO - Output Voltage - V 4 5 Figure 8. 11 Not Recommended for New Designs ISO7230A ISO7231A SLLS906C – MAY 2008 – REVISED JUNE 2011 www.ti.com APPLICATION INFORMATION 2 mm max. from VCC1 VCC1 2 mm max. from VCC2 VCC2 0.1 mF 0.1 mF 1 16 2 15 IN A 3 14 OUT A IN B 4 13 OUT B IN C 5 12 OUT C NC 6 11 NC 7 10 8 9 GND2 GND1 NC EN GND2 GND1 ISO7230 Figure 9. Typical ISO7230 Application Circuit LIFE EXPECTANCY vs WORKING VOLTAGE WORKING LIFE -- YEARS 100 VIORM at 560-V 28 Years 10 0 120 250 500 750 880 1000 WORKING VOLTAGE (VIORM) -- V Figure 10. Time Dependant Dielectric Breakdown Testing Results 12 Copyright © 2008–2011, Texas Instruments Incorporated Not Recommended for New Designs ISO7230A ISO7231A SLLS906C – MAY 2008 – REVISED JUNE 2011 www.ti.com PRODUCT NOTIFICATION An ISO723xA anomaly occurs when a negative-going pulse below the specified 1μs minimum bit width is input to the device. The output locks in a logic-low condition until the next rising edge occurs after a 1μs period. Positive noise edges in pulses of less than the minimum specified 1μs have no effect on the device, and are properly filtered. To prevent noise from interfering with ISO723xA performance, it is recommended that an appropriately sized capacitor be placed on each input of the device Figure 11. ISO723xA Anomaly Copyright © 2008–2011, Texas Instruments Incorporated 13 Not Recommended for New Designs ISO7230A ISO7231A SLLS906C – MAY 2008 – REVISED JUNE 2011 www.ti.com REVISION HISTORY Changes from Original (May 2008) to Revision A Page • Added Product Notification section link. ............................................................................................................................... 1 • Deleted text from paragraph 2 of the Description: "and turns off internal bias circuitry to conserve power" ....................... 1 • Deleted Product Preview note .............................................................................................................................................. 2 • Changed From: 3 To: 3.15 .................................................................................................................................................... 3 • Changed VCC From: 3.6 To: 3.45 .......................................................................................................................................... 3 • Changed ICC1 and ICC2 values From: TBD ............................................................................................................................. 4 • Changed VCC – 0.4 To: VCC – 0.8 ......................................................................................................................................... 4 • Changed Typical value from 1 To: 2 ..................................................................................................................................... 4 • Changed Propagation delay max From: 80 To: 95 .............................................................................................................. 4 • Changed ICC1 and ICC2 values From: TBD ............................................................................................................................. 5 • Changed Typical value from 1 To: 2 ..................................................................................................................................... 5 • Changed Propagation delay max From: 80 To: 100 ............................................................................................................ 5 • Changed ICC1 and ICC2 values From: TBD ............................................................................................................................. 6 • Changed Typical value from 1 To: 2 ..................................................................................................................................... 6 • Changed Propagation delay max From: 80 To: 100 ............................................................................................................ 6 • Changed ICC1 and ICC2 values From: TBD ............................................................................................................................. 7 • Changed ............................................................................................................................................................................... 7 • Changed Typical value from 1 To: 2 ..................................................................................................................................... 7 • Changed Propagation delay max From: 85 To: 110 ............................................................................................................ 7 • Changed L(101) Minimum air gap (Clearance) - minimum value from: 7.7mm to: 8.34mm .............................................. 10 • Changed Typical value from 1 To: 2 ................................................................................................................................... 10 • Changed Typical value from 1 To: 2 ................................................................................................................................... 10 • Changed the REGULATORY INFORMATION Table ......................................................................................................... 10 • Changed Figure 11 ............................................................................................................................................................. 13 Changes from Revision A (June 2008) to Revision B • Page Changed VCC From: 3.45 To: 3.6 .......................................................................................................................................... 3 Changes from Revision B (July 2008) to Revision C Page • Changed "1ns" to "2ns", added "(5v-Operation)" .................................................................................................................. 1 • Changed "2ns" to "10ns", added "(5v-Operation)" ................................................................................................................ 1 • Deleted "Low Jitter Content; 1 ns Typ at 150 Mbps" ............................................................................................................ 1 • Deleted Min = 4.5 V and max = 5.5 V for Supply Voltage of the ROC Table. ..................................................................... 3 • Changed VCC From: 3.6 To: 5.5 ............................................................................................................................................ 3 • Corrected Figure 1 ................................................................................................................................................................ 8 • Changed File number "1698195" to "220991" .................................................................................................................... 10 • Corrected DEVICE I/O SCHEMATICS ............................................................................................................................... 10 • Corrected Figure 9 .............................................................................................................................................................. 12 14 Copyright © 2008–2011, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) ISO7230ADW NRND SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 ISO7230A ISO7230ADWG4 NRND SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 ISO7230A ISO7230ADWR NRND SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 ISO7230A ISO7230ADWRG4 NRND SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 ISO7230A ISO7231ADW NRND SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 ISO7231A ISO7231ADWG4 NRND SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 ISO7231A ISO7231ADWR NRND SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 ISO7231A ISO7231ADWRG4 NRND SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 ISO7231A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant ISO7230ADWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 ISO7231ADWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ISO7230ADWR SOIC DW 16 2000 367.0 367.0 38.0 ISO7231ADWR SOIC DW 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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