Material Content Data Sheet Sales Product Name ESD206-B1-02EL E6327 MA# MA001124098 Package PG-TSLP-2-19 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip non noble metal noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material noble metal noble metal noble metal < 10% tin gold silicon nickel copper carbon black epoxy resin silicondioxide gold palladium gold 7440-31-5 7440-57-5 7440-21-3 7440-02-0 7440-50-8 1333-86-4 60676-86-0 7440-57-5 7440-05-3 7440-57-5 leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 Weight [mg] 0.60 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.000 0.06 587 0.001 0.23 2272 0.010 1.68 1.97 16841 19700 0.241 40.43 40.43 404286 404286 0.003 0.44 0.44 4445 4445 0.002 0.28 2770 0.048 8.03 0.280 47.08 55.39 470802 553885 0.010 1.75 1.75 17506 17506 0.000 0.01 0.000 0.01 80313 69 0.02 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com Sum [ppm] 109 178 1000000