MASW6020G GaAs SPST Switch DC - 6.0 GHz Rev. V5 Features Pad Layout Low Insertion Loss, 0.6 dB Typical @ 1.0 GHz Fast Switching Speed, 10 ns Typical Ultra Low DC Power Consumption Integral Static Protection 100% Matte Tin Plating over Copper Halogen-Free “Green” Mold Compound RoHS* Compliant Description The MASW6020G is a GaAs MMIC SPST switch die. This die is ideally used where low power consumption is required. Typical applications include transmit / receive switching, switch matrices and switched filter banks, WLAN IEEE 802.11a and 802.11 b/g systems. Other applications include cordless phones and base stations. Die Size - Inches (mm) 0.05 x 0.03 x 0.004 (1.270 x 0.770 x 0.250) Bond Pad Dimensions Ordering Information Part Number Package MASW6020G DIE 1 1. Die quantity varies. Absolute Maximum Rating 2,3 Bond Pad Dimensions - Inches (mm) RF1, RF2 0.004 x 0.008 (0.100 x 0.200) Alt RF 0.004 x 0.005 (0.100 x 0.125) A, B 0.004 x 0.004 (0.100 x 0.100) GND1 0.012 x 0.007 (0.300 x 0.175) Parameter Absolute Maximum GND2 0.009 x 0.008 (0.225 x 0.200) Control Value (A/B) -8.5 VDC Term 0.004 x 0.008 (0.100 x 0.200) Max Input RF Power +34 dBm (500 MHz - 4 GHz) Storage Temperature -65°C to +175°C Operating Temperature +175°C Schematic 2. Exceeding any one or combination of these limits may cause permanent damage to this device. 3. M/A-COM Technology Solutions does not recommend sustained operation near these survivability limits. *Restrictions on Hazardous Substances, European Union Directive 2002/95/EC. 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW6020G GaAs SPST Switch DC - 6.0 GHz Rev. V5 Electrical Specifications: 0 / -5 V Parameter Test Conditions Units Min. Typ. Max. Insertion Loss DC - 1.0 GHz DC - 2.0 GHz DC - 6.0 GHz L/T/H L/T/H L/T/H dB — — — 0.8 /1.0/0.9 0.9/1.1/1.0 2.5/2.7/2.5 — — — Isolation DC - 1.0 GHz DC - 2.0 GHz DC - 6.0 GHz L/T/H L/T/H L/T/H dB — — — 30/63/64 22/46/52 11/14/19 — — — VSWR DC - 1.0 GHz DC - 2.0 GHz DC - 6.0 GHz L/T/H L/T/H L/T/H Ratio — — — 1.1:1/1.1:1/1.1:1 1.3:1/1.2:1/1.1:1 2.0:1/2.7:1/2.0:1 — — — dBm — — +27 / +33 +21 / +26 — — dBm — — +68 +62 — — dBm — — +46 +40 — — Input P1dB Above 500 MHz - 0/-5V / 0/-8V 100 MHz - 0/-5V / 0/-8V IP2 Two Tone Input Power up to +5 dBm Above 500 MHz 100 MHz IP3 Two Tone Input Power up to +5 dBm Above 500 MHz 100 MHz Control Current VIN Low (0 to –0.2 V) VOUT High (-5 V @ 50 µA Typ to –8 V) µA — — — — 20 300 T-rise, T-fall 10% to 90% RF and 90% to 10% RF ns — 10 — TON, TOFF 50% control to 90% RF, and 50% control to 10% RF ns — 10 — Transients (In Band) mV — 10 — Truth Table 4,5 Option T L H 4. 5. Control Voltage Switch Condition & Bonding A B RF1 RF2 1 0 on on G G 0 1 off off G G 1 0 on on G G 0 1 off off G G 1 0 on on G G 0 1 off off G G ALT Ground Bonds GND1 GND2 Term Differential voltage, V (state 1) -V (state 2), must be 2.5 V minimum. 0 = 0 to –0.2 V, 1 = -5 V @ 10 µA typical to -8 V. 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW6020G GaAs SPST Switch DC - 6.0 GHz Rev. V5 Typical Performance Insertion Loss VSWR 3.0 2.5 Low Loss Terminated Low Loss Reflective High Isolation 2.0 Low Loss Terminated Low Loss Reflective High Isolation 2.5 1.5 2.0 1.0 1.5 0.5 1.0 0.0 0 1 2 3 4 5 6 Frequency (GHz) 0 1 2 3 4 5 6 Frequency (GHz) Isolation 90 80 Low Loss Terminated Low Loss Reflective High Isolation 70 60 50 40 30 20 10 0 1 2 3 4 5 6 Frequency (GHz) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW6020G GaAs SPST Switch DC - 6.0 GHz Rev. V5 Handling Precautions Mounting Permanent damage to the MASW6020G may occur if the following precautions are not adhered to: A. Cleanliness—MASW6020G should be handled in a clean environment. DO NOT attempt to clean unit after the MASW6020G is installed. B. Static Sensitivity—All chip handling equipment and personnel should be DC grounded. C. Transient—Avoid instrument and power supply transients while bias is applied to the MASW6020G. Use shielded signal and bias cables to minimize inductive pick-up. D. Bias—Apply voltage to either of the complementary control ports only when the other is grounded. No port should be allowed to “float”. E. General Handling—It is recommended that the MASW6020G chip be handled along the long side of the die with a sharp pair of bent tweezers. DO NOT touch the surface of the chip with fingers or tweezers. The MASW6020G is back-metallized with Pd/Ni/Au (100/1,000, 10,000 Å) metallization. It can be diemounted with AuSn eutectic preforms or with thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A. A 80/20 gold/tin preform is recommended with a work surface temperature of approximately 255°C and a tool temperature of 265°C. When not 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be approximately 290°C. B. DO NOT expose the MASW6020G to a temperature greater than 320°C for more than 20 seconds. No more than 3 seconds for scrubbing should be required for attachment. Handling Procedures Epoxy Die Attach: A. Apply a minimum amount of epoxy and place the MASW6020G into position. A thin epoxy fillet should be visible around the perimeter of the chip. B. Cure epoxy per manufacturer’s recommended schedule. C. Electrically conductive epoxy may be used by is not required. Please observe the following precautions to avoid damage: Wire Bonding Static Sensitivity Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. A. Ball or wedge with 1.0 mil diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150°C and a ball bonding force of 40 to 50 grams or wedge bonding force o1 18 to 22 grams is recommended. Ultrasonic energy and time should be adjusted to the minimum levels achieve reliable wirebonds. B. Wirebonds should be started on the chip and terminated on the package. 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.