1-, 2- and 4-Channel Low Capacitance ESD Protection Arrays CM1213A Features • • • • • • • • One, two, and four channels of ESD protection Note: For 6- and 8-channel devices, see the CM1213 datasheet. Provides ESD protection to IEC61000-4-2 Level 4 • ±8kV contact discharge Low channel input capacitance of 0.85pF typical Minimal capacitance change with temperature and voltage Channel input capacitance matching of 0.02pF typical is ideal for differential signals Zener diode protects supply rail and eliminates the need for external by-pass capacitors Each I/O pin can withstand over 1000 ESD strikes* Available in SOT, SC70, and MSOP RoHScompliant, lead-free packages Applications • • • • • • USB2.0 ports at 480Mbps in desktop PCs, notebooks and peripherals IEEE1394 Firewire ports at 400Mbps / 800Mbps DVI ports, HDMI ports in notebooks, set top boxes, digital TVs, LCD displays Serial ATA ports in desktop PCs and hard disk drives PCI Express ports General purpose high-speed data line ESD protection Product Description The CM1213A family of diode arrays has been designed to provide ESD protection for electronic components or subsystems requiring minimal capacitive loading. These devices are ideal for protecting systems with high data and clock rates or for circuits requiring low capacitive loading. Each ESD channel consists of a pair of diodes in series which steer the positive or negative ESD current pulse to either the positive (VP) or negative (VN) supply rail. A Zener diode is embedded between VP and VN, offering two advantages. First, it protects the VCC rail against ESD strikes, and second, it eliminates the need for a bypass capacitor that would otherwise be needed for absorbing positive ESD strikes to ground. The CM1213A will protect against ESD pulses up to 8kV per the IEC 61000-4-2 standard. These devices are particularly well-suited for protecting systems using high-speed ports such as USB 2.0, IEEE1394 (Firewire, iLink ), Serial ATA, DVI, HDMI and corresponding ports in removable storage, digital camcorders, DVD-RW drives and other applications where extremely low loading capacitance with ESD protection are required in a small package footprint. The CM1213A family of devices is available with RoHS-compliant, lead-free finishing. Block Diagram ©2010 SCILLC. All rights reserved. April 2010 – Rev. 5 Publication Order Number: CM1213A/D CM1213A Package/Pinout Diagrams Pin Descriptions 1-CHANNEL, 3-LEAD SOT23-3 PACKAGE (CM1213A-01SO) PIN NAME TYPE 1 CH1 I/O 2 VP 3 VN DESCRIPTION ESD Channel 1 CH1 I/O PWR Positive voltage supply rail 2 VN GND GND Negative voltage supply rail 3 CH2 I/O 4 CH3 I/O 5 VP PWR 6 CH4 I/O 2-CHANNEL, 4-LEAD SOT143-4 PACKAGE (CM1213A-02SR) PIN 4-CH, 6-LEAD SOT23-6 (CM1213A-04SO) AND SC70-6 (CM1213A04S7) PIN NAME TYPE DESCRIPTION NAME TYPE DESCRIPTION 1 VN GND 2 CH1 I/O ESD Channel PIN NAME TYPE 3 CH2 I/O ESD Channel 1 CH1 I/O 4 VP PWR Positive voltage supply rail 2 NC 3 VP PWR I/O Negative voltage supply rail CH2 5 NC No Connect 6 CH3 Negative voltage supply rail 7 NC I/O ESD Channel 8 VN GND I/O ESD Channel 9 CH4 I/O Positive voltage supply rail 10 NC TYPE 1 NC 2 VN GND 3 CH1 4 CH2 5 VP PWR ESD Channel Positive voltage supply rail ESD Channel Rev. 5 | Page 2 of 14 | www.onsemi.com DESCRIPTION ESD Channel No Connect 4 NAME ESD Channel 4-CHANNEL, 10-LEAD MSOP-10 PACKAGE (CM1213A04MR) DESCRIPTION 2-CHANNEL, 5-LEAD SOT23-5 PACKAGE (CM1213A-02SO) PIN ESD Channel Negative voltage supply rail Positive voltage supply rail ESD Channel No Connect I/O ESD Channel No Connect Negative voltage supply rail ESD Channel No Connect CM1213A Ordering Information PART NUMBERING INFORMATION Lead-free Finish 1 # of Channels Leads Package Ordering Part Number Part Marking 1 3 SOT23-3 CM1213A-01SO D231 2 4 SOT143-4 CM1213A-02SR D232 2 5 SOT23-5 CM1213A-02SO D233 4 6 SOT23-6 CM1213A-04SO D234 4 6 SC70-6 CM1213A-04S7 D38 4 10 MSOP-10 CM1213A-04MR D237 Note 1: Parts are shipped in Tape and Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Operating Supply Voltage (VP - VN) RATING UNITS 6.0 V Operating Temperature Range –40 to +85 °C Storage Temperature Range –65 to +150 °C (VN - 0.5) to (VP + 0.5) V DC Voltage at any channel input STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Package Power Rating SOT23-3, SOT143-4,SOT23-5, SOT23-6, and SC70-6 Packages MSOP-10 Package Rev. 5 | Page 3 of 14 | www.onsemi.com RATING UNITS –40 to +85 °C 225 400 mW mW CM1213A ELECTRICAL OPERATING CHARACTERISTICS SYMBOL PARAMETER (SEE NOTE 1) CONDITIONS MIN TYP MAX UNITS 3.3 5.5 V 8.0 µA 0.80 0.80 0.95 0.95 V V 0.1 1.0 µA 1.2 pF VP Operating Supply Voltage (VP-VN) IP Operating Supply Current (VP-VN)=3.3V VF Diode Forward Voltage Top Diode Bottom Diode IF = 8mA; TA=25°C ILEAK Channel Leakage Current TA=25°C; VP=5V, VN=0V CIN Channel Input Capacitance At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; Note 2 0.85 ∆C Channel Input Capacitance Matching At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; Note 2 0.02 VESD ESD Protection - Peak Discharge Voltage at any channel input, in system Contact discharge per IEC 61000-4-2 standard TA=25°C; Notes 2, 3, and 4 Channel Clamp Voltage Positive Transients Negative Transients TA=25°C, IPP = 1A, tP = 8/20µS; Notes 2 and 4 +10 –1.7 V V Dynamic Resistance Positive Transients Negative Transients IPP = 1A, tP = 8/20µS Any I/O pin to Ground; Notes 2 and 4 0.9 0.5 Ω Ω 0.60 0.60 IN VCL RDYN Note 1: All parameters specified at TA = –40°C to +85°C unless otherwise noted. Note 2: Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded. Note 3: These measurements performed with no external capacitor on VP (VP floating). Rev. 5 | Page 4 of 14 | www.onsemi.com pF kV 8 CM1213A Performance Information Input Channel Capacitance Performance Curves Rev. 5 | Page 5 of 14 | www.onsemi.com CM1213A Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V) Figure 2. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V) Rev. 5 | Page 6 of 14 | www.onsemi.com CM1213A Application Information Design Considerations In order to realize the maximum protection against ESD pulses, care must be taken in the PCB layout to minimize parasitic series inductances on the Supply/Ground rails as well as the signal trace segment between the signal input (typically a connector) and the ESD protection device. Refer to Error! Reference source not found., which illustrates an example of a positive ESD pulse striking an input channel. The parasitic series inductance back to the power supply is represented by L1 and L2. The voltage VCL on the line being protected is: VCL = Fwd + L2 x d(IESD) / dt voltage drop of D1 + VSUPPLY + L1 x d(IESD) / dt where IESD is the ESD current pulse, and VSUPPLY is the positive supply voltage. An ESD current pulse can rise from zero to its peak value in a very short time. As an example, a level 4 contact discharge per the IEC61000-4-2 standard results in a current pulse that rises from zero to 30 Amps in 1ns. Here -9 d(IESD)/dt can be approximated by ∆IESD/∆t, or 30/(1x10 ). So just 10nH of series inductance (L1 and L2 combined) will lead to a 300V increment in VCL! Similarly for negative ESD pulses, parasitic series inductance from the VN pin to the ground rail will lead to drastically increased negative voltage on the line being protected. The CM1213A has an integrated Zener diode between VP and VN. This greatly reduces the effect of supply rail inductance L2 on VCL by clamping VP at the breakdown voltage of the Zener diode. However, for the lowest possible VCL, especially when VP is biased at a voltage significantly below the Zener breakdown voltage, it is recommended that a 0.22µF ceramic chip capacitor be connected between VP and the ground plane. As a general rule, the ESD Protection Array should be located as close as possible to the point of entry of expected electrostatic discharges. The power supply bypass capacitor mentioned above should be as close to the VP pin of the Protection Array as possible, with minimum PCB trace lengths to the power supply, ground planes and between the signal input and the ESD device to minimize stray series inductance. Additional Information See also California Micro Devices Application Note AP209, “Design Considerations for ESD Protection,” in the Applications section at www.calmicro.com. Figure 3. Application of Positive ESD Pulse Between Input Channel and Ground Rev. 5 | Page 7 of 14 | www.onsemi.com CM1213A Mechanical Details The CM1213A is available in SOT23-3, SOT143-4, and SOT23-5, SOT23-6, SC70-6, and MSOP-10 lead-free packages. SOT23-3 Mechanical Specifications, 3 pin The CM1213A-01SO is supplied in a 3-pin SOT23 package. Dimensions are presented below. PACKAGE DIMENSIONS Package SOT23-3 (JEDEC name is TO-236) JEDEC No. TO-236 (Var. AB) Pins/Leads 3 Dimensions Millimeters Inches Min Max Min Max A 0.89 1.12 0.0350 0.0441 A1 0.01 0.10 0.0004 0.0039 b 0.30 0.50 0.0118 0.0197 c 0.08 0.20 0.0031 0.0079 D 2.80 3.04 0.1102 0.1197 E 2.10 2.64 0.0827 0.1039 E1 1.20 1.40 0.0472 0.0551 e 0.95 BSC 0.0374 BSC e1 1.90 BSC 0.0748 BSC L L1 # per tape and reel 0.40 0.60 0.54 REF 0.0157 0.0236 0.0213 REF 3000 pieces Package Dimensions for SOT23-3 Controlling dimension: millimeters Rev. 5 | Page 8 of 14 | www.onsemi.com CM1213A Tape and Reel Specifications PART NUMBER PACKAGE SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1213A-01SO 2.92 X 2.37 X 1.01 2.77 X 3.15 X 1.22 8mm 178mm (7") 3000 4mm 4mm Rev. 5 | Page 9 of 14 | www.onsemi.com CM1213A Mechanical Details (Cont’d) SOT143-4 Mechanical Specifications, 4 pin The CM1213A-02SR is packaged in a 4-pin SOT143 package. Dimensions are presented below. PACKAGE DIMENSIONS Package SOT143 Pins 4 Dimensions Millimeters Inches Min Max Min Max A 0.80 1.22 0.031 0.048 A1 0.05 0.15 0.002 0.006 b 0.30 0.50 0.012 0.019 b2 0.76 0.89 0.030 0.035 c 0.08 0.20 0.003 0.008 D 2.80 3.04 0.110 0.119 E 2.10 2.64 0.082 0.103 E1 1.20 1.40 0.047 0.055 e 1.92 BSC 0.075 BSC e1 0.20 BSC 0.008 BSC L L1 # per tape and reel 0.4 0.6 0.54 REF 0.016 0.024 0.021 REF 3000 pieces Package Dimensions for SOT143 Controlling dimension: millimeters Rev. 5 | Page 10 of 14 | www.onsemi.com CM1213A Tape and Reel Specifications PART NUMBER PACKAGE SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1213A-02SR 2.92 X 2.37 X 1.01 2.60 X 3.15 X 1.20 8mm 178mm (7") 3000 4mm 4mm Rev. 5 | Page 11 of 14 | www.onsemi.com CM1213A Mechanical Details (cont’d) SOT23-5 Mechanical Specifications, 5 pin The CM1213A-02SO is supplied in a 5-pin SOT23 package. DImensions are presented below. * PACKAGE DIMENSIONS Package SOT23-5 JEDEC No. MO-178 (Var. AA) Leads 5 Millimeters Dim. Inches Min Nom Max Min Nom Max A 1.14 1.24 1.35 0.045 0.049 0.053 A1 0.05 0.10 0.15 0.002 0.004 0.006 A2 1.09 1.14 1.19 0.043 0.045 0.047 b 0.30 0.35 0.40 0.012 0.014 0.016 c 0.08 0.15 0.22 0.003 0.006 0.009 D 2.87 2.92 2.97 0.113 0.115 0.117 E 2.67 2.79 2.92 0.105 0.110 0.115 E1 1.55 1.63 1.68 0.061 0.064 0.066 e 0.95 REF 0.020 REF e1 1.90 REF 0.075 REF L 0.35 0.40 0.45 0.014 0.016 0.018 L1 0.53 0.58 0.64 0.021 0.023 0.025 # per tape and reel Package Dimensions for SOT23-5 3000 pieces Controlling dimension: millimeters Rev. 5 | Page 12 of 14 | www.onsemi.com CM1213A Tape and Reel Specifications PART NUMBER PACKAGE SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1213A-02SO 2.92 X 2.79 X 1.24 3.20 X 3.20 X 1.40 8mm 178mm (7") 3000 4mm 4mm Rev. 5 | Page 13 of 14 | www.onsemi.com CM1213 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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