MC10H332 Dual Bus Driver/Receiver with 4−to−1 Output Multiplexers Description http://onsemi.com The MC10H332 is a Dual Bus Driver/Receiver with four−to−one output multiplexers. These multiplexers have common selects and output enable. When disabled, (OE = high) the bus outputs go to −2.0 V. The parameters specified are with 25 W loading on the bus drivers and 50 W loads on the receivers. MARKING DIAGRAMS* MC10H352P AWLYYWWG Features • Propagation Delay, 1.5 ns Typical Data−to−Output • Improved Noise Margin 150 mV (Over Operating Voltage and • • • Temperature Range) Voltage Compensated MECL 10K™ Compatible Pb−Free Packages are Available* PDIP−20 P SUFFIX CASE 738 1 20 DIP & PLLC PIN ASSIGNMENT VCC 1 20 VCC02 XBUS 2 19 YBUS X0 3 18 OE X1 4 17 Y0 X2 5 16 Y1 X3 6 15 Y2 S0 7 14 Y3 S1 8 13 RE XIN 9 12 YIN VEE 10 11 VCC01 10H332G AWLYYWW 20 1 PLLC−20 FN SUFFIX CASE 775 A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. Pin assignment is for Dual−in−Line Package.. ORDERING INFORMATION NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. Receiver outputs are terminated through a 50 W resistor to −2.0 Vdc. Bus outputs are terminated through a 25 W resistor to −2.0 Vdc. See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 7 1 Publication Order Number: MC10H332/D MC10H332 Table 1. MAXIMUM RATINGS Symbol Rating Unit VEE Power Supply (VCC = 0) Characteristic −8.0 to 0 Vdc VI Input Voltage (VCC = 0) 0 to VEE Vdc Iout Output Current 50 100 mA TA Operating Temperature Range 0 to +75 °C Tstg Storage Temperature Range − Plastic − Ceramic −55 to +150 −55 to +165 °C °C − Continuous − Surge Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1) 0° Symbol IE IinH Characteristic Power Supply Current Input Current High Pins 3,4,5,6,14, 15,16,17 Pins 7,8 Pins 13, 18 25° 75° Min Max Min Max Min Max Unit − 115 − 110 − 115 mA mA − − − 667 437 456 − − − 417 273 285 − − − 417 273 285 0.5 − 0.5 − 0.3 − mA IinL Input Current Low VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc VIH High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc VIL Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc 1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. Outputs are terminated through a 50 W resistor to −2.0 V. Table 3. AC PARAMETERS 0° Symbol tpd Characteristic Propagation Delay Data−to−Bus Output Select−to−Bus Output OE−to−Bus Output Bus−to−Receiver Select−to−Receiver RE−to−Receiver Data−to−Receiver 25° 75° Min Max Min Max Min Max 0.8 3.0 0.8 3.0 0.8 3.2 0.8 0.8 0.8 1.8 0.8 1.3 3.4 2.4 2.1 4.5 2.2 4.0 0.8 0.8 0.8 1.8 0.8 1.3 3.4 2.4 2.1 4.5 2.2 4.0 0.8 0.8 0.8 1.8 0.8 1.3 3.8 2.6 2.4 5.0 2.5 4.5 Unit ns tr Rise Time 0.5 2.0 0.5 2.0 0.5 2.1 ns tf Fall Time 0.5 2.0 0.5 2.0 0.5 2.1 ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. http://onsemi.com 2 MC10H332 Table 4. MULTIPLEXER TRUTH TABLE OE S1 S0 XBus YBus H L L L L X L L H H X L H L H −2.0V X0 X1 X2 X3 −2.0V Y0 Y1 Y2 Y3 Table 5. RECEIVER TRUTH TABLE RE Xin Yin H L L XBus L YBus LOGIC DIAGRAM OE 18 X0 3 X1 4 X2 5 X3 6 S0 7 S1 8 Y0 17 Y1 16 Y2 15 Y3 14 XIN 9 RE 13 YIN 12 2 XBUS 19 YBUS VCC VCC01 VCC02 VEE = = = = PIN 1 PIN 11 PIN 20 PIN 10 ORDERING INFORMATION Package Shipping † MC10H332FN PLLC−20 46 Units / Rail MC10H332FNG PLLC−20 (Pb−Free) 46 Units / Rail MC10H332FNR2 PLLC−20 500 / Tape & Reel MC10H332FNR2G PLLC−20 (Pb−Free) 500 / Tape & Reel MC10H332P PDIP−20 18 Unit / Rail MC10H332PG PDIP−20 (Pb−Free) 18 Unit / Rail Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 3 MC10H332 PACKAGE DIMENSIONS 20 LEAD PLLC CASE 775−02 ISSUE E 0.007 (0.180) M T L−M B Y BRK −N− U N S 0.007 (0.180) M T L−M S S N S D −L− −M− Z W 20 D 1 V 0.007 (0.180) M T L−M S N S R 0.007 (0.180) M T L−M S N S Z T L−M S N H J 0.007 (0.180) M T L−M S −T− VIEW S SEATING PLANE F 0.007 (0.180) M T L−M S VIEW S N S N S K 0.004 (0.100) G S S K1 E G1 0.010 (0.250) S T L−M S VIEW D−D A C 0.010 (0.250) G1 X NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 4 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2_ 10 _ 0.310 0.330 0.040 −−− MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2_ 10 _ 7.88 8.38 1.02 −−− N S MC10H332 PACKAGE DIMENSIONS PDIP−20 P SUFFIX PLASTIC DIP PACKAGE CASE 738−03 ISSUE E −A− 20 11 1 10 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. B L C −T− K SEATING PLANE G M N E F D J 0.25 (0.010) 20 PL 0.25 (0.010) 20 PL M T A M T B M M DIM A B C D E F G J K L M N INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 MECL 10H and MECL 10K are trademarks of Motorola, Inc. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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