MC74AC153, MC74ACT153 Dual 4−Input Multiplexer The MC74AC153/74ACT153 is a high−speed dual 4−input multiplexer with common select inputs and individual enable inputs for each section. It can select two lines of data from four sources. The two buffered outputs present data in the true (non−inverted) form. In addition to multiplexer operation, the MC74AC153/74ACT153 can act as a function generator and generate any two functions of three variables. • Outputs Source/Sink 24 mA • ′ACT153 Has TTL Compatible Inputs w These devices are available in Pb−free package(s). Specifications herein apply to both standard and Pb−free devices. Please see our website at www.onsemi.com for specific Pb−free orderable part numbers, or contact your local ON Semiconductor sales office or representative. VCC Eb S0 I3b I2b I1b I0b Zb 16 15 14 13 12 11 10 9 http://onsemi.com DIP−16 N SUFFIX CASE 648 16 1 16 1 16 1 2 3 4 5 6 7 8 Ea S1 I3a I2a I1a I0a Za GND Figure 1. Pinout: 16−Lead Packages Conductors (Top View) 16 PIN ASSIGNMENT PIN FUNCTION I0a−I3a Side A Data Inputs I0b−I3b Side B Data Inputs S0, S1 Common Select Inputs Ea Side A Enable Input Eb Side B Enable Input Za Side A Output Zb Side B Output 1 1 SO−16 D SUFFIX CASE 751B TSSOP−16 DT SUFFIX CASE 948F EIAJ−16 M SUFFIX CASE 966 ORDERING INFORMATION Device Package Shipping MC74AC153N PDIP−16 25 Units/Rail MC74ACT153N PDIP−16 25 Units/Rail MC74AC153D SOIC−16 48 Units/Rail MC74ACT153D SOIC−16 48 Units/Rail MC74AC153DR2 SOIC−16 2500 Tape & Reel MC74ACT153DR2 SOIC−16 2500 Tape & Reel MC74AC153DT TSSOP−16 96 Units/Rail MC74ACT153DT TSSOP−16 96 Units/Rail MC74AC153DTR2 TSSOP−16 2500 Tape & Reel MC74AC153M EIAJ−16 50 Units/Rail MC74ACT153M EIAJ−16 50 Units/Rail MC74AC153MEL EIAJ−16 2000 Tape & Reel MC74ACT153MEL EIAJ−16 2000 Tape & Reel DEVICE MARKING INFORMATION See general marking information in the device marking section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2006 March, 2006 − Rev. 7 1 Publication Order Number: MC74AC153/D MC74AC153, MC74ACT153 TRUTH TABLE Select Inputs Inputs (a or b) Output S0 S1 E I0 I1 I2 I3 Z X L L H X L L L H L L L X L H X X X X L X X X X X X X X L L H L H L L H H L H H H H L L L L L X X X X X H X X X X X L H X X X X X L H H L H L H H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial http://onsemi.com 2 MC74AC153, MC74ACT153 FUNCTIONAL DESCRIPTION S0 The MC74AC153/74ACT153 is a dual 4−input multiplexer. It can select two bits of data from up to four sources under the control of the common Select inputs (S0, S1). The two 4−input multiplexer circuits have individual active−LOW Enables (Ea,Eb) which can be used to strobe the outputs independently. When the Enables (Ea, Eb) are HIGH, the corresponding outputs (Za, Zb) are forced LOW. The MC74AC153/74ACT153 is the logic implementation of a 2−pole, 4−position switch, where the position of the switch is determined by the logic levels supplied to the two Select inputs. The logic equations for the outputs are shown below. Za = Ea•(I0a•S1•S0+I1a•S1•S0+I2a•S1•S0+I3a•S1•S0) Zb = Eb•(I0b•S1•S0+I1b•S1•S0+I2b•S1•S0+I3b•S1•S0) Ea I0a I1a I2a I3a I0b I1b I2b I3b Eb S1 Za Zb Figure 2. Logic Symbol Ea I0a I1a I2a I3a S1 S0 I0b Za NOTE: I2b I1b Zb This diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. Figure 3. Logic Diagram http://onsemi.com 3 I3b Eb MC74AC153, MC74ACT153 MAXIMUM RATINGS* Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) −0.5 to +7.0 V VIN DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V VOUT DC Output Voltage (Referenced to GND) −0.5 to VCC +0.5 V IIN DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC VCC or GND Current per Output Pin ±50 mA Tstg Storage Temperature −65 to +150 °C *Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs tr, tf Input Rise and Fall Time (Note 2) ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range IOH IOL Min Typ Max ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 − VCC VCC @ 3.0 V − 150 − VCC @ 4.5 V − 40 − VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − VCC @ 5.5 V − 8.0 − Unit V V ns/V ns/V − − 140 °C −40 25 85 °C Output Current − High − − −24 mA Output Current − Low − − 24 mA 1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. http://onsemi.com 4 MC74AC153, MC74ACT153 DC CHARACTERISTICS Symbol Parameter VCC (V) 74AC 74AC TA = +25°C TA = −40°C to +85°C Typ Unit Conditions Guaranteed Limits VIH Minimum High Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 5.5 − ±0.1 5.5 − 5.5 5.5 VOL Maximum Low Level Output Voltage IIN Maximum Input Leakage Current IOLD †Minimum Dynamic Output Current IOHD ICC Maximum Quiescent Supply Current V *VIN = VIL or VIH −12 mA IOH −24 mA −24 mA IOUT = 50 mA V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA ±1.0 mA VI = VCC, GND − 75 mA VOLD = 1.65 V Max − − −75 mA VOHD = 3.85 V Min − 8.0 80 mA VIN = VCC or GND *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. http://onsemi.com 5 V IOUT = −50 mA MC74AC153, MC74ACT153 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol VCC* (V) Parameter 74AC 74AC TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay Sn to Zn 3.3 5.0 2.5 2.0 9.5 6.5 15.0 11.0 2.5 2.0 17.5 12.5 ns 3−6 tPHL Propagation Delay Sn to Zn 3.3 5.0 3.0 2.5 8.5 6.5 14.5 11.0 2.5 2.0 16.5 12.0 ns 3−6 tPLH Propagation Delay En to Zn 3.3 5.0 2.5 1.5 8.0 5.5 13.5 9.5 2.0 1.5 16.0 11.0 ns 3−6 tPHL Propagation Delay En to Zn 3.3 5.0 2.5 2.0 7.0 5.0 11.0 8.0 2.0 1.5 12.5 9.0 ns 3−6 tPLH Propagation Delay In to Zn 3.3 5.0 2.5 1.5 7.5 5.5 12.5 9.0 2.0 1.5 14.5 10.5 ns 3−5 tPHL Propagation Delay In to Zn 3.3 5.0 1.5 1.5 7.0 5.0 11.5 8.5 1.5 1.5 13.0 10.0 ns 3−5 *Voltage Range 3.3 V is 3.3 V ±0.3 V. *Voltage Range 5.0 V is 5.0 V ±0.5 V. DC CHARACTERISTICS Symbol Parameter VCC (V) 74ACT 74ACT TA = +25°C TA = −40°C to +85°C Typ Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 − − 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 − − 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA VOL Maximum Low Level Output Voltage V V IOUT = −50 mA *VIN = VIL or VIH −24 mA IOH −24 mA IOUT = 50 mA IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA VI = VCC, GND DICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V IOLD †Minimum Dynamic Output Current 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80 mA VIN = VCC or GND IOHD ICC Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 6 MC74AC153, MC74ACT153 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol VCC* (V) Parameter 74ACT 74ACT TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay Sn to Zn 5.0 3.0 7.0 11.5 2.0 13.5 ns 3−6 tPHL Propagation Delay Sn to Zn 5.0 3.0 7.0 11.5 2.5 13.5 ns 3−6 tPLH Propagation Delay En to Zn 5.0 2.0 6.5 10.5 2.0 12.5 ns 3−6 tPHL Propagation Delay En to Zn 5.0 3.0 6.0 9.5 2.5 11.0 ns 3−6 tPLH Propagation Delay In to Zn 5.0 2.5 5.5 9.5 2.0 11.0 ns 3−5 tPHL Propagation Delay In to Zn 5.0 2.0 5.5 9.5 2.0 11.0 ns 3−5 *Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 65 pF VCC = 5.0 V MARKING DIAGRAMS DIP−16 SO−16 MC74AC153N AWLYYWW AC153 AWLYWW MC74ACT153N AWLYYWW ACT153 AWLYWW A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week http://onsemi.com 7 TSSOP−16 EIAJ−16 AC 153 ALYW 74AC153 ALYW ACT 153 ALYW 74ACT153 ALYW MC74AC153, MC74ACT153 PACKAGE DIMENSIONS PDIP−16 N SUFFIX 16 PIN PLASTIC DIP PACKAGE CASE 648−08 ISSUE R −A− 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. B F C DIM A B C D F G H J K L M S L S SEATING PLANE −T− K H G D M J 16 PL 0.25 (0.010) M T A M INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 SO−16 D SUFFIX 16 PIN PLASTIC SOIC PACKAGE CASE 751B−05 ISSUE J −A− 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S http://onsemi.com 8 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC74AC153, MC74ACT153 PACKAGE DIMENSIONS TSSOP−16 DT SUFFIX 16 PIN PLASTIC TSSOP PACKAGE CASE948F−01 ISSUE O 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S K ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. 8 1 N 0.15 (0.006) T U S 0.25 (0.010) A −V− M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE D DETAIL E H G EIAJ−16 M SUFFIX 16 PIN PLASTIC EIAJ PACKAGE CASE966−01 ISSUE O 16 LE 9 Q1 E HE 1 M_ L 8 Z DETAIL P D e VIEW P A A1 b 0.13 (0.005) c M 0.10 (0.004) http://onsemi.com 9 DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 0.78 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.031 MC74AC153, MC74ACT153 Notes http://onsemi.com 10 MC74AC153, MC74ACT153 Notes http://onsemi.com 11 MC74AC153, MC74ACT153 Notes ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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