ON NL27WZ32 Dual 2−input or gate Datasheet

NL27WZ32
Dual 2−Input OR Gate
The NL27WZ32 is a high performance dual 2−input OR Gate
operating from a 1.65 V to 5.5 V supply.
Features
•
•
•
•
•
•
•
•
•
•
Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V
Designed for 1.65 V to 5.5 V VCC Operation
Over Voltage Tolerant Inputs
LVTTL Compatible − Interface Capability With 5 V TTL Logic with
VCC = 3 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Replacement for NC7WZ32
Chip Complexity: FET = 120
Pb−Free Package is Available
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MARKING
DIAGRAM
8
8
1
L4 M G
G
US8
US SUFFIX
CASE 493
1
LR
M
G
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
A1
1
8
VCC
B1
2
7
Y1
Y2
3
6
B2
GND
*Date Code orientation may vary depending upon
manufacturing location.
ORDERING INFORMATION
See detailed ordering and shipping information in the
package dimensions section on page 4 of this data sheet.
IEEE/IEC
5
4
w1
A1
B1
A2
Y1
A2
B2
Y2
Figure 1. Pinout
Figure 2. Logic Symbol
PIN ASSIGNMENT
FUNCTION TABLE
Pin
Function
Input
1
A1
2
B1
A
B
Y
3
Y2
L
L
L
4
GND
L
H
H
5
A2
H
L
H
6
B2
H
H
H
7
Y1
8
VCC
© Semiconductor Components Industries, LLC, 2006
April, 2006 − Rev. 6
Output
Y=A+B
1
Publication Order Number:
NL27WZ32/D
NL27WZ32
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
*0.5 to )7.0
V
VI
DC Input Voltage
*0.5 to )7.0
V
VO
DC Output Voltage
*0.5 to )7.0
V
IIK
DC Input Diode Current
VI < GND
*50
mA
IOK
DC Output Diode Current
VO < GND
*50
mA
IO
DC Output Sink Current
$50
mA
ICC
DC Supply Current per Supply Pin
$100
mA
IGND
DC Ground Current per Ground Pin
$100
mA
TSTG
Storage Temperature Range
*65 to )150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature under Bias
qJA
Thermal Resistance
PD
Power Dissipation in Still Air at 85°C
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
V
ILatch−Up
Latch−Up Performance
Above VCC and Below GND at 85°C (Note 5)
$500
mA
(Note 1)
260
°C
)150
°C
250
°C/W
250
mW
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Supply Voltage
VI
Input Voltage
VO
Output Voltage
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
Min
Max
Unit
1.65
1.5
5.5
5.5
V
(Note 6)
0
5.5
V
(HIGH or LOW State)
0
VCC
V
*40
)85
°C
0
0
0
0
20
20
10
5
ns/V
Operating
Data Retention Only
VCC = 1.8 V $0.15 V
VCC = 2.5 V $0.2 V
VCC = 3.0 V $0.3 V
VCC = 5.0 V $0.5 V
6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
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2
NL27WZ32
DC ELECTRICAL CHARACTERISTICS
VCC
Symbol
Parameter
Condition
(V)
Min
0.75 VCC
0.7 VCC
VIH
HIGH Level Input Voltage
1.65 to 1.95
VIL
LOW Level Input Voltage
1.65 to 1.95
2.3 to 5.5
VOH
HIGH Level Output Voltage
VIN = VIH
VOL
Low−Level Output Voltage
VIN = VIL
TA = −405C to
+855C
TA = +255C
Typ
Max
Min
Max
0.75 VCC
0.7 VCC
0.3 VCC
V
0.3 VCC
IOH = −100 mA
1.65
2.3
3.0
4.5
1.55
2.2
2.9
4.4
1.65
2.3
3.0
4.5
1.55
2.2
2.9
4.4
IOH = −4 mA
IOH = −8 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65
2.3
3.0
3.0
4.5
1.29
1.9
2.4
2.3
3.8
1.52
2.15
2.8
2.68
4.2
1.20
1.9
2.4
2.3
3.8
IOL = 100 mA
1.65
2.3
3.0
4.5
0
0
0
0
0.1
0.1
0.1
0.1
IOH = 4 mA
IOH = 8 mA
IOH = 16 mA
IOH = 24 mA
IOH = 32 mA
1.65
2.3
3.0
3.0
4.5
0.08
0.1
0.15
0.22
0.22
0.24
0.3
0.4
0.55
0.55
V
$0.1
$1.0
VIN or VOUT = 5.5 V
0.0
1.0
10
VIN = VCC or GND
5.5
1.0
10
Input Leakage Current
VIN = VCC or GND
IOFF
Power OFF Leakage Current
ICC
Quiescent Supply Current
V
V
0 to 5.5
IIN
Unit
mA
mA
AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns
VCC
Symbol
tPLH
Parameter
Propagation Delay
(Figure 3 and 4)
tPHL
*405C v TA v 855C
TA = 255C
Condition
(V)
Min
Typ
Max
Min
Max
Unit
RL = 1 MW, CL = 15 pF
1.8 $ 0.15
2.5 $ 0.2
2.0
1.0
8.0
3.5
9.5
5.8
2.0
1.0
10.5
6.2
ns
RL = 1 MW, CL = 15 pF
3.3 $ 0.3
0.8
2.6
3.9
0.8
4.3
1.2
3.2
4.8
1.2
5.2
0.5
1.9
3.1
0.5
3.3
0.8
2.5
3.7
0.8
4.0
RL = 500 W, CL = 50 pF
RL = 1 MW, CL = 15 pF
5.0 $ 0.5
RL = 500 W, CL = 50 pF
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
Typical
Unit
CIN
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
2.5
pF
CPD
Power Dissipation Capacitance
(Note 7)
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
9
pF
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
11
7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NL27WZ32
tf = 3 ns
tf = 3 ns
90%
INPUT
A and B
50%
VCC
90%
50%
10%
10%
tPHL
INPUT
OUTPUT
GND
RL
tPLH
CL
VOH
OUTPUT Y
50%
50%
A 1−MHz square input wave is recommended for
propagation delay tests.
VOL
Figure 3. Switching Waveform
Figure 4. Test Circuit
DEVICE ORDERING INFORMATION
Device Order Number
NL27WZ32US
NL27WZ32USG
Package Type
Tape and Reel Size†
US8
178 mm, 3000 Units / Tape & Reel
US8
(Pb−Free)
178 mm, 3000 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NL27WZ32
PACKAGE DIMENSIONS
US8
US SUFFIX
CASE 493−02
ISSUE B
−X−
A
8
−Y−
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
J
DETAIL E
B
L
1
4
R
S
G
P
U
C
−T−
SEATING
PLANE
D
0.10 (0.004)
M
H
0.10 (0.004) T
K
N
R 0.10 TYP
T X Y
V
M
F
DETAIL E
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0_
6_
5_
10 _
0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.126
0_
6_
5_
10 _
0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
SOLDERING FOOTPRINT*
3.8
0.15
0.50
0.0197
1.8
0.07
0.30
0.012
1.0
0.0394
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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NL27WZ32/D
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