Datasheet Single-Output LDO Regulators 35V Withstand Voltage 1A LDO Regulators BDxxFC0 series ●Description The BDxxFC0 series are low-saturation regulators. The series’ output voltages are Variable, 3.0V, 3.3V, 5.0V, 6.0V, 7.0V, 8.0V, 9.0V, 10.0V, 12.0V and 15.0V and packages are HTSOP-J8, TO252-3, and TO252-5. This series has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits and a thermal shutdown circuit that protects the IC from thermal damage due to overloading. (Typ) (Typ) (Max) 4.90mm x 6.00mm x 1.00mm ●Packages HTSOP-J8 ●Key Specifications 1) Output current capability: 1A 2) Output voltage: Variable, 3.0V, 3.3V, 5.0V, 6.0V, 7.0V, 8.0V, 9.0V, 10.0V, 12.0V and 15.0V 3) High output voltage accuracy (Ta=25℃): ±1% 4) Low saturation with PDMOS output 5) Built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits 6) Built-in thermal shutdown circuit for protecting the IC from thermal damage due to overloading 7) Available Ceramic Capacitor to prevent oscillation 8) HTSOP-J8, TO252-3 and TO252-5 packages TO252-3 6.50mm x 9.50mm x 2.50mm TO252-5 6.50mm x 9.50mm x 2.50mm ●Features ・Output Voltage: 1.0V to 15.0V ・Output Voltage Precision(Ta=25℃): ±1% VO+1.0V to 26.5V ・Supply Voltage(VO≧3.0V): ・Supply Voltage(VO＜3.0V): 4.0V to 26.5V ・Output Current: 1A ・Operating Temperature Range: -25℃≦Ta≦+85℃ ●Ordering part number B Part Number D x x Output voltage 00: Variable 30: 3.0V 33: 3.3V 50: 5.0V 60: 6.0V 70: 7.0V 80: 8.0V 90: 9.0V J0: 10.0V J2: 12.0V J5: 15.0V F C 0 W x x x - E2 Input Output Voltage Current Shutdown Mode Package Packaging and forming specification F:35V “W”: Included shutdown mode None: Without shutdown mode EFJ: HTSOP-J8 FP: TO252-3/5 E2: Emboss tape reel C0:1.0A 〇Product structure : Silicon monolithic integrated circuit .www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ●Lineup Articles パッケージ Variable 3.0 3.3 5.0 6.0 7.0 8.0 9.0 10.0 12.0 15.0 BDxxFC0WEFJ-E2 ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ HTSOP-J8 Reel of 2500 BDxxFC0FP-E2 - - ○ ○ - - - - - - - TO252-3 Reel of 2000 BDxxFC0WFP-E2(Note 1) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ TO252-5 Reel of 2000 (Note 1) under development except for Variable ●Typical Application Circuits 〈Output Voltage Variable Type (With shutdown SW)〉 Vcc Vcc Vo R1 CIN EN COUT FB GND R2 Figure 1. Typical Application Circuit Output Voltage Variable Type(With shutdown SW) 〈Output Voltage Fixed Type (With Shutdown SW)〉 Vcc Vcc Vo CIN COUT EN GND Figure 2. Typical Application Circuit Output Voltage Fixed Type(With shutdown SW) 〈Output Voltage Fixed Type (Without Shutdown SW)〉 Vcc Vcc Vo CIN COUT GND Figure 3. Typical Application Circuit Output Voltage Fixed Type (Without Shutdown SW) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ●Pin Configuration/Pin Description HTSOP-J8 (TOP VIEW) 〈With Shutdown SW (HTSOP-J8)〉 Vo 1 8 Vcc FB/N.C. 2 7 N.C GND 3 6 N.C N.C 4 5 EN Figure 4. Pin Configuration (With Shutdown SW) Pin No. 1 2 3 4 5 6 7 8 Exposed PAD Pin name Vo FB / N.C. (Note 1) GND N.C. (Note 1) EN N.C. (Note 1) N.C. (Note 1) VCC Pin Function Output pin Feedback pin (Variable Output Type) No Connection (Fixed Output Type) GND pin No Connection (Connect to GND or leave OPEN) Enable pin No Connection (Connect to GND or leave OPEN) No Connection (Connect to GND or leave OPEN) Power supply pin GND Substrate(Connect to GND) (Note 1) N.C. Pin can be open, because it is not connected to the IC. 〈Without Shutdown SW (TO252-3)〉 TO252-3 (TOP VIEW) 1 2 3 Figure 5. Pin Description (Without Shutdown SW) Pin No. Pin Name Pin Function 1 Vcc Power Supply Pin 2 N.C. (Note 1) No Connection (leave OPEN) 3 Vo Output Pin FIN GND GND (Note 1) N.C.Pin can be open since it is not connected inside of IC. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series 〈With Shutdown SW (TO252-5)〉 TO252-5 (TOP VIEW) 1 2 3 4 5 Figure 6. Pin Configuration (With Shutdown SW) Pin No. Pin Name Pin Function 1 EN Enable Pin 2 Vcc Power Supply Pin 3 N.C. (Note 1) No Connection (leave OPEN) 4 Vo Output Pin 5 FB N.C. (Note 1) Variable Pin (Variable Output Type) N.C. Pin (Fixed Output Type) FIN GND GND (Note 1) N.C.Pin can be open since it is not connected inside of IC. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ●Block diagrams ■ HTSOP-J8 〈BD00FC0WEFJ (Output Voltage Variable Type) with Shutdown SW〉 VREF : Bandgap Reference OCP : Over Current Protection Circuit TSD : Thermal Shut Down Circuit Driver : Power Transistor Driver VREF Driver OCP TSD 1 2 EN Vcc 3 4 5 GND Vo FB Figure 7. Block diagrams BD00FC0WEFJ (Output Voltage Variable Type with Shutdown SW) ■ HTSOP-J8 〈BDxxFC0WEFJ (Output Voltage Fixed Type) with Shutdown SW〉 VREF : OCP : TSD : Driver : Bandgap Reference Over Current Protection Circuit Thermal Shut Down Circuit Power Transistor Driver VREF Driver OCP TSD 1 2 3 4 5 EN Vcc GND Vo N.C. Figure 8. Block diagrams BxxFC0WEFJ (Output Voltage Variable Type with shutdown SW) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ■TO252-3〈BDxxFC0FP (Output Voltage Fixed Type) without Shutdown SW〉 FIN GND VREF : OCP : TSD : Driver : VREF Bandgap Reference Over Current Protection Circuit Thermal Shut Down Circuit Power Transistor Driver Driver OCP TSD 1 2 3 Vcc N.C. Vo Figure 9. Block diagrams BDxxFC0FP (Output Voltage Fixed Type, without Shutdown SW) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ■ TO252-5 〈BD00FC0WFP (Output Voltage Variable Type) With Shutdown SW〉 FIN GND VREF : OCP : TSD : Driver : Bandgap Reference Over Current Protection Circuit Thermal Shut Down Circuit Power Transistor Driver VREF Driver OCP TSD 1 2 EN Vcc 3 4 5 N.C. Vo FB Figure 10. Block diagram BD00FC0WFP (Output Voltage Variable Type, with Shutdown SW) ■TO252-5〈BDxxFC0WFP (Output Voltage Fixed Type) With Shutdown SW〉 FIN GND VREF : OCP : TSD : Driver : Bandgap Reference Over Current Protection Circuit Thermal Shut Down Circuit Power Transistor Driver VREF Driver OCP TSD 1 2 EN Vcc 3 4 5 N.C. Vo N.C. Figure 11. Block diagram BDxxFC0WFP (Output Voltage Fixed Type, with Shutdown SW) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ●Absolute Maximum Ratings (Ta= 25℃) Parameter Supply Voltage *1 EN Voltage *2 Operating Temperature Range Storage Temperature Range Maximum Junction Temperature Symbol Vcc VEN Ta Tstg Tjmax Ratings -0.3 to +35.0 -0.3 to +35.0 -25 to +85 -55 to +150 150 Unit V V ℃ ℃ ℃ *1 Do not exceed Tjmax. *2 Power Supply (Vcc) and EN pin startup sequence does not matter provided they are operated within the power supply voltage range. ●Operating Conditions (-25℃≦Ta≦+85℃) Parameter Supply Voltage (VO≧3.0V) Supply Voltage (VO<3.0V) Startup Voltage (IO=0mA) EN Voltage (with shutdown SW) Output Current Output Voltage *3 (BD00FC0) Symbol Vcc Vcc Vcc VEN IO VO Min VO+1 4.0 0 0 1.0 Max 26.5 26.5 3.8 26.5 1.0 15.0 Unit V V V V A V *3 Please refer to Notes when using BD00FC0 at output voltage of 1.0V to 3.0V. ●Electrical Characteristics Unless otherwise specified, Ta=25°C, Vcc=13.5V, IO=0mA, VEN=5.0V The resistor between FB and OUT =56.7kΩ, FB and GND =10kΩ (BD00FC0) Guaranteed Limit Parameter Symbol Min Typ Max Circuit Current at shutdown mode ISD 0 5 Circuit Current Icc 0.5 2.5 Output Reference Voltage (BD00FC0) VFB 0.742 0.750 0.758 Output Voltage VO×0.99 VO VO×1.01 VO (BD30/33/50FC0) Output Voltage VO×0.99 VO VO×1.01 VO (BD60/70/80/90/J0/J2/J5FC0) Minimum dropout voltage Minimum dropout voltage (BD00/50/60/70/80/90/J0/J2/J5FC0) Line Regulation Load Regulation EN High Voltage (with shutdown SW) EN Low Voltage (with shutdown SW) EN Bias Current Unit Conditions µA mA V IO =50mA V IO =200mA V IO =500mA *4 ∆Vd - 0.4 0.7 V ∆Vd - 0.3 0.5 V Reg.I Reg.IO VEN(High) VEN(Low) IEN 2.0 - 20 VO×0.010 25 80 VO×0.020 0.8 50 mV V V V μA Vcc=4.0V IO =500mA *５ Vcc= VO×0.95, IO =500mA Vcc=VO+1.0V→26.5V IO =5mA→1A *4 ACTIVE MODE OFF MODE *4 In case of J0, J2 and J5, Vcc=Vo+4.5V *5 In case of Vo ≧ 4.0V www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ●Thermal Resistance Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 3) 2s2p(Note 4) θJA 206.4 45.2 °C/W ΨJT 21 13 °C/W θJA 115.3 20.8 °C/W ΨJT 14 3 °C/W HTSOP-J8 Junction to Ambient Junction to Top Characterization Parameter(Note 2) TO252-5 / TO252-3 Junction to Ambient Junction to Top Characterization Parameter(Note 2) (Note 1)Based on JESD51-2A(Still-Air) (Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3)Using a PCB board based on JESD51-3. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70μm (Note 4)Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Thermal Via (Note 5) Pitch Diameter 1.20mm Φ0.30mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70μm 74.2mm x 74.2mm 35μm 74.2mm x 74.2mm 70μm (Note 5) This thermal via connects with the copper pattern of all layers www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ●Reference Data ■BD00FC0 series (5.0V Output Setting) Unless otherwise specified, Ta=25°C, Vcc=13.5V, VEN=5.0V, IO=0mA, VO=5.0V (The resistor between FB and Vo =56.7kΩ, FB and GND =10kΩ) 18 15 0.8 Shutdown Current:ISD [μA] Circuit Current:Icc+IFEEDBACK_R [mA] 1.0 0.6 0.4 0.2 0.0 0 2 4 6 12 9 6 3 0 8 10 12 14 16 18 20 22 24 26 0 2 4 Supply Voltage:Vcc [V] 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Figure 12. Circuit Current (IFEEDBACK_R≒75µA) Figure 13. Shutdown Current 6 6 5 5 Output Voltage:VO[V] Output Voltage:VO[V] 6 4 3 2 1 4 3 2 1 0 0 2 4 6 0 8 10 12 14 16 18 20 22 24 26 0 Supply Voltage:Vcc [V] 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Figure 14. Line Regulation (IO=0mA) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2 Figure 15. Line Regulation (IO=500mA) 10/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ●Reference Data - Continued 6 1,000 900 Dropout Voltage : ∆Vd[mV] Output Voltage:VO[V] 5 4 3 2 1 800 700 600 500 400 300 200 100 0 0 400 800 1200 1600 2000 0 2400 0 Output Current:IO[mA] 400 600 800 1000 Output Current:IO[mA] Figure 17. Dropout Voltage (Vcc=4.75V) (lO=0mA→1000mA) Figure 16. Load Regulation 80 5.15 70 5.10 Output Voltage: Vo [V] Ripple Rejection:R.R. [dB] 200 60 50 40 30 20 5.05 5.00 4.95 4.90 10 0 10 100 1000 10000 100000 1000000 Frequency: f [Hz] -25 -5 15 35 55 75 Ambient Temperature: [℃ ] Figure 18. Ripple Rejection (IO =100mA) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4.85 Figure 19. Output Voltage Temperature Characteristic 11/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ●Reference Data - Continued 1.0 160 0.8 EN Bias Current:IEN [μA] Circuit Current:Icc+IFEEDBACK_R [mA] 140 0.6 0.4 0.2 120 100 80 60 40 20 0.0 0 0 200 400 600 800 1000 0 2 4 Output Current:IO[mA] 8 10 12 14 16 18 20 22 24 26 Enable Voltage: VEN [V] Figure 20. Circuit Current (IO =0mA→1000 mA) (IFEEDBACK_R≒75µA) Figure 21. EN Voltage vs EN Current 6 6 5 5 Output Voltage:VO[V] Output Voltage:VO[V] 6 4 3 2 1 4 3 2 1 0 0 2 4 6 0 8 10 12 14 16 18 20 22 24 26 130 Enable Voltage: VEN [V] 150 160 170 180 190 Ambient Temperature:Ta [℃] Figure 23. Thermal Shutdown Circuit Characteristic Figure 22. EN Voltage vs Output Voltage www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 140 12/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ●Measurement setup for reference data ■BD00FC0 series（5.0V Output Setting） Measurement setup for Figure 12 Measurement setup for Figure 15 Measurement setup for Figure 13 Measurement setup for Figure 16 Measurement setup for Figure 14 Measurement setup for Figure 17 Vcc Vo 56.7kΩ 1µF EN 13.5V FB GND 5V Measurement setup for Figure 18 Measurement setup for Figure 21 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Measurement setup for Figure 19 Measurement setup for Figure 22 13/38 1µF 10kΩ IFEEDBACK_R Measurement setup for Figure 20 Measurement setup for Figure 23 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ●Reference Data ■BD33FC0 series Unless otherwise specified Ta = 25°C, Vcc=13.5V, VEN=5.0V, Io=0mA 18 15 0.8 Shutdown Current:ISD [μA] Circuit Current:Icc [mA] 1.0 0.6 0.4 0.2 12 9 6 3 0 0.0 0 2 4 6 0 8 10 12 14 16 18 20 22 24 26 2 4 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Supply Voltage:Vcc [V] Figure 25. Shutdown Current Figure 24. Circuit Current 6 6 5 5 Output Voltage:Vo [V] Output Voltage:Vo [V] 6 4 3 2 1 4 3 2 1 0 0 2 4 6 0 8 10 12 14 16 18 20 22 24 26 0 Supply Voltage:Vcc [V] 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Figure 26. Line Regulation (Io=0mA) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2 Figure 27. Line Regulation (Io=500mA) 14/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ●Reference Data - Continued 80 6 70 Ripple Rejection:R.R. [dB] Output Voltage:Vo [V] 5 4 3 2 1 60 50 40 30 20 10 0 0 0 400 800 1200 1600 2000 10 2400 100 1000 10000 100000 1000000 Frequency: f [Hz] Output Current:Io [mA] Figure 29. Ripple Rejection (lo=100mA) Figure 28. Load Regulation 3.38 0.9 3.36 0.8 Circuit Current:Icc [mA] Output Voltage: Vo [V] 1.0 3.34 3.32 3.30 3.28 3.26 0.7 0.6 0.5 0.4 0.3 0.2 3.24 0.1 3.22 -25 -5 15 35 55 0.0 75 0 400 600 800 1000 Output Current:Io [mA] Figure 31. Circuit Current Ambient Temperature: [℃ ] Figure 30. Output Voltage Temperature Characteristic www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 200 15/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ●Reference Data - Continued 6 160 5 Output Voltage:Vo [V] EN Bias Current:IEN [μA] 140 120 100 80 60 4 3 2 40 1 20 0 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 0 2 4 6 8 10 12 14 16 18 20 22 24 26 Enable Voltage: VEN [V] Enablel Voltage: VEN [V] Figure 33. EN Voltage vs Output Voltage Figure 32. EN Voltage vs EN Current 6 Output Voltage:Vo [V] 5 4 3 2 1 0 130 140 150 160 170 180 190 Ambient Temperature:Ta [℃] Figure 34. Thermal Shutdown Circuit Characteristic www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ●Reference Data ■BD50FC0 series Unless otherwise specified, Ta = 25°C, Vcc=13.5V, VEN=5.0V, Io=0mA 18 15 0.8 Shutdown Current:ISD [μA] Circuit Current:Icc [mA] 1.0 0.6 0.4 0.2 0.0 0 2 4 6 12 9 6 3 0 8 10 12 14 16 18 20 22 24 26 0 2 4 Supply Voltage:Vcc [V] 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Figure 36. Shutdown Current Figure 35. Circuit Current 6 6 5 5 Output Voltage:Vo [V] Output Voltage:Vo [V] 6 4 3 2 1 4 3 2 1 0 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 0 Supply Voltage:Vcc [V] 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Figure 37. Line Regulation (Io=0mA) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2 Figure 38. Line Regulation (Io=500mA) 17/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ●Reference Data - Continued 6 1,000 900 Dropout Voltage : ∆Vd [mV] Output Voltage:Vo [V] 5 4 3 2 1 800 700 600 500 400 300 200 100 0 0 400 800 1200 1600 2000 0 2400 0 Output Current:Io [mA] 400 600 800 1000 Output Current:Io [mA] Figure 39. Load Regulation Figure 40. Dropout Voltage (Vcc=Vo×0.95V) 5.15 80 70 5.10 Output Voltage: Vo [V] Ripple Rejection:R.R. [dB] 200 60 50 40 30 20 5.05 5.00 4.95 4.90 10 0 10 100 1000 10000 100000 1000000 Frequency: f [Hz] -25 -5 15 35 55 75 Ambient Temperature: [℃] Figure 41. Ripple Rejection (lo=100mA) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4.85 Figure 42. Output Voltage Temperature Characteristic 18/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ●Reference Data - Continued 1.0 160 140 EN Bias Current:IEN [μA] Circuit Current:Icc [mA] 0.8 0.6 0.4 0.2 120 100 80 60 40 20 0 0.0 0 200 400 600 800 0 1000 2 6 8 10 12 14 16 18 20 22 24 26 Enable Voltage: VEN [V] Figure 44. EN Voltage vs EN Current Output Current:Io [mA] Figure 43. Circuit Current 6 6 5 5 Output Voltage:Vo [V] Output Voltage:Vo [V] 4 4 3 2 1 4 3 2 1 0 0 2 4 6 0 8 10 12 14 16 18 20 22 24 26 130 Enable Voltage: VEN [V] 150 160 170 180 190 Ambient Temperature:Ta [℃] Figure 46. Thermal Shutdown Circuit Characteristic Figure 45. EN Voltage vs Output Voltage www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 140 19/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series 1.2 18 1.0 15 Shutdown Current:ISD [μA] Circuit Current:Icc [mA] ●Reference Data ■BD80FC0 series Unless otherwise specified, Ta = 25°C, Vcc=13.5V, VEN=5.0V, Io=0mA 0.8 0.6 0.4 0.2 0.0 12 9 6 3 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 0 2 4 6 Supply Voltage:Vcc [V] Supply Voltage:Vcc [V] Figure 47. Circuit Current Figure 48. Shutdown Current 10 10 9 9 8 8 Output Voltage:Vo [V] Output Voltage:Vo [V] 8 10 12 14 16 18 20 22 24 26 7 6 5 4 3 7 6 5 4 3 2 2 1 1 0 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 0 Figure 49. Line Regulation (Io=0mA) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Supply Voltage:Vcc [V] Figure 50. Line Regulation (Io=500mA) 20/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series 10 1,000 9 900 8 800 Dropout Voltage : ∆Vd [mV] Output Voltage:Vo [V] ●Reference Data - Continued 7 6 5 4 3 2 700 600 500 400 300 200 1 100 0 0 0 400 800 1200 1600 2000 0 2400 200 400 600 800 1000 Output Current:Io [mA] Output Current:Io [mA] Figure 52. Dropout Voltage (Vcc=Vo×0.95V) Figure 51. Load Regulation 80 8.21 8.16 Output Voltage: Vo [V] Ripple Rejection:R.R. [dB] 70 60 50 40 30 20 10 8.11 8.06 8.01 7.96 7.91 7.86 7.81 7.76 0 10 100 1000 10000 100000 1000000 Frequency: f [Hz] -5 15 35 55 75 Ambient Temperature: [℃] Figure 53. Ripple Rejection (lo=100mA) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -25 Figure 54. Output Voltage Temperature Characteristic 21/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series ●Reference Data - Continued 160 1.0 140 EN Bias Current:IEN [μA] Circuit Current:Icc [mA] 0.8 0.6 0.4 120 100 80 60 40 0.2 20 0.0 0 200 400 600 800 0 1000 0 2 4 6 Output Current:Io [mA] Figure 55. Circuit Current Figure 56. EN Voltage vs EN Current 10 10 9 9 8 8 Output Voltage:Vo [V] Output Voltage:Vo [V] 8 10 12 14 16 18 20 22 24 26 Enable Voltage: VEN [V] 7 6 5 4 3 7 6 5 4 3 2 2 1 1 0 0 0 2 4 6 130 8 10 12 14 16 18 20 22 24 26 150 160 170 180 190 Figure 58. Thermal Shutdown Circuit Characteristic Figure 57. EN Voltage vs Output Voltage www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 140 Ambient Temperature:Ta [℃] Enable Voltage: VEN [V] 22/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 Series 1.2 18 1.0 15 Shutdown Current:ISD [μA] Circuit Current:Icc[mA] ●Reference Data ■BD90FC0 series Unless otherwise specified, Ta = 25°C, Vcc=13.5V, VEN=5.0V, Io=0mA 0.8 0.6 0.4 0.2 0.0 0 2 4 6 12 9 6 3 0 8 10 12 14 16 18 20 22 24 26 0 2 4 Supply Voltage:Vcc [V] 10 9 9 8 8 Output Voltage:Vo [V] Output Voltage:Vo [V] Figure 60. Shutdown Current 10 7 6 5 4 3 7 6 5 4 3 2 2 1 1 0 0 2 4 6 0 8 10 12 14 16 18 20 22 24 26 2 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Supply Voltage:Vcc [V] Figure 61. Line Regulation (Io=0mA) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8 10 12 14 16 18 20 22 24 26 Supply Voltage:Vcc [V] Figure 59. Circuit Current 0 6 Figure 62. Line Regulation (Io=500mA) 23/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 series 10 1,000 9 900 8 800 Dropout Voltage : ∆Vd [mV] Output Voltage:Vo [V] ●Reference Data - Continued 7 6 5 4 3 2 700 600 500 400 300 200 1 100 0 0 0 400 800 1200 1600 2000 0 2400 200 400 600 800 1000 Output Current:Io [mA] Output Current:Io [mA] Figure 63. Load Regulation Figure 64. Dropout Voltage (Vcc=Vo×0.95V) 80 9.23 Output Voltage: Vo [V] Ripple Rejection:R.R. [dB] 70 60 50 40 30 20 9.13 9.03 8.93 8.83 10 0 10 100 1000 10000 100000 1000000 Frequency: f [Hz] -25 -5 15 35 55 75 Ambient Temperature: [℃] Figure 65. Ripple Rejection (Io =100mA) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8.73 Figure 66. Output Voltage Temperature Characteristic 24/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 series ●Reference Data - Continued 160 1.0 0.8 EN Bias Current:IEN [μA] Circuit Current:Icc [mA] 140 0.6 0.4 0.2 120 100 80 60 40 20 0 0.0 0 200 400 600 800 0 1000 2 4 6 Enable Voltage: VEN [V] Output Current:Io [mA] Figure 68. EN Voltage vs EN Current Figure 67. Circuit Current 10 10 9 9 8 8 Output Voltage:Vo [V] Output Voltage:Vo [V] 8 10 12 14 16 18 20 22 24 26 7 6 5 4 3 7 6 5 4 3 2 2 1 1 0 0 0 2 4 6 130 8 10 12 14 16 18 20 22 24 26 150 160 170 180 190 Figure 70. Thermal Shutdown Circuit Characteristic Figure 69. EN Voltage vs Output Voltage www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 140 Ambient Temperature:Ta [℃] Enable Voltage: VEN [V] 25/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 series ●Measurement setup for reference data ■BDxxFC0 series(Output Voltage FixedType) Measurement setup for Figure 24, 35, 47 and 59 Measurement setup for Figure 25, 36, 48 and 60 Vcc Vo EN N.C. (1.0µF) 2.2µF Measurement setup for Figure 26, 37, 49 and 61 1µF 13.5V GND 5V Measurement setup for Figure 27, 38, 50 and 62 Measurement setup for Figure 29, 41, 53 and 65 Measurement setup for Figure 32, 44, 56 and 68 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Measurement setup for Figure 28, 39, 51 and 63 Measurement setup for Figure 40, 52 and 64 Measurement setup for Figure 30, 42, 54 and 66 Measurement setup for Figure 31, 43, 55 and 67 Measurement setup for Figure 33, 45, 57 and 69 26/38 Measurement setup for Figure 34, 46, 58 and 70 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 series ●Application Examples ・Applying positive surge to the Vcc pin If there is a possibility that surges higher than 35.0V will be applied to the Vcc pin, a Zener diode should be placed between the Vcc pin and GND pin, as shown in the Figure below. Vcc GND Figure 71. ・Applying negative surge to the Vcc pin If there is a possibility that negative surges lower than the GND are applied to the Vcc pin, a Schottky diode should be place between the Vcc pin and GND pin, as shown in the Figure below. Vcc GND Figure 72. ・Implementing a protection diode If there is a possibility that a large inductive load is connected to the output pin resulting in back-EMF at time of startup and Shutdown, a protection diode should be placed as shown in the Figure below. Vo Vo Figure 73. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 27/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 series ●Thermal Design ■HTSOP-J8 IC mounted on ROHM standard board based on JEDEC. Board material: FR4 Board size 1s 114.3 mm x 76.2 mm x 1.57 mmt 2s2p 114.3 mm x 76.2 mm x 1.6 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: The footprint ROHM recommend. + wiring to measure. 3.5 Power Dissipation: Pd[W] 3 ②2.8 W 2.5 2 1.5 ①: 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm x 0 mm) ②: 4-layer PCB (2 inner layers and copper foil area on the reverse side of PCB: 74.2mm x 74.2 mm) 1 ①0.6W 0.5 0 0 25 50 75 100 125 Condition①: θja = 206.4 °C/W, ΨJT = 21°C/W Condition②: θja = 45.2 °C/W, ΨJT = 13°C/W 150 Ambient Temperature: Ta[°C] Figure 74. ■TO252-3/5 IC mounted on ROHM standard board based on JEDEC. Board material: FR4 Board size 1s 114.3 mm x 76.2 mm x 1.57 mmt 2s2p 114.3 mm x 76.2 mm x 1.6 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: The footprint ROHM recommend. + wiring to measure. 8 Power Dissipation: Pd [W] ②6 W 6 4 ①: 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm x 0 mm) ②: 4-layer PCB (2 inner layers and copper foil area on the reverse side of PCB: 74.2mm x 74.2 mm) 2 ①1.1 W 0 0 25 50 75 100 125 150 Ambient Temperature: Ta [°C] Condition①: θja = 115.3 °C/W, ΨJT = 14°C/W Condition②: θja = 20.8 °C/W, ΨJT = 3°C/W Figure 75. When operating at temperature more than Ta=25°C, please refer to the power dissipation characteristic curve shown in Figure 74 and 75. The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at temperatures less than the maximum junction temperature Tjmax. Figure 74 and 75 show the acceptable power dissipation characteristic curves of the HTSOP-J8 and TO252-3/5 packages. Even when the ambient temperature (Ta) is at normal temperature (25°C), the chip junction temperature (Tj) may be quite high so please operate the IC at temperatures less than the acceptable power dissipation. The calculation method for power consumption Pc(W) is as follows Pc=(Vcc－Vo)×Io+Vcc×Icc Acceptable loss Pd ≥ Pc Solving this for load current Io in order to operate within the acceptable loss Io ≤ Pd－Vcc×Icc Vcc－Vo Vcc Vo Io Icc : Input voltage : Output voltage : Load current : Circuit current It is then possible to find the maximum load current Iomax with respect to the applied voltage Vcc at the time of thermal design. Calculation Example) When TO252-3 / TO252-5, Ta=85°C, Vcc=13.5V, Vo=5.0V 3.115－13.5×Icc 8.5 Io ≤ 365.6mA (Icc : 0.5mA) Io ≤ www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 75 ②θja=20.8 °C/W → -48.1mW/°C 25°C = 6W → 85°C =3.115W 28/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 series ●I/O equivalent circuit Vcc Terminal EN Terminal 200kΩ Vcc 1kΩ EN 200kΩ IC Vo Terminal BD30/33/50/60/70/80/90/J0/J2/J5FC0(W) R1 (kΩ) (Typ) BD30FC0(W) BD33FC0(W) BD50FC0(W) 10 BD60FC0(W) BD50FC0(W) Vo BD80C0A(W) 5 R2 BD90C0A(W) BDJ0C0A(W) 5 R1 BDJ2C0A(W) BDJ5C0A(W) 4 Vcc R3 R2 (kΩ) (Typ) 30.3 34 56.6 83.5 61.7 48.3 55 61.7 75 76.1 R3 (kΩ) (Typ) 15 20 15 BD00FC0W Vo Terminal FB Terminal Vcc 15kΩ (Typ) FB Vo Figure 76. ●Output Voltage Configuration Method (BD00FC0) Please connect resistors R1 and R2 (which determines the output voltage) as shown in Figure 77. Please be aware that the offset, due to the current that flows from the FB terminal, becomes large when resistors with large values are used. Resistance values ranging from R2=5kΩ to 10kΩ is recommended. VO VOUT setting equation is, R1 VFB ≒ 0.75 V (TYP) IC FB pin R2 VOUT≒VFB×(R1+R2)/R2 Thoroughly check the constant settings on the application because circuit current increases depending on connected resistor. Resistance value of R2 is from 5kΩ to 10kΩ. Determine R1 by adjusting with R2. Figure 77. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 29/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 series ●Operational Notes 1. Absolute maximum ratings Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC. 2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external circuits, and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics. 3. GND potential The potential of the GND pin must be the minimum potential in the system in all operating conditions. Ensure that no pins are at a voltage below the GND at any time, regardless of transient characteristics. 4. Ground wiring pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused by large currents. Also, ensure that the GND traces of external components do not cause variations on GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by poor soldering or foreign objects) may result in damage to the IC. 6. Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications where strong electromagnetic fields may be present. 7. Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Power Dissipation Pd Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics including reduced current capability due to the rise of chip temperature. The mentioned power dissipation in the absolute maximum rating of this specification, at HTSOP-J8 andTO252-3/5 package when 114.3mm×76.2mm×1.6mm glass epoxy board is mounted, is the value of when there is no heat dissipation board. And in case this exceeds, take the measures like enlarge the size of board; make copper foil area for heat dissipation big; and use dissipation board and do not exceed the power dissipation. 9. Thermal consideration Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions. (Pd≧Pc) Tjmax : Maximum junction temperature=150(℃) , Ta : Peripheral temperature(℃) , θja : Thermal resistance of package-ambience(℃/W), Pd : Package Power dissipation (W), Pc : Power consumption (W), Vcc : Input Voltage, VO : Output Voltage, IO : Load, Icc : Circut Current Package Power dissipation Power consumption : Pd (W) = (Tjmax-Ta) / θja : Pc (W) = (Vcc-VO)×IO+Vcc×Icc 10. Vcc pin Insert a capacitor (VO≧5.0V:capacitor≧1µF, 1.0≦VO＜5.0V:capacitor≧2.2µF) between the Vcc and GND pins. Choose the capacitance according to the line between the power smoothing circuit and the Vcc pin. Selection of the capacitance also depends on the application. Verify the application and allow for sufficient margins in the design. It is recommended to use a capacitor with excellent voltage and temperature characteristics. Electrolytic capacitor IC Ceramic capacitor, Low ESR capacitor www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 30/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 series 11. Output pin In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a capacitor with a capacitance of more than 1μF(3.0V≦VO≦15.0V). Electrolytic, tantalum and ceramic capacitors can be used. We recommend a capacitor with a capacitance of more than 4.7μF(1.0V≦VO<3.0V). Ceramic capacitors can be used. When selecting the capacitor, ensure that the capacitance of more than 1μF(3.0V≦VO≦15.0V) or more than 4.7μF(1.0V≦VO<3.0V) is maintained at the intended applied voltage and temperature range. Due to changes in temperature, the capacitance can fluctuate possibly resulting in oscillation. For selection of the capacitor, refer to the Cout_ESR vs IOUT data. The stable operation range given in the reference data is based on the standalone IC and resistive load. For actual applications, the stable operating range is influenced by the PCB impedance, input supply impedance, and load impedance. Therefore, verification of the final operating environment is needed. When selecting a ceramic type capacitor, we recommend using X5R, X7R, or better, with excellent temperature and DC-biasing characteristics and high voltage tolerance. Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that the actual application meets the required specification. 4.0V ≤ Vcc ≤ 26.5V 3.0V ≤ VO ≤ 15.0V -25℃ ≤ Ta ≤ +85℃ 5kΩ ≤ R2 ≤ 10kΩ (BD00FC0W) Cin=2.2µF ≤ Cin ≤ 100µF 1µF ≤ Cout ≤ 100µF 6.0V≤Vcc≤26.5V 5.0V≤VO≤15.0V -25℃≤Ta≤+85℃ 0A≤IO≤1A 5kΩ≤R2≤10kΩ (BD00FC0W) 4.0V ≤ Vcc ≤ 26.5V 3.0V ≤ VO ≤ 15.0V -25℃ ≤ Ta ≤ +85℃ 0A ≤ IO ≤ 1A 5kΩ ≤ R2 ≤ 10kΩ (BD00FC0W) 100 100 100 Unstable operating region Stable operating region 0.1 0.01 Cin（µF） 1 Cin（µF） Cout_ESR(Ω） 10 Stable operating region 10 2.2 Unstable operating region 1 1 0.001 0 200 400 600 800 1 1000 10 IIo(mA) O(mA) 1 100 4.0V ≤ Vcc ≤ 26.5V 1.5V ≤ Vo < 3.0V -25°C ≤ Ta ≤ +85°C 5kΩ ≤ R1 ≤ 10kΩ (BD00FC0W) 2.2µF ≤ Cin ≤ 100µF 4.7µF ≤ Cout ≤ 100µF 100 4.0V ≤ Vcc ≤ 26.5V 1.0V ≤ Vo < 3.0V -25°C ≤ Ta ≤ +85°C 0A ≤ Io ≤ 1A 5kΩ≤ R1 ≤ 10kΩ (BD00FC0W) 100 100 Unstable operating region Cout_ESR(Ω） 10 1 0.5 0.1 Stable operating region 0.01 Stable operating region 1 Cin（µF） Unstable operating region Stable operating region 0.1 0.01 0.001 200 400 600 800 1000 Unstable operating region 10 1 0 200 Io(mA) 400 600 800 1 1000 4.7 10 100 Cout（µF） Io(mA) Cout_ESR vs Io 1.0V ≤ Vo < 3.0V (Reference data) Cin vs Cout 1.0V ≤ Vo < 3.0V (Reference data) Vcc VCC (4.0V to 26.5V) Stable operating region 2.2 0.001 0 100 Cin vs Cout 3.0V ≤ Vo ≤ 15.0V (Reference data) 4.0V ≤ Vcc ≤ 26.5V 1.0V ≤ Vo < 1.5V -25°C ≤ Ta ≤ +85°C 5kΩ ≤ R1 ≤ 10kΩ (BD00FC0W) 2.2µF ≤ Cin ≤ 100µF 4.7µF ≤ Cout ≤ 100µF 10 10 Cout(µF) Cout（µF） Cout_ESR vs Io 3.0V ≤ Vo ≤ 15.0V (Reference data) Cout_ESR(Ω） Stable operating region 10 Vo Cin (1µF or higher) R2 EN Cout (1µF or higher) Io (Rout) FB GND VEN (5.0V) R1 (5k to 10kΩ) ESR (0.001Ω or higher) Operation Note 11 Measurement circuit (BD00FC0W) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 31/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 series 4.0V ≤ Vcc ≤ 26.5V 1.0V ≤ Vo < 3.0V (Cout and Ceramic capacitor 10µF is connected in parallel.) -25°C ≤ Ta ≤ +85°C 0A ≤ Io ≤ 1A 5kΩ≤ R1 ≤ 10kΩ (BD00FC0W) 4.0V ≤ Vcc ≤ 26.5V 1.0V ≤ Vo < 3.0V (Cout and Ceramic capacitor 10µF is connected in parallel.) -25°C ≤ Ta ≤ +85°C 5kΩ ≤ R1 ≤ 10kΩ (BD00FC0W) 2.2µF ≤ Cin ≤ 100µF 1µF ≤ Cout ≤ 100µF 100 100 Unstable operating region 1 Cin（µF） Cout_ESR(Ω） 10 Stable operating region 0.1 0.01 Stable operating region 10 2.2 Unstable operating region 1 0.001 0 200 400 600 800 1 1000 10 Io(mA) Cin vs Cout 1.0V ≤ Vo < 3.0V Cout and Ceramic capacitor 10µF is connected in parallel. (Reference data) Cout_ESR vs Io 1.0V ≤ Vo < 3.0V Cout and Ceramic capacitor 10µF is connected in parallel. (Reference data) Vcc Vo Cin (1µF or higher) VCC (4.0V to 26.5V) 100 Cout（µF） R2 EN FB GND R1 (5k to 10kΩ) VEN (5.0V) Cout (1µF or higher) ESR (0.001Ω or higher) 10µF Output load Io(Rout) Operation Note 11 Measurement circuit (BD00FC0W) 12. EN pin Do not make the voltage level of the chip’s enable pin at floating level or in between VEN(High) and VEN(Low). Otherwise, the output voltage would be unstable or indefinite. 13. For a steep change of the Vcc voltage Because MOSFET for output Transistor is used when an input voltage change is very steep, it may evoke large current. When selecting the value of external circuit constants, please make sure that the operation on the actual application takes these conditions into account. 14. For infinitesimal fluctuations of output voltage. For applications that have infinitesimal fluctuations of the output voltage caused by some factors (e.g. disturbance noise, input voltage fluctuations, load fluctuations, etc.), please take enough measures to avoid some influence (e.g. insert a filter, etc.). 15. Over current protection circuit (OCP) The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output capacity. This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit output current (without latching) in the event of a large and instantaneous current flow from a large capacitor or other component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous or transitive operation of the protection circuits. 16. Thermal Shutdown circuit (TSD) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off, completely, in the event of thermal overload. It is not designed to protect the IC from damage or guarantee its operation. IC’s should not be used after this function has activated, or in applications where the operation of this circuit is assumed. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 32/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 series 17. In some applications, the Vcc and the Vo potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. For example, the accumulated charge in the output pin capacitor flow backward from the Vo to the Vcc when the Vcc shorts to the GND. Use a capacitor with a capacitance with less than 1000μF for reducing the damage. We also recommend using reverse polarity diodes in series between the Vcc and the GND or a bypass diode between the Vo and the Vcc. 18. Regarding input pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes and/or transistors. For example (refer to the Figure below): ○When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode ○When GND > Pin B, the PN junction operates as a parasitic transistor Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Example of monolithic IC structure www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 33/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 series ●Physical Dimension Tape and Reel InformationS Package Name HTSOP-J8 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 34/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 series Package Name www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 TO252-3 35/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 series Package Name www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 TO252-5 36/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 series ●Marking Diagram TO252-3 TO252-3 (TOP VIEW) Part Number Marking Output Voltage[V] Part Number Marking 3.3 33FC0 5.0 50FC0 LOT Number 1PIN TO252-5 (TOP VIEW) TO252-5 Part Number Marking LOT Number 1PIN Output Voltage[V] Part Number Marking Variable 00FC0W 3.0 30FC0W 3.3 33FC0W 5.0 50FC0W 6.0 60FC0W 7.0 70FC0W 8.0 80FC0W 9.0 90FC0W 10.0 J0FC0W 12.0 J2FC0W 15.0 J5FC0W Output Voltage[V] Part Number Marking Variable 00FC0W 3.0 30FC0W 3.3 33FC0W 5.0 50FC0W 6.0 60FC0W 7.0 70FC0W 8.0 80FC0W 9.0 90FC0W 10.0 J0FC0W 12.0 J2FC0W 15.0 J5FC0W HTSOP-J8 HTSOP-J8 (TOP VIEW) Part Number Marking x x F C 0 W LOT Number 1PIN MARK www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 37/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Datasheet BDxxFC0 series ●Revision History Date 27.Aug.2013 Revision 001 20.Oct. 2015 002 02.Dec. 2015 003 16.May. 2016 004 Changes New Release Add BDxxFC0FP and BDxxFC0WFP Change pin name OUT -> Vo P2 Lineup modified The document control number:TSZ02201-0GAG0A600040-1-2 -> TSZ02201-0G2G0A600040-1-2 P8 Power dissipation deleted P8 notes added in electrical characteristics P9 Copper Pattern area modified Misentry modified in Whole page www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 38/38 TSZ02201-0G2G0A600040-1-2 16.May.2016 Rev.004 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD50FC0FP - Web Page Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD50FC0FP TO252-3 2000 2000 Taping inquiry Yes