Features • Fast Read Access Time – 55 ns • Dual Voltage Range Operation • • • • • • • • • – Low-voltage Power Supply Range, 3.0V to 3.6V or Standard 5V ± 10% Supply Range Pin Compatible with JEDEC Standard AT27C256R Low-power CMOS Operation – 20 µA Max (Less than 1 µA Typical) Standby for VCC = 3.6V – 29 mW Max Active at 5 MHz for VCC = 3.6V JEDEC Standard Packages – 32-lead PLCC – 28-lead SOIC – 28-lead TSOP High-reliability CMOS Technology – 2,000V ESD Protection – 200 mA Latchup Immunity Rapid Programming Algorithm – 100 µs/Byte (Typical) CMOS and TTL Compatible Inputs and Outputs – JEDEC Standard for LVTTL Integrated Product Identification Code Industrial Temperature Range Green (Pb/Halide-free) Packaging Option 256K (32K x 8) Low-voltage OTP EPROM AT27LV256A 1. Description The AT27LV256A is a high-performance, low-power, low-voltage 262,144-bit onetime programmable read-only memory (OTP EPROM) organized as 32K by 8 bits. It requires only one supply in the range of 3.0V to 3.6V in normal read mode operation, making it ideal for fast, portable systems using battery power. Atmel’s innovative design techniques provide fast speeds that rival 5V parts while keeping the low power consumption of a 3.3V supply. At VCC = 3.0V, any byte can be accessed in less than 55 ns. With a typical power dissipation of only 18 mW at 5 MHz and VCC = 3.3V, the AT27LV256A consumes less than one fifth the power of a standard 5V EPROM. Standby mode supply current is typically less than 1 µA at 3.3V. The AT27LV256A is available in industry-standard JEDEC-approved one-time programmable (OTP) plastic PLCC, SOIC and TSOP packages. All devices feature two-line control (CE, OE) to give designers the flexibility to prevent bus contention. The AT27LV256A operating with VCC at 3.0V produces TTL level outputs that are compatible with standard TTL logic devices operating at VCC = 5.0V. The device is also capable of standard 5-volt operation making it ideally suited for dual supply range systems or card products that are pluggable in both 3-volt and 5-volt hosts. Atmel’s AT27LV256A has additional features to ensure high quality and efficient production use. The Rapid Programming Algorithm reduces the time required to program the part and guarantees reliable programming. Programming time is typically only 100 µs/byte. The Integrated Product Identification Code electronically identifies the device and manufacturer. This feature is used by industry-standard programming equipment to select the proper programming algorithms and voltages. The AT27LV256A programs exactly the same way as a standard 5V AT27C256R and uses the same programming equipment. 0547G–EPROM–12/07 AT27LV256A 2. Pin Configurations Pin Name Function A0 - A14 Addresses O0 - O7 Outputs CE Chip Enable OE Output Enable NC No Connect 2.1 28-lead SOIC Top View 1 2 3 4 5 6 7 8 9 10 11 12 13 14 VPP A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 GND 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VCC A14 A13 A8 A9 A11 OE A10 CE O7 O6 O5 O4 O3 OE A11 A9 A8 A13 A14 VCC VPP A12 A7 A6 A5 A4 A3 28-lead TSOP (Type 1) Top View 22 23 24 25 26 27 28 1 2 3 4 5 6 7 21 20 19 18 17 16 15 14 13 12 11 10 9 8 A10 CE O7 O6 O5 O4 O3 GND O2 O1 O0 A0 A1 A2 32-lead PLCC Top View 29 28 27 26 25 24 23 22 21 14 15 16 17 18 19 20 5 6 7 8 9 10 11 12 13 A8 A9 A11 NC OE A10 CE O7 O6 O1 O2 GND NC O3 O4 O5 A6 A5 A4 A3 A2 A1 A0 NC O0 4 3 2 1 32 31 30 A7 A12 VPP NC VCC A14 A13 2.2 2.3 Note: 1. PLCC Package Pins 1 and 17 are Don’t Connect. 2 0547G–EPROM–12/07 AT27LV256A 3. System Considerations Switching between active and standby conditions via the Chip Enable pin may produce transient voltage excursions. Unless accommodated by the system design, these transients may exceed datasheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high frequency, low inherent inductance, ceramic capacitor should be utilized for each device. This capacitor should be connected between the VCC and Ground terminals of the device, as close to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7 µF bulk electrolytic capacitor should be utilized, again connected between the VCC and Ground terminals. This capacitor should be positioned as close as possible to the point where the power supply is connected to the array. 4. Block Diagram 5. Absolute Maximum Ratings* Temperature Under Bias.................................. -40°C to +85°C Storage Temperature ..................................... -65°C to +125°C Voltage on Any Pin with Respect to Ground .........................................-2.0V to +7.0V(1) Voltage on A9 with Respect to Ground ......................................-2.0V to +14.0V(1) *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability VPP Supply Voltage with Respect to Ground .......................................-2.0V to +14.0V(1) Note: 1. Minimum voltage is -0.6V DC which may undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is VCC + 0.75V DC which may be exceeded if certain precautions are observed (consult application notes) and which may overshoot to +7.0V for pulses of less than 20 ns. 3 0547G–EPROM–12/07 6. Operating Modes Mode/Pin Read(2) Output Disable Standby (2) CE OE Ai VPP VCC Outputs VIL VIL Ai VIL (2) Rapid Program(3) (3) (3) Optional PGM Verify (1) VCC DOUT VCC VCC High Z (1) X VIH X X VCC VCC High Z VIL VIH Ai VPP VCC DIN X VIL Ai VPP VCC DOUT VIL VIL Ai VCC VCC DOUT (1) PGM Verify VIH VCC (1) (3) PGM Inhibit VIH VIH X VPP VCC High Z Product Identification(3)(5) VIL VIL A9 = VH(4) A0 = VIH or VIL A1 - A14 = VIL VCC VCC Identification Code Notes: (1) 1. X can be VIL or VIH. 2. Read, output disable, and standby modes require, 3.0V ≤VCC ≤3.6V, or 4.5V ≤VCC ≤5.5V. 3. Refer to Programming Characteristics. Programming modes require VCC = 6.5V. 4. VH = 12.0 ± 0.5V. 5. Two identifier bytes may be selected. All Ai inputs are held low (VIL), except A9 which is set to VH and A0 which is toggled low (VIL) to select the Manufacturer’s Identification byte and high (VIH) to select the Device Code byte. 7. DC and AC Operating Conditions for Read Operation AT27LV256A Industrial Operating Temperature (Case) VCC Power Supply 4 -55 -90 -40°C - 85°C -40°C - 85°C 3.0V to 3.6V 3.0V to 3.6V 5V ± 10% 5V ± 10% AT27LV256A 0547G–EPROM–12/07 AT27LV256A 8. DC and Operating Characteristics for Read Operation Symbol Parameter Condition Min Max Units VCC = 3.0V to 3.6V ILI Input Load Current VIN = 0V to VCC ±1 µA ILO Output Leakage Current VOUT = 0V to VCC ±5 µA IPP1(2) VPP(1) Read/Standby Current VPP = VCC 10 µA VCC(1) Standby Current ISB1 (CMOS), CE = VCC ± 0.3V 20 µA ISB ISB2 (TTL), CE = 2.0 to VCC + 0.5V 100 µA ICC VCC Active Current 8 mA VIL Input Low Voltage -0.6 0.8 V VIH Input High Voltage 2.0 VCC + 0.5 V VOL Output Low Voltage IOL = 2.0 mA 0.4 V VOH Output High Voltage IOH = -2.0 mA f = 5 MHz, IOUT = 0 mA, CE = VIL 2.4 V VCC = 4.5V to 5.5V ILI ILO IPP1 (2) Input Load Current VIN = 0V to VCC ±1 µA Output Leakage Current VOUT = 0V to VCC ±5 µA VPP(1) VPP = VCC 10 µA ISB1 (CMOS), CE = VCC ± 0.3V 100 µA ISB2 (TTL), CE = 2.0 to VCC + 0.5V 1 mA f = 5 MHz, IOUT = 0 mA, CE = VIL 20 mA Read/Standby Current ISB VCC(1) Standby Current ICC VCC Active Current VIL Input Low Voltage -0.6 0.8 V VIH Input High Voltage 2.0 VCC + 0.5 V VOL Output Low Voltage IOL = 2.1 mA 0.4 V Output High Voltage IOH = -400 µA VOH Notes: 2.4 V 1. VCC must be applied simultaneously with or before VPP, and removed simultaneously with or after VPP. 2. VPP may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and IPP. 5 0547G–EPROM–12/07 9. AC Characteristics for Read Operation VCC = 3.0V to 3.6V and 4.5V to 5.5V AT27LV256A -55 Symbol Parameter Condition Address to Output Delay CE = OE = VIL tCE(2) CE to Output Delay tOE(2)(3) OE to Output Delay tDF(4)(5) OE or CE High to Output Float, Whichever Occurred First tOH Output Hold from Address, CE or OE, Whichever Occurred First tACC (3) -90 Max Units 55 90 ns OE = VIL 55 90 ns CE = VIL 35 50 ns 30 40 ns Max Min 0 Min 0 ns 10. AC Waveforms for Read Operation(1) Notes: 1. Timing measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified. 2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE. 3. OE may be delayed up to tACC - tOE after the address is valid without impact on tACC. 4. This parameter is only sampled and is not 100% tested. 5. Output float is defined as the point when data is no longer driven. 6 AT27LV256A 0547G–EPROM–12/07 AT27LV256A 11. Input Test Waveforms and Measurement Levels tR, tF < 20 ns (10% to 90%) 12. Output Test Load Note: CL = 100 pF including jig capacitance. 13. Pin Capacitance f = 1 MHz, T = 25°C(1) Symbol Typ Max Units Conditions CIN 4 8 pF VIN = 0V COUT 8 12 pF VOUT = 0V Note: 1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested. 7 0547G–EPROM–12/07 14. Programming Waveforms(1) Notes: 1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH. 2. tOE and tDFP are characteristics of the device but must be accommodated by the programmer. 3. When programming the AT27LV256A a 0.1 µF capacitor is required across VPP and ground to suppress spurious voltage transients. 8 AT27LV256A 0547G–EPROM–12/07 AT27LV256A 15. DC Programming Characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V Limits Symbol Parameter Test Conditions ILI Input Load Current VIN = VIL, VIH VIL Input Low Level VIH Input High Level VOL Output Low Voltage IOL = 2.1 mA VOH Output High Voltage IOH = -400 µA ICC2 VCC Supply Current (Program and Verify) IPP2 VPP Current VID A9 Product Identification Voltage Min Max Units ±10 µA -0.6 0.8 V 2.0 VCC + 0.5 V 0.4 V 2.4 V 25 mA 25 mA 12.5 V CE = VIL 11.5 16. AC Programming Characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V Limits Symbol Parameter tAS Address Setup Time tOES OE Setup Time tDS Data Setup Time tAH Address Hold Time tDH Data Hold Time tDFP Test Conditions Min Input Rise and Fall Times: (10% to 90%) 20 ns Input Pulse Levels: 0.45V to 2.4V (2) OE High to Output Float Delay Max VPP Setup Time tVCS VCC Setup Time tPW CE Program Pulse Width(3) tOE Data Valid from OE(2) tPRT VPP Pulse Rise Time During Programming Units 2 µs 2 µs 2 µs 0 µs 2 µs 0 tVPS Notes: (1) 130 ns Input Timing Reference Level: 0.8V to 2.0V 2 µs 2 µs Output Timing Reference Level: 0.8V to 2.0V 95 105 µs 150 ns 50 ns 1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP. 2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer driven – see timing diagram. 3. Program Pulse width tolerance is 100 µsec ± 5%. 17. Atmel’s AT27LV256A Integrated Product Identification Code(1) Pins A0 O7 O6 O5 O4 O3 O2 O1 O0 Hex Data Manufacturer 0 0 0 0 1 1 1 1 0 1E Device Type 1 1 0 0 0 1 1 0 0 8C Codes Note: 1. The AT27LV256A has the same Product Identification Code as the AT27C256R. Both are programming compatible. 9 0547G–EPROM–12/07 18. Rapid Programming Algorithm A 100 µs CE pulse width is used to program. The address is set to the first location. VCC is raised to 6.5V and VPP is raised to 13.0V. Each address is first programmed with one 100 µs CE pulse without verification. Then a verification/reprogramming loop is executed for each address. In the event a byte fails to pass verification, up to 10 successive 100 µs pulses are applied with a verification after each pulse. If the byte fails to verify after 10 pulses have been applied, the part is considered failed. After the byte verifies properly, the next address is selected until all have been checked. VPP is then lowered to 5.0V and VCC to 5.0V. All bytes are read again and compared with the original data to determine if the device passes or fails. 10 AT27LV256A 0547G–EPROM–12/07 AT27LV256A 19. Ordering Information 19.1 Standard Package ICC (mA) tACC (ns) Active Standby 55 8 90 8 Note: 19.2 Ordering Code Package 0.02 AT27LV256A-55JI AT27LV256A-55RI AT27LV256A-55TI 32J 28R(1) 28T Industrial (-40° C to 85° C) 0.02 AT27LV256A-90JI AT27LV256A-90RI AT27LV256A-90TI 32J 28R(1) 28T Industrial (-40° C to 85° C) Not recommended for new designs. Use Green package option. Green Package Option (Pb/Halide-free) ICC (mA) tACC (ns) Active Standby 55 8 90 8 Note: Operation Range Ordering Code Package Operation Range 0.02 AT27LV256A-55JU AT27LV256A-55RU AT27LV256A-55TU 32J 28R(1) 28T Industrial (-40° C to 85° C) 0.02 AT27LV256A-90JU AT27LV256A-90RU AT27LV256A-90TU 32J 28R(1) 28T Industrial (-40° C to 85° C) 1. The 28-pin SOIC package is not recommended for new designs. Package Type 32J 32-lead, Plastic J-leaded Chip Carrier (PLCC) 28R 28-lead, 0.330" Wide, Plastic Gull Wing Small Outline (SOIC) 28T 28-lead, Thin Small Outline Package (TSOP) 11 0547G–EPROM–12/07 20. Packaging Information 20.1 32J – PLCC 1.14(0.045) X 45˚ PIN NO. 1 IDENTIFIER 1.14(0.045) X 45˚ 0.318(0.0125) 0.191(0.0075) E1 E2 B1 E B e A2 D1 A1 D A 0.51(0.020)MAX 45˚ MAX (3X) COMMON DIMENSIONS (Unit of Measure = mm) D2 Notes: 1. This package conforms to JEDEC reference MS-016, Variation AE. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.102 mm) maximum. SYMBOL MIN NOM MAX A 3.175 – 3.556 A1 1.524 – 2.413 A2 0.381 – – D 12.319 – 12.573 D1 11.354 – 11.506 D2 9.906 – 10.922 E 14.859 – 15.113 E1 13.894 – 14.046 E2 12.471 – 13.487 B 0.660 – 0.813 B1 0.330 – 0.533 e NOTE Note 2 Note 2 1.270 TYP 10/04/01 R 12 2325 Orchard Parkway San Jose, CA 95131 TITLE 32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC) DRAWING NO. REV. 32J B AT27LV256A 0547G–EPROM–12/07 AT27LV256A 20.2 28R – SOIC B E E1 PIN 1 e D A A1 COMMON DIMENSIONS (Unit of Measure = mm) 0º ~ 8º C L Note: 1. Dimensions D and E1 do not include mold Flash or protrusion. Mold Flash or protrusion shall not exceed 0.25 mm (0.010"). SYMBOL MIN NOM MAX A 2.39 – 2.79 A1 0.050 – 0.356 D 18.00 – 18.50 E 11.70 – 12.50 E1 8.59 – 8.79 B 0.356 – 0.508 C 0.203 – 0.305 L 0.94 – 1.27 e NOTE Note 1 Note 1 1.27 TYP 5/18/2004 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 28R, 28-lead, 0.330" Body Width, Plastic Gull Wing Small Outline (SOIC) DRAWING NO. REV. 28R C 13 0547G–EPROM–12/07 20.3 28T – TSOP PIN 1 0º ~ 5º c Pin 1 Identifier Area D1 D L b e L1 A2 E A GAGE PLANE SEATING PLANE COMMON DIMENSIONS (Unit of Measure = mm) A1 MIN NOM MAX A – – 1.20 A1 0.05 – 0.15 A2 0.90 1.00 1.05 D 13.20 13.40 13.60 D1 11.70 11.80 11.90 Note 2 E 7.90 8.00 8.10 Note 2 L 0.50 0.60 0.70 SYMBOL Notes: 1. This package conforms to JEDEC reference MO-183. 2. Dimensions D1 and E do not include mold protrusion. Allowable protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side. 3. Lead coplanarity is 0.10 mm maximum. L1 NOTE 0.25 BASIC b 0.17 0.22 0.27 c 0.10 – 0.21 e 0.55 BASIC 12/06/02 R 14 2325 Orchard Parkway San Jose, CA 95131 TITLE 28T, 28-lead (8 x 13.4 mm) Plastic Thin Small Outline Package, Type I (TSOP) DRAWING NO. REV. 28T C AT27LV256A 0547G–EPROM–12/07 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support [email protected] Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. 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