TI1 LMH6882 Small signal bandwidth: 2400 mhz Datasheet

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LMH6882
SNOSC84D – AUGUST 2012 – REVISED FEBRUARY 2015
LMH6882 DC to 2.4-GHz, High-Linearity, Dual, Programmable Differential Amplifier
1 Features
3 Description
•
•
•
•
•
•
•
•
•
The LMH6882 is a high-speed, high-performance
programmable differential amplifier. With a bandwidth
of 2.4 GHz and high linearity of 42 dBm OIP3, the
LMH6882 is suitable for a wide variety of signal
conditioning applications.
1
Small Signal Bandwidth: 2400 MHz
OIP3 @ 100 MHz: 42 dBm
HD3 @ 100 MHz: −100 dBc
Noise Figure: 9.7 dB
Voltage Gain: 26 dB to 6 dB
Voltage Gain Step Size: 0.25 dB
Input Impedance: 100 Ω
Parallel and Serial Gain Control
Power Down Capability
2 Applications
•
•
•
•
•
•
Microwave Backhaul Radio Receiver
Zero IF Sampling
In-Phase/Quadrature (I/Q) Sampling
Medical Imaging
RF/IF and Baseband Gain Blocks
Differential Cable Driver
OIP3 vs Voltage Gain
50
OIP3 (dBm)
45
The LMH6882 programmable differential amplifier
combines the best of both fully differential amplifiers
and variable-gain amplifiers. The device offers
superior noise and distortion performance over the
entire gain range without external resistors, enabling
the use of just one device and one design for multiple
applications requiring different gain settings.
The LMH6882 is an easy-to-use amplifier that can
replace both fully differential, fixed-gain amplifiers as
well as variable-gain amplifiers. The LMH6882
requires no external gain-setting components and
supports gain settings from 6 dB to 26 dB with small,
accurate 0.25-dB gain steps. As shown in the
adjacent voltage gain chart the gain steps are very
accurate over the entire gain range. With an input
impedance of 100 Ω, the LMH6882 is easy to drive
from a variety of sources such as mixers or filters.
The LMH6882 also supports 50-Ω single-ended
signal sources and supports DC- and AC-coupled
applications.
Parallel gain control allows the LMH6882 to be
soldered down in a fixed-gain so that no control
circuit is required. If dynamic gain control is desired,
the LMH6882 can be changed with SPI™ serial
commands or with the parallel pins.
40
35
30
25
f = 100 MHz
POUT= 4dBm / Tone
20
6
8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)
The LMH6882 is fabricated in TI’s CBiCMOS8
proprietary
complementary
silicon
germanium
process and is available in a space-saving, thermally
enhanced 36-pin WQFN package. The same
amplifier is offered in a single package as the
LMH6881.
Device Information(1)
PART NUMBER
LMH6882
PACKAGE
BODY SIZE (NOM)
WQFN (36)
6.00 mm × 6.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMH6882
SNOSC84D – AUGUST 2012 – REVISED FEBRUARY 2015
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
7
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics ..........................................
Typical Characteristics ..............................................
Detailed Description ............................................ 14
7.1 Overview ................................................................. 14
7.2 Functional Block Diagram ....................................... 14
7.3 Feature Description................................................. 14
7.4 Device Functional Modes........................................ 15
7.5 Programming........................................................... 16
8
Application and Implementation ........................ 21
8.1 Application Information............................................ 21
8.2 Typical Applications ................................................ 26
9 Power Supply Recommendations...................... 29
10 Layout................................................................... 29
10.1 Layout Guidelines ................................................. 29
10.2 Layout Example .................................................... 30
10.3 Thermal Considerations ........................................ 31
11 Device and Documentation Support ................. 32
11.1
11.2
11.3
11.4
Documentation Support ........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
32
32
32
32
12 Mechanical, Packaging, and Orderable
Information ........................................................... 32
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (March 2013) to Revision D
•
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision B (March 2013) to Revision C
•
2
Page
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 29
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5 Pin Configuration and Functions
SD
OC
M
VC
VC
C
C
GN
D
GN
D
D1
D2
D3
A
NJK Package
36-Pins WQFN
Top View
1
INMSA 10
NC
INMDA
OUTPA
INPDA
OUTMA
INPSA
NC
GND
D0
NC
INPSB
NC
INPDB
OUTMB
INMDB
OUTPB
28
INMSB
NC
I
SP
B
OC
M
C
C
VC
VC
GN
D
GN
D
D4
D5
D6
19
Pin Functions
PIN
NAME
TYPE
NO.
DESCRIPTION
ANALOG I/O
INPD, INMD
11, 12, 16, 17
Analog Input
Differential inputs 100 Ω
INPS, INMS
10, 13, 15, 18
Analog Input
Single ended inputs 50 Ω
OUTP, OUTM
35, 34, 30, 29
Analog Output
Differential outputs, low impedance
POWER
GND
5, 6, 22, 23
Ground
Ground pins. Connect to low-impedance ground plane.
All pin voltages are specified with respect to the voltage
on these pins. The exposed thermal pad is internally
bonded to the ground pins.
VCC
3, 4, 24, 25
Power
Power supply pins. Valid power supply range is 4.75 V to
5.25 V.
Thermal/ Ground
Thermal management/ Ground
Digital Input
0 = Parallel Mode, 1 = Serial Mode
Exposed Center Pad
DIGITAL INPUTS
SPI
27
PARALLEL MODE DIGITAL PINS, SPI = LOGIC LOW
D0, D1, D2, D3, D4, D5, D6
SD
14, 7, 8, 9, 21, 29, 19 Digital Input
1
Digital Input
Attenuator control, D0 = 0.25 dB, D6 = 16 dB
Shutdown 0 = amp on, 1 = amp off
SERIAL MODE DIGITAL PINS, SPI = LOGIC HIGH (SPI COMPATIBLE)
CS
9
Digital Input
Chip Select (active low)
CLK
8
Digital Input
Clock
SDO
14
Digital Output- Open
Emitter
Serial Data Output (Requires external bias.)
SDI
7
Digital Input
Serial Data In
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6 Specifications
6.1 Absolute Maximum Ratings (1) (2)
Positive supply voltage (VCC)
MIN
MAX
−0.6
5.5
V
< 200
mV
5.5
V
5.5
V
Differential voltage between any two grounds
Analog input voltage
−0.6
Digital input voltage
−0.6
Output short circuit duration (one pin to ground)
Infinite
Junction temperature
Soldering information: infrared or convection (30 sec)
−65
Storage temperature, Tstg
(1)
(2)
UNIT
+150
°C
260
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±1000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±250
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage (VCC)
MIN
MAX
UNIT
4.75
5.25
V
< 10
mV
Differential voltage between any two grounds
Analog input voltage,
AC coupled
Temperature range
(1)
(1)
0
VCC
V
–40
85
°C
The maximum power dissipation is a function of TJ(MAX), θJA and the ambient temperature TA. The maximum allowable power dissipation
at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.
6.4 Thermal Information
LMH6882
THERMAL METRIC (1)
NJK (WQFN)
UNIT
36 PINS
RθJA
Junction-to-ambient thermal resistance
33.6
RθJC(top)
Junction-to-case (top) thermal resistance
16.9
RθJB
Junction-to-board thermal resistance
7.8
ψJT
Junction-to-top characterization parameter
0.3
ψJB
Junction-to-board characterization parameter
7.7
RθJC(bot)
Junction-to-case (bottom) thermal resistance
3.5
(1)
4
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 Electrical Characteristics
The following specifications apply for single supply with VCC = 5 V, Maximum Gain (26 dB), RL = 200 Ω. (1) (2) (3)
TEST CONDITIONS
MIN (4)
TYP (5)
MAX (4)
UNIT
DYNAMIC PERFORMANCE
3dBBW
−3-dB Bandwidth
VOUT = 2 VPPD
2.4
NF
Noise Figure
Source Resistance (Rs) = 100 Ω
9.7
dB
OIP3
Output Third Order Intercept Point (6) f = 100 MHz, POUT = 4 dBm per tone, tone
spacing = 1 MHz
42
dBm
f = 200 MHz, POUT = 4 dBm per tone, tone
spacing = 2 MHz
40
OIP2
Output Second Order Intercept Point POUT= 4 dBm per Tone, f1 = 112.5 MHz,
f2=187.5 MHz
IMD3
Third Order Intermodulation
Products
GHz
76
dBm
f = 100 MHz, VOUT = 4 dBm per tone, tone
spacing = 1 MHz
−76
dBc
f = 200 MHz, POUT = 4 dBm per tone, tone
spacing = 2 MHz
−72
P1dB
1-dB Compression Point
Output power
17
dBm
HD2
Second Order Harmonic Distortion
f = 200 MHz, VOUT = 4 dBm
−70
dBc
HD3
Third Order Harmonic Distortion
f = 200 MHz, POUT = 4 dBm
−76
dBc
CMRR
Common Mode Rejection Ratio
Pin = −15 dBm, f = 100 MHz
−40
dBc
SR
Slew Rate
6000
V/us
(7)
Output Voltage Noise
Maximum Gain f > 1 MHz
47
nV/√Hz
Input Referred Voltage Noise
Maximum Gain f > 1 MHz
2.3
nV/√Hz
100
Ω
ANALOG I/O
RIN
Input Resistance
Differential, INPD to INMD
RIN
Input Resistance
Single Ended, INPS or INMS, 50-Ω
termination on unused input
50
VICM
Input Common Mode Voltage
Self Biased
2.5
Maximum Input Voltage Swing
Volts peak to peak, differential
Maximum Differential Output Voltage Differential, f < 10 MHz
Swing
ROUT
Output Resistance
Ω
V
2
VPPD
6
VPPD
Differential, f = 100 MHz
0.4
Parallel Inputs (INPD and INMD), Rs =
100 Ω
26
Ω
GAIN PARAMETERS
Maximum Voltage Gain
Single ended input (INMS or INPS), 50 Ω
Rs and 50 Ω termination on unused input.
Minimum Gain
Gain Code = 80d or 50h
Gain Steps
(2)
(3)
(4)
(5)
(6)
(7)
6
dB
80
Gain Step Size
(1)
dB
26.6
0.25
Gain Step Error
Any two adjacent steps over entire range
±0.125
Gain Step Phase Shift
Any two adjacent steps over entire range
±3
dB
dB
Degrees
Electrical Table values apply only for factory testing conditions at the temperature indicated. No specification of parametric performance
is indicated in the electrical tables under conditions different than those tested
Negative input current implies current flowing out of the device.
Drift determined by dividing the change in parameter at temperature extremes by the total temperature change.
Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using
Statistical Quality Control (SQC) methods.
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
OIP3 is the third order intermodulation intercept point. In this data sheet OIP3 numbers are single power measurements where OIP3 =
IMD3 / 2 + POUT (per tone). OIP2 is the second order intercept point where OIP2 = IMD2 + POUT (per tone). HD2 is the second order
harmonic distortion and is a single tone measurement. HD3 is the third order harmonic distortion and is a single tone measurement.
Power measurements are made at the amplifier output pins.
CMRR is defined as the differential response at the output in response to a common mode signal at the input.
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Electrical Characteristics (continued)
The following specifications apply for single supply with VCC = 5 V, Maximum Gain (26 dB), RL = 200 Ω.(1)(2)(3)
MIN (4)
TEST CONDITIONS
Channel to Channel Gain Matching
MAX (4)
UNIT
0.2
dB
Channel to Channel Phase Matching f= 100 MHz, over entire gain range
1.5
Degrees
Gain Step Switching Time
20
ns
15
ns
Enable/ Disable Time
f = 100 MHz, over entire gain range
TYP (5)
Settled to 90% level
POWER REQUIREMENTS
ICC
Supply Current
P
Power
ICC
Disabled Supply Current
200
270
mA
1
W
25
mA
V
ALL DIGITAL INPUTS
Logic Compatibility
TTL, 2.5 V CMOS, 3.3 V CMOS, 5 V CMOS
VIL
Logic Input Low Voltage
0.4
VIH
Logic Input High Voltage
2.0-5.0
V
IIH
Logic Input High Input Current
−9
μA
IIL
Logic Input Low Input Current
−47
μA
PARALLEL MODE TIMING
tGS
Setup Time
3
ns
tGH
Hold Time
3
ns
50
MHz
SERIAL MODE
fCLK
6
SPI Clock Frequency
50% duty cycle, ATE tested @ 10 MHz
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6.6 Typical Characteristics
(Unless otherwise specified, the following conditions apply: TA = 25°C, VCC = 5 V, RL = 200 Ω, Maximum Gain,
Differential Input.) (8)
35
50
45
25
20
40
OIP3 (dBm)
VOLTAGE GAIN (dB)
30
15
10
5
35
30
0
-5
-10
25
4dB Step
-15
20
10
100
1k
FREQUENCY (MHz)
10k
6
Figure 1. Frequency Response Over Gain Range
Figure 2. OIP3 vs Voltage Gain
OIP3, NOISE FIGURE (dBm, dB)
50
45
40
35
f = 100MHz
Tone Spacing = 1 MHz
50
20
45
18
40
16
35
DRF = IIP3 - NF
14
30
12
25
10
20
8
15
6
10
OIP3
Noise Figure
Dynamic Range Figure
5
30
0
-4
-2
0
2
4
6
8
10
OUTPUT POWER FOR EACH TONE (dBm)
Figure 3. OIP3 vs Output Power
8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)
6
4
2
DYNAMIC RANGE FIGURE (dB)
1
OIP3 (dBm)
f = 100 MHz
POUT= 4dBm / Tone
0
8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)
Figure 4. Dynamic Range Figure vs Voltage Gain
50
50
f = 100 MHz
POUT= 4dBm / Tone
45
OIP3 (dBm)
OIP3 (dBm)
45
40
35
40
30
35
Voltage Gain
26 dB
16 dB
6 dB
25
20
0
30
50 100 150 200 250 300 350 400
FREQUENCY (MHz)
Figure 5. OIP3 vs Frequency
(8)
Voltage Gain
26 dB
16 dB
6 dB
4.50
4.75
5.00
5.25
SUPPLY VOLTAGE (V)
5.50
Figure 6. OIP3 vs Supply Voltage
LMH6881 devices have been used for some typical performance plots.
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Typical Characteristics (continued)
90
50
f = 100 MHz
POUT= 4dBm
85
80
OIP2 (dBm)
OIP3 (dBm)
45
40
35
75
70
65
60
Temperature
- 40 °C
25 °C
85 °C
30
25
6
f1= 187.5 MHz
f2= 112.5 MHz
POUT= 4dBm / Tone
55
50
8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)
6
Figure 7. OIP3 vs Temperature
8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)
Figure 8. OIP2 vs Voltage Gain
27.0
100
26.5
98
MAXIMUM GAIN (dB)
SUPPLY CURRENT (mA)
99
97
96
95
94
93
92
26.0
25.5
25.0
24.5
91
90
24.0
-45 -30 -15 0 15 30 45 60 75 90
TEMPERATURE (°C)
-45 -30 -15 0 15 30 45 60 75 90
TEMPERATURE (°C)
Figure 9. Supply Current vs Temperature
Figure 10. Maximum Gain vs Temperature
-30
-30
Voltage Gain
26 dB
16 dB
6 dB
-40
-50
HD3 (dBc)
HD2 (dBc)
Voltage Gain
26 dB
-40
16 dB
6 dB
-50
-60
-70
-60
-70
-80
-80
-90
-90
-100
-100
0
50
100
150
200
250
Frequency (MHz)
300
350
400
0
D001
Pout = 4 dBm
50
100
150
200
250
Frequency (MHz)
300
350
400
D002
Pout = 4 dBm
Figure 11. HD2 vs Frequency
8
f = 100 MHz
POUT= 4.5dBm
Figure 12. HD3 vs Frequency
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Typical Characteristics (continued)
-40
-20
HD2
-50
-40
-60
f = 100 MHz
POUT = 4dBm
-70
HD2 (dBc)
HD2,HD3 (dBc)
Voltage Gain
26 dB
21 dB
10 dB
-30
HD3
-80
-50
-60
-70
-80
-90
-90
-100
-100
-110
6
8
-110
10 12 14 16 18 20 22 24 26
0
VOLTAGE GAIN (dB)
2
C001
Figure 13. HD2 & HD3 vs Voltage Gain
16
Figure 14. HD2 vs Output Power
-10
20
-30
-40
-50
-60
-70
-80
-90
f = 100 MHz
Voltage Gain = 26dB
15
OUTPUT POWER (dBm)
Voltage Gain
26 dB
21 dB
10 dB
-20
HD3 (dBc)
4
6
8 10 12 14
OUTPUT POWER (dBm)
10
5
0
-100
-110
-5
0
2
4
6
8 10 12 14
OUTPUT POWER (dBm)
16
-25
Figure 15. HD3 vs Output Power
1.0
50 MHz
200 MHz
0.5
0.1
0.0
-0.1
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-0.2
50 MHz
200 MHz
-3.0
6
0
Figure 16. Output Power vs Input Power
PHASE ERROR (Degrees)
AMPLITUDE ERROR (dB)
0.2
-20
-15
-10
-5
INPUT POWER (dBm)
8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)
Figure 17. Gain Step Amplitude Error
6
8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)
Figure 18. Gain Step Phase Error
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Typical Characteristics (continued)
0.6
2
PHASE ERROR (Degrees)
0.5
0.4
0.3
0.2
0.1
0.0
-0.1
1
0
-1
-2
-3
-0.2
-4
-0.3
-5
6
8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)
6
Figure 19. Cumulative Amplitude Error
13
12
NOISE FIGURE (dB)
NOISE FIGURE (dB)
20
15
10
11
10
9
8
5
7
0
6
6
8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)
0
Figure 21. Noise Figure vs Voltage Gain
4
Enable Control
Output Voltage
200
400
600
800
FREQUENCY (MHz)
1000
Figure 22. Noise Figure vs Frequency
5
4
16dB Gain Control
Ouptut Voltage
3
3
2
2
1
1
0
0
-1
4
3
3
2
2
1
1
0
-1
0
-1
-2
-1
OUTPUT VOLTAGE (V)
4
ENABLE CONTROL (V)
OUTPUT VOLTAGE (V)
10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)
14
25
10
8
Figure 20. Cumulative Phase Error
30
5
50 MHz
200 MHz
-2
0 10 20 30 40 50 60 70 80 90 100
TIME (ns)
0 10 20 30 40 50 60 70 80 90 100
TIME (ns)
Figure 23. Channel Enable Control Timing Behavior
Figure 24. 16-dB Gain Control Timing Behavior
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16dB GAIN CONTROL (V)
AMPLITUDE ERROR (dB)
3
50 MHz
200 MHz
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Typical Characteristics (continued)
4
3
3
2
2
1
1
0
0
-1
-1
-2
COMMON MODE REJECTION (dBc)
0
4
8 dB Gain Control
Output Voltage
8 dB GAIN CONTROL (V)
-10
-20
-30
-40
-50
-60
1
0 10 20 30 40 50 60 70 80 90 100
TIME (ns)
Figure 25. 8-dB Gain Control Timing Behavior
50
40
OUTPUT IMPEDANCE (Ω)
100
INPUT IMPEDANCE (Ω)
1k
Figure 26. Common Mode Rejection (Sdc21) vs Frequency
125
75
R
X
50
Impedance = R + j X
25
0
-25
Impedance = R + j X
R
X
30
20
10
0
-10
-20
-30
-40
-50
-50
0
400
800
1200 1600
FREQUENCY (MHz)
2000
0
Figure 27. Differential Input Impedance
0
2.00
1.75
GAIN MATCHING (dB)
-30
-40
-50
-60
-70
-80
Gain
Phase
-100
10
Figure 29. Crosstalk
2.00
1.75
1.50
1.25
1.25
1.00
1.00
0.75
f = 100 MHz
CHA - CHB
0.50
10k
0.75
0.50
0.25
0.00
100
1k
FREQUENCY (MHz)
2000
1.50
0.25
-90
400
800
1200 1600
FREQUENCY (MHz)
Figure 28. Differential Output Impedance
-10
-20
CROSSTALK (dBc)
10
100
FREQUENCY (MHz)
PHASE MATCHING (Degrees)
OUTPUT VOLTAGE (V)
5
0.00
6
8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)
Figure 30. Channel A to Channel B Gain and Phase
Matching
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Typical Characteristics (continued)
GAIN MATCHING (dB)
OIP3 (dBm)
45
40
35
30
25
f = 100 MHz
POUT= 4dBm / Tone
1.50
1.25
1.00
1.00
0.75
f = 100 MHz
CHA - CHB
0.50
Figure 31. OIP3 Overvoltage Gain Range
0.75
0.50
0.25
0.00
6
8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)
1.75
1.25
0.00
6
2.00
1.50
0.25
20
12
Gain
Phase
1.75
PHASE MATCHING (Degrees)
2.00
50
8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)
Figure 32. Channel A to Channel B Gain and Phase
Matching
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6.6.1 Single-Ended Input
(Unless otherwise specified, the following conditions apply: TA = 25°C, VCC = 5 V, RL = 200Ω, Maximum Gain,
Differential Input).
-30
50
Volt Gain
26 dB
16 dB
6 dB
-40
-50
HD2 (dBc)
OIP3 (dBm)
45
40
-60
-70
-80
35
Single Ended Input
f = 100 MHz, 1MHz Spacing
POUT= 4dBm / Tone
-90
0
50
100
150
200
250
Frequency (MHz)
30
6
350
400
D001
Pout = 4 dBm
8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)
Figure 34. HD2 vs Frequency Across Gain Settings
Figure 33. OIP3 vs Voltage Gain
-30
-30
Volt Gain
26 dB
16 dB
6 dB
-40
HD2
HD3
-40
-50
HD2, HD3 (dBc)
-50
HD3 (dBc)
300
-60
-70
-80
-60
-70
-80
-90
-90
-100
-100
-110
0
50
100
150
200
250
Frequency (MHz)
300
350
400
6
8
Pout = 4 dBm
12
f = 100 MHz
Figure 35. HD3 vs Frequency Across Gain Settings
14
16
18
20
Voltage Gain (dB)
22
24
26
D003
Pout = 4 dBm
Figure 36. HD2 & HD3 vs Voltage Gain
20
60
f = 100 MHz
50
INPUT IMPEDANCE ( )
18
NOISE FIGURE (dB)
10
D002
16
14
12
10
30
Impedance = R + j X
20
10
0
8
-10
6
-20
6
R
X
40
8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)
Figure 37. Noise Figure vs Voltage Gain
0
400
800
1200 1600
FREQUENCY (MHz)
2000
Figure 38. Input Impedance
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7 Detailed Description
7.1 Overview
The LMH6882 has been designed to replace traditional, fixed-gain amplifiers, as well as variable-gain amplifiers,
with an easy-to-use device which can be flexibly configured to many different gain settings while maintaining
excellent performance over the entire gain range. Many systems can benefit from this programmable-gain, DCcapable, differential amplifier. Last minute design changes can be implemented immediately, and external
resistors are not required to set the gain. Gain control is enabled with a parallel- or a serial-control interface and
as a result, the amplifier can also serve as a digitally controlled variable-gain amplifier (DVGA) for automatic gain
control applications. Figure 50 and Figure 53 show typical implementations of the amplifier.
The LMH6882 is a fully differential amplifier optimized for signal path applications up to 1000 MHz. The
LMH6882 has a 100-Ω input impedance and a low (less than 0.5 Ω) impedance output. The gain is digitally
controlled over a 20 dB range from 26 dB to 6 dB. The LMH6882 is designed to replace fixed-gain differential
amplifiers with a single, flexible-gain device. It has been designed to provide good noise figure and OIP3 over the
entire gain range. This design feature is highlighted by the Dynamic Range Figure of merit (DRF). Traditional
variable gain amplifiers generally have the best OIP3 and NF performance at maximum gain only.
7.2 Functional Block Diagram
SD
SPI
Power Down A
INPSA
INPDA
OUTPA
AMP_In
INMDA
AMP_Out
OUTMA
ATTEN
X2
INMSA
OCMA
Decode
SPI
SPI
D0 - D6
Power Down A
Power Down B
Parallel
Decode
INMSB
X2
ATTEN
INMDB
AMP_In
OCMB
OUTMB
AMP_Out
OUTPB
INPDB
INPSB
Power Down B
SPI
SD
7.3 Feature Description
The LMH6882 has three functional stages, a low-noise amplifier, followed by a digital attenuator, and a lowdistortion, low-impedance output amplifier. The amplifier has four signal input pins to accommodate both
differential signals and single-ended signals. The amplifier has an OCM pin used to set the output common-mode
voltage. There is a gain of 2 on this pin so that 1.25 V applied on that pin will place the output common mode at
2.5 V.
14
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Feature Description (continued)
+5V
0.01 PF
SOURCE
LOAD
VCC
INMS
50:
49.9:
OUT+
INMD
VCM 2.5V
AC
VCM 2.5V
LMH6882
INPD
100:
OUT-
50:
49.9:
INPS
OCM
0.01 PF
1.25V
Figure 39. Typical Implementation With a Differential Input Signal
+5V
0.01 PF
SOURCE
LOAD
50:
VIN 2.5V INMS
VCC
OUT+
INMD
49.9:
AC
VCM 2.5V
LMH6882
INPD
100:
OUT-
INPS
49.9:
50:
0.01 PF
OCM
0.01 PF
2.5V
1.25V
Figure 40. Typical Implementation With a Single-Ended Input Signal
7.4 Device Functional Modes
The LMH6882 will support two modes of control for its gain: a parallel mode and a serial mode (SPI compatible).
Parallel mode is fastest and requires the most board space for logic line routing. Serial mode is compatible with
existing SPI-compatible systems. The device has gain settings covering a range of 20 dB. In parallel mode, only
2-dB steps are available. The serial interface should be used for finer gain control of 0.25 dB for a gain between
6 dB and 26 dB of voltage gain. If fixed gain is desired, the digital pins can be strapped to ground or VCC, as
required.
The device also supports two modes of power down control to enable power savings when the amplifier is not
being used: using the SD pin (when SPI pin = Logic 0) and the power-down register (when SPI pin = Logic 1).
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7.5 Programming
7.5.1 Digital Control of the Gain and Power-Down Pins
The LMH6882 was designed to interface with 2.5-V to 5-V CMOS logic circuits. If operation with 5-V logic is
required care should be taken to avoid signal transients exceeding the amplifier supply voltage. Long,
unterminated digital signal traces should be avoided. Signal voltages on the logic pins that exceed the device
power-supply voltage may trigger ESD protection circuits and cause unreliable operation. Some digital inputoutput pins have different functions depending on the digital control mode. Table 1 shows the mapping of the
digital pins. These functions for each pin will be described in the sections Parallel Interface and SPI-Compatible
Serial Interface.
While the full gain range is available in parallel mode both channels must be set to the same gain. If independent
channel control is desired, SPI mode must be used.
Table 1. Pins With Dual Functions
PIN
SPI = 0
SPI = 1
7
D1
SDI
14
D0
SDO
8
D2
CLK
9
D3
CS (active low)
(1)
(1)
Pin 14 requires external bias. See SPI-Compatible Serial Interface for details.
7.5.2 Parallel Interface
Parallel mode offers the fastest gain update capability with the drawback of requiring the most board space
dedicated to control lines. To place the LMH6882 into parallel mode the SPI pin (pin 27) is set to the logical zero
state. Alternately, the SPI pin can be connected directly to ground. The SPI pin has a weak internal resistor to
ground. If left unconnected, the amplifier will operate in parallel mode.
In parallel mode the gain can be changed in 0.25-dB steps with a 7-bit gain control bus. The attenuator control
pins are internally biased to logic high state with weak pull-up resistors, with the exception of D0 (pin 14) which is
biased low due to the shared SDO function. If the control bus is left unconnected, the amplifier gain will be set to
6 dB. Table 2 shows the gain of the amplifier when controlled in parallel mode.
The LMH6882 has a 7-bit gain control bus. Data from the gain control pins is immediately sent to the gain circuit
(that is, gain is changed immediately). To minimize gain change glitches all gain pins should change at the same
time. Gain glitches could result from timing skew between the gain set bits. This is especially the case when a
small gain change requires a change in state of three or more gain control pins. If necessary the PDA could be
put into a disabled state while the gain pins are reconfigured and then brought active when they have settled.
Table 2. Gain Change Values for the Parallel-Gain Pins
PIN
NAME
GAIN STEP SIZE (dB)
14
D0
0.25
7
D1
0.5
8
D2
1
9
D3
2
21
D4
4
20
D5
8
19
D6
16
Gain combinations that exceed 80 will result in minimum gain of 6 dB.
16
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Table 3. Amplifier Gain for Selected Control Pin Combinations
CONTROL PINS LOGICAL LEVEL IN PARALLEL MODE. (X = DON'T
CARE)
GAIN = 26 - 0.25 × DECIMAL VALUE AND GAIN
≥ 6 dB
D6
D5
D4
D3
D2
D1
D0
Decimal/
Hex
Value
0
0
0
0
0
0
0
0/0
26
0
0
0
0
0
0
1
1/1
25.75
0
0
0
0
0
1
0
2/2
25.5
0
0
0
0
0
1
1
3/3
25.25
0
0
0
0
1
0
0
4/4
25
0
0
0
0
1
0
1
5/5
24.75
0
0
0
0
1
1
0
6/5
24.5
0
0
0
0
1
1
1
7/7
24.25
0
0
0
1
0
0
0
8/8
24
0
0
1
0
0
0
0
16 / 10
22
0
0
1
1
0
0
0
24 / 18
20
0
1
0
0
0
0
0
32 / 20
18
0
1
0
1
0
0
0
40 / 28
16
0
1
1
0
0
0
0
48 / 30
14
0
1
1
1
0
0
0
56 / 38
12
1
0
0
0
0
0
0
64 / 40
10
1
0
0
1
0
0
0
72 / 48
8
1
0
1
0
0
0
0
80 / 50
6
1
0
1
X
X
X
X
> 80 / 50
6
1
1
X
X
X
X
X
> 80 / 50
6
Amplifier Voltage Gain (dB)
For fixed-gain applications the attenuator control pins should be connected to the desired logic state instead of
relying on the weak internal bias. Data from the gain-control pins directly drive the amplifier gain circuits. To
minimize gain change glitches all gain pins should be driven with minimal skew. If gain-pin timing is uncertain,
undesirable transients can be avoided by using the shutdown pin to disable the amplifier while the gain is
changed. Gain glitches are most likely to occur when multiple bits change value for a small gain change, such as
the gain change from 10 dB to 12 dB which requires changing all 4 gain control pins.
A shutdown pin (SD == 0, amplifier on, SD == 1, amplifier off) is provided to reduce power consumption by
disabling the highest power portions of the amplifier. The digital control circuit is not shut down and will preserve
the last active gain setting during the disabled state. See the Typical Characteristics section for disable and
enable timing information. The SD pin is functional in parallel mode only and disabled in serial mode.
LMH6882
CONTROL LOGIC
Shutdown
SD
0.25 dB Step
0.5 dB Step
D0
D1
1 dB Step
D2
D3
2 dB Step
4 dB Step
D4
8 dB Step
D5
16 dB Step
D6
Figure 41. Parallel Mode Connection
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7.5.3 SPI-Compatible Serial Interface
The serial interface allows a great deal of flexibility in gain programming and reduced board complexity. The
LMH6882 serial interface is a generic 4-wire synchronous interface compatible with SPI type interfaces that are
used on many microcontrollers and DSP controllers. Using only 4 wires, the SPI mode offers access to the 0.25dB gain steps of the amplifier.
For systems where gain is changed only infrequently, or where only slower gain changes are required, serial
mode is the best choice. To place the LMH6882 into serial mode the SPI pin (Pin 27) should be put into the logic
high state. Alternatively the SPI pin can be connected directly to the 5-V supply bus. In this configuration the pins
function as shown in Table 2. The SPI interface uses the following signals: clock input (CLK); serial data in (SDI);
serial data out (SDO); and serial chip select (CS). The chip-select pin is active low meaning the device is
selected when the pin is low.
The SD pin is inactive in the serial mode. This pin can be left disconnected for serial mode. The SPI interface
has the ability to shutdown the amplifier without using the SD pin.
The CLK pin is the serial clock pin. It is used to register the input data that is presented on the SDI pin on the
rising edge and to source the output data on the SDO pin on the falling edge. The user may disable clock and
hold it in the low state, as long as the clock pulse-width minimum specification is not violated when the clock is
enabled or disabled. The clock pulse-width minimum is equal to one setup plus one hold time, or 6 ns.
The CS pin is the chip-select pin. This pin is active low; the chip is selected in the logic low state. Each assertion
starts a new register access - i.e., the SDATA field protocol is required. The user is required to de-assert this
signal after the 16th clock. If the CS pin is de-asserted before the 16th clock, no address or data write will occur.
The rising edge captures the address just shifted in and, in the case of a write operation, writes the addressed
register. There is a minimum pulse-width requirement for the deasserted pulse - which is specified in the
Electrical Characteristics section.
The SDI pin is the input pin for the serial data. It must observe setup / hold requirements with respect to the
SCLK. Values can be found in the Electrical Characteristics table (refer to electrical table of the DS). Each write
cycle is 16-bit long.
The SDO pin is the data output pin. This output is normally at a high-impedance state, and is driven only when
CS is asserted. Upon CS assertion, contents of the register addressed during the first byte are shifted out with
the second 8 SCLK falling edges. The SDO pin is a current output and requires external bias resistor to develop
the correct logic voltage. See Figure 43 for details on sizing the external bias resistor. Resistor values of 180 Ω
to 400 Ω are recommended. The SDO pin can source 10 mA in the logic high state. With a bias resistor of 250 Ω
the logic 1 voltage would be 2.5 V. In the logic 0 state, the SDO output is off, and no current flows, so the bias
resistor will pull the voltage to 0 V.
Each serial interface access cycle is exactly 16 bits long as shown in Figure 42. Each signal's function is
described below. the read timing is shown in Figure 44.
The external bias resistor means that in the high impedance state the SDO pin impedance is equal to the
external bias resistor value. If bussing multiple SPI devices make sure that the SDO pins of the other devices
can drive the bias resistor.
The serial interface has 6 registers with address [0] to address [6]. Table 4 shows the content of each SPI
register. Registers 0 and 1 are read only. Registers 2 through 6 are read/write and control the gain and power of
the amplifier. Register contents and functions are detailed below.
Table 4. SPI Registers by Address and Function
Address
R/W
Name
Default Value Hex (Dec)
0
R
Revision ID
1 (1)
1
R
Product ID
21 (33)
2
R/W
Power Control
0 (0)
3
R/W
Attenuation A
50 (80)
4
R/W
Attenuation B
50 (80)
5
R/W
Channel Control
3 (3)
18
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Table 5. Serial Word Format for Register 2: Power Control
7
6
5
4
3
2
1
0
RES
RES
CHA1
CHB1
CHA2
CHB2
RES
RES
CHA1 and CHA2 = 0 for ON, CHA1 and CHA2 = 1 for OFF
CHB1 and CHB2 = 0 for ON, CHB1 and CHB2 = 1 for OFF
Table 6. Serial Word Format for Registers 3, 4: Gain Control
7
6
RES
Gain = 26 — (register value * 0.25) valid range is 0 to 80
5
4
3
2
1
0
Table 7. Serial Word Format for Register 5: Channel Control
7
6
5
4
3
RES
2
1
1
SYNC
Load A
Load B
The Channel Control register controls how registers 3 and 4 work. When the SYNC bit is set to 1 both channel A
and channel B are set to the gain indicated in register 3. When the SYNC bit is set to zero, register 3 controls
channel A, and register 4 controls channel B. When the Load A bit is zero data written to register 3 does not
transfer to channel A. When the Load A bit is set to 1 the gain of channel A is set equal to the value indicated in
register 3. The Load B bit works the same for channel B and register 4.
1
2
3
4
C7
C6
C5
C4
R/Wb
0
0
0
5
6
7
8
C3
C2
C1
C0
A3
A2
A1
A0
9
10
11
D7
D6
(MSB)
D5
12
13
14
15
16
D2
D1
D0
(LSB)
D2
D1
17
SCLK
SCSb
COMMAND FIELD
SDI
Reserved (3-bits)
DATA FIELD
D4
D3
Write DATA
Address (4-bits)
D7
D6
(MSB)
D5
D4
D3
D0
(LSB)
Hi-Z
Read DATA
SDO
Data (8-bits)
Single Access Cycle
Figure 42. Serial Interface Protocol (SPI Compatible)
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Control Logic
LMH6882
CLK
CS
SDI
Clock out
Chip Select out
Data Out (MOSI)
Data In (MISO)
SDO
R
10 mA
Typ
For SDO (MISO) pin only:
VOH = R x 0.010A,
VOL = 0V
Recommended:
R = 250: to 400:
Figure 43. Internal Operation of the SDO Pin
R/Wb
Read / Write bit. A value of 1 indicates a read operation, while a value of 0 indicates a write
operation.
Reserved
Not used. Must be set to 0.
ADDR:
Address of register to be read or written.
DATA
In a write operation the value of this field will be written to the addressed register when the chipselect pin is deasserted. In a read operation this field is ignored.
st
1 clock
th
th
8 clock
16
clock
SCLK
tCSH
tCSS
tCSH
tCSS
CSb
tOZD
SDO
tODZ
tOD
D7
D1
D0
Figure 44. Read Timing
20
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Input Characteristics
The LMH6882 has internally terminated inputs. The INMD and INPD pins are intended to be the differential input
pins and have an internal 100-Ω resistive termination. An example differential circuit is shown in Figure 39. When
using the differential inputs, the single-ended inputs should be left disconnected.
The INMS and INPS pins are intended for use as single-ended inputs and have been designed to support singleended termination of 50 Ω working as an active termination. For single-ended signals an external 50-Ω resistor is
required as shown in Figure 40. When using the single-ended inputs, the differential inputs should be left
disconnected.
All of the input pins are self biased to 2.5 V. When using the LMH6882 for DC-coupled applications, it is possible
to externally bias the input pins to voltages from 1.5 V to 3.5 V. Performance is best at the 2.5-V level specified.
Performance will degrade slightly as the common mode shifts away from 2.5 V.
The first stage of the LMH6882 is a low-noise amplifier that can accommodate a maximum input signal of 2 Vppd
on the differential input pins and 1 Vpp on either of the single-ended pins. Signals larger than this will cause
severe distortion. Although the inputs are protected against ESD, sustained electrical overstress will damage the
part. Signal power over 13 dBm should not be applied to the amplifier differential inputs continuously. On the
single-ended pins the power limit is 10 dBm for each pin.
8.1.2 Output Characteristics
The LMH6882 has a low-impedance output very similar to a traditional Op-amp output. This means that a wide
range of loads can be driven with good performance. Matching load impedance for proper termination of filters is
as easy as inserting the proper value of resistor between the filter and the amplifier (See Figure 50 for example.)
This flexibility makes system design and gain calculations very easy. By using a differential output stage the
LMH6882 can achieve large voltage swings on a single 5-V supply. This is illustrated in Figure 45. This figure
shows how a voltage swing of 4 Vppd is realized while only swinging 2 Vpp on each output. A 1-Vp signal on one
branch corresponds to 2 Vpp on that branch and 4 Vppd when looking at both branches (positive and negative).
5.0
4.5
4VPPD
4.0
VOUT(V)
3.5
3.0
2.5
2.0
2VPP
1.5
1.0
0.5
0.0
0.0
Out Plus
Out Minus
Differential Vout
0.9 1.8 2.7 3.6 4.5 5.4
PHASE ANGLE (Radians)
Figure 45. Differential Output Voltage
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Application Information (continued)
The LMH6882 has been designed for both AC-coupled and DC-coupled applications. To give more flexibility in
DC-coupled applications, the common-mode voltage of the output pins is set by the OCM pin. The OCM pin
needs to be driven from an external low-noise source. If the OCM pin is left floating, the output common-mode is
undefined, and the amplifier will not operate properly.
There is a DC gain of 2 between the OCM pin and the output pins so that the OCM voltage should be between 1
V and 1.5 V. This will set the output common mode voltage between 2 V and 3 V. Output common-mode
voltages outside the recommended range will exhibit poor voltage swing and distortion performance. The
amplifier will give optimum performance when the output common mode is set to half of the supply voltage (2.5 V
or 1.25 V at the OCM pin).
The ability of the LMH6882 to drive low-impedance loads while maintaining excellent OIP3 performance creates
an opportunity to greatly increase power gain and drive low-impedance filters. This gives the system designer
much needed flexibility in filter design. In many cases using a lower impedance filter will provide better
component values for the filter. Another benefit of low-impedance filters is that they are less likely to be
influenced by circuit board parasitic reactances such as pad capacitance or trace inductance. The output stage is
a low-impedance voltage amplifier, so voltage gain is constant over different load conditions. Power gain will
change based on load conditions. See Figure 46 for details on power gain with respect to different load
conditions. The graph was prepared for the 26 dB voltage gain. Other gain settings will behave similarly.
All measurements in this data sheet, unless specified otherwise, refer to voltage or power at the device output
pins. For instance, in an OIP3 measurement the power out will be equal to the output voltage at the device pins
squared, divided by the total load voltage. In back-terminated applications, power to the load would be 3 dB less.
Common back-terminated applications include driving a matched filter or driving a transmission line.
POWER GAIN AT LOAD (dB)
24
22
20
18
16
14
12
0
100
200
300
LOAD IMPEDANCE ( )
400
Figure 46. Power Gain as a Function of the Load
Printed circuit board (PCB) design is critical to high-frequency performance. In order to ensure output stability the
load-matching resistors should be placed as close to the amplifier output pins as possible. This allows the
matching resistors to mask the board parasitics from the amplifier output circuit. An example of this is shown in
Figure 50. Also note that the low-pass filters in Figure 48 and Figure 49 use center-tapped capacitors. Having
capacitors to ground provides a path for high-frequency, common-mode energy to dissipate. This is equally
valuable for the ADC, so there are also capacitors to ground on the ADC side of the filter. The LMH6882EVAL
evaluation board is available to serve a guide for system board layout. See also application note AN-2235
(SNOA869) for more details.
8.1.3 Interfacing to an ADC
The LMH6882 is an excellent choice for driving high-speed ADCs such as the ADC12D1800RF,
ADC12D1600RF or the ADS5400. The following sections will detail several elements of ADC system design,
including noise filters, AC, and DC coupling options.
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Application Information (continued)
8.1.3.1 ADC Noise Filter
When connecting a broadband amplifier to an analog to digital converter it is nearly always necessary to filter the
signal before sampling it with the ADC. Figure 47 shows a schematic of a second order Butterworth filter and
Table 8 shows component values for some common IF frequencies. These filters, shown in Table 8, offer a good
compromise between bandwidth, noise rejection and cost. This filter topology is the same as is used on the
ADC14V155KDRB High IF Receiver reference design board. This filter topology is adequate for reducing aliasing
of broadband noise and will also provide rejection of harmonic distortion and many of the images that are
commonly created by mixers.
R1
AMP VOUT -
L1
C1
L5
L2
AMP VOUT +
ADC ZIN
C2
R4
C3
R3
ADC VIN +
ADC VIN -
R2
ADC VCM
Figure 47. Sample Filter
Table 8. Filter Component Values (1)
CENTER
FREQUENCY
BANDWIDTH
R1, R2
L1, L2
C1, C2
C3
L5
R3, R4
75 MHz
40 MHz
90 Ω
390 nH
10 pF
22 pF
220 nH
100 Ω
150 MHz
60 MHz
90 Ω
370 nH
3 pF
19 pF
62 nH
100 Ω
180 MHz
75 MHz
90 Ω
300 nH
2.7 pF
15 pF
54 nH
100 Ω
250 MHz
100 MHz
90 Ω
225 nH
1.9 pF
11 pF
36 nH
100 Ω
(1)
Resistor values are approximate, but have been reduced due to the internal 10 Ω of output resistance per pin.
8.1.3.2 AC Coupling to an ADC
AC coupling is an effective method for interfacing to an ADC for many communications systems. In many
applications this will be the best choice. The LMH6882 evaluation board is configured for AC coupling as shipped
from the factory. Coupling with capacitors is usually the most cost-effective method. Transformers can provide
both AC coupling and impedance transformation as well as single-ended-to-differential conversion. One of the
key benefits of AC coupling is that each stage of the system can be biased to the ideal DC operating point. Many
systems operate with lower overall power dissipation when DC bias currents are eliminated between stages.
8.1.3.3 DC Coupling to an ADC
The LMH6882 supports DC-coupled signals. In order to successfully implement a DC-coupled signal chain the
common-mode voltage requirements of every stage need to be met. This requires careful planning, and in some
cases there will be signal-level, gain or termination compromises required to meet the requirements of every part.
Shown in Figure 48 and Figure 49 is a method using resistors to change the 2.5-V common mode of the
amplifier output to a common mode compatible for the input of a low-input voltage ADC such as the
ADC12D1800RF. This DC level shift is achieved while maintaining an AC impedance match with the filter in
Figure 48 while in Figure 49 there is a small mismatch between the amplifier termination resistors and the ADC
input. Because there is no universal ADC input common mode, and some ADC’s have impedance controlled
input, each design will require a different resistor ratio. For high-speed data-conversion systems it is very
important to keep the physical distance between the amplifier and the ADC electrically short. When connections
between the amplifier and the ADC are electrically short, termination mismatches are not critical.
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LMH6882
50:
INPS
RIN = 50:
ROUT
N/C
RT
75:
LPF
INPD
50:
VCM = 2.5V
N/C
ADC
VCM =1.5V
300:
RL
INMD
50:
ROUT
75:
RT
x2
INMS
OCM
+1.25V
50:
Parallel termination = 2* RT || RL = 150 || 300 =
100:
VCM voltage divider = 2.5V * RT/(ROUT + RT) =
2.5 * 75/125 = 1.5 V
+2.5V
Figure 48. DC-Coupled ADC Driver Example 1, High Input Impedance ADC
LMH6882
N/C
INSP
ROUT
100:
RT
OUTM
INDP
100:
OUTP
INDM
100:
N/C
CM
100:
RT
+1.25V
x2
ROUT
INSM
ADC
V=1.25V
V =2.5V
100:
OCM
Figure 49. DC-Coupled ADC Driver Example 2, ADC12D1800RF with Terminated Input
8.1.4 Figure of Merit: Dynamic Range Figure
The dynamic range figure (DRF) as illustrated in Figure 4, is defined as the input third order intercept point (IIP3)
minus the noise figure (NF). The combination of noise figure and linearity gives a good proxy for the total
dynamic range of an amplifier. In some ways this figure is similar to the SFDR of an analog to digital converter.
In contrast to an ADC, however, an amplifier will not have a full-scale input to use as a reference point. With
amplifiers, there is no one point where signal amplitude hits “full scale”. Yet, there are real limitations to how
large a signal the amplifier can handle. Normally, the distortion products produced by the amplifier will determine
the upper limit to signal amplitude. The intermodulation intercept point is an imaginary point that gives a wellunderstood figure of merit for the maximum signal an amplifier can handle. For low-amplitude signals the noise
figure gives a threshold of the lowest signal that the amplifier can reproduce. By combining the third-order input
intercepts point and the noise figure the DRF gives a very good indication of the available dynamic range offered.
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Table 9. Compatible High-Speed Analog-to-Digital Converters
PRODUCT NUMBER
MAX SAMPLING RATE (MSPS)
RESOLUTION
CHANNELS
ADC12D1800RF
1800
12
DUAL
ADC12D1600RF
1600
12
DUAL
ADC12D1000RF
1000
12
DUAL
ADS5400
1000
12
SINGLE
ADC12D1800
1800
12
DUAL
ADC12D1600
1600
12
DUAL
ADC12D1000
1000
12
DUAL
ADC10D1000
1000
10
DUAL
ADC10D1500
1500
10
DUAL
ADC12C105
105
12
SINGLE
ADC12C170
170
12
SINGLE
ADC12V170
170
12
SINGLE
ADC14C080
80
14
SINGLE
ADC14C105
105
14
SINGLE
ADC14DS105
105
14
DUAL
ADC14155
155
14
SINGLE
ADC14V155
155
14
SINGLE
ADC16V130
130
16
SINGLE
ADC16DV160
160
16
DUAL
ADC08D500
500
8
DUAL
ADC08500
500
8
SINGLE
ADC08D1000
1000
8
DUAL
ADC081000
1000
8
SINGLE
ADC08D1500
1500
8
DUAL
ADC081500
1500
8
SINGLE
ADC08(B)3000
3000
8
SINGLE
ADC08100
100
8
SINGLE
ADCS9888
170
8
SINGLE
ADC08(B)200
200
8
SINGLE
ADC11C125
125
11
SINGLE
ADC11C170
170
11
SINGLE
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8.2 Typical Applications
8.2.1 LMH6882 Typical Application
+5V
100:
FILTER
0.01 PF
RF
49.9:
100:
LMH6882
100:
FILTER
2.5V
ADS5400
49.9:
0.01 PF
LO
7
OCM 1.25V
GAIN 0-6
SD
Figure 50. LMH6882 Typical Application
8.2.1.1 Design Requirements
Figure 50 shows a design example for an IF amplifier in a typical direct-IF receiver application and LMH6881
meets these requirements.
Table 10. Example Design Requirement for an IF Receiver Application
SPECIFICATION
EXAMPLE DESIGN REQUIREMENT
Supply Voltage and Current
4.75V to 5.25V, with a minimum 150-mA supply current
Input structure and Impedance
DC coupled Single-ended or Differential with 100Ω input differential
impedance
Output control
DC coupled with output common mode control capability
RF input frequency range
DC to 250MHz
Voltage Gain Range
26dB to 6dB
OIP3 in RF input frequency range for Pout = 4dBm/tone with
RL = 200Ω
> 38 dBm at 200MHz for Max Gain
Noise Figure
< 12dB at Max Gain across RF input frequency
Attenuation Control
Parallel control as well as SPI control
8.2.1.2 Detailed Design Procedure
The LMH6882 device can be included in most receiver applications by following these basic procedures:
• Select an appropriate input drive circuitry to the LMH6882 by frequency planning the signal chain properly
such that the down-converted input signal is within the input frequency specifications of the device. Identify
whether dc-or ac-coupling is required or filtering is needed to optimize the system. Follow the guidelines
mentioned in Input Characteristics for interfacing the LMH6882 inputs.
• Choose the right speed grade ADC that meets the signal bandwidth application. Based upon the noise
filtering and anti-aliasing requirement , determine the right order & type for the anti-aliasing filter. Follow the
guidelines mentioned in Output Characteristics and Interfacing to an ADC when interfacing the device to an
anti-aliasing filter.
• Optimize the signal chain gain leading up to the ADC for best SNR and SFDR performance by employing the
device in automatic gain control (AGC) loop using serial or parallel digital interface.
• While interfacing the digital inputs, verify the electrical and functional compatibility of the LMH6882 digital
input pins with the external micro-controller (µC).
• Choose the appropriate power-supply architecture and supply bypass filtering devices to provide stable, low
noise supplies as mentioned in the Power Supply Recommendations.
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50
30
45
25
NOISE FIGURE (dB)
OIP3 (dBm)
8.2.1.3 Application Curves
40
35
30
Voltage Gain
26 dB
16 dB
6 dB
25
20
0
20
15
10
5
0
50 100 150 200 250 300 350 400
FREQUENCY (MHz)
6
Figure 51. OIP3 vs Frequency
8 10 12 14 16 18 20 22 24 26
VOLTAGE GAIN (dB)
Figure 52. Noise Figure vs Voltage Gain
8.2.2 LMH6882 Used as Twisted Pair Cable Driver
VCC
:
0.01 PF
49.9:
CAT5
100:
:
LMH6882
49.9:
0.01 PF
5
GAIN 0-3
Rx
100:
1.25V
OCM
SD
Figure 53. LMH6882 Used as Twisted Pair Cable Driver
8.2.2.1 Design Requirements
Table 11 shows a design example for LMH6882 used as cable driver for driving un-shielded twisted pair (UTP)
CAT-5 cables.
Table 11. Example Design Requirement for a Cable Driver
SPECIFICATION
EXAMPLE DESIGN REQUIREMENT
Supply Voltage and Current
4.75 V to 5.25 V, with a minimum 150-mA supply current
Input to Output Device Configuration
Single-ended input to differential output
Input frequency range
0.1 to 100 MHz
Voltage Gain Range
26-dB to 6-dB gain range
Output voltage swing
4 Vppdiff into a 200-Ω load at the output
Cable length to be driven
300 to 400 feet
8.2.2.2 Detailed Design Procedure
The LMH6882 device can be used as a cable driver to drive (UTP) CAT-5 cable by following these basic
procedures:
• Select an appropriate input buffer or drive circuitry to the LMH6882 that provides pre-equalization in the
frequency range of interest that needs to be driven down the CAT-5 cable. The cable usually presents
attenuation of the signal at the receive end which is proportional to the length of the cable and the frequency
being transmitted. In some cases, use of the pre-equalization buffer is not possible which mandates the use
of a post-equalizer at the receive end to gain up the received signal.
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•
•
•
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Determine the maximum output swing required to be transmitted in-order to receive the signal with good
signal integrity. When driving long cable lengths, there is a possibility of corruption of differential signals due
to common mode signals which requires the use of devices that offer good common mode rejection. Also,
care must be taken to match the source impedance with the characteristic impedance of the CAT-5 cable to
minimize signal reflections at higher frequencies. The LMH6882 offers low differential output resistance that
makes source matching of driven cable very convenient.
Verify the electrical and functional compatibility when interfacing LMH6882 digital input pins with the external
micro-controller (µC).
Also, use appropriate power-supply architecture and supply bypass filtering devices to provide stable, low
noise supplies as mentioned in the Power Supply Recommendations.
8.2.2.3 Application Curves
0
15
COMMON MODE REJECTION (dBc)
OUTPUT POWER (dBm)
20
f = 100 MHz
Voltage Gain = 26dB
10
5
0
-5
-25
-20
-15
-10
-5
INPUT POWER (dBm)
-20
-30
-40
-50
-60
1
0
Figure 54. Output Power vs Input Power
28
-10
10
100
FREQUENCY (MHz)
1k
Figure 55. Common Mode Rejection (Sdc21) vs Frequency
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9 Power Supply Recommendations
The LMH6882 was designed to be operated on 5-V power supplies. The voltage range for VCC is 4.75 V to 5.25
V. Power supply accuracy of 5% or better is advised. When operated on a board with high-speed digital signals it
is important to provide isolation between digital-signal noise and the analog input pins. The SP16160CH1RB
reference board provides an example of good board layout.
Each power supply pin should be decoupled with a low inductance, surface-mount ceramic capacitor of
approximately 10 nF as close to the device as possible. When vias are used to connect the bypass capacitors to
a ground plane the vias should be configured for minimal parasitic inductance. One method of reducing via
inductance is to use multiple vias. For broadband systems two capacitors per supply pin are advised.
To avoid undesirable signal transients the LMH6882 should not be powered on with large inputs signals present.
Careful planning of system power-on sequencing is especially important to avoid damage to ADC inputs when an
ADC is used in the application.
10 Layout
10.1 Layout Guidelines
It is very important to employ good high-speed layout techniques when dealing with devices having relatively
high gain bandwidth in excess of 1GHz to ensure stability and optimum performance. The LMH6882 evaluation
board provides a good reference for suggested layout techniques. The LMH6882 evaluation board was designed
for both good signal integrity and thermal dissipation using higher performance (Rogers) dielectric on the top
layer. The high performance dielectric provides well matched impedance and low loss to frequencies beyond
1GHz.
TI recommends that the LMH6882 board be multi-layered to improve thermal performance, grounding and
power-supply decoupling. The LMH6882 evaluation board is an 8-layered board with the supply sandwiched inbetween the GND layers for decoupling and having the stack up as Top layer - GND - GND - GND - Supply GND - GND - Bottom layer. All signal paths are routed on the top layer on the higher performance (Rogers)
dielectric, while the remainder signal layers are conventional FR4.
10.1.1 Uncontrolled Impedance Traces
It is important to pay careful attention while routing high-frequency signal traces on the PCB to maintain signal
integrity. A good board layout software package can simplify the trace thickness design to maintain controlled
characteristic impedances for high-frequency signals. Eliminating copper (the ground and power plane) from
underneath the input and output pins of the device also helps in minimizing parasitic capacitance affecting the
high frequency signals near the PCB and package junctions. The LMH6882 evaluation board has copper keepout areas under both the input and the output traces for this purpose. It is recommended that the application
board also follow these keep-out areas to avoid any performance degradation.
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10.2 Layout Example
Stitched GND vias
across signal traces
provide GND shielding
Supply bypass
Capacitor pads
Rout pads closer to
device output pins
Signal trace line widths chosen
based upon 50-?
Ω characteristic
impedance and Rogers RO4350
dielectric used on the top layer
Figure 56. Top Layer
30
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Layout Example (continued)
A GND layer cut out is beneath
the signal traces to reduce
reduce parasitic capacitance at
the input and outptut pins
Figure 57. GND Layer
10.3 Thermal Considerations
The LMH6882 is packaged in a thermally enhanced package. The exposed pad on the bottom of the package is
the primary means of removing heat from the package. It is recommended, but not necessary, that the exposed
pad be connected to the supply ground plane. In any case, the thermal dissipation of the device is largely
dependent on the attachment of the exposed pad to the system printed circuit board (PCB). The exposed pad
should be attached to as much copper on the PCB as possible, preferably external layers of copper.
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
AN-2235 Circuit Board Design for LMH6517/21/22 and Other High-Speed IF/RF Feedback Amplifiers,
SNOA869
11.2 Trademarks
SPI is a trademark of Motorola, Inc.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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7-Nov-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMH6882SQ/NOPB
ACTIVE
WQFN
NJK
36
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
LMH6882
LMH6882SQE/NOPB
ACTIVE
WQFN
NJK
36
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
LMH6882
LMH6882SQX/NOPB
ACTIVE
WQFN
NJK
36
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
LMH6882
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
7-Nov-2014
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Nov-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
LMH6882SQ/NOPB
WQFN
NJK
36
LMH6882SQE/NOPB
WQFN
NJK
LMH6882SQX/NOPB
WQFN
NJK
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1000
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
36
250
178.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
36
2500
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Nov-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMH6882SQ/NOPB
WQFN
NJK
36
1000
367.0
367.0
38.0
LMH6882SQE/NOPB
WQFN
NJK
36
250
213.0
191.0
55.0
LMH6882SQX/NOPB
WQFN
NJK
36
2500
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
NJK0036A
SQA36A (Rev A)
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