MR2535L Overvoltage Transient Suppressors Medium Current Designed for applications requiring a low voltage rectifier with reverse avalanche characteristics for use as reverse power transient suppressors. Developed to suppress transients in the automotive system, these devices operate in the forward mode as standard rectifiers or reverse mode as power avalanche rectifier and will protect electronic equipment from overvoltage conditions. http://onsemi.com Features • • • • • Avalanche Voltage 24 to 32 V High Power Capability Economical Increased Capacity by Parallel Operation Pb−Free Packages are Available* MICRODE AXIAL CASE 194 STYLE 1 Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 2.5 Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • MARKING DIAGRAM Leads are Readily Solderable Maximum Lead Temperature for Soldering Purposes: 350°C 3/8″ from Case for 10 Seconds at 5 lbs. Tension Polarity: Indicated by Diode Symbol or Cathode Band MR2535LAYYWW G G MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Symbol Value Unit DC Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 20 V Repetitive Peak Reverse Surge Current (Time Constant = 10 ms, Duty Cycle ≤ 1%, TC = 25°C) IRSM 62 A IO 6.0 A IFSM 600 A TJ, Tstg −65 to +175 °C Rating Average Rectified Forward Current (Single Phase, Resistive Load, 60 Hz, TC = 125°C) (Figure 4) Non−Repetitive Peak Surge Current Surge Supplied at Rated Load Conditions Halfwave, Single Phase Operating and Storage Junction Temperature Range ORDERING INFORMATION *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. June, 2006 − Rev. 7 = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. © Semiconductor Components Industries, LLC, 2006 A YY WW G 1 Package Shipping† MR2535L Microde Axial 1000 Units/Box MR2535LG Microde Axial (Pb−Free) 1000 Units/Box MR2535LRL Microde Axial 800/Tape & Reel MR2535LRLG Microde Axial (Pb−Free) 800/Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: MR2535L/D MR2535L THERMAL CHARACTERISTICS Characteristic Lead Length Symbol Max Unit 1/4″ 3/8″ 1/2″ RqJL 7.5 10 13 °C/W RqJC 0.8 (Note 1) °C/W Thermal Resistance, Junction−to−Lead @ Both Leads to Heatsink, Equal Length Thermal Resistance Junction−to−Case ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Symbol Min Max Unit Instantaneous Forward Voltage (Note 2) (iF = 100 A, TC = 25°C) vF − 1.1 V Reverse Current (VR = 20 Vdc, TC = 25°C) IR − 200 nAdc Breakdown Voltage (Note 2) (IR = 100 mAdc, TC = 25°C) V(BR) 24 32 V Breakdown Voltage (Note 2) (IR = 90 A, TC = 150°C, PW = 80 ms) V(BR) − 40 V V(BR)TC − 0.096 (Note 1) %/°C VFTC − 2 (Note 1) mV/°C Characteristic Breakdown Voltage Temperature Coefficient Forward Voltage Temperature Coefficient @ IF = 10 mA 1000 IR, REVERSE CURRENT (nA) 1000 75°C 100 TJ = 125°C 25°C 10 1 100 10 1 0.1 0.01 600 700 800 900 1000 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current versus Junction Temperature TJ = 25°C 3500 3000 2500 2000 1500 1000 0 25 VF, INSTANTANEOUS FORWARD VOLTAGE (mV) 4000 C, CAPACITANCE (pF) VR = 20 V 5 10 15 20 25 IF(avg), AVERAGE FORWARD CURRENT (A) IF, INSTANTANEOUS FORWARD CURRENT (A) 1. Typical. 2. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%. 25 Both leads to heatsink with equal length IF(peak)/IF(avg) = p 20 15 10 mm L = 6.25 mm 10 15 mm 5 0 20 VR, DC BLOCKING VOLTAGE (V) 40 60 80 100 120 140 160 TL, LEAD TEMPERATURE (°C) Figure 3. Typical Capacitance Figure 4. Maximum Current Ratings http://onsemi.com 2 180 MR2535L 45 R qJL, THERMAL RESISTANCE JUNCTION TO LEAD ( ° C/W) r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1 0.1 L = 6.25 mm, both leads to heatsink (equal length) 0.01 40 Maximum 35 Typical 30 Single to heatsink 25 Maximum 20 Typical 15 10 5 Both leads to heatsink (equal length) 0 0.001 0.01 0.1 1 10 100 0 5 t, TIME (S) 20 25 Figure 6. Steady State Thermal Resistance 100 10000 PRSM, PEAK REVERSE POWER (W) IRSM, PEAK REVERSE CURRENT (A) 15 LEAD LENGTH (mm) Figure 5. Thermal Response TJ = 25°C 10 1 10 100 TJ = 25°C 1000 100 1000 1 10 100 1000 t, TIME CONSTANT (mS) t, TIME CONSTANT (mS) Figure 7. Maximum Peak Reverse Current Figure 8. Maximum Peak Reverse Power 2400 PEAK REVERSE POWER (W) 1000 W RSM, PEAK REVERSE ENERGY (J) 10 TJ = 25°C 100 10 1 2000 Time Constant = 10 mS 1600 1200 800 Time Constant = 100 mS 400 0 1 10 100 1000 25 50 75 100 125 t, TIME CONSTANT (mS) TL, LEAD TEMPERATURE (°C) Figure 9. Maximum Reverse Energy Figure 10. Reverse Power Derating http://onsemi.com 3 150 MR2535L 1.20 V Z(Irsm) /V Z(100 mA) 1.18 PW = 80 mS, TL = 25°C 1.16 1.14 1.12 1.10 1.08 1.06 1.04 1.02 1.00 10 20 30 40 50 60 70 80 90 100 110 120 IRSM, REPETITIVE PEAK REVERSE SURGE CURRENT (A) Figure 11. Typical Clamping Factor 2W 0 − 150 V 50 mF dl/dt Limitation 100 mH MR2535L Figure 12. Load Dump Test Circuit 100 dl/dt < 1 A/ms 80 (%) 60 40 20 0 0 0.1 t (50%) t (37%) 0.2 0.3 t (10%) 0.5 0.4 t (37%) = Time Constant t (50%) = 0.7 t (37%) t (10%) = 2.3 t (37%) t, TIME (S) Figure 13. Load Dump Pulse Current http://onsemi.com 4 MR2535L PACKAGE DIMENSIONS MICRODE AXIAL CASE 194−04 ISSUE H A NOTES: 1. CATHODE SYMBOL ON PACKAGE. 2. 194−01 OBSOLETE, 194−04 NEW STANDARD. D 1 MILLIMETERS INCHES DIM MIN MAX MIN MAX A 8.43 8.69 0.332 0.342 B 5.94 6.25 0.234 0.246 D 1.27 1.35 0.050 0.053 K 25.15 25.65 0.990 1.010 K STYLE 1: PIN 1. CATHODE 2. ANODE B K 2 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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