1/4 STRUCTURE Silicon monolithic integrated circuits PRODUCT SERIES Stepping motor driver TYPE BD6393FP FUNCTION ・PWM constant current controllable two H bridge driver ・Full, Half, Quarter step ・Parallel IN control ○Absolute maximum ratings(Ta=25℃) Item Supply voltage Symbol VCC1,2 Limit Unit -0.2～+36.0 V 1.45※1 W Power dissipation Pd 3.47※2 W Input voltage for control pin VIN -0.2～+5.5 V Maximum input voltage for RNF VRNF 0.5 V ※3 Maximum output current IOUT 1.2 A/phase Operating temperature range Topr -25～+85 ℃ Storage temperature range Tstg -55～+150 ℃ Junction temperature Tjmax +150 ℃ ※1 Glass epoxy board. Derating in done at 11.6mW/℃ for operating above Ta=25℃. ※2 Recommended 4 layers board. Derating in done at 27.8mW/℃ or operating above Ta=25℃. ※3 Do not, however exceed Pd, ASO and Tjmax=150℃. ○Operating conditions (Ta=-25～+85℃) Item Symbol Supply voltage VCC1,2 Output current IOUT ※4 Do not, however exceed Pd, ASO. Min. 16 - Typ. 24 0.7 This product isn’t designed for protection against radioactive rays. REV. A Max. 28 0.9※4 Unit V A/phase 2/4 ○Electrical characteristics (Unless otherwise specified Ta=25℃, VCC1,2=24V) Item Symbol Min. Limit Typ. Max. 0.4 3.0 2.0 10.0 mA mA - 0.8 V V Whole Circuit current at standby ICCST Circuit current ICC Control input (PHASE1, I11, I01, PS, I02, I12, PHASE2) H level input voltage VINH 2.0 L level input voltage VINL Output (OUT1A, OUT1B, OUT2A, OUT2B) Output ON resistance Output leak current Current control RNFX input current VREF input current VREF input voltage range Comparator threshold 100% Comparator threshold 67% Comparator threshold 33% Minimum on time Unit RON - 1.5 1.8 Ω ILEAK - - 10 μA IRNF IVREF VREF VCTHLL VCTHHL VCTHLH tONMIN -40 -1.0 0 0.340 0.227 0.113 0.30 -20 -0.1 0.400 0.267 0.133 0.85 2.0 0.460 0.307 0.153 1.40 μA μA V V V V μs REV. A Conditions PS=L PS=H, VREFX=2V IOUT=0.7A, Sum of upper and lower RNFX=0V VREF=0V VREF=2V, I0x=L, I1x=L VREF=2V, I0x=H, I1x=L VREF=2V, I0x=L, I1x=H R=39kΩ, C=1000pF 3/4 ○Package outline Max 13.95 (include.BURR) Type BD6393FP Lot No. HSOP25 (Unit : mm) ○Block diagram ○Pin No. / Pin name Pin No. 1 2 3 4 5 6 FIN 7 8 9 10 11 12 13 3 VCC1 6 OUT1A PHASE1 8 CR1 7 I01 10 I11 9 ONE SHOT LOGIC Predriver 2 OUT1B 4 RNF1 OCP DAC Current Limit Comp. CR2 19 I02 16 I12 17 23 VCC2 20 OUT2A PHASE2 18 ONE SHOT LOGIC Predriver 24 OUT2B 22 RNF2 OCP DAC Current Limit Comp. VREF 11 1 PGND Buffer Pin name PGND OUT1B VCC1 RNF1 NC OUT1A FIN CR1 PHASE1 I11 I01 VREF PS NC TSD PS 12 Reference OVLO NC : Non Connection UVLO GND 15 REV. A Pin No. 14 15 16 17 18 19 FIN 20 21 22 23 24 25 Pin name NC GND I02 I12 PHASE2 CR2 FIN OUT2A NC RNF2 VCC2 OUT2B NC 4/4 ○Operation Notes (1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. (2) Power supply lines As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins. (3) GND potential Ensure a minimum GND pin potential in all operating conditions. (4) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. This IC is equipped with FIN heat dissipation terminals, but dissipation efficiency can be improved by applying heat dissipation treatment in this area. It is important to consider actual usage conditions and to take as large a dissipation pattern as possible. (5) Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. (6) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. (7) Thermal shutdown circuit The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃, and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect peripheral equipment. (8) Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. 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