Rohm BD6393FP Silicon monolithic integrated circuit Datasheet

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STRUCTURE
Silicon monolithic integrated circuits
PRODUCT SERIES
Stepping motor driver
TYPE
BD6393FP
FUNCTION
・PWM constant current controllable two H bridge driver
・Full, Half, Quarter step
・Parallel IN control
○Absolute maximum ratings(Ta=25℃)
Item
Supply voltage
Symbol
VCC1,2
Limit
Unit
-0.2~+36.0
V
1.45※1
W
Power dissipation
Pd
3.47※2
W
Input voltage for control pin
VIN
-0.2~+5.5
V
Maximum input voltage for RNF
VRNF
0.5
V
※3
Maximum output current
IOUT
1.2
A/phase
Operating temperature range
Topr
-25~+85
℃
Storage temperature range
Tstg
-55~+150
℃
Junction temperature
Tjmax
+150
℃
※1
Glass epoxy board. Derating in done at 11.6mW/℃ for operating above Ta=25℃.
※2
Recommended 4 layers board. Derating in done at 27.8mW/℃ or operating above Ta=25℃.
※3
Do not, however exceed Pd, ASO and Tjmax=150℃.
○Operating conditions (Ta=-25~+85℃)
Item
Symbol
Supply voltage
VCC1,2
Output current
IOUT
※4
Do not, however exceed Pd, ASO.
Min.
16
-
Typ.
24
0.7
This product isn’t designed for protection against radioactive rays.
REV. A
Max.
28
0.9※4
Unit
V
A/phase
2/4
○Electrical characteristics (Unless otherwise specified Ta=25℃, VCC1,2=24V)
Item
Symbol
Min.
Limit
Typ.
Max.
0.4
3.0
2.0
10.0
mA
mA
-
0.8
V
V
Whole
Circuit current at standby
ICCST
Circuit current
ICC
Control input (PHASE1, I11, I01, PS, I02, I12, PHASE2)
H level input voltage
VINH
2.0
L level input voltage
VINL
Output (OUT1A, OUT1B, OUT2A, OUT2B)
Output ON resistance
Output leak current
Current control
RNFX input current
VREF input current
VREF input voltage range
Comparator threshold 100%
Comparator threshold 67%
Comparator threshold 33%
Minimum on time
Unit
RON
-
1.5
1.8
Ω
ILEAK
-
-
10
μA
IRNF
IVREF
VREF
VCTHLL
VCTHHL
VCTHLH
tONMIN
-40
-1.0
0
0.340
0.227
0.113
0.30
-20
-0.1
0.400
0.267
0.133
0.85
2.0
0.460
0.307
0.153
1.40
μA
μA
V
V
V
V
μs
REV. A
Conditions
PS=L
PS=H, VREFX=2V
IOUT=0.7A,
Sum of upper and lower
RNFX=0V
VREF=0V
VREF=2V, I0x=L, I1x=L
VREF=2V, I0x=H, I1x=L
VREF=2V, I0x=L, I1x=H
R=39kΩ, C=1000pF
3/4
○Package outline
Max 13.95 (include.BURR)
Type
BD6393FP
Lot No.
HSOP25 (Unit : mm)
○Block diagram
○Pin No. / Pin name
Pin No.
1
2
3
4
5
6
FIN
7
8
9
10
11
12
13
3 VCC1
6 OUT1A
PHASE1 8
CR1 7
I01 10
I11 9
ONE
SHOT
LOGIC
Predriver
2 OUT1B
4 RNF1
OCP
DAC
Current
Limit
Comp.
CR2 19
I02 16
I12 17
23 VCC2
20 OUT2A
PHASE2 18
ONE
SHOT
LOGIC
Predriver
24 OUT2B
22 RNF2
OCP
DAC
Current
Limit
Comp.
VREF 11
1 PGND
Buffer
Pin name
PGND
OUT1B
VCC1
RNF1
NC
OUT1A
FIN
CR1
PHASE1
I11
I01
VREF
PS
NC
TSD
PS 12
Reference
OVLO
NC : Non Connection
UVLO
GND 15
REV. A
Pin No.
14
15
16
17
18
19
FIN
20
21
22
23
24
25
Pin name
NC
GND
I02
I12
PHASE2
CR2
FIN
OUT2A
NC
RNF2
VCC2
OUT2B
NC
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○Operation Notes
(1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature
range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode
or open mode) when such damage is suffered. A physical safety measure such as a fuse should be
implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded
is anticipated.
(2) Power supply lines
As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor
between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no
problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor
to decide capacity value. If the connected power supply does not have sufficient current absorption capacity,
regenerative current will cause the voltage on the power supply line to rise, which combined with the
product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to
implement a physical safety measure such as the insertion of a voltage clamp diode between the power
supply and GND pins.
(3) GND potential
Ensure a minimum GND pin potential in all operating conditions.
(4) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual
operating conditions. This IC is equipped with FIN heat dissipation terminals, but dissipation efficiency can
be improved by applying heat dissipation treatment in this area. It is important to consider actual usage
conditions and to take as large a dissipation pattern as possible.
(5) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to
malfunction.
(6) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(7) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃,
and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to
prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not
use the TSD function to protect peripheral equipment.
(8) Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the ground potential of application so that the pattern wiring
resistance and voltage variations caused by large currents do not cause variations in the small signal
ground voltage. Be careful not to change the GND wiring pattern of any external components, either.
REV. A
Notice
Notes
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
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use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
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R1120A
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