TI1 MAX3232E-Q1 3-v to 5.5-v multichannel rs-232 line driver/receiver with â±15-kv iec esd protection Datasheet

MAX3232E-Q1
www.ti.com
SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
FEATURES
1
•
•
•
•
•
•
•
•
•
PW PACKAGE
(TOP VIEW)
Qualified for Automotive Applications
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operates With 3-V to 5.5-V VCC Supply
Operates up to 250 kbit/s
Two Drivers and Two Receivers
Low Standby Current . . .300 µA Typical
External Capacitors . . . 4 × 0.1 µF
Accepts 5-V Logic Input With 3.3-V Supply
Pin Compatible to Alternative High-Speed
Pin-Compatible Device (1 Mbit/s): SNx5C3232
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
GND
DOUT1
RIN1
ROUT1
DIN1
DIN2
ROUT2
DESCRIPTION
The MAX3232E device consists of two line drivers, two line receivers, and a dual charge-pump circuit with
±15-kV IEC ESD protection pin to pin (serial-port connection pins, including GND). The device meets the
requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication
controller and the serial-port connector. The charge pump and four small external capacitors allow operation from
a single 3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of
30-V/µs driver output slew rate.
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 85°C
(1)
(2)
TSSOP – PW
ORDERABLE PART NUMBER
Reel of 2000
MAX3232EIPWRQ1
TOP-SIDE MARKING
MB3232I
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
FUNCTION TABLE
EACH DRIVER (1)
(1)
EACH RECEIVER (1)
INPUT
DIN
OUTPUT
DOUT
INPUT
RIN
OUTPUT
ROUT
L
H
L
H
H
L
H
L
Open
H
H = high level, L = low level, Open = input disconnected or connected driver off
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2008, Texas Instruments Incorporated
MAX3232E-Q1
www.ti.com
SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008
LOGIC DIAGRAM (POSITIVE LOGIC)
14
11
DIN1
DOUT1
10
7
DIN2
DOUT2
12
13
ROUT1
RIN1
9
8
ROUT2
RIN2
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
VCC
Supply voltage range (2)
–0.3 to 6
V
V+
Positive output supply voltage range (2)
–0.3 to 7
V
V–
Negative output supply voltage range (2)
0.3 to –7
V
V+ – V–
Supply voltage difference
(2)
13
V
Drivers
–0.3 to 6
V
Receivers
–25 to 25
V
–13.2 to 13.2
V
VI
Input voltage range
VO
Output voltage range
θJA
Package thermal impedance (3)
TJ
Operating virtual junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
Drivers
Receivers
(4)
–0.3 to VCC + 0.3
V
108
°C/W
150
°C
–65 to 150
°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
see Figure 4
Supply voltage
VCC = 3.3 V
VCC = 5 V
VIH
Driver high-level input voltage
DIN
VIL
Driver low-level input voltage
DIN
VI
Receiver input voltage
TA
Operating free-air temperature
(1)
2
VCC = 3.3 V
VCC = 5 V
MAX3232I
MIN
NOM
MAX
3
3.3
3.6
4.5
5
5.5
2
5.5
2.4
5.5
UNIT
V
V
0
0.8
V
–25
25
V
–40
85
°C
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ±0.5 V.
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MAX3232E-Q1
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SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008
ELECTRICAL CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
TEST CONDITIONS (1)
PARAMETER
ICC
(1)
(2)
Supply current
MIN
No load, VCC = 3.3 V or 5 V
TYP (2)
MAX
0.3
1
UNIT
mA
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C.
DRIVER SECTION – ELECTRICAL CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
TEST CONDITIONS (1)
PARAMETER
MIN
TYP (2)
MAX
UNIT
VOH
High-level output voltage
DOUT at RL = 3 kΩ to GND, DIN = GND
5
5.4
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to GND, DIN = VCC
–5
–5.4
IIH
High-level input current
VI = VCC
±0.01
±1
µA
IIL
Low-level input current
VI at GND
±0.01
±1
µA
±35
±60
mA
IOS
Short-circuit output current (3)
ro
Output resistance
(1)
(2)
(3)
VCC = 3.6 V, VO = 0 V
VCC = 5.5 V, VO = 0 V
VCC, V+, and V– = 0 V, VO = 2 V
300
V
V
Ω
10M
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one
output should be shorted at a time.
DRIVER SECTION – SWITCHING CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
TEST CONDITIONS (1)
PARAMETER
Maximum data rate
CL = 1000 pF, One DOUT switching,
RL = 3 kΩ, See Figure 1
tsk(p)
Pulse skew (3)
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ,
See Figure 2
SR(tr)
Slew rate, transition region
(see Figure 1)
RL = 3 kΩ to 7 kΩ,
VCC = 3.3 V
(1)
(2)
(3)
MIN
TYP (2)
150
250
kbit/s
300
ns
MAX
CL = 150 pF to 1000 pF
6
30
CL = 150 pF to 2500 pF
4
30
UNIT
v/µs
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
RECEIVER SECTION – ELECTRICAL CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4 )
PARAMETER
TEST CONDITIONS (1)
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOL = 1.6 mA
VIT+
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT–)
rI
Input resistance
(1)
(2)
MIN
TYP (2)
VCC – 0.6 V
VCC – 0.1 V
MAX
V
0.4
VCC = 3.3 V
1.5
2.4
VCC = 5 V
1.8
2.4
VCC = 3.3 V
0.6
1.2
VCC = 5 V
0.8
1.5
3
5
V
V
V
0.3
VI = ±3 V to ±25 V
UNIT
V
7
kΩ
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C.
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Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): MAX3232E-Q1
3
MAX3232E-Q1
www.ti.com
SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008
RECEIVER SECTION – SWITCHING CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3)
TEST CONDITIONS (1)
PARAMETER
TYP (2)
UNIT
tPLH
Propagation delay time, low- to high-level output
CL = 150 pF
300
ns
tPHL
Propagation delay time, high- to low-level output
CL = 150 pF
300
ns
300
ns
tsk(p)
(1)
(2)
(3)
4
Pulse skew
(3)
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): MAX3232E-Q1
MAX3232E-Q1
www.ti.com
SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008
PARAMETER MEASUREMENT INFORMATION
3V
Input
Generator
(see Note B)
1.5 V
RS-232
Output
50 Ω
RL
1.5 V
0V
tTHL
CL
(see Note A)
tTLH
3V
Output
−3 V
TEST CIRCUIT
SR(tr) +
t
THL
6V
or t
VOH
3V
−3 V
VOL
VOLTAGE WAVEFORMS
TLH
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
1.5 V
Input
1.5 V
0V
CL
(see Note A)
tPHL
tPLH
VOH
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
tPHL
CL
(see Note A)
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
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Product Folder Link(s): MAX3232E-Q1
5
MAX3232E-Q1
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SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008
APPLICATION INFORMATION
1
−
16
+ CBYPASS
− = 0.1µF
+
C1
VCC
C1+
2
+
†
C3
V+
GND
15
−
3
4
14
DOUT1
C1−
13
C2+
+
C2
RIN1
5 kΩ
−
5 C2−
12
6
C4
DOUT2
RIN2
−
V−
11
ROUT1
DIN1
+
7
10
8
9
DIN2
ROUT2
5 kΩ
†
C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
VCC vs CAPACITOR VALUES
VCC
C1
C2, C3, C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 4. Typical Operating Circuit and Capacitor Values
6
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Product Folder Link(s): MAX3232E-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
13-May-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
MAX3232EIPWRQ1
ACTIVE
TSSOP
PW
Pins Package Eco Plan (2)
Qty
16
2000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
CU NIPDAU
MSL Peak Temp (3)
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
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OTHER QUALIFIED VERSIONS OF MAX3232E-Q1 :
• Catalog: MAX3232E
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 1
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