MAX3232E-Q1 www.ti.com SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION FEATURES 1 • • • • • • • • • PW PACKAGE (TOP VIEW) Qualified for Automotive Applications Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates up to 250 kbit/s Two Drivers and Two Receivers Low Standby Current . . .300 µA Typical External Capacitors . . . 4 × 0.1 µF Accepts 5-V Logic Input With 3.3-V Supply Pin Compatible to Alternative High-Speed Pin-Compatible Device (1 Mbit/s): SNx5C3232 C1+ V+ C1− C2+ C2− V− DOUT2 RIN2 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2 DESCRIPTION The MAX3232E device consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV IEC ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate. ORDERING INFORMATION (1) PACKAGE (2) TA –40°C to 85°C (1) (2) TSSOP – PW ORDERABLE PART NUMBER Reel of 2000 MAX3232EIPWRQ1 TOP-SIDE MARKING MB3232I For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. FUNCTION TABLE EACH DRIVER (1) (1) EACH RECEIVER (1) INPUT DIN OUTPUT DOUT INPUT RIN OUTPUT ROUT L H L H H L H L Open H H = high level, L = low level, Open = input disconnected or connected driver off 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2008, Texas Instruments Incorporated MAX3232E-Q1 www.ti.com SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008 LOGIC DIAGRAM (POSITIVE LOGIC) 14 11 DIN1 DOUT1 10 7 DIN2 DOUT2 12 13 ROUT1 RIN1 9 8 ROUT2 RIN2 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT VCC Supply voltage range (2) –0.3 to 6 V V+ Positive output supply voltage range (2) –0.3 to 7 V V– Negative output supply voltage range (2) 0.3 to –7 V V+ – V– Supply voltage difference (2) 13 V Drivers –0.3 to 6 V Receivers –25 to 25 V –13.2 to 13.2 V VI Input voltage range VO Output voltage range θJA Package thermal impedance (3) TJ Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) Drivers Receivers (4) –0.3 to VCC + 0.3 V 108 °C/W 150 °C –65 to 150 °C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) see Figure 4 Supply voltage VCC = 3.3 V VCC = 5 V VIH Driver high-level input voltage DIN VIL Driver low-level input voltage DIN VI Receiver input voltage TA Operating free-air temperature (1) 2 VCC = 3.3 V VCC = 5 V MAX3232I MIN NOM MAX 3 3.3 3.6 4.5 5 5.5 2 5.5 2.4 5.5 UNIT V V 0 0.8 V –25 25 V –40 85 °C Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ±0.5 V. Submit Documentation Feedback Copyright © 2005–2008, Texas Instruments Incorporated Product Folder Link(s): MAX3232E-Q1 MAX3232E-Q1 www.ti.com SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008 ELECTRICAL CHARACTERISTICS over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) TEST CONDITIONS (1) PARAMETER ICC (1) (2) Supply current MIN No load, VCC = 3.3 V or 5 V TYP (2) MAX 0.3 1 UNIT mA Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C. DRIVER SECTION – ELECTRICAL CHARACTERISTICS over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) TEST CONDITIONS (1) PARAMETER MIN TYP (2) MAX UNIT VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.4 VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 –5.4 IIH High-level input current VI = VCC ±0.01 ±1 µA IIL Low-level input current VI at GND ±0.01 ±1 µA ±35 ±60 mA IOS Short-circuit output current (3) ro Output resistance (1) (2) (3) VCC = 3.6 V, VO = 0 V VCC = 5.5 V, VO = 0 V VCC, V+, and V– = 0 V, VO = 2 V 300 V V Ω 10M Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output should be shorted at a time. DRIVER SECTION – SWITCHING CHARACTERISTICS over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) TEST CONDITIONS (1) PARAMETER Maximum data rate CL = 1000 pF, One DOUT switching, RL = 3 kΩ, See Figure 1 tsk(p) Pulse skew (3) CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, See Figure 2 SR(tr) Slew rate, transition region (see Figure 1) RL = 3 kΩ to 7 kΩ, VCC = 3.3 V (1) (2) (3) MIN TYP (2) 150 250 kbit/s 300 ns MAX CL = 150 pF to 1000 pF 6 30 CL = 150 pF to 2500 pF 4 30 UNIT v/µs Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. RECEIVER SECTION – ELECTRICAL CHARACTERISTICS over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4 ) PARAMETER TEST CONDITIONS (1) VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOL = 1.6 mA VIT+ Positive-going input threshold voltage VIT– Negative-going input threshold voltage Vhys Input hysteresis (VIT+ – VIT–) rI Input resistance (1) (2) MIN TYP (2) VCC – 0.6 V VCC – 0.1 V MAX V 0.4 VCC = 3.3 V 1.5 2.4 VCC = 5 V 1.8 2.4 VCC = 3.3 V 0.6 1.2 VCC = 5 V 0.8 1.5 3 5 V V V 0.3 VI = ±3 V to ±25 V UNIT V 7 kΩ Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C. Submit Documentation Feedback Copyright © 2005–2008, Texas Instruments Incorporated Product Folder Link(s): MAX3232E-Q1 3 MAX3232E-Q1 www.ti.com SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008 RECEIVER SECTION – SWITCHING CHARACTERISTICS over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3) TEST CONDITIONS (1) PARAMETER TYP (2) UNIT tPLH Propagation delay time, low- to high-level output CL = 150 pF 300 ns tPHL Propagation delay time, high- to low-level output CL = 150 pF 300 ns 300 ns tsk(p) (1) (2) (3) 4 Pulse skew (3) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. Submit Documentation Feedback Copyright © 2005–2008, Texas Instruments Incorporated Product Folder Link(s): MAX3232E-Q1 MAX3232E-Q1 www.ti.com SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008 PARAMETER MEASUREMENT INFORMATION 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V tTHL CL (see Note A) tTLH 3V Output −3 V TEST CIRCUIT SR(tr) + t THL 6V or t VOH 3V −3 V VOL VOLTAGE WAVEFORMS TLH A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 1. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 Ω RL 1.5 V Input 1.5 V 0V CL (see Note A) tPHL tPLH VOH 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew 3V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 Ω tPHL CL (see Note A) tPLH VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times Submit Documentation Feedback Copyright © 2005–2008, Texas Instruments Incorporated Product Folder Link(s): MAX3232E-Q1 5 MAX3232E-Q1 www.ti.com SLLS676A – DECEMBER 2005 – REVISED FEBRUARY 2008 APPLICATION INFORMATION 1 − 16 + CBYPASS − = 0.1µF + C1 VCC C1+ 2 + † C3 V+ GND 15 − 3 4 14 DOUT1 C1− 13 C2+ + C2 RIN1 5 kΩ − 5 C2− 12 6 C4 DOUT2 RIN2 − V− 11 ROUT1 DIN1 + 7 10 8 9 DIN2 ROUT2 5 kΩ † C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. VCC vs CAPACITOR VALUES VCC C1 C2, C3, C4 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 µF 0.047 µF 0.1 µF 0.1 µF 0.33 µF 0.47 µF Figure 4. Typical Operating Circuit and Capacitor Values 6 Submit Documentation Feedback Copyright © 2005–2008, Texas Instruments Incorporated Product Folder Link(s): MAX3232E-Q1 PACKAGE OPTION ADDENDUM www.ti.com 13-May-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing MAX3232EIPWRQ1 ACTIVE TSSOP PW Pins Package Eco Plan (2) Qty 16 2000 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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