Material Content Data Sheet Sales Product Name TLE4966-3K Issued MA# MA000866708 Package PG-TSOP6-6-5 Weight* Construction Element Material Group Substances chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon silicon titanium chromium copper gold carbon black brominated resin antimonytrioxide epoxy resin silicondioxide tin silver epoxy resin silver wire encapsulation leadfinish plating glue *deviation 28. August 2013 13.46 mg CAS# if applicable Weight [mg] Average Mass [%] 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-57-5 1333-86-4 1309-64-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 0.856 6.36 0.001 0.01 0.005 0.04 404 0.016 0.12 1211 5.414 40.21 40.38 402079 403775 0.021 0.15 0.15 1543 1543 0.050 0.37 3734 0.063 0.47 4667 0.126 0.93 9335 1.144 8.49 84946 4.902 36.41 46.67 364056 466738 0.299 2.22 2.22 22200 22200 0.155 1.15 1.15 11479 11479 0.072 0.54 0.341 2.53 Sum [%] Average Mass [ppm] Sum [ppm] 6.36 63596 63596 81 5367 3.07 25302 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 30669 1000000