AD ADuM1301CRW Triple-channel digital isolator Datasheet

Triple-Channel Digital Isolators
ADuM1300/ADuM1301
Data Sheet
FEATURES
GENERAL DESCRIPTION
Qualified for automotive applications
Low power operation
5 V operation
1.2 mA per channel maximum @ 0 Mbps to 2 Mbps
3.5 mA per channel maximum @ 10 Mbps
32 mA per channel maximum @ 90 Mbps
3 V operation
0.8 mA per channel maximum @ 0 Mbps to 2 Mbps
2.2 mA per channel maximum @ 10 Mbps
20 mA per channel maximum @ 90 Mbps
Bidirectional communication
3 V/5 V level translation
High temperature operation: 125°C
High data rate: dc to 90 Mbps (NRZ)
Precise timing characteristics
2 ns maximum pulse width distortion
2 ns maximum channel-to-channel matching
High common-mode transient immunity: >25 kV/μs
Output enable function
16-lead SOIC wide body package
RoHS-compliant models available
Safety and regulatory approvals
UL recognition: 2500 V rms for 1 minute per UL 1577
CSA Component Acceptance Notice #5A
VDE Certificate of Conformity
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
VIORM = 560 V peak
TÜV approval: IEC/EN/UL/CSA 61010-1
The ADuM130x 1 are triple-channel digital isolators based on the
Analog Devices, Inc., iCoupler® technology. Combining high
speed CMOS and monolithic transformer technology, these
isolation components provide outstanding performance
characteristics superior to alternatives, such as optocouplers.
APPLICATIONS
By avoiding the use of LEDs and photodiodes, iCoupler
devices remove the design difficulties commonly associated
with optocouplers. The typical optocoupler concerns regarding
uncertain current transfer ratios, nonlinear transfer functions,
and temperature and lifetime effects are eliminated with the
simple iCoupler digital interfaces and stable performance
characteristics. The need for external drivers and other
discrete components is eliminated with these iCoupler products.
Furthermore, iCoupler devices consume one-tenth to one-sixth
of the power of optocouplers at comparable signal data rates.
The ADuM130x isolators provide three independent isolation
channels in a variety of channel configurations and data rates
(see the Ordering Guide). Both models operate with the supply
voltage on either side ranging from 2.7 V to 5.5 V, providing
compatibility with lower voltage systems as well as enabling a
voltage translation functionality across the isolation barrier. In
addition, the ADuM130x provide low pulse width distortion
(<2 ns for CRW grade) and tight channel-to-channel matching
(<2 ns for CRW grade). Unlike other optocoupler alternatives,
the ADuM130x isolators have a patented refresh feature that
ensures dc correctness in the absence of input logic transitions
and when power is not applied to one of the supplies.
1
Protected by U.S. Patents 5,952,849; 6,873,065; 6,903,578; and 7,075,329.
General-purpose multichannel isolation
SPI interface/data converter isolation
RS-232/RS-422/RS-485 transceivers
Industrial field bus isolation
Automotive systems
FUNCTIONAL BLOCK DIAGRAMS
GND1 2
15 GND2
VIA 3
ENCODE
DECODE
14 VOA
VIB 4
ENCODE
DECODE
13 VOB
VIC 5
ENCODE
DECODE
12 VOC
NC 6
11 NC
NC 7
10 VE2
GND1 8
9
GND2
VDD1 1
16 VDD2
GND1 2
15 GND2
VIA 3
ENCODE
DECODE
14 VOA
VIB 4
ENCODE
DECODE
13 VOB
VOC 5
DECODE
ENCODE
12 VIC
NC 6
11 NC
VE1 7
10 VE2
GND1 8
9
GND2
03787-002
16 VDD2
03787-001
VDD1 1
Figure 1. ADuM1300 Functional Block Diagram
Figure 2. ADuM1301 Functional Block Diagram
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2003–2012 Analog Devices, Inc. All rights reserved.
Rev. I
ADuM1300/ADuM1301
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
Insulation Characteristics ......................................................... 20
General Description ......................................................................... 1
Recommended Operating Conditions .................................... 20
Functional Block Diagrams............................................................. 1
Absolute Maximum Ratings ......................................................... 21
Revision History ............................................................................... 3
ESD Caution................................................................................ 21
Specifications..................................................................................... 4
Pin Configurations and Function Descriptions ......................... 22
Electrical Characteristics—5 V, 105°C Operation ................... 4
Typical Performance Characteristics ........................................... 23
Electrical Characteristics—3 V, 105°C Operation ................... 6
Applications Information .............................................................. 25
Electrical Characteristics—Mixed 5 V/3 V or 3 V/5 V,
105°C Operation........................................................................... 8
PC Board Layout ........................................................................ 25
Electrical Characteristics—5 V, 125°C Operation ................. 11
DC Correctness and Magnetic Field Immunity........................... 25
Electrical Characteristics—3 V, 125°C Operation ................. 13
Power Consumption .................................................................. 26
Electrical Characteristics—Mixed 5 V/3 V, 125°C Operation... 15
Insulation Lifetime ..................................................................... 27
Electrical Characteristics—Mixed 3 V/5 V 125°C Operation... 17
Outline Dimensions ....................................................................... 28
Package Characteristics ............................................................. 19
Ordering Guide .......................................................................... 28
Regulatory Information............................................................. 19
Automotive Products ................................................................. 29
Propagation Delay-Related Parameters................................... 25
Insulation and Safety-Related Specifications.......................... 19
Rev. I | Page 2 of 32
Data Sheet
ADuM1300/ADuM1301
REVISION HISTORY
3/12—Rev. H to Rev. I
Created Hyperlink for Safety and Regulatory Approvals
Entry in Features Section .................................................................1
Change to PC Board Layout Section ............................................25
Updated Outline Dimensions........................................................28
Moved Automotive Products Section...........................................28
5/08—Rev. G to Rev. H
Added ADuM1300W and ADuM1301W Parts............. Universal
Changes to Features List...................................................................1
Added Table 4 ..................................................................................11
Added Table 5 ..................................................................................13
Added Table 6 ..................................................................................15
Added Table 7 ..................................................................................17
Changes to Table 12 ........................................................................20
Changes to Table 13 ........................................................................21
Added Automotive Products Section ...........................................27
Changes to Ordering Guide...........................................................28
11/07—Rev. F to Rev. G
Changes to Note 1 and Figure 2 ......................................................1
Added ADuM130xARW Change vs. Temperature Parameter ...3
Added ADuM130xARW Change vs. Temperature Parameter ...5
Added ADuM130xARW Change vs. Temperature Parameter ...8
Changes to Figure 14 ......................................................................16
6/07—Rev. E to Rev. F
Updated VDE Certification Throughout.......................................1
Changes to Features, Note 1, Figure 1, and Figure 2 ....................1
Changes to Regulatory Information Section ...............................10
Added Table 10 ................................................................................12
Added Insulation Lifetime Section ...............................................17
Updated Outline Dimensions........................................................19
Changes to Ordering Guide...........................................................19
2/06—Rev. D to Rev. E
Updated Format ................................................................. Universal
Added TÜV Approval ....................................................... Universal
Changes to Figure 2 ..........................................................................1
5/05—Rev. C to Rev. D
Changes to Format............................................................. Universal
Changes to Figure 2 ..........................................................................1
Changes to Table 6 ..........................................................................10
Changes to Ordering Guide...........................................................18
6/04—Rev. B to Rev. C
Changes to Format............................................................. Universal
Changes to Features ..........................................................................1
Changes to Electrical Characteristics—5 V Operation................3
Changes to Electrical Characteristics—3 V Operation................5
Changes to Electrical Characteristics—Mixed 5 V/3 V or
3 V/5 V Operation ............................................................................7
Changes to Ordering Guide...........................................................18
5/04—Rev. A to Rev. B
Changes to the Format ...................................................... Universal
Changes to the Features....................................................................1
Changes to Table 7 and Table 8 .....................................................14
Changes to Table 9 ..........................................................................15
Changes to the DC Correctness and Magnetic Field Immunity
Section ..............................................................................................19
Changes to the Power Consumption Section..............................20
Changes to the Ordering Guide ....................................................21
9/03—Rev. 0 to Rev. A
Edits to Regulatory Information ...................................................13
Edits to Absolute Maximum Ratings............................................15
Deleted the Package Branding Information ................................16
9/03—Revision 0: Initial Version
Rev. I | Page 3 of 32
ADuM1300/ADuM1301
Data Sheet
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS—5 V, 105°C OPERATION
All voltages are relative to their respective ground. 4.5 V ≤ VDD1 ≤ 5.5 V, 4.5 V ≤ VDD2 ≤ 5.5 V; all minimum/maximum specifications apply
over the entire recommended operation range, unless otherwise noted; all typical specifications are at TA = 25°C, VDD1 = VDD2 = 5 V. These
specifications do not apply to ADuM1300W and ADuM1301W automotive grade versions.
Table 1.
Parameter
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent
Output Supply Current per Channel, Quiescent
ADuM1300 Total Supply Current, Three Channels 1
DC to 2 Mbps
VDD1 Supply Current
VDD2 Supply Current
10 Mbps (BRW and CRW Grades Only)
VDD1 Supply Current
VDD2 Supply Current
90 Mbps (CRW Grade Only)
VDD1 Supply Current
VDD2 Supply Current
ADuM1301 Total Supply Current, Three Channels1
DC to 2 Mbps
VDD1 Supply Current
VDD2 Supply Current
10 Mbps (BRW and CRW Grades Only)
VDD1 Supply Current
VDD2 Supply Current
90 Mbps (CRW Grade Only)
VDD1 Supply Current
VDD2 Supply Current
For All Models
Input Currents
Symbol
Min
Typ
Max Unit
IDDI (Q)
IDDO (Q)
0.50
0.19
0.53
0.24
mA
mA
IDD1 (Q)
IDD2 (Q)
1.6
0.7
2.5
1.0
mA
mA
DC to 1 MHz logic signal freq.
DC to 1 MHz logic signal freq.
IDD1 (10)
IDD2 (10)
6.5
1.9
8.1
2.5
mA
mA
5 MHz logic signal freq.
5 MHz logic signal freq.
IDD1 (90)
IDD2 (90)
57
16
77
18
mA
mA
45 MHz logic signal freq.
45 MHz logic signal freq.
IDD1 (Q)
IDD2 (Q)
1.3
1.0
2.1
1.4
mA
mA
DC to 1 MHz logic signal freq.
DC to 1 MHz logic signal freq.
IDD1 (10)
IDD2 (10)
5.0
3.4
6.2
4.2
mA
mA
5 MHz logic signal freq.
5 MHz logic signal freq.
IDD1 (90)
IDD2 (90)
43
29
57
37
mA
mA
45 MHz logic signal freq.
45 MHz logic signal freq.
μA
0 V ≤ VIA, VIB, VIC ≤ VDD1 or VDD2,
0 V ≤ VE1, VE2 ≤ VDD1 or VDD2
IIA, IIB, IIC, IE1, IE2
−10
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
VIH, VEH
VIL, VEL
VOAH, VOBH, VOCH
2.0
Logic Low Output Voltages
VOAL, VOBL, VOCL
SWITCHING SPECIFICATIONS
ADuM130xARW
Minimum Pulse Width 2
Maximum Data Rate 3
Propagation Delay 4
Pulse Width Distortion, |tPLH − tPHL|4
Change vs. Temperature
Propagation Delay Skew 5
Channel-to-Channel Matching 6
+0.01 +10
0.8
(VDD1 or VDD2) − 0.1
(VDD1 or VDD2) − 0.4
5.0
4.8
0.0
0.04
0.2
PW
1
50
tPHL, tPLH
PWD
65
11
tPSK
tPSKCD/tPSKOD
Rev. I | Page 4 of 32
0.1
0.1
0.4
V
V
V
V
V
V
V
1000 ns
Mbps
100 ns
40
ns
ps/°C
50
ns
50
ns
Test Conditions
IOx = −20 μA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 μA, VIx = VIxL
IOx = 400 μA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
Data Sheet
Parameter
ADuM130xBRW
Minimum Pulse Width2
Maximum Data Rate3
Propagation Delay4
Pulse Width Distortion, |tPLH − tPHL|4
Change vs. Temperature
Propagation Delay Skew5
Channel-to-Channel Matching, Codirectional
Channels6
Channel-to-Channel Matching, OpposingDirectional Channels6
ADuM130xCRW
Minimum Pulse Width2
Maximum Data Rate3
Propagation Delay4
Pulse Width Distortion, |tPLH − tPHL|4
Change vs. Temperature
Propagation Delay Skew5
Channel-to-Channel Matching, Codirectional
Channels6
Channel-to-Channel Matching, OpposingDirectional Channels6
For All Models
Output Disable Propagation Delay (High/Low
to High Impedance)
Output Enable Propagation Delay (High
Impedance to High/Low)
Output Rise/Fall Time (10% to 90%)
Common-Mode Transient Immunity at Logic
High Output 7
Common-Mode Transient Immunity at Logic
Low Output7
Refresh Rate
Input Dynamic Supply Current per Channel 8
Output Dynamic Supply Current per Channel8
ADuM1300/ADuM1301
Symbol
Min
Typ
PW
Max Unit
Test Conditions
100
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
tPSK
tPSKCD
15
3
ns
Mbps
ns
ns
ps/°C
ns
ns
tPSKOD
6
ns
CL = 15 pF, CMOS signal levels
11.1
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
tPHL, tPLH
PWD
10
20
32
50
3
5
PW
tPSK
tPSKCD
10
2
ns
Mbps
ns
ns
ps/°C
ns
ns
tPSKOD
5
ns
CL = 15 pF, CMOS signal levels
tPHL, tPLH
PWD
90
18
8.3
120
27
0.5
3
32
2
tPHZ, tPLH
6
8
ns
CL = 15 pF, CMOS signal levels
tPZH, tPZL
6
8
ns
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
VIx = VDD1 or VDD2, VCM = 1000 V,
transient magnitude = 800 V
VIx = 0 V, VCM = 1000 V,
transient magnitude = 800 V
tR/tF
|CMH|
25
2.5
35
ns
kV/μs
|CML|
25
35
kV/μs
1.2
0.19
0.05
Mbps
mA/Mbps
mA/Mbps
fr
IDDI (D)
IDDO (D)
1
The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load
present. The supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section.
See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through
Figure 12 for total VDD1 and VDD2 supply currents as a function of data rate for ADuM1300/ADuM1301 channel configurations.
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4
tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is
measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5
tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load
within the recommended operating conditions.
6
Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of
the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with
inputs on opposing sides of the isolation barrier.
7
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common-mode voltage slew rate
that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient
magnitude is the range over which the common mode is slewed.
8
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information
on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current
for a given data rate.
Rev. I | Page 5 of 32
ADuM1300/ADuM1301
Data Sheet
ELECTRICAL CHARACTERISTICS—3 V, 105°C OPERATION
All voltages are relative to their respective ground. 2.7 V ≤ VDD1 ≤ 3.6 V, 2.7 V ≤ VDD2 ≤ 3.6 V; all minimum/maximum specifications apply
over the entire recommended operation range, unless otherwise noted; all typical specifications are at TA = 25°C, VDD1 = VDD2 = 3.0 V.
These specifications do not apply to ADuM1300W and ADuM1301W automotive grade versions.
Table 2.
Parameter
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent
Output Supply Current per Channel, Quiescent
ADuM1300 Total Supply Current, Three Channels1
DC to 2 Mbps
VDD1 Supply Current
VDD2 Supply Current
10 Mbps (BRW and CRW Grades Only)
VDD1 Supply Current
VDD2 Supply Current
90 Mbps (CRW Grade Only)
VDD1 Supply Current
VDD2 Supply Current
ADuM1301 Total Supply Current, Three Channels1
DC to 2 Mbps
VDD1 Supply Current
VDD2 Supply Current
10 Mbps (BRW and CRW Grades Only)
VDD1 Supply Current
VDD2 Supply Current
90 Mbps (CRW Grade Only)
VDD1 Supply Current
VDD2 Supply Current
For All Models
Input Currents
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
Logic Low Output Voltages
SWITCHING SPECIFICATIONS
ADuM130xARW
Minimum Pulse Width2
Maximum Data Rate3
Propagation Delay4
Pulse Width Distortion, |tPLH − tPHL|4
Change vs. Temperature
Propagation Delay Skew5
Channel-to-Channel Matching6
Symbol
Min
Typ
Max Unit
IDDI (Q)
IDDO (Q)
0.26
0.11
0.31
0.15
mA
mA
IDD1 (Q)
IDD2 (Q)
0.9
0.4
1.7
0.7
mA
mA
DC to 1 MHz logic signal freq.
DC to 1 MHz logic signal freq.
IDD1 (10)
IDD2 (10)
3.4
1.1
4.9
1.6
mA
mA
5 MHz logic signal freq.
5 MHz logic signal freq.
IDD1 (90)
IDD2 (90)
31
8
48
13
mA
mA
45 MHz logic signal freq.
45 MHz logic signal freq.
IDD1 (Q)
IDD2 (Q)
0.7
0.6
1.4
0.9
mA
mA
DC to 1 MHz logic signal freq.
DC to 1 MHz logic signal freq.
IDD1 (10)
IDD2 (10)
2.6
1.8
3.7
2.5
mA
mA
5 MHz logic signal freq.
5 MHz logic signal freq.
IDD1 (90)
IDD2 (90)
24
16
36
23
mA
mA
45 MHz logic signal freq.
45 MHz logic signal freq.
μA
0 V ≤ VIA, VIB, VIC ≤ VDD1 or VDD2,
0 V ≤ VE1, VE2 ≤ VDD1 or VDD2
IIA, IIB, IIC, IE1, IE2
−10
+0.01 +10
VIH, VEH
1.6
VIL, VEL
VOAH, VOBH, VOCH (VDD1 or VDD2) − 0.1 3.0
(VDD1 or VDD2) − 0.4 2.8
VOAL, VOBL, VOCL
0.0
0.04
0.2
PW
1
50
tPHL, tPLH
PWD
75
11
tPSK
tPSKCD/tPSKOD
Rev. I | Page 6 of 32
0.4
0.1
0.1
0.4
V
V
V
V
V
V
V
1000 ns
Mbps
100 ns
40
ns
ps/°C
50
ns
50
ns
Test Conditions
IOx = −20 μA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 μA, VIx = VIxL
IOx = 400 μA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
Data Sheet
Parameter
ADuM130xBRW
Minimum Pulse Width2
Maximum Data Rate3
Propagation Delay4
Pulse Width Distortion, |tPLH − tPHL|4
Change vs. Temperature
Propagation Delay Skew5
Channel-to-Channel Matching, Codirectional
Channels6
Channel-to-Channel Matching, OpposingDirectional Channels6
ADuM130xCRW
Minimum Pulse Width2
Maximum Data Rate3
Propagation Delay4
Pulse Width Distortion, |tPLH − tPHL|4
Change vs. Temperature
Propagation Delay Skew5
Channel-to-Channel Matching, Codirectional
Channels6
Channel-to-Channel Matching, OpposingDirectional Channels6
For All Models
Output Disable Propagation Delay (High/Low to
High Impedance)
Output Enable Propagation Delay (High
Impedance to High/Low)
Output Rise/Fall Time (10% to 90%)
Common-Mode Transient Immunity at
Logic High Output 7
Common-Mode Transient Immunity at
Logic Low Output7
Refresh Rate
Input Dynamic Supply Current per Channel 8
Output Dynamic Supply Current per Channel8
ADuM1300/ADuM1301
Symbol
Min
Typ
PW
Max Unit
Test Conditions
100
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
tPSK
tPSKCD
26
3
ns
Mbps
ns
ns
ps/°C
ns
ns
tPSKOD
6
ns
CL = 15 pF, CMOS signal levels
11.1
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
tPHL, tPLH
PWD
10
20
38
50
3
5
PW
tPSK
tPSKCD
16
2
ns
Mbps
ns
ns
ps/°C
ns
ns
tPSKOD
5
ns
CL = 15 pF, CMOS signal levels
tPHL, tPLH
PWD
90
20
8.3
120
34
0.5
3
45
2
tPHZ, tPLH
6
8
ns
CL = 15 pF, CMOS signal levels
tPZH, tPZL
6
8
ns
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
VIx = VDD1 or VDD2, VCM = 1000 V,
transient magnitude = 800 V
VIx = 0 V, VCM = 1000 V,
transient magnitude = 800 V
tR/tF
|CMH|
25
3
35
ns
kV/μs
|CML|
25
35
kV/μs
1.1
0.10
0.03
Mbps
mA/Mbps
mA/Mbps
fr
IDDI (D)
IDDO (D)
1
The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load
present. The supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section.
See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through
Figure 12 for total VDD1 and VDD2 supply currents as a function of data rate for ADuM1300/ADuM1301 channel configurations.
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4
tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is
measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5
tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load
within the recommended operating conditions.
6
Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of
the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with
inputs on opposing sides of the isolation barrier.
7
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common-mode voltage slew rate
that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient
magnitude is the range over which the common mode is slewed.
8
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information
on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current
for a given data rate.
Rev. I | Page 7 of 32
ADuM1300/ADuM1301
Data Sheet
ELECTRICAL CHARACTERISTICS—MIXED 5 V/3 V OR 3 V/5 V, 105°C OPERATION
All voltages are relative to their respective ground. 5 V/3 V operation: 4.5 V ≤ VDD1 ≤ 5.5 V, 2.7 V ≤ VDD2 ≤ 3.6 V; 3 V/5 V operation:
2.7 V ≤ VDD1 ≤ 3.6 V, 4.5 V ≤ VDD2 ≤ 5.5 V; all minimum/maximum specifications apply over the entire recommended operation range,
unless otherwise noted; all typical specifications are at TA = 25°C; VDD1 = 3.0 V, VDD2 = 5 V or VDD1 = 5 V, VDD2 = 3.0 V. These specifications do not apply to ADuM1300W and ADuM1301W automotive grade versions.
Table 3.
Parameter
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent
5 V/3 V Operation
3 V/5 V Operation
Output Supply Current per Channel, Quiescent
5 V/3 V Operation
3 V/5 V Operation
ADuM1300 Total Supply Current, Three Channels 1
DC to 2 Mbps
VDD1 Supply Current
5 V/3 V Operation
3 V/5 V Operation
VDD2 Supply Current
5 V/3 V Operation
3 V/5 V Operation
10 Mbps (BRW and CRW Grades Only)
VDD1 Supply Current
5 V/3 V Operation
3 V/5 V Operation
VDD2 Supply Current
5 V/3 V Operation
3 V/5 V Operation
90 Mbps (CRW Grade Only)
VDD1 Supply Current
5 V/3 V Operation
3 V/5 V Operation
VDD2 Supply Current
5 V/3 V Operation
3 V/5 V Operation
ADuM1301 Total Supply Current, Three Channels1
DC to 2 Mbps
VDD1 Supply Current
5 V/3 V Operation
3 V/5 V Operation
VDD2 Supply Current
5 V/3 V Operation
3 V/5 V Operation
10 Mbps (BRW and CRW Grades Only)
VDD1 Supply Current
5 V/3 V Operation
3 V/5 V Operation
VDD2 Supply Current
5 V/3 V Operation
3 V/5 V Operation
Symbol
Min
Typ
Max Unit
Test Conditions
0.50
0.26
0.53 mA
0.31 mA
0.11
0.19
0.15 mA
0.24 mA
1.6
0.9
2.5
1.7
mA
mA
DC to 1 MHz logic signal freq.
DC to 1 MHz logic signal freq.
0.4
0.7
0.7
1.0
mA
mA
DC to 1 MHz logic signal freq.
DC to 1 MHz logic signal freq.
6.5
3.4
8.1
4.9
mA
mA
5 MHz logic signal freq.
5 MHz logic signal freq.
1.1
1.9
1.6
2.5
mA
mA
5 MHz logic signal freq.
5 MHz logic signal freq.
57
31
77
48
mA
mA
45 MHz logic signal freq.
45 MHz logic signal freq.
8
16
13
18
mA
mA
45 MHz logic signal freq.
45 MHz logic signal freq.
1.3
0.7
2.1
1.4
mA
mA
DC to 1 MHz logic signal freq.
DC to 1 MHz logic signal freq.
0.6
1.0
0.9
1.4
mA
mA
DC to 1 MHz logic signal freq.
DC to 1 MHz logic signal freq.
5.0
2.6
6.2
3.7
mA
mA
5 MHz logic signal freq.
5 MHz logic signal freq.
1.8
3.4
2.5
4.2
mA
mA
5 MHz logic signal freq.
5 MHz logic signal freq.
IDDI (Q)
IDDO (Q)
IDD1 (Q)
IDD2 (Q)
IDD1 (10)
IDD2 (10)
IDD1 (90)
IDD2 (90)
IDD1 (Q)
IDD2 (Q)
IDD1 (10)
IDD2 (10)
Rev. I | Page 8 of 32
Data Sheet
Parameter
90 Mbps (CRW Grade Only)
VDD1 Supply Current
5 V/3 V Operation
3 V/5 V Operation
VDD2 Supply Current
5 V/3 V Operation
3 V/5 V Operation
For All Models
Input Currents
Logic High Input Threshold
5 V/3 V Operation
3 V/5 V Operation
Logic Low Input Threshold
5 V/3 V Operation
3 V/5 V Operation
Logic High Output Voltages
Logic Low Output Voltages
SWITCHING SPECIFICATIONS
ADuM130xARW
Minimum Pulse Width2
Maximum Data Rate3
Propagation Delay4
Pulse Width Distortion, |tPLH − tPHL|4
Change vs. Temperature
Propagation Delay Skew5
Channel-to-Channel Matching6
ADuM130xBRW
Minimum Pulse Width2
Maximum Data Rate3
Propagation Delay4
Pulse Width Distortion, |tPLH − tPHL|4
Change vs. Temperature
Propagation Delay Skew5
Channel-to-Channel Matching, Codirectional
Channels6
Channel-to-Channel Matching, OpposingDirectional Channels6
ADuM130xCRW
Minimum Pulse Width2
Maximum Data Rate3
Propagation Delay4
Pulse Width Distortion, |tPLH − tPHL|4
Change vs. Temperature
Propagation Delay Skew5
Channel-to-Channel Matching,
Codirectional Channels6
Channel-to-Channel Matching,
Opposing-Directional Channels6
ADuM1300/ADuM1301
Symbol
Min
Typ
Max Unit
Test Conditions
43
24
57
36
mA
mA
45 MHz logic signal freq.
45 MHz logic signal freq.
16
29
23
37
mA
mA
45 MHz logic signal freq.
45 MHz logic signal freq.
+0.01
+10
μA
0 V ≤ VIA, VIB, VIC ≤ VDD1 or VDD2,
0 V ≤ VE1, VE2 ≤ VDD1 or VDD2
IDD1 (90)
IDD2 (90)
IIA, IIB, IIC, IE1, IE2 −10
VIH, VEH
2.0
1.6
V
V
VIL, VEL
0.8
0.4
VOAH, VOBH, VOCH (VDD1 or VDD2) − 0.1 (VDD1 or VDD2)
(VDD1 or VDD2) − 0.4 (VDD1 or VDD2) − 0.2
VOAL, VOBL, VOCL
0.0
0.1
0.04
0.1
0.2
0.4
PW
tPHL, tPLH
PWD
1
50
70
11
tPSK
tPSKCD/tPSKOD
PW
V
V
V
V
V
V
V
1000 ns
Mbps
100 ns
40
ns
ps/°C
50
ns
50
ns
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
100
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
tPSK
tPSKCD
6
3
ns
Mbps
ns
ns
ps/°C
ns
ns
tPSKOD
22
ns
tPHL, tPLH
PWD
10
15
35
IOx = −20 μA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 μA, VIx = VIxL
IOx = 400 μA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
50
3
5
tPSK
tPSKCD
11.1 ns
Mbps
40
ns
2
ns
ps/°C
14
ns
2
ns
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
tPSKOD
5
CL = 15 pF, CMOS signal levels
PW
tPHL, tPLH
PWD
90
20
Rev. I | Page 9 of 32
8.3
120
30
0.5
3
ns
ADuM1300/ADuM1301
Parameter
For All Models
Output Disable Propagation Delay
(High/Low to High Impedance)
Output Enable Propagation Delay (High
Impedance to High/Low)
Output Rise/Fall Time (10% to 90%)
5 V/3 V Operation
3 V/5 V Operation
Common-Mode Transient Immunity at
Logic High Output 7
Common-Mode Transient Immunity at
Logic Low Output7
Refresh Rate
5 V/3 V Operation
3 V/5 V Operation
Input Dynamic Supply Current per Channel8
5 V/3 V Operation
3 V/5 V Operation
Output Dynamic Supply Current per Channel8
5 V/3 V Operation
3 V/5 V Operation
Data Sheet
Symbol
Min
Typ
Max Unit
Test Conditions
tPHZ, tPLH
6
8
ns
CL = 15 pF, CMOS signal levels
tPZH, tPZL
6
8
ns
CL = 15 pF, CMOS signal levels
tR/tF
CL = 15 pF, CMOS signal levels
|CMH|
25
3.0
2.5
35
ns
ns
kV/μs
|CML|
25
35
kV/μs
1.2
1.1
Mbps
Mbps
0.19
0.10
mA/Mbps
mA/Mbps
0.03
0.05
mA/Mbps
mA/Mbps
VIx = VDD1 or VDD2, VCM = 1000 V,
transient magnitude = 800 V
VIx = 0 V, VCM = 1000 V,
transient magnitude = 800 V
fr
IDDI (D)
IDDO (D)
1
The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load present. The
supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through
Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total VDD1 and VDD2
supply currents as a function of data rate for ADuM1300/ADuM1301 channel configurations.
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4
tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is measured
from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5
tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load within the
recommended operating conditions.
6
Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of the isolation
barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing
sides of the isolation barrier.
7
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common-mode voltage slew rate that can be
sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the
range over which the common mode is slewed.
8
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information on
per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a given
data rate.
Rev. I | Page 10 of 32
Data Sheet
ADuM1300/ADuM1301
ELECTRICAL CHARACTERISTICS—5 V, 125°C OPERATION
All voltages are relative to their respective ground. 4.5 V ≤ VDD1 ≤ 5.5 V, 4.5 V ≤ VDD2 ≤ 5.5 V; all minimum/maximum specifications apply
over the entire recommended operation range, unless otherwise noted; all typical specifications are at TA = 25°C, VDD1 = VDD2 = 5 V. These
specifications apply to ADuM1300W and ADuM1301W automotive grade versions.
Table 4.
Parameter
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent
Output Supply Current per Channel, Quiescent
ADuM1300W, Total Supply Current, Three Channels 1
DC to 2 Mbps
VDD1 Supply Current
VDD2 Supply Current
10 Mbps (TRWZ Grade Only)
VDD1 Supply Current
VDD2 Supply Current
ADuM1301W, Total Supply Current, Three Channels1
DC to 2 Mbps
VDD1 Supply Current
VDD2 Supply Current
10 Mbps (TRWZ Grade Only)
VDD1 Supply Current
VDD2 Supply Current
For All Models
Input Currents
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
Logic Low Output Voltages
SWITCHING SPECIFICATIONS
ADuM130xWSRWZ
Minimum Pulse Width 2
Maximum Data Rate 3
Propagation Delay 4
Pulse Width Distortion, |tPLH − tPHL|4
Propagation Delay Skew 5
Channel-to-Channel Matching 6
ADuM130xWTRWZ
Minimum Pulse Width2
Maximum Data Rate3
Propagation Delay4
Pulse Width Distortion, |tPLH − tPHL|4
Change vs. Temperature
Propagation Delay Skew5
Channel-to-Channel Matching, Codirectional
Channels6
Channel-to-Channel Matching, OpposingDirectional Channels6
Symbol
Typ
Max Unit
IDDI (Q)
IDDO (Q)
0.50
0.19
0.53 mA
0.24 mA
IDD1 (Q)
IDD2 (Q)
1.6
0.7
2.5
1.0
mA
mA
DC to 1 MHz logic signal freq.
DC to 1 MHz logic signal freq.
IDD1 (10)
IDD2 (10)
6.5
1.9
8.1
2.5
mA
mA
5 MHz logic signal freq.
5 MHz logic signal freq.
IDD1 (Q)
IDD2 (Q)
1.3
1.0
2.1
1.4
mA
mA
DC to 1 MHz logic signal freq.
DC to 1 MHz logic signal freq.
IDD1 (10)
IDD2 (10)
5.0
3.4
6.2
4.2
mA
mA
5 MHz logic signal freq.
5 MHz logic signal freq.
μA
0 V ≤ VIA, VIB, VIC ≤ VDD1 or VDD2,
0 V ≤ VE1, VE2 ≤ VDD1 or VDD2
IIA, IIB, IIC, IE1, IE2
Min
−10
+0.01 +10
VIH, VEH
2.0
VIL, VEL
VOAH, VOBH, VOCH VDD1, VDD2 − 0.1 5.0
VDD1, VDD2 − 0.4 4.8
VOAL, VOBL, VOCL
0.0
0.04
0.2
PW
tPHL, tPLH
PWD
tPSK
tPSKCD/tPSKOD
1
50
65
PW
0.8
0.1
0.1
0.4
V
V
V
V
V
V
V
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
100
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
tPSK
tPSKCD
15
3
tPSKOD
6
ns
tPHL, tPLH
PWD
27
32
3
5
Rev. I | Page 11 of 32
IOx = −20 μA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 μA, VIx = VIxL
IOx = 400 μA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
1000 ns
Mbps
100 ns
40
ns
50
ns
50
ns
ns
Mbps
ns
ns
ps/°C
ns
ns
10
18
Test Conditions
ADuM1300/ADuM1301
Parameter
For All Models
Output Disable Propagation Delay
(High/Low to High Impedance)
Output Enable Propagation Delay
(High Impedance to High/Low)
Output Rise/Fall Time (10% to 90%)
Common-Mode Transient Immunity at Logic
High Output 7
Common-Mode Transient Immunity at Logic
Low Output7
Refresh Rate
Input Dynamic Supply Current per Channel 8
Output Dynamic Supply Current per Channel8
Data Sheet
Symbol
Min
Typ
Max Unit
Test Conditions
tPHZ, tPLH
6
8
ns
CL = 15 pF, CMOS signal levels
tPZH, tPZL
6
8
ns
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
VIx = VDD1/VDD2, VCM = 1000 V,
transient magnitude = 800 V
VIx = 0 V, VCM = 1000 V,
transient magnitude = 800 V
tR/tF
|CMH|
25
2.5
35
ns
kV/μs
|CML|
25
35
kV/μs
1.2
0.19
0.05
Mbps
mA/Mbps
mA/Mbps
fr
IDDI (D)
IDDO (D)
1
The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load
present. The supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section.
See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through
Figure 12 for total VDD1 and VDD2 supply currents as a function of data rate for ADUM1300W/ADUM1301W channel configurations.
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4
tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is
measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5
tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load
within the recommended operating conditions.
6
Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of
the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with
inputs on opposing sides of the isolation barrier.
7
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common-mode voltage slew rate
that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient
magnitude is the range over which the common mode is slewed.
8
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information
on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current
for a given data rate.
Rev. I | Page 12 of 32
Data Sheet
ADuM1300/ADuM1301
ELECTRICAL CHARACTERISTICS—3 V, 125°C OPERATION
All voltages are relative to their respective ground. 3.0 V ≤ VDD1 ≤ 3.6 V, 3.0 V ≤ VDD2 ≤ 3.6 V; all minimum/maximum specifications apply
over the entire recommended operation range, unless otherwise noted; all typical specifications are at TA = 25°C, VDD1 = VDD2 = 3.0 V.
These specifications apply to ADuM1300W and ADuM1301W automotive grade versions.
Table 5.
Parameter
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent
Output Supply Current per Channel, Quiescent
ADuM1300W, Total Supply Current, Three Channels1
DC to 2 Mbps
VDD1 Supply Current
VDD2 Supply Current
10 Mbps (TRWZ Grade Only)
VDD1 Supply Current
VDD2 Supply Current
ADuM1301W, Total Supply Current, Three Channels1
DC to 2 Mbps
VDD1 Supply Current
VDD2 Supply Current
10 Mbps (TRWZ Grade Only)
VDD1 Supply Current
VDD2 Supply Current
For All Models
Input Currents
Symbol
Min
Typ
Max
Unit
IDDI (Q)
IDDO (Q)
0.26
0.11
0.31
0.15
mA
mA
IDD1 (Q)
IDD2 (Q)
0.9
0.4
1.7
0.7
mA
mA
DC to 1 MHz logic signal freq.
DC to 1 MHz logic signal freq.
IDD1 (10)
IDD2 (10)
3.4
1.1
4.9
1.6
mA
mA
5 MHz logic signal freq.
5 MHz logic signal freq.
IDD1 (Q)
IDD2 (Q)
0.7
0.6
1.4
0.9
mA
mA
DC to 1 MHz logic signal freq.
DC to 1 MHz logic signal freq.
IDD1 (10)
IDD2 (10)
2.6
1.8
3.7
2.5
mA
mA
5 MHz logic signal freq.
5 MHz logic signal freq.
μA
0 V ≤ VIA, VIB, VIC ≤ VDD1 or VDD2,
0 V ≤ VE1, VE2 ≤ VDD1 or VDD2
IIA, IIB, IIC, IE1, IE2
−10
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
VIH, VEH
VIL, VEL
VOAH, VOBH, VOCH
1.6
Logic Low Output Voltages
VOAL, VOBL, VOCL
SWITCHING SPECIFICATIONS
ADuM130xWSRWZ
Minimum Pulse Width2
Maximum Data Rate3
Propagation Delay4
Pulse Width Distortion, |tPLH − tPHL|4
Propagation Delay Skew5
Channel-to-Channel Matching6
ADuM130xWTRWZ
Minimum Pulse Width2
Maximum Data Rate3
Propagation Delay4
Pulse Width Distortion, |tPLH − tPHL|4
Change vs. Temperature
Propagation Delay Skew5
Channel-to-Channel Matching,
Codirectional Channels6
Channel-to-Channel Matching,
Opposing-Directional Channels6
+0.01 +10
0.4
VDD1, VDD2 − 0.1 3.0
VDD1, VDD2 − 0.4 2.8
0.0
0.04
0.2
PW
tPHL, tPLH
PWD
tPSK
tPSKCD/tPSKOD
1
50
75
PW
0.1
0.1
0.4
V
V
V
V
V
V
V
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
100
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
tPSK
tPSKCD
26
3
tPSKOD
6
ns
tPHL, tPLH
PWD
34
45
3
5
Rev. I | Page 13 of 32
IOx = −20 μA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 μA, VIx = VIxL
IOx = 400 μA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
1000 ns
Mbps
100 ns
40
ns
50
ns
50
ns
ns
Mbps
ns
ns
ps/°C
ns
ns
10
20
Test Conditions
ADuM1300/ADuM1301
Parameter
For All Models
Output Disable Propagation Delay (High/Low to
High Impedance)
Output Enable Propagation Delay (High Impedance
to High/Low)
Output Rise/Fall Time (10% to 90%)
Common-Mode Transient Immunity at
Logic High Output 7
Common-Mode Transient Immunity at
Logic Low Output7
Refresh Rate
Input Dynamic Supply Current per Channel 8
Output Dynamic Supply Current per Channel8
Data Sheet
Symbol
Min
Typ
Max
Unit
Test Conditions
tPHZ, tPLH
6
8
ns
CL = 15 pF, CMOS signal levels
tPZH, tPZL
6
8
ns
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
VIx = VDD1/VDD2, VCM = 1000 V,
transient magnitude = 800 V
VIx = 0 V, VCM = 1000 V,
transient magnitude = 800 V
tR/tF
|CMH|
25
3
35
ns
kV/μs
|CML|
25
35
kV/μs
1.1
0.10
0.03
Mbps
mA/Mbps
mA/Mbps
fr
IDDI (D)
IDDO (D)
1
The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load
present. The supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section.
See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through
Figure 12 for total VDD1 and VDD2 supply currents as a function of data rate for ADUM1300W/ADUM1301W channel configurations.
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4
tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is
measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5
tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load
within the recommended operating conditions.
6
Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of
the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with
inputs on opposing sides of the isolation barrier.
7
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common-mode voltage slew rate
that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient
magnitude is the range over which the common mode is slewed.
8
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information
on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current
for a given data rate.
Rev. I | Page 14 of 32
Data Sheet
ADuM1300/ADuM1301
ELECTRICAL CHARACTERISTICS—MIXED 5 V/3 V, 125°C OPERATION 1
All voltages are relative to their respective ground. 4.5 V ≤ VDD1 ≤ 5.5 V, 3.0 V ≤ VDD2 ≤ 3.6 V; all minimum/maximum specifications apply
over the entire recommended operation range, unless otherwise noted; all typical specifications are at TA = 25°C; VDD1 = 5 V, VDD2 = 3.0 V.
These specifications apply to ADuM1300W and ADuM1301W automotive grade versions.
Table 6.
Parameter
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent
Output Supply Current per Channel, Quiescent
ADuM1300W, Total Supply Current, Three Channels 2
DC to 2 Mbps
VDD1 Supply Current
VDD2 Supply Current
10 Mbps (TRWZ Grade Only)
VDD1 Supply Current
VDD2 Supply Current
ADuM1301W, Total Supply Current, Three Channels1
DC to 2 Mbps
VDD1 Supply Current
VDD2 Supply Current
10 Mbps (TRWZ Grade Only)
VDD1 Supply Current
VDD2 Supply Current
For All Models
Input Currents
Symbol
Min
Typ
Max
Unit
IDDI (Q)
IDDO (Q)
0.50
0.11
0.53
0.15
mA
mA
IDD1 (Q)
IDD2 (Q)
1.6
0.4
2.5
0.7
mA
mA
DC to 1 MHz logic signal freq.
DC to 1 MHz logic signal freq.
IDD1 (10)
IDD2 (10)
6.5
1.1
8.1
1.6
mA
mA
5 MHz logic signal freq.
5 MHz logic signal freq.
IDD1 (Q)
IDD2 (Q)
1.3
0.6
2.1
0.9
mA
mA
DC to 1 MHz logic signal freq.
DC to 1 MHz logic signal freq.
IDD1 (10)
IDD2 (10)
5.0
1.8
6.2
2.5
mA
mA
5 MHz logic signal freq.
5 MHz logic signal freq.
+0.01
+10
μA
0 V ≤ VIA, VIB, VIC ≤ VDD1 or VDD2,
0 V ≤ VE1, VE2 ≤ VDD1 or VDD2
IIA, IIB, IIC, IE1, IE2
−10
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
VIH, VEH
VIL, VEL
VOAH, VOBH, VOCH
2.0
Logic Low Output Voltages
VOAL, VOBL, VOCL
SWITCHING SPECIFICATIONS
ADuM130xWSRWZ
Minimum Pulse Width 3
Maximum Data Rate 4
Propagation Delay 5
Pulse Width Distortion, |tPLH − tPHL|4
Propagation Delay Skew 6
Channel-to-Channel Matching 7
ADuM130xWTRWZ
Minimum Pulse Width2
Maximum Data Rate3
Propagation Delay4
Pulse Width Distortion, |tPLH − tPHL|4
Change vs. Temperature
Propagation Delay Skew5
Channel-to-Channel Matching, Codirectional
Channels6
Channel-to-Channel Matching, OpposingDirectional Channels6
0.8
VDD1, VDD2 − 0.1 VDD1, VDD2
VDD1, VDD2 − 0.4 VDD1,
VDD2 − 0.2
0.0
0.04
0.2
PW
1
50
tPHL, tPLH
PWD
tPSK
70
tPSKCD/tPSKOD
PW
0.1
0.1
0.4
V
V
V
V
IOx = −20 μA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
V
V
V
IOx = 20 μA, VIx = VIxL
IOx = 400 μA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
1000 ns
Mbps
100 ns
40
ns
50
ns
50
ns
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
100
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
tPSK
tPSKCD
6
3
ns
Mbps
ns
ns
ps/°C
ns
ns
tPSKOD
22
ns
tPHL, tPLH
PWD
10
20
30
40
3
5
Rev. I | Page 15 of 32
Test Conditions
ADuM1300/ADuM1301
Parameter
For All Models
Output Disable Propagation Delay (High/Low
to High Impedance)
Output Enable Propagation Delay (High
Impedance to High/Low)
Output Rise/Fall Time (10% to 90%)
Common-Mode Transient Immunity at
Logic High Output 8
Common-Mode Transient Immunity at
Logic Low Output7
Refresh Rate
Input Dynamic Supply Current per Channel 9
Output Dynamic Supply Current per Channel8
Data Sheet
Symbol
Min
Typ
Max
Unit
Test Conditions
tPHZ, tPLH
6
8
ns
CL = 15 pF, CMOS signal levels
tPZH, tPZL
6
8
ns
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
VIx = VDD1/VDD2, VCM = 1000 V,
transient magnitude = 800 V
VIx = 0 V, VCM = 1000 V,
transient magnitude = 800 V
tR/tF
|CMH|
25
3.0
35
ns
kV/μs
|CML|
25
35
kV/μs
1.2
0.19
0.03
Mbps
mA/Mbps
mA/Mbps
fr
IDDI (D)
IDDO (D)
1
All voltages are relative to their respective ground.
The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load present. The
supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through
Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total VDD1 and VDD2
supply currents as a function of data rate for ADUM1300W/ADUM1301W channel configurations.
3
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
4
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
5
tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is measured
from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
6
tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load within the
recommended operating conditions.
7
Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of the isolation
barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing
sides of the isolation barrier.
8
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common-mode voltage slew rate that can be
sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the
range over which the common mode is slewed.
9
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information on
per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a
given data rate.
2
Rev. I | Page 16 of 32
Data Sheet
ADuM1300/ADuM1301
ELECTRICAL CHARACTERISTICS—MIXED 3 V/5 V, 125°C OPERATION
All voltages are relative to their respective ground. 3.0 V ≤ VDD1 ≤ 3.6 V, 4.5 V ≤ VDD2 ≤ 5.5 V; all minimum/maximum specifications apply
over the entire recommended operation range, unless otherwise noted; all typical specifications are at TA = 25°C; VDD1 = 3.0 V, VDD2 = 5 V.
These apply to ADuM1300W and ADuM1301W automotive grade versions.
Table 7.
Parameter
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent
Output Supply Current per Channel, Quiescent
ADuM1300W, Total Supply Current, Three Channels 1
DC to 2 Mbps
VDD1 Supply Current
VDD2 Supply Current
10 Mbps (TRWZ Grade Only)
VDD1 Supply Current
VDD2 Supply Current
ADuM1301W, Total Supply Current, Three Channels1
DC to 2 Mbps
VDD1 Supply Current
VDD2 Supply Current
10 Mbps (TRWZ Grade Only)
VDD1 Supply Current
VDD2 Supply Current
For All Models
Input Currents
Symbol
Min
Typ
Max
Unit
IDDI (Q)
IDDO (Q)
0.26
0.19
0.31
0.24
mA
mA
IDD1 (Q)
IDD2(Q)
0.9
0.7
1.7
1.0
mA
mA
DC to 1 MHz logic signal freq.
DC to 1 MHz logic signal freq.
IDD1 (10)
IDD2 (10)
3.4
1.9
4.9
2.5
mA
mA
5 MHz logic signal freq.
5 MHz logic signal freq.
IDD1 (Q)
IDD2 (Q)
0.7
1.0
1.4
1.4
mA
mA
DC to 1 MHz logic signal freq.
DC to 1 MHz logic signal freq.
IDD1 (10)
IDD2 (10)
2.6
3.4
3.7
4.2
mA
mA
5 MHz logic signal freq.
5 MHz logic signal freq.
+0.01
+10
μA
0 7≤ VIA,VIB, VIC ≤ VDD1 or VDD2,
0 7≤ VE1,VE2 ≤ VDD1 or VDD2
IIA, IIB, IIC, IE1, IE2
−10
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
VIH, VEH
VIL, VEL
VOAH, VOBH, VOCH
1.6
Logic Low Output Voltages
VOAL, VOBL, VOCL
SWITCHING SPECIFICATIONS
ADuM130xWSRWZ
Minimum Pulse Width 2
Maximum Data Rate 3
Propagation Delay 4
Pulse Width Distortion, |tPLH − tPHL|4
Propagation Delay Skew 5
Channel-to-Channel Matching 6
ADuM130xWTRWZ
Minimum Pulse Width2
Maximum Data Rate3
Propagation Delay4
Pulse Width Distortion, |tPLH − tPHL|4
Change vs. Temperature
Propagation Delay Skew5
Channel-to-Channel Matching, Codirectional
Channels6
Channel-to-Channel Matching, OpposingDirectional Channels6
0.4
VDD1, VDD2 − 0.1 VDD1, VDD2
VDD1, VDD2 − 0.4 VDD1,
VDD2 − 0.2
0.0
0.04
0.2
PW
1
50
tPHL, tPLH
PWD
tPSK
70
tPSKCD/tPSKOD
PW
0.1
0.1
0.4
V
V
V
V
IOx = −20 μA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
V
V
V
IOx = 20 μA, VIx = VIxL
IOx = 400 μA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
1000 ns
Mbps
100 ns
40
ns
50
ns
50
ns
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
100
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
tPSK
tPSKCD
6
3
ns
Mbps
ns
ns
ps/°C
ns
ns
tPSKOD
22
ns
tPHL, tPLH
PWD
10
20
30
40
3
5
Rev. I | Page 17 of 32
Test Conditions
ADuM1300/ADuM1301
Parameter
For All Models
Output Disable Propagation Delay (High/Low
to High Impedance)
Output Enable Propagation Delay
(High Impedance to High/Low)
Output Rise/Fall Time (10% to 90%)
5 V/3 V Operation
3 V/5 V Operation
Common-Mode Transient Immunity at Logic
High Output 7
Common-Mode Transient Immunity at Logic
Low Output7
Refresh Rate
Input Dynamic Supply Current per Channel 8
Output Dynamic Supply Current per Channel8
Data Sheet
Symbol
Min
Typ
Max
Unit
Test Conditions
tPHZ, tPLH
6
8
ns
CL = 15 pF, CMOS signal levels
tPZH, tPZL
6
8
ns
CL = 15 pF, CMOS signal levels
tR/tF
CL = 15 pF, CMOS signal levels
|CMH|
25
3.0
2.5
35
|CML|
25
35
kV/μs
1.1
0.10
0.05
Mbps
mA/Mbps
mA/Mbps
fr
IDDI (D)
IDDO (D)
1
ns
ns
kV/μs
VIx = VDD1/VDD2, VCM = 1000 V,
transient magnitude = 800 V
VIx = 0 V, VCM = 1000 V,
transient magnitude = 800 V
The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load present. The
supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through
Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total VDD1 and VDD2
supply currents as a function of data rate for ADUM1300W/ADUM1301W channel configurations.
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4
tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is measured
from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5
tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load within the
recommended operating conditions.
6
Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of the isolation
barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing
sides of the isolation barrier.
7
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common-mode voltage slew rate that can be
sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the
range over which the common mode is slewed.
8
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information on
per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a
given data rate.
Rev. I | Page 18 of 32
Data Sheet
ADuM1300/ADuM1301
PACKAGE CHARACTERISTICS
Table 8.
Parameter
Resistance (Input-to-Output)1
Capacitance (Input-to-Output)1
Input Capacitance2
IC Junction-to-Case Thermal Resistance, Side 1
Symbol
RI-O
CI-O
CI
θJCI
IC Junction-to-Case Thermal Resistance, Side 2
θJCO
Min
Typ
1012
1.7
4.0
33
Max
28
Unit
Ω
pF
pF
°C/W
Test Conditions
f = 1 MHz
Thermocouple located at center of
package underside
°C/W
1
Device is considered a 2-terminal device; Pin 1, Pin 2, Pin 3, Pin 4, Pin 5, Pin 6, Pin 7, and Pin 8 are shorted together and Pin 9, Pin 10, Pin 11, Pin 12, Pin 13, Pin 14,
Pin 15, and Pin 16 are shorted together.
2
Input capacitance is from any input data pin to ground.
REGULATORY INFORMATION
The ADuM130x are approved by the organizations listed in Table 9. Refer to Table 14 and the Insulation Lifetime section for details
regarding recommended maximum working voltages for specific crossisolation waveforms and insulation levels.
Table 9.
UL
Recognized under 1577
Component Recognition
Program1
CSA
Approved under CSA Component
Acceptance Notice #5A
VDE
Certified according
to DIN V VDE V 0884-10
(VDE V 0884-10):2006-122
Double/reinforced
insulation, 2500 V rms
isolation voltage
Basic insulation per CSA 60950-1-03 and
IEC 60950-1, 800 V rms (1131 V peak)
maximum working voltage
Reinforced insulation per CSA 60950-1-03
and IEC 60950-1, 400 V rms (566 V peak)
maximum working voltage
File 205078
Reinforced insulation,
560 V peak
TÜV
Approved according to
IEC 61010-1:2001 (2nd Edition),
EN 61010-1:2001 (2nd Edition),
UL 61010-1:2004 CSA C22.2.61010.1:2005
Reinforced insulation, 400 V rms
maximum working voltage
File 2471900-4880-0001
Certificate U8V 05 06 56232 002
File E214100
1
2
In accordance with UL 1577, each ADuM130x is proof tested by applying an insulation test voltage ≥3000 V rms for 1 sec (current leakage detection limit = 5 μA).
In accordance with DIN V VDE V 0884-10, each ADuM130x is proof tested by applying an insulation test voltage ≥1050 V peak for 1 sec (partial discharge detection
limit = 5 pC). The * marking branded on the component designates DIN V VDE V 0884-10 approval.
INSULATION AND SAFETY-RELATED SPECIFICATIONS
Table 10.
Parameter
Rated Dielectric Insulation Voltage
Minimum External Air Gap (Clearance)
Symbol
L(I01)
Value
2500
7.7 min
Unit
V rms
mm
Minimum External Tracking (Creepage)
L(I02)
8.1 min
mm
Minimum Internal Gap (Internal Clearance)
Tracking Resistance (Comparative Tracking Index)
Isolation Group
CTI
0.017 min
>175
IIIa
mm
V
Rev. I | Page 19 of 32
Conditions
1-minute duration
Measured from input terminals to output terminals,
shortest distance through air
Measured from input terminals to output terminals,
shortest distance path along body
Insulation distance through insulation
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
ADuM1300/ADuM1301
Data Sheet
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 INSULATION CHARACTERISTICS
These isolators are suitable for reinforced electrical isolation only within the safety limit data. Maintenance of the safety data is ensured by
protective circuits. The asterisk (*) marking on packages denotes DIN V VDE V 0884-10 approval for 560 V peak working voltage.
Table 11.
Description
Installation Classification per DIN VDE 0110
For Rated Mains Voltage ≤ 150 V rms
For Rated Mains Voltage ≤ 300 V rms
For Rated Mains Voltage ≤ 400 V rms
Climatic Classification
Pollution Degree per DIN VDE 0110, Table 1
Maximum Working Insulation Voltage
Input-to-Output Test Voltage, Method B1
Input-to-Output Test Voltage, Method A
After Environmental Tests Subgroup 1
After Input and/or Safety Test Subgroup 2
and Subgroup 3
Highest Allowable Overvoltage
Safety-Limiting Values
VIORM × 1.875 = VPR, 100% production test, tm = 1 sec,
partial discharge < 5 pC
VIORM × 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC
Symbol
Characteristic
Unit
VIORM
VPR
I to IV
I to III
I to II
40/105/21
2
560
1050
V peak
V peak
896
672
V peak
V peak
VTR
4000
V peak
TS
IS1
IS2
RS
150
265
335
>109
°C
mA
mA
Ω
VPR
VIORM × 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC
Transient overvoltage, tTR = 10 seconds
Maximum value allowed in the event of a failure
(see Figure 3)
VIO = 500 V
350
RECOMMENDED OPERATING CONDITIONS
300
Table 12.
Parameter
Operating Temperature (TA) 1
Operating Temperature (TA) 2
Supply Voltages (VDD1, VDD2)1, 3
Supply Voltages (VDD1, VDD2) 2, 3
Input Signal Rise and Fall Times
250
SIDE #2
200
150
SIDE #1
100
1
50
0
0
50
100
150
CASE TEMPERATURE (°C)
200
Rating
−40°C to +105°C
−40°C to +125°C
2.7 V to 5.5 V
3.0 V to 5.5 V
1.0 ms
Does not apply to ADuM1300W and ADuM1301W automotive grade versions.
Applies to ADuM1300W and ADuM1301W automotive grade versions.
3
All voltages are relative to their respective ground. See the DC Correctness
and Magnetic Field Immunity section for information on immunity to external
magnetic fields.
2
03787-003
SAFETY-LIMITING CURRENT (mA)
Case Temperature
Side 1 Current
Side 2 Current
Insulation Resistance at TS
Conditions
Figure 3. Thermal Derating Curve, Dependence of Safety-Limiting
Values with Case Temperature per DIN V VDE V 0884-10
Rev. I | Page 20 of 32
Data Sheet
ADuM1300/ADuM1301
ABSOLUTE MAXIMUM RATINGS
Ambient temperature = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 13.
Parameter
Storage Temperature (TST)
Ambient Operating Temperature (TA)1
Ambient Operating Temperature (TA)2
Supply Voltages (VDD1, VDD2)3
Input Voltage (VIA, VIB, VIC, VE1, VE2)3, 4
Output Voltage (VOA, VOB, VOC)3, 4
Average Output Current per Pin5
Side 1 (IO1)
Side 2 (IO2)
Common-Mode Transients6
Rating
−65°C to +150°C
−40°C to +105°C
−40°C to +125°C
−0.5 V to +7.0 V
−0.5 V to VDDI + 0.5 V
−0.5 V to VDDO + 0.5 V
ESD CAUTION
−23 mA to +23 mA
−30 mA to +30 mA
−100 kV/μs to +100 kV/μs
1
Does not apply to ADuM1300W and ADuM1301W automotive grade
versions.
2
Applies to ADuM1300W and ADuM1301W automotive grade versions.
3
All voltages are relative to their respective ground.
4
VDDI and VDDO refer to the supply voltages on the input and output sides of a
given channel, respectively. See the PC Board Layout section.
5
See Figure 3 for maximum rated current values for various temperatures.
6
This refers to common-mode transients across the insulation barrier.
Common-mode transients exceeding the Absolute Maximum Ratings may
cause latch-up or permanent damage.
Table 14. Maximum Continuous Working Voltage1
Parameter
AC Voltage, Bipolar Waveform
AC Voltage, Unipolar Waveform
Basic Insulation
Reinforced Insulation
DC Voltage
Basic Insulation
Reinforced Insulation
1
Max
565
Unit
V peak
Constraint
50-year minimum lifetime
1131
560
V peak
V peak
Maximum approved working voltage per IEC 60950-1
Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10
1131
560
V peak
V peak
Maximum approved working voltage per IEC 60950-1
Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10
Refers to continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for more details.
Table 15. Truth Table (Positive Logic)
VIx Input1
H
L
X
X
X
X
1
2
VEx Input1, 2
H or NC
H or NC
L
H or NC
L
X
VDDI State1
Powered
Powered
Powered
Unpowered
Unpowered
Powered
VDDO State1
Powered
Powered
Powered
Powered
Powered
Unpowered
VOx Output1
Notes
H
L
Z
H
Outputs return to the input state within 1 μs of VDDI power restoration.
Z
Indeterminate Outputs return to the input state within 1 μs of VDDO power restoration
if the VEx state is H or NC. Outputs return to a high impedance state
within 8 ns of VDDO power restoration if the VEx state is L.
VIx and VOx refer to the input and output signals of a given channel (A, B, or C). VEx refers to the output enable signal on the same side as the VOx outputs. VDDI and VDDO
refer to the supply voltages on the input and output sides of the given channel, respectively.
In noisy environments, connecting VEx to an external logic high or low is recommended.
Rev. I | Page 21 of 32
ADuM1300/ADuM1301
Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
VDD1 1
16
VDD2
*GND1 2
15
GND2*
VIA 3
14
VOA
VIA 3
TOP VIEW 13 VOB
VIC 5 (Not to Scale) 12 VOC
11 NC
NC 6
VIB 4
TOP VIEW 13 VOB
VOC 5 (Not to Scale) 12 VIC
NC 6
11 NC
NC 7
10
VE2
VE1 7
10 VE2
*GND1 8
9
GND2*
03787-004
VIB 4
NC = NO CONNECT
16 VDD2
*GND1 8
15 GND2*
ADuM1301
14 VOA
9
NC = NO CONNECT
GND2*
03787-005
ADuM1300
VDD1 1
*GND1 2
*PIN 2 AND PIN 8 ARE INTERNALLY CONNECTED, AND CONNECTING
BOTH TO GND1 IS RECOMMENDED. PIN 9 AND PIN 15 ARE INTERNALLY
CONNECTED, AND CONNECTING BOTH TO GND2 IS RECOMMENDED.
*PIN 2 AND PIN 8 ARE INTERNALLY CONNECTED, AND CONNECTING
BOTH TO GND1 IS RECOMMENDED. PIN 9 AND PIN 15 ARE INTERNALLY
CONNECTED, AND CONNECTING BOTH TO GND2 IS RECOMMENDED.
Figure 4. ADuM1300 Pin Configuration
Figure 5. ADuM1301 Pin Configuration
Table 16. ADuM1300 Pin Function Descriptions
Table 17. ADuM1301 Pin Function Descriptions
Pin
No.
1
2
3
4
5
6
7
8
9
10
Pin
No.
1
2
3
4
5
6
7
Mnemonic
VDD1
GND1
VIA
VIB
VOC
NC
VE1
8
9
10
GND1
GND2
VE2
11
12
13
14
15
16
NC
VIC
VOB
VOA
GND2
VDD2
11
12
13
14
15
16
Mnemonic
VDD1
GND1
VIA
VIB
VIC
NC
NC
GND1
GND2
VE2
NC
VOC
VOB
VOA
GND2
VDD2
Description
Supply Voltage for Isolator Side 1.
Ground 1. Ground reference for Isolator Side 1.
Logic Input A.
Logic Input B.
Logic Input C.
No Connect.
No Connect.
Ground 1. Ground reference for Isolator Side 1.
Ground 2. Ground reference for Isolator Side 2.
Output Enable 2. Active high logic input. VOA, VOB,
and VOC outputs are enabled when VE2 is high or
disconnected. VOA, VOB, and VOC outputs are disabled
when VE2 is low. In noisy environments, connecting
VE2 to an external logic high or low is recommended.
No Connect.
Logic Output C.
Logic Output B.
Logic Output A.
Ground 2. Ground reference for Isolator Side 2.
Supply Voltage for Isolator Side 2.
Rev. I | Page 22 of 32
Description
Supply Voltage for Isolator Side 1.
Ground 1. Ground reference for Isolator Side 1.
Logic Input A.
Logic Input B.
Logic Output C.
No Connect.
Output Enable 1. Active high logic input. VOC output
is enabled when VE1 is high or disconnected. VOC
output is disabled when VE1 is low. In noisy environments, connecting VE1 to an external logic high
or low is recommended.
Ground 1. Ground reference for Isolator Side 1.
Ground 2. Ground reference for Isolator Side 2.
Output Enable 2. Active high logic input. VOA and
VOB outputs are enabled when VE2 is high or disconnected. VOA and VOB outputs are disabled when VE2 is
low. In noisy environments, connecting VE2 to an
external logic high or low is recommended.
No Connect.
Logic Input C.
Logic Output B.
Logic Output A.
Ground 2. Ground reference for Isolator Side 2.
Supply Voltage for Isolator Side 2.
Data Sheet
ADuM1300/ADuM1301
TYPICAL PERFORMANCE CHARACTERISTICS
60
20
18
50
14
40
CURRENT (mA)
CURRENT/CHANNEL (mA)
16
12
5V
10
8
6
30
5V
20
3V
3V
4
10
0
20
40
60
DATA RATE (Mbps)
80
100
0
03787-008
0
0
Figure 6. Typical Input Supply Current per Channel vs. Data Rate
for 5 V and 3 V Operation
20
40
60
DATA RATE (Mbps)
80
100
03787-011
2
Figure 9. Typical ADuM1300 VDD1 Supply Current vs. Data Rate
for 5 V and 3 V Operation
6
16
14
12
4
CURRENT (mA)
CURRENT/CHANNEL (mA)
5
3
5V
2
3V
10
8
5V
6
3V
4
1
0
20
40
60
DATA RATE (Mbps)
80
100
0
03787-009
0
0
40
60
DATA RATE (Mbps)
80
100
Figure 10. Typical ADuM1300 VDD2 Supply Current vs. Data Rate
for 5 V and 3 V Operation
Figure 7. Typical Output Supply Current per Channel vs. Data Rate
for 5 V and 3 V Operation (No Output Load)
50
9
45
8
40
7
35
CURRENT (mA)
10
6
5
4
5V
30
25
5V
20
3V
15
3
10
1
5
0
0
20
40
60
DATA RATE (Mbps)
80
100
Figure 8. Typical Output Supply Current per Channel vs. Data Rate
for 5 V and 3 V Operation (15 pF Output Load)
0
0
20
40
60
DATA RATE (Mbps)
80
100
Figure 11. Typical ADuM1301 VDD1 Supply Current vs. Data Rate
for 5 V and 3 V Operation
Rev. I | Page 23 of 32
03787-013
3V
2
03787-010
CURRENT/CHANNEL (mA)
20
03787-012
2
ADuM1300/ADuM1301
Data Sheet
30
40
PROPAGATION DELAY (ns)
25
15
5V
10
3V
3V
35
30
5
0
0
20
40
60
DATA RATE (Mbps)
80
100
Figure 12. Typical ADuM1301 VDD2 Supply Current vs. Data Rate
for 5 V and 3 V Operation
25
–50
–25
0
25
50
TEMPERATURE (°C)
75
Figure 13. Propagation Delay vs. Temperature, C Grade
Rev. I | Page 24 of 32
100
03787-019
5V
03787-014
CURRENT (mA)
20
Data Sheet
ADuM1300/ADuM1301
APPLICATIONS INFORMATION
PC BOARD LAYOUT
DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY
The ADuM130x digital isolator requires no external interface
circuitry for the logic interfaces. Power supply bypassing is
strongly recommended at the input and output supply pins (see
Figure 14). Bypass capacitors are most conveniently connected
between Pin 1 and Pin 2 for VDD1 and between Pin 15 and
Pin 16 for VDD2. The capacitor value should be between 0.01 μF
and 0.1 μF. The total lead length between both ends of the
capacitor and the input power supply pin should not exceed
20 mm. Bypassing between Pin 1 and Pin 8 and between Pin 9
and Pin 16 should also be considered unless the ground pair on
each package side is connected close to the package.
Positive and negative logic transitions at the isolator input
cause narrow (~1 ns) pulses to be sent to the decoder via the
transformer. The decoder is bistable and is therefore either set
or reset by the pulses, indicating input logic transitions. In the
absence of logic transitions at the input for more than ~1 μs, a
periodic set of refresh pulses indicative of the correct input state
are sent to ensure dc correctness at the output. If the decoder
receives no internal pulses for more than about 5 μs, the input
side is assumed to be unpowered or nonfunctional, in which
case the isolator output is forced to a default state (see Table 15)
by the watchdog timer circuit.
VDD2
GND2
VOA
VOB
VOC/VIC
NC
VE2
GND2
The ADuM130x is extremely immune to external magnetic
fields. The limitation on the magnetic field immunity of the
ADuM130x is set by the condition in which induced voltage in
the receiving coil of the transformer is sufficiently large enough
to either falsely set or reset the decoder. The following analysis
defines the conditions under which this may occur. The 3 V
operating condition of the ADuM130x is examined because it
represents the most susceptible mode of operation.
03787-015
VDD1
GND1
VIA
VIB
VIC/VOC
NC
NC/VE1
GND1
Figure 14. Recommended Printed Circuit Board Layout
In applications involving high common-mode transients,
care should be taken to ensure that board coupling across the
isolation barrier is minimized. Furthermore, the board layout
should be designed such that any coupling that does occur
equally affects all pins on a given component side. Failure to
ensure this could cause voltage differentials between pins
exceeding the absolute maximum ratings of the device,
thereby leading to latch-up or permanent damage.
The pulses at the transformer output have an amplitude greater
than 1.0 V. The decoder has a sensing threshold at about 0.5 V,
thus establishing a 0.5 V margin in which induced voltages can be
tolerated. The voltage induced across the receiving coil is given by
V = (−dβ/dt)∑∏rn2; n = 1, 2, … , N
PROPAGATION DELAY-RELATED PARAMETERS
where:
β is magnetic flux density (gauss).
N is the number of turns in the receiving coil.
rn is the radius of the nth turn in the receiving coil (cm).
Propagation delay is a parameter that describes the time it takes
a logic signal to propagate through a component. The propagation
delay to a logic low output may differ from the propagation
delay to a logic high output.
Given the geometry of the receiving coil in the ADuM130x and
an imposed requirement that the induced voltage be 50% at
most of the 0.5 V margin at the decoder, a maximum allowable
magnetic field is calculated as shown in Figure 16.
See the AN-1109 Application Note for board layout guidelines.
50%
Figure 15. Propagation Delay Parameters
Pulse width distortion is the maximum difference between
these two propagation delay values and is an indication of
how accurately the timing of the input signal is preserved.
Channel-to-channel matching refers to the maximum amount
that the propagation delay differs between channels within a
single ADuM130x component.
MAXIMUM ALLOWABLE MAGNETIC FLUX
DENSITY (kgauss)
tPHL
03787-016
tPLH
OUTPUT (VOx)
100
50%
Propagation delay skew refers to the maximum amount that
the propagation delay differs between multiple ADuM130x
components operating under the same conditions.
10
1
0.1
0.01
0.001
1k
1M
10k
100k
10M
MAGNETIC FIELD FREQUENCY (Hz)
100M
Figure 16. Maximum Allowable External Magnetic Flux Density
Rev. I | Page 25 of 32
03787-017
INPUT (VIx)
ADuM1300/ADuM1301
Data Sheet
For example, at a magnetic field frequency of 1 MHz, the
maximum allowable magnetic field of 0.2 kgauss induces a
voltage of 0.25 V at the receiving coil. This is about 50% of the
sensing threshold and does not cause a faulty output transition.
Similarly, if such an event occurs during a transmitted pulse
(and has the worst-case polarity), it reduces the received pulse
from >1.0 V to 0.75 V—still well above the 0.5 V sensing
threshold of the decoder.
POWER CONSUMPTION
The preceding magnetic flux density values correspond to
specific current magnitudes at given distances from the
ADuM130x transformers. Figure 17 shows these allowable
current magnitudes as a function of frequency for selected
distances. The ADuM130x is extremely immune and can be
affected only by extremely large currents operated at a high
frequency very close to the component. For the 1 MHz example
noted, one would have to place a 0.5 kA current 5 mm away
from the ADuM130x to affect the operation of the component.
For each output channel, the supply current is given by
DISTANCE = 1m
100
10
DISTANCE = 100mm
1
DISTANCE = 5mm
0.1
0.01
1k
10k
100k
1M
10M
MAGNETIC FIELD FREQUENCY (Hz)
100M
03787-018
MAXIMUM ALLOWABLE CURRENT (kA)
1000
Figure 17. Maximum Allowable Current
for Various Current-to-ADuM130x Spacings
The supply current at a given channel of the ADuM130x
isolator is a function of the supply voltage, the data rate of
the channel, and the output load of the channel.
For each input channel, the supply current is given by
IDDI = IDDI (Q)
f ≤ 0.5 fr
IDDI = IDDI (D) × (2f − fr) + IDDI (Q)
f > 0.5 fr
IDDO = IDDO (Q)
f ≤ 0.5 fr
−3
IDDO = (IDDO (D) + (0.5 × 10 ) × CL × VDDO) × (2f − fr) + IDDO (Q)
f > 0.5 fr
where:
IDDI (D), IDDO (D) are the input and output dynamic supply currents
per channel (mA/Mbps).
CL is the output load capacitance (pF).
VDDO is the output supply voltage (V).
f is the input logic signal frequency (MHz); it is half of the input
data rate expressed in units of Mbps.
fr is the input stage refresh rate (Mbps).
IDDI (Q), IDDO (Q) are the specified input and output quiescent
supply currents (mA).
To calculate the total VDD1 and VDD2 supply current, the supply
currents for each input and output channel corresponding to
VDD1 and VDD2 are calculated and totaled. Figure 6 and Figure 7
provide per-channel supply currents as a function of data rate
for an unloaded output condition. Figure 8 provides per-channel
supply current as a function of data rate for a 15 pF output
condition. Figure 9 through Figure 12 provide total VDD1 and
VDD2 supply current as a function of data rate for ADuM1300/
ADuM1301 channel configurations.
Note that at combinations of strong magnetic field and high
frequency, any loops formed by printed circuit board traces
could induce error voltages sufficiently large enough to trigger
the thresholds of succeeding circuitry. Care should be taken in
the layout of such traces to avoid this possibility.
Rev. I | Page 26 of 32
Data Sheet
ADuM1300/ADuM1301
Note that the voltage presented in Figure 19 is shown as sinusoidal
for illustration purposes only. It is meant to represent any voltage
waveform varying between 0 V and some limiting value. The
limiting value can be positive or negative, but the voltage
cannot cross 0 V.
The insulation lifetime of the ADuM130x depends on the
voltage waveform type imposed across the isolation barrier.
The iCoupler insulation structure degrades at different rates
depending on whether the waveform is bipolar ac, unipolar ac,
or dc. Figure 18, Figure 19, and Figure 20 illustrate these
different isolation voltage waveforms, respectively.
Bipolar ac voltage is the most stringent environment. The goal
of a 50-year operating lifetime under the ac bipolar condition
determines the Analog Devices recommended maximum
working voltage.
RATED PEAK VOLTAGE
03787-021
Analog Devices performs accelerated life testing using voltage
levels higher than the rated continuous working voltage. Acceleration factors for several operating conditions are determined.
These factors allow calculation of the time to failure at the
actual working voltage. The values shown in Table 14 summarize
the peak voltage for 50 years of service life for a bipolar ac
operating condition and the maximum CSA/VDE approved
working voltages. In many cases, the approved working voltage
is higher than the 50-year service life voltage. Operation at these
high working voltages can lead to shortened insulation life in
some cases.
0V
Figure 18. Bipolar AC Waveform
RATED PEAK VOLTAGE
03787-022
All insulation structures eventually break down when subjected
to voltage stress over a sufficiently long period. The rate of
insulation degradation is dependent on the characteristics of the
voltage waveform applied across the insulation. In addition to
the testing performed by the regulatory agencies, Analog Devices
carries out an extensive set of evaluations to determine the
lifetime of the insulation structure within the ADuM130x.
In the case of unipolar ac or dc voltage, the stress on the insulation is significantly lower, which allows operation at higher
working voltages while still achieving a 50-year service life. The
working voltages listed in Table 14 can be applied while maintaining the 50-year minimum lifetime provided the voltage
conforms to either the unipolar ac or dc voltage cases. Any cross
insulation voltage waveform that does not conform to Figure 19
or Figure 20 should be treated as a bipolar ac waveform, and its
peak voltage should be limited to the 50-year lifetime voltage
value listed in Table 14.
0V
Figure 19. Unipolar AC Waveform
RATED PEAK VOLTAGE
03787-023
INSULATION LIFETIME
0V
Figure 20. DC Waveform
Rev. I | Page 27 of 32
ADuM1300/ADuM1301
Data Sheet
OUTLINE DIMENSIONS
10.50 (0.4134)
10.10 (0.3976)
9
16
7.60 (0.2992)
7.40 (0.2913)
8
1.27 (0.0500)
BSC
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10
0.51 (0.0201)
0.31 (0.0122)
10.65 (0.4193)
10.00 (0.3937)
0.75 (0.0295)
45°
0.25 (0.0098)
2.65 (0.1043)
2.35 (0.0925)
SEATING
PLANE
8°
0°
0.33 (0.0130)
0.20 (0.0079)
COMPLIANT TO JEDEC STANDARDS MS-013-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
1.27 (0.0500)
0.40 (0.0157)
03-27-2007-B
1
Figure 21. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body (RW-16)
Dimensions shown in millimeters (and inches)
ORDERING GUIDE
Model 1, 2, 3, 4
ADuM1300ARW
ADuM1300CRW
ADuM1300ARWZ
ADuM1300BRWZ
ADuM1300CRWZ
ADuM1300WSRWZ
ADuM1300WTRWZ
ADuM1301ARW
ADuM1301BRW
ADuM1301CRW
ADuM1301ARWZ
ADuM1301BRWZ
ADuM1301CRWZ
ADuM1301WSRWZ
ADuM1301WTRWZ
EVAL-ADuMQSEBZ
Number Number Maximum
of Inputs, of Inputs, Data Rate
VDD1 Side VDD2 Side (Mbps)
3
0
1
3
0
90
3
0
1
3
0
10
3
0
90
3
0
1
3
0
10
2
1
1
2
1
10
2
1
90
2
1
1
2
1
10
2
1
90
2
1
1
2
1
10
Maximum
Propagation
Delay, 5 V (ns)
100
32
100
50
32
100
32
100
50
32
100
50
32
100
32
1
Maximum
Pulse Width
Distortion (ns)
40
2
40
3
2
40
3
40
3
2
40
3
2
40
3
Z = RoHS Compliant Part.
W = Qualified for Automotive Applications.
3
Tape and reel are available. The addition of an -RL suffix designates a 13” (1,000 units) tape-and-reel option.
4
No tape-and-reel option is available for the ADuM1301CRW model.
5
RW-16 = 16-lead wide body SOIC.
2
Rev. I | Page 28 of 32
Temperature Range
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +125°C
−40°C to +125°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +125°C
−40°C to +125°C
Package
Option 5
RW-16
RW-16
RW-16
RW-16
RW-16
RW-16
RW-16
RW-16
RW-16
RW-16
RW-16
RW-16
RW-16
RW-16
RW-16
Data Sheet
ADuM1300/ADuM1301
AUTOMOTIVE PRODUCTS
The ADuM1300W/ADuM1301W models are available with controlled manufacturing to support the quality and reliability requirements
of automotive applications. Note that these automotive models may have specifications that differ from the commercial models; therefore,
designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for
use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and
to obtain the specific Automotive Reliability reports for these models.
Rev. I | Page 29 of 32
ADuM1300/ADuM1301
Data Sheet
NOTES
Rev. I | Page 30 of 32
Data Sheet
ADuM1300/ADuM1301
NOTES
Rev. I | Page 31 of 32
ADuM1300/ADuM1301
Data Sheet
NOTES
©2003–2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03787-0-3/12(I)
Rev. I | Page 32 of 32