HV5812
20-Channel Serial-Input Vacuum Fluorescent Display Driver for Anode or Grid
Features
•
•
•
•
•
•
•
General Description
HVCMOS® Technology for High Performance
Operating Voltage of up to 80V
High-speed Source Driver
5V CMOS Logic Circuitry
Up to 5 MHz Data Input Rate
Excellent Noise Immunity
Flexible High-voltage Supplies
The HV5812 is a 20-channel serial-input vacuum
fluorescent display driver. It combines a 20-bit CMOS
shift register, data latches and control circuitry with
high-voltage MOSFET outputs. The HV5812 is
primarily designed for vacuum fluorescent displays.
The CMOS shift register and latches allow direct
interfacing with microprocessor-based systems. Data
input rates are typically over 5 MHz with 5V logic
supply. Especially useful for interdigit blanking, the
blanking input disables the output source drives and
turns on the sink drivers. Using with TTL may require
external pull-up resistors to ensure an input logic high.
Applications
• Display Driver
Package Types
28-lead PDIP
(Top view)
1
28
28-lead PLCC
(Top view)
4
1 28
28-lead SOW
(Top view)
26
1
28
See Table 2-1 for pin information.
2016 Microchip Technology Inc.
DS20005629A-page 1
HV5812
Functional Block Diagram
BL
STROBE
VPP
HVOUT1
VDD
HVOUT2
DATA IN
CLK
DATA OUT
GND
20-bit
Shift
Register
20-bit
Latch
HVOUT3
HVOUT20
DS20005629A-page 2
2016 Microchip Technology Inc.
HV5812
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage, VDD................................................................................................................................ –0.5V to +7.5V
Supply Voltage, VPP .................................................................................................................................. –0.5V to +90V
Logic Input Levels ............................................................................................................................ –0.3V to VDD +0.3V
Maximum Operating Junction Temperature .........................................................................................................+125°C
Storage Temperature ............................................................................................................................–55°C to +150°C
Power Dissipation:
28-lead PDIP ......................................................................................................................................... 2000 mW
28-lead PLCC........................................................................................................................................ 1900 mW
28-Lead SOW........................................................................................................................................ 1700 mW
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions above those
indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Parameter
Sym.
Min.
Typ.
Max.
Unit
Supply Voltage
VDD
4.5
—
5.5
V
Supply Voltage
VPP
20
—
80
V
TJ
–40
—
+125
°C
Operating Junction Temperature
Conditions
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over recommended operating conditions; TA = 25°C unless otherwise indicated.
Parameter
Sym.
Min.
Typ.
Max.
Unit
IDSS
—
–5
–15
µA
Output Leakage Current
78
78.5
—
77
78
—
4.5
4.7
—
—
1.5
3
HVOUT
High-level Output
VOH
DATA
OUT
HVOUT
Low-level Output
VOL
DATA
OUT
V
V
VOUT = 0V, TA = +70°C
IOUT = –25 mA, VPP = 80V,
TJ = +25°C
IOUT = –25 mA, VPP = 80V,
TJ = +125°C
IOUT = –200 µA, VDD = 5V
IOUT = 1 mA, TJ = +25°C, VDD = 5V
V
IOUT = 1 mA, TJ = +125°C,
VDD = 5V
IOUT = +200 µA, VDD = 5V
—
2.3
4
—
200
250
V
ISINK
2
3.5
—
mA
High-level Logic Input Voltage
VIH
3.5
—
5.3
V
—
0.8
V
Output Pull-down Current
Conditions
VOUT = 5V to VPP, VDD = 5V
VDD = 5V
Low-level Logic Input Voltage
VIL
–0.3
High-level Logic Input Current
IIH
—
0.05
0.5
µA
VIN = VDD, VDD = 5V
Low-level Logic Input Current
IIL
—
–0.05
–0.5
µA
VIN = 0.8V, VDD = 5V
—
100
300
—
100
300
—
10
100
—
10
100
Quiescent VDD Supply
Current
IDDQ
Quiescent VPP Supply Current
IPPQ
2016 Microchip Technology Inc.
µA
µA
All outputs high, VDD = 5V
All outputs low, VDD = 5V
All outputs high, no load
All outputs low, no load
DS20005629A-page 3
HV5812
AC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over recommended operating conditions; TA = 25°C unless otherwise indicated.
Parameter
Sym.
Min.
Typ.
Max.
tPHL
—
2000
—
tPLH
—
1000
—
Output Fall Time
tr
—
1450
Output Rise Time
tf
—
Data Set-up Time
tSU
Data Hold Time
Blanking to Output Delay
Unit
Conditions
ns
CL = 30 pF, 50% to 50%, VDD=5V
—
ns
CL = 30 pF, 90% to 10%, VDD = 5V
650
—
ns
CL = 30 pF, 10% to 90%, VDD = 5V
75
—
—
ns
See Timing Waveforms.
tH
75
—
—
ns
See Timing Waveforms.
Minimum Data Pulse Width
tPWD
150
—
—
ns
See Timing Waveforms.
Minimum Clock Pulse Width
tPWCLK
150
—
—
ns
See Timing Waveforms.
Minimum Time between Clock
Activation and Strobe
tCKS
300
—
—
ns
See Timing Waveforms.
Minimum Strobe Pulse Width
tPWS
100
—
—
ns
SeeTiming Waveforms.
Typical Time between Strobe
Activation and Output
Transition
tSTO
—
500
—
ns
See Timing Waveforms.
Maximum Clock Frequency
fCLK
—
8
—
—
5
—
MHz
TJ = +25°C, VDD = 5V
TJ = +125°C, VDD = 5V
TEMPERATURE SPECIFICATIONS
Parameter
Sym.
Min.
Typ.
Max.
Unit
Operating Junction Temperature
TJ
–40
—
+125
°C
Storage Temperature
TS
–55
—
+150
°C
Conditions
TEMPERATURE RANGE
PACKAGE THERMAL RESISTANCE
28-lead PDIP
JA
—
43
—
°C/W
28-lead PLCC
JA
—
48
—
°C/W
28-lead SOW
JA
—
55
—
°C/W
DS20005629A-page 4
2016 Microchip Technology Inc.
HV5812
Timing Waveforms
tPWCLK
CLK
50%
VIH
50%
VIL
tSU
DATA IN
50%
VIH
tPWD
50%
VIL
th
STROBE
tPWS
tCKS
50%
VIH
50%
BL
50%
50%
tPHL
HVOUT
tSTO
90%
tr
2016 Microchip Technology Inc.
90%
50%
10%
10%
tf
VIL
VIH
tPLH
50%
VIL
VOH
VOL
DS20005629A-page 5
HV5812
2.0
PIN DESCRIPTION
The details on the pins of HV5812 28-lead PDIP,
28-lead PLCC and 28-lead SOW are listed on
Table 2-1. Refer to Package Types for the location of
pins.
TABLE 2-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
1
VPP
2
Data Out
Serial data output. Data output for cascading to the data input of the next device.
3
HVOUT20
High-voltage output
4
HVOUT19
High-voltage output
5
HVOUT18
High-voltage output
6
HVOUT17
High-voltage output
7
HVOUT16
High-voltage output
8
HVOUT15
High-voltage output
9
HVOUT14
High-voltage output
10
HVOUT13
High-voltage output
11
HVOUT12
High-voltage output
12
HVOUT11
High-voltage output
13
BLANKING
14
GND
15
CLOCK
16
STROBE
Strobe
17
HVOUT10
High-voltage output
18
HVOUT9
High-voltage output
19
HVOUT8
High-voltage output
20
HVOUT7
High-voltage output
21
HVOUT6
High-voltage output
22
HVOUT5
High-voltage output
23
HVOUT4
High-voltage output
24
HVOUT3
High-voltage output
25
HVOUT2
High-voltage output
26
HVOUT1
High-voltage output
27
Data In
Serial data input
28
VDD
DS20005629A-page 6
Description
High-voltage power rail
Blank
Logic and high-voltage ground
Data shift register clock
Low-voltage logic power rail
2016 Microchip Technology Inc.
HV5812
3.0
FUNCTIONAL DESCRIPTION
Follow the steps below to power up and power down
the HV5812:
POWER-UP AND POWER-DOWN SEQUENCE
Power-up
Step
Power-down
Description
Step
1
Connect ground.
1
2
Apply VDD.
2
3
Set all inputs (Data, CLK, etc.) to a known state
3
4
4
Apply VPP. (Note 1)
Note 1: The VPP should not drop below VDD during operation.
Shift Register Contents
I1
I2
I3... IN-1
IN
Remove VPP.
Remove all inputs.
Remove VDD.
Disconnect ground.
,
FUNCTION TABLE (Note 1)
Serial
Clock
Data
Input
Input
Description
Serial
Strobe
Data
Input
Output
Latch Contents
Output Contents
I1
I2
I3... IN-1
IN
Blanking
I1
I2
I3... IN-1
IN
H
L to H
H
R1
R2...RN–2
RN–1
RN–1
—
—
—
—
—
—
—
—
—
—
L
L to H
L
R1
R2...RN–2
RN–1
RN–1
—
—
—
—
—
—
—
—
—
—
X
H to L
R1
R2
R3...RN–1
RN
RN
—
—
—
—
—
—
—
—
—
—
—
—
X
X
X...X
X
X
L
R1
R2
R3...RN–1
RN
—
—
—
—
—
—
—
P1
P2
P3...PN–1
PN
PN
H
P1
P2
P3...PN–1
PN
L
P1
P2
P3...PN–1
PN
—
—
—
—
—
—
—
—
X
X
X...X
X
H
L
L
L...L
L
Note 1:
L = Low logic level
H = High logic level
X = Irrelevant
P = Present state
R = Previous state
VDD
VPP
VDD
L/T
GND
GND
GND
Logic Inputs
FIGURE 3-1:
HVOUT
Data Out
INPUT
Logic Data Output
High Voltage Outputs
IO Circuits.
2016 Microchip Technology Inc.
DS20005629A-page 7
HV5812
4.0
PACKAGE MARKING INFORMATION
4.1
Packaging Information
28-lead PDIP
XXXXXX e3
YYWWNNN
Example
XXXXXXXXX
e3 YYWWNNN
HV5812PJ
e3 1611231
XXXXXXX e3
YYWWNNN
e3
*
Note:
DS20005629A-page 8
HV5812P e3
1625859
28-lead PLCC
28-lead SOW
Legend: XX...X
Y
YY
WW
NNN
Example
Example
HV5812WG e3
1678896
Product Code or Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
2016 Microchip Technology Inc.
HV5812
28-Lead PDIP (.600in Row Spacing) Package Outline (P)
1.565x.580in body, .250in height (max), .100in pitch
D
28
E1
Note 1
(Index Area)
E
b1
1
D1
D1
b
Top View
View B
View B
A
Seating
Plane
A A2
A1
L
eA
eB
e
A
Side View
View A - A
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Note:
1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURU
DSULQWHGLQGLFDWRU
Symbol
Dimension
(inches)
A
A1
A2
b
b1
D
D1
E
†
.590
E1
†
.140*
.015
.125
.014
.030
1.380
.065
-
-
-
-
-
-
-
-
-
.070
1.565
.085*
.625
.580
MAX
.250
.055*
.195
.023
eA
.100
BSC
.600
BSC
.485
MIN
NOM
†
e
eB
L
.600*
.115
-
-
.700
.200
-('(&5HJLVWUDWLRQ069DULDWLRQ$%,VVXH%-XQH
7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ
7KLVGLPHQVLRQGLIIHUVIURPWKH-('(&GUDZLQJ
Drawings not to scale.
2016 Microchip Technology Inc.
DS20005629A-page 9
HV5812
28-Lead PLCC Package Outline (PJ)
.453x.453in. body, .180in. height (max), .050in. pitch
.048/.042
x 45O
D
D1
1
4
.056/.042
x 45O
26
28
.150 MAX
Note 1
(Index Area)
075 MAX
E1
E
Note 2
.020max
(3 Places)
Top View
Vertical Side View
View A
b1
A
Base .020 MIN
Plane
A1 A2
Seating
Plane
e
b
Horizontal Side View
R
View A
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Notes:
1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURU
a printed indicator.
2. $FWXDOVKDSHRIWKLVIHDWXUHPD\YDU\
Symbol
Dimension
(inches)
A
A1
A2
b
b1
D
D1
E
E1
MIN
.165
.090
.062
.013
.026
.485
.450
.485
.450
NOM
.172
.105
-
-
-
.490
.453
.490
.453
MAX
.180
.120
.083
.021
.032
.495
.456
.495
.456
e
R
.050
BSC
.035
.025
.045
JEDEC Registration MS-018, Variation AB, Issue A, June, 1993.
Drawings not to scale.
DS20005629A-page 10
2016 Microchip Technology Inc.
HV5812
28-Lead SOW (Wide Body) Package Outline (WG)
17.90x7.50mm body, 2.65mm height (max), 1.27mm pitch
D
θ1
28
E1
E
Gauge
Plane
L2
Note 1
(Index Area
0.25D x 0.75E1)
L
Seating
Plane
θ
L1
1
Top View
View B
A
View
B
h
A A2
h
Seating
Plane
b
e
A1
Note 1
A
Side View
View A - A
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Note:
1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURU
a printed indicator.
Symbol
MIN
Dimension
NOM
(mm)
MAX
A
A1
A2
b
D
E
E1
2.15*
0.10
2.05
0.31
17.70*
9.97*
7.40*
2.65
0.30
2.55*
0.51
17.90
18.10*
10.30
10.63*
7.50
7.60*
e
1.27
BSC
h
L
0.25
0.40
0.75
1.27
L1
1.40
REF
L2
0.25
BSC
ș
ș
0O
5O
-
-
8
O
15O
JEDEC Registration MS-013, Variation AE, Issue E, Sep. 2005.
7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ
Drawings are not to scale.
S
# S
28SO
G
0 1309
2016 Microchip Technology Inc.
DS20005629A-page 11
HV5812
NOTES:
DS20005629A-page 12
2016 Microchip Technology Inc.
HV5812
APPENDIX A:
REVISION HISTORY
Revision A (October 2016)
• Converted Supertex Doc# DSFP-HV5812 to
Microchip DS20005629A
• Changed the packaging quantity of 28-lead PLCC
(PJ M904) from 500/Reel to 750/Reel and
28-lead SOW (WG) from 1000/Reel to 1600/Reel
• Made minor text changes throughout the document
2016 Microchip Technology Inc.
DS20005629A-page 13
HV5812
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
XX
-
Package
Options
X
-
Environmental
X
Media Type
Device:
HV5812
=
20-Channel Serial-Input Vacuum
Fluorescent Display Driver for Anode or
Grid
Packages:
P
PJ
WG
=
=
=
28-lead PDIP
28-lead PLCC
28-lead SOW
Environmental:
G
=
Lead (Pb)-free/RoHS-compliant Package
Media Types:
(blank)
=
=
=
=
13/Tube for a P Package
38/Tube for a PJ Package
1600/Reel f or a WG Package
750/Reel for a PJ Package
M904
DS20005629A-page 14
Examples:
a) HV5812P-G:
b) HV5812PJ-G:
c) HV5812PJ-G-M904:
d) HV5812WG-G:
20-Channel Serial-Input Vacuum
Fluorescent Display Driver for
Anode or Grid, 28-lead PDIP,
13/Tube
20-Channel Serial-Input Vacuum
Fluorescent Display Driver for
Anode or Grid, 28-lead PLCC,
38/Tube
20-Channel Serial-Input Vacuum
Fluorescent Display Driver for
Anode or Grid, 28-lead PLCC,
750/Reel
20-Channel Serial-Input Vacuum
Fluorescent Display Driver for
Anode or Grid, 28-lead SOW,
1600/Reel
2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2016 Microchip Technology Inc.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
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Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
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SQTP is a service mark of Microchip Technology Incorporated
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Silicon Storage Technology is a registered trademark of
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GestIC is a registered trademarks of Microchip Technology
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All other trademarks mentioned herein are property of their
respective companies.
© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0999-1
DS20005629A-page 15
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India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany - Dusseldorf
Tel: 49-2129-3766400
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
China - Dongguan
Tel: 86-769-8702-9880
China - Guangzhou
Tel: 86-20-8755-8029
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7828
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
06/23/16
DS20005629A-page 16
2016 Microchip Technology Inc.