Datasheet MAX 104 segments (SEG26×COM4) Multifunction LCD Segment Driver BU97941FV-LB This is the product guarantees long time support in Industrial market. Key Specifications ■ ■ ■ ■ ■ ■ ■ Features Long Time Support Product for Industrial Applications. Integrated RAM for Display Data (DDRAM): 26 x 4 bit (Max 104 Segments) LCD Drive Output: 4 Common Output, 26 Segment Output Integrated 4ch LED Driver Circuit Support Standby Mode Integrated Power-On-Reset Circuit (POR) Integrated Oscillator Circuit No External Component Low Power Consumption Design Independent Power Supply for LCD Driving Supply Voltage Range: +1.8V to +3.6V LCD Drive Power Supply Range: +2.7V to +5.5V Operating Temperature Range: -40°C to +85°C Max Segments: 104 Segments Display Duty: Static, 1/3, 1/4 Selectable Bias: Static, 1/3 Interface: 3wire Serial Interface Package W (Typ.) x D (Typ.) x H (Max.) Applications Etc. Industrial Equipment Telephone FAX Portable Equipment (POS, ECR, PDA etc.) DSC DVC Car Audio Home Electrical Appliance Meter Equipment SSOP-B40 13.60mm x 7.80mm x 2.00mm Typical Application Circuit VLED=5.0 About resistor value: Determine the optimal value based on the applied current With 25mA as max per 1 port VLCD LED1 LED2 LED3 LED4 VDD LCD BU97941FV-LB 5.0V 3.3V SEG0 to SEG25 VSS CSB SD SCL COM0 to COM3 Signal input from controller Figure 1. ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 Typical application circuit ○This product has no designed protection against radioactive rays. 1/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) Block Diagram / Pin Configuration / Pin Description 40 1 COM0……COM3 SEG0……SEG25 LED4...LED1 VLCD common driver LCD voltage Generator Segment driver LED Driver LCD BIAS SELECTOR common counter DDRAM SEG6 SEG5 SEG7 SEG4 SEG8 SEG3 SEG9 SEG2 SEG10 SEG1 SEG11 SEG0 SEG12 COM3 SEG13 COM2 SEG14 COM1 SEG15 COM0 SEG16 VLCD SEG17 VDD VSS Command register Data Decoder OSCILLATOR VDD Power On Reset serial inter face SEG18 SD SEG19 SCL SEG20 CSB External clock line IF FILTER VSS SD CSB SCL/CLKIN SEG21 VSS SEG22 LED4 SEG23 LED3 SEG24 LED2 SEG25 LED1 Block Diagram Table 1. Figure 3. 21 20 Figure 2. Pin Configuration (TOP VIEW) Pin Description Pin Name Pin No. I/O Setting when not in use CSB 26 I VDD Chip select: "L" active SCL 27 I VSS Serial data transfer clock SD 28 I VSS Input serial data VDD 29 - - Power supply for LOGIC VSS 25 - - External clock input terminal (for display/PWM using selectable) Support Hi-Z input mode at internal clock mode VLCD 30 - - GND COM0 to 3 31 to 34 O OPEN Power supply for LCD SEG0 to 25 1 to 20 35 to 40 O OPEN COMMON output for LCD LED1 to 4 21 to 24 O OPEN LED driver output www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Function 2/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) Absolute Maximum Ratings (VSS=0V) Item Symbol Ratings Unit Power Supply Voltage1 VDD -0.3 to +4.5 V Power supply Power Supply Voltage2 VLCD -0.5 to +7.0 V Voltage for Liquid crystal display Power Supply Voltage2 VLED -0.5 to +7.0 V Voltage for LED driving port terminal Power Dissipation Pd Input Voltage Range Operating Temperature Range Storage Temperature Range VIN -0.5 to VDD+0.5 V Topr -40 to +85 °C Tstg -55 to +125 °C Iout1 5 mA Output Current 0.8 (Note1) Remarks W SEG output Iout2 5 mA COM output Iout3 50 mA LED output (per 1 port) (Note1) Decreases 8mW per 1°C when using at 1 Ta=25°C or higher. (During ROHM standard board mounting) (Board size：74.2mm×74.2mm×1.6mm Material：FR4 Glass-epoxy board Copper foil： Land pattern only) Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta=-40°C to +85°C, VSS=0V) Item Symbol Min Typ Max Unit Power Supply Voltage1 VDD 1.8 - 3.6 V Power supply Power Supply Voltage2 VLCD 2.7 - 5.5 V Voltage for Liquid crystal Display Iout1 - - 25 mA LED Output (per LED1 port) Iout2 - - 100 mA LED Output (LED port current total sum) Output Current Remarks Electrical Characteristics DC Characteristics (Ta=-40°C to +85°C, VDD=1.8V to 3.6V, VLCD=2.7V to 5.5V, VSS=0V) Limit Value Item Symbol Unit Condition Min Typ Max “H” level Input Voltage VIH 0.8VDD VDD V SD, SCL, CSB “L” level Input Voltage VIL VSS 0.2VDD V SD, SCL, CSB Hysteresis Width VH 0.2 V SCL, VDD=3.3V, Ta=25°C SD,SCL, CSB, “H” level Input Current IIH1 5 µA VI=3.6V LED Off Leak OFF LEAK 5 0 5 µA LED VI=5.5V VLCD Iload=-50µA, VLCD=5.0V VOH1 V -0.4 SEG0 to SEG25 “H” level Output Voltage (Note2) VLCD Iload=-50µA, VLCD=5.0V VOH2 V -0.4 COM0 to COM3 Iload= 50µA, VLCD=5.0V VOL1 0.4 V SEG0 to SEG25 “L” level Output Voltage Iload= 50µA, VLCD=5.0V VOL2 0.4 V (Note2) COM0 to COM3 Iload=20mA, VLCD=5.0V VOL4 0.11 0.5 V LED1 to 4 Iload=±50µA, VLCD=5.0V, SEG0 to 25, VOUT1 2.73 3.33 3.93 V COM0 to 3 Output Voltage(Note2) Iload=±50µA, VLCD=5.0V, SEG0 to 25, VOUT2 1.07 1.67 2.27 V COM0 to 3 Input pin ALL ’L’, IstVDD 3 10 µA Display off, Oscillation off Input pin ALL ’L’, IstVLCD 0.5 5 µA Display off, Oscillation off Supply Current (Note1) VDD=3.3V, Ta=25°C IVDD1 8 15 µA 1/3bias, fFR=64Hz, Output open VLCD=5.0V, Ta=25°C IVLCD1 10 15 µA 1/3bias, fFR=64Hz, Output open (Note1) During power save mode 1, frame inversion. (Note2) Iload：When setting the load of 1 pin only. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) Electrical Characteristics – continued Oscillation Frequency Characteristics (Ta=-40°C to +85°C, VDD=1.8V to 3.6V, VLCD=2.7V to 5.5V, VSS=0V) Limit Value Item Symbol Unit Condition Min Typ Max Frame Frequency 1 fFR1 76.5 85 93.5 Frame Frequency 2 Frame Frequency 3 Hz VDD=3.3V, Ta=25°C, fFR=85Hz setting fFR2 68 85 97.0 Hz VDD=2.5V to 3.6V, fFR=85Hz setting fFR3 59.7 - 68 Hz VDD=1.8V to 2.5V, fFR=85Hz setting MPU Interface Characteristics (Ta=-40°C to +85°C, VDD=1.8V to 3.6V, VLCD=2.7V to 5.5V, VSS=0V ) Limit Value Item Symbol Unit Condition Min Typ Max Input Rise Time ｔｒ 50 ns Input Fall Time ｔf 50 ns SCL Cycle tSCYC 250 ns “H” SCL pulse width tSHW 50 ns “L” SCL pulse width tSLW 50 ns SD Setup Time tSDS 50 ns SD Hold Time tSDH 50 ns CSB Setup Time tCSS 50 ns CSB Hold Time tCSH 50 ns “H” CSB pulse width tCHW 50 ns tCHW CSB tCSH tCSS tSCYC tf tr tSLW SCL tSHW tSDS tSDH SD Figure 4. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Serial Interface Timing 4/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) I/O Equivalence Circuit VLCD VDD VSS VSS VDD VLCD SEG0-25 COM0-3 CSB, SD, VSS SCL,CLKIN VSS LED1-4 VSS Figure 5. I/O equivalence circuit Example of Recommended Circuit VLED=5.0V About resistor value Determine the optimal value based on the applied current With 25mA as max per 1 port VLCD LED1 LED2 LED3 LED4 VDD LCD BU97941FV-LB 5.0V 3.3V SEG0 to SEG25 VSS CSB SD SCL COM0 to COM3 Signal input from controller Figure 6. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Recommended circuit example 5/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) Function Description Command /Data Transfer Method 3-SPI (3-wire Serial Interface） This device is controlled by a 3-wire signal: CSB, SCL, SD. First, Interface Counter is initialized with CSB=”H”. Setting CSB = “L” enables SD and SCL inputs. Each command starts with Command or data judgment bit (D/C) as MSB data, followed by D6 to D0 (this is while CSB=”L). Internal data is latched at the rising edge of SCL, and then the data is converted to an 8-bit parallel data at the falling edge of the 8th CLK. When CSB changes from “L” to “H” and the data being transferred is less than 8 bits, command and data being transferred will be cancelled. To start sending command again, please set CSB to “L”. Then, be sure to input a 1-byte command. Also, when DDRAM data becomes input state through RAMWR command, the device cannot accept command inputs. In order to input again, please start up CSB. If CSB is set to ”H”, the data input state is cancelled and if ”CSB” is set to ”L” again, command will be received. 1st byte Command 2nd byte Command 3rd byte Command CSB SCL D/C SD D6 D5 D4 D3 D2 D1 D0 D/C D6 D5 D4 D3 D2 D1 D0 D/C D6 D5 D4 D3 D2 D1 D0 D/C Figure 7. D6 3-SPI Data Transfer Format Write and Transfer Method of Display Data This device has display data ram of 26×4=104bit. The handling of display data with write and the handling of DDRAM data and Address and display are as follows: 1st Byte 2nd Byte Command Command Command 10000011 00000000 10100000 a b c RAM Write Address set d e f onwards g h i j k l m n o p … Display da ta Binary 8-bit data is written to DDRAM. The starting address is set with the Address set command, and is automatically incremented per 4bit data received. Next, by transferring data, data can be written continuously to DDRAM. (When continuously writing data to DDRAM, after writing to the final address 19h(SEG25), address will return to 00h (SEG0) through auto increment.) DDRAM address 04 05 06 07 ・・・ 00 01 02 03 17h 18h 19h 0 a e i m COM0 1 b f j n COM1 2 c g k o COM2 BIT 3 d h l p SEG 0 SEG 1 SEG 2 SEG 3 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 COM3 SEG 4 SEG 5 6/23 SEG 6 SEG 7 SEG 23 SEG 24 SEG 25 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) Writing to RAM is done per 4bit. When CSB is set to ‘H’ and the data is less than 4 bits, the writing of RAM will be cancelled. (Transfer of command is done per 8bit.) 1st byte Command / 2nd byte Command Command Display data CSB SCL SD Address Set Command RAM WRITE Command D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 Internal Signal RAM write Address 00h Address 01h Address 02h RAM write per 4bit 1st byte Command / 2nd byte Command When CSB='H' is set and less than 4bit, writing is cancelled. Display data Command CSB SCL SD Address Set Command RAM WRITE Command D7 D6 D5 D4 D3 D2 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 Internal Signal RAM write Address 00h Address 30h Address 31h Address 00h Returns to 0 through auto increment Figure 8. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Display Data Transfer Method 7/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) LCD Driver Bias / Duty Circuit Voltage is generated for LCD driver. Buffer amplifier is integrated with low power consumption possible. (Noet1) Line and frame inversion can be set by MODESET command. (Note2) 1/4duty, 1/3duty, and static duty can be set by DISCTL command. For each liquid crystal display waveform, refer to ”Liquid crystal Display Waveform”. Reset Initial State The default condition after executing Software Reset is as follows: Display is turned OFF Each command register enters Reset state DDRAM address is initialized (Note) DDRAM data is not initialized. Therefore, it is recommended to write initial values to all DDRAM before Display on. Command / Function Table Function Description Table NO Command Function 1 Mode Set (MODESET) Liquid crystal Display setting 2 Display control (DISCTL) LCD setting1 3 Address set (ADSET) LCD setting2 4 LED control (LEDCTL) LED board ON/OFF setting 5 RAM WRITE (RAMWR) RAM Write Start setting 6 All Pixel ON (APON) All display ON 7 All Pixel OFF (APOFF) All display OFF 8 All Pixel On/Off mode off (NORON) Normal display APON/APOFF setting release 9 Software Reset (SWRST) Software reset www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) Command Description D/C (MSB) is a bit for command or data judgment. For details, see 3-wire Serial Interface Command, Data Transfer Method. 1. Mode Set Command (MODESET) MSB LSB D/C D6 D5 D4 D3 D2 D1 D0 Hex Reset 1st byte Command 1 0 0 0 0 0 0 1 81h - 2nd byte Command 0 0 0 0 P3 P2 P1 P0 - 00h Display setting Setting P3 Reset state Display OFF 0 ○ Display ON 1 Display OFF ： Display ON ： Oscillation circuit operation OFF, Liquid crystal power supply circuit operation OFF with frame cycle. Display OFF state (Output：VSS level) Oscillation circuit operation ON, Liquid crystal power supply circuit ON. Read operation from DDRAM starts. Display ON state with frame cycle. (Note) LED port is not affected by the ON/OFF state of Display. The output state of LED port is determined by the setting of the LEDCTL command. Liquid crystal Drive Waveform Setting Setting P2 Reset state Frame inversion 0 Line inversion 1 ○ Power save mode (Low current consumption mode) setting Setting P1 P0 Reset state Power save mode1 0 0 Power save mode2 0 1 Normal mode 1 0 High power mode 1 1 ○ (Note) Use high power mode at VLCD＞3V or higher. (Reference Current Consumption Data) Current Setting Consumption Power save mode 1 ×1.0 Power save mode 2 ×1.7 Normal mode ×2.7 High power mode ×5.0 (Note) The current consumption data above is reference data and changes according to panel load. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB 2. Datasheet MAX 104 segments (SEG26×COM4) (2)Display control command (DISCTL) MSB LSB D/C D6 D5 D4 D3 D2 D1 D0 Hex Reset 1st byte Command 1 0 0 0 0 0 1 0 82h - 2nd byte Command 0 0 0 0 P3 P2 P1 P0 - 02h Duty setting Setting P3 P2 Reset state 0 0 ○ 1/3duty (1/3bias) 0 1 Static (1/1bias) 1 * 1/4duty (1/3bias) (*: Don’t care) At 1/3duty setting, the display / blink data for COM3 are invalid. (COM3: same waveform with COM1) At 1/1duty (Static) setting, the display / blink data for COM1 to 3 are invalid. (Note) COM1 to 3: same waveform with COM0 Be careful in sending display data. For sample output waveform of SEG/COM with duty setting, see "Liquid crystal Display Waveform". Frame Frequency Setting Setting (When 1/4,1/3,1/1duty) (128Hz, 130Hz, 128Hz) P1 P0 0 0 (85Hz, 86hz, 64Hz) 0 1 (64Hz, 65Hz, 48Hz) 1 0 (51Hz, 52Hz, 32Hz) 1 1 Reset state ○ The relationship with frame frequency (FR), internal osc frequency and dividing number is below: Divide FR [Hz] DISCTL (P1,P0) 1/4duty 1/3duty 1/1duty 1/4duty 1/3duty 1/1duty (0,0) 160 156 160 128 131.3 128 (0,1) 240 237 320 85.3 86.4 64 (1,0) 320 315 428 64 65 47.9 (1,1) 400 393 640 51.2 52.1 32 When calculating the OSC frequency from the measurement value of frame frequency, use the following equation: “ OSC frequency = Frame Frequency (Measurement value) × Dividing number” Dividing number: Using the values of Frame Frequency setting (P1, P0) and duty setting (P3, P2), determine the values from the table above. Ex) (P1,P0)= (0,1), (P3,P2)= (0,1) Æ Dividing number= 237 (Note) The value of FR in the table above is the Frame Frequency calcuated as OSC Frequency = 20.48KHz (typ). www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB 3. Datasheet MAX 104 segments (SEG26×COM4) Address set command (ADSET) MSB MSB LSB D/C D6 D5 D4 D3 D2 D1 D0 Hex Reset 1st byte Command 1 0 0 0 0 0 1 1 83h - 2nd byte Command 0 0 0 P4 P3 P2 P1 P0 - 00h Sets the starting RAM address for normal display. Address can be set from 00h to 1Bh. Setting is prohibited for addresses not written above. Address during Reset is 00h. When writing to RAM, a separate RAM WRITE setting is needed. 4. LED control command (LEDCTL) MSB MSB LSB D/C D6 D5 D4 D3 D2 D1 D0 Hex Reset 1st byte Command 1 0 0 0 0 1 0 1 85h - 2nd byte Command 0 0 0 0 P3 P2 P1 P0 - 00h Sets the driver of the LED port. Setting during Reset is 00h. The relationship between each parameter and the Drive board is as follows: LED1 P0 LED2 P1 LED3 P2 LED4 P3 LED ON 1 1 1 1 LED OFF 0 0 0 0 (Note) Please input CSB="H" after LEDCTL command is issued. To avoid noise and reset interface. 5. RAM WRITE command (RAMWR) MSB 1st byte Command LSB D/C D6 D5 1 0 1 2nd byte Command D4 D3 D2 D1 D0 Hex 0 0 0 0 0 A0h Display data Reset Random ・・・・ th n byte Command Display data Random The input data after command setting is the data input for display. Be sure to send this command after setting the ADSET command. The display data is transferred per 4bit. (For details, see “Write and Transfer Method of Display Data.”) 6. All Pixel ON command (APON) MSB 1st byte Command LSB D/C D6 D5 D4 D3 D2 D1 D0 Hex Reset 1 0 0 1 0 0 0 1 91h - Regardless of the contents of DDRAM, the SEG output will enter all light up mode. (Pin that selects SEG output) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB 7. Datasheet MAX 104 segments (SEG26×COM4) All Pixel OFF command (APOFF) MSB 1st byte Command LSB D/C D6 D5 D4 D3 D2 D1 D0 Hex Reset 1 0 0 1 0 0 0 0 90h - Regardless of the contents of DDRAM, the SEG output will enter all light up mode. (Pin that selects SEG output) 8. All Pixel ON/OFF mode off (NORON) MSB 1st byte Command LSB D/C D6 D5 D4 D3 D2 D1 D0 Hex Reset 1 0 0 1 0 0 1 1 93h - APON / OFF mode is cancelled and switches to normal display mode. (Pin that selects SEG output) After reset, NORON is set and becomes normal display state. 9. Software Reset command (SWRST) MSB 1st byte Command LSB D/C D6 D5 D4 D3 D2 D1 D0 Hex Reset 1 0 0 1 0 0 1 0 92h - This IC will be reset by this command. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) Liquid crystal Drive Waveform 1/4Duty Line inversion Frame inversion SEGn SEGn+1SEGn+2SEGn+3 SEGn SEGn+1SEGn+2SEGn+3 COM0 stateA COM0 stateA COM1 stateB COM1 stateB COM2 COM2 COM3 COM3 1frame 1frame Vreg Vreg COM0 COM0 VSS VSS Vreg Vreg COM1 COM1 VSS VSS Vreg Vreg COM2 COM2 VSS VSS Vreg Vreg COM3 COM3 VSS VSS Vreg Vreg SEGn SEGn VSS VSS Vreg Vreg SEGn+1 SEGn+1 VSS VSS Vreg Vreg SEGn+2 SEGn+2 VSS VSS Vreg Vreg SEGn+3 SEGn+3 VSS VSS Vreg Vreg stateA stateA (COM0-SEGn) (COM0-SEGn) -Vreg -Vreg Vreg Vreg stateB stateB (COM1-SEGn) (COM1-SEGn) -Vreg Figure 9. -Vreg LCD Drive Waveform during Line inversion www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Figure 10. 13/23 LCD Drive Waveform during Frame inversion TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) 1/3Duty Frame inversion Line inversion SEGn SEGn+1 SEGn+2 SEGn+3 SEGn SEGn+1 SEGn+2 SEGn+3 COM0 stateA COM0 stateA COM1 stateB COM1 stateB COM2 COM2 COM3 COM3 When 1/3duty 1frame 1frame Vreg Vreg COM0 COM0 VSS VSS Vreg Vreg COM1 COM1 VSS VSS Vreg Vreg COM2 COM2 VSS VSS Vreg COM3 Vreg COM3 When 1/3duty COM3 waveform output is same as COM1 VSS VSS Vreg Vreg SEGn SEGn VSS VSS Vreg Vreg SEGn+1 SEGn+1 VSS VSS Vreg Vreg SEGn+2 SEGn+2 VSS VSS Vreg Vreg SEGn+3 SEGn+3 VSS VSS Vreg Vreg stateA stateA (COM0-SEGn) (COM0-SEGn) -Vreg -Vreg Vreg Vreg stateB stateB (COM1-SEGn) (COM1-SEGn) -Vreg Figure 11. When 1/3duty COM3 waveform output is same as COM1 COM3 waveform output is same as COM1 -Vreg LCD Drive Waveform during Line inversion www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Figure 12. 14/23 LCD Drive Waveform during Frame inversion TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) 1/1Duty (Static) Frame inversion Line inversion SEGn SEGn+1 SEGn+2 SEGn+3 COM0 COM1 SEGn SEGn+1 SEGn+2 SEGn+3 stateA stateB COM0 COM1 When 1/1duty (Static) When 1/1duty (Static) COM1 ：same waveform as COM0 COM1 ： same waveform as COM0 COM2 COM2 COM2 ：same waveform as COM0 COM2 ：same waveform as COM0 COM3 stateA stateB COM3 COM3 ：same waveform as COM0 1frame COM3 ：same waveform as COM0 1frame Vreg Vreg COM0 COM0 VSS VSS When 1/1duty (Static) Vreg COM1 COM1 / COM0 is same waveform Vreg COM1 VSS VSS Vreg Vreg COM2 / COM0 is same waveform COM2 COM2 VSS VSS Vreg Vreg COM3 / COM0 is same waveform COM3 COM3 VSS VSS Vreg Vreg SEGn SEGn VSS VSS Vreg Vreg SEGn+1 SEGn+1 VSS VSS Vreg Vreg SEGn+2 SEGn+2 VSS VSS Vreg Vreg SEGn+3 SEGn+3 VSS VSS Vreg Vreg stateA stateA -Vreg -Vreg Vreg Vreg stateB stateB -Vreg Figure 13.LCD Drive Waveform during Line inversion www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 -Vreg Figure 14. 15/23 LCD Drive Waveform during Frame inversion TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) Initialization Sequence Execute the following sequence after power supply and start display after the IC has initialized. Power supply ↓ CSB ‘H’ …Initialize I/F ↓ CSB ‘L’ …Start I/F Data Transfer ↓ Execute Software Reset from SWRST command ↓ MODESET (Display off) ↓ Various command setting ↓ RAM WRITE ↓ MODESET (Display on) ↓ Start display After inserting power supply, each register value, DDRAM address and DDRAM data are random prior to initialization. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) Caution during Power supply ON/OFF POR circuit During power supply rise, because the IC internal circuit and reset pass through an area of unstable low voltage and VDD starts up, there is a risk that the inside of the IC is not completely reset and wrong operation might occur. In order to prevent this, P.O.R circuit and Software Reset functions are incorporated. In order to ensure that operation, do as follows during power supply rise: 1. Set power up conditions to meet the recommended tR, tOFF and Vbot specs below in order to ensure POR operation. (POR circuit uses VDET type) (Note) The voltage detection of POR differs depending on the used environment etc. In order to assure the operation of POR, it is recommended to make Vbot = 0.5V or lower. VDD Recommended conditions of tR, tOFF, Vbot tR VDET tOFF tR tOFF Vbot VDET 10ms or lower 1ms or higher 0.5V or lower TYP 1.2 V Vbot (Note) VDET is integrated POR detection level Figure 15. Rise Waveform 2. When the conditions are not met, do the following countermeasures after power supply ON: 1. Set CSB to ’H’. 2. Turn ON the CSB and execute SWRST command. In order for the SWRST command to take effect for sure, it is recommended to start up CSB after 1ms after the VDD level has reached 90%. ※Since the state is irregular until SWRST command input after power supply ON, countermeasure through Software Reset is not the perfect substitute for P.O.R function so it is important to be careful. VDD CSB M in 1ms M in 50ns SW RST com m and Figure 16. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SWRST command sequence 17/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) Attention about using LEDCTL (85h) command Please input CSB="H" after LEDCTL command is issued. To avoid noise and reset interface. Parameter LEDCTL (85h) 2nd Command CSB SCL 1 SD 0 0 0 0 1 Figure 17. 0 1 0 0 0 0 P3 P2 P1 P0 D/C D6 D5 D4 D3 D2 D1 D0 D/C D6 Recommended sequence when using LEDCTL (85h) command Attention about input port pull down Satisfy the following sequence if input terminals are pulled down by external resistors (In case MPU output Hi-Z). Date transaction period with MPU Input "L" period Input"Hi-Z" period CSB SD SCL Figure 18. Recommended sequence when input ports are pulled down BU97941FV-LB adopts a 5V tolerant I/O for the digital input. This circuit includes a bus-hold function to keep the level of HIGH. A pull down resistor of below 10KΩshall be connected to the input terminals to transit from HIGH to LOW because the bus-hold transistor turns on during the input’s HIGH level. (Refer to the Figure 5. I/O Equivalent Circuit) A higher resistor than 10KΩ (approximate) causes input terminals being steady by intermediate potential between HIGH and LOW level so unexpected current is consumed by the system. The potential depends on the pull down resistance and bus-hold transistor’s resistance. As the bus-hold transistor turns off upon the input level cleared to LOW a higher resistor can be used as a pull down resistor if an MPU sets SD and SCL lines to LOW before it releases the lines. The LOW period preceding the MPU’s bus release shall be at least 50ns as same as a minimum CLK width (tSLW). www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB MAX 104 segments (SEG26×COM4) Datasheet Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) Ordering Information B U 9 7 9 Part Number 4 1 F V Package FV : - LBE2 Product class SSOP-B40 LB for Industrial applications Packaging and forming specification E2: Embossed tape and reel (SSOP-B40) Marking Diagram SSOP-B40 (TOP VIEW) Part Number Marking BU97941 LOT Number 1PIN MARK www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) Physical Dimension, Tape and Reel Information Package Name SSOP-B40 (Max 13.95 (include. BURR) <Tape and Reel information> Tape Embossed carrier tape Quantity 2000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 22/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 BU97941FV-LB Datasheet MAX 104 segments (SEG26×COM4) Revision History Date Revision 23.Aug.2013 001 26.Feb.2014 002 Changes New Release Delete sentence “and log life cycle” in General Description and Futures. Applied new style (change of the size of the title). www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 23/23 TSZ02201-0P4P0D300500-1-2 26.Feb.2014 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - SS © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - SS © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001