Material Content Data Sheet Sales Product Name BSC018NE2LS MA# MA001011614 Package PG-TDSON-8-6 Issued 29. June 2015 Weight* 118.48 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper gold carbon black epoxy resin silicondioxide tin silver silver tin lead iron phosphorus copper iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7439-89-6 7723-14-0 7440-50-8 7439-89-6 7723-14-0 7440-50-8 0.629 0.53 0.038 0.03 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.53 5310 5310 319 0.011 0.01 37.762 31.87 31.91 318720 96 319135 0.045 0.04 0.04 380 380 0.088 0.07 739 6.215 5.25 37.464 31.62 36.94 316209 369403 1.470 1.24 1.24 12406 12406 0.166 0.14 0.14 1397 1397 0.023 0.02 0.019 0.02 0.895 0.76 0.011 0.01 0.003 0.00 11.320 9.55 0.022 0.02 0.007 0.01 22.292 18.81 52455 198 158 0.80 7550 29 9.56 95545 2. 3. 57 18.84 188148 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 95670 188 Important Remarks: 1. 7906 96 188393 1000000