INTEGRATED CIRCUITS MB2241 16-bit buffer/line driver (3-State) Product specification Supersedes data of 1993 Aug 18 IC23 Data Handbook 1998 Jan 16 Philips Semiconductors Product specification 16-bit buffer/line driver (3-State) MB2241 FEATURES DESCRIPTION • 16–bit bus interface • Power 3-State • Multiple VCC and GND pins minimize switching noise • 3-State buffers • Output capability: +64mA/–32mA • Latch-up protection exceeds 500mA per Jedec Std 17 • ESD protection exceeds 2000 V per MIL STD 883 Method 3015 The MB2241 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. The MB2241 device is a 16-bit buffer that is ideal for driving bus lines. The device features four Output Enables (1OE, 2OE, 3OE, 4OE), each controlling four of the 3-State outputs. and 200 V per Machine Model • Inputs are disabled during 3-State mode QUICK REFERENCE DATA SYMBOL CONDITIONS Tamb = 25°C; GND = 0V PARAMETER TYPICAL UNIT 3.0 3.1 ns tPLH tPHL Propagation delay nAx to nYx CL = 50pF; VCC = 5V CIN Input capacitance VI = 0V or VCC 4 pF COUT Output capacitance VO = 0V or VCC; 3-State 7 pF ICCZ Total supply current Outputs disabled; VCC = 5.5V 65 µA ORDERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER –40°C to +85°C MB2241 BB MB2241 BB SOT379-1 52–pin plastic Quad Flat Pack 50 49 48 47 46 45 44 43 42 PIN NUMBER SYMBOL 41 40 44, 43, 41, 40, 38, 37, 35, 34, 32, 31, 29, 28, 26, 25, 23, 22 1A0 – 1A3, 2A0 – 2A3, 3A0 – 3A3, 4A0 – 4A3 Data inputs 14, 15, 17, 18, 8, 9, 11, 12, 2, 3, 5, 6, 48, 49, 51, 52 4Y0 – 4Y3, 3Y0 – 3Y3, 2Y0 – 2Y3, 1Y0 – 1Y3 Data outputs 47, 45, 21, 19 1OE, 2OE, 3OE, 4OE Output enables 4, 7, 10, 16, 20, 24, 30, 33, 36, 42, 46, 50 GND Ground (0V) 1, 13, 27, 39 VCC Positive supply voltage 1A2 GND 1A1 1A0 20E GND 1OE 1Y0 1Y1 PIN DESCRIPTION 1A3 52 51 GND 1Y2 1Y3 PIN CONFIGURATION VCC 1 2Y0 2 39 V CC 38 2A0 2Y1 3 37 2A1 GND 4 36 GND 2Y2 5 35 2A2 2Y3 6 GND 7 33 GND 3Y0 8 32 3A0 3Y1 9 31 3A1 È 52-pin PQFP 34 2A3 29 3A2 3Y3 12 28 3A3 VCC 13 27 VCC 1998 Jan 16 26 4A0 4A1 GND 4A2 4A3 GND 3OE 4Y3 21 22 23 24 25 GND 17 18 19 20 4Y1 14 15 16 4OE 3Y2 11 4Y2 30 GND 4Y0 GND 10 NAME AND FUNCTION SB00024 2 853–1571 18869 Philips Semiconductors Product specification 16-bit buffer/line driver (3-State) MB2241 LOGIC SYMBOL 44 43 41 40 47 38 37 35 34 45 1A0 1Y0 1A1 1Y1 1A2 1Y2 1A3 1Y3 48 32 3A0 3Y0 49 31 3A1 3Y1 3A2 3Y2 3A3 3Y3 51 29 52 28 1OE 2Y0 2A1 2Y1 2A2 2Y2 2A3 2Y3 2 3 26 25 5 23 6 22 2OE 9 11 12 3OE 19 2A0 8 4A0 4Y0 4A1 4Y1 4A2 4Y2 4A3 4Y3 14 15 17 18 4OE 21 SB00025 LOGIC SYMBOL (IEEE/IEC) 47 19 EN1 44 EN3 48 32 43 49 31 9 41 51 29 11 40 52 28 12 45 1 21 EN2 38 3 8 EN4 2 26 37 3 25 35 5 23 17 34 6 22 18 2 4 14 15 SB00026 SB00027 FUNCTION TABLE INPUTS OUTPUTS 1OE or 3OE 1An or 3An 2OE or 4OE 2An or 4An 1Yn or 3Yn 2Yn or 4Yn L L H L H X H H L L H X L H Z L H Z H = High voltage level L = Low voltage level Z = High voltage level-impedance ”OFF” state 1998 Jan 16 3 Philips Semiconductors Product specification 16-bit buffer/line driver (3-State) MB2241 ABSOLUTE MAXIMUM RATINGS1, 2 PARAMETER SYMBOL VCC IIK CONDITIONS RATING UNIT –0.5 to +7.0 V –18 mA –1.2 to +7.0 V VO < 0 –50 mA output in Off or High state –0.5 to +5.5 V output in Low state 128 mA –65 to 150 °C DC supply voltage DC input diode current VI < 0 voltage3 VI DC input IOK DC output diode current voltage3 VOUT DC output IOUT DC output current Tstg Storage temperature range NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER LIMITS DC supply voltage UNIT Min Max 4.5 5.5 V 0 VCC V VI Input voltage VIH High-level input voltage VIL Low-level Input voltage 0.8 V IOH High-level output current –32 mA IOL Low-level output current 64 mA 0 10 ns/V –40 +85 °C ∆t/∆v Input transition rise or fall rate Tamb Operating free-air temperature range 1998 Jan 16 2.0 4 V Philips Semiconductors Product specification 16-bit buffer/line driver (3-State) MB2241 DC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER TEST CONDITIONS Min VIK VOH VOL Input clamp voltage High-level output voltage Tamb = –40°C to +85°C Tamb = +25°C VCC = 4.5V; IIK = –18mA Typ Max –0.9 –1.2 Min UNIT Max –1.2 V VCC = 4.5V; IOH = –3mA; VI = VIL or VIH 2.5 2.9 2.5 V VCC = 5.0V; IOH = –3mA; VI = VIL or VIH 3.0 3.4 3.0 V VCC = 4.5V; IOH = –32mA; VI = VIL or VIH 2.0 2.4 2.0 V Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or VIH 0.42 0.55 0.55 V Input leakage current VCC = 5.5V; VI = GND or 5.5V ±0.01 ±1.0 ±1.0 µA Power-off leakage current VCC = 0.0V; VO or VI ≤ 4.5V ±5.0 ±100 ±100 µA Power-up/down 3-State output current VCC = 2.0V; VO = 0.5V; VI = GND or VCC; V OE = VCC; VOE = GND ±5.0 ±50 ±50 µA IOZH 3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or VIH 5.0 50 50 µA IOZL 3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or VIH –5.0 –50 –50 µA ICEX Output high leakage current VCC = 5.5V; VO = 5.5V; VI = GND or VCC 5.0 50 50 µA –70 –180 –180 mA VCC = 5.5V; Outputs High, VI = GND or VCC 65 250 250 µA VCC = 5.5V; Outputs Low, VI = GND or VCC 48 60 60 mA VCC = 5.5V; Outputs 3-State; VI = GND or VCC 65 250 250 µA Outputs enabled, one input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 0.5 1.5 1.5 mA II IOFF IPU/IPU IO Output current1 ICCH ICCL Quiescent supply current ICCZ ∆ICC Additional supply current per input pin2 VCC = 5.5V; VO = 2.5V –50 –50 NOTES: 1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. 2. This is the increase in supply current for each input at 3.4V. AC CHARACTERISTICS GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω LIMITS SYMBOL PARAMETER Tamb = +25°C VCC = +5.0V WAVEFORM Tamb = –40°C to +85°C VCC = +5.0V ±0.5V Min Typ Max Min Max UNIT tPLH tPHL Propagation delay nAx to nYx 1 1.2 1.2 3.0 3.1 4.5 4.5 1.2 1.2 5.1 5.1 ns tPZH tPZL Output enable time to High and Low level 2 1.3 1.8 3.7 4.8 6.3 6.8 1.3 1.8 6.9 7.4 ns tPHZ tPLZ Output disable time from High and Low level 2 1.3 1.2 3.9 3.4 5.9 5.2 1.3 1.2 6.7 5.8 ns 1998 Jan 16 5 Philips Semiconductors Product specification 16-bit buffer/line driver (3-State) MB2241 AC WAVEFORMS VM = 1.5V, VIN = GND to 3.0V nOE INPUT nOE INPUT nAx INPUT VM VM VM VM tPLZ tPZL tPLH nYx OUTPUT VM VM VM nYx OUTPUT 3.5V tPHL VOL + 0.3V VOL tPHZ tPZH VOH VOH – 0.3V SB00028 nYx OUTPUT VM Waveform 1. Waveforms Showing the Input (nAx) to Output (nYx) Propagation Delays 0V SB00029 Waveform 2. Waveforms Showing the 3-State Output Enable and Disable Times TEST CIRCUIT AND WAVEFORMS VCC 7.0V RL VOUT VIN PULSE GENERATOR tW 90% NEGATIVE PULSE 90% CL VM VM 10% 10% 0V D.U.T. RT RL tTHL (tF) tTLH (tR) tTLH (tR) tTHL (tF) 90% POSITIVE PULSE Test Circuit for 3-State Outputs AMP (V) 90% VM VM 10% 10% tW SWITCH POSITION TEST SWITCH tPLZ closed tPZL closed All other open Load resistor; see AC CHARACTERISTICS for value. CL = Load capacitance includes jig and probe capacitance; see AC CHARACTERISTICS for value. RT = Termination resistance should be equal to ZOUT of pulse generators. 0V VM = 1.5V Input Pulse Definition INPUT PULSE REQUIREMENTS DEFINITIONS RL = AMP (V) FAMILY MB Amplitude Rep. Rate tW tR tF 3.0V 1MHz 500ns 2.5ns 2.5ns SB00010 1998 Jan 16 6 Philips Semiconductors Product specification 16-bit buffer/line driver (3-State) MB2241 tPLH vs Temperature (Tamb) CL = 50pF, 1 Output Switching nAx to nYx Adjustment of tPLH for Load Capacitance and # of Outputs Switching nAx to nYx 5 6 4 MAX 5 16 switching 8 switching 1 switching 3 Offset in ns ns 4 4.5VCC 5.5VCC 3 2 1 2 0 MIN 1 –1 0 –2 –55 –35 –15 5 25 45 65 85 105 0 125 50 °C 100 150 200 pF tPHL vs Temperature (Tamb) CL = 50pF, 1 Output Switching nAx to nYx Adjustment of tPHL for Load Capacitance and # of Outputs Switching nAx to nYx 7 4 6 3 16 switching 8 switching 1 switching MAX 5 Offset in ns 2 ns 4 4.5VCC 3 5.5VCC 1 0 2 MIN –1 1 0 –2 –55 –35 –15 5 25 45 65 85 105 125 0 50 °C 200 Adjustment of tPZH for Load Capacitance and # of Outputs Switching nOE to nYx 8 5 7 MAX 4 16 switching 6 8 switching 3 Offset in ns 5 ns 150 pF tPZH vs Temperature (Tamb) CL = 50pF, 1 Output Switching nOE to nYx 4 4.5VCC 3 5.5VCC 1 switching 2 1 0 2 –1 MIN 1 0 –55 100 –2 –35 –15 5 25 45 65 85 105 125 0 °C 50 100 150 200 pF SB00030 1998 Jan 16 7 Philips Semiconductors Product specification 16-bit buffer/line driver (3-State) MB2241 tPZL vs Temperature (Tamb) CL = 50pF, 1 Output Switching nOE to nYx Adjustment of tPZL for Load Capacitance and # of Outputs Switching nOE to nYx 9 4 8 3 MAX 16 switching 8 switching 1 switching 7 2 Offset in ns ns 6 4.5VCC 5 4 5.5VCC 1 0 3 –1 MIN 2 1 –2 –55 –35 –15 5 25 45 65 85 105 125 0 50 °C 150 200 pF Adjustment of tPHZ for Load Capacitance and # of Outputs Switching nOE to nYx tPHZ vs Temperature (Tamb) CL = 50pF, 1 Output Switching nOE to nYx 7 8 6 7 MAX 5 4.5VCC 4 5.5VCC Offset in ns 6 ns 100 3 5 16 switching 4 8 switching 1 switching 3 2 1 2 0 MIN 1 –1 0 –2 –55 –35 –15 5 25 45 65 85 105 0 125 50 °C 100 150 200 pF tPLZ vs Temperature (Tamb) CL = 50pF, 1 Output Switching nOE to nYx Adjustment of tPLZ for Load Capacitance and # of Outputs Switching nOE to nYx 7 6 6 5 16 switching 8 switching 1 switching MAX 4 5 ns Offset in ns 4.5VCC 5.5VCC 4 3 2 3 2 1 0 MIN 1 –1 0 –55 –2 –35 –15 5 25 45 65 85 105 125 0 °C 50 100 150 200 pF SB00031 1998 Jan 16 8 Philips Semiconductors Product specification 16-bit buffer/line driver (3-State) MB2241 tTLH vs Temperature (Tamb) CL = 50pF, 1 Output Switching Adjustment of tTLH for Load Capacitance and # of Outputs Switching 4 8 7 16 switching 8 switching 1 switching 6 5 Offset in ns 3 ns 4.5VCC 5.5VCC 2 4 3 2 1 0 –1 –2 1 –3 –55 –35 –15 5 25 45 65 85 105 125 0 50 °C 100 150 200 pF tTHL vs Temperature (Tamb) CL = 50pF, 1 Output Switching Adjustment of tTHL for Load Capacitance and # of Outputs Switching 3.0 4 3 16 switching 8 switching 1 switching 2.5 Offset in ns 2 4.5VCC ns 2.0 5.5VCC 1 0 1.5 –1 1 –2 –55 –35 –15 5 25 45 65 85 105 0 125 50 °C 100 150 VOHP and VOLV vs Load Capacitance VCC = 5V, VIN = 0 to 3V VOHV and VOLP vs Load Capacitance VCC = 5V, VIN = 0 to 3V 4.0 6 3.5 125°C 25°C –55°C 3.0 5 4 125°C 25°C –55°C 2.5 3 volts 2.0 volts 200 pF 1.5 1.0 2 1 0.5 125°C 25°C –55°C 0.0 125°C 25°C –55°C 0 –1 –0.5 –1 –2 0 50 100 150 200 0 pF 50 100 150 200 pF SB00032 1998 Jan 16 9 Philips Semiconductors Product specification 16-bit buffer/line driver (3-State) MB2241 QFP52: plastic quad flat package; 52 leads (lead length 1.6 mm); body 10 x 10 x 2.0 mm 1998 Jan 16 10 SOT379-1 Philips Semiconductors Product specification 16-bit buffer/line driver (3-State) MB2241 NOTES 1998 Jan 16 11 Philips Semiconductors Product specification 16-bit buffer/line driver (3-State) MB2241 Data sheet status Data sheet status Product status Definition [1] Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued datasheet before initiating or completing a design. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 print code Document order number: 1998 Jan 16 12 Date of release: 05-96 9397-750-03804