TI BQ25100 Bq2510x 250-ma single cell li-ion battery chargers, 1-ma termination, 75-na battery leakage Datasheet

Product
Folder
Sample &
Buy
Support &
Community
Tools &
Software
Technical
Documents
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
bq2510x 250-mA Single Cell Li-Ion Battery Chargers, 1-mA Termination, 75-nA Battery
Leakage
1 Features
3 Description
•
The bq2510x series of devices are highly integrated
Li-Ion and Li-Pol linear chargers targeted at spacelimited portable applications. The high input voltage
range with input overvoltage protection supports lowcost unregulated adapters.
1
•
•
Charging
– 1% Charge Voltage Accuracy
– 10% Charge Current Accuracy
– Supports Applications for Very Low Charge
Currents - 10 mA to 250 mA
– Supports minimum 1-mA Charge Termination
Current
– Ultra Low Battery Output Leakage Current Maximum 75 nA
– Adjustable Termination and Precharge
Threshold
– High voltage Chemistry Support: 4.35 V with
bq25100H/01H, 4.30 V with bq25100A
Protection
– 30-V Input Rating; with 6.5-V Input
Overvoltage Protection
– Input Voltage Dynamic Power Management
– 125°C Thermal Regulation; 150°C Thermal
Shutdown Protection
– OUT Short-Circuit Protection and ISET Short
Detection
– Operation over JEITA Range via Battery
NTC – 1/2 Fast-Charge-Current at Cold, 4.06
V (bq25100/01) or 4.2 V (bq25100H/01H) at
Hot
– Fixed 10 Hour Safety Timer
System
– Automatic Termination and Timer Disable
Mode (TTDM) for Absent Battery Pack
– Available in Small 1.60 mm × 0.90 mm
DSBGA Package
2 Applications
•
•
•
•
Fitness Accessories
Smart Watches
Bluetooth® Headsets
Low-Power Handheld Devices
The bq2510x has a single power output that charges
the battery. A system load can be placed in parallel
with the battery as long as the average system load
does not keep the battery from charging fully during
the 10 hour safety timer.
The battery is charged in three phases: conditioning,
constant current and constant voltage. In all charge
phases, an internal control loop monitors the IC
junction temperature and reduces the charge current
if an internal temperature threshold is exceeded.
The charger power stage and charge current sense
functions are fully integrated. The charger function
has high accuracy current and voltage regulation
loops and charge termination. The pre-charge current
and termination current threshold are programmed
via an external resistor on the bq2510x. The fast
charge current value is also programmable via an
external resistor.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
bq25100
DSBGA (6)
1.60 mm × 0.90 mm
bq25101
DSBGA (6)
1.60 mm × 0.90 mm
bq25100A
DSBGA (6)
1.60 mm × 0.90 mm
bq25100H
DSBGA (6)
1.60 mm × 0.90 mm
bq25101H
DSBGA (6)
1.60 mm × 0.90 mm
bq25100L(2)
DSBGA (6)
1.60 mm × 0.90 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
(2) Product preview. Contact the local TI representative for device
details.
SYSTEM
USB Port or
Adapter
VBUS
IN
D+
D-
OUT
1ÛF
1ÛF
VSS
GND
PACK+
TS
ISET
1.35kŸ
TEMP
HOST
PRETERM
PACK-
6kŸ
bq25100
CE
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1 Absolute Maximum Ratings ....................................
7.2 Handling Ratings.......................................................
7.3 Recommended Operating Conditions .....................
7.4 Thermal Information ..................................................
7.5 Electrical Characteristics..........................................
7.6 Typical Characteristics ..............................................
4
4
4
4
5
8
Detailed Description ............................................ 12
8.1
8.2
8.3
8.4
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
12
14
15
18
9
Application and Implementation ........................ 22
9.1 Application Information............................................ 22
9.2 Typical Application - Charger Application Design
Example ................................................................... 22
10 Power Supply Recommendations ..................... 24
10.1 Leakage Current Effects on Battery Capacity....... 24
11 Layout................................................................... 24
11.1 Layout Guidelines ................................................. 24
11.2 Layout Example .................................................... 25
11.3 Thermal Package .................................................. 25
12 Device and Documentation Support ................. 26
12.1
12.2
12.3
12.4
12.5
Device Support ....................................................
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
26
26
26
26
26
13 Mechanical, Packaging, and Orderable
Information ........................................................... 26
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (October 2014) to Revision C
Page
•
Changed data sheet title ........................................................................................................................................................ 1
•
Deleted product preview note from bq25101H in Device Information Table.......................................................................... 1
•
Deleted product preview note from bq25101H in Device Comparison Table ....................................................................... 3
Changes from Revision A (September 2014) to Revision B
Page
•
Deleted product preview note from bq25101 and bq25100H in Device Information Table.................................................... 1
•
Deleted product preview note from bq25101 and bq25100H in Device Comparison Table ................................................. 3
Changes from Original (August 2014) to Revision A
•
2
Page
Release to Production ............................................................................................................................................................ 1
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
5 Device Comparison Table
(1)
PART NUMBER
VO(REG)
VOVP
PreTerm /CHG
TS
bq25100
4.20 V
6.5 V
PreTerm
TS (JEITA)
bq25101
4.20 V
6.5 V
CHG
TS (JEITA)
bq25100A
4.30 V
6.5 V
PreTerm
TS
bq25100H
4.35 V
6.5 V
PreTerm
TS (JEITA)
bq25101H
4.35 V
6.5 V
CHG
TS (JEITA)
bq25100L (1)
4.06 V
6.5V
PreTerm
TS
Product preview. Contact the local TI representative for device details.
6 Pin Configuration and Functions
SPACING
6-Pin DSBGA
YFP Package
(Top View)
1
2
A
OUT
IN
B
TS
ISET
C
PRETERM
VSS
6-Pin DSBGA
YFP Package
(Top View)
1
2
A
OUT
IN
B
TS
ISET
C
CHG
VSS
bq25100/100A/100H/100L
bq25101/101H
Pin Functions
PIN
NAME
CHG
NUMBER
I/O
C1 (1)
DESCRIPTION
Low (FET on) indicates charging and open drain (FET off) indicates no charging or the first charge
cycle complete.
IN
A2
I
Input power, connected to external DC supply (AC adapter or USB port). Expected range of bypass
capacitors 1 μF to 10 μF, connect from IN to VSS.
ISET
B2
I
Programs the fast-charge current setting. External resistor from ISET to VSS defines fast charge
current value. Recommended range is 13.5 kΩ (10 mA) to 0.54 kΩ (250 mA).
OUT
A1
O
Battery Connection. System Load may be connected. Expected range of bypass capacitors 1 μF to
10 μF.
C1 (1)
I
Programs the current termination threshold ( 1% to 50% of Iout, 1mA minimum). The pre-charge
current is twice the termination current level.
PRE-TERM
Expected range of programming resistor is 600 Ω to 30 kΩ (6k: Ichg/10 for term; Ichg/5 for
precharge)
TS
B1
I
Temperature sense pin connected to 10k at 25°C NTC thermistor, in the battery pack. Floating TS
pin or pulling high puts part in TTDM “Charger” mode and disables TS monitoring, Timers and
Termination. Pulling pin low disables the IC. If NTC sensing is not needed, connect this pin to VSS
through an external 10-kΩ resistor. A 250-kΩ resistor from TS to ground will prevent IC entering
TTDM mode when battery with thermistor is removed.
VSS
C2
–
Ground pin
(1)
Spins have different pin definitions
Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
3
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
www.ti.com
7 Specifications
Absolute Maximum Ratings (1)
7.1
over operating free-air temperature range (unless otherwise noted)
Input voltage
TJ
(1)
MIN
MAX
UNIT
IN (with respect to VSS)
–0.3
30
V
OUT (with respect to VSS)
–0.3
7
V
PRE-TERM, ISET, TS, CHG
(with respect to VSS)
–0.3
7
V
Input current
IN
300
mA
Output current (continuous)
OUT
300
mA
Output sink current
CHG
15
mA
150
°C
Junction temperature
–40
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
7.2 Handling Ratings
MIN
ESD
Electrostatic discharge
(IEC61000-4-2) (1)
TSTG
Storage temperature
(1)
IN, OUT, TS
1 µF between IN and GND,
1 µF between TS and GND,
2 µF between OUT and GND,
x5R Ceramic or equivalent
MAX
UNIT
8
contact
15 Air
kV
150
°C
–65
The test was performed on IC pins that may potentially be exposed to the customer at the product level. The bq2510x IC requires a
minimum of the listed capacitance, external to the IC, to pass the ESD test.
7.3
Recommended Operating Conditions
(1)
MIN
IN voltage range
VIN
IN operating voltage range, Restricted by VDPM and VOVP
NOM
UNIT
3.5
28
4.45
6.45
V
V
IIN
Input current, IN pin
250
mA
IOUT
Current, OUT pin
250
mA
TJ
Junction temperature
RPRE-TERM
Programs precharge and termination current thresholds
RISET
RTS
(1)
0
125
°C
0.6
30
kΩ
Fast-charge current programming resistor
0.54
13.5
kΩ
10k NTC thermistor range without entering BAT_EN or TTDM
1.66
258
kΩ
Operation with VIN less than 4.5V or in drop-out may result in reduced performance.
7.4 Thermal Information
THERMAL METRIC (1)
bq25100
YFP (6 PINS)
RθJA
Junction-to-ambient thermal resistance
RθJCtop
Junction-to-case (top) thermal resistance
1.3
RθJB
Junction-to-board thermal resistance
21.8
ψJT
Junction-to-top characterization parameter
5.6
ψJB
Junction-to-board characterization parameter
21.8
RθJCbot
Junction-to-case (bottom) thermal resistance
n/a
(1)
4
UNIT
132.9
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com
7.5
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
Electrical Characteristics
Over junction temperature range 0°C ≤ TJ ≤ 125°C and recommended supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
3.15
3.3
3.45
V
INPUT
Undervoltage lock-out exit
VIN: 0 V → 4 V
VHYS_UVLO
Hysteresis on VUVLO_RISE falling
VIN: 4 V→0 V;
VUVLO_FALL = VUVLO_RISE – VHYS-UVLO
VIN-DT
Input power good detection
threshold is VOUT + VIN-DT
Input power good if VIN > VOUT + VIN-DT;
VOUT = 3.6 V; VIN: 3.5 V → 4 V
VHYS-INDT
Hysteresis on VIN-DT falling
VOUT = 3.6 V; VIN: 4 V → 3.5 V
31
mV
tDGL(PG_PWR)
Deglitch time on exiting sleep
Time measured from VIN: 0 V → 5 V 1-μs risetime to charge enables; VOUT = 3.6 V
29
ms
tDGL(PG_NO-PWR)
Deglitch time on VHYS-INDT power
down. Same as entering sleep.
Time measured from VIN: 5 V → 3.2 V 1-μs falltime to charge disables; VOUT = 3.6 V
29
ms
VOVP
Input over-voltage protection
threshold
VIN: 5 V → 12 V
tDGL(OVP-SET)
Input over-voltage blanking time
VIN: 5 V → 12 V
113
μs
VHYS-OVP
Hysteresis on OVP
VIN: 11 V → 5 V
110
mV
tDGL(OVP-REC)
Deglitch time exiting OVP
Time measured from VIN: 12 V → 5 V 1-μs falltime to charge enables
450
μs
VIN-DPM
Low input voltage protection.
Restricts lout at VIN-DPM
Limit input source current to 50 mA;
VOUT = 3.5 V; RISET = 1.35 kΩ
UVLO
250
15
6.52
4.25
60
6.67
mV
130
6.82
mV
V
4.31
4.37
V
420
450
Ω
ISET SHORT CIRCUIT TEST
RISET_SHORT
Highest resistor value considered RISET: 540 Ω → 250 Ω, Iout latches off;
a fault (short).
Cycle power to reset
tDGL_SHORT
Deglitch time transition from ISET Clear fault by disconnecting IN or cycling (high /
short to Iout disable
low) TS/BAT_EN
IOUT_CL
Maximum OUT current limit
regulation (Clamp)
1
ms
VIN = 5 V; VOUT = 3.6 V; RISET: 540 Ω → 250 Ω;
IOUT latches off after tDGL-SHORT
550
600
650
mA
0.75
0.8
0.85
V
BATTERY SHORT PROTECTION
VOUT(SC)
OUT pin short-circuit detection
threshold/ precharge threshold
VOUT:3 V → 0.5 V; No deglitch
VOUT(SC-HYS)
OUT pin Short hysteresis
Recovery ≥ VOUT(SC) + VOUT(SC-HYS); Rising; No
deglitch
IOUT(SC)
Source current to OUT pin during
short-circuit detection
77
9
11
mV
13
mA
QUIESCENT CURRENT
VIN = 0 V; 0°C to 125°C
75
VIN = 0 V; 0°C to 85°C
50
IOUT(PDWN)
Battery current into OUT pin
IOUT(DONE)
OUT pin current, charging
terminated
VIN = 6 V; VOUT > VOUT(REG)
IIN(STDBY)
Standby current into IN pin
TS = GND; VIN ≤ 6 V
Active supply current, IN pin
TS = open, VIN = 6 V;
TTDM – no load on OUT pin; VOUT > VOUT(REG);
IC enabled
ICC
nA
6
μA
125
μA
0.75
1
mA
BATTERY CHARGER FAST-CHARGE
VOUT(REG)
Output voltage
TJ = 0°C to 125°C; IOUT = 0 mA to 250 mA;
VIN = 5.0 V; VTS-45°C≤ VTS ≤ VTS-0°C (bq25100/101)
4.16
4.2
4.23
TJ = 0°C to 125°C; IOUT = 0 mA to 250 mA;
VIN = 5.0 V; VTS-45°C≤ VTS ≤ VTS-0°C (bq25100A)
4.26
4.3
4.33
TJ = 0°C to 125°C; IOUT = 0 mA to 250 mA;
VIN = 5.0 V; VTS-45°C≤ VTS ≤ VTS-0°C
(bq25100H/101H)
4.31
4.35
4.38
4.275
4.3
4.325
VIN = 5.0 V; IOUT =10 mA to 250 mA;
VTS-60°C≤ VTS ≤ VTS-45°C (bq25100/101)
4.02
4.06
4.1
VIN = 5.0 V; IOUT =10 mA to 250 mA;
VTS-60°C≤ VTS ≤ VTS-45°C (bq25100H/101H)
4.16
4.2
4.24
TJ = -5°C to 55°C; IOUT = 10mA to 75 mA;
VIN = 5.0 V; VTS-45°C≤ VTS ≤ VTS-0°C (bq25100A)
VO_HT(REG)
IOUT(RANGE)
Battery hot regulation voltage
Programmed output “fast charge”
current range
Copyright © 2014, Texas Instruments Incorporated
VOUT(REG) > VOUT > VLOWV; VIN = 5 V;
RISET = 0.54 kΩ to 13.5 kΩ
V
V
10
250
Submit Documentation Feedback
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
mA
5
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
www.ti.com
Electrical Characteristics (continued)
Over junction temperature range 0°C ≤ TJ ≤ 125°C and recommended supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VDO(IN-OUT)
Drop-Out, VIN – VOUT
Adjust VIN down until IOUT = 0.2 A; VOUT = 4.15 V;
RISET = 680 Ω; TJ ≤ 100°C
IOUT
Output “fast charge” formula
VOUT(REG) > VOUT > VLOWV; VIN = 5 V
KISET
Fast charge current factor
MIN
TYP
MAX
UNIT
220
400
mV
KISET/RISET
A
RISET = KISET /IOUT; 20 < IOUT < 250 mA
129
135
145
RISET = KISET /IOUT; 5 < IOUT < 20 mA
125
135
145
2.4
2.5
2.6
AΩ
PRECHARGE – SET BY PRETERM PIN
VLOWV
Pre-charge to fast-charge
transition threshold
tDGL1(LOWV)
Deglitch time on pre-charge to
fast-charge transition
57
μs
tDGL2(LOWV)
Deglitch time on fast-charge to
pre-charge transition
32
ms
IPRE-TERM
Refer to the Termination Section
%PRECHG
Pre-charge current, default
setting
VOUT < VLOWV; RISET = 2.7 kΩ; RPRE-TERM= High Z
or for BQ25101/101H
18
Pre-charge current formula
RPRE-TERM = KPRE-CHG (Ω/%) × %PRE-CHG (%)
RPRE-TERM/KPRE-CHG%
KPRE-CHG
% Pre-charge Factor
20
22
V
%IOUTCC
VOUT < VLOWV; VIN = 5 V;
RPRE-TERM = 6 kΩ to 30 kΩ;
RISET = 1.8 kΩ;
RPRE-TERM = KPRE-CHG × %IPRE-CHG,
where %IPRE-CHG is 20 to 100%
280
300
320
Ω/%
VOUT < VLOWV; VIN = 5 V;
RPRE-TERM = 3 kΩ to 6 kΩ;
RISET = 1.8 kΩ;
RPRE-TERM = KPRE-CHG × %IPRE-CHG,
where %IPRE-CHG is 10% to 20%
265
300
340
Ω/%
9
10
11
%IOUT-
TERMINATION – SET BY PRE-TERM PIN
%TERM
KTERM
Termination threshold current,
default setting
VOUT > VRCH; RISET = 2.7 kΩ; RPRE-TERM = High Z
or for BQ25101/101H
Termination current threshold
formula
RPRE-TERM = KTERM (Ω/%) × %TERM (%)
% Term factor
CC
RPRE-TERM/ KTERM
VOUT > VRCH; VIN = 5 V;
RPRE-TERM = 6 kΩ to 30 kΩ;
RISET = 1.8 kΩ, RPRE-TERM=KTERM × %ITERM,
where %ITERM is 10 to 50%
575
600
640
VOUT > VRCH; VIN = 5 V;
RPRE-TERM = 3 kΩ to 6 kΩ ;
RISET = 1.8 kΩ, RPRE-TERM= KTERM × %ITERM,
where %ITERM is 5 to 10%
555
620
685
VOUT > VRCH; VIN = 5 V;
RPRE-TERM = 750 Ω to 3 kΩ;
RISET = 1.8 kΩ, RPRE-TERM= KTERM × %ITERM,
where %ITERM is 1.25% to 5%
352
680
1001
23
25
27
IPRE-TERM
Current for programming the
term. and pre-chg with resistor,
ITerm-Start is the initial PRE-TERM
current
RPRE-TERM = 6 kΩ; VOUT = 4.15 V
ITERM
Termination current range
Minimum absolute termination current
%TERM
Termination current formula
tDGL(TERM)
Deglitch time, termination
detected
1
Ω/%
μA
mA
RTERM/ KTERM
%
29
ms
RECHARGE OR REFRESH
Recharge detection threshold –
normal temp
VIN = 5 V; VTS = 0.5 V;
VOUT: 4.25 V → VRCH (bq25100);
VOUT: 4.35 V → VRCH (bq25100A);
VOUT: 4.40 V → VRCH (bq25100H)
VO(REG)
–0.125
VO(REG)–0.0
95
VO(REG)–0.0
75
V
Recharge detection threshold –
hot temp
VIN = 5 V; VTS = 0.2 V;
VOUT: 4.15 V → VRCH (bq25100);
VOUT: 4.25 V → VRCH (bq25100H)
VO_HT(REG)
–0.130
VO_HT(REG)
–0.105
VO_HT(REG)
–0.080
V
Deglitch time, recharge threshold
detected
VIN = 5 V; VTS = 0.5 V;
VOUT: 4.25 V → 3.5V in 1 μs;
tDGL(RCH) is time to ISET ramp
VRCH
tDGL1(RCH)
6
Submit Documentation Feedback
29
ms
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
Electrical Characteristics (continued)
Over junction temperature range 0°C ≤ TJ ≤ 125°C and recommended supply voltage (unless otherwise noted)
PARAMETER
tDGL2(RCH)
Deglitch time, recharge threshold
detected in OUT-Detect Mode
TEST CONDITIONS
MIN
TYP
VIN = 5 V; VTS = 0.5 V;
VOUT = 3.5 V inserted;
tDGL(RCH) is time to ISET ramp
MAX
29
UNIT
ms
BATTERY DETECT ROUTINE – (NOTE: In Hot mode VO(REG) becomes VO_HT(REG))
VREG-BD
VOUT reduced regulation during
battery detect
IBD-SINK
Sink current during VREG-BD
tDGL(HI/LOW REG)
Regulation time at VREG or VREGBD
bq25100/101/bq25100H/101H;
VIN = 5 V; VTS = 0.5 V, Battery absent
VO(REG)0.450
VO(REG)0.400
VO(REG)0.350
bq25100A;
VIN = 5 V; VTS = 0.5 V; Battery absent
VO(REG)0.550
VO(REG)0.500
VO(REG)0.450
V
VIN = 5 V; VTS = 0.5 V; Battery absent
2
mA
VIN = 5 V; VTS = 0.5 V; Battery absent
25
ms
VBD-HI
High battery detection threshold
VIN = 5 V; VTS = 0.5 V; Battery absent
VO(REG) 0.150
VO(REG)0.100
VO(REG)0.050
V
VBD-LO
Low battery detection threshold
VIN = 5 V; VTS = 0.5 V; Battery absent
VREG-BD
+0.05
VREG-BD
+0.1
VREG-BD
+0.15
V
1700
1940
2250
s
34000
38800
45000
s
48.5
50.5
52.5
μA
27
30
33
μA
4
5
6.5
μA
1550
1600
1650
mV
1900
1950
BATTERY CHARGING TIMERS AND FAULT TIMERS
tPRECHG
Pre-charge safety timer value
Restarts when entering pre-charge;
Always enabled when in pre-charge.
tMAXCH
Charge safety timer value
Clears fault or resets at UVLO, TS disable, OUT
Short, exiting LOWV and Refresh
BATTERY-PACK NTC MONITOR (see Note 1); TS pin: 10k NTC
INTC-10k
NTC bias current
VTS = 0.3 V
INTC-DIS-10k
10k NTC bias current when
charging is disabled
VTS = 0 V
INTC-FLDBK-10k
INTC is reduced prior to entering
TTDM to keep cold thermistor
from entering TTDM
VTS: Set to 1.525 V
VTTDM(TS)
Termination and timer disable
mode Threshold – Enter
VTS: 0.5 V → 1.7 V; Timer held in reset
VHYS-TTDM(TS)
Hysteresis exiting TTDM
VTS: 1.7 V → 0.5 V; Timer enabled
VCLAMP(TS)
TS maximum voltage clamp
VTS = Open (float)
tDGL(TTDM)
100
Deglitch exit TTDM between
states
Deglitch enter TTDM between
states
VTS_I-FLDBK
TS voltage where INTC is reduce
to keep thermistor from entering
TTDM
CTS
Optional capacitance – ESD
INTC adjustment (90 to 10%; 45 to 6.6 uA) takes
place near this spec threshold;
VTS: 1.425 V → 1.525 V
VTS-0°C
Low temperature CHG pending
Low temp charging to pending;
VTS: 1 V → 1.5 V
VHYS-0°C
Hysteresis
At 0°C;
Charge pending to low temp charging;
VTS: 1.5 V → 1 V
VTS-10°C
Low temperature, half charge
Normal charging to low temp charging;
VTS: 0.5 V → 1 V
VHYS-10°C
Hysteresis
At 10°C;
Low temp charging to normal CHG;
VTS: 1 V → 0.5 V
VTS-45°C
High temperature
At 4.1V (bq25100/101) or 4.2V (bq25100H/101H);
Normal charging to high temp CHG;
VTS: 0.5 V → 0.2 V
VHYS-45°C
Hysteresis
At 45°C;
High temp charging to normal CHG;
VTS: 0.2 V → 0.5 V
VTS-60°C
High temperature disable
bq25100/01/100H/101H/100L;
High temp charge to pending;
VTS: 0.2 V → 0.1 V
VHYS-60°C
Hysteresis
At 60°C (bq25100/01/100H/101H/100L);
Charge pending to high temp CHG;
VTS: 0.1 V → 0.2 V
Copyright © 2014, Texas Instruments Incorporated
1230
mV
2000
57
ms
8
μs
1475
mV
0.22
μF
1255
1280
100
775
800
268
830
170
283
mV
mV
180
20
Submit Documentation Feedback
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
mV
mV
20
160
mV
mV
55
253
mV
mV
mV
7
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
www.ti.com
Electrical Characteristics (continued)
Over junction temperature range 0°C ≤ TJ ≤ 125°C and recommended supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
Normal to cold operation; VTS: 0.6 V → 1 V
50
Cold to normal operation; VTS: 1 V → 0.6 V
12
30
tDGL(TS_10C)
Deglitch for TS thresholds: 10C
tDGL(TS)
Deglitch for TS thresholds:
0/45/60C
Battery charging
VTS-EN-10k
Charge enable threshold, (10k
NTC)
VTS: 0 V → 0.175 V
VTS-DIS_HYS-10k
HYS below VTS-EN-10k to disable,
(10k NTC)
VTS: 0.125 V → 0 V
84
92
MAX
UNIT
ms
ms
100
mV
12
mV
THERMAL REGULATION
TJ(REG)
Temperature regulation limit
125
°C
TJ(OFF)
Thermal shutdown temperature
155
°C
TJ(OFF-HYS)
Thermal shutdown hysteresis
20
°C
LOGIC LEVELS ON /CHG
VOL
Output low voltage
ISINK = 5 mA
ILEAK
Leakage current into IC
V CHG = 5 V
0.4
V
1
μA
7.6 Typical Characteristics
Setup: Typical Applications Schematic; VIN = 5 V, VBAT = 3.6 V (unless otherwise noted)
VIN
VIN 2 V/div
2 V/div
VOUT 2 V/div
VOUT
2 V/div
IOUT 60 mA/div
IOUT 60 mA/div
VISET 1 V/div
t-time – 20 ms/div
t-time – 10 ms/div
No Battery, No Load
Hot Plug
Figure 3. Power Up Timing
8
Submit Documentation Feedback
Figure 4. OVP 7-V Adaptor
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
Typical Characteristics (continued)
Setup: Typical Applications Schematic; VIN = 5 V, VBAT = 3.6 V (unless otherwise noted)
VIN 2 V/div
VIN 2 V/div
VTS 500 mV/div
VOUT 2 V/div
IOUT 60 mA/div
IOUT 60 mA/div
VISET 1 V/div
VISET 1 V/div
t-time – 50 ms/div
t-time – 50 ms/div
VIN 0 V -5 V-7 V-5 V
Figure 5. OVP from Normal Power-Up Operation
Figure 6. TS Enable and Disable
VIN 1 V/div
VIN 5 V/div
IOUT 60 mA/div
VOUT 2 V/div
VOUT 2 V/div
IOUT 100 mA/div
VISET 1 V/div
VISET 1 V/div
t-time – 5 ms/div
t-time – 20 ms/div
VIN Regulated
Figure 7. DPM-Adaptor Current Limits
Figure 8. Hot Plug Source
with No Battery - Battery
Detection
VIN 5 V/div
VIN 5 V/div
IOUT 100 mA/div
VOUT 2 V/div
VOUT 2 V/div
VISET 1 V/div
VISET 1 V/div
IOUT 100 mA/div
t-time – 20 ms/div
t-time – 200 μs/div
No Load
Figure 9. Battery Removal
Copyright © 2014, Texas Instruments Incorporated
Figure 10.
ISET Shorted During Normal Operation
Submit Documentation Feedback
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
9
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
www.ti.com
Typical Characteristics (continued)
Setup: Typical Applications Schematic; VIN = 5 V, VBAT = 3.6 V (unless otherwise noted)
VIN 5 V/div
VIN 5 V/div
VOUT 5 V/div
VOUT 5 V/div
IOUT 100 mA/div
IOUT 100 mA/div
VISET 1 V/div
VISET 1 V/div
t-time – 10 ms/div
t-time – 10 ms/div
20-Ω resistor at OUT, No input, VBAT = 3.7 V
20-Ω resistor at OUT, No input, VBAT = 3.7 V
Figure 12. Battery Removal
Figure 11. Battery Plug In
VIN 2 V/div
VIN 2 V/div
VISET 2 V/div
VOUT 2 V/div
ILOAD 70 mA/div
IOUT 400 mA/div
VISET 1 V/div
IOUT 70 mA/div
t-time – 10 ms/div
t-time – 10 ms/div
90-mA Load, 120-mA ICHG
Figure 13. ISET Short Prior to Power Up
Figure 14. Power Up
4.21
4.202
VREG = 0qC
VREG = 25qC
VREG = 85qC
VREG = 125qC
Regulation Voltage (V)
4.206
4.201
Regulation Voltage (V)
4.208
4.204
4.202
4.2
4.198
4.196
4.2
4.199
VREG = 0qC
VREG = 25qC
VREG = 85qC
VREG = 125qC
4.198
4.197
4.196
4.194
4.195
4.192
4.19
4.194
1 mA
10 mA 50 mA 100 mA 150 mA 200 mA 250 mA
Load Current (mA)
Figure 15. Load Regulation Over Temperature
10
Submit Documentation Feedback
D001
4.5 V
5V
5.5 V
6V
6.5 V
Input Voltage (V)
D002
Figure 16. Line Regulation Over Temperature
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
Typical Characteristics (continued)
Setup: Typical Applications Schematic; VIN = 5 V, VBAT = 3.6 V (unless otherwise noted)
80
112
70
6.4
IOUT (mA)
VOUT (V) 5.6
60
4.8
50
4
40
3.2
30
2.4
20
1.6
10
0.8
110
109
108
IO = 0qC
IO = 25qC
IO = 85qC
IO = 125qC
107
0
106
2.5 V
3V
3.5 V
4V
0
4.1 V
Output Voltage (V)
Figure 17. Current Regulation Over Temperature
Copyright © 2014, Texas Instruments Incorporated
Output Voltage (V)
Output Current (mA)
Output Current (mA)
111
D003
D004
bq25100 charge cycle, ICHG = 75 mA, VBAT_REG = 4.2 V
Figure 18. Battery Voltage vs Charge Current
Submit Documentation Feedback
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
11
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
www.ti.com
8 Detailed Description
8.1 Overview
The bq2510x is a highly integrated family of single cell Li-Ion and Li-Pol chargers. The charger can be used to
charge a battery, power a system or both. The charger has three phases of charging: pre-charge to recover a
fully discharged battery, fast-charge constant current to supply the charge safely and voltage regulation to safely
reach full capacity. The charger is very flexible, allowing programming of the fast-charge current and Precharge/Termination Current. This charger is designed to work with a USB connection (100-mA limit) or Adaptor
(DC output). The charger also checks to see if a battery is present.
The charger also comes with a full set of safety features: JEITA Temperature Standard
(bq25100/01/100H/101H), Over-Voltage Protection, DPM-IN, Safety Timers, and ISET short protection. All of
these features and more are described in detail below.
The charger is designed for a single power path from the input to the output to charge a single cell Li-Ion or
Li-Pol battery pack. Upon application of a 5-V DC power source the ISET and OUT short checks are performed
to assure a proper charge cycle.
If the battery voltage is below the LOWV threshold, the battery is considered discharged and a preconditioning
cycle begins. The amount of precharge current can be programmed using the PRE-TERM pin which programs a
percent of fast charge current (10 to 100%) as the precharge current. This feature is useful when the system load
is connected across the battery “stealing” the battery current. The precharge current can be set higher to account
for the system loading while allowing the battery to be properly conditioned. The PRE-TERM pin is a dual
function pin which sets the precharge current level and the termination threshold level. The termination "current
threshold" is always half of the precharge programmed current level.
Once the battery voltage has charged to the VLOWV threshold, fast charge is initiated and the fast charge
current is applied. The fast charge constant current is programmed using the ISET pin. The constant current
provides the bulk of the charge. Power dissipation in the IC is greatest in fast charge with a lower battery voltage.
If the IC reaches 125°C, the IC enters thermal regulation, slows the timer clock by half, and reduces the charge
current as needed to keep the temperature from rising any further. Figure 19 shows the charging profile with
thermal regulation. Typically under normal operating conditions, the IC’s junction temperature is less than 125°C
and thermal regulation is not entered.
Once the cell has charged to the regulation voltage the voltage loop takes control and holds the battery at the
regulation voltage until the current tapers to the termination threshold. The termination can be disabled if desired.
Further details are described in the Operating Modes section.
12
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
Overview (continued)
PreConditioning
Phase
VO(REG)
Thermal
Regulation
Phase
Current
Regulation
Phase
Voltage Regulation and
Charge Termination
Phase
DONE
IO(OUT)
FAST-CHARGE
CURRENT
PRE-CHARGE
CURRENT AND
TERMINATION
THRESHOLD
Battery
Voltage,
V(OUT)
Battery Current,
I(OUT)
Charge
Complete
Status,
Charger
Off
VO(LOWV)
I(TERM)
IO(PRECHG)
T(THREG)
0A
Temperature, Tj
T(PRECHG)
T(CHG)
DONE
Figure 19. Charging Profile With Thermal Regulation
Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
13
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
www.ti.com
8.2 Functional Block Diagram
Internal Charge
Current Sense
w/ Multiple Outputs
IN
OUT
80 mV
Input
Power
Detect
IN
+
_
OUT
OUT
+
_
+
_
+
-
IN-DPMREF
OUTREGREF
Charge
Pump
TJ
+
_
FAST CHARGE
125ÛCREF
PRE-CHARGE
ISET
IN
+
_
1.5V
PRE-CHG Reference
Term Reference
TJ
+
_
+
_
150ÛCREF
Thermal Shutdown
PA
+
_
22mA Startup Current
Limit
Internal Current
Sensing Resistor
Charge
Pump
PRE-TERM
+
_
OUT
VTERM_EN
+
_
IN
OVPREF
+
_
CHARGE
CONTROL
VCOOL-10ÛC
+
_
+
_
VWARM-45ÛC
VCOLD-0ÛC
+
_
+
_
VHOT-60ÛC
LO=LDO MODE
TS
VLDO
VDISABLE
5PA
14
+
_
+
_
HI=CHIP DISABLE
Cold Temperature Sink
Disable Sink
Current
Current = 20PA
= 45PA
VCLAMP=1.4V
+
+
_
_
45PA
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
8.3 Feature Description
8.3.1 Overvoltage-Protection (OVP) – Continuously Monitored
If the input source applies an overvoltage, the pass FET, if previously on, turns off after a deglitch, tBLK(OVP). The
timer stops counting. Once the overvoltage returns to a normal voltage, the timer and charge continues.
8.3.2
CHG Pin Indication (bq25101, bq25101H)
The charge pin has an internal open drain FET which is on (pulls down to VSS) during the first charge only
(independent of TTDM) and is turned off once the battery reaches voltage regulation and the charge current
tapers to the termination threshold set by the PRE-TERM resistor. The bq25101/01H terminates at 10% of the
programmed charge current. The charge pin is high impedance in sleep mode and OVP and returns to its
previous state once the condition is removed. Cycling input power, removing and replacing the battery, pulling
the TS pin low and releasing or entering pre-charge mode causes the CHG pin to go reset (go low if power is
good and a discharged battery is attached) and is considered the start of a first charge.
8.3.3
CHG Pin LED Pull-up Source (bq25101, bq25101H)
For host monitoring, a pull-up resistor is used between the CHG pin and the VCC of the host and for a visual
indication a resistor in series with an LED is connected between the /CHG pin and a power source. If the CHG
source is capable of exceeding 7 V, a 6.2-V zener should be used to clamp the voltage. If the source is the OUT
pin, note that as the battery changes voltage, and the brightness of the LEDs vary.
8.3.4 IN-DPM (VIN-DPM or IN-DPM)
The IN-DPM feature is used to detect an input source voltage that is folding back (voltage dropping), reaching its
current limit due to excessive load. When the input voltage drops to the VIN-DPM threshold the internal pass FET
starts to reduce the current until there is no further drop in voltage at the input. This would prevent a source with
voltage less than VIN-DPM to power the out pin. This is an added safety feature that helps protect the source from
excessive loads. This feature is not applicable for bq25100A.
8.3.5 OUT
The Charger’s OUT pin provides current to the battery and to the system, if present. This IC can be used to
charge the battery plus power the system, charge just the battery or just power the system (TTDM) assuming the
loads do not exceed the available current. The OUT pin is a current limited source and is inherently protected
against shorts. If the system load ever exceeds the output programmed current threshold, the output will be
discharged unless there is sufficient capacitance or a charged battery present to supplement the excessive load.
8.3.6 ISET
An external resistor is used to Program the Output Current (10 to 250 mA) and can be used as a current monitor.
RISET = KISET ÷ IOUT
(1)
Where:
IOUT is the desired fast charge current;
KISET is a gain factor found in the electrical specification
For greater accuracy at lower currents, part of the sense FET is disabled to give better resolution. Going from
higher currents to low currents, there is hysteresis and the transition occurs around 50 mA.
The ISET resistor is short protected and will detect a resistance lower than ≉420 Ω. The detection requires at
least 50 mA of output current. If a “short” is detected, then the IC will latch off and can be reset by cycling the
power or cycling TS pin. The OUT current is internally clamped to a maximum current of 600 mA typical and is
independent of the ISET short detection circuitry.
For charge current that is below 50 mA, an extra RC circuit is recommended on ISET to acheive more stable
current signal. More detail is available in 9.1 Application Information.
Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
15
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
www.ti.com
Feature Description (continued)
60C
45C
10C
Programmed VBAT_REG
0C
No Operation
During Cold Fault
Reduced VBAT_REG
Programmed ICHG
(100%)
50%
Cold Fault
0
0.2
0.4
VHOT VWARM
0.6
0.8
1.0
VCOOL
1.2
VCOLD
1.4
1.6
Termination
Disable
1.8
TS Voltage-V
Figure 20. Operation Over TS Bias Voltage - bq25100, bq25100H, bq25101, bq25101H
16
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
Feature Description (continued)
45C
10C
Programmed VBAT_REG
0C
No Operation
During Cold Fault
Hot Fault
Charge Disable
Programmed ICHG
(100%)
50%
Cold Fault
0
0.2
0.4
VHOT VWARM
0.6
0.8
1.0
VCOOL
1.2
VCOLD
1.4
1.6
Termination
Disable
1.8
TS Voltage-V
Figure 21. Operation Over TS Bias Voltage – bq25100A
8.3.7 PRE_TERM – Pre-Charge and Termination Programmable Threshold
Pre-Term is used to program both the pre-charge current and the termination current threshold. The pre-charge
current level is a factor of two higher than the termination current level. The termination can be set between 5
and 50% (recommended range) of the programmed output current level set by ISET. If left floating the
termination and pre-charge are set internally at 10/20% respectively. The RPRE-TERM is ranged from 600 Ω to 30
kΩ and the minimum termination current can be programmed to 1 mA. The pre-charge-to-fast-charge, Vlowv
threshold is set to 2.5 V.
RPRE-TERM = %Term × KTERM = %Pre-CHG × KPRE-CHG
(2)
Where:
%Term is the percent of fast charge current where termination occurs;
%Pre-CHG is the percent of fast charge current that is desired during precharge;
KTERM and KPRE-CHG are gain factors found in the electrical specifications.
8.3.8 TS
The TS function for the bq2510x family is designed to follow the new JEITA temperature standard
(bq25100/bq25100H/bq25101/bq25101H) for Li-Ion and Li-Pol batteries. There are now four thresholds, 60°C,
45°C, 10°C, and 0°C. Normal operation occurs between 10°C and 45°C. If between 0°C and 10°C the charge
current level is cut in half and if between 45°C and 60°C the regulation voltage is reduced to 4.1 V max for
bq25100 and 4.2 V max for bq25100H, see Figure 20. The TS function for the bq25100A cut the charge current
level in half between 0°C and 10°C and disables charging when the NTC temperature is above 45°C.
Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
17
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
www.ti.com
Feature Description (continued)
The TS feature is implemented using an internal 50μA current source to bias the thermistor (designed for use
with a 10-k NTC β = 3370 (SEMITEC 103AT-2 or Mitsubishi TH05-3H103F) connected from the TS pin to VSS. If
this feature is not needed, a fixed 10-k can be placed between TS and VSS to allow normal operation. This may
be done if the host is monitoring the thermistor and then the host would determine when to pull the TS pin low to
disable charge.
The TS pin has two additional features, when the TS pin is pulled low or floated/driven high. A low disables
charge and a high puts the charger in TTDM.
Above 60°C (45°C for bq25100A) or below 0°C the charge is disabled. Once the thermistor reaches ≉–10°C the
TS current folds back to keep a cold thermistor (between –10°C and –50°C) from placing the IC in the TTDM
mode. If the TS pin is pulled low into disable mode, the current is reduce to ≉30 μA. Since the ITS curent is fixed
along with the temperature thresholds, it is not possible to use thermistor values other than the 10-k NTC (at
25°C).
8.3.9 Timers
The pre-charge timer is set to 30 minutes. The pre-charge current, can be programmed to off-set any system
load, making sure that the 30 minutes is adequate.
The fast charge timer is fixed at 10 hours and can be increased real time by going into thermal regulation or INDPM. The timer clock slows by a factor of 2, resulting in a clock than counts half as fast when in these modes. If
either the 30 minute or ten hour timer times out, the charging is terminated and for bq25101/1H the CHG pin
goes high impedance if not already in that state. The timer is reset by disabling the IC, cycling power or going
into and out of TTDM.
8.3.10 Termination
Once the OUT pin goes above VRCH, (reaches voltage regulation) and the current tapers down to the
termination threshold, a battery detect route is run to determine if the battery was removed or the battery is full. If
the battery is present, the charge current will terminate. If the battery was removed along with the thermistor,
then the TS pin is driven high and the charge enters TTDM. If the battery was removed and the TS pin is held in
the active region, then the battery detect routine will continue until a battery is inserted. The termination current
can be programmed down to 625 uA, however, the accuracy will reduce acoordingly when the termination
current is below 1 mA.
8.4 Device Functional Modes
8.4.1 Power-Down or Undervoltage Lockout (UVLO)
The bq2510x family is in power down mode if the IN pin voltage is less than UVLO. The part is considered
“dead” and all the pins are high impedance. Once the IN voltage rises above the UVLO threshold the IC will
enter Sleep Mode or Active mode depending on the OUT pin (battery) voltage.
8.4.2 Power-up
The IC is alive after the IN voltage ramps above UVLO (see sleep mode), resets all logic and timers, and starts
to perform many of the continuous monitoring routines. Typically the input voltage quickly rises through the
UVLO and sleep states where the IC declares power good, starts the qualification charge at 22 mA, sets the
charge current base on the ISET pin, and starts the safety timer.
8.4.3 Sleep Mode
If the IN pin voltage is between VOUT+VDT and UVLO, the charge current is disabled, the safety timer counting
stops (not reset). As the input voltage rises and the charger exits sleep mode, the safety timer continues to count
and the charge is enabled. See Figure 22.
8.4.4 New Charge Cycle
A new charge cycle is started when a good power source is applied, performing a chip disable/enable (TS pin),
exiting Termination and Timer Disable Mode (TTDM), detecting a battery insertion or the OUT voltage dropping
below the VRCH threshold.
18
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
Device Functional Modes (continued)
Apply Input
Power
Is power good?
VBAT+VDT<VIN<VOVP
&VUVLO<VIN
No
Yes
Is chip enabled?
VTS>VEN
No
Yes
Set Input Current Limit to 22mA
And Start Charge
Perform ISET & OUT short tests
Set charge current
based on ISET setting
Return to
Charge
Figure 22. bq2510x Power-Up Flow Diagram
Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
19
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
www.ti.com
Device Functional Modes (continued)
8.4.5 Termination and Timer Disable Mode (TTDM) - TS Pin High
The battery charger is in TTDM when the TS pin goes high from removing the thermistor (removing battery
pack/floating the TS pin) or by pulling the TS pin up to the TTDM threshold.
When entering TTDM, the 10 hour safety timer is held in reset and termination is disabled. A battery detect
routine is run to see if the battery was removed or not. For bq25101/1H, if the battery was removed then the
CHG pin will go to its high impedance state if not already there. If a battery is detected the CHG pin does not
change states until the current tapers to the termination threshold, where the CHG pin goes to its high
impedance state if not already there (the regulated output will remain on).
The charging profile does not change (still has pre-charge, fast-charge constant current and constant voltage
modes). This implies the battery is still charged safely and the current is allowed to taper to zero.
When coming out of TTDM, the battery detect routine is run and if a battery is detected, then a new charge cycle
begins.
If TTDM is not desired upon removing the battery with the thermistor, one can add a 237-kΩ resistor between TS
and VSS to disable TTDM. This keeps the current source from driving the TS pin into TTDM. This creates ≉0.1°C
error at hot and a ≉3°C error at cold.
8.4.6 Battery Detect Routine
The battery detect routine should check for a missing battery while keeping the OUT pin at a useable voltage.
The battery detect routine is run when entering and exiting TTDM to verify if battery is present, or run all the time
if battery is missing and not in TTDM. On power-up, if battery voltage is greater than VRCH thereshold, a battery
detect routine is run to determine if a battery is present.
The battery detect routine is disabled while the IC is in TTDM, or has a TS fault. See Figure 23 for the Battery
Detect Flow Diagram.
8.4.7 Refresh Threshold
After termination, if the OUT pin voltage drops to VRCH (100mV below regulation) then a new charge is initiated.
8.4.8 Starting a Charge on a Full Battery
The termination threshold is raised by ≉14% for the first minute of a charge cycle so if a full battery is removed
and reinserted or a new charge cycle is initiated, that the new charge terminates (less than 1 minute). Batteries
that have relaxed many hours may take several minutes to taper to the termination threshold and terminate
charge.
20
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
Device Functional Modes (continued)
Start
BATT_DETECT
Start 25ms timer
Timer Expired?
No
Yes
Is VOUT<VREG-100mV?
Yes
Battery Present
Turn off Sink Current
Return to flow
No
Set OUT REG
to VREG-400mV
Enable sink current
Reset & Start 25ms timer
Timer Expired?
No
Yes
Yes
Is VOUT>VREG-300mV?
Battery Present
Turn off Sink Current
Return to flow
No
Battery Absent
Don’t Signal Charge
Turn off Sink Current
Return to Flow
Figure 23. Battery Detect Routine
Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
21
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
www.ti.com
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The bq2510x series of devices are highly integrated Li-Ion and Li-Pol linear chargers targeted at space-limited
portable applications. The fast charge current can be programmed from 10 mA to 250 mA through an external
resistor on ISET pin. The pre_charge and termination current can also be programmed through the resistor
connected on PRETERM pin. The device has complete system-level protection such as input under-voltage
lockout (UVLO), input over-voltage protection (OVP), sleep mode, thermal regulation, safety timers, and NTC
monitoring input.
9.2 Typical Application - Charger Application Design Example
SYSTEM
USB Port or
Adapter
VBUS
IN
D+
D-
OUT
1ÛF
1ÛF
VSS
GND
PACK+
TS
TEMP
HOST
ISET
Optional 2.7kŸ
RC
10 nF
3.4kŸ
PRETERM
PACK-
6kŸ
bq25100
CE
9.2.1 Design Requirements
• Supply voltage = 5 V
• Fast charge current: IOUT-FC = 40 mA;
• Termination Current Threshold: %IOUT-FC = 10% of Fast Charge or ~4 mA
• Pre-Charge Current by default is twice the termination Current or ~8 mA
• TS – Battery Temperature Sense = 10-k NTC (103AT)
• /CE is an open drain control pin
9.2.2 Detailed Design Procedures
• The regulation voltage is set to 4.2 V, the input voltage is 5 V and the charge current is programmed to 40
mA.
• For charge current that is below 50 mA, an extra RC circuit is recommended on ISET to acheive more stable
current signal. For applications that need higher charge current, the RC circuit is not needed.
• For applications that use more than 200-mA current, there could be a very low level ~1% of charge current
ringing in the output. The ringing can be removed by increasing the input capacitance.
22
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
Typical Application - Charger Application Design Example (continued)
9.2.2.1 Calculations
9.2.2.1.1 Program the Fast Charge Current, ISET:
RISET = [K(ISET) / I(OUT)]
from electrical characteristics table. . . K(SET) = 135 AΩ
RISET = [135 AΩ/0.04 A] = 3.4 kΩ
Selecting the closest standard value, use a 3.4-kΩ resistor between ISET and Vss.
9.2.2.1.2 Program the Termination Current Threshold, ITERM:
RPRE-TERM = K(TERM) × %IOUT-FC
RPRE-TERM = 600 Ω/% × 10% = 6 kΩ
Selecting the closest standard value, use a 6-kΩ resistor between PRETERM and Vss.
One can arrive at the same value by using 20% for a pre-charge value (factor of 2 difference).
RPRE-TERM = K(PRE-CHG) × %IOUT-FC
RPRE-TERM = 300 Ω/% × 20%= 6 kΩ
9.2.2.1.3 TS Function
Use a 10-k NTC thermistor in the battery pack (103AT).
To Disable the temp sense function, use a fixed 10-kΩ resistor between the TS and VSS.
9.2.2.1.4 Selecting IN and OUT Pin Capacitors
In most applications, all that is needed is a high-frequency decoupling capacitor (ceramic) on the power pin, input
and output pins. Using the values shown on the application diagram is recommended. After evaluation of these
voltage signals with real system operational conditions, one can determine if capacitance values can be adjusted
toward the minimum recommended values (DC load application) or higher values for fast, high amplitude, pulsed
load applications. Note if designed for high input voltage sources (bad adaptors or wrong adaptors), the capacitor
needs to be rated appropriately. Ceramic capacitors are tested to 2x their rated values so a 16-V capacitor may
be adequate for a 30-V transient (verify tested rating with capacitor manufacturer).
9.2.3 bq25100 Application Performance Plots
VIN
VIN 2 V/div
2 V/div
VOUT 2 V/div
VOUT 2 V/div
IOUT 60 mA/div
IOUT 60 mA/div
VISET 1 V/div
VISET 1 V/div
t-time – 20 ms/div
Hot Plug
t-time – 50 ms/div
VIN 0 V -5 V-7 V-5 V
Figure 24. OVP 7-V Adaptor
Copyright © 2014, Texas Instruments Incorporated
Figure 25. OVP from Normal Power-Up Operation
Submit Documentation Feedback
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
23
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
www.ti.com
Typical Application - Charger Application Design Example (continued)
VIN 2 V/div
VIN 2 V/div
VTS 500 mV/div
VISET 2 V/div
ILOAD 70 mA/div
IOUT 60 mA/div
VISET 1 V/div
IOUT 70 mA/div
t-time – 10 ms/div
t-time – 50 ms/div
90-mA Load, 120-mA IOUT
Figure 26. TS Enable and Disable
Figure 27. Power Up
10 Power Supply Recommendations
10.1 Leakage Current Effects on Battery Capacity
To determine how fast a leakage current on the battery will discharge the battery is an easy calculation. The time
from full to discharge can be calculated by dividing the Amp-Hour Capacity of the battery by the leakage current.
For a 0.1-AHr battery and a 75-nA leakage current (100mAHr/75nA = 250000 Hours), it would take 1333k hours
or 152 years to discharge. In reality the self discharge of the cell would be much faster so the 75-nA leakage
would be considered negligible.
11 Layout
11.1 Layout Guidelines
To obtain optimal performance, the decoupling capacitor from IN to GND and the output filter capacitors from
OUT to GND should be placed as close as possible to the bq2510x, with short trace runs to both IN, OUT and
GND.
• All low-current GND connections should be kept separate from the high-current charge or discharge paths
from the battery. Use a single-point ground technique incorporating both the small signal ground path and the
power ground path.
• The high current charge paths into IN pin and from the OUT pin must be sized appropriately for the maximum
charge current in order to avoid voltage drops in these traces
24
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
www.ti.com
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
11.2 Layout Example
Figure 28. Board Layout
11.3 Thermal Package
The most common measure of package thermal performance is thermal impedance (θJA ) measured (or
modeled) from the chip junction to the air surrounding the package surface (ambient). The mathematical
expression for θJA is:
θJA = (TJ – T) / P
(3)
Where:
TJ = chip junction temperature
T = ambient temperature
P = device power dissipation
Factors that can influence the measurement and calculation of θJA include:
1. Whether or not the device is board mounted
2. Trace size, composition, thickness, and geometry
3. Orientation of the device (horizontal or vertical)
4. Volume of the ambient air surrounding the device under test and airflow
5. Whether other surfaces are in close proximity to the device being tested
Due to the charge profile of Li-Ion and Li-Pol batteries the maximum power dissipation is typically seen at the
beginning of the charge cycle when the battery voltage is at its lowest. Typically after fast charge begins the pack
voltage increases to ≉3.4 V within the first 2 minutes. The thermal time constant of the assembly typically takes a
few minutes to heat up so when doing maximum power dissipation calculations, 3.4 V is a good minimum voltage
to use.
The device power dissipation, P, is a function of the charge rate and the voltage drop across the internal
PowerFET. It can be calculated from the following equation when a battery pack is being charged :
P = [V(IN) – V(OUT)] × I(OUT)
Copyright © 2014, Texas Instruments Incorporated
(4)
Submit Documentation Feedback
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
25
bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
www.ti.com
Thermal Package (continued)
The thermal loop feature reduces the charge current to limit excessive IC junction temperature. It is
recommended that the design not run in thermal regulation for typical operating conditions (nominal input voltage
and nominal ambient temperatures) and use the feature for non typical situations such as hot environments or
higher than normal input source voltage. With that said, the IC will still perform as described, if the thermal loop
is always active.
12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
bq25100
Click here
Click here
Click here
Click here
Click here
bq25101
Click here
Click here
Click here
Click here
Click here
bq25100A
Click here
Click here
Click here
Click here
Click here
bq25100H
Click here
Click here
Click here
Click here
Click here
bq25101H
Click here
Click here
Click here
Click here
Click here
bq25100L
Click here
Click here
Click here
Click here
Click here
12.3 Trademarks
Bluetooth is a registered trademark of Bluetooth SIG, Inc..
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
26
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L
PACKAGE OPTION ADDENDUM
www.ti.com
15-Jun-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
BQ25100AYFPR
ACTIVE
DSBGA
YFP
6
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
25100A
BQ25100AYFPT
ACTIVE
DSBGA
YFP
6
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
25100A
BQ25100HYFPR
ACTIVE
DSBGA
YFP
6
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
0 to 125
25100H
BQ25100HYFPT
ACTIVE
DSBGA
YFP
6
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
0 to 125
25100H
BQ25100YFPR
ACTIVE
DSBGA
YFP
6
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
0 to 125
25100
BQ25100YFPT
ACTIVE
DSBGA
YFP
6
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
0 to 125
25100
BQ25101HYFPR
ACTIVE
DSBGA
YFP
6
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
0 to 125
25101H
BQ25101HYFPT
ACTIVE
DSBGA
YFP
6
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
0 to 125
25101H
BQ25101YFPR
ACTIVE
DSBGA
YFP
6
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
0 to 125
25101
BQ25101YFPT
ACTIVE
DSBGA
YFP
6
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
0 to 125
25101
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
15-Jun-2015
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Jul-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
BQ25100AYFPR
DSBGA
YFP
6
3000
180.0
8.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
0.98
1.68
0.59
4.0
8.0
Q1
BQ25100AYFPT
DSBGA
YFP
6
250
180.0
8.4
0.98
1.68
0.59
4.0
8.0
Q1
BQ25100HYFPR
DSBGA
YFP
6
3000
180.0
8.4
0.98
1.68
0.59
4.0
8.0
Q1
BQ25100HYFPT
DSBGA
YFP
6
250
180.0
8.4
0.98
1.68
0.59
4.0
8.0
Q1
BQ25100YFPR
DSBGA
YFP
6
3000
180.0
8.4
0.98
1.68
0.59
4.0
8.0
Q1
BQ25100YFPT
DSBGA
YFP
6
250
180.0
8.4
0.98
1.68
0.59
4.0
8.0
Q1
BQ25101HYFPR
DSBGA
YFP
6
3000
180.0
8.4
0.98
1.68
0.59
4.0
8.0
Q1
BQ25101HYFPT
DSBGA
YFP
6
250
180.0
8.4
0.98
1.68
0.59
4.0
8.0
Q1
BQ25101YFPR
DSBGA
YFP
6
3000
180.0
8.4
0.98
1.68
0.59
4.0
8.0
Q1
BQ25101YFPT
DSBGA
YFP
6
250
180.0
8.4
0.98
1.68
0.59
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Jul-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ25100AYFPR
DSBGA
YFP
6
3000
182.0
182.0
20.0
BQ25100AYFPT
DSBGA
YFP
6
250
182.0
182.0
20.0
BQ25100HYFPR
DSBGA
YFP
6
3000
182.0
182.0
20.0
BQ25100HYFPT
DSBGA
YFP
6
250
182.0
182.0
20.0
BQ25100YFPR
DSBGA
YFP
6
3000
182.0
182.0
20.0
BQ25100YFPT
DSBGA
YFP
6
250
182.0
182.0
20.0
BQ25101HYFPR
DSBGA
YFP
6
3000
182.0
182.0
20.0
BQ25101HYFPT
DSBGA
YFP
6
250
182.0
182.0
20.0
BQ25101YFPR
DSBGA
YFP
6
3000
182.0
182.0
20.0
BQ25101YFPT
DSBGA
YFP
6
250
182.0
182.0
20.0
Pack Materials-Page 2
D: Max = 1.608 mm, Min =1.547 mm
E: Max = 0.91 mm, Min = 0.85 mm
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated