19-2627; Rev 0; 10/02 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP Features ♦ USB 1.1 Signal Switching Compliant ♦ 2ns (max) Differential Skew ♦ -3dB Bandwidth: >300MHz ♦ Low 15pF On-Channel Capacitance ♦ Single-Supply Operation from +1.8V to +5.5V ♦ 4.5Ω RON (max) Switches (MAX4717/MAX4718) 0.3Ω (max) RON Match (+3.0V Supply) 1.2Ω (max) Flatness (+3.0V Supply) ♦ 20Ω RON (max) Switch (MAX4718) 0.4Ω (max) RON Match (+3.0V Supply) 1.2Ω (max) Flatness (+3.0V Supply) ♦ Rail-to-Rail® Signal Handling ♦ High Off-Isolation: -55dB (10MHz) These switches are packaged in a chip-scale package (UCSP™), significantly reducing the required PC board area. The chip occupies only a 2.0mm ✕ 1.50mm area and has a 4 ✕ 3 bump array with a bump pitch of 0.5mm. These switches are also available in a 10-pin µMAX package. ♦ Low Crosstalk: -80dB (10MHz) ♦ Low Distortion: 0.03% ♦ +1.8V CMOS-Logic Compatible ♦ <0.5nA Leakage Current at +25°C Applications Ordering Information USB 1.1 Signal Switching Circuits PART Battery-Operated Equipment TEMP RANGE PIN/BUMPPACKAGE TOP MARK Audio/Video-Signal Routing MAX4717EUB -40°C to +85°C 10 µMAX Headphone Switching MAX4717EBC-T* -40°C to +85°C 12 UCSP-12 Low-Voltage Data-Acquisition Systems MAX4718EUB -40°C to +85°C 10 µMAX Sample-and-Hold Circuits MAX4718EBC-T* -40°C to +85°C 12 UCSP-12 Cell Phones Note: UCSP package requires special solder temperature profile described in the Absolute Maximum Ratings section. — ABH — ABI PDAs *UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and environment. See the UCSP reliability notice in the UCSP Reliability section of this data sheet for more information. UCSP is a trademark of Maxim Integrated Products, Inc. Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd. Pin Configurations/Functional Diagrams/Truth Tables TOP VIEW MAX4717/MAX4718 (BUMP SIDE DOWN) GND NC1 C1 IN1 C2 B1 A1 NC2 A2 IN2 PART SPDT1 SPDT2 MAX4717 4.5Ω 4.5Ω MAX4718 4.5Ω 20Ω MAX4717/MAX4718 COM1 NO1 C3 C4 A3 B4 V+ UCSP A4 COM2 NO2 IN_ NO_ MAX4717/MAX4718 V+ 1 10 NO2 NO1 2 9 COM2 COM1 3 8 IN2 IN1 4 7 NC2 NC1 5 6 GND NC_ 0 OFF ON 1 ON OFF SWITCHES SHOWN FOR LOGIC "0" INPUT µMAX ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX4717/MAX4718 General Description The MAX4717/MAX4718 low-voltage, low on-resistance (RON), dual single-pole/double throw (SPDT) analog switches operate from a single +1.8V to +5.5V supply. These devices are designed for USB 1.1 and audio switching applications. The MAX4717 features two 4.5Ω R ON (max) SPDT switches with 1.2Ω flatness and 0.3Ω matching between channels. The MAX4718 features one 4.5Ω RON (max) SPDT switch and one 20Ω RON (max) SPDT switch. The 20Ω switch has a guaranteed matching and flatness of 0.4Ω and 1.2Ω, respectively. These switches offer breakbefore-make switching (1ns) with tON <80ns and tOFF <40ns at +2.7V. The digital logic inputs are +1.8V logic compatible with a +2.7V to +3.6V supply. MAX4717/MAX4718 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP ABSOLUTE MAXIMUM RATINGS (All Voltages Referenced to GND) V+, IN_...................................................................-0.3V to +6.0V COM_, NO_, NC_ (Note 1) ...........................-0.3V to (V+ + 0.3V) Continuous Current COM_, NO_, NC_ ...........................±100mA Peak Current COM_, NO_, NC_ (pulsed at 1ms, 10% duty cycle)................................±200mA Continuous Power Dissipation (TA = +70°C) 10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW 12-Bump UCSP (derate 11.4mW/°C above +70°C) ....909mW ESD Method 3015.7 .............................................................>2kV Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Bump Temperature (soldering) (Note 2) Infrared (15s) ...............................................................+220°C Vapor Phase (60s) .......................................................+215°C Note 1: Signals on COM_, NO_, or NC_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maximum current rating. Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry standard specification, JEDEC 020A, paragraph 7.6, table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS—Single +3V Supply (V+ = +2.7V to +3.6V, VIH = +1.4V, VIL = +0.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +3.0V, TA = +25°C, unless otherwise noted.) (Notes 3, 4) PARAMETER Analog Signal Range SYMBOL CONDITIONS VCOM_, VNO_, VNC_ TA MIN TMIN to TMAX 0 TYP MAX UNITS V+ V ANALOG SWITCH (Low RON—MAX4717/MAX4718 SPDT 1) +25°C On-Resistance (Note 5) RON V+ = 2.7V, ICOM_ = 10mA; VNO_ or VNC_ = 1.5V ∆RON V+ = 2.7V, ICOM_ = 10mA; VNO_ or VNC_ = 1.5V 3.0 TMIN to TMAX 5 +25°C On-Resistance Match Between Channels (Notes 5, 6) 0.1 TMIN to TMAX RFLAT(ON) V+ = 2.7V, ICOM_ = 10mA; VNO_ or VNC_ = 1.0V, 1.5V, 2.0V NO_, NC_ Off-Leakage Current (Note 8) INO_(OFF), INC_(OFF) V+ = 3.6V, VCOM_ = 0.3V, 3.3V; VNO_ or VNC_ = 3.3V, 0.3V COM_ On-Leakage Current (Note 8) ICOM_(ON) V+ = 3.6V, VCOM_ = 0.3V, 3.3V; VNO_ or VNC_ = 0.3V, 3.3V, or floating 0.6 TMIN to TMAX +25°C -0.5 -1 +25°C -1 TMIN to TMAX -2 +0.01 Ω +0.5 +1 +0.01 Ω 1.2 1.5 TMIN to TMAX Ω 0.3 0.4 +25°C On-Resistance Flatness (Note 7) 4.5 nA +1 +2 nA ANALOG SWITCH (High RON—MAX4718 SPDT 2) +25°C On-Resistance (Note 5) 2 RON V+ = 2.7V, ICOM_ = 10mA; VNO_ or VNC_ = 1.5V 15 TMIN to TMAX _______________________________________________________________________________________ 20 25 Ω 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP (V+ = +2.7V to +3.6V, VIH = +1.4V, VIL = +0.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +3.0V, TA = +25°C, unless otherwise noted.) (Notes 3, 4) PARAMETER SYMBOL CONDITIONS TA MIN +25°C On-Resistance Match Between Channels (Notes 5, 6) ∆RON V+ = 2.7V, ICOM_ = 10mA; VNO_ or VNC_ = 1.5V TYP MAX 0.15 0.4 TMIN to TMAX 0.5 +25°C 0.6 On-Resistance Flatness (Note 7) RFLAT(ON) V+ = 2.7V, ICOM_ = 10mA; VNO_ or VNC_ = 1.0V, 1.5V, 2.0V NO_, NC_ Off-Leakage Current (Note 8) INO_(OFF), INC_(OFF) V+ = 3.6V, VCOM_ = 0.3V, 3.3V; VNO_ or VNC_ = 3.3V, 0.3V COM_ On-Leakage Current (Note 8) ICOM_(ON) V+ = 3.6V, VCOM_ = 0.3V, 3.3V; VNO_ or VNC_ = 0.3V, 3.3V, or floating tON VNO_, VNC_ = 1.5V; RL = 300Ω, CL = 35pF, Figure 1; VIH = 1.5V, VIL = 0V tOFF VNO_, VNC_ = 1.5V; RL = 300Ω, CL = 35pF, Figure 1; VIH = 1.5V, VIL = 0V Break-Before-Make Time Delay (Note 8) tBBM VNO_, VNC_ = 1.5V; RL = 300Ω, CL = 35pF, Figure 2 Skew (Note 8) tSKEW RS = 39Ω, CL = 50pF, Figure 3 TMIN to TMAX 0.15 VGEN = 1.5V, RGEN = 0Ω, CL = 1.0nF, Figure 4 +25°C 5 TMIN to TMAX -0.5 TMIN to TMAX -1 +25°C -1 TMIN to TMAX -2 +0.01 Ω +0.5 +1 +0.01 Ω 1.2 1.5 +25°C UNITS nA +1 +2 nA DYNAMIC CHARACTERISTICS Turn-On Time Turn-Off Time +25°C 40 TMIN to TMAX 100 +25°C 20 TMIN to TMAX Charge Injection Q Off-Isolation VISO Crosstalk (Note 9) VCT On-Channel -3dB Bandwidth Total Harmonic Distortion NO_, NC_ Off-Capacitance f = 10MHz; VNO_, VNC_ = 1VP-P; RL = 50Ω, CL = 5pF, Figure 5 ns 40 50 +25°C TMIN to TMAX 80 ns 8 ns 1 2 ns pC -55 +25°C dB f = 1MHz; VNO_, VNC_ = 1VP-P; RL = 50Ω, CL = 5pF, Figure 5 -80 f = 10MHz; VNO_, VNC_ = 1VP-P; RL = 50Ω, CL = 5pF, Figure 5 -80 +25°C f = 1MHz; VNO_, VNC_ = 1VP-P; RL = 50Ω, CL = 5pF, Figure 5 dB -110 BW Signal = 0dBm, RL = 50Ω, CL = 5pF, Figure 5 +25°C >300 MHz THD VCOM = 2VP-P, RL = 600Ω +25°C 0.03 % +25°C 9 pF CNO_(OFF), f = 1MHz, Figure 6 CNC_(OFF) _______________________________________________________________________________________ 3 MAX4717/MAX4718 ELECTRICAL CHARACTERISTICS—Single +3V Supply (continued) MAX4717/MAX4718 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP ELECTRICAL CHARACTERISTICS—Single +3V Supply (continued) (V+ = +2.7V to +3.6V, VIH = +1.4V, VIL = +0.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +3.0V, TA = +25°C, unless otherwise noted.) (Notes 3, 4) PARAMETER Switch On-Capacitance SYMBOL C(ON) CONDITIONS f = 1MHz, Figure 6 TA MIN +25°C TYP MAX 15 UNITS pF DIGITAL I/O Input Logic High Voltage VIH TMIN to TMAX Input Logic Low Voltage VIL TMIN to TMAX Input Leakage Current IIN V+ = +3.6V, VIN_ = 0 or 5.5V 1.4 V 0.5 V TMIN to TMAX -100 +100 nA TMIN to TMAX 1.8 5.5 V 1 µA POWER SUPPLY Power-Supply Range V+ Supply Current I+ V+ = +5.5V, VIN_ = 0V or V+ TMIN to TMAX ELECTRICAL CHARACTERISTICS—Single +5V Supply (V+ = +4.2V to +5.5V, VIH = +2.0V, VIL = +0.8V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +5.0V, TA = +25°C, unless otherwise noted.) (Notes 3, 4) PARAMETER Analog Signal Range SYMBOL CONDITIONS VCOM_, VNO_, VNC_ TA MIN TMIN to TMAX 0 TYP MAX UNITS V+ V ANALOG SWITCH (Low RON—MAX4717/MAX4718 SPDT 1) +25°C On-Resistance (Note 5) RON V+ = 4.2V, ICOM_ = 10mA; VNO_ or VNC_ = 3.5V ∆RON V+ = 4.2V, ICOM_ = 10mA; VNO_ or VNC_ = 3.5V 1.7 TMIN to TMAX 3.5 +25°C On-Resistance Match Between Channels (Notes 5, 6) 0.1 TMIN to TMAX RFLAT(ON) V+ = 4.2V, ICOM_ = 10mA; VNO_ or VNC_ = 1.0V, 2.0V, 3.5V NO_, NC_ Off-Leakage Current (Note 8) INO_(OFF), INC_(OFF) V+ = 5.5V; VCOM_ = 1.0V, 4.5V; VNO_ or VNC_ = 1.0V, 4.5V COM_ On-Leakage Current (Note 8) ICOM_(ON) V+ = 5.5V; VCOM_ = 1.0V, 4.5V; VNO_ or VNC_ = 1.0V, 4.5V, or floating 4 0.4 TMIN to TMAX -0.5 TMIN to TMAX -1 +25°C -1 TMIN to TMAX -2 +0.01 _______________________________________________________________________________________ Ω +0.5 +1 +0.01 Ω 1.2 1.5 +25°C Ω 0.3 0.4 +25°C On-Resistance Flatness (Note 7) 3 nA +1 +2 nA 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP (V+ = +4.2V to +5.5V, VIH = +2.0V, VIL = +0.8V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +5.0V, TA = +25°C, unless otherwise noted.) (Notes 3, 4) PARAMETER SYMBOL CONDITIONS TA MIN TYP MAX 12 20 UNITS ANALOG SWITCH (High RON—MAX4718 SPDT 2) +25°C On-Resistance (Note 5) RON V+ = 4.2V, ICOM_ = 10mA; VNO_ or VNC_ = 3.5V ∆RON V+ = 4.2V, ICOM_ = 10mA; VNO_ or VNC_ = 3.5V TMIN to TMAX 25 +25°C On-Resistance Match Between Channels (Notes 5, 6) 0.15 TMIN to TMAX RFLAT(ON) V+ = 4.2V, ICOM_ = 10mA; VNO_ or VNC_ = 1.0V, 2.0V, 4.5V NO_, NC_ Off-Leakage Current (Note 8) INO_(OFF), INC_(OFF) V+ = 5.5V; VCOM_ = 1.0V, 4.5V; VNO_ or VNC_= 1.0V, 4.5V COM_ On-Leakage Current (Note 8) ICOM_(ON) V+ = 5.5V, VCOM_ = 1.0V, 4.5V; VNO_ or VNC_ = 1.0V, 4.5V, or floating tON VNO_, VNC_ = 3.0V; RL = 300Ω, CL = 35pF, Figure 1 tOFF VNO_, VNC_ = 3.0V; RL = 300Ω, CL = 35pF, Figure 1 Break-Before-Make Time Delay (Note 8) tBBM VNO_, VNC_ = 3.0V; RL = 300Ω, CL = 35pF, Figure 2 Skew (Note 8) tSKEW RS = 39Ω, CL = 50pF, Figure 3 0.4 0.5 +25°C On-Resistance Flatness (Note 7) 0.4 TMIN to TMAX -0.5 TMIN to TMAX -1 +25°C -1 TMIN to TMAX -2 +0.01 Ω +0.5 +1 +0.01 Ω 1.2 1.5 +25°C Ω nA +1 +2 nA DYNAMIC CHARACTERISTICS +25°C Turn-On Time 30 TMIN to TMAX 100 +25°C Turn-Off Time 20 TMIN to TMAX ns 40 50 +25°C TMIN to TMAX 80 ns 8 ns 1 TMIN to TMAX 0.15 2 ns DIGITAL I/O Input Logic High Voltage VIH TMIN to TMAX Input Logic Low Voltage VIL TMIN to TMAX Input Leakage Current IIN V+ = 5.5V, VIN_ = 0V or V+ TMIN to TMAX 2.0 -100 V 0.8 V +100 nA _______________________________________________________________________________________ 5 MAX4717/MAX4718 ELECTRICAL CHARACTERISTICS—Single +5V Supply (continued) ELECTRICAL CHARACTERISTICS—Single +5V Supply (continued) (V+ = +4.2V to +5.5V, VIH = +2.0V, VIL = +0.8V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +5.0V, TA = +25°C, unless otherwise noted.) (Notes 3, 4) PARAMETER SYMBOL CONDITIONS TA MIN TMIN to TMAX 1.8 TYP MAX UNITS 5.5 V 1 µA POWER SUPPLY Power-Supply Range V+ Supply Current I+ Note 3: Note 4: Note 5: Note 6: Note 7: Note 8: Note 9: TMIN to TMAX V+ = 5.5V, VIN_ = 0V or V+ UCSP parts are 100% tested at +25°C only, and guaranteed by design over the specified temperature range. µMAX parts are 100% tested at TMAX and guaranteed by design over the specified temperature range. The algebraic convention used in this data sheet is where the most negative value is a minimum and the most positive value is a maximum. Guaranteed by design for UCSP parts. ∆RON = RON(MAX) - RON(MIN). Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the specified analog signal ranges. Guaranteed by design. Between any two switches. Typical Operating Characteristics (TA = +25°C, unless otherwise noted.) ON-RESISTANCE vs. VCOM V+ = 1.8V 5 RON (Ω) 6 V+ = 3V LOW RON SWITCH V+ = 2.5V V+ = 3V 4 TA = +85°C TA = +25°C 3 V+ = 4.2V V+ = 5V 2 2 0 1 V+ = 5V LOW RON SWITCH 4 RON (Ω) 8 ON-RESISTANCE vs. VCOM 5 MAX4717/18 toc02 MAX4717/18 toc01 LOW RON SWITCH 4 6 3 TA = +25°C 1 2 3 VCOM (V) 6 4 5 TA = +85°C 2 1 TA = -40°C TA = -40°C 0 MAX4717/18 toc03 ON-RESISTANCE vs. VCOM 10 RON (Ω) MAX4717/MAX4718 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP 0 0 0.5 1.0 1.5 VCOM (V) 2.0 2.5 3.0 0 1 2 3 VCOM (V) _______________________________________________________________________________________ 4 5 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP ON-RESISTANCE vs. VCOM 12 TA = -40°C 11 1 2 3 4 10 5 10 0.5 0 1.0 VCOM (V) LEAKAGE CURRENT vs. TEMPERATURE 2.5 3.0 COM ON-LEAKAGE COM OFF-LEAKAGE 200 V+ = 5V LOW RON SWITCH 800 100 0 600 COM ON-LEAKAGE COM OFF-LEAKAGE 400 60 85 -15 TEMPERATURE (°C) LEAKAGE CURRENT vs. TEMPERATURE 10 35 60 COM ON-LEAKAGE COM OFF-LEAKAGE 100 -100 10 35 TEMPERATURE (°C) -15 40 CL = 1nF V+ = 5V 30 CL = 1nF V+ = 3V 20 60 85 10 35 60 85 SUPPLY CURRENT vs. TEMPERATURE 6 5 4 V+ = 5V 3 2 V+ = 3V 1 0 -15 -40 TEMPERATURE (°C) 10 -40 COM OFF-LEAKAGE 100 85 50 CHARGE INJECTION (pC) 700 300 COM ON-LEAKAGE 300 CHARGE INJECTION vs. VCOM MAX4717/18 toc10 V+ = 5V HIGH RON SWITCH 500 500 TEMPERATURE (°C) 900 5 -100 -40 SUPPLY CURRENT (nA) 35 4 V+ = 3V HIGH RON SWITCH MAX4717/18 toc11 10 3 LEAKAGE CURRENT vs. TEMPERATURE 0 -15 2 700 200 -40 1 0 VCOM (V) 1000 LEAKAGE CURRENT (pA) 400 LEAKAGE CURRENT (pA) 2.0 LEAKAGE CURRENT vs. TEMPERATURE MAX4717/18 toc07 V+ = 3V LOW RON SWITCH LEAKAGE CURRENT (pA) 1.5 VCOM (V) 500 300 TA = +25°C TA = -40°C V+ = 5V 0 11 TA = +25°C MAX4717/18 toc09 12 10 MAX4717/18 toc05 12 V+ = 4.2V TA = +85°C 13 MAX4717/18 toc12 14 13 V+ = 5V HIGH RON SWITCH 14 RON (Ω) V+ = 2.5V 15 LEAKAGE CURRENT (pA) 16 TA = +85°C 14 RON (Ω) RON (Ω) 18 V+ = 3V HIGH RON SWITCH ON-RESISTANCE vs. VCOM MAX4717/18 toc08 V+ = 1.8V 15 MAX4717/18 toc04 HIGH RON SWITCH MAX4717/18 toc06 ON-RESISTANCE vs. VCOM 20 0 0 1 2 3 VCOM (V) 4 5 -40 -15 10 35 60 85 TEMPERATURE (°C) _______________________________________________________________________________________ 7 MAX4717/MAX4718 Typical Operating Characteristics (continued) (TA = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (TA = +25°C, unless otherwise noted.) 40 1.2 VTH0.8 60 tON 40 tOFF V+ = 3V 20 0.4 0 20 0 1 2 3 4 5 0 2.0 1.5 2.5 3.0 3.5 4.0 4.5 5.0 5.5 TURN-ON/OFF TIME vs. SUPPLY VOLTAGE TURN-ON/OFF TIME vs. TEMPERATURE TURN-ON/OFF TIME vs. TEMPERATURE LOW RON SWITCH tON 40 40 tON, V+ = 5.0V 30 20 tOFF 20 50 3.5 4.5 5.5 40 30 tOFF, V+ = 5.0V tOFF, V+ = 3.0V 10 0 2.5 tON, V+ = 5.0V 20 tOFF, V+ = 5.0V tOFF, V+ = 3.0V 10 0 HIGH RON SWITCH tON, V+ = 3.0V tON/tOFF (ns) 60 tON, V+ = 3.0V 50 5.5 60 MAX4717/18 toc17 60 tON/tOFF (ns) 80 0 -40 -15 10 35 60 85 -40 -15 10 35 85 60 SUPPLY VOLTAGE (V) TEMPERATURE (°C) TEMPERATURE (°C) RISE/FALL-TIME DELAY vs. SUPPLY VOLTAGE RISE/FALL-TIME DELAY vs. TEMPERATURE RISE TIME TO FALL TIME MISMATCH vs. SUPPLY VOLTAGE 1.5 RISE DELAY 1.0 0.5 FALL DELAY 0 1.0 RISE DELAY FALL DELAY 0.5 3.5 SUPPLY VOLTAGE (V) 4.5 5.5 INPUT RISE/FALL TIME = 15ns FIGURE 4, CL = 50pF LOW RON SWITCH 300 200 100 0 2.5 400 MAX4717/18 toc21 1.5 INPUT RISE/FALL TIME = 15ns FIGURE 4, CL = 50pF V+ = 4.2V LOW RON SWITCH MISMATCH (ps) 2.0 2.0 MAX4717/18 toc20 INPUT RISE/FALL TIME = 15ns FIGURE 4, CL = 50pF LOW RON SWITCH OUTPUT RISE/FALL-TIME DELAY (ns) MAX4717/18 toc19 3.0 1.5 4.5 SUPPLY VOLTAGE (V) HIGH RON SWITCH 2.5 3.5 SUPPLY VOLTAGE (V) 100 1.5 2.5 1.5 LOGIC LEVEL (V) MAX4717/18 toc16 0 tON/tOFF (ns) 80 VTH+ MAX4717/18 toc18 60 LOW RON SWITCH tON/tOFF (ns) V+ = 5V 100 MAX4717/18 toc14 1.6 LOGIC THRESHOLD (V) 80 SUPPLY CURRENT (µA) 2.0 MAX4717/18 toc13 100 8 TURN-ON/OFF TIME vs. SUPPLY VOLTAGE LOGIC THRESHOLD vs. SUPPLY VOLTAGE MAX4717/18 toc15 SUPPLY CURRENT vs. LOGIC LEVEL OUTPUT RISE/FALL-TIME DELAY (ps) MAX4717/MAX4718 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP 0 -40 -15 10 35 TEMPERATURE (°C) 60 85 1.5 2.5 3.5 SUPPLY VOLTAGE (V) _______________________________________________________________________________________ 4.5 5.5 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP MAX4717/18 toc23 300 150 200 100 50 100 0 0 0 10 35 60 85 2.5 1.5 TEMPERATURE (°C) 3.5 4.5 SUPPLY VOLTAGE (V) 20 MAX4717/18 toc25 0 -20 -20 ON-LOSS (dB) -40 OFF-ISOLATION -80 -100 HIGH RON SWITCH V+ = 3V/5V 0 ON-LOSS -60 35 60 85 FREQUENCY RESPONSE LOW RON SWITCH V+ = 3V/5V 10 TEMPERATURE (°C) FREQUENCY RESPONSE 20 -15 -40 5.5 ON-LOSS -40 -60 OFF-ISOLATION -80 -100 CROSSTALK -120 -140 0.0001 0.01 -140 0.0001 100 1 CROSSTALK -120 FREQUENCY (MHz) 1 100 FREQUENCY (MHz) TOTAL HARMONIC DISTORTION vs. FREQUENCY TOTAL HARMONIC DISTORTION vs. FREQUENCY 1 MAX4717/18 toc27 1 0.01 THD (%) V+ = 3V LOW RON SWITCH RL = 600Ω 0.1 MAX4717/18 toc28 -15 ON-LOSS (dB) -40 INPUT RISE/FALL TIME = 15ns FIGURE 4, CL = 50pF V+ = 4.2V MAX4717 ONLY MAX4717/18 toc26 50 200 SKEW (ps) 100 SKEW vs. TEMPERATURE INPUT RISE/FALL TIME = 15ns FIGURE 4, CL = 50pF MAX4717 ONLY SKEW (ps) INPUT RISE/FALL TIME = 15ns FIGURE 4, CL = 50pF V+ = 4.2V LOW RON SWITCH THD (%) MISMATCH (ps) 150 SKEW vs. SUPPLY VOLTAGE 400 MAX4717/18 toc22 200 MAX4717/18 toc24 RISE TIME TO FALL TIME MISMATCH vs. TEMPERATURE V+ = 3V HIGH RON SWITCH RL = 600Ω 0.1 0.01 0.01 10 100 1k FREQUENCY (Hz) 10k 100k 10 100 1k 10k 100k FREQUENCY (Hz) _______________________________________________________________________________________ 9 MAX4717/MAX4718 Typical Operating Characteristics (continued) (TA = +25°C, unless otherwise noted.) MAX4717/MAX4718 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP Pin Description PIN NAME FUNCTION UCSP µMAX A1 7 NC2 Analog Switch 2—Normally Closed Terminal A2 8 IN2 Digital Control Input for Analog Switch 2 A3 9 COM2 A4 10 NO2 Analog Switch 2—Normally Open Terminal B1 6 GND Ground B4 1 V+ C1 5 NC1 Analog Switch 1—Normally Closed Terminal C2 4 IN1 Digital Control Input for Analog Switch 1 C3 3 COM1 C4 2 NO1 Analog Switch 2—Common Terminal Positive-Supply Voltage Input Analog Switch 1—Common Terminal Analog Switch 1—Normally Open Terminal Detailed Description The MAX4717/MAX4718 high-speed, low-voltage, low onresistance (RON), dual SPDT analog switches operate from a single +1.8V to +5.5V supply. The switches feature break-before-make switching operation and fast switching speeds (tON = 80ns (max), tOFF = 40ns (max)). These switches have low 15pF on-channel capacitance, which allows for 12Mbps switching of the data signals for USB 1.0/1.1 applications. The MAX4717 is designed to switch D+ and D- USB signals with a guaranteed skew of less than 2ns (see Figure 4) as measured from 50% of the input signal to 50% of the output signal. Applications Information Digital Control Inputs The MAX4717/MAX4718 logic inputs accept up to +5.5V regardless of supply voltage. For example, with a +3.3V supply, IN_ can be driven low to GND and high to +5.5V allowing for mixing of logic levels in a system. Driving the control logic inputs rail-to-rail minimizes power consumption. For a +3V supply voltage, the logic thresholds are 0.5V (low) and 1.4V (high); for a 10 +5V supply voltage, the logic thresholds are 0.8V (low) and 2.0V (high). Analog Signal Levels The on-resistance of the MAX4717/MAX4718 changes very little for analog input signals across the entire supply voltage range (see the Typical Operating Characteristics). The switches are bidirectional, so the NO_, NC_, and COM_ pins can be either inputs or outputs. Power-Supply Sequencing and Overvoltage Protection Caution: Do not exceed the absolute maximum ratings because stresses beyond the listed ratings may cause permanent damage to the device. Proper power-supply sequencing is recommended for all CMOS devices. Always apply V+ before applying analog signals, especially if the analog signal is not current-limited. UCSP Package Considerations For general UCSP package information and PC layout considerations, please refer to the Maxim Application Note (Wafer-Level Chip-Scale Package). UCSP Reliability The chip-scale package (UCSP) represents a unique packaging form factor that may not perform equally to a packaged product through traditional mechanical reliability tests. UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and usage environment. The user should closely review these areas when considering use of a UCSP package. Performance through Operating Life Test and Moisture Resistance remains uncompromised as it is primarily determined by the wafer-fabrication process. Mechanical stress performance is a greater consideration for a UCSP package. UCSPs are attached through direct solder contact to the user’s PC board, foregoing the inherent stress relief of a packaged product lead frame. Solder joint contact integrity must be considered. Information on Maxim’s qualification plan, test data, and recommendations are detailed in the UCSP application note, which can be found on Maxim’s website at www.maxim-ic.com. Chip Information TRANSISTOR COUNT: 235 PROCESS: BiCMOS ______________________________________________________________________________________ 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP MAX4717/ MAX4718 V+ VN_ LOGIC INPUT V+ COM_ NO_ 50% VIL VOUT OR NC_ RL t OFF CL IN_ VOUT GND LOGIC INPUT SWITCH OUTPUT 0.9 x V0UT 0.9 x VOUT 0V t ON CL INCLUDES FIXTURE AND STRAY CAPACITANCE. RL VOUT = VN_ RL + RON ( t r < 5ns t f < 5ns VIH IN DEPENDS ON SWITCH CONFIGURATION; INPUT POLARITY DETERMINED BY SENSE OF SWITCH. ) Figure 1. Switching Time V+ MAX4717/ MAX4718 LOGIC INPUT V+ VN_ NC_ RL 300Ω IN_ LOGIC INPUT 50% VIL VOUT COM_ NO_ VIH CL 35pF GND 0.9 x VOUT VOUT tBBM CL INCLUDES FIXTURE AND STRAY CAPACITANCE. Figure 2. Break-Before-Make Interval ______________________________________________________________________________________ 11 MAX4717/MAX4718 Test Circuits/Timing Diagrams 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP MAX4717/MAX4718 Test Circuits/Timing Diagrams (continued) RS IN+ RISE TIME DELAY = |tINRISE - tOUTRISE| MAX4717 NC1 OR NO1 COM1 OUT+ CL RS IN- NC2 OR NO2 COM2 FALL TIME DELAY = |tINFALL - tOUTFALL| RISE TIME TO FALL TIME MISMATCH = |tOUTFALL - tOUTRISE| OUTCL IN1 IN2 VIL TO VIH tINFALL V+ VIN+ tINRISE 90% 90% 50% 10% 0V 10% V+ VIN- 50% 0V tOUTFALL V+ tOUTRISE 90% 90% VOUT+ 50% 10% 0V 10% V+ 50% VOUT0V tSKEW Figure 3. Output Signal Skew 12 ______________________________________________________________________________________ 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP V+ MAX4717/ MAX4718 ∆VOUT V+ RGEN VOUT COM_ NC_ OR NO_ VOUT IN OFF CL V GEN GND OFF ON IN_ VIL TO VIH IN ON OFF OFF Q = (∆V OUT )(C L ) LOGIC INPUT WAVEFORMS INVERTED FOR SWITCHES THAT HAVE THE OPPOSITE LOGIC SENSE. Figure 4. Charge Injection +5V 10nF V OFF-ISOLATION = 20log OUT VIN NETWORK ANALYZER 0V OR V+ V+ IN_ NC1 MAX4717/ MAX4718 VOUT NO1* 50Ω 50Ω VIN COM1 GND V ON-LOSS = 20log OUT VIN 50Ω MEAS 50Ω MEASUREMENTS ARE STANDARDIZED AGAINST SHORTS AT IC TERMINALS. OFF-ISOLATION IS MEASURED BETWEEN COM_ AND "OFF" NO_ OR NC_ TERMINAL ON EACH SWITCH. ON-LOSS IS MEASURED BETWEEN COM_ AND "ON" NO_ OR NC_ TERMINAL ON EACH SWITCH. CROSSTALK IS MEASURED FROM ONE CHANNEL TO THE OTHER CHANNEL. SIGNAL DIRECTION THROUGH SWITCH IS REVERSED; WORST VALUES ARE RECORDED. REF V CROSSTALK = 20log OUT VIN 50Ω *FOR CROSSTALK THIS PIN IS NO2. NC2 AND COM2 ARE OPEN. Figure 5. On-Loss, Off-Isolation, and Crosstalk 10nF V+ V+ COM_ MAX4717/ MAX4718 IN CAPACITANCE METER f = 1MHz VIL OR VIH NC_ or NO_ GND Figure 6. Channel Off/On-Capacitance ______________________________________________________________________________________ 13 MAX4717/MAX4718 Test Circuits/Timing Diagrams (continued) Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) 12L, UCSP 4x3.EPS MAX4717/MAX4718 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP 14 ______________________________________________________________________________________ 4.5Ω/20Ω, 300MHz Bandwidth, Dual SPDT Analog Switches in UCSP 10LUMAX.EPS e 4X S 10 INCHES 10 H ÿ 0.50±0.1 0.6±0.1 1 1 0.6±0.1 BOTTOM VIEW TOP VIEW D2 MILLIMETERS MAX DIM MIN 0.043 A 0.006 A1 0.002 A2 0.030 0.037 0.120 D1 0.116 0.118 0.114 D2 0.116 0.120 E1 E2 0.114 0.118 H 0.187 0.199 L 0.0157 0.0275 L1 0.037 REF b 0.007 0.0106 e 0.0197 BSC c 0.0035 0.0078 0.0196 REF S α 0∞ 6∞ MAX MIN 1.10 0.15 0.05 0.75 0.95 3.05 2.95 3.00 2.89 3.05 2.95 2.89 3.00 4.75 5.05 0.40 0.70 0.940 REF 0.177 0.270 0.500 BSC 0.090 0.200 0.498 REF 0∞ 6∞ E2 GAGE PLANE A2 c A b D1 A1 α E1 L L1 FRONT VIEW SIDE VIEW PROPRIETARY INFORMATION TITLE: PACKAGE OUTLINE, 10L uMAX/uSOP APPROVAL DOCUMENT CONTROL NO. 21-0061 REV. I 1 1 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 15 © 2002 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products. MAX4717/MAX4718 Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.)