CPC3730 INTEGRATED CIRCUITS DIVISION RDS(on) (max) IDSS (min) Package 350VP 30 140mA SOT-89 Low RDS(on) at Cold Temperatures RDS(on) 30 max. at 25ºC High Input Impedance High Breakdown Voltage: 350VP Low VGS(off) Voltage: -1.6 to -3.9V Small Package Size: SOT-89 Description The CPC3730 is an N-channel, depletion mode, field effect transistor (FET) that utilizes IXYS Integrated Circuits Division’s proprietary third-generation vertical DMOS process. The third-generation process realizes world class, high voltage MOSFET performance in an economical silicon gate process. Our vertical DMOS process yields a robust device, with high input impedance, for use in high power applications. The CPC3730 is a highly reliable FET device that has been used extensively in our solid state relays for industrial and telecommunications applications. This device excels in power applications requiring low drain-source resistance, particularly in cold environments such as automotive ignition modules. The CPC3730 offers a low, 30 maximum, on-state resistance at 25ºC. Applications • • • • • • PRELIMINARY V(BR)DSX / V(BR)DGX Features • • • • • • 350V N-Channel Depletion-Mode FET Ignition Modules Normally-On Switches Solid State Relays Converters Telecommunications Power Supply The CPC3730 has a minimum breakdown voltage of 350VP , and is available in an SOT-89 package. As with all MOS devices, the FET structure prevents thermal runaway and thermal-induced secondary breakdown. Ordering Information Part # CPC3730CTR Description N-Channel Depletion Mode FET, SOT-89 Pkg. Tape and Reel (1000/Reel) Circuit Symbol Package Pinout D D G G D S S (SOT-89) DS-CPC3730-R00K PRELIMINARY 1 INTEGRATED CIRCUITS DIVISION CPC3730 PRELIMINARY Absolute Maximum Ratings @ 25ºC Parameter Drain-to-Source Voltage Gate-to-Source Voltage Pulsed Drain Current Total Package Dissipation Junction Temperature Operational Temperature Storage Temperature 1 Ratings 350 ±15 600 1.4 1 150 -55 to +125 -55 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP VP mA W ºC ºC ºC Mounted on FR4 board 1"x1"x0.062" Electrical Characteristics @ 25ºC (Unless Otherwise Noted) Parameter Symbol Conditions Drain-to-Source Breakdown Voltage V(BR)DSX VGS= -5V, ID=100µA 350 Gate-to-Source Off Voltage VGS(off) IDS= 5V, ID=1mA -1.6 Typ Max Units - - VP - -3.9 V dVGS(off)/dT VDS= 5V, ID=1A - - 4.5 mV/ºC Gate Body Leakage Current IGSS VGS=±15V, VDS=0V - - 100 nA Drain-to-Source Leakage Current ID(off) VGS= -5V, VDS=350V - - 1 A VGS= -5V, VDS=280V, TA=125ºC - - 1 mA Saturated Drain-to-Source Current IDSS VGS= 0V, VDS=15V 140mA - - mA Static Drain-to-Source On-State Resistance Change in RDS(on) with Temperatures RDS(on) VGS= 0V, ID=140mA - - 30 dRDS(on)/dT VGS= 0V, ID=140mA - - 1.1 %/ºC ID= 100mA, VDS = 10V 150 m Forward Transconductance GFS Input Capacitance CISS Common Source Output Capacitance COSS Reverse Transfer Capacitance CRSS Turn-On Delay Time td(on) Rise Time VGS= -5V VDS= 25V f= 1MHz tr Turn-Off Delay Time td(off) Fall time tf - - - 100 200 20 100 5 80 Change in VGS(off) with Temperatures Min pF 20 VDD= 25V ID= 150mA VGS= 0V to -10V Rgen= 50 - 10 20 - ns 50 Source-Drain Diode Voltage Drop VSD VGS= -5V, ISD= 150mA - 0.6 1.8 V Thermal Resistance (Junction to Ambient) RJA - - 90 - ºC/W Switching Waveform & Test Circuit VDD RL 0V 90% PULSE GENERATOR INPUT -10V 10% t on t d(on) VDS OUTPUT Rgen t off tf t d(off) tr D.U.T. 90% 90% INPUT OUTPUT 0V 2 10% 10% PRELIMINARY R00K INTEGRATED CIRCUITS DIVISION CPC3730 PRELIMINARY PERFORMANCE DATA* Output Characteristics (TA=25ºC) VGS=0.0 -0.4 ID (mA) ID (mA) 0 120.0 VGS=-1.5 +125ºC 80.0 +25ºC 60.0 -40ºC VGS=-2.0 2 3 4 5 -2.0 20.0 -2.4 0 -3.0 6 VDS (V) -2.0 VGS (V) RON vs. Temperature (VGS=0V, ID=80mA) Power Dissipation vs. Ambient Temperature 36.0 1.4 30.0 1.2 Power (W) 1.6 24.0 18.0 12.0 -2.5 -1.5 -3.0 -40 -1.0 0 40 80 Temperature (ºC) 120 Max Rated Safe Operating Area 1 1.0 0.8 0.6 0.4 6.0 -1.6 Drain Current (A) 1 -1.2 40.0 42.0 0 -0.8 100.0 VGS=-1.0 0 RON (:) 140.0 VGS(off) (V) 150.0 135.0 120.0 105.0 90.0 75.0 60.0 45.0 30.0 15.0 0 VGS(off) vs. Temperature (VDS=10V, ID=1mA) Transfer Characteristics (VDS=5V) 0.1 0.01 0.2 0.0 -40 0 40 80 Temperature (ºC) 120 0 20 40 60 80 100 120 Ambient Temperature (ºC) 50 45 40 35 30 25 20 15 10 5 0 0.00 0.001 0.1 1 10 100 Drain-Source Voltage (V) 1000 Capacitance vs. Drain-Source Voltage (VGS=-5V) 160 140 VISS 120 C (pF) RON (:) On-Resistance vs. Drain Current (VGS=0V) 140 100 80 60 VOSS 40 20 0.04 0.12 0.08 ID (A) 0.16 0.2 0 VRSS 0 10 20 VDS (V) 30 40 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R00K PRELIMINARY 3 INTEGRATED CIRCUITS DIVISION CPC3730 PRELIMINARY Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC3730C MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC3730C 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. 4 PRELIMINARY R00K INTEGRATED CIRCUITS DIVISION CPC3730 PRELIMINARY MECHANICAL DIMENSIONS CPC3730C 1.626 / 1.829 (0.064 / 0.072) 1.397 / 1.600 (0.055 / 0.063) R 0.254 (R 0.010) PCB Land Pattern 1.90 (0.075) 3.937 / 4.242 (0.155 / 0.167) 45º 2.286 / 2.591 (0.090 / 0.102) 2.45 (0.096) 1.40 (0.055) Pin 1 0.889 / 1.194 (0.035 / 0.047) 0.356 / 0.483 (0.014 / 0.019) 0.432 / 0.559 (0.017 / 0.022) 50º 0.356 / 0.432 (0.014 / 0.017) 0.864 / 1.016 (0.034 / 0.040) 4.394 / 4.597 (0.173 / 0.181) 1.118 / 1.270 (0.044 / 0.050) 50º 5.00 (0.197) 1.90 (0.074) 0.432 / 0.508 (0.017 / 0.020) 0.60 (0.024) TYP 3 2.845 / 2.997 (0.112 / 0.118) 1.422 / 1.575 (0.056 / 0.062) 2.921 / 3.073 (0.115 / 0.121) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) CPC3730CTR Tape & Reel 177.8 Dia (7.00 Dia) 5.50 ± 0.05 (0.217 ± 0.002) Top Cover Tape Thickness 0.102 Max (0.004 Max) 2.00 ± 0.05 (0.079 ± 0.002) 4.00 ± 0.1 (0.157 ± 0.004) 1.75 ± 0.1 (0.069 ± 0.004) W=12.00 ± 0.3 (0.472 ± 0.012) B0=4.60 ± 0.1 (0.181 ± 0.004) K0=1.80 ± 0.1 (0.071 ± 0.004) Embossed Carrier A0=4.80 ± 0.1 (0.189 ± 0.004) P=8.00 ± 0.1 (0.315 ± 0.004) Embossment Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 5 PRELIMINARY Specification: DS-CPC3730-R00K ©Copyright 2014, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 8/7/2014