Material Content Data Sheet Sales Product Name TLE42994E V33 MA# MA000970130 Package PG-SSOP-14-2 Issued 28. August 2013 Weight* 83.48 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 2.995 3.59 0.009 0.01 0.034 0.04 413 0.689 0.83 8254 27.978 33.51 34.39 335129 343899 0.153 0.18 0.18 1830 1830 0.097 0.12 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.59 35880 35880 103 1159 4.451 5.33 43.830 52.50 57.95 525010 579481 0.976 1.17 1.17 11692 11692 0.768 0.92 0.92 9195 9195 0.376 0.45 1.128 1.35 53312 4506 1.80 13517 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 18023 1000000