MC10EL01, MC100EL01 5VECL 4-Input OR/NOR Description The MC10EL/100EL01 is a 4-input OR/NOR gate. The device is functionally equivalent to the E101 device with higher performance capabilities. With propagation delays and output transition times significantly faster than the E101, the EL01 is ideally suited for those applications which require the ultimate in AC performance. The 100 series contains temperature compensation. • • • • • • • 1 > 100 V Machine Model PECL Mode Operating Range: VCC = 4.2 V to 5.7 V with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = −4.2 V to −5.7 V Internal Input Pulldown Resistors Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test Moisture Sensitivity Level 1 For Additional Information, see Application Note AND8003/D Flammability Rating: UL 94 V−0 @ 0.125 in, Oxygen Index: 28 to 34 Transistor Count = 46 devices Pb−Free Packages are Available SOIC−8 D SUFFIX CASE 751 8 1 TSSOP−8 DT SUFFIX CASE 948R 8 8 HEL01 ALYW G 1 1 8 1 DFN8 MN SUFFIX CASE 506AA D0 1 8 VCC D1 2 7 Q KEL01 ALYW G H = MC10 K = MC100 4M = MC10 2A = MC100 A = Assembly Location 8 HL01 ALYWG G 1 L Y W M G 4 1 KL01 ALYWG G 2A M G G 8 • 230 ps Propagation Delay • ESD Protection: > 1 kV Human Body Model, • MARKING DIAGRAMS* 4M M G G Features http://onsemi.com 1 4 = Wafer Lot = Year = Work Week = Date Code = Pb−Free Package (Note: Microdot may be in either location) D2 3 6 Q D3 4 5 VEE *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Figure 1. Logic Diagram and Pinout Assignment © Semiconductor Components Industries, LLC, 2006 December, 2006 − Rev. 5 1 Publication Order Number: MC10EL01/D MC10EL01, MC100EL01 Table 1. PIN DESCRIPTION PIN FUNCTION D0−D3 Q, Q VCC VEE ECL Data Inputs ECL Data Outputs Positive Supply Negative Supply EP Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open. Table 2. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 8 V VEE NECL Mode Power Supply VCC = 0 V −8 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V Iout Output Current Continuous Surge 50 100 mA mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm 8 SOIC 8 SOIC 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board 8 SOIC 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm 8 TSSOP 8 TSSOP 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board 8 TSSOP 41 to 44 ± 5% °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 °C/W °C/W Tsol Wave Solder <2 to 3 sec @ 248°C <2 to 3 sec @ 260°C 265 265 °C Pb Pb−Free VI VCC VI VEE Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 MC10EL01, MC100EL01 Table 3. 10EL SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V (Note 1) −40°C Symbol Characteristic Min 25°C Typ Max 14 17 Min 85°C Typ Max 14 17 Min Typ Max Unit 14 17 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) 3920 4010 4110 4020 4105 4190 4090 4185 4280 mV VOL Output LOW Voltage (Note 2) 3050 3200 3350 3050 3210 3370 3050 3227 3405 mV VIH Input HIGH Voltage 3770 4110 3870 4190 3940 4280 mV VIL Input LOW Voltage 3050 3500 3050 3520 3050 3555 mV IIH Input HIGH Current 150 mA IIL Input LOW Current 150 0.5 150 0.5 0.3 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.25 V / −0.5 V. 2. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 4. 10EL SERIES NECL DC CHARACTERISTICS VCC = 0.0 V; VEE = −5.0 V (Note 3) −40°C Symbol Characteristic Typ Max 14 17 −1080 −990 −890 Output LOW Voltage (Note 4) −1950 −1800 VIH Input HIGH Voltage VIL Input LOW Voltage IIH Input HIGH Current IIL Input LOW Current IEE Power Supply Current VOH Output HIGH Voltage (Note 4) VOL Min 25°C Min 85°C Typ Max 14 17 −980 −895 −810 −1650 −1950 −1790 −1230 −890 −1950 −1500 Typ Max Unit 14 17 mA −910 −815 −720 mV −1630 −1950 −1773 −1595 mV −1130 −810 −1060 −720 mV −1950 −1480 −1950 −1445 mV 150 mA 150 0.5 Min 150 0.5 0.3 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3. Input and output parameters vary 1:1 with VCC. VEE can vary +0.25 V / −0.5 V. 4. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. http://onsemi.com 3 MC10EL01, MC100EL01 Table 5. 100EL SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V (Note 5) −40°C Symbol Characteristic Min 25°C Typ Max 14 17 Min 85°C Typ Max 14 17 Min Typ Max Unit 16 20 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 6) 3915 3995 4120 3975 4045 4120 3975 4050 4120 mV VOL Output LOW Voltage (Note 6) 3170 3305 3445 3190 3295 3380 3190 3295 3380 mV VIH Input HIGH Voltage 3835 4120 3835 4120 3835 4120 mV VIL Input LOW Voltage 3190 3525 3190 3525 3190 3525 mV IIH Input HIGH Current 150 mA IIL Input LOW Current 150 0.5 150 0.5 0.5 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V. 6. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 6. 100EL SERIES NECL DC CHARACTERISTICS VCC = 0.0 V; VEE = −5.0 V (Note 7) −40°C Symbol Characteristic Min Typ 25°C Max Min Typ 85°C Max Min Typ Max Unit IEE Power Supply Current 14 17 14 17 16 20 mA VOH Output HIGH Voltage (Note 8) −1085 −1005 −880 −1025 −955 −880 −1025 −955 −880 mV VOL Output LOW Voltage (Note 8) −1830 −1695 −1555 −1810 −1705 −1620 −1810 −1705 −1620 mV VIH Input HIGH Voltage −1165 −880 −1165 −880 −1165 −880 mV VIL Input LOW Voltage −1810 −1475 −1810 −1475 −1810 −1475 mV IIH Input HIGH Current 150 mA IIL Input LOW Current 150 0.5 150 0.5 0.5 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 7. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V. 8. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 7. AC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V or VCC = 0.0 V; VEE = −5.0 V (Note 9) −40°C Symbol Characteristic fMAX Maximum Toggle Frequency tPLH tPHL Propagation Delay to Output tJITTER Cycle−to−Cycle Jitter tr tf Output Rise/Fall Times Q (20% − 80%) Min Typ 25°C Max Min TBD 70 220 225 Max Min TBD 370 130 TBD 100 Typ 85°C 230 330 150 TBD 350 100 225 Typ Max TBD 250 GHz 350 TBD 350 100 225 Unit ps ps 350 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 9. 10 Series: VEE can vary +0.25 V / −0.5 V. 100 Series: VEE can vary +0.8 V / −0.5 V. http://onsemi.com 4 MC10EL01, MC100EL01 Zo = 50 W Q D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 3.0 V Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) ORDERING INFORMATION Package Shipping† SOIC−8 98 Units / Rail MC10EL01DG SOIC−8 (Pb−Free) 98 Units / Rail MC10EL01DR2 SOIC−8 2500 / Tape & Reel MC10EL01DR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC10EL01DT TSSOP−8 100 Units / Rail MC10EL01DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC10EL01DTR2 TSSOP−8 2500 / Tape & Reel MC10EL01DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel MC10EL01MNR4 DFN8 1000 / Tape & Reel DFN8 (Pb−Free) 1000 / Tape & Reel SOIC−8 98 Units / Rail MC100EL01DG SOIC−8 (Pb−Free) 98 Units / Rail MC100EL01DR2 SOIC−8 2500 / Tape & Reel MC100EL01DR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC100EL01DT TSSOP−8 100 Units / Rail MC100EL01DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC100EL01DTR2 TSSOP−8 2500 / Tape & Reel MC100EL01DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel MC100EL01MNR4 DFN8 1000 / Tape & Reel DFN8 (Pb−Free) 1000 / Tape & Reel Device MC10EL01D MC10EL01MNR4G MC100EL01D MC100EL01MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 MC10EL01, MC100EL01 Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 6 MC10EL01, MC100EL01 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AH −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 1 0.25 (0.010) M Y M 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− H 0.10 (0.004) D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC10EL01, MC100EL01 PACKAGE DIMENSIONS TSSOP−8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R−02 ISSUE A 8x 0.15 (0.006) T U 0.10 (0.004) S 2X L/2 L 8 5 1 PIN 1 IDENT 0.15 (0.006) T U K REF S M T U V S 0.25 (0.010) B −U− 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S M A −V− F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E http://onsemi.com 8 DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ MC10EL01, MC100EL01 PACKAGE DIMENSIONS DFN8 CASE 506AA−01 ISSUE D D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B PIN ONE REFERENCE 2X 0.10 C 2X ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ 0.10 C TOP VIEW 0.08 C SEATING PLANE MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.20 −−− 0.25 0.35 A 0.10 C 8X DIM A A1 A3 b D D2 E E2 e K L E (A3) SIDE VIEW A1 C D2 e e/2 4 1 8X L E2 K 8 5 8X b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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