Freescale Semiconductor
Document Number: MPC8548E
Rev. 9, 02/2012
Data Sheet: Technical Data
MPC8548E PowerQUICC III
Integrated Processor
Hardware Specifications
1
Overview
This section provides a high-level overview of the device
features. The following figure shows the major functional
units within the device.
Although this document is written from the perspective of
the MPC8548E, most of the material applies to the other
family members, such as MPC8547E, MPC8545E, and
MPC8543E. When specific differences occur, such as pinout
differences and processor frequency ranges, they are
identified as such.
For specific PVR and SVR numbers, see the MPC8548E
PowerQUICC III Integrated Host Processor Reference
Manual.
© 2012 Freescale Semiconductor, Inc. All rights reserved.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . 10
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 15
Input Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 19
DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 20
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Enhanced Three-Speed Ethernet (eTSEC) . . . . . . . . 27
Ethernet Management Interface Electrical
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Programmable Interrupt Controller . . . . . . . . . . . . . 53
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
GPOUT/GPIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
PCI/PCI-X . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 65
PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Serial RapidIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 91
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
System Design Information . . . . . . . . . . . . . . . . . . 135
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 145
Document Revision History . . . . . . . . . . . . . . . . . . 148
Overview
DDR
SDRAM
DDR/DDR2/
Memory Controller
Security
Engine
Flash
SDRAM
GPIO
Local Bus Controller
XOR
Engine
IRQs
Serial
Programmable Interrupt
Controller (PIC)
DUART
I2C
I2C
Controller
I2C
I2C
Controller
MII, GMII, TBI,
RTBI, RGMII,
RMII
MII, GMII, TBI,
RTBI, RGMII,
RMII
MII, GMII, TBI,
RTBI, RGMII,
RMII
RTBI, RGMII,
RMII
eTSEC
10/100/1Gb
eTSEC
10/100/1Gb
eTSEC
10/100/1Gb
eTSEC
10/100/1Gb
e500
Coherency
Module
512-Kbyte
L2 Cache/
SRAM
Core Complex
Bus
e500 Core
32-Kbyte L1
Instruction
Cache
32-Kbyte
L1 Data
Cache
Serial RapidIO
or
PCI Express
4x RapidIO
x8 PCI Express
OceaN
Switch
Fabric
PCI 32-bit
66 MHz
32-bit PCI Bus Interface
(If 64-bit not used)
32-bit PCI/
64-bit PCI/PCI-X
Bus Interface
PCI/PCI-X
133 MHz
4-Channel DMA
Controller
Figure 1. Device Block Diagram
1.1
Key Features
The following list provides an overview of the device feature set:
• High-performance 32-bit core built on Power Architecture® technology.
— 32-Kbyte L1 instruction cache and 32-Kbyte L1 data cache with parity protection. Caches can
be locked entirely or on a per-line basis, with separate locking for instructions and data.
— Signal-processing engine (SPE) APU (auxiliary processing unit). Provides an extensive
instruction set for vector (64-bit) integer and fractional operations. These instructions use both
the upper and lower words of the 64-bit GPRs as they are defined by the SPE APU.
— Double-precision floating-point APU. Provides an instruction set for double-precision (64-bit)
floating-point instructions that use the 64-bit GPRs.
— 36-bit real addressing
— Embedded vector and scalar single-precision floating-point APUs. Provide an instruction set
for single-precision (32-bit) floating-point instructions.
— Memory management unit (MMU). Especially designed for embedded applications. Supports
4-Kbyte to 4-Gbyte page sizes.
— Enhanced hardware and software debug support
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Freescale Semiconductor
Overview
— Performance monitor facility that is similar to, but separate from, the device performance
monitor
The e500 defines features that are not implemented on this device. It also generally defines some features
that this device implements more specifically. An understanding of these differences can be critical to
ensure proper operations.
•
•
•
512-Kbyte L2 cache/SRAM
— Flexible configuration.
— Full ECC support on 64-bit boundary in both cache and SRAM modes
— Cache mode supports instruction caching, data caching, or both.
— External masters can force data to be allocated into the cache through programmed memory
ranges or special transaction types (stashing).
— 1, 2, or 4 ways can be configured for stashing only.
— Eight-way set-associative cache organization (32-byte cache lines)
— Supports locking entire cache or selected lines. Individual line locks are set and cleared through
Book E instructions or by externally mastered transactions.
— Global locking and Flash clearing done through writes to L2 configuration registers
— Instruction and data locks can be Flash cleared separately.
— SRAM features include the following:
– I/O devices access SRAM regions by marking transactions as snoopable (global).
– Regions can reside at any aligned location in the memory map.
– Byte-accessible ECC is protected using read-modify-write transaction accesses for
smaller-than-cache-line accesses.
Address translation and mapping unit (ATMU)
— Eight local access windows define mapping within local 36-bit address space.
— Inbound and outbound ATMUs map to larger external address spaces.
– Three inbound windows plus a configuration window on PCI/PCI-X and PCI Express
– Four inbound windows plus a default window on RapidIO™
– Four outbound windows plus default translation for PCI/PCI-X and PCI Express
– Eight outbound windows plus default translation for RapidIO with segmentation and
sub-segmentation support
DDR/DDR2 memory controller
— Programmable timing supporting DDR and DDR2 SDRAM
— 64-bit data interface
— Four banks of memory supported, each up to 4 Gbytes, to a maximum of 16 Gbytes
— DRAM chip configurations from 64 Mbits to 4 Gbits with ×8/×16 data ports
— Full ECC support
— Page mode support
– Up to 16 simultaneous open pages for DDR
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Overview
•
•
– Up to 32 simultaneous open pages for DDR2
— Contiguous or discontiguous memory mapping
— Read-modify-write support for RapidIO atomic increment, decrement, set, and clear
transactions
— Sleep mode support for self-refresh SDRAM
— On-die termination support when using DDR2
— Supports auto refreshing
— On-the-fly power management using CKE signal
— Registered DIMM support
— Fast memory access via JTAG port
— 2.5-V SSTL_2 compatible I/O (1.8-V SSTL_1.8 for DDR2)
— Support for battery-backed main memory
Programmable interrupt controller (PIC)
— Programming model is compliant with the OpenPIC architecture.
— Supports 16 programmable interrupt and processor task priority levels
— Supports 12 discrete external interrupts
— Supports 4 message interrupts with 32-bit messages
— Supports connection of an external interrupt controller such as the 8259 programmable
interrupt controller
— Four global high-resolution timers/counters that can generate interrupts
— Supports a variety of other internal interrupt sources
— Supports fully nested interrupt delivery
— Interrupts can be routed to external pin for external processing.
— Interrupts can be routed to the e500 core’s standard or critical interrupt inputs.
— Interrupt summary registers allow fast identification of interrupt source.
Integrated security engine (SEC) optimized to process all the algorithms associated with IPSec,
IKE, WTLS/WAP, SSL/TLS, and 3GPP
— Four crypto-channels, each supporting multi-command descriptor chains
– Dynamic assignment of crypto-execution units via an integrated controller
– Buffer size of 256 bytes for each execution unit, with flow control for large data sizes
— PKEU—public key execution unit
– RSA and Diffie-Hellman; programmable field size up to 2048 bits
– Elliptic curve cryptography with F2m and F(p) modes and programmable field size up to
511 bits
— DEU—Data Encryption Standard execution unit
– DES, 3DES
– Two key (K1, K2) or three key (K1, K2, K3)
– ECB and CBC modes for both DES and 3DES
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Overview
•
•
•
•
— AESU—Advanced Encryption Standard unit
– Implements the Rijndael symmetric key cipher
– ECB, CBC, CTR, and CCM modes
– 128-, 192-, and 256-bit key lengths
— AFEU—ARC four execution unit
– Implements a stream cipher compatible with the RC4 algorithm
– 40- to 128-bit programmable key
— MDEU—message digest execution unit
– SHA with 160- or 256-bit message digest
– MD5 with 128-bit message digest
– HMAC with either algorithm
— KEU—Kasumi execution unit
– Implements F8 algorithm for encryption and F9 algorithm for integrity checking
– Also supports A5/3 and GEA-3 algorithms
— RNG—random number generator
— XOR engine for parity checking in RAID storage applications
Dual I2C controllers
— Two-wire interface
— Multiple master support
— Master or slave I2C mode support
— On-chip digital filtering rejects spikes on the bus
Boot sequencer
— Optionally loads configuration data from serial ROM at reset via the I2C interface
— Can be used to initialize configuration registers and/or memory
— Supports extended I2C addressing mode
— Data integrity checked with preamble signature and CRC
DUART
— Two 4-wire interfaces (SIN, SOUT, RTS, CTS)
— Programming model compatible with the original 16450 UART and the PC16550D
Local bus controller (LBC)
— Multiplexed 32-bit address and data bus operating at up to 133 MHz
— Eight chip selects support eight external slaves
— Up to eight-beat burst transfers
— The 32-, 16-, and 8-bit port sizes are controlled by an on-chip memory controller.
— Three protocol engines available on a per chip select basis:
– General-purpose chip select machine (GPCM)
– Three user programmable machines (UPMs)
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Overview
•
– Dedicated single data rate SDRAM controller
— Parity support
— Default boot ROM chip select with configurable bus width (8, 16, or 32 bits)
Four enhanced three-speed Ethernet controllers (eTSECs)
— Three-speed support (10/100/1000 Mbps)
— Four controllers designed to comply with IEEE Std. 802.3®, 802.3u, 802.3x, 802.3z, 802.3ac,
and 802.3ab
— Support for various Ethernet physical interfaces:
– 1000 Mbps full-duplex IEEE 802.3 GMII, IEEE 802.3z TBI, RTBI, and RGMII
– 10/100 Mbps full and half-duplex IEEE 802.3 MII, IEEE 802.3 RGMII, and RMII
— Flexible configuration for multiple PHY interface configurations. See Section 8.1, “Enhanced
Three-Speed Ethernet Controller (eTSEC)
(10/100/1Gb Mbps)—GMII/MII/TBI/RGMII/RTBI/RMII Electrical Characteristics,” for
more information.
— TCP/IP acceleration and QoS features available
– IP v4 and IP v6 header recognition on receive
– IP v4 header checksum verification and generation
– TCP and UDP checksum verification and generation
– Per-packet configurable acceleration
– Recognition of VLAN, stacked (queue in queue) VLAN, IEEE Std 802.2™, PPPoE session,
MPLS stacks, and ESP/AH IP-security headers
– Supported in all FIFO modes
— Quality of service support:
– Transmission from up to eight physical queues
– Reception to up to eight physical queues
— Full- and half-duplex Ethernet support (1000 Mbps supports only full duplex):
– IEEE 802.3 full-duplex flow control (automatic PAUSE frame generation or
software-programmed PAUSE frame generation and recognition)
— Programmable maximum frame length supports jumbo frames (up to 9.6 Kbytes) and
IEEE Std. 802.1™ virtual local area network (VLAN) tags and priority
— VLAN insertion and deletion
– Per-frame VLAN control word or default VLAN for each eTSEC
– Extracted VLAN control word passed to software separately
— Retransmission following a collision
— CRC generation and verification of inbound/outbound frames
— Programmable Ethernet preamble insertion and extraction of up to 7 bytes
— MAC address recognition:
– Exact match on primary and virtual 48-bit unicast addresses
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Overview
•
•
•
– VRRP and HSRP support for seamless router fail-over
– Up to 16 exact-match MAC addresses supported
– Broadcast address (accept/reject)
– Hash table match on up to 512 multicast addresses
– Promiscuous mode
— Buffer descriptors backward compatible with MPC8260 and MPC860T 10/100 Ethernet
programming models
— RMON statistics support
— 10-Kbyte internal transmit and 2-Kbyte receive FIFOs
— MII management interface for control and status
— Ability to force allocation of header information and buffer descriptors into L2 cache
OCeaN switch fabric
— Full crossbar packet switch
— Reorders packets from a source based on priorities
— Reorders packets to bypass blocked packets
— Implements starvation avoidance algorithms
— Supports packets with payloads of up to 256 bytes
Integrated DMA controller
— Four-channel controller
— All channels accessible by both the local and remote masters
— Extended DMA functions (advanced chaining and striding capability)
— Support for scatter and gather transfers
— Misaligned transfer capability
— Interrupt on completed segment, link, list, and error
— Supports transfers to or from any local memory or I/O port
— Selectable hardware-enforced coherency (snoop/no snoop)
— Ability to start and flow control each DMA channel from external 3-pin interface
— Ability to launch DMA from single write transaction
Two PCI/PCI-X controllers
— PCI 2.2 and PCI-X 1.0 compatible
— One 32-/64-bit PCI/PCI-X port with support for speeds of up to 133 MHz (maximum PCI-X
frequency in synchronous mode is 110 MHz)
— One 32-bit PCI port with support for speeds from 16 to 66 MHz (available when the other port
is in 32-bit mode)
— Host and agent mode support
— 64-bit dual address cycle (DAC) support
— PCI-X supports multiple split transactions
— Supports PCI-to-memory and memory-to-PCI streaming
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Overview
•
•
— Memory prefetching of PCI read accesses
— Supports posting of processor-to-PCI and PCI-to-memory writes
— PCI 3.3-V compatible
— Selectable hardware-enforced coherency
Serial RapidIO™ interface unit
— Supports RapidIO™ Interconnect Specification, Revision 1.2
— Both 1× and 4× LP-serial link interfaces
— Long- and short-haul electricals with selectable pre-compensation
— Transmission rates of 1.25, 2.5, and 3.125 Gbaud (data rates of 1.0, 2.0, and 2.5 Gbps) per lane
— Auto detection of 1- and 4-mode operation during port initialization
— Link initialization and synchronization
— Large and small size transport information field support selectable at initialization time
— 34-bit addressing
— Up to 256 bytes data payload
— All transaction flows and priorities
— Atomic set/clr/inc/dec for read-modify-write operations
— Generation of IO_READ_HOME and FLUSH with data for accessing cache-coherent data at
a remote memory system
— Receiver-controlled flow control
— Error detection, recovery, and time-out for packets and control symbols as required by the
RapidIO specification
— Register and register bit extensions as described in part VIII (Error Management) of the
RapidIO specification
— Hardware recovery only
— Register support is not required for software-mediated error recovery.
— Accept-all mode of operation for fail-over support
— Support for RapidIO error injection
— Internal LP-serial and application interface-level loopback modes
— Memory and PHY BIST for at-speed production test
RapidIO-compatible message unit
— 4 Kbytes of payload per message
— Up to sixteen 256-byte segments per message
— Two inbound data message structures within the inbox
— Capable of receiving three letters at any mailbox
— Two outbound data message structures within the outbox
— Capable of sending three letters simultaneously
— Single segment multicast to up to 32 devIDs
— Chaining and direct modes in the outbox
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Overview
•
•
•
•
•
•
— Single inbound doorbell message structure
— Facility to accept port-write messages
PCI Express interface
— PCI Express 1.0a compatible
— Supports x8,x4,x2, and x1 link widths
— Auto-detection of number of connected lanes
— Selectable operation as root complex or endpoint
— Both 32- and 64-bit addressing
— 256-byte maximum payload size
— Virtual channel 0 only
— Traffic class 0 only
— Full 64-bit decode with 32-bit wide windows
Pin multiplexing for the high-speed I/O interfaces supports one of the following configurations:
— 8 PCI Express
— 4 PCI Express and 4 serial RapidIO
Power management
— Supports power saving modes: doze, nap, and sleep
— Employs dynamic power management, which automatically minimizes power consumption of
blocks when they are idle
System performance monitor
— Supports eight 32-bit counters that count the occurrence of selected events
— Ability to count up to 512 counter-specific events
— Supports 64 reference events that can be counted on any of the eight counters
— Supports duration and quantity threshold counting
— Burstiness feature that permits counting of burst events with a programmable time between
bursts
— Triggering and chaining capability
— Ability to generate an interrupt on overflow
System access port
— Uses JTAG interface and a TAP controller to access entire system memory map
— Supports 32-bit accesses to configuration registers
— Supports cache-line burst accesses to main memory
— Supports large block (4-Kbyte) uploads and downloads
— Supports continuous bit streaming of entire block for fast upload and download
JTAG boundary scan, designed to comply with IEEE Std. 1149.1™
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
9
Electrical Characteristics
2
Electrical Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the device.
This device is currently targeted to these specifications. Some of these specifications are independent of
the I/O cell, but are included for a more complete reference. These are not purely I/O buffer design
specifications.
2.1
Overall DC Electrical Characteristics
This section covers the ratings, conditions, and other characteristics.
2.1.1
Absolute Maximum Ratings
The following table provides the absolute maximum ratings.
Table 1. Absolute Maximum Ratings 1
Characteristic
Symbol
Max Value
Unit
Notes
Core supply voltage
VDD
–0.3 to 1.21
V
—
PLL supply voltage
AVDD
–0.3 to 1.21
V
—
Core power supply for SerDes transceivers
SVDD
–0.3 to 1.21
V
—
Pad power supply for SerDes transceivers
XVDD
–0.3 to 1.21
V
—
DDR and DDR2 DRAM I/O voltage
GVDD
–0.3 to 2.75
–0.3 to 1.98
V
2
LVDD (for eTSEC1
and eTSEC2)
–0.3 to 3.63
–0.3 to 2.75
V
TVDD (for eTSEC3
and eTSEC4)
–0.3 to 3.63
–0.3 to 2.75
PCI/PCI-X, DUART, system control and power management,
I2C, Ethernet MII management, and JTAG I/O voltage
OVDD
–0.3 to 3.63
V
—
Local bus I/O voltage
BVDD
–0.3 to 3.63
–0.3 to 2.75
V
—
Input voltage
MVIN
–0.3 to (GVDD + 0.3)
V
4
MVREF
–0.3 to
(GVDD/2 + 0.3)
V
—
Three-speed Ethernet I/O signals
LVIN
TVIN
–0.3 to (LVDD + 0.3)
–0.3 to (TVDD + 0.3)
V
4
Local bus signals
BVIN
–0.3 to (BVDD + 0.3)
—
—
DUART, SYSCLK, system control and power
management, I2C, Ethernet MII management,
and JTAG signals
OVIN
–0.3 to (OVDD + 0.3)
V
4
PCI/PCI-X
OVIN
–0.3 to (OVDD + 0.3)
V
4
Three-speed Ethernet I/O voltage
DDR/DDR2 DRAM signals
DDR/DDR2 DRAM reference
3
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Freescale Semiconductor
Electrical Characteristics
Table 1. Absolute Maximum Ratings 1 (continued)
Characteristic
Symbol
Max Value
Unit
Notes
TSTG
–55 to 150
C
—
Storage temperature range
Notes:
1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and
functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause
permanent damage to the device.
2. The –0.3 to 2.75 V range is for DDR and –0.3 to 1.98 V range is for DDR2.
3. The 3.63 V maximum is only supported when the port is configured in GMII, MII, RMII, or TBI modes; otherwise the 2.75 V
maximum applies. See Section 8.2, “FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI AC Timing Specifications,” for details on
the recommended operating conditions per protocol.
4. (M,L,O)VIN may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2.
2.1.2
Recommended Operating Conditions
The following table provides the recommended operating conditions for this device. Note that the values
in this table are the recommended and tested operating conditions. Proper device operation outside these
conditions is not guaranteed.
Table 2. Recommended Operating Conditions
Symbol
Recommended
Value
Unit
Notes
Core supply voltage
VDD
1.1 V ± 55 mV
V
—
PLL supply voltage
AVDD
1.1 V ± 55 mV
V
1
Core power supply for SerDes transceivers
SVDD
1.1 V ± 55 mV
V
—
Pad power supply for SerDes transceivers
XVDD
1.1 V ± 55 mV
V
—
DDR and DDR2 DRAM I/O voltage
GVDD
2.5 V ± 125 mV
1.8 V ± 90 mV
V
—
Three-speed Ethernet I/O voltage
LVDD
3.3 V ± 165 mV
2.5 V ± 125 mV
V
4
TVDD
3.3 V ± 165 mV
2.5 V ± 125 mV
—
4
PCI/PCI-X, DUART, system control and power management, I2C,
Ethernet MII management, and JTAG I/O voltage
OVDD
3.3 V ± 165 mV
V
3
Local bus I/O voltage
BVDD
3.3 V ± 165 mV
2.5 V ± 125 mV
V
—
Input voltage
MVIN
GND to GVDD
V
2
MVREF
GND to GVDD/2
V
2
Three-speed Ethernet signals
LVIN
TVIN
GND to LVDD
GND to TVDD
V
4
Local bus signals
BVIN
GND to BVDD
V
—
PCI, DUART, SYSCLK, system control and power
management, I2C, Ethernet MII management, and
JTAG signals
OVIN
GND to OVDD
V
3
Characteristic
DDR and DDR2 DRAM signals
DDR and DDR2 DRAM reference
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
11
Electrical Characteristics
Table 2. Recommended Operating Conditions (continued)
Characteristic
Junction temperature range
Symbol
Recommended
Value
Unit
Notes
Tj
0 to 105
C
—
Notes:
1. This voltage is the input to the filter discussed in Section 22.2, “PLL Power Supply Filtering,” and not necessarily the voltage
at the AVDD pin, which may be reduced from VDD by the filter.
2. Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
3. Caution: OVIN must not exceed OVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
4. Caution: L/TVIN must not exceed L/TVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
The following figure shows the undershoot and overshoot voltages at the interfaces of this device.
B/G/L/O/TVDD + 20%
B/G/L/O/TVDD + 5%
B/G/L/O/TVDD
VIH
GND
GND – 0.3 V
VIL
GND – 0.7 V
Not to Exceed 10%
of tCLOCK1
Notes:
1. tCLOCK refers to the clock period associated with the respective interface:
For I2C and JTAG, tCLOCK references SYSCLK.
For DDR, tCLOCK references MCLK.
For eTSEC, tCLOCK references EC_GTX_CLK125.
For LBIU, tCLOCK references LCLK.
For PCI, tCLOCK references PCIn_CLK or SYSCLK.
For SerDes, tCLOCK references SD_REF_CLK.
2. Note that with the PCI overshoot allowed (as specified above), the device
does not fully comply with the maximum AC ratings and device protection
guideline outlined in the PCI rev. 2.2 standard (section 4.2.2.3).
Figure 2. Overshoot/Undershoot Voltage for GVDD/OVDD/LVDD/BVDD/TVDD
The core voltage must always be provided at nominal 1.1 V. Voltage to the processor interface I/Os are
provided through separate sets of supply pins and must be provided at the voltages shown in Table 2. The
input voltage threshold scales with respect to the associated I/O supply voltage. OVDD and LVDD based
receivers are simple CMOS I/O circuits and satisfy appropriate LVCMOS type specifications. The DDR
SDRAM interface uses a single-ended differential receiver referenced the externally supplied MVREF
signal (nominally set to GVDD/2) as is appropriate for the SSTL2 electrical signaling standard.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Electrical Characteristics
2.1.3
Output Driver Characteristics
The following table provides information on the characteristics of the output driver strengths. The values
are preliminary estimates.
Table 3. Output Drive Capability
Driver Type
Programmable
Output Impedance
()
Supply
Voltage
25
25
BVDD = 3.3 V
BVDD = 2.5 V
45(default)
45(default)
BVDD = 3.3 V
BVDD = 2.5 V
25
OVDD = 3.3 V
2
Local bus interface utilities signals
PCI signals
Notes
1
45(default)
DDR signal
18
36 (half strength mode)
GVDD = 2.5 V
3
DDR2 signal
18
36 (half strength mode)
GVDD = 1.8 V
3
TSEC/10/100 signals
45
L/TVDD = 2.5/3.3 V
—
DUART, system control, JTAG
45
OVDD = 3.3 V
—
I2C
150
OVDD = 3.3 V
—
Notes:
1. The drive strength of the local bus interface is determined by the configuration of the appropriate bits in PORIMPSCR.
2. The drive strength of the PCI interface is determined by the setting of the PCI_GNT1 signal at reset.
3. The drive strength of the DDR interface in half-strength mode is at Tj = 105C and at GVDD (min).
2.2
Power Sequencing
The device requires its power rails to be applied in a specific sequence in order to ensure proper device
operation. These requirements are as follows for power-up:
1. VDD, AVDD_n, BVDD, LVDD, OVDD, SVDD, TVDD, XVDD
2. GVDD
All supplies must be at their stable values within 50 ms.
NOTE
Items on the same line have no ordering requirement with respect to one
another. Items on separate lines must be ordered sequentially such that
voltage rails on a previous step must reach 90% of their value before the
voltage rails on the current step reach 10% of theirs.
NOTE
In order to guarantee MCKE low during power-up, the above sequencing for
GVDD is required. If there is no concern about any of the DDR signals being
in an indeterminate state during power-up, then the sequencing for GVDD is
not required.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
13
Electrical Characteristics
NOTE
From a system standpoint, if any of the I/O power supplies ramp prior to the
VDD core supply, the I/Os associated with that I/O supply may drive a logic
one or zero during power-up, and extra current may be drawn by the device.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
14
Freescale Semiconductor
Power Characteristics
3
Power Characteristics
The estimated typical power dissipation for the core complex bus (CCB) versus the core frequency for this
family of PowerQUICC III devices is shown in the following table.
Table 4. Device Power Dissipation
CCB Frequency1
Core Frequency
SLEEP2
Typical-653
Typical-1054
Maximum5
Unit
400
800
2.7
4.6
7.5
8.1
W
1000
2.7
5.0
7.9
8.5
W
1200
2.7
5.4
8.3
8.9
500
1500
11.5
13.6
16.5
18.6
W
533
1333
6.2
7.9
10.8
12.8
W
Notes:
1. CCB frequency is the SoC platform frequency, which corresponds to the DDR data rate.
2. SLEEP is based on VDD = 1.1 V, Tj = 65C.
3. Typical-65 is based on VDD = 1.1 V, Tj = 65C, running Dhrystone.
4. Typical-105 is based on VDD = 1.1 V, Tj = 105C, running Dhrystone.
5. Maximum is based on VDD = 1.1 V, Tj = 105C, running a smoke test.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
15
Input Clocks
4
Input Clocks
This section discusses the timing for the input clocks.
4.1
System Clock Timing
The following table provides the system clock (SYSCLK) AC timing specifications for the device.
Table 5. SYSCLK AC Timing Specifications
At recommended operating conditions (see Table 2) with OVDD = 3.3 V ± 165 mV.
Parameter/Condition
Symbol
Min
Typ
Max
Unit
Notes
SYSCLK frequency
fSYSCLK
16
—
133
MHz
1, 6, 7, 8
SYSCLK cycle time
tSYSCLK
7.5
—
60
ns
6, 7, 8
SYSCLK rise and fall time
tKH, tKL
0.6
1.0
1.2
ns
2
tKHK/tSYSCLK
40
—
60
%
3
—
—
—
±150
ps
4, 5
SYSCLK duty cycle
SYSCLK jitter
Notes:
1. Caution: The CCB clock to SYSCLK ratio and e500 core to CCB clock ratio settings must be chosen such that the resulting
SYSCLK frequency, e500 (core) frequency, and CCB clock frequency do not exceed their respective maximum or minimum
operating frequencies.See Section 20.2, “CCB/SYSCLK PLL Ratio,” and Section 20.3, “e500 Core PLL Ratio,” for ratio
settings.
2. Rise and fall times for SYSCLK are measured at 0.6 and 2.7 V.
3. Timing is guaranteed by design and characterization.
4. This represents the total input jitter—short term and long term—and is guaranteed by design.
5. The SYSCLK driver’s closed loop jitter bandwidth must be <500 kHz at –20 dB. The bandwidth must be set low to allow
cascade-connected PLL-based devices to track SYSCLK drivers with the specified jitter.
6. This parameter has been adjusted slower according to the workaround for device erratum GEN 13.
7. For spread spectrum clocking. Guidelines are + 0% to –1% down spread at modulation rate between 20 and 60 kHz on
SYSCLK.
8. System with operating core frequency less than 1200 MHz must limit SYSCLK frequency to 100 MHz maximum.
4.2
Real Time Clock Timing
The RTC input is sampled by the platform clock (CCB clock). The output of the sampling latch is then
used as an input to the counters of the PIC and the TimeBase unit of the e500. There is no jitter
specification. The minimum pulse width of the RTC signal must be greater than 2x the period of the CCB
clock. That is, minimum clock high time is 2 tCCB, and minimum clock low time is 2 tCCB. There is
no minimum RTC frequency; RTC may be grounded if not needed.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
16
Freescale Semiconductor
Input Clocks
4.3
eTSEC Gigabit Reference Clock Timing
The following table provides the eTSEC gigabit reference clocks (EC_GTX_CLK125) AC timing
specifications for the device.
Table 6. EC_GTX_CLK125 AC Timing Specifications
Parameter/Condition
Symbol
Min
Typ
Max
Unit
Notes
EC_GTX_CLK125 frequency
fG125
—
125
—
MHz
—
EC_GTX_CLK125 cycle time
tG125
—
8
—
ns
tG125R, tG125F
—
—
EC_GTX_CLK125 rise and fall time
L/TVDD = 2.5 V
L/TVDD = 3.3 V
—
tG125H/tG125
EC_GTX_CLK125 duty cycle
ns
1
%
2, 3
0.75
1.0
45
47
GMII, TBI
1000Base-T for RGMII, RTBI
55
53
Notes:
1. Rise and fall times for EC_GTX_CLK125 are measured from 0.5 and 2.0 V for L/TVDD = 2.5 V, and from 0.6 and 2.7 V for
L/TVDD = 3.3 V.
2. Timing is guaranteed by design and characterization.
3. EC_GTX_CLK125 is used to generate the GTX clock TSECn_GTX_CLK for the eTSEC transmitter with 2% degradation.
EC_GTX_CLK125 duty cycle can be loosened from 47/53% as long as the PHY device can tolerate the duty cycle generated
by the TSECn_ GTX_CLK. See Section 8.2.6, “RGMII and RTBI AC Timing Specifications,” for duty cycle for 10Base-T and
100Base-T reference clock.
4.4
PCI/PCI-X Reference Clock Timing
When the PCI/PCI-X controller is configured for asynchronous operation, the reference clock for the
PCI/PCI-x controller is not the SYSCLK input, but instead the PCIn_CLK. The following table provides
the PCI/PCI-X reference clock AC timing specifications for the device.
Table 7. PCIn_CLK AC Timing Specifications
At recommended operating conditions (see Table 2) with OVDD = 3.3 V ± 165 mV.
Parameter/Condition
Symbol
Min
Typ
Max
Unit
Notes
PCIn_CLK frequency
fPCICLK
16
—
133
MHz
—
PCIn_CLK cycle time
tPCICLK
7.5
—
60
ns
—
tPCIKH, tPCIKL
0.6
1.0
2.1
ns
1, 2
tPCIKHKL/tPCICLK
40
—
60
%
2
PCIn_CLK rise and fall time
PCIn_CLK duty cycle
Notes:
1. Rise and fall times for SYSCLK are measured at 0.6 and 2.7 V.
2. Timing is guaranteed by design and characterization.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
17
Input Clocks
4.5
Platform to FIFO Restrictions
Note the following FIFO maximum speed restrictions based on platform speed.
For FIFO GMII mode:
FIFO TX/RX clock frequency platform clock frequency/4.2
For example, if the platform frequency is 533 MHz, the FIFO TX/RX clock frequency must be no more
than 127 MHz.
For FIFO encoded mode:
FIFO TX/RX clock frequency platform clock frequency/4.2
For example, if the platform frequency is 533 MHz, the FIFO TX/RX clock frequency must be no more
than 167 MHz.
4.6
Platform Frequency Requirements for PCI-Express and Serial
RapidIO
The CCB clock frequency must be considered for proper operation of the high-speed PCI-Express and
Serial RapidIO interfaces as described below.
For proper PCI Express operation, the CCB clock frequency must be greater than:
527 MHz (PCI-Express link width)
8
See MPC8548ERM, Rev. 2, PowerQUICC III Integrated Processor Family Reference Manual,
Section 18.1.3.2, “Link Width,” for PCI Express interface width details.
For proper serial RapidIO operation, the CCB clock frequency must be greater than:
2 (0.80) (Serial RapidIO interface frequency) × (Serial RapidIO link width)
64
See MPC8548ERM, Rev. 2, PowerQUICC III Integrated Processor Family Reference Manual,
Section 17.4, “1x/4x LP-Serial Signal Descriptions,” for serial RapidIO interface width and frequency
details.
4.7
Other Input Clocks
For information on the input clocks of other functional blocks of the platform see the specific section of
this document.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
18
Freescale Semiconductor
RESET Initialization
5
RESET Initialization
This section describes the AC electrical specifications for the RESET initialization timing requirements of
the device. The following table provides the RESET initialization AC timing specifications for the DDR
SDRAM component(s).
Table 8. RESET Initialization Timing Specifications
Parameter/Condition
Min
Max
Unit
Notes
Required assertion time of HRESET
100
—
s
—
Minimum assertion time for SRESET
3
—
SYSCLKs
1
100
—
s
—
Input setup time for POR configs (other than PLL config) with respect to
negation of HRESET
4
—
SYSCLKs
1
Input hold time for all POR configs (including PLL config) with respect to
negation of HRESET
2
—
SYSCLKs
1
Maximum valid-to-high impedance time for actively driven POR configs with
respect to negation of HRESET
—
5
SYSCLKs
1
PLL input setup time with stable SYSCLK before HRESET negation
Note:
1. SYSCLK is the primary clock input for the device.
The following table provides the PLL lock times.
Table 9. PLL Lock Times
Parameter/Condition
Min
Max
Unit
Core and platform PLL lock times
—
100
s
Local bus PLL lock time
—
50
s
PCI/PCI-X bus PLL lock time
—
50
s
5.1
Power-On Ramp Rate
This section describes the AC electrical specifications for the power-on ramp rate requirements.
Controlling the maximum power-on ramp rate is required to avoid falsely triggering the ESD circuitry. The
following table provides the power supply ramp rate specifications.
Table 10. Power Supply Ramp Rate
Parameter
Min
Max
Unit
Notes
Required ramp rate for MVREF
—
3500
V/s
1
Required ramp rate for VDD
—
4000
V/s
1, 2
Note:
1. Maximum ramp rate from 200 to 500 mV is most critical as this range may falsely trigger the ESD circuitry.
2. VDD itself is not vulnerable to false ESD triggering; however, as per Section 22.2, “PLL Power Supply Filtering,” the
recommended AVDD_CORE, AVDD_PLAT, AVDD_LBIU, AVDD_PCI1 and AVDD_PCI2 filters are all connected to VDD.
Their ramp rates must be equal to or less than the VDD ramp rate.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
19
DDR and DDR2 SDRAM
6
DDR and DDR2 SDRAM
This section describes the DC and AC electrical specifications for the DDR SDRAM interface of the
device. Note that GVDD(typ) = 2.5 V for DDR SDRAM, and GVDD(typ) = 1.8 V for DDR2 SDRAM.
6.1
DDR SDRAM DC Electrical Characteristics
The following table provides the recommended operating conditions for the DDR2 SDRAM controller of
the device when GVDD(typ) = 1.8 V.
Table 11. DDR2 SDRAM DC Electrical Characteristics for GVDD(typ) = 1.8 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
I/O supply voltage
GVDD
1.71
1.89
V
1
I/O reference voltage
MVREF
0.49 GVDD
0.51 GVDD
V
2
I/O termination voltage
VTT
MVREF – 0.04
MVREF + 0.04
V
3
Input high voltage
VIH
MVREF + 0.125
GVDD + 0.3
V
—
Input low voltage
VIL
–0.3
MVREF – 0.125
V
—
Output leakage current
IOZ
–50
50
A
4
Output high current (VOUT = 1.420 V)
IOH
–13.4
—
mA
—
Output low current (VOUT = 0.280 V)
IOL
13.4
—
mA
—
Notes:
1. GVDD is expected to be within 50 mV of the DRAM VDD at all times.
2. MVREF is expected to be equal to 0.5 GVDD, and to track GVDD DC variations as measured at the receiver. Peak-to-peak
noise on MVREF may not exceed ±2% of the DC value.
3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
equal to MVREF. This rail must track variations in the DC level of MVREF.
4. Output leakage is measured with all outputs disabled, 0 V VOUT GVDD.
This table provides the DDR2 I/O capacitance when GVDD(typ) = 1.8 V.
Table 12. DDR2 SDRAM Capacitance for GVDD(typ)=1.8 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Input/output capacitance: DQ, DQS, DQS
CIO
6
8
pF
1
Delta input/output capacitance: DQ, DQS, DQS
CDIO
—
0.5
pF
1
Note:
1. This parameter is sampled. GVDD = 1.8 V ± 0.090 V, f = 1 MHz, TA = 25°C, VOUT = GVDD/2, VOUT (peak-to-peak) = 0.2 V.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
20
Freescale Semiconductor
DDR and DDR2 SDRAM
Table 13 provides the recommended operating conditions for the DDR SDRAM controller when
GVDD(typ) = 2.5 V.
Table 13. DDR SDRAM DC Electrical Characteristics for GVDD(typ) = 2.5 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
I/O supply voltage
GVDD
2.375
2.625
V
1
I/O reference voltage
MVREF
0.49 GVDD
0.51 GVDD
V
2
I/O termination voltage
VTT
MVREF – 0.04
MVREF + 0.04
V
3
Input high voltage
VIH
MVREF + 0.15
GVDD + 0.3
V
—
Input low voltage
VIL
–0.3
MVREF – 0.15
V
—
Output leakage current
IOZ
–50
50
A
4
Output high current (VOUT = 1.95 V)
IOH
–16.2
—
mA
—
Output low current (VOUT = 0.35 V)
IOL
16.2
—
mA
—
Notes:
1. GVDD is expected to be within 50 mV of the DRAM VDD at all times.
2. MVREF is expected to be equal to 0.5 GVDD, and to track GVDD DC variations as measured at the receiver. Peak-to-peak
noise on MVREF may not exceed ±2% of the DC value.
3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
equal to MVREF. This rail must track variations in the DC level of MVREF .
4. Output leakage is measured with all outputs disabled, 0 V VOUT GVDD .
Table 14 provides the DDR I/O capacitance when GVDD(typ) = 2.5 V.
Table 14. DDR SDRAM Capacitance for GVDD(typ) = 2.5 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Input/output capacitance: DQ, DQS
CIO
6
8
pF
1
Delta input/output capacitance: DQ, DQS
CDIO
—
0.5
pF
1
Note:
1. This parameter is sampled. GVDD = 2.5 V ± 0.125 V, f = 1 MHz, TA = 25°C, VOUT = GVDD/2, VOUT (peak-to-peak) = 0.2 V.
This table provides the current draw characteristics for MVREF.
Table 15. Current Draw Characteristics for MVREF
Parameter/Condition
Current draw for MVREF
Symbol
Min
Max
Unit
Notes
IMVREF
—
500
A
1
Note:
1. The voltage regulator for MVREF must be able to supply up to 500 A current.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
21
DDR and DDR2 SDRAM
6.2
DDR SDRAM AC Electrical Characteristics
This section provides the AC electrical characteristics for the DDR SDRAM interface. The DDR
controller supports both DDR1 and DDR2 memories. DDR1 is supported with the following AC timings
at data rates of 333 MHz. DDR2 is supported with the following AC timings at data rates down to
333 MHz.
6.2.1
DDR SDRAM Input AC Timing Specifications
This table provides the input AC timing specifications for the DDR SDRAM when GVDD(typ) = 1.8 V.
Table 16. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface
At recommended operating conditions
Parameter
Symbol
Min
Max
Unit
AC input low voltage
VIL
—
MVREF – 0.25
V
AC input high voltage
VIH
MVREF + 0.25
—
V
Table 17 provides the input AC timing specifications for the DDR SDRAM when GVDD(typ) = 2.5 V.
Table 17. DDR SDRAM Input AC Timing Specifications for 2.5-V Interface
At recommended operating conditions.
Parameter
Symbol
Min
Max
Unit
AC input low voltage
VIL
—
MVREF – 0.31
V
AC input high voltage
VIH
MVREF + 0.31
—
V
This table provides the input AC timing specifications for the DDR SDRAM interface.
Table 18. DDR SDRAM Input AC Timing Specifications
At recommended operating conditions.
Parameter
Symbol
Controller Skew for MDQS—MDQ/MECC
533 MHz
400 MHz
333 MHz
tCISKEW
Min
–300
–365
–390
Max
Unit
Notes
ps
1, 2
300
365
390
Notes:
1. tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding bit that
is captured with MDQS[n]. This must be subtracted from the total timing budget.
2. The amount of skew that can be tolerated from MDQS to a corresponding MDQ signal is called tDISKEW. This can be
determined by the following equation: tDISKEW = ± (T/4 – abs(tCISKEW)) where T is the clock period and abs(tCISKEW) is the
absolute value of tCISKEW.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
22
Freescale Semiconductor
DDR and DDR2 SDRAM
6.2.2
DDR SDRAM Output AC Timing Specifications
Table 19. DDR SDRAM Output AC Timing Specifications
At recommended operating conditions.
Symbol1
Min
Max
Unit
Notes
MCK[n] cycle time, MCK[n]/MCK[n] crossing
tMCK
3.75
6
ns
2
ADDR/CMD output setup with respect to MCK
533 MHz
400 MHz
333 MHz
tDDKHAS
ns
3
ADDR/CMD output hold with respect to MCK
533 MHz
400 MHz
333 MHz
tDDKHAX
ns
3
MCS[n] output setup with respect to MCK
533 MHz
400 MHz
333 MHz
tDDKHCS
ns
3
MCS[n] output hold with respect to MCK
533 MHz
400 MHz
333 MHz
tDDKHCX
ns
3
MCK to MDQS Skew
tDDKHMH
ns
4
MDQ/MECC/MDM output setup with respect
to MDQS
533 MHz
400 MHz
333 MHz
tDDKHDS,
tDDKLDS
ps
5
MDQ/MECC/MDM output hold with respect to
MDQS
533 MHz
400 MHz
333 MHz
tDDKHDX,
tDDKLDX
ps
5
MDQS preamble start
tDDKHMP
ns
6
Parameter
1.48
1.95
2.40
1.48
1.95
2.40
1.48
1.95
2.40
—
—
—
—
—
—
—
—
—
1.48
1.95
2.40
—
—
—
–0.6
0.6
538
700
900
—
—
—
538
700
900
—
—
—
–0.5 tMCK – 0.6
–0.5 tMCK + 0.6
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
23
DDR and DDR2 SDRAM
Table 19. DDR SDRAM Output AC Timing Specifications (continued)
At recommended operating conditions.
Parameter
MDQS epilogue end
Symbol1
Min
Max
Unit
Notes
tDDKHME
–0.6
0.6
ns
6
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can be read as DDR timing
(DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example,
tDDKHAS symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes from the high (H) state until outputs
(A) are setup (S) or output valid time. Also, tDDKLDX symbolizes DDR timing (DD) for the time tMCK memory clock reference
(K) goes low (L) until data outputs (D) are invalid (X) or data output hold time.
2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS.
4. Note that tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR timing (DD)
from the rising edge of the MCK[n] clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be modified through control
of the MDQS override bits (called WR_DATA_DELAY) in the TIMING_CFG_2 register. This is typically set to the same delay
as in DDR_SDRAM_CLK_CNTL[CLK_ADJUST]. The timing parameters listed in the table assume that these 2 parameters
have been set to the same adjustment value. See the MPC8548E PowerQUICC III Integrated Processor Reference Manual
for a description and understanding of the timing modifications enabled by use of these bits.
5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), ECC
(MECC), or data mask (MDM). The data strobe must be centered inside of the data eye at the pins of the microprocessor.
6. All outputs are referenced to the rising edge of MCK[n] at the pins of the microprocessor. Note that tDDKHMP follows the
symbol conventions described in note 1.
NOTE
For the ADDR/CMD setup and hold specifications in Table 19, it is
assumed that the clock control register is set to adjust the memory clocks by
1/2 applied cycle.
Figure 3 shows the DDR SDRAM output timing for the MCK to MDQS skew measurement (tDDKHMH).
MCK[n]
MCK[n]
tMCK
tDDKHMHmax) = 0.6 ns
MDQS
tDDKHMH(min) = –0.6 ns
MDQS
Figure 3. Timing Diagram for tDDKHMH
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
24
Freescale Semiconductor
DDR and DDR2 SDRAM
Figure 4 shows the DDR SDRAM output timing diagram.+
MCK[n]
MCK[n]
tMCK
tDDKHAS, tDDKHCS
tDDKHAX, tDDKHCX
ADDR/CMD
Write A0
NOOP
tDDKHMP
tDDKHMH
MDQS[n]
tDDKHME
tDDKHDS
tDDKLDS
MDQ[x]
D0
D1
tDDKLDX
tDDKHDX
Figure 4. DDR SDRAM Output Timing Diagram
Figure 5 provides the AC test load for the DDR bus.
Output
Z0 = 50
RL = 50
GVDD/2
Figure 5. DDR AC Test Load
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
25
DUART
7
DUART
This section describes the DC and AC electrical specifications for the DUART interface of the device.
7.1
DUART DC Electrical Characteristics
This table provides the DC electrical characteristics for the DUART interface.
Table 20. DUART DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
2
OVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.8
V
Input current (VIN1 = 0 V or VIN = VDD)
IIN
—
±5
A
High-level output voltage (OVDD = min, IOH = –2 mA)
VOH
2.4
—
V
Low-level output voltage (OVDD = min, IOL = 2 mA)
VOL
—
0.4
V
Note:
1. Note that the symbol VIN, in this case, represents the OVIN symbol referenced in Table 1 and Table 2.
7.2
DUART AC Electrical Specifications
This table provides the AC timing parameters for the DUART interface.
Table 21. DUART AC Timing Specifications
Parameter
Value
Unit
Notes
Minimum baud rate
fCCB/1,048,576
baud
1, 2
Maximum baud rate
fCCB/16
baud
1, 2, 3
16
—
1, 4
Oversample rate
Notes:
1. Guaranteed by design.
2. fCCB refers to the internal platform clock.
3. Actual attainable baud rate is limited by the latency of interrupt processing.
4. The middle of a start bit is detected as the 8th sampled 0 after the 1-to-0 transition of the start bit. Subsequent bit values are
sampled each 16th sample.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
26
Freescale Semiconductor
Enhanced Three-Speed Ethernet (eTSEC)
8
Enhanced Three-Speed Ethernet (eTSEC)
This section provides the AC and DC electrical characteristics for the enhanced three-speed Ethernet
controller. The electrical characteristics for MDIO and MDC are specified in Section 9, “Ethernet
Management Interface Electrical Characteristics.”
8.1
Enhanced Three-Speed Ethernet Controller (eTSEC)
(10/100/1Gb Mbps)—GMII/MII/TBI/RGMII/RTBI/RMII Electrical
Characteristics
The electrical characteristics specified here apply to all gigabit media independent interface (GMII), media
independent interface (MII), ten-bit interface (TBI), reduced gigabit media independent interface
(RGMII), reduced ten-bit interface (RTBI), and reduced media independent interface (RMII) signals
except management data input/output (MDIO) and management data clock (MDC). The RGMII and RTBI
interfaces are defined for 2.5 V, while the GMII, MII, and TBI interfaces can be operated at 3.3 or 2.5 V.
The GMII, MII, or TBI interface timing is compliant with the IEEE 802.3. The RGMII and RTBI interfaces
follow the Reduced Gigabit Media-Independent Interface (RGMII) Specification Version 1.3
(12/10/2000). The RMII interface follows the RMII Consortium RMII Specification Version 1.2
(3/20/1998). The electrical characteristics for MDIO and MDC are specified in Section 9, “Ethernet
Management Interface Electrical Characteristics.”
8.1.1
eTSEC DC Electrical Characteristics
All GMII, MII, TBI, RGMII, RMII, and RTBI drivers and receivers comply with the DC parametric
attributes specified in Table 22 and Table 23. The RGMII and RTBI signals are based on a 2.5-V CMOS
interface voltage as defined by JEDEC EIA/JESD8-5.
Table 22. GMII, MII, RMII, and TBI DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
Notes
Supply voltage 3.3 V
LVDD
TVDD
3.13
3.47
V
1, 2
Output high voltage (LVDD/TVDD = min, IOH = –4.0 mA)
VOH
2.40
LVDD/TVDD + 0.3
V
—
Output low voltage (LVDD/TVDD = min, IOL = 4.0 mA)
VOL
GND
0.50
V
—
Input high voltage
VIH
2.0
LVDD/TVDD + 0.3
V
—
Input low voltage
VIL
–0.3
0.90
V
—
Input high current (VIN = LVDD, VIN = TVDD)
IIH
—
40
A
1, 2, 3
Input low current (VIN = GND)
IIL
–600
—
A
—
Notes:
1. LVDD supports eTSECs 1 and 2.
2. TVDD supports eTSECs 3 and 4.
3. The symbol VIN, in this case, represents the LVIN and TVIN symbols referenced in Table 1 and Table 2.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
27
Enhanced Three-Speed Ethernet (eTSEC)
Table 23. GMII, MII, RMII, TBI, RGMII, RTBI, and FIFO DC Electrical Characteristics
Parameters
Symbol
Min
Max
Unit
Notes
LVDD/TVDD
2.37
2.63
V
1, 2
Output high voltage (LVDD/TVDD = Min,
IOH = –1.0 mA)
VOH
2.00
LVDD/TVDD + 0.3
V
—
Output low voltage (LVDD/TVDD = Min,
IOL = 1.0 mA)
VOL
GND–0.3
0.40
V
—
Input high voltage
VIH
1.70
LVDD/TVDD + 0.3
V
—
Input low voltage
VIL
–0.3
0.90
V
—
Input high current (VIN = LVDD, VIN = TVDD)
IIH
—
10
A
1, 2, 3
Input low current (VIN = GND)
IIL
–15
—
A
3
Supply voltage 2.5 V
Notes:
1. LVDD supports eTSECs 1 and 2.
2. TVDD supports eTSECs 3 and 4.
3. Note that the symbol VIN, in this case, represents the LVIN and TVIN symbols referenced in Table 1 and Table 2.
8.2
FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI AC Timing
Specifications
The AC timing specifications for FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI are presented in this
section.
8.2.1
FIFO AC Specifications
The basis for the AC specifications for the eTSEC’s FIFO modes is the double data rate RGMII and RTBI
specifications, since they have similar performances and are described in a source-synchronous fashion
like FIFO modes. However, the FIFO interface provides deliberate skew between the transmitted data and
source clock in GMII fashion.
When the eTSEC is configured for FIFO modes, all clocks are supplied from external sources to the
relevant eTSEC interface. That is, the transmit clock must be applied to the eTSECn’s TSECn_TX_CLK,
while the receive clock must be applied to pin TSECn_RX_CLK. The eTSEC internally uses the transmit
clock to synchronously generate transmit data and outputs an echoed copy of the transmit clock back out
onto the TSECn_GTX_CLK pin (while transmit data appears on TSECn_TXD[7:0], for example). It is
intended that external receivers capture eTSEC transmit data using the clock on TSECn_GTX_CLK as a
source- synchronous timing reference. Typically, the clock edge that launched the data can be used, since
the clock is delayed by the eTSEC to allow acceptable set-up margin at the receiver. Note that there is
relationship between the maximum FIFO speed and the platform speed. For more information see
Section 4.5, “Platform to FIFO Restrictions.”
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
28
Freescale Semiconductor
Enhanced Three-Speed Ethernet (eTSEC)
A summary of the FIFO AC specifications appears in Table 24 and Table 25.
Table 24. FIFO Mode Transmit AC Timing Specification
Parameter/Condition
Symbol
Min
Typ
Max
Unit
tFIT
5.3
8.0
100
ns
tFITH/tFIT
45
50
55
%
TX_CLK, GTX_CLK peak-to-peak jitter
tFITJ
—
—
250
ps
Rise time TX_CLK (20%–80%)
tFITR
—
—
0.75
ns
Fall time TX_CLK (80%–20%)
tFITF
—
—
0.75
ns
FIFO data TXD[7:0], TX_ER, TX_EN setup time to GTX_CLK
tFITDV
2.0
—
—
ns
GTX_CLK to FIFO data TXD[7:0], TX_ER, TX_EN hold time
tFITDX
0.5
—
3.0
ns
TX_CLK, GTX_CLK clock period
TX_CLK, GTX_CLK duty cycle
Table 25. FIFO Mode Receive AC Timing Specification
Parameter/Condition
Symbol
Min
Typ
Max
Unit
tFIR
5.3
8.0
100
ns
tFIRH/tFIR
45
50
55
%
RX_CLK peak-to-peak jitter
tFIRJ
—
—
250
ps
Rise time RX_CLK (20%–80%)
tFIRR
—
—
0.75
ns
Fall time RX_CLK (80%–20%)
tFIRF
—
—
0.75
ns
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tFIRDV
1.5
—
—
ns
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tFIRDX
0.5
—
—
ns
RX_CLK clock period
RX_CLK duty cycle
Note:
1. The minimum cycle period of the TX_CLK and RX_CLK is dependent on the maximum platform frequency of t he speed bins
the part belongs to as well as the FIFO mode under operation. See Section 4.5, “Platform to FIFO Restrictions.”
Timing diagrams for FIFO appear in Figure 6 and Figure 7.
tFIT
tFITF
tFITR
GTX_CLK
tFITH
tFITDV
tFITDX
TXD[7:0]
TX_EN
TX_ER
Figure 6. FIFO Transmit AC Timing Diagram
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
29
Enhanced Three-Speed Ethernet (eTSEC)
tFIRR
tFIR
RX_CLK
tFIRF
tFIRH
RXD[7:0]
RX_DV
RX_ER
Valid Data
tFIRDV
tFIRDX
Figure 7. FIFO Receive AC Timing Diagram
8.2.2
GMII AC Timing Specifications
This section describes the GMII transmit and receive AC timing specifications.
8.2.2.1
GMII Transmit AC Timing Specifications
This table provides the GMII transmit AC timing specifications.
Table 26. GMII Transmit AC Timing Specifications
Symbol1
Min
Typ
Max
Unit
GMII data TXD[7:0], TX_ER, TX_EN setup time
tGTKHDV
2.5
—
—
ns
GTX_CLK to GMII data TXD[7:0], TX_ER, TX_EN delay
tGTKHDX
0.5
—
5.0
ns
GTX_CLK data clock rise time (20%–80%)
tGTXR2
—
—
1.0
ns
GTX_CLK data clock fall time (80%–20%)
tGTXF2
—
—
1.0
ns
Parameter/Condition
Notes:
1. The symbols used for timing specifications follow the pattern t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGTKHDV symbolizes GMII transmit timing
(GT) with respect to the tGTX clock reference (K) going to the high state (H) relative to the time date input signals (D) reaching
the valid state (V) to state or setup time. Also, tGTKHDX symbolizes GMII transmit timing (GT) with respect to the tGTX clock
reference (K) going to the high state (H) relative to the time date input signals (D) going invalid (X) or hold time. Note that, in
general, the clock reference symbol representation is based on three letters representing the clock of a particular functional.
For example, the subscript of tGTX represents the GMII(G) transmit (TX) clock. For rise and fall times, the latter convention
is used with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
30
Freescale Semiconductor
Enhanced Three-Speed Ethernet (eTSEC)
Figure 8 shows the GMII transmit AC timing diagram.
tGTXR
tGTX
GTX_CLK
tGTXF
tGTXH
TXD[7:0]
TX_EN
TX_ER
tGTKHDX
tGTKHDV
Figure 8. GMII Transmit AC Timing Diagram
8.2.2.2
GMII Receive AC Timing Specifications
This table provides the GMII receive AC timing specifications.
Table 27. GMII Receive AC Timing Specifications
Symbol1
Min
Typ
Max
Unit
tGRX
—
8.0
—
ns
tGRXH/tGRX
35
—
75
ns
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tGRDVKH
2.0
—
—
ns
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tGRDXKH
0
—
—
ns
RX_CLK clock rise (20%-80%)
tGRXR2
—
—
1.0
ns
RX_CLK clock fall time (80%-20%)
tGRXF2
—
—
1.0
ns
Parameter/Condition
RX_CLK clock period
RX_CLK duty cycle
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGRDVKH symbolizes GMII receive
timing (GR) with respect to the time data input signals (D) reaching the valid state (V) relative to the tRX clock reference (K)
going to the high state (H) or setup time. Also, tGRDXKL symbolizes GMII receive timing (GR) with respect to the time data
input signals (D) went invalid (X) relative to the tGRX clock reference (K) going to the low (L) state or hold time. Note that, in
general, the clock reference symbol representation is based on three letters representing the clock of a particular functional.
For example, the subscript of tGRX represents the GMII (G) receive (RX) clock. For rise and fall times, the latter convention
is used with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design.
Figure 9 provides the AC test load for eTSEC.
Output
Z0 = 50
RL = 50
LVDD/2
Figure 9. eTSEC AC Test Load
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
31
Enhanced Three-Speed Ethernet (eTSEC)
Figure 10 shows the GMII receive AC timing diagram.
tGRXR
tGRX
RX_CLK
tGRXH
tGRXF
RXD[7:0]
RX_DV
RX_ER
tGRDXKH
tGRDVKH
Figure 10. GMII Receive AC Timing Diagram
8.2.3
MII AC Timing Specifications
This section describes the MII transmit and receive AC timing specifications.
8.2.3.1
MII Transmit AC Timing Specifications
This table provides the MII transmit AC timing specifications.
Table 28. MII Transmit AC Timing Specifications
Symbol1
Min
Typ
Max
Unit
TX_CLK clock period 10 Mbps
tMTX2
—
400
—
ns
TX_CLK clock period 100 Mbps
tMTX
—
40
—
ns
tMTXH/tMTX
35
—
65
%
tMTKHDX
1
5
15
ns
TX_CLK data clock rise (20%–80%)
tMTXR2
1.0
—
4.0
ns
TX_CLK data clock fall (80%–20%)
tMTXF2
1.0
—
4.0
ns
Parameter/Condition
TX_CLK duty cycle
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit
timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general,
the clock reference symbol representation is based on two to three letters representing the clock of a particular functional.
For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is
used with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
32
Freescale Semiconductor
Enhanced Three-Speed Ethernet (eTSEC)
Figure 11 shows the MII transmit AC timing diagram.
tMTXR
tMTX
TX_CLK
tMTXF
tMTXH
TXD[3:0]
TX_EN
TX_ER
tMTKHDX
Figure 11. MII Transmit AC Timing Diagram
8.2.3.2
MII Receive AC Timing Specifications
This table provides the MII receive AC timing specifications.
Table 29. MII Receive AC Timing Specifications
Symbol1
Min
Typ
Max
Unit
RX_CLK clock period 10 Mbps
tMRX2
—
400
—
ns
RX_CLK clock period 100 Mbps
tMRX
—
40
—
ns
tMRXH/tMRX
35
—
65
%
RXD[3:0], RX_DV, RX_ER setup time to RX_CLK
tMRDVKH
10.0
—
—
ns
RXD[3:0], RX_DV, RX_ER hold time to RX_CLK
tMRDXKH
10.0
—
—
ns
RX_CLK clock rise (20%–80%)
tMRXR2
1.0
—
4.0
ns
RX_CLK clock fall time (80%–20%)
tMRXF2
1.0
—
4.0
ns
Parameter/Condition
RX_CLK duty cycle
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive
timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K)
going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input
signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in general,
the clock reference symbol representation is based on three letters representing the clock of a particular functional. For
example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used
with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design.
Figure 12 provides the AC test load for eTSEC.
Output
Z0 = 50
RL = 50
LVDD/2
Figure 12. eTSEC AC Test Load
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
33
Enhanced Three-Speed Ethernet (eTSEC)
Figure 13 shows the MII receive AC timing diagram.
tMRXR
tMRX
RX_CLK
tMRXF
tMRXH
RXD[3:0]
RX_DV
RX_ER
Valid Data
tMRDVKH
tMRDXKL
Figure 13. MII Receive AC Timing Diagram
8.2.4
TBI AC Timing Specifications
This section describes the TBI transmit and receive AC timing specifications.
8.2.4.1
TBI Transmit AC Timing Specifications
This table provides the TBI transmit AC timing specifications.
Table 30. TBI Transmit AC Timing Specifications
Symbol1
Min
Typ
Max
Unit
TCG[9:0] setup time GTX_CLK going high
tTTKHDV
2.0
—
—
ns
TCG[9:0] hold time from GTX_CLK going high
tTTKHDX
1.0
—
—
ns
GTX_CLK rise (20%–80%)
tTTXR2
—
—
1.0
ns
GTX_CLK fall time (80%–20%)
tTTXF2
—
—
1.0
ns
Parameter/Condition
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state )(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tTTKHDV symbolizes the TBI
transmit timing (TT) with respect to the time from tTTX (K) going high (H) until the referenced data signals (D) reach the valid
state (V) or setup time. Also, tTTKHDX symbolizes the TBI transmit timing (TT) with respect to the time from tTTX (K) going high
(H) until the referenced data signals (D) reach the invalid state (X) or hold time. Note that, in general, the clock reference
symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript
of tTTX represents the TBI (T) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate
letter: R (rise) or F (fall).
2. Guaranteed by design.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
34
Freescale Semiconductor
Enhanced Three-Speed Ethernet (eTSEC)
Figure 14 shows the TBI transmit AC timing diagram.
tTTXR
tTTX
GTX_CLK
tTTXH
tTTXF
tTTXF
TCG[9:0]
tTTKHDV
tTTXR
tTTKHDX
Figure 14. TBI Transmit AC Timing Diagram
8.2.4.2
TBI Receive AC Timing Specifications
This table provides the TBI receive AC timing specifications.
Table 31. TBI Receive AC Timing Specifications
Symbol1
Min
Typ
Max
Unit
tTRX
—
16.0
—
ns
tSKTRX
7.5
—
8.5
ns
tTRXH/tTRX
40
—
60
%
RCG[9:0] setup time to rising TSECn_RX_CLK
tTRDVKH
2.5
—
—
ns
RCG[9:0] hold time to rising TSECn_RX_CLK
tTRDXKH
1.5
—
—
ns
TSECn_RX_CLK[0:1] clock rise time (20%–80%)
tTRXR2
0.7
—
2.4
ns
TSECn_RX_CLK[0:1] clock fall time (80%–20%)
tTRXF2
0.7
—
2.4
ns
Parameter/Condition
TSECn_RX_CLK[0:1] clock period
TSECn_RX_CLK[0:1] skew
TSECn_RX_CLK[0:1] duty cycle
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tTRDVKH symbolizes TBI receive
timing (TR) with respect to the time data input signals (D) reach the valid state (V) relative to the tTRX clock reference (K)
going to the high (H) state or setup time. Also, tTRDXKH symbolizes TBI receive timing (TR) with respect to the time data input
signals (D) went invalid (X) relative to the tTRX clock reference (K) going to the high (H) state. Note that, in general, the clock
reference symbol representation is based on three letters representing the clock of a particular functional. For example, the
subscript of tTRX represents the TBI (T) receive (RX) clock. For rise and fall times, the latter convention is used with the
appropriate letter: R (rise) or F (fall). For symbols representing skews, the subscript is skew (SK) followed by the clock that
is being skewed (TRX).
2. Guaranteed by design.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
35
Enhanced Three-Speed Ethernet (eTSEC)
Figure 15 shows the TBI receive AC timing diagram.
tTRXR
tTRX
TSECn_RX_CLK1
tTRXH
RCG[9:0]
tTRXF
Valid Data
Valid Data
tTRDVKH
tSKTRX
tTRDXKH
TSECn_RX_CLK0
tTRDXKH
tTRXH
tTRDVKH
Figure 15. TBI Receive AC Timing Diagram
8.2.5
TBI Single-Clock Mode AC Specifications
When the eTSEC is configured for TBI modes, all clocks are supplied from external sources to the relevant
eTSEC interface. In single-clock TBI mode, when TBICON[CLKSEL] = 1, a 125-MHz TBI receive clock
is supplied on the TSECn_RX_CLK pin (no receive clock is used on TSECn_TX_CLK in this mode,
whereas for the dual-clock mode this is the PMA1 receive clock). The 125-MHz transmit clock is applied
on the TSEC_GTX_CLK125 pin in all TBI modes.
A summary of the single-clock TBI mode AC specifications for receive appears in Table 32.
Table 32. TBI single-clock Mode Receive AC Timing Specification
Parameter/Condition
Symbol
Min
Typ
Max
Unit
tTRRX
7.5
8.0
8.5
ns
tTRRH/TRRX
40
50
60
%
RX_CLK peak-to-peak jitter
tTRRJ
—
—
250
ps
Rise time RX_CLK (20%–80%)
tTRRR
—
—
1.0
ns
Fall time RX_CLK (80%–20%)
tTRRF
—
—
1.0
ns
RCG[9:0] setup time to RX_CLK rising edge
tTRRDVKH
2.0
—
—
ns
RCG[9:0] hold time to RX_CLK rising edge
tTRRDXKH
1.0
—
—
ns
RX_CLK clock period
RX_CLK duty cycle
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
36
Freescale Semiconductor
Enhanced Three-Speed Ethernet (eTSEC)
A timing diagram for TBI receive appears in Figure 16.
.
tTRRX
tTRRR
RX_CLK
tTRRF
tTRRH
Valid Data
RCG[9:0]
tTRRDVKH
tTRRDXKH
Figure 16. TBI Single-Clock Mode Receive AC Timing Diagram
8.2.6
RGMII and RTBI AC Timing Specifications
This table presents the RGMII and RTBI AC timing specifications.
Table 33. RGMII and RTBI AC Timing Specifications
Symbol1
Min
Typ
Max
Unit
tSKRGT5
–5006
0
5006
ps
tSKRGT
1.0
—
2.8
ns
tRGT5
7.2
8.0
8.8
ns
tRGTH/tRGT5
45
50
55
%
Rise time (20%–80%)
tRGTR5
—
—
0.75
ns
Fall time (20%–80%)
tRGTF5
—
—
0.75
ns
Parameter/Condition
Data to clock output skew (at transmitter)
Data to clock input skew (at receiver)
2
Clock period 3
Duty cycle for 10BASE-T and
100BASE-TX3, 4
Notes:
1. In general, the clock reference symbol representation for this section is based on the symbols RGT to represent RGMII and
RTBI timing. For example, the subscript of tRGT represents the TBI (T) receive (RX) clock. Note also that the notation for rise
(R) and fall (F) times follows the clock symbol that is being represented. For symbols representing skews, the subscript is
skew (SK) followed by the clock that is being skewed (RGT).
2. This implies that PC board design requires clocks to be routed such that an additional trace delay of greater than 1.5 ns is
added to the associated clock signal.
3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively.
4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains as long
as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed transitioned
between.
5. Guaranteed by characterization.
6. In rev 1.0 silicon, due to errata, tSKRGT is -650 ps (min) and 650 ps (max). See “eTSEC 10” in the device errata document.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
37
Enhanced Three-Speed Ethernet (eTSEC)
Figure 17 shows the RGMII and RTBI AC timing and multiplexing diagrams.
tRGT
tRGTH
GTX_CLK
(At Transmitter)
tSKRGT
TXD[8:5][3:0]
TXD[7:4][3:0]
TX_CTL
TXD[3:0]
TXD[8:5]
TXD[7:4]
TXD[4]
TXEN
TXD[9]
TXERR
tSKRGT
TX_CLK
(At PHY)
RXD[8:5][3:0]
RXD[7:4][3:0]
RXD[8:5]
RXD[3:0] RXD[7:4]
tSKRGT
RXD[4]
RXDV
RX_CTL
RXD[9]
RXERR
tSKRGT
RX_CLK
(At PHY)
Figure 17. RGMII and RTBI AC Timing and Multiplexing Diagrams
8.2.7
RMII AC Timing Specifications
This section describes the RMII transmit and receive AC timing specifications.
8.2.7.1
RMII Transmit AC Timing Specifications
The RMII transmit AC timing specifications are in this table.
Table 34. RMII Transmit AC Timing Specifications
Symbol1
Min
Typ
Max
Unit
TSECn_TX_CLK clock period
tRMT
15.0
20.0
25.0
ns
TSECn_TX_CLK duty cycle
tRMTH
35
50
65
%
TSECn_TX_CLK peak-to-peak jitter
tRMTJ
—
—
250
ps
Rise time TSECn_TX_CLK (20%–80%)
tRMTR
1.0
—
2.0
ns
Fall time TSECn_TX_CLK (80%–20%)
tRMTF
1.0
—
2.0
ns
Parameter/Condition
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
38
Freescale Semiconductor
Enhanced Three-Speed Ethernet (eTSEC)
Table 34. RMII Transmit AC Timing Specifications (continued)
Parameter/Condition
TSECn_TX_CLK to RMII data TXD[1:0], TX_EN delay
Symbol1
Min
Typ
Max
Unit
tRMTDX
1.0
—
10.0
ns
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit
timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general,
the clock reference symbol representation is based on two to three letters representing the clock of a particular functional.
For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is
used with the appropriate letter: R (rise) or F (fall).
Figure 18 shows the RMII transmit AC timing diagram.
tRMTR
tRMT
TSECn_TX_CLK
tRMTH
tRMTF
TXD[1:0]
TX_EN
TX_ER
tRMTDX
Figure 18. RMII Transmit AC Timing Diagram
8.2.7.2
RMII Receive AC Timing Specifications
Table 35. RMII Receive AC Timing Specifications
Symbol1
Min
Typ
Max
Unit
TSECn_TX_CLK clock period
tRMR
15.0
20.0
25.0
ns
TSECn_TX_CLK duty cycle
tRMRH
35
50
65
%
TSECn_TX_CLK peak-to-peak jitter
tRMRJ
—
—
250
ps
Rise time TSECn_TX_CLK(20%–80%)
tRMRR
1.0
—
2.0
ns
Fall time TSECn_TX_CLK (80%–20%)
tRMRF
1.0
—
2.0
ns
RXD[1:0], CRS_DV, RX_ER setup time to REF_CLK rising edge
tRMRDV
4.0
—
—
ns
RXD[1:0], CRS_DV, RX_ER hold time to REF_CLK rising edge
tRMRDX
2.0
—
—
ns
Parameter/Condition
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive
timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K)
going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input
signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in general,
the clock reference symbol representation is based on three letters representing the clock of a particular functional. For
example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used
with the appropriate letter: R (rise) or F (fall).
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
39
Enhanced Three-Speed Ethernet (eTSEC)
Figure 19 provides the AC test load for eTSEC.
Z0 = 50
Output
RL = 50
LVDD/2
Figure 19. eTSEC AC Test Load
Figure 20 shows the RMII receive AC timing diagram.
tRMRR
tRMR
TSECn_TX_CLK
tRMRH
RXD[1:0]
CRS_DV
RX_ER
tRMRF
Valid Data
tRMRDV
tRMRDX
Figure 20. RMII Receive AC Timing Diagram
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
40
Freescale Semiconductor
Ethernet Management Interface Electrical Characteristics
9
Ethernet Management Interface Electrical
Characteristics
The electrical characteristics specified here apply to MII management interface signals MDIO
(management data input/output) and MDC (management data clock). The electrical characteristics for
GMII, RGMII, RMII, TBI, and RTBI are specified in “Section 8, “Enhanced Three-Speed Ethernet
(eTSEC).”
9.1
MII Management DC Electrical Characteristics
The MDC and MDIO are defined to operate at a supply voltage of 3.3 V. The DC electrical characteristics
for MDIO and MDC are provided in this table.
Table 36. MII Management DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
OVDD
3.13
3.47
V
Output high voltage (OVDD = Min, IOH = –1.0 mA)
VOH
2.10
OVDD + 0.3
V
Output low voltage (OVDD =Min, IOL = 1.0 mA)
VOL
GND
0.50
V
Input high voltage
VIH
2.0
—
V
Input low voltage
VIL
—
0.90
V
Input high current (OVDD = Max, VIN1 = 2.1 V)
IIH
—
40
A
Input low current (OVDD = Max, VIN = 0.5 V)
IIL
–600
—
A
Supply voltage (3.3 V)
Note:
1. Note that the symbol VIN, in this case, represents the OVIN symbol referenced in Table 1 and Table 2.
9.2
MII Management AC Electrical Specifications
This table provides the MII management AC timing specifications.
Table 37. MII Management AC Timing Specifications
At recommended operating conditions with OVDD is 3.3 V ± 5%.
Symbol1
Min
Typ
Max
Unit
Notes
MDC frequency
fMDC
0.72
2.5
8.3
MHz
2, 3, 4
MDC period
tMDC
120.5
—
1389
ns
—
MDC clock pulse width high
tMDCH
32
—
—
ns
—
MDC to MDIO valid
tMDKHDV
16 tCCB
—
—
ns
5
MDC to MDIO delay
tMDKHDX
(16 × tCCB× 8) – 3
—
(16 × tCCB × 8) + 3
ns
5
MDIO to MDC setup time
tMDDVKH
5
—
—
ns
—
MDIO to MDC hold time
tMDDXKH
0
—
—
ns
—
tMDCR
—
—
10
ns
4
Parameter
MDC rise time
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
41
Ethernet Management Interface Electrical Characteristics
Table 37. MII Management AC Timing Specifications (continued)
At recommended operating conditions with OVDD is 3.3 V ± 5%.
Parameter
MDC fall time
Symbol1
Min
tMDHF
—
Typ
Max
Unit
Notes
10
ns
4
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMDKHDX symbolizes management
data timing (MD) for the time tMDC from clock reference (K) high (H) until data outputs (D) are invalid (X) or data hold time.
Also, tMDDVKH symbolizes management data timing (MD) with respect to the time data input signals (D) reach the valid state
(V) relative to the tMDC clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention
is used with the appropriate letter: R (rise) or F (fall).
2. This parameter is dependent on the eTSEC system clock speed, which is half of the Platform Frequency (fCCB). The actual
ECn_MDC output clock frequency for a specific eTSEC port can be programmed by configuring the MgmtClk bit field of
device’s MIIMCFG register, based on the platform (CCB) clock running for the device. The formula is: Platform Frequency
(CCB) (2 × Frequency Divider determined by MIICFG[MgmtClk] encoding selection). For example, if
MIICFG[MgmtClk] = 000 and the platform (CCB) is currently running at 533 MHz, fMDC = 533) (2 × 4 × 8) = 533) 64 =
8.3 MHz. That is, for a system running at a particular platform frequency (fCCB), the ECn_MDC output clock frequency can be
programmed between maximum fMDC = fCCB 64 and minimum fMDC = fCCB 448. See 14.5.3.6.6, “MII Management
Configuration Register (MIIMCFG),” in the MPC8548E PowerQUICC™ III Integrated Processor Family Reference Manual for
more detail.
3.The maximum ECn_MDC output clock frequency is defined based on the maximum platform frequency for device (533 MHz)
divided by 64, while the minimum ECn_MDC output clock frequency is defined based on the minimum platform frequency for
device (333 MHz) divided by 448, following the formula described in Note 2 above.
4. Guaranteed by design.
5. tCCB is the platform (CCB) clock period.
Figure 21 shows the MII management AC timing diagram.
tMDCR
tMDC
MDC
tMDCF
tMDCH
MDIO
(Input)
tMDDVKH
tMDDXKH
MDIO
(Output)
tMDKHDX
Figure 21. MII Management Interface Timing Diagram
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
42
Freescale Semiconductor
Local Bus
10 Local Bus
This section describes the DC and AC electrical specifications for the local bus interface of the device.
10.1
Local Bus DC Electrical Characteristics
This table provides the DC electrical characteristics for the local bus interface operating at BVDD =
3.3 V DC.
Table 38. Local Bus DC Electrical Characteristics (3.3 V DC)
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
2
BVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.8
V
Input current (VIN1 = 0 V or VIN = BVDD)
IIN
—
±5
A
High-level output voltage (BVDD = min, IOH = –2 mA)
VOH
2.4
—
V
Low-level output voltage (BVDD = min, IOL = 2mA)
VOL
—
0.4
V
Note:
1. Note that the symbol VIN, in this case, represents the BVIN symbol referenced in Table 1 and Table 2.
Table 39 provides the DC electrical characteristics for the local bus interface operating at
BVDD = 2.5 V DC.
Table 39. Local Bus DC Electrical Characteristics (2.5 V DC)
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
1.70
BVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.7
V
IIH
—
10
A
1
Input current (VIN = 0 V or VIN = BVDD)
IIL
–15
High-level output voltage (BVDD = min, IOH = –1 mA)
VOH
2.0
—
V
Low-level output voltage (BVDD = min, IOL = 1mA)
VOL
—
0.4
V
Note:
1. Note that the symbol VIN, in this case, represents the BVIN symbol referenced in Table 1 and Table 2.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
43
Local Bus
10.2
Local Bus AC Electrical Specifications
This table describes the timing parameters of the local bus interface at BVDD = 3.3 V. For information
about the frequency range of local bus, see Section 20.1, “Clock Ranges.”
Table 40. Local Bus Timing Parameters (BVDD = 3.3 V)—PLL Enabled
Symbol1
Min
Max
Unit
Notes
Local bus cycle time
tLBK
7.5
12
ns
2
Local bus duty cycle
tLBKH/tLBK
43
57
%
—
LCLK[n] skew to LCLK[m] or LSYNC_OUT
tLBKSKEW
—
150
ps
7, 8
Input setup to local bus clock (except LGTA/LUPWAIT)
tLBIVKH1
1.8
—
ns
3, 4
LGTA/LUPWAIT input setup to local bus clock
tLBIVKH2
1.7
—
ns
3, 4
Input hold from local bus clock (except LGTA/LUPWAIT)
tLBIXKH1
1.0
—
ns
3, 4
LGTA/LUPWAIT input hold from local bus clock
tLBIXKH2
1.0
—
ns
3, 4
LALE output transition to LAD/LDP output transition (LATCH hold time)
tLBOTOT
1.5
—
ns
6
Local bus clock to output valid (except LAD/LDP and LALE)
tLBKHOV1
—
2.0
ns
—
Local bus clock to data valid for LAD/LDP
tLBKHOV2
—
2.2
ns
3
Local bus clock to address valid for LAD
tLBKHOV3
—
2.3
ns
3
Local bus clock to LALE assertion
tLBKHOV4
—
2.3
ns
3
Output hold from local bus clock (except LAD/LDP and LALE)
tLBKHOX1
0.7
—
ns
3
Output hold from local bus clock for LAD/LDP
tLBKHOX2
0.7
—
ns
3
Local bus clock to output high Impedance (except LAD/LDP and LALE)
tLBKHOZ1
—
2.5
ns
5
Local bus clock to output high impedance for LAD/LDP
tLBKHOZ2
—
2.5
ns
5
Parameter
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus
timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case
for clock one (1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect
to the output (O) going invalid (X) or output hold time.
2. All timings are in reference to LSYNC_IN for PLL enabled and internal local bus clock for PLL bypass mode.
3. All signals are measured from BVDD/2 of the rising edge of LSYNC_IN for PLL enabled or internal local bus clock for PLL
bypass mode to 0.4 BVDD of the signal in question for 3.3-V signaling levels.
4. Input timings are measured at the pin.
5. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
6. tLBOTOT is a measurement of the minimum time between the negation of LALE and any change in LAD. tLBOTOT is
programmed with the LBCR[AHD] parameter.
7. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between
complementary signals at BVDD/2.
8. Guaranteed by design.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
44
Freescale Semiconductor
Local Bus
Table 41 describes the timing parameters of the local bus interface at BVDD = 2.5 V.
Table 41. Local Bus Timing Parameters (BVDD = 2.5 V)—PLL Enabled
Symbol1
Min
Max
Unit
Notes
Local bus cycle time
tLBK
7.5
12
ns
2
Local bus duty cycle
tLBKH/tLBK
43
57
%
—
LCLK[n] skew to LCLK[m] or LSYNC_OUT
tLBKSKEW
—
150
ps
7, 8
Input setup to local bus clock (except LGTA/UPWAIT)
tLBIVKH1
1.9
—
ns
3, 4
LGTA/LUPWAIT input setup to local bus clock
tLBIVKH2
1.8
—
ns
3, 4
Input hold from local bus clock (except LGTA/LUPWAIT)
tLBIXKH1
1.1
—
ns
3, 4
LGTA/LUPWAIT input hold from local bus clock
tLBIXKH2
1.1
—
ns
3, 4
LALE output transition to LAD/LDP output transition (LATCH hold time)
tLBOTOT
1.5
—
ns
6
Local bus clock to output valid (except LAD/LDP and LALE)
tLBKHOV1
—
2.1
ns
—
Local bus clock to data valid for LAD/LDP
tLBKHOV2
—
2.3
ns
3
Local bus clock to address valid for LAD
tLBKHOV3
—
2.4
ns
3
Local bus clock to LALE assertion
tLBKHOV4
—
2.4
ns
3
Output hold from local bus clock (except LAD/LDP and LALE)
tLBKHOX1
0.8
—
ns
3
Output hold from local bus clock for LAD/LDP
tLBKHOX2
0.8
—
ns
3
Local bus clock to output high Impedance (except LAD/LDP and LALE)
tLBKHOZ1
—
2.6
ns
5
Local bus clock to output high impedance for LAD/LDP
tLBKHOZ2
—
2.6
ns
5
Parameter
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus
timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case
for clock one (1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect
to the output (O) going invalid (X) or output hold time.
2. All timings are in reference to LSYNC_IN for PLL enabled and internal local bus clock for PLL bypass mode.
3. All signals are measured from BVDD/2 of the rising edge of LSYNC_IN for PLL enabled or internal local bus clock for PLL
bypass mode to 0.4 BVDD of the signal in question for 3.3-V signaling levels.
4. Input timings are measured at the pin.
5. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
6. tLBOTOT is a measurement of the minimum time between the negation of LALE and any change in LAD. tLBOTOT is
programmed with the LBCR[AHD] parameter.
7. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between
complementary signals at BVDD/2.
8. Guaranteed by design.
Figure 22 provides the AC test load for the local bus.
Output
Z0 = 50
RL = 50
BVDD/2
Figure 22. Local Bus AC Test Load
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
45
Local Bus
NOTE
PLL bypass mode is required when LBIU frequency is at or below 83 MHz.
When LBIU operates above 83 MHz, LBIU PLL is recommended to be
enabled.
Figure 23 through Figure 28 show the local bus signals.
LSYNC_IN
tLBIXKH1
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH2
tLBIVKH2
Input Signal:
LGTA
LUPWAIT
Output Signals:
LA[27:31]/LBCTL/LBCKE/LOE/
LSDA10/LSDWE/LSDRAS/
LSDCAS/LSDDQM[0:3]
tLBKHOV1
tLBKHOZ1
tLBKHOX1
tLBKHOV2
tLBKHOZ2
tLBKHOX2
Output (Data) Signals:
LAD[0:31]/LDP[0:3]
tLBKHOV3
tLBKHOZ2
tLBKHOX2
Output (Address) Signal:
LAD[0:31]
tLBOTOT
tLBKHOV4
LALE
Figure 23. Local Bus Signals (PLL Enabled)
This table describes the timing parameters of the local bus interface at BVDD = 3.3 V with PLL disabled.
Table 42. Local Bus Timing Parameters—PLL Bypassed
Symbol1
Min
Max
Unit
Notes
Local bus cycle time
tLBK
12
—
ns
2
Local bus duty cycle
tLBKH/tLBK
43
57
%
—
Internal launch/capture clock to LCLK delay
tLBKHKT
2.3
4.4
ns
8
Input setup to local bus clock (except LGTA/LUPWAIT)
tLBIVKH1
6.2
—
ns
4, 5
LGTA/LUPWAIT input setup to local bus clock
tLBIVKL2
6.1
—
ns
4, 5
Input hold from local bus clock (except LGTA/LUPWAIT)
tLBIXKH1
–1.8
—
ns
4, 5
Parameter
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
46
Freescale Semiconductor
Local Bus
Table 42. Local Bus Timing Parameters—PLL Bypassed (continued)
Symbol1
Min
Max
Unit
Notes
LGTA/LUPWAIT input hold from local bus clock
tLBIXKL2
–1.3
—
ns
4, 5
LALE output transition to LAD/LDP output transition (LATCH hold time)
tLBOTOT
1.5
—
ns
6
Local bus clock to output valid (except LAD/LDP and LALE)
tLBKLOV1
—
–0.3
ns
—
Local bus clock to data valid for LAD/LDP
tLBKLOV2
—
–0.1
ns
4
Local bus clock to address valid for LAD
tLBKLOV3
—
0
ns
4
Local bus clock to LALE assertion
tLBKLOV4
—
0
ns
4
Output hold from local bus clock (except LAD/LDP and LALE)
tLBKLOX1
–3.7
—
ns
4
Output hold from local bus clock for LAD/LDP
tLBKLOX2
–3.7
—
ns
4
Local bus clock to output high Impedance (except LAD/LDP and LALE)
tLBKLOZ1
—
0.2
ns
7
Local bus clock to output high impedance for LAD/LDP
tLBKLOZ2
—
0.2
ns
7
Parameter
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus
timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case
for clock one (1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect
to the output (O) going invalid (X) or output hold time.
2. All timings are in reference to local bus clock for PLL bypass mode. Timings may be negative with respect to the local bus
clock because the actual launch and capture of signals is done with the internal launch/capture clock, which precedes LCLK
by tLBKHKT.
3. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between
complementary signals at BVDD/2.
4. All signals are measured from BVDD/2 of the rising edge of local bus clock for PLL bypass mode to 0.4 BVDD of the signal
in question for 3.3-V signaling levels.
5. Input timings are measured at the pin.
6. The value of tLBOTOT is the measurement of the minimum time between the negation of LALE and any change in LAD.
7. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
8. Guaranteed by characterization.
9. Guaranteed by design.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
47
Local Bus
Internal Launch/Capture Clock
tLBKHKT
LCLK[n]
tLBIVKH1
tLBIXKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIVKL2
Input Signal:
LGTA
tLBIXKL2
LUPWAIT
tLBKLOV1
tLBKLOX1
Output Signals:
LA[27:31]/LBCTL/LBCKE/LOE/
LSDA10/LSDWE/LSDRAS/
LSDCAS/LSDDQM[0:3]
tLBKLOZ1
tLBKLOZ2
tLBKLOV2
Output (Data) Signals:
LAD[0:31]/LDP[0:3]
tLBKLOX2
tLBKLOV3
Output (Address) Signal:
LAD[0:31]
tLBKLOV4
tLBOTOT
LALE
Figure 24. Local Bus Signals (PLL Bypass Mode)
NOTE
In PLL bypass mode, LCLK[n] is the inverted version of the internal clock
with the delay of tLBKHKT. In this mode, signals are launched at the rising edge
of the internal clock and are captured at falling edge of the internal clock
with the exception of LGTA/LUPWAIT (which is captured on the rising
edge of the internal clock).
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
48
Freescale Semiconductor
Local Bus
LSYNC_IN
T1
T3
GPCM Mode Output Signals:
LCS[0:7]/LWE
tLBKHOV1
tLBKHOZ1
GPCM Mode Input Signal:
LGTA
tLBIVKH2
tLBIXKH2
UPM Mode Input Signal:
LUPWAIT
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH1
tLBKHOV1
tLBKHOZ1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 25. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 (PLL Enabled)
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
49
Local Bus
Internal Launch/Capture Clock
T1
T3
LCLK
tLBKLOX1
tLBKLOV1
GPCM Mode Output Signals:
LCS[0:7]/LWE
tLBKLOZ1
GPCM Mode Input Signal:
LGTA
tLBIVKL2
tLBIXKL2
UPM Mode Input Signal:
LUPWAIT
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 26. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 (PLL Bypass Mode)
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Freescale Semiconductor
Local Bus
LSYNC_IN
T1
T2
T3
T4
tLBKHOV1
tLBKHOZ1
GPCM Mode Output Signals:
LCS[0:7]/LWE
GPCM Mode Input Signal:
LGTA
tLBIVKH2
tLBIXKH2
UPM Mode Input Signal:
LUPWAIT
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH1
tLBKHOV1
tLBKHOZ1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 27. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 8 or 16 (PLL Enabled)
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
51
Local Bus
Internal Launch/Capture Clock
T1
T2
T3
T4
LCLK
tLBKLOX1
tLBKLOV1
GPCM Mode Output Signals:
LCS[0:7]/LWE
tLBKLOZ1
GPCM Mode Input Signal:
LGTA
tLBIVKL2
tLBIXKL2
UPM Mode Input Signal:
LUPWAIT
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 28. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 8 or 16 (PLL Bypass Mode)
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Freescale Semiconductor
Programmable Interrupt Controller
11 Programmable Interrupt Controller
In IRQ edge trigger mode, when an external interrupt signal is asserted (according to the programmed
polarity), it must remain the assertion for at least 3 system clocks (SYSCLK periods).
12 JTAG
This section describes the DC and AC electrical specifications for the IEEE 1149.1 (JTAG) interface of
the device.
12.1
JTAG DC Electrical Characteristics
This table provides the DC electrical characteristics for the JTAG interface.
Table 43. JTAG DC Electrical Characteristics
Symbol1
Min
Max
Unit
High-level input voltage
VIH
2
OVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.8
V
Input current (VIN1 = 0 V or VIN = VDD)
IIN
—
±5
A
High-level output voltage (OVDD = min, IOH = –2 mA)
VOH
2.4
—
V
Low-level output voltage (OVDD = min, IOL = 2 mA)
VOL
—
0.4
V
Parameter
Note:
1. Note that the symbol VIN, in this case, represents the OVIN.
12.2
JTAG AC Electrical Specifications
This table provides the JTAG AC timing specifications as defined in Figure 30 through Figure 32.
Table 44. JTAG AC Timing Specifications (Independent of SYSCLK)1
Symbol2
Min
Max
Unit
Notes
JTAG external clock frequency of operation
fJTG
0
33.3
MHz
—
JTAG external clock cycle time
t JTG
30
—
ns
—
tJTKHKL
15
—
ns
—
tJTGR & tJTGF
0
2
ns
6
tTRST
25
—
ns
3
Boundary-scan data
TMS, TDI
tJTDVKH
tJTIVKH
4
0
—
—
Boundary-scan data
TMS, TDI
tJTDXKH
tJTIXKH
20
25
—
—
Parameter
JTAG external clock pulse width measured at 1.4 V
JTAG external clock rise and fall times
TRST assert time
ns
Input setup times:
4
ns
Input hold times:
4
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
53
JTAG
Table 44. JTAG AC Timing Specifications (Independent of SYSCLK)1 (continued)
Symbol2
Min
Max
Boundary-scan data
TDO
tJTKLDV
tJTKLOV
4
2
20
10
Boundary-scan data
TDO
tJTKLDX
tJTKLOX
30
30
—
—
JTAG external clock to output high impedance:
Boundary-scan data
TDO
tJTKLDZ
tJTKLOZ
3
3
19
9
Parameter
Unit
Notes
ns
Valid times:
5
ns
Output hold times:
5
ns
5, 6
Notes:
1. All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in question.
The output timings are measured at the pins. All output timings assume a purely resistive 50-load (see Figure 29).
Time-of-flight delays must be added for trace lengths, vias, and connectors in the system.
2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tJTDVKH symbolizes JTAG device
timing (JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the tJTG clock reference (K)
going to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG timing (JT) with respect to the time data input signals
(D) went invalid (X) relative to the tJTG clock reference (K) going to the high (H) state. Note that, in general, the clock reference
symbol representation is based on three letters representing the clock of a particular functional. For rise and fall times, the
latter convention is used with the appropriate letter: R (rise) or F (fall).
3. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only.
4. Non-JTAG signal input timing with respect to tTCLK.
5. Non-JTAG signal output timing with respect to tTCLK.
6. Guaranteed by design.
Figure 29 provides the AC test load for TDO and the boundary-scan outputs.
Z0 = 50
Output
RL = 50
OVDD/2
Figure 29. AC Test Load for the JTAG Interface
Figure 30 provides the JTAG clock input timing diagram.
JTAG
External Clock
VM
VM
VM
tJTGR
tJTKHKL
tJTG
tJTGF
VM = Midpoint Voltage (OVDD/2)
Figure 30. JTAG Clock Input Timing Diagram
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
54
Freescale Semiconductor
JTAG
Figure 31 provides the TRST timing diagram.
TRST
VM
VM
tTRST
VM = Midpoint Voltage (OVDD/2)
Figure 31. TRST Timing Diagram
Figure 32 provides the boundary-scan timing diagram.
JTAG
External Clock
VM
VM
tJTDVKH
tJTDXKH
Boundary
Data Inputs
Input
Data Valid
tJTKLDV
tJTKLDX
Boundary
Data Outputs
Output Data Valid
tJTKLDZ
Boundary
Data Outputs
Output Data Valid
VM = Midpoint Voltage (OVDD/2)
Figure 32. Boundary-Scan Timing Diagram
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
55
I2 C
13 I2C
This section describes the DC and AC electrical characteristics for the I2C interfaces of the device.
13.1
I2C DC Electrical Characteristics
This table provides the DC electrical characteristics for the I2C interfaces.
Table 45. I2C DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
Notes
Input high voltage level
VIH
0.7 OVDD
OVDD + 0.3
V
—
Input low voltage level
VIL
–0.3
0.3 OVDD
V
—
Low level output voltage
VOL
0
0.2 OVDD
V
1
tI2KHKL
0
50
ns
2
Input current each I/O pin (input voltage is between
0.1 OVDD and 0.9 OVDD(max)
II
–10
10
A
3
Capacitance for each I/O pin
CI
—
10
pF
—
Pulse width of spikes which must be suppressed by the
input filter
Notes:
1. Output voltage (open drain or open collector) condition = 3 mA sink current.
2. See the MPC8548E PowerQUICC™ III Integrated Processor Family Reference Manual, for information on the digital filter
used.
3. I/O pins obstruct the SDA and SCL lines if OVDD is switched off.
13.2
I2C AC Electrical Specifications
This table provides the AC timing parameters for the I2C interfaces.
Table 46. I2C AC Electrical Specifications
Symbol1
Min
Max
Unit
Notes
SCL clock frequency
fI2C
0
400
kHz
—
Low period of the SCL clock
tI2CL
1.3
—
s
4
High period of the SCL clock
tI2CH
0.6
—
s
4
Setup time for a repeated START condition
tI2SVKH
0.6
—
s
4
Hold time (repeated) START condition (after this period,
the first clock pulse is generated)
tI2SXKL
0.6
—
s
4
Data setup time
tI2DVKH
100
—
ns
4
s
2
—
0
—
—
Parameter
Data input hold time:
tI2DXKL
CBUS compatible masters
I2C bus devices
Data output delay time:
tI2OVKL
—
0.9
—
3
Set-up time for STOP condition
tI2PVKH
0.6
—
s
—
Bus free time between a STOP and START condition
tI2KHDX
1.3
—
s
—
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Freescale Semiconductor
I2 C
Table 46. I2C AC Electrical Specifications (continued)
Parameter
Symbol1
Min
Max
Unit
Notes
Noise margin at the LOW level for each connected device
(including hysteresis)
VNL
0.1 OVDD
—
V
—
Noise margin at the HIGH level for each connected
device (including hysteresis)
VNH
0.2 OVDD
—
V
—
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tI2DVKH symbolizes I2C timing (I2)
with respect to the time data input signals (D) reach the valid state (V) relative to the tI2C clock reference (K) going to the high
(H) state or setup time. Also, tI2SXKL symbolizes I2C timing (I2) for the time that the data with respect to the start condition
(S) went invalid (X) relative to the tI2C clock reference (K) going to the low (L) state or hold time. Also, tI2PVKH symbolizes I2C
timing (I2) for the time that the data with respect to the stop condition (P) reaching the valid state (V) relative to the tI2C clock
reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate
letter: R (rise) or F (fall).
2. As a transmitter, the device provides a delay time of at least 300 ns for the SDA signal (see the VIH(min) of the SCL signal)
to bridge the undefined region of the falling edge of SCL to avoid unintended generation of Start or Stop condition. When the
device acts as the I2C bus master while transmitting, the device drives both SCL and SDA. As long as the load on SCL and
SDA are balanced, the device would not cause unintended generation of Start or Stop condition. Therefore, the 300 ns SDA
output delay time is not a concern. If, under some rare condition, the 300 ns SDA output delay time is required for the device
as a transmitter, the following setting is recommended for the FDR bit field of the I2CFDR register to ensure both the desired
I2C SCL clock frequency and SDA output delay time are achieved, assuming that the desired I2C SCL clock frequency is 400
kHz and the Digital Filter Sampling Rate Register (I2CDFSRR) is programmed with its default setting of 0x10 (decimal 16):
333 MHz 266 MHz
200 MHz
133 MHz
I2C source clock frequency
FDR bit setting
0x2A
0x05
0x26
0x00
Actual FDR divider selected
896
704
512
384
378 kHz
390 kHz
346 kHz
Actual I2C SCL frequency generated 371 kHz
For the detail of I2C frequency calculation, see Determining the I2C Frequency Divider Ratio for SCL (AN2919). Note that the
I2C source clock frequency is half of the CCB clock frequency for the device.
3. The maximum tI2DXKL has only to be met if the device does not stretch the LOW period (tI2CL) of the SCL signal.
4. Guaranteed by design.
Figure 33 provides the AC test load for the I2C.
Output
Z0 = 50
RL = 50
OVDD/2
Figure 33. I2C AC Test Load
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
57
I2 C
Figure 34 shows the AC timing diagram for the I2C bus.
SDA
tI2CF
tI2DVKH
tI2CL
tI2KHKL
tI2SXKL
tI2CF
tI2CR
SCL
tI2SXKL
S
tI2CH
tI2DXKL,tI2OVKL
tI2SVKH
Sr
tI2PVKH
P
S
Figure 34. I2C Bus AC Timing Diagram
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Freescale Semiconductor
GPOUT/GPIN
14 GPOUT/GPIN
This section describes the DC and AC electrical specifications for the GPOUT/GPIN bus of the device.
14.1
GPOUT/GPIN Electrical Characteristics
Table 47 and Table 48 provide the DC electrical characteristics for the GPOUT interface.
Table 47. GPOUT DC Electrical Characteristics (3.3 V DC)
Parameter
Symbol
Min
Max
Unit
BVDD
3.13
3.47
V
High-level output voltage
(BVDD = min, IOH = –2 mA)
VOH
BVDD – 0.2
—
V
Low-level output voltage
(BVDD = min, IOL = 2mA)
VOL
—
0.2
V
Supply voltage 3.3 V
Table 48. GPOUT DC Electrical Characteristics (2.5 V DC)
Parameter
Symbol
Min
Max
Unit
BVDD
2.37
2.63
V
High-level output voltage
(BVDD = min, IOH = –1 mA)
VOH
2.0
BVDD + 0.3
V
Low-level output voltage
(BVDD min, IOL = 1 mA)
VOL
GND – 0.3
0.4
V
Supply voltage 2.5 V
Table 49 and Table 50 provide the DC electrical characteristics for the GPIN interface.
Table 49. GPIN DC Electrical Characteristics (3.3 V DC)
Parameter
Symbol
Min
Max
Unit
BVDD
3.13
3.47
V
High-level input voltage
VIH
2
BVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.8
V
Input current
(BVIN 1 = 0 V or BVIN = BVDD)
IIN
—
±5
A
Supply voltage 3.3 V
Note:
1. The symbol BVIN, in this case, represents the BVIN symbol referenced in Table 1.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
59
PCI/PCI-X
Table 50. GPIN DC Electrical Characteristics (2.5 V DC)
Parameter
Symbol
Min
Max
Unit
BVDD
2.37
2.63
V
High-level input voltage
VIH
1.70
BVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.7
V
Input current
(BVIN 1 = 0 V or BVIN = BVDD)
IIH
—
10
A
Supply voltage 2.5 V
Note:
1. The symbol BVIN, in this case, represents the BVIN symbol referenced in Table 1.
15 PCI/PCI-X
This section describes the DC and AC electrical specifications for the PCI/PCI-X bus of the device.
Note that the maximum PCI-X frequency in synchronous mode is 110 MHz.
15.1
PCI/PCI-X DC Electrical Characteristics
This table provides the DC electrical characteristics for the PCI/PCI-X interface.
Table 51. PCI/PCI-X DC Electrical Characteristics1
Parameter
Symbol
Min
Max
Unit
Notes
High-level input voltage
VIH
2
OVDD + 0.3
V
—
Low-level input voltage
VIL
–0.3
0.8
V
—
Input current (VIN = 0 V or VIN = VDD)
IIN
—
±5
A
2
High-level output voltage (OVDD = min, IOH = –2 mA)
VOH
2.4
—
V
—
Low-level output voltage (OVDD = min, IOL = 2 mA)
VOL
—
0.4
V
—
Notes:
1. Ranges listed do not meet the full range of the DC specifications of the PCI 2.2 Local Bus Specifications.
2. The symbol VIN, in this case, represents the OVIN symbol referenced in Table 1 and Table 2.
15.2
PCI/PCI-X AC Electrical Specifications
This section describes the general AC timing parameters of the PCI/PCI-X bus. Note that the clock
reference CLK is represented by SYSCLK when the PCI controller is configured for synchronous mode
and by PCIn_CLK when it is configured for asynchronous mode.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Freescale Semiconductor
PCI/PCI-X
This table provides the PCI AC timing specifications at 66 MHz.
Table 52. PCI AC Timing Specifications at 66 MHz
Symbol1
Min
Max
Unit
Notes
CLK to output valid
tPCKHOV
—
6.0
ns
2, 3
Output hold from CLK
tPCKHOX
2.0
—
ns
2, 10
CLK to output high impedance
tPCKHOZ
—
14
ns
2, 4, 11
Input setup to CLK
tPCIVKH
3.0
—
ns
2, 5, 10
Input hold from CLK
tPCIXKH
0
—
ns
2, 5, 10
REQ64 to HRESET 9 setup time
tPCRVRH
10 tSYS
—
clocks
6, 7, 11
HRESET to REQ64 hold time
tPCRHRX
0
50
ns
7, 11
HRESET high to first FRAME assertion
tPCRHFV
10
—
clocks
8, 11
Parameter
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI/PCI-X
timing (PC) with respect to the time the input signals (I) reach the valid state (V) relative to the SYSCLK clock, tSYS, reference
(K) going to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI/PCI-X timing (PC) with respect to the time hard
reset (R) went high (H) relative to the frame signal (F) going to the valid (V) state.
2. See the timing measurement conditions in the PCI 2.2 Local Bus Specifications.
3. All PCI signals are measured from OVDD/2 of the rising edge of SYSCLK or PCI_CLKn to 0.4 OVDD of the signal in question
for 3.3-V PCI signaling levels.
4. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
5. Input timings are measured at the pin.
6. The timing parameter tSYS indicates the minimum and maximum CLK cycle times for the various specified frequencies. The
system clock period must be kept within the minimum and maximum defined ranges. For values see Section 20, “Clocking.”
7. The setup and hold time is with respect to the rising edge of HRESET.
8. The timing parameter tPCRHFV is a minimum of 10 clocks rather than the minimum of 5 clocks in the PCI 2.2 Local Bus
Specifications.
9. The reset assertion timing requirement for HRESET is 100 s.
10.Guaranteed by characterization.
11.Guaranteed by design.
Figure 35 provides the AC test load for PCI and PCI-X.
Output
Z0 = 50
RL = 50
LVDD/2
Figure 35. PCI/PCI-X AC Test Load
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
61
PCI/PCI-X
Figure 36 shows the PCI/PCI-X input AC timing conditions.
CLK
tPCIVKH
tPCIXKH
Input
Figure 36. PCI/PCI-X Input AC Timing Measurement Conditions
Figure 37 shows the PCI/PCI-X output AC timing conditions.
CLK
tPCKHOV
Output Delay
tPCKHOZ
High-Impedance
Output
Figure 37. PCI/PCI-X Output AC Timing Measurement Condition
Table 53 provides the PCI-X AC timing specifications at 66 MHz.
Table 53. PCI-X AC Timing Specifications at 66 MHz
Parameter
Symbol
Min
Max
Unit
Notes
SYSCLK to signal valid delay
tPCKHOV
—
3.8
ns
1, 2, 3, 7, 8
Output hold from SYSCLK
tPCKHOX
0.7
—
ns
1, 10
SYSCLK to output high impedance
tPCKHOZ
—
7
ns
1, 4, 8, 11
Input setup time to SYSCLK
tPCIVKH
1.7
—
ns
3, 5
Input hold time from SYSCLK
tPCIXKH
0.5
—
ns
10
REQ64 to HRESET setup time
tPCRVRH
10
—
clocks
11
HRESET to REQ64 hold time
tPCRHRX
0
50
ns
11
HRESET high to first FRAME assertion
tPCRHFV
10
—
clocks
9, 11
PCI-X initialization pattern to HRESET setup time
tPCIVRH
10
—
clocks
11
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Freescale Semiconductor
PCI/PCI-X
Table 53. PCI-X AC Timing Specifications at 66 MHz (continued)
Parameter
HRESET to PCI-X initialization pattern hold time
Symbol
Min
Max
Unit
Notes
tPCRHIX
0
50
ns
6, 11
Notes:
1. See the timing measurement conditions in the PCI-X 1.0a Specification.
2. Minimum times are measured at the package pin (not the test point). Maximum times are measured with the test point and
load circuit.
3. Setup time for point-to-point signals applies to REQ and GNT only. All other signals are bused.
4. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
5. Setup time applies only when the device is not driving the pin. Devices cannot drive and receive signals at the same time.
6. Maximum value is also limited by delay to the first transaction (time for HRESET high to first configuration access, tPCRHFV).
The PCI-X initialization pattern control signals after the rising edge of HRESET must be negated no later than two clocks
before the first FRAME and must be floated no later than one clock before FRAME is asserted.
7. A PCI-X device is permitted to have the minimum values shown for tPCKHOV and tCYC only in PCI-X mode. In conventional
mode, the device must meet the requirements specified in PCI 2.2 for the appropriate clock frequency.
8. Device must meet this specification independent of how many outputs switch simultaneously.
9. The timing parameter tPCRHFV is a minimum of 10 clocks rather than the minimum of 5 clocks in the PCI-X 1.0a Specification.
10.Guaranteed by characterization.
11.Guaranteed by design.
This table provides the PCI-X AC timing specifications at 133 MHz. Note that the maximum PCI-X
frequency in synchronous mode is 110 MHz.
Table 54. PCI-X AC Timing Specifications at 133 MHz
Parameter
Symbol
Min
Max
Unit
Notes
SYSCLK to signal valid delay
tPCKHOV
—
3.8
ns
1, 2, 3, 7, 8
Output hold from SYSCLK
tPCKHOX
0.7
—
ns
1, 11
SYSCLK to output high impedance
tPCKHOZ
—
7
ns
1, 4, 8, 12
Input setup time to SYSCLK
tPCIVKH
1.2
—
ns
3, 5, 9, 11
Input hold time from SYSCLK
tPCIXKH
0.5
—
ns
11
REQ64 to HRESET setup time
tPCRVRH
10
—
clocks
12
HRESET to REQ64 hold time
tPCRHRX
0
50
ns
12
HRESET high to first FRAME assertion
tPCRHFV
10
—
clocks
10, 12
PCI-X initialization pattern to HRESET setup time
tPCIVRH
10
—
clocks
12
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
63
PCI/PCI-X
Table 54. PCI-X AC Timing Specifications at 133 MHz (continued)
Parameter
HRESET to PCI-X initialization pattern hold time
Symbol
Min
Max
Unit
Notes
tPCRHIX
0
50
ns
6, 12
Notes:
1. See the timing measurement conditions in the PCI-X 1.0a Specification.
2. Minimum times are measured at the package pin (not the test point). Maximum times are measured with the test point and
load circuit.
3. Setup time for point-to-point signals applies to REQ and GNT only. All other signals are bused.
4. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
5. Setup time applies only when the device is not driving the pin. Devices cannot drive and receive signals at the same time.
6. Maximum value is also limited by delay to the first transaction (time for HRESET high to first configuration access, tPCRHFV).
The PCI-X initialization pattern control signals after the rising edge of HRESET must be negated no later than two clocks
before the first FRAME and must be floated no later than one clock before FRAME is asserted.
7. A PCI-X device is permitted to have the minimum values shown for tPCKHOV and tCYC only in PCI-X mode. In conventional
mode, the device must meet the requirements specified in PCI 2.2 for the appropriate clock frequency.
8. Device must meet this specification independent of how many outputs switch simultaneously.
9. The timing parameter tPCIVKH is a minimum of 1.4 ns rather than the minimum of 1.2 ns in the PCI-X 1.0a Specification.
10.The timing parameter tPCRHFV is a minimum of 10 clocks rather than the minimum of 5 clocks in the PCI-X 1.0a
Specification.
11.Guaranteed by characterization.
12.Guaranteed by design.
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High-Speed Serial Interfaces (HSSI)
16 High-Speed Serial Interfaces (HSSI)
The device features one Serializer/Deserializer (SerDes) interface to be used for high-speed serial
interconnect applications. The SerDes interface can be used for PCI Express and/or serial RapidIO data
transfers.
This section describes the common portion of SerDes DC electrical specifications, which is the DC
requirement for SerDes reference clocks. The SerDes data lane’s transmitter and receiver reference circuits
are also shown.
16.1
Signal Terms Definition
The SerDes utilizes differential signaling to transfer data across the serial link. This section defines terms
used in the description and specification of differential signals.
Figure 38 shows how the signals are defined. For illustration purpose, only one SerDes lane is used for the
description. The figure shows a waveform for either a transmitter output (SD_TX and SD_TX) or a
receiver input (SD_RX and SD_RX). Each signal swings between A volts and B volts where A > B.
Using this waveform, the definitions are as follows. To simplify the illustration, the following definitions
assume that the SerDes transmitter and receiver operate in a fully symmetrical differential signaling
environment.
• Single-ended swing
The transmitter output signals and the receiver input signals SD_TX, SD_TX, SD_RX and SD_RX
each have a peak-to-peak swing of A – B volts. This is also referred as each signal wire’s
single-ended swing.
• Differential output voltage, VOD (or differential output swing):
The differential output voltage (or swing) of the transmitter, VOD, is defined as the difference of
the two complimentary output voltages: VSD_TX – VSD_TX. The VOD value can be either positive
or negative.
• Differential input voltage, VID (or differential input swing):
The differential input voltage (or swing) of the receiver, VID, is defined as the difference of the two
complimentary input voltages: VSD_RX – VSD_RX. The VID value can be either positive or
negative.
• Differential peak voltage, VDIFFp
The peak value of the differential transmitter output signal or the differential receiver input signal
is defined as differential peak voltage, VDIFFp = |A – B| volts.
• Differential peak-to-peak, VDIFFp-p
Because the differential output signal of the transmitter and the differential input signal of the
receiver each range from A – B to –(A – B) volts, the peak-to-peak value of the differential
transmitter output signal or the differential receiver input signal is defined as differential
peak-to-peak voltage, VDIFFp-p = 2 VDIFFp = 2 |(A – B)| volts, which is twice of differential
swing in amplitude, or twice of the differential peak. For example, the output differential
peak-to-peak voltage can also be calculated as VTX-DIFFp-p = 2 |VOD|.
• Common mode voltage, Vcm
The common mode voltage is equal to one half of the sum of the voltages between each conductor
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65
High-Speed Serial Interfaces (HSSI)
of a balanced interchange circuit and ground. In this example, for SerDes output, Vcm_out =
VSD_TX + VSD_TX = (A + B)/2, which is the arithmetic mean of the two complimentary output
voltages within a differential pair. In a system, the common mode voltage may often differ from
one component’s output to the other’s input. Sometimes, it may be even different between the
receiver input and driver output circuits within the same component. It is also referred to as the DC
offset.
A Volts
SD_TX or
SD_RX
Vcm = (A + B)/2
B Volts
SD_TX or
SD_RX
Differential Swing, VID or VOD = A – B
Differential Peak Voltage, VDIFFp = |A – B|
Differential Peak-Peak Voltage, VDIFFpp = 2*VDIFFp (not shown)
Figure 38. Differential Voltage Definitions for Transmitter or Receiver
To illustrate these definitions using real values, consider the case of a CML (current mode logic)
transmitter that has a common mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing
that goes between 2.5 and 2.0 V. Using these values, the peak-to-peak voltage swing of each signal (TD or
TD) is 500 mVp-p, which is referred as the single-ended swing for each signal. In this example, since the
differential signaling environment is fully symmetrical, the transmitter output’s differential swing (VOD)
has the same amplitude as each signal’s single-ended swing. The differential output signal ranges between
500 and –500 mV, in other words, VOD is 500 mV in one phase and –500 mV in the other phase. The peak
differential voltage (VDIFFp) is 500 mV. The peak-to-peak differential voltage (VDIFFp-p) is 1000 mVp-p.
16.2
SerDes Reference Clocks
The SerDes reference clock inputs are applied to an internal PLL whose output creates the clock used by
the corresponding SerDes lanes. The SerDes reference clocks inputs are SD_REF_CLK and
SD_REF_CLK for PCI Express and serial RapidIO.
The following sections describe the SerDes reference clock requirements and some application
information.
16.2.1
SerDes Reference Clock Receiver Characteristics
Figure 39 shows a receiver reference diagram of the SerDes reference clocks.
• The supply voltage requirements for XVDD_SRDS2 are specified in Table 1 and Table 2.
• SerDes Reference clock receiver reference circuit structure:
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High-Speed Serial Interfaces (HSSI)
•
•
— The SD_REF_CLK and SD_REF_CLK are internally AC-coupled differential inputs as shown
in Figure 39. Each differential clock input (SD_REF_CLK or SD_REF_CLK) has a 50-
termination to SGND_SRDSn (xcorevss) followed by on-chip AC-coupling.
— The external reference clock driver must be able to drive this termination.
— The SerDes reference clock input can be either differential or single-ended. See the differential
mode and single-ended mode description below for further detailed requirements.
The maximum average current requirement that also determines the common mode voltage range:
— When the SerDes reference clock differential inputs are DC coupled externally with the clock
driver chip, the maximum average current allowed for each input pin is 8 mA. In this case, the
exact common mode input voltage is not critical as long as it is within the range allowed by the
maximum average current of 8 mA (see the following bullet for more detail), since the input is
AC-coupled on-chip.
— This current limitation sets the maximum common mode input voltage to be less than 0.4 V
(0.4 V/50 = 8 mA) while the minimum common mode input level is 0.1 V above
SGND_SRDSn (xcorevss). For example, a clock with a 50/50 duty cycle can be produced by
a clock driver with output driven by its current source from 0 to 16 mA (0–0.8 V), such that
each phase of the differential input has a single-ended swing from 0 V to 800 mV with the
common mode voltage at 400 mV.
— If the device driving the SD_REF_CLK and SD_REF_CLK inputs cannot drive 50 to
SGND_SRDSn (xcorevss) DC, or it exceeds the maximum input current limitations, then it
must be AC-coupled off-chip.
The input amplitude requirement:
— This requirement is described in detail in the following sections.
50
SD_REF_CLK
Input
Amp
SD_REF_CLK
50
Figure 39. Receiver of SerDes Reference Clocks
16.2.2
DC Level Requirement for SerDes Reference Clocks
The DC level requirement for the SerDes reference clock inputs is different depending on the signaling
mode used to connect the clock driver chip and SerDes reference clock inputs as described below:
• Differential mode
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High-Speed Serial Interfaces (HSSI)
•
— The input amplitude of the differential clock must be between 400 and 1600 mV differential
peak-peak (or between 200 and 800 mV differential peak). In other words, each signal wire of
the differential pair must have a single-ended swing less than 800 mV and greater than 200 mV.
This requirement is the same for both external DC- or AC-coupled connection.
— For external DC-coupled connection, as described in Section 16.2.1, “SerDes Reference Clock
Receiver Characteristics,” the maximum average current requirements sets the requirement for
average voltage (common mode voltage) to be between 100 and 400 mV. Figure 40 shows the
SerDes reference clock input requirement for DC-coupled connection scheme.
— For external AC-coupled connection, there is no common mode voltage requirement for the
clock driver. Since the external AC-coupling capacitor blocks the DC level, the clock driver
and the SerDes reference clock receiver operate in different command mode voltages. The
SerDes reference clock receiver in this connection scheme has its common mode voltage set to
SGND_SRDSn. Each signal wire of the differential inputs is allowed to swing below and above
the command mode voltage (SGND_SRDSn). Figure 41 shows the SerDes reference clock
input requirement for AC-coupled connection scheme.
Single-ended mode
— The reference clock can also be single-ended. The SD_REF_CLK input amplitude
(single-ended swing) must be between 400 and 800 mV peak-to-peak (from Vmin to Vmax) with
SD_REF_CLK either left unconnected or tied to ground.
— The SD_REF_CLK input average voltage must be between 200 and 400 mV. Figure 42 shows
the SerDes reference clock input requirement for single-ended signaling mode.
— To meet the input amplitude requirement, the reference clock inputs might need to be DC- or
AC-coupled externally. For the best noise performance, the reference of the clock could be DCor AC-coupled into the unused phase (SD_REF_CLK) through the same source impedance as
the clock input (SD_REF_CLK) in use.
200 mV < Input Amplitude or Differential Peak < 800 mV
SD_REF_CLK
Vmax < 800 mV
100 mV < Vcm < 400 mV
Vmin > 0 V
SD_REF_CLK
Figure 40. Differential Reference Clock Input DC Requirements (External DC-Coupled)
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High-Speed Serial Interfaces (HSSI)
200 mV < Input Amplitude or Differential Peak < 800 mV
SD_REF_CLK
Vmax < Vcm + 400 mV
Vcm
SD_REF_CLK
Vmin > Vcm – 400 mV
Figure 41. Differential Reference Clock Input DC Requirements (External AC-Coupled)
400 mV < SD_REF_CLK Input Amplitude < 800 mV
SD_REF_CLK
0V
SD_REF_CLK
Figure 42. Single-Ended Reference Clock Input DC Requirements
16.2.3
•
•
•
Interfacing with Other Differential Signaling Levels
With on-chip termination to SGND_SRDSn (xcorevss), the differential reference clocks inputs are
HCSL (high-speed current steering logic) compatible DC-coupled.
Many other low voltage differential type outputs like LVDS (low voltage differential signaling) can
be used but may need to be AC-coupled due to the limited common mode input range allowed (100
to 400 mV) for DC-coupled connection.
LVPECL outputs can produce signal with too large amplitude and may need to be DC-biased at
clock driver output first, then followed with series attenuation resistor to reduce the amplitude, in
addition to AC-coupling.
NOTE
Figure 43 through Figure 46 below are for conceptual reference only. Due
to the fact that clock driver chip's internal structure, output impedance, and
termination requirements are different between various clock driver chip
manufacturers, it is very possible that the clock circuit reference designs
provided by clock driver chip vendor are different from what is shown
below. They might also vary from one vendor to the other. Therefore,
Freescale Semiconductor can neither provide the optimal clock driver
reference circuits, nor guarantee the correctness of the following clock
driver connection reference circuits. The system designer is recommended
to contact the selected clock driver chip vendor for the optimal reference
circuits with the SerDes reference clock receiver requirement provided in
this document.
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High-Speed Serial Interfaces (HSSI)
Figure 43 shows the SerDes reference clock connection reference circuits for HCSL type clock driver. It
assumes that the DC levels of the clock driver chip is compatible with SerDes reference clock input’s DC
requirement.
HCSL CLK Driver Chip
CLK_Out
MPC8548E
SD_REF_CLK
33
50
SerDes Refer.
CLK Receiver
100 Differential PWB Trace
Clock Driver
33
SD_REF_CLK
CLK_Out
50
Total 50 Assume clock driver’s
output impedance is about 16
Clock driver vendor dependent
source termination resistor
Figure 43. DC-Coupled Differential Connection with HCSL Clock Driver (Reference Only)
Figure 44 shows the SerDes reference clock connection reference circuits for LVDS type clock driver.
Since LVDS clock driver’s common mode voltage is higher than the SerDes reference clock input’s
allowed range (100–400 mV), AC-coupled connection scheme must be used. It assumes the LVDS output
driver features 50-termination resistor. It also assumes that the LVDS transmitter establishes its own
common mode level without relying on the receiver or other external component.
LVDS CLK Driver Chip
CLK_Out
MPC8548E
50
SerDes Refer.
CLK Receiver
100 Differential PWB Trace
Clock Driver
CLK_Out
SD_REF_CLK
10 nF
10 nF
SD_REF_CLK
50
Figure 44. AC-Coupled Differential Connection with LVDS Clock Driver (Reference Only)
Figure 45 shows the SerDes reference clock connection reference circuits for LVPECL type clock driver.
Since LVPECL driver’s DC levels (both common mode voltages and output swing) are incompatible with
the SerDes reference clock input’s DC requirement, AC-coupling must be used. Figure 45 assumes that
the LVPECL clock driver’s output impedance is 50 R1 is used to DC-bias the LVPECL outputs prior
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High-Speed Serial Interfaces (HSSI)
to AC-coupling. Its value could be ranged from 140to 240 depending on the clock driver vendor’s
requirement. R2 is used together with the SerDes reference clock receiver’s 50- termination resistor to
attenuate the LVPECL output’s differential peak level such that it meets the SerDes reference clock’s
differential input amplitude requirement (between 200 and 800 mV differential peak). For example, if the
LVPECL output’s differential peak is 900 mV and the desired SerDes reference clock input amplitude is
selected as 600 mV, the attenuation factor is 0.67, which requires R2 = 25 Consult a clock driver chip
manufacturer to verify whether this connection scheme is compatible with a particular clock driver chip.
LVPECL CLK Driver Chip
MPC8548E
CLK_Out
Clock Driver
SD_REF_CLK
10 nF
R2
50
SerDes Refer.
CLK Receiver
R1 100 Differential PWB Trace
10 nF
R2
SD_REF_CLK
CLK_Out
50
R1
Figure 45. AC-Coupled Differential Connection with LVPECL Clock Driver (Reference Only)
Figure 46 shows the SerDes reference clock connection reference circuits for a single-ended clock driver.
It assumes the DC levels of the clock driver are compatible with the SerDes reference clock input’s DC
requirement.
Single-Ended CLK
Driver Chip
MPC8548E
Total 50 Assume clock driver’s
output impedance is about 16
SD_REF_CLK
33
Clock Driver
CLK_Out
50
SerDes Refer.
CLK Receiver
100 Differential PWB Trace
SD_REF_CLK
50
50
Figure 46. Single-Ended Connection (Reference Only)
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71
High-Speed Serial Interfaces (HSSI)
16.2.4
AC Requirements for SerDes Reference Clocks
The clock driver selected must provide a high quality reference clock with low phase noise and
cycle-to-cycle jitter. Phase noise less than 100 kHz can be tracked by the PLL and data recovery loops and
is less of a problem. Phase noise above 15 MHz is filtered by the PLL. The most problematic phase noise
occurs in the 1–15 MHz range. The source impedance of the clock driver must be 50 to match the
transmission line and reduce reflections which are a source of noise to the system.
The detailed AC requirements of the SerDes reference clocks are defined by each interface protocol based
on application usage. See the following sections for detailed information:
• Section 17.2, “AC Requirements for PCI Express SerDes Clocks”
• Section 18.2, “AC Requirements for Serial RapidIO SD_REF_CLK and SD_REF_CLK”
16.2.4.1
Spread Spectrum Clock
SD_REF_CLK/SD_REF_CLK are designed to work with a spread spectrum clock (+0% to –0.5%
spreading at 30–33 kHz rate is allowed), assuming both ends have same reference clock. For better results,
a source without significant unintended modulation must be used.
16.3
SerDes Transmitter and Receiver Reference Circuits
Figure 47 shows the reference circuits for SerDes data lane’s transmitter and receiver.
SD_TXn
SD_RXn
50
50
Receiver
Transmitter
50
SD_TXn
SD_RXn
50
Figure 47. SerDes Transmitter and Receiver Reference Circuits
The DC and AC specification of SerDes data lanes are defined in each interface protocol section below
(PCI Express, Serial Rapid IO, or SGMII) in this document based on the application usage:
• Section 17, “PCI Express”
• Section 18, “Serial RapidIO”
Note that external an AC coupling capacitor is required for the above three serial transmission protocols
with the capacitor value defined in the specification of each protocol section.
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PCI Express
17 PCI Express
This section describes the DC and AC electrical specifications for the PCI Express bus of the MPC8548E.
17.1
DC Requirements for PCI Express SD_REF_CLK and
SD_REF_CLK
For more information, see Section 16.2, “SerDes Reference Clocks.”
17.2
AC Requirements for PCI Express SerDes Clocks
Table 55 lists the AC requirements for the PCI Express SerDes clocks.
Table 55. SD_REF_CLK and SD_REF_CLK AC Requirements
Symbol
Min
Typ
Max
Unit
Notes
REFCLK cycle time
—
10
—
ns
1
tREFCJ
REFCLK cycle-to-cycle jitter. Difference in the period of any two
adjacent REFCLK cycles.
—
—
100
ps
—
tREFPJ
Phase jitter. Deviation in edge location with respect to mean edge
location.
–50
—
50
ps
—
tREF
Parameter Description
Note:
1. Typical based on PCI Express Specification 2.0.
17.3
Clocking Dependencies
The ports on the two ends of a link must transmit data at a rate that is within 600 parts per million (ppm)
of each other at all times. This is specified to allow bit rate clock sources with a ±300 ppm tolerance.
17.4
Physical Layer Specifications
The following is a summary of the specifications for the physical layer of PCI Express on this device. For
further details as well as the specifications of the transport and data link layer see PCI Express Base
Specification. Rev. 1.0a.
17.4.1
Differential Transmitter (TX) Output
Table 56 defines the specifications for the differential output at all transmitters (TXs). The parameters are
specified at the component pins.
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PCI Express
Table 56. Differential Transmitter (TX) Output Specifications
Symbol
Parameter
Min
Nom
Max
Unit
Comments
UI
Unit interval
399.88
400
400.12
ps
Each UI is 400 ps ± 300 ppm. UI does not account
for spread spectrum clock dictated variations.
See Note 1.
VTX-DIFFp-p
Differential
peak-to-peak
output voltage
0.8
—
1.2
V
VTX-DIFFp-p = 2 × |VTX-D+ – VTX-D–|. See Note 2.
VTX-DE-RATIO
De- emphasized
differential
output voltage
(ratio)
–3.0
–3.5
–4.0
dB
Ratio of the VTX-DIFFp-p of the second and
following bits after a transition divided by the
VTX-DIFFp-p of the first bit after a transition.
See Note 2.
TTX-EYE
Minimum TX
eye width
0.70
—
—
UI
The maximum transmitter jitter can be derived as
TTX-MAX-JITTER = 1 – TTX-EYE = 0.3 UI.
See Notes 2 and 3.
TTX-EYE-MEDIAN-to-
Maximum time
between the
jitter median and
maximum
deviation from
the median.
—
—
0.15
UI
Jitter is defined as the measurement variation of
the crossing points (VTX-DIFFp-p = 0 V) in relation
to a recovered TX UI. A recovered TX UI is
calculated over 3500 consecutive unit intervals of
sample data. Jitter is measured using all edges of
the 250 consecutive UI in the center of the 3500
UI used for calculating the TX UI.
See Notes 2 and 3.
TTX-RISE, TTX-FALL
D+/D– TX output
rise/fall time
0.125
—
—
UI
See Notes 2 and 5.
VTX-CM-ACp
RMS AC peak
common mode
output voltage
—
—
20
mV
VTX-CM-ACp = RMS(|VTXD+ + VTXD–|/2 –
VTX-CM-DC)
VTX-CM-DC = DC(avg) of |VTX-D+ + VTX-D–|/2.
See Note 2.
VTX-CM-DC-ACTIVE-
Absolute delta of
dc common
mode voltage
during L0 and
electrical idle
0
—
100
mV
|VTX-CM-DC (during L0) + VTX-CM-Idle-DC (during
electrical idle)| 100 mV
VTX-CM-DC = DC(avg) of |VTX-D+ + VTX-D–|/2 [L0]
VTX-CM-Idle-DC = DC(avg) of |VTX-D+ + VTX-D–|/2
[electrical idle]
See Note 2.
VTX-CM-DC-LINE-DELTA Absolute delta of
DC common
mode between
D+ and D–
0
—
25
mV
|VTX-CM-DC-D+ – VTX-CM-DC-D–| 25 mV
VTX-CM-DC-D+ = DC(avg) of |VTX-D+|
VTX-CM-DC-D–= DC(avg) of |VTX-D–|.
See Note 2.
MAX-JITTER
IDLE-DELTA
VTX-IDLE-DIFFp
Electrical idle
differential peak
output voltage
0
—
20
mV
VTX-IDLE-DIFFp = |VTX-IDLE-D+ – VTX-IDLE-D–|
20 mV.
See Note 2.
VTX-RCV-DETECT
The amount of
voltage change
allowed during
receiver
detection
—
—
600
mV
The total amount of voltage change that a
transmitter can apply to sense whether a low
impedance receiver is present. See Note 6.
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PCI Express
Table 56. Differential Transmitter (TX) Output Specifications (continued)
Symbol
Parameter
Min
Nom
Max
Unit
Comments
VTX-DC-CM
The TX DC
common mode
voltage
0
—
3.6
V
The allowed DC common mode voltage under any
conditions. See Note 6.
ITX-SHORT
TX short circuit
current limit
—
—
90
mA
The total current the transmitter can provide when
shorted to its ground
TTX-IDLE-MIN
Minimum time
spent in
electrical idle
50
—
UI
Minimum time a transmitter must be in electrical
idle utilized by the receiver to start looking for an
electrical idle exit after successfully receiving an
electrical idle ordered set
TTX-IDLE-SET-TO-IDLE
Maximum time
to transition to a
valid electrical
idle after
sending an
electrical idle
ordered set
—
—
20
UI
After sending an electrical idle ordered set, the
transmitter must meet all electrical idle
specifications within this time. This is considered
a debounce time for the transmitter to meet
electrical idle after transitioning from L0.
TTX-IDLE-TO-DIFF-DATA
Maximum time
to transition to
valid TX
specifications
after leaving an
electrical idle
condition
—
—
20
UI
Maximum time to meet all TX specifications when
transitioning from electrical idle to sending
differential data. This is considered a debounce
time for the TX to meet all TX specifications after
leaving electrical idle
RLTX-DIFF
Differential
return loss
12
—
—
dB
Measured over 50 MHz to 1.25 GHz.
See Note 4.
RLTX-CM
Common mode
return loss
6
—
—
dB
Measured over 50 MHz to 1.25 GHz.
See Note 4.
ZTX-DIFF-DC
DC differential
TX impedance
80
100
120
TX DC differential mode low impedance
ZTX-DC
Transmitter DC
impedance
40
—
—
Required TX D+ as well as D– DC impedance
during all states
LTX-SKEW
Lane-to-lane
output skew
—
—
500
+ 2 UI
ps
Static skew between any two transmitter lanes
within a single Link
CTX
AC coupling
capacitor
75
—
200
nF
All transmitters shall be AC coupled. The AC
coupling is required either within the media or
within the transmitting component itself. See note
8.
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PCI Express
Table 56. Differential Transmitter (TX) Output Specifications (continued)
Symbol
Parameter
Min
Nom
Max
Unit
Tcrosslink
Crosslink
random timeout
0
—
1
ms
Comments
This random timeout helps resolve conflicts in
crosslink configuration by eventually resulting in
only one downstream and one upstream port.
See Note 7.
Notes:
1. No test load is necessarily associated with this value.
2. Specified at the measurement point into a timing and voltage compliance test load as shown in Figure 50 and measured over
any 250 consecutive TX UIs. (Also see the transmitter compliance eye diagram shown in Figure 48.)
3. A TTX-EYE = 0.70 UI provides for a total sum of deterministic and random jitter budget of TTX-JITTER-MAX = 0.30 UI for the
transmitter collected over any 250 consecutive TX UIs. The TTX-EYE-MEDIAN-to-MAX-JITTER median is less than half of the total
TX jitter budget collected over any 250 consecutive TX UIs. Note that the median is not the same as the mean. The jitter
median describes the point in time where the number of jitter points on either side is approximately equal as opposed to the
averaged time value.
4. The transmitter input impedance shall result in a differential return loss greater than or equal to 12 dB and a common mode
return loss greater than or equal to 6 dB over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement
applies to all valid input levels. The reference impedance for return loss measurements is 50 to ground for both the D+ and
D– line (that is, as measured by a vector network analyzer with 50- probes—see Figure 50). Note that the series capacitors
CTX is optional for the return loss measurement.
5. Measured between 20%–80% at transmitter package pins into a test load as shown in Figure 50 for both VTX-D+ and VTX-D–.
6. See Section 4.3.1.8 of the PCI Express Base Specifications Rev 1.0a.
7. See Section 4.2.6.3 of the PCI Express Base Specifications Rev 1.0a.
8. MPC8548E SerDes transmitter does not have CTX built in. An external AC coupling capacitor is required.
17.4.2
Transmitter Compliance Eye Diagrams
The TX eye diagram in Figure 48 is specified using the passive compliance/test measurement load (see
Figure 50) in place of any real PCI Express interconnect +RX component.
There are two eye diagrams that must be met for the transmitter. Both eye diagrams must be aligned in
time using the jitter median to locate the center of the eye diagram. The different eye diagrams differ in
voltage depending whether it is a transition bit or a de-emphasized bit. The exact reduced voltage level of
the de-emphasized bit is always relative to the transition bit.
The eye diagram must be valid for any 250 consecutive UIs.
A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. The eye diagram is
created using all edges of the 250 consecutive UI in the center of the 3500 UI used for calculating the
TX UI.
NOTE
It is recommended that the recovered TX UI is calculated using all edges in
the 3500 consecutive UI interval with a fit algorithm using a minimization
merit function (for example, least squares and median deviation fits).
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PCI Express
VRX-DIFF = 0 mV
(D+ D– Crossing Point)
[Transition Bit]
VTX-DIFFp-p-MIN = 800 mV
VTX-DIFF = 0 mV
(D+ D– Crossing Point)
[De-Emphasized Bit]
566 mV (3 dB) >= VTX-DIFFp-p-MIN >= 505 mV (4 dB)
0.07 UI = UI – 0.3 UI (JTX-TOTAL-MAX)
[Transition Bit]
VTX-DIFFp-p-MIN = 800 mV
Figure 48. Minimum Transmitter Timing and Voltage Output Compliance Specifications
17.4.3
Differential Receiver (RX) Input Specifications
Table 57 defines the specifications for the differential input at all receivers (RXs). The parameters are
specified at the component pins.
Table 57. Differential Receiver (RX) Input Specifications
Symbol
Parameter
Min
Nom
Max
Unit
Comments
UI
Unit interval
399.88
400
400.12
ps
Each UI is 400 ps ± 300 ppm. UI does not account
for spread spectrum clock dictated variations.
See Note 1.
VRX-DIFFp-p
Differential
peak-to-peak
input voltage
0.175
—
1.200
V
VRX-DIFFp-p = 2 × |VRX-D+ – VRX-D–|. See Note 2.
TRX-EYE
Minimum
receiver eye
width
0.4
—
—
UI
The maximum interconnect media and transmitter
jitter that can be tolerated by the receiver can be
derived as TRX-MAX-JITTER = 1 – TRX-EYE = 0.6 UI.
See Notes 2 and 3.
TRX-EYE-MEDIAN-to-
Maximum time
between the
jitter median and
maximum
deviation from
the median
—
—
0.3
UI
Jitter is defined as the measurement variation of
the crossing points (VRX-DIFFp-p = 0 V) in relation
to a recovered TX UI. A recovered TX UI is
calculated over 3500 consecutive unit intervals of
sample data. Jitter is measured using all edges of
the 250 consecutive UI in the center of the
3500 UI used for calculating the TX UI.
See Notes 2, 3, and 7.
MAX-JITTER
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Table 57. Differential Receiver (RX) Input Specifications (continued)
Symbol
Parameter
Min
Nom
Max
Unit
VRX-CM-ACp
AC peak
common mode
input voltage
—
—
150
mV
VRX-CM-ACp = |VRXD+ – VRXD-|/2 + VRX-CM-DC
VRX-CM-DC = DC(avg) of |VRX-D+ + VRX-D–| 2.
See Note 2.
RLRX-DIFF
Differential
return loss
15
—
—
dB
Measured over 50 MHz to 1.25 GHz with the D+
and D– lines biased at +300 mV and –300 mV,
respectively. See Note 4.
RLRX-CM
Common mode
return loss
6
—
—
dB
Measured over 50 MHz to 1.25 GHz with the D+
and D– lines biased at 0 V. See Note 4.
ZRX-DIFF-DC
DC differential
input impedance
80
100
120
RX DC differential mode impedance. See Note 5.
ZRX-DC
DC input
impedance
40
50
60
Required RX D+ as well as D– DC impedance
(50 ± 20% tolerance). See Notes 2 and 5.
ZRX-HIGH-IMP-DC
Powered down
DC input
impedance
200 k
—
—
Required RX D+ as well as D– DC impedance
when the receiver terminations do not have
power. See Note 6.
VRX-IDLE-DET-DIFFp-p
Electrical idle
detect threshold
65
—
175
mV
VRX-IDLE-DET-DIFFp-p = 2 × |VRX-D+ –VRX-D–|.
Measured at the package pins of the receiver
TRX-IDLE-DET-DIFF-
Unexpected
electrical idle
enter detect
threshold
integration time
—
—
10
ms
An unexpected electrical idle (VRX-DIFFp-p <
VRX-IDLE-DET-DIFFp-p) must be recognized no
longer than TRX-IDLE-DET-DIFF-ENTERING to signal
an unexpected idle condition.
ENTERTIME
Comments
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Table 57. Differential Receiver (RX) Input Specifications (continued)
Symbol
Parameter
Min
Nom
Max
Unit
Comments
LTX-SKEW
Total Skew
—
—
20
ns
Skew across all lanes on a Link. This includes
variation in the length of SKP ordered set (for
example, COM and one to five symbols) at the RX
as well as any delay differences arising from the
interconnect itself.
Notes:
1. No test load is necessarily associated with this value.
2. Specified at the measurement point and measured over any 250 consecutive UIs. The test load in Figure 50 must be used
as the RX device when taking measurements (also see the receiver compliance eye diagram shown in Figure 49). If the
clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UI must
be used as a reference for the eye diagram.
3. A TRX-EYE = 0.40 UI provides for a total sum of 0.60 UI deterministic and random jitter budget for the transmitter and
interconnect collected any 250 consecutive UIs. The TRX-EYE-MEDIAN-to-MAX-JITTER specification ensures a jitter distribution
in which the median and the maximum deviation from the median is less than half of the total. UI jitter budget collected over
any 250 consecutive TX UIs. Note that the median is not the same as the mean. The jitter median describes the point in time
where the number of jitter points on either side is approximately equal as opposed to the averaged time value. If the clocks
to the RX and TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UI must be
used as the reference for the eye diagram.
4. The receiver input impedance shall result in a differential return loss greater than or equal to 15 dB with the D+ line biased
to 300 mV and the D– line biased to –{300 mV and a common mode return loss greater than or equal to 6 dB (no bias
required) over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement applies to all valid input levels.
The reference impedance for return loss measurements for is 50 to ground for both the D+ and D– line (that is, as
measured by a vector network analyzer with 50- probes—see Figure 50). Note: that the series capacitors CTX is optional
for the return loss measurement.
5. Impedance during all LTSSM states. When transitioning from a fundamental reset to detect (the initial state of the LTSSM)
there is a 5 ms transition time before receiver termination values must be met on all unconfigured lanes of a port.
6. The RX DC common mode Impedance that exists when no power is present or fundamental reset is asserted. This helps
ensure that the receiver detect circuit does not falsely assume a receiver is powered on when it is not. This term must be
measured at 300 mV above the RX ground.
7. It is recommended that the recovered TX UI is calculated using all edges in the 3500 consecutive UI interval with a fit
algorithm using a minimization merit function. Least squares and median deviation fits have worked well with experimental
and simulated data.
17.5
Receiver Compliance Eye Diagrams
The RX eye diagram in Figure 49 is specified using the passive compliance/test measurement load (see
Figure 50) in place of any real PCI Express RX component.
Note: In general, the minimum receiver eye diagram measured with the compliance/test measurement load
(see Figure 50) is larger than the minimum receiver eye diagram measured over a range of systems at the
input receiver of any real PCI Express component. The degraded eye diagram at the input receiver is due
to traces internal to the package as well as silicon parasitic characteristics which cause the real PCI Express
component to vary in impedance from the compliance/test measurement load. The input receiver eye
diagram is implementation specific and is not specified. RX component designer must provide additional
margin to adequately compensate for the degraded minimum receiver eye diagram (shown in Figure 49)
expected at the input receiver based on some adequate combination of system simulations and the return
loss measured looking into the RX package and silicon. The RX eye diagram must be aligned in time using
the jitter median to locate the center of the eye diagram.
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PCI Express
The eye diagram must be valid for any 250 consecutive UIs.
A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. The eye diagram is
created using all edges of the 250 consecutive UI in the center of the 3500 UI used for calculating the
TX UI.
NOTE
The reference impedance for return loss measurements is 50. to ground for
both the D+ and D– line (that is, as measured by a vector network analyzer
with 50- probes—see Figure 50). Note that the series capacitors, CTX, are
optional for the return loss measurement.
VRX-DIFF = 0 mV
(D+ D– Crossing Point)
VRX-DIFF = 0 mV
(D+ D– Crossing Point)
VRX-DIFFp-p-MIN > 175 mV
0.4 UI = TRX-EYE-MIN
Figure 49. Minimum Receiver Eye Timing and Voltage Compliance Specification
17.5.1
Compliance Test and Measurement Load
The AC timing and voltage parameters must be verified at the measurement point, as specified within
0.2 inches of the package pins, into a test/measurement load shown in Figure 50.
NOTE
The allowance of the measurement point to be within 0.2 inches of the
package pins is meant to acknowledge that package/board routing may
benefit from D+ and D– not being exactly matched in length at the package
pin boundary.
D+ Package
Pin
C = CTX
TX
Silicon
+ Package
D– Package
Pin
C = CTX
R = 50
R = 50
Figure 50. Compliance Test/Measurement Load
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18
Serial RapidIO
This section describes the DC and AC electrical specifications for the RapidIO interface of the
MPC8548E, for the LP-Serial physical layer. The electrical specifications cover both single- and
multiple-lane links. Two transmitters (short and long run) and a single receiver are specified for each of
three baud rates, 1.25, 2.50, and 3.125 GBaud.
Two transmitter specifications allow for solutions ranging from simple board-to-board interconnect to
driving two connectors across a backplane. A single receiver specification is given that accepts signals
from both the short- and long-run transmitter specifications.
The short-run transmitter must be used mainly for chip-to-chip connections on either the same
printed-circuit board or across a single connector. This covers the case where connections are made to a
mezzanine (daughter) card. The minimum swings of the short-run specification reduce the overall power
used by the transceivers.
The long-run transmitter specifications use larger voltage swings that are capable of driving signals across
backplanes. This allows a user to drive signals across two connectors and a backplane. The specifications
allow a distance of at least 50 cm at all baud rates.
All unit intervals are specified with a tolerance of ±100 ppm. The worst case frequency difference between
any transmit and receive clock is 200 ppm.
To ensure interoperability between drivers and receivers of different vendors and technologies, AC
coupling at the receiver input must be used.
18.1
DC Requirements for Serial RapidIO SD_REF_CLK and
SD_REF_CLK
For more information, see Section 16.2, “SerDes Reference Clocks.”
18.2
AC Requirements for Serial RapidIO SD_REF_CLK and
SD_REF_CLK
Table 58 lists the Serial RapidIO SD_REF_CLK and SD_REF_CLK AC requirements.
Table 58. SD_REF_CLK and SD_REF_CLK AC Requirements
Symbol
Min
Typ
Max
Unit
Comments
REFCLK cycle time
—
10(8)
—
ns
8 ns applies only to serial
RapidIO with 125-MHz reference
clock
tREFCJ
REFCLK cycle-to-cycle jitter. Difference in the
period of any two adjacent REFCLK cycles.
—
—
80
ps
—
tREFPJ
Phase jitter. Deviation in edge location with
respect to mean edge location.
–40
—
40
ps
—
tREF
Parameter Description
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18.3
Signal Definitions
LP-serial links use differential signaling. This section defines terms used in the description and
specification of differential signals. Figure 51 shows how the signals are defined. The figures show
waveforms for either a transmitter output (TD and TD) or a receiver input (RD and RD). Each signal
swings between A volts and B volts where A > B. Using these waveforms, the definitions are as follows:
1. The transmitter output signals and the receiver input signals TD, TD, RD, and RD each have a
peak-to-peak swing of A – B volts.
2. The differential output signal of the transmitter, VOD, is defined as VTD – VTD.
3. The differential input signal of the receiver, VID, is defined as VRD – VRD.
4. The differential output signal of the transmitter and the differential input signal of the receiver
each range from A – B to –(A – B) volts.
5. The peak value of the differential transmitter output signal and the differential receiver input
signal is A – B volts.
6. The peak-to-peak value of the differential transmitter output signal and the differential receiver
input signal is 2 (A – B) volts.
A Volts
B Volts
TD or RD
TD or RD
Differential Peak-to-Peak = 2 (A – B)
Figure 51. Differential Peak–Peak Voltage of Transmitter or Receiver
To illustrate these definitions using real values, consider the case of a CML (current mode logic)
transmitter that has a common mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing
that goes between 2.5 and 2.0 V. Using these values, the peak-to-peak voltage swing of the signals TD and
TD is 500 mVp-p. The differential output signal ranges between 500 and –500 mV. The peak differential
voltage is 500 mV. The peak-to-peak differential voltage is 1000 mVp-p.
18.4
Equalization
With the use of high-speed serial links, the interconnect media causes degradation of the signal at the
receiver. Effects such as inter-symbol interference (ISI) or data dependent jitter are produced. This loss can
be large enough to degrade the eye opening at the receiver beyond what is allowed in the specification. To
negate a portion of these effects, equalization can be used. The most common equalization techniques that
can be used are:
• A passive high pass filter network placed at the receiver. This is often referred to as passive
equalization.
• The use of active circuits in the receiver. This is often referred to as adaptive equalization.
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18.5
Explanatory Note on Transmitter and Receiver Specifications
AC electrical specifications are given for transmitter and receiver. Long- and short-run interfaces at three
baud rates (a total of six cases) are described.
The parameters for the AC electrical specifications are guided by the XAUI electrical interface specified
in Clause 47 of IEEE 802.3ae-2002.
XAUI has similar application goals to Serial RapidIO, as described in Section 8.1. The goal of this
standard is that electrical designs for Serial RapidIO can reuse electrical designs for XAUI, suitably
modified for applications at the baud intervals and reaches described herein.
18.6
Transmitter Specifications
LP-serial transmitter electrical and timing specifications are stated in the text and tables of this section.
The differential return loss, S11, of the transmitter in each case shall be better than:
• –10 dB for (baud frequency)/10 < Freq(f) < 625 MHz, and
• –10 dB + 10log(f/625 MHz) dB for 625 MHz Freq(f) baud frequency
The reference impedance for the differential return loss measurements is 100- resistive. Differential
return loss includes contributions from on-chip circuitry, chip packaging, and any off-chip components
related to the driver. The output impedance requirement applies to all valid output levels.
It is recommended that the 20%–80% rise/fall time of the transmitter, as measured at the transmitter output,
in each case have a minimum value 60 ps.
It is recommended that the timing skew at the output of an LP-serial transmitter between the two signals
that comprise a differential pair not exceed 25 ps at 1.25 GB, 20 ps at 2.50 GB, and 15 ps at 3.125 GB.
Table 59. Short Run Transmitter AC Timing Specifications—1.25 GBaud
Range
Characteristic
Symbol
Unit
Notes
Min
Max
VO
–0.40
2.30
V
VDIFFPP
500
1000
mV p-p
—
Deterministic jitter
JD
—
0.17
UI p-p
—
Total jitter
JT
—
0.35
UI p-p
—
SMO
—
1000
ps
Skew at the transmitter output between lanes of a
multilane link
UI
800
800
ps
±100 ppm
Output voltage
Differential output voltage
Multiple output skew
Unit Interval
Voltage relative to COMMON of either signal
comprising a differential pair
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Serial RapidIO
Table 60. Short Run Transmitter AC Timing Specifications—2.5 GBaud
Range
Characteristic
Symbol
Unit
Notes
Min
Max
VO
–0.40
2.30
V
VDIFFPP
500
1000
mV p-p
—
Deterministic jitter
JD
—
0.17
UI p-p
—
Total jitter
JT
—
0.35
UI p-p
—
SMO
—
1000
ps
Skew at the transmitter output between lanes of a
multilane link
UI
400
400
ps
±100 ppm
Output voltage
Differential output voltage
Multiple output skew
Unit interval
Voltage relative to COMMON of either signal
comprising a differential pair
Table 61. Short Run Transmitter AC Timing Specifications—3.125 GBaud
Range
Characteristic
Symbol
Unit
Notes
Min
Max
VO
–0.40
2.30
V
VDIFFPP
500
1000
mVp-p
—
Deterministic jitter
JD
—
0.17
UI p-p
—
Total jitter
JT
—
0.35
UI p-p
—
SMO
—
1000
ps
Skew at the transmitter output between lanes of a
multilane link
UI
320
320
ps
±100 ppm
Output voltage
Differential output voltage
Multiple output skew
Unit interval
Voltage relative to COMMON of either signal
comprising a differential pair
Table 62. Long Run Transmitter AC Timing Specifications—1.25 GBaud
Range
Characteristic
Symbol
Unit
Notes
Min
Max
VO
–0.40
2.30
V
VDIFFPP
800
1600
mVp-p
—
Deterministic jitter
JD
—
0.17
UI p-p
—
Total jitter
JT
—
0.35
UI p-p
—
SMO
—
1000
ps
Skew at the transmitter output between lanes of a
multilane link
UI
800
800
ps
±100 ppm
Output voltage
Differential output voltage
Multiple output skew
Unit interval
Voltage relative to COMMON of either signal
comprising a differential pair
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Serial RapidIO
Table 63. Long Run Transmitter AC Timing Specifications—2.5 GBaud
Range
Characteristic
Symbol
Unit
Notes
Min
Max
VO
–0.40
2.30
V
VDIFFPP
800
1600
mVp-p
—
Deterministic jitter
JD
—
0.17
UI p-p
—
Total jitter
JT
—
0.35
UI p-p
—
SMO
—
1000
ps
Skew at the transmitter output between lanes of a
multilane link
UI
400
400
ps
±100 ppm
Output voltage
Differential output voltage
Multiple output skew
Unit interval
Voltage relative to COMMON of either signal
comprising a differential pair
Table 64. Long Run Transmitter AC Timing Specifications—3.125 GBaud
Range
Characteristic
Symbol
Unit
Notes
Min
Max
VO
–0.40
2.30
V
VDIFFPP
800
1600
mVp-p
—
Deterministic jitter
JD
—
0.17
UI p-p
—
Total jitter
JT
—
0.35
UI p-p
—
SMO
—
1000
ps
Skew at the transmitter output between lanes of a
multilane link
UI
320
320
ps
±100 ppm
Output voltage
Differential output voltage
Multiple output skew
Unit interval
Voltage relative to COMMON of either signal
comprising a differential pair
For each baud rate at which an LP-serial transmitter is specified to operate, the output eye pattern of the
transmitter shall fall entirely within the unshaded portion of the transmitter output compliance mask shown
in Figure 52 with the parameters specified in Table 65 when measured at the output pins of the device and
the device is driving a 100- ± 5% differential resistive load. The output eye pattern of an LP-serial
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Serial RapidIO
Transmitter Differential Output Voltage
transmitter that implements pre-emphasis (to equalize the link and reduce inter-symbol interference) need
only comply with the transmitter output compliance mask when pre-emphasis is disabled or minimized.
VDIFF max
VDIFF min
0
–VDIFF min
–VDIFF max
0
A
B
1-B
1-A
1
Time in UI
Figure 52. Transmitter Output Compliance Mask
Table 65. Transmitter Differential Output Eye Diagram Parameters
Transmitter Type
18.7
VDIFFmin (mV)
VDIFFmax (mV)
A (UI)
B (UI)
1.25 GBaud short range
250
500
0.175
0.39
1.25 GBaud long range
400
800
0.175
0.39
2.5 GBaud short range
250
500
0.175
0.39
2.5 GBaud long range
400
800
0.175
0.39
3.125 GBaud short range
250
500
0.175
0.39
3.125 GBaud long range
400
800
0.175
0.39
Receiver Specifications
LP-serial receiver electrical and timing specifications are stated in the text and tables of this section.
Receiver input impedance shall result in a differential return loss better that 10 dB and a common mode
return loss better than 6 dB from 100 MHz to (0.8) (baud frequency). This includes contributions from
on-chip circuitry, the chip package, and any off-chip components related to the receiver. AC coupling
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Serial RapidIO
components are included in this requirement. The reference impedance for return loss measurements is
100- resistive for differential return loss and 25- resistive for common mode.
Table 66. Receiver AC Timing Specifications—1.25 GBaud
Range
Characteristic
Symbol
Unit
Min
Max
Notes
Differential input voltage
VIN
200
1600
mVp-p
Measured at receiver
Deterministic jitter tolerance
JD
0.37
—
UI p-p
Measured at receiver
Combined deterministic and random
jitter tolerance
JDR
0.55
—
UI p-p
Measured at receiver
Total jitter tolerance1
JT
0.65
—
UI p-p
Measured at receiver
Multiple input skew
SMI
—
24
ns
Skew at the receiver input between lanes
of a multilane link
Bit error rate
BER
—
10–12
—
—
Unit interval
UI
800
800
ps
±100 ppm
Note:
1. Total jitter is composed of three components, deterministic jitter, random jitter, and single frequency sinusoidal jitter. The
sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 53. The sinusoidal jitter component
is included to ensure margin for low frequency jitter, wander, noise, crosstalk, and other variable system effects.
Table 67. Receiver AC Timing Specifications—2.5 GBaud
Range
Characteristic
Symbol
Unit
Min
Max
Notes
Differential input voltage
VIN
200
1600
mVp-p
Measured at receiver
Deterministic jitter tolerance
JD
0.37
—
UI p-p
Measured at receiver
Combined deterministic and random
jitter tolerance
JDR
0.55
—
UI p-p
Measured at receiver
Total jitter tolerance1
JT
0.65
—
UI p-p
Measured at receiver
Multiple input skew
SMI
—
24
ns
Bit error rate
BER
—
10–12
Unit interval
UI
400
400
Skew at the receiver input between lanes
of a multilane link
—
ps
±100 ppm
Note:
1. Total jitter is composed of three components, deterministic jitter, random jitter, and single frequency sinusoidal jitter. The
sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 53. The sinusoidal jitter component
is included to ensure margin for low frequency jitter, wander, noise, crosstalk, and other variable system effects.
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Table 68. Receiver AC Timing Specifications—3.125 GBaud
Range
Characteristic
Symbol
Unit
Min
Max
Notes
Differential input voltage
VIN
200
1600
mVp-p
Measured at receiver
Deterministic jitter tolerance
JD
0.37
—
UI p-p
Measured at receiver
Combined deterministic and random
jitter tolerance
JDR
0.55
—
UI p-p
Measured at receiver
Total jitter tolerance1
JT
0.65
—
UI p-p
Measured at receiver
Multiple input skew
SMI
—
22
ns
Bit error rate
BER
—
10-12
Unit interval
UI
320
320
Skew at the receiver input between lanes
of a multilane link
—
ps
±100 ppm
Note:
1. Total jitter is composed of three components, deterministic jitter, random jitter and single frequency sinusoidal jitter. The
sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 53. The sinusoidal jitter component
is included to ensure margin for low frequency jitter, wander, noise, crosstalk and other variable system effects.
Sinusoidal Jitter Amplitude
8.5 UI p-p
0.10 UI p-p
22.1 kHz
Frequency
1.875 MHz
20 MHz
Figure 53. Single Frequency Sinusoidal Jitter Limits
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18.8
Receiver Eye Diagrams
For each baud rate at which an LP-serial receiver is specified to operate, the receiver shall meet the
corresponding bit error rate specification (Table 66, Table 67, and Table 68) when the eye pattern of the
receiver test signal (exclusive of sinusoidal jitter) falls entirely within the unshaded portion of the receiver
input compliance mask shown in Figure 54 with the parameters specified in Table 69. The eye pattern of
the receiver test signal is measured at the input pins of the receiving device with the device replaced with
a 100- ± 5% differential resistive load.
Receiver Differential Input Voltage
VDIFF max
VDIFF min
0
–VDIFF min
–VDIFF max
0
A
B
1-B
1-A
1
Time (UI)
Figure 54. Receiver Input Compliance Mask
Table 69. Receiver Input Compliance Mask Parameters Exclusive of Sinusoidal Jitter
VDIFFmin
(mV)
VDIFFmax
(mV)
A (UI)
B (UI)
1.25 GBaud
100
800
0.275
0.400
2.5 GBaud
100
800
0.275
0.400
3.125 GBaud
100
800
0.275
0.400
Receiver Type
18.9
Measurement and Test Requirements
Since the LP-serial electrical specification are guided by the XAUI electrical interface specified in
Clause 47 of IEEE Std. 802.3ae-2002, the measurement and test requirements defined here are similarly
guided by Clause 47. Additionally, the CJPAT test pattern defined in Annex 48A of IEEE Std.
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Serial RapidIO
802.3ae-2002 is specified as the test pattern for use in eye pattern and jitter measurements. Annex 48B of
IEEE Std. 802.3ae-2002 is recommended as a reference for additional information on jitter test methods.
18.9.1
Eye Template Measurements
For the purpose of eye template measurements, the effects of a single-pole high pass filter with a 3 dB point
at (baud frequency)/1667 is applied to the jitter. The data pattern for template measurements is the
continuous jitter test pattern (CJPAT) defined in Annex 48A of IEEE 802.3ae. All lanes of the LP-serial
link shall be active in both the transmit and receive directions, and opposite ends of the links shall use
asynchronous clocks. Four lane implementations shall use CJPAT as defined in Annex 48A. Single lane
implementations shall use the CJPAT sequence specified in Annex 48A for transmission on lane 0. The
amount of data represented in the eye shall be adequate to ensure that the bit error ratio is less than 10–12.
The eye pattern shall be measured with AC coupling and the compliance template centered at 0 V
differential. The left and right edges of the template shall be aligned with the mean zero crossing points of
the measured data eye. The load for this test shall be 100- resistive ± 5% differential to 2.5 GHz.
18.9.2
Jitter Test Measurements
For the purpose of jitter measurement, the effects of a single-pole high pass filter with a 3 dB point at (baud
frequency)/1667 is applied to the jitter. The data pattern for jitter measurements is the Continuous Jitter test
pattern (CJPAT) pattern defined in Annex 48A of IEEE 802.3ae. All lanes of the LP-serial link shall be
active in both the transmit and receive directions, and opposite ends of the links shall use asynchronous
clocks. Four lane implementations shall use CJPAT as defined in Annex 48A. Single lane implementations
shall use the CJPAT sequence specified in Annex 48A for transmission on lane 0. Jitter shall be measured
with AC coupling and at 0 V differential. Jitter measurement for the transmitter (or for calibration of a jitter
tolerance setup) shall be performed with a test procedure resulting in a BER curve such as that described
in Annex 48B of IEEE 802.3ae.
18.9.3
Transmit Jitter
Transmit jitter is measured at the driver output when terminated into a load of 100 resistive ± 5%
differential to 2.5 GHz.
18.9.4
Jitter Tolerance
Jitter tolerance is measured at the receiver using a jitter tolerance test signal. This signal is obtained by first
producing the sum of deterministic and random jitter defined in Section 18.7, “Receiver Specifications,”
and then adjusting the signal amplitude until the data eye contacts the 6 points of the minimum eye opening
of the receive template shown in Figure 54 and Table 69. Note that for this to occur, the test signal must
have vertical waveform symmetry about the average value and have horizontal symmetry (including jitter)
about the mean zero crossing. Eye template measurement requirements are as defined above. Random
jitter is calibrated using a high pass filter with a low frequency corner at 20 MHz and a 20 dB/decade
roll-off below this. The required sinusoidal jitter specified in Section 18.7, “Receiver Specifications,” is
then added to the signal and the test load is replaced by the receiver being tested.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
90
Freescale Semiconductor
Package Description
19 Package Description
This section details package parameters, pin assignments, and dimensions.
19.1
Package Parameters
The package parameters for both the HiCTE FC-CBGA and FC-PBGA are provided in Table 70.
Table 70. Package Parameters
CBGA1
PBGA2
29 mm 29 mm
29 mm 29 mm
783
783
1 mm
1 mm
Ball diameter (typical)
0.6 mm
0.6 mm
Solder ball
63% Sn
37% Pb
0% Ag
63% Sn
37% Pb
0% Ag
Solder ball (lead-free)
95% Sn
4.5% Ag
0.5% Cu
96.5% Sn
3.5% Ag
Parameter
Package outline
Interconnects
Ball pitch
Notes:
1. The HiCTE FC-CBGA package is available on only Version 2.0 of the device.
2. The FC-PBGA package is available on only versions 2.1.1 and 2.1.2, and 3.0
of the device.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
91
Package Description
19.2
Mechanical Dimensions of the HiCTE FC-CBGA and FC-PBGA
with Full Lid
The following figures show the mechanical dimensions and bottom surface nomenclature for the
MPC8548E HiCTE FC-CBGA and FC-PBGA packages.
Figure 55. Mechanical Dimensions and Bottom Surface Nomenclature of
the HiCTE FC-CBGA and FC-PBGA with Full Lid
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
92
Freescale Semiconductor
Package Description
Notes:
1. All dimensions are in millimeters.
2. Dimensioning and tolerancing per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
6. All dimensions are symmetric across the package center lines unless dimensioned otherwise.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
93
Package Description
Notes:
1. All dimensions are in millimeters.
2. Dimensioning and tolerancing per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Capacitors may not be present on all devices.
6. Caution must be taken not to short capacitors or exposed metal capacitor pads on package top.
7. Parallelism measurement shall exclude any effect of mark on top surface of package.
8. All dimensions are symmetric across the package center lines unless dimensioned otherwise.
Figure 56. Mechanical Dimensions and Bottom Surface Nomenclature of the FC-PBGA with Stamped Lid
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
94
Freescale Semiconductor
Package Description
19.3
Pinout Listings
NOTE
The DMA_DACK[0:1] and TEST_SEL/TEST_SEL pins must be set to a
proper state during POR configuration. See the pinlist table of the individual
device for more details.
For MPC8548/47/45, GPIOs are still available on
PCI1_AD[63:32]/PC2_AD[31:0] pins if they are not used for PCI
functionality.
For MPC8545/43, eTSEC does not support 16 bit FIFO mode.
Table 71 provides the pinout listing for the MPC8548E 783 FC-PBGA package.
Table 71. MPC8548E Pinout Listing
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
PCI1 and PCI2 (One 64-Bit or Two 32-Bit)
PCI1_AD[63:32]/PCI2_AD[31:0]
AB14, AC15, AA15, Y16, W16, AB16, AC16,
AA16, AE17, AA18, W18, AC17, AD16, AE16,
Y17, AC18, AB18, AA19, AB19, AB21, AA20,
AC20, AB20, AB22, AC22, AD21, AB23, AF23,
AD23, AE23, AC23, AC24
I/O
OVDD
17
PCI1_AD[31:0]
AH6, AE7, AF7, AG7, AH7, AF8, AH8, AE9,
AH9, AC10, AB10, AD10, AG10, AA10, AH10,
AA11, AB12, AE12, AG12, AH12, AB13, AA12,
AC13, AE13, Y14, W13, AG13, V14, AH13,
AC14, Y15, AB15
I/O
OVDD
17
PCI1_C_BE[7:4]/PCI2_C_BE[3:0]
AF15, AD14, AE15, AD15
I/O
OVDD
17
PCI1_C_BE[3:0]
AF9, AD11, Y12, Y13
I/O
OVDD
17
PCI1_PAR64/PCI2_PAR
W15
I/O
OVDD
PCI1_GNT[4:1]
AG6, AE6, AF5, AH5
O
OVDD
5, 9, 35
PCI1_GNT0
AG5
I/O
OVDD
—
PCI1_IRDY
AF11
I/O
OVDD
2
PCI1_PAR
AD12
I/O
OVDD
—
PCI1_PERR
AC12
I/O
OVDD
2
PCI1_SERR
V13
I/O
OVDD
2, 4
PCI1_STOP
W12
I/O
OVDD
2
PCI1_TRDY
AG11
I/O
OVDD
2
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
95
Package Description
Table 71. MPC8548E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
PCI1_REQ[4:1]
AH2, AG4, AG3, AH4
I
OVDD
—
—
—
—
—
PCI1_REQ0
AH3
I/O
OVDD
—
PCI1_CLK
AH26
I
OVDD
39
PCI1_DEVSEL
AH11
I/O
OVDD
2
PCI1_FRAME
AE11
I/O
OVDD
2
PCI1_IDSEL
AG9
I
OVDD
—
PCI1_REQ64/PCI2_FRAME
AF14
I/O
OVDD
2, 5, 10
PCI1_ACK64/PCI2_DEVSEL
V15
I/O
OVDD
2
PCI2_CLK
AE28
I
OVDD
39
PCI2_IRDY
AD26
I/O
OVDD
2
PCI2_PERR
AD25
I/O
OVDD
2
PCI2_GNT[4:1]
AE26, AG24, AF25, AE25
O
OVDD
5, 9, 35
PCI2_GNT0
AG25
I/O
OVDD
—
PCI2_SERR
AD24
I/O
OVDD
2, 4
PCI2_STOP
AF24
I/O
OVDD
2
PCI2_TRDY
AD27
I/O
OVDD
2
PCI2_REQ[4:1]
AD28, AE27, W17, AF26
I
OVDD
—
PCI2_REQ0
AH25
I/O
OVDD
—
DDR SDRAM Memory Interface
MDQ[0:63]
L18, J18, K14, L13, L19, M18, L15, L14, A17,
B17, A13, B12, C18, B18, B13, A12, H18, F18,
J14, F15, K19, J19, H16, K15, D17, G16, K13,
D14, D18, F17, F14, E14, A7, A6, D5, A4, C8,
D7, B5, B4, A2, B1, D1, E4, A3, B2, D2, E3, F3,
G4, J5, K5, F6, G5, J6, K4, J1, K2, M5, M3, J3,
J2, L1, M6
I/O
GVDD
—
MECC[0:7]
H13, F13, F11, C11, J13, G13, D12, M12
I/O
GVDD
—
MDM[0:8]
M17, C16, K17, E16, B6, C4, H4, K1, E13
O
GVDD
—
MDQS[0:8]
M15, A16, G17, G14, A5, D3, H1, L2, C13
I/O
GVDD
—
MDQS[0:8]
L17, B16, J16, H14, C6, C2, H3, L4, D13
I/O
GVDD
—
MA[0:15]
A8, F9, D9, B9, A9, L10, M10, H10, K10, G10,
B8, E10, B10, G6, A10, L11
O
GVDD
—
MBA[0:2]
F7, J7, M11
O
GVDD
—
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Freescale Semiconductor
Package Description
Table 71. MPC8548E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
MWE
E7
O
GVDD
—
MCAS
H7
O
GVDD
—
MRAS
L8
O
GVDD
—
MCKE[0:3]
F10, C10, J11, H11
O
GVDD
11
MCS[0:3]
K8, J8, G8, F8
O
GVDD
—
MCK[0:5]
H9, B15, G2, M9, A14, F1
O
GVDD
—
MCK[0:5]
J9, A15, G1, L9, B14, F2
O
GVDD
—
MODT[0:3]
E6, K6, L7, M7
O
GVDD
—
MDIC[0:1]
A19, B19
I/O
GVDD
36
Local Bus Controller Interface
LAD[0:31]
E27, B20, H19, F25, A20, C19, E28, J23, A25,
K22, B28, D27, D19, J22, K20, D28, D25, B25,
E22, F22, F21, C25, C22, B23, F20, A23, A22,
E19, A21, D21, F19, B21
I/O
BVDD
—
LDP[0:3]
K21, C28, B26, B22
I/O
BVDD
—
LA[27]
H21
O
BVDD
5, 9
LA[28:31]
H20, A27, D26, A28
O
BVDD
5, 7, 9
LCS[0:4]
J25, C20, J24, G26, A26
O
BVDD
LCS5/DMA_DREQ2
D23
I/O
BVDD
1
LCS6/DMA_DACK2
G20
O
BVDD
1
LCS7/DMA_DDONE2
E21
O
BVDD
1
LWE0/LBS0/LSDDQM[0]
G25
O
BVDD
5, 9
LWE1/LBS1/LSDDQM[1]
C23
O
BVDD
5, 9
LWE2/LBS2/LSDDQM[2]
J21
O
BVDD
5, 9
LWE3/LBS3/LSDDQM[3]
A24
O
BVDD
5, 9
LALE
H24
O
BVDD
5, 8, 9
LBCTL
G27
O
BVDD
5, 8, 9
LGPL0/LSDA10
F23
O
BVDD
5, 9
LGPL1/LSDWE
G22
O
BVDD
5, 9
LGPL2/LOE/LSDRAS
B27
O
BVDD
5, 8, 9
LGPL3/LSDCAS
F24
O
BVDD
5, 9
LGPL4/LGTA/LUPWAIT/LPBSE
H23
I/O
BVDD
—
LGPL5
E26
O
BVDD
5, 9
LCKE
E24
O
BVDD
—
LCLK[0:2]
E23, D24, H22
O
BVDD
—
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
97
Package Description
Table 71. MPC8548E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
LSYNC_IN
F27
I
BVDD
—
LSYNC_OUT
F28
O
BVDD
—
DMA
DMA_DACK[0:1]
AD3, AE1
O
OVDD
5, 9,
102
DMA_DREQ[0:1]
AD4, AE2
I
OVDD
—
DMA_DDONE[0:1]
AD2, AD1
O
OVDD
—
Programmable Interrupt Controller
UDE
AH16
I
OVDD
—
MCP
AG19
I
OVDD
—
IRQ[0:7]
AG23, AF18, AE18, AF20, AG18, AF17, AH24,
AE20
I
OVDD
—
IRQ[8]
AF19
I
OVDD
—
IRQ[9]/DMA_DREQ3
AF21
I
OVDD
1
IRQ[10]/DMA_DACK3
AE19
I/O
OVDD
1
IRQ[11]/DMA_DDONE3
AD20
I/O
OVDD
1
IRQ_OUT
AD18
O
OVDD
2, 4
Ethernet Management Interface
EC_MDC
AB9
O
OVDD
5, 9
EC_MDIO
AC8
I/O
OVDD
—
I
LVDD
—
Gigabit Reference Clock
EC_GTX_CLK125
V11
Three-Speed Ethernet Controller (Gigabit Ethernet 1)
TSEC1_RXD[7:0]
R5, U1, R3, U2, V3, V1, T3, T2
I
LVDD
—
TSEC1_TXD[7:0]
T10, V7, U10, U5, U4, V6, T5, T8
O
LVDD
5, 9
TSEC1_COL
R4
I
LVDD
—
TSEC1_CRS
V5
I/O
LVDD
20
TSEC1_GTX_CLK
U7
O
LVDD
—
TSEC1_RX_CLK
U3
I
LVDD
—
TSEC1_RX_DV
V2
I
LVDD
—
TSEC1_RX_ER
T1
I
LVDD
—
TSEC1_TX_CLK
T6
I
LVDD
—
TSEC1_TX_EN
U9
O
LVDD
30
TSEC1_TX_ER
T7
O
LVDD
—
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Freescale Semiconductor
Package Description
Table 71. MPC8548E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
Three-Speed Ethernet Controller (Gigabit Ethernet 2)
TSEC2_RXD[7:0]
P2, R2, N1, N2, P3, M2, M1, N3
I
LVDD
—
TSEC2_TXD[7:0]
N9, N10, P8, N7, R9, N5, R8, N6
O
LVDD
5, 9, 33
TSEC2_COL
P1
I
LVDD
—
TSEC2_CRS
R6
I/O
LVDD
20
TSEC2_GTX_CLK
P6
O
LVDD
TSEC2_RX_CLK
N4
I
LVDD
—
TSEC2_RX_DV
P5
I
LVDD
—
TSEC2_RX_ER
R1
I
LVDD
—
TSEC2_TX_CLK
P10
I
LVDD
—
TSEC2_TX_EN
P7
O
LVDD
30
TSEC2_TX_ER
R10
O
LVDD
5, 9, 33
Three-Speed Ethernet Controller (Gigabit Ethernet 3)
TSEC3_TXD[3:0]
V8, W10, Y10, W7
O
TVDD
5, 9, 29
TSEC3_RXD[3:0]
Y1, W3, W5, W4
I
TVDD
—
TSEC3_GTX_CLK
W8
O
TVDD
—
TSEC3_RX_CLK
W2
I
TVDD
—
TSEC3_RX_DV
W1
I
TVDD
—
TSEC3_RX_ER
Y2
I
TVDD
—
TSEC3_TX_CLK
V10
I
TVDD
—
TSEC3_TX_EN
V9
O
TVDD
30
Three-Speed Ethernet Controller (Gigabit Ethernet 4)
TSEC4_TXD[3:0]/TSEC3_TXD[7:4]
AB8, Y7, AA7, Y8
O
TVDD
1, 5, 9,
29
TSEC4_RXD[3:0]/TSEC3_RXD[7:4]
AA1, Y3, AA2, AA4
I
TVDD
1
TSEC4_GTX_CLK
AA5
O
TVDD
—
TSEC4_RX_CLK/TSEC3_COL
Y5
I
TVDD
1
TSEC4_RX_DV/TSEC3_CRS
AA3
I/O
TVDD
1, 31
TSEC4_TX_EN/TSEC3_TX_ER
AB6
O
TVDD
1, 30
DUART
UART_CTS[0:1]
AB3, AC5
I
OVDD
—
UART_RTS[0:1]
AC6, AD7
O
OVDD
—
UART_SIN[0:1]
AB5, AC7
I
OVDD
—
UART_SOUT[0:1]
AB7, AD8
O
OVDD
—
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
99
Package Description
Table 71. MPC8548E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
I2C interface
IIC1_SCL
AG22
I/O
OVDD
4, 27
IIC1_SDA
AG21
I/O
OVDD
4, 27
IIC2_SCL
AG15
I/O
OVDD
4, 27
IIC2_SDA
AG14
I/O
OVDD
4, 27
SerDes
SD_RX[0:7]
M28, N26, P28, R26, W26, Y28, AA26, AB28
I
XVDD
—
SD_RX[0:7]
M27, N25, P27, R25, W25, Y27, AA25, AB27
I
XVDD
—
SD_TX[0:7]
M22, N20, P22, R20, U20, V22, W20, Y22
O
XVDD
—
SD_TX[0:7]
M23, N21, P23, R21, U21, V23, W21, Y23
O
XVDD
—
SD_PLL_TPD
U28
O
XVDD
24
SD_REF_CLK
T28
I
XVDD
3
SD_REF_CLK
T27
I
XVDD
3
Reserved
AC1, AC3
—
—
2
Reserved
M26, V28
—
—
32
Reserved
M25, V27
—
—
34
Reserved
M20, M21, T22, T23
—
—
38
O
BVDD
—
General-Purpose Output
GPOUT[24:31]
K26, K25, H27, G28, H25, J26, K24, K23
System Control
HRESET
AG17
I
OVDD
—
HRESET_REQ
AG16
O
OVDD
29
SRESET
AG20
I
OVDD
—
CKSTP_IN
AA9
I
OVDD
—
CKSTP_OUT
AA8
O
OVDD
2, 4
Debug
TRIG_IN
AB2
I
OVDD
—
TRIG_OUT/READY/QUIESCE
AB1
O
OVDD
6, 9,
19, 29
MSRCID[0:1]
AE4, AG2
O
OVDD
5, 6, 9
MSRCID[2:4]
AF3, AF1, AF2
O
OVDD
6, 19,
29
MDVAL
AE5
O
OVDD
6
CLK_OUT
AE21
O
OVDD
11
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Freescale Semiconductor
Package Description
Table 71. MPC8548E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
Clock
RTC
AF16
I
OVDD
—
SYSCLK
AH17
I
OVDD
—
JTAG
TCK
AG28
I
OVDD
—
TDI
AH28
I
OVDD
12
TDO
AF28
O
OVDD
—
TMS
AH27
I
OVDD
12
TRST
AH23
I
OVDD
12
DFT
L1_TSTCLK
AC25
I
OVDD
25
L2_TSTCLK
AE22
I
OVDD
25
LSSD_MODE
AH20
I
OVDD
25
TEST_SEL
AH14
I
OVDD
25
Thermal Management
THERM0
AG1
—
—
14
THERM1
AH1
—
—
14
O
OVDD
9, 19,
29
Power Management
ASLEEP
AH18
Power and Ground Signals
GND
A11, B7, B24, C1, C3, C5, C12, C15, C26, D8,
D11, D16, D20, D22, E1, E5, E9, E12, E15, E17,
F4, F26, G12, G15, G18, G21, G24, H2, H6, H8,
H28, J4, J12, J15, J17, J27, K7, K9, K11, K27,
L3, L5, L12, L16, N11, N13, N15, N17, N19, P4,
P9, P12, P14, P16, P18, R11, R13, R15, R17,
R19, T4, T12, T14, T16, T18, U8, U11, U13,
U15, U17, U19, V4, V12, V18, W6, W19, Y4, Y9,
Y11, Y19, AA6, AA14, AA17, AA22, AA23, AB4,
AC2, AC11, AC19, AC26, AD5, AD9, AD22,
AE3, AE14, AF6, AF10, AF13, AG8, AG27,
K28, L24, L26, N24, N27, P25, R28, T24, T26,
U24, V25, W28, Y24, Y26, AA24, AA27, AB25,
AC28, L21, L23, N22, P20, R23, T21, U22, V20,
W23, Y21, U27
—
—
—
OVDD
V16, W11, W14, Y18, AA13, AA21, AB11,
AB17, AB24, AC4, AC9, AC21, AD6, AD13,
AD17, AD19, AE10, AE8, AE24, AF4, AF12,
AF22, AF27, AG26
Power for PCI
and other
standards
(3.3 V)
OVDD
—
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
101
Package Description
Table 71. MPC8548E Pinout Listing (continued)
Power
Supply
Notes
Power for
TSEC1 and
TSEC2
(2.5 V, 3.3 V)
LVDD
—
W9, Y6
Power for
TSEC3 and
TSEC4
(2,5 V, 3.3 V)
TVDD
—
GVDD
B3, B11, C7, C9, C14, C17, D4, D6, D10, D15,
E2, E8, E11, E18, F5, F12, F16, G3, G7, G9,
G11, H5, H12, H15, H17, J10, K3, K12, K16,
K18, L6, M4, M8, M13
Power for
DDR1 and
DDR2 DRAM
I/O voltage
(1.8 V, 2.5)
GVDD
—
BVDD
C21, C24, C27, E20, E25, G19, G23, H26, J20 Power for local
bus (1.8 V,
2.5 V, 3.3 V)
BVDD
—
VDD
M19, N12, N14, N16, N18, P11, P13, P15, P17, Power for core
P19, R12, R14, R16, R18, T11, T13, T15, T17,
(1.1 V)
T19, U12, U14, U16, U18, V17, V19
VDD
—
Signal
Package Pin Number
Pin Type
LVDD
N8, R7, T9, U6
TVDD
SVDD
L25, L27, M24, N28, P24, P26, R24, R27, T25,
V24, V26, W24, W27, Y25, AA28, AC27
Core Power
for SerDes
transceivers
(1.1 V)
SVDD
—
XVDD
L20, L22, N23, P21, R22, T20, U23, V21, W22,
Y20
Pad Power for
SerDes
transceivers
(1.1 V)
XVDD
—
AVDD_LBIU
J28
Power for local
bus PLL
(1.1 V)
—
26
AVDD_PCI1
AH21
Power for
PCI1 PLL
(1.1 V)
—
26
AVDD_PCI2
AH22
Power for
PCI2 PLL
(1.1 V)
—
26
AVDD_CORE
AH15
Power for
e500 PLL (1.1
V)
—
26
AVDD_PLAT
AH19
Power for CCB
PLL (1.1 V)
—
26
AVDD_SRDS
U25
Power for
SRDSPLL
(1.1 V)
—
26
SENSEVDD
M14
O
VDD
13
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
102
Freescale Semiconductor
Package Description
Table 71. MPC8548E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
SENSEVSS
M16
—
—
13
Analog Signals
MVREF
A18
I
Reference
voltage signal
for DDR
MVREF
—
SD_IMP_CAL_RX
L28
I
200 to
GND
—
SD_IMP_CAL_TX
AB26
I
100 to
GND
—
SD_PLL_TPA
U26
O
—
24
Notes:
1. All multiplexed signals are listed only once and do not re-occur. For example, LCS5/DMA_REQ2 is listed only once in the
local bus controller section, and is not mentioned in the DMA section even though the pin also functions as DMA_REQ2.
2. Recommend a weak pull-up resistor (2–10 k) be placed on this pin to OVDD.
3. A valid clock must be provided at POR if TSEC4_TXD[2] is set = 1.
4. This pin is an open drain signal.
5. This pin is a reset configuration pin. It has a weak internal pull-up P-FET which is enabled only when the processor is in the
reset state. This pull-up is designed such that it can be overpowered by an external 4.7-kpull-down resistor. However, if
the signal is intended to be high after reset, and if there is any device on the net which might pull down the value of the net
at reset, then a pullup or active driver is needed.
6. Treat these pins as no connects (NC) unless using debug address functionality.
7. The value of LA[28:31] during reset sets the CCB clock to SYSCLK PLL ratio. These pins require 4.7-k pull-up or pull-down
resistors. See Section 20.2, “CCB/SYSCLK PLL Ratio.”
8. The value of LALE, LGPL2, and LBCTL at reset set the e500 core clock to CCB clock PLL ratio. These pins require 4.7-k
pull-up or pull-down resistors. See the Section 20.3, “e500 Core PLL Ratio.”
9. Functionally, this pin is an output, but structurally it is an I/O because it either samples configuration input during reset or
because it has other manufacturing test functions. This pin therefore is described as an I/O for boundary scan.
10.This pin functionally requires a pull-up resistor, but during reset it is a configuration input that controls 32- vs. 64-bit PCI
operation. Therefore, it must be actively driven low during reset by reset logic if the device is to be configured to be a 64-bit
PCI device. See the PCI Specification.
11.This output is actively driven during reset rather than being three-stated during reset.
12.These JTAG pins have weak internal pull-up P-FETs that are always enabled.
13.These pins are connected to the VDD/GND planes internally and may be used by the core power supply to improve tracking
and regulation.
14.Internal thermally sensitive resistor.
15.No connections must be made to these pins if they are not used.
16.These pins are not connected for any use.
17.PCI specifications recommend that a weak pull-up resistor (2–10 k) be placed on the higher order pins to OVDD when using
64-bit buffer mode (pins PCI_AD[63:32] and PCI1_C_BE[7:4]).
19.If this pin is connected to a device that pulls down during reset, an external pull-up is required to drive this pin to a safe state
during reset.
20.This pin is only an output in FIFO mode when used as Rx flow control.
24.Do not connect.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
103
Package Description
Table 71. MPC8548E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
25.These are test signals for factory use only and must be pulled up (100 –1 k) to OVDD for normal machine operation.
26.Independent supplies derived from board VDD.
27.Recommend a pull-up resistor (~1 k) be placed on this pin to OVDD.
29. The following pins must NOT be pulled down during power-on reset: TSEC3_TXD[3], TSEC4_TXD3/TSEC3_TXD7,
HRESET_REQ, TRIG_OUT/READY/QUIESCE, MSRCID[2:4], ASLEEP.
30.This pin requires an external 4.7-k pull-down resistor to prevent PHY from seeing a valid transmit enable before it is actively
driven.
31.This pin is only an output in eTSEC3 FIFO mode when used as Rx flow control.
32.These pins must be connected to XVDD.
33.TSEC2_TXD1, TSEC2_TX_ER are multiplexed as cfg_dram_type[0:1]. They must be valid at power-up, even before
HRESET assertion.
34.These pins must be pulled to ground through a 300- (±10%) resistor.
35.When a PCI block is disabled, either the POR config pin that selects between internal and external arbiter must be pulled
down to select external arbiter if there is any other PCI device connected on the PCI bus, or leave the PCIn_AD pins as ‘no
connect’ or terminated through 2–10 k pull-up resistors with the default of internal arbiter if the PCIn_AD pins are not
connected to any other PCI device. The PCI block drives the PCIn_AD pins if it is configured to be the PCI arbiter—through
POR config pins—irrespective of whether it is disabled via the DEVDISR register or not. It may cause contention if there is
any other PCI device connected on the bus.
36.MDIC0 is grounded through an 18.2- precision 1% resistor and MDIC1 is connected to GVDD through an 18.2- precision
1% resistor. These pins are used for automatic calibration of the DDR IOs.
38.These pins must be left floating.
39. If PCI1 or PCI2 is configured as PCI asynchronous mode, a valid clock must be provided on pin PCI1_CLK or PCI2_CLK.
Otherwise the processor will not boot up.
40.These pins must be connected to GND.
101.This pin requires an external 4.7-k resistor to GND.
102.For Rev. 2.x silicon, DMA_DACK[0:1] must be 0b11 during POR configuration; for rev. 1.x silicon, the pin values during
POR configuration are don’t care.
103.If these pins are not used as GPINn (general-purpose input), they must be pulled low (to GND) or high (to LVDD) through
2–10 k resistors.
104.These must be pulled low to GND through 2–10 k resistors if they are not used.
105.These must be pulled low or high to LVDD through 2–10 k resistors if they are not used.
106.For rev. 2.x silicon, DMA_DACK[0:1] must be 0b10 during POR configuration; for rev. 1.x silicon, the pin values during POR
configuration are don’t care.
107.For rev. 2.x silicon, DMA_DACK[0:1] must be 0b01 during POR configuration; for rev. 1.x silicon, the pin values during POR
configuration are don’t care.
108.For rev. 2.x silicon, DMA_DACK[0:1] must be 0b11 during POR configuration; for rev. 1.x silicon, the pin values during POR
configuration are don’t care.
109.This is a test signal for factory use only and must be pulled down (100 – 1 k) to GND for normal machine operation.
110.These pins must be pulled high to OVDD through 2–10 k resistors.
111.If these pins are not used as GPINn (general-purpose input), they must be pulled low (to GND) or high (to OVDD) through
2–10 k resistors.
112.This pin must not be pulled down during POR configuration.
113.These should be pulled low or high to OVDD through 2–10 k resistors.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
104
Freescale Semiconductor
Package Description
Table 72 provides the pin-out listing for the MPC8547E 783 FC-PBGA package.
NOTE
All note references in the following table use the same numbers as those for
Table 71. See Table 71 for the meanings of these notes.
Table 72. MPC8547E Pinout Listing
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
PCI1 (One 64-Bit or One 32-Bit)
PCI1_AD[63:32]
AB14, AC15, AA15, Y16, W16, AB16, AC16,
AA16, AE17, AA18, W18, AC17, AD16, AE16,
Y17, AC18, AB18, AA19, AB19, AB21, AA20,
AC20, AB20, AB22, AC22, AD21, AB23, AF23,
AD23, AE23, AC23, AC24
I/O
OVDD
17
PCI1_AD[31:0]
AH6, AE7, AF7, AG7, AH7, AF8, AH8, AE9,
AH9, AC10, AB10, AD10, AG10, AA10, AH10,
AA11, AB12, AE12, AG12, AH12, AB13, AA12,
AC13, AE13, Y14, W13, AG13, V14, AH13,
AC14, Y15, AB15
I/O
OVDD
17
PCI1_C_BE[7:4]
AF15, AD14, AE15, AD15
I/O
OVDD
17
PCI1_C_BE[3:0]
AF9, AD11, Y12, Y13
I/O
OVDD
17
PCI1_PAR64
W15
I/O
OVDD
—
PCI1_GNT[4:1]
AG6, AE6, AF5, AH5
O
OVDD
5, 9, 35
PCI1_GNT0
AG5
I/O
OVDD
—
PCI1_IRDY
AF11
I/O
OVDD
2
PCI1_PAR
AD12
I/O
OVDD
—
PCI1_PERR
AC12
I/O
OVDD
2
PCI1_SERR
V13
I/O
OVDD
2, 4
PCI1_STOP
W12
I/O
OVDD
2
PCI1_TRDY
AG11
I/O
OVDD
2
PCI1_REQ[4:1]
AH2, AG4, AG3, AH4
I
OVDD
—
PCI1_REQ0
AH3
I/O
OVDD
—
PCI1_CLK
AH26
I
OVDD
39
PCI1_DEVSEL
AH11
I/O
OVDD
2
PCI1_FRAME
AE11
I/O
OVDD
2
PCI1_IDSEL
AG9
I
OVDD
—
PCI1_REQ64
AF14
I/O
OVDD
2, 5,10
PCI1_ACK64
V15
I/O
OVDD
2
Reserved
AE28
—
—
2
Reserved
AD26
—
—
2
Reserved
AD25
—
—
2
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
105
Package Description
Table 72. MPC8547E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
Reserved
AE26
—
—
2
cfg_pci1_clk
AG24
I
OVDD
5
Reserved
AF25
—
—
101
Reserved
AE25
—
—
2
Reserved
AG25
—
—
2
Reserved
AD24
—
—
2
Reserved
AF24
—
—
2
Reserved
AD27
—
—
2
Reserved
AD28, AE27, W17, AF26
—
—
2
Reserved
AH25
—
—
2
DDR SDRAM Memory Interface
MDQ[0:63]
L18, J18, K14, L13, L19, M18, L15, L14, A17,
B17, A13, B12, C18, B18, B13, A12, H18, F18,
J14, F15, K19, J19, H16, K15, D17, G16, K13,
D14, D18, F17, F14, E14, A7, A6, D5, A4, C8,
D7, B5, B4, A2, B1, D1, E4, A3, B2, D2, E3, F3,
G4, J5, K5, F6, G5, J6, K4, J1, K2, M5, M3, J3,
J2, L1, M6
I/O
GVDD
—
MECC[0:7]
H13, F13, F11, C11, J13, G13, D12, M12
I/O
GVDD
—
MDM[0:8]
M17, C16, K17, E16, B6, C4, H4, K1, E13
O
GVDD
—
MDQS[0:8]
M15, A16, G17, G14, A5, D3, H1, L2, C13
I/O
GVDD
—
MDQS[0:8]
L17, B16, J16, H14, C6, C2, H3, L4, D13
I/O
GVDD
—
MA[0:15]
A8, F9, D9, B9, A9, L10, M10, H10, K10, G10,
B8, E10, B10, G6, A10, L11
O
GVDD
—
MBA[0:2]
F7, J7, M11
O
GVDD
—
MWE
E7
O
GVDD
—
MCAS
H7
O
GVDD
—
MRAS
L8
O
GVDD
—
MCKE[0:3]
F10, C10, J11, H11
O
GVDD
11
MCS[0:3]
K8, J8, G8, F8
O
GVDD
—
MCK[0:5]
H9, B15, G2, M9, A14, F1
O
GVDD
—
MCK[0:5]
J9, A15, G1, L9, B14, F2
O
GVDD
—
MODT[0:3]
E6, K6, L7, M7
O
GVDD
—
MDIC[0:1]
A19, B19
I/O
GVDD
36
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
106
Freescale Semiconductor
Package Description
Table 72. MPC8547E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
Local Bus Controller Interface
LAD[0:31]
E27, B20, H19, F25, A20, C19, E28, J23, A25,
K22, B28, D27, D19, J22, K20, D28, D25, B25,
E22, F22, F21, C25, C22, B23, F20, A23, A22,
E19, A21, D21, F19, B21
I/O
BVDD
—
LDP[0:3]
K21, C28, B26, B22
I/O
BVDD
—
LA[27]
H21
O
BVDD
5, 9
LA[28:31]
H20, A27, D26, A28
O
BVDD
5, 7, 9
LCS[0:4]
J25, C20, J24, G26, A26
O
BVDD
—
LCS5/DMA_DREQ2
D23
I/O
BVDD
1
LCS6/DMA_DACK2
G20
O
BVDD
1
LCS7/DMA_DDONE2
E21
O
BVDD
1
LWE0/LBS0/LSDDQM[0]
G25
O
BVDD
5, 9
LWE1/LBS1/LSDDQM[1]
C23
O
BVDD
5, 9
LWE2/LBS2/LSDDQM[2]
J21
O
BVDD
5, 9
LWE3/LBS3/LSDDQM[3]
A24
O
BVDD
5, 9
LALE
H24
O
BVDD
5, 8, 9
LBCTL
G27
O
BVDD
5, 8, 9
LGPL0/LSDA10
F23
O
BVDD
5, 9
LGPL1/LSDWE
G22
O
BVDD
5, 9
LGPL2/LOE/LSDRAS
B27
O
BVDD
5, 8, 9
LGPL3/LSDCAS
F24
O
BVDD
5, 9
LGPL4/LGTA/LUPWAIT/LPBSE
H23
I/O
BVDD
—
LGPL5
E26
O
BVDD
5, 9
LCKE
E24
O
BVDD
—
LCLK[0:2]
E23, D24, H22
O
BVDD
—
LSYNC_IN
F27
I
BVDD
—
LSYNC_OUT
F28
O
BVDD
—
DMA
DMA_DACK[0:1]
AD3, AE1
O
OVDD
5, 9,
107
DMA_DREQ[0:1]
AD4, AE2
I
OVDD
—
DMA_DDONE[0:1]
AD2, AD1
O
OVDD
—
Programmable Interrupt Controller
UDE
AH16
I
OVDD
—
MCP
AG19
I
OVDD
—
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
107
Package Description
Table 72. MPC8547E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
IRQ[0:7]
AG23, AF18, AE18, AF20, AG18, AF17, AH24,
AE20
I
OVDD
—
IRQ[8]
AF19
I
OVDD
—
IRQ[9]/DMA_DREQ3
AF21
I
OVDD
1
IRQ[10]/DMA_DACK3
AE19
I/O
OVDD
1
IRQ[11]/DMA_DDONE3
AD20
I/O
OVDD
1
IRQ_OUT
AD18
O
OVDD
2, 4
Ethernet Management Interface
EC_MDC
AB9
O
OVDD
5, 9
EC_MDIO
AC8
I/O
OVDD
—
I
LVDD
—
Gigabit Reference Clock
EC_GTX_CLK125
V11
Three-Speed Ethernet Controller (Gigabit Ethernet 1)
TSEC1_RXD[7:0]
R5, U1, R3, U2, V3, V1, T3, T2
I
LVDD
—
TSEC1_TXD[7:0]
T10, V7, U10, U5, U4, V6, T5, T8
O
LVDD
5, 9
TSEC1_COL
R4
I
LVDD
—
TSEC1_CRS
V5
I/O
LVDD
20
TSEC1_GTX_CLK
U7
O
LVDD
—
TSEC1_RX_CLK
U3
I
LVDD
—
TSEC1_RX_DV
V2
I
LVDD
—
TSEC1_RX_ER
T1
I
LVDD
—
TSEC1_TX_CLK
T6
I
LVDD
—
TSEC1_TX_EN
U9
O
LVDD
30
TSEC1_TX_ER
T7
O
LVDD
—
Three-Speed Ethernet Controller (Gigabit Ethernet 2)
TSEC2_RXD[7:0]
P2, R2, N1, N2, P3, M2, M1, N3
I
LVDD
—
TSEC2_TXD[7:0]
N9, N10, P8, N7, R9, N5, R8, N6
O
LVDD
5, 9, 33
TSEC2_COL
P1
I
LVDD
—
TSEC2_CRS
R6
I/O
LVDD
20
TSEC2_GTX_CLK
P6
O
LVDD
—
TSEC2_RX_CLK
N4
I
LVDD
—
TSEC2_RX_DV
P5
I
LVDD
—
TSEC2_RX_ER
R1
I
LVDD
—
TSEC2_TX_CLK
P10
I
LVDD
—
TSEC2_TX_EN
P7
O
LVDD
30
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
108
Freescale Semiconductor
Package Description
Table 72. MPC8547E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
TSEC2_TX_ER
R10
O
LVDD
5, 9, 33
Three-Speed Ethernet Controller (Gigabit Ethernet 3)
TSEC3_TXD[3:0]
V8, W10, Y10, W7
O
TVDD
5, 9, 29
TSEC3_RXD[3:0]
Y1, W3, W5, W4
I
TVDD
—
TSEC3_GTX_CLK
W8
O
TVDD
—
TSEC3_RX_CLK
W2
I
TVDD
—
TSEC3_RX_DV
W1
I
TVDD
—
TSEC3_RX_ER
Y2
I
TVDD
—
TSEC3_TX_CLK
V10
I
TVDD
—
TSEC3_TX_EN
V9
O
TVDD
30
Three-Speed Ethernet Controller (Gigabit Ethernet 4)
TSEC4_TXD[3:0]/TSEC3_TXD[7:4]
AB8, Y7, AA7, Y8
O
TVDD
1, 5, 9,
29
TSEC4_RXD[3:0]/TSEC3_RXD[7:4]
AA1, Y3, AA2, AA4
I
TVDD
1
TSEC4_GTX_CLK
AA5
O
TVDD
TSEC4_RX_CLK/TSEC3_COL
Y5
I
TVDD
1
TSEC4_RX_DV/TSEC3_CRS
AA3
I/O
TVDD
1, 31
TSEC4_TX_EN/TSEC3_TX_ER
AB6
O
TVDD
1, 30
DUART
UART_CTS[0:1]
AB3, AC5
I
OVDD
—
UART_RTS[0:1]
AC6, AD7
O
OVDD
—
UART_SIN[0:1]
AB5, AC7
I
OVDD
—
AB7, AD8
O
OVDD
—
UART_SOUT[0:1]
I2C
Interface
IIC1_SCL
AG22
I/O
OVDD
4, 27
IIC1_SDA
AG21
I/O
OVDD
4, 27
IIC2_SCL
AG15
I/O
OVDD
4, 27
IIC2_SDA
AG14
I/O
OVDD
4, 27
SerDes
SD_RX[0:3]
M28, N26, P28, R26
I
XVDD
—
SD_RX[0:3]
M27, N25, P27, R25
I
XVDD
—
SD_TX[0:3]
M22, N20, P22, R20
O
XVDD
—
SD_TX[0:3]
M23, N21, P23, R21
O
XVDD
—
Reserved
W26, Y28, AA26, AB28
—
—
40
Reserved
W25, Y27, AA25, AB27
—
—
40
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
109
Package Description
Table 72. MPC8547E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
Reserved
U20, V22, W20, Y22
—
—
15
Reserved
U21, V23, W21, Y23
—
—
15
SD_PLL_TPD
U28
O
XVDD
24
SD_REF_CLK
T28
I
XVDD
—
SD_REF_CLK
T27
I
XVDD
—
Reserved
AC1, AC3
—
—
2
Reserved
M26, V28
—
—
32
Reserved
M25, V27
—
—
34
Reserved
M20, M21, T22, T23
—
—
38
O
BVDD
—
General-Purpose Output
GPOUT[24:31]
K26, K25, H27, G28, H25, J26, K24, K23
System Control
HRESET
AG17
I
OVDD
—
HRESET_REQ
AG16
O
OVDD
29
SRESET
AG20
I
OVDD
—
CKSTP_IN
AA9
I
OVDD
—
CKSTP_OUT
AA8
O
OVDD
2, 4
Debug
TRIG_IN
AB2
I
OVDD
—
TRIG_OUT/READY/QUIESCE
AB1
O
OVDD
6, 9,
19, 29
MSRCID[0:1]
AE4, AG2
O
OVDD
5, 6, 9
MSRCID[2:4]
AF3, AF1, AF2
O
OVDD
6, 19,
29
MDVAL
AE5
O
OVDD
6
CLK_OUT
AE21
O
OVDD
11
Clock
RTC
AF16
I
OVDD
—
SYSCLK
AH17
I
OVDD
—
JTAG
TCK
AG28
I
OVDD
—
TDI
AH28
I
OVDD
12
TDO
AF28
O
OVDD
—
TMS
AH27
I
OVDD
12
TRST
AH23
I
OVDD
12
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
110
Freescale Semiconductor
Package Description
Table 72. MPC8547E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
DFT
L1_TSTCLK
AC25
I
OVDD
25
L2_TSTCLK
AE22
I
OVDD
25
LSSD_MODE
AH20
I
OVDD
25
TEST_SEL
AH14
I
OVDD
25
Thermal Management
THERM0
AG1
—
—
14
THERM1
AH1
—
—
14
O
OVDD
9, 19,
29
Power Management
ASLEEP
AH18
Power and Ground Signals
GND
A11, B7, B24, C1, C3, C5, C12, C15, C26, D8,
D11, D16, D20, D22, E1, E5, E9, E12, E15, E17,
F4, F26, G12, G15, G18, G21, G24, H2, H6, H8,
H28, J4, J12, J15, J17, J27, K7, K9, K11, K27,
L3, L5, L12, L16, N11, N13, N15, N17, N19, P4,
P9, P12, P14, P16, P18, R11, R13, R15, R17,
R19, T4, T12, T14, T16, T18, U8, U11, U13,
U15, U17, U19, V4, V12, V18, W6, W19, Y4, Y9,
Y11, Y19, AA6, AA14, AA17, AA22, AA23, AB4,
AC2, AC11, AC19, AC26, AD5, AD9, AD22,
AE3, AE14, AF6, AF10, AF13, AG8, AG27,
K28, L24, L26, N24, N27, P25, R28, T24, T26,
U24, V25, W28, Y24, Y26, AA24, AA27, AB25,
AC28, L21, L23, N22, P20, R23, T21, U22, V20,
W23, Y21, U27
—
—
—
OVDD
V16, W11, W14, Y18, AA13, AA21, AB11,
AB17, AB24, AC4, AC9, AC21, AD6, AD13,
AD17, AD19, AE10, AE8, AE24, AF4, AF12,
AF22, AF27, AG26
Power for PCI
and other
standards
(3.3 V)
OVDD
—
LVDD
N8, R7, T9, U6
Power for
TSEC1 and
TSEC2
(2.5 V, 3.3 V)
LVDD
—
TVDD
W9, Y6
Power for
TSEC3 and
TSEC4
(2,5 V, 3.3 V)
TVDD
—
GVDD
B3, B11, C7, C9, C14, C17, D4, D6, D10, D15,
E2, E8, E11, E18, F5, F12, F16, G3, G7, G9,
G11, H5, H12, H15, H17, J10, K3, K12, K16,
K18, L6, M4, M8, M13
Power for
DDR1 and
DDR2 DRAM
I/O voltage
(1.8 V, 2.5 V)
GVDD
—
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
111
Package Description
Table 72. MPC8547E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
BVDD
C21, C24, C27, E20, E25, G19, G23, H26, J20 Power for local
bus (1.8 V,
2.5 V, 3.3 V)
BVDD
—
VDD
M19, N12, N14, N16, N18, P11, P13, P15, P17, Power for core
P19, R12, R14, R16, R18, T11, T13, T15, T17,
(1.1 V)
T19, U12, U14, U16, U18, V17, V19
VDD
—
SVDD
L25, L27, M24, N28, P24, P26, R24, R27, T25, Core power for
V24, V26, W24, W27, Y25, AA28, AC27
SerDes
transceivers
(1.1 V)
SVDD
—
XVDD
L20, L22, N23, P21, R22, T20, U23, V21, W22,
Y20
Pad Power for
SerDes
transceivers
(1.1 V)
XVDD
—
AVDD_LBIU
J28
Power for local
bus PLL
(1.1 V)
—
26
AVDD_PCI1
AH21
Power for
PCI1 PLL
(1.1 V)
—
26
AVDD_PCI2
AH22
Power for
PCI2 PLL
(1.1 V)
—
26
AVDD_CORE
AH15
Power for
e500 PLL (1.1
V)
—
26
AVDD_PLAT
AH19
Power for CCB
PLL (1.1 V)
—
26
AVDD_SRDS
U25
Power for
SRDSPLL
(1.1 V)
—
26
SENSEVDD
M14
O
VDD
13
SENSEVSS
M16
—
—
13
Analog Signals
MVREF
A18
I
Reference
voltage signal
for DDR
MVREF
—
SD_IMP_CAL_RX
L28
I
200 to
GND
—
SD_IMP_CAL_TX
AB26
I
100 to
GND
—
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
112
Freescale Semiconductor
Package Description
Table 72. MPC8547E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
SD_PLL_TPA
U26
O
—
24
Note: All note references in this table use the same numbers as those for Table 71. See Table 71 for the meanings of these
notes.
Table 73 provides the pin-out listing for the MPC8545E 783 FC-PBGA package.
NOTE
All note references in the following table use the same numbers as those for
Table 71. See Table 71 for the meanings of these notes.
Table 73. MPC8545E Pinout Listing
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
PCI1 and PCI2 (One 64-Bit or Two 32-Bit)
PCI1_AD[63:32]/PCI2_AD[31:0]
AB14, AC15, AA15, Y16, W16, AB16, AC16,
AA16, AE17, AA18, W18, AC17, AD16, AE16,
Y17, AC18, AB18, AA19, AB19, AB21, AA20,
AC20, AB20, AB22, AC22, AD21, AB23, AF23,
AD23, AE23, AC23, AC24
I/O
OVDD
17
PCI1_AD[31:0]
AH6, AE7, AF7, AG7, AH7, AF8, AH8, AE9,
AH9, AC10, AB10, AD10, AG10, AA10, AH10,
AA11, AB12, AE12, AG12, AH12, AB13, AA12,
AC13, AE13, Y14, W13, AG13, V14, AH13,
AC14, Y15, AB15
I/O
OVDD
17
PCI1_C_BE[7:4]/PCI2_C_BE[3:0]
AF15, AD14, AE15, AD15
I/O
OVDD
17
PCI1_C_BE[3:0]
AF9, AD11, Y12, Y13
I/O
OVDD
17
PCI1_PAR64/PCI2_PAR
W15
I/O
OVDD
—
PCI1_GNT[4:1]
AG6, AE6, AF5, AH5
O
OVDD
5, 9, 35
PCI1_GNT0
AG5
I/O
OVDD
—
PCI1_IRDY
AF11
I/O
OVDD
2
PCI1_PAR
AD12
I/O
OVDD
—
PCI1_PERR
AC12
I/O
OVDD
2
PCI1_SERR
V13
I/O
OVDD
2, 4
PCI1_STOP
W12
I/O
OVDD
2
PCI1_TRDY
AG11
I/O
OVDD
2
PCI1_REQ[4:1]
AH2, AG4, AG3, AH4
I
OVDD
—
PCI1_REQ0
AH3
I/O
OVDD
—
PCI1_CLK
AH26
I
OVDD
39
PCI1_DEVSEL
AH11
I/O
OVDD
2
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
113
Package Description
Table 73. MPC8545E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
PCI1_FRAME
AE11
I/O
OVDD
2
PCI1_IDSEL
AG9
I
OVDD
—
PCI1_REQ64/PCI2_FRAME
AF14
I/O
OVDD
2, 5, 10
PCI1_ACK64/PCI2_DEVSEL
V15
I/O
OVDD
2
PCI2_CLK
AE28
I
OVDD
39
PCI2_IRDY
AD26
I/O
OVDD
2
PCI2_PERR
AD25
I/O
OVDD
2
PCI2_GNT[4:1]
AE26, AG24, AF25, AE25
O
OVDD
5, 9, 35
PCI2_GNT0
AG25
I/O
OVDD
—
PCI2_SERR
AD24
I/O
OVDD
2,4
PCI2_STOP
AF24
I/O
OVDD
2
PCI2_TRDY
AD27
I/O
OVDD
2
PCI2_REQ[4:1]
AD28, AE27, W17, AF26
I
OVDD
—
PCI2_REQ0
AH25
I/O
OVDD
—
DDR SDRAM Memory Interface
MDQ[0:63]
L18, J18, K14, L13, L19, M18, L15, L14, A17,
B17, A13, B12, C18, B18, B13, A12, H18, F18,
J14, F15, K19, J19, H16, K15, D17, G16, K13,
D14, D18, F17, F14, E14, A7, A6, D5, A4, C8,
D7, B5, B4, A2, B1, D1, E4, A3, B2, D2, E3, F3,
G4, J5, K5, F6, G5, J6, K4, J1, K2, M5, M3, J3,
J2, L1, M6
I/O
GVDD
—
MECC[0:7]
H13, F13, F11, C11, J13, G13, D12, M12
I/O
GVDD
—
MDM[0:8]
M17, C16, K17, E16, B6, C4, H4, K1, E13
O
GVDD
—
MDQS[0:8]
M15, A16, G17, G14, A5, D3, H1, L2, C13
I/O
GVDD
—
MDQS[0:8]
L17, B16, J16, H14, C6, C2, H3, L4, D13
I/O
GVDD
—
MA[0:15]
A8, F9, D9, B9, A9, L10, M10, H10, K10, G10,
B8, E10, B10, G6, A10, L11
O
GVDD
—
MBA[0:2]
F7, J7, M11
O
GVDD
—
MWE
E7
O
GVDD
—
MCAS
H7
O
GVDD
—
MRAS
L8
O
GVDD
—
MCKE[0:3]
F10, C10, J11, H11
O
GVDD
11
MCS[0:3]
K8, J8, G8, F8
O
GVDD
—
MCK[0:5]
H9, B15, G2, M9, A14, F1
O
GVDD
—
MCK[0:5]
J9, A15, G1, L9, B14, F2
O
GVDD
—
MODT[0:3]
E6, K6, L7, M7
O
GVDD
—
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
114
Freescale Semiconductor
Package Description
Table 73. MPC8545E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
MDIC[0:1]
A19, B19
I/O
GVDD
36
Local Bus Controller Interface
LAD[0:31]
E27, B20, H19, F25, A20, C19, E28, J23, A25,
K22, B28, D27, D19, J22, K20, D28, D25, B25,
E22, F22, F21, C25, C22, B23, F20, A23, A22,
E19, A21, D21, F19, B21
I/O
BVDD
—
LDP[0:3]
K21, C28, B26, B22
I/O
BVDD
—
LA[27]
H21
O
BVDD
5, 9
LA[28:31]
H20, A27, D26, A28
O
BVDD
5, 7, 9
LCS[0:4]
J25, C20, J24, G26, A26
O
BVDD
—
LCS5/DMA_DREQ2
D23
I/O
BVDD
1
LCS6/DMA_DACK2
G20
O
BVDD
1
LCS7/DMA_DDONE2
E21
O
BVDD
1
LWE0/LBS0/LSDDQM[0]
G25
O
BVDD
5, 9
LWE1/LBS1/LSDDQM[1]
C23
O
BVDD
5, 9
LWE2/LBS2/LSDDQM[2]
J21
O
BVDD
5, 9
LWE3/LBS3/LSDDQM[3]
A24
O
BVDD
5, 9
LALE
H24
O
BVDD
5, 8, 9
LBCTL
G27
O
BVDD
5, 8, 9
LGPL0/LSDA10
F23
O
BVDD
5, 9
LGPL1/LSDWE
G22
O
BVDD
5, 9
LGPL2/LOE/LSDRAS
B27
O
BVDD
5, 8, 9
LGPL3/LSDCAS
F24
O
BVDD
5, 9
LGPL4/LGTA/LUPWAIT/LPBSE
H23
I/O
BVDD
—
LGPL5
E26
O
BVDD
5, 9
LCKE
E24
O
BVDD
—
LCLK[0:2]
E23, D24, H22
O
BVDD
—
LSYNC_IN
F27
I
BVDD
—
LSYNC_OUT
F28
O
BVDD
—
DMA
DMA_DACK[0:1]
AD3, AE1
O
OVDD
5, 9,
106
DMA_DREQ[0:1]
AD4, AE2
I
OVDD
—
DMA_DDONE[0:1]
AD2, AD1
O
OVDD
—
Programmable Interrupt Controller
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
115
Package Description
Table 73. MPC8545E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
UDE
AH16
I
OVDD
—
MCP
AG19
I
OVDD
—
IRQ[0:7]
AG23, AF18, AE18, AF20, AG18, AF17, AH24,
AE20
I
OVDD
—
IRQ[8]
AF19
I
OVDD
—
IRQ[9]/DMA_DREQ3
AF21
I
OVDD
1
IRQ[10]/DMA_DACK3
AE19
I/O
OVDD
1
IRQ[11]/DMA_DDONE3
AD20
I/O
OVDD
1
IRQ_OUT
AD18
O
OVDD
2, 4
Ethernet Management Interface
EC_MDC
AB9
O
OVDD
5, 9
EC_MDIO
AC8
I/O
OVDD
—
I
LVDD
—
Gigabit Reference Clock
EC_GTX_CLK125
V11
Three-Speed Ethernet Controller (Gigabit Ethernet 1)
TSEC1_RXD[7:0]
R5, U1, R3, U2, V3, V1, T3, T2
I
LVDD
—
TSEC1_TXD[7:0]
T10, V7, U10, U5, U4, V6, T5, T8
O
LVDD
5, 9
TSEC1_COL
R4
I
LVDD
—
TSEC1_CRS
V5
I/O
LVDD
20
TSEC1_GTX_CLK
U7
O
LVDD
—
TSEC1_RX_CLK
U3
I
LVDD
—
TSEC1_RX_DV
V2
I
LVDD
—
TSEC1_RX_ER
T1
I
LVDD
—
TSEC1_TX_CLK
T6
I
LVDD
—
TSEC1_TX_EN
U9
O
LVDD
30
TSEC1_TX_ER
T7
O
LVDD
—
GPIN[0:7]
P2, R2, N1, N2, P3, M2, M1, N3
I
LVDD
103
GPOUT[0:5]
N9, N10, P8, N7, R9, N5
O
LVDD
—
cfg_dram_type0/GPOUT6
R8
O
LVDD
5, 9
GPOUT7
N6
O
LVDD
—
Reserved
P1
—
—
104
Reserved
R6
—
—
104
Reserved
P6
—
—
15
Reserved
N4
—
—
105
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
116
Freescale Semiconductor
Package Description
Table 73. MPC8545E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
FIFO1_RXC2
P5
I
LVDD
104
Reserved
R1
—
—
104
Reserved
P10
—
—
105
FIFO1_TXC2
P7
O
LVDD
15
cfg_dram_type1
R10
I
LVDD
5
Three-Speed Ethernet Controller (Gigabit Ethernet 3)
TSEC3_TXD[3:0]
V8, W10, Y10, W7
O
TVDD
5, 9, 29
TSEC3_RXD[3:0]
Y1, W3, W5, W4
I
TVDD
—
TSEC3_GTX_CLK
W8
O
TVDD
—
TSEC3_RX_CLK
W2
I
TVDD
—
TSEC3_RX_DV
W1
I
TVDD
—
TSEC3_RX_ER
Y2
I
TVDD
—
TSEC3_TX_CLK
V10
I
TVDD
—
TSEC3_TX_EN
V9
O
TVDD
30
TSEC3_TXD[7:4]
AB8, Y7, AA7, Y8
O
TVDD
5, 9, 29
TSEC3_RXD[7:4]
AA1, Y3, AA2, AA4
I
TVDD
—
Reserved
AA5
—
—
15
TSEC3_COL
Y5
I
TVDD
—
TSEC3_CRS
AA3
I/O
TVDD
31
TSEC3_TX_ER
AB6
O
TVDD
—
DUART
UART_CTS[0:1]
AB3, AC5
I
OVDD
—
UART_RTS[0:1]
AC6, AD7
O
OVDD
—
UART_SIN[0:1]
AB5, AC7
I
OVDD
—
AB7, AD8
O
OVDD
—
UART_SOUT[0:1]
2C
I
interface
IIC1_SCL
AG22
I/O
OVDD
4, 27
IIC1_SDA
AG21
I/O
OVDD
4, 27
IIC2_SCL
AG15
I/O
OVDD
4, 27
IIC2_SDA
AG14
I/O
OVDD
4, 27
SerDes
SD_RX[0:3]
M28, N26, P28, R26
I
XVDD
—
SD_RX[0:3]
M27, N25, P27, R25
I
XVDD
—
SD_TX[0:3]
M22, N20, P22, R20
O
XVDD
—
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
117
Package Description
Table 73. MPC8545E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
SD_TX[0:3]
M23, N21, P23, R21
O
XVDD
—
Reserved
W26, Y28, AA26, AB28
—
—
40
Reserved
W25, Y27, AA25, AB27
—
—
40
Reserved
U20, V22, W20, Y22
—
—
15
Reserved
U21, V23, W21, Y23
—
—
15
SD_PLL_TPD
U28
O
XVDD
24
SD_REF_CLK
T28
I
XVDD
—
SD_REF_CLK
T27
I
XVDD
—
Reserved
AC1, AC3
—
—
2
Reserved
M26, V28
—
—
32
Reserved
M25, V27
—
—
34
Reserved
M20, M21, T22, T23
—
—
38
O
BVDD
—
General-Purpose Output
GPOUT[24:31]
K26, K25, H27, G28, H25, J26, K24, K23
System Control
HRESET
AG17
I
OVDD
—
HRESET_REQ
AG16
O
OVDD
29
SRESET
AG20
I
OVDD
—
CKSTP_IN
AA9
I
OVDD
—
CKSTP_OUT
AA8
O
OVDD
2, 4
Debug
TRIG_IN
AB2
I
OVDD
—
TRIG_OUT/READY/QUIESCE
AB1
O
OVDD
6, 9,
19, 29
MSRCID[0:1]
AE4, AG2
O
OVDD
5, 6, 9
MSRCID[2:4]
AF3, AF1, AF2
O
OVDD
6, 19,
29
MDVAL
AE5
O
OVDD
6
CLK_OUT
AE21
O
OVDD
11
Clock
RTC
AF16
I
OVDD
—
SYSCLK
AH17
I
OVDD
—
JTAG
TCK
AG28
I
OVDD
—
TDI
AH28
I
OVDD
12
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
118
Freescale Semiconductor
Package Description
Table 73. MPC8545E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
TDO
AF28
O
OVDD
—
TMS
AH27
I
OVDD
12
TRST
AH23
I
OVDD
12
DFT
L1_TSTCLK
AC25
I
OVDD
25
L2_TSTCLK
AE22
I
OVDD
25
LSSD_MODE
AH20
I
OVDD
25
TEST_SEL
AH14
I
OVDD
25
Thermal Management
THERM0
AG1
—
—
14
THERM1
AH1
—
—
14
O
OVDD
9, 19,
29
Power Management
ASLEEP
AH18
Power and Ground Signals
GND
A11, B7, B24, C1, C3, C5, C12, C15, C26, D8,
D11, D16, D20, D22, E1, E5, E9, E12, E15, E17,
F4, F26, G12, G15, G18, G21, G24, H2, H6, H8,
H28, J4, J12, J15, J17, J27, K7, K9, K11, K27,
L3, L5, L12, L16, N11, N13, N15, N17, N19, P4,
P9, P12, P14, P16, P18, R11, R13, R15, R17,
R19, T4, T12, T14, T16, T18, U8, U11, U13,
U15, U17, U19, V4, V12, V18, W6, W19, Y4, Y9,
Y11, Y19, AA6, AA14, AA17, AA22, AA23, AB4,
AC2, AC11, AC19, AC26, AD5, AD9, AD22,
AE3, AE14, AF6, AF10, AF13, AG8, AG27,
K28, L24, L26, N24, N27, P25, R28, T24, T26,
U24, V25, W28, Y24, Y26, AA24, AA27, AB25,
AC28, L21, L23, N22, P20, R23, T21, U22, V20,
W23, Y21, U27
—
—
—
OVDD
V16, W11, W14, Y18, AA13, AA21, AB11,
AB17, AB24, AC4, AC9, AC21, AD6, AD13,
AD17, AD19, AE10, AE8, AE24, AF4, AF12,
AF22, AF27, AG26
Power for PCI
and other
standards
(3.3 V)
OVDD
—
LVDD
N8, R7, T9, U6
Power for
TSEC1 and
TSEC2
(2.5 V, 3.3 V)
LVDD
—
TVDD
W9, Y6
Power for
TSEC3 and
TSEC4
(2,5 V, 3.3 V)
TVDD
—
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
119
Package Description
Table 73. MPC8545E Pinout Listing (continued)
Power
Supply
Notes
Power for
DDR1 and
DDR2 DRAM
I/O voltage
(1.8 V, 2.5 V)
GVDD
—
BVDD
C21, C24, C27, E20, E25, G19, G23, H26, J20 Power for local
bus (1.8 V,
2.5 V, 3.3 V)
BVDD
—
VDD
M19, N12, N14, N16, N18, P11, P13, P15, P17, Power for core
P19, R12, R14, R16, R18, T11, T13, T15, T17,
(1.1 V)
T19, U12, U14, U16, U18, V17, V19
VDD
—
SVDD
L25, L27, M24, N28, P24, P26, R24, R27, T25, Core power for
V24, V26, W24, W27, Y25, AA28, AC27
SerDes
transceivers
(1.1 V)
SVDD
—
XVDD
L20, L22, N23, P21, R22, T20, U23, V21, W22,
Y20
Pad power for
SerDes
transceivers
(1.1 V)
XVDD
—
AVDD_LBIU
J28
Power for local
bus PLL
(1.1 V)
—
26
AVDD_PCI1
AH21
Power for
PCI1 PLL
(1.1 V)
—
26
AVDD_PCI2
AH22
Power for
PCI2 PLL
(1.1 V)
—
26
AVDD_CORE
AH15
Power for
e500 PLL (1.1
V)
—
26
AVDD_PLAT
AH19
Power for CCB
PLL (1.1 V)
—
26
AVDD_SRDS
U25
Power for
SRDSPLL (1.1
V)
—
26
SENSEVDD
M14
O
VDD
13
SENSEVSS
M16
—
—
13
I
Reference
voltage signal
for DDR
MVREF
—
Signal
Package Pin Number
Pin Type
GVDD
B3, B11, C7, C9, C14, C17, D4, D6, D10, D15,
E2, E8, E11, E18, F5, F12, F16, G3, G7, G9,
G11, H5, H12, H15, H17, J10, K3, K12, K16,
K18, L6, M4, M8, M13
Analog Signals
MVREF
A18
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
120
Freescale Semiconductor
Package Description
Table 73. MPC8545E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
SD_IMP_CAL_RX
L28
I
200 to
GND
—
SD_IMP_CAL_TX
AB26
I
100 to
GND
—
SD_PLL_TPA
U26
O
—
24
Note: All note references in this table use the same numbers as those for Table 71. See Table 71 for the meanings of these
notes.
Table 74 provides the pin-out listing for the MPC8543E 783 FC-PBGA package.
NOTE
All note references in the following table use the same numbers as those for
Table 71. See Table 71 for the meanings of these notes.
Table 74. MPC8543E Pinout Listing
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
PCI1 (One 32-Bit)
Reserved
AB14, AC15, AA15, Y16, W16, AB16, AC16,
AA16, AE17, AA18, W18, AC17, AD16, AE16,
Y17, AC18,
—
—
110
GPOUT[8:15]
AB18, AA19, AB19, AB21, AA20, AC20, AB20,
AB22
O
OVDD
—
GPIN[8:15]
AC22, AD21, AB23, AF23, AD23, AE23, AC23,
AC24
I
OVDD
111
PCI1_AD[31:0]
AH6, AE7, AF7, AG7, AH7, AF8, AH8, AE9,
AH9, AC10, AB10, AD10, AG10, AA10, AH10,
AA11, AB12, AE12, AG12, AH12, AB13, AA12,
AC13, AE13, Y14, W13, AG13, V14, AH13,
AC14, Y15, AB15
I/O
OVDD
17
Reserved
AF15, AD14, AE15, AD15
—
—
110
PCI1_C_BE[3:0]
AF9, AD11, Y12, Y13
I/O
OVDD
17
Reserved
W15
—
—
110
PCI1_GNT[4:1]
AG6, AE6, AF5, AH5
O
OVDD
5, 9, 35
PCI1_GNT0
AG5
I/O
OVDD
—
PCI1_IRDY
AF11
I/O
OVDD
2
PCI1_PAR
AD12
I/O
OVDD
—
PCI1_PERR
AC12
I/O
OVDD
2
PCI1_SERR
V13
I/O
OVDD
2, 4
PCI1_STOP
W12
I/O
OVDD
2
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
121
Package Description
Table 74. MPC8543E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
PCI1_TRDY
AG11
I/O
OVDD
2
PCI1_REQ[4:1]
AH2, AG4, AG3, AH4
I
OVDD
—
PCI1_REQ0
AH3
I/O
OVDD
—
PCI1_CLK
AH26
I
OVDD
39
PCI1_DEVSEL
AH11
I/O
OVDD
2
PCI1_FRAME
AE11
I/O
OVDD
2
PCI1_IDSEL
AG9
I
OVDD
—
cfg_pci1_width
AF14
I/O
OVDD
112
Reserved
V15
—
—
110
Reserved
AE28
—
—
2
Reserved
AD26
—
—
110
Reserved
AD25
—
—
110
Reserved
AE26
—
—
110
cfg_pci1_clk
AG24
I
OVDD
5
Reserved
AF25
—
—
101
Reserved
AE25
—
—
110
Reserved
AG25
—
—
110
Reserved
AD24
—
—
110
Reserved
AF24
—
—
110
Reserved
AD27
—
—
110
Reserved
AD28, AE27, W17, AF26
—
—
110
Reserved
AH25
—
—
110
DDR SDRAM Memory Interface
MDQ[0:63]
L18, J18, K14, L13, L19, M18, L15, L14, A17,
B17, A13, B12, C18, B18, B13, A12, H18, F18,
J14, F15, K19, J19, H16, K15, D17, G16, K13,
D14, D18, F17, F14, E14, A7, A6, D5, A4, C8,
D7, B5, B4, A2, B1, D1, E4, A3, B2, D2, E3, F3,
G4, J5, K5, F6, G5, J6, K4, J1, K2, M5, M3, J3,
J2, L1, M6
I/O
GVDD
—
MECC[0:7]
H13, F13, F11, C11, J13, G13, D12, M12
I/O
GVDD
—
MDM[0:8]
M17, C16, K17, E16, B6, C4, H4, K1, E13
O
GVDD
—
MDQS[0:8]
M15, A16, G17, G14, A5, D3, H1, L2, C13
I/O
GVDD
—
MDQS[0:8]
L17, B16, J16, H14, C6, C2, H3, L4, D13
I/O
GVDD
—
MA[0:15]
A8, F9, D9, B9, A9, L10, M10, H10, K10, G10,
B8, E10, B10, G6, A10, L11
O
GVDD
—
MBA[0:2]
F7, J7, M11
O
GVDD
—
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
122
Freescale Semiconductor
Package Description
Table 74. MPC8543E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
MWE
E7
O
GVDD
—
MCAS
H7
O
GVDD
—
MRAS
L8
O
GVDD
—
MCKE[0:3]
F10, C10, J11, H11
O
GVDD
11
MCS[0:3]
K8, J8, G8, F8
O
GVDD
—
MCK[0:5]
H9, B15, G2, M9, A14, F1
O
GVDD
—
MCK[0:5]
J9, A15, G1, L9, B14, F2
O
GVDD
—
MODT[0:3]
E6, K6, L7, M7
O
GVDD
—
MDIC[0:1]
A19, B19
I/O
GVDD
36
Local Bus Controller Interface
LAD[0:31]
E27, B20, H19, F25, A20, C19, E28, J23, A25,
K22, B28, D27, D19, J22, K20, D28, D25, B25,
E22, F22, F21, C25, C22, B23, F20, A23, A22,
E19, A21, D21, F19, B21
I/O
BVDD
—
LDP[0:3]
K21, C28, B26, B22
I/O
BVDD
—
LA[27]
H21
O
BVDD
5, 9
LA[28:31]
H20, A27, D26, A28
O
BVDD
5, 7, 9
LCS[0:4]
J25, C20, J24, G26, A26
O
BVDD
—
LCS5/DMA_DREQ2
D23
I/O
BVDD
1
LCS6/DMA_DACK2
G20
O
BVDD
1
LCS7/DMA_DDONE2
E21
O
BVDD
1
LWE0/LBS0/LSDDQM[0]
G25
O
BVDD
5, 9
LWE1/LBS1/LSDDQM[1]
C23
O
BVDD
5, 9
LWE2/LBS2/LSDDQM[2]
J21
O
BVDD
5, 9
LWE3/LBS3/LSDDQM[3]
A24
O
BVDD
5, 9
LALE
H24
O
BVDD
5, 8, 9
LBCTL
G27
O
BVDD
5, 8, 9
LGPL0/LSDA10
F23
O
BVDD
5, 9
LGPL1/LSDWE
G22
O
BVDD
5, 9
LGPL2/LOE/LSDRAS
B27
O
BVDD
5, 8, 9
LGPL3/LSDCAS
F24
O
BVDD
5, 9
LGPL4/LGTA/LUPWAIT/LPBSE
H23
I/O
BVDD
—
LGPL5
E26
O
BVDD
5, 9
LCKE
E24
O
BVDD
—
LCLK[0:2]
E23, D24, H22
O
BVDD
—
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
123
Package Description
Table 74. MPC8543E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
LSYNC_IN
F27
I
BVDD
—
LSYNC_OUT
F28
O
BVDD
—
DMA
DMA_DACK[0:1]
AD3, AE1
O
OVDD
5, 9, 108
DMA_DREQ[0:1]
AD4, AE2
I
OVDD
—
DMA_DDONE[0:1]
AD2, AD1
O
OVDD
—
Programmable Interrupt Controller
UDE
AH16
I
OVDD
—
MCP
AG19
I
OVDD
—
IRQ[0:7]
AG23, AF18, AE18, AF20, AG18, AF17, AH24,
AE20
I
OVDD
—
IRQ[8]
AF19
I
OVDD
—
IRQ[9]/DMA_DREQ3
AF21
I
OVDD
1
IRQ[10]/DMA_DACK3
AE19
I/O
OVDD
1
IRQ[11]/DMA_DDONE3
AD20
I/O
OVDD
1
IRQ_OUT
AD18
O
OVDD
2, 4
Ethernet Management Interface
EC_MDC
AB9
O
OVDD
5, 9
EC_MDIO
AC8
I/O
OVDD
—
I
LVDD
—
Gigabit Reference Clock
EC_GTX_CLK125
V11
Three-Speed Ethernet Controller (Gigabit Ethernet 1)
TSEC1_RXD[7:0]
R5, U1, R3, U2, V3, V1, T3, T2
I
LVDD
—
TSEC1_TXD[7:0]
T10, V7, U10, U5, U4, V6, T5, T8
O
LVDD
5, 9
TSEC1_COL
R4
I
LVDD
—
TSEC1_CRS
V5
I/O
LVDD
20
TSEC1_GTX_CLK
U7
O
LVDD
—
TSEC1_RX_CLK
U3
I
LVDD
—
TSEC1_RX_DV
V2
I
LVDD
—
TSEC1_RX_ER
T1
I
LVDD
—
TSEC1_TX_CLK
T6
I
LVDD
—
TSEC1_TX_EN
U9
O
LVDD
30
TSEC1_TX_ER
T7
O
LVDD
—
GPIN[0:7]
P2, R2, N1, N2, P3, M2, M1, N3
I
LVDD
103
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
124
Freescale Semiconductor
Package Description
Table 74. MPC8543E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
GPOUT[0:5]
N9, N10, P8, N7, R9, N5
O
LVDD
—
cfg_dram_type0/GPOUT6
R8
O
LVDD
5, 9
GPOUT7
N6
O
LVDD
—
Reserved
P1
—
—
104
Reserved
R6
—
—
104
Reserved
P6
—
—
15
Reserved
N4
—
—
105
FIFO1_RXC2
P5
I
LVDD
104
Reserved
R1
—
—
104
Reserved
P10
—
—
105
FIFO1_TXC2
P7
O
LVDD
15
cfg_dram_type1
R10
O
LVDD
5, 9
Three-Speed Ethernet Controller (Gigabit Ethernet 3)
TSEC3_TXD[3:0]
V8, W10, Y10, W7
O
TVDD
5, 9, 29
TSEC3_RXD[3:0]
Y1, W3, W5, W4
I
TVDD
—
TSEC3_GTX_CLK
W8
O
TVDD
—
TSEC3_RX_CLK
W2
I
TVDD
—
TSEC3_RX_DV
W1
I
TVDD
—
TSEC3_RX_ER
Y2
I
TVDD
—
TSEC3_TX_CLK
V10
I
TVDD
—
TSEC3_TX_EN
V9
O
TVDD
30
TSEC3_TXD[7:4]
AB8, Y7, AA7, Y8
O
TVDD
5, 9, 29
TSEC3_RXD[7:4]
AA1, Y3, AA2, AA4
I
TVDD
—
Reserved
AA5
—
—
15
TSEC3_COL
Y5
I
TVDD
—
TSEC3_CRS
AA3
I/O
TVDD
31
TSEC3_TX_ER
AB6
O
TVDD
—
DUART
UART_CTS[0:1]
AB3, AC5
I
OVDD
—
UART_RTS[0:1]
AC6, AD7
O
OVDD
—
UART_SIN[0:1]
AB5, AC7
I
OVDD
—
UART_SOUT[0:1]
AB7, AD8
O
OVDD
—
I/O
OVDD
4, 27
2C
I
IIC1_SCL
interface
AG22
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
125
Package Description
Table 74. MPC8543E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
IIC1_SDA
AG21
I/O
OVDD
4, 27
IIC2_SCL
AG15
I/O
OVDD
4, 27
IIC2_SDA
AG14
I/O
OVDD
4, 27
SerDes
SD_RX[0:7]
M28, N26, P28, R26, W26, Y28, AA26, AB28
I
XVDD
—
SD_RX[0:7]
M27, N25, P27, R25, W25, Y27, AA25, AB27
I
XVDD
—
SD_TX[0:7]
M22, N20, P22, R20, U20, V22, W20, Y22
O
XVDD
—
SD_TX[0:7]
M23, N21, P23, R21, U21, V23, W21, Y23
O
XVDD
—
SD_PLL_TPD
U28
O
XVDD
24
SD_REF_CLK
T28
I
XVDD
—
SD_REF_CLK
T27
I
XVDD
—
Reserved
AC1, AC3
—
—
2
Reserved
M26, V28
—
—
32
Reserved
M25, V27
—
—
34
Reserved
M20, M21, T22, T23
—
—
38
O
BVDD
—
General-Purpose Output
GPOUT[24:31]
K26, K25, H27, G28, H25, J26, K24, K23
System Control
HRESET
AG17
I
OVDD
—
HRESET_REQ
AG16
O
OVDD
29
SRESET
AG20
I
OVDD
—
CKSTP_IN
AA9
I
OVDD
—
CKSTP_OUT
AA8
O
OVDD
2, 4
Debug
TRIG_IN
AB2
I
OVDD
—
TRIG_OUT/READY/QUIESCE
AB1
O
OVDD
6, 9, 19,
29
MSRCID[0:1]
AE4, AG2
O
OVDD
5, 6, 9
MSRCID[2:4]
AF3, AF1, AF2
O
OVDD
6, 19, 29
MDVAL
AE5
O
OVDD
6
CLK_OUT
AE21
O
OVDD
11
Clock
RTC
AF16
I
OVDD
—
SYSCLK
AH17
I
OVDD
—
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
126
Freescale Semiconductor
Package Description
Table 74. MPC8543E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
JTAG
TCK
AG28
I
OVDD
—
TDI
AH28
I
OVDD
12
TDO
AF28
O
OVDD
—
TMS
AH27
I
OVDD
12
TRST
AH23
I
OVDD
12
DFT
L1_TSTCLK
AC25
I
OVDD
25
L2_TSTCLK
AE22
I
OVDD
25
LSSD_MODE
AH20
I
OVDD
25
TEST_SEL
AH14
I
OVDD
109
Thermal Management
THERM0
AG1
—
—
14
THERM1
AH1
—
—
14
O
OVDD
9, 19, 29
Power Management
ASLEEP
AH18
Power and Ground Signals
GND
A11, B7, B24, C1, C3, C5, C12, C15, C26, D8,
D11, D16, D20, D22, E1, E5, E9, E12, E15, E17,
F4, F26, G12, G15, G18, G21, G24, H2, H6, H8,
H28, J4, J12, J15, J17, J27, K7, K9, K11, K27,
L3, L5, L12, L16, N11, N13, N15, N17, N19, P4,
P9, P12, P14, P16, P18, R11, R13, R15, R17,
R19, T4, T12, T14, T16, T18, U8, U11, U13,
U15, U17, U19, V4, V12, V18, W6, W19, Y4, Y9,
Y11, Y19, AA6, AA14, AA17, AA22, AA23, AB4,
AC2, AC11, AC19, AC26, AD5, AD9, AD22,
AE3, AE14, AF6, AF10, AF13, AG8, AG27,
K28, L24, L26, N24, N27, P25, R28, T24, T26,
U24, V25, W28, Y24, Y26, AA24, AA27, AB25,
AC28, L21, L23, N22, P20, R23, T21, U22, V20,
W23, Y21, U27
—
—
—
OVDD
V16, W11, W14, Y18, AA13, AA21, AB11,
AB17, AB24, AC4, AC9, AC21, AD6, AD13,
AD17, AD19, AE10, AE8, AE24, AF4, AF12,
AF22, AF27, AG26
Power for
PCI and
other
standards
(3.3 V)
OVDD
—
LVDD
N8, R7, T9, U6
Power for
TSEC1 and
TSEC2
(2.5 V, 3.3 V)
LVDD
—
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Freescale Semiconductor
127
Package Description
Table 74. MPC8543E Pinout Listing (continued)
Power
Supply
Notes
Power for
TSEC3 and
TSEC4
(2,5 V, 3.3 V)
TVDD
—
B3, B11, C7, C9, C14, C17, D4, D6, D10, D15,
E2, E8, E11, E18, F5, F12, F16, G3, G7, G9,
G11, H5, H12, H15, H17, J10, K3, K12, K16,
K18, L6, M4, M8, M13
Power for
DDR1 and
DDR2
DRAM I/O
voltage
(1.8 V,2.5 V)
GVDD
—
BVDD
C21, C24, C27, E20, E25, G19, G23, H26, J20
Power for
local bus
(1.8 V, 2.5 V,
3.3 V)
BVDD
—
VDD
M19, N12, N14, N16, N18, P11, P13, P15, P17,
P19, R12, R14, R16, R18, T11, T13, T15, T17,
T19, U12, U14, U16, U18, V17, V19
Power for
core (1.1 V)
VDD
—
SVDD
L25, L27, M24, N28, P24, P26, R24, R27, T25,
V24, V26, W24, W27, Y25, AA28, AC27
Core power
for SerDes
transceivers
(1.1 V)
SVDD
—
XVDD
L20, L22, N23, P21, R22, T20, U23, V21, W22,
Y20
Pad power
for SerDes
transceivers
(1.1 V)
XVDD
—
AVDD_LBIU
J28
Power for
local bus
PLL
(1.1 V)
—
26
AVDD_PCI1
AH21
Power for
PCI1 PLL
(1.1 V)
—
26
AVDD_PCI2
AH22
Power for
PCI2 PLL
(1.1 V)
—
26
AVDD_CORE
AH15
Power for
e500 PLL
(1.1 V)
—
26
AVDD_PLAT
AH19
Power for
CCB PLL
(1.1 V)
—
26
AVDD_SRDS
U25
Power for
SRDSPLL
(1.1 V)
—
26
SENSEVDD
M14
O
VDD
13
Signal
Package Pin Number
Pin Type
TVDD
W9, Y6
GVDD
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Freescale Semiconductor
Package Description
Table 74. MPC8543E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
SENSEVSS
M16
—
—
13
Analog Signals
MVREF
A18
I
Reference
voltage
signal for
DDR
MVREF
—
SD_IMP_CAL_RX
L28
I
200 (±1%)
to GND
—
SD_IMP_CAL_TX
AB26
I
100 (±1%)
to GND
—
SD_PLL_TPA
U26
O
AVDD_SRDS
24
Note: All note references in this table use the same numbers as those for Table 71. See Table 71 for the meanings of these
notes.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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129
Clocking
20 Clocking
This section describes the PLL configuration of the device. Note that the platform clock is identical to the
core complex bus (CCB) clock.
20.1
Clock Ranges
Table 75 through Table 77 provide the clocking specifications for the processor cores and Table 78,
through Table 80 provide the clocking specifications for the memory bus.
Table 75. Processor Core Clocking Specifications (MPC8548E and MPC8547E)
Maximum Processor Core Frequency
Characteristic
e500 core processor frequency
1000 MHz
1200 MHz
1333 MHz
Min
Max
Min
Max
Min
Max
800
1000
800
1200
800
1333
Unit
Notes
MHz
1, 2
Notes:
1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK
frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating
frequencies. See Section 20.2, “CCB/SYSCLK PLL Ratio,” and Section 20.3, “e500 Core PLL Ratio,” for ratio settings.
2.)The minimum e500 core frequency is based on the minimum platform frequency of 333 MHz.
Table 76. Processor Core Clocking Specifications (MPC8545E)
Maximum Processor Core Frequency
Characteristic
e500 core processor frequency
800 MHz
1000 MHz
1200 MHz
Min
Max
Min
Max
Min
Max
800
800
800
1000
800
1200
Unit
Notes
MHz
1, 2
Notes:
1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK
frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating
frequencies. See Section 20.2, “CCB/SYSCLK PLL Ratio,” and Section 20.3, “e500 Core PLL Ratio,” for ratio settings.
2.)The minimum e500 core frequency is based on the minimum platform frequency of 333 MHz.
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Clocking
Table 77. Processor Core Clocking Specifications (MPC8543E)
Maximum Processor Core Frequency
Characteristic
e500 core processor frequency
800 MHz
1000 MHz
Min
Max
Min
Max
800
800
800
1000
Unit
Notes
MHz
1, 2
Notes:
1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK
frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating
frequencies. See Section 20.2, “CCB/SYSCLK PLL Ratio,” and Section 20.3, “e500 Core PLL Ratio,” for ratio settings.
2.)The minimum e500 core frequency is based on the minimum platform frequency of 333 MHz.
Table 78. Memory Bus Clocking Specifications (MPC8548E and MPC8547E)
Maximum Processor Core Frequency
Characteristic
Memory bus clock speed
1000, 1200, 1333 MHz
Min
Max
166
266
Unit
Notes
MHz
1, 2
Notes:
1. Caution: The CCB clock to SYSCLK ratio and e500 core to CCB clock ratio settings must be chosen such that the resulting
SYSCLK frequency, e500 (core) frequency, and CCB clock frequency do not exceed their respective maximum or minimum
operating frequencies. See Section 20.2, “CCB/SYSCLK PLL Ratio,” and Section 20.3, “e500 Core PLL Ratio,” for ratio
settings.
2. The memory bus speed is half of the DDR/DDR2 data rate, hence, half of the platform clock frequency.
Table 79. Memory Bus Clocking Specifications (MPC8545E)
Maximum Processor Core Frequency
Characteristic
Memory bus clock speed
800, 1000, 1200 MHz
Min
Max
166
200
Unit
Notes
MHz
1, 2
Notes:
1. Caution: The CCB clock to SYSCLK ratio and e500 core to CCB clock ratio settings must be chosen such that the resulting
SYSCLK frequency, e500 (core) frequency, and CCB clock frequency do not exceed their respective maximum or minimum
operating frequencies. See Section 20.2, “CCB/SYSCLK PLL Ratio,” and Section 20.3, “e500 Core PLL Ratio,” for ratio
settings.
2. The memory bus speed is half of the DDR/DDR2 data rate, hence, half of the platform clock frequency.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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131
Clocking
Table 80. Memory Bus Clocking Specifications (MPC8543E)
Maximum Processor Core Frequency
Characteristic
800, 1000 MHz
Memory bus clock speed
Min
Max
166
200
Unit
Notes
MHz
1, 2
Notes:
1. Caution: The CCB clock to SYSCLK ratio and e500 core to CCB clock ratio settings must be chosen such that the resulting
SYSCLK frequency, e500 (core) frequency, and CCB clock frequency do not exceed their respective maximum or minimum
operating frequencies. See Section 20.2, “CCB/SYSCLK PLL Ratio,” and Section 20.3, “e500 Core PLL Ratio,” for ratio
settings.
2. The memory bus speed is half of the DDR/DDR2 data rate, hence, half of the platform clock frequency.
20.2
CCB/SYSCLK PLL Ratio
The CCB clock is the clock that drives the e500 core complex bus (CCB), and is also called the platform
clock. The frequency of the CCB is set using the following reset signals, as shown in Table 81:
• SYSCLK input signal
• Binary value on LA[28:31] at power up
Note that there is no default for this PLL ratio; these signals must be pulled to the desired values. Also note
that the DDR data rate is the determining factor in selecting the CCB bus frequency, since the CCB
frequency must equal the DDR data rate.
For specifications on the PCI_CLK, see the PCI 2.2 Specification.
Table 81. CCB Clock Ratio
Binary Value of LA[28:31] Signals
CCB:SYSCLK Ratio
Binary Value of LA[28:31] Signals
CCB:SYSCLK Ratio
0000
16:1
1000
8:1
0001
Reserved
1001
9:1
0010
2:1
1010
10:1
0011
3:1
1011
Reserved
0100
4:1
1100
12:1
0101
5:1
1101
20:1
0110
6:1
1110
Reserved
0111
Reserved
1111
Reserved
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Freescale Semiconductor
Clocking
20.3
e500 Core PLL Ratio
This table describes the clock ratio between the e500 core complex bus (CCB) and the e500 core clock.
This ratio is determined by the binary value of LBCTL, LALE, and LGPL2 at power up, as shown in this
table.
Table 82. e500 Core to CCB Clock Ratio
Binary Value of
LBCTL, LALE, LGPL2
Signals
e500 core:CCB Clock Ratio
Binary Value of
LBCTL, LALE, LGPL2
Signals
e500 core:CCB Clock Ratio
000
4:1
100
2:1
001
9:2
101
5:2
010
Reserved
110
3:1
011
3:2
111
7:2
20.4
Frequency Options
Table 83This table shows the expected frequency values for the platform frequency when using a CCB
clock to SYSCLK ratio in comparison to the memory bus clock speed.
Table 83. Frequency Options of SYSCLK with Respect to Memory Bus Speeds
CCB to
SYSCLK Ratio
SYSCLK (MHz)
16.66
25
33.33
41.66
66.66
83
100
111
133.33
333
400
445
533
Platform/CCB Frequency (MHz)
2
3
4
333
400
500
5
333
415
6
400
500
8
333
9
375
10
333
417
12
400
500
16
400
20
333
533
533
500
Note: Due to errata Gen 13 the max sys clk frequency must not exceed 100 MHz if the core clk frequency is below
1200 MHz.
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133
Thermal
21 Thermal
This section describes the thermal specifications of the device.
21.1
Thermal for Version 2.0 Silicon HiCTE FC-CBGA with Full Lid
This section describes the thermal specifications for the HiCTE FC-CBGA package for revision 2.0
silicon.
This table shows the package thermal characteristics.
Table 84. Package Thermal Characteristics for HiCTE FC-CBGA
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
Die junction-to-ambient (natural convection)
Single-layer board (1s)
RJA
17
°C/W
1, 2
Die junction-to-ambient (natural convection)
Four-layer board (2s2p)
RJA
12
°C/W
1, 2
Die junction-to-ambient (200 ft/min)
Single-layer board (1s)
RJA
11
°C/W
1, 2
Die junction-to-ambient (200 ft/min)
Four-layer board (2s2p)
RJA
8
°C/W
1, 2
Die junction-to-board
N/A
RJB
3
°C/W
3
Die junction-to-case
N/A
RJC
0.8
°C/W
4
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1). The cold plate temperature is used for the case temperature, measured value includes the thermal resistance of the
interface layer.
21.2
Thermal for Version 2.1.1, 2.1.2, and 2.1.3 Silicon FC-PBGA with
Full Lid and Version 3.1.x Silicon with Stamped Lid
This section describes the thermal specifications for the FC-PBGA package for revision 2.1.1, 2.1.2, and
3.0 silicon.
This table shows the package thermal characteristics.
Table 85. Package Thermal Characteristics for FC-PBGA
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
Die junction-to-ambient (natural convection)
Single-layer board (1s)
RJA
18
°C/W
1, 2
Die junction-to-ambient (natural convection)
Four-layer board (2s2p)
RJA
13
°C/W
1, 2
Die junction-to-ambient (200 ft/min)
Single-layer board (1s)
RJA
13
°C/W
1, 2
Die junction-to-ambient (200 ft/min)
Four-layer board (2s2p)
RJA
9
°C/W
1, 2
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Freescale Semiconductor
System Design Information
Table 85. Package Thermal Characteristics for FC-PBGA (continued)
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
Die junction-to-board
N/A
RJB
5
°C/W
3
Die junction-to-case
N/A
RJC
0.8
°C/W
4
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1). The cold plate temperature is used for the case temperature, measured value includes the thermal resistance of the
interface layer.
21.3
Heat Sink Solution
Every system application has different conditions that the thermal management solution must solve. As
such, providing a recommended heat sink has not been found to be very useful. When a heat sink is chosen,
give special consideration to the mounting technique. Mounting the heat sink to the printed-circuit board
is the recommended procedure using a maximum of 10 lbs force (45 Newtons) perpendicular to the
package and board. Clipping the heat sink to the package is not recommended.
22 System Design Information
This section provides electrical design recommendations for successful application of the device.
22.1
System Clocking
This device includes five PLLs, as follows:
1. The platform PLL generates the platform clock from the externally supplied SYSCLK input. The
frequency ratio between the platform and SYSCLK is selected using the platform PLL ratio
configuration bits as described in Section 20.2, “CCB/SYSCLK PLL Ratio.”
2. The e500 core PLL generates the core clock as a slave to the platform clock. The frequency ratio
between the e500 core clock and the platform clock is selected using the e500 PLL ratio
configuration bits as described in Section 20.3, “e500 Core PLL Ratio.”
3. The PCI PLL generates the clocking for the PCI bus.
4. The local bus PLL generates the clock for the local bus.
5. There is a PLL for the SerDes block.
22.2
PLL Power Supply Filtering
Each of the PLLs listed above is provided with power through independent power supply pins
(AVDD_PLAT, AVDD_CORE, AVDD_PCI, AVDD_LBIU, and AVDD_SRDS, respectively). The AVDD
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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135
System Design Information
level must always be equivalent to VDD, and preferably these voltages are derived directly from VDD
through a low frequency filter scheme such as the following.
There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to
provide independent filter circuits per PLL power supply as illustrated in Figure 57, one to each of the
AVDD pins. By providing independent filters to each PLL the opportunity to cause noise injection from
one PLL to the other is reduced.
This circuit is intended to filter noise in the PLLs resonant frequency range from a 500 kHz to 10 MHz
range. It must be built with surface mount capacitors with minimum Effective Series Inductance (ESL).
Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook
of Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a
single large value capacitor.
Each circuit must be placed as close as possible to the specific AVDD pin being supplied to minimize noise
coupled from nearby circuits. It must be routed directly from the capacitors to the AVDD pin, which is on
the periphery of the footprint, without the inductance of vias.
Figure 57 through Figure 59 shows the PLL power supply filter circuits.
150
VDD
AVDD_PLAT
2.2 µF
2.2 µF
GND
Low ESL Surface Mount Capacitors
Figure 57. PLL Power Supply Filter Circuit with PLAT Pins
180
VDD
AVDD_CORE
2.2 µF
2.2 µF
GND
Low ESL Surface Mount Capacitors
Figure 58. PLL Power Supply Filter Circuit with CORE Pins
10
VDD
AVDD_PCI/AVDD_LBIU
2.2 µF
2.2 µF
GND
Low ESL Surface Mount Capacitors
Figure 59. PLL Power Supply Filter Circuit with PCI/LBIU Pins
The AVDD_SRDS signal provides power for the analog portions of the SerDes PLL. To ensure stability of
the internal clock, the power supplied to the PLL is filtered using a circuit similar to the one shown in
following figure. For maximum effectiveness, the filter circuit is placed as closely as possible to the
AVDD_SRDS ball to ensure it filters out as much noise as possible. The ground connection must be near
the AVDD_SRDS ball. The 0.003-µF capacitor is closest to the ball, followed by the two 2.2 µF capacitors,
and finally the 1 resistor to the board supply plane. The capacitors are connected from AVDD_SRDS to
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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System Design Information
the ground plane. Use ceramic chip capacitors with the highest possible self-resonant frequency. All traces
must be kept short, wide and direct.
SVDD
1.0
AVDD_SRDS
2.2 µF
1
2.2 µF
1
0.003 µF
GND
Note:
1. An 0805 sized capacitor is recommended for system initial bring-up.
Figure 60. SerDes PLL Power Supply Filter
Note the following:
• AVDD_SRDS must be a filtered version of SVDD.
• Signals on the SerDes interface are fed from the XVDD power plane.
22.3
Decoupling Recommendations
Due to large address and data buses, and high operating frequencies, the device can generate transient
power surges and high frequency noise in its power supply, especially while driving large capacitive loads.
This noise must be prevented from reaching other components in the device system, and the device itself
requires a clean, tightly regulated source of power. Therefore, it is recommended that the system designer
place at least one decoupling capacitor at each VDD, TVDD, BVDD, OVDD, GVDD, and LVDD pin of the
device. These decoupling capacitors must receive their power from separate VDD, TVDD, BVDD, OVDD,
GVDD, LVDD, and GND power planes in the PCB, utilizing short low impedance traces to minimize
inductance. Capacitors must be placed directly under the device using a standard escape pattern as much
as possible. If some caps are to be placed surrounding the part it must be routed with large trace to
minimize the inductance.
These capacitors must have a value of 0.1 µF. Only ceramic SMT (surface mount technology) capacitors
must be used to minimize lead inductance, preferably 0402 or 0603 sizes. Besides, it is recommended that
there be several bulk storage capacitors distributed around the PCB, feeding the VDD, TVDD, BVDD,
OVDD, GVDD, and LVDD, planes, to enable quick recharging of the smaller chip capacitors. These bulk
capacitors must have a low ESR (equivalent series resistance) rating to ensure the quick response time
necessary. They must also be connected to the power and ground planes through two vias to minimize
inductance. Suggested bulk capacitors—100–330 µF (AVX TPS tantalum or Sanyo OSCON). However,
customers must work directly with their power regulator vendor for best values, types and quantity of bulk
capacitors.
22.4
SerDes Block Power Supply Decoupling Recommendations
The SerDes block requires a clean, tightly regulated source of power (SVDD and XVDD) to ensure low
jitter on transmit and reliable recovery of data in the receiver. An appropriate decoupling scheme is
outlined below.
Only surface mount technology (SMT) capacitors must be used to minimize inductance. Connections from
all capacitors to power and ground must be done with multiple vias to further reduce inductance.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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137
System Design Information
•
•
•
22.5
First, the board must have at least 10 10-nF SMT ceramic chip capacitors as close as possible to
the supply balls of the device. Where the board has blind vias, these capacitors must be placed
directly below the chip supply and ground connections. Where the board does not have blind vias,
these capacitors must be placed in a ring around the device as close to the supply and ground
connections as possible.
Second, there must be a 1-µF ceramic chip capacitor from each SerDes supply (SVDD and XVDD)
to the board ground plane on each side of the device. This must be done for all SerDes supplies.
Third, between the device and any SerDes voltage regulator there must be a 10-µF, low equivalent
series resistance (ESR) SMT tantalum chip capacitor and a 100-µF, low ESR SMT tantalum chip
capacitor. This must be done for all SerDes supplies.
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. All unused active low inputs must be tied to VDD, TVDD, BVDD, OVDD, GVDD, and LVDD, as
required. All unused active high inputs must be connected to GND. All NC (no-connect) signals must
remain unconnected. Power and ground connections must be made to all external VDD, TVDD, BVDD,
OVDD, GVDD, LVDD, and GND pins of the device.
22.6
Pull-Up and Pull-Down Resistor Requirements
The device requires weak pull-up resistors (2–10 k is recommended) on open drain type pins including
I2C pins and PIC (interrupt) pins.
Correct operation of the JTAG interface requires configuration of a group of system control pins as
demonstrated in Figure 63. Care must be taken to ensure that these pins are maintained at a valid deasserted
state under normal operating conditions as most have asynchronous behavior and spurious assertion gives
unpredictable results.
The following pins must not be pulled down during power-on reset: TSEC3_TXD[3], HRESET_REQ,
TRIG_OUT/READY/QUIESCE, MSRCID[2:4], ASLEEP. The DMA_DACK[0:1], and TEST_SEL/
TEST_SEL pins must be set to a proper state during POR configuration. See the pinlist table of the
individual device for more details
See the PCI 2.2 specification for all pull ups required for PCI.
22.7
Output Buffer DC Impedance
The device drivers are characterized over process, voltage, and temperature. For all buses, the driver is a
push-pull single-ended driver type (open drain for I2C).
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD
or GND. Then, the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 61). The
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals
OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each
other in value. Then, Z0 = (RP + RN)/2.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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Freescale Semiconductor
System Design Information
OVDD
RN
SW2
Data
Pad
SW1
RP
OGND
Figure 61. Driver Impedance Measurement
This table summarizes the signal impedance targets. The driver impedances are targeted at minimum VDD,
nominal OVDD, 105C.
Table 86. Impedance Characteristics
Impedance
Local Bus, Ethernet, DUART, Control,
Configuration, Power Management
PCI
DDR DRAM
Symbol
Unit
RN
43 Target
25 Target
20 Target
Z0
W
RP
43 Target
25 Target
20 Target
Z0
W
Note: Nominal supply voltages. See Table 1, Tj = 105C.
22.8
Configuration Pin Muxing
The device provides the user with power-on configuration options which can be set through the use of
external pull-up or pull-down resistors of 4.7 k on certain output pins (see customer visible configuration
pins). These pins are generally used as output only pins in normal operation.
While HRESET is asserted however, these pins are treated as inputs. The value presented on these pins
while HRESET is asserted, is latched when HRESET deasserts, at which time the input receiver is disabled
and the I/O circuit takes on its normal function. Most of these sampled configuration pins are equipped
with an on-chip gated resistor of approximately 20 k. This value must permit the 4.7-kresistor to pull
the configuration pin to a valid logic low level. The pull-up resistor is enabled only during HRESET (and
for platform/system clocks after HRESET deassertion to ensure capture of the reset value). When the input
receiver is disabled the pull-up is also, thus allowing functional operation of the pin as an output with
minimal signal quality or delay disruption. The default value for all configuration bits treated this way has
been encoded such that a high voltage level puts the device into the default state and external resistors are
needed only when non-default settings are required by the user.
Careful board layout with stubless connections to these pull-down resistors coupled with the large value
of the pull-down resistor minimizes the disruption of signal quality or speed for output pins thus
configured.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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System Design Information
The platform PLL ratio and e500 PLL ratio configuration pins are not equipped with these default pull-up
devices.
22.9
JTAG Configuration Signals
Correct operation of the JTAG interface requires configuration of a group of system control pins as
demonstrated in Figure 63. Care must be taken to ensure that these pins are maintained at a valid deasserted
state under normal operating conditions as most have asynchronous behavior and spurious assertion gives
unpredictable results.
Boundary-scan testing is enabled through the JTAG interface signals. The TRST signal is optional in the
IEEE 1149.1 specification, but it is provided on all processors built on Power Architecture technology. The
device requires TRST to be asserted during power-on reset flow to ensure that the JTAG boundary logic
does not interfere with normal chip operation. While the TAP controller can be forced to the reset state
using only the TCK and TMS signals, generally systems assert TRST during the power-on reset flow.
Simply tying TRST to HRESET is not practical because the JTAG interface is also used for accessing the
common on-chip processor (COP), which implements the debug interface to the chip.
The COP function of these processors allow a remote computer system (typically, a PC with dedicated
hardware and debugging software) to access and control the internal operations of the processor. The COP
interface connects primarily through the JTAG port of the processor, with some additional status
monitoring signals. The COP port requires the ability to independently assert HRESET or TRST in order
to fully control the processor. If the target system has independent reset sources, such as voltage monitors,
watchdog timers, power supply failures, or push-button switches, then the COP reset signals must be
merged into these signals with logic.
The arrangement shown in Figure 63 allows the COP port to independently assert HRESET or TRST,
while ensuring that the target can drive HRESET as well.
The COP interface has a standard header, shown in Figure 62, for connection to the target system, and is
based on the 0.025" square-post, 0.100" centered header assembly (often called a Berg header). The
connector typically has pin 14 removed as a connector key.
The COP header adds many benefits such as breakpoints, watchpoints, register and memory
examination/modification, and other standard debugger features. An inexpensive option can be to leave
the COP header unpopulated until needed.
There is no standardized way to number the COP header; so emulator vendors have issued many different
pin numbering schemes. Some COP headers are numbered top-to-bottom then left-to-right, while others
use left-to-right then top-to-bottom. Still others number the pins counter-clockwise from pin 1 (as with an
IC). Regardless of the numbering scheme, the signal placement recommended in Figure 62 is common to
all known emulators.
22.9.1
Termination of Unused Signals
Freescale recommends the following connections, when the JTAG interface and COP header are not used:
• TRST must be tied to HRESET through a 0 k isolation resistor so that it is asserted when the
system reset signal (HRESET) is asserted, ensuring that the JTAG scan chain is initialized during
the power-on reset flow. Freescale recommends that the COP header be designed into the system
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System Design Information
•
as shown in Figure 63. If this is not possible, the isolation resistor allows future access to TRST in
case a JTAG interface may need to be wired onto the system in future debug situations.
No pull-up/pull-down is required for TDI, TMS, TDO, or TCK.
COP_TDO
1
2
NC
COP_TDI
3
4
COP_TRST
COP_RUN/STOP
5
6
COP_VDD_SENSE
COP_TCK
7
8
COP_CHKSTP_IN
COP_TMS
9
10
NC
COP_SRESET
11
12
NC
COP_HRESET
13
COP_CHKSTP_OUT
15
KEY
No pin
16
GND
Figure 62. COP Connector Physical Pinout
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
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141
System Design Information
OVDD
SRESET
From Target
Board Sources
(if any)
HRESET
13
11
10 k
SRESET 6
10 k
HRESET1
COP_HRESET
10 k
COP_SRESET
B
10 k
A
5
10 k
10 k
2
3
4
5
6
7
8
9
10
11
12
6
5
COP Header
1
4
KEY
13 No
pin
15
15
COP_TRST
COP_VDD_SENSE2
TRST1
10
NC
COP_CHKSTP_OUT
CKSTP_OUT
10 k
14 3
10 k
COP_CHKSTP_IN
8
CKSTP_IN
COP_TMS
16
9
COP Connector
Physical Pinout
1
3
TMS
COP_TDO
COP_TDI
TDO
TDI
COP_TCK
7
2
TCK
NC
10
NC
12
4
16
Notes:
1. The COP port and target board must be able to independently assert HRESET and TRST to the processor
in order to fully control the processor as shown here.
2. Populate this with a 10 resistor for short-circuit/current-limiting protection.
3. The KEY location (pin 14) is not physically present on the COP header.
4. Although pin 12 is defined as a No-Connect, some debug tools may use pin 12 as an additional GND pin for
improved signal integrity.
5. This switch is included as a precaution for BSDL testing. The switch must be closed to position A during BSDL
testing to avoid accidentally asserting the TRST line. If BSDL testing is not being performed, this switch must be
closed to position B.
6. Asserting SRESET causes a machine check interrupt to the e500 core.
Figure 63. JTAG Interface Connection
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System Design Information
22.10 Guidelines for High-Speed Interface Termination
This section provides the guidelines for high-speed interface termination when the SerDes interface is
entirely unused and when it is partly unused.
22.10.1 SerDes Interface Entirely Unused
If the high-speed SerDes interface is not used at all, the unused pin must be terminated as described in this
section.
The following pins must be left unconnected (float):
• SD_TX[7:0]
• SD_TX[7:0]
• Reserved pins T22, T23, M20, M21
The following pins must be connected to GND:
• SD_RX[7:0]
• SD_RX[7:0]
• SD_REF_CLK
• SD_REF_CLK
NOTE
It is recommended to power down the unused lane through SRDSCR1[0:7]
register (offset = 0xE_0F08) (This prevents the oscillations and holds the
receiver output in a fixed state.) that maps to SERDES lane 0 to lane 7
accordingly.
Pins V28 and M26 must be tied to XVDD. Pins V27 and M25 must be tied to GND through a 300-
resistor.
In Rev 2.0 silicon, POR configuration pin cfg_srds_en on TSEC4_TXD[2]/TSEC3_TXD[6] can be used
to power down SerDes block.
22.10.2 SerDes Interface Partly Unused
If only part of the high-speed SerDes interface pins are used, the remaining high-speed serial I/O pins must
be terminated as described in this section.
The following pins must be left unconnected (float) if not used:
• SD_TX[7:0]
• SD_TX[7:0]
• Reserved pins: T22, T23, M20, M21
The following pins must be connected to GND if not used:
• SD_RX[7:0]
• SD_RX[7:0]
• SD_REF_CLK
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143
System Design Information
•
SD_REF_CLK
NOTE
It is recommended to power down the unused lane through SRDSCR1[0:7]
register (offset = 0xE_0F08) (this prevents the oscillations and holds the
receiver output in a fixed state) that maps to SERDES lane 0 to lane 7
accordingly.
Pins V28 and M26 must be tied to XVDD. Pins V27 and M25 must be tied to GND through a 300-
resistor.
22.11 Guideline for PCI Interface Termination
PCI termination if PCI 1 or PCI 2 is not used at all.
Option 1
If PCI arbiter is enabled during POR:
• All AD pins are driven to the stable states after POR. Therefore, all ADs pins can be floating.
• All PCI control pins can be grouped together and tied to OVDD through a single 10-k resistor.
• It is optional to disable PCI block through DEVDISR register after POR reset.
Option 2
If PCI arbiter is disabled during POR:
• All AD pins are in the input state. Therefore, all ADs pins need to be grouped together and tied to
OVDD through a single (or multiple) 10-k resistor(s).
• All PCI control pins can be grouped together and tied to OVDD through a single 10-k resistor.
• It is optional to disable PCI block through DEVDISR register after POR reset.
22.12 Guideline for LBIU Termination
If the LBIU parity pins are not used, the following is the termination recommendation:
• For LDP[0:3]—tie them to ground or the power supply rail via a 4.7-k resistor.
• For LPBSE—tie it to the power supply rail via a 4.7-k resistor (pull-up resistor).
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Ordering Information
23 Ordering Information
Ordering information for the parts fully covered by this specification document is provided in
Section 23.1, “Part Numbers Fully Addressed by this Document.”
23.1
Part Numbers Fully Addressed by this Document
This table provides the Freescale part numbering nomenclature for the device. Note that the individual part
numbers correspond to a maximum processor core frequency. For available frequencies, contact your local
Freescale sales office. In addition to the processor frequency, the part-numbering scheme also includes an
application modifier that may specify special application conditions. Each part number also contains a
revision code that refers to the die mask revision number.
Table 87. Part Numbering Nomenclature
MPC
nnnnn
t
pp
ff
c
r
Product
Code
Part
Identifier
Temperature
Package1, 2, 3
Processor
Frequency4
Core
Frequency
Silicon Version
MPC
8548E
AV = 15003
AU = 1333
AT = 1200
AQ = 1000
J = 533
H = 5005
G = 400
Blank = 0 to 105C
HX = CBGA
C = –40 to 105C VU = Pb-free CBGA
PX = PBGA
VT = Pb-free PBGA
8548
8547E
8547
Blank = Ver. 2.0
(SVR = 0x80390020)
A = Ver. 2.1.1
B = Ver. 2.1.2
C = Ver. 2.1.3
(SVR = 0x80390021)
D = Ver. 3.1.x
(SVR = 0x80390031)
Blank = Ver. 2.0
(SVR = 0x80310020)
A = Ver. 2.1.1
B = Ver. 2.1.2
C = Ver. 2.1.3
(SVR = 0x80310021)
D = Ver. 3.1.x
(SVR = 0x80310031)
AU = 1333
AT = 1200
AQ = 1000
J = 533
G = 400
Blank = Ver. 2.0
(SVR = 0x80390120)
A = Ver. 2.1.1
B = Ver. 2.1.2
C = Ver. 2.1.3
(SVR = 0x80390121)
D = Ver. 3.1.x
(SVR = 0x80390131)
Blank = Ver. 2.0
(SVR = 0x80390120)
A = Ver. 2.1.1
B = Ver. 2.1.2
C = Ver. 2.1.3
(SVR = 0x80310121)
D = Ver. 3.1.x
(SVR = 0x80310131)
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Ordering Information
Table 87. Part Numbering Nomenclature (continued)
MPC
nnnnn
t
pp
ff
c
r
Product
Code
Part
Identifier
Temperature
Package1, 2, 3
Processor
Frequency4
Core
Frequency
Silicon Version
MPC
8545E
AT = 1200
AQ = 1000
AN = 800
G = 400
Blank = 0 to 105C
HX = CBGA
C = –40 to 105C VU = Pb-free CBGA
PX = PBGA
VT = Pb-free PBGA
8545
8543E
8543
Blank = Ver. 2.0
(SVR = 0x80390220)
A = Ver. 2.1.1
B = Ver. 2.1.2
D = Ver. 3.1.x
(SVR = 0x80390231)
Blank = Ver. 2.0
(SVR = 0x80310220)
A = Ver. 2.1.1
B = Ver. 2.1.2
D = Ver. 3.1.x
(SVR = 0x80310231)
AQ = 1000
AN = 800
Blank = Ver. 2.0
(SVR = 0x803A0020)
A = Ver. 2.1.1
B = Ver. 2.1.2
D = Ver. 3.1.x
(SVR = 0x803A0031)
Blank = Ver. 2.0
(SVR = 0x80320020)
A = Ver. 2.1.1
B = Ver. 2.1.2
D = Ver. 3.1.x
(SVR = 0x80320031)
Notes:
1. See Section 19, “Package Description,” for more information on available package types.
2. The HiCTE FC-CBGA package is available on only Version 2.0 of the device.
3. The FC-PBGA package is available on only Version 2.1.1, 2.1.2, and 2.1.3 of the device.
4. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by part number specifications may support other
maximum core frequencies.
5. This speed available only for silicon Version 2.1.1, 2.1.2, and 2.1.3.
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Ordering Information
23.2
Part Marking
Parts are marked as the example shown in Figure 64.
(F)
MPC8548xxxxxx
TWLYWW
MMMMM CCCCC
YWWLAZ
Notes:
TWLYYWW is final test traceability code.
MMMMM is 5 digit mask number.
CCCCC is the country of assembly. This space is left blank if parts are assembled in the United States.
YWWLAZ is assembly traceability code.
Figure 64. Part Marking for CBGA and PBGA Device
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Document Revision History
24 Document Revision History
The following table provides a revision history for this hardware specification.
Table 88. Document Revision History
Rev.
Number
Date
Substantive Change(s)
9
02/2012
• Updated Section 21.2, “Thermal for Version 2.1.1, 2.1.2, and 2.1.3 Silicon FC-PBGA with Full Lid and
Version 3.1.x Silicon with Stamped Lid,” with version 3.0 silicon information.
• Added Figure 56, “Mechanical Dimensions and Bottom Surface Nomenclature of the FC-PBGA with
Stamped Lid.”
• Updated Table 87, “Part Numbering Nomenclature,” with version 3.0 silicon information.
• Removed Note from Section 5.1, “Power-On Ramp Rate”.
• Changed the Table 10 title to “Power Supply Ramp Rate”.
• Removed table 11.
• Updated the title of Section 21.2, “Thermal for Version 2.1.1, 2.1.2, and 2.1.3 Silicon FC-PBGA with
Full Lid and Version 3.1.x Silicon with Stamped Lid” to include Thermal Version 2.1.3 and Version 3.1.x
Silicon.
• Corrected the leaded Solder Ball composition in Table 70, “Package Parameters”
• Updated Table 87, “Part Numbering Nomenclature,” with Version 3.1.x silicon information.
• Updated the Min and Max value of TDO in the valid times row of Table 44, “JTAG AC Timing
Specifications (Independent of SYSCLK)1” from 4 and 25 to 2 and 10 respectively .
8
04/2011
• Added Section 14.1, “GPOUT/GPIN Electrical Characteristics.”
• Updated Table 71, “MPC8548E Pinout Listing,” Table 72, “MPC8547E Pinout Listing,” Table 73,
“MPC8545E Pinout Listing,” and Table 74, “MPC8543E Pinout Listing,” to reflect that the TDO signal
is not driven during HRSET* assertion.
• Updated Table 87, “Part Numbering Nomenclature” with Ver. 2.1.3 silicon information.
7
09/2010
• In Table 37, “MII Management AC Timing Specifications, modified the fifth row from “MDC to MDIO
delay tMDKHDX (16 × tptb_clk × 8) – 3 — (16 × tptb_clk × 8) + 3” to “MDC to MDIO delay tMDKHDX
(16 × tCCB × 8) – 3 — (16 × tCCB × 8) + 3.”
• Updated Figure 55, “Mechanical Dimensions and Bottom Surface Nomenclature of the HiCTE
FC-CBGA and FC-PBGA with Full Lid and figure notes.
6
12/2009
• In Section 5.1, “Power-On Ramp Rate” added explanation that Power-On Ramp Rate is required to
avoid falsely triggering ESD circuitry.
• In Table 13 changed required ramp rate from 545 V/s for MVREF and VDD/XVDD/SVDD to 3500 V/s
for MVREF and 4000 V/s for VDD.
• In Table 13 deleted ramp rate requirement for XVDD/SVDD.
• In Table 13 footnote 1 changed voltage range of concern from 0–400 mV to 20–500mV.
• In Table 13 added footnote 2 explaining that VDD voltage ramp rate is intended to control ramp rate of
AVDD pins.
5
10/2009
• In Table 27, “GMII Receive AC Timing Specifications,” changed duty cycle specification from 40/60 to
35/75 for RX_CLK duty cycle.
• Updated tMDKHDX in Table 37, “MII Management AC Timing Specifications.”
• Added a reference to Revision 2.1.2.
• Updated Table 55, “MII Management AC Timing Specifications.”
• Added Section 5.1, “Power-On Ramp Rate.”
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Document Revision History
Table 88. Document Revision History (continued)
Rev.
Number
Date
Substantive Change(s)
4
04/2009
• In Table 1, “Absolute Maximum Ratings 1,” and in Table 2, “Recommended Operating Conditions,”
moved text, “MII management voltage” from LVDD/TVDD to OVDD, added “Ethernet management” to
OVDD row of input voltage section.
• In Table 5, “SYSCLK AC Timing Specifications,” added notes 7 and 8 to SYSCLK frequency and cycle
time.
• In Table 36, “MII Management DC Electrical Characteristics,” changed all instances of LVDD/OVDD to
OVDD.
• Modified Section 16, “High-Speed Serial Interfaces (HSSI),” to reflect that there is only one SerDes.
• Modified DDR clk rate min from 133 to 166 MHz.
• Modified note in Table 75, “Processor Core Clocking Specifications (MPC8548E and MPC8547E), “.”
• In Table 56, “Differential Transmitter (TX) Output Specifications,” modified equations in Comments
column, and changed all instances of “LO” to “L0.” Also added note 8.
• In Table 57, “Differential Receiver (RX) Input Specifications,” modified equations in Comments column,
and in note 3, changed “TRX-EYE-MEDIAN-to-MAX-JITTER,” to “TRX-EYE-MEDIAN-to-MAX-JITTER.”
• Modified Table 83, “Frequency Options of SYSCLK with Respect to Memory Bus Speeds.”
• Added a note on Section 4.1, “System Clock Timing,” to limit the SYSCLK to 100 MHz if the core
frequency is less than 1200 MHz
• In Table 71, “MPC8548E Pinout ListingTable 72, “MPC8547E Pinout ListingTable 73, “MPC8545E
Pinout ListingTable 74, “MPC8543E Pinout Listing,” added note 5 to LA[28:31].
• Added note to Table 83, “Frequency Options of SYSCLK with Respect to Memory Bus Speeds.”
3
01/2009
• [Section 4.6, “Platform Frequency Requirements for PCI-Express and Serial RapidIO.” Changed
minimum frequency equation to be 527 MHz for PCI x8.
• In Table 5, added note 7.
• Section 4.5, “Platform to FIFO Restrictions.” Changed platform clock frequency to 4.2.
• Section 8.1, “Enhanced Three-Speed Ethernet Controller (eTSEC)
(10/100/1Gb Mbps)—GMII/MII/TBI/RGMII/RTBI/RMII Electrical Characteristics.” Added MII after GMII
and add ‘or 2.5 V’ after 3.3 V.
• In Table 23, modified table title to include GMII, MII, RMII, and TBI.
• In Table 24 and Table 25, changed clock period minimum to 5.3.
• In Table 25, added a note.
• In Table 26, Table 27, Table 28, Table 29, and Table 30, removed subtitle from table title.
• In Table 30 and Figure 15, changed all instances of PMA to TSECn.
• In Section 8.2.5, “TBI Single-Clock Mode AC Specifications.” Replaced first paragraph.
• In Table 34, Table 35, Figure 18, and Figure 20, changed all instances of REF_CLK to
TSECn_TX_CLK.
• In Table 36, changed all instances of OVDD to LVDD/TVDD.
• In Table 37, “MII Management AC Timing Specifications,” changed MDC minimum clock pulse width
high from 32 to 48 ns.
• Added new section, Section 16, “High-Speed Serial Interfaces (HSSI).”
• Section 16.1, “DC Requirements for PCI Express SD_REF_CLK and SD_REF_CLK.” Added new
paragraph.
• Section 17.1, “DC Requirements for Serial RapidIO SD_REF_CLK and SD_REF_CLK.” Added new
paragraph.
• Added information to Figure 63, both in figure and in note.
• Section 22.3, “Decoupling Recommendations.” Modified the recommendation.
• Table 87, “Part Numbering Nomenclature.” In Silicon Version column added Ver. 2.1.2.
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Document Revision History
Table 88. Document Revision History (continued)
Rev.
Number
Date
2
04/2008
•
•
•
•
•
1
10/2007
• Adjusted maximum SYSCLK frequency down in Table 5, “SYSCLK AC Timing Specifications” per
device erratum GEN-13.
• Clarified notes to Table 6, “EC_GTX_CLK125 AC Timing Specifications.”
• Added Section 4.4, “PCI/PCI-X Reference Clock Timing.”
• Clarified descriptions and added PCI/PCI-X to Table 9, “PLL Lock Times.”
• Removed support for 266 and 200 Mbps data rates per device erratum GEN-13 in Section 6, “DDR and
DDR2 SDRAM.”
• Clarified Note 4 of Table 19, “DDR SDRAM Output AC Timing Specifications.”
• Clarified the reference clock used in Section 7.2, “DUART AC Electrical Specifications.”
• Corrected VIH(min) in Table 22, “GMII, MII, RMII, and TBI DC Electrical Characteristics.”
• Corrected VIL(max) in Table 23, “GMII, MII, RMII, TBI, RGMII, RTBI, and FIFO DC Electrical
Characteristics.”
• Removed DC parameters from Table 24, Table 25, Table 26, Table 27, Table 28, Table 29, Table 32,
Table 34, and Table 35.
• Corrected VIH(min) in Table 36, “MII Management DC Electrical Characteristics.”
• Corrected tMDC(min) in Table 37, “MII Management AC Timing Specifications.”
• Updated parameter descriptions for tLBIVKH1, tLBIVKH2, tLBIXKH1, and tLBIXKH2 in Table 40, “Local Bus
Timing Parameters (BVDD = 3.3 V)—PLL Enabled” and Table 40, “Local Bus Timing Parameters
(BVDD = 2.5 V)—PLL Enabled.”
• Updated parameter descriptions for tLBIVKH1, tLBIVKL2, tLBIXKH1, and tLBIXKL2 in Table 42, “Local Bus
Timing Parameters—PLL Bypassed.” Note that tLBIVKL2 and tLBIXKL2 were previously labeled tLBIVKH2
and tLBIXKH2.
• Added LUPWAIT signal to Figure 23, “Local Bus Signals (PLL Enabled)” and Figure 24, “Local Bus
Signals (PLL Bypass Mode).”
• Added LGTA signal to Figure 25, Figure 26, Figure 27 and Figure 28.
• Corrected LUPWAIT assertion in Figure 26 and Figure 28.
• Clarified the PCI reference clock in Section 15.2, “PCI/PCI-X AC Electrical Specifications”
• Added Section 17.1, “Package Parameters.”
• Added PBGA thermal information in Section 21.2, “Thermal for Version 2.1.1, 2.1.2, and 2.1.3 Silicon
FC-PBGA with Full Lid and Version 3.1.x Silicon with Stamped Lid.”
• Updated.”
• Updated Table 87, “Part Numbering Nomenclature.”
0
07/2007
• Initial Release
Substantive Change(s)
Removed 1:1 support on Table 82, “e500 Core to CCB Clock Ratio.”
Removed MDM from Table 18, “DDR SDRAM Input AC Timing Specifications.” MDM is an Output.
Figure 57, “PLL Power Supply Filter Circuit with PLAT Pins” (AVDD_PLAT).
Figure 58, “PLL Power Supply Filter Circuit with CORE Pins” (AVDD_CORE).
Split Figure 59, “PLL Power Supply Filter Circuit with PCI/LBIU Pins,” (formerly called just “PLL Power
Supply Filter Circuit”) into three figures: the original (now specific for AVDD_PCI/AVDD_LBIU) and two
new ones.
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Document Number: MPC8548EEC
Rev. 9
02/2012
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