ON MC10H180FNG Dual 2−bit adder/subtractor Datasheet

MC10H180
Dual 2−Bit Adder/Subtractor
Description
The MC10H180 is a high−speed, low−power, general−purpose
adder/ subtractor. It is designed to be used in special purpose
adders/subtractors or in high−speed multiplier arrays.
Inputs for each adder are Carry−in, Operand A, and Operand B;
outputs are Sum, Sum and Carry−out. The common select inputs serve
as a control line to Invert A for subtract, and a control line to Invert B.
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MARKING DIAGRAMS*
Features
• Propagation Delay, 1.8 ns Typical, Operand and Select to Output
• Power Dissipation, 360 mW Typical MC10H180
• Improved Noise Margin 150 mV (Over Operating Voltage and
16
MC10H180L
AWLYYWW
Temperature Range)
• Voltage Compensated
• MECL 10K™ Compatible
• Pb−Free Packages are Available*
1
CDIP−16
L SUFFIX
CASE 620A
LOGIC DIAGRAM
7
9
5
6
4
SELA
S0
S0
SELB
AO
BO
COUT
CIN
11
10
12
SELA
S1
S1
SELB
A1
B1
COUT
CIN
15
2
3
14
1
16
POSITIVE LOGIC ONLY
A’ = A SELA = A SELA
B’ = B SELB = B SELB
S = CIN (A’ B’ + A’ B’) +
CIN(A’ B’ + A’ B’)
COUT = CINA’ + CINB’ + A’ B’
MC10H180P
AWLYYWWG
16
1
PDIP−16
P SUFFIX
CASE 648
1 20
13
VCC = PIN 16
VEE = PIN 8
10H180G
AWLYYWW
20 1
DIP PIN ASSIGNMENT
S1
1
16
VCC
S0
2
15
S0
COUT
3
14
S1
CIN
4
13
COUT
A0
5
12
CIN
B0
6
11
A1
SELA
7
10
B1
VEE
8
9
1
PLLC−20
FN SUFFIX
CASE 775
A
WL, L
YY, Y
WW, W
G
SELB
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 7
1
Publication Order Number:
MC10H180/D
MC10H180
Table 1. MAXIMUM RATINGS
Symbol
Rating
Unit
VEE
Power Supply (VCC = 0)
Characteristic
−8.0 to 0
Vdc
VI
Input Voltage (VCC = 0)
0 to VEE
Vdc
Iout
Output Current
50
100
mA
TA
Operating Temperature Range
0 to +75
°C
Tstg
Storage Temperature Range − Plastic
− Ceramic
−55 to +150
−55 to +165
°C
°C
− Continuous
− Surge
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1)
0°
Symbol
IE
IinH
Characteristic
25°
75°
Min
Max
Min
Max
Min
Max
Unit
Power Supply Current
−
95
−
86
−
95
mA
Input Current High
Pins 4, 12
Pins 7, 9
Pins 5, 6, 10, 11
−
−
−
665
515
410
−
−
−
417
320
255
−
−
−
417
320
255
0.5
−
0.5
−
0.3
−
mA
mA
IinL
Input Current Low
VOH
High Output Voltage
−1.02
−0.84
−0.98
−0.81
−0.92
−0.735
Vdc
VOL
Low Output Voltage
−1.95
−1.63
−1.95
−1.63
−1.95
−1.60
Vdc
VIH
High Input Voltage (1)
−1.17
−0.84
−1.13
−0.81
−1.07
−0.735
Vdc
VIL
Low Input Voltage (1)
−1.95
−1.48
−1.95
−1.48
−1.95
−1.45
Vdc
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
Outputs are terminated through a 50 W resistor to −2.0 V.
Table 3. AC PARAMETERS
0°
Symbol
25°
75°
Min
Max
Min
Max
Min
Max
Propagation Delay
Operand to Output
Select to Output
Carry−in to Output
0.6
0.6
0.4
2.4
2.2
1.6
0.7
0.7
0.4
2.5
2.3
1.7
0.8
0.8
0.4
2.8
2.6
1.8
tr
Rise Time
0.5
2.0
0.5
2.1
0.5
2.2
ns
tf
Fall Time
0.5
2.0
0.5
2.1
0.5
2.2
ns
tpd
Characteristic
Unit
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
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2
MC10H180
Table 4. FUNCTION SELECT TABLE
SelA
SelB
H
H
FuncS = A plustion
B
H
L
L
L
H
L
S = A minus B
S = B minus A
S = 0 minus A minus B
Table 5. TRUTH TABLE
FUNCTION
INPUTS
SelA
SelB
A0 B0
Cin
ADD
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
H
H
H
H
L
L
H
H
L
L
H
H
L
H
L
H
L
H
L
H
L
H
H
L
H
L
L
H
H
L
L
H
L
H
H
L
L
L
L
H
L
H
H
H
SUBTRACT
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
L
L
L
L
H
H
H
H
L
L
H
H
L
L
H
H
L
H
L
H
L
H
L
H
H
L
L
H
L
H
H
L
L
H
H
L
H
L
L
H
L
H
L
L
H
H
L
H
FUNCTION
S0 S0 Cout
REVERSE
SUBTRACT
INPUTS
SelA
SelB
L
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
A0 B0
L
L
L
L
H
H
H
H
L
L
H
H
L
L
H
H
Cin
L
H
L
H
L
H
L
H
S0 S0 Cout
H
L
L
H
L
H
H
L
L
H
H
L
H
L
L
H
L
H
H
H
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
H
H
H
L
L
H
H
L
L
H
H
L
H
L
H
L
H
L
H
L
H
H
L
H
L
L
H
H
L
L
H
L
H
H
L
H
H
L
H
L
H
L
L
ORDERING INFORMATION
Package
Shipping †
MC10H180FN
PLLC−20
46 Units / Rail
MC10H180FNG
PLLC−20
(Pb−Free)
46 Units / Rail
MC10H180L
CDIP−16
25 Unit / Rail
MC10H180P
PDIP−16
25 Unit / Rail
MC10H180PG
PDIP−16
(Pb−Free)
25 Unit / Rail
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MC10H180
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE E
0.007 (0.180) M T L−M
B
Y BRK
−N−
U
N
S
0.007 (0.180) M T L−M
S
S
N
S
D
−L−
−M−
Z
W
20
D
1
V
0.007 (0.180) M T L−M
S
N
S
R
0.007 (0.180) M T L−M
S
N
S
Z
T L−M
S
N
H
J
0.007 (0.180) M T L−M
S
−T−
VIEW S
SEATING
PLANE
F
0.007 (0.180) M T L−M
S
VIEW S
N
S
N
S
K
0.004 (0.100)
G
S
S
K1
E
G1
0.010 (0.250) S T L−M
S
VIEW D−D
A
C
0.010 (0.250)
G1
X
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
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4
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−− 0.020
2_
10 _
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2_
10 _
7.88
8.38
1.02
−−−
N
S
MC10H180
PACKAGE DIMENSIONS
CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A−01
ISSUE O
B
A
A
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
M
B
L
16X
0.25 (0.010)
E
M
DIM
A
B
C
D
E
F
G
H
K
L
M
N
J
T B
F
C
K
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
−−−
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
SEATING
PLANE
T
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
−−− 0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
G
16X
0.25 (0.010)
M
D
T A
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE R
−A−
16
9
1
8
B
F
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
L
S
−T−
H
SEATING
PLANE
K
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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5
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MC10H180/D