TI LM2936HVBMAX3.3/NOPB Ultra-low quiescent current ldo voltage regulator Datasheet

Product
Folder
Sample &
Buy
Support &
Community
Tools &
Software
Technical
Documents
Reference
Design
LM2936
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
LM2936 Ultra-Low Quiescent Current LDO Voltage Regulator
1 Features
3 Description
•
•
•
The LM2936 ultra-low quiescent current regulator
features low dropout voltage and low current in the
standby mode. With less than 15-μA quiescent
current at a 100-μA load, the LM2936 is ideally suited
for automotive and other battery operated systems.
The LM2936 retains all of the features that are
common to low dropout regulators including a low
dropout PNP pass device, short circuit protection,
reverse battery protection, and thermal shutdown.
The LM2936 has a 40-V maximum operating voltage
limit, a −40°C to 125°C operating temperature range,
and ±3% output voltage tolerance over the entire
output current, input voltage, and temperature range.
The LM2936 is available in a TO-92 through-hole
package, as well as SOIC-8, VSSOP, SOT–223, and
TO-252 surface mount packages.
1
•
•
•
•
•
•
•
•
•
LM2936 Operating VIN range of 5.5 V to 40 V
LM2936HV Operating VIN range of 5.5 V to 60 V
Ultra Low Quiescent Current (IQ ≤ 15 μA for
IOUT = 100 μA)
Fixed 3-V, 3.3-V or 5-V with 50-mA Output
±2% Initial Output Tolerance
±3% Output Tolerance Over Line, Load, and
Temperature
Dropout Voltage Typically 200 mV at IOUT = 50 mA
–24-V Input Voltage Protection
–50-V Input Transient Protection
Internal Short Circuit Current Limit
Internal Thermal Shutdown Protection
Shutdown Pin Available with LM2936BM Package
Device Information(1)
PART NUMBER
2 Applications
•
•
•
Automotive
Industrial Controls
Point of Load
LM2936
PACKAGE
BODY SIZE (NOM)
SOIC (8)
4.90 mm x 3.91 mm
TO-252 (3)
6.10 mm x 6.58 mm
VSSOP (8)
3.00 mm x 3.00 mm
SOT-223 (4)
6.50 mm x 3.50 mm
TO-92 (3)
4.30 mm x 4.30 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
IN
VIN
OUT
VOUT
GND
CIN
100 nF *
COUT
10 µF **
* Required if regulator is located more than 2″ from power supply filter capacitor.
** Required for stability. See Electrical Characteristics for 3-V LM2936 for required values. Must be rated over
intended operating temperature range. Effective series resistance (ESR) is critical, see Typical Characteristics. Locate
capacitor as close as possible to the regulator output and ground pins. Capacitance may be increased without bound.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2936
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
4
4
4
4
5
6
7
8
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics for 3-V LM2936.................
Electrical Characteristics for 3.3-V LM2936..............
Electrical Characteristics for 5-V LM2936.................
Typical Characteristics ..............................................
Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 12
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 13
8
Application and Implementation ........................ 14
8.1 Application Information............................................ 14
8.2 Typical Application ................................................. 14
9 Power Supply Recommendations...................... 15
10 Layout................................................................... 16
10.1 Layout Guidelines ................................................. 16
10.2 Layout Examples................................................... 16
10.3 Thermal Considerations ........................................ 16
11 Device and Documentation Support ................. 18
11.1
11.2
11.3
11.4
Documentation Support ........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
18
18
18
18
12 Mechanical, Packaging, and Orderable
Information ........................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision N (March 2013) to Revision O
•
Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision M (March 2013) to Revision N
•
2
Page
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 13
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
LM2936
www.ti.com
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
5 Pin Configuration and Functions
LM2936DT TO-252 (NDP) Package
3-Pins
Top View
OUT 3
4 GND
(TAB)
GND 2
OUT 3
LM2936BM SOIC (D) Package
8-Pins
Top View
GND 2
GND 3
NC 4
8 IN
OUT 1
7 GND
GND 2
6 GND
GND 3
IN
3
6 GND
5 NC
OUT 1
NC 2
NC 3
NC 4
LM2936MM
2
7 GND
LM2936MM VSSOP (DGK) Package
8-Pins
Top View
1
GND
8 IN
NC 4
5 SD
LM2936Z TO-92 (LP) Package
3-Pins
Bottom View
OUT
4 GND
(TAB)
LM2936M SOIC (D) Package
8-Pins
Top View
LM2936M
LM2936BM
OUT 1
LM2936MP
IN 1
LM2936DT
IN 1
LM2936MP SOT-223 (DCY) Package
4-Pins
Top View
8 IN
7 GND
6 NC
5 NC
Pin Functions
PIN
NAME
IN
D
(LM2936BM)
D
(LM2936M)
NDP
DGK
DCY
LP
I/O
DESCRIPTION
8
8
1
8
1
3
I
GND
2, 3, 6, 7
2, 3, 6, 7
4
7
2, 4
2
—
Ground.
OUT
1
1
3
1
3
1
O
Regulated output voltage. Requires a minimum
output capacitance, with specific ESR, on this pin
to maintain stability.
Shutdown. LM2936BM only. Pull this pin HIGH (> 2
V) to turn the output OFF. If this pin is left open,
pull ed low (< 0.6 V), or connected to GND, the
output will be ON by default. Avoid having any
voltage between 0.6 V and 2 V on this pin as the
output status may not be predicable across the
operating range.
SD
5
—
—
—
—
—
I
NC
4
4, 5
—
2, 3, 4, 5, 6
—
—
—
Unregulated input voltage.
No internal connection, Connect to GND, or leave
open.
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
3
LM2936
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
(1) (2)
Input voltage (survival)
Power dissipation
(3)
MIN
MAX
UNIT
−50
60
V
Internally limited
Junction temperature (TJMAX)
150
−65
Storage temperature, Tstg
(1)
(2)
(3)
°C
150
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its specified operating ratings.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) − TA) / RθJA. If this dissipation is exceeded, the die temperature can rise above the TJ(MAX) of 150°C, and
the LM2936 may go into thermal shutdown.
6.2 ESD Ratings
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
VALUE
UNIT
±2000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. .
6.3 Recommended Operating Conditions
MIN
MAX
UNIT
−40
125
°C
Input voltage, VIN , LM2936
5.5
40
V
Input voltage, VIN , LM2936HV only
5.5
60
V
0
40
V
Temperature, TJ
Shutdown pin voltage, VSD, LM2936BM only
6.4 Thermal Information
LM2936
THERMAL METRIC
(1)
SOIC (D)
TO-252
(NDP)
VSSOP
(DGK)
SOT-223
(DCY)
TO-92 (LP)
8 PINS
3 PINS
8 PINS
4 PINS
3 PINS
RθJA
Junction-to-ambient thermal resistance
111.4
50.5
173.4
62.8
156.8
RθJC(top)
Junction-to-case (top) thermal resistance
56.3
52.6
65.9
44.2
80.4
RθJB
Junction-to-board thermal resistance
51.9
29.7
94.9
11.7
n/a
ψJT
Junction-to-top characterization parameter
10.9
4.8
9.6
3.6
24.5
ψJB
Junction-to-board characterization parameter
51.4
29.3
93.3
11.6
136.0
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
1.6
n/a
n/a
n/a
(1)
4
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
LM2936
www.ti.com
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
6.5 Electrical Characteristics for 3-V LM2936
VIN = 14 V, IOUT = 10 mA, TJ = 25°C, unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN (1)
TYP (2)
MAX (1)
2.91
3
3.09
10
30
2.94
3
3.06
2.91
3.000
3.09
UNIT
3-V LM2936HV ONLY
Output voltage
5.5 V ≤ VIN ≤ 48 V, 100 µA ≤ IOUT ≤ 50 mA, (2)
–40°C ≤ TJ ≤ 125°C
Line regulation
6 V ≤ VIN ≤ 60 V, IOUT = 1 mA
V
mV
ALL 3-V LM2936
Output voltage
4 V ≤ VIN ≤ 26 V, 100 µA ≤ IOUT ≤ 50 mA, (2)
–40°C ≤ TJ ≤ 125°C
Quiescent current
IOUT = 100 μA, 8 V ≤ VIN ≤ 24 V
15
20
μA
IOUT = 10 mA, 8 V ≤ VIN ≤ 24 V
0.2
0.5
mA
IOUT = 50 mA, 8 V ≤ VIN ≤ 24 V
1.5
2.5
mA
Line regulation
Load regulation
Dropout voltage
9 V ≤ VIN ≤ 16 V
5
10
6 V ≤ VIN ≤ 40 V, IOUT = 1 mA
10
30
100 μA ≤ IOUT ≤ 5 mA
10
30
5 mA ≤ IOUT ≤ 50 mA
10
30
V
mV
mV
IOUT = 100 μA
0.05
0.1
V
IOUT = 50 mA
0.20
0.40
V
120
250
Short-circuit current
VOUT = 0 V
Output impedance
IOUT = 30 mAdc and 10 mArms, ƒ = 1000 Hz
65
450
Output noise voltage
10 Hz–100 kHz
500
μV
20
mV/1000 Hr
−60
dB
−80
V
Long-term stability
Ripple rejection
Vripple = 1 Vrms, ƒripple = 120 Hz
−40
Reverse polarity
transient input voltage
RL = 500 Ω, t = 1 ms
−50
Output voltage with
reverse polarity input
VIN = −15 V, RL = 500 Ω
Maximum Line Transient
RL = 500 Ω, VOUT ≤ 3.3 V, T = 40 ms
60
Output bypass
capacitance (COUT) ESR
COUT = 22 µF, 0.1 mA ≤ IOUT ≤ 50 mA
0.3
0
mA
mΩ
−0.3
V
V
8
Ω
0.01
V
SHUTDOWN INPUT − 3-V LM2936BM ONLY
Output voltage, VOUT
Output off, VSD = 2.4 V, RLOAD = 500 Ω
Shutdown high
threshold voltage, VIH
Output off, RLOAD = 500 Ω
Shutdown low
threshold voltage, VIL
Output on, RLOAD = 500 Ω
1.1
Shutdown high
current, IIH
Output off, VSD = 2.4 V, RLOAD = 500Ω
12
μA
Quiescent current
Output off, VSD = 2.4 V, RLOAD = 500 Ω,
includes IIH current
30
μA
(1)
(2)
0
2
1.1
V
0.6
V
Datasheet min/max specification limits are ensured by design, test, or statistical analysis.
Typicals are at 25°C (unless otherwise specified) and represent the most likely parametric norm.
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
5
LM2936
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
www.ti.com
6.6 Electrical Characteristics for 3.3-V LM2936
VIN = 14 V, IOUT = 10 mA, TJ = 25°C, unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN (1)
TYP (2)
MAX (1)
3.201
3.300
3.399
10
30
3.234
3.300
3.366
3.201
3.300
3.399
UNIT
3.3-V LM2936HV ONLY
Output voltage
5.5 V ≤ VIN ≤ 48 V, 100 µA ≤ IOUT ≤ 50 mA, (3)
–40°C ≤ TJ ≤ 125°C
Line regulation
6 V ≤ VIN ≤ 60 V, IOUT = 1 mA
V
mV
ALL 3.3-V LM2936
Output voltage
4 V ≤ VIN ≤ 26 V, 100 µA ≤ IOUT ≤ 50 mA, (3)
–40°C ≤ TJ ≤ 125°C
Quiescent current
IOUT = 100 μA, 8 V ≤ VIN ≤ 24 V
15
20
μA
IOUT = 10 mA, 8 V ≤ VIN ≤ 24 V
0.2
0.5
mA
IOUT = 50 mA, 8 V ≤ VIN ≤ 24 V
1.5
2.5
mA
Line regulation
Load regulation
Dropout voltage
9 V ≤ VIN ≤ 16 V
V
5
10
6 V ≤ VIN ≤ 40 V, IOUT = 1 mA
10
30
100 μA ≤ IOUT ≤ 5 mA
10
30
5 mA ≤ IOUT ≤ 50 mA
10
30
IOUT = 100 μA
0.05
0.10
V
IOUT = 50 mA
0.2
0.4
V
120
250
65
mV
mV
Short-circuit current
VOUT = 0 V
Output impedance
IOUT = 30 mAdc and 10 mArms, ƒ = 1000 Hz
450
Output noise voltage
10 Hz–100 kHz
500
μV
20
mV/1000 Hr
−60
dB
−80
V
Long-term stability
Ripple rejection
Vripple = 1 Vrms, ƒripple = 120 Hz
−40
Reverse polarity
transient input voltage
RL = 500 Ω, T = 1 ms
−50
Output voltage with
reverse polarity input
VIN = −15 V, RL = 500 Ω
maximum line transient
RL = 500 Ω, VOUT ≤ 3.63 V, T = 40 ms
60
Output bypass
capacitance (COUT) ESR
COUT = 22 µF, 0.1 mA ≤ IOUT ≤ 50 mA
0.3
0
mA
mΩ
−0.3
V
V
8
Ω
0.01
V
SHUTDOWN INPUT − 3.3-V LM2936BM ONLY
Output voltage, VOUT
Output off, VSD = 2.4 V, RLOAD = 500 Ω
Shutdown high
threshold voltage, VIH
Output off, RLOAD = 500 Ω
Shutdown low
threshold voltage, VIL
Output on, RLOAD = 500 Ω
1.1
Shutdown high
current, IIH
Output off, VSD = 2.4V, RLOAD = 500 Ω
12
μA
Quiescent current
Output off, VSD = 2.4V, RLOAD = 500 Ω,
includes IIH current
30
μA
(1)
(2)
(3)
6
0
2
1.1
V
0.6
V
Datasheet min/max specification limits are ensured by design, test, or statistical analysis.
Typicals are at 25°C (unless otherwise specified) and represent the most likely parametric norm.
To ensure constant junction temperature, pulse testing is used.
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
LM2936
www.ti.com
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
6.7 Electrical Characteristics for 5-V LM2936
VIN = 14 V, IOUT = 10 mA, TJ = 25°C, unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN (1)
TYP (2)
MAX (1)
4.85
5
5.15
15
35
UNIT
5-V LM2936HV ONLY
Output voltage
5.5 V ≤ VIN ≤ 48 V, 100 µA ≤ IOUT ≤ 50 mA, (3)
–40°C ≤ TJ ≤ 125°C
Line regulation
6 V ≤ VIN ≤ 60 V, IOUT = 1 mA
V
mV
ALL 5-V LM2936
4.9
5
5.1
4.85
5
5.15
Output voltage
5.5 V ≤ VIN ≤ 26 V, 100 µA ≤ IOUT ≤ 50 mA, (3)
–40°C ≤ TJ ≤ 125°C
Quiescent current
IOUT = 100 μA, 8 V ≤ VIN ≤ 24 V
9
15
μA
IOUT = 10 mA, 8 V ≤ VIN ≤ 24 V
0.2
0.5
mA
IOUT = 50 mA, 8 V ≤ VIN ≤ 24 V
1.5
2.5
mA
Line regulation
Load regulation
Dropout voltage
9 V ≤ VIN ≤ 16 V
V
5
10
6 V ≤ VIN ≤ 40 V, IOUT = 1 mA
10
30
100 μA ≤ IOUT ≤ 5 mA
10
30
5 mA ≤ IOUT ≤ 50 mA
10
30
IOUT = 100 μA
0.05
0.1
V
IOUT = 50 mA
0.2
0.4
V
120
250
65
mV
mV
Short-circuit current
VOUT = 0 V
Output impedance
IOUT = 30 mAdc and 10 mArms, ƒ = 1000 Hz
450
Output noise voltage
10 Hz–100 kHz
500
μV
20
mV/1000 Hr
−60
dB
−80
V
Long-term stability
Ripple rejection
Vripple = 1 Vrms, ƒripple = 120 Hz
−40
Reverse polarity
transient input voltage
RL = 500 Ω, T = 1 ms
−50
Output voltage with
reverse polarity input
VIN = −15 V, RL = 500 Ω
Maximum line transient
RL = 500 Ω, VOUT ≤ 5.5 V, T = 40 ms
60
Output bypass
capacitance (COUT) ESR
COUT = 10 µF, 0.1 mA ≤ IOUT ≤ 50 mA
0.3
0
mA
mΩ
−0.3
V
V
8
Ω
0.01
V
SHUTDOWN INPUT − 5-V LM2936BM ONLY
Output voltage, VOUT
Output off, VSD = 2.4 V, RLOAD = 500 Ω
Shutdown high
threshold voltage, VIH
Output off, RLOAD = 500 Ω
Shutdown low
threshold voltage, VIL
Output on, RLOAD = 500 Ω
1.1
Shutdown high
current, IIH
Output off, VSD = 2.4 V, RLOAD = 500 Ω
12
μA
Quiescent current
Output off, VSD = 2.4 V, RLOAD = 500Ω,
includes IIH current
30
μA
(1)
(2)
(3)
0
2
1.1
V
0.6
V
Datasheet min/max specification limits are ensured by design, test, or statistical analysis.
Typicals are at 25°C (unless otherwise specified) and represent the most likely parametric norm.
To ensure constant junction temperature, pulse testing is used.
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
7
LM2936
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
www.ti.com
6.8 Typical Characteristics
8
Figure 1. Maximum Power Dissipation (TO-92)
Figure 2. Dropout Voltage
Figure 3. Dropout Voltage
Figure 4. Quiescent Current
Figure 5. Quiescent Current
Figure 6. Quiescent Current
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
LM2936
www.ti.com
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
Typical Characteristics (continued)
Figure 8. Quiescent Current
Figure 7. Quiescent Current
50
Figure 9. 5-V LM2936 COUT ESR
Figure 10. 3-V LM2936 COUT ESR
Figure 11. 3.3-V LM2936 COUT ESR
Figure 12. Peak Output Current
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
9
LM2936
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
www.ti.com
Typical Characteristics (continued)
10
Figure 13. Peak Output Current
Figure 14. 5-V LM2936 Current Limit
Figure 15. 5-V LM2936 Line Transient Response
Figure 16. 5-V LM2936 Output at Voltage Extremes
Figure 17. 5-V LM2936 Ripple Rejection
Figure 18. 5-V LM2936 Load Transient Response
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
LM2936
www.ti.com
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
Typical Characteristics (continued)
Figure 19. 5-V LM2936 Low Voltage Behavior
Figure 20. 5-V LM2936 Output Impedance
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
11
LM2936
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
www.ti.com
7 Detailed Description
7.1 Overview
The LM2936 ultra-low quiescent current regulator features low dropout voltage and low current in the standby
mode. With less than 15 μA quiescent current at a 100-μA load, the LM2936 is ideally suited for automotive and
other battery operated systems. The LM2936 retains all of the features that are common to low dropout
regulators including a low dropout PNP pass device, short circuit protection, reverse battery input protection, and
thermal shutdown. The LM2936 has a 40-V maximum operating voltage limit, a −40°C to 125°C operating
temperature range, and ±3% output voltage tolerance over the entire output current, input voltage, and
temperature range.
7.2 Functional Block Diagram
IN
OUT
Current
Limit
Thermal
Shutdown
PNP
+
Bandgap
Reference
LM2936
GND
7.3 Feature Description
7.3.1 High Input Operating Voltage
Unlike namy other PNP low dropout regulators, the LM2936 remains fully operational with VIN = 40 V, and the
LM2936HV remains fully operational with VIN = 60 V . Owing to power dissipation characteristics of the available
packages, full output current cannot be ensured for all combinations of ambient temperature and input voltage.
While the LM2936HV maintains regulation to 60 V, it will not withstand a short circuit to ground on the output
when VIN is above 40 V because of safe operating area limitations in the internal PNP pass device. Above 60V
the LM2936 will break down with catastrophic effects on the regulator and possibly the load as well. Do not use
this device in a design where the input operating voltage may exceed 40 V, or where transients are likely to
exceed 60 V.
7.3.2 Thermal Shutdown (TSD)
The TSD circuitry of the LM2936 has been designed to protect the device against temporary thermal overload
conditions. The TSD circuitry is not intended to replace proper heat-sinking. Continuously running the LM2936
device at TSD may degrade device reliability as the junction temperature will be exceeding the absolute
maximum junction temperature rating. If the LM2936 goes into TSD mode, the output current will be shut off until
the junction temperature falls approximately 10°C, then the output current will automatically be restored. The
LM2936 will continuously cycle in and out of TSD until the condition is corrected. The LM2936 TSD junction
temperature is typically 160°C.
12
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
LM2936
www.ti.com
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
Feature Description (continued)
7.3.3 Short-Circuit Current Limit
The output current limiting circuitry of the LM2936 has been designed to limit the output current in cases where
the load impedance is unusually low. This includes situations where the output may be shorted directly to ground.
Continuous operation of the LM2936 at the current limit will typically result in the LM2936 transitioning into TSD
mode.
7.3.4 Shutdown (SD) Pin
The LM2936BM has a pin for shutting down the regulator output. Applying a Logic Level High (> 2 V) to the SD
pin will cause the output to turn off. Leaving the SD pin open, connecting it to Ground, or applying a Logic Level
Low (< 0.6 V) will allow the regulator output to turn on.
7.4 Device Functional Modes
The LM2936 design does not include any undervoltage lockout (UVLO), or overvoltage shutdown (OVSD)
functions. Generally, the output voltage will track the input voltage until the input voltage is greater than VOUT + 1
V. When the input voltage is greater than VOUT + 1 V the LM2936 will be in linear operation, and the output
voltage will be regulated; however, the device will be sensitive to any small perturbation of the input voltage.
Device dynamic performance is improved when the input voltage is at least 2 V greater than the output voltage.
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
13
LM2936
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
www.ti.com
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM2936 ultra-low quiescent current regulator features low dropout voltage and low current in the standby
mode. The LM2936 has a 40-V maximum operating voltage limit, a −40°C to 125°C operating temperature range,
–24-V input voltage protection and ±3% output voltage tolerance over the entire output current, input voltage, and
temperature range This following section presents a simplified discussion of the design process. Also the
WEBENCH® software may be used to generate complete designs. When generating a design, WEBENCH
utilizes iterative design procedure and accesses comprehensive databases of components. Please go to
www.ti.com for more details.
8.2 Typical Application
Figure 21 shows the typical application circuit for the LM2936. For the LM2936 5-V option, the output capacitor,
COUT, must have a capacitance value of at least 10 µF with an equivalent series resistance (ESR) of at least 300
mΩ, but no more than 8 Ω. For the LM2936 3.3-V and 3-V options, the output capacitor, COUT, must have a
capacitance value of at least 22 µF with an ESR of at least 300 mΩ, but no more than 8 Ω. The minimum
capacitance value and the ESR requirements apply across the entire expected operating ambient temperature
range.
IN
VIN
OUT
VOUT
GND
CIN
100 nF *
COUT
10 µF **
* CIN is required only if the regulator is located more than 3 inches from the power-supply-filter capacitors.
** Required for stability. COUT must be at least 10 µF for the LM2936 5-V option, and at least 22 µF for the 3.3-V and
3-V options. Capacitance must be maintained over entire expected operating temperature range, and located as close
as possible to the regulator. The ESR, of the COUT capacitor must at least 300 mΩ, but no more than 8 Ω.
Figure 21. LM2936 Typical Application
8.2.1 Design Requirements
Table 1. Design Parameters
DESIGN PARAMETER
14
EXAMPLE VALUE
Output voltage
5V
Input voltage
10 V to 26 V
Output current requirement
1 mA to 50 mA
Input capacitor
0.1 µF
Output capacitance
10 µF minimum
Output capacitor ESR value
300 mΩ to 8 Ω
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
LM2936
www.ti.com
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
8.2.2 Detailed Design Procedure
8.2.2.1 External Capacitors
The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both
ESR and minimum amount of capacitance.
8.2.2.1.1 Minimum Capacitance
The minimum output capacitance required to maintain stability is at least 10 µF for the LM2936 5-V option, and
at least 22 µF for the 3.3-V and 3-V options. This value may be increased without limit. Larger values of output
capacitance will give improved transient response.
8.2.2.1.2 ESR Limits
The ESR of the output capacitor will cause loop instability if it is too high, or too low. ESR, of the COUT capacitor
must at least 300 mΩ, but no more than 8 Ω.
8.2.2.2 Output Capacitor ESR
It is essential that the output capacitor meet the capacitance and ESR requirements, or oscillations can result.
The ESR is used with the output capacitance in
Ceramic capacitors (MLCC) can be used for COUT only if a series resistor is added to simulate the ESR
requirement. The ESR is not optional, it is mandatory. Typically, a 500-mΩ to 1-Ω series resistor is used for this
purpose. When using ceramic capacitors, due diligence must be given to initial tolerances, capacitance derating
due to applied DC voltage, and capacitance variations due to temperature. Dielectric types X5R and X7R are
preferred.
8.2.3 Application Curve
Figure 22. LM2936 VOUT vs. VIN
9 Power Supply Recommendations
This device is designed to operate from an input supply voltage from at least VOUT + 1 V up to a maximum of 40
V. The input supply should be well regulated and free of spurious noise. To ensure that the LM2936 output
voltage is well regulated the input supply should be at least VOUT + 2 V. A capacitor at the IN pin may not be
specifically required if the bulk input supply filter capacitors are within three inches of the IN pin, but adding one
will not be detrimental to operation.
While the LM2936 maintains regulation to VIN = 60 V, it will not withstand a short circuit on the output with VIN
above 40 V because of safe operating area limitations in the internal PNP pass device. With VIN above 60 V the
LM2936 will break down with catastrophic effects on the regulator and possibly the load as well. Do not use this
device in a design where the input operating voltage, including transients, is likely to exceed 60 V.
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
15
LM2936
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
www.ti.com
10 Layout
10.1 Layout Guidelines
The dynamic performance of the LM2936 is dependent on the layout of the PCB. PCB layout practices that are
adequate for typical LDOs may degrade the PSRR, noise, or transient performance of the LM2936. Best
performance is achieved by placing CIN and COUT on the same side of the PCB as the LM2936, and as close as
is practical to the package. The ground connections for CIN and COUT should be back to the LM2936 ground pin
using as wide, and as short, of a copper trace as is practical.
Connections using long trace lengths, narrow trace widths, and/or connections through vias should be avoided
as these will add parasitic inductances and resistances that will give inferior performance, especially during
transient conditions
10.2 Layout Examples
6
3
7
2
8
1
VIN
5
GND
CIN
4
VSD
COUT
GND
VOUT
Figure 23. LM2936BM SOIC (D) Layout
5
6
3
7
2
8
1
VIN
4
GND
GND
VOUT
Figure 24. LM2936M SOIC (D) Layout
Thermal
Vias
4
GND
CIN
GND
1
3
COUT
VIN
VOUT
Figure 25. LM2936 TO-252 (NDP) Layout
10.3 Thermal Considerations
Due to the power dissipation characteristics of the available packages (RθJA), full output current cannot be
ensured for all combinations of ambient temperature and input voltage.
Exceeding the maximum allowable power dissipation as defined by the final package RθJA will cause excessive
die junction temperature, and the regulator may go into thermal shutdown.
Power dissipation, PD, is calculated from the following formula:
PD = ((VIN – VOUT) × IOUT) + (VIN × IGND)
16
(1)
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
LM2936
www.ti.com
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
Thermal Considerations (continued)
space
VIN
IIN = IGND + IOUT
VOUT
IOUT
IN
OUT
GND
CIN
IGND
LOAD
COUT
Figure 26. Current Paths for Power Dissipation Calculation
Knowing the power dissipation (PD), the thermal resistance of the package (RθJA), and the ambient temperature
(TA), the junction temperature (TJ) can be estimated using the following formula:
TJ = (PD × RθJA) + TA
(2)
Knowing the thermal resistance of the package (RθJA), the ambient temperature (TA), and the maximum allowed
operating junction temperature (TJ) of 125°C, the maximum power dissipation can be estimated using the
following formula:
PD(MAX) = (125°C – TA) / RθJA
(3)
Alternately, solving for the required thermal resistance (RθJA):
RθJA = (125°C – TA) / PD(MAX)
(4)
The maximum allowed PD information from Equation 3 can be used to estimate the maximum allowed load
current (IOUT), or the maximum allowed VIN:
VIN(MAX) = (PD(MAX) / IOUT) + VOUT
IOUT(MAX) = (PD(MAX) / (VIN – VOUT))
(5)
(6)
As an example, an application requires : VIN = 14 V, VOUT = 5 V, IOUT = 25 mA, and TA = 85°C. Find the
maximum RθJA to keep the junction temperature under 125°C.
RθJA
RθJA
RθJA
RθJA
≤ (125°C – TA) / PD(MAX)
≤ (125°C – 85°C) / ((14 V – 5 V) × 0.025 A)
≤ 40°C / 0.225W
≤ 177°C/W
(7)
(8)
(9)
(10)
The EIA/JEDEC standard (JESD51-2) provides methodologies to estimate the junction temperature from external
measurements (ΨJB references the temperature at the PCB, and ΨJT references the temperature at the top
surface of the package) when operating under steady-state power dissipation conditions. These methodologies
have been determined to be relatively independent of the copper thermal spreading area that may be attached to
the package DAP when compared to the more typical RθJA. Refer to Texas Instruments Application Report
Semiconductor and IC Package Thermal Metrics (SPRA953), for specifics.
On the 8-pin SOIC (D) package, the four ground pins are thermally connected to the backside of the die. Adding
approximately 0.04 square inches of 2 oz. copper pad area to these four pins will improve the JEDEC RθJA rating
from 111.4°C/W to approximately 100°C/W. If this extra copper area is placed directly beneath the SOIC
package there should not be any impact on board density.
The LM2936 has an internally set thermal shutdown point of typically 160°C. Thermal shutdown is outside the
ensured operating temperature range and is intended as a safety feature only. Continuous operation near the
thermal shutdown temperature should be avoided as it may have a negative affect on the life of the device.
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
17
LM2936
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
www.ti.com
11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
Texas Instruments Application Report Semiconductor and IC Package Thermal Metrics (SPRA953)
11.2 Trademarks
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM2936BM-3.3/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LM293
6B3.3
LM2936BM-5.0/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LM293
6B5.0
LM2936BMX-3.3/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LM293
6B3.3
LM2936BMX-5.0/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LM293
6B5.0
LM2936DT-3.0/NOPB
ACTIVE
TO-252
NDP
3
75
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LM2936D
T-3.0
LM2936DT-3.3/NOPB
ACTIVE
TO-252
NDP
3
75
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LM2936D
T-3.3
LM2936DT-5.0
NRND
TO-252
NDP
3
75
TBD
Call TI
Call TI
-40 to 125
LM2936D
T-5.0
LM2936DT-5.0/NOPB
ACTIVE
TO-252
NDP
3
75
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LM2936D
T-5.0
LM2936DTX-3.3/NOPB
ACTIVE
TO-252
NDP
3
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LM2936D
T-3.3
LM2936DTX-5.0
NRND
TO-252
NDP
3
2500
TBD
Call TI
Call TI
-40 to 125
LM2936D
T-5.0
LM2936DTX-5.0/NOPB
ACTIVE
TO-252
NDP
3
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LM2936D
T-5.0
LM2936HVBMA-3.3
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 125
2936H
BM3.3
LM2936HVBMA-3.3/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2936H
BM3.3
LM2936HVBMA-5.0
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 125
2936H
BM5.0
LM2936HVBMA-5.0/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2936H
BM5.0
LM2936HVBMAX3.3
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
2936H
BM3.3
LM2936HVBMAX3.3/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
2936H
BM3.3
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM2936HVBMAX5.0/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LM2936HVMA-5.0
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 125
2936H
M-5.0
LM2936HVMA-5.0/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2936H
M-5.0
LM2936HVMAX-5.0
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 125
2936H
M-5.0
LM2936HVMAX-5.0/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
2936H
M-5.0
LM2936M-3.0/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LM293
6M-3
LM2936M-3.3
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 125
LM293
6-3.3
LM2936M-3.3/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LM293
6-3.3
LM2936M-5.0
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 125
LM293
6M-5
LM2936M-5.0/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LM293
6M-5
LM2936MM-3.0/NOPB
ACTIVE
VSSOP
DGK
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
KBC
LM2936MM-3.3
NRND
VSSOP
DGK
8
1000
TBD
Call TI
Call TI
-40 to 125
KBB
LM2936MM-3.3/NOPB
ACTIVE
VSSOP
DGK
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
KBB
LM2936MM-5.0/NOPB
ACTIVE
VSSOP
DGK
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
KBA
LM2936MMX-3.3/NOPB
ACTIVE
VSSOP
DGK
8
3500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
KBB
LM2936MMX-5.0
NRND
VSSOP
DGK
8
3500
TBD
Call TI
Call TI
-40 to 125
KBA
LM2936MMX-5.0/NOPB
ACTIVE
VSSOP
DGK
8
3500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
KBA
LM2936MP-3.0/NOPB
ACTIVE
SOT-223
DCY
4
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LM2936MP-3.3
NRND
SOT-223
DCY
4
1000
TBD
Call TI
Call TI
Addendum-Page 2
2936H
BM5.0
KACA
-40 to 125
KABA
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
16-Oct-2015
Status
(1)
LM2936MP-3.3/NOPB
Package Type Package Pins Package
Drawing
Qty
ACTIVE
SOT-223
DCY
4
1000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
KABA
(4/5)
LM2936MP-5.0
NRND
SOT-223
DCY
4
1000
TBD
Call TI
Call TI
-40 to 125
KAAA
LM2936MP-5.0/NOPB
ACTIVE
SOT-223
DCY
4
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
KAAA
LM2936MPX-3.0/NOPB
ACTIVE
SOT-223
DCY
4
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
KACA
LM2936MPX-3.3/NOPB
ACTIVE
SOT-223
DCY
4
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
KABA
LM2936MPX-5.0/NOPB
ACTIVE
SOT-223
DCY
4
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
KAAA
LM2936MX-3.3/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LM293
6-3.3
LM2936MX-5.0
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 125
LM293
6M-5
LM2936MX-5.0/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LM293
6M-5
LM2936Z-3.0/NOPB
LIFEBUY
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
LM2936
Z-3
LM2936Z-3.3/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 125
LM2936
Z-3.3
LM2936Z-5.0/LFT1
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
LM293
6Z-5
LM2936Z-5.0/LFT3
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
LM293
6Z-5
LM2936Z-5.0/LFT4
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
LM293
6Z-5
LM2936Z-5.0/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 3
-40 to 125
LM293
6Z-5
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
LM2936BMX-3.3/NOPB
Package Package Pins
Type Drawing
SOIC
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
D
8
2500
330.0
12.4
6.5
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
5.4
2.0
8.0
12.0
Q1
LM2936BMX-5.0/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2936DTX-3.3/NOPB
TO-252
NDP
3
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
Q2
LM2936DTX-5.0
TO-252
NDP
3
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
Q2
LM2936DTX-5.0/NOPB
TO-252
NDP
3
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
Q2
LM2936HVBMAX3.3
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2936HVBMAX3.3/NOP
B
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2936HVBMAX5.0/NOP
B
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2936MM-3.0/NOPB
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM2936MM-3.3
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM2936MM-3.3/NOPB
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM2936MM-5.0/NOPB
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM2936MMX-3.3/NOPB
VSSOP
DGK
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM2936MMX-5.0
VSSOP
DGK
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM2936HVMAX-5.0
LM2936HVMAX-5.0/NOP
B
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM2936MMX-5.0/NOPB
VSSOP
DGK
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM2936MP-3.0/NOPB
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2936MP-3.3
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2936MP-3.3/NOPB
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2936MP-5.0
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2936MP-5.0/NOPB
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2936MPX-3.0/NOPB SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2936MPX-3.3/NOPB SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2936MPX-5.0/NOPB SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2936MX-3.3/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2936MX-5.0
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM2936MX-5.0/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM2936BMX-3.3/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM2936BMX-5.0/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM2936DTX-3.3/NOPB
TO-252
NDP
3
2500
367.0
367.0
38.0
LM2936DTX-5.0
TO-252
NDP
3
2500
367.0
367.0
35.0
LM2936DTX-5.0/NOPB
TO-252
NDP
3
2500
367.0
367.0
38.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM2936HVBMAX3.3
SOIC
D
8
2500
367.0
367.0
35.0
LM2936HVBMAX3.3/NOP
B
SOIC
D
8
2500
367.0
367.0
35.0
LM2936HVBMAX5.0/NOP
B
SOIC
D
8
2500
367.0
367.0
35.0
LM2936HVMAX-5.0
SOIC
D
8
2500
367.0
367.0
35.0
LM2936HVMAX-5.0/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM2936MM-3.0/NOPB
VSSOP
DGK
8
1000
210.0
185.0
35.0
LM2936MM-3.3
VSSOP
DGK
8
1000
210.0
185.0
35.0
LM2936MM-3.3/NOPB
VSSOP
DGK
8
1000
210.0
185.0
35.0
LM2936MM-5.0/NOPB
VSSOP
DGK
8
1000
210.0
185.0
35.0
LM2936MMX-3.3/NOPB
VSSOP
DGK
8
3500
367.0
367.0
35.0
LM2936MMX-5.0
VSSOP
DGK
8
3500
367.0
367.0
35.0
LM2936MMX-5.0/NOPB
VSSOP
DGK
8
3500
367.0
367.0
35.0
LM2936MP-3.0/NOPB
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM2936MP-3.3
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM2936MP-3.3/NOPB
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM2936MP-5.0
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM2936MP-5.0/NOPB
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM2936MPX-3.0/NOPB
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM2936MPX-3.3/NOPB
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM2936MPX-5.0/NOPB
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM2936MX-3.3/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM2936MX-5.0
SOIC
D
8
2500
367.0
367.0
35.0
LM2936MX-5.0/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 3
MECHANICAL DATA
NDP0003B
TD03B (Rev F)
www.ti.com
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
DCY (R-PDSO-G4)
PLASTIC SMALL-OUTLINE
6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)
4
0,10 (0.004) M
3,70 (0.146)
3,30 (0.130)
7,30 (0.287)
6,70 (0.264)
Gauge Plane
1
2
0,84 (0.033)
0,66 (0.026)
2,30 (0.091)
4,60 (0.181)
1,80 (0.071) MAX
3
0°–10°
0,10 (0.004) M
0,25 (0.010)
0,75 (0.030) MIN
1,70 (0.067)
1,50 (0.059)
0,35 (0.014)
0,23 (0.009)
Seating Plane
0,08 (0.003)
0,10 (0.0040)
0,02 (0.0008)
4202506/B 06/2002
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters (inches).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Falls within JEDEC TO-261 Variation AA.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated