TECHNICAL DATA IN74ACT139 Dual 1-of-4 Decoder/Demultiplexer High-Speed Silicon-Gate CMOS The IN74ACT139 is identical in pinout to the LS/ALS139, HC/HCT139. The IN74ACT139 may be used as a level converter for interfacing TTL or NMOS outputs to High Speed CMOS inputs. This device consists of two independent 1-of-4 decoders, each of which decodes a two-bit Address to one-of-four active-low outputs. Active-low Selects are provided to facilitate the demultiplexing and cascading functions. The demultiplexing function is accomplished by using the Address inputs to select the desired device output, and utilizing the Select as a data input. • TTL/NMOS Compatible Input Levels • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 4.5 to 5.5 V • Low Input Current: 1.0 μA; 0.1 μA @ 25°C • Outputs Source/Sink 24 mA ORDERING INFORMATION IN74ACT139N Plastic IN74ACT139D SOIC TA = -40° to 85° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM FUNCTION TABLE Inputs PIN 16 =VCC PIN 8 = GND Outputs Select A1 A0 Y0 Y1 Y2 Y3 H X X H H H H L L L L H H H L L H H L H H L H L H H L H L H H H H H L X = don’t care Rev. 00 IN74ACT139 MAXIMUM RATINGS* Symbol Parameter Value Unit -0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC Supply Current, VCC and GND Pins ±50 mA PD Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750 500 mW -65 to +150 °C 260 °C VOUT IIN Tstg TL Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TJ Junction Temperature (PDIP) TA Operating Temperature, All Package Types IOH Output Current - High IOL Output Current - Low tr, tf * Parameter Input Rise and Fall Time (except Schmitt Inputs) * Min Max Unit 4.5 5.5 V 0 VCC V 140 °C +85 °C -24 mA 24 mA 10 8.0 ns/V -40 VCC =4.5 V VCC =5.5 V 0 0 VIN from 0.8 V to 2.0 V This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Rev. 00 IN74ACT139 DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions Guaranteed Limits V 25 °C -40°C to 85°C Unit VIH Minimum HighLevel Input Voltage VOUT=0.1 V or VCC-0.1 V 4.5 5.5 2.0 2.0 2.0 2.0 V VIL Maximum Low Level Input Voltage VOUT=0.1 V or VCC-0.1 V 4.5 5.5 0.8 0.8 0.8 0.8 V VOH Minimum HighLevel Output Voltage IOUT ≤ -50 μA 4.5 5.5 4.4 5.4 4.4 5.4 V 4.5 5.5 3.86 4.86 3.76 4.76 4.5 5.5 0.1 0.1 0.1 0.1 VIN= VIH or VIL IOL=24 mA IOL=24 mA 4.5 5.5 0.36 0.36 0.44 0.44 ±0.1 ±1.0 μA * VIN=VIH or VIL IOH=-24 mA IOH=-24 mA VOL Maximum LowLevel Output Voltage IOUT ≤ 50 μA V * IIN Maximum Input Leakage Current VIN=VCC or GND 5.5 ΔICCT Additional Max. ICC/Input VIN=VCC - 2.1 V 5.5 1.5 mA IOLD +Minimum Dynamic Output Current VOLD=1.65 V Max 5.5 75 mA IOHD +Minimum Dynamic Output Current VOHD=3.85 V Min 5.5 -75 mA ICC Maximum Quiescent Supply Current (per Package) VIN=VCC or GND 5.5 80 μA 8.0 * All outputs loaded; thresholds on input associated with output under test. +Maximum test duration 2.0 ms, one output loaded at a time. Rev. 00 IN74ACT139 AC ELECTRICAL CHARACTERISTICS (VCC=5.0 V ± 10%, CL=50pF,Input tr=tf=3.0 ns) Guaranteed Limits Symbol Parameter 25 °C -40°C to 85°C Min Max Min Max Unit tPLH Propagation Delay , Input A to Output Y (Figure 2) 1.5 8.5 1.5 9.5 ns tPHL Propagation Delay , Input A to Output Y (Figure 2) 1.5 9.5 1.5 10.5 ns tPLH Propagation Delay, Select to Output Y (Figure 1) 2.5 10.0 2.0 11.0 ns tPHL Propagation Delay, Select to Output Y (Figure 1) 2.0 9.5 1.5 10.5 ns CIN Maximum Input Capacitance 4.5 4.5 pF Typical @25°C,VCC=5.0 V CPD Power Dissipation Capacitance Figure 1. Switching Waveform 40 pF Figure 2. Switching Waveform Rev. 00 IN74ACT139 EXPANDED LOGIC DIAGRAM Rev. 00 IN74ACT139 N SUFFIX PLASTIC DIP (MS - 001BB) A Dimension, mm 9 16 Symbol MIN MAX A 18.67 19.69 B 6.1 7.11 B 1 8 5.33 C F L C D 0.36 0.56 F 1.14 1.78 G 2.54 H 7.62 -T- SEATING PLANE N G K M H D J 0.25 (0.010) M T NOTES: 1. Dimensions “A”, “B” do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. J 0° 10° K 2.92 3.81 L 7.62 8.26 M 0.2 0.36 N 0.38 D SUFFIX SOIC (MS - 012AC) Dimension, mm A 16 9 H B 1 G P 8 R x 45 C -TK D SEATING PLANE J 0.25 (0.010) M T C M NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B ‑ 0.25 mm (0.010) per side. F M Symbol MIN MAX A 9.8 10 B 3.8 4 C 1.35 1.75 D 0.33 0.51 F 0.4 1.27 G 1.27 H 5.72 J 0° 8° K 0.1 0.25 M 0.19 0.25 P 5.8 6.2 R 0.25 0.5 Rev. 00