PHILIPS LPC2134FBD64/01 Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kb Datasheet

LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB
ISP/IAP flash with 10-bit ADC and DAC
Rev. 5 — 2 February 2011
Product data sheet
1. General description
The LPC2131/32/34/36/38 microcontrollers are based on a 16/32-bit ARM7TDMI-S CPU
with real-time emulation and embedded trace support, that combine the microcontroller
with 32 kB, 64 kB, 128 kB, 256 kB and 512 kB of embedded high-speed flash memory. A
128-bit wide memory interface and a unique accelerator architecture enable 32-bit code
execution at maximum clock rate. For critical code size applications, the alternative 16-bit
Thumb mode reduces code by more than 30 % with minimal performance penalty.
Due to their tiny size and low power consumption, these microcontrollers are ideal for
applications where miniaturization is a key requirement, such as access control and
point-of-sale. With a wide range of serial communications interfaces and on-chip SRAM
options of 8 kB, 16 kB, and 32 kB, they are very well suited for communication gateways
and protocol converters, soft modems, voice recognition and low-end imaging, providing
both large buffer size and high processing power. Various 32-bit timers, single or dual
10-bit 8-channel ADC(s), 10-bit DAC, PWM channels and 47 GPIO lines with up to nine
edge or level sensitive external interrupt pins make these microcontrollers particularly
suitable for industrial control and medical systems.
2. Features and benefits
2.1 Enhancements brought by LPC213x/01 devices
„ Fast GPIO ports enable port pin toggling up to 3.5 times faster than the original
LPC213x. They also allow for a port pin to be read at any time regardless of its
function.
„ Dedicated result registers for ADC(s) reduce interrupt overhead.
„ UART0/1 include fractional baud rate generator, auto-bauding capabilities and
handshake flow-control fully implemented in hardware.
„ Additional BOD control enables further reduction of power consumption.
2.2 Key features common for LPC213x and LPC213x/01
„ 16/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 or HVQFN package.
„ 8/16/32 kB of on-chip static RAM and 32/64/128/256/512 kB of on-chip flash program
memory. 128-bit wide interface/accelerator enables high-speed 60 MHz operation.
„ In-System Programming/In-Application Programming (ISP/IAP) via on-chip bootloader
software. Single flash sector or full chip erase in 400 ms and programming of 256 B in
1 ms.
„ EmbeddedICE RT and Embedded Trace interfaces offer real-time debugging with the
on-chip RealMonitor software and high-speed tracing of instruction execution.
LPC2131/32/34/36/38
NXP Semiconductors
Single-chip 16/32-bit microcontrollers
„ One (LPC2131/32) or two (LPC2134/36/38) 8-channel 10-bit ADCs provide a total of
up to 16 analog inputs, with conversion times as low as 2.44 μs per channel.
„ Single 10-bit DAC provides variable analog output (LPC2132/34/36/38).
„ Two 32-bit timers/external event counters (with four capture and four compare
channels each), PWM unit (six outputs) and watchdog.
„ Low power Real-time clock with independent power and dedicated 32 kHz clock input.
„ Multiple serial interfaces including two UARTs (16C550), two Fast I2C-bus (400 kbit/s),
SPI and SSP with buffering and variable data length capabilities.
„ Vectored interrupt controller with configurable priorities and vector addresses.
„ Up to forty-seven 5 V tolerant general purpose I/O pins in tiny LQFP64 or HVQFN
package.
„ Up to nine edge or level sensitive external interrupt pins available.
„ 60 MHz maximum CPU clock available from programmable on-chip PLL with settling
time of 100 μs.
„ On-chip integrated oscillator operates with external crystal in range of 1 MHz to
30 MHz and with external oscillator up to 50 MHz.
„ Power saving modes include Idle and Power-down.
„ Individual enable/disable of peripheral functions as well as peripheral clock scaling
down for additional power optimization.
„ Processor wake-up from Power-down mode via external interrupt or BOD.
„ Single power supply chip with POR and BOD circuits:
‹ CPU operating voltage range of 3.0 V to 3.6 V (3.3 V ± 10 %) with 5 V tolerant I/O
pads.
3. Ordering information
Table 1.
Ordering information
Type number
LPC2131_32_34_36_38
Product data sheet
Package
Name
Description
Version
LPC2131FBD64
LQFP64
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
SOT314-2
LPC2131FBD64/01
LQFP64
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
SOT314-2
LPC2132FBD64
LQFP64
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
SOT314-2
LPC2132FBD64/01
LQFP64
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
SOT314-2
LPC2132FHN64
HVQFN64 plastic thermal enhanced very thin quad flat
package; no leads; 64 terminals; body
9 × 9 × 0.85 mm
SOT804-2
LPC2132FHN64/01 HVQFN64 plastic thermal enhanced very thin quad flat
package; no leads; 64 terminals; body
9 × 9 × 0.85 mm
SOT804-2
LPC2134FBD64
LQFP64
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
SOT314-2
LPC2134FBD64/01
LQFP64
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
SOT314-2
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 2 February 2011
© NXP B.V. 2011. All rights reserved.
2 of 45
LPC2131/32/34/36/38
NXP Semiconductors
Single-chip 16/32-bit microcontrollers
Table 1.
Ordering information …continued
Type number
Package
Name
Description
Version
LPC2136FBD64
LQFP64
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
SOT314-2
LPC2136FBD64/01
LQFP64
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
SOT314-2
LPC2138FBD64
LQFP64
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
SOT314-2
LPC2138FBD64/01
LQFP64
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
SOT314-2
LPC2138FHN64
HVQFN64 plastic thermal enhanced very thin quad flat
package; no leads; 64 terminals; body
9 × 9 × 0.85 mm
SOT804-2
LPC2138FHN64/01 HVQFN64 plastic thermal enhanced very thin quad flat
package; no leads; 64 terminals; body
9 × 9 × 0.85 mm
SOT804-2
3.1 Ordering options
Table 2.
LPC2131_32_34_36_38
Product data sheet
Ordering options
Type number
Flash
RAM
memory
ADC
DAC
Enhanced UARTs,
Temperature
ADC, Fast I/Os, and range
BOD
LPC2131FBD64
32 kB
8 kB
1
-
no
−40 °C to +85 °C
LPC2131FBD64/01
32 kB
8 kB
1
-
yes
−40 °C to +85 °C
LPC2132FBD64
64 kB
16 kB 1
1
no
−40 °C to +85 °C
LPC2132FBD64/01
64 kB
16 kB 1
1
yes
−40 °C to +85 °C
LPC2132FHN64
64 kB
16 kB 1
1
no
−40 °C to +85 °C
LPC2132FHN64/01
64 kB
16 kB 1
1
yes
−40 °C to +85 °C
LPC2134FBD64
128 kB
16 kB 2
1
no
−40 °C to +85 °C
LPC2134FBD64/01
128 kB
16 kB 2
1
yes
−40 °C to +85 °C
LPC2136FBD64
256 kB
32 kB 2
1
no
−40 °C to +85 °C
LPC2136FBD64/01
256 kB
32 kB 2
1
yes
−40 °C to +85 °C
LPC2138FBD64
512 kB
32 kB 2
1
no
−40 °C to +85 °C
LPC2138FBD64/01
512 kB
32 kB 2
1
yes
−40 °C to +85 °C
LPC2138FHN64
512 kB
32 kB 2
1
no
−40 °C to +85 °C
LPC2138FHN64/01
512 kB
32 kB 2
1
yes
−40 °C to +85 °C
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 2 February 2011
© NXP B.V. 2011. All rights reserved.
3 of 45
LPC2131/32/34/36/38
NXP Semiconductors
Single-chip 16/32-bit microcontrollers
4. Block diagram
TMS(3)
TRST(3)
LPC2131, LPC2131/01
LPC2132, LPC2132/01
LPC2134, LPC2134/01
LPC2136, LPC2136/01
LPC2138, LPC2138/01
P1[31:16]
trace
TEST/DEBUG
INTERFACE
ARM7TDMI-S
FAST GENERAL
PURPOSE I/O
XTAL2
RESET
XTAL1
TDO(3) signals
EMULATION
TRACE MODULE
P0[31:0]
TDI(3)
TCK(3)
AHB BRIDGE
PLL
system
clock
SYSTEM
FUNCTIONS
VECTORED
INTERRUPT
CONTROLLER
AMBA AHB
(Advanced High-performance Bus)
ARM7 local bus
INTERNAL
SRAM
CONTROLLER
INTERNAL
FLASH
CONTROLLER
8/16/32 kB
SRAM
32/64/128/
256/512 kB
FLASH
AHB
DECODER
AHB TO APB
BRIDGE
APB
DIVIDER
APB (ARM
peripheral bus)
EXTERNAL
INTERRUPTS
I2C SERIAL
INTERFACES 0 AND 1
CAPTURE/
COMPARE
TIMER 0/TIMER 1
SPI AND SSP
SERIAL INTERFACES
EINT[3:0]
8 × CAP
8 × MAT
AD0[7:0]
AD1[7:0](1)
AOUT(2)
SCL0,1
SDA0,1
SCK0,1
MOSI0,1
MISO0,1
SSEL0,1
A/D CONVERTERS
0 AND 1(1)
TXD0,1
RXD0,1
DSR1(1),CTS1(1)
RTS1(1), DTR1(1)
DCD1(1), RI1(1)
UART0/UART1
D/A CONVERTER(2)
RTCX1
P0[31:0]
P1[31:16]
REAL TIME CLOCK
RTCX2
VBAT
GENERAL
PURPOSE I/O
WATCHDOG
TIMER
PWM[6:1]
PWM0
SYSTEM
CONTROL
002aab067
(1) LPC2134/36/38 only.
(2) LPC2132/34/36/38 only.
(3) Pins shared with GPIO.
Fig 1. Block diagram
LPC2131_32_34_36_38
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 2 February 2011
© NXP B.V. 2011. All rights reserved.
4 of 45
LPC2131/32/34/36/38
NXP Semiconductors
Single-chip 16/32-bit microcontrollers
5. Pinning information
49 VBAT
50 VSS
51 VDD
52 P1.30/TMS
53 P0.18/CAP1.3/MISO1/MAT1.3
54 P0.19/MAT1.2/MOSI1/CAP1.2
55 P0.20/MAT1.3/SSEL1/EINT3
56 P1.29/TCK
57 RESET
58 P0.23
59 VSSA
60 P1.28/TDI
61 XTAL2
62 XTAL1
63 VREF
64 P1.27/TDO
5.1 Pinning
P0.21/PWM5/CAP1.3
1
48 P1.20/TRACESYNC
P0.22/CAP0.0/MAT0.0
2
47 P0.17/CAP1.2/SCK1/MAT1.2
RTCX1
3
46 P0.16/EINT0/MAT0.2/CAP0.2
P1.19/TRACEPKT3
4
45 P0.15/EINT2
RTCX2
5
44 P1.21/PIPESTAT0
VSS
6
43 VDD
VDDA
7
42 VSS
P1.18/TRACEPKT2
8
P0.25/AD0.4
9
41 P0.14/EINT1/SDA1
LPC2131
LPC2131/01
40 P1.22/PIPESTAT1
P0.26/AD0.5 10
39 P0.13/MAT1.1
P0.27/AD0.0/CAP0.1/MAT0.1 11
38 P0.12/MAT1.0
P1.17/TRACEPKT1 12
37 P0.11/CAP1.1/SCL1
P0.28/AD0.1/CAP0.2/MAT0.2 13
36 P1.23/PIPESTAT2
P0.29/AD0.2/CAP0.3/MAT0.3 14
35 P0.10/CAP1.0
P0.30/AD0.3/EINT3/CAP0.0 15
34 P0.9/RXD1/PWM6/EINT3
P1.16/TRACEPKT0 16
P1.24/TRACECLK 32
P0.7/SSEL0/PWM2/EINT2 31
P0.6/MOSI0/CAP0.2 30
P0.5/MISO0/MAT0.1/AD0.7 29
P1.25/EXTIN0 28
P0.4/SCK0/CAP0.1/AD0.6 27
P0.3/SDA0/MAT0.0/EINT1 26
VSS 25
P1.26/RTCK 24
VDD 23
P0.2/SCL0/CAP0.0 22
P0.1/RXD0/PWM3/EINT0 21
P1.31/TRST 20
P0.0/TXD0/PWM1 19
VSS 18
P0.31 17
33 P0.8/TXD1/PWM4
002aab068
Fig 2. LPC2131 LQFP64 pinning
LPC2131_32_34_36_38
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 2 February 2011
© NXP B.V. 2011. All rights reserved.
5 of 45
LPC2131/32/34/36/38
NXP Semiconductors
49 VBAT
50 VSS
51 VDD
52 P1.30/TMS
53 P0.18/CAP1.3/MISO1/MAT1.3
54 P0.19/MAT1.2/MOSI1/CAP1.2
55 P0.20/MAT1.3/SSEL1/EINT3
56 P1.29/TCK
57 RESET
58 P0.23
59 VSSA
60 P1.28/TDI
61 XTAL2
62 XTAL1
63 VREF
64 P1.27/TDO
Single-chip 16/32-bit microcontrollers
P0.21/PWM5/CAP1.3
1
48 P1.20/TRACESYNC
P0.22/CAP0.0/MAT0.0
2
47 P0.17/CAP1.2/SCK1/MAT1.2
RTCX1
3
46 P0.16/EINT0/MAT0.2/CAP0.2
P1.19/TRACEPKT3
4
45 P0.15/EINT2
RTCX2
5
44 P1.21/PIPESTAT0
VSS
6
43 VDD
VDDA
7
42 VSS
P1.18/TRACEPKT2
8
P0.25/AD0.4/AOUT
9
41 P0.14/EINT1/SDA1
LPC2132
LPC2132/01
40 P1.22/PIPESTAT1
P0.26/AD0.5 10
39 P0.13/MAT1.1
P0.27/AD0.0/CAP0.1/MAT0.1 11
38 P0.12/MAT1.0
P1.17/TRACEPKT1 12
37 P0.11/CAP1.1/SCL1
P0.28/AD0.1/CAP0.2/MAT0.2 13
36 P1.23/PIPESTAT2
P0.29/AD0.2/CAP0.3/MAT0.3 14
35 P0.10/CAP1.0
P0.30/AD0.3/EINT3/CAP0.0 15
34 P0.9/RXD1/PWM6/EINT3
P1.16/TRACEPKT0 16
P1.24/TRACECLK 32
P0.7/SSEL0/PWM2/EINT2 31
P0.6/MOSI0/CAP0.2 30
P0.5/MISO0/MAT0.1/AD0.7 29
P1.25/EXTIN0 28
P0.4/SCK0/CAP0.1/AD0.6 27
P0.3/SDA0/MAT0.0/EINT1 26
VSS 25
P1.26/RTCK 24
VDD 23
P0.2/SCL0/CAP0.0 22
P0.1/RXD0/PWM3/EINT0 21
P1.31/TRST 20
P0.0/TXD0/PWM1 19
VSS 18
P0.31 17
33 P0.8/TXD1/PWM4
002aab406
Fig 3. LPC2132 LQFP64 pin configuration
LPC2131_32_34_36_38
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 2 February 2011
© NXP B.V. 2011. All rights reserved.
6 of 45
LPC2131/32/34/36/38
NXP Semiconductors
49 VBAT
50 VSS
51 VDD
52 P1.30/TMS
53 P0.18/CAP1.3/MISO1/MAT1.3
54 P0.19/MAT1.2/MOSI1/CAP1.2
55 P0.20/MAT1.3/SSEL1/EINT3
56 P1.29/TCK
57 RESET
58 P0.23
59 VSSA
60 P1.28/TDI
61 XTAL2
62 XTAL1
63 VREF
64 P1.27/TDO
Single-chip 16/32-bit microcontrollers
P0.21/PWM5/AD1.6/CAP1.3
1
48 P1.20/TRACESYNC
P0.22/AD1.7/CAP0.0/MAT0.0
2
47 P0.17/CAP1.2/SCK1/MAT1.2
RTCX1
3
46 P0.16/EINT0/MAT0.2/CAP0.2
P1.19/TRACEPKT3
4
45 P0.15/RI1/EINT2/AD1.5
RTCX2
5
44 P1.21/PIPESTAT0
VSS
6
43 VDD
VDDA
7
42 VSS
P1.18/TRACEPKT2
8
P0.25/AD0.4/AOUT
9
41 P0.14/DCD1/EINT1/SDA1
LPC2134, LPC2134/01
LPC2136, LPC2136/01
LPC2138, LPC2138/01
P0.26/AD0.5 10
40 P1.22/PIPESTAT1
39 P0.13/DTR1/MAT1.1/AD1.4
P0.27/AD0.0/CAP0.1/MAT0.1 11
38 P0.12/DSR1/MAT1.0/AD1.3
P1.17/TRACEPKT1 12
37 P0.11/CTS1/CAP1.1/SCL1
P0.28/AD0.1/CAP0.2/MAT0.2 13
36 P1.23/PIPESTAT2
P0.29/AD0.2/CAP0.3/MAT0.3 14
35 P0.10/RTS1/CAP1.0/AD1.2
P1.24/TRACECLK 32
P0.7/SSEL0/PWM2/EINT2 31
P0.6/MOSI0/CAP0.2/AD1.0 30
P0.5/MISO0/MAT0.1/AD0.7 29
P1.25/EXTIN0 28
P0.4/SCK0/CAP0.1/AD0.6 27
P0.3/SDA0/MAT0.0/EINT1 26
VSS 25
P1.26/RTCK 24
VDD 23
P0.2/SCL0/CAP0.0 22
P0.1/RXD0/PWM3/EINT0 21
P1.31/TRST 20
P0.0/TXD0/PWM1 19
33 P0.8/TXD1/PWM4/AD1.1
VSS 18
34 P0.9/RXD1/PWM6/EINT3
P1.16/TRACEPKT0 16
P0.31 17
P0.30/AD0.3/EINT3/CAP0.0 15
002aab407
Fig 4. LPC2134/36/38 LQFP64 pin configuration
LPC2131_32_34_36_38
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 2 February 2011
© NXP B.V. 2011. All rights reserved.
7 of 45
LPC2131/32/34/36/38
NXP Semiconductors
49 VBAT
50 VSS
51 VDD
52 P1.30/TMS
53 P0.18/CAP1.3/MISO1/MAT1.3
54 P0.19/MAT1.2/MOSI1/CAP1.2
55 P0.20/MAT1.3/SSEL1/EINT3
56 P1.29/TCK
57 RESET
58 P0.23
59 VSSA
60 P1.28/TDI
61 XTAL2
62 XTAL1
terminal 1
index area
63 VREF
64 P1.27/TDO
Single-chip 16/32-bit microcontrollers
P0.21/PWM5/AD1.6/CAP1.3
1
48 P1.20/TRACESYNC
P0.22/AD1.7/CAP0.0/MAT0.0
2
47 P0.17/CAP1.2/SCK1/MAT1.2
RTCX1
3
46 P0.16/EINT0/MAT0.2/CAP0.2
P1.19/TRACEPKT3
4
45 P0.15/RI1/EINT2/AD1.5
RTCX2
5
44 P1.21/PIPESTAT0
VSS
6
43 VDD
VDDA
7
42 VSS
P1.18/TRACEPKT2
8
P0.25/AD0.4/AOUT
9
41 P0.14/DCD1/EINT1/SDA1
LPC2132/2138
40 P1.22/PIPESTAT1
P0.26/AD0.5 10
39 P0.13/DTR1/MAT1.1/AD1.4
P0.27/AD0.0/CAP0.1/MAT0.1 11
38 P0.12/DSR1/MAT1.0/AD1.3
P1.17/TRACEPKT1 12
37 P0.11/CTS1/CAP1.1/SCL1
P0.28/AD0.1/CAP0.2/MAT0.2 13
36 P1.23/PIPESTAT2
P0.29/AD0.2/CAP0.3/MAT0.3 14
35 P0.10/RTS1/CAP1.0/AD1.2
Transparent top view
P1.24/TRACECLK 32
P0.7/SSEL0/PWM2/EINT2 31
P0.6/MOSI0/CAP0.2/AD1.0 30
P0.5/MISO0/MAT0.1/AD0.7 29
P1.25/EXTIN0 28
P0.4/SCK0/CAP0.1/AD0.6 27
P0.3/SDA0/MAT0.0/EINT1 26
VSS 25
P1.26/RTCK 24
VDD 23
P0.2/SCL0/CAP0.0 22
P0.1/RXD0/PWM3/EINT0 21
P1.31/TRST 20
P0.0/TXD0/PWM1 19
33 P0.8/TXD1/PWM4/AD1.1
VSS 18
34 P0.9/RXD1/PWM6/EINT3
P1.16/TRACEPKT0 16
P0.31 17
P0.30/AD0.3/EINT3/CAP0.0 15
002aab943
AD1.7 to AD1.0 only available on LPC2134/36/38.
Fig 5. LPC2132/38 HVQFN64 pin configuration
LPC2131_32_34_36_38
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 2 February 2011
© NXP B.V. 2011. All rights reserved.
8 of 45
LPC2131/32/34/36/38
NXP Semiconductors
Single-chip 16/32-bit microcontrollers
5.2 Pin description
Table 3.
Pin description
Symbol
Pin
P0.0 to P0.31
Type
Description
I/O
Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each bit. Total of
31 pins of the Port 0 can be used as a general purpose bidirectional digital I/Os while
P0.31 is output only pin. The operation of port 0 pins depends upon the pin function
selected via the pin connect block.
Pin P0.24 is not available.
P0.0/TXD0/
PWM1
19[1]
P0.1/RXD0/
PWM3/EINT0
21[2]
P0.2/SCL0/
CAP0.0
22[3]
P0.3/SDA0/
MAT0.0/EINT1
26[3]
P0.4/SCK0/
CAP0.1/AD0.6
27[4]
P0.5/MISO0/
MAT0.1/AD0.7
29[4]
P0.6/MOSI0/
CAP0.2/AD1.0
30[4]
P0.7/SSEL0/
PWM2/EINT2
31[2]
P0.8/TXD1/
PWM4/AD1.1
33[4]
P0.9/RXD1/
PWM6/EINT3
34[2]
P0.10/RTS1/
CAP1.0/AD1.2
35[4]
LPC2131_32_34_36_38
Product data sheet
O
TXD0 — Transmitter output for UART0.
O
PWM1 — Pulse Width Modulator output 1.
I
RXD0 — Receiver input for UART0.
O
PWM3 — Pulse Width Modulator output 3.
I
EINT0 — External interrupt 0 input.
I/O
SCL0 — I2C0 clock input/output. Open drain output (for I2C-bus compliance).
I
CAP0.0 — Capture input for Timer 0, channel 0.
I/O
SDA0 — I2C0 data input/output. Open drain output (for I2C-bus compliance).
O
MAT0.0 — Match output for Timer 0, channel 0.
I
EINT1 — External interrupt 1 input.
I/O
SCK0 — Serial clock for SPI0. SPI clock output from master or input to slave.
I
CAP0.1 — Capture input for Timer 0, channel 1.
I
AD0.6 — ADC 0, input 6. This analog input is always connected to its pin.
I/O
MISO0 — Master In Slave VDD = 3.6 V for SPI0. Data input to SPI master or data
output from SPI slave.
O
MAT0.1 — Match output for Timer 0, channel 1.
I
AD0.7 — ADC 0, input 7. This analog input is always connected to its pin.
I/O
MOSI0 — Master Out Slave In for SPI0. Data output from SPI master or data input to
SPI slave.
I
CAP0.2 — Capture input for Timer 0, channel 2.
I
AD1.0 — ADC 1, input 0. This analog input is always connected to its pin. Available in
LPC2134/36/38 only.
I
SSEL0 — Slave Select for SPI0. Selects the SPI interface as a slave.
O
PWM2 — Pulse Width Modulator output 2.
I
EINT2 — External interrupt 2 input.
O
TXD1 — Transmitter output for UART1.
O
PWM4 — Pulse Width Modulator output 4.
I
AD1.1 — ADC 1, input 1. This analog input is always connected to its pin. Available in
LPC2134/36/38 only.
I
RXD1 — Receiver input for UART1.
O
PWM6 — Pulse Width Modulator output 6.
I
EINT3 — External interrupt 3 input.
O
RTS1 — Request to Send output for UART1. Available in LPC2134/36/38.
I
CAP1.0 — Capture input for Timer 1, channel 0.
I
AD1.2 — ADC 1, input 2. This analog input is always connected to its pin. Available in
LPC2134/36/38 only.
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Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P0.11/CTS1/
CAP1.1/SCL1
37[3]
I
CTS1 — Clear to Send input for UART1. Available in LPC2134/36/38.
I
CAP1.1 — Capture input for Timer 1, channel 1.
I/O
SCL1 — I2C1 clock input/output. Open drain output (for I2C-bus compliance)
I
DSR1 — Data Set Ready input for UART1. Available in LPC2134/36/38.
O
MAT1.0 — Match output for Timer 1, channel 0.
I
AD1.3 — ADC 1, input 3. This analog input is always connected to its pin. Available in
LPC2134/36/38 only.
O
DTR1 — Data Terminal Ready output for UART1. Available in LPC2134/36/38.
O
MAT1.1 — Match output for Timer 1, channel 1.
I
AD1.4 — ADC 1, input 4. This analog input is always connected to its pin. Available in
LPC2134/36/38 only.
I
DCD1 — Data Carrier Detect input for UART1. Available in LPC2134/36/38.
I
EINT1 — External interrupt 1 input.
I/O
SDA1 — I2C1 data input/output. Open drain output (for I2C-bus compliance).
I
RI1 — Ring Indicator input for UART1. Available in LPC2134/36/38.
I
EINT2 — External interrupt 2 input.
I
AD1.5 — ADC 1, input 5. This analog input is always connected to its pin. Available in
LPC2134/36/38 only.
I
EINT0 — External interrupt 0 input.
O
MAT0.2 — Match output for Timer 0, channel 2.
I
CAP0.2 — Capture input for Timer 0, channel 2.
I
CAP1.2 — Capture input for Timer 1, channel 2.
I/O
SCK1 — Serial Clock for SSP. Clock output from master or input to slave.
P0.12/DSR1/
MAT1.0/AD1.3
P0.13/DTR1/
MAT1.1/AD1.4
P0.14/DCD1/
EINT1/SDA1
P0.15/RI1/
EINT2/AD1.5
38[4]
39[4]
41[3]
45[4]
P0.16/EINT0/
46[2]
MAT0.2/CAP0.2
P0.17/CAP1.2/
SCK1/MAT1.2
47[1]
P0.18/CAP1.3/
MISO1/MAT1.3
53[1]
P0.19/MAT1.2/
MOSI1/CAP1.2
54[1]
P0.20/MAT1.3/
SSEL1/EINT3
55[2]
P0.21/PWM5/
AD1.6/CAP1.3
1[4]
P0.22/AD1.7/
CAP0.0/MAT0.0
2[4]
LPC2131_32_34_36_38
Product data sheet
O
MAT1.2 — Match output for Timer 1, channel 2.
I
CAP1.3 — Capture input for Timer 1, channel 3.
I/O
MISO1 — Master In Slave Out for SSP. Data input to SPI master or data output from
SSP slave.
O
MAT1.3 — Match output for Timer 1, channel 3.
O
MAT1.2 — Match output for Timer 1, channel 2.
I/O
MOSI1 — Master Out Slave In for SSP. Data output from SSP master or data input to
SSP slave.
I
CAP1.2 — Capture input for Timer 1, channel 2.
O
MAT1.3 — Match output for Timer 1, channel 3.
I
SSEL1 — Slave Select for SSP. Selects the SSP interface as a slave.
I
EINT3 — External interrupt 3 input.
O
PWM5 — Pulse Width Modulator output 5.
I
AD1.6 — ADC 1, input 6. This analog input is always connected to its pin. Available in
LPC2134/36/38 only.
I
CAP1.3 — Capture input for Timer 1, channel 3.
I
AD1.7 — ADC 1, input 7. This analog input is always connected to its pin. Available in
LPC2134/36/38 only.
I
CAP0.0 — Capture input for Timer 0, channel 0.
O
MAT0.0 — Match output for Timer 0, channel 0.
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Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P0.23
58[1]
I/O
General purpose digital input/output pin.
P0.25/AD0.4/
AOUT
9[5]
I
AD0.4 — ADC 0, input 4. This analog input is always connected to its pin.
O
AOUT — DAC output. Not available in LPC2131.
P0.26/AD0.5
10[4]
I
AD0.5 — ADC 0, input 5. This analog input is always connected to its pin.
P0.27/AD0.0/
11[4]
CAP0.1/MAT0.1
I
AD0.0 — ADC 0, input 0. This analog input is always connected to its pin.
I
CAP0.1 — Capture input for Timer 0, channel 1.
O
MAT0.1 — Match output for Timer 0, channel 1.
I
AD0.1 — ADC 0, input 1. This analog input is always connected to its pin.
I
CAP0.2 — Capture input for Timer 0, channel 2.
O
MAT0.2 — Match output for Timer 0, channel 2.
I
AD0.2 — ADC 0, input 2. This analog input is always connected to its pin.
I
CAP0.3 — Capture input for Timer 0, channel 3.
O
MAT0.3 — Match output for Timer 0, channel 3.
I
AD0.3 — ADC 0, input 3. This analog input is always connected to its pin.
I
EINT3 — External interrupt 3 input.
P0.28/AD0.1/
CAP0.2/MAT0.2
13[4]
P0.29/AD0.2/
CAP0.3/MAT0.3
14[4]
P0.30/AD0.3/
EINT3/CAP0.0
15[4]
P0.31
17[6]
I
CAP0.0 — Capture input for Timer 0, channel 0.
O
General purpose digital output only pin.
Important: This pin MUST NOT be externally pulled LOW when RESET pin is LOW or
the JTAG port will be disabled.
P1.0 to P1.31
I/O
Port 1: Port 1 is a 32-bit bidirectional I/O port with individual direction controls for each
bit. The operation of port 1 pins depends upon the pin function selected via the pin
connect block. Pins 0 through 15 of port 1 are not available.
P1.16/
TRACEPKT0
16[6]
O
TRACEPKT0 — Trace Packet, bit 0. Standard I/O port with internal pull-up.
P1.17/
TRACEPKT1
12[6]
O
TRACEPKT1 — Trace Packet, bit 1. Standard I/O port with internal pull-up.
P1.18/
TRACEPKT2
8[6]
O
TRACEPKT2 — Trace Packet, bit 2. Standard I/O port with internal pull-up.
P1.19/
TRACEPKT3
4[6]
O
TRACEPKT3 — Trace Packet, bit 3. Standard I/O port with internal pull-up.
P1.20/
TRACESYNC
48[6]
O
TRACESYNC — Trace Synchronization. Standard I/O port with internal pull-up. LOW
on TRACESYNC while RESET is LOW enables pins P1.25:16 to operate as Trace port
after reset.
P1.21/
PIPESTAT0
44[6]
O
PIPESTAT0 — Pipeline Status, bit 0. Standard I/O port with internal pull-up.
P1.22/
PIPESTAT1
40[6]
O
PIPESTAT1 — Pipeline Status, bit 1. Standard I/O port with internal pull-up.
P1.23/
PIPESTAT2
36[6]
O
PIPESTAT2 — Pipeline Status, bit 2. Standard I/O port with internal pull-up.
P1.24/
TRACECLK
32[6]
O
TRACECLK — Trace Clock. Standard I/O port with internal pull-up.
P1.25/EXTIN0
28[6]
I
EXTIN0 — External Trigger Input. Standard I/O with internal pull-up.
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Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P1.26/RTCK
24[6]
I/O
RTCK — Returned Test Clock output. Extra signal added to the JTAG port. Assists
debugger synchronization when processor frequency varies. Bidirectional pin with
internal pull-up. LOW on RTCK while RESET is LOW enables pins P1.31:26 to operate
as Debug port after reset.
P1.27/TDO
64[6]
O
TDO — Test Data out for JTAG interface.
P1.28/TDI
60[6]
I
TDI — Test Data in for JTAG interface.
P1.29/TCK
56[6]
I
TCK — Test Clock for JTAG interface.
P1.30/TMS
52[6]
I
TMS — Test Mode Select for JTAG interface.
P1.31/TRST
20[6]
I
TRST — Test Reset for JTAG interface.
RESET
57[7]
I
External reset input: A LOW on this pin resets the device, causing I/O ports and
peripherals to take on their default states, and processor execution to begin at address
0. TTL with hysteresis, 5 V tolerant.
XTAL1
62[8]
I
Input to the oscillator circuit and internal clock generator circuits.
XTAL2
61[8]
O
Output from the oscillator amplifier.
RTCX1
3[9]
I
Input to the RTC oscillator circuit.
RTCX2
5[9]
O
Output from the RTC oscillator circuit.
VSS
6, 18,
25, 42,
50
I
Ground: 0 V reference.
VSSA
59
I
Analog ground: 0 V reference. This should nominally be the same voltage as VSS, but
should be isolated to minimize noise and error.
VDD
23, 43,
51
I
3.3 V power supply: This is the power supply voltage for the core and I/O ports.
VDDA
7
I
Analog 3.3 V power supply: This should be nominally the same voltage as VDD but
should be isolated to minimize noise and error. This voltage is used to power the
on-chip PLL.
VREF
63
I
ADC reference: This should be nominally the same voltage as VDD but should be
isolated to minimize noise and error. Level on this pin is used as a reference for A/D
and D/A convertor(s).
VBAT
49
I
RTC power supply: 3.3 V on this pin supplies the power to the RTC.
[1]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.
[2]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. If configured for an input
function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns.
[3]
Open drain 5 V tolerant digital I/O I2C-bus 400 kHz specification compatible pad. It requires external pull-up to provide an output
functionality.
[4]
5 V tolerant pad providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog input function. If configured
for an input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. When configured as an ADC input, digital
section of the pad is disabled.
[5]
5 V tolerant pad providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog output function. When
configured as the DAC output, digital section of the pad is disabled.
[6]
5 V tolerant pad with built-in pull-up resistor providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.
The pull-up resistor’s value ranges from 60 kΩ to 300 kΩ.
[7]
5 V tolerant pad providing digital input (with TTL levels and hysteresis) function only.
[8]
Pad provides special analog functionality.
[9]
When unused, the RTCX1 pin can be grounded or left floating. For lowest power leave it floating.
The other RTC pin, RTCX2, should be left floating.
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6. Functional description
6.1 Architectural overview
The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high
performance and very low power consumption. The ARM architecture is based on
Reduced Instruction Set Computer (RISC) principles, and the instruction set and related
decode mechanism are much simpler than those of microprogrammed Complex
Instruction Set Computers. This simplicity results in a high instruction throughput and
impressive real-time interrupt response from a small and cost-effective processor core.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM7TDMI-S processor also employs a unique architectural strategy known as
Thumb, which makes it ideally suited to high-volume applications with memory
restrictions, or applications where code density is an issue.
The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the
ARM7TDMI-S processor has two instruction sets:
• The standard 32-bit ARM set.
• A 16-bit Thumb set.
The Thumb set’s 16-bit instruction length allows it to approach twice the density of
standard ARM code while retaining most of the ARM’s performance advantage over a
traditional 16-bit processor using 16-bit registers. This is possible because Thumb code
operates on the same 32-bit register set as ARM code.
Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the
performance of an equivalent ARM processor connected to a 16-bit memory system.
6.2 On-chip flash program memory
The LPC2131/32/34/36/38 incorporate a 32 kB, 64 kB, 128 kB, 256 kB and 512 kB flash
memory system respectively. This memory may be used for both code and data storage.
Programming of the flash memory may be accomplished in several ways. It may be
programmed In System via the serial port. The application program may also erase and/or
program the flash while the application is running, allowing a great degree of flexibility for
data storage field firmware upgrades, etc. When the LPC2131/32/34/36/38 on-chip
bootloader is used, 32/64/128/256/500 kB of flash memory is available for user code.
The LPC2131/32/34/36/38 flash memory provides a minimum of 100000 erase/write
cycles and 20 years of data-retention.
6.3 On-chip static RAM
On-chip static RAM may be used for code and/or data storage. The SRAM may be
accessed as 8-bit, 16-bit, and 32-bit. The LPC2131, LPC2132/34, and LPC2136/38
provide 8 kB, 16 kB and 32 kB of static RAM respectively.
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6.4 Memory map
The LPC2131/32/34/36/38 memory map incorporates several distinct regions, as shown
in Figure 6.
In addition, the CPU interrupt vectors may be re-mapped to allow them to reside in either
flash memory (the default) or on-chip static RAM. This is described in Section 6.18
“System control”.
4.0 GB
0xFFFF FFFF
AHB PERIPHERALS
0xF000 0000
3.75 GB
APB PERIPHERALS
3.5 GB
0xE000 0000
3.0 GB
0xC000 0000
RESERVED ADDRESS SPACE
2.0 GB
0x8000 0000
BOOT BLOCK (RE-MAPPED FROM
ON-CHIP FLASH MEMORY
RESERVED ADDRESS SPACE
0x4001 8000
0x4000 7FFF
TOTAL OF 32 kB ON-CHIP STATIC RAM (LPC2136/38)
TOTAL OF 16 kB ON-CHIP STATIC RAM (LPC2132/34)
TOTAL OF 8 kB ON-CHIP STATIC RAM (LPC2131)
1.0 GB
0x4000 0000
RESERVED ADDRESS SPACE
TOTAL OF 512 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2138)
TOTAL OF 256 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2136)
TOTAL OF 128 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2134)
TOTAL OF 64 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2132)
0.0 GB
0x4000 4000
0x4000 3FFF
0x4000 2000
0x4000 1FFF
TOTAL OF 32 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2131)
0x0008 0000
0x0007 FFFF
0x0004 0000
0x0003 FFFF
0x0002 0000
0x0001 FFFF
0x0001 0000
0x0000 FFFF
0x0000 8000
0x0000 7FFF
0x0000 0000
002aab069
Fig 6. LPC2131/32/34/36/38 memory map
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6.5 Interrupt controller
The Vectored Interrupt Controller (VIC) accepts all of the interrupt request inputs and
categorizes them as Fast Interrupt Request (FIQ), vectored Interrupt Request (IRQ), and
non-vectored IRQ as defined by programmable settings. The programmable assignment
scheme means that priorities of interrupts from the various peripherals can be dynamically
assigned and adjusted.
FIQ has the highest priority. If more than one request is assigned to FIQ, the VIC
combines the requests to produce the FIQ signal to the ARM processor. The fastest
possible FIQ latency is achieved when only one request is classified as FIQ, because then
the FIQ service routine can simply start dealing with that device. But if more than one
request is assigned to the FIQ class, the FIQ service routine can read a word from the VIC
that identifies which FIQ source(s) is (are) requesting an interrupt.
Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned
to this category. Any of the interrupt requests can be assigned to any of the 16 vectored
IRQ slots, among which slot 0 has the highest priority and slot 15 has the lowest.
Non-vectored IRQs have the lowest priority.
The VIC combines the requests from all the vectored and non-vectored IRQs to produce
the IRQ signal to the ARM processor. The IRQ service routine can start by reading a
register from the VIC and jumping there. If any of the vectored IRQs are requesting, the
VIC provides the address of the highest-priority requesting IRQs service routine,
otherwise it provides the address of a default routine that is shared by all the non-vectored
IRQs. The default routine can read another VIC register to see what IRQs are active.
6.5.1 Interrupt sources
Table 4 lists the interrupt sources for each peripheral function. Each peripheral device has
one interrupt line connected to the Vectored Interrupt Controller, but may have several
internal interrupt flags. Individual interrupt flags may also represent more than one
interrupt source.
Table 4.
Interrupt sources
Block
Flag(s)
VIC channel #
WDT
Watchdog Interrupt (WDINT)
0
-
Reserved for software interrupts only
1
ARM Core
EmbeddedICE, DbgCommRX
2
ARM Core
EmbeddedICE, DbgCommTX
3
TIMER0
Match 0 to 3 (MR0, MR1, MR2, MR3)
4
Capture 0 to 3 (CR0, CR1, CR2, CR3)
TIMER1
Match 0 to 3 (MR0, MR1, MR2, MR3)
UART0
RX Line Status (RLS)
5
Capture 0 to 3 (CR0, CR1, CR2, CR3)
6
Transmit Holding Register empty (THRE)
RX Data Available (RDA)
Character Time-out Indicator (CTI)
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Table 4.
Interrupt sources …continued
Block
Flag(s)
VIC channel #
UART1
RX Line Status (RLS)
7
Transmit Holding Register empty (THRE)
RX Data Available (RDA)
Character Time-out Indicator (CTI)
Modem Status Interrupt (MSI) (Available in LPC2134/36/38
only)
PWM0
Match 0 to 6 (MR0, MR1, MR2, MR3, MR4, MR5, MR6)
8
Capture 0 to 3 (CR0, CR1, CR2, CR3)
I2C0
SI (state change)
9
SPI0
SPIF, MODF
10
SSP
TX FIFO at least half empty (TXRIS)
11
RX FIFO at least half full (RXRIS)
Receive Timeout (RTRIS)
Receive Overrun (RORRIS)
PLL
PLL Lock (PLOCK)
12
RTC
RTCCIF (Counter Increment), RTCALF (Alarm)
13
System Control
External Interrupt 0 (EINT0)
14
External Interrupt 1 (EINT1)
15
External Interrupt 2 (EINT2)
16
External Interrupt 3 (EINT3)
17
AD0
ADC 0
18
I2C1
SI (state change)
19
BOD
Brown Out Detect
20
AD1
ADC 1 (Available in LPC2134/36/38 only)
21
6.6 Pin connect block
The pin connect block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on chip peripherals. Peripherals should be connected to the appropriate pins
prior to being activated, and prior to any related interrupt(s) being enabled. Activity of any
enabled peripheral function that is not mapped to a related pin should be considered
undefined.
6.7 General purpose parallel I/O and Fast I/O
Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate
registers allow setting or clearing any number of outputs simultaneously. The value of the
output register may be read back, as well as the current state of the port pins.
6.7.1 Features
• Direction control of individual bits.
• Separate control of output set and clear.
• All I/O default to inputs after reset.
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6.7.2 Fast I/O features available in LPC213x/01 only
•
•
•
•
Fast I/O registers are located on the ARM local bus for the fastest possible I/O timing.
All GPIO registers are byte addressable.
Entire port value can be written in one instruction.
Mask registers allow single instruction to set or clear any number of bits in one port.
6.8 10-bit ADC
The LPC2131/32 contain one and the LPC2134/36/38 contain two ADCs. These
converters are single 10-bit successive approximation ADCs with eight multiplexed
channels.
6.8.1 Features
•
•
•
•
•
Measurement range of 0 V to 3.3 V.
Each converter capable of performing more than 400000 10-bit samples per second.
Burst conversion mode for single or multiple inputs.
Optional conversion on transition on input pin or Timer Match signal.
Global Start command for both converters (LPC2134/36/38 only).
6.8.2 ADC features available in LPC213x/01 only
• Every analog input has a dedicated result register to reduce interrupt overhead.
• Every analog input can generate an interrupt once the conversion is completed.
6.9 10-bit DAC
This peripheral is available in the LPC2132/34/36/38 only. The DAC enables the
LPC2132/34/36/38 to generate variable analog output.
6.9.1 Features
•
•
•
•
10-bit digital to analog converter.
Buffered output.
Power-down mode available.
Selectable speed versus power.
6.10 UARTs
The LPC2131/32/34/36/38 each contain two UARTs. In addition to standard transmit and
receive data lines, the LPC2134/36/38 UART1 also provides a full modem control
handshake interface.
6.10.1 Features
• 16 B Receive and Transmit FIFOs.
• Register locations conform to 16C550 industry standard.
• Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B
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• Built-in baud rate generator.
• Standard modem interface signals included on UART1. (LPC2134/36/38 only)
• The LPC2131/32/34/36/38 transmission FIFO control enables implementation of
software (XON/XOFF) flow control on both UARTs and hardware (CTS/RTS) flow
control on the LPC2134/36/38 UART1 only.
6.10.2 UART features available in LPC213x/01 only
• Fractional baud rate generator enables standard baud rates such as 115200 to be
achieved with any crystal frequency above 2 MHz.
• Auto-bauding.
• Auto-CTS/RTS flow-control fully implemented in hardware (LPC2134/36/38 only).
6.11 I2C-bus serial I/O controller
The LPC2131/32/34/36/38 each contain two I2C-bus controllers.
The I2C-bus is bidirectional, for inter-IC control using only two wires: a serial clock line
(SCL), and a serial data line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver or a transmitter with the
capability to both receive and send information (such as memory)). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus, it can be
controlled by more than one bus master connected to it.
This I2C-bus implementation supports bit rates up to 400 kbit/s (Fast I2C).
6.11.1 Features
•
•
•
•
•
•
Standard I2C compliant bus interface.
Easy to configure as Master, Slave, or Master/Slave.
Programmable clocks allow versatile rate control.
Bidirectional data transfer between masters and slaves.
Multi-master bus (no central master).
Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus may be used for test and diagnostic purposes.
6.12 SPI serial I/O controller
The LPC2131/32/34/36/38 each contain one SPI controller. The SPI is a full duplex serial
interface, designed to be able to handle multiple masters and slaves connected to a given
bus. Only a single master and a single slave can communicate on the interface during a
given data transfer. During a data transfer the master always sends a byte of data to the
slave, and the slave always sends a byte of data to the master.
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6.12.1 Features
•
•
•
•
Compliant with Serial Peripheral Interface (SPI) specification.
Synchronous, Serial, Full Duplex, Communication.
Combined SPI master and slave.
Maximum data bit rate of one eighth of the input clock rate.
6.13 SSP serial I/O controller
The LPC2131/32/34/36/38 each contain one Serial Synchronous Port controller (SSP).
The SSP controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can
interact with multiple masters and slaves on the bus. However, only a single master and a
single slave can communicate on the bus during a given data transfer. The SSP supports
full duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the
slave and from the slave to the master. Often only one of these data flows carries
meaningful data.
6.13.1 Features
• Compatible with Motorola SPI, 4-wire TI SSI and National Semiconductor Microwire
buses.
•
•
•
•
Synchronous Serial Communication.
Master or slave operation.
8-frame FIFOs for both transmit and receive.
Four bits to 16 bits per frame.
6.14 General purpose timers/external event counters
The Timer/Counter is designed to count cycles of the peripheral clock (PCLK) or an
externally supplied clock, and optionally generate interrupts or perform other actions at
specified timer values, based on four match registers. It also includes four capture inputs
to trap the timer value when an input signal transitions, optionally generating an interrupt.
Multiple pins can be selected to perform a single capture or match function, providing an
application with ‘or’ and ‘and’, as well as ‘broadcast’ functions among them.
At any given time only one of peripheral’s capture inputs can be selected as an external
event signal source, i.e., timer’s clock. The rate of external events that can be
successfully counted is limited to PCLK/2. In this configuration, unused capture lines can
be selected as regular timer capture inputs.
6.14.1 Features
• A 32-bit Timer/Counter with a programmable 32-bit Prescaler.
• External Event Counter or timer operation.
• Four 32-bit capture channels per timer/counter that can take a snapshot of the timer
value when an input signal transitions. A capture event may also optionally generate
an interrupt.
• Four 32-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
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– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Four external outputs per timer/counter corresponding to match registers, with the
following capabilities:
– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
6.15 Watchdog timer
The purpose of the watchdog is to reset the microcontroller within a reasonable amount of
time if it enters an erroneous state. When enabled, the watchdog will generate a system
reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined
amount of time.
6.15.1 Features
• Internally resets chip if not periodically reloaded.
• Debug mode.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
•
•
•
•
Incorrect/Incomplete feed sequence causes reset/interrupt if enabled.
Flag to indicate watchdog reset.
Programmable 32-bit timer with internal pre-scaler.
Selectable time period from (Tcy(PCLK) × 256 × 4) to (Tcy(PCLK) × 232 × 4) in multiples of
Tcy(PCLK) × 4.
6.16 Real-time clock
The Real-Time Clock (RTC) is designed to provide a set of counters to measure time
when normal or idle operating mode is selected. The RTC has been designed to use little
power, making it suitable for battery powered systems where the CPU is not running
continuously (Idle mode).
6.16.1 Features
• Measures the passage of time to maintain a calendar and clock.
• Ultra-low power design to support battery powered systems.
• Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and
Day of Year.
• Can use either the RTC dedicated 32 kHz oscillator input or clock derived from the
external crystal/oscillator input at XTAL1. Programmable Reference Clock Divider
allows fine adjustment of the RTC.
• Dedicated power supply pin can be connected to a battery or the main 3.3 V.
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6.17 Pulse width modulator
The PWM is based on the standard Timer block and inherits all of its features, although
only the PWM function is pinned out on the LPC2131/32/34/36/38. The Timer is designed
to count cycles of the peripheral clock (PCLK) and optionally generate interrupts or
perform other actions when specified timer values occur, based on seven match registers.
The PWM function is also based on match register events.
The ability to separately control rising and falling edge locations allows the PWM to be
used for more applications. For instance, multi-phase motor control typically requires
three non-overlapping PWM outputs with individual control of all three pulse widths and
positions.
Two match registers can be used to provide a single edge controlled PWM output. One
match register (MR0) controls the PWM cycle rate, by resetting the count upon match.
The other match register controls the PWM edge position. Additional single edge
controlled PWM outputs require only one match register each, since the repetition rate is
the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a
rising edge at the beginning of each PWM cycle, when an MR0 match occurs.
Three match registers can be used to provide a PWM output with both edges controlled.
Again, the MR0 match register controls the PWM cycle rate. The other match registers
control the two PWM edge positions. Additional double edge controlled PWM outputs
require only two match registers each, since the repetition rate is the same for all PWM
outputs.
With double edge controlled PWM outputs, specific match registers control the rising and
falling edge of the output. This allows both positive going PWM pulses (when the rising
edge occurs prior to the falling edge), and negative going PWM pulses (when the falling
edge occurs prior to the rising edge).
6.17.1 Features
• Seven match registers allow up to six single edge controlled or three double edge
controlled PWM outputs, or a mix of both types.
• The match registers also allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Supports single edge controlled and/or double edge controlled PWM outputs. Single
edge controlled PWM outputs all go HIGH at the beginning of each cycle unless the
output is a constant LOW. Double edge controlled PWM outputs can have either edge
occur at any position within a cycle. This allows for both positive going and negative
going pulses.
• Pulse period and width can be any number of timer counts. This allows complete
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will
occur at the same repetition rate.
• Double edge controlled PWM outputs can be programmed to be either positive going
or negative going pulses.
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• Match register updates are synchronized with pulse outputs to prevent generation of
erroneous pulses. Software must ‘release’ new match values before they can become
effective.
• May be used as a standard timer if the PWM mode is not enabled.
• A 32-bit Timer/Counter with a programmable 32-bit Prescaler.
6.18 System control
6.18.1 Crystal oscillator
On-chip integrated oscillator operates with external crystal in range of 1 MHz to 30 MHz
and with external oscillator up to 50 MHz. The oscillator output frequency is called fosc and
the ARM processor clock frequency is referred to as CCLK for purposes of rate equations,
etc. fosc and CCLK are the same value unless the PLL is running and connected. Refer to
Section 6.18.2 “PLL” for additional information.
6.18.2 PLL
The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input
frequency is multiplied up into the range of 10 MHz to 60 MHz with a Current Controlled
Oscillator (CCO). The multiplier can be an integer value from 1 to 32 (in practice, the
multiplier value cannot be higher than 6 on this family of microcontrollers due to the upper
frequency limit of the CPU). The CCO operates in the range of 156 MHz to 320 MHz, so
there is an additional divider in the loop to keep the CCO within its frequency range while
the PLL is providing the desired output frequency. The output divider may be set to divide
by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2,
it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and
bypassed following a chip reset and may be enabled by software. The program must
configure and activate the PLL, wait for the PLL to Lock, then connect to the PLL as a
clock source. The PLL settling time is 100 μs.
6.18.3 Reset and wake-up timer
Reset has two sources on the LPC2131/32/34/36/38: the RESET pin and watchdog reset.
The RESET pin is a Schmitt trigger input pin with an additional glitch filter. Assertion of
chip reset by any source starts the wake-up timer (see wake-up timer description below),
causing the internal chip reset to remain asserted until the external reset is de-asserted,
the oscillator is running, a fixed number of clocks have passed, and the on-chip flash
controller has completed its initialization.
When the internal reset is removed, the processor begins executing at address 0, which is
the reset vector. At that point, all of the processor and peripheral registers have been
initialized to predetermined values.
The wake-up timer ensures that the oscillator and other analog functions required for chip
operation are fully functional before the processor is allowed to execute instructions. This
is important at power on, all types of reset, and whenever any of the aforementioned
functions are turned off for any reason. Since the oscillator and other functions are turned
off during Power-down mode, any wake-up of the processor from Power-down mode
makes use of the wake-up timer.
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The wake-up timer monitors the crystal oscillator as the means of checking whether it is
safe to begin code execution. When power is applied to the chip, or some event caused
the chip to exit Power-down mode, some time is required for the oscillator to produce a
signal of sufficient amplitude to drive the clock logic. The amount of time depends on
many factors, including the rate of VDD ramp (in the case of power on), the type of crystal
and its electrical characteristics (if a quartz crystal is used), as well as any other external
circuitry (e.g. capacitors), and the characteristics of the oscillator itself under the existing
ambient conditions.
6.18.4 Brownout detector
The LPC2131/32/34/36/38 include 2-stage monitoring of the voltage on the VDD pins. If
this voltage falls below 2.9 V, the BOD asserts an interrupt signal to the Vectored Interrupt
Controller. This signal can be enabled for interrupt; if not, software can monitor the signal
by reading dedicated register.
The second stage of low-voltage detection asserts reset to inactivate the
LPC2131/32/34/36/38 when the voltage on the VDD pins falls below 2.6 V. This reset
prevents alteration of the flash as operation of the various elements of the chip would
otherwise become unreliable due to low voltage. The BOD circuit maintains this reset
down below 1 V, at which point the POR circuitry maintains the overall reset.
Both the 2.9 V and 2.6 V thresholds include some hysteresis. In normal operation, this
hysteresis allows the 2.9 V detection to reliably interrupt, or a regularly-executed event
loop to sense the condition.
Features available only in LPC213x/01 parts include ability to put the BOD in power-down
mode, turn it on or off and to control when the BOD will reset the LPC213x/01
microcontroller. This can be used to further reduce power consumption when a low power
mode (such as Power Down) is invoked.
6.18.5 Code security
This feature of the LPC2131/32/34/36/38 allow an application to control whether it can be
debugged or protected from observation.
If after reset on-chip bootloader detects a valid checksum in flash and reads 0x8765 4321
from address 0x1FC in flash, debugging will be disabled and thus the code in flash will be
protected from observation. Once debugging is disabled, it can be enabled only by
performing a full chip erase using the ISP.
6.18.6 External interrupt inputs
The LPC2131/32/34/36/38 include up to nine edge or level sensitive External Interrupt
Inputs as selectable pin functions. When the pins are combined, external events can be
processed as four independent interrupt signals. The External Interrupt Inputs can
optionally be used to wake up the processor from Power-down mode.
6.18.7 Memory Mapping Control
The Memory Mapping Control alters the mapping of the interrupt vectors that appear
beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the on-chip
flash memory, or to the on-chip static RAM. This allows code running in different memory
spaces to have control of the interrupts.
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6.18.8 Power Control
The LPC2131/32/34/36/38 support two reduced power modes: Idle mode and
Power-down mode.
In Idle mode, execution of instructions is suspended until either a reset or interrupt occurs.
Peripheral functions continue operation during Idle mode and may generate interrupts to
cause the processor to resume execution. Idle mode eliminates power used by the
processor itself, memory systems and related controllers, and internal buses.
In Power-down mode, the oscillator is shut down and the chip receives no internal clocks.
The processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Power-down mode and the logic levels of chip output pins remain
static. The Power-down mode can be terminated and normal operation resumed by either
a reset or certain specific interrupts that are able to function without clocks. Since all
dynamic operation of the chip is suspended, Power-down mode reduces chip power
consumption to nearly zero.
Selecting an external 32 kHz clock instead of the PCLK as a clock-source for the on-chip
RTC will enable the microcontroller to have the RTC active during Power-down mode.
Power-down current is increased with RTC active. However, it is significantly lower than in
Idle mode.
A Power Control for Peripherals feature allows individual peripherals to be turned off if
they are not needed in the application, resulting in additional power savings.
6.18.9 APB bus
The APB divider determines the relationship between the processor clock (CCLK) and the
clock used by peripheral devices (PCLK). The APB divider serves two purposes. The first
is to provide peripherals with the desired PCLK via APB bus so that they can operate at
the speed chosen for the ARM processor. In order to achieve this, the APB bus may be
slowed down to 1⁄2 to 1⁄4 of the processor clock rate. Because the APB bus must work
properly at power-up (and its timing cannot be altered if it does not work since the APB
divider control registers reside on the APB bus), the default condition at reset is for the
APB bus to run at 1⁄4 of the processor clock rate. The second purpose of the APB divider
is to allow power savings when an application does not require any peripherals to run at
the full processor rate. Because the APB divider is connected to the PLL output, the PLL
remains active (if it was running) during Idle mode.
6.19 Emulation and debugging
The LPC2131/32/34/36/38 support emulation and debugging via a JTAG serial port. A
trace port allows tracing program execution. Debugging and trace functions are
multiplexed only with GPIOs on Port 1. This means that all communication, timer and
interface peripherals residing on Port 0 are available during the development and
debugging phase as they are when the application is run in the embedded system itself.
6.19.1 EmbeddedICE
Standard ARM EmbeddedICE logic provides on-chip debug support. The debugging of
the target system requires a host computer running the debugger software and an
EmbeddedICE protocol convertor. EmbeddedICE protocol convertor converts the Remote
Debug Protocol commands to the JTAG data needed to access the ARM core.
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The ARM core has a Debug Communication Channel function built-in. The debug
communication channel allows a program running on the target to communicate with the
host debugger or another separate host without stopping the program flow or even
entering the debug state. The debug communication channel is accessed as a
co-processor 14 by the program running on the ARM7TDMI-S core. The debug
communication channel allows the JTAG port to be used for sending and receiving data
without affecting the normal program flow. The debug communication channel data and
control registers are mapped in to addresses in the EmbeddedICE logic.
6.19.2 Embedded trace
Since the LPC2131/32/34/36/38 have significant amounts of on-chip memory, it is not
possible to determine how the processor core is operating simply by observing the
external pins. The Embedded Trace Macrocell provides real-time trace capability for
deeply embedded processor cores. It outputs information about processor execution to
the trace port.
The ETM is connected directly to the ARM core and not to the main AMBA system bus. It
compresses the trace information and exports it through a narrow trace port. An external
trace port analyzer must capture the trace information under software debugger control.
Instruction trace (or PC trace) shows the flow of execution of the processor and provides a
list of all the instructions that were executed. Instruction trace is significantly compressed
by only broadcasting branch addresses as well as a set of status signals that indicate the
pipeline status on a cycle by cycle basis. Trace information generation can be controlled
by selecting the trigger resource. Trigger resources include address comparators,
counters and sequencers. Since trace information is compressed the software debugger
requires a static image of the code being executed. Self-modifying code can not be traced
because of this restriction.
6.19.3 RealMonitor
RealMonitor is a configurable software module, developed by ARM Inc., which enables
real time debug. It is a lightweight debug monitor that runs in the background while users
debug their foreground application. It communicates with the host using the DCC, which is
present in the EmbeddedICE logic. The LPC2131/32/34/36/38 contain a specific
configuration of RealMonitor software programmed into the on-chip flash memory.
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7. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
VDD
supply voltage (core and external rail)
VDDA
analog 3.3 V pad supply voltage
Vi(VBAT)
input voltage on pin VBAT
Vi(VREF)
input voltage on pin VREF
VIA
analog input voltage
on ADC related
pins
VI
input voltage
5 V tolerant I/O
pins; only valid
when the VDD
supply voltage is
present
Max
Unit
−0.5
+3.6
V
−0.5
+4.6
V
−0.5
+4.6
V
−0.5
+4.6
V
−0.5
+5.1
V
[2]
−0.5
+6.0
V
other I/O pins
[2][3]
−0.5
VDD + 0.5
V
per supply pin
[4]
-
100
mA
per ground pin
[4]
-
100
mA
[5]
−40
+125
°C
-
1.5
W
−4000
+4000
V
for the RTC
supply current
IDD
Min
ISS
ground current
Tstg
storage temperature
Ptot(pack)
total power dissipation (per package)
based on package
heat transfer, not
device power
consumption
VESD
electrostatic discharge voltage
human body model
[6]
all pins
[1]
The following applies to the Limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Including voltage on outputs in 3-state mode.
[3]
Not to exceed 4.6 V.
[4]
The peak current is limited to 25 times the corresponding maximum current.
[5]
Dependent on package type.
[6]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
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8. Static characteristics
Table 6.
Static characteristics
Tamb = −40 °C to +85 °C for commercial applications, unless otherwise specified.
Min
Typ[1]
Max
Unit
supply voltage (core and
external rail)
3.0
3.3
3.6
V
VDDA
analog 3.3 V pad supply
voltage
2.5
3.3
3.6
V
Vi(VBAT)
input voltage on pin VBAT
2.0
3.3
3.6
V
Vi(VREF)
input voltage on pin VREF
2.5
3.3
3.6
V
Symbol
Parameter
VDD
Conditions
[2]
Standard port pins, RESET, RTCK
IIL
LOW-level input current
VI = 0 V; no pull-up
-
-
3
μA
IIH
HIGH-level input current
VI = VDD; no-pull-down
-
-
3
μA
IOZ
OFF-state output current
VO = 0 V; VO = VDD; no
pull-up/down
-
-
3
μA
Ilatch
I/O latch-up current
−(0.5VDD) < VI < (1.5VDD);
Tj < 125 °C
-
-
100
mA
VI
input voltage
pin configured to provide a
digital function
0
-
5.5
V
0
-
VDD
V
[3][4][5]
[6]
VO
output voltage
output active
VIH
HIGH-level input voltage
2.0
-
-
V
VIL
LOW-level input voltage
-
-
0.8
V
Vhys
hysteresis voltage
0.4
-
-
V
VOH
HIGH-level output voltage IOH = −4 mA
[7]
VDD − 0.4
-
-
V
VOL
LOW-level output voltage
IOL = −4 mA
[7]
-
-
0.4
V
IOH
HIGH-level output current VOH = VDD − 0.4 V
[7]
−4
-
-
mA
IOL
LOW-level output current
VOL = 0.4 V
[7]
4
-
-
mA
-
-
−45
mA
IOHS
HIGH-level short-circuit
output current
VOH = 0 V
[8]
IOLS
LOW-level short-circuit
output current
VOL = VDDA
[8]
-
-
50
mA
Ipd
pull-down current
VI = 5 V
[9]
10
50
150
μA
VI = 0 V
[10]
−15
−50
−85
μA
0
0
0
μA
CCLK = 10 MHz
-
10
-
mA
CCLK = 60 MHz
-
40
-
mA
-
60
-
μA
-
200
500
μA
Ipu
pull-up current
VDD < VI < 5 V
IDD(act)
active mode supply
current
[9]
VDD = 3.3 V; Tamb = 25 °C;
code
while(1){}
executed from flash, no active
peripherals
IDD(pd)
Power-down mode supply VDD = 3.3 V; Tamb = 25 °C
current
VDD = 3.3 V; Tamb = 85 °C
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Table 6.
Static characteristics …continued
Tamb = −40 °C to +85 °C for commercial applications, unless otherwise specified.
Min
Typ[1]
Max
Unit
-
14
-
μA
VDD = 3.0 V; Vi(VBAT) = 3.0 V
-
16
-
μA
VDD = 3.3 V; Vi(VBAT) = 3.3 V
-
18
-
μA
VDD = 3.6 V; Vi(VBAT) = 3.6 V
-
20
-
μA
VDD = 3.0 V; Vi(VBAT) = 3.0 V
-
78
-
μA
VDD = 3.3 V; Vi(VBAT) = 3.3 V
-
80
-
μA
-
82
-
μA
CCLK = 6 MHz
-
21
-
μA
CCLK = 25 MHz
-
23
-
μA
CCLK = 50 MHz
-
27
-
μA
CCLK = 60 MHz
-
30
-
μA
V
Symbol
Parameter
Conditions
IBATpd
Power-down mode battery RTC clock = 32 kHz
supply current
(from RTCX pins);
Tamb = 25 °C
[11]
VDD = 3.0 V; Vi(VBAT) = 2.5 V
active mode battery
supply current
IBATact
[11]
CCLK = 60 MHz;
PCLK = 15 MHz;
PCLK enabled to RTCK;
RTC clock = 32 kHz
(from RTCX pins);
Tamb = 25 °C
VDD = 3.6 V; Vi(VBAT) = 3.6 V
IBATact(opt) optimized active mode
battery supply current
I2C-bus
PCLK disabled to RTCK in the
PCONP register;
RTC clock = 32 kHz
(from RTCX pins);
Tamb = 25 °C; Vi(VBAT) = 3.3 V
[11][12]
pins
VIH
HIGH-level input voltage
0.7VDD
-
-
VIL
LOW-level input voltage
-
-
0.3VDD
V
Vhys
hysteresis voltage
-
0.05VDD
-
V
VOL
LOW-level output voltage
[7]
-
-
0.4
V
VI = VDD
[13]
-
2
4
μA
VI = 5 V
[13]
-
10
22
μA
input leakage current
ILI
IOLS = 3 mA
Oscillator pins
Vi(XTAL1)
input voltage on pin
XTAL1
0
1.8
1.95
V
Vo(XTAL2)
output voltage on pin
XTAL2
0
1.8
1.95
V
Vi(RTCX1)
input voltage on pin
RTCX1
0
1.8
1.95
V
Vo(RTCX2)
output voltage on pin
RTCX2
0
1.8
1.95
V
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
[2]
The RTC typically fails when Vi(VBAT) drops below 1.6 V.
[3]
Including voltage on outputs in 3-state mode.
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[4]
VDD supply voltages must be present.
[5]
3-state outputs go into 3-state mode when VDD is grounded.
[6]
Please also see the errata note mentioned in the errata sheet.
[7]
Accounts for 100 mV voltage drop in all supply lines.
[8]
Only allowed for a short time period.
[9]
Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V.
[10] Applies to P1.16 to P1.25.
[11] On pin VBAT.
[12] Optimized for low battery consumption.
[13] To VSS.
9. Dynamic characteristics
Table 7.
Dynamic characteristics
Tamb = −40 °C to +85 °C for commercial applications, VDD over specified ranges.[1]
Symbol
Parameter
Conditions
Min
Typ[2]
Max
Unit
External clock
fosc
oscillator frequency
10
-
25
MHz
Tcy(clk)
clock cycle time
40
-
100
ns
tCHCX
clock HIGH time
Tcy(clk) × 0.4
-
-
ns
tCLCX
clock LOW time
Tcy(clk) × 0.4
-
-
ns
tCLCH
clock rise time
-
-
5
ns
tCHCL
clock fall time
-
-
5
ns
Port pins (except P0.2 and P0.3)
tr(o)
output rise time
-
10
-
ns
tf(o)
output fall time
-
10
-
ns
20 + 0.1 × Cb[3]
-
-
ns
I2C-bus
pins (P0.2 and P0.3)
output fall time
tf(o)
VIH to VIL
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
[3]
Bus capacitance Cb in pF, from 10 pF to 400 pF.
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9.1 Timing
tCHCL
tCHCX
tCLCH
tCLCX
Tcy(clk)
002aaa907
Fig 7. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
9.2 LPC2138 power consumption measurements
002aab404
40
(1)
(2)
(3)
(4)
(5)
IDD (mA)
30
20
10
0
0
10
20
30
40
50
60
frequency (MHz)
Test conditions: code executed from flash; all peripherals are enabled in PCONP register; PCLK = CCLK/4.
(1) VDD = 3.6 V at −60 °C (max)
(2) VDD = 3.6 V at 140 °C
(3) VDD = 3.6 V at 25 °C
(4) VDD = 3.3 V at 25 °C (typical)
(5) VDD = 3.3 V at 95 °C (typical)
Fig 8.
IDD(act) measured at different frequencies (CCLK) and temperatures
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002aab403
15
IDD (mA)
(1)
(2)
(3)
(4)
(5)
10
5
0
0
10
20
30
40
60
50
frequency (MHz)
Test conditions: Idle mode entered executing code from flash; all peripherals are enabled in PCONP register;
PCLK = CCLK/4.
(1) VDD = 3.6 V at 140 °C (max)
(2) VDD = 3.6 V at −60 °C
(3) VDD = 3.6 V at 25 °C
(4) VDD = 3.3 V at 25 °C (typical)
(5) VDD = 3.3 V at 95 °C (typical)
Fig 9.
IDD idle measured at different frequencies (CCLK) and temperatures
002aab405
500
IDD (μA)
(1)
(2)
(3)
400
(4)
300
200
100
0
−60
−20
20
60
100
temp °(C)
140
Test conditions: Power-down mode entered executing code from flash; all peripherals are enabled in PCONP register.
(1) VDD = 3.6 V
(2) VDD = 3.3 V (max)
(3) VDD = 3.0 V
(4) VDD = 3.3 V (typical)
Fig 10. IDD(pd) measured at different temperatures
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10. ADC electrical characteristics
Table 8.
ADC static characteristics
VDDA = 2.5 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified; ADC frequency 4.5 MHz.
Symbol
Parameter
VIA
analog input voltage
Cia
analog input capacitance
ED
differential linearity error
Conditions
Min
Typ
Max
Unit
0
-
VDDA
V
-
-
1
pF
[1][2][3]
-
-
±1
LSB
integral non-linearity
[1][4]
-
-
±2
LSB
offset error
[1][5]
-
-
±3
LSB
EG
gain error
[1][6]
-
-
±0.5
%
ET
absolute error
[1][7]
-
-
±4
LSB
[8]
-
-
40
kΩ
EL(adj)
EO
voltage source interface
resistance
Rvsi
[1]
Conditions: VSSA = 0 V, VDDA = 3.3 V.
[2]
The ADC is monotonic, there are no missing codes.
[3]
The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 11.
[4]
The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 11.
[5]
The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 11.
[6]
The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 11.
[7]
The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated
ADC and the ideal transfer curve. See Figure 11.
[8]
See Figure 11.
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offset
error
EO
gain
error
EG
1023
1022
1021
1020
1019
1018
(2)
7
code
out
(1)
6
5
(5)
4
(4)
3
(3)
2
1 LSB
(ideal)
1
0
1
2
3
4
5
6
7
1018
1019
1020
1021
1022
1023
1024
VIA (LSBideal)
offset error
EO
1 LSB =
Vi(VREF) − VSSA
1024
002aae604
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 11. ADC characteristics
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LPC2131/32/34/36/38
20 kΩ
ADx.y
ADx.ySAMPLE
3 pF
Rvsi
5 pF
VEXT
VSS
002aad452
Fig 12. Suggested ADC interface - LPC2131/32/34/36/38 ADx.y pin
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11. DAC electrical characteristics
Table 9.
DAC electrical characteristics
VDDA = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified
Symbol
Parameter
ED
Min
Typ
Max
Unit
differential linearity error
-
±1
-
LSB
EL(adj)
integral non-linearity
-
±1.5
-
LSB
EO
offset error
-
0.6
-
%
EG
gain error
-
0.6
-
%
CL
load capacitance
-
200
-
pF
RL
load resistance
1
-
-
kΩ
LPC2131_32_34_36_38
Product data sheet
Conditions
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12. Application information
12.1 Crystal oscillator XTAL input and component selection
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
Ci = 100 pF. To limit the input voltage to the specified range, choose an additional
capacitor to ground Cg which attenuates the input voltage by a factor Ci / (Ci + Cg). In
slave mode, a minimum of 200 mV (RMS) is needed.
LPC2xxx
XTAL1
Ci
100 pF
Cg
002aae718
Fig 13. Slave mode operation of the on-chip oscillator
In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF
(Figure 13), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This
corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.
The XTALOUT pin in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in Figure 14 and in
Table 10 and Table 11. Since the feedback resistance is integrated on chip, only a crystal
and the capacitances CX1 and CX2 need to be connected externally in case of
fundamental mode oscillation (the fundamental frequency is represented by L, CL and
RS). Capacitance CP in Figure 14 represents the parallel package capacitance and should
not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal
manufacturer.
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LPC2xxx
L
XTALIN
XTALOUT
=
CL
CP
XTAL
RS
CX2
CX1
002aaf494
Fig 14. Oscillator modes and models: oscillation mode of operation and external crystal
model used for CX1/CX2 evaluation
Table 10.
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters): low frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1/CX2
1 MHz to 5 MHz
10 pF
< 300 Ω
18 pF, 18 pF
20 pF
< 300 Ω
39 pF, 39 pF
30 pF
< 300 Ω
57 pF, 57 pF
10 pF
< 300 Ω
18 pF, 18 pF
20 pF
< 200 Ω
39 pF, 39 pF
5 MHz to 10 MHz
10 MHz to 15 MHz
15 MHz to 20 MHz
Table 11.
Product data sheet
< 100 Ω
57 pF, 57 pF
< 160 Ω
18 pF, 18 pF
20 pF
< 60 Ω
39 pF, 39 pF
10 pF
< 80 Ω
18 pF, 18 pF
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters): high frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1, CX2
15 MHz to 20 MHz
10 pF
< 180 Ω
18 pF, 18 pF
20 pF
< 100 Ω
39 pF, 39 pF
10 pF
< 160 Ω
18 pF, 18 pF
20 pF
< 80 Ω
39 pF, 39 pF
20 MHz to 25 MHz
LPC2131_32_34_36_38
30 pF
10 pF
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12.2 RTC 32 kHz oscillator component selection
LPC2xxx
L
RTCX1
RTCX2
=
CL
CP
32 kHz XTAL
RS
CX1
CX2
002aaf495
Fig 15. RTC oscillator modes and models: oscillation mode of operation and external
crystal model used for CX1/CX2 evaluation
The RTC external oscillator circuit is shown in Figure 15. Since the feedback resistance is
integrated on chip, only a crystal, the capacitances CX1 and CX2 need to be connected
externally to the microcontroller.
Table 12 gives the crystal parameters that should be used. CL is the typical load
capacitance of the crystal and is usually specified by the crystal manufacturer. The actual
CL influences oscillation frequency. When using a crystal that is manufactured for a
different load capacitance, the circuit will oscillate at a slightly different frequency
(depending on the quality of the crystal) compared to the specified one. Therefore for an
accurate time reference it is advised to use the load capacitors as specified in Table 12
that belong to a specific CL. The value of external capacitances CX1 and CX2 specified in
this table are calculated from the internal parasitic capacitances and the CL. Parasitics
from PCB and package are not taken into account.
Table 12.
Recommended values for the RTC external 32 kHz oscillator CX1/CX2 components
Crystal load capacitance Maximum crystal series
CL
resistance RS
External load capacitors CX1/CX2
11 pF
< 100 kΩ
18 pF, 18 pF
13 pF
< 100 kΩ
22 pF, 22 pF
15 pF
< 100 kΩ
27 pF, 27 pF
12.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
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13. Package outline
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
SOT314-2
c
y
X
A
48
33
49
32
ZE
e
E HE
A
A2
(A 3)
A1
wM
θ
bp
pin 1 index
64
Lp
L
17
detail X
16
1
ZD
e
v M A
wM
bp
D
B
HD
v M B
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
10.1
9.9
10.1
9.9
0.5
HD
HE
12.15 12.15
11.85 11.85
L
Lp
v
w
y
1
0.75
0.45
0.2
0.12
0.1
Z D (1) Z E (1)
1.45
1.05
1.45
1.05
θ
7o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT314-2
136E10
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
03-02-25
Fig 16. Package outline SOT314-2 (LQFP64)
LPC2131_32_34_36_38
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HVQFN64: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals;
body 9 x 9 x 0.85 mm
SOT804-2
B
D
D1
A
terminal 1
index area
A
A4
E1 E
c
A1
detail X
C
e1
e
1/2
17
y1 C
v M C A B
w M C
b
e
y
32
L
33
16
e
e2
Eh
1/2
1
terminal 1
index area
e
48
49
64
X
Dh
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A4
b
c
D
D1
Dh
E
E1
Eh
e
e1
e2
L
v
w
y
y1
mm
1
0.05
0.00
0.80
0.65
0.30
0.18
0.2
9.05
8.95
8.95
8.55
7.25
6.95
9.05
8.95
8.95
8.55
7.25
6.95
0.5
7.5
7.5
0.5
0.3
0.1
0.05
0.05
0.1
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT804-2
---
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
04-03-25
Fig 17. Package outline SOT804-2 (HVQFN64)
LPC2131_32_34_36_38
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14. Abbreviations
Table 13.
LPC2131_32_34_36_38
Product data sheet
Acronym list
Acronym
Description
A/D
Analog-to-Digital
ADC
Analog-to-Digital Converter
AHB
Advanced High-performance Bus
AMBA
Advanced Microcontroller Bus Architecture
APB
Advanced Peripheral Bus
BOD
BrownOut Detection
CPU
Central Processing Unit
DAC
Digital-to-Analog Converter
DCC
Debug Communications Channel
ETM
Embedded Trace Macrocell
FIFO
First In, First Out
GPIO
General Purpose Input/Output
JTAG
Joint Test Action Group
LSB
Least Significant Bit
PLL
Phase-Locked Loop
POR
Power-On Reset
PWM
Pulse Width Modulator
RAM
Random Access Memory
SPI
Serial Peripheral Interface
SRAM
Static Random Access Memory
SSP
Synchronous Serial Port
UART
Universal Asynchronous Receiver/Transmitter
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15. Revision history
Table 14.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
LPC2131_32_34_36_38 v.5
20110202
Product data sheet
-
LPC2131_32_34_36_38 v.4
Modifications:
•
•
Table 3 “Pin description”: Added Table note [9] to RTCX1 and RTCX2 pins.
Table 6 “Static characteristics”, I2C-bus pins: Changed typical hysteresis voltage from
0.5VDD to 0.05VDD.
•
•
•
•
Table 6 “Static characteristics”: Removed table note for VIH and VIL.
•
•
Table 6 “Static characteristics”: Changed Vi(VREF) minimum voltage from 3.0 V to 2.5 V.
•
•
Added Section 11 “DAC electrical characteristics”.
Changed all occurrences of VPB to APB.
Table 6 “Static characteristics”: Added Table note [6] to VI.
Table 6 “Static characteristics”, Standard port pins, RESET, RTCK: Vhys hysteresis
voltage (0.4 V) moved from typical to minimum.
Table 6 “Static characteristics”: Updated min, typical and max values for oscillator pins
Vi(XTAL1), Vo(XTAL2), Vi(RTCX1), and Vo(RTCX2).
Added Section 12 “Application information”.
LPC2131_32_34_36_38 v.4
20071016
Product data sheet
-
LPC2131_32_34_36_38 v.3
LPC2131_32_34_36_38 v.3
20060921
Product data sheet
-
LPC2131_32_34_36_38 v.2
LPC2131_32_34_36_38 v.2
20050318
Preliminary data sheet
-
LPC2131_2132_2138 v.1
LPC2131_2132_2138 v.1
20041118
Preliminary data sheet
-
-
LPC2131_32_34_36_38
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16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
LPC2131_32_34_36_38
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 2 February 2011
© NXP B.V. 2011. All rights reserved.
43 of 45
LPC2131/32/34/36/38
NXP Semiconductors
Single-chip 16/32-bit microcontrollers
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
LPC2131_32_34_36_38
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 2 February 2011
© NXP B.V. 2011. All rights reserved.
44 of 45
LPC2131/32/34/36/38
NXP Semiconductors
Single-chip 16/32-bit microcontrollers
18. Contents
1
2
2.1
2.2
3
3.1
4
5
5.1
5.2
6
6.1
6.2
6.3
6.4
6.5
6.5.1
6.6
6.7
6.7.1
6.7.2
6.8
6.8.1
6.8.2
6.9
6.9.1
6.10
6.10.1
6.10.2
6.11
6.11.1
6.12
6.12.1
6.13
6.13.1
6.14
6.14.1
6.15
6.15.1
6.16
6.16.1
6.17
6.17.1
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Enhancements brought by LPC213x/01
devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Key features common for LPC213x and
LPC213x/01 . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 9
Functional description . . . . . . . . . . . . . . . . . . 13
Architectural overview . . . . . . . . . . . . . . . . . . 13
On-chip flash program memory . . . . . . . . . . . 13
On-chip static RAM. . . . . . . . . . . . . . . . . . . . . 13
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 14
Interrupt controller . . . . . . . . . . . . . . . . . . . . . 15
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 15
Pin connect block . . . . . . . . . . . . . . . . . . . . . . 16
General purpose parallel I/O and Fast I/O . . . 16
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Fast I/O features available in LPC213x/01
only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
ADC features available in LPC213x/01 only. . 17
10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
UART features available in LPC213x/01 only. 18
I2C-bus serial I/O controller . . . . . . . . . . . . . . 18
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SPI serial I/O controller. . . . . . . . . . . . . . . . . . 18
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
SSP serial I/O controller . . . . . . . . . . . . . . . . . 19
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
General purpose timers/external event
counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Watchdog timer. . . . . . . . . . . . . . . . . . . . . . . . 20
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Real-time clock . . . . . . . . . . . . . . . . . . . . . . . . 20
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Pulse width modulator . . . . . . . . . . . . . . . . . . 21
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.18
6.18.1
6.18.2
6.18.3
6.18.4
6.18.5
6.18.6
6.18.7
6.18.8
6.18.9
6.19
6.19.1
6.19.2
6.19.3
7
8
9
9.1
9.2
10
11
12
12.1
12.2
12.3
13
14
15
16
16.1
16.2
16.3
16.4
17
18
System control . . . . . . . . . . . . . . . . . . . . . . . .
Crystal oscillator. . . . . . . . . . . . . . . . . . . . . . .
PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reset and wake-up timer . . . . . . . . . . . . . . . .
Brownout detector . . . . . . . . . . . . . . . . . . . . .
Code security . . . . . . . . . . . . . . . . . . . . . . . . .
External interrupt inputs . . . . . . . . . . . . . . . . .
Memory Mapping Control. . . . . . . . . . . . . . . .
Power Control . . . . . . . . . . . . . . . . . . . . . . . .
APB bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Emulation and debugging . . . . . . . . . . . . . . .
EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . .
Embedded trace. . . . . . . . . . . . . . . . . . . . . . .
RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
Static characteristics . . . . . . . . . . . . . . . . . . .
Dynamic characteristics. . . . . . . . . . . . . . . . .
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LPC2138 power consumption measurements
ADC electrical characteristics . . . . . . . . . . . .
DAC electrical characteristics . . . . . . . . . . . .
Application information . . . . . . . . . . . . . . . . .
Crystal oscillator XTAL input and component
selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RTC 32 kHz oscillator component selection .
XTAL and RTCX Printed Circuit Board (PCB)
layout guidelines . . . . . . . . . . . . . . . . . . . . . .
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
22
22
22
22
23
23
23
23
24
24
24
24
25
25
26
27
29
30
30
32
35
36
36
38
38
39
41
42
43
43
43
43
44
44
45
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 2 February 2011
Document identifier: LPC2131_32_34_36_38