Marktech C527RT290-0101 Razerthin led Datasheet

RazerThin® LEDs
CxxxRT290-S0100
Cree’s RazerThin LEDs are a new generation of solid-state LED emitters that combine highly efficient InGaN materials
with Cree’s proprietary G•SiC® substrate to deliver superior price/performance for high-intensity blue and green
LEDs. These vertically structured LED chips are approximately 95 microns in height and require a low forward
voltage. Cree’s RazerThin series chips have the ability to withstand 1000V ESD. Applications for RazerThin LEDs
include next-generation keypad backlighting where sub-miniaturization and thinner form factors are required.
FEATURES
APPLICATIONS
•
Thin 95 μm Chip
•
Reduced Forward Voltage
–
White LEDs
–
2.9V Typical at 5 mA
–
Blue LEDs
RazerThin LED Performance
–
Green LEDs
•
•
–
460nm - 3.8-11.1 mW
–
470nm - 3.4-10.4 mW
–
527nm - 1.7-6.0 mW
•
Single Wire Bond Structure
•
Class 2 ESD Rating
Mobile Phone Key Pads
•
Cellular Phone LCD Backlighting
•
Digital Camera Flash for Mobile Appliance
•
Automotive Dashboard Lighting
•
LED Video Displays
•
Audio Product Display Lighting
CxxxRT290-S0100 Chip Diagram
R3BU, Rev. D
Datasheet: CP
Top View
Bottom View
Die Cross Section
G•SiC LED Chip
270 x 270 μm
Mesa (junction)
246 x 246 μm
Gold Bond Pad
110 μm Diameter
Subject to change without notice.
www.cree.com
InGaN
Anode (+)
SiC Substrate
h = 95 μm
Backside
Metallization
Cathode (-)
Maximum Ratings at TA = 25°C Notes 1&3
CxxxRT290-S0100
DC Forward Current
30 mA
Peak Forward Current (1/10 duty cycle @ 1kHz)
100 mA
LED Junction Temperature
125°C
Reverse Voltage
5V
Operating Temperature Range
-40°C to +100°C
Storage Temperature Range
-40°C to +100°C
Electrostatic Discharge Threshold (HBM)
1000 V
Electrostatic Discharge Classification (MIL-STD-883E)Note 2
Class 2
Note 2
Typical Electrical/Optical Characteristics at TA = 25°C, If = 5mA
Part Number
Note 3
Reverse Current
[I(Vr=5V), μA]
Forward Voltage (Vf, V)
Min.
Typ.
Max.
Max.
C460RT290-S0100
2.7
2.9
3.1
1
C470RT290-S0100
2.7
2.9
3.1
1
C527RT290-S0100
2.6
2.9
3.2
1
Mechanical Specifications
Description
CxxxRT290-S0100
Dimension
Tolerance
P-N Junction Area (μm)
246 x 246
± 25
Top Area (μm)
270 x 270
± 25
Bottom Area (μm)
270 x 270
± 25
95
± 15
Chip Thickness (μm)
Au Bond Pad Diameter (μm)
110
± 20
Au Bond Pad Thickness (μm)
1.2
± 0.5
Back Contact Metal Width (μm)
20
± 10
Notes:
1.
2.
3.
4.
Maximum ratings are package dependent. The above ratings were determined using a T-1 3/4 package (with Hysol OS4000 epoxy)
for characterization. Seller makes no representations regarding ratings for packages other than the T-1 3/4 package used by Seller.
The forward currents (DC and Peak) are not limited by the G•SiC die but by the effect of the LED junction temperature on the
package. The junction temperature limit of 125°C is a limit of the T-1 3/4 package; junction temperature should be characterized
in a specific package to determine limitations. Assembly processing temperature must not exceed 325°C (< 5 seconds).
Product resistance to electrostatic discharge (ESD) is measured by simulating ESD using a rapid avalanche energy test (RAET).
The RAET procedures are designed to approximate the maximum ESD ratings shown. Seller gives no other assurances regarding
the ability of Products to withstand ESD.
All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled
and operated at 5 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given are
the average values expected by Seller in large quantities and are provided for information only. Seller gives no assurances products
shipped will exhibit such typical ratings. All measurements were made using lamps in T-1 3/4 packages (with Hysol OS4000
epoxy). Dominant wavelength measurements taken using Illuminance E.
For reference only, typical Vf for C460, C470, and C527 is 3.2 V and at 20 mA.
Copyright © 2003-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree,
the Cree logo, G•SiC and RazerThin are registered trademarks of Cree, Inc.
CPR3BU Rev. D
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com
Standard Bins for RT290
All LED chips are sorted onto die sheets according to the bins shown below. All radiant flux values shown and specified
are at If = 20 mA (see Note 1) and all dominant wavelength values shown and specified are at If = 5 mA (see Note
2).
C460RT290-S0100
Radiant Flux
11.1 mW
7.2 mW
C460RT290-0105
C460RT290-0106
C460RT290-0107
C460RT290-0108
C460RT290-0101
C460RT290-0102
C460RT290-0103
C460RT290-0104
3.8 mW
455 nm
457.5 nm
460 nm
Dominant Wavelength
C470RT290-0105
C470RT290-0106
C470RT290-0107
C470RT290-0108
C470RT290-0101
C470RT290-0102
C470RT290-0103
C470RT290-0104
3.4 mW
465 nm
Radiant Flux
Radiant Flux
465 nm
C470RT290-S0100
10.4 mW
6.7 mW
462.5 nm
467.5 nm
470 nm
Dominant Wavelength
475 nm
C527RT290-S0100
6.0 mW
3.5 mW
472.5 nm
C527RT290-0104
C527RT290-0105
C527RT290-0106
C527RT290-0101
C527RT290-0102
C527RT290-0103
1.7 mW
520 nm
525 nm
530 nm
535 nm
Dominant Wavelength
Notes:
1.
2.
3.
For reference only, radiant flux values at If = 5 mA are typically 29% and 32% of the corresponding radiant flux at If = 20 mA for
455-475 nm range and 520-535 nm range, respectively.
For reference only, wavelength values at If = 20 mA are typically 2 nm less and 7 nm less than the corresponding wavelength
values at If = 5 mA for 455-475 nm range and 520-535 nm range, respectively.
Sorted die dits may contain any or all of the bins shown above, respectively.
Copyright © 2003-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree,
the Cree logo, G•SiC and RazerThin are registered trademarks of Cree, Inc.
CPR3BU Rev. D
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com
Characteristic Curves
These are representative measurements for the RazerThin products. Actual curves will vary slightly for the various
radiant flux and dominant wavelength bins.
Wavelength Shift vs Forward Current
Forward Current vs Forward Voltage
10.00
30
8.00
25
6.00
4.00
2.00
Shift (nm)
If (mA)
20
15
0.00
-2.00
-4.00
10
-6.00
527nm
-8.00
5
470nm
-10.00
-12.00
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0
5.0
5
10
15
20
25
30
If (mA)
Volts
Relative Intensity vs Wavelength - All Products
Relative Intensity vs Forward Current
100%
140
120
80%
Relative Intensity (%)
% Intensity
100
80
60
40
60%
40%
470 nm
527 nm
20%
20
0
0%
0
5
10
15
20
25
30
If (mA)
Copyright © 2003-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree,
the Cree logo, G•SiC and RazerThin are registered trademarks of Cree, Inc.
CPR3BU Rev. D
500
Wavelength (nm)
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com
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