STMicroelectronics HCF4510 Presettable up/down counter Datasheet

HCF4510B
HCF4516B

PRESETTABLE UP/DOWN COUNTERS
MEDIUM SPEED OPERATION fCL = 8MHz
TYP. AT 10V
■ SYNCHRONOUS INTERNAL CARRY
PROPAGATION
■ RESET AND PRESET CAPABILITY
■ QUIESCENT CURRENT SPECIFIED TO 15V
■ 5V, 10V, AND 15V PARAMETRIC RATINGS
■ INPUT CURRENT OF 100nAAT 15V AND 25°C
■ 100% TESTED FOR QUIESCENT CURRENT
MEETS ALL REQUIREMENTS OF JEDEC
TENTATIVE STANDARD No. 13A, ”STANDARD
SPECIFICATIONS FOR DESCRIPTION OF ”B”
SERIES CMOS DEVICES”
■
DESCRIPTION
The HCF4510B and HCF4516B are monolithic
integrated circuits available in 16-lead dual in-line
plastic and plastic micro package. The
HCF4510B Presettable BCD Up/Down Counter
and the HCF4516B Presettable Binary Up/Down
Counter consist of four synchronously clocked
D-type flip-flops (with a gating structure to provide
T-type flip-flop capability) connected as counters.
These counters can be cleared by a high level on
the RESET line, and can be preset to any binary
number present on the jam inputs by a high level
on the PRESET ENABLE line. The HCF4510B
will count out of non-BCD counter states in a
maximum of two clock pulses in the up mode,
DIP
SOP
ORDER CODES
PACKAGE
TUBE
DIP
HCF45XXBEY
SOP
HCF45XXBM1
T& R
HCF45XXM013TR
and a maximum of four clock pulses in the down
mode. If the CARRY-IN input is held low, the
counter advances up or down on each
positive-going clock transition. Synchronous
cascading is accomplished by connecting all
clock inputs in parallel and connecting the
CARRY-OUT of a less significant stage to the
CARRY-IN of a more significant stage. The
HCF4510B and HCF4516B can be loaded in the
ripple mode by connecting the CARRY-OUT to
the clock of the next stage. If the UP/DOWN input
changes during a terminal count, the
CARRY-OUT must be gated with the clock, and
the UP/DOWN input must change while the clock
is high. This method provides a clean clock signal
to the subsequent counting stage.
PIN CONNECTION
March 2000
1/12
HCF4510B/4515B
FUNCTIONAL DIAGRAM
TRUTH TABLE
CL
CI
U/D
PE
R
Actio n
X
1
X
0
0
No Count
0
1
0
0
Count Up
0
0
0
0
Count Down
X
X
X
1
0
Preset
X
X
X
X
1
Reset
X= Don’t care
ABSOLUTE MAXIMUM RATING
Symbol
VDD *
Parameter
Supply Voltage
Value
Unit
-0.5 to +18
V
Vi
Input Voltage
-0.5 to VDD + 0.5
V
II
DC Input Current (any one input)
± 10
mA
Ptot
Total Power Dissipation (per package)
Dissipation per Output Transistor
for Top = Full Package Temperature Range
200
mW
100
mW
Top
Operating Temperature
Tstg
Storage Temperature
-40 to +85
o
-65 to +150
o
C
C
Stresses above those listedunder ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional
operation ofthe device atthese or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to
absolute maximum ratingconditions for external periods may affect device reliability.
* Allvoltage values are referred to VSS pin voltage.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Value
Unit
Supply Voltage
3 to 15
V
VI
Input Voltage
0 to VDD
V
Top
Operating Temperature
VDD
2/12
-40 to +85
o
C
HCF4510B/4516B
LOGIC DIAGRAMS
4510B
4516B
3/12
HCF4510B/4515B
TIMING DIAGRAMS
4510B
4516B
4/12
HCF4510B/4516B
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Symb ol
Parameter
T est Cond it ios
VI
(V)
IL
VOH
VOL
Quiescent Current
Output High
Voltage
Output Low
Voltage
VO
(V)
VIL
IOH
0/5
5
20
0.02
20
150
10
40
0.02
40
300
0/15
15
80
0.02
80
600
0/5
<1
5
4.95
4.95
4.95
0/10
<1
10
9.95
9.95
9.95
0/15
<1
15
14.95
14.95
14.95
5/0
<1
5
0.05
0.05
0.05
<1
10
0.05
0.05
0.05
IOL
IIH, IIL
CI
Input Low
Voltage
Output Sink Current
Input Leakage
Current
Input Capacitance
0.05
0.05
<1
15
0.5/4.5
<1
5
3.5
3.5
3.5
1/9
<1
10
7
7
7
1.5/13.5
<1
15
11
4.5/0.5
<1
5
1.5
1.5
1.5
9/1
<1
10
3
3
3
13.5/1.5
<1
15
11
4
4
-1.53
-1.36
-3.2
-1.1
0/5
4.6
5
-0.52
-0.44
-1
-0.36
0/10
9.5
10
-1.3
-1.1
-2.6
-0.9
0/15
13.5
15
-3.6
-3.0
-6.8
-2.4
0/5
0.4
5
0.52
0.44
1
0.36
0/10
0.5
10
1.3
1.1
2.6
0.9
0/15
1.5
15
3.6
3.0
6.8
2.4
0/15
Any
Input
±10
5
-5
±0.3
7.5
V
4
5
Any Input
V
11
2.5
±0.3
V
0.05
0/5
15
µA
V
10/0
Input High
Voltage
Output Drive
Current
Un it
0/10
15/0
VIH
Valu e
|IO | V DD
-40 oC
25 o C
85 o C
(µA) (V) Min. Max. Min. T yp. Max. Min . Max.
mA
mA
±1
µA
pF
TheNoise Margin for both ”1” and ”0” level is: 1V min.withV DD = 5 V, 2 V min.with VDD = 10 V, 2.5 V min. with VDD = 15 V
5/12
HCF4510B/4515B
DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb = 25 oC, CL = 50 pF, RL = 200 KΩ,
typical temperaturecoefficent for all VDD values is 03 %/oC, all input rise and fall times= 20 ns)
Symb ol
Parameter
tPHL
tPLH
Propagation Delay Time Clock to Q Output
tPHL
tPLH
Propagation Delay Time Preset or Reset to
Q Output
tPHL
tPLH
Propagation Delay Time Clock to Carry Out
tPHL
tPLH
Propagation Delay Time Carry In to Carry
Out
tPHL
tPLH
Propagation Delay Time Preset or Reset to
Carry Out
tTHL
tTLH
Transition Time
fMAX
Max Clock Frequency
tW
Clock Pulse Width
Preset Enable or Reset Removal Time (1)
tr, tf
Clock Rise and Fall Time (2)
tsetup
Carry In Setup Time
tsetup
tW
Up Down Setup Time
Preset Enable or Reset Pulse Width
T est Cond ition s
V DD
(V)
5
10
15
5
10
Min.
Value
Typ. Max.
Un it
200
100
75
210
105
400
200
150
420
210
15
5
10
15
5
10
15
80
240
120
90
125
60
50
160
480
240
180
250
120
100
5
10
320
160
640
320
ns
15
5
10
15
5
10
15
125
100
50
40
4
8
11
250
200
100
80
ns
2
4
5.5
5
10
15
5
10
15
5
10
15
150
75
60
150
80
60
5
10
15
5
10
15
5
130
60
45
360
160
110
220
10
15
100
75
ns
ns
ns
ns
MHz
ns
ns
15
5
5
µs
ns
ns
ns
(1) Timerequired after the falling edge of the reset or preset enable inuts before the rising edge ofthe clock will trigger the counter (similar to setup time).
(2) Ifmore than unit is cascated in the parallel clocked application, trCL should be made less than or equal to the sum of the fixed propagation delay at
15pF and the transition timeof the carry output driving stage ofthe estimated capacitive load.
6/12
HCF4510B/4516B
Typical Output Low (sink) Current
Characteristics.
Minimum Output Low (sink) Current
Characteristics.
Typical Output High (source) Current
Characteristics.
Minimum Output High (source) Current
Characteristics.
Typical Propagation Delay Time vs. Load
Capacitance for Clock to Q Output.
Typical Maximum Clock Input Frequency vs.
Supply Voltage.
7/12
HCF4510B/4515B
Typical Transition Time vs. Load Capacitance.
Typical Dynamic Power Dissipation vs.
Frequency.
TYPICAL APPLICATIONS
TYPICAL 16-CHANNEL, 10 BIT DATA ACQUISITION SYSTEM
Thisacquisition system can be operated in the random access mode by jamming in the channel number at the present inputs, or in the sequential mode
by clocking the HCF4516B.
8/12
HCF4510B/4516B
CASCADING COUNTER PACKAGES
TEST CIRCUITS
Quiescent Device Current.
Noise Immunity.
Input Leakage Current.
Power Dissipation and Input Waveform.
9/12
HCF4510B/4515B
Plastic DIP-16 (0.25) MECHANICAL DATA
mm
DIM.
MIN.
a1
0.51
B
0.77
TYP.
inch
MAX.
MIN.
TYP.
MAX.
0.020
1.65
0.030
0.065
b
0.5
0.020
b1
0.25
0.010
D
20
0.787
E
8.5
0.335
e
2.54
0.100
e3
17.78
0.700
F
7.1
0.280
I
5.1
0.201
L
Z
3.3
0.130
1.27
0.050
P001C
10/12
HCF4510B/4516B
SO-16 MECHANICAL DATA
mm
DIM.
MIN.
TYP.
A
a1
inch
MAX.
MIN.
TYP.
1.75
0.1
0.068
0.2
a2
MAX.
0.004
0.007
1.65
0.064
b
0.35
0.46
0.013
0.018
b1
0.19
0.25
0.007
0.010
C
0.5
0.019
c1
45 (typ.)
D
9.8
10
0.385
0.393
E
5.8
6.2
0.228
0.244
e
1.27
e3
0.050
8.89
0.350
F
3.8
4.0
0.149
0.157
G
4.6
5.3
0.181
0.208
L
0.5
1.27
0.019
0.050
M
S
0.62
0.024
8 (max.)
P013H
11/12
HCF4510B/4515B
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems withoutexpress written approval of STMicroelectronics.
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12/12
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