INDEX MX23C3210 32M-BIT MASK ROM (8/16-BIT OUTPUT) FEATURES ORDER INFORMATION • Bit organization - 4M x 8 (byte mode) - 2M x 16 (word mode) • Fast access time - Random access: 100ns (max.) • Current - Operating:60mA - Standby:100uA • Supply voltage - 5V±10% • Package - 44 pin SOP (500mil) - 48 pin TSOP (20mm x 12mm) - 42 pin DIP (600 mil) (word mode) PIN CONFIGURATION 44 SOP 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 A20 A19 A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE VSS D15/A1 D7 D14 D6 D13 D5 D12 D4 VCC A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE/CE VSS OE/OE D0 D8 D1 D9 D2 D10 D3 D11 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 MX23C3210 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 MX23C3210 NC A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE/CE VSS OE/OE D0 D8 D1 D9 D2 D10 D3 D11 42 DIP (For Word Mode Only) 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 A19 A8 A9 A10 A11 A12 A13 A14 A15 A16 A20 VSS D15 D7 D14 D6 D13 D5 D12 D4 VCC Part No. MX23C3210MC-10 MX23C3210MC-12 MX23C3210MC-15 MX23C3210TC-10 MX23C3210TC-12 MX23C3210TC-15 MX23C3210RC-10 Access Time 100ns 120ns 150ns 100ns 120ns 150ns 100ns MX23C3210RC-12 120ns MX23C3210RC-15 150ns MX23C3210PC-10 MX23C3210PC-12 MX23C3210PC-15 100ns 120ns 150ns Package 44 pin SOP 44 pin SOP 44 pin SOP 48 pin TSOP 48 pin TSOP 48 pin TSOP 48 pin TSOP (Reverse type) 48 pin TSOP (Reverse type) 48 pin TSOP (Reverse type) 42 pin DIP 42 pin DIP 42 pin DIP PIN DESCRIPTION Symbol A0~A20 D0~D14 D15/A-1 CE/CE OEOE Byte VCC VSS NC Pin Function Address Inputs Data Outputs D15 (Word Mode)/ LSB Address (Byte Mode) Chip Enable Input Output Enable Input Word/ Byte Mode Selection Power Supply Pin Ground Pin No Connection MODE SELECTION CE/CE OE/OE Byte D15/A-1 D0~D7 D8~D15 Mode Power L/H X X X High Z High Z - Stand-by H/L L/H X X High Z High Z - Active H/L H/L H Output D0~D7 D8~D15 Word Active H/L H/L L Input D0~D7 High Z Byte Active P/N:PM0247 REV. 2.8, FEB. 01, 1999 1 INDEX MX23C3210 48 TSOP (Normal Type) BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 A19 VSS A20 A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE/CE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 TSOP (Reverse Type) MX23C3210 (Normal Type) 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS VSS D15/A-1 D7 D14 D6 D13 D5 D12 D4 VCC VCC NC D11 D3 D10 D2 D9 D1 D8 D0 OE/OE VSS VSS VSS VSS D15/A-1 D7 D14 D6 D13 D5 D12 D4 VCC VCC NC D11 D3 D10 D2 D9 D1 D8 D0 OE/OE VSS VSS 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MX23C3210 (Reverse Tpye) BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 A19 VSS A20 A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE/CE BLOCK DIAGRAM A0/(A-1) Address Buffer Memory Array Sense Amplifier Word/ Byte Output Buffer A20 D0 D15/(D7) CE BYTE OE ABSOLUTE MAXIMUM RATINGS Item Voltage on any Pin Relative to VSS Ambient Operating Temperature Storage Temperature Symbol VIN Topr Tstg P/N:PM0247 Ratings -0.5V to 7.0V 0°C to 70°C -65°C to 125°C REV. 2.8, FEB. 01, 1999 2 INDEX MX23C3210 DC CHARACTERISTICS (Ta = 0°C ~ 70°C, VCC = 5V±10%) Item Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current Operating Current Standby Current (TTL) Standby Current (cmos) Input Capacitance Output Capacitance Symbol VOH VOL VIH VIL ILI ILO ICC1 ISTB1 ISTB2 CIN COUT MIN. 2.4V 2.2V -0.3V - MAX. 0.4V VCC+0.3V 0.8V 5uA 5uA 60mA 1mA 100uA 10pF 10pF Conditions IOH = -1.0mA IOL = 2.1mA 0V, VCC 0V, VCC tRC = 100ns, all output open CE = VIH CE>VCC-0.2V Ta = 25°C, f = 1MHZ Ta = 25°C, f = 1MHZ AC CHARACTERISTICS (Ta = 0°C ~ 70°C, VCC = 5V±10%) Item Symbol Read Cycle Time Address Access Time Chip Enable Access Time Output Enable Time Output Hold After Address Output High Z Delay tRC tAA tACE tOE tOH tHZ 23C3210-10 MIN. MAX. 100ns 100ns 100ns 50ns 0ns 20ns 23C3210-12 MIN. MAX. 120ns 120ns 120ns 60ns 0ns 20ns 23C3210-15 MIN. MAX. 150ns 150ns 150ns 70ns 0ns 20ns Note:Output high-impedance delay (tHZ) is measured from OE going high, and this parameter guaranteed by design over the full voltage and temperature operating range - not tested. P/N:PM0247 REV. 2.8, FEB. 01, 1999 3 INDEX MX23C3210 AC Test Conditions Input Pulse Levels Input Rise and Fall Times Input Timing Level Output Timing Level Output Load 0.4V~2.4V 10ns 1.5V 0.8V and 2.0V See Figure IOH (load)=-1mA DOUT IOL (load)=2.1mA C<100pF Note:No output loading is present in tester load board. Active loading is used and under software programming control. Output loading capacitance includes load board's and all stray capacitance. TIMING DIAGRAM RANDOM READ ADD ADD ADD ADD tRC tACE CE OE tOE tAA DATA tOH VALLID VALLID P/N:PM0247 tHZ VALLID REV. 2.8, FEB. 01, 1999 4 INDEX MX23C3210 PACKAGE INFORMATION 42-PIN PLASTIC DIP(600 mil) ITEM MILLIMETERS INCHES A 52.54 max. 2.070 max. B 0.76 [REF] .030 [REF] C 2.54 [TP] .100 [TP] D .46 [Typ.] .018 [Typ.] E 50.76 2.000 F 1.27 [Typ.] .050 [Typ.] G 3.30 ± . 25 .130 ± .010 H .51 [REF] .020 [REF] I 3.94 ± . 25 .155 ± .010 J 5.33 max. .210 max. K 15.22 ± .25 .600 ± .010 L 13.97± .25 .550 ± .010 M .25 [Typ.] .010 [Typ.] NOTE: 42 22 1 21 A K L I J H F D B C Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. G 0~15¡ M E 44-PIN PLASTIC SOP ITEM MILLIMETERS INCHES A 28.70 max. 1.130 max. B 1.10 [REF] .043 [REF] C 1.27 [TP] .050 [TP] D .40 ± .10 [Typ.] .016 ± .004 [Typ.] E .010 min. .004 min. F 3.00 max. .118 max. G 2.80 ± .13 .110 ± .005 H 16.04 ± .30 .631 ± .012 I 12.60 .496 J 1.72 .068 K .15 ± .10 [Typ.] .006 ± .004 [Typ.] L .80 ± .20 .031 ± .008 44 23 1 22 H A I G J F K E D C B L NOTE: Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. P/N:PM0247 REV. 2.8, FEB. 01, 1999 5 INDEX MX23C3210 48-PIN PLASTIC TSOP ITEM MILLIMETERS INCHES A 20.0 ± .20 .787 ± .008 B 18.40 ± .10 .724 ± .004 C 12.20 max. .480 max. D 0.15 [Typ.] .006 [Typ.] E .80 [Typ.] .031 [Typ.] F .20 ± .10 .008 ±.004 G .30 ± .10 .012 ± .004 H .50 [Typ.] .020 [Typ.] I .45 max. .018 max. J 0 ~ .20 0 ~ .008 K 1.00 ± .10 .039 ± .004 L 1.27 max. .050 max. M .50 .020 N 0 ~ 5° .500 A NOTE: B C N M K L D E F G H I J Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. P/N:PM0247 REV. 2.8, FEB. 01, 1999 6 INDEX MX23C3210 REVISION HISTORY Revision 2.6 2.7 2.8 Description Page DC Characteristics: The input leakage current (ILI) is changed as 5uA instead of 10uA. The output leakage current (ILO) is changed as 5uA instead 10uA. The power down supply current (ISTB2) is changed as 100uA instead of 5uA. AC Characteristics: Added 100ns grade item, deleted 200ns grade item. The output enable time (tOE) is changed as 60ns instead of 70ns in 120ns grade item, and 70ns instead of 80ns grade item. The output high Z delay is changed as 20ns instead of 70ns. AC Characteristics: tOH 10ns --> 0ns P3 P/N:PM0247 Date MAR/25/1998 FEB/01/1999 REV. 2.8, FEB. 01, 1999 7 INDEX MX23C3210 MACRONIX INTERNATIONAL CO., LTD. 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