Cypress BCM20705A1KWFBGT Single-chip bluetooth transceiver and baseband processor Datasheet

The following document contains information on Cypress products. Although the document is marked with the name
“Broadcom”, the company that originally developed the specification, Cypress will continue to offer these products to
new and existing customers.
CONTINUITY OF SPECIFICATIONS
There is no change to this document as a result of offering the device as a Cypress product. Any changes that have
been made are the result of normal document improvements and are noted in the document history page, where
supported. Future revisions will occur when appropriate, and changes will be noted in a document history page.
CONTINUITY OF ORDERING PART NUMBERS
Cypress continues to support existing part numbers. To order these products, please use only the Cypress Ordering
Part Number listed in the table.
Broadcom Ordering Part Number
BCM20705B0KWFBGT
BCM20705B0KWFBG
BCM20705A1KWFBG
BCM20705A1KWFBGT
Cypress Ordering Part Number
CYW20705B0KWFBGT
CYW20705B0KWFBG
CYW20705A1KWFBG
CYW20705A1KWFBGT
FOR MORE INFORMATION
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Cypress products and services.
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Cypress Semiconductor Corporation
Document Number: 002-14867 Rev. *D
198 Champion Court
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408-943-2600
Revised October 17, 2016
Data Sheet
BCM20705
Single-Chip Bluetooth Transceiver and Baseband Processor
GE NE R AL DE S C RI PT ION
F E A T U RE S
The Broadcom® BCM20705 is a monolithic, singlechip, Bluetooth 4.1 compliant, stand-alone baseband
processor with an integrated 2.4 GHz transceiver.
Manufactured using the industry's most advanced
65 nm CMOS low-power process, the BCM20705
employs the highest level of integration, eliminating
all critical external components, and thereby
minimizing the device’s footprint and costs associated
with the implementation of Bluetooth solutions.
• Bluetooth 4.1 + EDR compliant
• Class 1 capable with built-in PA
• Programmable output power control meets Class
1, Class 2, or Class 3 requirements
• Use supply voltages up to 5.5V
• Supports Broadcom SmartAudio™, wide-band
speech, SBC codec, and packet loss
concealment.
• Fractional-N synthesizer supports frequency
references from 12 MHz to 52 MHz
• Automatic frequency detection for standard
crystal and TCXO values when an external
32.768 kHz reference clock is provided.
• Ultra-low power consumption
• Supports serial flash interfaces
• Available in a 50-ball FPBGA package.
• ARM7TDMI-S™–based microprocessor with
integrated ROM and RAM
• Supports mobile and PC applications without
external memory
• A USB hub
A P P L IC AT IO N S
The BCM20705 is the optimal solution for voice and
data applications that require a Bluetooth SIG
standard Host Controller Interface (HCI) via USB,
UART H4 or H5, and PCM audio interface support.
The BCM20705 radio transceiver’s enhanced radio
performance meets the most stringent industrial
temperature application requirements for compact
integration into mobile handset and portable devices.
The BCM20705 is fully compatible with all standard
TCXO frequencies and provides full radio
compatibility, enabling it to operate simultaneously
with GPS and cellular radios.
• Desktop and laptop personal computers
• Computer peripheral devices (PCMCIA cards, CF
cards, and USB dongles)
• Personal digital assistants
• Automotive telematic systems
Figure 1: System Block Diagram
PCM/I2C
BCM20705
USB
UART/SPI
GPIO
High-Speed Peripheral
Transport Unit (PTU)
Radio Transceiver
Microprocessor and
Memory Unit (uPU)
Bluetooth Baseband
Core (BBC)
SPI Master
BSC
TCXO
LPO
MCS20705-DS104-R
5300 California Avenue • Irvine, CA 92617 • Phone: 949-926-5000 • Fax: 949-926-5203
November 13, 2014
Revision History
Revision
Date
Change
MCS20705-DS104-R
11/13/14
MCS20705-DS103-R
03/04/14
MCS20705-DS102-R
2/25/13
MCS20705-DS101-R
08/09/12
MCS20705-DS100-R
10/11/11
Updated:
• Bluetooth compatibility from 4.0 to 4.1
Updated:
• Drive strength in Table 24 on page 68
Updated:
• “Host Controller Power Management” on page 22
• “HCI 3-Wire Transport (UART H5)” on page 36
Updated:
• Table 1: “Power Control Pin Summary,” on page 32
• “Major Features” on page 18
• Section 3: “Bluetooth Baseband Core,” on page 28
• “Bluetooth 3.04.0 + EDR Features” on page 29Table 1: “Power
Control Pin Summary,” on page 32
• “BBC Power Management” on page 33
• “Serial Enhanced Coexistence Interface” on page 34
• Section 4: Microprocessor Unit, “Overview” on page 36
• Table 2: “OTP Programming Supply Voltage Requirements,” on page
39
• “TCXO Clock Request Support” on page 51
• Table 10: “BCM20702BCM20705 Signal Descriptions,” on page 57
• Table 21: “Pad I/O Characteristics,” on page 65
• “Startup Timing” on page 73
• Section 11: “Ordering Information,” on page 92
Initial release.
Broadcom Corporation
5300 California Avenue
Irvine, CA 92617
© 2014 by Broadcom Corporation
All rights reserved
Printed in the U.S.A.
Broadcom®, the pulse logo, Connecting everything®, and the Connecting everything logo are among the
trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the
EU. Any other trademarks or trade names mentioned are the property of their respective owners.
This data sheet (including, without limitation, the Broadcom component(s) identified herein) is not designed,
intended, or certified for use in any military, nuclear, medical, mass transportation, aviation, navigations,
pollution control, hazardous substances management, or other high-risk application. BROADCOM PROVIDES
THIS DATA SHEET “AS-IS,” WITHOUT WARRANTY OF ANY KIND. BROADCOM DISCLAIMS ALL
WARRANTIES, EXPRESSED AND IMPLIED, INCLUDING, WITHOUT LIMITATION, THE IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NONINFRINGEMENT.
BCM20705 Data Sheet
Table of Contents
Table of Contents
About This Document .................................................................................................................................. 8
Purpose and Audience ............................................................................................................................ 8
Acronyms and Abbreviations................................................................................................................... 8
Document Conventions ........................................................................................................................... 8
Technical Support ........................................................................................................................................ 8
Section 1: Overview ............................................................................................................ 9
Major Features .............................................................................................................................................. 9
Block Diagram ............................................................................................................................................ 11
Usage Model ............................................................................................................................................... 12
PC Product Usage Model...................................................................................................................... 12
Section 2: Integrated Radio Transceiver......................................................................... 13
Transmitter Path ......................................................................................................................................... 13
Digital Modulator ................................................................................................................................... 13
Power Amplifier ..................................................................................................................................... 13
Receiver Path.............................................................................................................................................. 14
Digital Demodulator and Bit Synchronizer............................................................................................. 14
Receiver Signal Strength Indicator........................................................................................................ 14
Local Oscillator Generation....................................................................................................................... 14
Calibration................................................................................................................................................... 14
Internal LDO ................................................................................................................................................ 15
Section 3: Bluetooth Baseband Core .............................................................................. 16
Transmit and Receive Functions .............................................................................................................. 16
Bluetooth 4.1 + EDR Features ................................................................................................................... 17
Frequency Hopping Generator.................................................................................................................. 17
Link Control Layer...................................................................................................................................... 17
Test Mode Support ..................................................................................................................................... 18
Power Management Unit............................................................................................................................ 19
RF Power Management ........................................................................................................................ 19
Host Controller Power Management ..................................................................................................... 19
BBC Power Management...................................................................................................................... 21
Backdrive Protection ...................................................................................................................... 21
Adaptive Frequency Hopping.................................................................................................................... 22
Collaborative Coexistence......................................................................................................................... 22
Serial Enhanced Coexistence Interface ................................................................................................... 22
SECI Advantages .................................................................................................................................. 23
SECI I/O ................................................................................................................................................ 23
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
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BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Table of Contents
Section 4: Microprocessor Unit ....................................................................................... 24
Overview...................................................................................................................................................... 24
NVRAM Configuration Data and Storage ................................................................................................. 25
Serial Interface ...................................................................................................................................... 25
EEPROM ...................................................................................................................................................... 25
External Reset............................................................................................................................................. 25
One-Time Programmable Memory ............................................................................................................ 26
Contents ................................................................................................................................................ 27
Programming......................................................................................................................................... 27
Section 5: Peripheral Transport Unit ............................................................................... 28
PCM Interface.............................................................................................................................................. 28
System Diagram.................................................................................................................................... 28
Slot Mapping ......................................................................................................................................... 29
Wideband Speech ................................................................................................................................. 29
Frame Synchronization ......................................................................................................................... 30
Data Formatting..................................................................................................................................... 30
HCI Transport Detection Configuration.................................................................................................... 30
USB Interface .............................................................................................................................................. 31
Features ................................................................................................................................................ 31
Operation............................................................................................................................................... 31
USB Hub and UHE Support .................................................................................................................. 32
UART Interface............................................................................................................................................ 33
HCI 3-Wire Transport (UART H5) ......................................................................................................... 33
SPI................................................................................................................................................................ 34
Simultaneous UART Transport and Bridging .......................................................................................... 34
Section 6: Frequency References.................................................................................... 35
Crystal Interface and Clock Generation ................................................................................................... 35
Crystal Oscillator........................................................................................................................................ 37
External Frequency Reference.................................................................................................................. 37
TCXO Clock Request Support .............................................................................................................. 38
Frequency Selection .................................................................................................................................. 38
Frequency Trimming .................................................................................................................................. 39
LPO Clock Interface ................................................................................................................................... 39
Section 7: Pin-out and Signal Descriptions .................................................................... 40
Pin Descriptions ......................................................................................................................................... 40
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
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BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Table of Contents
Section 8: Ball Grid Arrays ............................................................................................... 43
Section 9: Electrical Characteristics ............................................................................... 44
RF Specifications ....................................................................................................................................... 50
Timing and AC Characteristics ................................................................................................................. 54
Startup Timing ....................................................................................................................................... 54
USB Full-Speed Timing......................................................................................................................... 56
UART Timing......................................................................................................................................... 57
PCM Interface Timing............................................................................................................................ 58
BSC Interface Timing ............................................................................................................................ 62
Section 10: Mechanical Information ................................................................................ 63
Tape, Reel, and Packing Specification ..................................................................................................... 64
Section 11: Ordering Information .................................................................................... 65
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
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BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
List of Figures
List of Figures
Figure 1: System Block Diagram ....................................................................................................................... 1
Figure 2: Functional Block Diagram................................................................................................................. 11
Figure 3: PC Product Usage Model ................................................................................................................. 12
Figure 4: LDO Functional Block Diagram ........................................................................................................ 15
Figure 5: PCM Interface with Linear PCM Codec ............................................................................................ 28
Figure 6: USB Compounded Device Configuration ......................................................................................... 31
Figure 7: Recommended Oscillator Configuration ........................................................................................... 37
Figure 8: Recommended TCXO Connection ................................................................................................... 37
Figure 9: 4.5 x 4 x 0.8 mm (WFBGA) Array ..................................................................................................... 43
Figure 10: Startup Timing from Power-on Reset ............................................................................................. 55
Figure 11: USB Full-Speed Timing .................................................................................................................. 56
Figure 12: UART Timing .................................................................................................................................. 57
Figure 13: PCM Interface Timing (Short Frame Synchronization, Master Mode) ............................................ 58
Figure 14: PCM Interface Timing (Short Frame Synchronization, Slave Mode) .............................................. 59
Figure 15: PCM Interface Timing (Long Frame Synchronization, Master Mode)............................................. 60
Figure 16: PCM Interface Timing (Long Frame Synchronization, Slave Mode)............................................... 61
Figure 17: BSC Interface Timing Diagram ....................................................................................................... 62
Figure 18: 50-Ball WFBGA Mechanical Drawing ............................................................................................. 63
Figure 19: Reel, Labeling, and Packing Specification...................................................................................... 64
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
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BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
List of Tables
List of Tables
Table 1: Power Control Pin Summary.............................................................................................................. 20
Table 2: OTP Programming Supply Voltage Requirements ............................................................................ 27
Table 3: PCM Interface Time Slotting Scheme ................................................................................................ 29
Table 4: Crystal Interface Signal Characteristics ............................................................................................. 35
Table 5: External LPO Signal Requirements ................................................................................................... 39
Table 6: BCM20705 Signal Descriptions ......................................................................................................... 40
Table 7: Ball-Out for the 50-Ball WFBGA ........................................................................................................ 43
Table 8: Absolute Maximum Voltages ............................................................................................................. 44
Table 9: Power Supply..................................................................................................................................... 45
Table 10: High-Voltage Regulator (HV LDO) Electrical Specifications ............................................................ 45
Table 11: Main Regulator (Main LDO) Electrical Specifications ...................................................................... 45
Table 12: Digital I/O Characteristics ................................................................................................................ 46
Table 13: Pad I/O Characteristics .................................................................................................................... 46
Table 14: USB Interface Level ......................................................................................................................... 47
Table 15: Current Consumption—Class 1(10 dBm) ........................................................................................ 48
Table 16: Current Consumption—Class 2 (3 dBm) ......................................................................................... 49
Table 17: Operating Conditions ....................................................................................................................... 49
Table 18: Receiver RF Specifications, ............................................................................................................ 50
Table 19: Transmitter RF Specifications , ....................................................................................................... 52
Table 20: USB Full-Speed Timing Specifications ............................................................................................ 56
Table 21: UART Timing Specifications ............................................................................................................ 57
Table 22: PCM Interface Timing Specifications (Short Frame Synchronization, Master Mode) ...................... 58
Table 23: PCM Interface Timing Specifications (Short Frame Synchronization, Slave Mode) ........................ 59
Table 24: PCM Interface Timing Specifications (Long Frame Synchronization, Master Mode)....................... 60
Table 25: PCM Interface Timing Specifications (Long Frame Synchronization, Slave Mode)......................... 61
Table 26: BSC Interface Timing Specifications................................................................................................ 62
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
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BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
About This Document
Purpose and Audience
This document provides engineering design information for the Broadcom® BCM20705, a single-chip Bluetooth
transceiver and baseband processor that provides a complete lower layer Bluetooth protocol stack.
The information provided is intended for hardware design engineers who will be incorporating the BCM20705
into their designs.
Acronyms and Abbreviations
In most cases, acronyms and abbreviations are defined on first use.
For a comprehensive list of acronyms and other terms used in Broadcom documents, go to:
http://www.broadcom.com/press/glossary.php.
Document Conventions
The following conventions may be used in this document:
Convention
Description
Bold
User input and actions: for example, type exit, click OK, press Alt+C
Monospace
Code: #include <iostream>
HTML: <td rowspan = 3>
Command line commands and parameters: wl [-l] <command>
<>
Placeholders for required elements: enter your <username> or wl <command>
[]
Indicates optional command-line parameters: wl [-l]
Indicates bit and byte ranges (inclusive): [0:3] or [7:0]
Technical Support
Broadcom provides customer access to a wide range of information, including technical documentation,
schematic diagrams, product bill of materials, PCB layout information, and software updates through its
customer support portal (https://support.broadcom.com). For a CSP account, contact your Sales or Engineering
support representative.
In addition, Broadcom provides other product support through its Downloads and Support site
(http://www.broadcom.com/support/).
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 8
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Overview
Section 1: Overview
The Broadcom® BCM20705 complies with Bluetooth Core Specification, version 4.1 and is designed for use in
standard Host Controller Interface (HCI) UART and HCI USB applications. The combination of the Bluetooth
Baseband Core (BBC), a Peripheral Transport Unit (PTU), and an ARM®-based microprocessor with on-chip
ROM provides a complete lower layer Bluetooth protocol stack, including the Link Controller (LC), Link Manager
(LM), and HCI.
Major Features
Major features of the BCM20705 include:
•
Support for Bluetooth 4.1 + EDR including the following options:
– A whitelist size of 25.
– Enhanced Power Control
– HCI Read Encryption Key Size command
•
Full support for Bluetooth 2.1 + EDR additional features:
– Secure Simple Pairing (SSP)
– Encryption Pause Resume (EPR)
– Enhance Inquiry Response (EIR)
– Link Supervision Time Out (LSTO)
– Sniff SubRating (SSR)
– Erroneous Data (ED)
– Packet Boundary Flag (PBF)
•
Built-in Low Drop-Out (LDO) regulators (2)
– 1.63 to 5.5V input voltage range
– 1.8 to 3.3V intermediate programmable output voltage
•
Integrated RF section
– Single-ended, 50 ohm RF interface
– Built-in TX/RX switch functionality
– TX Class 1 output power capability
– RX sensitivity basic rate of –88 dBm
– RX sensitivity for Low Energy of –92 dBm
•
Supports maximum Bluetooth data rates over HCI UART, USB, and SPI interfaces
•
Multipoint operation, with up to 7 active slaves
– Maximum of 7 simultaneous active ACL links
– Maximum of 3 simultaneous active SCO and eSCO links, with Scatternet support
•
Scatternet operation, with up to 4 active piconets (with background scan and support for ScatterMode)
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
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BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
•
Major Features
High-speed HCI UART transport support
– H4 five-wire UART (four signal wires, one ground wire)
– H5 three-wire UART (two signal wires, one ground wire)
– Maximum UART baud rates of 4 Mbps
– Low-power out-of-band BT_WAKE and HOST_WAKE signaling
– VSC from host transport to UART
– Proprietary compressing scheme (allows more than 2 simultaneous A2DP packets and up to 5 devices
at a time)
•
HCI USB transport support
– USB version 2.0 full-speed compliant interface
– Full USB hub
– UHE (proprietary method for emulating a Human Interface Device (HID) at system bootup)
•
Channel Quality-Driven Data Rate (CQDDR) and packet type selection
•
Standard Bluetooth test modes
•
Extended radio and production test mode features
•
Full support for power savings modes:
– Bluetooth standard sniff
– Deep sleep modes and regulator shutdown
•
Supports Wide-Band Speech (WBS) over PCM and Packet Loss Concealment (PLC) for better audio
quality
•
2-, 3-, and 4-wire coexistence
•
Power Amplifier (PA) shutdown for externally controlled coexistence, such as WIMAX
•
Built-in LPO clock or operation using an external LPO clock
•
TCXO input and auto-detection of all standard handset clock frequencies (supports low-power crystal,
which can be used during Power Saving mode with better timing accuracy)
•
OR gate for combining a host clock request with a Bluetooth clock request (operates even when the
Bluetooth core logic is powered off)
•
Larger patch RAM space to support future enhancements
•
Serial flash Interface with native support for devices from several manufacturers
•
One-Time Programmable (OTP) memory
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 10
BROADCOM CONFIDENTIAL
Block Diagram
BCM20705 Data Sheet
Block Diagram
Figure 2 shows the interconnect of the major BCM20705 physical blocks and associated external interfaces.
Figure 2: Functional Block Diagram
JTAG
ARM7TDMI-S
DMA
Scan JTAG
Address Decoder
Bus Arb
Trap & Patch
Flash I/F
32-bit AHB
AHB2EBI
External
Bus I/F
AHB2APB
WD Timer
Remap &
Pause
GPIO+Aux
SW
Timers
OTP
(128 bytes)
AHB2MEM
AHB2MEM
PMU Control
ROM
RAM
Interrupt
Controller
PCM
32-bit APB
Calibration &
Control
Bluetooth Radio
Digital Demod
Bit Sync
Low Power
Scan
Blue RF Registers
LCU
UART
Buffer
APU
Debug UART
Blue RF I/F
SPI Transport
BT Clk/
Hopper
I2C_Master
Rx/Tx
Buffer
FIFO 1
COEX
PMU
LPO
POR
USB
JTAG Master
Digital
Modulator
RF
SPI
Master
I/O
Port Control
Digital I/O
FIFO 2
SECI
PTU
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
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BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Usage Model
Usage Model
This section contains information on the PC Product Usage Model.
PC Product Usage Model
The BCM20705 can be directly interfaced using the HCI USB interface, providing full support for embedded
USB applications like laptops and PC motherboards. The BCM20705 also supports PC applications as an
external USB dongle peripheral device.
Figure 3 shows an example of a PC product usage model.
Figure 3: PC Product Usage Model
VDD_USB
Host PC
USB
LINK_IND
20 MHz Crystal Oscillator
Flash Memory
Serial Interface
BT_BUSY/TX_REQ
WIFI_BUSY/TX_CONFIRM
OPTIONAL/STATUS
Broadcom®
November 13, 2014 • MCS20705-DS104-R
IEEE 802.11™
WLAN
Bluetooth Transceiver and Baseband Processor
Page 12
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Integrated Radio Transceiver
S e c t i o n 2 : I n t e g ra t e d R a d i o Tra n s c e i v e r
The BCM20705 has an integrated radio transceiver that has been optimized for use in 2.4 GHz Bluetooth
wireless systems. It has been designed to provide low-power, low-cost, robust communications for applications
operating in the globally available 2.4 GHz unlicensed ISM band. The BCM20705 is fully compliant with the
Bluetooth Radio Specification and enhanced data rate specification and meets or exceeds the requirements to
provide the highest communication link quality of service.
Transmitter Path
The BCM20705 features a fully integrated zero IF transmitter. The baseband transmitted data is digitally
modulated in the modem block and up-converted to the 2.4 GHz ISM band in the transmitter path. The
transmitter path consists of signal filtering, I/Q up-conversion, a high-output power amplifier (PA), and RF
filtering.
The BCM20705 also incorporates modulation schemes to support enhanced data rates.
•
P/4-DQPSK for 2 Mbps
•
8-DPSK for 3 Mbps
Digital Modulator
The digital modulator performs the data modulation and filtering required for the GFSK, /4DQPSK, and 8DPSK signals. The fully digital modulator minimizes any frequency drift or anomalies in the modulation
characteristics of the transmitted signal and is much more stable than direct VCO modulation schemes.
Power Amplifier
The BCM20705 integrated PA can be configured for Class 2 operation, transmitting up to +4 dBm. The PA can
also be configured for Class 1 operation, transmitting up +10 dBm at the chip in gFSK mode, when a minimum
supply voltage of 2.5V is applied to VDDTF.
Because of the linear nature of the PA, combined with integrated filtering, minimal external filtering is required
to meet Bluetooth and regulatory harmonic and spurious requirements.
Using a highly linearized, temperature compensated design, the PA can transmit +10 dBm for basic rate and
+8 dBm for enhanced data rates (2 to 3 Mbps). A flexible supply voltage range allows the PA to operate from
1.2V to 3.3V. A minimum supply voltage of 2.5V is required at VDDTF to achieve +10 dBm of transmit power.
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
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BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Receiver Path
Receiver Path
The receiver path uses a low IF scheme to downconvert the received signal for demodulation in the digital
demodulator and bit synchronizer. The receiver path provides a high degree of linearity, an extended dynamic
range, and high order on-chip channel filtering to ensure reliable operation in the noisy 2.4 GHz ISM band. The
front-end topology, with built-in out-of-band attenuation, enables the device to be used in most applications
without off-chip filtering. For integrated handset operation where the Bluetooth function is integrated close to the
cellular transmitter, minimal external filtering is required to eliminate the desensitization of the receiver by the
cellular transmit signal.
Digital Demodulator and Bit Synchronizer
The digital demodulator and bit synchronizer uses the low IF received signal to perform an optimal frequency
tracking and bit synchronization algorithm.
Receiver Signal Strength Indicator
The BCM20705 radio provides a Receiver Signal Strength Indicator (RSSI) signal to the baseband so that the
controller can take part in a Bluetooth power-controlled link by providing a metric of its own receiver signal
strength to determine whether the transmitter should increase or decrease its output power.
Local Oscillator Generation
Local Oscillator (LO) generation provides fast frequency hopping (1600 hops/second) across the 79 maximum
available channels. The LO generation subblock employs an architecture for high immunity to LO pulling during
PA operation. The device uses fully-integrated PLL loop filters.
Calibration
The radio transceiver features an automated calibration scheme that is fully self-contained in the radio. User
interaction is not required during normal operation or during manufacturing to provide the optimal performance.
Calibration optimizes the performance of all major blocks in the radio, including gain and phase characteristics
of filters, matching between key components, and key gain blocks. Calibration, which takes process and
temperature variations into account, occurs transparently during the settling time of the hops, adjusting for
temperature variations as the device cools and heats during normal operation.
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
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BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Internal LDO
Internal LDO
Two internal Low Drop-Out (LDO) voltage regulators eliminate the need for external voltage regulators and
therefore reduce the BOM. The first LDO is a preregulator (HV LDO). The second LDO (Main LDO) supplies the
main power to the BCM20705 (see Figure 4).
The HV LDO has an input voltage range of 2.3V to 5.5V. The input VBAT is ideal for batteries. The VREGHV
output is programmable from 1.8V to 3.3V, in 100 mV steps. The dropout voltage is 200 mV. The HV LDO can
supply up to 95 mA, which leaves spare power for external circuitry such as an RF power amp for higher transmit
power. If the HV LDO is not used, to turn off the HV LDO and minimize current consumption, connect the VBAT
input to the VREGHV output. Firmware can then disable the HV LDO, saving the quiescent current.
The HV LDO default output voltage is 2.9V, allowing this regulator to be used to power external NV memory
devices, as well as the VDDO rail. The firmware can then adjust this output to as low as 1.8V, if desired, to power
VDDTF.
The main LDO has a 1.22V output (VREG) and is used to supply main power to the BCM20705. The input of
this LDO (VREGHV) has an input voltage range of from 1.63V to 3.63V. The output of the HV LDO is internally
connected to the input to the main LDO. Power can be applied to VREGHV when the HV LDO is not used. The
main LDO supplies power to the entire device for Class 2 operation. The main LDO can drive up to 60 mA, which
leaves spare power for external circuitry. The main LDO is bypassed by not connecting anything to its output
(VREG) and driving 1.12V–1.32V directly to VDDC and VDDRF.
REG_EN provides a control signal for the host to control power to the BCM20705. When power is enabled, the
BCM20705 will require complete initialization.
Figure 4: LDO Functional Block Diagram
HV LDO
REG_EN
Broadcom®
November 13, 2014 • MCS20705-DS104-R
VBAT
Main LDO
VREGHV
VREG
Bluetooth Transceiver and Baseband Processor
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BCM20705 Data Sheet
Bluetooth Baseband Core
Section 3: Bluetooth Baseband Core
The Bluetooth Baseband Core (BBC) implements the time critical functions required for high-performance
Bluetooth and Low Energy operation. The BBC manages buffering, segmentation, and data routing for all
connections. It also buffers data that passes through it, handles data flow control, schedules SCO/ACL Tx/Rx
transactions, monitors Bluetooth slot usage, optimally segments and packages data into baseband packets,
manages connection status indicators, and composes and decodes HCI packets. In addition to these functions,
it independently handles HCI event types and HCI command types.
Transmit and Receive Functions
The following transmit and receive functions are implemented in the BBC hardware to increase the reliability
and security of the Tx/Rx data before sending the data over the air:
In the transmitter:
•
Data framing
•
Forward Error Correction (FEC) generation
•
Header Error Control (HEC) generation
•
Cyclic Redundancy Check (CRC) generation
•
Key generation
•
Data encryption
•
Data whitening
In the receiver:
•
Symbol timing recovery
•
Data deframing
•
FEC
•
HEC
•
CRC
•
Data decryption
•
Data dewhitening
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BCM20705 Data Sheet
Bluetooth 4.1 + EDR Features
Bluetooth 4.1 + EDR Features
The BCM20705 supports Bluetooth 4.1 + EDR and Low Energy, including the following options:
•
A whitelist size of 25
•
Enhanced Power Control
•
HCI Read Encryption Key Size command
The BCM20705 provides full support for Bluetooth 2.1 + EDR additional features:
•
Secure Simple Pairing (SSP)
•
Encryption Pause Resume (EPR)
•
Enhance Inquiry Response (EIR)
•
Link Supervision Time Out (LSTO)
•
Sniff SubRating (SSR)
•
Erroneous Data (ED)
•
Packet Boundary Flag (PBF)
Frequency Hopping Generator
The frequency hopping sequence generator selects the correct hopping channel number, based on the link
controller state, Bluetooth clock, and device address.
Link Control Layer
The Link Control layer is part of the Bluetooth link control functions implemented in dedicated logic in the Link
Control Unit (LCU). This layer consists of the Command Controller that takes commands from the software and
other controllers that are activated or configured by the Command Controller to perform the link control tasks.
There are two major states–Standby and Connection. Each task establishes a different state in the Bluetooth
Link Controller. In addition, there are eight substates—Page, Page Scan, Inquiry, Inquiry Scan, Sniff, and Sniff
Subrating.
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BCM20705 Data Sheet
Test Mode Support
Test Mode Support
The BCM20705 fully supports Bluetooth Test Mode.
In addition to the standard Bluetooth Test mode, the device supports enhanced testing features to simplify RF
debugging and qualification and type approval testing.
These test features include:
•
Fixed frequency carrier wave (unmodulated) transmission
– Simplifies some type approval measurements (Japan)
– Aids in transmitter performance analysis
•
Fixed frequency constant receiver mode
– Directs receiver output to I/O pin
– Allows for direct BER measurements using standard RF test equipment
– Facilitates spurious emissions testing for receive mode
•
Fixed frequency constant bit stream transmission
– Unmodulated, 8-bit fixed pattern, PRBS-9, or PRBS-15
– Enables modulated signal measurements with standard RF test equipment
•
Packetized connectionless transmitter test
– Hopping or fixed frequency
– Multiple packet types supported
– Multiple data patterns supported
•
Packetized connectionless receiver test
– Fixed frequency
– Multiple packet types supported
– Multiple data patterns supported
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BCM20705 Data Sheet
Power Management Unit
Power Management Unit
The Power Management Unit (PMU) provides power management features that can be invoked through power
management registers or packet handling in the baseband core. This section contains descriptions of the PMU
features.
RF Power Management
The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to
the 2.4 GHz transceiver. The transceiver then processes the power-down functions, accordingly.
Host Controller Power Management
The host can place the device in a sleep state, in which all nonessential blocks are powered off and all
nonessential clocks are disabled. Power to the digital core is maintained so that the state of the registers and
RAM is not lost. In addition, the LPO clock is applied to the internal sleep controller so that the chip can wake
automatically at a specified time or based on signaling from the host. The goal is to limit the current consumption
to a minimum, while maintaining the ability to wake up and resume a connection with minimal latency.
If a scan or sniff session is enabled while the device is in Sleep mode, the device automatically will wake up for
the scan/sniff event, then go back to sleep when the event is done. In this case, the device uses its internal LPObased timers to trigger the periodic wake up. While in Sleep mode, the transports are idle. However, the host
can signal the device to wake up at any time. If signaled to wake up while a scan or sniff session is in progress,
the session continues but the device will not sleep between scan/sniff events. Once Sleep mode is enabled, the
wake signaling mechanism can also be thought of as a sleep signaling mechanism, since removing the wake
status will often cause the device to sleep.
In addition to a Bluetooth device wake signaling mechanism, there is a host wake signaling mechanism. This
feature provides a way for the Bluetooth device to wake up a host that is in a reduced power state.
There are two mechanisms for the device and the host to signal wake status to each other:
USB
When running in USB mode, the device supports the USB version
2.0 full-speed specification, suspend/resume signaling, as well as
remote wake-up signaling for power control.
Bluetooth WAKE (BT_WAKE) and
Host WAKE (and HOST_WAKE)
signaling
The BT_WAKE pin (GPIO_0) allows the host to wake the BT device,
and HOST_WAKE (GPIO_1) is an output that allows the BT device
to wake the host.
When running in SPI mode, the BCM20705 has a mode where it enters Sleep mode when there is no activity
on the SPI interface for a specified (programmable) amount of time. Idle mode is detected when the SPI_CSN
is left deasserted. Whether to sleep on an idle interface and the amount of time to wait before entering Sleep
mode can be programed by the host. Once the BCM20705 enters sleep, the host can wake it by asserting
SPI_CSN. If the host decides to sleep, the BCM20705 will wake up the host by asserting SPI_INT when it has
data for it.
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BCM20705 Data Sheet
Power Management Unit
Note: Successful operation of the power management handshaking signals requires coordinated
support between the device firmware and the host software.
Table 1: Power Control Pin Summary
Pin
Direction
Description
BT_WAKE
(GPIO_0)
Host output
BT input
Bluetooth device wake-up: Signal from the host to the Bluetooth device that the
host requires attention.
• Asserted = Bluetooth device must wake up or remain awake.
• Deasserted = Bluetooth device may sleep when sleep criteria are met.
The polarity of this signal is software configurable and can be asserted high or
low. By default, BT_WAKE is active-low (if BT-WAKE is low it requires the
device to wake up or remain awake).
For USB applications, this can be used for setting Airport mode (radio disable
mode).
HOST_WAKE BT output
(GPIO_1)
Host input
Host wake-up. Signal from the Bluetooth device to the host indicating that
Bluetooth device requires attention.
• Asserted = Host device must wake up or remain awake.
• Deasserted = Host device may sleep when sleep criteria are met.
The polarity of this signal is software configurable and can be asserted high or
low.
CLK_REQ
(GPIO_5)
BT output
Clock request
• Asserted = External clock reference required
• Deasserted = External clock reference may be powered down
For the BCM20705A1KWFBG, the polarity of CLK_REQ is active low.
For BCM20705B0KWFBG, the CLK_REQ function is only available as a
configurable feature after firmware boot, which means it cannot be used to
request a clock at boot time.
REG_EN
BT input
Enables the internal preregulator and main regulator outputs. REG_EN is
active-high.
• 1 = Enabled
• 0 = Disabled
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BCM20705 Data Sheet
Power Management Unit
BBC Power Management
The device provides the following low-power operations for the BBC:
•
Physical layer packet handling turns RF on and off dynamically within packet TX and RX.
•
Bluetooth specified low-power connection mode (Sniff). While in this low-power connection mode, the
device runs on the Low Power Oscillator and wakes up after a predefined time period.
Backdrive Protection
The BCM20705 provides a backdrive protection feature that allows the device to be turned off while the host
and other devices in the system remain operational. When the device is not needed in the system, VDD_RF and
VDDC are shut down and VDDO remains powered. This allows the device to be effectively off, while keeping
the I/O pins powered so that they do not draw extra current from other devices connected to the I/O.
Note: VDD_RF collectively refers to the VDDTF, VDDIF, VDDLNA, VDDPX, and VDDRF RF power
supplies.
Note: Never apply voltage to I/O pins if VDDO is not applied.
During the low power shutdown state and as long as VDDO remains applied to the device, all outputs are
tristated and all digital and analog clocks are disabled. Input voltages must remain within the limits defined for
normal operation. This is done to either prevent current draw and back loading on digital signals in the system.
It also enables the device to be fully integrated in an embedded device and take full advantage of the lowest
power savings modes. If VDDC is powered up externally (not connected to VREG), VDDC requires 750K ohms
to ground during low-power shutdown. If VDDC is powered up by VREG, VDDC does not require 750K ohms to
ground because the internal main LDO has about 750 K ohms to ground when turned off.
Several signals, including the frequency reference input (XTAL_IN) and external LPO input (LPO_IN), are
designed to be high-impedance inputs that will not load down the driving signal, even if VDDO power is not
applied to the chip. The other signals with back drive prevention are RST_N, COEX_IN, PCM_SYNC,
PCM_CLK, PCM_OUT, PCM_IN, UART_RTS_N, UART_CTS_N, UART_RXD, UART_TXD, GPIO_0, GPIO_1,
GPIO_4, GPIO_7, HUSB_DP, HUSB_DN, CFG_SEL, and OTP_DIS.
All other I/O signals must remain at VSS until VDDO is applied. Failing to do this can result in unreliable startup
behavior.
When powered on, using REG_EN is the same as applying power to the BCM20705. The device does not have
information about its state before being powered-down.
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BCM20705 Data Sheet
Adaptive Frequency Hopping
Adaptive Frequency Hopping
The BCM20705 supports host channel classification and dynamic channel classification Adaptive Frequency
Hopping (AFH) schemes, as defined in the Bluetooth specification.
Host channel classification enables the host to set a predefined hopping map for the device to follow.
If dynamic channel classification is enabled, the device gathers link quality statistics on a channel-by-channel
basis to facilitate channel assessment and channel map selection. To provide a more accurate frequency hop
map, link quality is determined using both RF and baseband signal processing.
Collaborative Coexistence
The BCM20705 provides extensions and collaborative coexistence to the standard Bluetooth AFH for direct
communication with WLAN devices. Collaborative coexistence enables WLAN and Bluetooth to operate
simultaneously in a single device. The device supports industry-standard coexistence signaling, including
802.15.2, and supports Broadcom and third-party WLAN solutions.
Using a multitiered prioritization approach, relative priorities between data types and applications can be set.
This approach maximizes the performance-WLAN data throughput vs. voice quality vs. link performance.
A PA shutdown pin is available to allow full external control of the RF output for other types of coexistence, such
as WIMAX.
Serial Enhanced Coexistence Interface
The Serial Enhanced Coexistence Interface (Serial ECI or SECI) is a proprietary Broadcom interface between
Broadcom WLAN devices and Bluetooth devices. It is an optional replacement to the legacy 3- or 4-wire
coexistence feature, which is also available.
The following key features are associated with the interface:
•
Enhanced coexistence data can be exchanged over a two-wire interface, one serial input (SECI_IN), and
one serial output (SECI_OUT). The pad configuration registers must be programmed to choose the digital I/
O pins that serve the SECI_IN and SECI_OUT function.
•
It supports generic UART communication between WLAN and Bluetooth devices.
•
To conserve power, it is disabled when inactive.
•
It supports automatic resynchronizaton upon waking from sleep mode.
•
It supports a baud rate of up to 4 Mbps.
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BCM20705 Data Sheet
Serial Enhanced Coexistence Interface
SECI Advantages
The advantages of the SECI over the legacy 3-wire coexistence interface are:
•
Only two wires are required: SECI_IN and SECI_OUT.
•
Up to 48-bits of coexistence data can be exchanged.
Previous Broadcom standalone Bluetooth devices such as the BCM2070 supported only a 3-wire or 4-wire
coexistence interface. Previous Broadcom WLAN and Bluetooth combination devices such as the BCM4325,
BCM4329, and BCM4330 support an internal parallel enhanced coexistence interface for more efficient WLAN
and Bluetooth information exchange. The SECI allows enhanced coexistence information to be passed to a
companion Broadcom WLAN chip through a serial interface using fewer I/O than the 3-wire coexistence
scheme.
The 48-bits of the SECI significantly enhance WLAN and Bluetooth coexistence by sharing such information as
frequencies used and radio usage times. The exact contents of the SECI are Broadcom confidential.
SECI I/O
The BCM20705 does not have dedicated SECI_IN or SECI_OUT pins, but the two pin functions can be mapped
to the following digital I/O: the UART, GPIO, SPI Master (or BSC), PCM, and COEX pins. Pin function mapping
is controlled by the config file that is either stored in NVRAM or downloaded directly into on-chip RAM from the
host.
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BCM20705 Data Sheet
Microprocessor Unit
S e c t i o n 4 : M i c ro p r o c e s s o r U n i t
Overview
The BCM20705 microprocessor unit runs software from the Link Control (LC) layer up to the Host Controller
Interface (HCI). The microprocessor is based on the ARM7TDMIS 32-bit RISC processor with embedded ICERT debug and JTAG interface units. The microprocessor also includes 448 KB of ROM memory for program
storage and boot ROM, 132 KB of RAM for data scratch-pad, and patch RAM code.
Note: The BCM20705A1KWFBG part only contains 384 KB of ROM and 112 KB of RAM.
The internal boot ROM provides flexibility during power-on reset to enable the same device to be used in various
configurations, including automatic host transport selection from SPI, USB, or UART, with or without external
NVRAM. At power-up, the lower layer protocol stack is executed from the internal ROM.
External patches can be applied to the ROM-based firmware to provide flexibility for bug fixes and features
additions. These patches can be downloaded from the host to the device through the SPI, USB, or UART
transports, or using external NVRAM. The device can also support the integration of user applications and
profiles using an external serial flash memory.
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BCM20705 Data Sheet
NVRAM Configuration Data and Storage
NVRAM Configuration Data and Storage
Serial Interface
The BCM20705 includes an SPI master controller that can be used to access serial flash memory. The SPI
master contains an AHB slave interface, transmit and receive FIFOs, and the SPI core PHY logic. Data is
transferred to and from the module by the system CPU. DMA operation is not supported.
The BCM20705 supports serial flash vendors Atmel®, MXIC, and Numonyx™. The most commonly used parts
from two of these vendors are:
•
AT25BCM512B, manufactured by Atmel
•
MX25V512ZUI-20G, manufactured by MXIC
EEPROM
The BCM20705 includes a Broadcom Serial Control (BSC) master interface. The BSC interface supports lowspeed and fast mode devices and is compatible with I2C slave devices. Multiple I2C master devices and flexible
wait state insertion by the master interface or slave devices are not supported. The BCM20705 provides 400
kHz, full speed clock support.
The BSC interface is programmed by the CPU to generate the following BSC transfer types on the bus:
•
Read-only
•
Write-only
•
Combined read/write
•
Combined write-read
NVRAM may contain configuration information about the customer application, including the following:
•
Fractional-N information
•
BD_ADDR
•
UART baud rate
•
USB enumeration information
•
SDP service record
•
File system information used for code, code patches, or data
External Reset
The BCM20705 has an integrated power-on reset circuit which completely resets all circuits to a known power
on state. This action can also be driven by an external reset signal, which can be used to externally control the
device, forcing it into a power-on reset state. The RST_N signal input is an active-low signal for all versions of
the BCM20705. The BCM20705 requires an external pull-up resistor on the RST_N input. Alternatively, the
RST_N input can be connected to REG_EN or driven directly by a host GPIO.
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BCM20705 Data Sheet
One-Time Programmable Memory
One-Time Programmable Memory
The BCM20705 includes a One-Time Programmable (OTP) memory, allowing manufacturing customization and
avoiding the need for an on-board NVRAM.If customization is not required, then the OTP does not need to be
programmed. Whether the OTP is programmed or not, it is disabled after the boot process completes to save
power.
The OTP size is 128 bytes.
The OTP is designed to store a minimal amount of information. Aside from OTP data, most user configuration
information will be downloaded into RAM after the BCM20705 boots up and is ready for host transport
communication. The OTP contents are limited to:
•
Parameters required prior to downloading user configuration to RAM.
•
Parameters unique to each part and each customer (i.e., the BD_ADDR, software license key, and USB
PID/VID).
The OTP memory is particularly useful in a PC design with USB transport capability because:
•
Some customer-specific information must be configured before enumerating the part on the USB transport.
•
Part or customer unique information (BD_ADDR, software license key, and USB PID/VID) do not need to
be stored on the host system.
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BCM20705 Data Sheet
One-Time Programmable Memory
Contents
The following are typical parameters programmed into the OTP memory:
•
BD_ADDR
•
Software license key
•
USB PID/VID
•
USB bus/self-powered status
•
Output power calibration
•
Frequency trimming
•
Initial status LED drive configuration
The OTP contents also include a static error correction table to improve yield during the programming process
as well as forward error correction codes to eliminate any long-term reliability problems. The OTP contents
associated with error correction are not visible by customers.
Programming
OTP memory programming takes place through a combination of Broadcom software integrated with the
manufacturing test software and code embedded in BCM20705 firmware.
Programming the OTP requires a 3.3V supply. The OTP programming supply comes from the VDD_USB pin.
For applications where the OTP is most useful, such as the USB transport application for the PC market, the
3.3V is already required for USB operation from the VDD_USB pin. The OTP power supply is allowed to be as
low as 1.8 V to be able to read the contents. See Table 2 for the OTP memory programming supply voltage
requirements.
The OTP is enabled by default by setting OTP_DIS to low using an internal pull-down resistor. Leave this pin
floating for a default configuration. To disable the OTP, set the OTP_DIS pin to active high. This pin can be
configured from the HW to enable or disable OTP.
Typically it won’t be necessary to disable the OTP memory, even if it is not programmed during manufacturing.
The OTP_DIS package ball only needs to be tied to high if recommended by Broadcom.
Table 2: OTP Programming Supply Voltage Requirementsa
Supply
Minimumb
Typical
Maximumb
Unit
VDD_USB
TBD
TBD
TBD
V
a. The average and peak current consumptions during OTP memory programming are 20 mA and 70 mA,
respectively.
b. Contact your Broadcom representative for recommended minimum and maximum supply voltages.
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BCM20705 Data Sheet
Peripheral Transport Unit
S e c t i o n 5 : P e r i p h e r a l Tra n s p o r t U n i t
This section discusses the PCM, USB, UART, and SPI peripheral interfaces. The BCM20705 has a 1040 byte
transmit and receive fifo, which is large enough to hold the entire payload of the largest EDR BT packet (3-DH5).
PCM Interface
The BCM20705 PCM interface can connect to linear PCM codec devices in master or slave mode. In master
mode, the device generates the PCM_BCLK and PCM_SYNC signals. In slave mode, these signals are
provided by another master on the PCM interface as inputs to the device.
The device supports up to three SCO or eSCO channels through the PCM interface and each channel can be
independently mapped to any available slot in a frame.
The host can adjust the PCM interface configuration using vendor-specific HCI commands or it can be setup in
the configuration file.
System Diagram
Figure 5 shows options for connecting the device to a PCM codec device as a master or a slave.
Figure 5: PCM Interface with Linear PCM Codec
PCM_IN
PCM_OUT
PCM_BCLK
PCM_SYNC
PCM Codec
(Master)
BCM20705
(Slave)
PCM Interface Slave Mode
PCM_IN
PCM_OUT
PCM_BCLK
PCM_SYNC
PCM Codec
(Slave)
BCM20705
(Master)
PCM Interface Master Mode
PCM_IN
PCM_OUT
PCM_BCLK
PCM_SYNC
PCM Codec
(Hybrid)
BCM20705
(Hybrid)
PCM Interface Hybrid Mode
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BCM20705 Data Sheet
PCM Interface
Slot Mapping
The device supports up to three simultaneous, full-duplex SCO or eSCO channels. These channels are timemultiplexed onto the PCM interface using a time slotting scheme based on the audio sampling rate, as described
in Table 3.
Table 3: PCM Interface Time Slotting Scheme
Audio Sample Rate Time Slotting Scheme
8 kHz
The number of slots depends on the selected interface rate, as follows:
Interface rate Slot
128
1
256
2
512
4
1024
8
2048
16
16 kHz
The number of slots depends on the selected interface rate, as follows:
Interface rate Slot
256
1
512
2
1024
4
2048
8
Transmit and receive PCM data from an SCO channel is always mapped to the same slot. The PCM data output
driver tri-states its output on unused slots to allow other devices to share the same PCM interface signals. The
data output driver tri-states its output after the falling edge of the PCM clock during the last bit of the slot.
Wideband Speech
The BCM20705 provides support for Wideband Speech (WBS) in two ways:
•
Transparent mode
The host encodes WBS packets and the encoded packets are
transferred over the PCM bus for SCO or eSCO voice connections.
In Transparent mode, the PCM bus is typically configured in master
mode for a 4 kHz sync rate with 16-bit samples, resulting in a
64 kbps bit rate.
•
On-chip SmartAudio® technology
The BCM20705 can perform Subband-Codec (SBC) encoding and
decoding of linear 16 bits at 16 kHz (256 kbps rate) transferred over
the PCM bus.
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BCM20705 Data Sheet
HCI Transport Detection Configuration
Frame Synchronization
The device supports both short and long frame synchronization types in both master and slave configurations.
In short frame synchronization mode, the frame synchronization signal is an active-high pulse at the 8 kHz audio
frame rate (which is a single bit period in width) and synchronized to the rising edge of the bit clock. The PCM
slave expects PCM_SYNC to be high on the falling edge of the bit clock and the first bit of the first slot to start
at the next rising edge of the clock. In the long frame synchronization mode, the frame synchronization signal
is an active-high pulse at the 8 kHz audio frame rate. However, the duration is 3-bit periods and the pulse starts
coincident with the first bit of the first slot.
Data Formatting
The device can be configured to generate and accept several different data formats. The device uses 13 of the
16 bits in each PCM frame. The location and order of these 13 bits is configurable to support various data
formats on the PCM interface. The remaining three bits are ignored on the input, and may be filled with zeros,
ones, a sign bit, or a programmed value on the output. The default format is 13-bit two’s complement data, left
justified, and clocked most significant bit first.
HCI Transport Detection Configuration
The BCM20705 supports the following interface types for the HCI transport from the host:
•
UART (H4 and H5)
•
USB
•
SPI
Only one host interface can be active at a time. The firmware performs a transport detect function at boot-time
to determine which host is the active transport. It can auto-detect UART and USB interfaces, but the SPI
interface must be selected by strapping the SCL pin to 0.
The complete algorithm is summarized as follows:
1. Determine if SCL is pulled low. If it is, select SPI as HCI host transport.
2. Determine if any local NVRAM contains a valid configuration file. If it does and a transport configuration entry
is present, select the active transport according to entry, and then exit the transport detection routine.
3. Look for start-of-frame (SOF) on the USB interface. If it is present, select USB.
4. Look for CTS_N = 0 on the UART interface. If it is present, select UART.
5. Repeat Step 3 and Step 4 until transport is determined.
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BCM20705 Data Sheet
USB Interface
USB Interface
Features
The following USB interface features are supported:
•
USB Protocol, Revision 2.0, full-speed compliant including the hub
•
Optional hub compound device with up to three device cores internal to device.
•
Bus or self-power, dynamic configuration for the hub
•
Global and selective suspend and resume with remote wakeup
•
Bluetooth HCI
•
HID, DFU, UHE (proprietary method to emulate an HID device at system boot)
•
Integrated detach resistor
Operation
Note: The USB and HCI UART interfaces cannot be used simultaneously. For designs that do not use
the USB interface, VDD_USB, HUSB_DP and HUSB_DN must be connected to ground.
The BCM20705 can be configured to boot up as either a single USB peripheral or a USB hub with several USB
peripherals attached. As a single peripheral, the host detects a single USB Bluetooth device. In Hub mode, the
host detects a hub with one to three of the ports already connected to USB devices (see Figure 6).
Figure 6: USB Compounded Device Configuration
Host
USB Compounded Device
Hub Controller
USB Device 1
HID Keyboard
USB Device 2
HID Mouse
USB Device 3
Bluetooth
Depending on the desired hub mode configuration, the BCM20705 can boot up showing the three ports
connected to logical USB devices internal to the BCM20705—a generic Bluetooth device, a mouse, and a
keyboard. In this mode, the mouse and keyboard are emulated devices, since they connect to real HID devices
via a Bluetooth link. The Bluetooth link to these HID devices is hidden from the USB host. To the host, the mouse
and/or keyboard appear to be directly connected to the USB port. This Broadcom proprietary architecture is
called USB HID Emulation (UHE).
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USB Interface
The USB device, configuration, and string descriptors are fully programmable, allowing manufacturers to
customize the descriptors, including vendor and product IDs, the BCM20705 uses to identify itself on the USB
port. To make custom USB descriptor information available at boot time, stored it in external NVRAM.
Despite the mode of operation (Single Peripheral or Hub), the Bluetooth device is configured to include the
following interfaces:
Interface 0
Contains a Control endpoint (Endpoint 0x00) for HCI commands, a Bulk In Endpoint (Endpoint
0x82) for receiving ACL data, a Bulk Out Endpoint (Endpoint 0x02) for transmitting ACL data,
and an Interrupt Endpoint (Endpoint 0x81) for HCI events.
Interface 1
Contains Isochronous In and Out endpoints (Endpoints 0x83 and 0x03) for SCO traffic. Several
alternate Interface 1 settings are available for reserving the proper bandwidth of isochronous
data (depending on the application).
Interface 2
Contains Bulk In and Bulk Out endpoints (Endpoints 0x84 and 0x04) used for proprietary testing
and debugging purposes. These endpoints can be ignored during normal operation.
USB Hub and UHE Support
The BCM20705 supports the USB hub and device model (USB, Revision 2.0, full-speed compliant). Optional
mouse and keyboard devices utilize Broadcom’s proprietary USB HID Emulation (UHE) architecture, which
allows these devices appear as standalone HID devices even though connected through a Bluetooth link.
The presence of UHE devices requires the hub to be enabled. The BCM20705 cannot appear as a single
keyboard or a single mouse device without the hub. Once either mouse or keyboard UHE device is enabled, the
hub must also be enabled.
When the hub is enabled, the BCM20705 handles all standard USB functions for the following devices:
•
HID keyboard
•
HID mouse
•
Bluetooth
All hub and device descriptors are firmware-programmable. This USB compound device configuration (see
Figure 6 on page 31) supports up to three downstream ports. This configuration can also be programmed to a
single USB device core. The device automatically detects activity on the USB interface when connected.
Therefore, no special configuration is needed to select HCI as the transport.
The hub’s downstream port definition is as follows:
•
Port 1 USB lite device core (for HID applications)
•
Port 2 USB lite device core (for HID applications)
•
Port 3 USB full device core (for Bluetooth applications)
When operating in Hub mode, all three internal devices do not have to be enabled. Each internal USB device
can be optionally enabled. The configuration record in NVRAM determines which devices are present.
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 32
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
UART Interface
UART Interface
The UART physical interface is a standard, 4-wire interface (RX, TX, RTS, CTS) with adjustable baud rates from
9600 bps to 4.0 Mbps. The interface features an automatic baud rate detection capability that returns a baud
rate selection. Alternatively, the baud rate can be selected via a vendor-specific UART HCI command. The
interface supports Bluetooth UART HCI (H4) specifications. The default baud rate for H4 is 115.2 Kbaud.
The following baud rates are supported:
•
9600
•
14400
•
19200
•
28800
•
38400
•
57600
•
115200
•
230400
•
460800
•
921600
•
144444
•
150000
•
2000000
•
3000000
•
3250000
•
3692000
•
4000000
Normally, the UART baud rate is set by a configuration record downloaded after reset or by automatic baud rate
detection. The host does not need to adjust the baud rate. Support for changing the baud rate during normal
HCI UART operation is provided through a vendor-specific command.
The BCM20705 UART operates with the host UART correctly, provided the combined baud rate error of the two
devices is within ±2%.
HCI 3-Wire Transport (UART H5)
The BCM20705 supports H5 UART transport for serial UART communications. H5 reduces the number of signal
lines required by eliminating CTS and RTS, when compared to H4.
H5 requires the use of an external LPO. CTS must be pulled low.
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 33
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
SPI
SPI
The BCM20705 supports a slave SPI HCI transport with an input clock range of up to 16 MHz. Higher clock
rates may be possible. The physical interface between the SPI master and the BCM20705 consists of the four
SPI signals (SPI_CSB, SPI_CLK, SPI_SI, and SPI_SO) and one interrupt signal (SPI_INT). The BCM20705
can be configured to accept active-low or active-high polarity on the SPI_CSB chip select signal. It can also be
configured to drive an active-low or active-high SPI_INT interrupt signal. Bit ordering on the SPI_SI and
SPI_SO data lines can be configured as either little-endian or big-endian. Additionally, proprietary sleep mode,
half-duplex handshaking is implemented between the SPI master and the BCM20705.
SPI_INT is required to negotiate the start of a transaction. The SPI interface does not require flow control in the
middle of a payload. The FIFO is large enough to handle the largest packet size. Only the SPI master can stop
the flow of bytes on the data lines, since it controls SPI_CSB and SPI_CLK. Flow control should be implemented
in higher layer protocols.
Simultaneous UART Transport and Bridging
The BCM20705 supports UART or USB interfaces that can function as the host controller interface (HCI).
Typically, a customer application would choose one of the two interfaces and the other would be idle. The
BCM20705 allows the UART transport to operate simultaneously with the USB. To operate this way, the
assumption is that the USB would function as the primary host transport, while the UART would function as a
secondary communication channel that can operate at the same time. This can enable the following
applications:
•
Bridging primary HCI transport traffic to another device via the UART
•
Generic communication to an external device for a vendor-supported application via the UART
Simultaneous UART transport and bridging is enabled by including:
•
Two dedicated 64-byte FIFOs, one for the input and one for the output
•
Additional DMA channels
•
Additional vendor-supported commands over the HCI transport
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 34
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Frequency References
S e c t i o n 6 : F re q u e n c y R e f e r e n c e s
The BCM20705 uses two different frequency references for normal and low-power operational modes. An
external crystal or frequency reference driven by a Temperature Compensated Crystal Oscillator (TCXO) signal
is used to generate the radio frequencies and normal operation clocking. Either an external 32.768 kHz or fully
integrated internal Low-Power Oscillator (LPO) is used for low-power mode timing.
Crystal Interface and Clock Generation
The BCM20705 uses a fractional-N synthesizer to generate the radio frequencies, clocks, and data/packet
timing, enabling it to operate from any of a multitude of frequency sources. The source can be external, such as
a TCXO, or a crystal interfaced directly to the device.
The default frequency reference setting is for a 20 MHz crystal or TCXO. The signal characteristics for the
crystal interface are listed in Table 4 on page 35.
Table 4: Crystal Interface Signal Characteristics
Parameter
Crystal
External Frequency Reference Units
a
Acceptable frequencies
12–52 MHz in 2 ppm steps 12–52 MHz in 2 ppma steps
–
Crystal load capacitance
12 (typical)
N/A
pF
ESR
60 (max)
–
Ω
Power dissipation
200 (max)
–
μW
Input signal amplitude
N/A
400 to 2000
2000 to 3300 (requires a 10 pF
DC blocking capacitor to
attenuate the signal)
mVp-p
Signal type
N/A
Square-wave or sine-wave
–
Input impedance
N/A
≥1
≤2
MΩ
pF
Phase noise
@ 1 kHz
@ 10 kHz
@ 100 kHz
@ 1 MHz
N/A
N/A
N/A
N/A
N/A
–
<
<
<
<
–
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Auto-detection frequencies when
using external LPOc
12, 13, 14.4, 15.36, 16.2, 16.8, MHz
12, 13, 14.4, 15.36, 16.2,
16.8, 18, 19.2, 19.44, 19.68, 18, 19.2, 19.44, 19.68, 19.8, 20,
19.8, 20, 24, 26, 33.6, 37.4, 24, 26, 33.6, 37.4, and 38.4
and 38.4
–120b
–131b
–136b
–136b
Tolerance without frequency trimmingd ±20
±20
ppm
Initial frequency tolerance trimming
range
±50
ppm
±50
a. The frequency step size is approximately 80 Hz resolution.
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November 13, 2014 • MCS20705-DS104-R
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BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Crystal Interface and Clock Generation
b. With a 26 MHz reference clock. For a 13 MHz clock, subtract 6 dB. For a 52 MHz clock, add 6 dB.
c. Auto-detection of the frequency requires the crystal or external frequency reference to have less than ±50 ppm
of variation and also requires an external LPO frequency which has less than ±250 ppm of variation at the time
of detection.
d. AT-Cut crystal or TXCO recommended.
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 36
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Crystal Oscillator
Crystal Oscillator
The BCM20705 can use an external crystal to provide a frequency reference. The recommended configuration
for the crystal oscillator, including all external components, is shown in Figure 7.
Figure 7: Recommended Oscillator Configuration
XIN
0 ~ 18 pF*
Crystal
Oscillator
XOUT
0 ~ 18 pF*
*Capacitor value range depends
on the manufacturer of the XTAL
as well as board layout.
External Frequency Reference
An external frequency reference, such as VDD_RF, collectively refers to several RF power supplies generated
by a TCXO signal that may be directly connected to the crystal input pin on the BCM20705, as shown in
Figure 8. The external frequency reference input is designed to not change loading on the TCXO when the
BCM20705 is powered up or powered down.
When using the BCM20705 with the TXCO OR gate option, GPIO 6 must be driven active high or active low.
Excessive leakage current results if GPIO6 is allowed to float.
Figure 8: Recommended TCXO Connection
TCXO
XIN
10–1000 pF*
XOUT
No Connection
* Recommended value is 100 pF.
Higher values produce a longer startup time.
Lower values have greater isolation.
Larger values help small signal swings.
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 37
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Frequency Selection
TCXO Clock Request Support
If the application utilizes an external TCXO as a clock reference, the BCM20705 provides a clock request output
to allow the system to power off the TCXO when not in use.
Frequency Selection
Any frequency within the range specified for the crystal and TCXO reference can be used. These frequencies
include standard handset reference frequencies (12, 13, 14.4, 15.36, 16.2, 16.8, 18, 19.2, 19.44, 19.68, 19.8,
20, 24, 26, 33.6, 37.4, and 38.4 MHz) and any frequency between these reference frequencies, as desired by
the system designer. Since bit timing is derived from the reference frequency, the BCM20705 must have the
reference frequency set correctly in order for any of the USB, UART, and PCM interfaces to function properly.
The BCM20705 reference frequency can be set in one of the following ways.
•
Use the default 20 MHz frequency by leaving the CFG_SEL pin unconnected or by strapping it high. The
CFG_SEL pin is internally pulled up in the BCM20705.
•
Use the 26 MHz option by setting CFG_SEL low.
•
Designate the reference frequency in external NVRAM
•
Auto-detect the standard handset reference frequencies using an external LPO clock
For PC and embedded applications where there typically won’t be an LPO clock, if autobaud is enabled, the
BCM20705 will use XTAL to sync up with the UART, thus allowing a user to download a firmware configuration
without having to make a crystal frequency assumption. Alternatively, the BCM20705 will upload the firmware
configuration from an attached NVRAM (if one is attached) and use it to make a crystal frequency assumption.
Finally, if neither of the above is true, then the BCM20705 will look at the status of the CFG_SEL pin and decide
whether to choose 20 or 26 MHz. Autobaud is only valid for UART applications.
The 20 MHz choice is only a default in the sense that if the pin is left floating, it will be pulled up internally to
support the 20 MHz option.
If the application requires a frequency other than the default, the value can be stored in an external NVRAM.
Programming the reference frequency in NVRAM provides the maximum flexibility in the selection of the
reference frequency, since any frequency within the specified range for crystal and external frequency reference
can be used. During power-on reset (POR), the device downloads the parameter settings stored in NVRAM,
which can be programmed to include the reference frequency and frequency trim values. Typically, this is how
a PC Bluetooth application is configured.
For applications such as handsets and portable smart communication devices, where the reference frequency is
one of the standard frequencies commonly used, the BCM20705 automatically detects the reference frequency and
programs itself to the correct reference frequency. In order for auto-frequency detection to work properly, the
BCM20705 must have a valid and stable 32.768 kHz external LPO clock present during POR. This eliminates the
need for NVRAM in applications where the external LPO clock is available and an external NVRAM is typically not
used.
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 38
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Frequency Trimming
Frequency Trimming
The BCM20705 uses a fractional-N synthesizer to digitally fine-tune the frequency reference input to within ±2
ppm tuning accuracy. This trimming function can be applied to either the crystal or an external frequency source
such as a TCXO. Unlike the typical crystal-trimming methods used, the BCM20705 changes the frequency using
a fully digital implementation and is much more stable and unaffected by crystal characteristics or temperature.
Input impedance and loading characteristics remain unchanged on the TCXO or crystal during the trimming
process and are unaffected by process and temperature variations.
The option to use or not use frequency trimming is based on the system designer’s cost trade-off between billof-materials (BOM) cost of the crystal and the added manufacturing cost associated with frequency trimming.
The frequency trimming value can either be stored in the host and written to the BCM20705 as a vendor-specific
HCI command or stored in NVRAM and subsequently recalled during POR.
Frequency trimming is not a substitute for the poor use of tuning capacitors at an crystal oscillator (XTAL).
Occasionally, trimming can help alleviate hardware changes.
LPO Clock Interface
The LPO clock is the second frequency reference that the BCM20705 uses to provide low-power mode timing
for sniff. The LPO clock can be provided to the device externally, from a 32.768 kHz source or the BCM20705
can operate using the internal LPO clock.
The LPO can be internally driven from the main clock. However, sleep current will be impacted.
The accuracy of the internal LPO limits the maximum sniff intervals.
Table 5: External LPO Signal Requirements
Parameter
External LPO Clock
Units
Nominal input frequency
32.768
kHz
Frequency accuracy
±250
ppm
Input signal amplitude
200 to 3600
mVp-p
Signal type
Square-wave or sine-wave
–
Input impedance (when power is applied or power is off)
>100
<5
kΩ
pF
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 39
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Pin-out and Signal Descriptions
S e c t i o n 7 : P i n - ou t a n d S i g n a l D e s c ri p t i o n s
Pin Descriptions
Table 6: BCM20705 Signal Descriptions
WFBGA Pin
(50-Ball)
I/O
Power
Domain
RES
F3
O
VDD_RF
External calibration resistor,
15 kΩ @ 1%
RFP
D1
I/O
VDD_RF
RF I/O antenna port
XIN
G2
I
VDD_RF
Crystal or reference input
XOUT
G3
O
VDD_RF
Crystal oscillator output
B4
I
VDDRF
External LPO input
Signal
Description
Radio
Analog
LPO_IN
Voltage Regulators
REG_EN
B2
I
VDDO
HV LDO and main enable
VBAT
A3
I
N/A
HV LDO input
VREGHV
A2
I/O
N/A
HV LDO output: main LDO input
VREG
A1
O
N/A
Main LDO output
CFG_SEL
B8
I/O
VDDO
This pin is floating for the 20 MHz XTAL option and
tied to ground for the 26 MHz XTAL option.
OTP_DIS
B7
I/O
VDDO
OTP disable pin. By default, leave this pin floating.
RST_N
A4
I
VDDO
Active-low reset input
TM0
–
I
VDDO
Clock request polarity select
TM1
–
I
VDDO
Internally connected to ground
TM2
E3
I
VDDO
Reserved: connect to ground.
GPIO_0
B5
I/O
VDDO
GPIO/BT_WAKE
GPIO_1
B3
I/O
VDDO
GPIO/HOST_WAKE.
GPIO_3
D8
I/O
VDDO
GPIO/LINK_IND
Note: Can be configured for active high or low as
well as open drain.
GPIO_4
–
I/O
VDDO
GPIO
GPIO_5
F4
I/O
VDDO
GPIO/CLK_REQ
TCXO-OR Function Out available on some
packages. See Section 11: “Ordering Information,”
on page 65.
Straps
Digital I/O
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 40
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Pin Descriptions
Table 6: BCM20705 Signal Descriptions (Cont.)
Signal
WFBGA Pin
(50-Ball)
I/O
Power
Domain
GPIO_6
E4
I/O
VDDO
GPIO
TCXO-OR Function In available on some
packages. See Section 11: “Ordering Information,”
on page 65.
GPIO_7
C7
I/O
VDDO
DETATCH/CARD_DETECT
UART_RXD
D7
I/O
VDDO
UART receive data
UART_TXD
F6
I/O
VDDO
UART transmit data
UART_RTS_N
E5
I/O
VDDO
UART request to send output
UART_CTS_N
G7
I/O
VDDO
UART clear to send input
SCL
F7
I/O
VDDO
BSC clock
SDA
E7
I/O
VDDO
BSC data
SPIM_CLK
E8
I/O
VDDO
Serial flash SPI clock
SPIM_CS_N
G8
I/O
VDDO
Serial flash active-low chip select
PCM_IN
G6
I/O
VDDO
PCM/I2S data input
PCM_OUT
F5
I/O
VDDO
PCM/I2S data output
PCM_CLK
G5
I/O
VDDO
PCM/I2S clock
Description
PCM_SYNC
C4
I/O
VDDO
PCM sync/I2S word select
COEX_IN
B6
I/O
VDDO
Coexistence input
HUSB_DP
A8
I/O
VDD_USB
USB hub. If not used, connect to GND.
HUSB_DN
A7
I/O
VDD_USB
If not used, connect to GND.
VDDIF
B1
I
N/A
Radio IF PLL supply
VDDTF
C1
I
N/A
Radio PA supply
VDDLNA
E1
I
N/A
Radio LNA supply
VDDRF
F1
I
N/A
Radio supply
VDDPX
G1
I
N/A
Radio RF PLL supply
VDDC
A6
I
N/A
Core logic supply
USB
Supplies
VDDC
F8
I
N/A
Core logic supply
VDDC
–
I
N/A
Core logic supply
VDDO
G4
I
N/A
Digital I/O supply voltage
VDDO
A5
I
N/A
Digital I/O supply voltage
VDDO
E6
I
N/A
Digital I/O supply voltage
VDD_USB
C8
I
N/A
USB transceiver supply voltage. If not used,
connect to GND.
VSS
C2
–
N/A
Ground
VSS
D2
–
N/A
Ground
VSS
F2
–
N/A
Ground
VSS
D3
–
N/A
Ground
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 41
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Pin Descriptions
Table 6: BCM20705 Signal Descriptions (Cont.)
Signal
WFBGA Pin
(50-Ball)
I/O
Power
Domain
Description
VSS
C6
–
N/A
Ground
VSS
–
–
N/A
Ground
VSS
–
–
N/A
Ground
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 42
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Ball Grid Arrays
S e c t io n 8 : B a l l G r i d A r r a y s
Figure 9 shows the top view of the following array:
•
50-ball 4.5 x 4 x 0.8 mm (WFBGA)
Figure 9: 4.5 x 4 x 0.8 mm (WFBGA) Array
1
2
3
4
5
6
7
8
A
B
C
D
E
F
G
Table 7: Ball-Out for the 50-Ball WFBGA
1
2
3
4
5
6
7
8
A VREG
VREGHV VBAT
RST_N
VDDO
VDDC
HUSB_DN
HUSB_DP
B VDDIF
REG_EN GPIO_1
LPO_IN
GPIO_0
COEX_IN
OTP_DIS
CFG_SEL
C VDDTF
VSS
–
PCM_SYNC
–
VSS
GPIO_7
VDD_USB
D RFP
VSS
VSS
–
–
–
UART_RXD
GPIO_3
–
TM2
GPIO_6
UART_RTS_ VDDO
N
SDA
SPIM_CLK
VSS
RES
GPIO_5
PCM_OUT
UART_TXD SCL
XIN
XOUT
VDDO
PCM_CLK
PCM_IN
E
VDDLNA
F VDDRF
G
VDDPX
Broadcom®
November 13, 2014 • MCS20705-DS104-R
VDDC
UART_CTS_ SPIM_CS_N
N
Bluetooth Transceiver and Baseband Processor
Page 43
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Electrical Characteristics
Section 9: Electrical Characteristics
Note: All voltages listed in Table 8 are referenced to VDD.
Table 8: Absolute Maximum Voltages
Rating
Symbol
a
Minimum
Typical
Maximum
Unit
–
1.22
1.32
V
DC supply voltage for RF
VDD_RF
DC supply voltage for core
VDDC
–
1.22
1.32
V
DC supply voltage for I/O
VDDO b
–
1.8
3.6
V
DC supply
VDDTF
–
1.12
3.3 c
V
Voltage on input or output pin
VIMAX, VIMIN VSS – 0.3
–
VDDO + 0.3 V
Storage temperature range
TSTG
–
125
–40
°C
a. VDD_RF collectively refers to the VDDIF, VDDLNA, VDDPX, and VDDRF RF power supplies.
b. If VDDO is not applied, voltage should never be applied to any digital I/O pins (I/O pins should never be driven
or pulled high). The list of digital I/O pins includes the following (these pins are listed in Section 7: “Pin-out and
Signal Descriptions,” on page 40 with VDDO shown as their power domain):
GPIO[3], GPIO[5], GPIO[6]
SCL, SDA
N_MODE
SPIM_CS_N, SPIM_CLK
c. VDDTF for Class 2 must be connected to VREG (main LDO output). VDDTF for Class 1 must be connected to
VREGHV (HV LDO output) or an external voltage source. Refer to the Broadcom compatibility guide for
configuration details.
Broadcom®
November 13, 2014 • MCS20705-DS104-R
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BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Electrical Characteristics
Table 9: Power Supply
Parameter
Symbol
DC supply voltage for RF
DC supply noise for RF, from 100 kHz to
1 MHz
DC supply voltage for core
DC supply voltage for I/O
DC supply voltage for USB
DC supply
Minimum
Typical
Maximum
Unit
a
VDD_RF
VDD_RF b
1.159
–
1.22
–
1.281
150
V
μV rms
VDDC
VDDO
VDD_USB
VDDTF c
1.159
1.7
3.0
1.12
1.22
–
3.3
–
1.281
3.6
3.6
3.0d
V
V
V
V
a. VDD_RF collectively refers to the VDDIF, VDDLNA, VDDPX, VDDLNA, VDDRF RF power supplies.
b. Overall performance defined using integrated regulation.
c. VDDTF for Class 2 must be connected to VREG (main LDO output). VDDTF for Class 1 must be connected to
VREGHV (HV LDO output) or an external voltage source. Refer to the Broadcom compatibility guide for
configuration details. VDDTF requires a capacitor to ground. The value of the capacitor must be tuned to
ensure optimal RF RX sensitivity. Typical 10 pF for BGA packages and 6.2 pF for wafer package. The value
may depend on board layout.
d. Can be 3.3V if the output power is limited to 9 dBm.
Table 10: High-Voltage Regulator (HV LDO) Electrical Specifications
Parameter
Minimum
Typical
Maximum
Unit
Input voltage
Output voltage
Max current load
Load capacitance
Load capacitor ESR
PSRR
Turn-on time (Cload = 2.2 μF)
Dropout voltage
2.3
1.8
–
1
0.01
20
–
–
–
–
–
–
–
–
–
–
5.5
3.3
95
10
2
40
200
200
V
V
mA
μF
Ω
dB
μs
mV
Table 11: Main Regulator (Main LDO) Electrical Specifications
Parameter
Minimum
Typical
Maximum
Unit
Input voltage
Output voltage
Load current
Load capacitance
ESR
Turn-on time
PSRR
Dropout voltage
1.63
1.159
–
1
0.1
–
15
–
–
1.22
–
–
–
–
–
–
3.63
1.281
60
2.2
0.5
300
–
200
V
V
mA
μF
Ω
μs
dB
mV
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 45
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Electrical Characteristics
Table 12: Digital I/O Characteristics
Characteristics
Symbol
Minimum
Typical
Maximum
Unit
Input low voltage (VDDO = 3.3V)
VIL
–
–
0.8
V
Input high voltage (VDDO = 3.3V)
VIH
2.0
–
–
V
Input low voltage (VDDO = 1.8V)
VIL
–
–
0.6
V
Input high voltage (VDDO = 1.8V)
VIH
1.1
–
–
V
Output low voltage
VOL
–
–
0.4
V
Output high voltage
VOH
VDDO –
0.4V
–
–
V
Input low current
IIL
–
–
1.0
μA
Input high current
IIH
–
–
1.0
μA
Output low current (VDDO = 3.3V, VOL = 0.4V) IOL
–
–
3.0
mA
Output high current (VDDO = 3.3V, VOH = 2.9V) IOH
–
–
3.0
mA
Output low current (VDDO = 1.8V, VOL = 0.4V) IOL
–
–
3.0
mA
Output high current (VDDO = 1.8V, VOH = 1.4V) IOH
–
–
3.0
mA
Input capacitance
–
–
0.4
pF
CIN
Note: GPIO_3/LINK_IND has a 10 mA IOH or IOL driver current that can be used for an LED. By default, the
drive strength settings specified in Table 12 are for 3.3V. To achieve the required drive strength for a VDDO of
2.5V or 1.8V, contact a Broadcom technical support representative (see “Technical Support” on page 8 for
contact information).
Table 13: Pad I/O Characteristicsa
Pad Name
Pull-Up/Pull-Down
Fail-Safe
COEX_IN
Y
Y
PCM_CLK
Y
Y
PCM_OUT
Y
Y
PCM_IN
Y
Y
PCM_SYNC
Y
Y
UART_RTS_N
Y
Y
UART_CTS_N
Y
Y
UART_RXD
Y
Y
UART_TXD
Y
Y
GPIO_0
Y
Y
GPIO_1
Y
Y
GPIO_4
Y
Y
GPIO_7
Y
Y
RST_N
N/A
Y
USB D+
N/A
Y
USB D-
N/A
Y
CFG_SEL
Y
N
OTP_DIS
Y
N
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 46
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Electrical Characteristics
a. All digital I/O internal pull-up or pull-down values are around 60 kΩ. This does not include the USB signals.
Table 14: USB Interface Level
Parameter
Symbol
Minimum
Typical
Maximum
Unit
I/O supply voltage
VDD_USB
3.0
–
3.6
V
Supply current
Icchpf
–
–
500
mA
Input high voltage (driven)
Vih
2.0
–
–
V
Input high voltage (floating)
Vihz
2.7
–
3.6
V
Input low voltage
Vil
–
–
0.8
V
Differential input sensitivity
Vdi
0.2
–
–
V
Differential common-mode range
Vcm
0.8
–
2.5
V
Output low voltage
Vol
0.0
–
0.3
V
Output high voltage (driven)
Voh
2.8
–
3.6
V
Output signal crossover voltage
Vcrs
1.3
–
2.0
V
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 47
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Electrical Characteristics
Table 15: Current Consumption—Class 1(10 dBm)
Operational Mode
Conditions
Typica Unit
l
s
Receive (1 Mbps)
Current level during receive of a basic rate packet
31
mA
Transmit (1 Mbps)
Current level during transmit of a basic rate packet, GFSK output
power = 10 dBm
65
mA
Receive (EDR)
Current level during receive of a 2 or 3 Mbps rate packet
32
mA
Transmit (EDR)
Current level during transmit of a 2 or 3 Mbps rate packet, GFSK
output power = 10 dBm
59
mA
DM1/DH1
Average current during basic rate max throughput connection
which includes only this packet type.
45
mA
DM3/DH3
Average current during basic rate max throughput connection
which includes only this packet type.
46
mA
DM5/DH5
Average current during max basic rate throughput connection
which includes only this packet type.
48
mA
HV1
Average current during SCO voice connection consisting of only
this packet type. ACL channel is in 500 ms sniff.
38
mA
HV2
Average current during SCO voice connection consisting of only
this packet type. ACL channel is in 500 ms sniff.
23
mA
HV3
Average current during SCO voice connection consisting of only
this packet type. ACL channel is in 500 ms sniff.
17
mA
HCI only active
Average current when waiting for HCI command UART, USB, or SPI 4.8
transports.
mA
Sleep
UART transport active, external LPO clock available.
55
μA
Sleep, HV Reg Bypass
UART transport active, external LPO clock available, HV LDO
disabled and in bypass mode.
45
μA
Inquiry Scan (1.28 sec)
Periodic scan rate is 1.28 sec.
350
μA
Page Scan (R1)
Periodic scan rate is R1 (1.28 sec).
350
μA
Inquiry Scan + Page
Scan (R1)
Both inquiry and page scans are interlaced together at 1.28 sec
periodic scan rate.
630
μA
Sniff master (500 ms)
Attempt and timeout parameters set to 4. Quality connection
which rarely requires more than minimum packet exchange.
175
μA
Sniff slave (500 ms)
Attempt and timeout parameters set to 4. Quality connection
which rarely requires more than minimum packet exchange. Sniff
master follows optimal sniff protocol of BCM20705 master.
160
μA
Sniff (500 ms) + Inquiry/ Same conditions as Sniff master and Page Scan (R1). Scan maybe 455
Page Scan (R1)
either Inquiry Scan or Page Scan at 1.28 sec periodic scan rate.
μA
Sniff (500ms) + Inquiry
Scan + Page Scan (R1)
μA
Same conditions as Sniff master and Inquiry Scan + Page Scan.
Broadcom®
November 13, 2014 • MCS20705-DS104-R
760
Bluetooth Transceiver and Baseband Processor
Page 48
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Electrical Characteristics
Table 16: Current Consumption—Class 2 (3 dBm)
Operational Mode
Conditions
Typical Units
Receive (1 Mbps)
Current level during receive of a basic rate packet
31
mA
Transmit (1 Mbps)
Current level during transmit of a basic rate packet, GFSK output
power = 3 dBm
44
mA
Receive (EDR)
Current level during receive of a 2 or 3 Mbps rate packet
32
mA
Transmit (EDR)
Current level during transmit of a 2 or 3 Mbps rate packet, GFSK
output power = 3 dBm
41
mA
DM1/DH1
Average current during basic rate max throughput connection
which includes only this packet type.
35
mA
DM3/DH3
Average current during basic rate max throughput connection
which includes only this packet type.
36
mA
DM5/DH5
Average current during max basic rate throughput connection
which includes only this packet type.
37
mA
HV1
Average current during SCO voice connection consisting of only
this packet type. ACL channel is in 500 ms sniff.
28
mA
HV2
Average current during SCO voice connection consisting of only
this packet type. ACL channel is in 500 ms sniff.
17
mA
HV3
Average current during SCO voice connection consisting of only
this packet type. ACL channel is in 500 ms sniff.
13
mA
HCI only active
Average current when waiting for HCI command UART, USB, or SPI 4.8
transports.
mA
Sleep
UART transport active, external LPO clock available.
55
μA
Sleep, HV Reg Bypass UART transport active, external LPO clock available, HV LDO
disabled and in bypass mode.
45
μA
Inquiry Scan (1.28 sec) Periodic scan rate is 1.28 sec.
350
μA
Page Scan (R1)
Periodic scan rate is R1 (1.28 sec).
350
μA
Inquiry Scan + Page
Scan (R1)
Both inquiry and page scans are interlaced together at 1.28 sec
periodic scan rate.
630
μA
Sniff master (500 ms)
Attempt and timeout parameters set to 4. Quality connection
which rarely requires more than minimum packet exchange.
145
μA
Sniff slave (500 ms)
Attempt and timeout parameters set to 4. Quality connection
which rarely requires more than minimum packet exchange. Sniff
master follows optimal sniff protocol of BCM20705 master.
135
μA
Sniff (500 ms) + Inquiry/ Same conditions as Sniff master and Page Scan (R1). Scan maybe 425
Page Scan (R1)
either Inquiry Scan or Page Scan at 1.28 sec periodic scan rate.
μA
Sniff (500 ms) + Inquiry Same conditions as Sniff master and Inquiry Scan + Page Scan.
Scan + Page Scan (R1)
μA
730
Table 17: Operating Conditions
Parameter
Conditions
Minimum
Typical
Maximum
Unit
Temperature
Commercial
–30.0
–
85
°C
Power supply
RF, Core
1.14
1.22
1.32
V
PA supply (VDDTF)
Reduced power level
1.14
3.0
3.3
V
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 49
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
RF Specifications
RF Specifications
Table 18: Receiver RF Specificationsa,
b
Conditions
Minimum Typical c
Maximum Unit
–
2402
–
2480
MHz
GFSK, 0.1% BER, 1 Mbps
–
–89
–85
dBm
/4-DQPSK, 0.01% BER,
–
–91
–85
dBm
8-DPSK, 0.01% BER, 3 Mbps –
–86
–81
dBm
Maximum input
GFSK, 1 Mbps
–
–
–20
dBm
Maximum input
/4-DQPSK, 8-DPSK, 2/
–
–
–20
dBm
C/I cochannel
GFSK, 0.1% BER
–
–
11
dB
C/I 1 MHz adjacent channel
GFSK, 0.1% BER
–
–
0
dB
C/I 2 MHz adjacent channel
GFSK, 0.1% BER
–
–
–30.0
dB
C/I > 3 MHz adjacent channel
GFSK, 0.1% BER
–
–
–40.0
dB
C/I image channel
GFSK, 0.1% BER
–
–
–9.0
dB
C/I 1 MHz adjacent to image
channel
GFSK, 0.1% BER
–
–
–20.0
dB
C/I cochannel
–
–
13
dB
–
–
0
dB
C/I 2 MHz adjacent channel
/4-DQPSK, 0.1% BER
/4-DQPSK, 0.1% BER
/4-DQPSK, 0.1% BER
–
–
–30.0
dB
C/I > 3 MHz adjacent channel
8-DPSK, 0.1% BER
–
–
–40.0
dB
C/I image channel
/4-DQPSK, 0.1% BER
/4-DQPSK, 0.1% BER
–
–
–7.0
dB
–
–
–20.0
dB
C/I cochannel
8-DPSK, 0.1% BER
–
–
21
dB
C/I 1 MHz adjacent channel
8-DPSK, 0.1% BER
–
–
5
dB
C/I 2 MHz adjacent channel
8-DPSK, 0.1% BER
–
–
–25.0
dB
C/I > 3 MHz adjacent channel
8-DPSK, 0.1% BER
–
–
–33.0
dB
C/I Image channel
8-DPSK, 0.1% BER
–
–
0
dB
C/I 1 MHz adjacent to image
channel
8-DPSK, 0.1% BER
–
–
–13.0
dB
Parameter
General
Frequency range
RX sensitivity
d
2 Mbps
3 Mbps
Interference Performance
C/I 1 MHz adjacent channel
C/I 1 MHz adjacent to image
channel
Out-of-Band Blocking Performance (CW) e
30 MHz–2000 MHz
0.1% BER
–
–10.0
–
dBm
2000–2399 MHz
0.1% BER
–
–27
–
dBm
2498–3000 MHz
0.1% BER
–
–27
–
dBm
3000 MHz–12.75 GHz
0.1% BER
–
–10.0
–
dBm
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 50
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
RF Specifications
Table 18: Receiver RF Specificationsa,
Parameter
Conditions
b
(Cont.)
Minimum Typical c
Maximum Unit
Out-of-Band Blocking Performance, Modulated Interferer
776–764 MHz
CDMA
–
–15
–
dBm
824–849 MHz
CDMA
–
–15
–
dBm
1850–1910 MHz
CDMA
–
–20
–
dBm
824–849 MHz
EDGE/GSM
–
–10
–
dBm
880–915 MHz
EDGE/GSM
–
–10
–
dBm
1710–1785 MHz
EDGE/GSM
–
–15
–
dBm
1850–1910 MHz
EDGE/GSM
–
–15
–
dBm
1850–1910 MHz
WCDMA
–
–25
–
dBm
1920–1980 MHz
WCDMA
–
–25
–
dBm
–
–39.0
–
–
dBm
30 MHz to 1 GHz
–
–
–
–57
dBm
1 GHz to 12.75 GHz
–
–
–
–47
dBm
65 MHz to 108 MHz
FM Rx
–
–145
–
dBm/Hz
Intermodulation Performance
BT, Df = 5 MHz
Spurious Emissions
f
g
746 MHz to 764 MHz
CDMA
–
–145
–
dBm/Hz
851–894 MHz
CDMA
–
–145
–
dBm/Hz
925–960 MHz
EDGE/GSM
–
–145
–
dBm/Hz
1805–1880 MHz
EDGE/GSM
–
–145
–
dBm/Hz
1930–1990 MHz
PCS
–
–145
–
dBm/Hz
2110–2170 MHz
WCDMA
–
–145
–
dBm/Hz
a.
b.
c.
d.
e.
f.
All specifications are single ended. Unused inputs are left open.
All specifications, except typical, are for industrial temperatures. For details see Table 17 on page 49.
Typical operating conditions are 1.22V operating voltage and 25°C ambient temperature.
The receiver sensitivity is measured at BER of 0.1% on the device interface.
Meets this specification using front-end band pass filter.
f0 = -64 dBm Bluetooth-modulated signal, f1 = –39 dBm sine wave, f2 = –39 dBm Bluetooth-modulated signal,
f0 = 2f1 – f2, and |f2 – f1| = n*1 MHz, where n is 3, 4, or 5. For the typical case, n = 5.
g. Includes baseband radiated emissions.
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 51
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
RF Specifications
Table 19: Transmitter RF Specifications
Parameter
Conditions
a, b
Minimum Typical
Maximum Unit
General
Frequency range
–
2402
–
2480
MHz
Class1: GFSK Tx power c
–
6.5
10
–
dBm
Class1: EDR Tx power d
–
4.5
8
–
dBm
Class 2: GFSK Tx power
–
–1.5
2
–
dBm
Power control step
–
2
4
6
dB
–
–10
–
10
kHz
–
–
–
20
%
Modulation Accuracy
/4-DQPSK Frequency Stability
/4-DQPSK RMS DEVM
/4-QPSK Peak DEVM
/4-DQPSK 99% DEVM
–
–
–
35
%
–
–
–
30
%
8-DPSK frequency stability
–
–10
–
10
kHz
8-DPSK RMS DEVM
–
–
–
13
%
8-DPSK Peak DEVM
–
–
–
25
%
8-DPSK 99% DEVM
–
–
–
20
%
+500 kHz
–
–
–
–20
dBc
1.0 MHz < |M – N| < 1.5 MHz
–
–
–
–26
dBc
1.5 MHz < |M – N| < 2.5 MHz
–
–
–
–20
dBm
|M – N| > 2.5 MHz
–
–
–
–40
dBm
In-Band Spurious Emissions
Out-of-Band Spurious Emissions
30 MHz to 1 GHz
–
–
–
–36.0 e
dBm
1 GHz to 12.75 GHz
–
–
–
–30.0 e, f
dBm
1.8 GHz to 1.9 GHz
–
–
–
–47.0
dBm
5.15 GHz to 5.3 GHz
–
–
–
–47.0
dBm
–150
–127
dBm/Hz
GPS Band Noise Emission (without a front-end band pass filter)
1572.92 MHz to 1577.92 MHz
–
–
Out-of-Band Noise Emissions (without a front-end band pass filter)
65 MHz to 108 MHz
FM Rx
–
–145
–
dBm/Hz
746 MHz to 764 MHz
CDMA
–
–145
–
dBm/Hz
869 MHz to 960 MHz
CDMA
–
–145
–
dBm/Hz
925 MHz to 960 MHz
EDGE/GSM
–
–145
–
dBm/Hz
1805 MHz to 1880 MHz
EDGE/GSM
–
–145
–
dBm/Hz
1930 MHz to 1990 MHz
PCS
–
–145
–
dBm/Hz
2110 MHz to 2170 MHz
WCDMA
–
–145
–
dBm/Hz
a.
b.
c.
d.
All specifications are for industrial temperatures. For details, see Table 17 on page 49.
All specifications are single-ended. Unused input are left open.
+10 dBm output for GFSK measured with VDDTF = 2.9 V.
+8 dBm output for EDR measured with VDDTF = 2.9 V.
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 52
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
RF Specifications
e. Maximum value is the value required for Bluetooth qualification.
f. Meets this spec using a front-end bandpass filter.
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 53
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Timing and AC Characteristics
Timing and AC Characteristics
In this section, use the numbers listed in the reference column to interpret the timing diagrams.
Startup Timing
There are two basic startup scenarios. In one scenario, the chip startup and firmware boot is held off while the
RST_N pin is asserted. In the second scenario, the chip startup and firmware boot is directly triggered by the
chip power-up. In this case, an internal power-on reset (POR) is held for a few ms, after which the chip
commences startup.
The global reset signal in the BCM20705 is a logical OR (actually a wired AND, since the signals are active low)
of the RST_N input and the internal POR signals. The last signal to be released determines the time at which
the chip is released from reset. The POR is typically asserted for 3 ms after VDDC crosses the 0.8V threshold,
but it may be as soon as 1.5 ms after this event.
After the chip is released from reset, both startup scenarios follow the same sequence, as follows:
1. For the BCM20705A1KWFBG parts: after approximately 120 μs, the CLK_REQ (GPIO_5) signal is asserted
(not available on BCM20705B0KWFBG parts).
2. The chip remains in sleep state for a minimum of 4.2 ms.
3. If present, the crystal (or TCXO) and LPO clocks must be oscillating by the end of the 4.2 ms period.
If a TCXO clock is not in the system, a crystal is assumed to be present at the XIN and XOUT pins. If an LPO
clock is not used, the firmware will detect the absence of a clock at the LPO_IN lead and use the internal LPO
clock instead.
The following two figures illustrate two startup timing scenarios.
Note: The GPIO5 (CLK_REQ) waveform does not apply to the BCM20705B0KWFBG.
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 54
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Timing and AC Characteristics
trampmax = 200 μs
VDDIO, VBAT,REG_EN
VDDC > 0.8V
VREG
t = 800 μs
tmin= 1.5 ms
Internal POR
t = 64 to 171 μs
GPIO5 (CLK_REQ)
tmax = 4.2 ms
XTAL/TCXO
LPO
Figure 10: Startup Timing from Power-on Reset
Note: The GPIO5 (CLK_REQ) waveform does not apply to the BCM20705B0KWFBG.
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 55
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Timing and AC Characteristics
USB Full-Speed Timing
Table 20 through Table 25 shows timing specifications for VDD_USB = 3.3V, VSS = 0V, and TA = 0 to 85oC
operating temperature range.
Table 20: USB Full-Speed Timing Specifications
Reference
Characteristics
Minimum
Maximum
Unit
1
Transition rise time
4
20
ns
2
Transition fall time
4
20
ns
3
Rise/fall timing matching
90
111
%
4
Full-speed data rate
12 – 0.25%
12 + 0.25%
Mb/s
Figure 11: USB Full-Speed Timing
2
1
D+
90%
90%
VCRS
10%
10%
D-
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 56
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Timing and AC Characteristics
UART Timing
Table 21: UART Timing Specifications
Reference
Characteristics
Minimum
Maximum
Unit
1
Delay time, UART_CTS_N low to UART_TXD valid
–
24
Baudout
cycles
2
Setup time, UART_CTS_N high before midpoint of stop bit –
10
ns
3
Delay time, midpoint of stop bit to UART_RTS_N high
2
Baudout
cycles
–
Figure 12: UART Timing
UART_CTS_N
2
1
UART_TXD
Midpoint of STOP
bit
Midpoint of STOP
bit
UART_RXD
3
UART_RTS_N
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 57
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Timing and AC Characteristics
PCM Interface Timing
Table 22: PCM Interface Timing Specifications (Short Frame Synchronization, Master Mode)
Reference
Characteristics
Minimum
Maximum
Unit
1
PCM bit clock frequency
128
2048
kHz
2
PCM bit clock HIGH time
128
–
ns
3
PCM bit clock LOW time
209
–
ns
4
Delay from PCM_BCLK rising edge to PCM_SYNC high
–
50
ns
5
Delay from PCM_BCLK rising edge to PCM_SYNC low
–
50
ns
6
Delay from PCM_BCLK rising edge to data valid on
PCM_OUT
–
50
ns
7
Setup time for PCM_IN before PCM_BCLK falling edge
50
–
ns
8
Hold time for PCM_IN after PCM_BCLK falling edge
10
–
ns
9
Delay from falling edge of PCM_BCLK during last bit
period to PCM_OUT becoming high impedance
–
50
ns
Figure 13: PCM Interface Timing (Short Frame Synchronization, Master Mode)
2
1
3
PCM_BCLK
4
5
PCM_SYNC
6
PCM_OUT
Bit 15 (Previous Frame)
9
Bit 15
Bit 0
HIGH
IMPEDENCE
7
8
PCM_IN
Bit 15 (Previous Frame)
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bit 0
Bit 15
Bluetooth Transceiver and Baseband Processor
Page 58
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Timing and AC Characteristics
Table 23: PCM Interface Timing Specifications (Short Frame Synchronization, Slave Mode)
Reference
Characteristics
Minimum
Maximum
Unit
1
PCM bit clock frequency
128
2048
kHz
2
PCM bit clock HIGH time
209
–
ns
3
PCM bit clock LOW time
209
–
ns
4
Setup time for PCM_SYNC before falling edge of
PCM_BCLK
50
–
ns
5
Hold time for PCM_SYNC after falling edge of PCM_BCLK 10
–
ns
6
Hold time of PCM_OUT after PCM_BCLK falling edge
–
175
ns
7
Setup time for PCM_IN before PCM_BCLK falling edge
50
–
ns
8
Hold time for PCM_IN after PCM_BCLK falling edge
10
–
ns
9
Delay from falling edge of PCM_BCLK during last bit
period
to PCM_OUT becoming high impedance
–
100
ns
Figure 14: PCM Interface Timing (Short Frame Synchronization, Slave Mode)
2
1
3
PCM_BCLK
4
5
PCM_SYNC
6
PCM_OUT
Bit 15 (Previous Frame)
9
Bit 0
Bit 15
HIGH
IMPEDENCE
7
8
PCM_IN
Bit 15 (Previous Frame)
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bit 0
Bit 15
Bluetooth Transceiver and Baseband Processor
Page 59
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Timing and AC Characteristics
Table 24: PCM Interface Timing Specifications (Long Frame Synchronization, Master Mode)
Reference Characteristics
Minimum
Maximum
Unit
1
PCM bit clock frequency
128
2048
kHz
2
PCM bit clock HIGH time
209
–
ns
3
PCM bit clock LOW time
209
–
ns
4
Delay from PCM_BCLK rising edge to PCM_SYNC HIGH
during first bit time
–
50
ns
5
Delay from PCM_BCLK rising edge to PCM_SYNC LOW
during third bit time
–
50
ns
6
Delay from PCM_BCLK rising edge to data valid on
PCM_OUT
–
50
ns
7
Setup time for PCM_IN before PCM_BCLK falling edge
50
–
ns
8
Hold time for PCM_IN after PCM_BCLK falling edge
10
–
ns
9
Delay from falling edge of PCM_BCLK during last bit period –
to PCM_OUT becoming high impedance
50
ns
Figure 15: PCM Interface Timing (Long Frame Synchronization, Master Mode)
2
1
3
PCM_BCLK
4
5
PCM_SYNC
6
PCM_OUT
Bit 0
Bit 1
9
Bit 2
Bit 15
Bit 2
Bit 15
HIGH
IMPEDENCE
7
8
PCM_IN
Bit 0
Bit 1
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 60
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Timing and AC Characteristics
Table 25: PCM Interface Timing Specifications (Long Frame Synchronization, Slave Mode)
Reference
Characteristics
Minimum
Maximum Unit
1
PCM bit clock frequency.
128
2048
kHz
2
PCM bit clock HIGH time.
209
–
ns
3
PCM bit clock LOW time.
209
–
ns
4
Setup time for PCM_SYNC before falling edge of
PCM_BCLK during first bit time.
50
–
ns
5
Hold time for PCM_SYNC after falling edge of PCM_BCLK 10
during second bit period. (PCM_SYNC may go low any time
from second bit period to last bit period).
–
ns
6
Delay from rising edge of PCM_BCLK or PCM_SYNC
(whichever is later) to data valid for first bit on PCM_OUT.
–
50
ns
7
Hold time of PCM_OUT after PCM_BCLK falling edge.
–
175
ns
8
Setup time for PCM_IN before PCM_BCLK falling edge.
50
–
ns
9
Hold time for PCM_IN after PCM_BCLK falling edge.
10
–
ns
10
Delay from falling edge of PCM_BCLK or PCM_SYNC
(whichever is later) during last bit in slot to PCM_OUT
becoming high impedance.
–
100
ns
Figure 16: PCM Interface Timing (Long Frame Synchronization, Slave Mode)
2
1
PCM_BCLK
3
4
5
PCM_SYNC
7
6
PCM_OUT
Bit 0
10
Bit 1
Bit 15
HIGH
IMPEDENCE
8
9
PCM_IN
Bit 0
Bit 1
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bit 15
Bluetooth Transceiver and Baseband Processor
Page 61
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Timing and AC Characteristics
BSC Interface Timing
Table 26: BSC Interface Timing Specifications
Reference
Characteristics
Minimum
Maximum
Unit
1
Clock frequency
–
100
400
800
1000
kHz
2
START condition setup time
650
–
ns
3
START condition hold time
280
–
ns
4
Clock low time
650
–
ns
5
Clock high time
280
–
ns
0
–
ns
timea
6
Data input hold
7
Data input setup time
100
–
ns
8
STOP condition setup time
280
–
ns
9
Output valid from clock
–
400
ns
10
timeb
650
–
ns
Bus free
a. As a transmitter, 300 ns of delay is provided to bridge the undefined region of the falling edge of SCL to avoid
unintended generation of START or STOP conditions
b. Time that the cbus must be free before a new transaction can start.
Figure 17: BSC Interface Timing Diagram
1
5
SCL
2
3
4
7
6
8
SDA
IN
10
9
SDA
OUT
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 62
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Mechanical Information
Section 10: Mechanical Information
Figure 18: 50-Ball WFBGA Mechanical Drawing
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 63
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Tape, Reel, and Packing Specification
Tape, Reel, and Packing Specification
ESD Warning
Figure 19: Reel, Labeling, and Packing Specification
Br
o
Ba adco
rco m
de
Device Orientation/Mix Lot Number
Each reel may contain up to three lot numbers, independent of the date code.
Individual lots must be labeled on the box, moisture barrier bag, and the reel.
Pin 1
Top-right corner toward sprocket holes.




Moisture Barrier Bag Contents/Label
Desiccant pouch (minimum 1)
Humidity indicator (minimum 1)
Reel (maximum 1)
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 64
BROADCOM CONFIDENTIAL
BCM20705 Data Sheet
Ordering Information
S e c t i o n 11 : O r d e r i n g I n f o r m a t i o n
The following table lists available part numbers and describes differences in package type, available I/O, and
functional configuration. See the referenced figures and tables for mechanical drawings and package I/O
information.
All packages are rated from –30°C to +85°C.
Part Number
Package Type
Functional I/O Features
Strapped
Configuration
BCM20705A1KWFBG
Commercial 50-ball WFBGA,
4.5 mm x 4.0 mm x 0.8 mm.
See Figure 18 on page 63
–
–
BCM20705B0KWFBG
Commercial 50-ball WFBGA,
4.5 mm x 4.0 mm x 0.8 mm.
See Figure 18 on page 63
–
–
Broadcom®
November 13, 2014 • MCS20705-DS104-R
Bluetooth Transceiver and Baseband Processor
Page 65
BROADCOM CONFIDENTIAL
BCM2070 Data Sheet
Broadcom® Corporation reserves the right to make changes without further notice to any products or
data herein to improve reliability, function, or design.
Information furnished by Broadcom Corporation is believed to be accurate and reliable. However,
Broadcom Corporation does not assume any liability arising out of the application or use of this
information, nor the application or use of any product or circuit described herein, neither does it
convey any license under its patent rights nor the rights of others.
®
Broadcom Corporation
5300 California Avenue
Irvine, CA 92617
© 2014 by BROADCOM CORPORATION. All rights reserved.
MCS20705-DS104-R
November 13, 2014
Phone: 949-926-5000
Fax: 949-926-5203
E-mail: [email protected]
Web: www.broadcom.com
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