QMS–032–06.75–L–D–DP–A F-217 QMS–026–06.75–L–D–A (0.635 mm) .025" QMS SERIES RUGGED GROUND PLANE HEADER SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QMS Insulator Material: Liquid Crystal Polymer Terminal & Ground Plane Material: Phosphor Bronze Plating: Au over 50 µ" (1.27 µm) Ni (Tin on Ground Plane Tail) Current Rating: Contact: 2.6 A per pin (1 pin powered per row) Ground Plane: 15.7 A per ground plane (1 ground plane powered) Operating Temp: -55 °C to +125 °C Voltage Rating: 300 VAC mated with QFS RoHS Compliant: Yes Integral metal plane for power or ground Board Mates: QFS Cable Mates: 6QCD Standoffs: SO, JSOM Increased insertion depth for rugged applications (1.60 mm) .063" NOMINAL WIPE ALSO AVAILABLE (MOQ Required) • Other platings • Guide Posts • Without PCB Alignment Pins (05.75 and 06.75 only) • Hot Pluggable • 64 (-DP) and 104 positions per row Contact Samtec. HIGH-SPEED CHANNEL PERFORMANCE QMS-DP/QFS-DP @ 10 mm Mated Stack Height Rating based on Samtec reference channel. For full SI performance data visit Samtec.com or contact [email protected] 25 G b p s PROCESSING Lead–Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (026-052) (0.15 mm) .006" max (078) Board Stacking: For applications requiring more than two connectors per board, contact [email protected] RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality PINS PER ROW NO. OF PAIRS QMS –026, –052, –078 (52 total pins per bank = –D) –016, –032, –048 STANDARDS PROTOCOLS • 100 GbE • FIbre Channel • XAUI • PCI Express® • SATA PLATING OPTION Specify LEAD STYLE from chart –L (16 pairs per bank = –D–DP) (–078 & –048 Not available with –09.75 lead style) FILE NO. E111594 • SUMIT™ • PCI/104-Express™ LEAD STYLE LEAD STYLE A –05.75 –06.75 –09.75 QFS LEAD STYLE –04.25 –06.25 (5.38) .212 10 mm 12 mm (6.35) .250 11 mm 13 mm (9.35) .368 14 mm (6.35) .250 (No. of Banks) x (21.34) .840 - (0.51) .020 (21.34) .840 01 (0.635) .025 (0.23) .009 02 A Note: Some lengths, styles and options are non-standard, non-returnable. –D –D–DP –D–DP = Differential Pair = (5.50 mm) .217" DIA Polyimide film Pick & Place Pad APPLICATION STACK HEIGHT (0.44) .017 (0.25) .010 Requires Standoff SO-1524-03-01-01-L or JSOM-1524-02 for 15.24 mm or SO-2215-02-01-01-L for 22 mm board spacing. Connectors designed to not fully seat when mated. (7.52) .296 (7.26) .286 (2.29) .090 = Single-Ended (–09.75 lead style only) = 10 µ" (0.25 µm) Gold on Signal Pins and Ground Plane (Tin on Signal Pin tails, and Ground Plane tails) 16 mm *Processing conditions will affect mated height. See SO Series for board space tolerances. –K –D (–05.75 and –06.75 lead style only) = 10 µ" (0.25 µm) Gold on Signal Pins and Ground Plane (Tin on Signal Pin tails, and Ground Plane tails) –SL MATED HEIGHT* OTHER OPTION A TYPE INTERCONNECTS INDUSTRY STANDARD TERMINAL SOCKET SUMIT™ PCI/104-Express™ PCI/104-Express™ PCI/104-Express™ PCI/104-Express™ ASP-129637-01 ASP-129637-03 ASP-129637-13 ASP-142781-02 ASP-142781-03 ASP-129646-01 ASP-129646-03 ASP-129646-22 ASP-129646-02 ASP-129646-03 WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. STACK BANKS HEIGHT 1 3 1 2 3 15.24 mm 15.24 mm 15.24 mm 22 mm 22 mm