Allegro A3212ELHLT-T Micropower, ultra-sensitive hall-ef fect switch Datasheet

Data Sheet
27622.61G
A3212
MICROPOWER, ULTRA-SENSITIVE
HALL-EFFECT SWITCH
2 x 2 mm MLPD
Package A3212EELLT-T
The A3212 integrated circuit is an ultra-sensitive, pole independent Hall-effect
switch with a latched digital output. This sensor is especially suited for operation in battery-operated, hand-held equipment such as cellular and cordless
telephones, pagers, and palmtop computers. A 2.5 volt to 3.5 volt operation and a
unique clocking scheme reduce the average operating power requirements to less
than 15 µW with a 2.75 volt supply.
Unlike other Hall-effect switches, either a north or south pole of sufficient
strength will turn the output on; in the absence of a magnetic field, the output
is off. The polarity independence and minimal power requirement allow these
devices to easily replace reed switches for superior reliability and ease of manufacturing, while eliminating the requirement for signal conditioning.
Improved stability is made possible through chopper stabilization (dynamic offset cancellation), which reduces the residual offset voltage normally caused by
device overmolding, temperature dependencies, and thermal stress.
Approximate actual size
ABSOLUTE MAXIMUM RATINGS
This device includes on a single silicon chip a Hall-voltage generator, small-signal amplifier, chopper stabilization, a latch, and a MOSFET output. Advanced
BiCMOS processing is used to take advantage of low-voltage and low-power
requirements, component matching, very low input-offset errors, and small component geometries.
Four package styles provide magnetically optimized solutions for most applications. Miniature low-profile surface-mount package types EH and EL
(0.75 and 0.50 mm nominal height) are leadless, LH is a leaded low-profile
SMD, and UA is a three-lead SIP for through-hole mounting. Each package is
available in a lead (Pb) free version (suffix, –T) with 100% matte tin plated leadframe. EL package for limited release, engineering samples available.
Supply Voltage, VDD .............................. 5 V
Magnetic Flux Density, B .......... Unlimited
Output Off Voltage, VOUT ...................... 5 V
FEATURES
■
Micropower Operation
Junction Temperature, TJ ................ +170°C
■
Operation with North or South Pole
Operating Temperature, TA
Range 'E-' .................... -40°C to +85°C
Range 'L-' .................. -40°C to +150°C
■
2.5 V to 3.5 V Battery Operation
■
Chopper Stabilized
Superior Temperature Stability
Extremely Low Switch-Point Drift
Insensitive to Physical Stress
■
ESD Protected to 5 kV
■
Solid-State Reliability
■
Small Size
■
Easily Manufacturable with Magnet Pole Independence
Output Current, IOUT ........................... 1 mA
Storage Temperature Range,
TS .............................. -65°C to +170°C
Caution: These CMOS devices have input
static protection (Class 3) but are still susceptible to damage if exposed to extremely
high static electrical charges.
A3212
MICROPOWER,
ULTRA-SENSITIVE
HALL-EFFECT SWITCH
Product Selection Guide
Use complete part numbers when ordering
Pb-free
Packing*
(Units/Pack)
–
Tape and Reel (3000)
A3212EEHLT–T
Yes
Tape and Reel (3000)
A3212EELLT–T
Yes
Tape and Reel (2000)
–
Tape and Reel (3000)
Yes
Tape and Reel (3000)
–
Bulk Pack (500)
Yes
Bulk Pack (500)
Part Number
A3212EEHLT
A3212ELHLT
A3212ELHLT–T
A3212EUA
A3212EUA–T
A3212LLHLT
A3212LLHLT–T
A3212LUA
A3212LUA–T
–
Tape and Reel (3000)
Yes
Tape and Reel (3000)
–
Bulk Pack (500)
Yes
Bulk Pack (500)
Ambient
Temperature
TA (°C)
Package
Leadless Surface Mount
–40 to 85
3-Pin Surface Mount
SIP-3 Through Hole, Straight Lead
3-Pin Surface Mount
–40 to 150
SIP-3 Through Hole, Straight Lead
*Contact Allegro for additional packaging and handling options.
FUNCTIONAL BLOCK DIAGRAM
SUPPLY
SWITCH
LATCH
OUTPUT
SAMPLE
& HOLD
X
DYNAMIC
OFFSET CANCELLATION
TIMING
LOGIC
GROUND
Dwg. FH-020-5
2
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
3212
MICROPOWER,
ULTRA-SENSITIVE
HALL-EFFECT SWITCH
6
5
4
Dwg. PH-016-2
GROUND
(Leadless Chip Carrier)
NO
CONNECTION
Package Suffix ‘EL’ Pinning
(Leadless Chip Carrier)
SUPPLY
Package Suffix ‘EH’ Pinning
3
X
VDD
V
2
3
OUTPUT
NO
CONNECTION
GROUND
DD
1
2
OUTPUT
GROUND
SUPPLY
1
Dwg. PH-016-1
Package Suffix ‘LH’ Pinning
Package Suffix ‘UA’ Pinning
(SOT23W)
(SIP)
X
3
V
DD
V
2
Dwg. PH-016-1
3
OUTPUT
1
GROUND
OUTPUT
2
GROUND
SUPPLY
1
SUPPLY
DD
Dwg. PH-016
Pinning is shown viewed from branded side.
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3
Copyright © 2002, 2003 Allegro MicroSystems, Inc.
A3212
MICROPOWER,
ULTRA-SENSITIVE
HALL-EFFECT SWITCH
ELECTRICAL CHARACTERISTICS over operating voltage and temperature range (unless
otherwise specified).
Limits
Characteristic
Symbol
Test Conditions
Min.
Typ.
Max.
Units
2.5
2.75
3.5
V
Supply Voltage Range
VDD
Operating1
Output Leakage Current
IOFF
VOUT = 3.5 V, BRPN < B < BRPS
–
<1.0
1.0
µA
Output On Voltage
VOUT
IOUT = 1 mA, VDD = 2.75 V
–
100
300
mV
Awake Time
tawake
–
45
90
µs
Period
tperiod
–
45
90
ms
d.c.
–
0.1
–
%
fC
–
340
–
kHz
Duty Cycle
Chopping Frequency
Supply Current
IDD(EN)
Chip awake (enabled)
–
–
2.0
mA
IDD(DIS)
Chip asleep (disabled)
–
–
8.0
µA
IDD(AVG)
VDD = 2.75 V
–
5.1
10
µA
VDD = 3.5 V
–
6.7
10
µA
NOTES: 1. Operate and release points will vary with supply voltage.
2. BOPx = operate point (output turns on); BRPx = release point (output turns off).
3. Typical Data is at TA = +25°C and VDD = 2.75 V and is for design information only.
MAGNETIC CHARACTERISTICS over operating voltage and temperature range (unless
otherwise specified).
Limits
Characteristic
Symbol
Operate Points
BOPS
Release Points
Hysteresis
Test Conditions
Min.
Typ.
Max.
Units
South pole to branded side
–
37
55
G
BOPN
North pole to branded side
-55
-40
–
G
BRPS
South pole to branded side
10
31
–
G
BRPN
North pole to branded side
–
-34
-10
G
Bhys
|BOPx - BRPx|
–
5.9
–
G
NOTES: 1. Negative flux densities are defined as less than zero (algebraic convention), i.e., -50 G is less than +10 G.
2. BOPx = operate point (output turns on); BRPx = release point (output turns off).
3. Typical Data is at TA = +25°C and VDD = 2.75 V and is for design information only.
4. 1 gauss (G) is exactly equal to 0.1 millitesla (mT).
4
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
3212
MICROPOWER,
ULTRA-SENSITIVE
HALL-EFFECT SWITCH
TYPICAL OPERATING CHARACTERISTICS
SWITCH POINTS
60
60
BOPS
BOPS
40
SWITCH POINTS IN GAUSS
SWITCH POINTS IN GAUSS
40
BRPS
20
VDD = 2.75 V
0
-20
BRPN
-40
BRPS
20
TA = 25°C
0
-20
BRPN
-40
BOPN
BOPN
-60
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE IN ° C
125
-60
2.4
150
2.6
2.8
3.0
3.2
3.4
SUPPLY VOLTAGE IN VOLTS
Dwg. GH-027-3
3.6
Dwg. GH-057-2
SUPPLY CURRENT
7.0
AVERAGE SUPPLY CURRENT IN µA
AVERAGE SUPPLY CURRENT IN µA
7.0
6.0
VDD =3.5 V
VDD =2.75 V
5.0
VDD =2.5 V
4.0
3.0
-50
-25
0
25
50
75
AMBIENT TEMPERATURE IN °C
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100
125
150
Dwg. GH-028-11
6.0
5.0
4.0
3.0
2.4
TA = 25°C
2.6
2.8
3.0
3.2
SUPPLY VOLTAGE IN VOLTS
3.4
3.6
Dwg. GH-058-7
5
A3212
MICROPOWER,
ULTRA-SENSITIVE
HALL-EFFECT SWITCH
FUNCTIONAL DESCRIPTION
Low Average Power. Internal timing circuitry activates the
sensor for 45 µs and deactivates it for the remainder of the period (45 ms). A short "awake" time allows for stabilization prior
to the sensor sampling and data latching on the falling edge of
the timing pulse. The output during the "sleep" time is latched in
the last sampled state. The supply current is not affected by the
output state.
PERIOD
IDD(EN)
"AWAKE"
"SLEEP"
SAMPLE &
OUTPUT LATCHED
B
IDD(DIS)
+V
0
Dwg. WH-017-2
—
HALL
VOLTAGE
+
Dwg. AH-011-2
+V
SAMPLE
& HOLD
Chopper-Stabilized Technique. The Hall element can be
considered as a resistor array similar to a Wheatstone bridge. A
large portion of the offset is a result of the mismatching of these
resistors. These devices use a proprietary dynamic offset cancellation technique, with an internal high-frequency clock to reduce
the residual offset voltage of the Hall element that is normally
caused by device overmolding, temperature dependencies, and
thermal stress. The chopper-stabilizing technique cancels the
mismatching of the resistor circuit by changing the direction of
the current flowing through the Hall plate using CMOS switches
and Hall voltage measurement taps, while maintaing the Hallvoltage signal that is induced by the external magnetic flux. The
signal is then captured by a sample-and-hold circuit and further
processed using low-offset bipolar circuitry. This technique
produces devices that have an extremely stable quiescent Hall
output voltage, are immune to thermal stress, and have precise
recoverability after temperature cycling. A relatively high sampling frequency is used for faster signal processing capability
can be processed.
X
More detailed descriptions of the circuit operation can be found
in: Technical Paper STP 97-10, Monolithic Magnetic Hall Sensor
Using Dynamic Quadrature Offset Cancellation and Technical
Paper STP 99-1, Chopper-Stabilized Amplifiers With A Trackand-Hold Signal Demodulator.
6
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
Dwg. EH-012-1
3212
MICROPOWER,
ULTRA-SENSITIVE
HALL-EFFECT SWITCH
FUNCTIONAL DESCRIPTION (cont'd)
As used here, negative flux densities are defined as less than
zero (algebraic convention), i.e., -50 G is less than +10 G.
Applications. Allegro's pole-independent sensing technique
allows for operation with either a north pole or south pole magnet orientation, enhancing the manufacturability of the device.
The state-of-the-art technology provides the same output polarity
for either pole face.
OUTPUT OFF
5V
MAX
B OPS
B OPN
OUTPUT VOLTAGE
Operation. The output of this device switches low (turns on)
when a magnetic field perpendicular to the Hall sensor exceeds
the operate point BOPS (or is less than BOPN). After turn-on, the
output is capable of sinking up to 1 mA and the output voltage
is VOUT(ON). When the magnetic field is reduced below the
release point BRPS (or increased above BRPN), the device output
switches high (turns off). The difference in the magnetic operate
and release points is the hysteresis (Bhys) of the device. This
built-in hysteresis allows clean switching of the output even
in the presence of external mechanical vibration and electrical
noise.
BRPS
BRPN
OUTPUT ON
0
0
-B
+B
MAGNETIC FLUX
Dwg. GH-043-1
It is strongly recommended that an external bypass capacitor
be connected (in close proximity to the Hall sensor) between the
supply and ground of the device to reduce both external noise
and noise generated by the chopper-stabilization technique. This
is especially true due to the relatively high impedance of battery
supplies.
2
OUTPUT
SUPPLY
(3 V BATTERY)
1
V
DD
3
50 kΩ
10 pF
X
The simplest form of magnet that will operate these devices
is a bar magnet with either pole near the branded surface of the
device. Many other methods of operation are possible. Extensive applications information for Hall-effect sensors is available
in:
• Hall-Effect IC Applications Guide, Application Note 27701;
• Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming, Application Note 27703.1;
• Soldering of Through-Hole Hall-Sensor Dervices, Application
Note 27703; and
• Soldering of Surface-Mount Hall-Sensor Devices, Application
Note 27703.2.
All are provided at
0.1 µF
Dwg. EH-013-2
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7
A3212
MICROPOWER,
ULTRA-SENSITIVE
HALL-EFFECT SWITCH
SENSOR LOCATIONS
Package Designator 'EL'
Package Designator 'EH'
ACTIVE AREA DEPTH
0.013"
0.34 mm
NOM
ACTIVE AREA DEPTH
0.006"
0.16 mm
NOM
0.035"
0.88 mm
6
5
.0406
1.03 mm
3
4
.0291
0.74 mm
0.062"
1.56 mm
BRANDED
SURFACE
BRANDED
SURFACE
A
1
1
3
2
A
2
Dwg. MH-030
Package Designator 'UA'
Package Designator 'LH'
ACTIVE AREA DEPTH
0.011"
0.28 mm
NOM
ACTIVE AREA DEPTH
0.0195"
0.50 mm
NOM
0.056"
1.42 mm
3
0.078"
1.98 mm
0.033"
0.84 mm
0.052"
1.32 mm
A
A
1
2
Dwg. MH-025-2
BRANDED
SURFACE
1
2
3
Dwg. MH-011-13
8
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
3212
MICROPOWER,
ULTRA-SENSITIVE
HALL-EFFECT SWITCH
PACKAGE DESIGNATOR ‘EH'
(Reference MO-229C WCED-1)
2.15 .085
1.85 .073
6
3.15 .124
2.85 .112
A
1
0.30 .012
0.20 .008
0.50 .020
BSC
0.30 .012
BSC
0.80 .031
0.70 .028
0.50 .020
BSC
0.20 .008
REF
6
0.05 .002
0.00 .000
1
1.00 .039
BSC
0.65 .026
0.45 .018
C
3.70 .146
BSC
1.25 .049
BSC
1.324 .052
1.074 .042
0.25 .010
BSC
B
6
1
0.25 .010
BSC
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0.40 .016
BSC
1.142 .045
0.892 .035
Dimensions in millimeters
U.S. Customary dimensions (in.) in brackets, for reference only
A Pin index area
B Exposed thermal pad
C ø0.3 Thermal via (optional)
0.95 .037
BSC
9
3212
MICROPOWER,
ULTRA-SENSITIVE
HALL-EFFECT SWITCH
PACKAGE DESIGNATOR ‘EL'
MLPD 3 Contact
2.00 .079
BSC
3
2.00 .079
BSC
A
1
0.32 .013
0.20 .008
1.350 .053
BSC
0.32 .013
MIN
0.50 .020
0.30 .012
3
0.55 .022
0.45 .018
0.50 .020
BSC
0.325 .013
REF
1.025 .040
MAX
2
0.15 .006
REF
0.05
0.80 .002
.031
0.00
0.70 .000
.028
1
2
0.138 .005
REF
D
0.20 .008
REF
C
0.138 .005
REF
0.15 .006
MIN
1
0.40 .016
NOM
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0.50 .020
BSC
1.025 .040
0.775 .031
B
1.350 .053
1.100 .043
A Pin index area
B Exposed thermal pad
C Optional thermal vias, ∅0.30 [.012], pitch 1.2 [.047]
R0.200 .008
REF
2.40 .094
REF
Dimensions in millimeters
U.S. Customary dimensions (in.)
in brackets, for reference only
3
D Typical pad layout; adjust as necessary to
meet application process requirements
0.325 .013
REF
10
3212
MICROPOWER,
ULTRA-SENSITIVE
HALL-EFFECT SWITCH
PACKAGE DESIGNATOR ‘LH’
(SOT23W, fits SC-59A solder-pad layout)
Dimensions in Inches
(for reference only)
Dimensions in Millimeters
(controlling dimensions)
3.10
2.90
0.122
0.114
0.50
0.30
0.020
0.012
0.083
0.073
3
1
2
0.118
0.106
2.10
1.85
0.010
BSC
3
1
2
3.00
2.70
SEATING PLANE
REF
0° TO 8°
0.037
0.006
0.000
SEATING PLANE
0.55
0.010
REF
0.045
0.032
0° TO 8°
0.95
MIN
BSC
BSC
GAUGE PLANE
GAUGE PLANE
0.022
0.25
MIN
BSC
0.0079
0.0050
0.15
0.00
0.25
0.20
0.127
1.13
0.87
Dwg. MA-010-3D in
Dwg. MA-010-3D mm
0.028
0.70
3
3
1.00
0.039
2.40
0.094
1
1
2
0.037
Dwg. MA-011-3 in
2
0.95
Dwg. MA-011-3 mm
NOTES: 1. Tolerances on package height and width represent allowable mold offsets. Dimensions given are
measured at the widest point (parting line).
2. Exact body and lead configuration at vendor’s option within limits shown.
3. Height does not include mold gate flash.
4. Where no tolerance is specified, dimension is nominal.
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11
A3212
MICROPOWER,
ULTRA-SENSITIVE
HALL-EFFECT SWITCH
PACKAGE DESIGNATOR ‘UA’
Dimensions in Millimeters
(for reference only)
Dimensions in Inches
(controlling dimensions)
0.164
0.159
4.17
4.04
0.062
0.058
45°
1.57
1.47
45°
0.122
0.117
3.10
2.97
45°
45°
0.085
1
2
3
0.031
2.16
1
2
3
16.26
15.24
0.0173
0.0138
0.640
0.600
0.0189
0.0142
SEE NOTE
BSC
0.44
0.35
0.48
0.36
SEE NOTE
1.27
0.050
Dwg. MH-014E in
BSC
NOTES: 1. Tolerances on package height and width represent
allowable mold offsets. Dimensions given are measured
at the widest point (parting line).
2. Exact body and lead configuration at vendor’s option
within limits shown.
3. Height does not include mold gate flash.
4. Recommended minimum PWB hole diameter to clear
transition area is 0.035" (0.89 mm).
5. Where no tolerance is specified, dimension is nominal.
12
0.79
MAX
MAX
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
Dwg. MH-014E mm
3212
MICROPOWER,
ULTRA-SENSITIVE
HALL-EFFECT SWITCH
The products described herein are manufactured under one or
more of the following U.S. patents: 5,045,920; 5,264,783; 5,442,283;
5,389,889; 5,581,179; 5,517,112; 5,619,137; 5,621,319; 5,650,719;
5,686,894; 5,694,038; 5,729,130; 5,917,320; and other patents pending.
Allegro MicroSystems, Inc. reserves the right to make, from time to
time, such departures from the detail specifications as may be required
to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to
verify that the information being relied upon is current.
Allegro products are not authorized for use as critical components
in life-support appliances, devices, or systems without express written
approval.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility
for its use; nor for any infringements of patents or other rights of third
parties that may result from its use.
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