ON LB11862MC Fan motor driver single-phase, full-wave Datasheet

LB11862MC
Fan Motor Driver,
Single-Phase, Full-Wave
Overview
Single-phase full-wave drive design and a compact package make these
ICs optimal for small fans (especially CPU cooling fans). Low switching
noise and effective motor drive are further advantages.
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Features
 Single-phase full-wave drive
 Built-in thermal shutdown circuit.
 Built-in lock protection and automatic recovery circuits
SOIC-10
Typical Applications
 PC power supply system
 CPU cooling fan system
 Refrigerator
 PC
GENERIC
MARKING DIAGRAM*
10
XXXXX
ALYWX
1
SPECIFICATION
ABSOLUTE MAXIMUM RATINGS at Ta = 25C
Parameter
Symbol
Conditions
(Note 1)
Ratings
Unit
Supply voltage
VCC max
17
Output current
IOUT max
0.8
A
Output withstand voltage
VOUT max
17
V
17
V
Output withstand voltage on
VR max
RD output pin
V
RD output current
IR max
5
mA
HB output current
IB max
10
mA
VST max
15
V
Input voltage ST pin
Allowable power dissipation
Operating temperature
Pd max
When mounted
on a circuit
board (Note 2)
Topr
C
Package
SOIC-10
(Pb-Free / Halogen Free)
2. Specified circuit board : 114.3  76.1  1.6mm3, glass epoxy
Shipping (Qty / packing)
2500 / Tape & Reel
† For information on tape and reel specifications, including part
3. Absolute maximum ratings represent the values which cannot be exceeded even for a
moment
4. If you should intend to use this IC continuously under high temperature, high current, high
voltage, or drastic temperature change, even if it is used within the range of absolute
maximum ratings or operating conditions, there is a possibility of decrease reliability. Please
contact us for a confirmation
© Semiconductor Components Industries, LLC, 2015
ORDERING INFORMATION
Ordering Code:
LB11862MC-AH
Storage temperature
Tstg
C
-55 to +150
1. Stresses exceeding those listed in the Absolute Maximum Rating table may damage the
device. If any of these limits are exceeded, device functionality should not be assumed,
damage may occur and reliability may be affected.
September 2015- Rev. 2
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
W
0.75
-40 to +85
XXXXX
A
L
Y
W
1
orientation and tape sizes, please refer to our Tape and Reel
Packaging Specifications Brochure, BRD8011/D.
http://www.onsemi.com/pub_link/Collateral/BRD8011-D.PDF
Publication Order Number:
LB11862MC/D
LB11862MC
Recommended Operating Conditions at Ta = 25C (Note 5)
Parameter
Symbol
Supply voltage
VCC
ST input High-level voltage
ST input Low-level voltage
Hall input common-mode input
Conditions
Ratings
Unit
3.8 to 16.8
V
VSTH
3 to 14
V
VSTL
-0.3 to 0.4
V
VICM
0.2 to VCC-1.5
V
voltage range
5. Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the
Recommended Operating Ranges limits may affect device reliability.
Electrical Characteristics Unless otherwise specified Ta  25C, VCC = 5V (Note 6)
Ratings
Parameter
Symbol
Conditions
Unit
min
Circuit current
ICC1
Operation mode (CT=L, ST=L)
typ
max
12
17
mA
mA
ICC2
Lock protection mode (CT=H, ST=L)
2.5
4.0
ICC2
Standby mode (ST=H)
110
150
A
ICT1
VCT = 0.2V
1.5
2.1
3.0
A
Capacitor discharging current
ICT2
VCT = 3.0V
0.21
0.35
0.50
A
Capacitor charging / discharging
RCT
RCD = ICT1/ICT2
5.0
6.0
8.0
2.55
2.75
2.95
V
1.6
1.8
2.0
V
0.2
0.3
V
7
15
mA
0.1
0.3
V
30
A
1.3
V
Lock detection capacitor charging
current
current ratio
CT charging voltage
CT discharging voltage
VCT1
VCT2
Output Low-level voltage
VOL
IO = 200mA
Output High-level voltage
VOH
IO = 200mA
Hall input sensitivity
VHN
Zero peak value
3.9
4.1
V
(including offset hysteresis)
RD output pin Low-level voltage
VRDL
IRD = 5mA
RD output pin leakage current
IRDL
VRD = 15V
HB output Low-level voltage
VHBL
IHB = 5mA
1.0
ST pin input current
VST = 5V
75
100
A
6. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may
not be indicated by the Electrical Characteristics if operated under different conditions.
IST
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2
LB11862MC
Package Dimensions
unit : mm
SOIC−10 NB
CASE 751BQ
ISSUE B
2X
0.10 C A-B
D
D
A
2X
0.10 C A-B
10
F
6
H
E
1
0.20 C
5
10X
B
2X 5 TIPS
L2
b
0.25
A3
L
DETAIL A
M
C
SEATING
PLANE
C A-B D
TOP VIEW
10X
0.10 C
0.10 C
h
X 45
M
A
e
A1
C
SEATING
PLANE
SIDE VIEW
DETAIL A
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
1.00
PITCH
10X 0.58
6.50
10X 1.18
1
DIMENSION: MILLIMETERS
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3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.10mm TOTAL IN EXCESS OF ’b’
AT MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15mm
PER SIDE. DIMENSIONS D AND E ARE DETERMINED AT DATUM F.
5. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM F.
6. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
DIM
A
A1
A3
b
D
E
e
H
h
L
L2
M
MILLIMETERS
MIN
MAX
1.25
1.75
0.10
0.25
0.17
0.25
0.31
0.51
4.80
5.00
3.80
4.00
1.00 BSC
5.80
6.20
0.37 REF
0.40
0.80
0.25 BSC
0
8
LB11862MC
Pdmax-Ta graph
1.0
Allowable power dissipation, Pd max - W
Specified circuit board : 114.3× 76.1× 1.6mm3
glass epoxy board
0.8
0.6
0.4
0.39
0.2
0
-40
0
40
80
Ambient temperature, Ta - °C
Pin Assignment
IN-
RD
IN+
HB
LB11862MC
CT
ST
OUT1
VCC
GND
OUT2
(TOP VIEW)
Truth Table
ST
High
Low
IN-
IN+
CT
-
-
-
High
Low
Low
High
Low
High
OUT1
OUT2
RD
HB
OFF
OFF
Standby
Low
Low
Operating
OFF
Low
Lock protection
OFF
OFF
High
Low
Low
High
OFF
OFF
(The RD output is latched at “Low”-level in operating mode and “High”-level in stop mode.)
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4
Mode
LB11862MC
Block Diagram
CT
charge/discharge
circuit
RD
Discharging pulse
VCC
Delay circuit
HALL
IN+
IN-
control
circuit
Amplifier with
hysteresis
OUT2
HB
Delay circuit
M
Thermal
protection circuit
OUT1
START/STOP
ST
GND
Application Circuit Example
D1
C2
VCC
RD
H
ININ+
OUT1
OUT2
ST
Motor coil
CT
GND
1.
2.
3.
4.
D1 is for protection against breakdown in case of reverse connection of power supply and mat is deleted when there
is no problem.
C2 is necessary to allow the kick-back regenerative current to flow when C2 is to be used with the coil current of
500mA or more.
CT to be connected to GND when not used.
RD, ST and HB pins to be OPEN when not used.
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5
LB11862MC
ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States
and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of
SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf . SCILLC reserves the right to make changes without
further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose,
nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including
without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can
and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are
not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or
sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was
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