TI1 MSP430F5517IPN Mixed-signal microcontroller Datasheet

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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
MSP430F552x, MSP430F551x Mixed-Signal Microcontrollers
1 Device Overview
1.1
Features
1
• Low Supply Voltage Range:
3.6 V Down to 1.8 V
• Ultra-Low Power Consumption
– Active Mode (AM):
• All System Clocks Active:
– 290 µA/MHz at 8 MHz, 3.0 V, Flash
Program Execution (Typical)
– 150 µA/MHz at 8 MHz, 3.0 V, RAM
Program Execution (Typical)
– Standby Mode (LPM3):
• Real-Time Clock (RTC) With Crystal,
Watchdog, and Supply Supervisor
Operational, Full RAM Retention, Fast Wake
up:
– 1.9 µA at 2.2 V, 2.1 µA at 3.0 V (Typical)
• Low-Power Oscillator (VLO), GeneralPurpose Counter, Watchdog, and Supply
Supervisor Operational, Full RAM Retention,
Fast Wake up:
– 1.4 µA at 3.0 V (Typical)
– Off Mode (LPM4):
• Full RAM Retention, Supply Supervisor
Operational, Fast Wake up:
– 1.1 µA at 3.0 V (Typical)
– Shutdown Mode (LPM4.5):
• 0.18 µA at 3.0 V (Typical)
• Wake up From Standby Mode in 3.5 µs (Typical)
• 16-Bit RISC Architecture, Extended Memory, up to
25-MHz System Clock
• Flexible Power Management System
– Fully Integrated LDO With Programmable
Regulated Core Supply Voltage
– Supply Voltage Supervision, Monitoring, and
Brownout
• Unified Clock System
– FLL Control Loop for Frequency Stabilization
– Low-Power Low-Frequency Internal Clock
Source (VLO)
1.2
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
– Low-Frequency Trimmed Internal Reference
Source (REFO)
– 32-kHz Watch Crystals (XT1)
– High-Frequency Crystals up to 32 MHz (XT2)
16-Bit Timer TA0, Timer_A With Five
Capture/Compare Registers
16-Bit Timer TA1, Timer_A With Three
Capture/Compare Registers
16-Bit Timer TA2, Timer_A With Three
Capture/Compare Registers
16-Bit Timer TB0, Timer_B With Seven
Capture/Compare Shadow Registers
Two Universal Serial Communication Interfaces
– USCI_A0 and USCI_A1 Each Support:
• Enhanced UART Supports Automatic BaudRate Detection
• IrDA Encoder and Decoder
• Synchronous SPI
– USCI_B0 and USCI_B1 Each Support:
• I2C
• Synchronous SPI
Full-Speed Universal Serial Bus (USB)
– Integrated USB-PHY
– Integrated 3.3-V and 1.8-V USB Power System
– Integrated USB-PLL
– Eight Input and Eight Output Endpoints
12-Bit Analog-to-Digital Converter (ADC)
(MSP430F552x Only) With Internal Reference,
Sample-and-Hold, and Autoscan Feature
Comparator
Hardware Multiplier Supports 32-Bit Operations
Serial Onboard Programming, No External
Programming Voltage Needed
Three-Channel Internal DMA
Basic Timer With RTC Feature
Section 3 Summarizes Available Family Members
For Complete Module Descriptions, See the
MSP430x5xx and MSP430x6xx Family User's
Guide (SLAU208)
Applications
Analog and Digital Sensor Systems
Data Loggers
•
Connection to USB Hosts
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
1.3
www.ti.com
Description
The TI MSP430™ family of ultra-low-power microcontrollers consists of several devices featuring
peripheral sets targeted for a variety of applications. The architecture, combined with extensive low-power
modes, is optimized to achieve extended battery life in portable measurement applications. The
microcontroller features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that
contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows the devices to wake
up from low-power modes to active mode in 3.5 µs (typical).
The MSP430F5529, MSP430F5527, MSP430F5525, and MSP430F5521 microcontrollers have integrated
USB and PHY supporting USB 2.0, four 16-bit timers, a high-performance 12-bit analog-to-digital
converter (ADC), two universal serial communication interfaces (USCI), a hardware multiplier, DMA, a
real-time clock (RTC) module with alarm capabilities, and 63 I/O pins. The MSP430F5528,
MSP430F5526, MSP430F5524, and MSP430F5522 microcontrollers include all of these peripherals but
have 47 I/O pins.
The MSP430F5519, MSP430F5517, and MSP430F5515 microcontrollers have integrated USB and PHY
supporting USB 2.0, four 16-bit timers, two universal serial communication interfaces (USCI), a hardware
multiplier, DMA, an RTC module with alarm capabilities, and 63 I/O pins. The MSP430F5514 and
MSP430FF5513 microcontrollers include all of these peripherals but have 47 I/O pins.
Typical applications include analog and digital sensor systems, data loggers, and others that require
connectivity to various USB hosts.
Device Information (1)
PART NUMBER
MSP430F5529PN
PACKAGE
BODY SIZE (2)
LQFP (80)
12 mm × 12 mm
MSP430F5528RGC
VQFN (64)
9 mm × 9 mm
MSP430F5528YFF
DSBGA (64)
3.5 mm × 3.5 mm
MSP430F5528ZQE
MicroStar Junior™ BGA (80)
5 mm × 5 mm
(1)
(2)
2
For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 8,
or see the TI website at www.ti.com.
The sizes shown here are approximations. For the package dimensions with tolerances, see the Mechanical Data in Section 8.
Device Overview
Copyright © 2009–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
1.4
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Functional Block Diagrams
Figure 1-1 shows the functional block diagram for the MSP430F5529, MSP430F5527, MSP430F5525, and
MSP430F5521 devices in the PN package.
XIN XOUT RST/NMI DVCC DVSS VCORE
AVCC AVSS
P1.x
XT2IN
XT2OUT
ACLK
Unified
Clock
System
SMCLK
128KB
96KB
64KB
32KB
8KB+2KB
6KB+2KB
4KB+2KB
Flash
RAM
MCLK
CPUXV2
and
Working
Registers
Power
Management
LDO
SVM/SVS
Brownout
SYS
Watchdog
Port Map
Control
(P4)
PA
P2.x
P3.x
PB
P4.x
I/O Ports
P1/P2
2×8 I/Os
Interrupt
& Wakeup
I/O Ports
P3/P4
2×8 I/Os
PA
1×16 I/Os
PB
1×16 I/Os
P5.x
PC
P6.x
I/O Ports
P5/P6
2×8 I/Os
PC
1×16 I/Os
P7.x
PD
P8.x
DP,DM,PUR
I/O Ports
P7/P8
1×8 I/Os
1×3 I/Os
Full-speed
USB
USB-PHY
USB-LDO
USB-PLL
PD
1×11 I/Os
MAB
DMA
MDB
3 Channel
EEM
(L: 8+2)
JTAG/
SBW
Interface
MPY32
TA0
TA1
TA2
TB0
Timer_A
5 CC
Registers
Timer_A
3 CC
Registers
Timer_A
3 CC
Registers
Timer_B
7 CC
Registers
RTC_A
CRC16
USCI0,1
ADC12_A
USCI_Ax:
UART,
IrDA, SPI
12 Bit
200 KSPS
USCI_Bx:
SPI, I2C
REF
COMP_B
12 Channels
16 Channels
(14 ext/2 int)
Autoscan
Figure 1-1. Functional Block Diagram – MSP430F5529IPN, MSP430F5527IPN, MSP430F5525IPN,
MSP430F5521IPN
Figure 1-2 shows the functional block diagram for the MSP430F5528, MSP430F5526, MSP430F5524, and
MSP430F5522 devices in the RGC and ZQE packages and for the MSP430F5528, MSP430F5526, and
MSP430F5524 devices in the YFF package.
XIN XOUT RST/NMI DVCC DVSS VCORE
AVCC AVSS
P1.x
XT2IN
XT2OUT
ACLK
Unified
Clock
System
SMCLK
128KB
96KB
64KB
32KB
8KB+2KB
6KB+2KB
4KB+2KB
Flash
RAM
MCLK
CPUXV2
and
Working
Registers
Power
Management
LDO
SVM/SVS
Brownout
SYS
Watchdog
Port Map
Control
(P4)
PA
P2.x
P3.x
PB
P4.x
P5.x
PC
P6.x
I/O Ports
P1/P2
2×8 I/Os
Interrupt
& Wakeup
I/O Ports
P3/P4
1×5 I/Os
1×8 I/Os
I/O Ports
P5/P6
1×6 I/Os
1×8 I/Os
PA
1×16 I/Os
PB
1×13 I/Os
PC
1×14 I/Os
DP,DM,PUR
Full-speed
USB
USB-PHY
USB-LDO
USB-PLL
MAB
DMA
MDB
3 Channel
EEM
(L: 8+2)
JTAG/
SBW
Interface
MPY32
TA0
TA1
TA2
TB0
Timer_A
5 CC
Registers
Timer_A
3 CC
Registers
Timer_A
3 CC
Registers
Timer_B
7 CC
Registers
RTC_A
CRC16
USCI0,1
ADC12_A
USCI_Ax:
UART,
IrDA, SPI
12 Bit
200 KSPS
USCI_Bx:
SPI, I2C
12 Channels
(10 ext/2 int)
Autoscan
REF
COMP_B
8 Channels
Figure 1-2. Functional Block Diagram –
MSP430F5528IRGC, MSP430F5526IRGC, MSP430F5524IRGC, MSP430F5522IRGC
MSP430F5528IZQE, MSP430F5526IZQE, MSP430F5524IZQE, MSP430F5522IZQE
MSP430F5528IYFF, MSP430F5526IYFF, MSP430F5524IYFF
Device Overview
Submit Documentation Feedback
Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
3
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
Figure 1-3 shows the functional block diagram for the MSP430F5519, MSP430F5517, and MSP430F5515
devices in the PN package.
XIN XOUT RST/NMI DVCC DVSS VCORE
AVCC AVSS
P1.x
XT2IN
XT2OUT
Unified
Clock
System
ACLK
SMCLK
MCLK
CPUXV2
and
Working
Registers
128KB
96KB
64KB
4KB+2KB
Flash
RAM
Power
Management
LDO
SVM/SVS
Brownout
SYS
Watchdog
Port Map
Control
(P4)
PA
P2.x
P3.x
PB
P4.x
P5.x
PC
P6.x
P7.x
PD
P8.x
I/O Ports
P1/P2
2×8 I/Os
Interrupt
& Wakeup
I/O Ports
P3/P4
2×8 I/Os
I/O Ports
P5/P6
2×8 I/Os
I/O Ports
P7/P8
1×8 I/Os
1×3 I/Os
PA
1×16 I/Os
PB
1×16 I/Os
PC
1×16 I/Os
PD
1×11 I/Os
DP,DM,PUR
Full-speed
USB
USB-PHY
USB-LDO
USB-PLL
MAB
DMA
MDB
3 Channel
EEM
(L: 8+2)
USCI0,1
JTAG/
SBW
Interface
MPY32
TA0
TA1
TA2
TB0
Timer_A
5 CC
Registers
Timer_A
3 CC
Registers
Timer_A
3 CC
Registers
Timer_B
7 CC
Registers
RTC_A
CRC16
USCI_Ax:
UART,
IrDA, SPI
COMP_B
REF
12 Channels
USCI_Bx:
SPI, I2C
Figure 1-3. Functional Block Diagram – MSP430F5519IPN, MSP430F5517IPN, MSP430F5515IPN
Figure 1-4 shows the functional block diagram for the MSP430F5514 and MSP430F5513 devices in the
RGC and ZQE packages.
XIN XOUT RST/NMI DVCC DVSS VCORE
AVCC AVSS
P1.x
XT2IN
XT2OUT
Unified
Clock
System
ACLK
SMCLK
MCLK
CPUXV2
and
Working
Registers
64KB
32KB
4KB+2KB
Flash
RAM
Power
Management
LDO
SVM/SVS
Brownout
SYS
Watchdog
Port Map
Control
(P4)
PA
P2.x
P3.x
PB
P4.x
P5.x
PC
P6.x
I/O Ports
P1/P2
2×8 I/Os
Interrupt
& Wakeup
I/O Ports
P3/P4
1×5 I/Os
1×8 I/Os
I/O Ports
P5/P6
1×6 I/Os
1×8 I/Os
PA
1×16 I/Os
PB
1×13 I/Os
PC
1×14 I/Os
DP,DM,PUR
Full-speed
USB
USB-PHY
USB-LDO
USB-PLL
MAB
DMA
MDB
3 Channel
EEM
(L: 8+2)
USCI0,1
JTAG/
SBW
Interface
MPY32
TA0
TA1
TA2
TB0
Timer_A
5 CC
Registers
Timer_A
3 CC
Registers
Timer_A
3 CC
Registers
Timer_B
7 CC
Registers
RTC_A
CRC16
USCI_Ax:
UART,
IrDA, SPI
COMP_B
REF
8 Channels
USCI_Bx:
SPI, I2C
Figure 1-4. Functional Block Diagram – MSP430F5514IRGC, MSP430F5513IRGC, MSP430F5514IZQE,
MSP430F5513IZQE
4
Device Overview
Copyright © 2009–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Table of Contents
1
2
3
4
5
Device Overview ......................................... 1
5.24
PMM, SVS Low Side ................................ 33
1.1
Features .............................................. 1
1.2
Applications ........................................... 1
5.25
5.26
1.3
Description ............................................ 2
PMM, SVM Low Side ............................... 33
Wake-up Times From Low-Power Modes and
Reset ................................................ 34
1.4
Functional Block Diagrams ........................... 3
5.27
Timer_A
Revision History ......................................... 6
Device Comparison ..................................... 7
Terminal Configuration and Functions .............. 8
5.28
Timer_B
4.1
Pin Diagrams ......................................... 8
5.31
4.2
Signal Descriptions .................................. 14
5.32
Specifications ........................................... 19
5.33
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14
........................
ESD Ratings ........................................
Recommended Operating Conditions ...............
Absolute Maximum Ratings
5.30
5.34
5.35
19
19
19
Active Mode Supply Current Into VCC Excluding
External Current ..................................... 21
Low-Power Mode Supply Currents (Into VCC)
Excluding External Current.......................... 22
Thermal Characteristics ............................. 23
Schmitt-Trigger Inputs – General-Purpose I/O
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7)
(P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to
P8.2, PJ.0 to PJ.3, RST/NMI) ....................... 24
Inputs – Ports P1 and P2
(P1.0 to P1.7, P2.0 to P2.7)......................... 24
Leakage Current – General-Purpose I/O
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7)
(P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to
P8.2, PJ.0 to PJ.3, RST/NMI) ....................... 24
Outputs – General-Purpose I/O (Full Drive Strength)
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7)
(P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to
P8.2, PJ.0 to PJ.3) .................................. 24
Outputs – General-Purpose I/O (Reduced Drive
Strength)
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7)
(P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to
P8.2, PJ.0 to PJ.3) .................................. 25
Output Frequency – General-Purpose I/O
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7)
(P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to
P8.2, PJ.0 to PJ.3) .................................. 25
Typical Characteristics – Outputs, Reduced Drive
Strength (PxDS.y = 0) ............................... 26
Typical Characteristics – Outputs, Full Drive
Strength (PxDS.y = 1) ............................... 27
.....
5.15
Crystal Oscillator, XT1, Low-Frequency Mode
5.16
5.17
Crystal Oscillator, XT2 .............................. 29
Internal Very-Low-Power Low-Frequency Oscillator
(VLO) ................................................ 30
Internal Reference, Low-Frequency Oscillator
(REFO) .............................................. 30
5.18
5.29
5.38
5.39
6
DCO Frequency ..................................... 31
5.20
PMM, Brown-Out Reset (BOR)
5.21
PMM, Core Voltage ................................. 32
5.22
PMM, SVS High Side ............................... 32
5.23
PMM, SVM High Side ............................... 33
7
32
8
34
35
35
35
35
37
39
12-Bit ADC, Power Supply and Input Range
Conditions ........................................... 40
12-Bit ADC, Timing Parameters .................... 40
12-Bit ADC, Linearity Parameters Using an External
Reference Voltage or AVCC as Reference Voltage 41
12-Bit ADC, Linearity Parameters Using the Internal
Reference Voltage .................................. 41
12-Bit ADC, Temperature Sensor and Built-In VMID
42
REF, External Reference
Mechanical, Packaging, and Orderable
Information ............................................. 114
Table of Contents
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Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
34
........................... 43
5.41 REF, Built-In Reference ............................. 43
5.42 Comparator_B ....................................... 45
5.43 Ports PU.0 and PU.1 ................................ 45
5.44 USB Output Ports DP and DM ...................... 47
5.45 USB Input Ports DP and DM ........................ 47
5.46 USB-PWR (USB Power System) ................... 48
5.47 USB-PLL (USB Phase Locked Loop) ............... 48
5.48 Flash Memory ....................................... 49
5.49 JTAG and Spy-Bi-Wire Interface .................... 49
Detailed Description ................................... 50
6.1
CPU (Link to User's Guide) ......................... 50
6.2
Operating Modes .................................... 51
6.3
Interrupt Vector Addresses.......................... 52
6.4
Memory Organization ............................... 53
6.5
Bootstrap Loader (BSL) ............................. 54
6.6
JTAG Operation ..................................... 55
6.7
Flash Memory (Link to User's Guide) ............... 56
6.8
RAM (Link to User's Guide) ......................... 56
6.9
Peripherals .......................................... 56
6.10 Input/Output Schematics ............................ 81
6.11 Device Descriptors (TLV) .......................... 103
Device and Documentation Support .............. 109
7.1
Device Support..................................... 109
7.2
Documentation Support ............................ 112
7.3
Related Links ...................................... 113
7.4
Community Resources............................. 113
7.5
Trademarks ........................................ 113
7.6
Electrostatic Discharge Caution ................... 113
7.7
Glossary............................................ 113
5.40
28
5.19
.....................
5.36
5.37
.............................................
.............................................
USCI (UART Mode) Clock Frequency ..............
USCI (UART Mode) .................................
USCI (SPI Master Mode) Clock Frequency .........
USCI (SPI Master Mode)............................
USCI (SPI Slave Mode) .............................
USCI (I2C Mode) ....................................
5
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision L (June 2013) to Revision M
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
6
Page
Formatting and organization changes throughout, including addition of section numbering ............................... 1
Added Device Information table .................................................................................................... 2
Added Section 1.4 and moved all functional block diagrams to it .............................................................. 3
Added Section 3 and moved Family Members table to it ....................................................................... 7
Added Section 5 and moved all electrical specifications to it ................................................................. 19
Added Section 5.2, ESD Ratings.................................................................................................. 19
Moved Section 5.6, Thermal Characteristics .................................................................................... 23
Changed the TYP value of CL,eff with Test Conditions of "XTS = 0, XCAPx = 0" from 2 pF to 1 pF ..................... 28
Corrected MRG0 and MRG1 bit names in fMCLK,MRG parameter description ................................................. 49
Corrected spelling of NMIIFG in Table 6-9, System Module Interrupt Vector Registers ................................... 60
Corrected register names (added "USB" prefix as necessary) in Table 6-45, USB Control Registers .................. 80
Changed P5.3 schematic (added P5SEL.2 and XT2BYPASS inputs, AND gate, and OR gate after P5SEL.3) ....... 89
Changed P5SEL.3 column from X to 0 for "P5.3 (I/O)" rows .................................................................. 89
Changed P5.5 schematic (change input from P5SEL.5 to P5SEL.4 and added P5SEL.5 input and the following
OR gate) .............................................................................................................................. 91
Changed P5SEL.5 column from X to 0 for "P5.5 (I/O)" rows .................................................................. 91
Added Section 7 and moved Tools Support, Device Nomenclature, ESD Caution, and Trademarks sections to it .. 109
Added Section 8, Mechanical, Packaging, and Orderable Information ..................................................... 114
Revision History
Copyright © 2009–2015, Texas Instruments Incorporated
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Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
3 Device Comparison
Table 3-1 summarizes the available family members.
Table 3-1. Family Members (1) (2)
USCI
(1)
(2)
(3)
(4)
(5)
DEVICE
FLASH
(KB)
SRAM
(KB) (3)
MSP430F5529
128
8+2
Timer_A
5, 3, 3
(4)
Timer_B
7
(5)
CHANNEL A:
UART, IrDA,
SPI
CHANNEL B:
SPI, I2C
ADC12_A
(Ch)
Comp_B
(Ch)
I/O
2
2
14 ext, 2 int
12
63
80 PN
PACKAGE
MSP430F5528
128
8+2
5, 3, 3
7
2
2
10 ext, 2 int
8
47
64 RGC,
64 YFF,
80 ZQE
MSP430F5527
96
6+2
5, 3, 3
7
2
2
14 ext, 2 int
12
63
80 PN
MSP430F5526
96
6+2
5, 3, 3
7
2
2
10 ext, 2 int
8
47
64 RGC,
64 YFF,
80 ZQE
MSP430F5525
64
4+2
5, 3, 3
7
2
2
14 ext, 2 int
12
63
80 PN
MSP430F5524
64
4+2
5, 3, 3
7
2
2
10 ext, 2 int
8
47
64 RGC,
64 YFF,
80 ZQE
MSP430F5522
32
8+2
5, 3, 3
7
2
2
10 ext, 2 int
8
47
64 RGC,
80 ZQE
MSP430F5521
32
6+2
5, 3, 3
7
2
2
14 ext, 2 int
12
63
80 PN
MSP430F5519
128
8+2
5, 3, 3
7
2
2
–
12
63
80 PN
MSP430F5517
96
6+2
5, 3, 3
7
2
2
–
12
63
80 PN
MSP430F5515
64
4+2
5, 3, 3
7
2
2
–
12
63
80 PN
MSP430F5514
64
4+2
5, 3, 3
7
2
2
–
8
47
64 RGC,
80 ZQE
MSP430F5513
32
4+2
5, 3, 3
7
2
2
–
8
47
64 RGC,
80 ZQE
For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 8, or see the TI website at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
The additional 2KB USB SRAM that is listed can be used as general-purpose SRAM when USB is not in use.
Each number in the sequence represents an instantiation of Timer_A with its associated number of capture/compare registers and PWM output generators available. For example, a
number sequence of 3, 5 would represent two instantiations of Timer_A, the first instantiation having 3 and the second instantiation having 5 capture/compare registers and PWM output
generators, respectively.
Each number in the sequence represents an instantiation of Timer_B with its associated number of capture/compare registers and PWM output generators available. For example, a
number sequence of 3, 5 would represent two instantiations of Timer_B, the first instantiation having 3 and the second instantiation having 5 capture/compare registers and PWM output
generators, respectively.
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Device Comparison
7
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
4 Terminal Configuration and Functions
4.1
Pin Diagrams
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
P6.3/CB3/A3
P6.2/CB2/A2
P6.1/CB1/A1
P6.0/CB0/A0
RST/NMI/SBWTDIO
PJ.3/TCK
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.0/TDO
TEST/SBWTCK
P5.3/XT2OUT
P5.2/XT2IN
AVSS2
V18
VUSB
VBUS
PU.1/DM
PUR
PU.0/DP
VSSU
Figure 4-1 shows the pinout for the MSP430F5529, MSP430F5527, MSP430F5525, and MSP430F5521
devices in the PN package.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
MSP430F5529
MSP430F5527
MSP430F5525
MSP430F5521
P7.7/TB0CLK/MCLK
P7.6/TB0.4
P7.5/TB0.3
P7.4/TB0.2
P5.7/TB0.1
P5.6/TB0.0
P4.7/PM_NONE
P4.6/PM_NONE
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P4.4/PM_UCA1TXD/PM_UCA1SIMO
DVCC2
DVSS2
P4.3/PM_UCB1CLK/PM_UCA1STE
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P4.0/PM_UCB1STE/PM_UCA1CLK
P3.7/TB0OUTH/SVMOUT
P3.6/TB0.6
P3.5/TB0.5
P3.4/UCA0RXD/UCA0SOMI
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UCB0STE/UCA0CLK
P3.0/UCB0SIMO/UCB0SDA
P3.1/UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
P3.3/UCA0TXD/UCA0SIMO
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6
P6.7/CB7/A7
P7.0/CB8/A12
P7.1/CB9/A13
P7.2/CB10/A14
P7.3/CB11/A15
P5.0/A8/VREF+/VeREF+
P5.1/A9/VREF−/VeREF−
AVCC1
P5.4/XIN
P5.5/XOUT
AVSS1
P8.0
P8.1
P8.2
DVCC1
DVSS1
VCORE
Figure 4-1. Pin Designation – MSP430F5529IPN, MSP430F5527IPN, MSP430F5525IPN, MSP430F5521IPN
(Top View)
8
Terminal Configuration and Functions
Copyright © 2009–2015, Texas Instruments Incorporated
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Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
RST/NMI/SBWTDIO
PJ.3/TCK
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.0/TDO
TEST/SBWTCK
P5.3/XT2OUT
P5.2/XT2IN
AVSS2
V18
VUSB
VBUS
PU.1/DM
PUR
PU.0/DP
VSSU
Figure 4-2 shows the pinout for the MSP430F5528, MSP430F5526, MSP430F5524, and MSP430F5522
devices in the RGC package.
P6.0/CB0/A0
P6.1/CB1/A1
P6.2/CB2/A2
P6.3/CB3/A3
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6
P6.7/CB7/A7
P5.0/A8/VREF+/VeREF+
P5.1/A9/VREF−/VeREF−
AVCC1
2
47
3
46
4
45
5
44
6
43
7
8
9
10
MSP430F5528
MSP430F5526
MSP430F5524
MSP430F5522
42
41
40
39
11
38
12
37
13
36
14
35
15
34
16
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
P4.7/PM_NONE
P4.6/PM_NONE
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P4.3/PM_UCB1CLK/PM_UCA1STE
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P4.0/PM_UCB1STE/PM_UCA1CLK
DVCC2
DVSS2
P3.4/UCA0RXD/UCA0SOMI
P3.3/UCA0TXD/UCA0SIMO
P3.2/UCB0CLK/UCA0STE
P3.1/UCB0SOMI/UCB0SCL
P3.0/UCB0SIMO/UCB0SDA
P2.7/UCB0STE/UCA0CLK
VCORE
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P5.4/XIN
P5.5/XOUT
AVSS1
DVCC1
DVSS1
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
1
NOTE: TI recommends connecting the exposed thermal pad to VSS.
Figure 4-2. Pin Designation – MSP430F5528IRGC, MSP430F5526IRGC, MSP430F5524IRGC,
MSP430F5522IRGC (Top View)
Terminal Configuration and Functions
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
9
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
P6.3/CB3
P6.2/CB2
P6.1/CB1
P6.0/CB0
RST/NMI/SBWTDIO
PJ.3/TCK
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.0/TDO
TEST/SBWTCK
P5.3/XT2OUT
P5.2/XT2IN
AVSS2
V18
VUSB
VBUS
PU.1/DM
PUR
PU.0/DP
VSSU
Figure 4-3 shows the pinout for the MSP430F5519, MSP430F5517, and MSP430F5515 devices in the PN
package.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
MSP430F5519
MSP430F5517
MSP430F5515
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
P7.7/TB0CLK/MCLK
P7.6/TB0.4
P7.5/TB0.3
P7.4/TB0.2
P5.7/TB0.1
P5.6/TB0.0
P4.7/PM_NONE
P4.6/PM_NONE
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P4.4/PM_UCA1TXD/PM_UCA1SIMO
DVCC2
DVSS2
P4.3/PM_UCB1CLK/PM_UCA1STE
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P4.0/PM_UCB1STE/PM_UCA1CLK
P3.7/TB0OUTH/SVMOUT
P3.6/TB0.6
P3.5/TB0.5
P3.4/UCA0RXD/UCA0SOMI
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UCB0STE/UCA0CLK
P3.0/UCB0SIMO/UCB0SDA
P3.1/UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
P3.3/UCA0TXD/UCA0SIMO
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
P6.4/CB4
P6.5/CB5
P6.6/CB6
P6.7/CB7
P7.0/CB8
P7.1/CB9
P7.2/CB10
P7.3/CB11
P5.0
P5.1
AVCC1
P5.4/XIN
P5.5/XOUT
AVSS1
P8.0
P8.1
P8.2
DVCC1
DVSS1
VCORE
Figure 4-3. Pin Designation – MSP430F5519IPN, MSP430F5517IPN, MSP430F5515IPN (Top View)
10
Terminal Configuration and Functions
Copyright © 2009–2015, Texas Instruments Incorporated
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Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
RST/NMI/SBWTDIO
PJ.3/TCK
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.0/TDO
TEST/SBWTCK
P5.3/XT2OUT
P5.2/XT2IN
AVSS2
V18
VUSB
VBUS
PU.1/DM
PUR
PU.0/DP
VSSU
Figure 4-4 shows the pinout for the MSP430F5514 and MSP430F5513 devices in the RGC package.
P6.0/CB0
P6.1/CB1
P6.2/CB2
P6.3/CB3
P6.4/CB4
P6.5/CB5
P6.6/CB6
P6.7/CB7
P5.0
P5.1
AVCC1
2
47
3
46
4
45
5
44
6
43
7
42
8
9
MSP430F5514
MSP430F5513
41
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
P4.7/PM_NONE
P4.6/PM_NONE
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P4.3/PM_UCB1CLK/PM_UCA1STE
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P4.0/PM_UCB1STE/PM_UCA1CLK
DVCC2
DVSS2
P3.4/UCA0RXD/UCA0SOMI
P3.3/UCA0TXD/UCA0SIMO
P3.2/UCB0CLK/UCA0STE
P3.1/UCB0SOMI/UCB0SCL
P3.0/UCB0SIMO/UCB0SDA
P2.7/UCB0STE/UCA0CLK
VCORE
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P5.4/XIN
P5.5/XOUT
AVSS1
DVCC1
DVSS1
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
1
NOTE: TI recommends connecting the exposed thermal pad to VSS.
Figure 4-4. Pin Designation – MSP430F5514IRGC, MSP430F5513IRGC (Top View)
Terminal Configuration and Functions
Submit Documentation Feedback
Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
11
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
Figure 4-5 shows the pinout for the MSP430F5528, MSP430F5526, MSP430F5524, MSP430F5522,
MSP430F5514, and MSP430F5513 devices in the ZQE package.
P6.0 RST/NMI PJ.2
TEST
AVSS2
VUSB
VBUS
PU.1
PU.0
A1
A2
A3
A4
A5
A6
A7
A8
A9
P6.2
P6.1
PJ.3
P5.3
P5.2
V18
PUR
VSSU
VSSU
B1
B2
B3
B4
B5
B6
B7
B8
B9
P6.4
P6.3
PJ.1
PJ.0
Reserved
P4.7
P4.6
P4.5
C1
C2
C4
C5
C6
C7
C8
C9
P6.6
P6.5
P6.7
Reserved Reserved Reserved
P4.4
P4.3
P4.2
D1
D2
D3
D5
D7
D8
D9
P5.0
P5.1
P4.1
P4.0
DVCC2
E1
E2
E7
E8
E9
P5.4
F1
P5.5
D4
D6
Reserved Reserved Reserved Reserved
E3
E4
E5
E6
AVCC1 Reserved Reserved Reserved Reserved Reserved Reserved DVSS2
F2
F3
AVSS1 Reserved
F4
F5
F6
F7
F8
F9
P1.3
P1.6
P2.1
P3.4
P3.2
P3.3
G1
G2
G3
G4
G5
G6
G7
G8
G9
DVCC1
P1.0
P1.1
P1.4
P1.7
P2.3
P2.7
P3.0
P3.1
H1
H2
H3
H4
H5
H6
H7
H8
H9
P1.2
P1.5
P2.0
P2.2
P2.4
P2.5
P2.6
J3
J4
J5
J6
J7
J8
J9
DVSS1 VCORE
J1
J2
Figure 4-5. Pin Designation – MSP430F5528IZQE, MSP430F5526IZQE, MSP430F5524IZQE,
MSP430F5522IZQE, MSP430F5514IZQE, MSP430F5513IZQE (Top View)
12
Terminal Configuration and Functions
Copyright © 2009–2015, Texas Instruments Incorporated
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Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Figure 4-6 shows the pinout for the MSP430F5528, MSP430F5526, and MSP430F5524 devices in the
YFF package.
BALL-SIDE VIEW
TOP VIEW
D
H8
H7
P2.7
P3.1
H6
H5
DVSS2 DVCC2
H4
H3
H2
H1
H1
H2
H3
H4
P4.1
P4.4
VSSU
PU.0
PU.0
VSSU
P4.4
P4.1
H5
H6
DVCC2 DVSS2
H7
H8
P3.1
P2.7
G8
G7
G6
G5
G4
G3
G2
G1
G1
G2
G3
G4
G5
G6
G7
G8
P3.0
P3.2
P3.3
P3.4
P4.2
P4.5
PUR
PU.1
PU.1
PUR
P4.5
P4.2
P3.4
P3.3
P3.2
P3.0
F2
F1
F1
F2
F8
F7
F6
F5
F4
F3
P2.4
P2.5
P2.6
P4.0
P4.3
P4.6
VBUS VUSB
E8
E7
E6
E5
E4
E3
E2
E1
P2.1
P2.2
P2.3
P2.0
P4.7
TEST
V18
P5.2
D6
D5
D4
D8
D7
P1.7
P1.6
P1.5 RST/NMI PJ.1
VUSB VBUS
D
F3
F4
F5
F6
F7
F8
P4.6
P4.3
P4.0
P2.6
P2.5
P2.4
E1
E2
E3
E4
E5
E6
E7
E8
P5.2
V18
TEST
P4.7
P2.0
P2.3
P2.2
P2.1
D4
D5
D6
D3
D2
D1
D1
D2
D3
PJ.0
AVSS2
P5.3
P5.3
AVSS2
PJ.0
PJ.1 RST/NMI P1.5
D7
D8
P1.6
P1.7
C8
C7
C6
C5
C4
C3
C2
C1
C1
C2
C3
C4
C5
C6
C7
C8
P1.3
P1.4
P1.2
P6.7
P6.3
P6.1
PJ.3
PJ.2
PJ.2
PJ.3
P6.1
P6.3
P6.7
P1.2
P1.4
P1.3
B7
B8
B8
B7
B6
B5
B4
B3
B2
B1
B1
B2
B3
B4
B5
B6
VCORE
P1.0
P1.1
P5.1
P5.0
P6.5
P6.4
P6.0
P6.0
P6.4
P6.5
P5.0
P5.1
P1.1
A8
A7
A6
A4
A3
A2
A3
A4
DVSS1 DVCC1 P5.5
A5
P5.4
AVSS1 AVCC1 P6.6
E
A1
A1
A2
P6.2
P6.2
P6.6
AVCC1 AVSS1
A5
A6
P5.4
P5.5
P1.0 VCORE
A7
A8
DVCC1 DVSS1
E
Figure 4-6. Pin Designation – MSP430F5528IYFF, MSP430F5526IYFF, MSP430F5524IYFF
Terminal Configuration and Functions
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
13
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
4.2
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Signal Descriptions
Table 4-1. Terminal Functions
TERMINAL
NAME
I/O (1)
NO.
PN
RGC
YFF
ZQE
1
5
B2
C1
DESCRIPTION
General-purpose digital I/O
P6.4/CB4/A4
I/O
Comparator_B input CB4
Analog input A4 – ADC (not available on F551x devices)
General-purpose digital I/O
P6.5/CB5/A5
2
6
B3
D2
I/O
Comparator_B input CB5
Analog input A5 – ADC (not available on F551x devices)
General-purpose digital I/O
P6.6/CB6/A6
3
7
A2
D1
I/O
Comparator_B input CB6
Analog input A6 – ADC (not available on F551x devices)
General-purpose digital I/O
P6.7/CB7/A7
4
8
C5
D3
I/O
Comparator_B input CB7
Analog input A7 – ADC (not available on F551x devices)
General-purpose digital I/O (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
P7.0/CB8/A12
5
N/A
N/A
N/A
I/O
Comparator_B input CB8 (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
Analog input A12 – ADC (not available on F551x devices)
General-purpose digital I/O (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
P7.1/CB9/A13
6
N/A
N/A
N/A
I/O
Comparator_B input CB9 (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
Analog input A13 – ADC (not available on F551x devices)
General-purpose digital I/O (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
P7.2/CB10/A14
7
N/A
N/A
N/A
I/O
Comparator_B input CB10 (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
Analog input A14 – ADC (not available on F551x devices)
General-purpose digital I/O (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
P7.3/CB11/A15
8
N/A
N/A
N/A
I/O
Comparator_B input CB11 (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
Analog input A15 – ADC (not available on F551x devices)
General-purpose digital I/O
P5.0/A8/VREF+/VeREF+
9
9
B4
E1
I/O
Output of reference voltage to the ADC (not available on F551x devices)
Input for an external reference voltage to the ADC (not available on F551x devices)
Analog input A8 – ADC (not available on F551x devices)
General-purpose digital I/O
I/O
Negative terminal for the ADC reference voltage for both sources, the internal
reference voltage, or an external applied reference voltage (not available on F551x
devices)
P5.1/A9/VREF-/VeREF-
10
10
B5
E2
AVCC1
11
11
A3
F2
P5.4/XIN
12
12
A5
F1
I/O
P5.5/XOUT
13
13
A6
G1
I/O
AVSS1
14
14
A4
G2
P8.0
15
N/A
N/A
N/A
I/O
General-purpose digital I/O
P8.1
16
N/A
N/A
N/A
I/O
General-purpose digital I/O
P8.2
17
N/A
N/A
N/A
I/O
General-purpose digital I/O
Analog input A9 – ADC (not available on F551x devices)
(1)
I = input, O = output, N/A = not available
14
Terminal Configuration and Functions
Analog power supply
General-purpose digital I/O
Input terminal for crystal oscillator XT1
General-purpose digital I/O
Output terminal of crystal oscillator XT1
Analog ground supply
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Table 4-1. Terminal Functions (continued)
TERMINAL
NAME
I/O (1)
NO.
DESCRIPTION
PN
RGC
YFF
ZQE
DVCC1
18
15
A7
H1
Digital power supply
DVSS1
19
16
A8
J1
Digital ground supply
VCORE (2)
20
17
B8
J2
Regulated core power supply output (internal use only, no external current loading)
P1.0/TA0CLK/ACLK
21
18
B7
H2
General-purpose digital I/O with port interrupt
I/O
TA0 clock signal TA0CLK input
ACLK output (divided by 1, 2, 4, 8, 16, or 32)
General-purpose digital I/O with port interrupt
P1.1/TA0.0
22
19
B6
H3
I/O
TA0 CCR0 capture: CCI0A input, compare: Out0 output
BSL transmit output
General-purpose digital I/O with port interrupt
P1.2/TA0.1
23
20
C6
J3
I/O
TA0 CCR1 capture: CCI1A input, compare: Out1 output
BSL receive input
P1.3/TA0.2
24
21
C8
G4
I/O
P1.4/TA0.3
25
22
C7
H4
I/O
P1.5/TA0.4
26
23
D6
J4
I/O
P1.6/TA1CLK/CBOUT
27
24
D7
G5
I/O
General-purpose digital I/O with port interrupt
TA0 CCR2 capture: CCI2A input, compare: Out2 output
General-purpose digital I/O with port interrupt
TA0 CCR3 capture: CCI3A input compare: Out3 output
General-purpose digital I/O with port interrupt
TA0 CCR4 capture: CCI4A input, compare: Out4 output
General-purpose digital I/O with port interrupt
TA1 clock signal TA1CLK input
Comparator_B output
P1.7/TA1.0
28
25
D8
H5
I/O
P2.0/TA1.1
29
26
E5
J5
I/O
P2.1/TA1.2
30
27
E8
G6
I/O
P2.2/TA2CLK/SMCLK
31
28
E7
J6
I/O
General-purpose digital I/O with port interrupt
TA1 CCR0 capture: CCI0A input, compare: Out0 output
General-purpose digital I/O with port interrupt
TA1 CCR1 capture: CCI1A input, compare: Out1 output
General-purpose digital I/O with port interrupt
TA1 CCR2 capture: CCI2A input, compare: Out2 output
General-purpose digital I/O with port interrupt
TA2 clock signal TA2CLK input
SMCLK output
P2.3/TA2.0
32
29
E6
H6
I/O
P2.4/TA2.1
33
30
F8
J7
I/O
P2.5/TA2.2
34
31
F7
J8
I/O
P2.6/RTCCLK/DMAE0
35
32
F6
J9
I/O
General-purpose digital I/O with port interrupt
TA2 CCR0 capture: CCI0A input, compare: Out0 output
General-purpose digital I/O with port interrupt
TA2 CCR1 capture: CCI1A input, compare: Out1 output
General-purpose digital I/O with port interrupt
TA2 CCR2 capture: CCI2A input, compare: Out2 output
General-purpose digital I/O with port interrupt
RTC clock output for calibration
DMA external trigger input
General-purpose digital I/O with port interrupt
P2.7/UCB0STE/UCA0CLK
36
33
H8
H7
I/O
Slave transmit enable – USCI_B0 SPI mode
Clock signal input – USCI_A0 SPI slave mode
Clock signal output – USCI_A0 SPI master mode
General-purpose digital I/O
P3.0/UCB0SIMO/UCB0SDA
37
34
G8
H8
I/O
Slave in, master out – USCI_B0 SPI mode
I2C data – USCI_B0 I2C mode
(2)
VCORE is for internal use only. No external current loading is possible. VCORE should only be connected to the recommended
capacitor value, CVCORE.
Terminal Configuration and Functions
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Copyright © 2009–2015, Texas Instruments Incorporated
15
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
Table 4-1. Terminal Functions (continued)
TERMINAL
NAME
I/O (1)
NO.
PN
RGC
YFF
ZQE
38
35
H7
H9
DESCRIPTION
General-purpose digital I/O
P3.1/UCB0SOMI/UCB0SCL
I/O
Slave out, master in – USCI_B0 SPI mode
I2C clock – USCI_B0 I2C mode
General-purpose digital I/O
P3.2/UCB0CLK/UCA0STE
39
36
G7
G8
I/O
Clock signal input – USCI_B0 SPI slave mode
Clock signal output – USCI_B0 SPI master mode
Slave transmit enable – USCI_A0 SPI mode
General-purpose digital I/O
P3.3/UCA0TXD/UCA0SIMO
40
37
G6
G9
I/O
Transmit data – USCI_A0 UART mode
Slave in, master out – USCI_A0 SPI mode
General-purpose digital I/O
P3.4/UCA0RXD/UCA0SOMI
41
38
G5
G7
I/O
Receive data – USCI_A0 UART mode
Slave out, master in – USCI_A0 SPI mode
P3.5/TB0.5
42
N/A
N/A
N/A
I/O
General-purpose digital I/O (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
TB0 CCR5 capture: CCI5A input, compare: Out5 output
P3.6/TB0.6
43
N/A
N/A
N/A
I/O
General-purpose digital I/O (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
TB0 CCR6 capture: CCI6A input, compare: Out6 output
General-purpose digital I/O (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
P3.7/TB0OUTH/SVMOUT
44
N/A
N/A
N/A
I/O
Switch all PWM outputs high impedance input – TB0 (not available on F5528,
F5526, F5524, F5522, F5514, F5513 devices)
SVM output (not available on F5528, F5526, F5524, F5522, F5514, F5513 devices)
General-purpose digital I/O with reconfigurable port mapping secondary function
P4.0/PM_UCB1STE/
PM_UCA1CLK
45
41
F5
E8
I/O
Default mapping: Slave transmit enable – USCI_B1 SPI mode
Default mapping: Clock signal input – USCI_A1 SPI slave mode
Default mapping: Clock signal output – USCI_A1 SPI master mode
General-purpose digital I/O with reconfigurable port mapping secondary function
P4.1/PM_UCB1SIMO/
PM_UCB1SDA
46
42
H4
E7
I/O
Default mapping: Slave in, master out – USCI_B1 SPI mode
Default mapping: I2C data – USCI_B1 I2C mode
General-purpose digital I/O with reconfigurable port mapping secondary function
P4.2/PM_UCB1SOMI/
PM_UCB1SCL
47
43
G4
D9
I/O
Default mapping: Slave out, master in – USCI_B1 SPI mode
Default mapping: I2C clock – USCI_B1 I2C mode
General-purpose digital I/O with reconfigurable port mapping secondary function
Default mapping: Clock signal input – USCI_B1 SPI slave mode
P4.3/PM_UCB1CLK/
PM_UCA1STE
48
44
F4
D8
DVSS2
49
39
H6
F9
Digital ground supply
DVCC2
50
40
H5
E9
Digital power supply
P4.4/PM_UCA1TXD/
PM_UCA1SIMO
51
45
H3
D7
I/O
Default mapping: Clock signal output – USCI_B1 SPI master mode
Default mapping: Slave transmit enable – USCI_A1 SPI mode
General-purpose digital I/O with reconfigurable port mapping secondary function
I/O
Default mapping: Transmit data – USCI_A1 UART mode
Default mapping: Slave in, master out – USCI_A1 SPI mode
General-purpose digital I/O with reconfigurable port mapping secondary function
P4.5/PM_UCA1RXD/
PM_UCA1SOMI
52
46
G3
C9
I/O
Default mapping: Receive data – USCI_A1 UART mode
Default mapping: Slave out, master in – USCI_A1 SPI mode
P4.6/PM_NONE
53
47
F3
C8
I/O
P4.7/PM_NONE
54
48
E4
C7
I/O
16
Terminal Configuration and Functions
General-purpose digital I/O with reconfigurable port mapping secondary function
Default mapping: no secondary function.
General-purpose digital I/O with reconfigurable port mapping secondary function
Default mapping: no secondary function.
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Table 4-1. Terminal Functions (continued)
TERMINAL
NAME
P5.6/TB0.0
PN
55
P5.7/TB0.1
56
P7.4/TB0.2
57
P7.5/TB0.3
58
P7.6/TB0.4
I/O (1)
NO.
59
RGC
N/A
N/A
N/A
N/A
N/A
YFF
N/A
N/A
N/A
N/A
N/A
DESCRIPTION
ZQE
N/A
N/A
N/A
N/A
N/A
I/O
I/O
I/O
I/O
I/O
General-purpose digital I/O (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
TB0 CCR0 capture: CCI0A input, compare: Out0 output (not available on F5528,
F5526, F5524, F5522, F5514, F5513 devices)
General-purpose digital I/O (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
TB0 CCR1 capture: CCI1A input, compare: Out1 output (not available on F5528,
F5526, F5524, F5522, F5514, F5513 devices)
General-purpose digital I/O (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
TB0 CCR2 capture: CCI2A input, compare: Out2 output (not available on F5528,
F5526, F5524, F5522, F5514, F5513 devices)
General-purpose digital I/O (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
TB0 CCR3 capture: CCI3A input, compare: Out3 output (not available on F5528,
F5526, F5524, F5522, F5514, F5513 devices)
General-purpose digital I/O (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
TB0 CCR4 capture: CCI4A input, compare: Out4 output (not available on F5528,
F5526, F5524, F5522, F5514, F5513 devices)
General-purpose digital I/O (not available on F5528, F5526, F5524, F5522, F5514,
F5513 devices)
P7.7/TB0CLK/MCLK
60
N/A
N/A
N/A
I/O
TB0 clock signal TBCLK input (not available on F5528, F5526, F5524, F5522,
F5514, F5513 devices)
MCLK output (not available on F5528, F5526, F5524, F5522, F5514, F5513
devices)
VSSU
61
49
H2
B8,
B9
PU.0/DP
62
50
H1
A9
I/O
PUR
63
51
G2
B7
I/O
PU.1/DM
64
52
G1
A8
I/O
VBUS
65
53
F2
A7
USB LDO input (connect to USB power source)
VUSB
66
54
F1
A6
USB LDO output
V18
67
55
E2
B6
USB regulated power (internal use only, no external current loading)
AVSS2
68
56
D2
A5
Analog ground supply
P5.2/XT2IN
69
57
E1
B5
I/O
P5.3/XT2OUT
70
58
D1
B4
I/O
TEST/SBWTCK (3)
71
59
E3
A4
I
PJ.0/TDO (4)
72
60
D3
C5
I/O
PJ.1/TDI/TCLK (4)
73
61
D4
C4
I/O
USB PHY ground supply
General-purpose digital I/O. Controlled by USB control register
USB data terminal DP
USB pullup resistor pin (open drain). The voltage level at the PUR pin is used to
invoke the default USB BSL. Recommended 1-MΩ resistor to ground. See
Section 6.5.1 for more information.
General-purpose digital I/O. Controlled by USB control register
USB data terminal DM
General-purpose digital I/O
Input terminal for crystal oscillator XT2
General-purpose digital I/O
Output terminal of crystal oscillator XT2
Test mode pin – Selects four wire JTAG operation
Spy-Bi-Wire input clock when Spy-Bi-Wire operation activated
General-purpose digital I/O
JTAG test data output port
General-purpose digital I/O
JTAG test data input
Test clock input
PJ.2/TMS (4)
(3)
(4)
74
62
C1
A3
I/O
General-purpose digital I/O
JTAG test mode select
See Section 6.5 and Section 6.6 for use with BSL and JTAG functions.
See Section 6.6 for use with JTAG function.
Terminal Configuration and Functions
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Copyright © 2009–2015, Texas Instruments Incorporated
17
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
Table 4-1. Terminal Functions (continued)
TERMINAL
I/O (1)
NO.
NAME
PJ.3/TCK (4)
PN
RGC
YFF
ZQE
75
63
C2
B3
I/O
DESCRIPTION
General-purpose digital I/O
JTAG test clock
Reset input, active low (5)
RST/NMI/SBWTDIO
(3)
76
64
D5
A2
I/O
Nonmaskable interrupt input
Spy-Bi-Wire data input/output when Spy-Bi-Wire operation activated
General-purpose digital I/O
P6.0/CB0/A0
77
1
B1
A1
I/O
Comparator_B input CB0
Analog input A0 – ADC (not available on F551x devices)
General-purpose digital I/O
P6.1/CB1/A1
78
2
C3
B2
I/O
Comparator_B input CB1
Analog input A1 – ADC (not available on F551x devices)
General-purpose digital I/O
P6.2/CB2/A2
79
3
A1
B1
I/O
Comparator_B input CB2
Analog input A2 – ADC (not available on F551x devices)
General-purpose digital I/O
P6.3/CB3/A3
80
4
C4
C2
Reserved
N/A
N/A
N/A
(6)
QFN Pad
N/A
Pad
N/A
N/A
I/O
Comparator_B input CB3
Analog input A3 – ADC (not available on F551x devices)
(5)
(6)
18
Reserved. Connect to ground.
QFN package pad. TI recommends connecting to VSS.
When this pin is configured as reset, the internal pullup resistor is enabled by default.
C6, D4, D5, D6, E3, E4, E5, E6, F3, F4, F5, F6, F7, F8, G3 are reserved and should be connected to ground.
Terminal Configuration and Functions
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5 Specifications
Absolute Maximum Ratings (1)
5.1
over operating free-air temperature range (unless otherwise noted)
Voltage applied at VCC to VSS
Voltage applied to any pin (excluding VCORE, VBUS, V18)
(2)
MIN
MAX
–0.3
4.1
–0.3
VCC + 0.3
Diode current at any device pin
(1)
(2)
(3)
–55
95
°C
150
°C
ESD Ratings
VALUE
V(ESD)
(2)
V
mA
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to VSS. VCORE is for internal device use only. No external DC loading or voltage should be applied.
Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
5.2
(1)
V
±2
Maximum operating junction temperature, TJ
Storage temperature, Tstg (3)
UNIT
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±1000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±250
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as
±1000 V may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±250 V
may actually have higher performance.
5.3
Recommended Operating Conditions
Typical values are specified at VCC = 3.3 V and TA = 25°C (unless otherwise noted)
MIN
Supply voltage during program execution and flash
programming (AVCC = DVCC1/2 = DVCC) (1) (2)
VCC
Supply voltage during USB operation, USB PLL disabled,
USB_EN = 1, UPLLEN = 0
VCC,
USB
Supply voltage during USB operation, USB PLL enabled (3),
USB_EN = 1, UPLLEN = 1
3.6
PMMCOREVx = 0, 1
2.0
3.6
PMMCOREVx = 0, 1, 2
2.2
3.6
PMMCOREVx = 0, 1, 2, 3
2.4
3.6
PMMCOREVx = 0
1.8
3.6
PMMCOREVx = 0, 1
2.0
3.6
PMMCOREVx = 0, 1, 2
2.2
3.6
PMMCOREVx = 0, 1, 2, 3
2.4
3.6
PMMCOREVx = 2
2.2
3.6
PMMCOREVx = 2, 3
2.4
Supply voltage (AVSS = DVSS1/2 = DVSS)
TA
Operating free-air temperature
I version
–40
TJ
Operating junction temperature
I version
–40
CVCORE
Recommended capacitor at VCORE (4)
CDVCC/
CVCORE
Capacitor ratio of DVCC to VCORE
(2)
(3)
(4)
MAX
1.8
VSS
(1)
NOM
PMMCOREVx = 0
UNIT
V
V
3.6
0
V
85
85
470
10
°C
°C
nF
ratio
TI recommends powering AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be
tolerated during power up and operation.
The minimum supply voltage is defined by the supervisor SVS levels when it is enabled. See the Section 5.22 threshold parameters for
the exact values and further details.
USB operation with USB PLL enabled requires PMMCOREVx ≥ 2 for proper operation.
A capacitor tolerance of ±20% or better is required.
Specifications
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Recommended Operating Conditions (continued)
Typical values are specified at VCC = 3.3 V and TA = 25°C (unless otherwise noted)
MIN
Processor frequency (maximum MCLK frequency) (5)
(see Figure 5-1)
fSYSTEM
fSYSTEM_USB
Minimum processor frequency for USB operation
USB_wait
Wait state cycles during USB operation
(5)
NOM
MAX
PMMCOREVx = 0,
1.8 V ≤ VCC ≤ 3.6 V
(default condition)
0
8.0
PMMCOREVx = 1,
2.0 V ≤ VCC ≤ 3.6 V
0
12.0
PMMCOREVx = 2,
2.2 V ≤ VCC ≤ 3.6 V
0
20.0
PMMCOREVx = 3,
2.4 V ≤ VCC ≤ 3.6 V
0
25.0
1.5
UNIT
MHz
MHz
16
cycles
Modules may have a different maximum input clock specification. See the specification of the respective module in this data sheet.
25
System Frequency - MHz
3
20
2
2, 3
1
1, 2
1, 2, 3
0, 1
0, 1, 2
0, 1, 2, 3
12
8
0
0
1.8
2.0
2.2
2.4
3.6
Supply Voltage - V
The numbers within the fields denote the supported PMMCOREVx settings.
Figure 5-1. Maximum System Frequency
20
Specifications
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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5.4
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Active Mode Supply Current Into VCC Excluding External Current
over recommended operating free-air temperature (unless otherwise noted) (1)
(2) (3)
FREQUENCY (fDCO = fMCLK = fSMCLK)
PARAMETER
IAM,
IAM,
(1)
(2)
(3)
Flash
RAM
EXECUTION
MEMORY
Flash
RAM
VCC
PMMCOREVx
3.0 V
3.0 V
1 MHz
8 MHz
12 MHz
TYP
MAX
2.65
4.0
4.4
2.90
20 MHz
TYP
MAX
TYP
MAX
0
0.36
0.47
2.32
2.60
1
0.40
2
0.44
3
0.46
0
0.20
1
0.22
1.35
2.0
2
0.24
1.50
2.2
3.7
3
0.26
1.60
2.4
3.9
3.10
0.24
1.20
TYP
MAX
4.3
7.1
7.7
4.6
7.6
25 MHz
TYP
UNIT
MAX
mA
10.1
11.0
1.30
2.2
mA
4.2
5.3
6.2
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
Characterized with program executing typical data processing. USB disabled (VUSBEN = 0, SLDOEN = 0).
fACLK = 32786 Hz, fDCO = fMCLK = fSMCLK at specified frequency.
XTS = CPUOFF = SCG0 = SCG1 = OSCOFF= SMCLKOFF = 0.
Specifications
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.5
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Low-Power Mode Supply Currents (Into VCC) Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
ILPM0,1MHz
Low-power mode 0 (3) (4)
ILPM2
Low-power mode 2 (5) (4)
VCC
PMMCOREVx
2.2 V
0
3.0 V
3
2.2 V
3.0 V
2.2 V
ILPM3,XT1LF
Low-power mode 3,
crystal mode (6) (4)
3.0 V
ILPM3,VLO
ILPM4
ILPM4.5
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
22
Low-power mode 3,
VLO mode (7) (4)
3.0 V
Low-power mode 4 (8) (4)
Low-power mode 4.5
(9)
3.0 V
3.0 V
–40°C
TYP
MAX
25°C
60°C
(2)
85°C
TYP
MAX
TYP
73
77
85
80
85
97
79
83
92
88
95
105
0
6.5
6.5
12
10
11
17
3
7.0
7.0
13
11
12
18
0
1.60
1.90
2.6
5.6
1
1.65
2.00
2.7
5.9
2
1.75
2.15
2.9
6.1
0
1.8
2.1
2.8
5.8
1
1.9
2.3
2.9
6.1
2
2.0
2.4
3.0
6.3
3
2.0
2.5
3.9
3.1
6.4
9.3
0
1.1
1.4
2.7
1.9
4.9
7.4
1
1.1
1.4
2.0
5.2
2
1.2
1.5
2.1
5.3
3
1.3
1.6
3.0
2.2
5.4
8.5
0
0.9
1.1
1.5
1.8
4.8
7.3
1
1.1
1.2
2.0
5.1
2
1.2
1.2
2.1
5.2
3
1.3
1.3
1.6
2.2
5.3
8.1
0.15
0.18
0.35
0.26
0.5
1.0
2.9
MAX
TYP
MAX
8.3
UNIT
µA
µA
µA
µA
µA
µA
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
Current for watchdog timer clocked by SMCLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 1 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0).
Current for brownout, high-side supervisor (SVSH) normal mode included. Low-side supervisor and monitor disabled (SVSL, SVML).
High-side monitor disabled (SVMH). RAM retention enabled.
Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 0 MHz; DCO setting = 1
MHz operation, DCO bias generator enabled.
USB disabled (VUSBEN = 0, SLDOEN = 0)
Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0)
Current for watchdog timer and RTC clocked by ACLK included. ACLK = VLO.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = fVLO, fMCLK = fSMCLK = fDCO = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0)
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 (LPM4); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0)
Internal regulator disabled. No data retention.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1, PMMREGOFF = 1 (LPM4.5); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
Specifications
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5.6
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Thermal Characteristics
PARAMETER
Low-K board (JESD51-3)
θJA
Junction-to-ambient thermal resistance, still air
High-K board (JESD51-7)
θJC
θJB
Junction-to-case thermal resistance
Junction-to-board thermal resistance
VALUE
LQFP (PN)
70
VQFN (RGC)
55
BGA (ZQE)
84
LQFP (PN)
45
VQFN (RGC)
25
BGA (ZQE)
46
LQFP (PN)
12
VQFN (RGC)
12
BGA (ZQE)
30
LQFP (PN)
22
VQFN (RGC)
6
BGA (ZQE)
20
Specifications
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UNIT
°C/W
°C/W
°C/W
23
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Schmitt-Trigger Inputs – General-Purpose I/O (1)
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7)
(P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3, RST/NMI)
5.7
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIT+
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input voltage hysteresis (VIT+ – VIT–)
RPull
Pullup and pulldown resistor (2)
For pullup: VIN = VSS
For pulldown: VIN = VCC
CI
Input capacitance
VIN = VSS or VCC
(1)
(2)
VCC
MIN
1.8 V
0.80
TYP
1.40
3V
1.50
2.10
1.8 V
0.45
1.00
3V
0.75
1.65
1.8 V
0.3
0.85
3V
0.4
1.0
20
35
MAX
UNIT
V
V
V
50
kΩ
5
pF
Same parametrics apply to clock input pin when crystal bypass mode is used on XT1 (XIN) or XT2 (XT2IN).
Also applies to RST pin when pullup or pulldown resistor is enabled.
Inputs – Ports P1 and P2 (1)
(P1.0 to P1.7, P2.0 to P2.7)
5.8
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
External interrupt timing (2)
t(int)
(1)
(2)
TEST CONDITIONS
VCC
External trigger pulse duration to set interrupt flag
MIN
2.2 V, 3 V
MAX
UNIT
20
ns
Some devices may contain additional ports with interrupts. See the block diagram and terminal function descriptions.
An external signal sets the interrupt flag every time the minimum interrupt pulse duration t(int) is met. It may be set by trigger signals
shorter than t(int).
5.9
Leakage Current – General-Purpose I/O
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7)
(P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3, RST/NMI)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Ilkg(Px.x)
(1)
(2)
TEST CONDITIONS
(1) (2)
High-impedance leakage current
VCC
MIN
MAX
1.8 V, 3 V
–50
50
UNIT
nA
The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted.
The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup or pulldown resistor is
disabled.
5.10 Outputs – General-Purpose I/O (Full Drive Strength)
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7)
(P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
I(OHmax) = –3 mA (1)
VOH
High-level output voltage
I(OHmax) = –10 mA (2)
I(OHmax) = –5 mA (1)
I(OHmax) = –15 mA (2)
I(OLmax) = 3 mA
VOL
Low-level output voltage
(2)
24
1.8 V
3V
(1)
I(OLmax) = 10 mA (2)
I(OLmax) = 5 mA (1)
I(OLmax) = 15 mA (2)
(1)
VCC
1.8 V
3V
MIN
MAX
VCC – 0.25
VCC
VCC – 0.60
VCC
VCC – 0.25
VCC
VCC – 0.60
VCC
VSS
VSS + 0.25
VSS
VSS + 0.60
VSS
VSS + 0.25
VSS
VSS + 0.60
UNIT
V
V
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±48 mA to hold the maximum voltage drop
specified.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±100 mA to hold the maximum voltage
drop specified.
Specifications
Copyright © 2009–2015, Texas Instruments Incorporated
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.11 Outputs – General-Purpose I/O (Reduced Drive Strength)
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7)
(P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
I(OHmax) = –1 mA (2)
VOH
1.8 V
I(OHmax) = –3 mA (3)
High-level output voltage
I(OHmax) = –2 mA
(2)
3.0 V
I(OHmax) = –6 mA (3)
I(OLmax) = 1 mA (2)
VOL
I(OLmax) = 2 mA (2)
(3)
MAX
VCC
VCC – 0.60
VCC
VCC – 0.25
VCC
VCC – 0.60
VCC
VSS
VSS + 0.25
VSS
VSS + 0.60
VSS
VSS + 0.25
VSS
VSS + 0.60
3.0 V
I(OLmax) = 6 mA (3)
(1)
(2)
MIN
VCC – 0.25
1.8 V
I(OLmax) = 3 mA (3)
Low-level output voltage
VCC
UNIT
V
V
Selecting reduced drive strength may reduce EMI.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±48 mA to hold the maximum voltage drop
specified.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±100 mA to hold the maximum voltage
drop specified.
5.12 Output Frequency – General-Purpose I/O
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7)
(P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fPx.y
fPort_CLK
(1)
(2)
TEST CONDITIONS
Port output frequency
(with load)
See
Clock output frequency
ACLK,
SMCLK,
MCLK,
CL = 20 pF (2)
(1) (2)
MIN
MAX
VCC = 1.8 V,
PMMCOREVx = 0
16
VCC = 3 V,
PMMCOREVx = 3
25
VCC = 1.8 V,
PMMCOREVx = 0
16
VCC = 3 V,
PMMCOREVx = 3
25
UNIT
MHz
MHz
A resistive divider with 2 × R1 between VCC and VSS is used as load. The output is connected to the center tap of the divider. For full
drive strength, R1 = 550 Ω. For reduced drive strength, R1 = 1.6 kΩ. CL = 20 pF is connected to the output to VSS.
The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
Specifications
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5.13 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
8.0
VCC = 3.0 V
Px.y
IOL – Typical Low-Level Output Current – mA
IOL – Typical Low-Level Output Current – mA
25.0
TA = 25°C
20.0
TA = 85°C
15.0
10.0
5.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VOL – Low-Level Output Voltage – V
Figure 5-2. Typical Low-Level Output Current vs Low-Level
Output Voltage
IOH – Typical High-Level Output Current – mA
IOH – Typical High-Level Output Current – mA
-5.0
-10.0
TA = 85°C
TA = 25°C
3.0
2.0
1.0
0.5
1.0
1.5
2.0
VCC = 1.8 V
Px.y
-1.0
-2.0
-3.0
-4.0
TA = 85°C
-5.0
-6.0
TA = 25°C
-7.0
-8.0
-25.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VOH – High-Level Output Voltage – V
Figure 5-4. Typical High-Level Output Current vs High-Level
Output Voltage
26
4.0
0.0
VCC = 3.0 V
Px.y
-20.0
5.0
VOL – Low-Level Output Voltage – V
Figure 5-3. Typical Low-Level Output Current vs Low-Level
Output Voltage
0.0
-15.0
TA = 85°C
6.0
0.0
0.0
3.5
TA = 25°C
VCC = 1.8 V
Px.y
7.0
Specifications
0.0
0.5
1.0
1.5
2.0
VOH – High-Level Output Voltage – V
Figure 5-5. Typical High-Level Output Current vs High-Level
Output Voltage
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.14 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TA = 25°C
VCC = 3.0 V
Px.y
55.0
50.0
IOL – Typical Low-Level Output Current – mA
IOL – Typical Low-Level Output Current – mA
60.0
TA = 85°C
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
IOH – Typical High-Level Output Current – mA
IOH – Typical High-Level Output Current – mA
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-40.0
-45.0
TA = 85°C
-55.0
TA = 25°C
-60.0
0.0
TA = 85°C
16
12
8
4
0.5
1.0
1.5
2.0
0
VCC = 3.0 V
Px.y
-50.0
TA = 25°C
20
VOL – Low-Level Output Voltage – V
Figure 5-7. Typical Low-Level Output Current vs Low-Level
Output Voltage
0.0
-5.0
VCC = 1.8 V
Px.y
0
0.0
3.5
VOL – Low-Level Output Voltage – V
Figure 5-6. Typical Low-Level Output Current vs Low-Level
Output Voltage
24
0.5
VCC = 1.8 V
Px.y
-4
-8
-12
TA = 85°C
-16
TA = 25°C
-20
1.0
1.5
2.0
2.5
3.0
3.5
VOH – High-Level Output Voltage – V
Figure 5-8. Typical High-Level Output Current vs High-Level
Output Voltage
0.0
0.5
1.0
1.5
VOH – High-Level Output Voltage – V
Figure 5-9. Typical High-Level Output Current vs High-Level
Output Voltage
Specifications
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5.15 Crystal Oscillator, XT1, Low-Frequency Mode (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
ΔIDVCC.LF
Differential XT1 oscillator
crystal current consumption
from lowest drive setting, LF
mode
TEST CONDITIONS
VCC
MIN
fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0,
XT1DRIVEx = 1, TA = 25°C
fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0,
XT1DRIVEx = 2, TA = 25°C
3.0 V
0.170
0.290
XTS = 0, XT1BYPASS = 0
32768
XT1 oscillator crystal
frequency, LF mode
fXT1,LF,SW
XT1 oscillator logic-level
square-wave input frequency, XTS = 0, XT1BYPASS = 1 (2)
LF mode
OALF
Oscillation allowance for
LF crystals (4)
(3)
10
fFault,LF
tSTART,LF
210
XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 1,
fXT1,LF = 32768 Hz, CL,eff = 12 pF
300
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
28
XTS = 0, XCAPx = 2
8.5
XTS = 0, XCAPx = 3
12.0
Oscillator fault frequency,
LF mode (7)
XTS = 0 (8)
fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0,
XT1DRIVEx = 0, TA = 25°C, CL,eff = 6 pF
fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0,
XT1DRIVEx = 3, TA = 25°C, CL,eff = 12 pF
µA
Hz
50
kHz
1
5.5
Duty cycle, LF mode
UNIT
kΩ
XTS = 0, XCAPx = 1
XTS = 0, Measured at ACLK,
fXT1,LF = 32768 Hz
Start-up time, LF mode
32.768
XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 0,
fXT1,LF = 32768 Hz, CL,eff = 6 pF
XTS = 0, XCAPx = 0 (6)
CL,eff
MAX
0.075
fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0,
XT1DRIVEx = 3, TA = 25°C
fXT1,LF0
Integrated effective load
capacitance, LF mode (5)
TYP
pF
30%
70%
10
10000
Hz
1000
3.0 V
ms
500
To improve EMI on the XT1 oscillator, the following guidelines should be observed.
• Keep the trace between the device and the crystal as short as possible.
• Design a good ground plane around the oscillator pins.
• Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
• Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
• Use assembly materials and processes that avoid any parasitic load on the oscillator XIN and XOUT pins.
• If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins.
When XT1BYPASS is set, XT1 circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in
the Schmitt-trigger Inputs section of this data sheet.
Maximum frequency of operation of the entire device cannot be exceeded.
Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the
XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following
guidelines, but should be evaluated based on the actual crystal selected for the application:
• For XT1DRIVEx = 0, CL,eff ≤ 6 pF.
• For XT1DRIVEx = 1, 6 pF ≤ CL,eff ≤ 9 pF.
• For XT1DRIVEx = 2, 6 pF ≤ CL,eff ≤ 10 pF.
• For XT1DRIVEx = 3, CL,eff ≥ 6 pF.
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, TI recommends verifying the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies between the MIN and MAX specifications might set the flag.
Measured with logic-level input frequency but also applies to operation with crystals.
Specifications
Copyright © 2009–2015, Texas Instruments Incorporated
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.16 Crystal Oscillator, XT2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
VCC
MIN
fOSC = 4 MHz, XT2OFF = 0, XT2BYPASS = 0,
XT2DRIVEx = 0, TA = 25°C
IDVCC.XT2
XT2 oscillator crystal
current consumption
fOSC = 12 MHz, XT2OFF = 0, XT2BYPASS = 0,
XT2DRIVEx = 1, TA = 25°C
fOSC = 20 MHz, XT2OFF = 0, XT2BYPASS = 0,
XT2DRIVEx = 2, TA = 25°C
(2)
TYP
MAX
UNIT
200
260
3.0 V
µA
325
fOSC = 32 MHz, XT2OFF = 0, XT2BYPASS = 0,
XT2DRIVEx = 3, TA = 25°C
450
fXT2,HF0
XT2 oscillator crystal
frequency, mode 0
XT2DRIVEx = 0, XT2BYPASS = 0 (3)
4
8
MHz
fXT2,HF1
XT2 oscillator crystal
frequency, mode 1
XT2DRIVEx = 1, XT2BYPASS = 0 (3)
8
16
MHz
fXT2,HF2
XT2 oscillator crystal
frequency, mode 2
XT2DRIVEx = 2, XT2BYPASS = 0 (3)
16
24
MHz
fXT2,HF3
XT2 oscillator crystal
frequency, mode 3
XT2DRIVEx = 3, XT2BYPASS = 0 (3)
24
32
MHz
fXT2,HF,SW
XT2 oscillator logic-level
square-wave input
frequency, bypass mode
XT2BYPASS = 1 (4)
0.7
32
MHz
OAHF
tSTART,HF
CL,eff
Oscillation allowance for
HF crystals (5)
Start-up time
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
XT2DRIVEx = 0, XT2BYPASS = 0,
fXT2,HF0 = 6 MHz, CL,eff = 15 pF
450
XT2DRIVEx = 1, XT2BYPASS = 0,
fXT2,HF1 = 12 MHz, CL,eff = 15 pF
320
XT2DRIVEx = 2, XT2BYPASS = 0,
fXT2,HF2 = 20 MHz, CL,eff = 15 pF
200
XT2DRIVEx = 3, XT2BYPASS = 0,
fXT2,HF3 = 32 MHz, CL,eff = 15 pF
200
fOSC = 6 MHz, XT2BYPASS = 0, XT2DRIVEx = 0,
TA = 25°C, CL,eff = 15 pF
fOSC = 20 MHz, XT2BYPASS = 0, XT2DRIVEx = 2,
TA = 25°C, CL,eff = 15 pF
Ω
0.5
3.0 V
ms
0.3
Integrated effective load
capacitance, HF
mode (6) (1)
Duty cycle
fFault,HF
(3)
Oscillator fault
frequency (7)
1
Measured at ACLK, fXT2,HF2 = 20 MHz
XT2BYPASS = 1
(8)
40%
30
50%
pF
60%
300
kHz
Requires external capacitors at both terminals. Values are specified by crystal manufacturers. In general, an effective load capacitance
of up to 18 pF can be supported.
To improve EMI on the XT2 oscillator the following guidelines should be observed.
• Keep the traces between the device and the crystal as short as possible.
• Design a good ground plane around the oscillator pins.
• Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.
• Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.
• Use assembly materials and processes that avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.
• If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins.
This represents the maximum frequency that can be input to the device externally. Maximum frequency achievable on the device
operation is based on the frequencies present on ACLK, MCLK, and SMCLK cannot be exceed for a given range of operation.
When XT2BYPASS is set, the XT2 circuit is automatically powered down. Input signal is a digital square wave with parametrics defined
in the Schmitt-trigger Inputs section of this data sheet.
Oscillation allowance is based on a safety factor of 5 for recommended crystals.
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, TI recommends verifying the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies between the MIN and MAX specifications might set the flag.
Measured with logic-level input frequency but also applies to operation with crystals.
Specifications
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5.17 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
fVLO
VLO frequency
Measured at ACLK
1.8 V to 3.6 V
dfVLO/dT
VLO frequency temperature drift
Measured at ACLK (1)
1.8 V to 3.6 V
Measured at ACLK (2)
1.8 V to 3.6 V
Measured at ACLK
1.8 V to 3.6 V
dfVLO/dVCC VLO frequency supply voltage drift
Duty cycle
(1)
(2)
MIN
TYP
MAX
6
9.4
14
0.5
50%
kHz
%/°C
4
40%
UNIT
%/V
60%
Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 V to 3.6 V) – MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V – 1.8 V)
5.18 Internal Reference, Low-Frequency Oscillator (REFO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
IREFO
fREFO
TEST CONDITIONS
VCC
MIN
TYP
1.8 V to 3.6 V
REFO frequency calibrated
Measured at ACLK
1.8 V to 3.6 V
Full temperature range
1.8 V to 3.6 V
–3.5%
3.5%
3V
–1.5%
1.5%
REFO absolute tolerance calibrated
TA = 25°C
(1)
3
REFO frequency temperature drift
Measured at ACLK
1.8 V to 3.6 V
0.01
dfREFO/dVCC
REFO frequency supply voltage drift
Measured at ACLK (2)
1.8 V to 3.6 V
1.0
Duty cycle
Measured at ACLK
1.8 V to 3.6 V
REFO start-up time
40%/60% duty cycle
1.8 V to 3.6 V
(1)
(2)
30
40%
50%
UNIT
µA
32768
dfREFO/dT
tSTART
MAX
REFO oscillator current consumption TA = 25°C
Hz
%/°C
%/V
60%
25
µs
Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 V to 3.6 V) – MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V – 1.8 V)
Specifications
Copyright © 2009–2015, Texas Instruments Incorporated
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.19 DCO Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
(1)
MIN
TYP
MAX
UNIT
fDCO(0,0)
DCO frequency (0, 0)
DCORSELx = 0, DCOx = 0, MODx = 0
0.07
0.20
MHz
fDCO(0,31)
DCO frequency (0, 31) (1)
DCORSELx = 0, DCOx = 31, MODx = 0
0.70
1.70
MHz
fDCO(1,0)
DCO frequency (1, 0) (1)
DCORSELx = 1, DCOx = 0, MODx = 0
0.15
0.36
MHz
fDCO(1,31)
DCO frequency (1, 31) (1)
DCORSELx = 1, DCOx = 31, MODx = 0
1.47
3.45
MHz
(1)
fDCO(2,0)
DCO frequency (2, 0)
DCORSELx = 2, DCOx = 0, MODx = 0
0.32
0.75
MHz
fDCO(2,31)
DCO frequency (2, 31) (1)
DCORSELx = 2, DCOx = 31, MODx = 0
3.17
7.38
MHz
fDCO(3,0)
DCO frequency (3, 0) (1)
DCORSELx = 3, DCOx = 0, MODx = 0
0.64
1.51
MHz
(1)
fDCO(3,31)
DCO frequency (3, 31)
DCORSELx = 3, DCOx = 31, MODx = 0
6.07
14.0
MHz
fDCO(4,0)
DCO frequency (4, 0) (1)
DCORSELx = 4, DCOx = 0, MODx = 0
1.3
3.2
MHz
fDCO(4,31)
DCO frequency (4, 31) (1)
DCORSELx = 4, DCOx = 31, MODx = 0
12.3
28.2
MHz
(1)
fDCO(5,0)
DCO frequency (5, 0)
DCORSELx = 5, DCOx = 0, MODx = 0
2.5
6.0
MHz
fDCO(5,31)
DCO frequency (5, 31) (1)
DCORSELx = 5, DCOx = 31, MODx = 0
23.7
54.1
MHz
fDCO(6,0)
DCO frequency (6, 0) (1)
DCORSELx = 6, DCOx = 0, MODx = 0
4.6
10.7
MHz
fDCO(6,31)
DCO frequency (6, 31) (1)
DCORSELx = 6, DCOx = 31, MODx = 0
39.0
88.0
MHz
(1)
fDCO(7,0)
DCO frequency (7, 0)
DCORSELx = 7, DCOx = 0, MODx = 0
8.5
19.6
MHz
fDCO(7,31)
DCO frequency (7, 31) (1)
DCORSELx = 7, DCOx = 31, MODx = 0
60
135
MHz
SDCORSEL
Frequency step between range
DCORSEL and DCORSEL + 1
SRSEL = fDCO(DCORSEL+1,DCO)/fDCO(DCORSEL,DCO)
1.2
2.3
ratio
SDCO
Frequency step between tap
DCO and DCO + 1
SDCO = fDCO(DCORSEL,DCO+1)/fDCO(DCORSEL,DCO)
1.02
1.12
ratio
Duty cycle
Measured at SMCLK
40%
DCO frequency temperature
drift (2)
dfDCO/dT
dfDCO/dVCC
(1)
(2)
(3)
DCO frequency voltage drift
(3)
50%
60%
fDCO = 1 MHz
0.1
%/°C
fDCO = 1 MHz
1.9
%/V
When selecting the proper DCO frequency range (DCORSELx), the target DCO frequency, fDCO, should be set to reside within the
range of fDCO(n, 0),MAX ≤ fDCO ≤ fDCO(n, 31),MIN, where fDCO(n, 0),MAX represents the maximum frequency specified for the DCO frequency,
range n, tap 0 (DCOx = 0) and fDCO(n,31),MIN represents the minimum frequency specified for the DCO frequency, range n, tap 31
(DCOx = 31). This ensures that the target DCO frequency resides within the range selected. It should also be noted that if the actual
fDCO frequency for the selected range causes the FLL or the application to select tap 0 or 31, the DCO fault flag is set to report that the
selected range is at its minimum or maximum tap setting.
Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 V to 3.6 V) – MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V – 1.8 V)
Typical DCO Frequency, VCC = 3.0 V, TA = 25°C
100
fDCO – MHz
10
DCOx = 31
1
0.1
DCOx = 0
0
1
2
3
4
5
6
7
DCORSEL
Figure 5-10. Typical DCO Frequency
Specifications
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31
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5.20 PMM, Brown-Out Reset (BOR)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V(DVCC_BOR_IT–)
BORH on voltage, DVCC falling level
| dDVCC/dt | < 3 V/s
V(DVCC_BOR_IT+)
BORH off voltage, DVCC rising level
| dDVCC/dt | < 3 V/s
V(DVCC_BOR_hys)
BORH hysteresis
tRESET
Pulse duration required at RST/NMI pin
to accept a reset
MIN
TYP
0.80
1.30
60
MAX
UNIT
1.45
V
1.50
V
250
mV
2
µs
5.21 PMM, Core Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VCORE3(AM)
Core voltage, active mode, PMMCOREV = 3
2.4 V ≤ DVCC ≤ 3.6 V
1.90
V
VCORE2(AM)
Core voltage, active mode, PMMCOREV = 2
2.2 V ≤ DVCC ≤ 3.6 V
1.80
V
VCORE1(AM)
Core voltage, active mode, PMMCOREV = 1
2.0 V ≤ DVCC ≤ 3.6 V
1.60
V
VCORE0(AM)
Core voltage, active mode, PMMCOREV = 0
1.8 V ≤ DVCC ≤ 3.6 V
1.40
V
VCORE3(LPM)
Core voltage, low-current mode,
PMMCOREV = 3
2.4 V ≤ DVCC ≤ 3.6 V
1.94
V
VCORE2(LPM)
Core voltage, low-current mode,
PMMCOREV = 2
2.2 V ≤ DVCC ≤ 3.6 V
1.84
V
VCORE1(LPM)
Core voltage, low-current mode,
PMMCOREV = 1
2.0 V ≤ DVCC ≤ 3.6 V
1.64
V
VCORE0(LPM)
Core voltage, low-current mode,
PMMCOREV = 0
1.8 V ≤ DVCC ≤ 3.6 V
1.44
V
5.22 PMM, SVS High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVSHE = 0, DVCC = 3.6 V
I(SVSH)
SVS current consumption
V(SVSH_IT–)
V(SVSH_IT+)
SVSH on voltage level (1)
SVSH off voltage level (1)
tpd(SVSH)
SVSH propagation delay
t(SVSH)
SVSH on or off delay time
dVDVCC/dt
DVCC rise time
(1)
32
TYP
MAX
0
UNIT
nA
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 0
200
nA
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 1
1.5
µA
SVSHE = 1, SVSHRVL = 0
1.57
1.68
1.78
SVSHE = 1, SVSHRVL = 1
1.79
1.88
1.98
SVSHE = 1, SVSHRVL = 2
1.98
2.08
2.21
SVSHE = 1, SVSHRVL = 3
2.10
2.18
2.31
SVSHE = 1, SVSMHRRL = 0
1.62
1.74
1.85
SVSHE = 1, SVSMHRRL = 1
1.88
1.94
2.07
SVSHE = 1, SVSMHRRL = 2
2.07
2.14
2.28
SVSHE = 1, SVSMHRRL = 3
2.20
2.30
2.42
SVSHE = 1, SVSMHRRL = 4
2.32
2.40
2.55
SVSHE = 1, SVSMHRRL = 5
2.52
2.70
2.88
SVSHE = 1, SVSMHRRL = 6
2.90
3.10
3.23
SVSHE = 1, SVSMHRRL = 7
2.90
3.10
3.23
SVSHE = 1, dVDVCC/dt = 10 mV/µs, SVSHFP = 1
2.5
SVSHE = 1, dVDVCC/dt = 1 mV/µs, SVSHFP = 0
20
SVSHE = 0 → 1, SVSHFP = 1
12.5
SVSHE = 0 → 1, SVSHFP = 0
100
0
V
V
µs
µs
1000
V/s
The SVSH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208) on recommended settings and use.
Specifications
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.23 PMM, SVM High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVMHE = 0, DVCC = 3.6 V
I(SVMH)
V(SVMH)
SVMH current consumption
SVMH on or off voltage level
(1)
SVMH propagation delay
t(SVMH)
SVMH on or off delay time
(1)
MAX
0
UNIT
nA
SVMHE= 1, DVCC = 3.6 V, SVMHFP = 0
200
nA
SVMHE = 1, DVCC = 3.6 V, SVMHFP = 1
1.5
µA
SVMHE = 1, SVSMHRRL = 0
1.62
1.74
1.85
SVMHE = 1, SVSMHRRL = 1
1.88
1.94
2.07
SVMHE = 1, SVSMHRRL = 2
2.07
2.14
2.28
SVMHE = 1, SVSMHRRL = 3
2.20
2.30
2.42
SVMHE = 1, SVSMHRRL = 4
2.32
2.40
2.55
SVMHE = 1, SVSMHRRL = 5
2.52
2.70
2.88
SVMHE = 1, SVSMHRRL = 6
2.90
3.10
3.23
SVMHE = 1, SVSMHRRL = 7
2.90
3.10
3.23
SVMHE = 1, SVMHOVPE = 1
tpd(SVMH)
TYP
V
3.75
SVMHE = 1, dVDVCC/dt = 10 mV/µs, SVMHFP = 1
2.5
SVMHE = 1, dVDVCC/dt = 1 mV/µs, SVMHFP = 0
20
SVMHE = 0 → 1, SVMHFP = 1
12.5
SVMHE = 0 → 1, SVMHFP = 0
100
µs
µs
The SVMH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208) on recommended settings and use.
5.24 PMM, SVS Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVSLE = 0, PMMCOREV = 2
I(SVSL)
SVSL current consumption
tpd(SVSL)
SVSL propagation delay
t(SVSL)
SVSL on or off delay time
TYP
MAX
UNIT
0
nA
SVSLE = 1, PMMCOREV = 2, SVSLFP = 0
200
nA
SVSLE = 1, PMMCOREV = 2, SVSLFP = 1
1.5
µA
SVSLE = 1, dVCORE/dt = 10 mV/µs, SVSLFP = 1
2.5
SVSLE = 1, dVCORE/dt = 1 mV/µs, SVSLFP = 0
20
SVSLE = 0 → 1, dVCORE/dt = 10 mV/µs, SVSLFP = 1
12.5
SVSLE = 0 → 1, dVCORE/dt = 1 mV/µs, SVSLFP = 0
100
µs
µs
5.25 PMM, SVM Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
SVMLE = 0, PMMCOREV = 2
I(SVML)
SVML current consumption
tpd(SVML)
SVML propagation delay
t(SVML)
SVML on or off delay time
MIN
TYP
MAX
UNIT
0
nA
SVMLE= 1, PMMCOREV = 2, SVMLFP = 0
200
nA
SVMLE= 1, PMMCOREV = 2, SVMLFP = 1
1.5
µA
SVMLE = 1, dVCORE/dt = 10 mV/µs, SVMLFP = 1
2.5
SVMLE = 1, dVCORE/dt = 1 mV/µs, SVMLFP = 0
20
SVMLE = 0 → 1, dVCORE/dt = 10 mV/µs, SVMLFP = 1
12.5
SVMLE = 0 → 1, dVCORE/dt = 1 mV/µs, SVMLFP = 0
100
Specifications
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µs
µs
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5.26 Wake-up Times From Low-Power Modes and Reset
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
fMCLK ≥ 4.0 MHz
3.5
7.5
1.0 MHz < fMCLK
< 4.0 MHz
4.5
9
150
165
µs
tWAKE-UP-FAST
Wake-up time from LPM2,
LPM3, or LPM4 to active
mode (1)
PMMCOREV = SVSMLRRL = n
(where n = 0, 1, 2, or 3),
SVSLFP = 1
tWAKE-UP-SLOW
Wake-up time from LPM2,
LPM3 or LPM4 to active
mode (2)
PMMCOREV = SVSMLRRL = n
(where n = 0, 1, 2, or 3), SVSLFP = 0
tWAKE-UP-LPM5
Wake-up time from LPM4.5 to
active mode (3)
2
3
ms
tWAKE-UP-RESET
Wake-up time from RST or
BOR event to active mode (3)
2
3
ms
(1)
(2)
(3)
µs
This value represents the time from the wake-up event to the first active edge of MCLK. The wake-up time depends on the performance
mode of the low-side supervisor (SVSL) and low-side monitor (SVML). Fastest wake-up times are possible with SVSLand SVML in fullperformance mode or disabled when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while
operating in LPM2, LPM3, and LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx
and MSP430x6xx Family User's Guide (SLAU208).
This value represents the time from the wake-up event to the first active edge of MCLK. The wake-up time depends on the performance
mode of the low-side supervisor (SVSL) and low-side monitor (SVML). In this case, the SVSLand SVML are in normal mode (low current)
mode when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while operating in LPM2, LPM3, and
LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx and MSP430x6xx Family User's
Guide (SLAU208).
This value represents the time from the wake-up event to the reset vector execution.
5.27 Timer_A
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fTA
Timer_A input clock frequency
Internal: SMCLK, ACLK,
External: TACLK,
Duty cycle = 50% ± 10%
tTA,cap
Timer_A capture timing
All capture inputs, minimum pulse
duration required for capture
VCC
1.8 V, 3 V
1.8 V, 3 V
MIN
MAX
UNIT
25
MHz
20
ns
5.28 Timer_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fTB
Timer_B input clock frequency
Internal: SMCLK, ACLK,
External: TBCLK,
Duty cycle = 50% ± 10%
tTB,cap
Timer_B capture timing
All capture inputs, minimum pulse
duration required for capture
34
Specifications
VCC
1.8 V, 3 V
1.8 V, 3 V
MIN
MAX
UNIT
25
MHz
20
ns
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.29 USCI (UART Mode) Clock Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fUSCI
USCI input clock frequency
fBITCLK
BITCLK clock frequency
(equals baud rate in MBaud)
CONDITIONS
VCC
MIN
Internal: SMCLK, ACLK,
External: UCLK,
Duty cycle = 50% ± 10%
MAX
UNIT
fSYSTEM
MHz
1
MHz
UNIT
5.30 USCI (UART Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
UART receive deglitch time (1)
tt
(1)
TEST CONDITIONS
VCC
MIN
MAX
2.2 V
50
600
3V
50
600
ns
Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are
correctly recognized, their duration should exceed the maximum specification of the deglitch time.
5.31 USCI (SPI Master Mode) Clock Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fUSCI
USCI input clock frequency
CONDITIONS
VCC
MIN
Internal: SMCLK, ACLK,
Duty cycle = 50% ± 10%
MAX
UNIT
fSYSTEM
MHz
MAX
UNIT
fSYSTEM
MHz
5.32 USCI (SPI Master Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
(see Figure 5-11 and Figure 5-12)
PARAMETER
fUSCI
USCI input clock frequency
TEST CONDITIONS
SOMI input data setup time
PMMCOREV = 3
PMMCOREV = 0
tHD,MI
SOMI input data hold time
PMMCOREV = 3
tVALID,MO
SIMO output data valid time (2)
(2)
(3)
55
3.0 V
38
2.4 V
30
3.0 V
25
1.8 V
0
3.0 V
0
2.4 V
0
3.0 V
0
ns
ns
1.8 V
20
3.0 V
18
UCLK edge to SIMO valid,
CL = 20 pF, PMMCOREV = 3
2.4 V
16
3.0 V
15
SIMO output data hold time (3)
CL = 20 pF, PMMCOREV = 3
(1)
1.8 V
UCLK edge to SIMO valid,
CL = 20 pF, PMMCOREV = 0
CL = 20 pF, PMMCOREV = 0
tHD,MO
MIN
SMCLK, ACLK,
Duty cycle = 50% ± 10%
PMMCOREV = 0
tSU,MI
VCC
1.8 V
ns
–10
3.0 V
–8
2.4 V
–10
3.0 V
–8
ns
fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(USCI) + tSU,SI(Slave), tSU,MI(USCI) + tVALID,SO(Slave)).
For the slave parameters tSU,SI(Slave) and tVALID,SO(Slave), see the SPI parameters of the attached slave.
Specifies the time to drive the next valid data to the SIMO output after the output changing UCLK clock edge. See the timing diagrams
in Figure 5-11 and Figure 5-12.
Specifies how long data on the SIMO output is valid after the output changing UCLK clock edge. Negative values indicate that the data
on the SIMO output can become invalid before the output changing clock edge observed on UCLK. See the timing diagrams in Figure 511 and Figure 5-12.
Specifications
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
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1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tSU,MI
tHD,MI
SOMI
tHD,MO
tVALID,MO
SIMO
Figure 5-11. SPI Master Mode, CKPH = 0
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tHD,MI
tSU,MI
SOMI
tHD,MO
tVALID,MO
SIMO
Figure 5-12. SPI Master Mode, CKPH = 1
36
Specifications
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.33 USCI (SPI Slave Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
(see Figure 5-13 and Figure 5-14)
PARAMETER
TEST CONDITIONS
PMMCOREV = 0
tSTE,LEAD
STE lead time, STE low to clock
PMMCOREV = 3
PMMCOREV = 0
tSTE,LAG
STE lag time, Last clock to STE high
PMMCOREV = 3
PMMCOREV = 0
tSTE,ACC
STE access time, STE low to SOMI data
out
PMMCOREV = 3
PMMCOREV = 0
tSTE,DIS
STE disable time, STE high to SOMI high
impedance
PMMCOREV = 3
PMMCOREV = 0
tSU,SI
SIMO input data setup time
PMMCOREV = 3
PMMCOREV = 0
tHD,SI
SIMO input data hold time
PMMCOREV = 3
tVALID,SO
SOMI output data valid time (2)
(2)
(3)
11
3.0 V
8
2.4 V
7
3.0 V
6
1.8 V
3
3.0 V
3
2.4 V
3
3.0 V
3
TYP
MAX
ns
1.8 V
66
3.0 V
50
2.4 V
36
3.0 V
30
1.8 V
30
3.0 V
23
2.4 V
16
3.0 V
ns
ns
13
1.8 V
5
3.0 V
5
2.4 V
2
3.0 V
2
1.8 V
5
3.0 V
5
2.4 V
5
3.0 V
5
ns
ns
76
3.0 V
60
UCLK edge to SOMI valid,
CL = 20 pF, PMMCOREV = 3
2.4 V
44
3.0 V
40
SOMI output data hold time (3)
UNIT
ns
UCLK edge to SOMI valid,
CL = 20 pF, PMMCOREV = 0
CL = 20 pF, PMMCOREV = 3
(1)
MIN
1.8 V
CL = 20 pF, PMMCOREV = 0
tHD,SO
VCC
1.8 V
1.8 V
18
3.0 V
12
2.4 V
10
3.0 V
8
ns
ns
fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(Master) + tSU,SI(USCI), tSU,MI(Master) + tVALID,SO(USCI)).
For the master parameters tSU,MI(Master) and tVALID,MO(Master), see the SPI parameters of the attached slave.
Specifies the time to drive the next valid data to the SOMI output after the output changing UCLK clock edge. See the timing diagrams
in Figure 5-13 and Figure 5-14.
Specifies how long data on the SOMI output is valid after the output changing UCLK clock edge. See the timing diagrams in Figure 5-13
and Figure 5-14.
Specifications
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tSTE,LEAD
tSTE,LAG
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tSU,SI
tLO/HI
tHD,SI
SIMO
tHD,SO
tVALID,SO
tSTE,ACC
tSTE,DIS
SOMI
Figure 5-13. SPI Slave Mode, CKPH = 0
tSTE,LAG
tSTE,LEAD
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tHD,SI
tSU,SI
SIMO
tSTE,ACC
tHD,MO
tVALID,SO
tSTE,DIS
SOMI
Figure 5-14. SPI Slave Mode, CKPH = 1
38
Specifications
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.34 USCI (I2C Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5-15)
PARAMETER
TEST CONDITIONS
VCC
MIN
Internal: SMCLK, ACLK
External: UCLK
Duty cycle = 50% ± 10%
MAX
UNIT
fSYSTEM
MHz
400
kHz
fUSCI
USCI input clock frequency
fSCL
SCL clock frequency
tHD,STA
Hold time (repeated) START
tSU,STA
Setup time for a repeated START
tHD,DAT
Data hold time
2.2 V, 3 V
0
ns
tSU,DAT
Data setup time
2.2 V, 3 V
250
ns
2.2 V, 3 V
fSCL ≤ 100 kHz
fSCL ≤ 100 kHz
fSCL ≤ 100 kHz
tSP
Pulse duration of spikes suppressed by input
filter
tSU,STA
tHD,STA
4.7
µs
0.6
4.0
2.2 V, 3 V
fSCL > 100 kHz
µs
0.6
2.2 V, 3 V
fSCL > 100 kHz
Setup time for STOP
4.0
2.2 V, 3 V
fSCL > 100 kHz
tSU,STO
0
µs
0.6
2.2 V
50
600
3V
50
600
tHD,STA
ns
tBUF
SDA
tLOW
tHIGH
tSP
SCL
tSU,DAT
tSU,STO
tHD,DAT
Figure 5-15. I2C Mode Timing
Specifications
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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5.35 12-Bit ADC, Power Supply and Input Range Conditions
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
AVCC
Analog supply voltage
AVCC and DVCC are connected together,
AVSS and DVSS are connected together,
V(AVSS) = V(DVSS) = 0 V
V(Ax)
Analog input voltage range (2)
All ADC12 analog input pins Ax
IADC12_A
Operating supply current into
AVCC terminal (3)
fADC12CLK = 5.0 MHz (4)
CI
Input capacitance
Only one terminal Ax can be selected at one
time
Input MUX ON resistance
0 V ≤ VAx ≤ AVCC
RI
(1)
(2)
(3)
(4)
VCC
MIN
TYP
MAX
UNIT
2.2
3.6
V
0
AVCC
V
2.2 V
125
155
3V
150
220
2.2 V
20
25
pF
200
1900
Ω
10
µA
The leakage current is specified by the digital I/O input leakage.
The analog input voltage range must be within the selected reference voltage range VR+ to VR– for valid conversion results. If the
reference voltage is supplied by an external source or if the internal reference voltage is used and REFOUT = 1, then decoupling
capacitors are required. See Section 5.40 and Section 5.41.
The internal reference supply current is not included in current consumption parameter IADC12_A.
ADC12ON = 1, REFON = 0, SHT0 = 0, SHT1 = 0, ADC12DIV = 0
5.36 12-Bit ADC, Timing Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
For specified performance of ADC12 linearity
parameters using an external reference voltage or
AVCC as reference (1)
fADC12CLK
ADC conversion clock
For specified performance of ADC12 linearity
parameters using the internal reference (2)
2.2 V, 3 V
For specified performance of ADC12 linearity
parameters using the internal reference (3)
fADC12OSC
tCONVERT
tSample
(1)
(2)
(3)
(4)
(5)
(6)
40
Internal ADC12
oscillator (4)
Conversion time
Sampling time
MIN
TYP
MAX
0.45
4.8
5.0
0.45
2.4
4.0
0.45
2.4
2.7
4.8
5.4
ADC12DIV = 0, fADC12CLK = fADC12OSC
2.2 V, 3 V
4.2
REFON = 0, internal oscillator,
ADC12OSC used for ADC conversion clock
2.2 V, 3 V
2.4
MHz
MHz
3.1
µs
External fADC12CLK from ACLK, MCLK, or SMCLK,
ADC12SSEL ≠ 0
RS = 400 Ω, RI = 1000 Ω, CI = 20 pF,
t = [RS + RI] × CI (6)
UNIT
(5)
2.2 V, 3 V
1000
ns
REFOUT = 0, external reference voltage: SREF2 = 0, SREF1 = 1, SREF0 = 0. AVCC as reference voltage: SREF2 = 0, SREF1 = 0,
SREF0 = 0. The specified performance of the ADC12 linearity is ensured when using the ADC12OSC. For other clock sources, the
specified performance of the ADC12 linearity is ensured with fADC12CLK maximum of 5.0 MHz.
SREF2 = 0, SREF1 = 1, SREF0 = 0, ADC12SR = 0, REFOUT = 1
SREF2 = 0, SREF1 = 1, SREF0 = 0, ADC12SR = 0, REFOUT = 0. The specified performance of the ADC12 linearity is ensured when
using the ADC12OSC divided by 2.
The ADC12OSC is sourced directly from MODOSC inside the UCS.
13 × ADC12DIV × 1/fADC12CLK
Approximately 10 Tau (t) are needed to get an error of less than ±0.5 LSB:
tSample = ln(2n+1) x (RS + RI) × CI + 800 ns, where n = ADC resolution = 12, RS = external source resistance
Specifications
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.37 12-Bit ADC, Linearity Parameters Using an External Reference Voltage or AVCC as
Reference Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
EI
Integral linearity error (1)
ED
Differential linearity error (1)
EO
Offset error (3)
EG
Gain error (3)
ET
(1)
(2)
(3)
TEST CONDITIONS
1.4 V ≤ dVREF ≤ 1.6 V (2)
1.6 V < dVREF (2)
(2)
MIN
TYP
MAX
±2.0
2.2 V, 3 V
±1.7
2.2 V, 3 V
±1.0
dVREF ≤ 2.2 V (2)
2.2 V, 3 V
±1.0
±2.0
dVREF > 2.2 V (2)
2.2 V, 3 V
±1.0
±2.0
(2)
Total unadjusted error
VCC
2.2 V, 3 V
±1.0
±2.0
dVREF ≤ 2.2 V (2)
2.2 V, 3 V
±1.4
±3.5
dVREF > 2.2 V (2)
2.2 V, 3 V
±1.4
±3.5
UNIT
LSB
LSB
LSB
LSB
LSB
Parameters are derived using the histogram method.
The external reference voltage is selected by: SREF2 = 0 or 1, SREF1 = 1, SREF0 = 0. dVREF = VR+ – VR-, VR+ < AVCC, VR- > AVSS.
Unless otherwise mentioned, dVREF > 1.5 V. Impedance of the external reference voltage R < 100 Ω, and two decoupling capacitors,
10 µF and 100 nF, should be connected to VREF+ and VREF- to decouple the dynamic current. Also see the MSP430x5xx and
MSP430x6xx Family User's Guide (SLAU208).
Parameters are derived using a best fit curve.
5.38 12-Bit ADC, Linearity Parameters Using the Internal Reference Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
EI
Integral linearity
error (2)
ED
Differential
linearity error (2)
TEST CONDITIONS (1)
ADC12SR = 0, REFOUT = 1
fADC12CLK = 4.0 MHz
ADC12SR = 0, REFOUT = 0
fADC12CLK = 2.7 MHz
ADC12SR = 0, REFOUT = 1
fADC12CLK = 4.0 MHz
ADC12SR = 0, REFOUT = 1
fADC12CLK = 2.7 MHz
ADC12SR = 0, REFOUT = 0
fADC12CLK = 2.7 MHz
ADC12SR = 0, REFOUT = 1
fADC12CLK = 4.0 MHz
ADC12SR = 0, REFOUT = 0
fADC12CLK = 2.7 MHz
ADC12SR = 0, REFOUT = 1
fADC12CLK = 4.0 MHz
EO
Offset error (3)
EG
Gain error (3)
ADC12SR = 0, REFOUT = 0
fADC12CLK = 2.7 MHz
ET
Total unadjusted ADC12SR = 0, REFOUT = 1
error
ADC12SR = 0, REFOUT = 0
fADC12CLK = 4.0 MHz
(1)
(2)
(3)
(4)
fADC12CLK = 2.7 MHz
VCC
MIN
TYP
±1.7
2.2 V, 3 V
2.2 V, 3 V
2.2 V, 3 V
2.2 V, 3 V
2.2 V, 3 V
MAX
±2.5
–1.0
+2.0
–1.0
+1.5
–1.0
+2.5
±1.0
±2.0
±1.0
±2.0
±1.0
±2.0
±1.5%
±1.4
(4)
±3.5
UNIT
LSB
LSB
LSB
LSB
VREF
LSB
±1.5% (4) VREF
The internal reference voltage is selected by: SREF2 = 0 or 1, SREF1 = 1, SREF0 = 1. dVREF = VR+ – VR-.
Parameters are derived using the histogram method.
Parameters are derived using a best fit curve.
The gain error and total unadjusted error are dominated by the accuracy of the integrated reference module absolute accuracy. In this
mode the reference voltage used by the ADC12_A is not available on a pin.
Specifications
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5.39 12-Bit ADC, Temperature Sensor and Built-In VMID (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VSENSOR
See
TEST CONDITIONS
ADC12ON = 1, INCH = 0Ah,
TA = 0°C
(2)
TCSENSOR
ADC12ON = 1, INCH = 0Ah
tSENSOR(sample)
Sample time required if
channel 10 is selected (3)
ADC12ON = 1, INCH = 0Ah,
Error of conversion result ≤ 1 LSB
AVCC divider at channel 11,
VAVCC factor
ADC12ON = 1, INCH = 0Bh
AVCC divider at channel 11
ADC12ON = 1, INCH = 0Bh
Sample time required if
channel 11 is selected (4)
ADC12ON = 1, INCH = 0Bh,
Error of conversion result ≤ 1 LSB
VMID
tVMID(sample)
(1)
(2)
(3)
(4)
VCC
MIN
TYP
2.2 V
680
3V
680
2.2 V
2.25
3V
2.25
2.2 V
100
3V
100
MAX
UNIT
mV
mV/°C
µs
0.48
0.5
0.52 VAVCC
2.2 V
1.06
1.1
1.14
3V
1.44
1.5
1.56
2.2 V, 3 V
1000
V
ns
The temperature sensor is provided by the REF module. See the REF module parametric, IREF+, regarding the current consumption of
the temperature sensor.
The temperature sensor offset can be significant. TI recommends a single-point calibration to minimize the offset error of the built-in
temperature sensor. The TLV structure contains calibration values for 30°C ± 3°C and 85°C ± 3°C for each of the available reference
voltage levels. The sensor voltage can be computed as VSENSE = TCSENSOR × (Temperature,°C) + VSENSOR, where TCSENSOR and
VSENSOR can be computed from the calibration values for higher accuracy. See also the MSP430x5xx and MSP430x6xx Family User's
Guide (SLAU208).
The typical equivalent impedance of the sensor is 51 kΩ. The sample time required includes the sensor-on time tSENSOR(on).
The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed.
Typical Temperature Sensor Voltage (mV)
1000
950
900
850
800
750
700
650
600
550
500
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
Ambient Temperature (°C)
Figure 5-16. Typical Temperature Sensor Voltage
42
Specifications
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.40 REF, External Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
VeREF+
Positive external reference
voltage input
VeREF+ > VREF– and VeREF–
(2)
1.4
AVCC
V
VREF–, VeREF–
Negative external reference
voltage input
VeREF+ > VREF– and VeREF–
(3)
0
1.2
V
(VeREF+ –
VREF- or VeREF-)
Differential external reference
voltage input
VeREF+ > VREF– and VeREF–
(4)
1.4
AVCC
V
IVeREF+, IVREF-,
Static input current
VeREF-
CVREF+, CVREF(1)
(2)
(3)
(4)
(5)
1.4 V ≤ VeREF+ ≤ VAVCC,
VeREF– = 0 V, fADC12CLK = 5 MHz,
ADC12SHTx = 1h,
Conversion rate 200 ksps
2.2 V, 3 V
–26
26
µA
1.4 V ≤ VeREF+ ≤ VAVCC,
VeREF– = 0 V, fADC12CLK = 5 MHz,
ADC12SHTx = 8h,
Conversion rate 20 ksps
2.2 V, 3 V
–1
1
µA
Capacitance at VVREF+, VVREFterminal
(5)
10
µF
The external reference is used during ADC conversion to charge and discharge the capacitance array. The input capacitance (Ci) is also
the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the
recommendations on analog-source impedance to allow the charge to settle for 12-bit accuracy.
The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced
accuracy requirements.
The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced
accuracy requirements.
The accuracy limits minimum external differential reference voltage. Lower differential reference voltage levels may be applied with
reduced accuracy requirements.
Two decoupling capacitors, 10 µF and 100 nF, should be connected to VREF to decouple the dynamic current required for an external
reference source if it is used for the ADC12_A. See also the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208).
5.41 REF, Built-In Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
VREF+
AVCC(min)
IREF+
(1)
(2)
(3)
(4)
Positive built-in reference
voltage output
AVCC minimum voltage,
Positive built-in reference
active
Operating supply current into
AVCC terminal (2) (3)
TEST CONDITIONS
VCC
MIN
REFVSEL = {2} for 2.5 V,
REFON = REFOUT = 1, IVREF+ = 0 A
3V
2.4625
2.50 2.5375
REFVSEL = {1} for 2.0 V,
REFON = REFOUT = 1, IVREF+ = 0 A
3V
1.9503
1.98 2.0097
REFVSEL = {0} for 1.5 V,
REFON = REFOUT = 1, IVREF+ = 0 A
2.2 V, 3 V
1.4677
1.49 1.5124
REFVSEL = {0} for 1.5 V
2.2
REFVSEL = {1} for 2.0 V
2.3
REFVSEL = {2} for 2.5 V
2.8
TYP
MAX
UNIT
V
V
ADC12SR = 1 (4), REFON = 1, REFOUT = 0,
REFBURST = 0
3V
70
100
µA
ADC12SR = 1 (4), REFON = 1, REFOUT = 1,
REFBURST = 0
3V
0.45
0.75
mA
ADC12SR = 0 (4), REFON = 1, REFOUT = 0,
REFBURST = 0
3V
210
310
µA
ADC12SR = 0 (4), REFON = 1, REFOUT = 1,
REFBURST = 0
3V
0.95
1.7
mA
The reference is supplied to the ADC by the REF module and is buffered locally inside the ADC. The ADC uses two internal buffers, one
smaller and one larger for driving the VREF+ terminal. When REFOUT = 1, the reference is available at the VREF+ terminal, as well as,
used as the reference for the conversion and uses the larger buffer. When REFOUT = 0, the reference is only used as the reference for
the conversion and uses the smaller buffer.
The internal reference current is supplied by terminal AVCC. Consumption is independent of the ADC12ON control bit, unless a
conversion is active. REFOUT = 0 represents the current contribution of the smaller buffer. REFOUT = 1 represents the current
contribution of the larger buffer without external load.
The temperature sensor is provided by the REF module. Its current is supplied via terminal AVCC and is equivalent to IREF+ with
REFON =1 and REFOUT = 0.
For devices without the ADC12, the parametrics with ADC12SR = 0 are applicable.
Specifications
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REF, Built-In Reference (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
PARAMETER
TEST CONDITIONS
IL(VREF+)
Load-current regulation,
VREF+ terminal (5)
REFVSEL = (0, 1, 2),
IVREF+ = +10 µA, –1000 µA,
AVCC = AVCC (min) for each reference level,
REFVSEL = (0, 1, 2), REFON = REFOUT = 1
CVREF+
Capacitance at VREF+
terminal
REFON = REFOUT = 1
TCREF+
Temperature coefficient of
built-in reference (6)
IVREF+ = 0 A,
REFVSEL = (0, 1, 2), REFON = 1,
REFOUT = 0 or 1
Power supply rejection ratio
PSRR_DC
(DC)
Power supply rejection ratio
(AC)
PSRR_AC
tSETTLE
(5)
(6)
(7)
44
Settling time of reference
voltage (7)
VCC
MIN
TYP
MAX
UNIT
2500 µV/mA
100
pF
30
50
ppm/
°C
AVCC = AVCC (min) to AVCC(max),
TA = 25°C,
REFVSEL = (0, 1, 2), REFON = 1,
REFOUT = 0 or 1
120
300
µV/V
AVCC = AVCC (min) to AVCC(max),
TA = 25°C,
f = 1 kHz, ΔVpp = 100 mV,
REFVSEL = (0, 1, 2), REFON = 1,
REFOUT = 0 or 1
6.4
AVCC = AVCC (min) to AVCC(max),
REFVSEL = (0, 1, 2), REFOUT = 0,
REFON = 0 → 1
75
AVCC = AVCC (min) to AVCC(max),
CVREF = CVREF(max),
REFVSEL = (0, 1, 2), REFOUT = 1,
REFON = 0 → 1
20
mV/V
µs
75
Contribution only due to the reference and buffer including package. This does not include resistance due to PCB trace.
Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C)/(85°C – (–40°C)).
The condition is that the error in a conversion started after tREFON is less than ±0.5 LSB. The settling time depends on the external
capacitive load when REFOUT = 1.
Specifications
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.42 Comparator_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VCC
TEST CONDITIONS
VCC
Supply voltage
MIN
TYP
1.8
3.6
1.8 V
IAVCC_COMP
Comparator operating supply
current into AVCC, excludes
reference resistor ladder
IAVCC_REF
Quiescent current of local
reference voltage amplifier into
AVCC
VIC
Common mode input range
VOFFSET
Input offset voltage
CIN
Input capacitance
RSIN
tPD
tPD,filter
Series input resistance
Propagation delay, response
time
Propagation delay with filter
active
CBPWRMD = 00
30
50
3.0 V
40
65
2.2 V, 3 V
10
30
CBPWRMD = 10
2.2 V, 3 V
0.1
0.5
CBREFACC = 1,
CBREFLx = 01
V
µA
V
0
VCC – 1
–20
20
CBPWRMD = 01, 10
–10
10
5
ON (switch closed)
3
µA
22
CBPWRMD = 00
mV
pF
4
30
kΩ
MΩ
CBPWRMD = 00, CBF = 0
450
CBPWRMD = 01, CBF = 0
600
CBPWRMD = 10, CBF = 0
50
ns
µs
CBPWRMD = 00, CBON = 1,
CBF = 1, CBFDLY = 00
0.35
0.6
1.0
CBPWRMD = 00, CBON = 1,
CBF = 1, CBFDLY = 01
0.6
1.0
1.8
CBPWRMD = 00, CBON = 1,
CBF = 1, CBFDLY = 10
1.0
1.8
3.4
CBPWRMD = 00, CBON = 1,
CBF = 1, CBFDLY = 11
1.8
3.4
6.5
1
2
µs
1
1.5
µs
VIN ×
(n+1)
/ 32
VIN ×
(n+1.5)
/ 32
V
Comparator enable time,
settling time
CBON = 0 to CBON = 1,
CBPWRMD = 00, 01, 10
tEN_REF
Resistor reference enable time
CBON = 0 to CBON = 1
Reference voltage for a given
tap
2.2 V
OFF (switch open)
UNIT
40
CBPWRMD = 01
tEN_CMP
VCB_REF
MAX
VIN = reference into resistor
ladder (n = 0 to 31)
µs
VIN ×
(n+0.5)
/ 32
5.43 Ports PU.0 and PU.1
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
VUSB = 3.3 V ± 10%, IOH = –25 mA,
See Figure 5-18 for typical characteristics
VOL
Low-level output voltage
VUSB = 3.3 V ± 10%, IOL = 25 mA,
See Figure 5-17 for typical characteristics
VIH
High-level input voltage
VUSB = 3.3 V ± 10%,
See Figure 5-19 for typical characteristics
VIL
Low-level input voltage
VUSB = 3.3 V ± 10%,
See Figure 5-19 for typical characteristics
MIN
MAX
2.4
V
0.4
2.0
V
V
0.8
Specifications
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Copyright © 2009–2015, Texas Instruments Incorporated
UNIT
V
45
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
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TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
90
VCC = 3.0 V
TA = 25 ºC
IOL - Typical Low-Level Output Current - mA
80
VCC = 3.0 V
TA = 85 ºC
VCC = 1.8 V
TA = 25 ºC
70
60
50
VCC = 1.8 V
TA = 85 ºC
40
30
20
10
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
VOL - Low-Level Output Voltage - V
Figure 5-17. Ports PU.0, PU.1 Typical Low-Level Output Characteristics
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0
IOH - Typical High-Level Output Current - mA
-10
-20
-30
VCC = 1.8 V
TA = 85 ºC
-40
-50
VCC = 3.0 V
TA = 85 ºC
-60
VCC = 1.8 V
TA = 25 ºC
-70
VCC = 3.0 V
TA = 25 ºC
-80
-90
0.5
1
1.5
2
2.5
3
VOH - High-Level Output Voltage - V
Figure 5-18. Ports PU.0, PU.1 Typical High-Level Output Characteristics
TYPICAL PU.0, PU.1 INPUT THRESHOLD
2.0
T A = 25 °C, 85 °C
1.8
VIT+ , postive-going input threshold
Input Threshold - V
1.6
1.4
1.2
VIT- , negative-going input threshold
1.0
0.8
0.6
0.4
0.2
0.0
1.8
2.2
2.6
3
3.4
VUSB Supply Voltage, V USB - V
Figure 5-19. Ports PU.0, PU.1 Typical Input Threshold Characteristics
46
Specifications
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.44 USB Output Ports DP and DM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
VOH
D+, D– single ended
USB 2.0 load conditions
2.8
3.6
VOL
D+, D– single ended
USB 2.0 load conditions
0
0.3
V
V
Z(DRV)
D+, D– impedance
Including external series resistor of 27 Ω
28
44
Ω
tRISE
Rise time
Full speed, differential, CL = 50 pF,
10%/90%, Rpu on D+
4
20
ns
tFALL
Fall time
Full speed, differential, CL = 50 pF,
10%/90%, Rpu on D+
4
20
ns
5.45 USB Input Ports DP and DM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
MIN
MAX
V(CM)
Differential input common mode range
PARAMETER
0.8
2.5
Z(IN)
Input impedance
300
VCRS
Crossover voltage
1.3
VIL
Static SE input logic low level
VIH
Static SE input logic high level
VDI
Differential input voltage
UNIT
V
kΩ
2.0
V
0.8
V
2.0
V
0.2
Specifications
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Copyright © 2009–2015, Texas Instruments Incorporated
V
47
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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5.46 USB-PWR (USB Power System)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VLAUNCH
VBUS detection threshold
VBUS
USB bus voltage
VUSB
USB LDO output voltage
V18
Internal USB voltage (1)
IUSB_EXT
Maximum external current from VUSB
terminal (2)
VCC
Normal operation
MIN
TYP
3.76
3.003
3.3
MAX
UNIT
3.75
V
5.5
V
3.597
V
1.8
USB LDO is on
(3)
12
mA
100
mA
250
µA
IDET
USB LDO current overload detection
ISUSPEND
Operating supply current into VBUS terminal (4)
USB LDO is on,
USB PLL disabled
IUSB_LDO
Operating supply current into VBUS terminal,
represents the current of the 3.3-V LDO only
USB LDO is on,
USB 1.8-V LDO is disabled,
VBUS = 5.0 V,
USBDETEN = 0 or 1
1.8 V, 3 V
60
µA
IVBUS_DETE
Operating supply current into VBUS terminal,
represents the current of the VBUS detection
logic
USB LDO is disabled,
USB 1.8-V LDO is disabled,
VBUS > VLAUNCH,
USBDETEN = 1
1.8 V, 3 V
30
µA
CT
60
V
CBUS
VBUS terminal recommended capacitance
4.7
µF
CUSB
VUSB terminal recommended capacitance
220
nF
C18
V18 terminal recommended capacitance
220
nF
tENABLE
Settling time VUSB and V18
RPUR
Pullup resistance of PUR terminal (5)
(1)
(2)
(3)
(4)
(5)
Within 2%,
recommended capacitances
70
110
2
ms
150
Ω
This voltage is for internal uses only. No external DC loading should be applied.
This represents additional current that can be supplied to the application from the VUSB terminal beyond the needs of the USB
operation.
A current overload will be detected when the total current supplied from the USB LDO, including IUSB_EXT, exceeds this value.
Does not include current contribution of Rpu and Rpd as outlined in the USB specification.
This value, in series with an external resistor between PUR and D+, produces the Rpu as outlined in the USB specification.
5.47 USB-PLL (USB Phase Locked Loop)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
IPLL
Operating supply current
fPLL
PLL frequency
fUPD
PLL reference frequency
tLOCK
PLL lock time
tJitter
PLL jitter
48
Specifications
TEST CONDITIONS
VCC
MIN
TYP
MAX
7
48
1.5
1000
UNIT
mA
MHz
3
MHz
2
ms
ps
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.48 Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST
CONDITIONS
DVCC(PGM,ERASE) Program and erase supply voltage
MIN
TYP
1.8
MAX
3.6
UNIT
V
IPGM
Average supply current from DVCC during program (1)
3
5
mA
IERASE
Average supply current from DVCC during erase (1)
6
11
mA
IMERASE, IBANK
Average supply current from DVCC during mass erase or bank
erase (1)
6
11
mA
16
ms
tCPT
Cumulative program time
See
(2)
4
Program and erase endurance
10
5
10
cycles
tRetention
Data retention duration
TJ = 25°C
tWord
Word or byte program time
See
(3)
64
85
µs
tBlock,
0
Block program time for first byte or word
See
(3)
49
65
µs
tBlock,
1–(N–1)
Block program time for each additional byte or word, except for last
byte or word
See
(3)
37
49
µs
Block program time for last byte or word
See
(3)
55
73
µs
tErase
Erase time for segment, mass erase, and bank erase when
available.
See
(3)
23
32
ms
fMCLK,MRG
MCLK frequency in marginal read mode
(FCTL4.MRG0 = 1 or FCTL4.MRG1 = 1)
0
1
MHz
tBlock,
(1)
(2)
(3)
N
100
years
Default clock system frequency of MCLK = 1 MHz, ACLK = 32768 Hz, SMCLK = 1 MHz. No peripherals are enabled or active.
The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming
methods: individual word- or byte-write and block-write modes.
These values are hardwired into the state machine of the flash controller.
5.49 JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST
CONDITIONS
MIN
TYP
MAX
UNIT
fSBW
Spy-Bi-Wire input frequency
2.2 V, 3 V
0
20
MHz
tSBW,Low
Spy-Bi-Wire low clock pulse duration
2.2 V, 3 V
0.025
15
µs
tSBW, En
Spy-Bi-Wire enable time (TEST high to acceptance of first clock
edge) (1)
2.2 V, 3 V
1
µs
tSBW,Rst
Spy-Bi-Wire return to normal operation time
µs
fTCK
TCK input frequency, 4-wire JTAG (2)
Rinternal
Internal pulldown resistance on TEST
(1)
(2)
15
100
2.2 V
0
5
3V
0
10
2.2 V, 3 V
45
60
80
MHz
kΩ
Tools that access the Spy-Bi-Wire interface must wait for the tSBW,En time after pulling the TEST/SBWTCK pin high before applying the
first SBWTCK clock edge.
fTCK may be restricted to meet the timing requirements of the module selected.
Specifications
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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6 Detailed Description
6.1
CPU (Link to User's Guide)
The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All
operations, other than program-flow instructions, are performed as register operations in conjunction with
seven addressing modes for source operand and four addressing modes for destination operand.
The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-toregister operation execution time is one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as program counter, stack pointer, status register, and
constant generator, respectively. The remaining registers are general-purpose registers.
Peripherals are connected to the CPU using data, address, and control buses, and can be handled with all
instructions.
The instruction set consists of the original 51 instructions with three formats and seven address modes
and additional instructions for the expanded address range. Each instruction can operate on word and
byte data.
Program Counter
PC/R0
Stack Pointer
SP/R1
Status Register
Constant Generator
50
Detailed Description
SR/CG1/R2
CG2/R3
General-Purpose Register
R4
General-Purpose Register
R5
General-Purpose Register
R6
General-Purpose Register
R7
General-Purpose Register
R8
General-Purpose Register
R9
General-Purpose Register
R10
General-Purpose Register
R11
General-Purpose Register
R12
General-Purpose Register
R13
General-Purpose Register
R14
General-Purpose Register
R15
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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6.2
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Operating Modes
The MSP430 has one active mode and six software selectable low-power modes of operation. An interrupt
event can wake up the device from any of the low-power modes, service the request, and restore back to
the low-power mode on return from the interrupt program.
The following seven operating modes can be configured by software:
• Active mode (AM)
– All clocks are active
• Low-power mode 0 (LPM0)
– CPU is disabled
– ACLK and SMCLK remain active, MCLK is disabled
– FLL loop control remains active
• Low-power mode 1 (LPM1)
– CPU is disabled
– FLL loop control is disabled
– ACLK and SMCLK remain active, MCLK is disabled
• Low-power mode 2 (LPM2)
– CPU is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO DC generator remains enabled
– ACLK remains active
• Low-power mode 3 (LPM3)
– CPU is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO DC generator is disabled
– ACLK remains active
• Low-power mode 4 (LPM4)
– CPU is disabled
– ACLK is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO DC generator is disabled
– Crystal oscillator is stopped
– Complete data retention
• Low-power mode 4.5 (LPM4.5)
– Internal regulator disabled
– No data retention
– Wake-up signal from RST/NMI, P1, and P2
Detailed Description
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
6.3
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Interrupt Vector Addresses
The interrupt vectors and the power-up start address are located in the address range 0FFFFh to 0FF80h.
The vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence.
Table 6-1. Interrupt Sources, Flags, and Vectors
INTERRUPT SOURCE
INTERRUPT FLAG
SYSTEM
INTERRUPT
WORD
ADDRESS
PRIORITY
System Reset
Power-Up
External Reset
Watchdog Time-out, Password
Violation
Flash Memory Password Violation
WDTIFG, KEYV (SYSRSTIV) (1) (2)
Reset
0FFFEh
63, highest
System NMI
PMM
Vacant Memory Access
JTAG Mailbox
SVMLIFG, SVMHIFG, DLYLIFG, DLYHIFG,
VLRLIFG, VLRHIFG, VMAIFG, JMBNIFG,
JMBOUTIFG (SYSSNIV) (1)
(Non)maskable
0FFFCh
62
User NMI
NMI
Oscillator Fault
Flash Memory Access Violation
NMIIFG, OFIFG, ACCVIFG, BUSIFG
(SYSUNIV) (1) (2)
(Non)maskable
0FFFAh
61
Comp_B
Comparator B interrupt flags (CBIV) (1) (3)
Maskable
0FFF8h
60
TB0
TB0CCR0 CCIFG0 (3)
Maskable
0FFF6h
59
TB0
TB0CCR1 CCIFG1 to TB0CCR6 CCIFG6,
TB0IFG (TB0IV) (1) (3)
Maskable
0FFF4h
58
Watchdog Timer_A Interval Timer
Mode
WDTIFG
Maskable
0FFF2h
57
USCI_A0 Receive or Transmit
UCA0RXIFG, UCA0TXIFG (UCA0IV) (1) (3)
Maskable
0FFF0h
56
USCI_B0 Receive or Transmit
UCB0RXIFG, UCB0TXIFG (UCB0IV) (1) (3)
Maskable
0FFEEh
55
ADC12_A
ADC12IFG0 to ADC12IFG15 (ADC12IV) (1) (3) (4)
Maskable
0FFECh
54
TA0
Maskable
0FFEAh
53
TA0
TA0CCR1 CCIFG1 to TA0CCR4 CCIFG4,
TA0IFG (TA0IV) (1) (3)
Maskable
0FFE8h
52
USB_UBM
USB interrupts (USBIV) (1) (3)
Maskable
0FFE6h
51
DMA
Maskable
0FFE4h
50
TA1CCR0 CCIFG0 (3)
Maskable
0FFE2h
49
TA1
TA1CCR1 CCIFG1 to TA1CCR2 CCIFG2,
TA1IFG (TA1IV) (1) (3)
Maskable
0FFE0h
48
I/O Port P1
P1IFG.0 to P1IFG.7 (P1IV) (1) (3)
Maskable
0FFDEh
47
USCI_A1 Receive or Transmit
UCA1RXIFG, UCA1TXIFG (UCA1IV) (1) (3)
Maskable
0FFDCh
46
USCI_B1 Receive or Transmit
UCB1RXIFG, UCB1TXIFG (UCB1IV) (1) (3)
Maskable
0FFDAh
45
52
TA2CCR0 CCIFG0
(3)
Maskable
0FFD8h
44
TA2
TA2CCR1 CCIFG1 to TA2CCR2 CCIFG2,
TA2IFG (TA2IV) (1) (3)
Maskable
0FFD6h
43
I/O Port P2
P2IFG.0 to P2IFG.7 (P2IV) (1) (3)
Maskable
0FFD4h
42
RTC_A
RTCRDYIFG, RTCTEVIFG, RTCAIFG,
RT0PSIFG, RT1PSIFG (RTCIV) (1) (3)
Maskable
0FFD2h
41
0FFD0h
40
Reserved
(3)
(4)
(5)
DMA0IFG, DMA1IFG, DMA2IFG (DMAIV)
(1) (3)
TA1
TA2
(1)
(2)
TA0CCR0 CCIFG0
(3)
Reserved
(5)
⋮
⋮
0FF80h
0, lowest
Multiple source flags
A reset is generated if the CPU tries to fetch instructions from within peripheral space or vacant memory space.
(Non)maskable: the individual interrupt-enable bit can disable an interrupt event, but the general-interrupt enable cannot disable it.
Interrupt flags are located in the module.
Only on devices with ADC, otherwise reserved.
Reserved interrupt vectors at addresses are not used in this device and can be used for regular program code if necessary. To maintain
compatibility with other devices, TI recommends reserving these locations.
Detailed Description
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6.4
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Memory Organization
Table 6-2. Memory Organization (1)
Memory (flash)
Main: interrupt vector
MSP430F5522
MSP430F5521
MSP430F5513
MSP430F5525
MSP430F5524
MSP430F5515
MSP430F5514
MSP430F5527
MSP430F5526
MSP430F5517
MSP430F5529
MSP430F5528
MSP430F5519
32KB
00FFFFh–00FF80h
64KB
00FFFFh–00FF80h
96KB
00FFFFh–00FF80h
128KB
00FFFFh–00FF80h
N/A
N/A
N/A
32KB
0243FFh–01C400h
N/A
N/A
32KB
01C3FFh–014400h
32KB
01C3FFh–014400h
Bank B
15KB
00FFFFh–00C400h
32KB
0143FFh–00C400h
32KB
0143FFh–00C400h
32KB
0143FFh–00C400h
Bank A
17KB
00C3FFh–008000h
32KB
00C3FFh–004400h
32KB
00C3FFh–004400h
32KB
00C3FFh–004400h
Sector 3
2KB (2)
0043FFh–003C00h
N/A
N/A
2KB
0043FFh–003C00h
Sector 2
2KB (3)
003BFFh–003400h
N/A
2KB
003BFFh–003400h
2KB
003BFFh–003400h
Sector 1
2KB
0033FFh–002C00h
2KB
0033FFh–002C00h
2KB
0033FFh–002C00h
2KB
0033FFh–002C00h
Sector 0
2KB
002BFFh–002400h
2KB
002BFFh–002400h
2KB
002BFFh–002400h
2KB
002BFFh–002400h
Sector 7
2KB
0023FFh–001C00h
2KB
0023FFh–001C00h
2KB
0023FFh–001C00h
2KB
0023FFh–001C00h
Info A
128 B
0019FFh–001980h
128 B
0019FFh–001980h
128 B
0019FFh–001980h
128 B
0019FFh–001980h
Info B
128 B
00197Fh–001900h
128 B
00197Fh–001900h
128 B
00197Fh–001900h
128 B
00197Fh–001900h
Info C
128 B
0018FFh–001880h
128 B
0018FFh–001880h
128 B
0018FFh–001880h
128 B
0018FFh–001880h
Info D
128 B
00187Fh–001800h
128 B
00187Fh–001800h
128 B
00187Fh–001800h
128 B
00187Fh–001800h
BSL 3
512 B
0017FFh–001600h
512 B
0017FFh–001600h
512 B
0017FFh–001600h
512 B
0017FFh–001600h
BSL 2
512 B
0015FFh–001400h
512 B
0015FFh–001400h
512 B
0015FFh–001400h
512 B
0015FFh–001400h
BSL 1
512 B
0013FFh–001200h
512 B
0013FFh–001200h
512 B
0013FFh–001200h
512 B
0013FFh–001200h
BSL 0
512 B
0011FFh–001000h
512 B
0011FFh–001000h
512 B
0011FFh–001000h
512 B
0011FFh–001000h
4KB
000FFFh–0h
4KB
000FFFh–0h
4KB
000FFFh–0h
4KB
000FFFh–0h
Total Size
Bank D
Bank C
Main: code memory
RAM
USB RAM (4)
Information memory
(flash)
Bootstrap loader (BSL)
memory (flash)
Peripherals
(1)
(2)
(3)
(4)
Size
N/A = Not available
MSP430F5522 only
MSP430F5522, MSP430F5521 only
USB RAM can be used as general purpose RAM when not used for USB operation.
Detailed Description
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
6.5
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Bootstrap Loader (BSL)
The BSL enables users to program the flash memory or RAM using various serial interfaces. Access to
the device memory by the BSL is protected by an user-defined password. For further details on interfacing
to development tools and device programmers, see the MSP430 Hardware Tools User's Guide
(SLAU278). For complete description of the features of the BSL and its implementation, see the MSP430
Programming Via the Bootstrap Loader User's Guide (SLAU319).
6.5.1
USB BSL
All devices come preprogrammed with the USB BSL. Use of the USB BSL requires external access to the
six pins shown in Table 6-3. In addition to these pins, the application must support external components
necessary for normal USB operation; for example, the proper crystal on XT2IN and XT2OUT, proper
decoupling, and so on.
Table 6-3. USB BSL Pin Requirements and Functions
DEVICE SIGNAL
BSL FUNCTION
PU.0/DP
USB data terminal DP
PU.1/DM
USB data terminal DM
PUR
USB pullup resistor terminal
VBUS
USB bus power supply
VSSU
USB ground supply
NOTE
The default USB BSL evaluates the logic level of the PUR pin after a BOR reset. If the PUR
pin is pulled high externally, then the BSL is invoked. Therefore, unless the application is
invoking the BSL, it is important to keep PUR pulled low after a BOR reset, even if BSL or
USB is never used. TI recommends applying a 1-MΩ resistor to ground.
6.5.2
UART BSL
A UART BSL is also available that can be programmed by the user into the BSL memory by replacing the
preprogrammed, factory supplied, USB BSL. Use of the UART BSL requires external access to the six
pins shown in Table 6-4.
Table 6-4. UART BSL Pin Requirements and Functions
54
Detailed Description
DEVICE SIGNAL
BSL FUNCTION
RST/NMI/SBWTDIO
Entry sequence signal
TEST/SBWTCK
Entry sequence signal
P1.1
Data transmit
P1.2
Data receive
VCC
Power supply
VSS
Ground supply
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6.6
6.6.1
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
JTAG Operation
JTAG Standard Interface
The MSP430 family supports the standard JTAG interface which requires four signals for sending and
receiving data. The JTAG signals are shared with general-purpose I/O. The TEST/SBWTCK pin is used to
enable the JTAG signals. In addition to these signals, the RST/NMI/SBWTDIO is required to interface with
MSP430 development tools and device programmers. The JTAG pin requirements are shown in Table 65. For further details on interfacing to development tools and device programmers, see the MSP430
Hardware Tools User's Guide (SLAU278). For a complete description of the features of the JTAG interface
and its implementation, see MSP430 Programming Via the JTAG Interface (SLAU320).
Table 6-5. JTAG Pin Requirements and Functions
6.6.2
DEVICE SIGNAL
DIRECTION
FUNCTION
PJ.3/TCK
IN
JTAG clock input
PJ.2/TMS
IN
JTAG state control
PJ.1/TDI/TCLK
IN
JTAG data input, TCLK input
PJ.0/TDO
OUT
JTAG data output
TEST/SBWTCK
IN
Enable JTAG pins
RST/NMI/SBWTDIO
IN
External reset
VCC
Power supply
VSS
Ground supply
Spy-Bi-Wire Interface
In addition to the standard JTAG interface, the MSP430 family supports the two wire Spy-Bi-Wire
interface. Spy-Bi-Wire can be used to interface with MSP430 development tools and device programmers.
The Spy-Bi-Wire interface pin requirements are shown in Table 6-6. For further details on interfacing to
development tools and device programmers, see the MSP430 Hardware Tools User's Guide (SLAU278).
For a complete description of the features of the JTAG interface and its implementation, see MSP430
Programming Via the JTAG Interface (SLAU320).
Table 6-6. Spy-Bi-Wire Pin Requirements and Functions
DEVICE SIGNAL
DIRECTION
FUNCTION
TEST/SBWTCK
IN
Spy-Bi-Wire clock input
RST/NMI/SBWTDIO
IN, OUT
Spy-Bi-Wire data input/output
VCC
Power supply
VSS
Ground supply
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6.7
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Flash Memory (Link to User's Guide)
The flash memory can be programmed through the JTAG port, Spy-Bi-Wire (SBW), the BSL, or in-system
by the CPU. The CPU can perform single-byte, single-word, and long-word writes to the flash memory.
Features of the flash memory include:
• Flash memory has n segments of main memory and four segments of information memory (A to D) of
128 bytes each. Each segment in main memory is 512 bytes in size.
• Segments 0 to n may be erased in one step, or each segment may be individually erased.
• Segments A to D can be erased individually. Segments A to D are also called information memory.
• Segment A can be locked separately.
6.8
RAM (Link to User's Guide)
The RAM is made up of n sectors. Each sector can be completely powered down to save leakage;
however; all data is lost. Features of the RAM include:
• RAM has n sectors. The size of a sector can be found in Section 6.4.
• Each sector 0 to n can be complete disabled; however, data retention is lost.
• Each sector 0 to n automatically enters low-power retention mode when possible.
• For devices that contain USB memory, the USB memory can be used as normal RAM if USB is not
required.
6.9
Peripherals
Peripherals are connected to the CPU through data, address, and control buses. Peripherals can be
handled using all instructions. For complete module descriptions, see the MSP430x5xx and MSP430x6xx
Family User's Guide (SLAU208).
6.9.1
Digital I/O (Link to User's Guide)
There are up to eight 8-bit I/O ports implemented: For 80 pin options, P1, P2, P3, P4, P5, P6, and P7 are
complete, and P8 is reduced to 3-bit I/O. For 64 pin options, P3 and P5 are reduced to 5-bit I/O and 6-bit
I/O, respectively, and P7 and P8 are completely removed. Port PJ contains four individual I/O ports,
common to all devices.
• All individual I/O bits are independently programmable.
• Any combination of input, output, and interrupt conditions is possible.
• Pullup or pulldown on all ports is programmable.
• Drive strength on all ports is programmable.
• Edge-selectable interrupt and LPM4.5 wakeup input capability is available for all bits of ports P1 and
P2.
• Read and write access to port-control registers is supported by all instructions.
• Ports can be accessed byte-wise (P1 through P8) or word-wise in pairs (PA through PD).
56
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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6.9.2
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Port Mapping Controller (Link to User's Guide)
The port mapping controller allows the flexible and reconfigurable mapping of digital functions to port P4
(see Table 6-7). Table 6-8 shows the default mappings.
Table 6-7. Port Mapping Mnemonics and Functions
VALUE
PxMAPy MNEMONIC
INPUT PIN FUNCTION
0
PM_NONE
None
DVSS
PM_CBOUT0
-
Comparator_B output
PM_TB0CLK
TB0 clock input
1
2
-
PM_DMAE0
DMAE0 input
ADC12CLK
PM_SVMOUT
-
PM_TB0OUTH
TB0 high impedance input TB0OUTH
4
PM_TB0CCR0A
TB0 CCR0 capture input CCI0A
TB0 CCR0 compare output Out0
5
PM_TB0CCR1A
TB0 CCR1 capture input CCI1A
TB0 CCR1 compare output Out1
6
PM_TB0CCR2A
TB0 CCR2 capture input CCI2A
TB0 CCR2 compare output Out2
7
PM_TB0CCR3A
TB0 CCR3 capture input CCI3A
TB0 CCR3 compare output Out3
8
PM_TB0CCR4A
TB0 CCR4 capture input CCI4A
TB0 CCR4 compare output Out4
9
PM_TB0CCR5A
TB0 CCR5 capture input CCI5A
TB0 CCR5 compare output Out5
10
PM_TB0CCR6A
TB0 CCR6 capture input CCI6A
TB0 CCR6 compare output Out6
3
11
12
13
14
15
16
(1)
PM_ADC12CLK
OUTPUT PIN FUNCTION
SVM output
PM_UCA1RXD
USCI_A1 UART RXD (Direction controlled by USCI – input)
PM_UCA1SOMI
USCI_A1 SPI slave out master in (direction controlled by USCI)
PM_UCA1TXD
USCI_A1 UART TXD (Direction controlled by USCI – output)
PM_UCA1SIMO
USCI_A1 SPI slave in master out (direction controlled by USCI)
PM_UCA1CLK
USCI_A1 clock input/output (direction controlled by USCI)
PM_UCB1STE
USCI_B1 SPI slave transmit enable (direction controlled by USCI)
PM_UCB1SOMI
USCI_B1 SPI slave out master in (direction controlled by USCI)
PM_UCB1SCL
USCI_B1 I2C clock (open drain and direction controlled by USCI)
PM_UCB1SIMO
USCI_B1 SPI slave in master out (direction controlled by USCI)
PM_UCB1SDA
USCI_B1 I2C data (open drain and direction controlled by USCI)
PM_UCB1CLK
USCI_B1 clock input/output (direction controlled by USCI)
PM_UCA1STE
USCI_A1 SPI slave transmit enable (direction controlled by USCI)
17
PM_CBOUT1
None
Comparator_B output
18
PM_MCLK
None
MCLK
19 - 30
Reserved
None
DVSS
31 (0FFh) (1)
PM_ANALOG
Disables the output driver and the input Schmitt-trigger to prevent parasitic
cross currents when applying analog signals.
The value of the PM_ANALOG mnemonic is set to 0FFh. The port mapping registers are only 5 bits wide and the upper bits are ignored
resulting in a read out value of 31.
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Table 6-8. Default Mapping
PIN
6.9.3
PxMAPy MNEMONIC
INPUT PIN FUNCTION
OUTPUT PIN FUNCTION
P4.0/P4MAP0
PM_UCB1STE/PM_UCA1CLK
USCI_B1 SPI slave transmit enable (direction controlled by USCI)
USCI_A1 clock input/output (direction controlled by USCI)
P4.1/P4MAP1
PM_UCB1SIMO/PM_UCB1SDA
USCI_B1 SPI slave in master out (direction controlled by USCI)
USCI_B1 I2C data (open drain and direction controlled by USCI)
P4.2/P4MAP2
PM_UCB1SOMI/PM_UCB1SCL
USCI_B1 SPI slave out master in (direction controlled by USCI)
USCI_B1 I2C clock (open drain and direction controlled by USCI)
P4.3/P4MAP3
PM_UCB1CLK/PM_UCA1STE
USCI_A1 SPI slave transmit enable (direction controlled by USCI)
USCI_B1 clock input/output (direction controlled by USCI)
P4.4/P4MAP4
PM_UCA1TXD/PM_UCA1SIMO
USCI_A1 UART TXD (Direction controlled by USCI – output)
USCI_A1 SPI slave in master out (direction controlled by USCI)
P4.5/P4MAP5
PM_UCA1RXD/PM_UCA1SOMI
USCI_A1 UART RXD (Direction controlled by USCI – input)
USCI_A1 SPI slave out master in (direction controlled by USCI)
P4.6/P4MAP6
PM_NONE
None
DVSS
P4.7/P4MAP7
PM_NONE
None
DVSS
Oscillator and System Clock (Link to User's Guide)
The clock system in the MSP430F552x and MSP430F551x family of devices is supported by the Unified
Clock System (UCS) module that includes support for a 32-kHz watch crystal oscillator (XT1 LF mode)
(XT1 HF mode is not supported), an internal very-low-power low-frequency oscillator (VLO), an internal
trimmed low-frequency oscillator (REFO), an integrated internal digitally controlled oscillator (DCO), and a
high-frequency crystal oscillator (XT2). The UCS module is designed to meet the requirements of both low
system cost and low power consumption. The UCS module features digital frequency locked loop (FLL)
hardware that, in conjunction with a digital modulator, stabilizes the DCO frequency to a programmable
multiple of the selected FLL reference frequency. The internal DCO provides a fast turnon clock source
and stabilizes in 3.5 µs (typical). The UCS module provides the following clock signals:
• Auxiliary clock (ACLK), sourced from a 32-kHz watch crystal (XT1), a high-frequency crystal (XT2), the
internal low-frequency oscillator (VLO), the trimmed low-frequency oscillator (REFO), or the internal
digitally controlled oscillator DCO.
• Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced by same sources made
available to ACLK.
• Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be
sourced by same sources made available to ACLK.
• ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, ACLK/8, ACLK/16, ACLK/32.
6.9.4
Power Management Module (PMM) (Link to User's Guide)
The PMM includes an integrated voltage regulator that supplies the core voltage to the device and
contains programmable output levels to provide for power optimization. The PMM also includes supply
voltage supervisor (SVS) and supply voltage monitoring (SVM) circuitry, as well as brownout protection.
The brownout circuit is implemented to provide the proper internal reset signal to the device during power
on and power off. The SVS and SVM circuitry detects if the supply voltage drops below a user-selectable
level and supports both supply voltage supervision (SVS) (the device is automatically reset) and supply
voltage monitoring (SVM) (the device is not automatically reset). SVS and SVM circuitry is available on the
primary supply and core supply.
6.9.5
Hardware Multiplier (Link to User's Guide)
The multiplication operation is supported by a dedicated peripheral module. The module performs
operations with 32-, 24-, 16-, and 8-bit operands. The module supports signed and unsigned multiplication
as well as signed and unsigned multiply-and-accumulate operations.
58
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
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6.9.6
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Real-Time Clock (RTC_A) (Link to User's Guide)
The RTC_A module can be used as a general-purpose 32-bit counter (counter mode) or as an integrated
real-time clock (RTC) (calendar mode). In counter mode, the RTC_A also includes two independent 8-bit
timers that can be cascaded to form a 16-bit timer/counter. Both timers can be read and written by
software. Calendar mode integrates an internal calendar which compensates for months with less than
31 days and includes leap year correction. The RTC_A also supports flexible alarm functions and offsetcalibration hardware.
6.9.7
Watchdog Timer (WDT_A) (Link to User's Guide)
The primary function of the WDT_A module is to perform a controlled system restart after a software
problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog function
is not needed in an application, the module can be configured as an interval timer and can generate
interrupts at selected time intervals.
6.9.8
System Module (SYS) (Link to User's Guide)
The SYS module handles many of the system functions within the device. These include power-on reset
and power-up clear handling, NMI source selection and management, reset interrupt vector generators,
bootstrap loader entry mechanisms, and configuration management (device descriptors). It also includes a
data exchange mechanism through JTAG called a JTAG mailbox that can be used in the application.
Table 6-9. System Module Interrupt Vector Registers
INTERRUPT VECTOR REGISTER
ADDRESS
INTERRUPT EVENT
VALUE
019Eh
No interrupt pending
00h
Brownout (BOR)
02h
RST/NMI (POR)
04h
PMMSWBOR (BOR)
06h
SYSRSTIV, System Reset
Wakeup from LPMx.5
08h
Security violation (BOR)
0Ah
SVSL (POR)
0Ch
SVSH (POR)
0Eh
SVML_OVP (POR)
10h
SVMH_OVP (POR)
12h
PMMSWPOR (POR)
14h
WDT time-out (PUC)
16h
WDT password violation (PUC)
18h
KEYV flash password violation (PUC)
1Ah
Reserved
1Ch
Peripheral area fetch (PUC)
1Eh
PMM password violation (PUC)
20h
Reserved
22h to 3Eh
PRIORITY
Highest
Lowest
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Table 6-9. System Module Interrupt Vector Registers (continued)
INTERRUPT VECTOR REGISTER
ADDRESS
INTERRUPT EVENT
VALUE
019Ch
No interrupt pending
00h
SYSSNIV, System NMI
019Ah
SYSUNIV, User NMI
6.9.9
SVMLIFG
02h
SVMHIFG
04h
SVSMLDLYIFG
06h
SVSMHDLYIFG
08h
VMAIFG
0Ah
JMBINIFG
0Ch
JMBOUTIFG
0Eh
SVMLVLRIFG
10h
SVMHVLRIFG
12h
Reserved
14h to 1Eh
No interrupt pending
00h
NMIIFG
02h
OFIFG
04h
ACCVIFG
06h
BUSIFG
08h
Reserved
0Ah to 1Eh
PRIORITY
Highest
Lowest
Highest
Lowest
DMA Controller (Link to User's Guide)
The DMA controller allows movement of data from one memory address to another without CPU
intervention. For example, the DMA controller can be used to move data from the ADC12_A conversion
memory to RAM. Using the DMA controller can increase the throughput of peripheral modules. The DMA
controller reduces system power consumption by allowing the CPU to remain in sleep mode, without
having to awaken to move data to or from a peripheral.
The USB timestamp generator also uses the DMA trigger assignments described in Table 6-10.
Table 6-10. DMA Trigger Assignments (1)
TRIGGER
(1)
60
CHANNEL
0
1
2
0
DMAREQ
DMAREQ
DMAREQ
1
TA0CCR0 CCIFG
TA0CCR0 CCIFG
TA0CCR0 CCIFG
2
TA0CCR2 CCIFG
TA0CCR2 CCIFG
TA0CCR2 CCIFG
3
TA1CCR0 CCIFG
TA1CCR0 CCIFG
TA1CCR0 CCIFG
4
TA1CCR2 CCIFG
TA1CCR2 CCIFG
TA1CCR2 CCIFG
5
TA2CCR0 CCIFG
TA2CCR0 CCIFG
TA2CCR0 CCIFG
6
TA2CCR2 CCIFG
TA2CCR2 CCIFG
TA2CCR2 CCIFG
7
TB0CCR0 CCIFG
TB0CCR0 CCIFG
TB0CCR0 CCIFG
8
TB0CCR2 CCIFG
TB0CCR2 CCIFG
TB0CCR2 CCIFG
9
Reserved
Reserved
Reserved
10
Reserved
Reserved
Reserved
11
Reserved
Reserved
Reserved
12
Reserved
Reserved
Reserved
13
Reserved
Reserved
Reserved
14
Reserved
Reserved
Reserved
15
Reserved
Reserved
Reserved
If a reserved trigger source is selected, no Trigger1 is generated.
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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Table 6-10. DMA Trigger Assignments(1) (continued)
TRIGGER
(2)
CHANNEL
0
1
2
16
UCA0RXIFG
UCA0RXIFG
UCA0RXIFG
17
UCA0TXIFG
UCA0TXIFG
UCA0TXIFG
18
UCB0RXIFG
UCB0RXIFG
UCB0RXIFG
19
UCB0TXIFG
UCB0TXIFG
UCB0TXIFG
20
UCA1RXIFG
UCA1RXIFG
UCA1RXIFG
21
UCA1TXIFG
UCA1TXIFG
UCA1TXIFG
22
UCB1RXIFG
UCB1RXIFG
UCB1RXIFG
23
UCB1TXIFG
UCB1TXIFG
UCB1TXIFG
24
ADC12IFGx (2)
ADC12IFGx (2)
ADC12IFGx (2)
25
Reserved
Reserved
Reserved
26
Reserved
Reserved
Reserved
27
USB FNRXD
USB FNRXD
USB FNRXD
28
USB ready
USB ready
USB ready
29
MPY ready
MPY ready
MPY ready
30
DMA2IFG
DMA0IFG
DMA1IFG
31
DMAE0
DMAE0
DMAE0
Only on devices with ADC. Reserved on devices without ADC.
6.9.10 Universal Serial Communication Interface (USCI) (Links to User's Guide: UART
Mode, SPI Mode, I2C Mode)
The USCI modules are used for serial data communication. The USCI module supports synchronous
communication protocols such as SPI (3-pin or 4-pin) and I2C, and asynchronous communication
protocols such as UART, enhanced UART with automatic baudrate detection, and IrDA. Each USCI
module contains two portions, A and B.
The USCI_An module provides support for SPI (3-pin or 4-pin), UART, enhanced UART, or IrDA.
The USCI_Bn module provides support for SPI (3-pin or 4-pin) or I2C.
The MSP430F55xx series includes two complete USCI modules (n = 0, 1).
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6.9.11 TA0 (Link to User's Guide)
TA0 is a 16-bit timer and counter (Timer_A type) with five capture/compare registers. It can support
multiple capture/compare registers, PWM outputs, and interval timing. It also has extensive interrupt
capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the
capture/compare registers.
Table 6-11. TA0 Signal Connections
INPUT PIN NUMBER
RGC, YFF,
ZQE
18, H2-P1.0
PN
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
21-P1.0
TA0CLK
TACLK
ACLK
(internal)
ACLK
SMCLK
(internal)
SMCLK
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
OUTPUT PIN NUMBER
RGC, YFF, ZQE
PN
19, H3-P1.1
22-P1.1
18, H2-P1.0
21-P1.0
TA0CLK
TACLK
19, H3-P1.1
22-P1.1
TA0.0
CCI0A
DVSS
CCI0B
DVSS
GND
DVCC
VCC
TA0.1
CCI1A
20, J3-P1.2
23-P1.2
CBOUT
(internal)
CCI1B
ADC12
(internal) (1)
ADC12SHSx =
{1}
ADC12
(internal) (1)
ADC12SHSx =
{1}
DVSS
GND
21, G4-P1.3
24-P1.3
22, H4-P1.4
25-P1.4
23, J4-P1.5
26-P1.5
20, J3-P1.2
21, G4-P1.3
22, H4-P1.4
23, J4-P1.5
23-P1.2
24-P1.3
25-P1.4
26-P1.5
(1)
Only on devices with ADC.
62
Detailed Description
DVCC
VCC
TA0.2
CCI2A
ACLK
(internal)
CCI2B
DVSS
GND
DVCC
VCC
TA0.3
CCI3A
DVSS
CCI3B
DVSS
GND
DVCC
VCC
TA0.4
CCI4A
DVSS
CCI4B
DVSS
GND
DVCC
VCC
CCR0
CCR1
CCR2
CCR3
CCR4
TA0
TA1
TA2
TA3
TA4
TA0.0
TA0.1
TA0.2
TA0.3
TA0.4
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
6.9.12 TA1 (Link to User's Guide)
TA1 is a 16-bit timer and counter (Timer_A type) with three capture/compare registers. It can support
multiple capture/compare registers, PWM outputs, and interval timing. It also has extensive interrupt
capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the
capture/compare registers.
Table 6-12. TA1 Signal Connections
INPUT PIN NUMBER
RGC, YFF,
ZQE
24, G5-P1.6
PN
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
27-P1.6
TA1CLK
TACLK
ACLK
(internal)
ACLK
SMCLK
(internal)
SMCLK
24, G5-P1.6
27-P1.6
TA1CLK
TACLK
25, H5-P1.7
28-P1.7
TA1.0
CCI0A
DVSS
CCI0B
DVSS
GND
DVCC
VCC
26, J5-P2.0
27, G6-P2.1
29-P2.0
30-P2.1
TA1.1
CCI1A
CBOUT
(internal)
CCI1B
DVSS
GND
DVCC
VCC
TA1.2
CCI2A
ACLK
(internal)
CCI2B
DVSS
GND
DVCC
VCC
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
CCR0
CCR1
CCR2
TA0
TA1
TA2
OUTPUT PIN NUMBER
RGC, YFF,
ZQE
PN
25, H5-P1.7
28-P1.7
26, J5-P2.0
29-P2.0
27, G6-P2.1
30-P2.1
TA1.0
TA1.1
TA1.2
Detailed Description
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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6.9.13 TA2 (Link to User's Guide)
TA2 is a 16-bit timer and counter (Timer_A type) with three capture/compare registers. It can support
multiple capture/compare registers, PWM outputs, and interval timing. It also has extensive interrupt
capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the
capture/compare registers.
Table 6-13. TA2 Signal Connections
INPUT PIN NUMBER
RGC, YFF,
ZQE
28, J6-P2.2
PN
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
31-P2.2
TA2CLK
TACLK
ACLK
(internal)
ACLK
SMCLK
(internal)
SMCLK
28, J6-P2.2
31-P2.2
TA2CLK
TACLK
29, H6-P2.3
32-P2.3
TA2.0
CCI0A
DVSS
CCI0B
DVSS
GND
DVCC
VCC
30, J7-P2.4
31, J8-P2.5
64
33-P2.4
34-P2.5
Detailed Description
TA2.1
CCI1A
CBOUT
(internal)
CCI1B
DVSS
GND
DVCC
VCC
TA2.2
CCI2A
ACLK
(internal)
CCI2B
DVSS
GND
DVCC
VCC
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
CCR0
CCR1
CCR2
TA0
TA1
TA2
OUTPUT PIN NUMBER
RGC, YFF,
ZQE
PN
29, H6-P2.3
32-P2.3
30, J7-P2.4
33-P2.4
31, J8-P2.5
34-P2.5
TA2.0
TA2.1
TA2.2
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
6.9.14 TB0 (Link to User's Guide)
TB0 is a 16-bit timer and counter (Timer_B type) with seven capture/compare registers. It can support
multiple capture/compare registers, PWM outputs, and interval timing. It also has extensive interrupt
capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the
capture/compare registers.
Table 6-14. TB0 Signal Connections
INPUT PIN NUMBER
RGC, YFF,
ZQE (1)
PN
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
60-P7.7
TB0CLK
TBCLK
ACLK
(internal)
ACLK
SMCLK
(internal)
SMCLK
60-P7.7
TB0CLK
TBCLK
55-P5.6
TB0.0
CCI0A
55-P5.6
TB0.0
CCI0B
DVSS
GND
56-P5.7
VCC
TB0.1
CCI1A
CBOUT
(internal)
CCI1B
DVSS
GND
DVCC
VCC
57-P7.4
TB0.2
CCI2A
57-P7.4
TB0.2
CCI2B
DVSS
GND
DVCC
VCC
58-P7.5
TB0.3
CCI3A
58-P7.5
TB0.3
CCI3B
DVSS
GND
DVCC
VCC
59-P7.6
TB0.4
CCI4A
59-P7.6
TB0.4
CCI4B
DVSS
GND
DVCC
VCC
42-P3.5
TB0.5
CCI5A
42-P3.5
TB0.5
CCI5B
DVSS
GND
DVCC
VCC
TB0.6
CCI6A
ACLK
(internal)
CCI6B
DVSS
GND
DVCC
VCC
43-P3.6
(1)
(2)
DVCC
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
OUTPUT PIN NUMBER
RGC, YFF,
ZQE (1)
PN
55-P5.6
CCR0
TB0
TB0.0
ADC12
(internal) (2)
ADC12SHSx =
{2}
ADC12
(internal) (2)
ADC12SHSx =
{2}
56-P5.7
CCR1
TB1
TB0.1
ADC12 (internal)
ADC12SHSx =
{3}
ADC12 (internal)
ADC12SHSx =
{3}
57-P7.4
CCR2
TB2
TB0.2
58-P7.5
CCR3
TB3
TB0.3
59-P7.6
CCR4
TB4
TB0.4
42-P3.5
CCR5
TB5
TB0.5
43-P3.6
CCR6
TB6
TB0.6
Timer functions are selectable through the port mapping controller.
Only on devices with ADC
Detailed Description
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MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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6.9.15 Comparator_B (Link to User's Guide)
The primary function of the Comparator_B module is to support precision slope analog-to-digital
conversions, battery voltage supervision, and monitoring of external analog signals.
6.9.16 ADC12_A (Link to User's Guide)
The ADC12_A module supports fast 12-bit analog-to-digital conversions. The module implements a 12-bit
SAR core, sample select control, reference generator and a 16 word conversion-and-control buffer. The
conversion-and-control buffer allows up to 16 independent ADC samples to be converted and stored
without any CPU intervention.
6.9.17 CRC16 (Link to User's Guide)
The CRC16 module produces a signature based on a sequence of entered data values and can be used
for data checking purposes. The CRC16 module signature is based on the CRC-CCITT standard.
6.9.18 REF Voltage Reference (Link to User's Guide)
The reference module (REF) is responsible for generation of all critical reference voltages that can be
used by the various analog peripherals in the device.
6.9.19 Universal Serial Bus (USB) (Link to User's Guide)
The USB module is a fully integrated USB interface that is compliant with the USB 2.0 specification. The
module supports full-speed operation of control, interrupt, and bulk transfers. The module includes an
integrated LDO, PHY, and PLL. The PLL is highly-flexible and can support a wide range of input clock
frequencies. USB RAM, when not used for USB communication, can be used by the system.
6.9.20 Embedded Emulation Module (EEM) (Link to User's Guide)
The EEM supports real-time in-system debugging. The L version of the EEM has the following features:
• Eight hardware triggers or breakpoints on memory access
• Two hardware triggers or breakpoints on CPU register write access
• Up to 10 hardware triggers can be combined to form complex triggers or breakpoints
• Two cycle counters
• Sequencer
• State storage
• Clock control on module level
66
Detailed Description
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
6.9.21 Peripheral File Map
Table 6-15 lists the base address for the registers of each module. The following tables list the offsets for
all available registers in each module.
Table 6-15. Peripherals
MODULE NAME
BASE ADDRESS
OFFSET ADDRESS
RANGE
Special Functions (see Table 6-16)
0100h
000h-01Fh
PMM (see Table 6-17)
0120h
000h-010h
Flash Control (see Table 6-18)
0140h
000h-00Fh
CRC16 (see Table 6-19)
0150h
000h-007h
RAM Control (see Table 6-20)
0158h
000h-001h
Watchdog (see Table 6-21)
015Ch
000h-001h
UCS (see Table 6-22)
0160h
000h-01Fh
SYS (see Table 6-23)
0180h
000h-01Fh
Shared Reference (see Table 6-24)
01B0h
000h-001h
Port Mapping Control (see Table 6-25)
01C0h
000h-002h
Port Mapping Port P4 (see Table 6-25)
01E0h
000h-007h
Port P1 and P2 (see Table 6-26)
0200h
000h-01Fh
Port P3 and P4 (see Table 6-27)
0220h
000h-00Bh
Port P5 and P6 (see Table 6-28)
0240h
000h-00Bh
Port P7 and P8 (see Table 6-29)
0260h
000h-00Bh
Port PJ (see Table 6-30)
0320h
000h-01Fh
TA0 (see Table 6-31)
0340h
000h-02Eh
TA1 (see Table 6-32)
0380h
000h-02Eh
TB0 (see Table 6-33)
03C0h
000h-02Eh
TA2 (see Table 6-34)
0400h
000h-02Eh
Real-Time Clock (RTC_A) (see Table 6-35)
04A0h
000h-01Bh
32-Bit Hardware Multiplier (see Table 6-36)
04C0h
000h-02Fh
DMA General Control (see Table 6-37)
0500h
000h-00Fh
DMA Channel 0 (see Table 6-37)
0510h
000h-00Ah
DMA Channel 1 (see Table 6-37)
0520h
000h-00Ah
DMA Channel 2 (see Table 6-37)
0530h
000h-00Ah
USCI_A0 (see Table 6-38)
05C0h
000h-01Fh
USCI_B0 (see Table 6-39)
05E0h
000h-01Fh
USCI_A1 (see Table 6-40)
0600h
000h-01Fh
USCI_B1 (see Table 6-41)
0620h
000h-01Fh
ADC12_A (see Table 6-42)
0700h
000h-03Eh
000h-00Fh
Comparator_B (see Table 6-43)
08C0h
USB Configuration (see Table 6-44)
0900h
000h-014h
USB Control (see Table 6-45)
0920h
000h-01Fh
Detailed Description
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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Table 6-16. Special Function Registers (Base Address: 0100h)
REGISTER DESCRIPTION
REGISTER
OFFSET
SFR interrupt enable
SFRIE1
00h
SFR interrupt flag
SFRIFG1
02h
SFR reset pin control
SFRRPCR
04h
Table 6-17. PMM Registers (Base Address: 0120h)
REGISTER DESCRIPTION
REGISTER
OFFSET
PMM Control 0
PMMCTL0
00h
PMM control 1
PMMCTL1
02h
SVS high side control
SVSMHCTL
04h
SVS low side control
SVSMLCTL
06h
PMM interrupt flags
PMMIFG
0Ch
PMM interrupt enable
PMMIE
0Eh
PMM power mode 5 control
PM5CTL0
10h
Table 6-18. Flash Control Registers (Base Address: 0140h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Flash control 1
FCTL1
00h
Flash control 3
FCTL3
04h
Flash control 4
FCTL4
06h
Table 6-19. CRC16 Registers (Base Address: 0150h)
REGISTER DESCRIPTION
REGISTER
OFFSET
CRC data input
CRC16DI
00h
CRC data input reverse byte
CRCDIRB
02h
CRC initialization and result
CRCINIRES
04h
CRC result reverse byte
CRCRESR
06h
Table 6-20. RAM Control Registers (Base Address: 0158h)
REGISTER DESCRIPTION
RAM control 0
REGISTER
RCCTL0
OFFSET
00h
Table 6-21. Watchdog Registers (Base Address: 015Ch)
REGISTER DESCRIPTION
Watchdog timer control
REGISTER
WDTCTL
OFFSET
00h
Table 6-22. UCS Registers (Base Address: 0160h)
REGISTER DESCRIPTION
REGISTER
OFFSET
UCS control 0
UCSCTL0
00h
UCS control 1
UCSCTL1
02h
UCS control 2
UCSCTL2
04h
UCS control 3
UCSCTL3
06h
UCS control 4
UCSCTL4
08h
UCS control 5
UCSCTL5
0Ah
UCS control 6
UCSCTL6
0Ch
UCS control 7
UCSCTL7
0Eh
68
Detailed Description
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Table 6-22. UCS Registers (Base Address: 0160h) (continued)
REGISTER DESCRIPTION
UCS control 8
REGISTER
UCSCTL8
OFFSET
10h
Table 6-23. SYS Registers (Base Address: 0180h)
REGISTER DESCRIPTION
REGISTER
OFFSET
System control
SYSCTL
00h
Bootstrap loader configuration area
SYSBSLC
02h
JTAG mailbox control
SYSJMBC
06h
JTAG mailbox input 0
SYSJMBI0
08h
JTAG mailbox input 1
SYSJMBI1
0Ah
JTAG mailbox output 0
SYSJMBO0
0Ch
JTAG mailbox output 1
SYSJMBO1
0Eh
Bus Error vector generator
SYSBERRIV
18h
User NMI vector generator
SYSUNIV
1Ah
System NMI vector generator
SYSSNIV
1Ch
Reset vector generator
SYSRSTIV
1Eh
Table 6-24. Shared Reference Registers (Base Address: 01B0h)
REGISTER DESCRIPTION
Shared reference control
REGISTER
REFCTL
OFFSET
00h
Table 6-25. Port Mapping Registers
(Base Address of Port Mapping Control: 01C0h, Port P4: 01E0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port mapping key and ID register
PMAPKEYID
00h
Port mapping control register
PMAPCTL
02h
Port P4.0 mapping register
P4MAP0
00h
Port P4.1 mapping register
P4MAP1
01h
Port P4.2 mapping register
P4MAP2
02h
Port P4.3 mapping register
P4MAP3
03h
Port P4.4 mapping register
P4MAP4
04h
Port P4.5 mapping register
P4MAP5
05h
Port P4.6 mapping register
P4MAP6
06h
Port P4.7 mapping register
P4MAP7
07h
Detailed Description
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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Table 6-26. Port P1 and P2 Registers (Base Address: 0200h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P1 input
P1IN
00h
Port P1 output
P1OUT
02h
Port P1 direction
P1DIR
04h
Port P1 pullup or pulldown enable
P1REN
06h
Port P1 drive strength
P1DS
08h
Port P1 selection
P1SEL
0Ah
Port P1 interrupt vector word
P1IV
0Eh
Port P1 interrupt edge select
P1IES
18h
Port P1 interrupt enable
P1IE
1Ah
Port P1 interrupt flag
P1IFG
1Ch
Port P2 input
P2IN
01h
Port P2 output
P2OUT
03h
Port P2 direction
P2DIR
05h
Port P2 pullup or pulldown enable
P2REN
07h
Port P2 drive strength
P2DS
09h
Port P2 selection
P2SEL
0Bh
Port P2 interrupt vector word
P2IV
1Eh
Port P2 interrupt edge select
P2IES
19h
Port P2 interrupt enable
P2IE
1Bh
Port P2 interrupt flag
P2IFG
1Dh
Table 6-27. Port P3 and P4 Registers (Base Address: 0220h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P3 input
P3IN
00h
Port P3 output
P3OUT
02h
Port P3 direction
P3DIR
04h
Port P3 pullup or pulldown enable
P3REN
06h
Port P3 drive strength
P3DS
08h
Port P3 selection
P3SEL
0Ah
Port P4 input
P4IN
01h
Port P4 output
P4OUT
03h
Port P4 direction
P4DIR
05h
Port P4 pullup or pulldown enable
P4REN
07h
Port P4 drive strength
P4DS
09h
Port P4 selection
P4SEL
0Bh
70
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Table 6-28. Port P5 and P6 Registers (Base Address: 0240h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P5 input
P5IN
00h
Port P5 output
P5OUT
02h
Port P5 direction
P5DIR
04h
Port P5 pullup or pulldown enable
P5REN
06h
Port P5 drive strength
P5DS
08h
Port P5 selection
P5SEL
0Ah
Port P6 input
P6IN
01h
Port P6 output
P6OUT
03h
Port P6 direction
P6DIR
05h
Port P6 pullup or pulldown enable
P6REN
07h
Port P6 drive strength
P6DS
09h
Port P6 selection
P6SEL
0Bh
Table 6-29. Port P7 and P8 Registers (Base Address: 0260h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P7 input
P7IN
00h
Port P7 output
P7OUT
02h
Port P7 direction
P7DIR
04h
Port P7 pullup or pulldown enable
P7REN
06h
Port P7 drive strength
P7DS
08h
Port P7 selection
P7SEL
0Ah
Port P8 input
P8IN
01h
Port P8 output
P8OUT
03h
Port P8 direction
P8DIR
05h
Port P8 pullup or pulldown enable
P8REN
07h
Port P8 drive strength
P8DS
09h
Port P8 selection
P8SEL
0Bh
Table 6-30. Port J Registers (Base Address: 0320h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port PJ input
PJIN
00h
Port PJ output
PJOUT
02h
Port PJ direction
PJDIR
04h
Port PJ pullup or pulldown enable
PJREN
06h
Port PJ drive strength
PJDS
08h
Detailed Description
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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Table 6-31. TA0 Registers (Base Address: 0340h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA0 control
TA0CTL
00h
Capture/compare control 0
TA0CCTL0
02h
Capture/compare control 1
TA0CCTL1
04h
Capture/compare control 2
TA0CCTL2
06h
Capture/compare control 3
TA0CCTL3
08h
Capture/compare control 4
TA0CCTL4
0Ah
TA0 counter register
TA0R
10h
Capture/compare register 0
TA0CCR0
12h
Capture/compare register 1
TA0CCR1
14h
Capture/compare register 2
TA0CCR2
16h
Capture/compare register 3
TA0CCR3
18h
Capture/compare register 4
TA0CCR4
1Ah
TA0 expansion register 0
TA0EX0
20h
TA0 interrupt vector
TA0IV
2Eh
Table 6-32. TA1 Registers (Base Address: 0380h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA1 control
TA1CTL
00h
Capture/compare control 0
TA1CCTL0
02h
Capture/compare control 1
TA1CCTL1
04h
Capture/compare control 2
TA1CCTL2
06h
TA1 counter register
TA1R
10h
Capture/compare register 0
TA1CCR0
12h
Capture/compare register 1
TA1CCR1
14h
Capture/compare register 2
TA1CCR2
16h
TA1 expansion register 0
TA1EX0
20h
TA1 interrupt vector
TA1IV
2Eh
72
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Table 6-33. TB0 Registers (Base Address: 03C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TB0 control
TB0CTL
00h
Capture/compare control 0
TB0CCTL0
02h
Capture/compare control 1
TB0CCTL1
04h
Capture/compare control 2
TB0CCTL2
06h
Capture/compare control 3
TB0CCTL3
08h
Capture/compare control 4
TB0CCTL4
0Ah
Capture/compare control 5
TB0CCTL5
0Ch
Capture/compare control 6
TB0CCTL6
0Eh
TB0 register
TB0R
10h
Capture/compare register 0
TB0CCR0
12h
Capture/compare register 1
TB0CCR1
14h
Capture/compare register 2
TB0CCR2
16h
Capture/compare register 3
TB0CCR3
18h
Capture/compare register 4
TB0CCR4
1Ah
Capture/compare register 5
TB0CCR5
1Ch
Capture/compare register 6
TB0CCR6
1Eh
TB0 expansion register 0
TB0EX0
20h
TB0 interrupt vector
TB0IV
2Eh
Table 6-34. TA2 Registers (Base Address: 0400h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA2 control
TA2CTL
00h
Capture/compare control 0
TA2CCTL0
02h
Capture/compare control 1
TA2CCTL1
04h
Capture/compare control 2
TA2CCTL2
06h
TA2 counter register
TA2R
10h
Capture/compare register 0
TA2CCR0
12h
Capture/compare register 1
TA2CCR1
14h
Capture/compare register 2
TA2CCR2
16h
TA2 expansion register 0
TA2EX0
20h
TA2 interrupt vector
TA2IV
2Eh
Detailed Description
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Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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Table 6-35. Real-Time Clock Registers (Base Address: 04A0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
RTC control 0
RTCCTL0
00h
RTC control 1
RTCCTL1
01h
RTC control 2
RTCCTL2
02h
RTC control 3
RTCCTL3
03h
RTC prescaler 0 control
RTCPS0CTL
08h
RTC prescaler 1 control
RTCPS1CTL
0Ah
RTC prescaler 0
RTCPS0
0Ch
RTC prescaler 1
RTCPS1
0Dh
RTC interrupt vector word
RTCIV
0Eh
RTC seconds, RTC counter register 1
RTCSEC, RTCNT1
10h
RTC minutes, RTC counter register 2
RTCMIN, RTCNT2
11h
RTC hours, RTC counter register 3
RTCHOUR, RTCNT3
12h
RTC day of week, RTC counter register 4
RTCDOW, RTCNT4
13h
RTC days
RTCDAY
14h
RTC month
RTCMON
15h
RTC year low
RTCYEARL
16h
RTC year high
RTCYEARH
17h
RTC alarm minutes
RTCAMIN
18h
RTC alarm hours
RTCAHOUR
19h
RTC alarm day of week
RTCADOW
1Ah
RTC alarm days
RTCADAY
1Bh
74
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Table 6-36. 32-Bit Hardware Multiplier Registers (Base Address: 04C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
16-bit operand 1 – multiply
MPY
00h
16-bit operand 1 – signed multiply
MPYS
02h
16-bit operand 1 – multiply accumulate
MAC
04h
16-bit operand 1 – signed multiply accumulate
MACS
06h
16-bit operand 2
OP2
08h
16 × 16 result low word
RESLO
0Ah
16 × 16 result high word
RESHI
0Ch
16 × 16 sum extension register
SUMEXT
0Eh
32-bit operand 1 – multiply low word
MPY32L
10h
32-bit operand 1 – multiply high word
MPY32H
12h
32-bit operand 1 – signed multiply low word
MPYS32L
14h
32-bit operand 1 – signed multiply high word
MPYS32H
16h
32-bit operand 1 – multiply accumulate low word
MAC32L
18h
32-bit operand 1 – multiply accumulate high word
MAC32H
1Ah
32-bit operand 1 – signed multiply accumulate low word
MACS32L
1Ch
32-bit operand 1 – signed multiply accumulate high word
MACS32H
1Eh
32-bit operand 2 – low word
OP2L
20h
32-bit operand 2 – high word
OP2H
22h
32 × 32 result 0 – least significant word
RES0
24h
32 × 32 result 1
RES1
26h
32 × 32 result 2
RES2
28h
32 × 32 result 3 – most significant word
RES3
2Ah
MPY32 control register 0
MPY32CTL0
2Ch
Detailed Description
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Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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Table 6-37. DMA Registers (Base Address DMA General Control: 0500h,
DMA Channel 0: 0510h, DMA Channel 1: 0520h, DMA Channel 2: 0530h)
REGISTER DESCRIPTION
REGISTER
OFFSET
DMA channel 0 control
DMA0CTL
00h
DMA channel 0 source address low
DMA0SAL
02h
DMA channel 0 source address high
DMA0SAH
04h
DMA channel 0 destination address low
DMA0DAL
06h
DMA channel 0 destination address high
DMA0DAH
08h
DMA channel 0 transfer size
DMA0SZ
0Ah
DMA channel 1 control
DMA1CTL
00h
DMA channel 1 source address low
DMA1SAL
02h
DMA channel 1 source address high
DMA1SAH
04h
DMA channel 1 destination address low
DMA1DAL
06h
DMA channel 1 destination address high
DMA1DAH
08h
DMA channel 1 transfer size
DMA1SZ
0Ah
DMA channel 2 control
DMA2CTL
00h
DMA channel 2 source address low
DMA2SAL
02h
DMA channel 2 source address high
DMA2SAH
04h
DMA channel 2 destination address low
DMA2DAL
06h
DMA channel 2 destination address high
DMA2DAH
08h
DMA channel 2 transfer size
DMA2SZ
0Ah
DMA module control 0
DMACTL0
00h
DMA module control 1
DMACTL1
02h
DMA module control 2
DMACTL2
04h
DMA module control 3
DMACTL3
06h
DMA module control 4
DMACTL4
08h
DMA interrupt vector
DMAIV
0Eh
Table 6-38. USCI_A0 Registers (Base Address: 05C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI control 1
UCA0CTL1
00h
USCI control 0
UCA0CTL0
01h
USCI baud rate 0
UCA0BR0
06h
USCI baud rate 1
UCA0BR1
07h
USCI modulation control
UCA0MCTL
08h
USCI status
UCA0STAT
0Ah
USCI receive buffer
UCA0RXBUF
0Ch
USCI transmit buffer
UCA0TXBUF
0Eh
USCI LIN control
UCA0ABCTL
10h
USCI IrDA transmit control
UCA0IRTCTL
12h
USCI IrDA receive control
UCA0IRRCTL
13h
USCI interrupt enable
UCA0IE
1Ch
USCI interrupt flags
UCA0IFG
1Dh
USCI interrupt vector word
UCA0IV
1Eh
76
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Table 6-39. USCI_B0 Registers (Base Address: 05E0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI synchronous control 1
UCB0CTL1
00h
USCI synchronous control 0
UCB0CTL0
01h
USCI synchronous bit rate 0
UCB0BR0
06h
USCI synchronous bit rate 1
UCB0BR1
07h
USCI synchronous status
UCB0STAT
0Ah
USCI synchronous receive buffer
UCB0RXBUF
0Ch
USCI synchronous transmit buffer
UCB0TXBUF
0Eh
USCI I2C own address
UCB0I2COA
10h
USCI I2C slave address
UCB0I2CSA
12h
USCI interrupt enable
UCB0IE
1Ch
USCI interrupt flags
UCB0IFG
1Dh
USCI interrupt vector word
UCB0IV
1Eh
Table 6-40. USCI_A1 Registers (Base Address: 0600h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI control 1
UCA1CTL1
00h
USCI control 0
UCA1CTL0
01h
USCI baud rate 0
UCA1BR0
06h
USCI baud rate 1
UCA1BR1
07h
USCI modulation control
UCA1MCTL
08h
USCI status
UCA1STAT
0Ah
USCI receive buffer
UCA1RXBUF
0Ch
USCI transmit buffer
UCA1TXBUF
0Eh
USCI LIN control
UCA1ABCTL
10h
USCI IrDA transmit control
UCA1IRTCTL
12h
USCI IrDA receive control
UCA1IRRCTL
13h
USCI interrupt enable
UCA1IE
1Ch
USCI interrupt flags
UCA1IFG
1Dh
USCI interrupt vector word
UCA1IV
1Eh
Detailed Description
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Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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Table 6-41. USCI_B1 Registers (Base Address: 0620h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI synchronous control 1
UCB1CTL1
00h
USCI synchronous control 0
UCB1CTL0
01h
USCI synchronous bit rate 0
UCB1BR0
06h
USCI synchronous bit rate 1
UCB1BR1
07h
USCI synchronous status
UCB1STAT
0Ah
USCI synchronous receive buffer
UCB1RXBUF
0Ch
USCI synchronous transmit buffer
UCB1TXBUF
0Eh
USCI I2C own address
UCB1I2COA
10h
USCI I2C slave address
UCB1I2CSA
12h
USCI interrupt enable
UCB1IE
1Ch
USCI interrupt flags
UCB1IFG
1Dh
USCI interrupt vector word
UCB1IV
1Eh
78
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Table 6-42. ADC12_A Registers (Base Address: 0700h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Control register 0
ADC12CTL0
00h
Control register 1
ADC12CTL1
02h
Control register 2
ADC12CTL2
04h
Interrupt-flag register
ADC12IFG
0Ah
Interrupt-enable register
ADC12IE
0Ch
Interrupt-vector-word register
ADC12IV
0Eh
ADC memory-control register 0
ADC12MCTL0
10h
ADC memory-control register 1
ADC12MCTL1
11h
ADC memory-control register 2
ADC12MCTL2
12h
ADC memory-control register 3
ADC12MCTL3
13h
ADC memory-control register 4
ADC12MCTL4
14h
ADC memory-control register 5
ADC12MCTL5
15h
ADC memory-control register 6
ADC12MCTL6
16h
ADC memory-control register 7
ADC12MCTL7
17h
ADC memory-control register 8
ADC12MCTL8
18h
ADC memory-control register 9
ADC12MCTL9
19h
ADC memory-control register 10
ADC12MCTL10
1Ah
ADC memory-control register 11
ADC12MCTL11
1Bh
ADC memory-control register 12
ADC12MCTL12
1Ch
ADC memory-control register 13
ADC12MCTL13
1Dh
ADC memory-control register 14
ADC12MCTL14
1Eh
ADC memory-control register 15
ADC12MCTL15
1Fh
Conversion memory 0
ADC12MEM0
20h
Conversion memory 1
ADC12MEM1
22h
Conversion memory 2
ADC12MEM2
24h
Conversion memory 3
ADC12MEM3
26h
Conversion memory 4
ADC12MEM4
28h
Conversion memory 5
ADC12MEM5
2Ah
Conversion memory 6
ADC12MEM6
2Ch
Conversion memory 7
ADC12MEM7
2Eh
Conversion memory 8
ADC12MEM8
30h
Conversion memory 9
ADC12MEM9
32h
Conversion memory 10
ADC12MEM10
34h
Conversion memory 11
ADC12MEM11
36h
Conversion memory 12
ADC12MEM12
38h
Conversion memory 13
ADC12MEM13
3Ah
Conversion memory 14
ADC12MEM14
3Ch
Conversion memory 15
ADC12MEM15
3Eh
Detailed Description
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Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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Table 6-43. Comparator_B Registers (Base Address: 08C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Comp_B control register 0
CBCTL0
00h
Comp_B control register 1
CBCTL1
02h
Comp_B control register 2
CBCTL2
04h
Comp_B control register 3
CBCTL3
06h
Comp_B interrupt register
CBINT
0Ch
Comp_B interrupt vector word
CBIV
0Eh
Table 6-44. USB Configuration Registers (Base Address: 0900h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USB key and ID
USBKEYID
00h
USB module configuration
USBCNF
02h
USB PHY control
USBPHYCTL
04h
USB power control
USBPWRCTL
08h
USB PLL control
USBPLLCTL
10h
USB PLL divider
USBPLLDIV
12h
USB PLL interrupts
USBPLLIR
14h
Table 6-45. USB Control Registers (Base Address: 0920h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Input endpoint_0 configuration
USBIEPCNF_0
00h
Input endpoint_0 byte count
USBIEPCNT_0
01h
Output endpoint_0 configuration
USBOEPCNF_0
02h
Output endpoint_0 byte count
USBOEPCNT_0
03h
Input endpoint interrupt enables
USBIEPIE
0Eh
Output endpoint interrupt enables
USBOEPIE
0Fh
Input endpoint interrupt flags
USBIEPIFG
10h
Output endpoint interrupt flags
USBOEPIFG
11h
USB interrupt vector
USBIV
12h
USB maintenance
USBMAINT
16h
Timestamp
USBTSREG
18h
USB frame number
USBFN
1Ah
USB control
USBCTL
1Ch
USB interrupt enables
USBIE
1Dh
USB interrupt flags
USBIFG
1Eh
Function address
USBFUNADR
1Fh
80
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
6.10 Input/Output Schematics
6.10.1 Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
Pad Logic
P1REN.x
P1DIR.x
0
From module
1
P1OUT.x
0
From module
1
0
DVCC
1
1
Direction
0: Input
1: Output
P1DS.x
0: Low drive
1: High drive
P1SEL.x
P1IN.x
EN
To module
DVSS
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
D
P1IE.x
EN
P1IRQ.x
Q
P1IFG.x
P1SEL.x
P1IES.x
Set
Interrupt
Edge
Select
Detailed Description
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Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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Table 6-46. Port P1 (P1.0 to P1.7) Pin Functions
PIN NAME (P1.x)
P1.0/TA0CLK/ACLK
x
0
FUNCTION
P1DIR.x
P1SEL.x
P1.0 (I/O)
I: 0; O: 1
0
TA0CLK
0
1
ACLK
P1.1/TA0.0
1
P1.1 (I/O)
TA0.CCI0A
TA0.0
P1.2/TA0.1
2
P1.2 (I/O)
TA0.CCI1A
TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
82
Detailed Description
3
4
5
6
7
CONTROL BITS OR SIGNALS
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
TA0.CCI2A
0
1
TA0.2
1
1
P1.3 (I/O)
P1.4 (I/O)
I: 0; O: 1
0
TA0.CCI3A
0
1
TA0.3
1
1
P1.5 (I/O)
I: 0; O: 1
0
TA0.CCI4A
0
1
TA0.4
1
1
P1.6 (I/O)
I: 0; O: 1
0
TA1CLK
0
1
CBOUT comparator B
1
1
I: 0; O: 1
0
TA1.CCI0A
0
1
TA1.0
1
1
P1.7 (I/O)
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
6.10.2 Port P2, P2.0 to P2.7, Input/Output With Schmitt Trigger
Pad Logic
P2REN.x
P2DIR.x
0
From module
1
P2OUT.x
0
From module
1
0
DVCC
1
1
Direction
0: Input
1: Output
P2DS.x
0: Low drive
1: High drive
P2SEL.x
P2IN.x
EN
To module
DVSS
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UB0STE/UCA0CLK
D
P2IE.x
EN
To module
Q
P2IFG.x
P2SEL.x
P2IES.x
Set
Interrupt
Edge
Select
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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Table 6-47. Port P2 (P2.0 to P2.7) Pin Functions
PIN NAME (P2.x)
P2.0/TA1.1
x
0
FUNCTION
P2.0 (I/O)
TA1.CCI1A
TA1.1
P2.1/TA1.2
1
P2.1 (I/O)
TA1.CCI2A
TA1.2
P2.2/TA2CLK/SMCLK
2
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UCB0STE/UCA0CLK
3
4
5
6
7
84
P2SEL.x
0
0
1
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
TA2CLK
0
1
1
1
I: 0; O: 1
0
TA2.CCI0A
0
1
TA2.0
1
1
P2.3 (I/O)
P2.4 (I/O)
I: 0; O: 1
0
TA2.CCI1A
0
1
TA2.1
1
1
P2.5 (I/O)
I: 0; O: 1
0
TA2.CCI2A
0
1
TA2.2
1
1
P2.6 (I/O)
I: 0; O: 1
0
DMAE0
0
1
RTCCLK
1
1
P2.7 (I/O)
I: 0; O: 1
0
X
1
UCB0STE/UCA0CLK
(1)
(2)
(3)
P2DIR.x
I: 0; O: 1
P2.2 (I/O)
SMCLK
P2.3/TA2.0
CONTROL BITS OR SIGNALS (1)
(2) (3)
X = Don't care
The pin direction is controlled by the USCI module.
UCA0CLK function takes precedence over UCB0STE function. If the pin is required as UCA0CLK input or output, USCI B0 is forced to
3-wire SPI mode if 4-wire SPI mode is selected.
Detailed Description
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
6.10.3 Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger
Pad Logic
P3REN.x
P3DIR.x
0
From module
1
P3OUT.x
0
From module
1
DVSS
0
DVCC
1
Direction
0: Input
1: Output
P3DS.x
0: Low drive
1: High drive
P3SEL.x
P3IN.x
EN
To module
1
P3.0/UCB0SIMO/UCB0SDA
P3.1/UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
P3.3/UCA0TXD/UCA0SIMO
P3.4/UCA0RXD/UCA0SOMI
P3.5/TB0.5
P3.6/TB0.6
P3.7/TB0OUTH/SVMOUT
D
Table 6-48. Port P3 (P3.0 to P3.7) Pin Functions
PIN NAME (P3.x)
x
P3.0/UCB0SIMO/UCB0SDA
0
FUNCTION
P3.0 (I/O)
UCB0SIMO/UCB0SDA (2)
P3.1/UCB0SOMI/UCB0SCL
1
P3.1 (I/O)
UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
2
(2) (3)
P3.2 (I/O)
UCB0CLK/UCA0STE (2)
P3.3/UCA0TXD/UCA0SIMO
3
4
(4)
P3.3 (I/O)
UCA0TXD/UCA0SIMO
P3.4/UCA0RXD/UCA0SOMI
(2)
P3.4 (I/O)
UCA0RXD/UCA0SOMI (2)
P3.5/TB0.5
P3.6/TB0.6
(5)
(5)
P3.7/TB0OUTH/SVMOUT (5)
(1)
(2)
(3)
(4)
(5)
5
6
7
(3)
P3.5 (I/O)
CONTROL BITS OR SIGNALS (1)
P3DIR.x
P3SEL.x
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
TB0.CCI5A
0
1
TB0.5
1
1
P3.6 (I/O)
I: 0; O: 1
0
TB0.CCI6A
0
1
TB0.6
1
1
P3.7 (I/O)
I: 0; O: 1
0
TB0OUTH
0
1
SVMOUT
1
1
X = Don't care
The pin direction is controlled by the USCI module.
If the I2C functionality is selected, the output drives only the logical 0 to VSS level.
UCB0CLK function takes precedence over UCA0STE function. If the pin is required as UCB0CLK input or output, USCI A0 is forced to
3-wire SPI mode if 4-wire SPI mode is selected.
F5529, F5527, F5525, F5521, F5519, F5517, F5515 devices only.
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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6.10.4 Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
Pad Logic
P4REN.x
P4DIR.x
0
from Port Mapping Control
1
P4OUT.x
0
from Port Mapping Control
1
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
P4.0/P4MAP0
P4.1/P4MAP1
P4.2/P4MAP2
P4.3/P4MAP3
P4.4/P4MAP4
P4.5/P4MAP5
P4.6/P4MAP6
P4.7/P4MAP7
P4DS.x
0: Low drive
1: High drive
P4SEL.x
P4IN.x
EN
D
to Port Mapping Control
Table 6-49. Port P4 (P4.0 to P4.7) Pin Functions
PIN NAME (P4.x)
P4.0/P4MAP0
x
0
FUNCTION
P4.0 (I/O)
Mapped secondary digital function
P4.1/P4MAP1
1
P4.1 (I/O)
Mapped secondary digital function
P4.2/P4MAP2
2
P4.3/P4MAP3
3
P4.2 (I/O)
Mapped secondary digital function
P4.3 (I/O)
Mapped secondary digital function
P4.4/P4MAP4
4
P4.4 (I/O)
Mapped secondary digital function
P4.5/P4MAP5
5
P4.5 (I/O)
Mapped secondary digital function
P4.6/P4MAP6
6
P4.6 (I/O)
Mapped secondary digital function
P4.7/P4MAP7
7
P4.7 (I/O)
Mapped secondary digital function
(1)
86
CONTROL BITS OR SIGNALS
P4DIR.x (1)
P4SEL.x
I: 0; O: 1
0
X
X
1
≤ 30
I: 0; O: 1
0
X
X
1
≤ 30
I: 0; O: 1
0
X
≤ 30
P4MAPx
X
1
I: 0; O: 1
0
X
X
1
≤ 30
I: 0; O: 1
0
X
X
1
≤ 30
I: 0; O: 1
0
X
X
1
≤ 30
I: 0; O: 1
0
X
X
1
≤ 30
I: 0; O: 1
0
X
X
1
≤ 30
The direction of some mapped secondary functions are controlled directly by the module. See Table 6-7 for specific direction control
information of mapped secondary functions.
Detailed Description
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
6.10.5 Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger
Pad Logic
to/from Reference
(n/a MSP430F551x)
(n/a MSPF430F551x)
to ADC12
(n/a MSPF430F551x)
INCHx = x
P5REN.x
P5DIR.x
DVSS
0
DVCC
1
1
0
1
P5OUT.x
0
From module
1
P5.0/(A8/VREF+/VeREF+)
P5.1/(A9/VREF–/VeREF–)
P5DS.x
0: Low drive
1: High drive
P5SEL.x
P5IN.x
Bus
Keeper
EN
To module
D
Table 6-50. Port P5 (P5.0 and P5.1) Pin Functions
PIN NAME (P5.x)
P5.0/A8/VREF+/VeREF+ (2)
x
0
FUNCTION
P5.0 (I/O) (3)
A8/VeREF+
P5.1/A9/VREF-/VeREF- (6)
1
(4)
(6)
(7)
(8)
P5SEL.x
REFOUT
0
X
0
X
1
X
1
1
P5.1 (I/O) (3)
I: 0; O: 1
0
X
X
1
0
X
1
1
A9/VREF–
(5)
P5DIR.x
I: 0; O: 1
A8/VREF+ (5)
A9/VeREF– (7)
(1)
(2)
(3)
(4)
CONTROL BITS OR SIGNALS (1)
(8)
X = Don't care
VREF+/VeREF+ available on MSP430F552x devices only.
Default condition
Setting the P5SEL.0 bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying analog
signals. An external voltage can be applied to VeREF+ and used as the reference for the ADC12_A when available. Channel A8, when
selected with the INCHx bits, is connected to the VREF+/VeREF+ pin.
Setting the P5SEL.0 bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying analog
signals. The VREF+ reference is available at the pin. Channel A8, when selected with the INCHx bits, is connected to the
VREF+/VeREF+ pin.
VREF-/VeREF- available on MSP430F552x devices only.
Setting the P5SEL.1 bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying analog
signals. An external voltage can be applied to VeREF- and used as the reference for the ADC12_A when available. Channel A9, when
selected with the INCHx bits, is connected to the VREF-/VeREF- pin.
Setting the P5SEL.1 bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying analog
signals. The VREF– reference is available at the pin. Channel A9, when selected with the INCHx bits, is connected to the VREF/VeREF- pin.
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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6.10.6 Port P5, P5.2, Input/Output With Schmitt Trigger
Pad Logic
To XT2
P5REN.2
P5DIR.2
DVSS
0
DVCC
1
1
0
1
P5OUT.2
0
Module X OUT
1
P5DS.2
0: Low drive
1: High drive
P5SEL.2
P5.2/XT2IN
P5IN.2
EN
Module X IN
88
Detailed Description
Bus
Keeper
D
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
6.10.7 Port P5, P5.3, Input/Output With Schmitt Trigger
Pad Logic
To XT2
P5REN.3
P5DIR.3
DVSS
0
DVCC
1
1
0
1
P5OUT.3
0
Module X OUT
1
P5.3/XT2OUT
P5SEL.2
P5DS.3
0: Low drive
1: High drive
XT2BYPASS
P5SEL.3
P5IN.3
Bus
Keeper
EN
Module X IN
D
Table 6-51. Port P5 (P5.2, P5.3) Pin Functions
PIN NAME (P5.x)
P5.2/XT2IN
x
2
FUNCTION
P5DIR.x
P5SEL.2
P5SEL.3
XT2BYPASS
I: 0; O: 1
0
X
X
X
1
X
0
X
1
X
1
I: 0; O: 1
0
0
X
XT2OUT crystal mode (3)
X
1
X
0
P5.3 (I/O) (3)
X
1
0
1
P5.2 (I/O)
XT2IN crystal mode
(2)
XT2IN bypass mode (2)
P5.3/XT2OUT
(1)
(2)
(3)
3
CONTROL BITS OR SIGNALS (1)
P5.3 (I/O)
X = Don't care
Setting P5SEL.2 causes the general-purpose I/O to be disabled. Pending the setting of XT2BYPASS, P5.2 is configured for crystal
mode or bypass mode.
Setting P5SEL.2 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P5.3 can be used as
general-purpose I/O.
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
89
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
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6.10.7.1 Port P5, P5.4 and P5.5 Input/Output With Schmitt Trigger
Pad Logic
to XT1
P5REN.4
P5DIR.4
DVSS
0
DVCC
1
1
0
1
P5OUT.4
0
Module X OUT
1
P5DS.4
0: Low drive
1: High drive
P5SEL.4
P5.4/XIN
P5IN.4
EN
Module X IN
90
Detailed Description
Bus
Keeper
D
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Pad Logic
to XT1
P5REN.5
P5DIR.5
DVSS
0
DVCC
1
1
0
1
P5OUT.5
0
Module X OUT
1
P5.5/XOUT
P5SEL.4
P5DS.5
0: Low drive
1: High drive
XT1BYPASS
P5SEL.5
P5IN.5
Bus
Keeper
EN
Module X IN
D
Table 6-52. Port P5 (P5.4 and P5.5) Pin Functions
PIN NAME (P5.x)
P5.4/XIN
4
P5.5/XOUT
(1)
(2)
(3)
x
5
FUNCTION
P5.4 (I/O)
CONTROL BITS OR SIGNALS (1)
P5DIR.x
P5SEL.4
P5SEL.5
XT1BYPASS
I: 0; O: 1
0
X
X
XIN crystal mode (2)
X
1
X
0
XIN bypass mode (2)
X
1
X
1
P5.5 (I/O)
I: 0; O: 1
0
0
X
XOUT crystal mode (3)
X
1
X
0
P5.5 (I/O) (3)
X
1
0
1
X = Don't care
Setting P5SEL.4 causes the general-purpose I/O to be disabled. Pending the setting of XT1BYPASS, P5.4 is configured for crystal
mode or bypass mode.
Setting P5SEL.4 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P5.5 can be used as
general-purpose I/O.
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
6.10.8 Port P5, P5.6 to P5.7, Input/Output With Schmitt Trigger
Pad Logic
P5REN.x
P5DIR.x
0
From Module
1
P5OUT.x
0
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
1
P5DS.x
0: Low drive
1: High drive
P5SEL.x
P5.6/TB0.0
P5.7/TB0.1
P5IN.x
EN
D
To module
Table 6-53. Port P5 (P5.6 to P5.7) Pin Functions
PIN NAME (P5.x)
P5.6/TB0.0 (1)
P5.7/TB0.1 (1)
(1)
92
x
6
7
FUNCTION
CONTROL BITS OR SIGNALS
P5DIR.x
P5SEL.x
I: 0; O: 1
0
TB0.CCI0A
0
1
TB0.0
1
1
TB0.CCI1A
0
1
TB0.1
1
1
P5.6 (I/O)
F5529, F5527, F5525, F5521, F5519, F5517, F5515 devices only.
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
6.10.9 Port P6, P6.0 to P6.7, Input/Output With Schmitt Trigger
Pad Logic
to ADC12
(n/a MSPF430F551x)
INCHx = x
(n/a MSPF430F551x)
to Comparator_B
from Comparator_B
CBPD.x
P6REN.x
P6DIR.x
0
0
From module
1
0
DVCC
1
P6DS.x
0: Low drive
1: High drive
P6SEL.x
P6IN.x
EN
To module
1
Direction
0: Input
1: Output
1
P6OUT.x
DVSS
D
Bus
Keeper
P6.0/CB0/(A0)
P6.1/CB1/(A1)
P6.2/CB2/(A2)
P6.3/CB3/(A3)
P6.4/CB4/(A4)
P6.5/CB5/(A5)
P6.6/CB6/(A6)
P6.7/CB7/(A7)
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
93
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
Table 6-54. Port P6 (P6.0 to P6.7) Pin Functions
PIN NAME (P6.x)
P6.0/CB0/(A0)
x
0
FUNCTION
P6.0 (I/O)
A0 (only MSP430F552x)
CB0 (1)
P6.1/CB1/(A1)
1
P6.1 (I/O)
A1 (only MSP430F552x)
CB1 (1)
P6.2/CB2/(A2)
2
P6.2 (I/O)
A2 (only MSP430F552x)
CB2 (1)
P6.3/CB3/(A3)
P6.4/CB4/(A4)
P6.5/CB5/(A5)
P6.6/CB6/(A6)
3
4
5
6
(1)
94
0
CBPD
0
X
1
X
1
X
X
I: 0; O: 1
0
0
X
1
X
1
X
X
I: 0; O: 1
0
0
X
1
X
1
X
X
0
0
A3 (only MSP430F552x)
X
1
X
CB3 (1)
X
X
1
P6.4 (I/O)
I: 0; O: 1
0
0
A4 (only MSP430F552x)
X
1
X
CB4 (1)
X
X
1
P6.5 (I/O)
I: 0; O: 1
0
0
A5 (only MSP430F552x)
X
1
X
CB5 (1)
X
X
1
I: 0; O: 1
0
0
X
1
X
X
X
1
I: 0; O: 1
0
0
P6.6 (I/O)
CB6 (1)
7
P6SEL.x
I: 0; O: 1
I: 0; O: 1
P6.3 (I/O)
A6 (only MSP430F552x)
P6.7/CB7/(A7)
CONTROL BITS OR SIGNALS
P6DIR.x
P6.7 (I/O)
A7 (only MSP430F552x)
X
1
X
CB7 (1)
X
X
1
Setting the CBPD.x bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying analog
signals. Selecting the CBx input pin to the comparator multiplexer with the CBx bits automatically disables output driver and input buffer
for that pin, regardless of the state of the associated CBPD.x bit.
Detailed Description
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
6.10.10 Port P7, P7.0 to P7.3, Input/Output With Schmitt Trigger
Pad Logic
to ADC12
(n/a MSPF430F551x)
INCHx = x
(n/a MSPF430F551x)
to Comparator_B
from Comparator_B
CBPD.x
P7REN.x
P7DIR.x
0
0
From module
1
0
DVCC
1
1
Direction
0: Input
1: Output
1
P7OUT.x
DVSS
P7DS.x
0: Low drive
1: High drive
P7SEL.x
P7.0/CB8/(A12)
P7.1/CB9/(A13)
P7.2/CB10/(A14)
P7.3/CB11/(A15)
P7IN.x
EN
To module
Bus
Keeper
D
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
95
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
Table 6-55. Port P7 (P7.0 to P7.3) Pin Functions
PIN NAME (P7.x)
P7.0/CB8/(A12)
x
0
FUNCTION
P7.0 (I/O)
A12
(2)
CB8 (3)
P7.1/CB9/(A13)
1
X
1
0
(2)
X
1
X
1
(1)
P7.2 (I/O) (1)
(1)
P7.3 (I/O) (1)
CB11 (3)
96
1
0
A15 (2)
(1)
(2)
(3)
0
X
X
CB10 (3)
3
CBPD
X
A14 (2)
P7.3/CB11/(A15)
0
I: 0; O: 1
CB9 (3)
2
(1)
P7SEL.x
I: 0; O: 1
P7.1 (I/O) (1)
A13
P7.2/CB10/(A14)
(1)
CONTROL BITS OR SIGNALS
P7DIR.x
(1)
X
X
I: 0; O: 1
0
0
X
1
X
1
X
X
I: 0; O: 1
0
0
X
1
X
X
X
1
F5529, F5527, F5525, F5521, F5519, F5517, F5515 devices only
F5529, F5527, F5525, F5521 devices only
Setting the CBPD.x bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying analog
signals. Selecting the CBx input pin to the comparator multiplexer with the CBx bits automatically disables output driver and input buffer
for that pin, regardless of the state of the associated CBPD.x bit.
Detailed Description
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
6.10.11 Port P7, P7.4 to P7.7, Input/Output With Schmitt Trigger
Pad Logic
P7REN.x
P7DIR.x
0
From module
1
P7OUT.x
0
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
1
P7DS.x
0: Low drive
1: High drive
P7SEL.x
P7.4/TB0.2
P7.5/TB0.3
P7.6/TB0.4
P7.7/TB0CLK/MCLK
P7IN.x
EN
D
To module
Table 6-56. Port P7 (P7.4 to P7.7) Pin Functions
PIN NAME (P7.x)
P7.4/TB0.2 (1)
x
4
FUNCTION
P7.4 (I/O)
TB0.CCI2A
TB0.2
P7.5/TB0.3 (1)
P7.6/TB0.4
(1)
P7.7/TB0CLK/MCLK
(1)
5
6
(1)
7
CONTROL BITS OR SIGNALS
P7DIR.x
P7SEL.x
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
TB0.CCI3A
0
1
TB0.3
1
1
P7.5 (I/O)
P7.6 (I/O)
I: 0; O: 1
0
TB0.CCI4A
0
1
TB0.4
1
1
P7.7 (I/O)
I: 0; O: 1
0
TB0CLK
0
1
MCLK
1
1
F5529, F5527, F5525, F5521, F5519, F5517, F5515 devices only
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
97
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
6.10.12 Port P8, P8.0 to P8.2, Input/Output With Schmitt Trigger
Pad Logic
P8REN.x
P8DIR.x
0
from Port Mapping Control
1
P8OUT.x
0
from Port Mapping Control
1
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
P8.0
P8.1
P8.2
P8DS.x
0: Low drive
1: High drive
P8SEL.x
P8IN.x
EN
D
to Port Mapping Control
Table 6-57. Port P8 (P8.0 to P8.2) Pin Functions
PIN NAME (P8.x)
x
FUNCTION
CONTROL BITS OR SIGNALS
P8DIR.x
P8SEL.x
P8.0 (1)
0
P8.0(I/O)
I: 0; O: 1
0
P8.1 (1)
1
P8.1(I/O)
I: 0; O: 1
0
(1)
2
P8.2(I/O)
I: 0; O: 1
0
P8.2
(1)
98
F5529, F5527, F5525, F5521, F5519, F5517, F5515 devices only
Detailed Description
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
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SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
6.10.13 Port PU.0/DP, PU.1/DM, PUR USB Ports
PUSEL
PUOPE
USB output enable
PUOUT0
USB DP output
VUSB
VSSU
Pad Logic
0
1
0
PU.0/
DP
1
PUIN0
USB DP input
PUIPE
.
PUIN1
USB DM input
PUOUT1
0
USB DM output
1
PU.1/
DM
VUSB
VSSU
Pad Logic
PUREN
“1”
PUR
PUSEL
PURIN
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
99
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
Table 6-58. Port PU.0/DP, PU.1/DM Output Functions (1)
CONTROL BITS
(1)
(2)
PIN NAME
PUSEL
PUOPE
PUOUT1
PUOUT0
PU.1/DM
PU.0/DP
0
0
X
X
Output disabled
Output disabled
0
1
0
0
Output low
Output low
0
1
0
1
Output low
Output high
0
1
1
0
Output high
Output low
0
1
1
1
Output high
Output high
1
X
X
X
DM (2)
DP (2)
PU.1/DM and PU.0/DP inputs and outputs are supplied from VUSB. VUSB can be generated by the
device using the integrated 3.3-V LDO when enabled. VUSB can also be supplied externally when the
3.3-V LDO is not being used and is disabled.
Output state set by the USB module.
Table 6-59. Port PU.0/DP, PU.1/DM Input Functions (1)
CONTROL BITS
(1)
PIN NAME
PUSEL
PUIPE
PU.1/DM
PU.0/DP
0
0
Input disabled
Input disabled
0
1
Input enabled
Input enabled
1
X
DM input
DP input
PU.1/DM and PU.0/DP inputs and outputs are supplied from VUSB. VUSB can be generated by the
device using the integrated 3.3-V LDO when enabled. VUSB can also be supplied externally when the
3.3-V LDO is not being used and is disabled.
Table 6-60. Port PUR Input Functions
CONTROL BITS
100
Detailed Description
FUNCTION
PUSEL
PUREN
0
0
Input disabled
Pullup disabled
0
1
Input disabled
Pullup enabled
1
0
Input enabled
Pullup disabled
1
1
Input enabled
Pullup enabled
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
6.10.14 Port J, J.0 JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
Pad Logic
PJREN.0
PJDIR.0
0
DVCC
1
PJOUT.0
0
From JTAG
1
DVSS
0
DVCC
1
1
PJ.0/TDO
PJDS.0
0: Low drive
1: High drive
From JTAG
PJIN.0
EN
D
6.10.15 Port J, J.1 to J.3 JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt
Trigger or Output
Pad Logic
PJREN.x
PJDIR.x
0
DVSS
1
PJOUT.x
0
From JTAG
1
DVSS
0
DVCC
1
PJDS.x
0: Low drive
1: High drive
From JTAG
1
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
PJIN.x
EN
To JTAG
D
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
101
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
Table 6-61. Port PJ (PJ.0 to PJ.3) Pin Functions
PIN NAME (PJ.x)
x
CONTROL BITS/
SIGNALS (1)
FUNCTION
PJDIR.x
PJ.0/TDO
0
PJ.0 (I/O) (2)
I: 0; O: 1
TDO (3)
PJ.1/TDI/TCLK
1
X
PJ.1 (I/O) (2)
TDI/TCLK (3)
PJ.2/TMS
2
PJ.2 (I/O)
TMS (3)
PJ.3/TCK
3
102
(4)
X
(2)
I: 0; O: 1
(4)
X
PJ.3 (I/O) (2)
TCK (3)
(1)
(2)
(3)
(4)
I: 0; O: 1
I: 0; O: 1
(4)
X
X = Don't care
Default condition
The pin direction is controlled by the JTAG module.
In JTAG mode, pullups are activated automatically on TMS, TCK, and TDI/TCLK. PJREN.x are do not care.
Detailed Description
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
6.11 Device Descriptors (TLV)
Table 6-62 and Table 6-63 list the complete contents of the device descriptor tag-length-value (TLV)
structure for each device type.
Table 6-62. MSP430F552x Device Descriptor Table (1)
Info Block
Die Record
ADC12
Calibration
REF
Calibration
Peripheral
Descriptor
(1)
VALUE
DESCRIPTION
ADDRESS
SIZE
(bytes)
F5529
F5528
F5527
F5526
F5525
F5524
F5522
F5521
Info length
01A00h
1
06h
06h
06h
06h
06h
06h
06h
06h
CRC length
01A01h
1
06h
06h
06h
06h
06h
06h
06h
06h
CRC value
01A02h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Device ID
01A04h
1
55h
55h
55h
55h
55h
55h
55h
55h
Device ID
01A05h
1
29h
28h
27h
26h
25h
24h
22h
21h
Hardware revision
01A06h
1
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Firmware revision
01A07h
1
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Die Record Tag
01A08h
1
08h
08h
08h
08h
08h
08h
08h
08h
Die Record length
01A09h
1
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
Lot/Wafer ID
01A0Ah
4
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Die X position
01A0Eh
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Die Y position
01A10h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Test results
01A12h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC12 Calibration Tag
01A14h
1
11h
11h
11h
11h
11h
11h
11h
11h
ADC12 Calibration length
01A15h
1
10h
10h
10h
10h
10h
10h
10h
10h
ADC Gain Factor
01A16h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC Offset
01A18h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 1.5-V Reference
Temp. Sensor 30°C
01A1Ah
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 1.5-V Reference
Temp. Sensor 85°C
01A1Ch
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 2.0-V Reference
Temp. Sensor 30°C
01A1Eh
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 2.0-V Reference
Temp. Sensor 85°C
01A20h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 2.5-V Reference
Temp. Sensor 30°C
01A22h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 2.5-V Reference
Temp. Sensor 85°C
01A24h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
REF Calibration Tag
01A26h
1
12h
12h
12h
12h
12h
12h
12h
12h
REF Calibration length
01A27h
1
06h
06h
06h
06h
06h
06h
06h
06h
REF 1.5-V Reference
Factor
01A28h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
REF 2.0-V Reference
Factor
01A2Ah
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
REF 2.5-V Reference
Factor
01A2Ch
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Peripheral Descriptor Tag
01A2Eh
1
02h
02h
02h
02h
02h
02h
02h
02h
Peripheral Descriptor
Length
01A2Fh
1
63h
61h
65h
63h
63h
61h
61h
64h
Memory 1
2
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
Memory 2
2
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
Memory 3
2
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
Memory 4
2
12h
2Eh
12h
2Eh
12h
2Dh
12h
2Dh
12h
2Ch
12h
2Ch
12h
2Eh
12h
2Dh
Memory 5
2
22h
96h
22h
96h
2Ah
22h
2Ah
22h
22h
94h
22h
94h
40h
92h
2Ah
40h
NA = Not applicable, blank = unused and reads FFh.
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
103
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
Table 6-62. MSP430F552x Device Descriptor Table(1) (continued)
DESCRIPTION
104
ADDRESS
SIZE
(bytes)
VALUE
F5529
F5528
F5527
F5526
F5525
F5524
F5522
F5521
95h
92h
N/A
N/A
N/A
92h
Memory 6
1/2
N/A
N/A
95h
92h
delimiter
1
00h
00h
00h
00h
00h
00h
00h
00h
Peripheral count
1
21h
20h
21h
20h
21h
20h
20h
21h
MSP430CPUXV2
2
00h
23h
00h
23h
00h
23h
00h
23h
00h
23h
00h
23h
00h
23h
00h
23h
JTAG
2
00h
09h
00h
09h
00h
09h
00h
09h
00h
09h
00h
09h
00h
09h
00h
09h
SBW
2
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
EEM-L
2
00h
05h
00h
05h
00h
05h
00h
05h
00h
05h
00h
05h
00h
05h
00h
05h
TI BSL
2
00h
FCh
00h
FCh
00h
FCh
00h
FCh
00h
FCh
00h
FCh
00h
FCh
00h
FCh
SFR
2
10h
41h
10h
41h
10h
41h
10h
41h
10h
41h
10h
41h
10h
41h
10h
41h
PMM
2
02h
30h
02h
30h
02h
30h
02h
30h
02h
30h
02h
30h
02h
30h
02h
30h
FCTL
2
02h
38h
02h
38h
02h
38h
02h
38h
02h
38h
02h
38h
02h
38h
02h
38h
CRC16
2
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
CRC16_RB
2
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
RAMCTL
2
00h
44h
00h
44h
00h
44h
00h
44h
00h
44h
00h
44h
00h
44h
00h
44h
WDT_A
2
00h
40h
00h
40h
00h
40h
00h
40h
00h
40h
00h
40h
00h
40h
00h
40h
UCS
2
01h
48h
01h
48h
01h
48h
01h
48h
01h
48h
01h
48h
01h
48h
01h
48h
SYS
2
02h
42h
02h
42h
02h
42h
02h
42h
02h
42h
02h
42h
02h
42h
02h
42h
REF
2
03h
A0h
03h
A0h
03h
A0h
03h
A0h
03h
A0h
03h
A0h
03h
A0h
03h
A0h
Port Mapping
2
01h
10h
01h
10h
01h
10h
01h
10h
01h
10h
01h
10h
01h
10h
01h
10h
Port 1/2
2
04h
51h
04h
51h
04h
51h
04h
51h
04h
51h
04h
51h
04h
51h
04h
51h
Port 3/4
2
02h
52h
02h
52h
02h
52h
02h
52h
02h
52h
02h
52h
02h
52h
02h
52h
Port 5/6
2
02h
53h
02h
53h
02h
53h
02h
53h
02h
53h
02h
53h
02h
53h
02h
53h
Port 7/8
2
02h
54h
N/A
02h
54h
N/A
02h
54h
N/A
N/A
02h
54h
JTAG
2
0Ch
5Fh
0Eh
5Fh
0Ch
5Fh
0Eh
5Fh
0Ch
5Fh
0Eh
5Fh
0Eh
5Fh
0Ch
5Fh
TA0
2
02h
62h
02h
62h
02h
62h
02h
62h
02h
62h
02h
62h
02h
62h
02h
62h
TA1
2
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
TB0
2
04h
67h
04h
67h
04h
67h
04h
67h
04h
67h
04h
67h
04h
67h
04h
67h
TA2
2
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
RTC
2
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
MPY32
2
02h
85h
02h
85h
02h
85h
02h
85h
02h
85h
02h
85h
02h
85h
02h
85h
DMA-3
2
04h
47h
04h
47h
04h
47h
04h
47h
04h
47h
04h
47h
04h
47h
04h
47h
Detailed Description
Copyright © 2009–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Table 6-62. MSP430F552x Device Descriptor Table(1) (continued)
DESCRIPTION
Interrupts
ADDRESS
SIZE
(bytes)
VALUE
F5529
F5528
F5527
F5526
F5525
F5524
F5522
F5521
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
USCI_A/B
2
0Ch
90h
USCI_A/B
2
04h
90h
04h
90h
04h
90h
04h
90h
04h
90h
04h
90h
04h
90h
04h
90h
ADC12_A
2
10h
D1h
10h
D1h
10h
D1h
10h
D1h
10h
D1h
10h
D1h
10h
D1h
10h
D1h
COMP_B
2
1Ch
A8h
1Ch
A8h
1Ch
A8h
1Ch
A8h
1Ch
A8h
1Ch
A8h
1Ch
A8h
1Ch
A8h
USB
2
04h
98h
04h
98h
04h
98h
04h
98h
04h
98h
04h
98h
04h
98h
04h
98h
COMP_B
1
A8h
A8h
A8h
A8h
A8h
A8h
A8h
A8h
TB0.CCIFG0
1
64h
64h
64h
64h
64h
64h
64h
64h
TB0.CCIFG1..6
1
65h
65h
65h
65h
65h
65h
65h
65h
WDTIFG
1
40h
40h
40h
40h
40h
40h
40h
40h
USCI_A0
1
90h
90h
90h
90h
90h
90h
90h
90h
USCI_B0
1
91h
91h
91h
91h
91h
91h
91h
91h
ADC12_A
1
D0h
D0h
D0h
D0h
D0h
D0h
D0h
D0h
TA0.CCIFG0
1
60h
60h
60h
60h
60h
60h
60h
60h
TA0.CCIFG1..4
1
61h
61h
61h
61h
61h
61h
61h
61h
USB
1
98h
98h
98h
98h
98h
98h
98h
98h
DMA
1
46h
46h
46h
46h
46h
46h
46h
46h
TA1.CCIFG0
1
62h
62h
62h
62h
62h
62h
62h
62h
TA1.CCIFG1..2
1
63h
63h
63h
63h
63h
63h
63h
63h
P1
1
50h
50h
50h
50h
50h
50h
50h
50h
USCI_A1
1
92h
92h
92h
92h
92h
92h
92h
92h
USCI_B1
1
93h
93h
93h
93h
93h
93h
93h
93h
TA1.CCIFG0
1
66h
66h
66h
66h
66h
66h
66h
66h
TA1.CCIFG1..2
1
67h
67h
67h
67h
67h
67h
67h
67h
P2
1
51h
51h
51h
51h
51h
51h
51h
51h
RTC_A
1
68h
68h
68h
68h
68h
68h
68h
68h
delimiter
1
00h
00h
00h
00h
00h
00h
00h
00h
Table 6-63. MSP430F551x Device Descriptor Table (1)
Info Block
Die Record
ADC12 Calibration
(1)
VALUE
DESCRIPTION
ADDRESS
SIZE
(bytes)
F5519
F5517
F5515
F5514
F5513
Info length
01A00h
1
55h
55h
55h
55h
55h
CRC length
01A01h
1
19h
17h
15h
14h
13h
CRC value
01A02h
2
per unit
per unit
per unit
per unit
per unit
Device ID
01A04h
1
22h
21h
55h
55h
20h
Device ID
01A05h
1
80h
80h
15h
14h
80h
Hardware revision
01A06h
1
per unit
per unit
per unit
per unit
per unit
Firmware revision
01A07h
1
per unit
per unit
per unit
per unit
per unit
Die Record Tag
01A08h
1
08h
08h
08h
08h
08h
Die Record length
01A09h
1
0Ah
0Ah
0Ah
0Ah
0Ah
Lot/Wafer ID
01A0Ah
4
per unit
per unit
per unit
per unit
per unit
Die X position
01A0Eh
2
per unit
per unit
per unit
per unit
per unit
Die Y position
01A10h
2
per unit
per unit
per unit
per unit
per unit
Test results
01A12h
2
per unit
per unit
per unit
per unit
per unit
ADC12 Calibration Tag
01A14h
1
05h
05h
11h
11h
05h
ADC12 Calibration length
01A15h
1
10h
10h
10h
10h
10h
ADC Gain Factor
01A16h
2
blank
blank
blank
blank
blank
NA = Not applicable, blank = unused and reads FFh.
Detailed Description
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MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
105
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
Table 6-63. MSP430F551x Device Descriptor Table(1) (continued)
REF Calibration
Peripheral
Descriptor
106
VALUE
DESCRIPTION
ADDRESS
SIZE
(bytes)
F5519
F5517
F5515
F5514
F5513
ADC Offset
01A18h
2
blank
blank
blank
blank
blank
ADC 1.5-V Reference
Temp. Sensor 30°C
01A1Ah
2
blank
blank
blank
blank
blank
ADC 1.5-V Reference
Temp. Sensor 85°C
01A1Ch
2
blank
blank
blank
blank
blank
ADC 2.0-V Reference
Temp. Sensor 30°C
01A1Eh
2
blank
blank
blank
blank
blank
ADC 2.0-V Reference
Temp. Sensor 85°C
01A20h
2
blank
blank
blank
blank
blank
ADC 2.5-V Reference
Temp. Sensor 30°C
01A22h
2
blank
blank
blank
blank
blank
ADC 2.5-V Reference
Temp. Sensor 85°C
01A24h
2
blank
blank
blank
blank
blank
REF Calibration Tag
01A26h
1
12h
12h
12h
12h
12h
REF Calibration length
01A27h
1
06h
06h
06h
06h
06h
REF 1.5-V Reference
Factor
01A28h
2
per unit
per unit
per unit
per unit
per unit
REF 2.0-V Reference
Factor
01A2Ah
2
per unit
per unit
per unit
per unit
per unit
REF 2.5-V Reference
Factor
01A2Ch
2
per unit
per unit
per unit
per unit
per unit
Peripheral Descriptor Tag
01A2Eh
1
02h
02h
02h
02h
02h
Peripheral Descriptor
Length
01A2Fh
1
61h
63h
61h
5Fh
5Fh
Memory 1
2
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
Memory 2
2
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
Memory 3
2
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
Memory 4
2
12h
2Eh
12h
2Dh
12h
2Ch
12h
2Ch
12h
2Ch
Memory 5
2
22h
96h
2Ah
22h
22h
94h
22h
94h
40h
92h
Memory 6
1/2
N/A
95h
92h
N/A
N/A
N/A
delimiter
1
00h
00h
00h
00h
00h
Peripheral count
1
20h
20h
20h
1Fh
1Fh
MSP430CPUXV2
2
00h
23h
00h
23h
00h
23h
00h
23h
00h
23h
JTAG
2
00h
09h
00h
09h
00h
09h
00h
09h
00h
09h
SBW
2
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
EEM-L
2
00h
05h
00h
05h
00h
05h
00h
05h
00h
05h
TI BSL
2
00h
FCh
00h
FCh
00h
FCh
00h
FCh
00h
FCh
SFR
2
10h
41h
10h
41h
10h
41h
10h
41h
10h
41h
PMM
2
02h
30h
02h
30h
02h
30h
02h
30h
02h
30h
FCTL
2
02h
38h
02h
38h
02h
38h
02h
38h
02h
38h
CRC16
2
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
CRC16_RB
2
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
RAMCTL
2
00h
44h
00h
44h
00h
44h
00h
44h
00h
44h
Detailed Description
Copyright © 2009–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Table 6-63. MSP430F551x Device Descriptor Table(1) (continued)
DESCRIPTION
Interrupts
ADDRESS
SIZE
(bytes)
VALUE
F5519
F5517
F5515
F5514
F5513
00h
40h
00h
40h
00h
40h
00h
40h
WDT_A
2
00h
40h
UCS
2
01h
48h
01h
48h
01h
48h
01h
48h
01h
48h
SYS
2
02h
42h
02h
42h
02h
42h
02h
42h
02h
42h
REF
2
03h
A0h
03h
A0h
03h
A0h
03h
A0h
03h
A0h
Port Mapping
2
01h
10h
01h
10h
01h
10h
01h
10h
01h
10h
Port 1/2
2
04h
51h
04h
51h
04h
51h
04h
51h
04h
51h
Port 3/4
2
02h
52h
02h
52h
02h
52h
02h
52h
02h
52h
Port 5/6
2
02h
53h
02h
53h
02h
53h
02h
53h
02h
53h
Port 7/8
2
02h
54h
02h
54h
02h
54h
N/A
N/A
JTAG
2
0Ch
5Fh
0Ch
5Fh
0Ch
5Fh
0Eh
5Fh
0Eh
5Fh
TA0
2
02h
62h
02h
62h
02h
62h
02h
62h
02h
62h
TA1
2
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
TB0
2
04h
67h
04h
67h
04h
67h
04h
67h
04h
67h
TA2
2
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
RTC
2
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
MPY32
2
02h
85h
02h
85h
02h
85h
02h
85h
02h
85h
DMA-3
2
04h
47h
04h
47h
04h
47h
04h
47h
04h
47h
USCI_A/B
2
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
USCI_A/B
2
04h
90h
04h
90h
04h
90h
04h
90h
04h
90h
ADC12_A
2
N/A
N/A
N/A
N/A
N/A
COMP_B
2
2Ch
A8h
2Ch
A8h
2Ch
A8h
2Ch
A8h
2Ch
A8h
USB
2
04h
98h
04h
98h
04h
98h
04h
98h
04h
98h
COMP_B
1
A8h
A8h
A8h
A8h
A8h
TB0.CCIFG0
1
64h
64h
64h
64h
64h
TB0.CCIFG1..6
1
65h
65h
65h
65h
65h
WDTIFG
1
40h
40h
40h
40h
40h
USCI_A0
1
90h
90h
90h
90h
90h
USCI_B0
1
91h
91h
91h
91h
91h
ADC12_A
1
01h
01h
01h
01h
01h
TA0.CCIFG0
1
60h
60h
60h
60h
60h
TA0.CCIFG1..4
1
61h
61h
61h
61h
61h
USB
1
98h
98h
98h
98h
98h
DMA
1
46h
46h
46h
46h
46h
TA1.CCIFG0
1
62h
62h
62h
62h
62h
TA1.CCIFG1..2
1
63h
63h
63h
63h
63h
P1
1
50h
50h
50h
50h
50h
Detailed Description
Submit Documentation Feedback
Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
107
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
Table 6-63. MSP430F551x Device Descriptor Table(1) (continued)
108
VALUE
SIZE
(bytes)
F5519
F5517
F5515
F5514
F5513
USCI_A1
1
92h
92h
92h
92h
92h
USCI_B1
1
93h
93h
93h
93h
93h
TA1.CCIFG0
1
66h
66h
66h
66h
66h
TA1.CCIFG1..2
1
67h
67h
67h
67h
67h
P2
1
51h
51h
51h
51h
51h
RTC_A
1
68h
68h
68h
68h
68h
delimiter
1
00h
00h
00h
00h
00h
DESCRIPTION
Detailed Description
ADDRESS
Copyright © 2009–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
7 Device and Documentation Support
7.1
Device Support
7.1.1
Getting Started and Next Steps
For an introduction to the MSP430™ family of devices and the tools and libraries that are available to help
with your development, visit the Getting Started page.
7.1.2
Development Tools Support
All MSP microcontrollers are supported by a wide variety of software and hardware development tools.
Tools are available from TI and various third parties. See them all at MSP Tools.
7.1.2.1
Hardware Features
See the Code Composer Studio for MSP430 User's Guide (SLAU157) for details on the available features.
MSP430
ARCHITECTURE
4-WIRE
JTAG
2-WIRE
JTAG
BREAKPOINTS
(N)
RANGE
BREAKPOINTS
CLOCK
CONTROL
STATE
SEQUENCER
TRACE
BUFFER
LPMx.5
DEBUGGING
SUPPORT
MSP430Xv2
Yes
Yes
8
Yes
Yes
Yes
Yes
No
7.1.2.2
Recommended Hardware Options
7.1.2.2.1 Target Socket Boards
The target socket boards allow easy programming and debugging of the device using JTAG. They also
feature header pin outs for prototyping. Target socket boards are orderable individually or as a kit with the
JTAG programmer and debugger included. The following table shows the compatible target boards and
the supported packages.
PACKAGE
TARGET BOARD AND PROGRAMMER BUNDLE
TARGET BOARD ONLY
64-pin VQFN (RGC)
MSP-FET430U64USB
MSP-TS430RGC64USB
80-pin LQFP (PN)
MSP-FET430U80USB
MSP-TS430PN80USB
7.1.2.2.2 Experimenter Boards
Experimenter Boards and Evaluation kits are available for some MSP devices. These kits feature
additional hardware components and connectivity for full system evaluation and prototyping. See MSP
Tools for details.
7.1.2.2.3 Debugging and Programming Tools
Hardware programming and debugging tools are available from TI and from its third party suppliers. See
the full list of available tools at MSP Tools.
7.1.2.2.4 Production Programmers
The production programmers expedite loading firmware to devices by programming several devices
simultaneously.
PART NUMBER
MSP-GANG
PC PORT
Serial and USB
FEATURES
PROVIDER
Program up to eight devices at a time. Works with PC or as a standTexas Instruments
alone package.
Device and Documentation Support
Submit Documentation Feedback
Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
109
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
7.1.2.3
www.ti.com
Recommended Software Options
7.1.2.3.1 Integrated Development Environments
Software development tools are available from TI or from third parties. Open source solutions are also
available.
This device is supported by Code Composer Studio™ IDE (CCS).
7.1.2.3.2 MSPWare
MSPWare is a collection of code examples, data sheets, and other design resources for all MSP devices
delivered in a convenient package. In addition to providing a complete collection of existing MSP design
resources, MSPWare also includes a high-level API called MSP Driver Library. This library makes it easy
to program MSP hardware. MSPWare is available as a component of CCS or as a stand-alone package.
7.1.2.3.3 TI-RTOS
TI-RTOS is an advanced real-time operating system for the MSP microcontrollers. It features preemptive
deterministic multi-tasking, hardware abstraction, memory management, and real-time analysis. TI-RTOS
is available free of charge and is provided with full source code.
7.1.2.3.4 MSP430 USB Developer's Package
MSP430 USB Developer's Package is an easy-to-use USB stack implementation for the MSP
microcontrollers.
7.1.2.3.5 Command-Line Programmer
MSP Flasher is an open-source, shell-based interface for programming MSP microcontrollers through a
FET programmer or eZ430 using JTAG or Spy-Bi-Wire (SBW) communication. MSP430 Flasher can be
used to download binary files (.txt or .hex) files directly to the MSP430 Flash without the need for an IDE.
7.1.3
Device and Development Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
MSP430 MCU devices and support tools. Each MSP430 MCU commercial family member has one of
three prefixes: MSP, PMS, or XMS (for example, MSP430F5438A). TI recommends two of three possible
prefix designators for its support tools: MSP and MSPX. These prefixes represent evolutionary stages of
product development from engineering prototypes (with XMS for devices and MSPX for tools) through fully
qualified production devices and tools (with MSP for devices and MSP for tools).
Device development evolutionary flow:
XMS – Experimental device that is not necessarily representative of the electrical specifications for the
final device
PMS – Final silicon die that conforms to the electrical specifications for the device but has not completed
quality and reliability verification
MSP – Fully qualified production device
Support tool development evolutionary flow:
MSPX – Development-support product that has not yet completed TI's internal qualification testing.
MSP – Fully-qualified development-support product
XMS and PMS devices and MSPX development-support tools are shipped against the following
disclaimer:
"Developmental product is intended for internal evaluation purposes."
110
Device and Documentation Support
Copyright © 2009–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
MSP devices and MSP development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (XMS and PMS) have a greater failure rate than the standard
production devices. TI recommends that these devices not be used in any production system because
their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, PZP) and temperature range (for example, T). Figure 7-1 provides a legend
for reading the complete device name for any family member.
MSP 430 F 5 438 A I ZQW T -EP
Processor Family
Optional: Additional Features
430 MCU Platform
Optional: Tape and Reel
Device Type
Packaging
Series
Feature Set
Processor Family
Optional: Temperature Range
Optional: A = Revision
CC = Embedded RF Radio
MSP = Mixed-Signal Processor
XMS = Experimental Silicon
PMS = Prototype Device
TI’s Low-Power Microcontroller Platform
430 MCU Platform
Device Type
Memory Type
C = ROM
F = Flash
FR = FRAM
G = Flash or FRAM (Value Line)
L = No Nonvolatile Memory
Specialized Application
AFE = Analog Front End
BT = Preprogrammed with Bluetooth
BQ = Contactless Power
CG = ROM Medical
FE = Flash Energy Meter
FG = Flash Medical
FW = Flash Electronic Flow Meter
Series
1 Series = Up to 8 MHz
2 Series = Up to 16 MHz
3 Series = Legacy
4 Series = Up to 16 MHz with LCD
5 Series = Up to 25 MHz
6 Series = Up to 25 MHz with LCD
0 = Low-Voltage Series
Feature Set
Various Levels of Integration Within a Series
Optional: A = Revision
N/A
Optional: Temperature Range S = 0°C to 50°C
C = 0°C to 70°C
I = –40°C to 85°C
T = –40°C to 105°C
Packaging
http://www.ti.com/packaging
Optional: Tape and Reel
T = Small Reel
R = Large Reel
No Markings = Tube or Tray
Optional: Additional Features -EP = Enhanced Product (–40°C to 105°C)
-HT = Extreme Temperature Parts (–55°C to 150°C)
-Q1 = Automotive Q100 Qualified
Figure 7-1. Device Nomenclature
Device and Documentation Support
Submit Documentation Feedback
Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
111
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
7.2
www.ti.com
Documentation Support
The following documents describe the MSP430F552x and MSP430F551x devices. Copies of these
documents are available on the Internet at www.ti.com.
112
SLAU208
MSP430x5xx and MSP430x6xx Family User's Guide. Detailed information on the modules
and peripherals available in this device family.
SLAZ314
MSP430F5529 Device Erratasheet. Describes the known exceptions to the functional
specifications for all silicon revisions of the device.
SLAZ313
MSP430F5528 Device Erratasheet. Describes the known exceptions to the functional
specifications for all silicon revisions of the device.
SLAZ312
MSP430F5527 Device Erratasheet. Describes the known exceptions to the functional
specifications for all silicon revisions of the device.
SLAZ311
MSP430F5526 Device Erratasheet. Describes the known exceptions to the functional
specifications for all silicon revisions of the device.
SLAZ310
MSP430F5525 Device Erratasheet. Describes the known exceptions to the functional
specifications for all silicon revisions of the device.
SLAZ309
MSP430F5524 Device Erratasheet. Describes the known exceptions to the functional
specifications for all silicon revisions of the device.
SLAZ308
MSP430F5522 Device Erratasheet. Describes the known exceptions to the functional
specifications for all silicon revisions of the device.
SLAZ307
MSP430F5521 Device Erratasheet. Describes the known exceptions to the functional
specifications for all silicon revisions of the device.
SLAZ306
MSP430F5519 Device Erratasheet. Describes the known exceptions to the functional
specifications for all silicon revisions of the device.
SLAZ305
MSP430F5517 Device Erratasheet. Describes the known exceptions to the functional
specifications for all silicon revisions of the device.
SLAZ304
MSP430F5515 Device Erratasheet. Describes the known exceptions to the functional
specifications for all silicon revisions of the device.
SLAZ303
MSP430F5514 Device Erratasheet. Describes the known exceptions to the functional
specifications for all silicon revisions of the device.
SLAZ302
MSP430F5513 Device Erratasheet. Describes the known exceptions to the functional
specifications for all silicon revisions of the device.
Device and Documentation Support
Copyright © 2009–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
www.ti.com
7.3
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
Related Links
Table 7-1 lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 7-1. Related Links
7.4
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
MSP430F5529
Click here
Click here
Click here
Click here
Click here
MSP430F5528
Click here
Click here
Click here
Click here
Click here
MSP430F5527
Click here
Click here
Click here
Click here
Click here
MSP430F5526
Click here
Click here
Click here
Click here
Click here
MSP430F5525
Click here
Click here
Click here
Click here
Click here
MSP430F5524
Click here
Click here
Click here
Click here
Click here
MSP430F5522
Click here
Click here
Click here
Click here
Click here
MSP430F5521
Click here
Click here
Click here
Click here
Click here
MSP430F5519
Click here
Click here
Click here
Click here
Click here
MSP430F5517
Click here
Click here
Click here
Click here
Click here
MSP430F5515
Click here
Click here
Click here
Click here
Click here
MSP430F5514
Click here
Click here
Click here
Click here
Click here
MSP430F5513
Click here
Click here
Click here
Click here
Click here
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Community
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At
e2e.ti.com, you can ask questions, share knowledge, explore ideas, and help solve problems with fellow
engineers.
TI Embedded Processors Wiki
Texas Instruments Embedded Processors Wiki. Established to help developers get started with embedded
processors from Texas Instruments and to foster innovation and growth of general knowledge about the
hardware and software surrounding these devices.
7.5
Trademarks
MSP430, MicroStar Junior, Code Composer Studio, E2E are trademarks of Texas Instruments.
7.6
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
7.7
Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
Device and Documentation Support
Submit Documentation Feedback
Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
Copyright © 2009–2015, Texas Instruments Incorporated
113
MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
www.ti.com
8 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
114
Mechanical, Packaging, and Orderable Information
Copyright © 2009–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513
PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
ASP00886IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5522
ASP00886IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5522
MSP430A132IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5528
MSP430A133IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5526
MSP430A134IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5524
MSP430A145IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5522
MSP430A147IZQER
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5522
MSP430F5513IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
M430F5513
MSP430F5513IZQE
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
360
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5513
MSP430F5513IZQER
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5513
MSP430F5514IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
M430F5514
MSP430F5514IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
M430F5514
MSP430F5514IZQE
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
360
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5514
MSP430F5514IZQER
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5514
MSP430F5515IPN
ACTIVE
LQFP
PN
80
119
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5515
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
15-Apr-2017
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MSP430F5515IPNR
ACTIVE
LQFP
PN
80
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5515
MSP430F5517IPN
ACTIVE
LQFP
PN
80
119
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5517
MSP430F5517IPNR
ACTIVE
LQFP
PN
80
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5517
MSP430F5519IPN
ACTIVE
LQFP
PN
80
119
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5519
MSP430F5519IPNR
ACTIVE
LQFP
PN
80
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5519
MSP430F5521IPN
ACTIVE
LQFP
PN
80
119
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5521
MSP430F5521IPNR
ACTIVE
LQFP
PN
80
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5521
MSP430F5522IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
M430F5522
MSP430F5522IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
M430F5522
MSP430F5522IZQE
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
360
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5522
MSP430F5522IZQER
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5522
MSP430F5524IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
M430F5524
MSP430F5524IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
M430F5524
MSP430F5524IYFFR
ACTIVE
DSBGA
YFF
64
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
MSP430F5524IZQE
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
360
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5524
MSP430F5524IZQER
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5524
Addendum-Page 2
M430F5524
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
15-Apr-2017
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MSP430F5525IPN
ACTIVE
LQFP
PN
80
119
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5525
MSP430F5525IPNR
ACTIVE
LQFP
PN
80
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5525
MSP430F5526IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
M430F5526
MSP430F5526IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
M430F5526
MSP430F5526IYFFR
ACTIVE
DSBGA
YFF
64
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
MSP430F5526IZQE
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
360
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5526
MSP430F5526IZQER
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5526
MSP430F5527IPN
ACTIVE
LQFP
PN
80
119
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5527
MSP430F5527IPNR
ACTIVE
LQFP
PN
80
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5527
MSP430F5528IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
M430F5528
MSP430F5528IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
M430F5528
MSP430F5528IYFFR
ACTIVE
DSBGA
YFF
64
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
M430F5528
MSP430F5528IZQE
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
360
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5528
MSP430F5528IZQER
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5528
MSP430F5529IPN
ACTIVE
LQFP
PN
80
119
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5529
MSP430F5529IPNR
ACTIVE
LQFP
PN
80
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5529
Addendum-Page 3
M430F5526
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2017
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Nov-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
MSP430F5513IRGCR
MSP430F5513IZQER
MSP430F5514IRGCT
MSP430F5514IZQER
Package Package Pins
Type Drawing
VQFN
BGA MI
CROSTA
R JUNI
OR
VQFN
BGA MI
CROSTA
R JUNI
OR
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
RGC
64
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
ZQE
80
2500
330.0
12.4
5.3
5.3
1.5
8.0
12.0
Q1
RGC
64
250
180.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
ZQE
80
2500
330.0
12.4
5.3
5.3
1.5
8.0
12.0
Q1
MSP430F5515IPNR
LQFP
PN
80
1000
330.0
24.4
15.0
15.0
2.1
20.0
24.0
Q2
MSP430F5517IPNR
LQFP
PN
80
1000
330.0
24.4
15.0
15.0
2.1
20.0
24.0
Q2
MSP430F5519IPNR
LQFP
PN
80
1000
330.0
24.4
15.0
15.0
2.1
20.0
24.0
Q2
MSP430F5521IPNR
LQFP
PN
80
1000
330.0
24.4
15.0
15.0
2.1
20.0
24.0
Q2
VQFN
RGC
64
250
180.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
ZQE
80
2500
330.0
12.4
5.3
5.3
1.5
8.0
12.0
Q1
MSP430F5522IRGCT
MSP430F5522IZQER
BGA MI
CROSTA
R JUNI
OR
MSP430F5524IRGCT
VQFN
RGC
64
250
180.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
MSP430F5524IYFFR
DSBGA
YFF
64
2500
330.0
12.4
3.86
3.86
0.69
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Nov-2016
Device
MSP430F5524IZQER
Package Package Pins
Type Drawing
BGA MI
CROSTA
R JUNI
OR
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ZQE
80
2500
330.0
12.4
5.3
5.3
1.5
8.0
12.0
Q1
MSP430F5525IPNR
LQFP
PN
80
1000
330.0
24.4
15.0
15.0
2.1
20.0
24.0
Q2
MSP430F5526IRGCR
VQFN
RGC
64
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
MSP430F5526IRGCT
VQFN
RGC
64
250
180.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
MSP430F5526IYFFR
DSBGA
YFF
64
2500
330.0
12.4
3.86
3.86
0.69
8.0
12.0
Q2
MSP430F5526IZQER
BGA MI
CROSTA
R JUNI
OR
ZQE
80
2500
330.0
12.4
5.3
5.3
1.5
8.0
12.0
Q1
MSP430F5527IPNR
LQFP
PN
80
1000
330.0
24.4
15.0
15.0
2.1
20.0
24.0
Q2
MSP430F5528IRGCT
VQFN
RGC
64
250
180.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
MSP430F5528IYFFR
DSBGA
YFF
64
2500
330.0
12.4
3.86
3.86
0.69
8.0
12.0
Q2
MSP430F5528IZQER
BGA MI
CROSTA
R JUNI
OR
ZQE
80
2500
330.0
12.4
5.3
5.3
1.5
8.0
12.0
Q1
PN
80
1000
330.0
24.4
15.0
15.0
2.1
20.0
24.0
Q2
MSP430F5529IPNR
LQFP
*All dimensions are nominal
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Nov-2016
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MSP430F5513IRGCR
VQFN
RGC
64
2000
367.0
367.0
38.0
MSP430F5513IZQER
BGA MICROSTAR
JUNIOR
ZQE
80
2500
336.6
336.6
28.6
MSP430F5514IRGCT
VQFN
RGC
64
250
210.0
185.0
35.0
MSP430F5514IZQER
BGA MICROSTAR
JUNIOR
ZQE
80
2500
336.6
336.6
28.6
MSP430F5515IPNR
LQFP
PN
80
1000
367.0
367.0
45.0
MSP430F5517IPNR
LQFP
PN
80
1000
367.0
367.0
45.0
MSP430F5519IPNR
LQFP
PN
80
1000
367.0
367.0
45.0
MSP430F5521IPNR
LQFP
PN
80
1000
367.0
367.0
45.0
MSP430F5522IRGCT
VQFN
RGC
64
250
210.0
185.0
35.0
MSP430F5522IZQER
BGA MICROSTAR
JUNIOR
ZQE
80
2500
336.6
336.6
28.6
MSP430F5524IRGCT
VQFN
RGC
64
250
210.0
185.0
35.0
MSP430F5524IYFFR
DSBGA
YFF
64
2500
367.0
367.0
35.0
MSP430F5524IZQER
BGA MICROSTAR
JUNIOR
ZQE
80
2500
336.6
336.6
28.6
MSP430F5525IPNR
LQFP
PN
80
1000
367.0
367.0
45.0
MSP430F5526IRGCR
VQFN
RGC
64
2000
367.0
367.0
38.0
MSP430F5526IRGCT
VQFN
RGC
64
250
210.0
185.0
35.0
MSP430F5526IYFFR
DSBGA
YFF
64
2500
367.0
367.0
35.0
MSP430F5526IZQER
BGA MICROSTAR
JUNIOR
ZQE
80
2500
336.6
336.6
28.6
MSP430F5527IPNR
LQFP
PN
80
1000
367.0
367.0
45.0
MSP430F5528IRGCT
VQFN
RGC
64
250
210.0
185.0
35.0
MSP430F5528IYFFR
DSBGA
YFF
64
2500
367.0
367.0
35.0
MSP430F5528IZQER
BGA MICROSTAR
JUNIOR
ZQE
80
2500
336.6
336.6
28.6
MSP430F5529IPNR
LQFP
PN
80
1000
367.0
367.0
45.0
Pack Materials-Page 3
MECHANICAL DATA
MTQF010A – JANUARY 1995 – REVISED DECEMBER 1996
PN (S-PQFP-G80)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
0,08 M
41
60
61
40
80
21
0,13 NOM
1
20
Gage Plane
9,50 TYP
12,20
SQ
11,80
14,20
SQ
13,80
0,25
0,05 MIN
0°– 7°
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040135 / B 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
D: Max = 3.79 mm, Min = 3.73 mm
E: Max = 3.79 mm, Min = 3.73 mm
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