HI-3000, HI-3001, HI-3002 1Mbps Avionics CAN Transceiver with Low Power Standby Mode October 2015 PIN CONFIGURATIONS (Top Views) GENERAL DESCRIPTION TXD - 1 The HI-3000 is a 1 Mbps Controller Area Network (CAN) transceiver optimized for use in aerospace applications. It interfaces between a CAN protocol controller and the physical wires of the bus in a CAN network. Differential output amplitude and current drive capability are specifically enhanced to meet the needs of long cable runs typical of aerospace applications. 8 - STB HI-3000PSI HI-3000PST HI-3000PSM GND - 2 VDD - 3 5 - SPLIT TXD - 1 8 - STB HI-3001PSI HI-3001PST HI-3001PSM GND - 2 VDD - 3 o o All three devices are available in industrial -40 C to +85 C o o and extended -55 C to +125 C temperature ranges. “RoHS compliant” lead-free options are also available with optional burn-in for the extended temperature range. 5 - VIO TXD STDBY 16 15 14 13 GND GND VDD VDD HI-3002PCI HI-3002PCT HI-3002PCM 12 11 10 9 CANH CANH CANL CANL VIO RXD SPLIT 5 6 7 8 1 2 3 4 16 - PIN PLASTIC 4 x 4mm QFN FEATURES · Compatible with ARINC 825 and ISO 11898-5 standards. · Signaling rates up to 1Mbit/s. · Internal VDD/2 voltage source available to stabilize the · · · · · · · · ( DS 3000 Rev. F) 6 - CANL 8 - PIN PLASTIC NARROW BODY SOIC A TXD dominant time-out feature also protects the bus from being driven into a permanent dominant state (socalled “babbling idiot”) if pin TXD becomes permanently low due to application failure. The HI-3002 provides both the SPLIT and VIO supply voltage pins in a compact 16-pin QFN. 7 - CANH RXD - 4 Superior common-mode receiver performance makes the device especially suitable for applications where ground reference voltages may vary from point to point over long distances along the CAN bus. In addition, the HI-3000 provides a SPLIT pin to give an output reference voltage of VDD/2 which can be used for stabilizing the recessive bus level when the split termination technique is used to terminate the bus. The HI-3001 is identical to the HI-3000 except the SPLIT pin is substituted with a VIO supply voltage pin. This allows the HI-3001 to interface directly with controllers with 3.3V supply voltages. 6 - CANL RXD - 4 The HI-3000 supports two modes of operation: Normal Mode and Standby Mode. The Standby Mode is a very low-current mode which continues to monitor bus activity and allows an external controller to manage wake-up. The device also has short circuit protection to +/-58V on CANH, CANL and SPLIT pins and ESD protection to +/- 6kV on all pins. 7 - CANH recessive bus level if split termination is used (HI-3000 SPLIT pin). VIO input on HI-3001 allows for direct interfacing with 3.3V controllers. Detection of permanent dominant on TXD pin (babbling idiot protection). High impedance allows connection of up to 120 nodes. Input levels compatible with 3.3V or 5V controllers. CANH, CANL and SPLIT pins short-circuit proof to +/-58V. Will not disturb the bus if unpowered. Extended temperature range and burn-in options for high reliability applications. Compatible with CAN 2.0A & CAN 2.0B Specification controllers HOLT INTEGRATED CIRCUITS www.holtic.com 10/15 HI-3000, HI-3001, HI-3002 PIN DESCRIPTIONS SIGNAL FUNCTION TXD GND VDD RXD CANL CANH STB INPUT POWER POWER OUTPUT BUS I/O BUS I/O INPUT SPLIT (HI-3000) VIO (HI-3001) INPUT INPUT DESCRIPTION 100kOhm internal pull-up. Transmit Data Input. Chip 0V supply Positive supply, 5V +/-5%. Bypass with 0.1uF ceramic capacitor. Receive Data Output. CAN Bus Line Low. CAN Bus Line High. 100kOhm internal pull-up. Standby Mode selection input. Drive STB low or connect to GND for Normal operation. Drive STB high to select low-current Standby Mode. Supplies a VDD/2 output to provide recessive bus level stabilization when a split termination is used to terminate the bus. Connect to a 3.3V supply to allow compatibility of all digital I/O (RXD, TXD, STB) with a 3.3V controller input. BLOCK DIAGRAM VDD V Split SPLIT (HI-3000) CANH TXD Dominant Detect TXD STB Driver Standby Control VIO (HI-3001) RXD CANL MUX Main Receiver GND Low power Standby Rx Figure 1. HI-3000 Functional Block Diagram HOLT INTEGRATED CIRCUITS 2 HI-3000, HI-3001, HI-3002 FUNCTIONAL DESCRIPTION OPERATING MODES The HI-3000 provides two modes of operation which are selectable via the STB pin. Table 1 summarizes the modes. due to an unpowered node with high leakage from the bus lines to ground), the split circuit will force the recessive voltage to VDD/2. INTERNAL PROTECTION FEATURES Table 1 - Operating Modes MODE Normal Standby Short-circuit protection STB pin Short-circuit protection is provided on the CANH, CANL and SPLIT pins. These pins are protected from ESD to over 6KV (HBM) and from shorts between -58V and +58V continuous, as specified in ISO 11898-5. The short circuit current is limited to less than 200mA typical. LOW HIGH TXD permanent dominant time-out Normal Mode Normal mode is selected by setting the STB pin to a LOW logic level (GND). In this mode, the transceiver transmits and receives data in the usual way from the CANH and CANL bus lines. The differential receiver converts the analog bus data to digital data which is output on the RXD pin (Note: the RXD output on HI-3001 is compatible with 3.3V controllers if the VIO pin is connected to a 3.3V supply). Standby Mode A timer circuit prevents the bus lines being driven into a permanent dominant state, which would result in a situation blocking all bus traffic. This could happen in the case of the TXD pin becoming permanently low due to a hardware or application failure. The timer is triggered by a negative edge on the TXD pin (start of dominant state). If the TXD pin is not set high (recessive state) after a typical time of 2ms, the transmitter outputs will be disabled, driving the bus lines into the recessive state. The timer is reset by a positive edge on the TXD pin. Note that the minimum TXD dominant time-out time, tdom = 300μs, defines the minimum possible bit rate of 40kbit/s (the CAN protocol specifies a maximum of 11 successive dominant bits − 5 successive dominant bits immediately followed by an error frame). Standby Mode is selected by setting the STB pin to a HIGH logic level. In this mode, the transmitter is switched off and a low power differential receiver monitors the bus lines for activity. A dominant signal of more than 3ms will be reflected on the RXD pin as a logic LOW, where it may be detected by the host as a wake-up request. The device will not leave standby mode until the host forces the STB pin to a logic low. Fail-safe features SPLIT Circuit Pins TXD and STB will become floating if power is lost. This will prevent reverse currents via these pins. Pin TXD has a pull up in order to force a recessive level if pin TXD is left open. The SPLIT pin provides a stable VDD/2 DC voltage. This pin can be used to stabilize the recessive common mode voltage by connecting the SPLIT pin to the center tap of the split termination (see figure 7). In the case of a recessive bus voltage dropping below the ideal value of VDD/2 (e.g. HOLT INTEGRATED CIRCUITS 3 HI-3000, HI-3001, HI-3002 TIMING DIAGRAMS Timing Delays HIGH TXD LOW CANH CANL Dominant 0.9V VDIFF(BUS) = VCANH - VCANL 0.5V Recessive HIGH RXD 50% 50% LOW tdr(TXD) tdf(TXD) tdr(RXD) tdf(RXD) tProp1 tProp2 TXD dominant time-out feature transmitter enabled tdom(TXD) tRdom recessive TXD dominant HIGH LOW transmitter disabled CANH CANL HOLT INTEGRATED CIRCUITS 4 HI-3000, HI-3001, HI-3002 ABSOLUTE MAXIMUM RATINGS (Voltages referenced to GND = 0V) Supply Voltage, VDD, VIO : .....................................................................7V Current at Input pins ......................................................-100mA to +100mA DC Voltages at TXD, RXD and STB ..............................-0.5V to VDD +0.5V DC Voltages at CANH, CANL and SPLIT: ...............................-58V to +58V Internal Power Dissipation: ..............................................................900mW Electrostatic Discharge (ESD)1, All pins ..........................................+/- 6kV Operating Temperature Range: (Industrial).........................-40°C to +85°C (Hi-Temp) ........................-55°C to +125°C 2 Maximum Junction Temperature ......................................................175°C Storage Temperature Range: ................................... -65°C to +150°C Reflow Soldering Temperature: ................................................. 260°C NOTES: 1. Human Body Model (HBM). 2. Junction Temperature TJ is defined as TJ = TAMB + P × Rth, where TAMB is the ambient or operating temperature, P is the power dissipation and Rth is a fixed thermal resistance value which depends on the package and circuit board mounting conditions. Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS VDD = 5V±5%, Operating temperature range (unless otherwise noted). Positive currents flow into the IC. LIMITS PARAMETER SYMBOL CONDITIONS VDD Supply Current IDD Recessive: VTXD = VDD Dominant: VTXD = 0 V Standby Mode: VTXD = VDD VIO Supply Current IIO VIO Supply Voltage (see Note 1) VIO HIGH-level input voltage (see Note 1) LOW-level input voltage VIH VIL HIGH-level input current LOW-level input current IIH IIL VTXD = VDD or VIO VTXD = 0 V −5 VOH VOL IOH = 1mA IOL = 1mA 90%VDD 0 VSPLIT ISTB − 100 μA < ISPLIT < 100 μA CANH dominant output voltage CANL dominant output voltage VO(CANH) VO(CANL) Recessive output voltage MIN UNIT TYP MAX 6 50 15 10 70 30 100 mA mA μA μA 2.7 5.5 V 80%VDD − 0.5 VDD + 0.5 20%VDD V V 0 − 50 +5 − 150 μA μA 0.1 10%VDD V V 0.45VDD -5 0.5VDD 0.55VDD +5 V μA VTXD = 0 V VTXD = 0 V (See Fig. 2) 3 0.5 3.6 1.4 4.25 1.75 V V VCANH(r), VCANL(r) VTXD = VDD, RL = 0 (See Fig. 2) 2 0.5VDD 3 V VSTB VTXD = VDD, RL = 0 (See Fig. 2) -0.1 0.1 V VDIFF(d)(o) VDIFF(r)(o) VTXD = 0 V, 45 Ω < RL < 65 Ω VTXD = VDD, no load (See Fig. 2) 1.5 − 50 3 50 V mV POWER SUPPLIES DIGITAL INPUTS (Pins TXD, STB) DIGITAL OUTPUTS HIGH-level output voltage (RXD Pin) (see Note 1) LOW-level output voltage (RXD Pin) Output voltage (SPLIT Pin) Standby leakage current (SPLIT Pin) DRIVER Bus output voltage in standby Dominant differential output voltage Recessive differential output voltage 1.8 0 NOTE: 1. When VIO is connected (HI-3001 or HI-3002), power supply limits are referenced wrt VIO rather than VDD. If VIO < 3.3V, VIH must be at least 2.5V. HOLT INTEGRATED CIRCUITS 5 HI-3000, HI-3001, HI-3002 DC ELECTRICAL CHARACTERISTICS (cont.) VDD = 5V±5%, Operating temperature range. Positive currents flow into the IC. LIMITS PARAMETER SYMBOL CONDITIONS VOM Steady state common mode output voltage Short-circuit steady-state output current UNIT MIN TYP MAX (See Fig. 4) − 100 -40 150 mV VOC(ss) VSTB = 0V, RL = 60 Ω (See Fig. 5) 2 0.5VDD 3 V IOS(ss) VCANH = +58V, VCANL open VCANH = -58V, VCANL openV VCANL = +58V, VCANH open VCANL = -58V, VCANH open (See Fig. 6) -20 -200 100 -20 20 100 200 20 mA mA mA mA Differential receiver threshold voltage Differential hysteresis voltage Differential hysteresis voltage in Standby mode VTh(Rx)(diff) VHys(Rx)(diff) VHys(Stb)(diff) − 12 V < VCANH, VCANL < + 12 V − 12 V < VCANH, VCANL < + 12 V − 12 V < VCANH, VCANL < + 12 V 500 50 500 900 200 1150 mV mV mV Input leakage current, unpowered node ICANH, ICANL VDD = VIO 0 V VCANH = VCANL = 5V − 200 + 200 μA VTXD = VDD − 12 V < VCANH, VCANL < + 12 V 25 50 75 kΩ VTXD = VDD − 12 V < VCANH, VCANL < + 12 V 15 30 45 kΩ VCANH = VCANL −3 +3 % Matching of dominant output voltage, VDD − VO(CANH) − VO(CANL) RECEIVER Differential input resistance RIN(DIFF) Common mode input resistance RIN(CM) Deviation between common mode input resistance between CANH and CANL RIN(CM)(m) 700 120 AC ELECTRICAL CHARACTERISTICS VDD = 5V±5%, Operating temperature range. Positive currents flow into the IC. LIMITS PARAMETER SYMBOL Bit time Bit rate CONDITIONS tBit fBit Common mode input capacitance3 Differential input capacitance3 CIN(CM) CDIFF(CM) Delay TXD to bus active Delay TXD to bus inactive Delay bus active to RXD Delay bus inactive to RXD tdr(TXD) tdf(TXD) tdf(RXD) tdr(RXD) Propagation delay TXD to RXD (recessive to dominant) Propagation delay TXD to RXD (dominant to recessive) tProp1 tProp2 TXD permanent dominant time-out TXD permanent dominant timer reset time tdom tRdom Dominant time required on bus for wake up from standby MIN TYP 1 40 VTXD = VDD, 1Mbit/s data rate VTXD = VDD, 1Mbit/s data rate twake NOTES: 1. All currents into the device pins are positive; all currents out of the device pins are negative. 2. All typicals are given for VDD = 5V, TA = 25°C. 3. Guaranteed by design but not tested. HOLT INTEGRATED CIRCUITS 6 25 1000 20 10 See Timing Diagrans VTXD = 0 V Rising edge on TXD while in permanent dominant state MAX 0.3 0.5 UNIT μs kHz pF pF 40 40 30 70 90 90 70 150 ns ns ns ns 70 110 160 240 ns ns 2 6 ms 1 μs 5 μs 3 HI-3000, HI-3001, HI-3002 Application and Test Information Transceiver TXD VDIFF(d)(o) RL VO(CANH) VO(CANL) STB Dominant Recessive ~3.5V: VO(CANH) ~2.5V ~1.5V: VO(CANL) Figure 2. CAN Bus Driver Circuit Transceiver 300 W +/- 1% CANH 0V VDIFF(d)(o) TXD RL +_ CANL STB -12V <= VTEST <= +12V 300 W +/- 1% Figure 3. CAN Bus Driver (Dominant) Test Circuit Transceiver TXD VDIFF(d)(o) RL VO(CANH) V1 VO(CANL) STB Figure 4. Driver Output Symmetry Test. HOLT INTEGRATED CIRCUITS 7 VOM = VDD - VO(CANH) + VO(CANL) HI-3000, HI-3001, HI-3002 Application and Test Information Transceiver TXD V1 VDIFF(d)(o) RL VO(CANH) VO(CANL) VOC(ss) = VO(CANH) + VO(CANL) STB 2 Figure 5. Common Mode Output Voltage Test. Transceiver CANH TXD +_ V1 -58V or +58V CANL Figure 6. CAN Bus Driver Short-Circuit Test. (Note: V1 is a pulse from 0V to VDD with duty cycle of 99% such that permanent dominant time-out is avoided). HOLT INTEGRATED CIRCUITS 8 HI-3000, HI-3001, HI-3002 Application and Test Information 5V Regulator VDD TXD RXD TXD RXD VDD 3 1 7 CANH 4 RL/2 HI-3000 5 Controller SPLIT (optional) CAN BUS VBAT RL/2 STB 8 GND 2 GND 6 CANL 5V 3.3V Regulator VDD VIO VDD TXD RXD TXD RXD 1 3 5 7 4 RL HI-3001 Controller STB GND CANH 8 2 GND Figure 7. Typical Application Connections HOLT INTEGRATED CIRCUITS 9 6 CANL CAN BUS VBAT HI-3000, HI-3001, HI-3002 ORDERING INFORMATION HI - 300x xx x x PART NUMBER Blank F PART NUMBER LEAD FINISH Tin / Lead (Sn / Pb) Solder 100% Matte Tin (Pb-free, RoHS compliant) TEMPERATURE RANGE FLOW BURN IN I -40°C TO +85°C I NO T -55°C TO +125°C T NO M -55°C TO +125°C M YES PART NUMBER PACKAGE DESCRIPTION PS 8 PIN PLASTIC NARROW BODY SOIC (8HN) (HI-3000 or HI-3001 only) PC 16 PIN PLASTIC 4 x 4 mm QFN (16PCS) (HI-3002 only) CR 8 PIN CERDIP (8D) not available Pb-free (HI-3000 or HI-3001 only) PART NUMBER DESCRIPTION 3000 SPLIT pin option 3001 VIO pin option 3002 Both SPLIT and VIO pins available HOLT INTEGRATED CIRCUITS 10 HI-3000, HI-3001, HI-3002 REVISION HISTORY P/N Rev DS3000 NEW A B C Date 02/15/11 04/29/11 09/09/11 12/18/12 D 10/30/14 E 6/19/15 F 10/14/15 Description of Change Initial Release Corrected heat-sink note on QFN package drawing. Update pad and heat-sink dimensions for 16-lead QFN package (16PCS) Change high-level digital input voltage (VIH) to 80%VDD (or VIO) and low-level digital input voltage (VIL) to 20%VDD (or VIO). Update SOIC-8 and SOIC-16 package drawings. Added "Compatible with CAN 2.0A & CAN 2.0B Specification controllers" to features. Updated 8HN and 16PCS package drawings. Clarified Reflow Soldering Temperature in Absolute Maximum Ratings. Corrected package pin numbers 3 and 5 in Figure 7 HI-3001 Typical Application Connections Add parameter specification for VIO to DC Characteristics Table. HOLT INTEGRATED CIRCUITS 11 PACKAGE DIMENSIONS millimeters (inches) 8-PIN PLASTIC SMALL OUTLINE (SOIC) - NB (Narrow Body) Package Type: 8HN 4.90 BSC (0.193) 0.175 ± 0.075 (0.007 ± 0.003) 6.00 BSC (0.236) 3.90 BSC (0.154) PIN 1 See Detail A 0.41 ± 0.10 (0.016 ± 0.004) 1.25 (0.049) min. 0° to 8° BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) 0.175 ± 0.075 (0.007 ± 0.003) 1.27 BSC (0.050) 0.835 ± 0.435 (0.033 ± 0.017) Detail A millimeters(inches) 16-PIN PLASTIC CHIP-SCALE PACKAGE Package Type: 16PCS 4.000 BSC (0.157) 4.000 BSC (0.157) Electrically isolated heat sink pad on bottom of package. Connect to any ground or power plane for optimum thermal dissipation. 2.600 ± 0.050 (0.102 ± 0.002) 2.600 ± 0.050 (0.102 ± 0.002) Top View Bottom View 0.400 ± 0.050 (0.016 ± 0.002) 1.000 (0.039)max. 0.200 (0.008)typ. BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) HOLT INTEGRATED CIRCUITS 12 0.65 (0.0256) BSC 0.300 ± 0.050 (0.012 ± 0.002) PACKAGE DIMENSIONS inches (millimeters) 8-PIN CERDIP Package Type: 8D .380 ±.004 (9.652 ±.102) .005 min (.127 min) .248 ±.003 (6.299 ±.076) .039 ±.006 (.991 ±.154) .100 BSC (2.54) .015 min (.381min) .200 max (5.080 max) .314 ±.003 (7.976 ±.076) Base Plane .010 ±.006 (.254 ±.152) Seating Plane .163 ±.037 (4.140 ±.940) .056 ±.006 (1.422 ±.152) .018 ±.006 (.457 ±.152) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) HOLT INTEGRATED CIRCUITS 13 .350 ±.030 (8.890 ±.762)