Gilway GHB-1104R-YG 3.0x1.0mm smd chip led lamp Datasheet

55 Commerce Way
Woburn, MA 01801
(781) 935 - 4442
(781) 938 - 5867
www.gilway.com
GHB-1104R-YG
Features
Description
!3.0mmx1.0mm SMT LED, 2.0mm THICKNESS.
The Mega Green source color devices are made with
!LOW POWER CONSUMPTION.
DH InGaAlP on GaAs substrate Light Emitting Diode.
!WIDE VIEWING ANGLE.
!IDEAL
3.0x1.0mm SMD CHIP LED LAMP
FOR BACKLIGHT AND INDICATOR.
!VARIOUS COLORS
!PACKAGE :
AND LENS TYPES AVAILABLE.
2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is 0.15(0.006") unless otherwise noted.
3. Specifications are subject to change without notice.
REV NO: V.3
DATE: DEC/29/2002
PAGE: 1 OF 4
Selection Guide
P
Pa
a
art
rt N
No
No.
o..
Lens
L
e
ens
nss T
Typ
Tyy pe
Diic
ce
MEGA GREEN(InGaAIP)
GHB-1104R-YG
IIv
((mcd
m c dd)
v (mcd)
@ 20 mA
WATER CLE AR
V
Viewin
Viiewing
i ew i n g
Angle
in.
Miin
n.
T
Typ
Tyyyp
pp..
36
80
120°
Note:
1 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at TA=25 C
S
Sy
yymbo
ymbol
mb o l
P
Pa
a
aramete
r am e t er
Un
nit
its
T
Test
e
est
ss t C
Condition
o n d it io nss
peak
Peak Wavelength
Mega Green
574
nm
I F =20mA
D
Dominate Wavelength
Mega Green
568
nm
I F =20mA
Spectral Line Half-width
Mega Green
26
nm
I F =20mA
C
C apacitance
Mega Green
20
pF
VF=0V;f=1MHz
VF
Forward Voltage
Mega Green
2.1
2.5
V
I F =20mA
IR
Reverse Current
Mega Green
10
uA
VR = 5V
1/2
De
evic
ev ic e
TTyyyp
pp..
Ma
ax
xx..
Absolute Maximum Ratings at TA=25 C
P
Paramet
Pa
a
arameter
r a m e t er
Mega
eg a Green
G
Gree
r e en
U
Unit
n
nit
its
Power dissipation
1 05
mW
DC Forward Current
30
mA
Peak Forward Current [1]
1 50
mA
Reverse Voltage
5
V
Operating / Storage Temperature
-40 C To +85 C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
REV NO: V.3
DATE: DEC/29/2002
PAGE: 2 OF 4
REV NO: V.3
DATE: DEC/29/2002
PAGE: 3 OF 4
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
REV NO: V.3
DATE: DEC/29/2002
PAGE: 4 OF 4
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