www.fairchildsemi.com FAN1112 1A 1.2V Low Dropout Linear Regulator Features Description • • • • • • The FAN1112 is a 1.2V low dropout three-terminal regulator with 1A output current capability. The device has been optimized for low voltage where transient response and minimum input voltage are critical. Low dropout voltage Load regulation: 0.05% typical Trimmed current limit On-chip thermal limiting Standard SOT-223 and TO-252 packages Three-terminal fixed 1.2V Current limit is trimmed to ensure specified output current and controlled short-circuit current. On-chip thermal limiting provides protection against any combination of overload and ambient temperatures that would create excessive junction temperatures. Applications • Post regulator for switching supplies • Supply for low-voltage processors Unlike PNP type regulators where up to 10% of the output current is wasted as quiescent current, the quiescent current of the FAN1112 flows into the load, increasing efficiency. The FAN1112 regulator is available in the industry-standard SOT-223 and TO-252 (DPAK) power packages. Typical Application FAN1112 VIN = 3.3V + VIN VOUT 10µF 1.2V at 1A + 22µF GND REV. 1.0.1 9/27/01 PRODUCT SPECIFICATION FAN1112 Pin Assignments Front View Tab is VOUT Front View Tab is VOUT 3 IN 2 OUT 1 GND 1 2 3 GND OUT 4-Lead Plastic SOT-223 ΘJC = 15°C/W* IN 3-Lead Plastic TO-252 ΘJC = 3°C/W* *With package soldered to 0.5 square inch copper area over backside ground plane or internal power plane., ΘJA can vary from 30°C/W to more than 50°C/W. Other mounting techniques may provide better thermal resistance than 30°C/W. Absolute Maximum Ratings Parameter Min. VIN (VIN – VOUT) * IOUT Max. Unit 18 V See Figure 1 Operating Junction Temperature Range Storage Temperature Range 0 125 °C -65 150 °C 300 °C Lead Temperature (Soldering, 10 sec.) 1.2 IOUT (A) 1.0 0.8 0.6 0.4 0.2 0 0 2 4 6 8 10 12 14 16 18 20 VIN – VOUT (V) Figure 1. Absolute Maximum Safe Operating Area 2 REV. 1.0.1 9/27/01 FAN1112 PRODUCT SPECIFICATION Electrical Characteristics Operating Conditions: VIN ≤ 7V, TJ = 25°C unless otherwise specified. The • denotes specifications which apply over the specified operating temperature range. Parameter Output Line Voltage3 Regulation1,2 Load Regulation1,2 Conditions Min. Typ. Max. Units 1.140 1.200 1.260 V 10mA ≤ IOUT ≤ 1A FAN1112, 3.0V ≤ VIN ≤ 7.2V • 3.0V ≤ VIN ≤ 12V, IOUT = 10mA • 0.005 0.2 % (VIN – VOUT) = 2V, 10mA ≤ IOUT ≤ 1A • 0.05 0.5 % 1.100 1.200 Dropout Voltage ∆VREF = 1%, IOUT = 1A • Current Limit (VIN – VOUT) = 2V • GND Pin Current 120 µA 0.2 5 µA • Minimum Load Current 3.0V ≤ VIN ≤ 15V • • VIN = 7V f = 120Hz, COUT = 22µF Tantalum, (VIN – VOUT) = 3V, IOUT = 1A Thermal Regulation TA = 25°C, 30ms pulse 10 mA 4 60 13 72 0.004 • Temperature Stability V A 35 3.0V ≤ VIN ≤ 7V, 10mA ≤ IOUT ≤ 1A Quiescent Current 1.5 • GND Pin Current Change Ripple Rejection 1.1 mA dB 0.02 0.5 %/W % Long-Term Stability TA = 125°C, 1000hrs. 0.03 RMS Output Noise (% of VOUT) TA = 25°C, 10Hz ≤ f ≤ 10kHz 0.003 % Thermal Resistance, Junction SOT-223 to Case TO-252 15 °C/W 3 °C/W Thermal Shutdown 155 °C 10 °C Thermal Shutdown Hysteresis Junction Temperature 1.0 % Notes: 1. See thermal regulation specifications for changes in output voltage due to heating effects. Load and line regulation are measured at a constant junction temperature by low duty cycle pulse testing. 2. Line and load regulation are guaranteed up to the maximum power dissipation (18W). Power dissipation is determined by input/output differential and the output current. Guaranteed maximum output power will not be available over the full input/ output voltage range. 3. Output current must be limited to meet the absolute maximum ratings of the part. REV. 1.0.1 9/27/01 3 PRODUCT SPECIFICATION FAN1112 Typical Performance Characteristics 0.10 DROPOUT VOLTAGE DEVIATION (%) DROPOUT VOLTAGE (V) 1.5 1.4 1.3 1.2 1.1 TJ = 0°C 1.0 0.9 TJ = 25°C 0.8 TJ = 125°C 0.7 0.6 0.5 0 0 0.2 0.4 0.6 0.8 0.05 0 -0.05 -0.10 -0.15 -0.20 -75 -50 -25 0 1.0 OUTPUT CURRENT (A) Figure 2. Dropout Voltage vs. Output Current Figure 3. Load Regulation vs. Temperature 5 MINIMUM LOAD CURRENT (mA) OUTPUT VOLTAGE (V) 1.220 1.215 1.210 1.205 1.200 1.195 1.190 1.185 1.180 1.175 -75 -50 -25 0 4 3 2 1 0 -75 -50 -25 0 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (°C) Figure 4. Reference Voltage vs. Temperature 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (°C) Figure 5. Minimum Load Current vs. Temperature 100 2.0 SHORT-CIRCUIT CURRENT (A) 90 ADJUST PIN CURRENT (µA) 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (°C) 1.225 80 70 60 50 40 30 20 10 0 -75 -50 -25 0 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (°C) Figure 6. GND Pin Current vs. Temperature 4 ∆I = 1A 1.75 1.5 1.25 1.0 -75 -50 -25 0 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (°C) Figure 7. Short-Circuit Current vs. Temperature REV. 1.0.1 9/27/01 FAN1112 PRODUCT SPECIFICATION Typical Performance Characteristics (continued) 90 10 70 7.5 60 POWER (W) RIPPLE REJECTION (dB) 80 50 40 30 20 10 100 1K 10K 100K FREQUENCY (Hz) Figure 8. Ripple Rejection vs. Frequency REV. 1.0.1 9/27/01 5 SOT-223 2.5 (VIN - VOUT) = 3V 0.5 < VRIPPLE < 2V IOUT = 1A 0 10 TO-252 0 25 45 65 85 105 125 CASE TEMPERATURE (°C) Figure 9. Maximum Power Dissipation 5 PRODUCT SPECIFICATION FAN1112 Mechanical Dimensions 4-Lead SOT-223 Package Inches Symbol Millimeters Min. Max. Min. Max. A A1 B c D — — .025 — .248 .071 .181 1.80 4.80 E e F H I J K L M N .130 .148 — — .640 — 6.30 3.30 .840 2.29 6.71 3.71 .115 .033 .264 .012 — 10° .0008 10° .010 .124 .041 .287 — 10° 16° .0040 16° .014 2.95 .840 6.71 .310 — 10° .0203 10° .250 3.15 1.04 7.29 — 10° 16° .1018 16° .360 .033 .090 .264 Notes D e K A H E N J M B I L A1 c 6 F REV. 1.0.1 9/27/01 FAN1112 PRODUCT SPECIFICATION Mechanical Dimensions (continued) 3-Lead TO-252 Package Symbol Inches Millimeters Notes: Notes Min. Max. Min. Max. A b b2 b3 c c2 .086 .025 .030 .205 .018 .018 .094 .035 2.19 0.64 0.76 5.21 0.46 0.46 2.39 0.89 D E e H 5.33 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 1 L L1 .210 .245 .250 .265 .090 BSC .370 .410 .055 .070 .108 REF L3 L4 .035 .025 0.89 0.64 4 .045 .215 .024 .023 .080 .040 1.14 5.46 0.61 0.58 2.03 1.02 E @PKG/ @HEATSINK b3 4 1 1. Dimensions are exclusive of mold flash, metal burrs or interlead protrusion. 2. Stand off-height is measured from lead tip with ref. to Datum -B-. 3. Foot length is measured with ref. to Datum -A- with lead surface. 4. Thermal pad contour optional within dimension b3 and L3. 5. Formed leads to be planar with respect to one another at seating place -C-. 6. Dimensions and tolerances per ASME Y14.5M-1994. 3 L3 c2 D E-PIN H L4 b2 L1 L b e -B- α = 0° – 10° -A- A -C- REV. 1.0.1 9/27/01 7 PRODUCT SPECIFICATION FAN1112 Ordering Information Product Number Package FAN1112D TO-252 FAN1112S SOT-223 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 9/27/01 0.0m 007 Stock#DS30001112 2001 Fairchild Semiconductor Corporation