AD ADG620BRMZ2 Cmos, â±5 v/5 v, 4 î©, single spdt switch Datasheet

CMOS, ±5 V/+5 V,
4 Ω, Single SPDT Switches
ADG619/ADG620
FEATURES
FUNCTIONAL BLOCK DIAGRAM
6.5 Ω (maximum) on resistance
0.8 Ω (maximum) on-resistance flatness
2.7 V to 5.5 V single supply
±2.7 V to ±5.5 V dual supply
Rail-to-rail operation
8-lead SOT-23, 8-lead MSOP
Typical power consumption (<0.1 μW)
TTL-/CMOS-compatible inputs
ADG619/ADG620
S2
D
S1
NOTES
1. SWITCHES SHOWN FOR
A LOGIC 1 INPUT.
APPLICATIONS
Figure 1.
Automatic test equipment
Power routing
Communication systems
Data acquisition systems
Sample-and-hold systems
Avionics
Relay replacement
Battery-powered systems
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The ADG619/ADG620 are monolithic, CMOS single-pole
double-throw (SPDT) switches. Each switch conducts equally
well in both directions when the device is on.
1.
2.
3.
4.
5.
The ADG619/ADG620 offer a low on resistance of 4 Ω, which
is matched to within 0.7 Ω between channels. These switches
also provide low power dissipation, yet result in high switching
speeds. The ADG619 exhibits break-before-make switching
action, thus preventing momentary shorting when switching
channels. The ADG620 exhibits make-before-break action.
02617-001
IN
Low on resistance (RON): 4 Ω typical.
Dual ±2.7 V to ±5.5 V or single 2.7 V to 5.5 V supplies.
Low power dissipation.
Fast tON/tOFF.
Tiny, 8-lead SOT-23 and 8-lead MSOP.
Table 1. Truth Table for the ADG619/ADG620
IN
0
Switch S1
On
Switch S2
Off
1
Off
On
The ADG619/ADG620 are available in an 8-lead SOT-23 and
an 8-lead MSOP.
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2001–2007 Analog Devices, Inc. All rights reserved.
ADG619/ADG620
TABLE OF CONTENTS
Features .............................................................................................. 1
Absolute Maximum Ratings ............................................................6
Applications....................................................................................... 1
ESD Caution...................................................................................6
Functional Block Diagram .............................................................. 1
Pin Configurations and Function Descriptions ............................7
General Description ......................................................................... 1
Typical Performance Characteristics ..............................................8
Product Highlights ........................................................................... 1
Terminology .................................................................................... 10
Revision History ............................................................................... 2
Test Circuits..................................................................................... 11
Specifications..................................................................................... 3
Outline Dimensions ....................................................................... 13
Dual Supply ................................................................................... 3
Ordering Guide............................................................................... 14
Single Supply ................................................................................. 5
REVISION HISTORY
3/07—Rev. B to Rev. C
Changes to Specifications ................................................................ 3
1/06—Rev. A to Rev. B
Changes to RON Values in Table 2 ................................................... 2
Updated Outline Dimensions ....................................................... 13
Changes to Ordering Guide .......................................................... 13
6/03—Rev. 0 to Rev. A.
Edits to Specifications ...................................................................... 2
Changes to Ordering Guide ............................................................ 4
Updated Outline Dimensions ......................................................... 8
Rev. C | Page 2 of 16
ADG619/ADG620
SPECIFICATIONS
DUAL SUPPLY
VDD = +5 V ± 10%, VSS = −5 V ± 10%, GND = 0 V. All specifications −40°C to +85°C, unless otherwise noted.
Table 2.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
RON Match Between Channels (ΔRON)
On-Resistance Flatness (RFLAT (ON))
+25°C
B Version 1
−40°C to +85°C
VSS to VDD
4
6.5
0.7
1.1
0.7
1.35
8.5
1.35
0.8
1.4
Unit
Test Conditions/Comments
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
VDD = +4.5 V, VSS = −4.5 V
VS = ±4.5 V, IDS = −10 mA; see Figure 15
LEAKAGE CURRENTS
±0.01
Channel On Leakage, ID, IS (On)
±0.25
±0.01
±0.25
±1
±1
2.4
0.8
0.005
±0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS 2
ADG619
tON
tOFF
Break-Before-Make Time Delay, tBBM
2
80
120
45
75
40
155
90
10
ADG620
tON
Make-Before-Break Time Delay, tMBB
40
65
200
330
160
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
Bandwidth −3 dB
CS (Off )
CD, CS (On)
110
−67
−67
190
25
95
tOFF
VS = ±3.3 V, IDS = −10 mA
VDD = +5.5 V, VSS = −5.5 V
Source Off Leakage, IS (Off )
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
VS = ±4.5 V, IDS = −10 mA
85
400
10
Rev. C | Page 3 of 16
nA typ
VS = ±4.5 V, VD = ∓ 4.5 V; see Figure 16
nA max
nA typ
nA max
VS = VD = ±4.5 V; see Figure 17
V min
V max
μA typ
μA max
pF typ
VIN = VINL or VINH
ns typ
ns max
ns typ
ns max
ns typ
ns min
RL = 300 Ω, CL = 35 pF
VS = 3.3 V; see Figure 18
RL = 300 Ω, CL = 35 pF
VS = 3.3 V; see Figure 18
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 3.3 V; see Figure 19
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
dB typ
dB typ
MHz typ
pF typ
pF typ
RL = 300 Ω, CL = 35 pF
VS = 3.3 V; see Figure 18
RL = 300 Ω, CL = 35 pF
VS = 3.3 V; see Figure 18
RL = 300 Ω, CL = 35 pF
VS = 0 V; see Figure 20
VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 21
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 22
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 23
RL = 50 Ω, CL = 5 pF; see Figure 24
f = 1 MHz
f = 1 MHz
ADG619/ADG620
Parameter
POWER REQUIREMENTS
IDD
+25°C
B Version 1
−40°C to +85°C
0.001
1.0
ISS
0.001
1.0
1
2
Temperature range for B version is −40°C to +85°C.
Guaranteed by design, not subject to production test.
Rev. C | Page 4 of 16
Unit
μA typ
μA max
μA typ
μA max
Test Conditions/Comments
VDD = +5.5 V, VSS = −5.5 V
Digital inputs = 0 V or 5.5 V
Digital inputs = 0 V or 5.5 V
ADG619/ADG620
SINGLE SUPPLY
VDD = 5 V ± 10%, VSS = 0 V, GND = 0 V. All specifications −40°C to +85°C, unless otherwise noted.
Table 3.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
RON Match Between Channels (ΔRON)
On-Resistance Flatness (RFLAT (ON))
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
Channel On Leakage, ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
+25°C
B Version 1
−40°C to +85°C
0 V to VDD
7
10
0.8
1.1
0.5
±0.01
±0.25
±0.01
±0.25
12.5
1.3
0.5
1.2
±1
±1
2.4
0.8
0.005
±0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS 2
ADG619
tON
tOFF
Break-Before-Make Time Delay, tBBM
2
120
220
50
75
70
280
110
10
ADG620
tON
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
VDD = 4.5 V, VSS = 0 V
VS = 0 V to 4.5 V, IDS = −10 mA; see Figure 15
nA typ
nA max
nA typ
nA max
RL = 300 Ω, CL = 35 pF
VS = 3.3 V; see Figure 18
RL = 300 Ω, CL = 35 pF
VS = 3.3 V; see Figure 18
RL = 300 Ω, CL = 35 pF
VS = 3.3 V; see Figure 20
VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 21
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure
22
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure
23
RL = 50 Ω, CL = 5 pF; see Figure 24
f = 1 MHz
f = 1 MHz
VDD = 5.5 V
Digital inputs = 0 V or 5.5 V
Channel-to-Channel Crosstalk
−67
dB typ
190
25
95
MHz typ
pF typ
pF typ
1.0
Temperature range for B version is −40°C to +85°C.
Guaranteed by design, not subject to production test.
Rev. C | Page 5 of 16
VS = VD = 1 V/4.5 V; see Figure 17
RL = 300 Ω, CL = 35 pF
VS = 3.3 V; see Figure 18
RL = 300 Ω, CL = 35 pF
VS = 3.3 V; see Figure 18
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 3.3 V; see Figure 19
6
−67
0.001
VDD = 5.5 V
VS = 1 V/4.5 V, VD = 4.5 V/1 V; see Figure 16
ns typ
ns max
ns typ
ns max
ns typ
ns min
Charge Injection
Off Isolation
Bandwidth −3 dB
CS (OFF)
CD, CS (ON)
POWER REQUIREMENTS
IDD
VS = 1.5 V to 3.3 V, IDS = −10 mA
VIN = VINL or VINH
Make-Before-Break Time Delay, tMBB
420
VS = 0 V to 4.5 V, IDS = −10mA
V min
V max
μA typ
μA max
pF typ
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
dB typ
110
10
2
Test Conditions/Comments
50
85
210
340
170
tOFF
1
Unit
μA typ
μA max
ADG619/ADG620
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
VDD to VSS
VDD to GND
VSS to GND
Analog Inputs1
Digital Inputs1
Peak Current, S or D
Continuous Current, S or D
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
MSOP
θJA Thermal Impedance
θJC Thermal Impedance
SOT-23
θJA Thermal Impedance
θJC Thermal Impedance
Lead Temperature, Soldering
(10 sec)
IR Reflow, Peak Temperature
1
Rating
13 V
−0.3 V to +6.5 V
+0.3 V to −6.5 V
VSS − 0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V or 30 mA
(whichever occurs first)
100 mA (pulsed at 1 ms,
10% duty cycle maximum)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at a time.
ESD CAUTION
50 mA
−40°C to +85°C
−65°C to +150°C
150°C
206°C/W
44°C/W
229.6°C/W
91.99°C/W
300°C
220°C
Overvoltages at IN, S, or D are clamped by internal diodes. Current should be
limited to the maximum ratings given.
Rev. C | Page 6 of 16
ADG619/ADG620
D 1
S1 2
ADG619/
ADG620
8
S2
7
VSS
TOP VIEW
6 IN
(Not to Scale)
VDD 4
5 NC
D 1
S1 2
GND 3
VDD 4
02617-002
NC = NO CONNECT
GND 3
ADG619/
ADG620
TOP VIEW
(Not to Scale)
8
S2
7
VSS
6
IN
5
NC
NC = NO CONNECT
Figure 2. 8-Lead SOT-23
(RJ-8)
02617-003
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 3. 8-Lead MSOP
(RM-8)
Table 5. Pin Function Descriptions
Pin No.
1
2
3
4
5
6
7
Mnemonic
D
S1
GND
VDD
NC
IN
VSS
8
S2
Description
Drain Terminal. Can be an input or output.
Source Terminal. Can be an input or output.
Ground (0 V) Reference.
Most Positive Power Supply.
No Connect. Not internally connected.
Logic Control Input.
Most Negative Power Supply. This pin is only used in dual-supply applications and should be tied to
ground in single-supply applications.
Source Terminal. Can be an input or output.
Rev. C | Page 7 of 16
ADG619/ADG620
TYPICAL PERFORMANCE CHARACTERISTICS
10
8
VDD, VSS = ±2.5V
7
9
8
VDD, VSS = ±3V
ON RESISTANCE (Ω)
ON RESISTANCE (Ω)
6
5
VDD, VSS = ±3.3V
4
VDD, VSS = ±4.5V
3
VDD, VSS = ±5V
TA = +85°C
7
6
TA = +25°C
5
TA = –40°C
4
3
2
02617-004
TA = 25°C
–5
–4
–3
–2
–1
0
1
VD, VS (V)
2
3
4
1
0
5
TA = 25°C
VSS = 0V
VDD = 2.7V
16
0.3
VDD = 3.3V
8
VDD = 4.5V
6
VDD = 5V
4
0
1
2
3
4
IS (OFF)
0.1
0
ID, IS (ON)
–0.1
–0.2
–0.3
–0.4
02617-005
2
0.2
02617-008
LEAKAGE CURRENTS (nA)
12
10
–0.5
5
0
10
20
VD, VS (V)
6
0.5
0.3
TA = +85°C
TA = +25°C
TA = –40°C
2
02617-006
1
VDD = +5V
VSS = –5V
–4
–3
–2
–1
0
1
VD, VS (V)
2
3
80
4
0.2
ID, IS (ON)
0.1
0
IS (OFF)
–0.1
–0.2
–0.3
02617-009
LEAKAGE CURRENTS (nA)
ON RESISTANCE (Ω)
5
0
–5
70
VDD = 5V
VSS = 0V
VD = 4.5V/1V
VS = 1V/4.5V
0.4
3
30
40
50
60
TEMPERATURE (°C)
Figure 8. Leakage Currents vs. Temperature (Dual Supply)
Figure 5. On Resistance vs. VD, VS (Single Supply)
4
5
VDD = +5V
VSS = –5V
VD = ±4.5V
VS = 4.5V
0.4
VDD = 3V
14
4
3
2
Figure 7. On Resistance vs. VD, VS for Different Temperatures (Single Supply)
0.5
18
ON RESISTANCE (Ω)
1
0
VD, VS (V)
Figure 4. On Resistance vs. VD, VS (Dual Supply)
0
VDD = 5V
VSS = 0V
±
0
02617-007
2
1
–0.4
–0.5
5
Figure 6. On Resistance vs. VD, VS for Different Temperatures (Dual Supply)
Rev. C | Page 8 of 16
0
10
20
30
40
50
60
TEMPERATURE (°C)
70
80
Figure 9. Leakage Currents vs. Temperature (Single Supply)
ADG619/ADG620
TA = 25°C
–10
–20
VDD = +5V
VSS = –5V
150
ATTENUATION (dB)
CHARGE INJECTION (pC)
200
100
VDD = +5V
VSS = 0V
0
–5
–4
–3
–2
–1
0
VS (V)
1
2
–40
–50
–60
02617-010
50
–30
3
4
VDD = +5V
VSS = –5V
TA = 25°C
–70
5
–80
0.2
1
10
FREQUENCY (MHz)
02617-013
250
100
Figure 13. Crosstalk vs. Frequency
Figure 10. Charge Injection vs. Source Voltage
180
0
160
–2
tON
TIME (ns)
100
ATTENUATION (dB)
VDD = +5V
VSS = –5V
120
80
60
tOFF
40
VDD = +5V
VSS = 0V
0
–40
–20
0
20
VDD = +5V
VSS = –5V
40
02617-011
20
TEMPERATURE (°C)
Figure 11. tON/tOFF Times vs. Temperatures
–20
ATTENUATION (dB)
–30
–40
–50
–60
–70
VDD = +5V
VSS = –5V
TA = 25°C
1
10
FREQUENCY (MHz)
02617-012
–80
–100
0.03
–8
–10
1
10
FREQUENCY (MHz)
100
Figure 14. On Response vs. Frequency
–10
–90
–6
–12 VDD = +5V
VSS = –5V
TA = 25°C
–14
0.2
80
60
–4
02617-014
VDD = +5V
VSS = 0V
140
100
Figure 12. Off Isolation vs. Frequency
Rev. C | Page 9 of 16
1000
ADG619/ADG620
TERMINOLOGY
IDD
Positive supply current.
CD, CS (On)
On switch capacitance.
ISS
Negative supply current.
tON
Delay between applying the digital control input and the output
switching on.
RON
Ohmic resistance between D and S terminals.
tOFF
Delay between applying the digital control input and the output
switching off.
ΔRON
On resistance match between any two channels.
RFLAT (ON)
Flatness is defined as the difference between the maximum and
minimum value of on resistance as measured over the specified
analog signal range.
IS (Off)
Source leakage current with the switch off.
ID, IS (On)
Channel leakage current with the switch on.
VD, VS
Analog voltage on Terminal D and Terminal S.
tMBB
On time is measured between the 80% points of both switches,
when switching from one address state to another.
tBBM
Off time or on time is measured between the 90% points of
both switches, when switching from one address state
to another.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during switching.
VINL
Maximum input voltage for Logic 0.
Crosstalk
A measure of unwanted signal coupled through from one
channel to another as a result of parasitic capacitance.
VINH
Minimum input voltage for Logic 1.
Off Isolation
A measure of unwanted signal coupling through an off switch.
IINL, IINH
Input current of the digital input.
Bandwidth
The frequency response of the on switch.
CS (Off)
Off switch source capacitance.
Insertion Loss
The loss due to the on resistance of the switch.
Rev. C | Page 10 of 16
ADG619/ADG620
TEST CIRCUITS
IDS
VS
Figure 15. On Resistance
D
ID (OFF)
A
VD
S
NC
Figure 16. Off Leakage
0.1µF
VDD VSS
S
A
Figure 17. On Leakage
0.1µF
VDD VSS
50%
VIN
D
IN
VS
ID (ON)
D
RL
300Ω
GND
CL
35pF
50%
90%
90%
VOUT
VOUT
tON
tOFF
Figure 18. Switching Times
S1
VS1
VDD VSS
0.1µF
VIN
VDD VSS
D2
D
S2
VS2
IN
VIN
CL2
35pF
RL2
300Ω
VOUT
VOUT
50%
0V
50%
90%
90%
0V
GND
tBBM
02617-019
0.1µF
tBBM
Figure 19. Break-Before-Make Time Delay, tBBM (ADG619 Only)
VDD VSS
0.1µF
VDD VSS
VS1
VD
IN
VIN
VS1
RL2
300Ω
GND
RL1
300Ω
CL2
35pF
CL1
35pF
VIN
50%
0V
50%
VS1
80%V D
80%V D
02617-020
0.1µF
VS2
tMBB
Figure 20. Make-Before-Break Time Delay, tMBB (ADG620 Only)
VS
VSS
VDD
VSS
D
S
VIN
VOUT
CL
1nF
IN
GND
S2
ΔVOUT
VOUT
S1
Figure 21. Charge Injection
Rev. C | Page 11 of 16
ΔVOUT
QINJ = CL × ΔVOUT
02617-021
RS
VDD
VD
02617-017
RON = V1/IDS
S
A
02617-018
02617-015
VS
IS (OFF)
D
02617-016
V1
S
ADG619/ADG620
VDD
VSS
0.1µF
0.1µF
VDD
NETWORK
ANALYZER
VSS
S
50Ω
50Ω
IN
VS
D
VIN
RL
50Ω
02617-022
GND
VOUT
VOUT
VS
OFF ISOLATION = 20 log
Figure 22. Off Isolation
VDD
VSS
0.1µF
NETWORK
ANALYZER
VOUT
0.1µF
VSS
VDD
S1
R
50Ω
S2
50Ω
D
R
50Ω
IN
VS
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
02617-023
GND
VOUT
VS
Figure 23. Channel-to-Channel Crosstalk
VDD
VSS
0.1µF
0.1µF
VDD
NETWORK
ANALYZER
VSS
S
50Ω
IN
VS
VIN
RL
50Ω
GND
INSERTION LOSS = 20 log
VOUT WITH SWITCH
VS WITHOUT SWITCH
Figure 24. Bandwidth
Rev. C | Page 12 of 16
VOUT
02617-024
D
ADG619/ADG620
OUTLINE DIMENSIONS
3.20
3.00
2.80
8
3.20
3.00
2.80
5.15
4.90
4.65
5
1
4
PIN 1
0.65 BSC
0.95
0.85
0.75
1.10 MAX
0.15
0.00
0.38
0.22
COPLANARITY
0.10
0.80
0.60
0.40
8°
0°
0.23
0.08
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 25. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
2.90 BSC
8
7
6
5
1
2
3
4
1.60 BSC
2.80 BSC
PIN 1
INDICATOR
0.65 BSC
1.95
BSC
1.30
1.15
0.90
1.45 MAX
0.15 MAX
0.38
0.22
0.22
0.08
SEATING
PLANE
8°
4°
0°
COMPLIANT TO JEDEC STANDARDS MO-178-BA
Figure 26. 8-Lead Small Outline Transistor Package [SOT-23]
(RJ-8)
Dimensions shown in millimeters
Rev. C | Page 13 of 16
0.60
0.45
0.30
ADG619/ADG620
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
Branding 1
ADG619BRM
ADG619BRM-REEL
ADG619BRM-REEL7
ADG619BRMZ 2
ADG619BRMZ-REEL2
ADG619BRMZ-REEL72
ADG619BRT-REEL
ADG619BRT-REEL7
ADG619BRT-500RL7
ADG619BRTZ-REEL2
ADG619BRTZ-REEL72
ADG619BRTZ-500RL72
ADG620BRM
ADG620BRM-REEL
ADG620BRM-REEL7
ADG620BRMZ2
ADG620BRT-REEL
ADG620BRT-REEL7
ADG620BRTZ-REEL72
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Small Outline Transistor Package (SOT-23)
8-Lead Small Outline Transistor Package (SOT-23)
8-Lead Small Outline Transistor Package (SOT-23)
8-Lead Small Outline Transistor Package (SOT-23)
8-Lead Small Outline Transistor Package (SOT-23)
8-Lead Small Outline Transistor Package (SOT-23)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Small Outline Transistor Package (SOT-23)
8-Lead Small Outline Transistor Package (SOT-23)
8-Lead Small Outline Transistor Package (SOT-23)
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RJ-8
RJ-8
RJ-8
RJ-8
RJ-8
RJ-8
RM-8
RM-8
RM-8
RM-8
RJ-8
RJ-8
RJ-8
SVB
SVB
SVB
SCC
SCC
SCC
SVB
SVB
SVB
SCC
SCC
SCC
SWB
SWB
SWB
S21
SWB
SWB
S21
1
2
Branding on SOT-23 and MSOP is limited to three characters due to space constraints.
Z = RoHS Compliant Part.
Rev. C | Page 14 of 16
ADG619/ADG620
NOTES
Rev. C | Page 15 of 16
ADG619/ADG620
NOTES
©2001–2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C02617-0-3/07(C)
Rev. C | Page 16 of 16